Integrated device, cooling system, cooling method and terminal

Abstract

The embodiment of the invention provides an integrated device, a cooling system, a cooling method and a terminal.The integrated device comprises a first circuit board, a temperature sensor and a humidity sensor, and the dew point temperature of the environment in the integrated device is calculated according to the temperature and humidity measured by the temperature sensor and the humidity sensor; the cooling mode of the integrated device is selected according to the dew point temperature, so that condensation is avoided. The cooling system comprises an integrated device, a cooling pipeline, a valve and a heat exchange medium, whether the heat exchange medium circulates in the cooling pipeline or not is controlled through opening and closing of the valve, the cooling mode of the integrated device is controlled, condensation is avoided, and a circuit board is prevented from being short-circuited. According to the scheme provided by the invention, the integrated device only needs an IP52 protection grade, does not need a ventilation valve, a dispensing sealing material and a reversible moisture absorption material, does not need to spray a waterproof coating on the circuit board, reduces the manufacturing and maintenance cost of the integrated device, is convenient to disassemble, is good in heat dissipation performance of the circuit board, and is beneficial to obtaining better performance of the integrated device.

Description

Integrated device, cooling system, cooling method and terminal Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to an integrated device, a cooling system, a cooling method and a terminal. Background Art

[0002] As autonomous driving levels increase, the computing power and power consumption of the system-on-chip (SoC) in the vehicle's intelligent modules are also increasing. Traditional natural cooling or air cooling cannot meet the SoC's heat dissipation requirements, requiring liquid cooling. When the coolant temperature is lower than the ambient temperature, there is a risk of condensation causing a short circuit in the circuit board. High humidity or low ambient temperature also poses a risk of condensation causing a short circuit in the circuit board.

[0003] Summary of the Invention

[0004] The present application provides an integrated device, a cooling system, a cooling method and a terminal for preventing condensation from causing a short circuit in a circuit board.

[0005] In a first aspect, an embodiment of the present application provides an integrated device, comprising a circuit board, a first temperature sensor, and a humidity sensor, wherein the first temperature sensor is used to measure temperature, and the first humidity sensor is used to measure humidity, wherein the temperature and humidity are used to obtain the dew point temperature of the environment within the integrated device, and the dew point temperature is used to determine a cooling method for the integrated device. The dew point temperature is related to the temperature and humidity of the environment, and the dew point temperature of the environment can be obtained by measuring the temperature and humidity of the environment. If, at the current dew point temperature of the environment, there is a risk of condensation when cooling the integrated device using liquid cooling, other cooling methods are used to dissipate heat from the integrated device to avoid condensation that could cause a short circuit in the circuit board.

[0006] In a possible implementation manner of the first aspect, the integrated device further includes a first processing module, the first processing module is configured to calculate the dew point temperature according to temperature and humidity, and the integrated device determines a cooling method according to the dew point temperature to avoid condensation.

[0007] In a possible implementation manner of the first aspect, the first temperature sensor is located on the circuit board. The first temperature sensor is integrated on the circuit board and is used to measure temperature to obtain the ambient dew point temperature.

[0008] In a possible implementation of the first aspect, the humidity sensor is located on the circuit board. The humidity sensor is integrated on the circuit board and is used to measure humidity to obtain the ambient dew point temperature.

[0009] In one possible implementation of the first aspect, the integrated device further includes a cold plate and a second temperature sensor. The cold plate is used for heat exchange in the integrated device, and the second temperature sensor is used to measure the temperature of the cold plate. The cold plate is used for heat exchange in the integrated device and is a location subject to condensation risk. Measuring the cold plate temperature by the second temperature sensor can more accurately determine the condensation risk. When the cold plate temperature is above the dew point, there is no condensation risk. When the cold plate temperature is below the dew point, there is a condensation risk. The cooling method of the integrated device can be determined based on this information.

[0010] The integrated device provided in the embodiment of the present application measures temperature and humidity through a temperature sensor and a humidity sensor, calculates the dew point temperature based on the measured temperature and humidity, determines the condensation risk based on the dew point temperature, and selects an appropriate cooling method to avoid the condensation risk. The solution provided in the present application enables the integrated device to only require an IP52 protection level, does not require a breathable valve, glue seal, and reversible moisture-absorbing material, and reduces the manufacturing cost of the integrated device. Since there is no need to seal the integrated module and there is no need to spray a waterproof coating on the circuit board of the integrated device, the integrated device provided in the embodiment of the present application is easy to disassemble and has strong maintainability. In addition, since there is no need to spray a waterproof coating on the circuit board, the circuit board has good heat dissipation performance, which is conducive to better performance of the integrated device. In a second aspect, the embodiment of the present application provides a cooling system, which includes the integrated device described in any one of the first aspects, a cooling pipeline, a valve, and a heat exchange medium. The cooling pipeline is used to circulate the heat exchange medium, the heat exchange medium is used to dissipate heat from the integrated device, and the valve is used to control the opening and closing of the cooling pipeline. When the valve is open, the heat exchange medium flows in the cooling pipe, and the integrated device is in a liquid cooling state; when the valve is closed, the heat exchange medium does not flow in the cooling pipe, and the integrated device is in other cooling states such as natural cooling or air cooling. That is to say, at this time, the integrated device uses cooling methods such as natural cooling or air cooling to dissipate heat.

[0011] In a possible implementation of the second aspect, the cooling system further includes a second processing module configured to control the valve to open when the temperature of the heat exchange medium is higher than the dew point temperature, or higher than the sum of the dew point temperature and a first threshold value. When the temperature of the heat exchange medium is higher than the dew point temperature, or higher than the sum of the dew point temperature and the first threshold value, condensation does not occur, and the valve is opened to allow the heat exchange medium to flow through the cooling pipeline, dissipating heat from the integrated device and ensuring normal operation of the integrated device.

[0012] In one possible implementation of the second aspect, the first threshold is related to the performance of a temperature and / or humidity sensor. The temperature and humidity measured by the temperature and humidity sensors may have errors. To prevent condensation from forming in the integrated device, the first threshold is set to prevent a misjudgment of no condensation risk if the measured dew point temperature is lower than the actual dew point temperature, thereby preventing the integrated device from being liquid-cooled and causing condensation.

[0013] In one possible implementation of the second aspect, the valve is closed when the temperature of the heat exchange medium is not higher than the dew point temperature, or is not higher than the sum of the dew point temperature and a first threshold. When the heat exchange medium temperature does not meet the conditions, there is a risk of condensation, and the valve is closed, placing the integrated device in another heat dissipation state, such as natural heat dissipation or air cooling, to prevent condensation.

[0014] In a possible implementation of the second aspect, the cooling system further includes a third temperature sensor configured to measure the temperature of the heat exchange medium. Based on the measured temperature of the heat exchange medium, the condensation risk can be determined and a cooling method for the integrated device can be determined.

[0015] In a third aspect, an embodiment of the present application provides a cooling method, which is applied to a cooling system, wherein the cooling system includes an integrated device, a cooling pipeline, a valve, and a heat exchange medium. After the integrated device is powered on for a first period of time, the valve is opened, the heat exchange medium circulates in the cooling pipeline, and the heat exchange medium dissipates heat for the integrated device. When the integrated device is powered on, the temperature of the heat exchange medium is low. At this time, the circulation of the heat exchange medium poses a risk of condensation when dissipating heat from the integrated device. After the first period of time, the temperature of the heat exchange medium rises to above the dew point temperature, and the valve is opened to allow the heat exchange medium to circulate in the cooling pipeline, dissipating heat for the integrated device without generating condensation.

[0016] Fourthly, embodiments of the present application provide a cooling method for use in a cooling system, the cooling system comprising an integrated device, a cooling pipeline, a valve, and a heat exchange medium. The ambient temperature outside the integrated device is obtained, and when the ambient temperature outside the integrated device is below a second threshold, the valve is closed. When the ambient temperature is below the second threshold, other heat dissipation methods such as natural heat dissipation or air cooling can meet the heat dissipation requirements of the integrated device. The valve is closed, preventing the heat exchange medium from circulating in the cooling pipeline, eliminating the risk of condensation.

[0017] In a possible implementation of the fourth aspect, when the ambient temperature is not lower than a second threshold and the integrated device is powered on for longer than a first duration, the valve opens, the heat exchange medium circulates through the cooling pipeline, and the heat exchange then dissipates heat from the integrated device. When the ambient temperature is not lower than the second threshold and other heat dissipation methods, such as natural heat dissipation or air cooling, cannot meet the heat dissipation requirements of the integrated device, liquid cooling of the integrated device is required. When the integrated device is powered on for longer than the first duration and the temperature of the heat exchange medium rises above the dew point, the valve opens to allow the heat exchange medium to circulate through the cooling pipeline, dissipating heat from the integrated device without generating condensation.

[0018] In a fifth aspect, embodiments of the present application provide a cooling method for an integrated device, the integrated device comprising a circuit board, a first temperature sensor, and a humidity sensor. The first temperature sensor is configured to measure temperature, and the first humidity sensor is configured to measure humidity. The temperature and humidity are used to determine the dew point temperature of the environment within the integrated device, and the dew point temperature is used to determine a cooling method for the integrated device.

[0019] In a sixth aspect, an embodiment of the present application provides a cooling method, which is applied to a cooling system, wherein the cooling system includes the integrated device, cooling pipeline, valve and heat exchange medium described in any one of the first aspects. The cooling pipeline is used to circulate the heat exchange medium, the heat exchange medium is used to dissipate heat from the integrated device, and the valve is used to control the opening and closing of the cooling pipeline. When the valve is open, the heat exchange medium circulates in the cooling pipeline, and the integrated device is in a liquid cooling state; when the valve is closed, the heat exchange medium does not circulate in the cooling pipeline, and the integrated device is in other cooling states such as natural cooling or air cooling.

[0020] In a seventh aspect, an embodiment of the present application provides a terminal, the terminal comprising the integrated device or cooling system according to any one of the first aspect or the second aspect. Optionally, the terminal is a vehicle.

[0021] In an eighth aspect, an embodiment of the present application provides a computer-readable storage medium, which, when executed on a computer or a processor, enables the method described in any one of the third aspect, fourth aspect, fifth aspect or sixth aspect to be executed.

[0022] Regarding the implementation effects brought about by the implementation methods corresponding to the fifth, sixth, seventh and eighth aspects, please refer to the introduction of the various implementation methods of the first and second aspects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] FIG1 is a schematic diagram of a usage scenario of the integrated device.

[0024] FIG2 is a schematic diagram of an integrated device provided in this application.

[0025] FIG3 is another schematic diagram of the integrated device provided in this application.

[0026] FIG4 is another schematic diagram of the integrated device provided in this application.

[0027] FIG5 is another schematic diagram of the integrated device provided in this application.

[0028] FIG6 is another schematic diagram of the integrated device provided in this application.

[0029] FIG7 is another schematic diagram of the integrated device provided in this application.

[0030] FIG8 is a schematic diagram of a cooling system provided in this application.

[0031] FIG9 is another schematic diagram of the cooling system provided in this application.

[0032] FIG10 is a schematic diagram of the cooling system provided in the present application applied to a vehicle.

[0033] FIG11 is another schematic diagram of the cooling system provided in this application.

[0034] FIG12 is a schematic flow chart of the cooling method provided in this application.

[0035] FIG13 is another schematic flow chart of the cooling method provided in this application.

[0036] FIG14 is another schematic flow chart of the cooling method provided in this application. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0038] For ease of understanding, the following examples provide some explanations of concepts related to the embodiments of the present application for reference.

[0039] 1. Integrated device

[0040] The integrated device mentioned in the embodiments of the present application can be an intelligent driving module, an in-vehicle entertainment module, a vehicle control module, a mobile data center (MDC), a cockpit domain controller (CDC), a vehicle domain controller (Vehicle Domain Controller) or other module units encapsulated with integrated circuits, such as an electronic control unit (ECU), a telematics box (Tbox), an industrial personal computer (IPC), etc. The integrated device in the embodiments of the present application can be used in various fields such as intelligent driving, intelligent transportation, intelligent manufacturing, intelligent control, and environmental monitoring, and can complete one or more functions of data processing, automatic control, information collection, simulation calculation, target recognition, etc.

[0041] 2. Circuit board

[0042] A circuit board can also be called a circuit board, PCB board, FPC circuit board, printed circuit board, or motherboard. A circuit board is a printed board with point-to-point connections and printed components on a substrate according to a predetermined design. Its function is to form predetermined circuit connections for electronic components. It is the substrate and key interconnection component on which electronic components are mounted.

[0043] The circuit board is installed in the integrated device. The whole formed by the circuit board and the electronic components integrated on the board is the core of the integrated device to realize its functions.

[0044] 3. Temperature sensor

[0045] A temperature sensor is a sensor that can sense temperature and convert it into a usable output signal.

[0046] 4. Humidity sensor refers to a sensor that can sense temperature and convert it into a usable output signal.

[0047] Humidity sensor

[0048] 5. Heat exchange medium

[0049] Heat exchange medium can also be called heat transfer medium, heat exchange medium, etc. It is used to transfer heat from one place to another. It is generally gas or liquid, such as air, water, oil, etc. It can also be phase change material or liquid metal, or it can be nanofluid formed by metal or non-metal nanoparticles dispersed in a fluid medium.

[0050] 6. Dew point temperature

[0051] Dew point temperature, also known as dew point, refers to the temperature at which the gaseous water in the air reaches saturation and condenses into liquid water under a fixed air pressure. At this temperature, it condenses into dew when it touches a solid surface, so it is called the dew point temperature.

[0052] At a fixed air pressure, the dew point is related to temperature and humidity. When the water vapor in the air reaches saturation, the dew point and the air temperature are the same.

[0053] 7. Valve

[0054] A device with a movable component that can open, close, or partially block one or more openings or passages to allow, block, or regulate the flow of liquids, air, or other loose materials. Based on the actuation method, valves can be categorized as manual, electric, hydraulic, or pneumatic.

[0055] 8. Cold plate

[0056] A component used for heat exchange and dissipation in an integrated device or cooling system. It is typically made of metal or non-metallic materials with good thermal conductivity, such as copper, aluminum, and carbon. A cold plate may be hollow to allow the heat exchange medium to circulate, or it may be a solid structure with structures such as cooling fins.

[0057] The cold plate can also be formed by the deformation of the cooling pipeline, or it can be a part of the cooling pipeline. The cold plate is usually in contact with the heat-generating part of the device and dissipates heat through heat exchange.

[0058] 9. Cooling pipe

[0059] A cooling pipe is also called a heat pipe, which is a heat transfer element that flows with a heat exchange medium and is used to quickly transfer heat from a heat-generating object to the outside of the heat source.

[0060] In the embodiments of the present application, for the number of nouns, unless otherwise specified, it means "singular noun or plural noun", that is, "one or more". "At least one" means one or more, and "plural" means two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. Unless otherwise specified, the character " / " generally indicates that the previous and next associated objects are in an "or" relationship. For example, A / B means: A or B. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c means: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, c can be single or multiple.

[0061] In the embodiments of this application, ordinal numbers such as "first" and "second" are used to distinguish multiple objects and are not used to limit the size, content, order, timing, application scenario, priority, or importance of the multiple objects. For example, the first processing module and the second processing module can be the same processing module or different processing modules, and such names do not indicate differences in the structure, location, priority, application scenario, or importance of the two processing modules.

[0062] In the embodiments of the present application, "connection" can be a direct connection or an indirect connection; in addition, it can refer to an electrical connection or a communication connection; for example, the connection between two electrical components A and B can refer to a direct connection between A and B, or it can refer to an indirect connection between A and B through other electrical components or a connection medium, so that electrical signals can be transmitted between A and B; for another example, the connection between two devices A and B can refer to a direct connection between A and B, or it can refer to an indirect connection between A and B through other communication devices or communication media, as long as communication between A and B can be carried out.

[0063] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between the various embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0064] Those skilled in the art will understand that all or part of the steps to implement the above embodiments may be accomplished by hardware, or by a program to instruct the relevant hardware, and the program may be stored in a computer-readable storage medium, which may be a read-only memory, a disk, or an optical disk, etc.

[0065] The above introduces some concepts involved in the embodiments of the present application. The following introduces the technical features of the embodiments of the present application.

[0066] Please refer to Figure 1, which illustrates a typical use case for an integrated device. During operation, the integrated device generates heat, requiring heat exchange medium in the cooling circuit to dissipate this heat to prevent the integrated device from overheating, shutting down, or even burning out. The heat exchange medium absorbs heat within the integrated device and releases it through the heat exchanger to dissipate heat. If the heat exchange medium temperature falls below the dew point, condensation may form on the integrated device. If this condensation drips onto the integrated device's circuit boards, it could create a short circuit risk.

[0067] To this end, the present application provides an integrated device. Please refer to Figure 2. Figure 2 is a schematic diagram of the integrated device provided by the present application, including a circuit board, a first temperature sensor and a humidity sensor. The first temperature sensor and humidity sensor are located in the integrated device. The first temperature sensor and humidity sensor are used to measure the temperature and humidity in the integrated device, and obtain the dew point temperature through the temperature and humidity. The cooling method of the integrated device is determined according to the dew point temperature. If there is a risk of condensation when using liquid cooling to cool the integrated device at the current dew point temperature, other cooling methods are used to dissipate heat from the integrated device to avoid condensation and short-circuiting the integrated device. Optionally, the first temperature sensor and humidity sensor can be different sensors, or they can be temperature and humidity sensors that can measure temperature and humidity in one. Please refer to Figure 3, which is a schematic diagram of the integrated device provided by the present application. The temperature and humidity sensor is both a first temperature sensor and a humidity sensor.

[0068] In a possible implementation manner, the first temperature sensor is integrated on the circuit board.

[0069] In a possible implementation manner, the humidity sensor is integrated on the circuit board.

[0070] A possible implementation method, please refer to Figure 4, which is a schematic diagram of an integrated device provided in this application, and also includes a first processing module, which is connected to a first temperature sensor and a humidity sensor, and the first processing module is used to calculate the dew point temperature based on temperature and humidity data.

[0071] In a possible implementation manner, the first processing module is integrated on a circuit board.

[0072] Optionally, the dew point temperature can be calculated using the Goff-Grech equation, the Magras formula, or by a table lookup, etc., and this application is not limited thereto. The processing module may include one or more processors. It should be understood that while the processor is described in the embodiments of this application for ease of explanation of the computing function, in specific implementations, the processor may include a device having computing functionality. For example, at least one processor may include one or more of the following devices: a central processing unit (CPU), an application processor (AP), a time-to-digital converter (TDC), a filter, a graphics processing unit (GPU), a microprocessor unit (MPU), an application specific integrated circuit (ASIC), an image signal processor (ISP), a digital signal processor (DSP), a field programmable gate array (FPGA), a complex programmable logic device (CPLD), a coprocessor (assisting the central processing unit to complete corresponding processing and applications), a microcontroller unit (MCU), and / or a neural-network processing unit (NPU), etc.

[0073] Optionally, the processing module may be located inside or outside the integrated device.

[0074] Alternatively, in some possible designs, the processing module may include multiple components, some of which are located inside the integrated device and some of which are located outside the integrated device. For example, the processing module may include a digital-to-analog conversion module, a filtering module, and an output module, wherein the digital-to-analog conversion module and the filtering module are located inside the integrated device, and the output module is located outside the integrated device.

[0075] A possible implementation method, please refer to Figure 5, which is a schematic diagram of the integrated device provided in this application. The integrated device also includes a cold plate, which is used for heat exchange in the integrated device and is a part with condensation risk. When the cold plate temperature is higher than the dew point temperature, there is no condensation risk. When the cold plate temperature is lower than the dew point temperature, there is a condensation risk. The cooling method of the integrated device can be determined accordingly. When there is a condensation risk, the integrated device adopts natural heat dissipation or other heat dissipation methods such as air cooling. When there is no condensation risk, the integrated device adopts liquid cooling.

[0076] A possible implementation method, please refer to Figure 6, which is a schematic diagram of the integrated device provided by the present application. The integrated device also includes a cold plate and a second temperature sensor. The integrated device also includes a cold plate, and the cold plate is used for heat exchange of the integrated device. The cold plate is a part with condensation risk. When the temperature of the cold plate is higher than the dew point temperature, there is no condensation risk. When the temperature of the cold plate is lower than the dew point temperature, there is a condensation risk. The cooling method of the integrated device can be determined based on this. When there is a condensation risk, the integrated device adopts other heat dissipation methods such as natural heat dissipation or air cooling. When there is no condensation risk, the integrated device adopts liquid cooling. The second temperature sensor and the first temperature sensor can be the same temperature sensor or different temperature sensors. Moreover, this name does not indicate the difference in the structure, location, priority, application scenario or importance of the two temperature sensors.

[0077] A possible implementation method, please refer to Figure 7, which is a schematic diagram of an integrated device provided in an embodiment of the present application, and the integrated device includes a housing, a circuit board, a chip, a temperature sensor, a humidity sensor and a cold plate. The chip is the main heat source in the integrated device, and the cold plate is connected to the chip to dissipate heat. The housing surrounds the electronic components such as the circuit board and acts as a package. Optionally, the cold plate can be hollow to circulate heat exchange medium, or it can be a solid structure. The cold plate and the heat-generating part of the integrated device can be in direct contact, or can be connected to the heat-generating part of the integrated device through other heat-conducting media. Optionally, the heat-conducting medium can be a thermal pad, thermal grease, etc. The heat-conducting medium can fill the gap between the cold plate and the chip, which is beneficial to improving the heat conduction efficiency. It can also provide a certain degree of protection for the chip, provide a buffer between the cold plate and the chip, and prevent the cold plate from damaging the chip during assembly or use.

[0078] The integrated device provided in the embodiment of the present application measures temperature and humidity through a temperature sensor and a humidity sensor, calculates the dew point temperature based on the measured temperature and humidity, determines the condensation risk based on the dew point temperature, and selects a suitable cooling method to avoid the condensation risk. The solution provided in the present application enables the integrated device to only require an IP52 protection level, and does not require a breathable valve, glue seal, and reversible hygroscopic material, thereby reducing the manufacturing cost of the integrated device. Since there is no need to seal the integrated module, and there is no need to spray a waterproof coating on the circuit board of the integrated device, the integrated device provided in the embodiment of the present application is easy to disassemble and has strong maintainability. In addition, since there is no need to spray a waterproof coating on the circuit board, the heat dissipation performance of the circuit board is good, which is conducive to better performance of the integrated device.

[0079] The present application provides a cooling system. Please refer to 8, which is a schematic diagram of the cooling system provided by the present application, including the integrated device, cooling pipeline, valve and heat exchange medium described in any one of the first aspects. The cooling pipeline is used to circulate the heat exchange medium, and the heat exchange medium is used to dissipate heat for the integrated device. The valve is used to control the switch of the cooling pipeline. When the valve is open, the heat exchange medium circulates in the cooling pipeline, and the integrated device is in a liquid cooling state; when the valve is closed, the heat exchange medium does not circulate in the cooling pipeline, and the integrated device is in other heat dissipation states such as natural heat dissipation or air cooling. The opening and closing of the valve is determined according to the cooling method required by the integrated device. When there is no condensation risk in the integrated device, the valve is opened and the integrated device is in a liquid cooling state. When there is a condensation risk, the valve is closed and the integrated device is in other heat dissipation states such as natural heat dissipation or air cooling, so as to avoid condensation.

[0080] A possible implementation method, please refer to Figure 9, which is a schematic diagram of the cooling system provided by the present application. The cooling system also includes a second processing module, which is connected to a valve. When the temperature of the heat exchange medium is higher than the dew point temperature, or the temperature of the heat exchange medium is higher than the sum of the dew point temperature and the first threshold, the second processing module controls the valve to open. When the temperature of the heat exchange medium is higher than the dew point temperature, or the temperature of the heat exchange medium is higher than the sum of the dew point temperature and the first threshold, no condensation will be generated. The valve opens to allow the heat exchange medium to circulate in the cooling pipeline, dissipating heat from the integrated device and ensuring the normal operation of the integrated device. The second processing module and the first processing module can be the same processing module or different processing modules, and this name does not indicate that the two processing modules are different in structure, location, priority, application scenario, or importance.

[0081] In one possible implementation, the cooling system is applied to a vehicle. Please refer to FIG10 , which provides a schematic diagram of the cooling system applied to a vehicle for an embodiment of the present application, including an electric drive circuit and a battery circuit, with a heat exchange medium flowing in the circuit. The direction of the arrow in the figure is the flow direction of the heat exchange medium, and the heat is dissipated to the outside through the heat exchanger and circulated in different circuits. When the vehicle starts, the initial temperature of the heat exchange medium is low. At this time, there is a risk of condensation when it is passed into the integrated device, so the valve is closed, and the integrated device is in a heat dissipation mode such as natural heat dissipation or air cooling. When the vehicle runs for a period of time, the heat of the power battery and the motor causes the heat exchange temperature in the circuit to rise, and there is no risk of condensation. The valve is opened, and the integrated device is in a liquid cooling mode. The pump is used to drive the heat exchange medium to flow in the circuit.

[0082] Optionally, the first threshold is related to the performance of the temperature and / or humidity sensor. The temperature and humidity measured by the temperature sensor and the humidity sensor may have errors. In order to ensure that no condensation occurs in the integrated device and to improve the reliability of anti-condensation, the first threshold is set to prevent the measured dew point temperature from being lower than the actual dew point temperature, which is mistakenly judged as no condensation risk, causing the integrated device to be in a liquid cooling state and produce condensation.

[0083] Optionally, the first threshold is related to the dew point calculation method. Different dew point calculation methods have different error ranges. Setting the first threshold can avoid misjudgment of condensation risk caused by errors and improve the reliability of anti-condensation.

[0084] In one possible implementation, the valve closes when the heat exchange medium temperature is not higher than the dew point temperature, or when the heat exchange medium temperature is not higher than the sum of the dew point temperature and a first threshold. When the heat exchange medium temperature does not meet the conditions, condensation risk exists, and the valve closes, placing the integrated device in a natural cooling or air cooling state, or other cooling state, to prevent condensation.

[0085] In one possible embodiment, please refer to Figure 11, which is a schematic diagram of the cooling system provided by this application. The cooling system also includes a third temperature sensor for measuring the temperature of the heat exchange medium. Based on the measured temperature of the heat exchange medium, the condensation risk can be determined and the cooling method of the integrated device can be determined. The heat exchange medium first flows through the third temperature sensor and then through the valve.

[0086] The present application provides a cooling method. Please refer to FIG12, which is a flow chart of a cooling method provided by the present application, which is applied to a cooling system. The cooling system may be a cooling system as shown in any one of FIG8, FIG9, and FIG11. The cooling system includes an integrated device, which may be an integrated device as shown in any one of FIG2-FIG7, a cooling pipeline, a valve, and a heat exchange medium. The process is performed as follows: Step 1, S1201, the integrated device is powered on, and the valve remains closed; Step 2, S1202, after the integrated device is powered on for a first period of time, the valve is opened, the heat exchange medium circulates in the cooling pipeline, and the heat exchange medium dissipates heat for the integrated device; Step 3, S1203, the valve remains open, and after the integrated device is powered off, the valve is closed. When the integrated device is powered on, the temperature of the heat exchange medium is low. At this time, the circulation of the heat exchange medium may cause condensation when dissipating heat from the integrated device. After the first period of time, the temperature of the heat exchange medium reaches above the dew point temperature, and the valve is opened to allow the heat exchange medium to circulate in the cooling pipeline, dissipating heat for the integrated device without causing condensation.

[0087] In one possible embodiment, the first duration is related to the user object of the cooling system, such as a vehicle. The structure, performance, and operating conditions of the user object will all affect the first duration. For example, when the cooling system is applied to a vehicle, after starting a vehicle with a high heat output, the heat exchange medium temperature will quickly rise to a temperature range without condensation risk, and the first duration required will be shorter than that of a vehicle with a lower heat output. For another example, when the vehicle is traveling at high speed, the heat output is higher, and the first duration is shorter than that of a vehicle traveling at low speed.

[0088] In one possible embodiment, the cooling system is installed in a vehicle. After the vehicle is started, the temperature of the heat exchange medium rises. After a first period of time, the temperature of the heat exchange medium rises to a level where there is no risk of condensation. The valve opens, and the heat exchange medium flows through the cooling pipeline, putting the integrated device in a liquid cooling state.

[0089] The present application provides a cooling method. Please refer to Figure 13, which is a flow chart of the cooling method provided by the present application, which is applied to a cooling system. The cooling system can be a cooling system as shown in any one of Figures 8, 9, and 11. The cooling system includes an integrated device, which can be an integrated device as shown in any one of Figures 2 to 7, a cooling pipeline valve, and a heat exchange medium. The process is carried out as follows: Step 1, S1301, the integrated device is powered on, and the valve remains closed; Step 2, S1302, determines whether the ambient temperature of the integrated device is lower than a second threshold. If so, execute Step S1301; if not, execute Step 3, Step S1303, after the integrated device is powered on for a first period of time, the valve opens; Step 4, S1304, the valve remains open, and after the integrated device is powered off, the valve closes. When the ambient temperature is lower than the second threshold, other heat dissipation methods such as natural heat dissipation or air cooling can meet the heat dissipation requirements of the integrated device. The valve is closed so that the heat exchange medium cannot circulate in the cooling pipeline, and there is no risk of condensation.

[0090] In one possible implementation, when the ambient temperature is not lower than a second threshold and the integrated device is powered on for a duration greater than a first duration, the valve opens, the heat exchange medium circulates through the cooling pipe, and the heat exchange then dissipates heat from the integrated device. When the ambient temperature is not lower than the second threshold, other heat dissipation methods such as natural heat dissipation or air cooling cannot meet the heat dissipation requirements of the integrated device, and liquid cooling is required for the integrated device. When the integrated device is powered on for a duration greater than the first duration, the temperature of the heat exchange medium rises above the dew point temperature, and the valve opens to allow the heat exchange medium to circulate through the cooling pipe, dissipating heat from the integrated device without generating condensation. The second threshold is related to the structure of the cooling system and the performance of the integrated device. If the cooling system can still provide heat dissipation without the circulation of the heat exchange medium, the second threshold in this case is higher than the second threshold of a cooling system with poor heat dissipation without the circulation of the heat exchange medium. If the integrated device itself generates relatively low heat or has good high-temperature tolerance, its second threshold is higher than the second threshold for an integrated device with high heat generation or poor high-temperature tolerance.

[0091] An embodiment of the present application provides a cooling method for an integrated device, the integrated device comprising a circuit board, a first temperature sensor, and a humidity sensor. The first temperature sensor is configured to measure temperature, and the first humidity sensor is configured to measure humidity. The temperature and humidity are used to determine the dew point temperature of the environment within the integrated device, and the dew point temperature is used to determine a cooling method for the integrated device.

[0092] An embodiment of the present application provides a cooling method. Please refer to Figure 14, which is a flow chart of the cooling method provided by the present application, which is applied to a cooling system. The cooling system may be a cooling system as shown in any one of Figures 8, 9, and 11. The cooling system includes an integrated device as described in any one of the first aspects, such as an integrated device as shown in any one of Figures 2 to 7, a cooling pipeline, a valve, and a heat exchange medium. The cooling pipeline is used to circulate the heat exchange medium, the heat exchange medium is used to dissipate heat for the integrated device, and the valve is used to control the switch of the cooling pipeline. When the valve is open, the heat exchange medium circulates in the cooling pipeline, and the integrated device is in a liquid cooling state; when the valve is closed, the heat exchange medium does not circulate in the cooling pipeline, and the integrated device is in other cooling states such as natural cooling or air cooling. The process is carried out as follows: in the first step, S1401, the integrated device is powered on and the valve remains closed; in the second step, S1402, the temperature and humidity sensors measure the temperature and humidity to determine the dew point temperature; in the third step, S1403, it is determined whether the temperature of the heat exchange medium is higher than the dew point temperature or the temperature of the heat exchange medium is higher than the sum of the dew point temperature and the first threshold value. If not, execute step S1401; if so, execute step S1404, the valve remains open, and the valve is closed after the integrated device is powered off.

[0093] An embodiment of the present application provides a terminal, the terminal comprising the integrated device or cooling system according to any one of the first aspect or the second aspect. Optionally, the terminal is a vehicle.

[0094] An embodiment of the present application provides a computer-readable storage medium. When the computer-readable storage medium is executed on a computer or a processor, the cooling method described in any one of the embodiments of the present application is executed.

[0095] For the technical effects of the cooling method and the terminal, please refer to the introduction of various implementation methods of the integrated device, cooling system, and cooling method, which will not be repeated here.

[0096] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0097] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0098] The units described as separate components may or may not be physically separate, and the components shown as units may be one physical unit or multiple physical units, that is, they may be located in one place or distributed in multiple places. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0099] In addition, the functional units in the various embodiments of the present application may be integrated into a single processing unit, or each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0100] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An integrated device, characterized in that: The integrated device includes a circuit board, a first temperature sensor and a humidity sensor, The first temperature sensor is used to measure temperature, The humidity sensor is used to measure humidity. The temperature and humidity are used to obtain the dew point temperature of the environment inside the integrated device. The dew point temperature is used to determine the cooling method of the integrated device.

2. The integrated device according to claim 1, characterized in that The integrated device further comprises a first processing module, The first processing module is used to calculate the dew point temperature according to temperature and humidity data.

3. The integrated device according to any one of claims 1 to 2, characterized in that: The first temperature sensor is located on the circuit board.

4. The integrated device according to any one of claims 1 to 3, characterized in that: The humidity sensor is located on the circuit board.

5. The integrated device according to any one of claims 1 to 4, characterized in that: The integrated device further comprises a cold plate and / or a second temperature sensor, The cold plate is used for heat exchange of the integrated device. The second temperature sensor is used to measure the temperature of the cold plate.

6. A cooling system, characterized in that: The integrated device according to any one of claims 1 to 5, a cooling pipeline, a valve and a heat exchange medium, The cooling pipeline is used to circulate the heat exchange medium. The heat exchange medium is used to dissipate heat from the integrated device. The valve is used to control the opening and closing of the cooling pipeline.

7. The cooling system according to claim 6, characterized in that The cooling system further includes a second processing module, The cooling method of the integrated device includes: When the temperature of the heat exchange medium is higher than the dew point temperature, or the temperature of the heat exchange medium is higher than the sum of the dew point temperature and a first threshold, the second processing module is configured to control the valve to open.

8. The cooling system according to claim 7, characterized in that The first threshold is related to the accuracy of the temperature and / or humidity sensor.

9. The cooling system according to any one of claims 6 to 8, characterized in that: When the temperature of the heat exchange medium is not higher than the dew point temperature, or when the temperature of the heat exchange medium is not higher than the sum of the dew point temperature and the first threshold value, the valve is closed.

10. The cooling system according to any one of claims 6 to 9, characterized in that: The cooling system further comprises a third temperature sensor, The third temperature sensor is used to measure the temperature of the heat exchange medium.

11. A cooling method, applied to a cooling system, the cooling system comprising an integrated device, a cooling pipeline, a heat exchange medium, and a valve, characterized in that: Powering on the integrated device, After the integrated device is powered on for a first period of time, the valve opens. The heat exchange medium flows through the cooling pipe. The heat exchange medium dissipates heat from the integrated device.

12. A cooling method, applied to a cooling system, the cooling system comprising an integrated device, a cooling pipeline, a valve, and a heat exchange medium, characterized in that: Get the ambient temperature of the integrated device. When the ambient temperature is lower than a second threshold, the valve is closed.

13. The cooling method according to claim 12, characterized in that: When the ambient temperature is not lower than the second threshold, if the power-on time of the integrated device is longer than the first time, The valve opens, The heat exchange medium flows through the cooling pipe. The heat exchange medium dissipates heat from the integrated device.

14. A cooling method, applied to an integrated device, the integrated device comprising a circuit board, a first temperature sensor and a humidity sensor, characterized in that: The first temperature sensor measures the temperature, The humidity sensor measures humidity, Obtaining the dew point temperature of the environment within the integrated device according to the temperature and humidity, A cooling method of the integrated device is determined according to the dew point temperature.

15. The cooling method according to claim 14, characterized in that: The integrated device further comprises a first processing module, The first processing module calculates the dew point temperature according to temperature data and humidity data.

16. The cooling method according to any one of claims 14 to 15, characterized in that: The first temperature sensor is located on the circuit board.

17. The cooling method according to any one of claims 14 to 16, characterized in that: The humidity sensor is located on the circuit board.

18. The cooling method according to any one of claims 14 to 17, characterized in that: The integrated device further comprises a cold plate and / or a second temperature sensor, The cold plate realizes the heat exchange of the integrated device, The second temperature sensor measures temperature data of the cold plate.

19. A cooling method, applied to a cooling system, the cooling system comprising the integrated device according to any one of claims 1 to 5, a cooling pipeline, a valve and a heat exchange medium, The heat exchange medium flows through the cooling pipe. The heat exchange medium dissipates heat from the integrated device. The valve controls the opening and closing of the cooling circuit.

20. The cooling method according to claim 19, characterized in that The cooling system further includes a second processing module, which controls the valve to open when the temperature of the heat exchange medium is higher than the dew point temperature or the temperature of the heat exchange medium is higher than the sum of the dew point temperature and a first threshold.

21. The cooling method according to claim 20, characterized in that: The first threshold is related to the accuracy of the temperature sensor and / or the humidity sensor.

22. The cooling method according to any one of claims 19 to 21, characterized in that: When the temperature of the heat exchange medium is not higher than the dew point temperature, or when the temperature of the heat exchange medium is not higher than the sum of the dew point temperature and a first threshold value, the valve is closed.

23. The cooling method according to any one of claims 19 to 22, characterized in that: The cooling system further comprises a third temperature sensor, The third temperature sensor measures the temperature of the heat exchange medium.

24. A terminal, characterized in that: The terminal comprises the integrated device or cooling system according to any one of claims 1-5, 6-10.

25. The terminal according to claim 24, characterized in that The terminal is a vehicle.

26. A computer-readable storage medium for storing a computer program, characterized in that: When the computer program is executed on a computer or a processor, the method according to any one of claims 11 to 23 is performed.

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