Heat dissipation device of electronic equipment

Abstract

The present invention relates to a heat dissipation device for an electronic device, and more particularly, to a heat dissipation device for an electronic device, the heat dissipation device comprising: a heat conduction panel main body in which a refrigerant flow space in which a refrigerant filled therein is subjected to phase change and gas-liquid circulation is formed; and an absorber which is disposed in the refrigerant flow space of the heat conduction panel main body, absorbs and retains a liquid refrigerant in the refrigerant, and disperses the liquid refrigerant in the gravity direction or at least in the direction opposite to the gravity direction, and which maintains the absorption rate of the liquid refrigerant by the material itself. And meanwhile, the shape deformation in the gravity direction is prevented, so that the heat dissipation performance is greatly improved on the whole.

Description

Technical Field

[0001] The present invention relates to a heat dissipation apparatus for an electronic device (HEAT DISSIPATION APPARA TUS FOR ELECTRONIC DEVICE), and more particularly, to a heat dissipation apparatus for an electronic device that can maintain the absorption capacity of a liquid refrigerant (liquid refrigerant) while preventing shape deformation caused by gravity, thereby improving heat dissipation performance. Background Art

[0002] In related technologies in various industrial fields such as communication, electronics, and electricity, continuous development is being made towards higher levels for application in more advanced industries. To conduct high-level technology development, high-output energy is required, and devices using high-output energy inevitably face the problem of high heat generation. Therefore, a matching cooling system must be developed simultaneously.

[0003] Heat dissipation systems are widely used in industries such as air conditioners, mobile communications, data centers, air transportation, electric vehicles, energy storage devices, and displays. These heat dissipation systems are one of the main causes of energy consumption, and energy consumption gradually increases with the development of the industry.

[0004] Generally, heat dissipation devices (Cooling Device) can be roughly divided into active heat dissipation devices (Active Cooling Device) and passive heat dissipation devices (Passive Cool ing De vice). Active heat dissipation devices mainly utilize forced convection generated by a fan, while passive heat dissipation devices are technologies that utilize natural convection without using a fan.

[0005] Here, existing heat dissipation systems have certain limitations when dissipating high heat generated by continuously developing high-end technologies. Therefore, the related industrial fields need innovative technologies that can solve these problems, and as part of the solution, heat dissipation devices using phase change materials are being developed.

[0006] However, preferably, the structure of a heat dissipation device using a phase change material should be designed such that the liquid refrigerant changes phase to a gaseous refrigerant at a position closest to the heat-generating body that is the target of heat dissipation. However, when the heat-generating bodies are arranged separately in the direction of gravity, the liquid refrigerant will shift downward due to gravity and be stored. Therefore, appropriately dispersing the liquid refrigerant at the position of each heat-generating body is the most critical factor in improving heat dissipation performance.

[0007] Existing heat dissipation devices such as vapor chambers adopt a technical structure. In this structure, in order to disperse the liquid refrigerant, a core component with a plurality of pore structures is integrated into the space (refrigerant flow space) where the refrigerant undergoes gas-liquid circulation through sintering, and the surface tension characteristics of the liquid are utilized to achieve the dispersion of the refrigerant.

[0008] However, there are limitations in dispersing the liquid refrigerant against gravity to the direction of gravity by utilizing the surface tension characteristics of the liquid, and the manufacturing and installation methods of the core component are extremely complex, resulting in a decrease in the production efficiency of the product.

[0009] In addition, due to the above-mentioned limitations in the dispersion of the liquid refrigerant based on the surface tension of the liquid, conventional heat dissipation devices such as vapor chambers are usually horizontally arranged above a flat-configured heat-generating body for heat transfer or heat dissipation, resulting in great limitations in their applicability. Summary of the Invention

[0010] Technical Problem

[0011] The present invention aims to solve the above technical problems, and its purpose is to provide a heat dissipation device for an electronic device: including an absorber, which forms a dispersion force higher than the surface tension of the liquid in the direction opposite to the direction of gravity through the liquid absorption rate of the material itself, and can maintain its shape even when absorbing the liquid refrigerant.

[0012] In addition, another object of the present invention is to provide a heat dissipation device for an electronic device, which can be widely applied to the layout design of various heat-generating bodies without being restricted by them.

[0013] The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art through the following description.

[0014] Solution to the Problem

[0015] According to an embodiment of the present invention, a heat dissipation device for an electronic device includes: a heat-conducting panel main body, which forms a refrigerant flow space where the refrigerant undergoes gas-liquid circulation while filling the inside; and an absorber, which is disposed in the refrigerant flow space of the heat-conducting panel main body, absorbs and retains the liquid refrigerant in the refrigerant, and at the same time disperses the liquid refrigerant to the direction of gravity or at least the direction opposite to the direction of gravity, wherein the absorber maintains the absorption rate of the liquid refrigerant by the material itself while preventing shape deformation in the direction of gravity.

[0016] Wherein, the absorber may include: an absorption main body part, which has an absorption rate for the liquid refrigerant and is deformed in shape due to an external force including a specified gravity or more; and a skeleton maintaining part, which is combined with the absorption main body part to prevent the absorption main body part from being deformed in shape due to the external force.

[0017] In addition, the absorption main body may be composed of at least one of non-woven fabric, cotton, and sponge.

[0018] The skeleton maintaining part may be made of a metal material and formed into a tubular structure to form a hollow inside, and the absorption main body is located therein.

[0019] In addition, the skeleton maintaining part may be formed by weaving metal wires into the tubular structure.

[0020] In addition, the skeleton maintaining part may be woven to have slits so that at least the liquid refrigerant in the refrigerant passes from the outside to the absorption main body inside by surface tension.

[0021] In addition, the metal material of the skeleton maintaining part may be a material having a thermal conductivity of a specified value or more.

[0022] In addition, the metal material of the skeleton maintaining part may contain copper.

[0023] In addition, the skeleton maintaining part may be formed into a cylindrical shape, and the absorption main body may be formed into a cylindrical shape so as to be inserted into the cylindrical skeleton maintaining part.

[0024] In addition, the heat conduction panel main body is composed of a metal panel member having a thermal conductivity of a specified value or more, and the heat conduction panel main body includes: a first heat conduction panel forming one side surface of the refrigerant flow space; and a second heat conduction panel forming the other side surface of the refrigerant flow space, and the absorber may be disposed adjacent to one end portion adjacent to the external heat generating body in the refrigerant flow space between the first heat conduction panel and the second heat conduction panel.

[0025] In addition, the refrigerant flow space includes: a first refrigerant flow path constituting one end portion where the absorber is disposed; and a second refrigerant flow path formed to be inclined in the direction of gravity with respect to the first refrigerant flow path and defined by an inclined guide member, the inclined guide member being formed on the first heat conduction panel and the second heat conduction panel in such a manner as to reduce the thickness of the refrigerant flow space, and the absorber may be disposed in the first refrigerant flow path.

[0026] In addition, when the first refrigerant flow path where the absorber is disposed is set to receive the heat of the heat generating body, at least one end and the other end of the absorber may be spaced apart from each other at a specified interval in the direction of gravity.

[0027] Effects of the Invention

[0028] The heat dissipation device of the electronic device according to an embodiment of the present invention can achieve the following various effects.

[0029] First, it can overcome the limitation of dispersing the liquid refrigerant in the direction opposite to the gravitational direction through the surface tension inherent in the liquid, and can evenly disperse the liquid refrigerant in the gravitational direction, thereby improving the gas-liquid circulation rate and significantly enhancing the heat dissipation performance.

[0030] Second, it is not restricted by the position design of the heating element, thereby improving the diversity of the bonding design for the heating element. Description of the Drawings

[0031] Figure 1 is a perspective view showing the back surface of the antenna device of the heat dissipation device of an electronic device according to an embodiment of the present invention.

[0032] Figure 2 is shown Figure 1 exploded perspective view of the back surface of the antenna device shown.

[0033] Figure 3 is a perspective view showing the heat dissipation device of an electronic device according to an embodiment of the present invention.

[0034] Figure 4 is Figure 3 exploded perspective view of.

[0035] Figure 5 is Figure 3 sectional perspective view (a), partial enlarged view (b) thereof, and sectional view (c) of this part.

[0036] Figure 6 and Figure 7 is shown Figure 5 perspective view showing various embodiments of the absorber in the structure shown.

[0037] Description of Reference Numerals

[0038] 100: Antenna device 110: Heat dissipation housing main body

[0039] 150: Press-in part 200: Heat dissipation device

[0040] 200P: Heat conduction panel main body 200-1: One-side heat conduction panel

[0041] 200-2: The other-side heat conduction panel 205: Refrigerant flow space

[0042] 210: First refrigerant flow path 215: Multiple inclined guides

[0043] 220: Second refrigerant flow path 240: Multiple strength reinforcement parts

[0044] 300: Absorber 310: Absorption main body part

[0045] 320, 321, 322: Skeleton maintenance parts Detailed implementation manners

[0046] The heat dissipation device of an electronic device according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0047] When adding reference numerals to the components in the drawings, it should be noted that even if the same components are shown in different drawings, the same reference numerals should be added as much as possible. In addition, when describing the embodiments of the present invention, if it is determined that the detailed description of related known configurations or functions will hinder the understanding of the embodiments of the present invention, the detailed description will be omitted.

[0048] When describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish one component from another, and do not limit the nature, order or sequence of the components. In addition, unless otherwise defined, all terms used herein, including technical terms or scientific terms, have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms defined in a commonly used dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and will not be interpreted in an idealized or overly formal sense unless clearly defined in this application.

[0049] Figure 1 is a perspective view showing the back surface of an antenna device equipped with the heat dissipation device of an electronic device according to an embodiment of the present invention Figure 2 shows Figure 1 an exploded perspective view of the back surface of the antenna device shown

[0050] Generally, electronic devices are manufactured in various forms in various industries. However, the applicant of the present invention is a company engaged in the manufacture of other wireless communication devices. Therefore, the antenna device will be described as a specific example of a representative electronic device. Digital components such as FPGA, which is one of the representative heat generating components, and analog components such as PA and LNA, which play a role in amplifying signals, are installed inside the antenna device, and the performance of the device depends on whether the heat generated by these components is effectively dissipated.

[0051] However, the heat dissipation device of the embodiments of the present invention below should not necessarily be construed as being limited to the antenna device.

[0052] As Figure 1 and 2 shown, the antenna device 100 of the heat dissipation device 200 of an electronic device to which an embodiment of the present invention is applied includes a heat dissipation housing main body 110. The heat dissipation housing main body 110 forms a receiving space that opens forward and has a rectangular parallelepiped shape with a generally vertically long and thin front-back receiving width.

[0053] Although not shown in the figure, a main board can be stacked inside the accommodation space of the heat dissipation housing body 110. On the front side of the main board, a plurality of MBF (Micro Bellows Filter) elements are mounted through a clamshell as a substrate for a PAU (Power Amplifier Unit) and a DTU (Digital Transceiving Unit), and a heating element is mounted on the back side.

[0054] Here, on the back side of the main board, some heating elements (heating bodies) that generate a large amount of heat during operation can be mounted, such as FPGA elements, RFIC elements, PA elements, or LNA elements, etc.

[0055] However, it should be noted that in an embodiment of the present invention, only the antenna device is described as an electronic device, and the configuration of the heating body is not limited to the above configuration. For example, the heating body can also adopt typical heating elements, such as semiconductors.

[0056] On the front side of the accommodation space of the heat dissipation housing body 110, a radome panel (not labeled in the figure) is mounted to protect the radiation element, which is realized as an antenna element, from the external environment, and at the same time ensure that the radiation element can radiate smoothly.

[0057] On the other hand, on the back side of the heat dissipation housing body 110, a heat dissipation device 200 according to an embodiment of the present invention can be mounted.

[0058] The heat dissipation device 200 of the electronic device according to an embodiment of the present invention is a structure in the form of a heat sink. Strictly speaking, it is different from the fixed heat sink 200F described later. Its feature is that it adopts a thin plate heat exchanger (PTX) structure, and necessarily includes an absorber 300 described later for absorbing the liquid refrigerant in the refrigerant.

[0059] As Figure 1 and Figure 2 shown, on the back side of the heat dissipation housing body 110, the heat dissipation devices 200 according to an embodiment of the present invention can be respectively extended and arranged along the vertical up and down direction, and a plurality of heat dissipation devices are arranged at a predetermined interval in the adjacent left and right directions.

[0060] However, although not shown in the drawings, the plurality of heat dissipation devices 200 do not necessarily need to be arranged along the vertical up and down direction, and can also be arranged in an upwardly inclined manner from the central portion of the back side of the heat dissipation housing body 110 toward the left end and the right end, which is natural.

[0061] In this way, the reason why the heat dissipation devices 200 of multiple electronic devices according to an embodiment of the present invention are arranged in a vertically up-and-down direction and an upwardly inclined manner is that the upward flow of the heat dissipation gas generated by heat exchange with the external air can smoothly discharge along the space between adjacent heat dissipation devices 200 and the inclined heat dissipation device 200 with the minimum air flow resistance.

[0062] In addition, on the back surface of the heat dissipation housing main body 110, in addition to the heat dissipation device 200 of the electronic device according to an embodiment of the present invention described above, a fixed heat sink 200F can also be provided. The fixed heat sink 200F, like the heat dissipation device 200 of the electronic device according to an embodiment of the present invention, can be detachably coupled to the back surface of the heat dissipation housing main body 110 after being separately manufactured. However, the difference is that the fixed heat sink 200F does not fill the refrigerant inside, but only relies on the thermal conductivity of the metal material itself to dissipate the heat of the heating element.

[0063] Here, as Figure 1 and Figure 2 shown, the fixed heat sink 200F can be arranged on the lower side of the back surface portion of the heat dissipation housing main body 110, that is, the portion not occupied by the heat dissipation device 200 of the electronic device according to an embodiment of the present invention.

[0064] In addition, as Figure 1 and Figure 2 shown, on the back surface of the heat dissipation housing main body 110, a press-in portion 150 for press-fitting and installing a plurality of heat dissipation devices 200 according to an embodiment of the present invention can be formed.

[0065] The press-in portion 150 can generally adopt a groove-shaped structure so as to insert a part of the front end portion of the heat dissipation device 200 according to an embodiment of the present invention.

[0066] Here, the meaning of the press-in portion 150 adopting a groove-shaped structure is that a pair of groove ribs (not labeled in the figure) protrude backward from the back surface of the heat dissipation housing main body 110, and an insertion space such as a groove for inserting the front end portion (or a part of the front end portion) of the heat dissipation device 200 of the electronic device according to an embodiment of the present invention is formed between the pair of groove ribs.

[0067] At this time, although not shown in the drawings, in order to improve the heat conduction efficiency, it is preferably to coat thermal epoxy in the press-in portion 150 and then press-fit and install the heat dissipation device.

[0068] Here, the press-in portion 150 can be configured to pass through at least one of a plurality of heat generation contact surfaces (not shown) formed on the inner side surface corresponding to the back surface side of the heat dissipation housing main body 110. These heat generation contact surfaces are recessed and protrude backward so that the heat generation surface of the heating element can be accommodated therein.

[0069] Figure 3is a perspective view showing a heat dissipation device according to an embodiment of the present invention, Figure 4 is Figure 3 exploded perspective view of, Figure 5 is Figure 3 sectional perspective view (a) thereof, partial enlarged view (b) thereof, and sectional view (c) of this part.

[0070] As Figures 3 to 5 shown, the heat dissipation device 200 of an electronic device according to an embodiment of the present invention may include a heat conduction panel main body 200P, in which a refrigerant flow space 205 providing a gas-liquid circulation space is provided, and the refrigerant filled in the closed space dissipates heat through a phase change.

[0071] Herein, the heat conduction panel main body 200P may be defined as a structure in which a panel member made of a single metal material is processed by stamping and then processed by bending or joining to have the above-mentioned refrigerant flow space 205 inside.

[0072] On the other hand, the refrigerant flow space 205 may include a first refrigerant flow path 210, which constitutes an evaporation region, and the liquid refrigerant in the filled refrigerant is collected by at least one of gravity or capillary force and is vaporized into gaseous refrigerant under the action of heat transferred from the heating element.

[0073] As the front end portion in the width direction of the heat conduction panel main body 200P formed by the above-mentioned bending or joining process, the first refrigerant flow path 210 may be defined as being separated from the press-fitting portion 150 on which the heating element is installed by only the distance determined by the material thickness of the heat conduction panel main body 200P composed of the panel member made of a metal material, and occupying a part of the refrigerant filling and flow space for accommodating the liquid refrigerant in the refrigerant.

[0074] Specifically, the "distance determined by the material thickness" refers to the distance between the first refrigerant flow path 210 and the heating element or the press-fitting portion 150 on which the heating element is installed. However, the definition of the first refrigerant flow path 210 is not only a space for collecting liquid refrigerant, but more importantly, as an evaporation region at one end in the width direction of the heat conduction panel main body 200P, it absorbs heat from the heating element of the heat dissipation object, so its function is more significant.

[0075] On the other hand, the refrigerant flow space 205 may further include a plurality of second refrigerant flow paths 220 for guiding the liquid refrigerant to the side of the first refrigerant flow path 210.

[0076] Here, if the region where the first refrigerant flow path 210 is located is defined as the evaporation region described above, the region other than the evaporation region can be defined as the condensation region, and the second refrigerant flow path 220 can be provided in the condensation region outside the evaporation region.

[0077] The multiple second refrigerant flow paths 220 can serve to provide a flow path. When the gaseous refrigerant in the condensation region condenses and aggregates into a liquid refrigerant through heat conduction with the external air, the volume of the aggregated liquid refrigerant gradually increases at a specific position within the refrigerant flow space 205 where the aggregation occurs. At this time, the above-mentioned flow path can guide a uniform amount of liquid refrigerant to flow toward the side of the first refrigerant flow path 210 that extends vertically in the up and down direction when flowing in the direction of gravity.

[0078] In particular, as described later, the second refrigerant flow path 220 can be defined as the space between multiple inclined guiding members 215. When the liquid refrigerant aggregated in the condensation region flows toward the side of the first refrigerant flow path 210, due to the action of surface tension, the liquid refrigerant can be inhibited from flowing dispersedly to the side of the second refrigerant flow path 220 adjacent to its own flow path.

[0079] That is, since the space formed by the multiple inclined guiding members 215 is narrower than the thickness of the second refrigerant flow path 220, during the refrigerant condensation process, due to the action of surface tension, the flow of the refrigerant to the adjacent side of the second refrigerant flow path 220 is inhibited, and it is uniformly guided to the side of the first refrigerant flow path 210 along its own flow path.

[0080] On the other hand, as Figures 3 to 5 shown, the heat conduction panel main body 200P can include a first heat conduction panel 200-1 forming one side surface of the refrigerant flow space and a second heat conduction panel 200-2 forming the other side surface of the refrigerant flow space.

[0081] Here, the heat dissipation device 200 of the electronic device according to an embodiment of the present invention may further include a plurality of strength reinforcement portions 240, which are formed on at least one of the first heat conduction panel 200-1 and the second heat conduction panel 200-2, project from the inner surfaces of the first heat conduction panel 200-1 and the second heat conduction panel 200-2 toward the refrigerant flow space with a predetermined length, and are formed opposite to each other.

[0082] The multiple strength reinforcement portions 240 are generally formed on at least one of the first heat conduction panel 200-1 and the second heat conduction panel 200-2 in a planar form to enhance the strength and prevent bending or indentation caused by external pressure.

[0083] Here, a plurality of strength reinforcing portions 240 may be formed such that at least their front end faces protrude more into the refrigerant flow space than the front end faces of the plurality of inclined guides 215. At this time, the amount of protrusion of the front end faces of the plurality of strength reinforcing portions 240 toward the refrigerant flow space side is preferably set such that when the one heat conducting panel 200-1 and the other heat conducting panel 200-2 are joined, at least the portions facing each other can be joined in a surface contact manner.

[0084] However, the plurality of strength reinforcing portions 240 do not necessarily come into surface contact with each other in the refrigerant flow space, but may also be formed at intervals from each other in the refrigerant flow space like the inclined guides 215 described above. This is because just by forming the plurality of strength reinforcing portions 240 themselves, they can have the function of enhancing the strength of the one heat conducting panel 200-1 and the other heat conducting panel 200-2.

[0085] In addition, the plurality of strength reinforcing portions 240 are symmetrically formed on the one heat conducting panel 200-1 and the other heat conducting panel 200-2 with any reference line as a reference, and may be formed only on the plurality of inclined guides 215.

[0086] Here, the plurality of strength reinforcing portions 240 are formed on the surfaces of the heat conducting panel main body 200P where the one heat conducting panel 200-1 and the other heat conducting panel 200-2 face each other, and in the interior of the refrigerant flow space 205, their front end faces may be arranged to face each other. In addition, the plurality of strength reinforcing portions 240 arranged to face each other can join the facing and contacting surfaces by laser welding.

[0087] In particular, the plurality of strength reinforcing portions 240 are preferably formed on the plurality of inclined guides 215 that define the second refrigerant flow path 220, and these second refrigerant flow paths mainly serve as the flow paths for the gaseous refrigerant, so that the condensation surface area where the gaseous refrigerant, which has been phase-changed to a gaseous state in the refrigerant, contacts and condenses during the flow is increased.

[0088] Here, the liquid refrigerant in the first refrigerant flow path 210 that is arranged closest to the heat generating body in the refrigerant flow space 205 changes from a liquid refrigerant to a gaseous refrigerant when it absorbs heat from the heat generating body and reaches the boiling point of the refrigerant.

[0089] However, with respect to the refrigerant filled into the refrigerant flow space 205 of the heat conducting panel body 200P, since it is necessary to ensure the gas refrigerant space (volume) for the phase change into gaseous refrigerant, it cannot be completely filled with liquid refrigerant. Regarding the view that only a very small amount of liquid refrigerant should be filled into the refrigerant flow space 205, when the first refrigerant flow path 210 is arranged along the vertical gravity direction, an empty cavity region without liquid refrigerant is necessarily formed on the upper side of the first refrigerant flow path 210. In this case, due to the difference in the evaporation amount between the side of the first refrigerant flow path 210 corresponding to the empty cavity region where liquid refrigerant does not exist and the side of the first refrigerant flow path 210 occupied by liquid refrigerant, it may be difficult to ensure uniform heat dissipation performance as a whole.

[0090] To solve the above problems, as Figures 3 to 5 shown, the heat dissipation device 200 of an electronic device according to an embodiment of the present invention may further include an absorber 300, which absorbs the liquid refrigerant from the state of the refrigerant guided through the second refrigerant flow path 220 and then uniformly disperses it on the first refrigerant flow path 210.

[0091] The absorber 300 here includes the concept of a core component with a core structure inside a common vapor chamber, but is not limited thereto. As long as it can collect and disperse liquid refrigerant in the vertical direction on the first refrigerant flow path 210 arranged vertically with respect to the gravity direction, thereby improving the limitations of the heat conducting material of an existing common heat sink and enabling the heat dissipation performance to be maximized, it can be a concept including all of these.

[0092] On the other hand, the closer to the press-in end 201 side, the easier it is for the heat transferred from the heat generating body to actively phase-change the liquid refrigerant into gaseous refrigerant. Therefore, preferably, the absorber 300 is arranged as far as possible inside the first refrigerant flow path 210 side close to the inside of the press-in end 201.

[0093] However, the absorber 300 does not have to be arranged only close to the press-in end 201 side. Of course, it can also be arranged to be uniformly dispersed in the entire evaporation region where the refrigerant can evaporate.

[0094] Figure 6 And Figure 7 are perspective views showing various embodiments of the absorber in the structure shown in Figure 5 shown.

[0095] In the heat dissipation device 100 of an electronic device according to an embodiment of the present invention, the absorber 300 is arranged in the refrigerant flow space 205 of the heat conducting panel body 200P, and can perform the function of absorbing and holding the liquid refrigerant in the refrigerant and dispersing the liquid refrigerant in the gravity direction or at least in the direction opposite to the gravity direction.

[0096] More specifically, as Figure 6 and Figure 7 shown, the absorber 300 may include: an absorption main body 310, having a specified absorption rate for the liquid refrigerant, formed of a material that deforms in shape by an external force greater than a specified gravity; and a skeleton maintaining portion 320, coupled to the absorption main body 310, preventing the shape deformation of the absorption main body 310 caused by the external force.

[0097] Among them, the absorption main body 310 may be composed of at least one of non-woven fabric, cotton, and sponge that form a plurality of pores (a kind of core structure). The absorption main body 310 composed of non-woven fabric, cotton, and sponge may be arranged longer in the up-down gravity direction due to the characteristics of its material, but when the pores contain liquid, it may sag in the gravity direction due to the weight of the liquid, and its outer shape (shape) may be deformed.

[0098] The skeleton maintaining portion 320 functions to prevent the shape deformation such as the sagging phenomenon of the absorption main body 310 as described above. For this purpose, the skeleton maintaining portion 320 may be formed in a tubular shape with a hollow (not labeled in the figure) inside where the absorption main body 310 is located.

[0099] Preferably, the skeleton maintaining portion 320 is also a structure that needs to transfer the heat transferred from the external heating element to the internal absorption main body 310. Therefore, a metal material with a specified thermal conductivity or more is preferably used. For example, the metal material constituting the skeleton maintaining portion 320 may be copper (pure copper) material.

[0100] In addition, as Figure 6 shown, the skeleton maintaining portion 320 may be woven into a tubular shape (refer to reference numeral "321"), or as Figure 7 shown, the skeleton maintaining portion 320 may be arranged to wind in a spiral shape (refer to reference numeral "322").

[0101] More specifically, referring to Figure 6 , the skeleton maintaining portion 321 may be woven with a metal (copper, pure copper) wire of a metal material in a tubular shape, so that the liquid refrigerant respectively guided to the first refrigerant flow path 210 side through a plurality of second refrigerant flow paths 220 can penetrate into the internal absorption main body 310.

[0102] At this time, the skeleton maintaining portion 321 may be woven to have gaps through which at least the liquid refrigerant in the refrigerant is transferred from the outside to the internal absorption main body 310 by surface tension. In this case, the gaseous refrigerant that has undergone a phase change from the liquid refrigerant through the absorption main body 310 can be easily dispersed to the outside through the woven gaps.

[0103] In addition, referring to Figure 7, the skeleton maintaining part 322 can be arranged in such a way that a metal (copper, pure copper) panel (or wire) is wound around the outside of the absorption main body part 310 in a spiral shape.

[0104] Preferably, the metal panel (or metal wire) has a shape retention force such that it can prevent sagging downward due to gravity at least when the absorption main body part 310 contains sufficient liquid refrigerant.

[0105] On the other hand, as Figure 6 shown, the skeleton maintaining part 321 is formed in a cylindrical shape, and the absorption main body part 310 can be formed in a cylindrical shape to be inserted into the skeleton maintaining part 321 formed in a cylindrical shape.

[0106] As described above, in the heat dissipation device 200 of the electronic device according to an embodiment of the present invention, the absorber 300 is separately manufactured and combined with the absorption main body part 310 and the skeleton maintaining part 320. However, without additionally setting the skeleton maintaining part 320, when it contains liquid refrigerant, if the shape retention force of the absorption main body part 310 itself does not cause shape deformation such as sagging, it is also sufficient to only set the absorption main body part 310 itself.

[0107] The absorber 300 of the above embodiment includes: an absorption main body part 310 formed of one of non-woven fabric, cotton, and sponge; a skeleton maintaining part 320 woven into a tubular shape or wound into a spiral shape from a metal (copper, pure copper) wire material, thereby preventing sagging downward regardless of the amount of liquid refrigerant contained in the absorption main body part 310, so that a uniform amount of liquid refrigerant can undergo a phase change on the first refrigerant flow path 210.

[0108] On the other hand, although not shown, the heat dissipation device 200 of the electronic device according to an embodiment of the present invention may further include a plurality of absorber fixing guides (not shown), which are simultaneously formed with the above-mentioned first refrigerant flow path 210 to the second refrigerant flow path 220 and the plurality of inclined guides 215 or the plurality of strength reinforcing parts 240 when the heat conducting panel main body 200P is formed by a stamping process.

[0109] When the absorber 300 made of non-woven fabric absorbs liquid refrigerant, there is a concern of sagging in the direction of gravity. To prevent this phenomenon, the plurality of absorber fixing guides protrude toward the refrigerant flow space side, so that when the one heat conducting panel 200-1 and the other heat conducting panel 200-2 are joined, they can play a role of pressing the absorber 300 while stably fixing it.

[0110] Furthermore, multiple absorber fixing guides can also perform the following functions simultaneously: pressing the outer side surface of the absorbent main body 310 or the skeleton maintaining part 320 made of a soft material, thereby ensuring a space for the flow of the gaseous refrigerant (gaseous refrigerant) evaporated in the first refrigerant flow path 210.

[0111] As described above, an absorber 300 is built into the first refrigerant flow path 210. The liquid refrigerant liquefied from the heat dissipation plate part 203 side moves to a position close to the heating element through the absorption force (or capillary force) of the absorber 300, and then the gaseous refrigerant that has undergone a phase change due to the heat transferred from the heating element moves back to the heat dissipation plate part 203 side. By repeating the above process, a gaseous cycle is achieved.

[0112] The gaseous refrigerant moving toward the heat dissipation plate part 203 side is uniformly dispersed as a whole to perform heat dissipation while being condensed, and the condensed liquid refrigerant easily moves back to the first refrigerant flow path 210 side in the direction of its own weight along the second refrigerant flow path 220 whose size in the thickness direction is relatively larger than that of the multiple inclined guides 215.

[0113] The heat generated from the heating element is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is provided. Most of the refrigerant stored on the first refrigerant flow path 210 side where the absorber 300 is provided is in a liquid state. After undergoing a phase change to a gaseous state due to the heat transferred from the heating element, it flows to the entire heat dissipation plate part 203 of the heat conduction panel main body 200P and dissipates heat.

[0114] As described above, the heat dissipation device 200 of an electronic device according to an embodiment of the present invention has been described in detail with reference to the accompanying drawings. However, the embodiments of the present invention are not necessarily limited to the above-described one embodiment, and those of ordinary skill in the technical field to which the present invention pertains can make various modifications and implement them within an equivalent range, which is natural. Therefore, the true scope of the rights of the present invention is determined by the claims.

[0115] Industrial Applicability

[0116] The present invention provides a heat dissipation device for an electronic device: including an absorber, which forms a dispersive force higher than the liquid surface tension in the direction opposite to the gravity direction through the liquid absorption rate of the material itself, and can maintain its shape even when absorbing liquid refrigerant.

Claims

1. A heat dissipation device for an electronic device, wherein, Comprising: A heat-conducting panel body, which forms a refrigerant flow space where a refrigerant undergoes a phase change and a gas-liquid cycle while being filled inside; And An absorber, disposed in the refrigerant flow space of the heat-conducting panel body, which absorbs and retains the liquid refrigerant in the refrigerant, and at the same time disperses the liquid refrigerant in the direction of gravity or at least the opposite direction of the gravity direction, Wherein, the absorber maintains the absorption rate of the liquid refrigerant by its own material, and at the same time prevents shape deformation in the direction of gravity.

2. The heat dissipation device of the electronic device according to claim 1, wherein, The absorber includes: An absorption main body portion, which has an absorption rate for the liquid refrigerant and is deformed in shape due to an external force greater than a specified gravity; and A skeleton maintaining portion, which is combined with the absorption main body portion and is used to prevent the absorption main body portion from being deformed in shape due to the external force.

3. The heat dissipation device of the electronic device according to claim 2, wherein, The absorption main body portion is composed of at least one of non-woven fabric, cotton and sponge.

4. The heat dissipation device of the electronic device according to claim 2, wherein, The skeleton maintaining portion is made of a metal material and is formed into a tubular structure with a hollow inside to accommodate the absorption main body portion therein.

5. The heat dissipation device of the electronic device according to claim 4, wherein, The skeleton maintaining portion is formed by weaving metal wires into the tubular structure.

6. The heat dissipation device of the electronic device according to claim 5, wherein, The skeleton maintaining portion is woven to have gaps so that at least the liquid refrigerant in the refrigerant can be transferred from the outside to the absorption main body portion inside through surface tension.

7. The heat dissipation device of the electronic device according to claim 4, wherein, The metal material of the skeleton maintaining portion is a material with a specified heat conductivity or more.

8. The heat dissipation device of the electronic device according to claim 7, wherein, The metal material of the skeleton maintaining portion contains copper.

9. The heat dissipation device of the electronic device according to claim 2, wherein, The skeleton maintaining portion is formed into a cylindrical shape, The absorption main body portion is formed into a cylindrical shape so as to be inserted into the cylindrical skeleton maintaining portion.

10. The heat dissipation device of the electronic device according to claim 1, wherein, The heat-conducting panel body is composed of a metal panel component with a specified heat conductivity or more, and the heat-conducting panel body includes: One-side heat-conducting panel, which forms one side surface of the refrigerant flow space; and The other-side heat-conducting panel, which forms the other side surface of the refrigerant flow space, The absorber is arranged adjacent to one end adjacent to the external heat-generating body in the refrigerant flow space between the one-side heat-conducting panel and the other-side heat-conducting panel.

11. The heat dissipation device of the electronic device according to claim 10, wherein, The refrigerant flow space includes: A first refrigerant flow path, which constitutes the one end where the absorber is arranged; and A second refrigerant flow path, which is formed obliquely in the direction of gravity with respect to the first refrigerant flow path and is defined by an inclined guiding member, and the inclined guiding member is formed between the one-side heat-conducting panel and the other-side heat-conducting panel in a manner that reduces the thickness of the refrigerant flow space, Wherein, the absorber is arranged in the first refrigerant flow path.

12. The heat dissipation device of the electronic device according to claim 11, wherein, When the first refrigerant flow path provided with the absorber is set to receive the heat of the heating element, at least one end and the other end of the absorber are spaced apart from each other at a predetermined interval in the direction of gravity.

Images