Welding device and lap joint device comprising same

Abstract

The welding apparatus may include: a stage on which a solar cell and a wire are disposed; a main body facing the stage; and a plurality of heaters disposed on a bottom surface of the main body to face the solar cells and the wires. The table may include a support portion having a plurality of guide pins configured to rise from below to support the wires toward the solar cells.

Description

Technical Field

[0001] The present invention relates to a welding device and a lapping device including the welding device. Background Art

[0002] A solar cell (i.e., a solar battery) is formed by positioning a diode having a p-n junction on a substrate. When sunlight irradiates the solar cell, excitons are generated in the electron-hole pairs, and as the excitons are separated, electrons move to the n-layer and holes move to the p-layer. Accordingly, a photoelectromotive force is generated in the p-n junction portion. Tabbing is a process of forming a solar cell module by positioning wires on a plurality of solar cells and electrically connecting the plurality of solar cells.

[0003] The lapping device includes a soldering device as a joining device for connecting a plurality of solar cells. The soldering device electrically connects the solar cell and the wire by melting solder on the wire in a state where the wire is positioned on the solar cell. Such a soldering process requires firmly supporting the solar cell and the wire so as to connect the solar cell and the wire at a specified position. However, the conventional lapping device does not have a component for supporting the solar cell and the wire during the soldering process, or has only a component that presses the solar cell and the wire only from the top but cannot strongly push the solar cell and the wire upward from the bottom or cannot prevent the wire from being misaligned.

[0004] In particular, when the solar cell is placed on the welding device and moved, a large-area solar cell may partially sag or bend due to its weight. When soldering is performed without correcting the misaligned position, the solar cell and the wire cannot be correctly connected. Summary of the Invention

[0005] Technical Problem

[0006] The present invention aims to provide a welding device capable of supporting a solar cell and a wire during a soldering process and a lapping device including the welding device.

[0007] Technical Solution

[0008] The welding device includes: a stage on which a solar cell and a wire are placed; a main body facing the stage; and a plurality of heaters on a bottom surface of the main body to face the solar cell and the wire, wherein the stage includes a support having a plurality of guide pins rising from below to support the wire toward the solar cell.

[0009] The support member may include a pin adjustment block, the pin adjustment block including a controller and air channels, each of the air channels communicating with one of a plurality of guide pins, and the controller being able to open or close the air channels and vertically move the plurality of guide pins.

[0010] When the air channels are open, the supplied air can raise the plurality of guide pins to support the wire, and when the air channels are closed, the plurality of guide pins can be lowered and can be out of contact with the wire.

[0011] The support member may include a first housing positioned on the pin adjustment block and including a plurality of first lifting holes, a plurality of lifting pins being inserted into the plurality of first lifting holes, and when the air channels are open, the plurality of lifting pins can be raised to raise the corresponding plurality of guide pins.

[0012] The support member may include a second housing having a plurality of second lifting holes and having an uneven portion, the plurality of guide pins being inserted into the plurality of second lifting holes, the uneven portion including a plurality of recessed portions and protrusions and being formed on the upper surface of the second housing, and the plurality of guide pins can overlap with the uneven portion.

[0013] The support member can selectively support the wire by raising at least some of the plurality of guide pins using air.

[0014] The support member may include a plurality of support portions, the plurality of support members being spaced apart from each other in one direction and having upper surfaces, and a plurality of wires being positioned on the upper surfaces and spaced apart from each other in one direction.

[0015] The lapping device is for placing a solar cell and a wire fixture on a wire on a wire transfer device and welding the solar cell and the wire to form a solar cell module. The lapping device includes a welding device, and the welding device includes: a stage on which the solar cell and the wire are placed; a main body facing the stage; and a plurality of heaters on the bottom surface of the main body to face the solar cell and the wire, wherein the stage includes a support member having a plurality of guide pins rising from below to support the wire toward the solar cell.

[0016] Advantageous Effects

[0017] The welding device and the lapping device including the welding device can support the wire during the welding process so that the wire and the solar cell can be properly connected to each other.

[0018] Since the welding device and the lapping device including the welding device can support the wire toward the solar cell using a plurality of guide pins positioned corresponding to the connection points between the wire and the solar cell, the wire and the solar cell can be more properly connected to each other.

[0019] The welding device and the lapping device including the welding device can prevent the wire from detaching from the designated position or sagging downward during the welding process by pressing the wire against the solar cell. Description of the Drawings

[0020] Figure 1 is a schematic diagram showing the lapping device.

[0021] Figure 2 shows the state where the solar cell and the wire are connected.

[0022] Figure 3 shows the welding process of the welding device.

[0023] Figure 4 shows the table of the welding device.

[0024] Figure 5 shows the cross-section of the support member.

[0025] Figure 6 shows the second housing.

[0026] Figure 7 shows the state where the wire is placed on the support member.

[0027] Figure 8 is an enlarged view of the upper surface of the second housing.

[0028] Figure 9 shows the state where the support member supports the wire. Detailed Description

[0029] The welding device includes: a table on which a solar cell and a wire are placed; a main body facing the table; and a plurality of heaters on the bottom surface of the main body to face the solar cell and the wire, wherein the table includes a support member having a plurality of guide pins rising from below to support the wire toward the solar cell.

[0030] Mode of the Present Invention

[0031] Hereinafter, the present disclosure will be described with reference to the embodiments illustrated in the drawings. The described embodiments are not limited to the content described in the specification and may have different forms. Therefore, only the embodiments will be described below with reference to the drawings to describe the aspects and features of the present invention.

[0032] The present disclosure includes various embodiments and modifications, and the specific embodiments will be illustrated in the drawings and described below. However, the present disclosure is not limited to the above embodiments and includes all modifications, equivalents, or alternatives included in the spirit and scope of the present invention.

[0033] When referring to an element or layer being "on" or "connected" or "coupled" to another element or layer, the element or layer can be directly connected or coupled to the other element or layer. Alternatively, one or more intervening elements or layers may be present. When referring to an element or layer being "directly on" or "directly connected" or "directly coupled" to another element or layer, there may be no other intervening elements or layers therebetween. For example, when referring to a first element and a second element being "coupled" or "connected", the first element can be directly coupled or directly connected to the second element, or the first element can be indirectly coupled or indirectly connected to the second element through one or more intervening elements.

[0034] For clarity of illustration, the dimensions of various elements, layers, etc. in the drawings may be exaggerated. The same reference numerals may refer to the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Additionally, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure". When phrases such as "at least one of" and "any one of" are described after a list of elements, these phrases can modify the elements of the entire list, but not the individual elements in the list. For example, a phrase such as "at least one of a, b, or c" can refer to only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variants thereof. As used herein, the terms "use", "using", and "used" may be considered synonymous with the terms "utilize", "utilizing", and "utilized", respectively. The terms "substantially", "about", and similar terms used herein are used as approximate terms and not terms of degree, and are intended to describe the inherent deviations of measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0035] Terms such as first, second, and third may be used to describe various elements, components, regions, layers, and / or portions, but these elements, components, regions, layers, and / or portions are not limited to these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Thus, without departing from the disclosure of the exemplary embodiments, the first element, first component, first region, first layer, or first portion discussed below may be named the second element, second component, second region, second layer, or second portion.

[0036] For ease of description, spatial relative terms such as "below", "lower", "above", and "upper" may be used herein to describe the relationship between one element described in the drawings and the features of other elements or functions (another element or function). In addition to the directions depicted in the drawings, spatial relative terms may include other directions during the use or operation of the device. For example, when the device in the drawings is flipped, an element described as "below" or "beneath" another element or feature will be oriented "above" or "over" the other element or feature. Thus, the term "below" can include both upward and downward directions. The device may be oriented in different directions (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly.

[0037] The terms used herein are for describing embodiments of the present invention and are not intended to limit the present invention. The singular forms used herein may also include the plural forms unless the context clearly indicates otherwise. When used herein, the terms "comprising", "having", and "constituting" specify the presence of features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0038] When an embodiment can be implemented as a process, the specific process order may be executed differently from the described order. For example, two processes described consecutively may be executed simultaneously or substantially simultaneously, or may be executed in the reverse order relative to the described order.

[0039] Figure 1 is a schematic diagram showing the overlapping device 1, Figure 2 shows the state where the solar cell C and the wire W are connected, Figure 3 shows the welding process of the welding device 10, Figure 4 shows the table 100 of the welding device 10, Figure 5 shows the cross-section of the support member 110, Figure 6 shows the second housing 113, Figure 7 shows the state where the wire W is placed on the support member 110, Figure 8 is an enlarged view of the upper surface of the second housing 113, and Figure 9 shows the state where the support member 110 supports the wire W.

[0040] The lapping device 1 is a device that forms a solar cell module by connecting a solar cell C and a wire W. The solar cell C may have a semiconductor junction region having a p-n junction surface, and when irradiated with a certain amount or more of energy, the solar cell C can generate an electromotive force to convert light energy into electrical energy. The material of the semiconductor included in the solar cell C is not particularly limited, and (single crystal, polycrystalline, and amorphous) silicon, gallium arsenide, cadmium telluride, cadmium sulfide, indium phosphide, copper indium gallium selenide (CIGS), organic dyes, or a mixture thereof can be used as the material.

[0041] The wire W is a conductor for electrically connecting a plurality of solar cells C to each other and connecting the front and rear surfaces of adjacent solar cells C to each other. For example, the wire W can be electrically connected to the solar cell C through a soldering process. Alternatively, the wire W can be electrically connected to the solar cell C through a conductive adhesive (ECA).

[0042] When the solar cell C and the wire W are connected, the wire clamp J fixes the wire W to prevent the wire W from being lifted or detached from the designated position. For example, as Figure 1 shown, in a state where the wire W is positioned on the wire transfer device 40, the wire clamp J can be placed on the wire transfer device 40 to press the wire W. In addition, the wire clamp J can be supported and transferred by a moving device 50 described below.

[0043] For example, as Figure 1 shown, the lapping device 1 may include a soldering device 10, a solar cell transfer device 20, a solar cell supply device 30, a wire transfer device 40, a moving device 50, and a wire clamp transfer device 60.

[0044] The soldering device 10 is positioned to perform the end processing of the lapping device 1 and forms a solar cell module by joining the wire W and the solar cell C. For example, the soldering device 10 can electrically connect the solar cell C and the wire W by melting solder in a state where the wire W is placed on the solar cell C. The soldering device 10 will be described below.

[0045] The solar cell transfer device 20 is positioned on one side of the lapping device 1 and transfers the solar cell C to the solar cell supply device 30. For example, as Figure 1 shown, the solar cell transfer device 20 can receive the solar cell C from an external device or pick up the solar cell C loaded in a box or the like, and transfer the solar cell C to the solar cell supply device 30. For example, the solar cell transfer device 20 can be a conveyor for transferring the solar cell C in one direction (e.g., Figure 1 the up and down direction). In addition, Figure 1A solar cell transfer device 20 is shown, but the present invention is not limited thereto. There may be two or more solar cell transfer devices 20.

[0046] The solar cell supply device 30 divides the solar cells C received from the solar cell transfer device 20 according to size, and transfers the divided solar cells C to the moving device 50. For example, the solar cell supply device 30 may include a scribing device 31 and a stage 33.

[0047] The scribing device 31 divides the solar cells C received from the solar cell transfer device 20 into sizes suitable for solar cell modules. For example, the scribing device 31 may use a breaking device to divide the solar cells C into multiple parts after laser is irradiated onto the upper surface of the solar cells C.

[0048] The stage 33 can move to a predetermined position while supporting the divided solar cells C, so that the moving device 50 can support the solar cells C. The stage 33 can move in three-axis directions such as the X-axis direction, the Y-axis direction, and the Z-axis direction, and can rotate around the Z-axis to correct the position of the solar cells C. In addition, the stage 33 can support the wire clamp J in addition to the solar cells C. That is, the wire clamp J conveyed by the wire clamp transfer device 60 described below can be placed on the stage 33, and the moving device 50 can support the solar cells C and the wire clamp J to place the solar cells C and the wire clamp J on the wire W.

[0049] The wire transfer device 40 can be spaced apart from the solar cell supply device 30. The wire transfer device 40 can transfer a plurality of wires W. For example, the wire transfer device 40 is a conveyor belt extending in a direction (e.g., Figure 1 the left-right direction or the transfer direction of the wire W) perpendicular to the moving direction of the cell clamp transfer member 55 (e.g., Figure 1 the up-down direction), and can transfer a plurality of (e.g., six or more) wires W. For example, as Figure 7 shown, 12 wires W can be spaced apart by a distance D1. In this case, a welding material (e.g., solder) can be applied or plated onto the wires W supplied to the wire transfer device 40. For example, in an embodiment, a dipping unit (not shown) for applying or plating a welding material onto the wires W may also be included, and the wires W passing through the dipping unit can be supplied to the wire transfer device 40.

[0050] For example, when the solar cells C and the wire clamp J approach the wire W via the cell clamp transfer member 55, the wire transfer device 40 temporarily stops so that the solar cells C and the wire clamp J are placed on the wire W. Thereafter, the wire transfer device 40 can operate again to transfer the wire W.

[0051] The mobile device 50 moves the solar cell C and the wire clamp J to the wire W. For example, as Figure 1 shown, the mobile device 50 can be positioned across the wire conveying device 40 and the wire clamp conveying device 60. That is, the mobile device 50 can overlap the wire conveying device 40 and the wire clamp conveying device 60 in a plan view. In addition, the mobile device 50 can include a first support member 51 and a second support member 53, and can include a battery clamp conveying member 55 that moves along the first support member 51.

[0052] The first support member 51 is a frame that extends through and elongates beyond the wire clamp conveying device 60 and the wire conveying device 40, and both ends of the first support member 51 can be connected to the second support member 53. The second support member 53 can extend in a direction intersecting the first support member 51, and the first support member 51 can adjust the position of the battery clamp conveying member 55 while moving in the longitudinal direction of the second support member 53.

[0053] The battery clamp conveying member 55 can move in the longitudinal direction of the first support member 51, support the solar cell C and the wire clamp J, and place the solar cell C and the wire clamp J on the wire W. For example, the battery clamp conveying member 55 can support the solar cell C and the wire clamp J placed on the table 33 simultaneously or separately. In addition, the battery clamp conveying member 55 can place the supported solar cell C and the supported wire clamp J on the wire W placed on the wire conveying device 40.

[0054] The wire clamp conveying device 60 can be spaced apart from the solar cell supply device 30 and the wire conveying device 40. The wire clamp conveying device 60 receives the wire clamp J and transports the wire clamp J to the mobile device 50. The wire clamp conveying device 60 moves a plurality of wire clamps J toward the table 33 and stops the wire clamp J at an end adjacent to the table 33. In this state, a conveying device (not shown) can convey the wire clamp J onto the table 33.

[0055] Reference Figure 1 and Figure 2 will describe the process of overlapping the wire W and the solar cell C using the wire clamp J by the overlapping device 1.

[0056] First, when the wire W is supplied by the wire conveying device 40 (see Figure 2 (a)), the mobile device 50 places a pair of the solar cell C and the wire clamp J on the wire W (see Figure 2 (b)). In addition, the wire conveying device 40 places another wire W on the solar cell C (see Figure 2(c)), and the mobile device 50 places a pair of solar cells C and wire clamps J on the wire W (see Figure 2 (d)). The wire transfer device 40 places the wire W on the solar cell C again (see Figure 2 (e)), and the mobile device 50 places a pair of solar cells C and wire clamps J on the wire (see Figure 2 (f)). Thus, the solar cell C and the wire W can be electrically connected, and the wire clamp J can support the wire W until the soldering process so that the wire W does not come off the designated position.

[0057] The soldering device 10 can heat the solar cell C and the wire W. For example, the soldering device 10 can heat the solder located on the surface of the wire W to the temperature at which the solder melts. Thus, the wire W and the solar cell C can be thermally joined by the melted solder and can be physically and electrically connected.

[0058] Reference Figures 3 to 9 , the soldering device 10 can include a stage 100, a main body 200, and a heater 300.

[0059] The stage 100 can support the solar cell C and the wire W and includes a heater (not shown) for heating the solar cell C and the wire W. For example, the stage 100 receives the solar cell C, the wire W, and the wire clamp J for supporting the solar cell C and the wire W from the wire transfer device 40 and supports the solar cell C, the wire W, and the wire clamp J. Here, the solar cell C, the wire W, and the wire clamp J placed on the stage 100 can have Figure 2 the shape shown. In addition, the stage 100 can support the solar cell C and the wire W and move the solar cell C and the wire W to the designated position.

[0060] For example, the stage 100 can be set in the form of a conveyor. For example, the stage 100 can be part of the conveyor of the wire transfer device 40 or a separate conveyor connected to the conveyor of the wire transfer device 40.

[0061] In another embodiment, the stage 100 can move independently. For example, the stage 100 is a shuttle conveyor and can transport the solar cell C and the wire W while reciprocating between the end of the wire transfer device 40 and the discharge position. For example, the stage 100 can move to the wire transfer device 40 to receive the solar cell C and the wire W and can move to the position corresponding to the main body 200 for the soldering process. Thereafter, when the soldering process is completed, the stage 100 can move to the discharge position.

[0062] For example, the stage 100 can support the wire W and maintain the position of the wire W during the soldering process. In the process of moving the stage 100 during the soldering process, when the solar cell C, the wire W, and the wire fixture J supporting the solar cell C and the wire W move slightly or deviate from the designated position, the bonding quality between the solar cell C and the wire W may be reduced. To prevent this, the stage 100 can support the wire W to arrange the position of the wire W.

[0063] For example, the stage 100 can support the wire W by using pins lifted by air provided therein. The lifted pins can lift the wire W from below to prevent the wire W from sagging. Alternatively, the stage 100 can use an air injection method such as an air knife to lift the wire W.

[0064] For example, the stage 100 can include a support member 110. As Figure 4 shown, the solar cell C, the wire W, and the wire fixture J can be placed on the upper surface of the support member 110, and the support member 110 can support the wire W to prevent misalignment of the position of the wire W.

[0065] For example, the support member 110 can include a pin adjustment block 111, a first housing 112, and a second housing 113.

[0066] The pin adjustment block 111 is positioned on one side of the support member 110 and connected to an air supply source (not shown). For example, as Figure 4 shown, the pin adjustment block 111 is positioned below the support member 110, for example, below the first housing 112. In addition, the pin adjustment block 111 can be connected to the air supply source and distribute air to lift the guide pins 1133 described below.

[0067] The pin adjustment block 111 can include a controller 1111 and an air passage 1112.

[0068] As Figure 4 shown, the controller 1111 can be positioned below the pin adjustment block 111 and connected to the air supply source. When the controller 1111 operates the air supply source, the pin adjustment block 111 can support the wire W by lifting all or some of the plurality of guide pins 1133. For example, the controller 1111 can include a plurality of solenoid valves, a processor, a communication module, and a memory arranged to correspond to the plurality of guide pins 1133. The controller 1111 can receive a preset program or an instruction from the user to only open the channels to be lifted or close other channels, so as to lift the plurality of guide pins 1133 individually or integrally.

[0069] The air passage 1112 is positioned inside the pin adjustment block 111 and serves as a passage through which air introduced from an air supply source moves to the first housing 112 and the second housing 113. For example, the number of air passages 1112 can be the same as the number of guide pins 1133 and lift pins 1121, which will be described below. For example, the number of air passages 1112 included in one pin adjustment block 111 is 12, and six air passages 1112 can be positioned in two columns. In addition, each air passage 1112 can overlap with the lift pin 1121 and the guide pin 1133.

[0070] For example, a plurality of air passages 1112 can be connected to the controller 1111 and can be individually opened or closed by the controller 1111. Therefore, the air introduced from the air supply source can be introduced into the air passage 1112 opened by the controller 1111 to lift the lift pin 1121 and the guide pin 1133.

[0071] The first housing 112 can be positioned on the pin adjustment block 111, and the lift pin 1121 can be provided in the first housing 112. For example, as Figure 4 shown, the first housing 112 can be positioned between the pin adjustment block 111 and the second housing 113. In addition, the first housing 112 can have a plurality of first lift holes 1122 communicating with the air passage 1112, and the lift pin 1121 can be inserted into the first lift holes 1122.

[0072] For example, the first housing 112 can have a block shape extending and elongating in one direction. For example, as Figure 4 and Figure 6 shown, the first housing 112 can have a rectangular parallelepiped shape extending in the moving direction of the solar cell C.

[0073] A plurality of first lift holes 1122 can be positioned inside the first housing 112, and the lift pin 1121 can be positioned inside the first lift holes 1122. Each of the plurality of first lift holes 1122 can have one end communicating with the air passage 1112 of the pin adjustment block 111 and the other end communicating with the second lift holes 1134 of the second housing 113. Therefore, the air introduced from the air passage 1112 pushes the lift pin 1121 positioned inside the first lift holes 1122 upward. In addition, one end of the lift pin 1121 can contact the guide pin 1133, and the guide pin 1133 can contact the wire W, so the wire W can be supported.

[0074] As Figure 5 shown, in a state where no air is supplied from the air supply source, the upper end of the lift pin 1121 can remain spaced apart from the lower end of the guide pin 1133. Thereafter, when air is supplied, the lift pin 1121 can rise to push the guide pin 1133 upward.

[0075] For example, a first housing 112 may correspond to a plurality of pin adjustment blocks 111. For example, as Figure 4 shown, two pin adjustment blocks 111 may be positioned below a first housing 112. Here, the length of each pin adjustment block 111 may correspond to the length of a solar cell C.

[0076] The second housing 113 may support the solar cell C, the wire W, and the wire fixture J, and may be positioned above the first housing 112. For example, as Figure 4 shown, the upper surface of the second housing 113 may be in direct contact with the wire W.

[0077] For example, the second housing 113 may include a lower block 1131 and an upper plate 1132.

[0078] The lower block 1131 may be positioned below the second housing 113, and the guide pin 1133 and the second lifting hole 1134 may be positioned within the lower block 1131. The same number of second lifting holes 1134 may be provided at positions corresponding to the first lifting holes 1122 of the first housing 112, and the guide pin 1133 may be positioned within the second lifting hole 1134.

[0079] The upper plate 1132 may be positioned on the lower block 1131 and have an upper surface on which the wire W may be placed. For example, as Figure 5 and Figure 6 shown, the lower block 1131 may include a plurality of insertion protrusions 1135 on its upper surface, and the upper plate 1132 may include insertion grooves 1139 corresponding to the insertion protrusions 1135. The insertion protrusions 1135 may be positioned between adjacent guide pins 1133 and protrude from the upper surface of the lower block 1131 to a predetermined height. By inserting the insertion protrusions 1135 into the insertion grooves 1139, the upper plate 1132 may be stably fixed to the lower block 1131.

[0080] The guide pin 1133 is positioned between the lower block 1131 and the upper plate 1132, is lifted while being inserted into the second lifting hole 1134 and the third lifting hole 1136, and lifts the wire W. For example, as Figure 5 shown, the guide pin 1133 may have a rod shape extending in the longitudinal direction. In a state where air is not supplied, that is, in a state where the lifting pin 1121 is not raised, the upper end of the guide pin 1133 may be positioned below the upper surface of the second housing 113. More specifically, as Figure 5As shown, the edge portion of the guide pin 1133 can be seated in the step formed in the second lifting hole 1134, so that the guide pin 1133 can be held in a specified position. Thereafter, the air supplied from the air supply source pushes the lifting pin 1121 upward, and the lifting pin 1121 contacts the lower end of the guide pin 1133, so that the guide pin 1133 rises. In addition, the upper end of the guide pin 1133 contacts the wire W, and the solar cell C and the wire W are in good close contact with each other. Therefore, during the soldering process, the connection point between the solar cell C and the wire W can be firmly supported. In addition, the guide pin 1133 can push up and support the wire W that sags downward.

[0081] For example, a plurality of guide pins 1133 can be positioned in a plurality of columns in one support member 110. For example, as Figure 6 and Figure 8 shown, a plurality of third lifting holes 1136 are positioned in two columns spaced apart from each other on the upper surface of the upper plate 1132, and the guide pins 1133 can be inserted into the third lifting holes 1136. Here, the wire W can overlap with the virtual line connecting adjacent guide pins 1133.

[0082] For example, adjacent guide pins 1133 can be spaced apart by a distance D2. The distance D2 can be in the range of 5% to 25% of the entire length of the wire W supported on one support member 110, and preferably can be in the range of 10% to 20% thereof. When the distance D2 is less than 10% of the entire length of the wire W, the number of guide pins 1133 may increase excessively compared to the number of wires W, so that the entire structure of the device may become complicated. In addition, when the heater provided in the stage 100 heats the wire W, the area of the wire W covered by the guide pins 1133 increases, so that the heating efficiency may decrease. When the distance D2 is greater than 20% of the entire length of the wire W, the gap between the guide pins 1133 increases excessively, so that the wire W cannot be sufficiently supported relative to the solar cell C, and the sagging of the wire W cannot be appropriately prevented.

[0083] For example, the diameters of the guide pin 1133 and the third lifting hole 1136 can be smaller than the width of the wire W. Therefore, it is possible to prevent the wire W disposed on the upper plate 1132 from sagging excessively toward the lower side of the third lifting hole 1136.

[0084] For example, the upper plate 1132 can be provided with third lifting holes 1136. As Figure 5 and Figure 6 shown, the third lifting holes 1136 can be positioned corresponding to the second lifting holes 1134, and the number of the third lifting holes 1136 can be the same as the number of the second lifting holes 1134.

[0085] For example, the upper plate 1132 can further include an uneven portion. As Figure 5 andFigure 6 As shown, the uneven portion faces the wire W on the upper surface of the upper plate 1132. A plurality of recessed portions 1137 and a plurality of protruding portions 1138 may be alternately positioned on the uneven portion. Thus, in a state where the wire W is placed on the support member 110, the wire W may contact the upper surface of the protruding portion 1138 and may not contact the recessed portion 1137. That is, a gap may be formed between the wire W and the recessed portion 113, and thus the wire W may move more smoothly on the stage 100. In addition, heat generated by the heater provided in the stage 100 circulates in the gap to effectively heat the solar cell C and the wire W.

[0086] For example, the uneven portion may have a width larger than the width of the wire W. As Figure 7 and Figure 8 shown, the recessed portion 1137 and the protruding portion 1138 included in the uneven portion may be positioned at both ends of the upper plate 1132 in the width direction and may be positioned corresponding to the wire W. Here, the width of each of the recessed portion 1137 and the protruding portion 1138 may be larger than the width of the wire W, and thus the wire W may be stably supported.

[0087] For example, a plurality of guide pins 1133 may overlap with the uneven portion. For example, as Figure 6 and Figure 8 shown, a plurality of third lifting holes 1136 may be positioned on the recessed portion 1137 and the protruding portion 1138, and a plurality of guide pins 1133 may be inserted into the third lifting holes 1136. Here, the third lifting holes 1136 may be positioned on the center line in the width direction of the recessed portion 1137 and the protruding portion 1138.

[0088] For example, the upper plate 1132 may further include an insertion groove 1139. As Figure 6 and Figure 8 shown, the insertion groove 1139 may be positioned between adjacent third lifting holes 1136 and may be positioned corresponding to the insertion protrusion 1135 of the lower block 1131. Thus, the insertion protrusion 1135 is inserted into the insertion groove 1139, and thus the lower block 1131 and the upper plate 1132 may be stably fixed. The shape of the insertion groove 1139 is not particularly limited and may be a shape corresponding to the insertion protrusion 1135. For excellent fastening between the lower block 1131 and the upper plate 1132, the insertion groove 1139 may have a long groove shape in the longitudinal direction (i.e., in the moving direction of the solar cell C).

[0089] For example, the stage 100 may include a main frame 120 and a support frame 130.

[0090] As Figure 4As shown, the main frame 120 is positioned below the support member 110 and supports other components of the support table 100. The support frame 130 is positioned on the main frame 120 and connects the support member 110 to the main frame 120. For example, the support frame 130 may be positioned on the central portion of the table 100 and extend in the width direction. The lower surface of the support frame 130 may be positioned on the main frame 120, and the upper surface of the support frame 130 may support the second housing 113.

[0091] For example, the support member 110 may be provided as a plurality of support members 110. For example, as Figure 4 shown, each support member 110 may be positioned on one of the one side and the other side with respect to the support frame 130 such that the support members 110 are symmetric with each other. Each of the support members 110 may support and cool one or more solar cells C. Figure 7 Six support members 110 are shown positioned on each of the one side and the other side of the support frame 130, but the number of the support members 110 is not particularly limited. The number of the support members 110 may be appropriately selected according to the specifications of the solar cells C and the wires W.

[0092] For example, one support member 110 may support a plurality of wires W. For example, as Figure 7 shown, two wires W may be spaced apart by a distance W1 from both ends of one support member 110 in the width direction. In addition, adjacent support members 110 may be spaced apart by a distance W1 from each other. Thus, all of the plurality of wires W arranged on the table 100 may be spaced apart from each other by the same distance W1. However, the number of wires W supported by one support member 110 is not limited to two. For example, when the guide pins 1133 included in one support member 110 are arranged to form three or more rows, the same number of wires W may also be arranged.

[0093] The main body 200 may face the table 100 and may melt the solder by irradiating light or applying heat to the solar cells C and the wires W arranged on the table 100. For example, as Figure 3 shown, the main body 200 may be spaced upward from the upper surface of the table 100 and may melt the solder applied to the connection portion between the solar cells C and the wires W when the solar cells C and the wires W are arranged on the table 100. For example, the heater 300 facing the solar cells C and the wires W may melt the solder applied to the wires W by irradiating light having a specific wavelength or applying heat to the bottom of the main body 200. For example, the heater 300 may be used as an ultraviolet lamp and may melt the solder by irradiating ultraviolet rays to the solder applied to the wires W. Alternatively, the heater 300 may melt the solder by heating the solder at a predetermined temperature. A plurality of heaters 300 may be spaced apart from each other in the longitudinal direction of the solar cells C.

[0094] Next, the operation of the welding apparatus 10 will be described with reference to Figures 1 to 9 the following.

[0095] The solar cell C and the wire jig J are placed on the wire W conveyed by the wire conveying device 40, and then conveyed to the stage 100 of the welding apparatus 10. When the wire W is positioned at a specified position on the stage 100, the air supplied from the air supply source moves to the controller 1111. Considering the positions and moving speeds of the solar cell C and the wire W, the controller 1111 can open the air passage 1112 corresponding to the guide pins 1133 to be raised. For example, the controller 1111 can supply air to the air passages 1112 corresponding to the 12 guide pins 1133 so that the 12 guide pins 1133 provided in one support member 110 are raised simultaneously. Alternatively, the controller 1111 can supply air to the corresponding air passages 1112 to raise only the guide pins 1133 at specific positions.

[0096] The supplied air can push up the lift pin 1121 inserted into the first lift hole 1122, and as the upper end of the lift pin 1121 and the lower end of the guide pin 1133 come into contact with each other, the guide pin 1133 can be raised to contact the wire W. In this way, as the guide pin 1133 contacts the wire W, the wire W and the solar cell C can be firmly in contact with each other during the welding process. In addition, sagging and position deviation of the wire W can be prevented.

[0097] Thereafter, when the guide pin 1133 is to be lowered, the controller 1111 closes the air passage 1112. Therefore, the air supplied from the air supply source is not conveyed to the air passage 1112, and as the lift pin 1121 descends, the guide pin 1133 also descends.

[0098] For example, the operation of raising the guide pin 1133 can be performed during the entire welding process. For example, this operation can be performed at any time before or after the welding apparatus 10 emits light and generates heat to melt the solder, or before or after the welding apparatus 10 cools the melted solder.

[0099] In this way, the present invention has been described with reference to the embodiments shown in the drawings, but this is merely an example. Those skilled in the art can fully understand that various modifications and other equivalent embodiments can be derived from the embodiments. Therefore, the actual technical protection scope of the present invention should be determined based on the appended claims.

[0100] Industrial Applicability

[0101] The present invention can be used in processes related to welding apparatuses and lapping apparatuses including such welding apparatuses.

Claims

1. A welding device, comprising: A stage on which a solar cell and a wire are placed; A main body facing the stage; And A plurality of heaters on the bottom surface of the main body to face the solar cell and the wire, Wherein the stage includes a support member having a plurality of guide pins rising from below to support the wire toward the solar cell.

2. The welding device according to claim 1, wherein, The support member includes a pin adjustment block including a controller and an air passage, each of the air passages communicating with one of the plurality of guide pins, and The controller opens or closes the air passage and vertically moves the plurality of guide pins.

3. The welding device according to claim 2, wherein, When the air passage is open, the supplied air raises the plurality of guide pins to support the wire, and when the air passage is closed, the plurality of guide pins lower and do not contact the wire.

4. The welding device according to claim 2, wherein, The support member includes a first housing positioned on the pin adjustment block and including a plurality of first lifting holes into which a plurality of lifting pins are inserted, and When the air passage is open, the plurality of lifting pins rise to raise the corresponding plurality of guide pins.

5. The welding device according to claim 2, wherein, The support member includes a second housing having a plurality of second lifting holes and having an uneven portion, the plurality of guide pins being inserted into the plurality of second lifting holes, the uneven portion including a plurality of recessed portions and protrusions and formed on the upper surface of the second housing, and The plurality of guide pins overlap the uneven portion.

6. The welding device according to claim 1, wherein, The support member selectively supports the wire by raising at least some of the plurality of guide pins using air.

7. The welding device according to claim 1, wherein, The support member includes a plurality of support members spaced apart from each other in one direction and having an upper surface on which a plurality of wires are positioned spaced apart from each other in the one direction.

8. A lapping device for placing a solar cell and a wire fixture on a wire of a wire transfer device and welding the solar cell and the wire to form a solar cell module, the lapping device including a welding device, the welding device including: A stage on which the solar cell and the wire are placed; A main body facing the stage; And A plurality of heaters positioned on the bottom surface of the main body to face the solar cell and the wire, Wherein the stage includes a support member having a plurality of guide pins rising from below to support the wire toward the solar cell.

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