Semiconductor gas pipeline modular welding device

By designing a modular welding device for semiconductor gas pipelines, the precise positioning of semiconductor gas pipelines and gas circulation is achieved using symmetric welding modules and positioning slots, the problems of inconsistent accuracy and risk of tungsten clamping in existing welding technologies are solved, and the welding efficiency and module stability are improved.

CN120228447APending Publication Date: 2025-07-01鸿舸半导体设备(上海)有限公司
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Patent Information

Application Number
CN202510687832.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-27
Publication Date
2025-07-01

AI Technical Summary

Technical Problem

The existing semiconductor gas pipeline welding technology is difficult to ensure consistency of welding accuracy, and it is prone to welding defects and tungsten clamping risks, resulting in module scrapping.

Method used

A modular welding device for semiconductor gas pipelines is designed, including a main body and two symmetrically arranged welding modules. The welding module includes a block, a ventilation block and a limit block. The precise positioning of the semiconductor gas pipeline and gas flow are achieved through the positioning groove and ventilation channel.

Benefits of technology

It improves welding accuracy and efficiency, reduces the risk of module scrapping, and meets the semiconductor industry's requirements for the consistency of module sealing accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor gas pipeline modular welding device. The modularized welding device for the semiconductor gas pipeline comprises a main body and two welding modules, the welding modules are symmetrically and oppositely arranged at the upper part of the main body, and a positioning gap is formed between the two welding modules; the welding module comprises a pressing block, a ventilation block and a limiting block; positioning grooves are formed in the main body; a ventilation channel is arranged in the ventilation block, the ventilation block is arranged above the positioning groove, and the ventilation channel is communicated with a gas hole in the semiconductor gas pipeline; the limiting block is connected with the pressing block; and the pressing block is used for pressing and positioning the semiconductor gas pipeline in the positioning groove. The two semiconductor gas pipelines are positioned through the two symmetrically-arranged welding modules, spot welding positioning is not needed, welding of a multi-flow-channel module can be compatible, the welding efficiency and the welding precision are guaranteed, and the requirement of a gas transmission panel in the semiconductor industry for module sealing precision consistency is met.
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Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and more particularly, to a modular welding device for semiconductor gas pipelines. Background Art

[0002] The post-welding tolerance accuracy requirements for semiconductor gas pipeline weldments are extremely high, and an accuracy requirement of 0.001 needs to be achieved.

[0003] In the existing solution, for the welding of pipeline components with modules, before welding in a class 100 clean room, manual spot welding is used. After spot welding, ordinary jigs are used for clamping, which cannot ensure the consistency of the post-welding tolerance accuracy of the modules, and is prone to welding defects, consuming time and labor.

[0004] In addition, the post-welding accuracy control of the modules completely relies on the sealing gaskets during the later assembly process to accommodate the tolerance, which does not meet the requirements of precision manufacturing in the semiconductor industry.

[0005] For the modular welding of pipeline weldments in the semiconductor industry, the weld is a thin-wall autogenous weld. Since the module needs to be spot welded at multiple points of 360° before welding, it is very easy to generate the risk of tungsten inclusion, there is a risk of reducing the weld quality and generating weld tungsten inclusion defects, and there is a risk of module scrapping caused by spot welding failure. Summary of the Invention

[0006] The purpose of the present invention is to provide a modular welding device for semiconductor gas pipelines, which can improve the welding accuracy and reduce the risk of module scrapping.

[0007] The present invention provides a modular welding device for semiconductor gas pipelines, including a main body and two welding modules; The welding modules are symmetrically arranged opposite to each other on the upper part of the main body, and there is a positioning gap between the two welding modules; The welding module includes a pressing block, a ventilation block, and a limiting block; A positioning groove is provided on the main body, and the positioning groove is used to position the semiconductor gas pipeline to be welded; A ventilation channel is provided in the ventilation block, the ventilation block is arranged above the positioning groove, and the ventilation channel is communicated with the air holes on the semiconductor gas pipeline; The limiting block is connected to the pressing block and can position the ventilation block; The pressing block is used to tightly position the semiconductor gas pipeline in the positioning groove.

[0008] In an alternative embodiment, the pressing block includes an upper pressing block, a middle pressing block, and a lower pressing block; The lower pressing block is arranged in the positioning groove; The lower pressing block is provided with a limiting groove, and the middle pressing block is arranged above the limiting groove; The upper pressing block is arranged above the middle pressing block and is used to press the middle pressing block and the limiting block.

[0009] In an alternative embodiment, a ventilation pipe is arranged between the upper pressing block and the middle pressing block, and the ventilation pipe is communicated with the ventilation channel.

[0010] In an alternative embodiment, the limiting block includes a pressing plate, a connecting plate and a fixing plate which are fixedly connected in sequence; The pressing plate is arranged above the ventilation block, the connecting plate is arranged on the side of the ventilation block, and the fixing plate is used to connect the lower pressing block.

[0011] In an alternative embodiment, the fixing plate is provided with a first kidney-shaped hole, and a fixing bolt connects the fixing plate and the lower pressing block through the first kidney-shaped hole.

[0012] In an alternative embodiment, the upper part of the lower pressing block has a second kidney-shaped hole matching the first kidney-shaped hole; The lower part of the lower pressing block has a third kidney-shaped hole, and a fixing bolt can fix the lower pressing block on the main body through the third kidney-shaped hole.

[0013] In an alternative embodiment, the number of the limiting blocks is two; The two limiting blocks are symmetrically arranged on both sides of the limiting groove.

[0014] In an alternative embodiment, the main body includes a base and an upper cover; The positioning groove is arranged on the base, and the welding module is arranged in the positioning groove; The upper cover is covered above the positioning groove and is used to fix the welding module.

[0015] In an alternative embodiment, the number of the positioning grooves is two, which are respectively arranged at both ends of the positioning gap and are used to install the two welding modules.

[0016] In an alternative embodiment, the cross-section of the positioning groove is semi-circular.

[0017] The beneficial effects of the embodiments of the present invention are as follows: By using two symmetrically arranged welding modules to respectively position two semiconductor gas pipelines, spot welding positioning is not required, welding of multi-channel modules can be compatible, welding efficiency and welding precision can be guaranteed, and the requirements for the consistency of module sealing precision of the gas transmission panel in the semiconductor cleaning industry can be met. Description of the Drawings

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0019] Figure 1 The front view of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 2 The top view of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 3 is Figure 2 the A-A cross-sectional view of; Figure 4 is Figure 2 the B-B cross-sectional view of; Figure 5 The three-dimensional structure diagram of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 6 The exploded view of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 7 The three-dimensional structure diagram of the ventilation block of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 8 The three-dimensional structure diagram of the lower pressing block of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 9 The three-dimensional structure diagram of the middle pressing block of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 10 The three-dimensional structure diagram of the upper pressing block of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention; Figure 11 The three-dimensional structure diagram of the limiting block of the modular welding device for semiconductor gas pipelines provided by the embodiment of the present invention.

[0020] Icon: 1 - gas pipeline; 2 - welding module; 3 - main body; 4 - positioning gap; 5 - lower pressing block; 6 - middle pressing block; 7 - upper pressing block; 8 - ventilation block; 9 - ventilation pipe; 10 - base; 11 - upper cover; 12 - limiting block; 13 - ventilation channel; 14 - bolt hole; 15 - second waist-shaped hole; 16 - third waist-shaped hole; 17 - fixing plate; 18 - connecting plate; 19 - pressing plate; 20 - first waist-shaped hole. Detailed implementation manners

[0021] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. Components of the embodiments of the present invention usually described and illustrated in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the detailed description of the embodiments of the present invention provided in the drawings below is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0023] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0024] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0025] In addition, terms such as "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0026] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] The following combination Figures 1-11, some embodiments of the present invention will be described in detail. In the case of no conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0028] The present invention provides a modular welding device for a semiconductor gas pipeline 1, which includes a main body 3 and two welding modules 2; the two welding modules 2 are symmetrically arranged opposite to each other on the upper part of the main body 3, and there is a positioning gap 4 between the two welding modules 2; the welding module 2 includes a pressing block, a ventilation block 8 and a limiting block 12; a positioning groove is provided on the main body 3, and the positioning groove is used for positioning the semiconductor gas pipeline 1 to be welded; a ventilation channel 13 is provided in the ventilation block 8, the ventilation block 8 is arranged above the positioning groove, and the ventilation channel 13 is communicated with the air holes on the semiconductor gas pipeline 1; the limiting block 12 is connected with the pressing block and can position the ventilation block 8; the pressing block is used for pressing and positioning the semiconductor gas pipeline 1 in the positioning groove.

[0029] In this embodiment, the structure of the modular welding device for the semiconductor gas pipeline 1 includes a main body 3 and two welding modules 2. Among them, a positioning groove is provided on the main body 3 for placing the semiconductor gas pipeline 1 to be welded; the two welding modules 2 are symmetrically arranged on the upper part of the main body 3, and there is a positioning gap 4 in the middle.

[0030] When welding, the two gas pipelines 1 are respectively placed on the two welding modules 2, and the ends of the two gas pipelines 1 are spliced in the positioning gap 4 to complete precise positioning, and then through the fixation of the welding module 2, the stability and welding accuracy of the gas pipeline 1 during the welding process are ensured.

[0031] Specifically, in this embodiment, each welding module 2 includes a pressing block, a ventilation block 8 and a limiting block 12. The function of the pressing block is to press and position the semiconductor gas pipeline 1 in the positioning groove to ensure that the gas pipeline 1 remains stable during the welding process. A ventilation channel 13 is provided inside the ventilation block 8 and is communicated with the air holes on the semiconductor gas pipeline 1 to ensure smooth gas flow during welding. The limiting block 12 is connected with the pressing block and is used for precisely positioning the ventilation block 8 to ensure that the welding module 2 accurately aligns with the semiconductor gas pipeline 1.

[0032] During the welding process, first place the semiconductor gas pipeline 1 into the positioning groove, and then press and position the pipeline through the welding module 2. The ventilation block 8 ensures gas flow, while the pressing block and the limiting block 12 ensure the accurate position of the pipeline during the welding process.

[0033] This modular setting method not only improves the welding efficiency but also ensures the welding quality. It is applicable to the welding requirements of various semiconductor gas pipelines 1, can realize fast and precise welding operations, and meets the high requirements for welding accuracy and efficiency in the semiconductor manufacturing process.

[0034] In an alternative embodiment, the pressing block includes an upper pressing block 7, a middle pressing block 6, and a lower pressing block 5; the lower pressing block 5 is disposed in the positioning groove; the lower pressing block 5 has a limiting groove, and the middle pressing block 6 is disposed above the limiting groove; the upper pressing block 7 is disposed above the middle pressing block 6 for pressing the middle pressing block 6 and the limiting block 12 together.

[0035] In this embodiment, the pressing block is divided into three parts: an upper pressing block 7, a middle pressing block 6, and a lower pressing block 5. The three parts have different functions and effects, and can provide a more stable pressing force and more precise positioning control for the gas pipeline 1.

[0036] Specifically, in this embodiment, the lower pressing block 5 is placed in the positioning groove, and a limiting groove is provided in the upper part of the lower pressing block 5. The shape of the limiting groove is square, which can realize the rotational positioning of the gas pipeline 1.

[0037] Specifically, in this embodiment, the middle pressing block 6 is located above the limiting groove. Its main function is to press the gas pipeline 1 in the limiting groove, so as to realize the positioning in the length direction of the gas pipeline 1 and ensure the relative positioning accuracy between two gas pipelines 1.

[0038] More specifically, in this embodiment, the middle pressing block 6 and the ventilation block 8 are arranged in parallel on the lower pressing block 5.

[0039] Specifically, in this embodiment, the upper pressing block 7 is located above the middle pressing block 6. Its function is to apply pressure to the middle pressing block 6 and the ventilation block 8, and at the same time fixedly connect the upper pressing block 7 to the main body 3 to enhance the pressing force on the pipeline. Through the pressing action of the upper pressing block 7, it can be ensured that the middle pressing block 6 and the lower pressing block 5 firmly fix the gas pipeline 1, preventing any possible movement or deviation during the welding process.

[0040] This pressing block structure composed of the upper pressing block 7, the middle pressing block 6, and the lower pressing block 5 not only improves the stability and reliability of the welding device, but also further improves the welding quality through precise layered pressing. In addition, this structure helps to simplify the operation process of the welding device, making the welding work more efficient and convenient. Through this modular and layered pressing design, the welding device in this embodiment can meet the requirements of high-precision welding in the semiconductor manufacturing process.

[0041] In an alternative embodiment, a ventilation pipe 9 is provided between the upper pressing block 7 and the middle pressing block 6, and the ventilation pipe 9 is communicated with the ventilation channel 13.

[0042] In this embodiment, the upper pressing block 7 has a semi-circular groove, and the middle pressing block 6 is correspondingly provided with a semi-circular groove. The two semi-circular grooves are arranged opposite to each other to form a complete circular hole, and the ventilation pipe 9 passes through the circular hole and communicates with the ventilation channel 13 on the ventilation block 8.

[0043] In this embodiment, the ventilation channel 13 in the ventilation block 8 is L-shaped. One communication port is below the ventilation block 8, and the other communication port is on the side of the ventilation block 8 away from the positioning gap 4, and communicates with the ventilation pipe 9.

[0044] Specifically, in this embodiment, one end of the ventilation block 8 has a bolt hole 14, which can be fixedly connected to the gas pipeline 1 through a bolt. Since the other end has an L-shaped ventilation channel 13, setting the bolt hole 14 will damage the sealing performance of the ventilation channel 13. Therefore, in this embodiment, the ventilation block 8 is fixed and positioned by the limit block 12, and at the same time, the limit block 12 has a notch for avoiding the front-end bolt, as Figure 11 shown.

[0045] In this embodiment, the setting of the ventilation pipe 9 can ensure that during the welding process, gas can pass through the ventilation block 8 stably and continuously, thereby avoiding gas blockage or pressure accumulation caused by the heat generated during welding. The presence of the ventilation pipe 9 enables gas to flow smoothly from the semiconductor gas pipeline 1 to the external environment, or from the external environment into the pipeline, depending on the specific requirements during the welding process.

[0046] In this embodiment, by arranging the ventilation pipe 9 between the upper pressing block 7 and the middle pressing block 6, the welding device not only improves the gas circulation efficiency but also helps to maintain the gas pressure balance in the welding area. It can effectively prevent gas leakage or abnormal pressure that may occur during the welding process, thereby improving the safety and reliability of welding.

[0047] In addition, the design of the ventilation pipe 9 also helps to reduce gas pollution that may be generated during the welding process, which is very important for maintaining the cleanliness of the semiconductor manufacturing environment. By ensuring the effective management and circulation of gas, the welding device of this embodiment can meet the requirements for high cleanliness and high safety during the semiconductor manufacturing process.

[0048] In summary, by arranging the ventilation pipe 9 between the upper pressing block 7 and the middle pressing block 6, the welding device of this embodiment provides significant advantages in terms of improving gas circulation efficiency, ensuring welding safety, and meeting high cleanliness requirements. This design is an important step in optimizing the performance of the welding device and helps to improve the quality and efficiency of the entire semiconductor manufacturing process.

[0049] In an alternative embodiment, the limiting block 12 includes a pressing plate 19, a connecting plate 18, and a fixing plate 17 that are fixedly connected in sequence; the pressing plate 19 is disposed above the ventilation block 8, the connecting plate 18 is disposed on the side of the ventilation block 8, and the fixing plate 17 is used to connect the pressing block 5.

[0050] In this embodiment, the number of the limiting blocks 12 is two, which are respectively disposed at opposite ends of the ventilation block 8 to press the ventilation block 8. The overall shape of the limiting block 12 is Z-shaped, and the pressing plate 19 and the connecting plate 18 are disposed perpendicular to each other, and the connecting plate 18 and the fixing plate 17 are disposed perpendicular to each other.

[0051] In such a setting manner, the two limiting blocks 12 can respectively position the ventilation block 8 at both ends of the ventilation block 8, that is, the fixing plate 17 is fixed to the pressing block 5 by bolts, and the pressing plate 19 is above the ventilation block 8 through the connecting plate 18.

[0052] Specifically, in this embodiment, the pressing plate 19 is located above the ventilation block 8, and its main function is to apply a downward pressure to the ventilation block 8 to ensure close contact between the ventilation block 8 and the semiconductor gas pipeline 1, as well as the sealing performance between the ventilation channel 13 and the air holes on the gas pipeline 1; the connecting plate 18 is disposed on the side of the ventilation block 8, and its function is to connect the pressing plate 19 and the fixing plate 17 to form a whole; the fixing plate 17 is used to connect the pressing block 5, which not only provides additional support for the limiting block 12, but also ensures the stability of the entire welding module 2. The fixing plate 17 enables the limiting block 12 to be firmly fixed on the welding device, so as to keep its position unchanged during the welding process, and further improve the welding accuracy and reliability.

[0053] Through the design of the limiting block 12 composed of the pressing plate 19, the connecting plate 18, and the fixing plate 17, the welding device of this embodiment can more effectively position and fix the ventilation block 8, so as to ensure the smooth flow of gas during the welding process and the stability of the welding quality.

[0054] In an alternative embodiment, a first waist-shaped hole 20 is provided on the fixing plate 17, and a fixing bolt connects the fixing plate 17 and the pressing block 5 through the first waist-shaped hole 20.

[0055] In this alternative embodiment, a first waist-shaped hole 20 is provided on the fixing plate 17 of the welding device, allowing the fixing bolts to move laterally to a certain extent. This helps to accommodate minor dimensional deviations that may occur during the manufacturing process, thereby improving the flexibility and success rate of assembly. Through the waist-shaped hole, the fixing bolts can firmly connect the fixing plate 17 and the lower pressing block 5, ensuring the stability of the device during the welding process and preventing displacement or vibration caused by pressure changes. The setting of the waist-shaped hole simplifies the installation process of the fixing bolts, making the assembly work more convenient and fast, and also facilitating subsequent maintenance and replacement work. Compared with common circular or square holes, the waist-shaped hole can more effectively disperse the stress generated by the tightening of the fixing bolts, thereby reducing material fatigue and improving the durability of the device.

[0056] In an alternative embodiment, the upper part of the lower pressing block 5 has a second waist-shaped hole 15 that matches the first waist-shaped hole 20; the lower part of the lower pressing block 5 has a third waist-shaped hole 16, and the fixing bolts can fix the lower pressing block 5 to the main body 3 through the third waist-shaped hole 16.

[0057] In this embodiment, a second waist-shaped hole 15 is provided above the lower pressing block 5, which matches the first waist-shaped hole 20 and can increase the position adjustment range of the limiting block 12.

[0058] In this embodiment, a third waist-shaped hole 16 is provided below the lower pressing block 5. By cooperating the third waist-shaped hole 16 with the fixing bolts, the lower pressing block 5 can be fixedly arranged on the main body 3.

[0059] Specifically, in this embodiment, the lower pressing block 5 has a cavity structure, which can not only ensure the overall strength but also facilitate the installation of the lower pressing block 5.

[0060] Through the setting of the second waist-shaped hole 15 and the third waist-shaped hole 16, it provides convenience for the assembly and disassembly of the device. The design of the waist-shaped hole allows for a certain adjustment space during assembly to accommodate manufacturing tolerances and assembly errors, making the assembly process more flexible and efficient. At the same time, this design also facilitates subsequent maintenance and component replacement, improving the maintainability of the device.

[0061] In an alternative embodiment, the main body 3 includes a base 10 and an upper cover 11; the positioning groove is provided on the base 10, and the welding module 2 is arranged in the positioning groove; the upper cover 11 is covered above the positioning groove for fixing the welding module 2.

[0062] In this alternative embodiment, the main body 3 structure of the semiconductor gas pipeline 1 modular welding device is composed of two parts, the base 10 and the upper cover 11. The base 10 is provided with a positioning groove for placing the lower pressing block 5, and the upper cover 11 is used for fixing and positioning the pressing block, and at the same time has a certain protective effect.

[0063] In this embodiment, the welding module 2 is arranged in the positioning groove and includes key components such as a pressing block, an air vent block 8, and a limiting block 12. These components work together to achieve precise positioning and clamping of the pipeline.

[0064] The function of the upper cover 11 is to cover the positioning groove and is used to fix the welding module 2 to ensure the stability of the module during the welding process. The upper cover 11 forms a groove structure with a relatively large depth in cooperation with the base 10, which helps to protect the welding area and reduce the influence of the external environment on the welding process.

[0065] In an alternative embodiment, the cross-section of the positioning groove is semi-circular.

[0066] It can be understood that in this embodiment, the cross-sectional shape of the positioning groove is semi-circular, but it is not limited to semi-circular. It can also be other types of shapes, such as square, trapezoidal, etc., as long as it can cooperate with the shape of the welding module 2 to achieve the positioning of the welding module 2.

[0067] The beneficial effects of the embodiments of the present invention are as follows: By using two symmetrically arranged welding modules 2 to position two semiconductor gas pipelines 1 respectively, spot welding positioning is not required, and the welding of multi-channel modules can be compatible, ensuring welding efficiency and welding accuracy, and meeting the requirements of the semiconductor cleaning industry for the consistency of module sealing accuracy of the gas transmission panel.

[0068] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, various changes and modifications can be made to the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A modular welding device for semiconductor gas pipelines, characterized in that, It includes a main body and two welding modules; The welding modules are symmetrically arranged opposite to each other on the upper part of the main body, and there is a positioning gap between the two welding modules; The welding module includes a pressing block, a ventilation block and a limiting block; A positioning groove is provided on the main body, and the positioning groove is used to position the semiconductor gas pipeline to be welded; A ventilation channel is provided in the ventilation block, the ventilation block is arranged above the positioning groove, and the ventilation channel is communicated with the air holes on the semiconductor gas pipeline; The limiting block is connected to the pressing block and can position the ventilation block; The pressing block is used to press and position the semiconductor gas pipeline in the positioning groove.

2. The semiconductor gas pipeline modular welding device according to claim 1, characterized in that, The pressing block includes an upper pressing block, a middle pressing block and a lower pressing block; The lower pressing block is arranged in the positioning groove; A limiting groove is provided on the lower pressing block, and the middle pressing block is arranged above the limiting groove; The upper pressing block is arranged above the middle pressing block and is used to press the middle pressing block and the limiting block.

3. The semiconductor gas pipeline modular welding device according to claim 2, characterized in that, A ventilation pipe is arranged between the upper pressing block and the middle pressing block, and the ventilation pipe is communicated with the ventilation channel.

4. The semiconductor gas pipeline modular welding device according to claim 2, wherein The limiting block includes a pressing plate, a connecting plate and a fixing plate which are fixedly connected in sequence; The pressing plate is arranged above the ventilation block, the connecting plate is arranged on the side of the ventilation block, and the fixing plate is used to connect the lower pressing block.

5. The semiconductor gas pipeline modular welding device according to claim 4, characterized in that, A first kidney-shaped hole is provided on the fixing plate, and a fixing bolt connects the fixing plate and the lower pressing block through the first kidney-shaped hole.

6. The modular welding device for semiconductor gas pipelines according to claim 5, characterized in that, The upper part of the lower pressing block has a second kidney-shaped hole matching the first kidney-shaped hole; The lower part of the lower pressing block has a third kidney-shaped hole, and the fixing bolt can fix the lower pressing block on the main body through the third kidney-shaped hole.

7. The modular welding device for semiconductor gas pipelines according to claim 4, characterized in that, The number of the limiting blocks is two; The two limiting blocks are symmetrically arranged on both sides of the limiting groove.

8. The modular welding device for semiconductor gas pipelines according to claim 1, characterized in that, The main body includes a base and an upper cover; The positioning groove is arranged on the base, and the welding module is arranged in the positioning groove; The upper cover is covered above the positioning groove and is used to fix the welding module.

9. The modular welding device for semiconductor gas pipelines according to claim 8, wherein, The number of the positioning grooves is two, which are respectively arranged at both ends of the positioning gap and are used to install the two welding modules.

10. The semiconductor gas pipeline modular welding device according to claim 8, characterized in that, The cross section of the positioning groove is semicircular.