Dual-light-source substrate image measuring system and method thereof

Abstract

The invention discloses a dual-light-source substrate image measuring system and a method thereof. The dual-light-source substrate image measuring system comprises an exciting light generating device, a white light generating device, a line scanning image capturing device and an image measuring device. The excitation light generating device is used for providing excitation light to a substrate in a fluorescence mode, so that the substrate generates fluorescence. The white light generating device is used for providing white light to the substrate in a white light mode. The line scanning image capturing device is used for capturing an image of the substrate in a fluorescence mode to obtain a two-dimensional fluorescence image, and / or capturing an image of the substrate in a white light mode to obtain a white light image. The image measuring device is connected or coupled with the line scanning image capturing device and establishes substrate measuring information according to the two-dimensional fluorescence image and / or the two-dimensional white light shadow image. According to the invention, the substrate is detected through the fluorescent image or the white light image, and comprehensive measurement application of the whole substrate is carried out through the fluorescent image, so that the quality of image circuit measurement is improved.

Description

Technical Field

[0001] The present invention relates to a substrate image measurement system and method, and particularly to a dual-light-source substrate image measurement system and method based on fluorescence and white light. Background Art

[0002] The advantages of fluorescence inspection / measurement methods are high sensitivity, and they can detect / measure very fine features that may be overlooked in other types of image detection methods.

[0003] Circuit board fluorescence measurement is carried out by irradiating excitation light on a substrate. Due to the response of organic substances on the substrate to the excitation light, the substrate emits fluorescence. Since metal lines do not respond to the excitation light and thus do not emit fluorescence, boundaries are generated between the metal lines and the substrate in the image. Fluorescence measurement is performed by measuring the metal lines based on the boundary differences in the image.

[0004] However, for circuit substrates of specific materials, such as glass substrates and steel substrates, if they do not have organic substances that can respond to the excitation light, boundary differences cannot be generated in the image, and thus fluorescence cannot be used for measurement operations. Summary of the Invention

[0005] The main object of the present invention is to provide a dual-light-source substrate image measurement system, including an excitation light generation device, a white light generation device, a line scan image capture device, and an image measurement device. The excitation light generation device is used to provide an excitation light to a substrate in a fluorescence mode to cause the substrate to generate fluorescence. The white light generation device is used to provide a white light to the substrate in a white light mode. The line scan image capture device is used to capture an image of the substrate in the fluorescence mode to obtain a two-dimensional fluorescence image, and / or capture an image of the substrate in the white light mode to obtain a two-dimensional white light image. The image measurement device is connected or coupled to the line scan image capture device, and establishes a substrate measurement information based on the two-dimensional fluorescence image and / or the two-dimensional white light image.

[0006] Another object of the present invention is to provide a dual-light-source substrate image measurement method, including: providing an excitation light to a substrate in a fluorescence mode to cause the substrate to generate fluorescence; providing a white light to the substrate in a white light mode; capturing an image of the substrate in the fluorescence mode to obtain a two-dimensional fluorescence image, and / or capturing an image of the substrate in the white light mode to obtain a two-dimensional white light image; and establishing a substrate measurement information based on the two-dimensional fluorescence image and / or the two-dimensional white light image.

[0007] Therefore, the present invention detects the substrate through fluorescence images or white light images. In addition to enabling full-panel comprehensive measurement applications through fluorescence images, thereby improving the quality of image line measurement, it can also perform measurement applications on circuit boards that cannot generate fluorescence through white light images. Further, by cross-comparing two-dimensional fluorescence images and two-dimensional white light images, the advantages of fluorescence measurement and white light measurement can be utilized to make up for their respective deficiencies and improve the accuracy of detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a block diagram of a dual-light source substrate image measurement system of the present invention.

[0009] Figure 2 It is a block diagram of fluorescence measurement in the present invention.

[0010] Figure 3 It is a schematic diagram showing the substrate and control points in the present invention.

[0011] Figure 4 In (a) to (f) are schematic diagrams of the appearances of different line types in the present invention.

[0012] Figure 5 It is a top view schematic diagram of the substrate circuit in the present invention.

[0013] Figure 6 It is a top view schematic diagram of an embodiment of a circuit turn in the present invention.

[0014] Figure 7 It is a top view schematic diagram of an embodiment of a circular pad area in the present invention.

[0015] Figure 8 It is a top view schematic diagram of an embodiment of a metal ring in the present invention.

[0016] Figure 9 It is a top view schematic diagram of an embodiment of a circular hole in the substrate of the present invention.

[0017] Figure 10 It is a full-panel abnormality distribution diagram in the present invention.

[0018] Figure 11 It is a substrate measurement information diagram in the present invention.

[0019] Figure 12 It is a sub-region abnormality distribution diagram of the substrate in the present invention.

[0020] Figure 13 It is a line accuracy distribution information diagram in the present invention.

[0021] Figure 14 It is another block diagram of a dual-light source substrate image measurement system of the present invention.

[0022] Figure 15 In (a) and (b) are schematic diagrams of cross - comparison images in the present invention.

[0023] Figure 16 It is a schematic flowchart of the substrate image measurement method in the present invention.

[0024] Figure 17 It is a schematic flowchart of the substrate defect analysis method in the present invention.

[0025] The markings in the figure are as follows:

[0026] 100 Dual - light - source substrate image measurement system

[0027] 10 Excitation light generation device

[0028] 20 White - light generation device

[0029] 30 Line - scan image capture device

[0030] 40 Image measurement device

[0031] 41 Contour analysis module

[0032] 50 Human - machine operation interface

[0033] 51 Host computer

[0034] 52 Monitor

[0035] 53 Input device

[0036] Ld1 Excitation light

[0037] J1 Diffuse fluorescence

[0038] BD1 Circuit

[0039] BD2 Organic layer

[0040] AR Sub - region

[0041] Y1 Control point / measurement point

[0042] UW Upper width of the circuit

[0043] DW Lower width of the circuit

[0044] S1 First side line width

[0045] S2 Second side line width

[0046] LR Circuit length

[0047] Ar Arc

[0048] AD Arc center

[0049] R Distance

[0050] Center of MD

[0051] Distance R1

[0052] Distance R2

[0053] Outer edge boundary of metal ring B1

[0054] Center of MD1

[0055] Inner edge boundary of metal ring B2

[0056] Center of MD2

[0057] Distance DT

[0058] Bottom surface characteristic area H1

[0059] Defect area H2

[0060] Wall characteristic area H3

[0061] Top surface characteristic area H4

[0062] Width L1

[0063] Width L2

[0064] Length L4

[0065] Width L5

[0066] Abnormal distribution information diagram of circuit I1

[0067] Upper area K1

[0068] Lower area K2

[0069] Substrate measurement information diagram of circuit I2

[0070] Abnormal distribution diagram of substrate sub - area of circuit I3

[0071] Line width defect F1

[0072] Arc defect F2

[0073] Concentricity defect F3

[0074] Accuracy distribution information diagram of circuit I4

[0075] Sub - area Sb1

[0076] Characteristic impedance line Rd1

[0077] Circuit L

[0078] Circuit L’

[0079] Defect D

[0080] Defect D’

[0081] Method for Measuring Images of 200 Dual-Light-Source Substrates

[0082] Method for Analyzing Defects of 300 Dual-Light-Source Substrates Specific Embodiments

[0083] The following is a detailed description of the present invention and its technical content in conjunction with the accompanying drawings. For the convenience of description, the scale of the accompanying drawings in the present invention is not necessarily drawn according to the actual scale and there may be an exaggeration. The accompanying drawings and their scale are not intended to limit the scope of the present invention.

[0084] All the data and information described in the present invention can be stored in any non-register storage device, for example, stored on a local server device or a cloud server device, which is not limited in the present invention; or the data and information can be stored in the storage device of an individual device or in the database of a central control system, which is also not limited in the present invention.

[0085] In the present invention, the "module" and its corresponding functions can be loaded into the storage device and executed cooperatively by a single chip or a combination of multiple chips. The number of chips configured is not within the scope of limitation of the present invention. In addition, the chips can be, but are not limited to, a combination of devices such as a processor, a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a programmable logic device (PLD), etc., which is not limited in the present invention. The "storage device" described in the present invention can be, but is not limited to, a cache memory, a dynamic random access memory (DRAM), a persistent memory, etc., which can be used for storing and retrieving data, or a combination thereof, which is not limited in the present invention.

[0086] The "substrate" described in the present invention may include, for example, but is not limited to, a printed circuit board (PCB), a flexible printed circuit (FPC), a ceramic substrate, a multi-layer circuit board, or an integrated circuit board such as a wafer or a chip, which is not limited in the present invention. The "circuit" described in the present invention may include, for example, but is not limited to, a metal circuit or an etched circuit on the substrate, which is not limited in the present invention. The substrate in the present invention may be a single board including only a set of circuit features or a composite board composed of multiple substrate sub-regions, and the embodiments are not limited in the present invention. In the embodiment of the composite board, the shape and size of each substrate sub-region may be the same or different. Generally, in a large number of processes, multiple substrate sub-regions are usually integrated on a single board, and the substrate sub-regions are cut in the backend process to obtain multiple independent substrate modules.

[0087] Please first refer to the following Figure 1 , which is a block diagram of the dual-light-source substrate image measurement system of the present invention. As shown in the figure: The present invention discloses a dual-light-source substrate image measurement system 100, which can selectively provide excitation light or white light to a substrate W, and then capture and process the two-dimensional fluorescence image or two-dimensional white light image of the substrate W to generate two-dimensional circuit profile information of the substrate W, so as to measure the circuit on the substrate W through the two-dimensional circuit profile information. The dual-light-source substrate image measurement system 100 mainly includes an excitation light generation device 10, a white light generation device 20, a line-scan image capture device 30, and an image measurement device 40.

[0088] The excitation light generation device 10 is used to provide excitation light to the substrate W in the fluorescence mode, so that the substrate W generates fluorescence, and the fluorescence is used to highlight the circuit profile of the substrate W. The white light generation device 20 is used to provide white light to the substrate W in the white light mode. The line-scan image capture device 30 is used to capture the image of the substrate W in the fluorescence mode to obtain a two-dimensional fluorescence image, and / or capture the image of the substrate W in the white light mode to obtain a two-dimensional white light image. The image measurement device 40 is connected or coupled to the line-scan image capture device 30, and establishes a substrate measurement information according to the two-dimensional fluorescence image and / or the two-dimensional white light image.

[0089] For providing viewing and operation by personnel, the dual-light-source substrate image measurement system 100 further includes a man-machine operation interface 50, which is used to display the two-dimensional fluorescence image, two-dimensional white light image, and two-dimensional line profile information of the substrate W for personnel reference. The man-machine operation interface 50 may include a computer device, and the computer device includes a host 51, a display 52 connected to the host 51, and an input device 53 (such as a mouse, keyboard, etc.) connected to the host 51 for personnel to operate. In addition to allowing personnel to perform visual inspection, the man-machine operation interface 50 also allows personnel to perform appropriate operations, such as generating various reference images or quantification charts based on the two-dimensional fluorescence image, two-dimensional white light image, and / or two-dimensional line profile information, so as to facilitate subsequent use as a basis for correcting and compensating various variables of the substrate process. In another embodiment, the man-machine operation interface 50 can also be replaced by a networked external device. The external device may include, for example, but is not limited to, a computer, a notebook computer, a mobile device, a server, or a network attached storage device (NAS), etc. The variations of this embodiment are not limited in the present invention.

[0090] Next, please refer to Figure 2 , which is a block diagram of fluorescence measurement in the present invention, as shown in the figure. The excitation light generating device 10 provides excitation light Ld1, which irradiates on the substrate W and the peripheral area adjacent to the line BD1, so that the organic matter (such as the organic layer BD2) on the peripheral surface of the line is excited to generate diffused fluorescence J1, causing a brightness difference between the peripheral area of the line BD1 and the line BD1, thereby obtaining two-dimensional line profile information. The excitation light provided by the excitation light generating device 10 may include, for example, but is not limited to, ultraviolet light, X-ray, or any other specific light source that can excite organic matter to generate fluorescence, which is not limited in the present invention.

[0091] The line scanning image capturing device 30 is used in conjunction with the moving stage to dynamically capture the top view image of the entire surface of the substrate W. In one embodiment, a fluorescence filter is arranged on the lens of the line scanning image capturing device 30, and the reflected excitation light and other ambient light are filtered out through the fluorescence filter, and the fluorescence is allowed to pass through, thereby eliminating the noise in the fluorescence image.

[0092] The described image measurement device 40 can load a storage device through a processor and execute a corresponding image processing program to perform image processing functions. The image processing program can, for example, include but is not limited to an image preprocessing program, image segmentation and positioning, defect detection (gradientation, region growing, growth compensation, etc.), a machine learning system (Machine Learning), a deep learning system (Deep Learning), etc. The described image measurement device 40 can perform an image preprocessing procedure (such as image enhancement, noise removal, contrast enhancement, edge enhancement, feature capture, image compression, image conversion, etc.), and segment or extract the boundary of the image after the image preprocessing procedure to divide the region of interest (Region of Interest, ROI). The extraction method of the region of interest can, for example, include but is not limited to using binarization processing (Binarization) or segmenting the image features of different regions from the image by a neural network such as a machine learning system (Machine Learning) or a deep learning system (DeepLearning) after being trained by the system. This is not limited in the present invention.

[0093] The described image measurement device 40 includes a contour analysis module 41 for generating two-dimensional line contour information based on a two-dimensional fluorescence image and / or a two-dimensional white light image, and then establishing substrate measurement information based on the two-dimensional line contour information. In one embodiment, the "two-dimensional line contour information" described in the present invention can, for example, include but is not limited to information such as line width, line pitch, aperture, polygon perimeter, radian, circularity, or concentricity.

[0094] In one embodiment, the image measurement device 40 establishes and generates a plurality of measurement point information corresponding to the substrate W based on a two-dimensional fluorescence image or a two-dimensional white light image. Specifically, the image measurement device 40 can perform a large number of high-precision measurements on the surface of the substrate W by establishing a plurality of control points in the image. The present invention uses a large number of control point measurements to improve the overall accuracy and details of the measurement. The specific method can, for example, set a plurality of sampling control points for measurement, set a large number of control points or measurement points, or set all measurement points (for all measurement points of the object to be measured, such as the point cloud for constructing a three-dimensional image) for the object to be measured. The above-mentioned control points refer to a plurality of reference points selected on the substrate before the measurement work, and the coordinate positions of the reference points are measured by a precision measuring instrument; the measurement points are control points with arbitrary measurement data.

[0095] Specifically, please refer to Figure 3, which is a schematic diagram of the substrate and control points in the present invention, as shown in the figure. In one embodiment, for example, the substrate W is divided into a plurality of sub-regions AR (such as 2 to the power of N, which is 64 in the figure), and the center of gravity of the sub-region AR is defined as the control point / measurement point Y1 for sampling measurement. In other embodiments, for example, the number of samples can be determined according to odd or even sub-regions AR or other methods; it is also possible to perform random control point measurement of sub-regions AR based on a percentage of the number of sub-regions AR (such as 70%). The principle of a large number of control points and sampling measurement is just that the number of sub-regions AR is larger and the measurement is comprehensive, and all 100% of the sub-regions AR need to be measured. All measurement points are used to measure the plane of the substrate W to establish a point cloud and obtain the coordinate information of all points on the substrate W.

[0096] Next, please refer to Figure 4 , where (a) to (f) in the figure are schematic diagrams of the appearances of different types of lines in the present invention, as shown in the figure: Taking the embodiment of single-lens shooting as an example, a top view image of the substrate W can be obtained through the line-scan image capture device 30. Among them, the locally enlarged top view image can present, for example but not limited to, a straight line as shown in Figure 4 (a), an arc bent between straight lines as shown in Figure 4 (b), a round hole as shown in Figure 4 (c), a rectangular area as shown in Figure 4 (d), a circular area as shown in Figure 4 (e), or an irregular area as shown in Figure 4 (f), or any other form of line structure, which is not limited in the present invention. The method for obtaining two-dimensional line contour information will be described in the following paragraphs, and it is stated here in advance.

[0097] Next, please refer to Figure 5 , which is a top view schematic diagram of the substrate line of the present invention, and please also refer to Figure 2 , as shown in the figure: The lines of the substrate W mainly include the following two-dimensional line contour information: the upper width UW of the line, the lower width DW of the line, the first side width S1, the second side width S2, and the line length LR. In one embodiment, the first side width S1 and the second side width S2 can be calculated from the top view image. For example, the adjacent boundaries between the upper width UW and the lower width DW of the line in the top view image can be obtained respectively. Regarding the acquisition of the polygon perimeter and the line length LR, it can be directly obtained through pixel conversion after image segmentation of the polygon area. Regarding the acquisition of radian, roundness, and concentricity, it is obtained as revealed below.

[0098] Regarding the acquisition of radian, please refer to Figure 6, is a top view schematic diagram of an embodiment of the circuit turn of the present invention, as shown in the figure: The radian is a unit for measuring angles, which is basically the ratio of the arc length to the radius. Basically, the formula can be expressed as follows:

[0099] ;

[0100] Among them, α is the radian, L is the arc length, and r is the radius of the arc. As Figure 6 shown, the image measuring device 40 measures the length of the arc Ar from the top view to obtain the arc length L, and then measures the distance R from the arc Ar to the center of the arc AD to obtain the radius r, so as to calculate the value of the radian according to the position and shape information of the radian.

[0101] Regarding the acquisition of true roundness, please refer to Figure 7 , is a top view schematic diagram of an embodiment of the circular pad area of the present invention, as shown in the figure: The true roundness is represented by the radial offset of its actual contour relative to the ideal circle, that is, the difference between the maximum radius and the minimum radius relative to the same center of the circle. Specifically, it can be expressed by the following formula:

[0102] ;

[0103] Among them, △ is the true roundness, is the maximum radius of the selected center of the circle, is the minimum radius of the selected center of the circle. As Figure 6 shown, the solid line part is the actual circular pad area, and the dotted line part is the virtual circle set with the center of the circular pad area. The image measuring device 40 selects the center of the circle MD of the circular pad area from the top view, and measures the distance R1 from the center of the circle MD to the farthest arc boundary of the circular pad area to obtain , measures the distance R2 from the center of the circle MD to the nearest arc boundary of the circular pad area to obtain , and the true roundness of the circular pad area or the circular hole can be obtained through the above method.

[0104] Regarding the acquisition of concentricity, please refer to Figure 8 , is a top view schematic diagram of an embodiment of the metal ring of the present invention, as shown in the figure: The concentricity measures whether the centers of two circles are equal or very close. As Figure 8 shown, the image measuring device 40 selects the center of the circle MD1 formed by the outer edge boundary B1 of the metal ring from the top view, selects the center of the circle MD2 formed by the inner edge boundary B2 of the metal ring, and measures the distance DT between the center of the circle MD1 and the center of the circle MD2. Through the above method, the concentricity between the outer edge boundary B1 of the metal ring and the inner edge boundary B2 of the metal ring can be obtained.

[0105] The method for obtaining various two-dimensional line profile information such as the above-mentioned line width, line pitch, aperture, polygon perimeter, radian, roundness, concentricity, etc. is only one example of the present invention and is not intended to limit the present invention. Other methods for obtaining two-dimensional line profile information also fall within the scope of protection of the present invention.

[0106] In addition to the embodiment of using a single lens for shooting described above, the measurement of the substrate W can also be achieved through a dual lens. The present invention does not intend to limit the configuration requirements of using a single lens or a dual lens, and can be implemented according to the target to be measured. This is hereby stated in advance. In one embodiment, the configuration of the dual lens can be, for example, a camera arranged in the top view direction of the substrate W can obtain the top view image of the substrate W, and another camera arranged in the side view direction of the substrate W can obtain the side view image of the substrate W. The image measurement device 40 can obtain two-dimensional line profile information such as the upper width UW, lower width DW, and line height of the line through the above two groups of images taken from different orientations, and calculate and obtain the cross-sectional area of the line through the above two-dimensional line profile information, and further calculate and obtain the current-carrying capacity of the line based on the cross-sectional area of the line. In one embodiment, in addition to obtaining the top view image of the substrate W, the difference from the previous embodiment is that a height rangefinder is configured, such as but not limited to using laser, ultrasonic, chromatic confocal displacement sensing or other methods for measurement, to obtain the line height. In addition to the above embodiments, the above two-dimensional line profile information can also be obtained through 3D scanning technology, such as but not limited to Time of Flight (TOF), Triangulation, stereo vision method, etc. The present invention does not limit this.

[0107] Next, please refer to Figure 9 , which is a top view schematic diagram of an embodiment of the substrate round hole of the present invention, and please also refer to Figure 2 , as shown in the figure: The following is also based on Figure 2Shooting is performed using a single lens. According to the reflection characteristics of the round holes on the substrate W for different light sources, in the two-dimensional fluorescence image or two-dimensional white light image, it can be divided into two parts: the wall characteristic region and the surface characteristic region. The image of the region of interest can be segmented by, for example, but not limited to, binarization processing and boundary extraction (or algorithms such as detecting step edges, watershed segmentation algorithm, etc. to segment image blocks), and the wall characteristic region and the surface characteristic region can be directly segmented. Furthermore, the boundary of the round hole can be obtained from the region characteristics, and then four parts, namely the bottom surface characteristic region H1, the defect region H2, the wall characteristic region H3, and the top surface characteristic region H4, can be obtained. And the detection information can be obtained from the boundaries of the above regions. Specifically, substituting the width L1 of the boundary of the bottom surface characteristic region H1 into the viewing distance calculation can obtain the value of the lower aperture; substituting the width L2 of the boundary of the wall characteristic region H3 into the viewing distance calculation can obtain the value of the upper aperture; substituting the length L4, width L5 of the boundary of the defect region H2 and the position in the two-dimensional image into the viewing distance calculation can obtain the defect length, defect width, and defect position, and even further obtain the defect type, etc. from the above values. On the other hand, the wall characteristic region H3 of the round hole can be presented more clearly in the side view image, which is beneficial for detecting wall defects of the hole.

[0108] The contour analysis module 41 described in the present invention analyzes the two-dimensional circuit contour information and generates substrate distribution information. In one embodiment, the substrate distribution information is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional circuit contour information of the substrate W. A heat map is a data visualization technique that displays the absolute quantity of a phenomenon in the form of colors in a two-dimensional space. The color form of the heat map is, for example, but not limited to, using rainbow color mapping, colors of different shades, intensities or hues, or any other way that can enable people to intuitively see the distribution of the circuit information of the substrate W from the image. The concept of the present invention uses continuous changes in colors or grayscales to present the abnormal change amount and distribution of the circuits on the substrate W, and the selection or definition of individual colors is only for illustration and is not limited in the present invention. According to the difference in the detection target and function, the substrate distribution information can include, for example, but not limited to, the circuit abnormal distribution information map and the circuit accuracy distribution information map. In a preferred embodiment, the circuit abnormal distribution information map and the circuit accuracy distribution information map can be the full-page information obtained after full-page measurement. In the present invention, detection can be performed by fluorescence or white light. Among them, fluorescence detection performs full-page line scanning measurement. Compared with traditional measurement equipment, such as measurement equipment based on area scanning, which can only measure part of the region of the object to be measured, it cannot achieve the efficiency of full-page measurement of the object to be measured in the present invention.

[0109] In order to establish standard data for anomaly detection, in one embodiment, before the product is put on the production line, a standard wafer can be sent to the device of the present invention to establish substrate distribution information via the line scan image capture device 30 and the image measurement device 40, so as to first obtain various two-dimensional circuit profile information of the standard wafer, and store the obtained two-dimensional circuit profile information in the database indexed by the circuit position (such as coordinates) as the expected circuit size information of each circuit coordinate. When the device enters the production line, the image measurement device 40 obtains two-dimensional circuit profile information based on the two-dimensional fluorescence image or two-dimensional white light image, subtracts it from the expected circuit size information at the corresponding position of the standard wafer, obtains error value information indexed by coordinates, and determines whether the circuit is abnormal and measures the error based on whether the error value information exceeds a reasonable threshold. In one embodiment, the expected circuit size information can be, for example, but not limited to, the standard wafer image or the original Computer-Aided Manufacturing (CAM) file or other similar data stored in the database in advance; the standard wafer can be, for example, a master wafer or a good wafer, which is not limited in the present invention. In another embodiment, the expected circuit size information can be, for example, but not limited to, including circuit position, standard circuit size, and / or reasonable threshold. In one embodiment, the error value information can be expressed in ways other than pure difference values, such as percentage error, range, etc., which is not limited in the present invention.

[0110] Next, please refer to Figure 10 and Figure 11 , which are the full-board anomaly distribution map and the substrate measurement information map in the present invention, and please also refer to Figure 1 as shown in the figure: In one embodiment, the image measurement device 40 compares the two-dimensional circuit profile information with the expected circuit size information at the corresponding position to obtain error value information, and generates the abnormal distribution of all circuits on the substrate based on the error value information to establish circuit abnormal distribution information.

[0111] For example, as Figure 1 the human-machine operation interface 50 (refer to Figure 1 ) can present the abnormal distribution of the entire substrate W, so that personnel can intuitively understand the circuit abnormal distribution trend of the substrate W. In an optional embodiment, as Figure 10 shown, color marks (represented by gray scale in the figure, and their colors are not limited in the present invention) are marked on the circuit abnormal distribution information map I1, which can highlight the circuit segments or areas identified as abnormal on the image. When performing a full-board inspection of the substrate W, these color marks can show the overall abnormal distribution of the substrate W, and thus present the full-board circuit abnormal distribution trend.

[0112] It can be seen from the circuit anomaly distribution information diagram I1 that the number of anomaly points in the upper region K1 of the substrate W is much larger than that in the lower region K2 of the substrate W, and the anomaly points in the upper region K1 of the substrate W and the anomaly points in the lower region K2 of the substrate W are both concentrated in the lower positions. In addition, from the distribution of the above-mentioned anomaly points, the change of the circuit anomaly can be seen, so as to facilitate subsequent judgment and adjustment of various variables of the substrate process. In a selected embodiment, the circuit anomaly distribution information diagram I1 can not only present the distribution of the anomaly points of the substrate W, but also present the distribution of the anomaly points in a selected local area, so as to obtain the statistical quantity of the anomaly points in the local area of the substrate W. The present invention does not limit this.

[0113] In a selected embodiment, as Figure 10 shown in the display standard of the color marking, for example but not limited to, it is displayed based on whether the circuit has circuit size anomaly, circuit pattern anomaly, circuit position anomaly, etc. or other similar discrimination methods. The present invention does not limit this. In a selected embodiment, through Figure 10 the anomaly points presented by the circuit anomaly distribution information diagram I1 (substrate distribution information) as described above, statistical quantification can be further performed based on the number of anomaly points of different circuit types, as Figure 11 shown in the substrate measurement information diagram I2 of. The histogram part shows that the number of abnormal line widths is about 36,000, the number of abnormal line spacings is about 10,000, the number of abnormal apertures is about 4,000, the number of abnormal polygon perimeters is about 7,000, the number of abnormal radian is about 4,600, the number of abnormal roundness is about 7,600, and the number of abnormal concentricity is about 5,400; the pie chart part shows that the abnormal line width accounts for 10% of the total line width quantity, the abnormal line spacing accounts for 1% of the total line spacing quantity, the abnormal aperture accounts for 45% of the total aperture quantity, the abnormal polygon perimeter accounts for 48% of the total polygon perimeter quantity, the abnormal radian accounts for 38% of the total radian quantity, the abnormal roundness accounts for 15% of the total roundness quantity, and the abnormal concentricity accounts for 6% of the total concentricity quantity. Refer to the specification comprehensively accordingly. In an embodiment, the substrate measurement information diagram is presented in the form of, for example but not limited to, a bar chart, a pie chart, a histogram or other forms of charts or tables. The present invention does not limit this.

[0114] Next, please refer to Figure 12 together, which is the abnormal distribution diagram of the substrate sub-region in the present invention, and please refer to Figure 1, as shown in the figure: In one embodiment, the image measuring device 40 determines whether the two-dimensional line profile information is abnormal based on the error magnitude of the error value information, and colors the corresponding lines determined to be abnormal to establish the abnormal distribution map I3 of the substrate sub-region. Specifically, the image measuring device 40 can mark the line width defect F1, the arc defect F2, and the concentricity defect F3 on the abnormal distribution map I3 of the substrate sub-region. By analyzing the colored lines, the distribution position of the abnormal lines is analyzed to evaluate the abnormal distribution trend of the substrate sub-region.

[0115] Next, please refer to Figure 13 , which is the line accuracy distribution information map in the present invention, and please also refer to Figure 1 , as shown in the figure: In one embodiment, the image measuring device 40 takes the measurement target on the substrate as a reference to generate the distribution of the two-dimensional line profile information of all measurement targets on the substrate, so as to establish the line accuracy distribution information.

[0116] For example, the human-machine operation interface 50 (refer to Figure 1 ) can present the line accuracy distribution information map of the measurement target for personnel to intuitively understand the line accuracy distribution trend of the entire substrate W. In an alternative embodiment, the human-machine operation interface 50 can be operated by personnel to select any type of line segment, and use the two-dimensional line profile information of the selected line segment as the measurement reference, so as to obtain the line accuracy distribution information map I4 of the entire substrate W. Specifically, by selecting any line segment in any substrate sub-region of the substrate W and using the two-dimensional line profile information of the selected line segment as the measurement reference, the relative values of the two-dimensional line profile information of the corresponding line segments at the positions corresponding to the selected line segment on other substrate sub-regions are quantified, and then the differences are presented in colors, so as to analyze the overall accuracy distribution trend of the selected line segment and all corresponding line segments on the entire substrate W. As Figure 13 shown in the left table, taking the characteristic impedance line Rd1 of the sub-region Sb1 as an example, first, multiple target line segments are selected by means of frame selection, and after selecting a line segment from the multiple target line segments, the selection is confirmed to determine the specified line segment (i.e., the characteristic impedance line Rd1); then the measurement target of the specified line segment is selected (in this embodiment, the lower line width (Lower Width) is selected), the lower line width value of the selected line segment is 54.636, and the maximum value (in this embodiment, 73.12) and the minimum value (in this embodiment, 40.861) of the corresponding line segments of the entire circuit board (i.e., the lower line widths of the corresponding position line segments of other sub-blocks) are respectively used as the limit values of the color marks (for example, green is the upper limit value, blue is the lower limit value, and white is the standard value), and the measured lower line width values of the corresponding line segments of each sub-block are mapped to the colors between the upper limit value and the lower limit value to show the full-board trend of the specified line segment.

[0117] In an alternative embodiment, for example, fromFigure 13 It can be seen that based on the two-dimensional line profile information of the selected line segment, a line accuracy distribution information diagram I4 of the two-dimensional line profile information corresponding to the entire substrate W is established. Among them, the area with a color closer to white indicates that the two-dimensional line profile information of the corresponding line segment is closer to the two-dimensional line profile information of the selected line segment; the area with a color closer to dark green indicates that the two-dimensional line profile information of the corresponding line segment is greater than the two-dimensional line profile information of the selected line segment; and the area with a color closer to dark blue indicates that the two-dimensional line profile information of the corresponding line segment is less than the two-dimensional line profile information of the selected line segment. From the different color blocks presented in the line accuracy distribution information diagram I4, personnel can intuitively understand the full-board line accuracy distribution trend of the entire substrate W for a specific line segment. In an alternative embodiment, Figure 13 the colors in the line accuracy distribution information diagram I4 can be converted into a grayscale image. Since different colors have different brightness levels, the difference in the distribution of hot spots can be presented through different shades of grayscale. For example, the changing trend of electrical accuracy can be shown through the changing shades of grayscale.

[0118] In an embodiment, the image measuring device 40 obtains a capability process index (CPK) based on the maximum value, minimum value, and average value of the two-dimensional line profile information of all measurement targets, in combination with the expected line size information of the measurement target. Specifically, by using the expected line size information obtained from the standard chip as described above and adding the standard deviation (σ) allowed in the process, the upper specification limit (USL) and lower specification limit (LSL) of the selected line segment can be obtained, that is, the maximum and minimum values allowed in the process. And from the full-board line accuracy distribution diagram I4, the average value (μ) of the two-dimensional line profile information of the entire substrate W for a specific line segment can be obtained. Substituting the above values into the following calculation formula can calculate the capability process index (CPK):

[0119]

[0120] Through the above formula, a unitless CPK value can be obtained to evaluate the process capability. When the CPK value is greater than or equal to 1.33, it indicates that the process capability is good; if the CPK value is less than 1.33, it indicates that the process needs to be improved.

[0121] Next, please refer to Figure 14, which is another block diagram of the dual-light-source substrate image measurement system of the present invention, as shown in the figure: In an embodiment, the dual-light-source substrate image measurement system 100 further includes a defect analysis device 60, which is used to judge whether the two-dimensional fluorescence image and / or the two-dimensional white light image has a circuit flaw based on the substrate measurement information, and generate a circuit flaw result. Among them, the circuit flaw result is, for example but not limited to, judging that the circuit is short-circuited, open-circuited, or has insufficient current-carrying capacity, etc. For example, the defect analysis device 60 can obtain the expected size of the circuit based on the standard wafer, and compare it with the circuit size measured based on the two-dimensional fluorescence image or the two-dimensional white light image. If the error between the expected circuit size and the measured circuit size exceeds a reasonable threshold, the defect analysis device 60 judges that there is a circuit flaw in the image. If the error is within the allowable range, the defect analysis device 60 judges that there is no circuit flaw in the image; or the defect analysis device 60 can compare the circuit based on the standard wafer with the two-dimensional fluorescence image or the two-dimensional white light image to judge whether there is a circuit flaw in the two-dimensional fluorescence image or the two-dimensional white light image.

[0122] Next, please refer to Figure 15 , which is a schematic diagram of cross-comparing images of the present invention, as shown in the figure: In an embodiment, the defect analysis device 60 can cross-compare the flaw regions of the two-dimensional fluorescence image and the corresponding flaw regions of the two-dimensional white light image according to the circuit flaw results generated by the two-dimensional fluorescence image and the two-dimensional white light image, and judge the authenticity of the flaws. In order to perform image comparison, the defect analysis device 60 needs to align the images first. The image alignment steps include, for example, feature extraction of the images. The extracted features include, for example but not limited to, corner points, edges, or specific graphics in the images, etc. According to the result of feature matching, the conversion method of the images is calculated, for example but not limited to, image conversions such as translation, rotation, or scaling, etc., to facilitate subsequent image comparison. The image conversion method is well-known to those with ordinary knowledge in the art and is not limited in the present invention. For example, as Figure 15 (a) shows, the left figure represents the two-dimensional fluorescence image FI of the flaw region of the substrate W, and the right figure represents the two-dimensional white light image WI of the flaw region corresponding to the aforementioned flaw region. In the two-dimensional fluorescence image FI, tiny chemical residues or oxidation and other flaws D can be shown on the circuit L. Because such flaws are related to the change of chemical components, they will emit fluorescence based on the irradiation of the excitation light, but such flaws are difficult to detect by white light detection. Therefore, the circuit L' does not show the above-mentioned flaw D in the two-dimensional white light image WI. Another example is, as Figure 15As shown in (b), the difference from the previous embodiment is that the defect D' is, for example, a scratch, a crack, etc. The appearance characteristics of such defects can be highlighted in white light inspection. Generally, such defects are difficult to detect in fluorescence inspection unless such defects are contaminated or affected by chemical substances or fluorescent materials, in which case such defects can be more prominent in fluorescence inspection. In the present invention, by cross-comparing the two-dimensional fluorescence image and the two-dimensional white light image, different types of defects are highlighted in different images to improve the accuracy of judging different defects.

[0123] In one embodiment, the defect analysis device 60 can determine to use the defective area of the two-dimensional fluorescence image or the corresponding defective area of the two-dimensional white light image as the standard reference area during cross-comparison according to the material of the area to be measured on the substrate W. Generally, the manufacturing components of the substrate W include multiple materials, such as but not limited to glass, silicon, and / or metal and other materials. For example, if it is desired to detect an area to be measured on the substrate W with a material of glass, since defects (such as scratches, cracks, etc.) on the glass surface generally have a low correlation with changes in chemical composition and are difficult to detect such defects in fluorescence inspection, therefore, the defect analysis device 60 can select the corresponding defective area of the two-dimensional white light image as the standard reference area to facilitate the judgment of defects in the glass material area. Another example, if it is desired to detect an area to be measured on the substrate W with a material of silicon, since there is a high possibility that silicon has minute chemical residues or oxidation and other defects due to changes in chemical composition, such defects are difficult to detect in white light inspection but can be clearly highlighted in fluorescence inspection. Therefore, the defect analysis device 60 can select the defective area of the two-dimensional fluorescence image as the standard reference area to facilitate the judgment of defects in the silicon material area. In the present invention, according to the material of the area to be measured on the substrate W to be detected, an image that is more conducive to highlighting defects can be selected as the detection benchmark to improve the accuracy of defect detection.

[0124] Next, please refer to Figure 16 together, which is a schematic flowchart of the substrate image measurement method in the present invention. Based on the above dual-light source substrate image measurement system 100, the present invention further discloses a dual-light source substrate image measurement method 200, including the following steps:

[0125] First, the excitation light generating device 10 provides excitation light to the substrate W in the fluorescence mode to cause the substrate W to generate fluorescence; the white light generating device 20 provides white light to the substrate W in the white light mode (step S01).

[0126] Next, the line scan image capturing device 30 captures an image of the substrate W in the fluorescence mode to obtain a two-dimensional fluorescence image, and / or captures an image of the substrate W in the white light mode to obtain a two-dimensional white light image (step S02).

[0127] Next, the substrate measurement information is established by the image measurement device 40 based on the two-dimensional fluorescence image and / or the two-dimensional white light image (step S03). Through the two-dimensional fluorescence image or the two-dimensional white light image of the substrate W captured in the present invention, two-dimensional circuit profile information such as, but not limited to, line width, line pitch, aperture, polygon perimeter, radian, roundness, or concentricity can be measured and obtained.

[0128] In the present invention, the contour analysis module 41 included in the image measurement device 40 generates two-dimensional circuit profile information based on the two-dimensional fluorescence image and / or the two-dimensional white light image, and then establishes the substrate measurement information based on the two-dimensional circuit profile information (step S04). The "substrate measurement information" is statistical data of various measurement data generated based on the circuit profile, such as statistical data charts of upper line width / line pitch, lower line width / line pitch, rectangle length and width, radian, roundness, concentricity, aperture, and so on.

[0129] Next, the image measurement device 40 analyzes the two-dimensional circuit profile information to generate substrate distribution information (step S05). In one embodiment, the substrate distribution information is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional circuit profile information of the substrate W. In one embodiment, the substrate distribution information includes a circuit anomaly distribution information map and a circuit accuracy distribution information map. Among them, the establishment of the circuit anomaly distribution information is achieved by comparing the two-dimensional circuit profile information with the expected circuit size information at the corresponding position to obtain error value information, and generating the distribution of all circuit anomalies on the substrate W based on the error value information to establish the circuit anomaly distribution information map; the establishment of the circuit accuracy distribution information is based on the measurement targets on the substrate W, and generates the distribution of the substrate measurement information of all measurement targets on the substrate W to establish the circuit accuracy distribution information.

[0130] In one embodiment, the image measurement device 40 can obtain the process capability index (CPK) based on the maximum value, minimum value, and average value in the two-dimensional circuit profile information of all measurement targets, in combination with the expected circuit size information of the measurement targets. If the process capability index is greater than or equal to 1.33, it indicates that the process capability is good; if the CPK value is less than 1.33, it indicates that the process needs to be improved.

[0131] Next, please refer to Figure 17 , which is a schematic flow chart of the dual-light source substrate defect analysis method in the present invention. As shown in the figure: Based on the above dual-light source substrate image measurement method 200, the present invention further discloses a dual-light source substrate defect analysis method 300, which respectively includes the following steps:

[0132] In one embodiment, the defect analysis device 60 can determine whether the two-dimensional fluorescence image and / or the two-dimensional white light image has a circuit flaw and generate a circuit flaw result (step S301). In the present invention, based on the expected circuit size information obtained from the standard wafer, the two-dimensional circuit profile information measured based on the two-dimensional fluorescence image or the two-dimensional white light image can be compared. If the obtained error value exceeds a reasonable threshold, the defect analysis device 60 determines that there is a circuit flaw in the image; otherwise, it determines that there is no circuit flaw. For example, but not limited to, judging flaws such as circuit short circuit, open circuit, and insufficient current-carrying capacity.

[0133] In one embodiment, the defect analysis device 60 can cross-compare the flaw region of the two-dimensional fluorescence image with the corresponding flaw region of the two-dimensional white light image according to the circuit flaw result generated from the two-dimensional fluorescence image and the two-dimensional white light image to determine the authenticity of the flaw (step S302). In the present invention, by cross-comparing the two-dimensional fluorescence image and the two-dimensional white light image and using the differences presented by different flaws for different light sources in the image, the flaw can be highlighted to facilitate judging and confirming whether the flaw is a real defect.

[0134] In one embodiment, the defect analysis device 60 can determine to use the flaw region of the two-dimensional fluorescence image or the corresponding flaw region of the two-dimensional white light image as the standard reference region during cross-comparison according to the material of the region to be measured on the substrate W (step S303). In the present invention, by selecting the two-dimensional fluorescence image or the two-dimensional white light image as the detection reference according to the different materials of the region to be measured on the substrate W, the respective advantages of fluorescence detection and white light detection can be effectively utilized to improve the accuracy of flaw detection.

[0135] In summary, the present invention detects the substrate through a fluorescence image or a white light image. In addition to being able to perform a comprehensive measurement application of the entire board through the fluorescence image, thereby improving the accuracy of circuit measurement and thus the quality of image circuit measurement, it can also perform a measurement application on a circuit board that cannot generate fluorescence through the white light image. Further, by cross-comparing the two-dimensional fluorescence image and the two-dimensional white light image, the advantages of fluorescence measurement and white light measurement can be utilized to make up for their respective deficiencies and improve the accuracy of detection.

[0136] The present invention has been described in detail above. The above description is only one preferred embodiment of the present invention. It should not be used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. A dual-light source substrate image measurement system, characterized in that: include: An excitation light generating device, used for providing an excitation light to a substrate in a fluorescence mode, so that the substrate generates fluorescence; a white light generating device, for providing a white light to the substrate in a white light mode; a line scanning image capture device for capturing an image of the substrate in the fluorescence mode to obtain a one-dimensional fluorescence image, and / or capturing an image of the substrate in the white light mode to obtain a one-dimensional white light image; as well as An image measuring device is connected or coupled to the line scan image capturing device, and establishes substrate measurement information according to the two-dimensional fluorescent image and / or the two-dimensional white light image.

2. The dual-light source substrate image measurement system according to claim 1, characterized in that: The substrate measurement information includes line width, line spacing, aperture, polygon perimeter, arc, roundness or concentricity. The image measurement device includes a contour analysis module for generating two-dimensional line contour information according to the two-dimensional fluorescent image and / or the two-dimensional white light image, and then establishing the substrate measurement information according to the two-dimensional line contour information.

3. The dual-light source substrate image measurement system according to claim 2, characterized in that: The profile analysis module analyzes the two-dimensional line profile information to generate substrate distribution information. The substrate distribution information is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional line profile information of the substrate, and the substrate distribution information includes a line abnormality distribution information map and a line accuracy distribution information map.

4. The dual-light source substrate image measurement system according to claim 3, characterized in that: The image measuring device compares the two-dimensional line profile information with the expected line size information of the corresponding position to obtain error value information, and generates abnormal distribution conditions of all lines on the substrate based on the error value information to establish the line abnormal distribution information map.

5. The dual-light source substrate image measurement system according to claim 3, characterized in that: The image measuring device uses a measurement target on the substrate as a reference to generate the distribution of the two-dimensional line profile information of all the measurement targets on the substrate to establish the line accuracy distribution information map.

6. The dual-light source substrate image measurement system according to claim 5, characterized in that: The image measuring device obtains a process capability index based on the maximum value, minimum value and average value of the two-dimensional line profile information of all the measurement targets and in combination with the expected line size information of the measurement targets.

7. The dual-light source substrate image measurement system according to claim 1, characterized in that: It further includes a defect analysis device, wherein the image measurement device generates a plurality of measurement point information corresponding to the substrate according to the two-dimensional fluorescent image, and the defect analysis device is used to determine whether the two-dimensional fluorescent image and / or the two-dimensional white light image has a line defect based on the substrate measurement information, and generate a line defect result.

8. The dual-light source substrate image measurement system according to claim 7, characterized in that: The defect analysis device cross-compares the defect area of ​​the two-dimensional fluorescent image with the corresponding defect area of ​​the two-dimensional white light image based on the line defect results generated by the two-dimensional fluorescent image and the two-dimensional white light image to determine the authenticity of the defect.

9. The dual-light source substrate image measurement system according to claim 8, characterized in that: The defect analysis device determines to use the defect area of ​​the two-dimensional fluorescent image or the corresponding defect area of ​​the two-dimensional white light image as a standard reference area during cross comparison according to the material of a test area on the substrate.

10. A dual-light source substrate image measurement method, characterized in that: include: Providing excitation light to a substrate in a fluorescence mode so that the substrate generates fluorescence; Providing a white light to the substrate in a white light mode; capturing an image of the substrate in the fluorescence mode to obtain a two-dimensional fluorescence image, and / or capturing an image of the substrate in the white light mode to obtain a two-dimensional white light image; as well as A substrate measurement information is established according to the two-dimensional fluorescent image and / or the two-dimensional white light image.

11. The dual-light source substrate image measurement method according to claim 10, characterized in that: A two-dimensional line profile information is generated according to the two-dimensional fluorescent image and / or the two-dimensional white light image, and then the substrate measurement information is established according to the two-dimensional line profile information. The substrate measurement information includes line width, line spacing, aperture, polygon perimeter, curvature, roundness or concentricity.

12. The dual-light source substrate image measurement method according to claim 11, characterized in that: The two-dimensional line contour information is further analyzed to generate substrate distribution information. The substrate distribution information is displayed in the form of a heat map or a grayscale map to present the distribution of the two-dimensional line contour information of the substrate, and the substrate distribution information includes a line abnormality distribution information map and a line accuracy distribution information map.

13. The dual-light source substrate image measurement method according to claim 12, characterized in that: The two-dimensional line profile information is compared with expected line size information of corresponding positions to obtain error value information, and the abnormal distribution of all lines on the substrate is generated based on the error value information to establish the line abnormal distribution information map.

14. The dual-light source substrate image measurement method according to claim 12, characterized in that: Taking a measurement target on the substrate as a reference, the distribution of the two-dimensional line profile information of all the measurement targets on the substrate is generated to establish the line accuracy distribution information map.

15. The dual-light source substrate image measurement method according to claim 14, characterized in that: A process capability index is obtained based on the maximum value, the minimum value and the average value in the two-dimensional line profile information of all the measurement targets and combined with the expected line size information of the measurement targets.

16. The dual-light source substrate image measurement method according to claim 10, characterized in that: According to the two-dimensional fluorescent image, a plurality of measurement point information corresponding to the substrate is generated, and it is determined whether the two-dimensional fluorescent image and / or the two-dimensional white light image has a line defect, and a line defect result is generated.

17. The dual-light source substrate image measurement method according to claim 16, characterized in that: According to the line defect results generated by the two-dimensional fluorescent image and the two-dimensional white light image, the defect area of ​​the two-dimensional fluorescent image is cross-compared with the corresponding defect area of ​​the two-dimensional white light image to determine the authenticity of the defect.

18. The dual-light source substrate image measurement method according to claim 17, characterized in that: According to the material of a region to be tested on the substrate, during cross comparison, it is determined to use the defect region of the two-dimensional fluorescent image or the corresponding defect region of the two-dimensional white light image as a standard reference region.

Images