Wafer cooling module and wafer testing equipment with same
By designing the wafer cooling module in the wafer test equipment, using the fluid channel of the fluid supply device and the test seat, the cooling fluid is sprayed to the wafer slot, solving the overheating problem caused by high power consumption during the wafer test and improving the reliability of the test.
Patent Information
- Application Number
- CN202311843829.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-07-01
AI Technical Summary
During wafer testing, the high power consumption of the wafer causes heat energy to rise, which may cause the wafer slot to overheat, damage the wafer test equipment, and the high temperature may cause the hot balls to soften and melt, affecting the test results.
A wafer cooling module is designed to generate cooling fluid through a fluid supply device and spray cooling fluid into the wafer slot through a fluid channel on the side wall of the test seat to cool the wafer and the slot to be tested.
Effectively reduces the temperature of the wafer slot, prevents overheating from damaging the equipment, and avoids softening and melting of the hot balls, improving the reliability and success rate of the test.
Smart Images
Figure CN120233121A_ABST
Abstract
Description
Technical Field
[0001] This case relates to a wafer cooling module for cooling a test device and a wafer under test when detecting a wafer, and a wafer test device equipped with the module. Background Art
[0002] With the development of technology, the functions of integrated circuit wafers (hereinafter simply referred to as wafers) are increasing, and their performance is also improving year by year. In order to ensure the yield of wafers, wafers must be tested before leaving the factory to ensure their normal functions. However, as the performance of wafers improves, the power consumption of wafers also increases. Herein, the heat generated during wafer testing gradually rises, so that the wafer socket for accommodating the wafer may have problems due to overheating, which may further cause damage to the test device.
[0003] In addition, when the temperature of the probe in the wafer under test or the wafer socket exceeds 100 °C, the solder balls on the bottom surface of the wafer may start to soften. Therefore, during the test process, solder ball melting often occurs, and the solder balls adhere to the probes or the solder ball residues are scattered in the test socket. After a period of time, at best, it will lead to test failure, and in severe cases, it will form a short circuit, causing damage to the wafer or equipment failure. Summary of the Invention
[0004] To solve the above problems, the inventor proposes a wafer cooling module and a wafer test device equipped with the module. A cooling fluid is generated by a fluid supply device, and the cooling fluid flows through the flow space formed by the lower surface of the wafer and the wafer socket to cool the wafer socket. In addition, the wafer cooling module and the wafer test device equipped with the module can also synchronously flow the cooling fluid through the upper surface of the wafer to further improve the efficiency of cooling the wafer socket.
[0005] In some embodiments, a wafer cooling module includes a test socket and a fluid supply device. The test socket includes a wafer socket and at least one fluid channel, and the wafer socket is used to accommodate a wafer under test. The fluid supply device is connected to at least one fluid channel of the test socket. Wherein, at least one fluid channel includes a gradually expanding opening, and the gradually expanding opening is arranged on a side wall of the test socket and faces the wafer socket; in response to the fluid supply device supplying a cooling fluid to at least one fluid channel, the cooling fluid forms a jet flow toward the wafer socket through the gradually expanding opening.
[0006] In some embodiments, in response to the wafer under test being accommodated in the wafer socket, a flow space is formed between the lower surface of the wafer under test and the wafer socket; in response to the fluid supply device supplying a cooling fluid to at least one fluid channel, the cooling fluid forms a jet flow toward the flow space through the gradually expanding opening.
[0007] In some embodiments, the test socket further includes at least one fluid discharge channel, wherein the at least one fluid discharge channel is disposed on another sidewall of the wafer slot, one end of the at least one fluid discharge channel communicates with the wafer slot, and the other end of the at least one fluid discharge channel communicates with the external atmosphere; the sidewall and the another sidewall are respectively located on two corresponding sides of the wafer slot.
[0008] In some embodiments, the wafer cooling module further includes a test socket plate, wherein the test socket plate is disposed on the test socket; the test socket plate includes at least one jet channel, one end of the at least one jet channel communicates with the fluid supply device, and the other end of the at least one jet channel communicates with the wafer slot of the test socket; the at least one jet channel includes a gradually expanding nozzle, and the gradually expanding nozzle is disposed on the sidewall of the test socket and faces the wafer slot; in response to the fluid supply device supplying a cooling fluid to the at least one jet channel, the cooling fluid forms a jet into the wafer slot via the gradually expanding nozzle.
[0009] In some embodiments, a wafer testing device includes a test socket, a fluid supply device, and a controller. The test socket includes a wafer slot and at least one fluid channel, the wafer slot is used to accommodate a wafer to be tested, the at least one fluid channel includes a gradually expanding opening, and the gradually expanding opening is disposed on a sidewall of the test socket and faces the wafer slot. The fluid supply device is connected to the at least one fluid channel of the test socket. The controller is electrically connected to the test socket and the fluid supply device. Wherein, the controller is used to control the fluid supply device to supply a cooling fluid to the at least one fluid channel, so that the cooling fluid forms a jet into the wafer slot via the gradually expanding opening, and the controller is used to control the test socket to test the wafer to be tested.
[0010] In some embodiments, the wafer testing device further includes a test socket plate, and the test socket plate is disposed on the test socket. The test socket plate includes at least one jet channel, one end of the at least one jet channel communicates with the fluid supply device, and the other end of the at least one jet channel communicates with the wafer slot of the test socket, wherein the at least one jet channel includes a gradually expanding nozzle. The controller is further used to control the fluid supply device to supply a cooling fluid to the at least one jet channel, so that the cooling fluid forms a jet into the wafer slot via the gradually expanding nozzle.
[0011] In some embodiments, the wafer testing device further includes a probing head, the probing head corresponds to the wafer slot of the test socket and is electrically connected to the controller, and the controller is further used to control the probing head to approach the wafer slot to press against the wafer to be tested or control the probing head to move away from the wafer slot. Wherein, the probing head includes an outlet channel and a pressing surface, the pressing surface includes a diversion groove, the diversion groove communicates with the gradually expanding nozzle of the test socket, one end of the outlet channel communicates with the diversion groove, and the other end of the outlet channel communicates with the external atmosphere.
[0012] In some embodiments, the wafer testing device further includes a probing head. The probing head corresponds to the wafer slot of the test socket and is electrically connected to the controller. The controller is further configured to control the probing head to approach the wafer slot to press against the wafer under test or to control the probing head to move away from the wafer slot. Wherein, the probing head includes at least one top flow channel. The at least one top flow channel communicates with the fluid supply device. The at least one top flow channel includes a gradually expanding outlet, and the gradually expanding outlet faces the wafer slot. The controller is further configured to control the fluid supply device to supply cooling fluid to the at least one top flow channel, so that the cooling fluid forms a jet flow into the wafer slot via the gradually expanding outlet.
[0013] In summary, according to any of the above embodiments, the wafer cooling module and the wafer testing device equipped with the module can provide cooling fluid to the wafer slot through the fluid channel on the side wall of the test socket to cool it. Wherein, when the cooling fluid passes through the gradually expanding opening of the fluid channel, the fluid pressure and temperature decrease, but the flow rate of the cooling fluid increases, and a jet flow is formed into the wafer slot. Therefore, the cooled cooling fluid can cool the inside of the wafer slot. In addition, a jet flow of cooling fluid can also be provided to the wafer slot synchronously through the jet flow channel on the side wall of the test socket or the top flow channel of the probing head, thereby improving the cooling effect of the wafer slot. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a perspective view of a wafer testing device according to an embodiment.
[0015] Figure 2 is a partial perspective exploded view of a wafer testing device according to an embodiment.
[0016] Figure 3 is a system block diagram of a wafer testing device according to an embodiment.
[0017] Figure 4 is a schematic diagram of a wafer testing device according to an embodiment.
[0018] Figure 5 is Figure 1 a cross-sectional view taken along section line 5-5 in
[0019] Figure 6 is Figure 5 an enlarged cross-sectional view of the circled area in
[0020] Figure 7 is Figure 1 a cross-sectional view taken along section line 7-7 in
[0021] Figure 8 is Figure 1 a schematic cross-sectional view taken along section line 9-9 in
[0022] Figure 9 isFigure 1 Schematic cross-sectional view along section line 10-10.
[0023] Figure 10 Schematic diagram of a wafer testing device according to another embodiment.
[0024] Figure 11 Cross-sectional view of a wafer testing device according to another embodiment.
[0025] Wherein, reference numerals:
[0026] 1: Wafer testing device
[0027] 100: Wafer cooling module
[0028] 101: Test socket
[0029] 102: Fluid supply device
[0030] 103: Wafer slot
[0031] 104: Fluid channel
[0032] 105: Fluid discharge channel
[0033] 106: Outlet channel
[0034] 110: Controller
[0035] 120: Test circuit board
[0036] 130: Test socket board
[0037] 131: Jet flow channel
[0038] 140: Pressure testing head
[0039] 141: Top flow channel
[0040] 142: Pressing surface
[0041] 143: Flow guiding groove
[0042] 144: Pressing block
[0043] 200: Wafer to be tested
[0044] CD1: Tapered section
[0045] CD2: Neck section
[0046] CD3: Divergent section
[0047] CF1: Cooling fluid
[0048] OP1: Divergent opening
[0049] OP2: Divergent nozzle
[0050] OP3: Gradually expanding outlet
[0051] SW, SW1, SW2: Side wall Detailed implementation manner
[0052] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but it is not intended to limit the present invention.
[0053] Please refer to Figures 1 to 7 , the wafer testing device 1 includes a wafer cooling module 100 and a controller 110, wherein the wafer cooling module 100 includes a test socket 101 and a fluid supply device 102. The test socket 101 includes a wafer slot 103 and a fluid channel 104, wherein the wafer slot 103 is used to accommodate the wafer 200 to be tested, and the fluid supply device 102 is connected to the fluid channel 104 of the test socket 101. In some embodiments, the test socket 101 further includes a side wall SW, wherein the side wall SW is used to define the wafer slot 103, so that when the wafer 200 to be tested is disposed on the wafer slot 103, it is clamped by the side wall SW to be fixed (as Figure 4 shown).
[0054] In some embodiments, the wafer testing device 1 further includes a test circuit board 120, wherein the test socket 101 is disposed on the test circuit board 120. As Figure 4 shown, in some embodiments, the controller 110 is electrically connected to the test socket 101 and the fluid supply device 102. In some embodiments, the test circuit board 120 can be a dedicated test board exclusive to the wafer 200 to be tested, such as but not limited to a development board, a mother board or a test male board; that is, when the wafer 200 to be tested is changed, the test circuit board 120 will be replaced accordingly.
[0055] Figure 7 shows 4 fluid channels 104, but not limited thereto. In addition, as Figures 4 to 6 shown, each fluid channel 104 includes a gradually expanding opening OP1, wherein the gradually expanding opening OP1 is disposed on a side wall SW1 of the test socket 101, and the gradually expanding opening OP1 faces the wafer slot 103. In some embodiments, the wafer slot 103 is provided with a plurality of probes (Pogo pings), which correspond to a plurality of pins or a plurality of solder balls on the lower surface of the wafer 200 to be tested. Among them, when the wafer 200 to be tested is disposed in the wafer slot 103, the wafer 200 to be tested is electrically contacted with the plurality of probes of the wafer slot 103 via the plurality of pins or the plurality of solder balls, and a fluid receiving space is formed between the lower surface of the wafer 200 to be tested and the wafer slot 103, and the gradually expanding opening OP1 faces the fluid receiving space.
[0056] In some embodiments, the test socket 101 further includes a fluid discharge channel 105 disposed on another sidewall SW2 of the wafer slot 103. One end of the fluid discharge channel 105 communicates with the fluid-containing space of the wafer slot 103, and the other end communicates with the external atmosphere. In some embodiments, the fluid discharge channel 105 may be a single elongated discharge channel or multiple independent discharge channels, and the independent discharge channels do not communicate with each other.
[0057] As Figure 4 shown, in some embodiments, the wafer testing device 1 further includes a test socket board 130 and a probing head 140. The test socket board 130 is disposed on the test socket 101; the probing head 140 is located above the wafer slot 103 of the test socket 101 and may include a lifting mechanism (not shown in the figure), which includes but is not limited to a pneumatic cylinder, a hydraulic cylinder, a linear motor, a screw lift, or other equivalent mechanisms. In addition, the probing head 140 is electrically connected to the controller 110, and the controller 110 can control the lifting of the probing head 140.
[0058] In some embodiments, when the wafer testing device 1 starts to operate, the controller 110 controls the probing head 140 to approach the wafer slot 103 to press against the wafer 200 to be tested, so as to ensure that a plurality of solder balls of the wafer 200 to be tested are in electrical contact with a plurality of probes of the wafer slot 103. Among them, when the probing head 140 presses against the wafer 200 to be tested, the probing head 140, the test socket 101, and the test socket board 130 form a fluid chamber.
[0059] In some embodiments, the controller 110 controls the fluid supply device 102 to generate a cooling fluid CF1 and supply it to the fluid channel 104, so that the fluid channel 104 forms a jet flow toward the wafer slot 103 through the gradually expanding opening OP1. Further explanation, when the cooling fluid CF1 is supplied to the fluid channel 104 and flows into the gradually expanding opening OP1, since the gradually expanding opening OP1 is configured as a gradually expanding nozzle, the cooling fluid CF1 is ejected toward the outlet direction of the gradually expanding opening OP1; after passing through the gradually expanding opening OP1, the velocity of the cooling fluid CF1 increases significantly, while the temperature and pressure both decrease significantly. However, the cooled cooling fluid CF1 can cool the wafer 200 to be tested and the wafer slot 103.
[0060] Further explanation, as Figure 4As shown, when the cooling fluid CF1 flows into the flow space formed between the lower surface of the wafer 200 under test and the wafer slot 103, the cooling fluid CF1 flows out of the flow space through the fluid discharge channel 105. At this time, since the cooling fluid CF1 flows through the lower surface (including pins or solder balls) of the wafer 200 under test and the wafer slot 103 (including probes), the wafer 200 under test and the wafer slot 103 can be cooled. At the same time, since the cooling fluid CF1 flows through the flow space at a certain flow rate, foreign matters such as lint or dust in the flow space can be discharged from the wafer slot 103 through the fluid discharge channel 105, and the cleanliness inside the wafer slot 103 can be maintained.
[0061] Please refer to Figure 2 , the probing head 140 includes four pressing blocks 144, which are equidistantly distributed on the lower surface of the probing head 140. Each pressing block 144 includes a pressing surface 142 for pressing against the wafer 200 under test, which can ensure that all the pins or solder balls on the wafer 200 under test are electrically connected to the corresponding probes on the wafer slot 103 of the test socket 101. Furthermore, a diversion groove 143 is formed between the four pressing blocks 144.
[0062] Please refer to Figure 2 , Figure 4 , Figure 8 and Figure 9 . As shown in the figure, the test socket board 130 includes two jet channels 131, one end of which is connected to the fluid supply device 102, and the other end is connected to the wafer slot 103 of the test socket 101. In addition, an outlet channel 106 is provided on the side wall SW of the test socket 101, one end of which is connected to the wafer slot 103, and the other end is connected to the external atmosphere.
[0063] In some embodiments, the jet channel 131 includes a gradually expanding jet orifice OP2, the opening direction of which is obliquely downward and towards the wafer 200 under test. Herein, when the fluid supply device 102 supplies the cooling fluid CF1 to the jet channel 131, the cooling fluid CF1 forms a jet towards the wafer slot 103 through the gradually expanding jet orifice OP2 to cool the wafer 200 under test, and is discharged through the outlet channel 106.
[0064] Further illustration, since the gradually expanding jet orifice OP2 is also configured as a gradually expanding nozzle, when the cooling fluid CF1 is supplied to the jet channel 131 and enters the gradually expanding jet orifice OP2, the velocity of the cooling fluid CF1 increases significantly, while the temperature and pressure both decrease significantly. However, the cooling fluid CF1 after the temperature drop can cool the upper surface of the wafer 200 under test. In addition, the diversion groove 143 on the probing head 140 provides a flow path for the cooling fluid CF1.
[0065] For another example Figure 4 and Figure 8As shown, when the pressure testing head 140 presses against the wafer 200 to be tested, a fluid chamber is formed among the pressure testing head 140, the test socket 101 and the test socket plate 130, and the upper and lower fluid-containing spaces separated by the wafer 200 to be tested are formed in this fluid chamber. Accordingly, when the fluid supply device 102 supplies the cooling fluid CF1 to the fluid channel 104 and the jet channel 131 simultaneously, and after accelerating and cooling the cooling fluid CF1 through the gradually expanding opening OP1 and the gradually expanding jet opening OP2, the cooling fluid CF1 can flow into the upper and lower fluid-containing spaces of the wafer 200 to be tested respectively. Thereby, in addition to cooling the upper and lower surfaces of the wafer 200 to be tested, the internal space of the wafer slot 103 can also be cleaned synchronously to avoid the influence of dust, lint or other foreign matters on the test.
[0066] Please refer to Figure 10 and Figure 11 , in the embodiment shown in the figure, the pressure testing head 140 may include a top flow channel 141, one end of which communicates with the fluid supply device 102, and the other end includes a gradually expanding outlet OP3, the opening of which faces the wafer 200 to be tested. Accordingly, when the fluid supply device 102 supplies the cooling fluid CF1 to the top flow channel 141, and after accelerating and cooling the cooling fluid CF1 through the gradually expanding outlet OP3, the upper surface of the wafer 200 to be tested can be cooled. It should be noted that Figure 10 shows only one top flow channel 141, but not limited thereto. In other embodiments, multiple top flow channels 141 may be included, such as Figure 11 the embodiment shown. Moreover, the number and position of the top flow channels 141 can also be set in combination with the pressing block 144 and the diversion groove 143 below the pressure testing head 140, please refer to Figure 2 .
[0067] In addition, as Figure 11 shown in the embodiment, the top flow channel 141 includes a gradually shrinking section CD1, a neck section CD2 and a gradually expanding section CD3; wherein the gradually shrinking section CD1 communicates with the fluid supply device 102, the neck section CD2 is located between the gradually shrinking section CD1 and the gradually expanding section CD3, and the gradually expanding section CD3 includes the gradually expanding outlet OP3. When the cooling fluid CF1 flows through the gradually shrinking section CD1, the fluid velocity increases significantly, while the temperature and pressure both decrease significantly. Then, when the cooling fluid CF1 flows through the neck section CD2, the fluid velocity rises slightly, while the temperature and pressure decrease slightly. Finally, when the cooling fluid CF1 enters the gradually expanding section CD3, the fluid velocity rises rapidly again, while the temperature and pressure both decrease rapidly. Therefore, Figure 11 the embodiment shown can further cool the cooling fluid CF1. It should be specifically noted that the fluid channel 104 and the jet channel 131 mentioned in the above embodiments can also adopt the configuration of the gradually shrinking section CD1, the neck section CD2 and the gradually expanding section CD3.
[0068] In some embodiments, when the cooling fluid CF1 forms a jet flow toward the wafer slot 103 via the gradually expanding opening OP1, the gradually expanding nozzle OP2, and the gradually expanding outlet OP3, the temperature of the jet flow formed by the cooling fluid CF1 is lower than the initial temperature of the cooling fluid CF1. Please refer to Table 1, which is the actual experimental data showing the temperature of the jet flow formed by the cooling fluid CF1 under different fluid pressures. As shown in Table 1, the initial temperature of the cooling fluid CF1 is 20°C. Among them, when the fluid pressure provided by the fluid supply device 102 is 0.62 MPa, the temperature of the jet flow formed by the cooling fluid CF1 is 10.1°C. That is to say, when the cooling fluid CF1 flows through the gradually expanding opening OP1 or the gradually expanding nozzle OP2, it can be reduced by about 10°C. When the fluid pressure provided by the fluid supply device 102 is 0.75 MPa, the temperature of the jet flow formed by the cooling fluid CF1 is further reduced to 8.2°C. Therefore, the greater the fluid pressure provided by the fluid supply device 102, the lower the temperature of the cooling fluid CF1 flowing through the gradually expanding opening OP1 or the gradually expanding nozzle OP2.
[0069] [Table 1]
[0070]
[0071] In another computer simulation, the simulation conditions include: the initial temperature of the cooling fluid CF1 is 20°C, and the thermal design power (TDP) of the wafer under test 200 is 8 W; when providing the cooling fluid CF1 with a mass flow rate of 0.0092 kg / s to Figure 11 the top flow channel 141 shown, the fluid temperature at the gradually expanding outlet OP3 can reach 3.83°C, and the temperature of the wafer under test 200 after cooling is 32.18°C. In contrast, in the case where the gradually contracting section CD1, the neck section CD2, and the gradually expanding section CD3 are not provided, the fluid temperature will reach 32.13°C, and the temperature of the wafer under test 200 will reach 61.44°C.
[0072] In some embodiments, the cooling fluid CF1 can be air, or can be, for example but not limited to, nitrogen, oxygen, or argon. In other embodiments, the cooling fluid CF1 can be a liquid having both a high thermal conductivity coefficient and insulating properties, such as but not limited to electronic coolant, deionized water, ethylene glycol, propylene glycol, or liquid coolant, or a gas-liquid two-phase mixed fluid. It should be noted that in some embodiments, "low temperature" represents a temperature lower than room temperature or even lower, where room temperature is, for example but not limited to, 25 degrees Celsius.
[0073] In some embodiments, the controller 110 may be a hardware component with control functions, such as but not limited to a central processing unit (CPU), a microprocessor, a digital signal processor (DSP), a complex programmable logic device (CPLD), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or a microcontroller unit (MCU). In addition, the controller 110 can also be any single or multiple processor computing devices or systems capable of executing computer-readable instructions, examples including but not limited to: workstations, laptops, client terminals, servers, distributed computing systems, handheld devices, or any other computing system or device. In its most basic configuration, the controller 110 may include at least one processor and system memory.
[0074] Although the present case has been disclosed as above by way of embodiments, it is not intended to limit the creation of the present case. Any person having ordinary knowledge in the technical field to which the present disclosure pertains may make some modifications and changes without departing from the spirit and scope of the present disclosure content. However, such modifications and changes are still within the scope of the patent application of the present case.
Claims
1. A wafer cooling module, characterized in that, Comprising: A test socket, comprising a wafer slot and at least one fluid channel, the wafer slot being used for accommodating a wafer to be tested; and A fluid supply device, communicating with the at least one fluid channel of the test socket; Wherein, the at least one fluid channel comprises a gradually expanding opening, and the gradually expanding opening is arranged on a side wall of the test socket and faces the wafer slot; In response to the fluid supply device supplying a cooling fluid to the at least one fluid channel, the cooling fluid forms a jet flow towards the wafer slot through the gradually expanding opening.
2. The wafer cooling module according to claim 1, wherein Wherein in response to the wafer to be tested being accommodated in the wafer slot, a fluid containing space is formed between the lower surface of the wafer to be tested and the wafer slot; In response to the fluid supply device supplying the cooling fluid to the at least one fluid channel, the cooling fluid forms a jet flow towards the fluid containing space through the gradually expanding opening.
3. The wafer cooling module according to claim 1, wherein, Wherein the test socket further comprises at least one fluid discharge channel, wherein the at least one fluid discharge channel is arranged on another side wall of the wafer slot, one end of the at least one fluid discharge channel communicates with the wafer slot, and the other end of the at least one fluid discharge channel communicates with the external atmosphere; The side wall and the other side wall are respectively located on two corresponding sides of the wafer slot.
4. The wafer cooling module according to claim 1, wherein, Further comprising a test socket plate, wherein the test socket plate is arranged on the test socket; The test socket plate comprises at least one jet flow channel, one end of the at least one jet flow channel communicates with the fluid supply device, and the other end of the at least one jet flow channel communicates with the wafer slot of the test socket; The at least one jet flow channel comprises a gradually expanding nozzle, and the gradually expanding nozzle is arranged on the side wall of the test socket and faces the wafer slot; In response to the fluid supply device supplying the cooling fluid to the at least one jet flow channel, the cooling fluid forms a jet flow into the wafer slot through the gradually expanding nozzle.
5. A wafer testing device, characterized in that, Comprising: A test socket, comprising a wafer slot and at least one fluid channel, the wafer slot being used for accommodating a wafer to be tested, the at least one fluid channel comprises a gradually expanding opening, and the gradually expanding opening is arranged on a side wall of the test socket and faces the wafer slot; A fluid supply device, communicating with the at least one fluid channel of the test socket; And A controller, electrically connected to the test socket and the fluid supply device; Wherein, the controller is used to control the fluid supply device to supply a cooling fluid to the at least one fluid channel, so that the cooling fluid forms a jet flow into the wafer slot through the gradually expanding opening, and the controller is used to control the test socket to test the wafer to be tested.
6. The wafer testing device according to claim 5, characterized in that, Wherein in response to the wafer to be tested being accommodated in the wafer slot, a fluid containing space is formed between the lower surface of the wafer to be tested and the wafer slot; In response to the fluid supply device supplying the cooling fluid to the at least one fluid channel, the cooling fluid forms a jet flow towards the fluid containing space through the gradually expanding opening.
7. The wafer testing device according to claim 6, wherein, Wherein the test socket further comprises at least one fluid discharge channel, wherein the at least one fluid discharge channel is arranged on another side wall of the wafer slot, one end of the at least one fluid discharge channel communicates with the wafer slot, and the other end of the at least one fluid discharge channel communicates with the external atmosphere; The side wall and the other side wall are respectively located on two corresponding sides of the wafer slot.
8. The wafer testing device according to claim 5, characterized in that, Further comprising a test seat plate disposed on the test seat; The test seat plate includes at least one jet channel, one end of the at least one jet channel communicating with the fluid supply device, and the other end of the at least one jet channel communicating with the wafer slot of the test seat, wherein the at least one jet channel includes a gradually expanding nozzle; The controller is further configured to control the fluid supply device to supply the cooling fluid to the at least one jet channel, such that the cooling fluid forms a jet toward the wafer slot through the gradually expanding nozzle.
9. The wafer testing device according to claim 8, characterized in that, Further comprising a probing head corresponding to the wafer slot of the test seat and electrically connected to the controller, and the controller is further configured to control the probing head to approach the wafer slot to press against the wafer under test or control the probing head to move away from the wafer slot; Wherein, the probing head includes an outlet channel and a pressing surface, the pressing surface includes a guiding groove communicating with the gradually expanding nozzle of the test seat, wherein one end of the outlet channel communicates with the guiding groove, and the other end of the outlet channel communicates with the external atmosphere.
10. The wafer testing device according to claim 5, wherein, Further comprising a probing head corresponding to the wafer slot of the test seat and electrically connected to the controller, and the controller is further configured to control the probing head to approach the wafer slot to press against the wafer under test or control the probing head to move away from the wafer slot; Wherein, the probing head includes at least one top channel communicating with the fluid supply device, the at least one top channel includes a gradually expanding outlet, and the gradually expanding outlet faces the wafer slot; The controller is further configured to control the fluid supply device to supply the cooling fluid to the at least one top channel, such that the cooling fluid forms a jet toward the wafer slot through the gradually expanding outlet.