Wafer aging test system and wafer aging test method

Abstract

The invention discloses a wafer aging test system and a wafer aging test method. The wafer aging test system comprises wafer transportation equipment; the wafer loading and unloading equipment is arranged on one side of the wafer transportation equipment; the wafer aging test equipment comprises at least one wafer aging test device, and the at least one wafer aging test device is arranged on at least one side of the wafer transportation equipment; any one wafer aging test device is opposite to the wafer transportation equipment to form a first transportation channel; the wafer conveying device comprises a wafer taking and placing device, a second conveying channel is formed in the wafer conveying device, any first conveying channel is communicated with the second conveying channel, and the wafer taking and placing device bears wafers and is controlled to move in the second conveying channel or any first conveying channel so as to achieve feeding or discharging of the wafers. According to the embodiment of the invention, parallel testing of a plurality of test positions can be expanded, the testing efficiency is improved, and the flexibility and rationality of equipment layout are improved at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and particularly relates to a wafer aging test system and a wafer aging test method. Background Art

[0002] In the semiconductor wafer testing process, wafers are usually loaded and unloaded and transported between a loading and unloading device and a testing device by a transportation device. Limited by transportation conditions and size limitations such as space, conventional equipment layouts usually have problems such as a loading and unloading device, a single transportation device, a single testing device, and limited testing positions, resulting in low testing efficiency. Summary of the Invention

[0003] In view of the above problems of the prior art, the present invention discloses a wafer aging test system and a wafer aging test method, which can expand multiple testing positions for parallel testing, improve testing efficiency, and at the same time enhance the flexibility and rationality of the equipment layout. The technical solutions disclosed by the present invention are as follows:

[0004] According to one aspect of the embodiments disclosed by the present invention, a wafer aging test system is provided, and the wafer aging test system includes:

[0005] A wafer transportation device;

[0006] A wafer loading and unloading device, arranged on one side of the wafer transportation device;

[0007] A wafer aging test device, the wafer aging test device includes at least one wafer aging test unit, and at least one of the wafer aging test units is arranged on at least one side of the wafer transportation device; any one of the wafer aging test units forms a first transportation channel with the wafer transportation device;

[0008] The wafer transportation device includes a wafer pick-and-place device, a second transportation channel is formed inside the wafer transportation device, and any one of the first transportation channels is communicated with the second transportation channel. The wafer pick-and-place device carries the wafer and is controlled to move in the second transportation channel or any one of the first transportation channels to realize wafer loading or unloading.

[0009] Optionally, the wafer aging test system includes at least two of the wafer aging test devices, the wafer transportation device includes at least two sequentially connected wafer transportation boxes, the wafer loading and unloading device is arranged on one side of the at least two wafer transportation boxes, and at least two of the wafer aging test units are arranged on at least one side of the at least two wafer transportation boxes; the first transportation channels corresponding to the wafer aging test units on the same layer in two adjacent wafer aging test devices are communicated.

[0010] Optionally, along the extending direction of the first transport channel, the wafer loading and unloading device and at least two of the wafer aging test devices are sequentially arranged on the same side of at least two of the wafer transport boxes.

[0011] Optionally, along the extending direction of the first transport channel, at least two of the wafer aging test devices are sequentially arranged on the other side of at least two of the wafer transport boxes; the wafer picking and placing device is further configured to rotate between the two sides of at least two of the wafer transport boxes.

[0012] Optionally, at least two of the wafer aging test devices are respectively arranged on the two sides of at least two of the wafer transport boxes. Along the extending direction of the first transport channel, the wafer loading and unloading device and at least one of the wafer aging test devices are sequentially arranged on one side of at least two of the wafer transport boxes; the wafer picking and placing device is further configured to rotate between the two sides of at least two of the wafer transport boxes.

[0013] Optionally, the wafer transport device further includes a first lifting mechanism and a moving mechanism. The first lifting mechanism is slidably connected to the moving mechanism, and the wafer picking and placing device is slidably connected to the first lifting mechanism. The wafer transport device corresponds to one wafer picking and placing device and one first lifting mechanism;

[0014] The wafer picking and placing device is controlled to slide on the first lifting mechanism along the second transport channel, and the first lifting mechanism is controlled to slide on the moving mechanism along the first transport channel.

[0015] Optionally, any one of the wafer aging test devices extends into the wafer transport device. The wafer aging test device includes a heat sink assembly, an alignment mechanism, and a mounting bracket. The mounting bracket extends into the wafer transport device. The heat sink assembly is arranged on the alignment mechanism. The alignment mechanism moves into the wafer transport device along the mounting bracket. The first transport channel is formed above the heat sink assembly to realize wafer loading or unloading between the wafer picking and placing device and the wafer aging test device;

[0016] The first transport channel is arranged horizontally, and the second transport channel is arranged vertically. The wafer picking and placing device is controlled to move horizontally in any one of the first transport channels and vertically in the second transport channel.

[0017] Optionally, the wafer picking and placing device includes a wafer loading device and a wafer unloading device arranged side by side. The wafer loading device includes a first bracket, and the wafer unloading device includes a second bracket. Adsorption mechanisms are respectively arranged on the first bracket and the second bracket;

[0018] The first support is connected to the corresponding adsorption mechanism through a second lifting mechanism, and the second lifting mechanism is used to drive the corresponding adsorption mechanism to move along the first support to complete the wafer loading operation; the second support is connected to the corresponding adsorption mechanism through a third lifting mechanism, and the third lifting mechanism is used to drive the corresponding adsorption mechanism to move along the second support to complete the wafer unloading operation.

[0019] Optionally, the adsorption mechanism includes:

[0020] A third support, in a ring shape;

[0021] A plurality of suction members, arranged at intervals along the circumferential direction of the third support and connected to the third support, and the plurality of suction members are configured to simultaneously provide an adsorption force to the bottom of the wafer so that the wafer adheres to the heat sink;

[0022] A plurality of clamping members, arranged at intervals along the circumferential direction of the third support and connected to the third support, and the plurality of clamping members are configured to simultaneously and controllably clamp the heat sink carrying the wafer.

[0023] Optionally, the third support includes a concentric first ring-shaped support and a second ring-shaped support, and the second ring-shaped support rotates relative to the first ring-shaped support with the center of the circle as the axis; the plurality of suction members and the plurality of clamping members are arranged on the second ring-shaped support.

[0024] Optionally, the wafer pick-and-place device is connected to the first lifting mechanism through a correction mechanism, and the correction mechanism includes a first connection component and a second connection component. The first connection component is used to correct the inclination degree of the wafer pick-and-place device in the first direction, and the second connection component is used to correct the inclination degree of the wafer pick-and-place device in the second direction. The first direction and the second direction are horizontal directions perpendicular to each other.

[0025] Optionally, the wafer transportation box body includes a first fixing member and a moving mechanism. The moving mechanism extends in the horizontal direction, and the moving mechanisms between adjacent two wafer transportation box bodies are connected to each other. The moving mechanism is arranged on the first fixing member, and a leveling component is arranged on each first fixing member;

[0026] The moving mechanism is used to move the wafer pick-and-place device along the horizontal direction, and the leveling component is used to level the first fixing member so that the moving mechanisms between adjacent two wafer transportation box bodies are aligned.

[0027] Optionally, the leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly. The moving mechanism is disposed on one side of the first fixing member. The first horizontal leveling assembly and the second horizontal leveling assembly are disposed on the other side of the first fixing member. The vertical leveling assembly is disposed at the bottom of the first fixing member.

[0028] The first horizontal leveling assembly is configured to level the first fixing member along the extending direction of the moving mechanism.

[0029] The second horizontal leveling assembly is configured to level the first fixing member in a direction perpendicular to the side surface of the first fixing member.

[0030] The vertical leveling assembly is configured to level the first fixing member in a direction parallel to the side surface of the first fixing member.

[0031] Optionally, the wafer transport device further includes a first connection structure, a second connection structure, and a housing. The first fixing member, the moving mechanism, and the wafer pick-and-place device are all disposed in the housing. The first connection structure spans the first fixing members of two adjacent wafer transport boxes to connect them. The housings of two adjacent wafer transport boxes are connected by the second connection structure.

[0032] According to another aspect of the disclosed embodiments of the present invention, there is provided a wafer aging test method based on the above wafer aging test system. The method includes:

[0033] The wafer loading and unloading device provides a wafer to be tested.

[0034] The wafer pick-and-place device picks up the wafer to be tested, is controlled to move in the second transport channel and the first transport channel corresponding to the target wafer aging test device to the target wafer aging test device, and performs unloading of the tested wafer and loading of the wafer to be tested in the target wafer aging test device. The target wafer aging test device is any wafer aging test device of the wafer aging test equipment.

[0035] The wafer pick-and-place device is controlled to move in the first transport channel corresponding to the target wafer aging test device and the second transport channel to the wafer loading and unloading device, and performs unloading of the tested wafer.

[0036] Optionally, the wafer pick-and-place device includes a wafer loading device and a wafer unloading device arranged side by side.

[0037] The wafer pick - and - place device picks up the wafer to be tested, and is controlled to move in the second transportation channel and the first transportation channel corresponding to the target wafer aging test device to the target wafer aging test device, and the discharging of the wafer that has completed the test in the target wafer aging test device and the loading of the wafer to be tested include:

[0038] The wafer loading device picks up the wafer to be tested, and the wafer loading device and the wafer unloading device are controlled to move in the second transportation channel and the first transportation channel corresponding to the target wafer aging test device to the target wafer aging test device;

[0039] The wafer unloading device discharges the wafer that has completed the test in the target wafer aging test device;

[0040] The wafer loading device loads the wafer to be tested.

[0041] Optionally, the discharging of the wafer that has completed the test by the wafer pick - and - place device includes:

[0042] The wafer unloading device discharges the wafer that has completed the test.

[0043] The technical solutions provided by the disclosed embodiments of the present invention at least bring the following beneficial effects:

[0044] The wafer aging test system and the wafer aging test method provided by the present invention. The wafer aging test system includes: a wafer transportation device; a wafer loading and unloading device disposed on one side of the wafer transportation device; a wafer aging test device, and the wafer aging test device includes at least one wafer aging test unit, and at least one wafer aging test unit is disposed on at least one side of the wafer transportation device, so that multiple test positions can be expanded for parallel testing, improving the test efficiency, and at the same time enhancing the flexibility and rationality of the device layout; any wafer aging test unit and the wafer transportation device form a first transportation channel relatively, the wafer transportation device includes a wafer pick - and - place device, a second transportation channel is formed in the wafer transportation device, and any first transportation channel is communicated with the second transportation channel, and the wafer pick - and - place device carries the wafer and is controlled to move in the second transportation channel or any first transportation channel to realize the loading or unloading of the wafer.

[0045] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the disclosure of the present invention, and are used together with the specification to explain the principles of the present disclosure, and do not constitute an improper limitation to the disclosure of the present invention.

[0047] Figure 1 It is a schematic structural diagram of a wafer aging test system provided by an embodiment of the present application;

[0048] Figure 2 It is a schematic structural diagram of a wafer transportation device provided by an embodiment of the present application;

[0049] Figure 3 It is a side cross-sectional view of a wafer transportation device and a wafer aging test device provided by an embodiment of the present application;

[0050] Figure 4 It is a top view of a wafer transportation device and a wafer aging test device provided by an embodiment of the present application;

[0051] Figure 5 It is a perspective schematic diagram of a second transportation channel and a first transportation channel provided by an embodiment of the present application;

[0052] Figure 6 It is a schematic structural diagram of another wafer aging test system provided by an embodiment of the present application;

[0053] Figure 7 It is a schematic structural diagram of another wafer aging test system provided by an embodiment of the present application;

[0054] Figure 8 It is a schematic structural diagram of a wafer aging test device provided by an embodiment of the present application;

[0055] Figure 9 It is a schematic structural diagram of a wafer pick-and-place device provided by an embodiment of the present application;

[0056] Figure 10 It is a top view of a wafer pick-and-place device provided by an embodiment of the present application;

[0057] Figure 11 It is a schematic state diagram of a wafer pick-and-place device provided by an embodiment of the present application;

[0058] Figure 12 It is a schematic state diagram of another wafer pick-and-place device provided by an embodiment of the present application;

[0059] Figure 13 It is a schematic structural diagram of an adsorption mechanism provided by an embodiment of the present application;

[0060] Figure 14 It is a partial enlarged view of the adsorption mechanism provided by an embodiment of the present application;

[0061] Figure 15 It is a schematic structural diagram of a third bracket provided by an embodiment of the present application;

[0062] Figure 16Schematic diagram of a first guide member and a second guide member provided by an embodiment of the present application;

[0063] Figure 17 Schematic diagram of a wafer pick - and - place device provided by an embodiment of the present application moving horizontally in two adjacent wafer transport boxes;

[0064] Figure 18 Schematic diagram of a wafer pick - and - place device provided by an embodiment of the present application moving vertically;

[0065] Figure 19 Schematic diagram of the structure of a wafer pick - and - place device and a correction mechanism provided by an embodiment of the present application;

[0066] Figure 20 Schematic diagram of the structure of a correction mechanism provided by an embodiment of the present application;

[0067] Figure 21 Schematic diagram of the structure of another wafer pick - and - place device and a correction mechanism provided by an embodiment of the present application;

[0068] Figure 22 Schematic diagram of a second connection structure provided by an embodiment of the present application;

[0069] Figure 23 Schematic diagram of a leveling component provided by an embodiment of the present application;

[0070] Figure 24 Enlarged schematic diagram of a leveling component provided by an embodiment of the present application;

[0071] Among them, the corresponding reference numerals in the figure are: 1 - wafer transportation device; 10 - wafer transportation box; 11 - first fixing member; 12 - second fixing member; 13 - third fixing member; 14 - moving mechanism; 141 - first guiding member; 151 - wafer pick - and - place device; 152 - first lifting mechanism; 153 - second guiding member; 16 - first transportation channel; 17 - second transportation channel; 110 - wafer loading device; 111 - first bracket; 112 - second lifting mechanism; 120 - wafer unloading device; 121 - second bracket; 122 - third lifting mechanism; 200 - adsorption mechanism; 210 - third bracket; 211 - first annular bracket; 212 - second annular bracket; 220 - adsorbing member; 230 - clamping member; 240 - sliding assembly; 250 - driving member; 260 - limiting assembly; 261 - first sensor; 262 - first limiting portion; 263 - second sensor; 264 - second limiting portion; 300 - heat sink; 500 - correction mechanism; 510 - first connection assembly; 511 - first connecting member; 512 - second connecting member; 513 - first pin; 520 - second connection assembly; 521 - third connecting member; 522 - fourth connecting member; 523 - second pin; 16 - leveling assembly; 161 - first horizontal leveling assembly; 162 - second horizontal leveling assembly; 163 - vertical leveling assembly; 164 - first leveling member; 165 - second leveling member; 17 - first connection structure; 18 - second connection structure; 181 - first sub - connection structure; 182 - second sub - connection structure; 2 - wafer loading and unloading device; 3 - wafer aging test device; 31 - wafer aging test device; 32 - mounting bracket; 33 - heat sink assembly; 34 - alignment mechanism. Detailed implementation manners

[0072] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0073] It should be noted that in the description of the specification and claims of the embodiments of the present application and the above-mentioned drawings, the orientation or positional relationship indicated by terms such as "upper", "lower", "top", "bottom", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. Terms such as "first", "second", etc. are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here. In addition, in the description of this embodiment, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system or product that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0074] In order to make the purpose, technical solution and advantages of the embodiments of the present application more clear and understandable, the following further details the embodiments of the present application in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the embodiments of the present application and are not used to limit the embodiments of the present application.

[0075] The following combines the attached Figures 1 - 24 to introduce the technical solutions in the embodiments of the present application.

[0076] Please refer to Figures 1 - 5 , a wafer aging test system provided by an embodiment of the present application, the wafer aging test system includes a wafer transportation device 1; a wafer loading and unloading device 2 is arranged on one side of the wafer transportation device 1; a wafer aging test device 3, the wafer aging test device 3 includes at least one wafer aging test device 31, and at least one wafer aging test device 31 is arranged on at least one side of the wafer transportation device 1; any wafer aging test device 31 and the wafer transportation device 1 form a first transportation channel 16 relatively; the wafer transportation device 1 includes a wafer picking and placing device 151, a second transportation channel 17 is formed in the wafer transportation device 1, and any first transportation channel 16 is communicated with the second transportation channel 17, and the wafer picking and placing device 151 carries the wafer and is controlled to move in the second transportation channel 17 or any first transportation channel 16 to realize the loading or unloading of the wafer.

[0077] In a specific embodiment, the wafer loading and unloading device 2 is used to pick up the wafers to be tested from a wafer cassette and transfer them to a preset position in the wafer transportation device 1, so that the wafer pick-and-place device 151 picks up the wafers to be tested from this preset position, and retrieves the wafers that have completed testing and placed by the wafer pick-and-place device 151 at this preset position and puts them into the wafer cassette. The wafer aging test device 3 can be a device for aging testing wafers. The wafer pick-and-place device 151 can be used to carry wafers or heat sinks carrying wafers.

[0078] In a specific embodiment, the number of each device in the wafer aging test system can be set accordingly according to actual application requirements. As Figure 1 As shown by the structure on the right side of the dashed line, the wafer aging test system can include a wafer loading and unloading device 2, a wafer transportation device 1, and a wafer aging test device 3. In actual applications, in order to improve the wafer testing efficiency, multiple wafer aging test devices 31 of the wafer aging test device 3 can be expanded to form multiple test positions for parallel testing to improve the testing efficiency. Optionally, multiple wafer aging test devices 31 can be stacked to form multiple test positions in multiple layers, with each layer corresponding to a first transportation channel.

[0079] Optionally, the wafer aging test system includes at least two wafer aging test devices 3, the wafer transportation device 1 includes at least two sequentially connected wafer transportation boxes 10, the wafer loading and unloading device 2 is arranged on one side of at least two wafer transportation boxes 10, and at least two wafer aging test devices 31 are arranged on at least one side of at least two wafer transportation boxes 10; the first transportation channels 16 corresponding to the wafer aging test devices 31 on the same layer in two adjacent wafer aging test devices 3 are connected.

[0080] In actual applications, multiple wafer transportation boxes 10 can be sequentially connected to correspond to multiple wafer aging test devices 3 to achieve long-distance handling of wafers, and further enable multiple wafer aging test devices 31 in multiple wafer aging test devices 3 to perform wafer aging tests synchronously. Optionally, the wafer loading and unloading device 2 is arranged on one side of at least two wafer transportation boxes 10, and at least two wafer aging test devices 3 are arranged on at least one side of at least two wafer transportation boxes 10, so that the wafer aging test device 3 can be flexibly expanded according to actual application requirements, with strong applicability.

[0081] In a specific embodiment, the wafer pick - and - place device 151 is used to move along the first transportation channel 16 and the second transportation channel 17 among at least two wafer transportation boxes 10, so as to pick up the wafers to be tested from the wafer loading and unloading equipment 2, pick up the wafers with the test completed from any one of the wafer aging test devices 31, and transport and place the wafers to be tested on each wafer aging test device 31 for the next round of testing. Furthermore, the wafers with the test completed are transported to the wafer loading and unloading equipment 2 and then recycled and stored in the wafer cassette. The number of the first transportation channels 16 is the same as the number of layers of the wafer aging test devices 31 in the wafer aging test equipment 3. Along one first transportation channel 16, the wafer pick - and - place device 151 can move to the wafer aging test devices 31 on the same layer of the corresponding multiple wafer aging test equipment 3.

[0082] Optionally, the area in the wafer aging test equipment 3 corresponding to the space between two adjacent wafer aging test equipment 3 can also form the second transportation channel 17, so as to expand the moving path of the wafer pick - and - place device 151 and facilitate wafer handling. The space between two adjacent wafer aging test equipment 3 can also be used as a maintenance channel to facilitate the maintenance of the wafer aging test equipment 3.

[0083] In some embodiments, as Figure 1 shown, along the channel direction, along the extending direction of the first transportation channel 16, the wafer loading and unloading equipment 2 and at least two wafer aging test devices 31 are arranged in sequence on the same side of at least two wafer transportation boxes 10.

[0084] Specifically, the wafer pick - and - place device 151 is used to move in the second transportation channel 17 and the first transportation channel 16 to realize the transfer and handling of the wafers to be tested and the wafers with the test completed.

[0085] In some embodiments, as Figure 6 shown, along the extending direction of the first transportation channel 16, at least two wafer aging test devices 31 are arranged in sequence on the other side of at least two wafer transportation boxes 10; the wafer pick - and - place device 151 is also used to rotate between the two sides of at least two wafer transportation boxes 10.

[0086] Specifically, the wafer loading and unloading equipment 2 and the wafer aging test equipment 3 are respectively arranged on the two sides of the wafer transportation box 10. On the basis of the movement of the wafer pick - and - place device 151 in the second transportation channel 17 and the first transportation channel 16, the wafer pick - and - place device 151 also rotates between the two sides of the wafer transportation box 10 to realize the loading and unloading and handling of the wafers to be tested and the wafers with the test completed between the wafer loading and unloading equipment 2 and each wafer aging test device 31.

[0087] In some embodiments, as Figure 7As shown, at least two wafer aging test devices 31 are respectively arranged on both sides of at least two wafer transport boxes 10. Along the extending direction of the first transport channel 16, the wafer loading and unloading device 2 and at least one wafer aging test device 31 are sequentially arranged on one side of at least two wafer transport boxes 10; the wafer pick-and-place device 151 is also used to rotate between both sides of at least two wafer transport boxes 10.

[0088] Specifically, multiple wafer aging test devices 3 are respectively arranged on both sides of the wafer transport box 10. The wafer loading and unloading device 2 is arranged on any one side of the wafer transport box 10. The devices arranged on both sides of the wafer transport device 1 are sequentially arranged at intervals. On the basis of moving in the second transport channel 17 and the first transport channel 16, the wafer pick-and-place device 151 also rotates between both sides of at least two wafer transport boxes 10 to realize the loading and unloading and handling of the wafers to be tested and the wafers with the testing completed between the wafer loading and unloading device 2 and other wafer aging test devices 3, where other wafer aging test devices 3 are the wafer aging test devices 3 among at least two wafer aging test devices 3 except for at least one wafer aging test device 3.

[0089] In a specific embodiment, as Figures 3 - 5 and Figure 8 shown, any one wafer aging test device 31 extends into the wafer transport device 1. The wafer aging test device 31 includes a heat sink assembly 33, an alignment mechanism 34, and a mounting bracket 32. The mounting bracket 32 extends into the wafer transport device 1. The heat sink assembly 33 is arranged on the alignment mechanism 34. The alignment mechanism 34 moves along the mounting bracket 32 into the wafer transport device 1. A first transport channel 16 is formed above the heat sink assembly 33 to realize the wafer loading or unloading between the wafer pick-and-place device 151 and the wafer aging test device 31; the first transport channel 16 is arranged horizontally, and the second transport channel 17 is arranged vertically. The wafer pick-and-place device 151 is controlled to move horizontally in any one of the first transport channels 16 and move vertically in the second transport channel 17.

[0090] In a specific embodiment, during the process of each wafer aging test device 31 testing a wafer, the heat sink assembly 33 and the alignment mechanism 34 are located inside each wafer aging test device 31. After the test is completed, the heat sink assembly 33 moves from each wafer aging test device 31 to the wafer transportation device 1 along with the alignment mechanism 34. The above-mentioned first transportation channel 16 is formed above the heat sink assembly 33. The wafer pick-and-place device 151 moves in the first transportation channel 16 to the wafer aging test device 31 to pick up the tested wafer (or the heat sink carrying the tested wafer), and places the wafer to be tested (or the heat sink carrying the wafer to be tested) on the wafer aging test device 31. The heat sink assembly 33 moves into the wafer aging test device 31 along with the alignment mechanism 34, so that the wafer aging test device 31 performs the next round of testing on the wafer placed thereon, realizing the loading or unloading of the wafer between the wafer pick-and-place device 151 and the wafer aging test device 31, thereby avoiding interference with the platform of each wafer aging test device 31 extending into the wafer transportation device 1 during the wafer transportation process.

[0091] In practical applications, the wafer pick-and-place device 151 picks up the wafer to be tested from the wafer loading / unloading device 2, vertically moves in the wafer transportation device 1 along the second transportation channel 17 to the connection point of the first transportation channel 16 corresponding to the target wafer aging test device 31, and then horizontally moves along the first transportation channel 16 to the target wafer aging test device 31. First, it picks up the wafer that has been tested by the target wafer aging test device 31 (i.e., wafer unloading), and then places the wafer to be tested on the target wafer aging test device 31 (i.e., wafer loading) for testing. During the process of the target wafer aging test device 31 testing the wafer to be tested, the wafer pick-and-place device 151 moves along the above-mentioned first transportation channel 16 to the connection point with the second transportation channel 17, and moves along the second transportation channel 17 to the wafer loading / unloading device 2, and places the tested wafer on the wafer loading / unloading device 2, so that the wafer loading / unloading device 2 puts the tested wafer into the wafer cassette for storage. Among them, the target wafer aging test device 31 can be any wafer aging test device 31 in the multiple wafer aging test devices 3.

[0092] Optionally, as Figures 9 - 10As shown in the figure, the wafer loading and unloading device 151 includes a wafer loading device 110 and a wafer unloading device 120 arranged side by side. The wafer loading device 110 includes a first bracket 111, and the wafer unloading device 120 includes a second bracket 121. Adsorption mechanisms 200 are respectively provided on the first bracket 111 and the second bracket 121. The first bracket 111 is connected to the corresponding adsorption mechanism 200 through a second lifting mechanism 112. The second lifting mechanism 112 is used to drive the corresponding adsorption mechanism 200 to move along the first bracket 111 to complete the wafer loading action (i.e., pick up the corresponding wafer). The second bracket 121 is connected to the corresponding adsorption mechanism 200 through a third lifting mechanism 122. The third lifting mechanism 122 is used to drive the corresponding adsorption mechanism 200 to move along the second bracket 121 to complete the wafer unloading action (i.e., place the corresponding wafer).

[0093] Specifically, the first bracket 111 serves as the main frame of the wafer loading device 110, playing a role in supporting and fixing other components. It is usually a rigid structure to ensure stable support during the wafer loading process. The second lifting mechanism 112 is connected to the first bracket 111 and is responsible for driving the adsorption mechanism 200 to lift along the first bracket 111. Its internal structure can adopt methods such as screw drive and cylinder drive to achieve precise height adjustment to meet the wafer loading requirements at different positions and complete the wafer loading action. The second bracket 121 is arranged side by side with the first bracket 111, constituting the main frame of the wafer unloading device 120, and also having good rigidity and stability to provide support for the adsorption mechanism 200 during the unloading process. The third lifting mechanism 122 is connected between the second bracket 121 and the adsorption mechanism 200. Similar to the second lifting mechanism 112, through a specific transmission mechanism, it drives the adsorption mechanism 200 to lift along the second bracket 121 and performs the wafer unloading action to take out the wafers that have completed the test from the test cavity. In this embodiment, the second lifting mechanism 112 is arranged on both sides of the adsorption mechanism 200 corresponding to the wafer loading device 110, and the third lifting mechanism 122 is arranged on both sides of the adsorption mechanism 200 corresponding to the wafer unloading device 120. In other embodiments, the installation positions and quantities of the second lifting mechanism 112 and the third lifting mechanism 122 can also be set according to actual requirements.

[0094] Specifically, the wafer pick-and-place device 151 is used to travel back and forth between the test position of the wafer aging test equipment 3 and the wafer loading and unloading equipment 2 for placing the heat sink 300 carrying the wafer. When the wafer pick-and-place device 151 is located at the test position of the wafer aging test equipment 3, the heat sink 300 carrying the tested wafer is taken from the wafer aging test device 31 of the wafer aging test equipment 3, and then the heat sink 300 carrying the wafer to be tested is placed on the wafer aging test device 31 of the wafer aging test equipment 3. When the wafer pick-and-place device 151 is located at the wafer loading and unloading equipment 2, the heat sink 300 carrying the tested wafer is placed at the wafer loading and unloading equipment 2, the heat sink 300 carrying the wafer to be tested is taken from the wafer loading and unloading equipment 2, and then goes to the test position to prepare for the next round of testing. Specifically, when the wafer pick-and-place device 151 is located at the wafer loading and unloading equipment 2, the wafer unloading device 120 places the heat sink 300 carrying the tested wafer at the wafer loading and unloading equipment 2, and the wafer loading device 110 takes the heat sink carrying the wafer to be tested from the wafer loading and unloading equipment 2 to the test position to prepare for the next round of testing.

[0095] Specifically, when the wafer pick-and-place device 151 is located at the test position of the wafer aging test equipment 3, the second lifting mechanism 112 and the third lifting mechanism 122 alternately lift and lower, as Figure 11 shown, the third lifting mechanism 122 first drives the corresponding adsorption mechanism 200 to descend, so that the adsorption mechanism 200 of the wafer unloading device 120 performs the wafer unloading action. After the wafer unloading is completed, the third lifting mechanism 122 drives the adsorption mechanism 200 to reset, as Figure 12 shown, the second lifting mechanism 112 drives the corresponding adsorption mechanism 200 to descend, so that the adsorption mechanism 200 of the wafer loading device 110 performs the wafer loading action. After the wafer loading is completed, the second lifting mechanism 112 drives the adsorption mechanism 200 to reset. When the wafer pick-and-place device 151 is located at the wafer loading and unloading equipment 2, the second lifting mechanism 112 and the third lifting mechanism 122 can alternately lift and lower or synchronously lift and lower, that is, there is no requirement for the sequence of the two actions of the wafer unloading device 120 placing the completed tested wafer at the wafer loading and unloading equipment 2 and the wafer loading device 110 taking the wafer to be tested from the wafer loading and unloading equipment 2. Usually, the wafer unloading device 120 can first place the completed tested wafer at the wafer loading and unloading equipment 2, and then the wafer loading device 110 takes out the wafer to be tested from the wafer loading and unloading equipment 2.

[0096] In the above embodiment, the wafer pick-and-place device 151 realizes the tight connection of the unloading and loading actions through the wafer loading device 110 and the wafer unloading device 120 arranged side by side, greatly saving the time required to pick the wafer from unloading to loading, effectively improving the efficiency of the entire production process, and reducing the production cost.

[0097] In a specific embodiment, as Figure 13 shown, the above-mentioned adsorption mechanism 200 includes a third bracket 210, a plurality of adsorbing members 220, and a plurality of clamping members 230. Among them, the third bracket 210 is annular; the plurality of adsorbing members 220 are arranged at intervals along the circumferential direction of the third bracket 210 and are connected to the third bracket 210. The plurality of adsorbing members 220 are configured to simultaneously provide an adsorption force to the bottom of the wafer, so that the wafer adheres to the heat sink 300; the plurality of clamping members 230 are arranged at intervals along the circumferential direction of the third bracket 210 and are connected to the third bracket 210. The plurality of clamping members 230 are configured to simultaneously and controllably clamp the heat sink 300 carrying the wafer and provide an adsorption force to the heat sink 300, so as to prevent the heat sink 300 carrying the wafer from falling off during the process of moving following the adsorption mechanism 200. Specifically, the plurality of adsorbing members 220 and the plurality of clamping members 230 are arranged staggeredly, so that the plurality of clamping members 230 and the plurality of adsorbing members 220 are evenly arranged on the third bracket 210.

[0098] Continuing to refer to Figure 13 , the adsorption mechanism 200 further includes a plurality of sliding components 240. Each sliding component 240 corresponds to a clamping member 230 and is used to slidably connect the clamping member 230 to the third bracket 210, so that the clamping member 230 controllably slides along the radial direction of the third bracket 210, thereby switching between a first position where it is clamped to the heat sink 300 and a second position where it is separated from the heat sink 300. Specifically, the plurality of sliding components 240 simultaneously drive the corresponding clamping members 230 to move towards the central position of the third bracket 210, so that the heat sink 300 can be supported simultaneously. At this time, the clamping member 230 is in the first position. When the plurality of sliding components 240 simultaneously drive the corresponding clamping members 230 to return to their original positions, that is, move away from the central position of the third bracket 210, the support for the heat sink 300 can be withdrawn. At this time, the clamping member 230 is in the second position.

[0099] In a specific embodiment, as Figure 14As shown, the adsorption mechanism 200 further includes a plurality of driving members 250. Each driving member 250 corresponds to a clamping member 230. The driving members 250 are arranged on the third bracket 210 and cooperate with the sliding components 240 corresponding to the respective clamping members 230 to simultaneously drive the clamping members 230 to switch between a first position and a second position under control. The driving member 250 is used to drive the corresponding sliding component 240 to drive the corresponding clamping member 230 to move. The driving member 250 is installed on the third bracket 210. Specifically, the driving member 250 is a cylinder. In other embodiments, other driving structures may also be selected for the driving member 250. In this embodiment, the number of driving members 250 is the same as the number of clamping members 230. In other embodiments, the number of driving members 250 may also be set according to specific design requirements. Exemplarily, a plurality of clamping members 230 correspond to one driving member 250. For example, every two clamping members 230 correspond to one driving member 250.

[0100] Specifically, referring to Figures 13 - 14 , the adsorption mechanism 200 further includes a plurality of limiting components 260. Each limiting component 260 corresponds to a clamping member 230 and is used to limit the movement of the clamping member 230 between the first position and the second position. Specifically, the limiting component 260 includes a first sensor 261, a first limiting portion 262, a second sensor 263, and a second limiting portion 264. The first sensor 261 and the second sensor 263 are installed on the third bracket 210. The first limiting portion 262 and the second limiting portion 264 are arranged on the upper sliding member 241 of the sliding component 240. The first sensor 261 cooperates with the first limiting portion 262 to detect whether the corresponding clamping member 230 is in the first position. The second sensor 263 cooperates with the second limiting portion 264 to detect whether the corresponding clamping member 230 is in the second position. When the first sensor 261 senses the first limiting portion 262, it indicates that the clamping member 230 has reached the first position. When the second sensor 263 senses the second limiting portion 264, it indicates that the clamping member 230 has reached the second position.

[0101] In the above embodiment, the bottom of the wafer is adsorbed by a plurality of adsorbing members 220, so that the wafer adheres to the heat sink 300, which can prevent the wafer from moving and falling off. In addition, the heat sink 300 carrying the wafer is simultaneously clamped by a plurality of clamping members 230, and the clamping members 230 can also provide an adsorption force and a supporting force for the heat sink 300, thereby avoiding the heat sink 300 from falling off during transportation and improving the stability of the movement of the heat sink 300. Not only the wafer is adsorbed, but also the heat sink 300 is adsorbed. Through double adsorption, the stability of the wafer and the heat sink 300 during transportation can be ensured, and the wafer and the heat sink 300 can be prevented from falling off the adsorption mechanism 200.

[0102] In some embodiments, such as Figure 15As shown in the figure, the third bracket 210 includes a concentric first annular bracket 211 and a second annular bracket 212. The second annular bracket 212 rotates relative to the first annular bracket 211 with the center of the circle as the axis. A plurality of suction members 220 and a plurality of clamping members 230 are arranged on the second annular bracket 212.

[0103] Specifically, the first annular bracket 211 serves as the basic bracket and is annular, providing a stable support framework for the entire adsorption mechanism 200. The second annular bracket 212 is also annular and is concentrically arranged with the first annular bracket 211. The second annular bracket 212 rotates relative to the first annular bracket 211 with the center of the circle as the axis. Optionally, the second annular bracket 212 and the first annular bracket 211 can be connected by a sliding connection. This sliding connection can be achieved by providing guiding structures such as sliding rails and sliding grooves on the first annular bracket 211, and at the same time providing matching sliders or other sliding components on the second annular bracket 212, so that the second annular bracket 212 can rotate circumferentially along the first annular bracket 211. A plurality of suction members 220 and a plurality of clamping members 230 are both installed on the second annular bracket 212. As the second annular bracket 212 rotates, the positions of the suction members 220 and the clamping members 230 can also be adjusted circumferentially accordingly, so that the positions of the respective clamping members 230 correspond to the corresponding notches on the heat sink 300, and the positions of the respective suction members 220 correspond to the corresponding air channels on the heat sink 300.

[0104] Specifically, the third bracket 210 is set as two concentric annular brackets inside and outside, and the second annular bracket 212 rotates relative to the first annular bracket 211 with the center of the circle as the axis, so as to realize the flexible adjustment of the adsorption mechanism 200 during operation. In actual wafer picking and placing operations, it may be necessary to optimize the positions of the suction members 220 and the clamping members 230 according to factors such as the size, shape, and specific installation position of the wafer. This sliding connection method allows the positions of the suction members 220 and the clamping members 230 to be better matched with the wafer and the heat sink 300 by only adjusting the position of the second annular bracket 212 without changing the relative positions of the entire adsorption mechanism 200 and other components, improving the accuracy and reliability of adsorption and clamping.

[0105] Specifically, as Figure 2 and Figure 16As shown, the wafer transport device 1 further includes a first lifting mechanism 152 and a moving mechanism 14. The first lifting mechanism 152 is slidably connected to the moving mechanism 14, and the wafer pickup and placement device 151 is slidably connected to the first lifting mechanism 152. The wafer transport device 1 corresponds to one wafer pickup and placement device 151 and one first lifting mechanism 152. The wafer pickup and placement device 151 is controlled to slide on the first lifting mechanism 152 along the second transport channel 17, and the first lifting mechanism 152 is controlled to slide on the moving mechanism 14 along the first transport channel 16. Specifically, a plurality of wafer transport boxes 10 correspond to one wafer pickup and placement device 151 and one first lifting mechanism 152.

[0106] In a specific embodiment, the moving mechanism 14 includes a first guiding member 141 and a first driving mechanism. The first guiding member 141 extends in the horizontal direction, and the first guiding members 141 between adjacent two wafer transport boxes 10 are connected to each other. The first driving mechanism is drivingly connected to the wafer pickup and placement device 151, and the wafer pickup and placement device 151 is slidably connected to the first guiding member 141. The first driving mechanism is used to drive the wafer pickup and placement device 151 to move horizontally along the first guiding member 141. Specifically, the first guiding member 141 can be a track, and the first driving mechanism can be a linear motor.

[0107] Specifically, a limiting member is provided on the first guiding member 141. Among a plurality of sequentially connected wafer transport boxes 10, the limiting member is provided at both ends of the overall connected first guiding member 141 to limit the maximum movable distance of the wafer pickup and placement device 151 in the extending direction (horizontal direction) of the moving mechanism 14.

[0108] In a specific embodiment, the wafer transport box 10 includes a first fixing member 11 and a moving mechanism 14. The moving mechanism 14 extends in the horizontal direction, and the moving mechanisms 14 between adjacent two wafer transport boxes 10 are connected to each other. The moving mechanism 14 is provided on the first fixing member 11. Specifically, the wafer transport box 10 further includes a housing, and the first fixing member 11 is installed inside the back housing of the corresponding wafer transport box 10.

[0109] In a specific embodiment, as Figure 16 shown, the first lifting mechanism 152 includes a second guiding member 153 and a second driving mechanism (not shown). The second driving mechanism is drivingly connected to the wafer pickup and placement device 151, and the wafer pickup and placement device 151 is slidably connected to the second guiding member 153. Under the drive of the second driving mechanism, the wafer pickup and placement device 151 slides vertically along the second guiding member 153. The second guiding member 153 can be a track, and the second driving mechanism can be a driving motor. Specifically, limiting members are provided at both ends of the second guiding member 153 to limit the maximum movable distance of the wafer pickup and placement device 151 in the vertical direction, as Figures 17 - 18 shown.Figure 17 shows the maximum movable distance of the wafer pick - and - place device 151 in the horizontal direction, Figure 18 shows the maximum movable distance of the wafer pick - and - place device 151 in the vertical direction, and can realize the wafer pick - and - place and handling of multiple wafer aging test devices 3 and multiple - layer test points in each wafer aging test device 3. The dotted line in the figure indicates the connection between the first fixing member 11 and the moving mechanism 14 in two adjacent wafer transport boxes 10.

[0110] Optionally, as Figures 19 - 21 shown, the wafer pick - and - place device 151 is connected to the first lifting mechanism 152 through a correction mechanism 500. The correction mechanism 500 includes a first connection component 510 and a second connection component 520. The first connection component 510 is used to correct the inclination degree of the wafer pick - and - place device 151 in the first direction, and the second connection component 520 is used to correct the inclination degree of the wafer pick - and - place device 151 in the second direction. The first direction and the second direction are mutually perpendicular horizontal directions.

[0111] Specifically, the first connection component 510 includes a first connecting member 511 connected to the wafer pick - and - place device 151 and a second connecting member 512 slidably connected to the first lifting mechanism 152. The first connecting member 511 and the second connecting member 512 are connected by a first pin 513. The axis of the first pin 513 is parallel to the second direction. The first connecting member 511 is used to drive the wafer pick - and - place device 151 to rotate around the axis of the first pin 513, and the second connecting member 512 is used to drive the wafer pick - and - place device 151 to move under the drive of the first lifting mechanism 152. Specifically, the first connecting member 511 is directly connected to the wafer pick - and - place device 151 and is usually fixed at a specific position of the wafer pick - and - place device 151 by bolts, flanges or other suitable connection methods as an interface for transmitting motion and force. The second connecting member 512 is slidably connected to the first lifting mechanism 152, and this sliding connection can be realized through structures such as guide rails and chutes, so that the second connecting member can drive the wafer pick - and - place device 151 to move along a predetermined path under the drive of the first lifting mechanism 152. The first pin 513 connects the first connecting member 511 and the second connecting member 512, and its axis is parallel to the second direction. The first pin not only plays a connecting role but also serves as a rotating shaft, enabling the first connecting member 511 to drive the wafer pick - and - place device 151 to rotate around its axis, thereby realizing the correction of the inclination degree of the wafer pick - and - place device 151 in the first direction.

[0112] Specifically, the second connection component 520 includes a third connection member 521 fixedly connected to the wafer pick-and-place device 151, and a fourth connection member 522 fixedly connected to the first connection member 511. The third connection member 521 and the fourth connection member 522 are connected by a second pin 523, and the axis of the second pin 523 is parallel to the first direction. The third connection member 521 is used to drive the wafer pick-and-place device 151 to rotate around the axis of the second pin 523. Specifically, the fourth connection member 522 is fixedly connected to the first connection member 511 to form a stable connection frame for transmitting motion and force. The second pin 523 connects the third connection member 521 and the fourth connection member 522, and its axis is parallel to the first direction. The third connection member 521 rotates around the axis of the second pin 523 to correct the inclination degree of the wafer pick-and-place device 151 in the second direction.

[0113] In a specific implementation, the correction mechanism 500 includes a second connection component 520 corresponding to the wafer loading device 110 and a second connection component 520 corresponding to the wafer unloading device 120. Correspondingly, the fourth connection members 522 corresponding to the wafer loading device 110 and the fourth connection members 522 corresponding to the wafer unloading device 120 are respectively fixedly connected to both sides of the first connection member 511, and the first connection member 511 is simultaneously fixedly connected to the first bracket 111 and the second bracket 121. The third connection member 521 corresponding to the wafer loading device 110 is fixedly connected to the first bracket 111, and the third connection member 521 corresponding to the wafer unloading device 120 is fixedly connected to the second bracket 121.

[0114] In a specific implementation, the first bracket 111 and the second bracket 121 include a back plate close to the first lifting mechanism 152. The first connection component 510 and the second connection component 520 are distributed on both sides of the back plate. An opening is provided on the back plate, and the fourth connection member 522 passes through the back plate through the opening and is fixedly connected to the first connection member 511.

[0115] Specifically, during the wafer handling process, due to factors such as equipment manufacturing errors, uneven installation, mechanical load changes, or mechanical deformations caused by long-term use, the wafer pick-and-place device 151 may tilt, affecting the precise placement and removal of the wafer. The correction mechanism 500 independently adjusts the tilt of the wafer pick-and-place device 151 in two mutually perpendicular horizontal directions through the coordinated action of the first connection assembly 510 and the second connection assembly 520. When it is necessary to correct the tilt of the wafer pick-and-place device 151 in the first direction, by controlling the first connecting member 511 in the first connection assembly 510 to rotate around the axis of the first pin 513, the wafer pick-and-place device 151 is driven to fine-tune in the first direction; when tilted in the second direction, the adjustment is achieved by rotating the third connecting member 521 in the second connection assembly 520 around the axis of the second pin 523. This adjustment method can accurately adjust the attitude of the wafer pick-and-place device 151 without changing its overall position, ensuring the precise docking of the adsorption mechanism 200 with the wafer and the test cavity.

[0116] In a specific embodiment, as Figure 2 shown, the wafer transport box 10 further includes a first connection structure 17 and a second connection structure 18. The first fixing member 11, the moving mechanism 14, and the wafer pick-and-place device 151 are all arranged inside the housing. The first connection structure 17 spans across the first fixing members 11 of two adjacent wafer transport boxes 10 to connect them, and the housings of two adjacent wafer transport boxes 10 are connected through the second connection structure 18.

[0117] Specifically, the second connection structure 18 can connect the two adjacent wafer transport boxes 10 as a whole. The specific setting of the second connection structure 18 can be determined according to actual application requirements. For example, the second connection structure 18 can be arranged on the inner side or the outer side of the housing at the connection of the wafer transport boxes 10, and further can be arranged at the bottom or the side of the housing at the connection.

[0118] Optionally, as Figure 22 shown, the second connection structure 18 includes a first sub-connection structure 181 and a second sub-connection structure 182. The first sub-connection structure 181 and the second sub-connection structure 182 are respectively arranged on the housings of two adjacent wafer transport boxes 10; the first sub-connection structure 181 and the second sub-connection structure 182 are inserted into each other to connect the housings of two adjacent wafer transport boxes 10.

[0119] Specifically, one of the first sub-connection structure 181 and the second sub-connection structure 182 can be a convex structure, and the other can be a corresponding concave structure. The connection between the housings is achieved by inserting the convex structure and the corresponding concave structure provided at the housing joint of two adjacent wafer transport boxes 10. On this basis, the first fixing members 11 of adjacent wafer transport boxes 10 are in contact with each other, and the moving mechanisms 14 are in contact with each other.

[0120] Specifically, in two adjacent wafer transport boxes 10, one end of the first connection structure 17 is fixed to the first fixing member 11 of one wafer transport box 10, and the other end is fixed to the first fixing member 11 of the other wafer transport box 10, so that the first fixing members 11 of two adjacent wafer transport boxes 10 are connected, and thus, the tracks of the two moving mechanisms 14 mounted on the corresponding first fixing members 11 in two adjacent wafer transport boxes 10 are connected. In practical applications, the specific structure of the first connection structure 17 can be set according to application requirements. For example, it can be strip-shaped.

[0121] Optionally, a leveling component is provided on each first fixing member 11; the moving mechanism 14 is used to move the wafer pick-and-place device 151 in the horizontal direction, and the leveling component is used to level the first fixing member 11 so that the moving mechanisms 14 of two adjacent wafer transport boxes 10 are aligned with each other.

[0122] In a specific embodiment, on the basis that the shells of two adjacent wafer transportation boxes 10 are connected and the moving mechanisms 14 of two adjacent wafer transportation boxes 10 are connected, the leveling assembly 16 can finely adjust the corresponding first fixing member 11 to align the moving mechanisms 14, so as to improve the connection accuracy. The leveling assembly 16 can level the corresponding first fixing member 11 in the x-axis direction, y-axis direction and z-axis direction, so that the moving mechanisms 14 arranged on the corresponding first fixing member 11 are aligned. Among them, the y-axis direction is the extending direction of the moving mechanism 14. Optionally, the first fixing members 11 of multiple wafer transportation boxes 10 can all be non-fixedly installed on the corresponding wafer transportation boxes 10, and are adjusted by their respective leveling assemblies 16 to achieve alignment and leveling. Or one of the first fixing members 11 can be fixedly installed on the corresponding wafer transportation box 10, and the other first fixing members 11 are non-fixedly installed on the corresponding wafer transportation boxes 10. Based on the fixedly installed first fixing member 11, by adjusting the other first fixing members 11, the other first fixing members 11 are aligned and leveled with the fixedly installed first fixing member 11, so that the moving mechanisms 14 on the first fixing members 11 are aligned (i.e., the tracks are aligned), high-precision splicing is realized, and further the wafer picking and placing device 151 can move smoothly in multiple wafer transportation boxes 10, avoiding situations such as movement obstruction or jamming at the connection of adjacent wafer transportation boxes 10, and improving the accuracy and stability of long-distance transportation.

[0123] In a specific embodiment, as Figure 23 shown, the leveling assembly includes a first horizontal leveling assembly 161, a second horizontal leveling assembly 162 and a vertical leveling assembly 163. The moving mechanism 14 is arranged on one side of the first fixing member 11. The first horizontal leveling assembly 161 and the second horizontal leveling assembly 162 are arranged on the other side of the first fixing member 11. The vertical leveling assembly 163 is arranged at the bottom of the first fixing member 11. The first horizontal leveling assembly 161 is used to level the first fixing member 11 in the extending direction of the moving mechanism 14. The second horizontal leveling assembly 162 is used to level the first fixing member 11 in the direction perpendicular to the side surface of the first fixing member 11. The vertical leveling assembly 163 is used to level the first fixing member 11 in the direction parallel to the side surface of the first fixing member 11.

[0124] Specifically, the first horizontal leveling component 161 is used to level the first fixing member 11 in the above-mentioned y-axis direction, the second horizontal leveling component 162 is used to level the first fixing member 11 in the above-mentioned x-axis direction, and the vertical leveling component 163 is used to level the first fixing member 11 in the above-mentioned z-axis direction. In the embodiment of the present specification, based on the front view of the wafer transport device 1, the moving mechanism 14 is arranged on the front of the first fixing member 11, and the first horizontal leveling component 161 and the second horizontal leveling component 162 are arranged on the back of the first fixing member 11.

[0125] In the above embodiment, Figure 23 the structure setting of the leveling component 16 is shown by taking one wafer transport box 10 as an example, and other wafer transport boxes 10 have the same setting.

[0126] In a specific embodiment, as Figure 24 shown, the first horizontal leveling component 161 includes a first leveling member 164 and a second leveling member 165. A second fixing member 12 is arranged in parallel on the other side of the first fixing member 11, and the size of the second fixing member 12 is smaller than that of the first fixing member 11; the second leveling member 165 is arranged on the second fixing member 12, and the first leveling member 164 is arranged on the first fixing member 11 relative to the second leveling member 165.

[0127] Specifically, the first leveling member 164 and the second leveling member 165 are arranged opposite to each other and have a preset distance. The first leveling member 164 and the second leveling member 165 can have a block structure. By fitting the opposite faces of the first leveling member 164 and the second leveling member 165, the first fixing member can be adjusted to be level and aligned in the y-axis direction. In practical applications, multiple first leveling members 164 and corresponding second leveling members 165 can be set to adjust different positions of the first fixing member 11 to ensure precise leveling. Specifically, the above preset distance is small and can be set according to actual application requirements.

[0128] Specifically, a third fixing member 13 is arranged in parallel on the other side of the first fixing member 11, the size of the third fixing member 13 is smaller than that of the first fixing member 11, and the second horizontal leveling component 162 is arranged on the third fixing member 13; the second horizontal leveling component 162 includes at least four leveling screws. Specifically, four leveling screws can be regarded as a group, and multiple groups of leveling screws can be arranged at intervals on the other side of the first fixing member 11 to adjust different positions of the first fixing member 11. Optionally, as Figure 23 and Figure 24 shown in the rightmost setting in, the second leveling member 165 and the leveling screws can be arranged on the same fixing member.

[0129] In the embodiments of this specification, the first fixing member 11, the second fixing member 12, and the third fixing member 13 may be fixing plates. Based on the front view of the wafer transportation device 1, both the second fixing member 12 and the third fixing member 13 are disposed on the back of the first fixing member 11.

[0130] Specifically, the vertical leveling assembly 163 can be used to support the first fixing member 11. The vertical leveling assembly 163 includes a plurality of vertical leveling members, and the plurality of vertical leveling members are spaced apart and disposed at the bottom of the first fixing member 11 to adjust different positions of the first fixing member 11.

[0131] Optionally, the wafer aging test system further includes a leveling detection device, and the leveling detection device is used to detect whether the moving mechanisms 14 between two adjacent wafer transportation boxes 10 are level and aligned. Specifically, the leveling detection device can indicate whether the moving mechanisms 14 are level and aligned through a pointer or the like.

[0132] In the above embodiments, the connection methods include detachable connection and non-detachable connection, such as connection through fasteners, integral connection, etc.

[0133] As can be seen from the technical solutions provided by the embodiments of this specification above, the wafer aging test system in this specification includes a wafer transportation device; a wafer loading and unloading device disposed on one side of the wafer transportation device; a wafer aging test device, and the wafer aging test device includes at least one wafer aging test device, and at least one wafer aging test device is disposed on at least one side of the wafer transportation device, so that multiple test positions can be expanded for parallel testing, improving the test efficiency, and at the same time enhancing the flexibility and rationality of the device layout; any wafer aging test device and the wafer transportation device form a first transportation channel relatively, the wafer transportation device includes a wafer picking and placing device, a second transportation channel is formed in the wafer transportation device, and any first transportation channel communicates with the second transportation channel, and the wafer picking and placing device carries the wafer and is controlled to move in the second transportation channel or any first transportation channel to realize the loading or unloading of the wafer.

[0134] The embodiments of this application further provide a wafer aging test method based on the above wafer aging test system, and the method may include:

[0135] The wafer loading and unloading device provides the wafers to be tested;

[0136] The wafer picking and placing device picks up the wafers to be tested, is controlled to move in the second transportation channel and the first transportation channel corresponding to the target wafer aging test device to the target wafer aging test device, and performs the unloading of the tested wafers and the loading of the wafers to be tested in the target wafer aging test device; the target wafer aging test device is any wafer aging test device of the wafer aging test device.

[0137] The wafer pick - and - place device is controlled to move to the wafer loading and unloading equipment in the first transportation channel and the second transportation channel corresponding to the target wafer aging test device, and unload the wafers that have completed the test.

[0138] In a specific embodiment, when the target wafer aging test device has completed the test on the wafer, the wafer pick - and - place device picks up the wafer to be tested, is controlled to move vertically along the second transportation channel in the wafer transportation equipment, and horizontally along the first transportation channel corresponding to the target wafer aging test device to the target wafer aging test device, picks up the wafer that has completed the test by the target wafer aging test device, and places the wafer to be tested on the target wafer aging test device; the target wafer aging test device is any wafer aging test device of any wafer aging test equipment. During the process of the target wafer aging test device testing the wafer to be tested, the wafer pick - and - place device is controlled to move horizontally along the first transportation channel corresponding to the target wafer aging test device in the wafer transportation equipment, and move vertically along the first transportation channel to the wafer loading and unloading equipment, and place the wafer that has completed the test on the wafer loading and unloading equipment, so that the wafer loading and unloading equipment puts the wafer that has completed the test into the wafer cassette for storage. Optionally, the wafer pick - and - place device can be used to carry the heat sink carrying the wafer.

[0139] Optionally, the above - mentioned wafer pick - and - place device may include a wafer loading device and a wafer unloading device arranged side by side. Correspondingly, the above - mentioned wafer pick - and - place device picks up the wafer to be tested, is controlled to move to the target wafer aging test device in the second transportation channel and the first transportation channel corresponding to the target wafer aging test device, and the unloading of the wafer that has completed the test and the loading of the wafer to be tested in the target wafer aging test device may include:

[0140] The wafer loading device picks up the wafer to be tested, and the wafer loading device and the wafer unloading device are controlled to move to the target wafer aging test device in the second transportation channel and the first transportation channel corresponding to the target wafer aging test device;

[0141] The wafer unloading device unloads the wafer that has completed the test in the target wafer aging test device;

[0142] The wafer loading device loads the wafer to be tested.

[0143] Optionally, the above - mentioned wafer pick - and - place device unloading the wafer that has completed the test includes:

[0144] The wafer unloading device unloads the wafer that has completed the test.

[0145] Specifically, the wafer loading device includes a first bracket, and the wafer unloading device includes a second bracket. Adsorption mechanisms are respectively arranged on the first bracket and the second bracket. The first bracket is connected to the corresponding adsorption mechanism through a second lifting mechanism, and the second bracket is connected to the corresponding adsorption mechanism through a third lifting mechanism. Correspondingly, the above-mentioned wafer picking and placing can be achieved through the following steps: the second lifting mechanism drives the corresponding adsorption mechanism to move along the first bracket to pick up the wafer; the third lifting mechanism drives the corresponding adsorption mechanism to move along the second bracket to place the wafer.

[0146] Specifically, when the wafer pick-and-place device is located at the test position of the wafer aging test equipment, the first lifting mechanism and the second lifting mechanism can be lifted alternately or synchronously.

[0147] Optionally, the above method may further include:

[0148] The second annular bracket rotates relative to the first annular bracket with the center of the circle as the axis to adjust the positions of the adsorbing member and the clamping member.

[0149] Specifically, multiple adsorbing members and multiple clamping members are all installed on the second annular bracket. As the second annular bracket slides, the positions of the adsorbing member and the clamping member can also be adjusted circumferentially accordingly, so that the positions of each clamping member correspond to each notch on the heat sink one by one, and the positions of each adsorbing member correspond to each third air passage on the heat sink one by one.

[0150] Optionally, the above method may further include:

[0151] The correction mechanism adjusts the inclination of the wafer pick-and-place device in two mutually perpendicular horizontal directions through the first connection component and the second connection component.

[0152] Specifically, when it is necessary to correct the inclination of the wafer pick-and-place device in the first direction, by controlling the first connecting piece in the first connection component to rotate around the axis of the first pin, the wafer pick-and-place device is driven to make fine adjustment in the first direction; when it is inclined in the second direction, the adjustment is achieved by rotating the third connecting piece in the second connection component around the axis of the second pin. This adjustment method can accurately adjust the posture of the wafer pick-and-place device without changing the overall position of the wafer pick-and-place device, ensuring the precise docking of the adsorption mechanism with the wafer and the test cavity.

[0153] Optionally, the above method may further include:

[0154] The first fixing piece is leveled through the leveling component so that the moving mechanisms between adjacent two wafer transport boxes are aligned.

[0155] Specifically, the leveling component levels the corresponding first fixing member in the x-axis direction, y-axis direction, and z-axis direction, so as to align the moving mechanisms provided on the corresponding first fixing members, thereby aligning the moving mechanisms on the first fixing members, achieving high-precision splicing. Furthermore, the wafer pick-and-place device can move smoothly in multiple wafer transport boxes, avoiding situations such as movement obstruction or jamming at the connection of adjacent wafer transport boxes, and improving the accuracy and stability of long-distance handling. Among them, the y-axis direction is the extension direction of the moving mechanism.

[0156] In a specific embodiment, the leveling component includes a first horizontal leveling component, a second horizontal leveling component, and a vertical leveling component. The leveling of the first fixing member by the leveling component described above may include:

[0157] In the extension direction of the moving mechanism, the first horizontal leveling component levels the first fixing member.

[0158] In the direction perpendicular to the side surface of the first fixing member, the second horizontal leveling component levels the first fixing member.

[0159] In the direction parallel to the side surface of the first fixing member, the vertical leveling component levels the first fixing member.

[0160] Specifically, the direction parallel to the side surface of the first fixing member is the above-mentioned x-axis direction, and the direction perpendicular to the side surface of the first fixing member is the above-mentioned z-axis direction.

[0161] Specifically, the wafer aging test system further includes a control mechanism, which is communicatively connected to the wafer loading and unloading device, the wafer transport device, and the wafer aging test device. The control mechanism is used to execute the wafer aging test method in the embodiments of this specification.

[0162] Those of ordinary skill in the art can understand that all or part of the steps of implementing the above embodiments can be completed by hardware, or can be completed by a program instructing related hardware. The program can be stored in a computer-readable storage medium. The storage medium mentioned above can be a read-only memory, a disk, or an optical disc, etc.

[0163] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A wafer aging test system, characterized in that: The wafer aging test system comprises: Wafer transport equipment; Wafer loading and unloading equipment, arranged on one side of the wafer transport equipment; Wafer aging test equipment, the wafer aging test equipment comprises at least one wafer aging test device, at least one of the wafer aging test devices is arranged on at least one side of the wafer transport equipment; any one of the wafer aging test devices and the wafer transport equipment form a first transport channel relative to each other; The wafer transport equipment includes a wafer loading and unloading device, a second transport channel is formed in the wafer transport equipment, any of the first transport channels is connected to the second transport channel, and the wafer loading and unloading device carries the wafer and is controlled to move in the second transport channel or any of the first transport channels to realize loading or unloading of the wafer.

2. The wafer aging test system according to claim 1, characterized in that: The wafer aging test system includes at least two wafer aging test devices, the wafer transport equipment includes at least two wafer transport boxes connected in sequence, the wafer loading and unloading equipment is arranged on one side of at least two wafer transport boxes, and at least two wafer aging test devices are arranged on at least one side of at least two wafer transport boxes; the first transport channels corresponding to the wafer aging test devices on the same layer in two adjacent wafer aging test devices are connected.

3. The wafer aging test system according to claim 2, characterized in that: Along the extension direction of the first transport channel, the wafer loading and unloading equipment and at least two of the wafer aging test devices are sequentially arranged on the same side of at least two of the wafer transport boxes.

4. The wafer aging test system according to claim 2, characterized in that: Along the extension direction of the first transport channel, at least two of the wafer aging test devices are sequentially arranged on the other side of at least two of the wafer transport boxes; the wafer loading and unloading device is also used to rotate between the two sides of at least two of the wafer transport boxes.

5. The wafer aging test system according to claim 2, characterized in that: At least two of the wafer aging test devices are respectively arranged on both sides of at least two of the wafer transport boxes. Along the extension direction of the first transport channel, the wafer loading and unloading equipment and at least one of the wafer aging test devices are sequentially arranged on one side of at least two of the wafer transport boxes; the wafer loading and unloading device is also used to rotate between the two sides of at least two of the wafer transport boxes.

6. The wafer aging test system according to any one of claims 1 to 5, characterized in that: The wafer transport equipment further includes a first lifting mechanism and a moving mechanism, the first lifting mechanism is slidably connected to the moving mechanism, the wafer loading and unloading device is slidably connected to the first lifting mechanism, and the wafer transport equipment corresponds to one wafer loading and unloading device and one first lifting mechanism; The wafer loading and unloading device is controlled to slide on the first lifting mechanism along the second transport channel, and the first lifting mechanism is controlled to slide on the moving mechanism along the first transport channel.

7. The wafer aging test system according to any one of claims 1 to 5, characterized in that: Any of the wafer aging test devices extends into the wafer transport equipment, and the wafer aging test device includes a heat sink assembly, an alignment mechanism and a mounting bracket, the mounting bracket extends into the wafer transport equipment, the heat sink assembly is arranged on the alignment mechanism, the alignment mechanism moves along the mounting bracket into the wafer transport equipment, and the first transport channel is formed above the heat sink assembly to realize wafer loading or unloading between the wafer loading and unloading device and the wafer aging test device; The first transport channel is arranged in a horizontal direction, the second transport channel is arranged in a vertical direction, and the wafer loading and unloading device is controlled to move in a horizontal direction in any of the first transport channels, and in a vertical direction in the second transport channel.

8. The wafer aging test system according to any one of claims 1 to 5, characterized in that: The wafer loading and unloading device comprises a wafer loading device and a wafer unloading device arranged side by side, the wafer loading device comprises a first bracket, the wafer unloading device comprises a second bracket, and the first bracket and the second bracket are respectively provided with adsorption mechanisms; The first bracket is connected to the corresponding adsorption mechanism through a second lifting mechanism, and the second lifting mechanism is used to drive the corresponding adsorption mechanism to move along the first bracket to complete the wafer loading action; the second bracket is connected to the corresponding adsorption mechanism through a third lifting mechanism, and the third lifting mechanism is used to drive the corresponding adsorption mechanism to move along the second bracket to complete the wafer unloading action.

9. The wafer aging test system according to claim 8, characterized in that: The adsorption mechanism comprises: The third bracket is ring-shaped; A plurality of adsorbents are arranged at intervals along the circumference of the third bracket and connected to the third bracket, wherein the plurality of adsorbents are configured to simultaneously provide adsorption force for the bottom of the wafer so that the wafer is attached to the heat sink; A plurality of clamping members are arranged at intervals along the circumference of the third bracket and connected to the third bracket. The plurality of clamping members are configured to clamp the heat sink carrying the wafer in a controlled manner and at the same time.

10. The wafer aging test system according to claim 9, characterized in that: The third bracket includes a first annular bracket and a second annular bracket which are concentric, and the second annular bracket and the first annular bracket rotate relative to each other with the center of the circle as the axis; the plurality of adsorption members and the plurality of clamping members are arranged on the second annular bracket.

11. The wafer aging test system according to claim 8, characterized in that: The wafer loading and unloading device is connected to the first lifting mechanism through a correction mechanism, and the correction mechanism includes a first connecting component and a second connecting component. The first connecting component is used to correct the tilt degree of the wafer loading and unloading device in a first direction, and the second connecting component is used to correct the tilt degree of the wafer loading and unloading device in a second direction. The first direction and the second direction are horizontal directions perpendicular to each other.

12. The wafer aging test system according to any one of claims 2 to 5, characterized in that: The wafer transport box comprises a first fixing member and a moving mechanism, the moving mechanism extends in a horizontal direction, the moving mechanisms of two adjacent wafer transport boxes are connected, the moving mechanism is arranged on the first fixing member, and each of the first fixing members is provided with a leveling component; The moving mechanism is used to move the wafer loading and unloading device along the horizontal direction, and the leveling component is used to level the first fixing member so that the moving mechanisms of two adjacent wafer transport boxes are aligned.

13. The wafer aging test system according to claim 12, characterized in that: The leveling assembly comprises a first horizontal leveling assembly, a second horizontal leveling assembly and a vertical leveling assembly, the moving mechanism is arranged on one side of the first fixing member, the first horizontal leveling assembly and the second horizontal leveling assembly are arranged on the other side of the first fixing member, and the vertical leveling assembly is arranged at the bottom of the first fixing member; The first horizontal leveling assembly is used to level the first fixing member along the extension direction of the moving mechanism; The second horizontal leveling assembly is used to level the first fixing member in a direction perpendicular to the side surface of the first fixing member; The vertical leveling assembly is used to level the first fixing member in a direction parallel to the side surface of the first fixing member.

14. The wafer aging test system according to claim 12, characterized in that: The wafer transport equipment also includes a first connecting structure, a second connecting structure and a shell. The first fixing member, the moving mechanism and the wafer loading and unloading device are all arranged in the shell. The first connecting structure spans the first fixing members of two adjacent wafer transport boxes to connect them. The shells of two adjacent wafer transport boxes are connected through the second connecting structure.

15. A wafer aging test method based on the wafer aging test system according to any one of claims 1 to 14, characterized in that: The method comprises: The wafer loading and unloading equipment provides wafers to be tested; The wafer loading and unloading device takes the wafer to be tested, and is controlled to move to the target wafer aging test device in the second transport channel and the first transport channel corresponding to the target wafer aging test device, and unloads the wafers that have been tested in the target wafer aging test device and loads the wafers to be tested; the target wafer aging test device is any wafer aging test device of the wafer aging test equipment; The wafer loading and unloading device is controlled to move in the first transport channel and the second transport channel corresponding to the target wafer aging test device to the wafer loading and unloading equipment to unload the wafers that have completed the test.

16. The method according to claim 15, characterized in that The wafer loading and unloading device comprises a wafer loading device and a wafer unloading device which are arranged side by side; The wafer loading and unloading device takes the wafer to be tested, and is controlled to move to the target wafer aging test device in the second transport channel and the first transport channel corresponding to the target wafer aging test device, and performs unloading of the wafers tested in the target wafer aging test device and loading of the wafers to be tested, including: The wafer loading device takes the wafer to be tested, and the wafer loading device and the wafer unloading device are controlled to move to the target wafer aging test device in the second transport channel and the first transport channel corresponding to the target wafer aging test device; The wafer unloading device unloads the wafers that have been tested in the target wafer aging test device; The wafer loading device loads the wafer to be tested.

17. The method according to claim 16, characterized in that The wafer loading and unloading device performs the unloading of the wafer after the test is completed, including: The wafer unloading device performs the test to complete the unloading of wafers.

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