Electrochromic device, electrochromic device and electrochromic product

By using a bonding assembly of multiple sub-bonding parts in the electrochromic device, the problem of uneven adhesive layer on the edge of the electrochromic device is solved, stable bonding and bus bar protection are achieved, and the reliability of the device is improved.

CN120233595APending Publication Date: 2025-07-01GUANGYI INTELLIGENT TECH (SUZHOU) CO LTD
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Patent Information

Application Number
CN202311848364.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2025-07-01

AI Technical Summary

Technical Problem

The adhesive layer of existing electrochromic devices is uneven at the edge, which is prone to wrinkles or falls off, affecting the stability and reliability of the bonding.

Method used

The bonding assembly using a combination of multiple sub-bonding parts is arranged in a specific direction perpendicular to the direction of the base layer stack, covering the bus bar and the edge of the base layer, forming a stable bonding structure, and a bus bar is provided in the groove to prevent short circuits.

Benefits of technology

It reduces the difficulty of bonding, avoids wrinkles and falls, improves the stability of the bonding assembly and the protection effect of the bus bar, and enhances the overall reliability of the electrochromic device.

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Abstract

The invention relates to the technical field of electrochromism devices, and provides an electrochromism device, an electrochromism device and an electrochromism product, and the electrochromism device comprises a bonding assembly, a bus bar, and a first conductive substrate layer, an electrochromism layer and a second conductive substrate layer which are stacked; the bus bar is arranged on the peripheral edge of at least one of the first conductive substrate layer and the second conductive substrate layer; the bonding assembly is arranged on the peripheral edge of at least one of the first conductive substrate layer and the second conductive substrate layer and at least partially covers the bus bar; the bonding assembly comprises at least two sub-bonding pieces, and the at least two sub-bonding pieces are arranged on the peripheral edge of at least one of the first conductive substrate layer and the second conductive substrate layer in the first direction; the first direction is perpendicular to the stacking direction of the first conductive substrate layer, the electrochromic layer and the second conductive substrate layer. And the width of each sub-bonding piece is set in a reasonable range convenient to attach, so that the bonding difficulty when the bonding assembly is arranged is effectively reduced.
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Description

Technical Field

[0001] This application relates to the technical field of electrochromism, and particularly provides an electrochromic device, an electrochromic device and an electrochromic product. Background Art

[0002] The electrochromic phenomenon refers to the reversible color change of a material under the action of an external electric field; the essence of electrochromism is that the material undergoes an oxidation-reduction reaction under the action of an external electric field and current, resulting in a change in its structure, and then a change in the absorption spectrum and optical properties (such as absorption rate, transmittance, reflectance), which is manifested as a reversible change in color and transparency in appearance. In recent years, electrochromic devices have been widely used in energy-saving windows, automotive rearview mirrors, display devices, mobile terminals and other fields, and have good market application prospects.

[0003] Various conductive materials are usually provided at the edges of electrochromic devices, and these conductive materials are used to power the electrochromic devices to cause color changes in the electrochromic devices. In order to enhance the bonding stability between these conductive materials and the electrochromic devices, an adhesive layer is usually provided on the conductive materials. However, due to the irregular shape of the edges of electrochromic devices, it is difficult to provide an adhesive layer at the edges of the devices, and the adhesive layer after bonding is prone to wrinkling and peeling, reducing the overall reliability of the electrochromic devices. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an electrochromic device and an electrochromic product, aiming to solve the problems that when the edge of an existing electrochromic device is bonded with an adhesive layer, the adhesive layer is uneven and prone to wrinkling or peeling.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] In a first aspect, the embodiments of this application provide an electrochromic device, including a bonding assembly, a bus bar, and a first conductive base layer, an electrochromic layer, and a second conductive base layer that are sequentially stacked; the bus bar is disposed at the peripheral edge of at least one of the first conductive base layer and the second conductive base layer; the bonding assembly is disposed at the peripheral edge of at least one of the first conductive base layer and the second conductive base layer and at least partially covers the bus bar; wherein, the bonding assembly includes at least two sub-bonding members, and along a first direction, at least two of the sub-bonding members are sequentially arranged on the peripheral edge of at least one of the first conductive base layer and the second conductive base layer; the first direction is perpendicular to the stacking direction of the first conductive base layer, the electrochromic layer, and the second conductive base layer.

[0007] In some embodiments, it further includes: a groove disposed at the peripheral edge of the electrochromic device, the groove penetrating through the first conductive base layer and the electrochromic layer along the stacking direction, and / or, the groove penetrating through the second conductive base layer and the electrochromic layer along the stacking direction; at least a part of the bus bar is disposed at the peripheral edge of the second conductive base layer on the side close to the electrochromic layer through the groove, and / or, at least a part of the bus bar is disposed at the peripheral edge of the first conductive base layer on the side close to the electrochromic layer through the groove.

[0008] In some embodiments, along the first direction, one end of at least a part of the bonding assembly is disposed on the peripheral edge of the first conductive base layer away from the electrochromic layer, and the other end of at least a part of the bonding assembly is disposed on the peripheral edge of the second conductive base layer on the side close to the electrochromic layer; and / or, along the first direction, one end of at least a part of the bonding assembly is disposed on the peripheral edge of the second conductive base layer away from the electrochromic layer, and the other end of at least a part of the bonding assembly is disposed on the peripheral edge of the first conductive base layer on the side close to the electrochromic layer.

[0009] In some embodiments, at least a part of the bus bar is disposed on the peripheral edge of the first conductive base layer on the side away from the electrochromic layer, and / or, at least a part of the bus bar is disposed on the peripheral edge of the second conductive base layer on the side away from the electrochromic layer.

[0010] In some embodiments, along the first direction, both ends of at least a part of the bonding assembly are disposed on the first conductive base layer, and / or, both ends of at least a part of the bonding assembly are disposed on the second conductive base layer.

[0011] In some embodiments, it further includes a barrier portion, the barrier portion is disposed on at least one of the first conductive base layer and the second conductive base layer, along the first direction, the barrier portion is located between the electrochromic layer and the bus bar, and at least a part of the bonding assembly also covers the barrier portion.

[0012] In some embodiments, the bus bar includes a first bus bar and a second bus bar, the bonding assembly includes a first bonding assembly and a second bonding assembly, wherein, at least a part of the first bonding assembly covers the first bus bar, at least a part of the second bonding assembly covers the second bus bar, and, along the first direction, one end of the first bonding assembly is connected to one end of the second bonding assembly.

[0013] In some embodiments, the adhesive assembly includes a first sub-adhesive and a second sub-adhesive disposed adjacent to each other, wherein, along the first direction, one end of the first sub-adhesive is disposed on a peripheral edge of the first conductive substrate layer on a side away from the electrochromic layer or on a peripheral edge of the second conductive substrate layer on a side away from the electrochromic layer, and the other end of the first sub-adhesive is disposed on the bus bar or on the second sub-adhesive; along the first direction, one end of the second sub-adhesive is disposed on the bus bar or on the first sub-adhesive, and the other end of the second sub-adhesive is disposed on a peripheral edge of the second conductive substrate layer on a side close to the electrochromic layer or on a peripheral edge of the first conductive substrate layer on a side close to the electrochromic layer.

[0014] In some embodiments, in the groove, the stacking thickness of the adhesive assembly and the bus bar in the stacking direction is less than or equal to the stacking thickness of the first conductive substrate layer and the electrochromic layer in the stacking direction; and / or, in the groove, the stacking thickness of the adhesive assembly and the bus bar in the stacking direction is less than or equal to the stacking thickness of the second conductive substrate layer and the electrochromic layer in the stacking direction.

[0015] In some embodiments, the adhesive assembly further includes a sealant, which is disposed on the bus bar and located between two adjacent sub-adhesive components.

[0016] In a second aspect, the present embodiment provides an electrochromic device, comprising a substrate and the electrochromic device, wherein the substrate is arranged on a side of the first conductive base layer away from the electrochromic layer; and / or the substrate is arranged on a side of the second conductive base layer away from the electrochromic layer.

[0017] In a third aspect, an embodiment of the present application provides an electrochromic product, including the electrochromic device or the electrochromic apparatus, wherein the electrochromic product includes any one of a rearview mirror, a curtain wall, a car sunroof, a car side window, a car windshield, an electronic product housing, glasses, a vehicle, and a display panel.

[0018] The beneficial effects of the present application are as follows: The bonding assembly is composed of multiple sub-bonding members combined to form a bonding effect on the peripheral edge of the first conductive base layer or the peripheral edge of the second conductive base layer, so that the width of a single sub-bonding member in the first direction does not need to be set too wide, which is convenient to set the width of each sub-bonding member within a reasonable range that can meet the requirements of convenient bonding operation, effectively reducing the bonding difficulty when setting the bonding assembly. Moreover, the sub-bonding member has good ductility, which can avoid unevenness, wrinkling or falling off during bonding, making it easier to perform the attachment operation of the bonding assembly. In addition, the bonding assembly also partially covers the bus bar, and can also achieve the protection of the bus bar to prevent the bus bar from being corroded by the external environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0020] Figure 1 It is a top view structural schematic diagram of an electrochromic device provided by an embodiment of the present application;

[0021] Figure 2 It is Figure 1 a cross-sectional view taken along B-B in

[0022] Figure 3 It is a cross-sectional structural schematic diagram of an electrochromic device provided by another embodiment of the present application;

[0023] Figure 4 It is for the application Figure 1 a cross-sectional view taken along A-A in

[0024] Figure 5 It is a three-dimensional structural schematic diagram of the first conductive base layer, electrochromic layer and second conductive base layer of an electrochromic device provided by an embodiment of the present application, which are stacked;

[0025] Figure 6 It is a three-dimensional structural schematic diagram of another setting method of the bonding assembly of an electrochromic device provided by an embodiment of the present application;

[0026] Figure 7 It is a three-dimensional structural schematic diagram of another setting method of the bonding assembly of an electrochromic device provided by an embodiment of the present application;

[0027] Figure 8 It is a three-dimensional structural schematic diagram of another setting method of the bonding assembly of an electrochromic device provided by an embodiment of the present application;

[0028] Figure 9 Schematic perspective view of an electrochromic device provided by another embodiment of the present application;

[0029] Figure 10 Schematic perspective view of an electrochromic device provided by another embodiment of the present application, wherein a barrier portion is formed between the bus bar and the electrochromic layer;

[0030] Figure 11 Partial schematic perspective view of an electrochromic device provided by an embodiment of the present application, wherein one end of the first bonding assembly is connected to one end of the second bonding assembly;

[0031] Figure 12 Schematic perspective view of another arrangement of the bonding assembly of an electrochromic device provided by an embodiment of the present application;

[0032] Figure 13 Schematic view of the structure of an electrochromic device provided by an embodiment of the present application;

[0033] Figure 14 Schematic view of the structure of an electrochromic device provided by an embodiment of the present application.

[0034] Among them, each reference numeral in the figure,

[0035] 1000, electrochromic device;

[0036] 1, bonding assembly; 101, sub-bonding member; 1a, first bonding assembly; 1b, second bonding assembly;

[0037] 1011, first sub-bonding member; 1012, second sub-bonding member; 1013, third sub-bonding member;

[0038] 2, first conductive base layer; 21, first base layer; 22, second conductive layer;

[0039] 3, electrochromic layer; 4, second conductive base layer; 41, second base layer; 42, second conductive layer;

[0040] 5, groove; 501, first groove; 502, second groove;

[0041] 6, bus bar; 601, first bus bar; 602, second bus bar

[0042] 6011, first inner bus bar; 6012, first outer bus bar;

[0043] 6021, second inner bus bar; 6022, second outer bus bar;

[0044] 7, barrier portion; 8, sealant;

[0045] 2000. Electrochromic device;

[0046] 2001. Substrate; 2002. Substrate adhesive layer;

[0047] X. First direction; Y. Laminating direction. Detailed implementation mode

[0048] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application and should not be construed as a limitation of the present application.

[0049] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.

[0050] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0051] In the present application, unless otherwise clearly defined and limited, terms such as "installed", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0052] In this application, terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0053] Currently, electrochromic devices are widely used in fields such as energy-saving windows, automotive rearview mirrors, display devices, and mobile terminals, and have good market application prospects. The essence of electrochromism is that the material undergoes an oxidation-reduction reaction under the action of an external electric field and current, resulting in a change in its structure, and then causing changes in the absorption spectrum and optical properties (such as absorption rate, transmittance, reflectance), which is manifested as a reversible change in color and transparency in appearance.

[0054] As mentioned in the background art, in order to improve the bonding stability of the conductive material of the electrochromic device, it is usually necessary to set a bonding adhesive layer at the peripheral edge of the electrochromic device. When the edge of the electrochromic device is an irregular arc structure, when only one adhesive layer with a relatively wide width is set, the adhesive layer will have wrinkles due to improper operations such as bending during the bonding process, resulting in local warping of the adhesive layer itself, thus affecting the connection stability of the adhesive layer. Seriously, it will also cause the adhesive layer to fall off from the electrochromic device, thus affecting the overall reliability of the electrochromic device.

[0055] Based on this, in order to solve the above problems, this application designs an electrochromic device. The bonding assembly is composed of a plurality of sub-bonding members combined to bond to the peripheral edge of the first conductive base layer or the peripheral edge of the second conductive base layer, so that the width of a single sub-bonding member in the first direction does not need to be set too wide, facilitating the width of each sub-bonding member to be set within a reasonable range that can meet the requirements of convenient bonding operation, effectively reducing the bonding difficulty when setting the bonding assembly. Moreover, the sub-bonding member has good ductility, which can avoid wrinkles during bonding and make the bonding assembly easier to perform the attachment operation. In addition, the bonding assembly also partially covers the bus bar, which can increase the connection stability of the bus bar and can also protect the bus bar from being corroded by the external environment.

[0056] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4, the electrochromic device 1000 provided in the first aspect of the embodiment of the present application includes an adhesive assembly 1, a bus bar 6, and a first conductive base layer 2, an electrochromic layer 3, and a second conductive base layer 4 stacked from top to bottom; the bus bar 6 is disposed on the peripheral edge of at least one of the first conductive base layer 2 and the second conductive base layer 4; the adhesive assembly 1 is disposed on the peripheral edge of at least one of the first conductive base layer 2 and the second conductive base layer 4 and at least partially covers the bus bar 6; wherein, the adhesive assembly 1 includes at least two sub-adhesive members 101, and along the first direction X, the at least two sub-adhesive members 101 are arranged in sequence on the peripheral edge of at least one of the first conductive base layer 2 and the second conductive base layer 4, and the first direction X is perpendicular to the stacking direction Y of the first conductive base layer 2, the electrochromic layer 3, and the second conductive base layer 4.

[0057] It can be understood that the electrochromic layer 3 is made of electrochromic materials and can exhibit stable and reversible color change under the action of an external electric field. The electrochromic layer 3 is a layer or multiple layers of materials in a gel state or a solid state, such as a Polymer Dispersed Liquid Crystal (PDLC) layer, a Suspended Particle Device (SPD), and an Electrochromic (EC) layer, etc. For the electrochromic layer 3 of the Electrochromic (EC) type, it may include a color-changing material layer, an electrolyte layer, and an ion storage layer stacked in sequence. The materials of the color-changing material layer, the electrolyte layer, and the ion storage layer can be materials in the prior art, and the present application does not make special limitations on this.

[0058] Specifically, Figure 1 is a top view of the electrochromic device 1000 of the embodiment of the present application. In the stacking direction Y of the first conductive base layer 2, the electrochromic layer 3, and the second conductive base layer 4, the overlapping area of the first conductive base layer 2 and the second conductive base layer 4 covers the electrochromic layer 3, so that the electrochromic layer 3 is not exposed outside the electrochromic device 1000, providing effective protection for the electrochromic layer 3.

[0059] Refer to Figure 3 , Figure 5, the first conductive substrate layer 2 includes a first substrate layer 21 and a first conductive layer 22 disposed on the surface of the first substrate layer 21; the second conductive substrate layer 4 includes a second substrate layer 41 and a second conductive layer 42 disposed on the surface of the second substrate layer 41. Preferably, the first substrate layer 21 and the second substrate layer 41 are selected as transparent flexible substrates, such as polyethylene glycol terephthalate (PET), polycarbonate (PC), etc., and can also be set as glass substrates; the first conductive layer 22 and the second conductive layer 42 are set as indium-tin-oxide (ITO), aluminum zinc oxide (AZO), fluorine doped tinoxide (FTO), and the first conductive layer 22 and the second conductive layer 42 are preferably set as ITO; so that both the first conductive substrate layer 2 and the second conductive substrate layer 4 have good electrical conductivity and light transmittance.

[0060] Reference Figures 1 - 4 , at the peripheral edge of the electrochromic device 1000, a non-overlapping portion is formed between the first conductive substrate layer 2 and the second conductive substrate layer 4 in the stacking direction Y; the bus bar 6 can be disposed on the first conductive substrate layer 2, and the bus bar 6 forms an electrical connection with the first conductive substrate layer 2; the bus bar 6 can also be disposed on the second conductive substrate layer 4, and the bus bar 6 forms an electrical connection with the second conductive substrate layer 4; the bus bar 6 is made of conductive materials such as but not limited to copper foil, silver wire, conductive resin, etc., and an extraction electrode (not shown) connected to an external power source can be provided on the bus bar 6. Then, by providing the bus bar 6 at the peripheral edge of the first conductive substrate layer 2 and / or the peripheral edge of the second conductive substrate layer 4, it is convenient to connect the electrochromic device 1000 to an external power source.

[0061] Reference 2, Figure 4 , in this embodiment, the bus bar 6 is respectively provided on the first conductive layer 22 of the first conductive substrate layer 2 and the second conductive layer 42 of the second conductive substrate layer 4. By introducing current or voltage to the first conductive layer 22 of the first conductive substrate layer 2 and the second conductive layer 42 of the second conductive substrate layer 4, an electric field is formed on both sides of the electrochromic layer, so as to drive the electrochromic layer 3 to undergo coloring or fading phenomena, that is, the electrochromic device 1000 shows a change in light transmittance in appearance, thereby realizing the adjustment of the light transmittance of the scene where the electrochromic device 1000 is applied.

[0062] It can be understood that, reference Figure 1 , Figure 4, on both sides of the electrochromic device 1000 in the stacking direction Y, there are bus bars 6 provided. One of the bus bars 6 is provided at the peripheral edge of the first conductive base layer 2 and can serve as the positive or negative electrode of the electrochromic device 1000; the other bus bar 6 is provided at the peripheral edge of the second conductive base layer 4 and can serve as the negative or positive electrode of the electrochromic device 1000. Through two electrodes, it is electrically connected to an external power supply, so as to provide a voltage for the electrochromic layer. And the bus bars on both sides are arranged at intervals to avoid the phenomenon of short circuit caused by contact between the bus bars 6 on both sides, so as to improve the stability of the electrochromic device 1000.

[0063] Reference Figures 2 - 4 , bonding components 1 are respectively provided at the peripheral edge of the first conductive base layer 2 and the peripheral edge of the second conductive base layer 4, and the bonding components 1 also cover the bus bars 6, which can enhance the connection stability of the bus bars 6.

[0064] Specifically, the bonding component 1 includes at least two sub-bonding members 101 arranged in sequence along the first direction X; the first direction X is the X direction shown in the figure, and the first direction X is perpendicular to the stacking direction Y of the first conductive base layer 2, the electrochromic layer 3 and the second conductive base layer 4. The sub-bonding member 101 has adhesiveness, and the material of the sub-bonding member 101 includes colloids that are conventional in the art and have the effects of insulation and water and oxygen isolation; each sub-bonding member 101 is connected to any one or more of the first conductive base layer 2, the bus bar 6, and the second conductive base layer 4 in a bonding manner.

[0065] When the side of the single sub-bonding member 101 of the bonding component 1 is close to the electrochromic layer 3, the sub-bonding member 101 can also prevent external water vapor and oxygen from entering the electrochromic layer 3 from the side of the electrochromic device 1000, thereby improving the electrochemical stability of the electrochromic device 1000.

[0066] And here, there is no limitation on the number and connection relationship of the sub-bonding members 101. The bonding component 1 can include 2, 3, 4 or more sub-bonding members 101; and any two adjacent sub-bonding members 101 can be connected to each other or arranged at intervals.

[0067] Since the bus bar 6 is provided at the peripheral edge of the first conductive base layer 2 and the peripheral edge of the second conductive base layer 4, when the bonding component 1 covers the bus bar 6, the bonding component 1 can also be used to protect the bus bar 6 from being corroded by the external environment. It should be noted that: the bonding component 1 partially covers the bus bar 6, as long as the overall projection of the bonding component 1 in the stacking direction Y partially or completely covers the bus bar 6, rather than each sub-bonding member 101 needs to cover the bus bar 6.

[0068] Understandably, if only one sub - adhesive member 101 is provided in the adhesive assembly 1, the width of a single sub - adhesive member 101 undoubtedly needs to be set wider to achieve good adhesion to the peripheral edge of the first conductive base layer 2 or the peripheral edge of the second conductive base layer 4; here, the width of the sub - adhesive member 101 is the length of the sub - adhesive member 101 in the first direction X.

[0069] Reference Figure 13 , in some embodiments, the peripheral edge of the electrochromic device 1000 is an irregular structure. At this irregular structure, the first conductive base layer 2, the electrochromic layer 3, and the second conductive base layer 4 are all arc - shaped. Therefore, when setting the adhesive assembly 1 at this irregular structure, the operation of attaching the sub - adhesive member 101 is difficult. If the width of a single sub - adhesive member 101 is too wide, it is easy to have the phenomenon of the colloid wrinkling during attachment, resulting in local unevenness of the product. However, the adhesive assembly 1 of the present application combines multiple sub - adhesive members 101, and the width of each single sub - adhesive member 101 is necessarily smaller than the width when only one sub - adhesive member 101 is provided; this makes it easier to attach each sub - adhesive member 101 of the adhesive assembly 1, reducing the operation difficulty.

[0070] In the electrochromic device 1000 of the present application, the adhesive assembly 1 is composed of multiple sub - adhesive members 101 combined to adhere to the peripheral edge of the first conductive base layer 2 or the peripheral edge of the second conductive base layer 4, so that the width of a single sub - adhesive member 101 in the first direction X does not need to be set too wide, facilitating setting the width of each sub - adhesive member 101 within a reasonable range that can meet the requirements of convenient adhesion operation, effectively reducing the adhesion difficulty when setting the adhesive assembly 1, and avoiding the colloid wrinkling during adhesion; enabling each sub - adhesive member 101 to be more firmly adhered to the peripheral edge of the electrochromic device 1000, improving the connection stability of the adhesive assembly 1, and increasing the overall reliability of the electrochromic device 1000.

[0071] In addition, the adhesive assembly 1 also partially covers the bus bar 6, and can also protect the bus bar 6 from being corroded by the external environment.

[0072] Reference Figures 1 - 5 , in some embodiments, the electrochromic device 1000 further includes a groove 5 provided at the peripheral edge of the electrochromic device 1000. The groove 5 penetrates the first conductive base layer 2 and the electrochromic layer 3 along the stacking direction Y, and / or the groove 5 penetrates the second conductive base layer 4 and the electrochromic layer 3 along the stacking direction Y; the bus bar 6 is at least partially disposed through the groove 5 at the peripheral edge of the second conductive base layer 4 close to the electrochromic layer 3 side, and / or the bus bar 6 is at least partially disposed through the groove 5 at the peripheral edge of the first conductive base layer 2 close to the electrochromic layer 3 side.

[0073] Specifically, referring to Figure 1 , Figure 4 , Figure 5 , a plurality of grooves 5 are alternately arranged at intervals on the peripheral edge of the electrochromic device 1000. The grooves 5 include a first groove 501 that penetrates through the first conductive base layer 2 and the electrochromic layer 3 along the stacking direction Y; and a second groove 502 that penetrates through the second conductive base layer 4 and the electrochromic layer 3 along the stacking direction Y. The number of the grooves 5 is a plurality respectively, and can be any number greater than the value of two, and can be specifically set according to the actual situation.

[0074] Understandably, referring to Figure 2 , Figure 4 , the bus bar 6 includes a first bus bar 601 that is at least partially disposed on the peripheral edge of the second conductive base layer 4 close to the electrochromic layer 3 through the first groove 501; wherein, the side of the second conductive base layer 4 close to the electrochromic layer 3 is the second conductive layer 42 of the second conductive base layer 4, and the first bus bar 601 is disposed in the first groove 501 to form an electrical connection with the second conductive base layer 4, that is, the first bus bar 601 forms the positive electrode or the negative electrode of the electrochromic device 1000.

[0075] The bus bar 6 further includes a second bus bar 602 that is at least partially disposed on the peripheral edge of the first conductive base layer 2 close to the electrochromic layer 3 through the second groove 502. Wherein, the side of the first conductive base layer 2 close to the electrochromic layer 3 is the first conductive layer 22 of the first conductive base layer 2, and the second bus bar 602 is disposed in the second groove 502 to form an electrical connection with the first conductive base layer 2, that is, the second bus bar 602 forms the negative electrode or the positive electrode of the electrochromic device 1000.

[0076] Moreover, the first bus bar 601 forms an electrical connection with the second conductive layer 42 in the second conductive base layer 4 through a plurality of first grooves 501, and the second bus bar 602 forms an electrical connection with the first conductive layer 22 in the first conductive base layer 2 through a plurality of second grooves 502. Thus, a multi-electrode structure can be alternately formed on the peripheral edge of the electrochromic device 1000, and the color change speed of the electrochromic device 1000 can be accelerated.

[0077] Here, the number and the setting position of the first groove 501 and the second groove 502 are not limited.

[0078] Exemplarily, referring to Figure 1 , Figure 2 , in Figure 2 's cross-sectional view angle, grooves 5 can be formed at both ends of the electrochromic device 1000 in the first direction X. Or, referring to Figure 3 , in Figure 3In a sectional view, the electrochromic device 1000 may have a groove 5 formed only at one end in the first direction X; alternatively, in a certain sectional view, neither end of the electrochromic device 1000 in the first direction X has a groove 5.

[0079] Refer to Figure 2 、 Figures 4 - 8 In some embodiments, along the first direction X, at least one end of the bonding assembly 1 is disposed on the peripheral edge of the first conductive base layer 2 away from the electrochromic layer 3, and at least one end of the bonding assembly 1 is disposed on the peripheral edge of the second conductive base layer 4 on the side close to the electrochromic layer 3; and / or,

[0080] Along the first direction X, at least one end of the bonding assembly 1 is disposed on the peripheral edge of the second conductive base layer 4 away from the electrochromic layer 3, and at least one end of the bonding assembly 1 is disposed on the peripheral edge of the first conductive base layer 2 on the side close to the electrochromic layer 3.

[0081] Specifically, refer to Figure 2 The bonding assembly 1 includes a first bonding assembly 1a and a second bonding assembly 1b respectively disposed on opposite sides of the electrochromic device 1000 in the stacking direction Y; along the first direction X, one end of the first bonding assembly 1a is disposed on the peripheral edge of the first conductive base layer 2 away from the electrochromic layer 3, and the other end of the first bonding assembly 1a is disposed on the peripheral edge of the second conductive base layer 4 on the side close to the electrochromic layer 3, that is, the first bonding assembly 1a can form a good bonding effect on the first bus bar 601 in the first groove 501, enhancing the bonding stability of the first bus bar 601 on the electrochromic device 1000.

[0082] Along the first direction X, one end of the second bonding assembly 1b is disposed on the peripheral edge of the second conductive base layer 4 away from the electrochromic layer 3, and the other end of the second bonding assembly 1b is disposed on the peripheral edge of the first conductive base layer 2 on the side close to the electrochromic layer 3; that is, the second bonding assembly 1b can form a good bonding effect on the second bus bar 602 at the second groove 502, enhancing the bonding stability of the second bus bar 602 on the electrochromic device 1000.

[0083] It should be noted that: the two ends of the first bonding assembly 1a refer to the two outermost distal ends of the first bonding assembly 1a relative to each other in the first direction, not the ends of a certain sub-bonding member 101 in the middle; the two ends of the second bonding assembly 1b refer to the two outermost distal ends of the second bonding assembly 1b relative to each other in the first direction, not the ends of a certain sub-bonding member 101 in the middle.

[0084] Refer to Figure 1 、 Figure 4 、 Figure 9, in some embodiments, the bus bar 6 is at least partially disposed on the peripheral edge of the first conductive base layer 2 on the side away from the electrochromic layer 3, and / or, the bus bar 6 is at least partially disposed on the peripheral edge of the second conductive base layer 4 on the side away from the electrochromic layer 3.

[0085] Understandably, the first bus bar 601 surrounds the peripheral edge of one side of the electrochromic device 1000. The first bus bar 601 includes a first inner bus bar 6011 located in the first groove 501 and on the peripheral edge of the second conductive base layer 4 on the side close to the electrochromic layer 3, and a first outer bus bar 6012 located on the peripheral edge of the first conductive base layer 2 on the side away from the electrochromic layer 3. The first bonding assembly 1a surrounds the peripheral edge of one side of the electrochromic device 1000 in the stacking direction Y to cover the first inner bus bar 6011 and the first outer bus bar 6012 at the same time; and along the first direction X, both ends of the first bonding assembly 1a covering the first outer bus bar 6012 are disposed on the first conductive base layer 2.

[0086] The second bus bar 602 surrounds the peripheral edge of the other side of the electrochromic device 1000. The second bus bar 602 includes a second inner bus bar 6021 located in the second groove 502 and on the peripheral edge of the first conductive base layer 2 on the side close to the electrochromic layer 3; and a second outer bus bar 6022 located on the peripheral edge of the second conductive base layer 4 on the side away from the electrochromic layer 3. The second bonding assembly 1b surrounds the peripheral edge of one side of the electrochromic device 1000 to cover the second inner bus bar 6021 and the second outer bus bar 6022 at the same time; and along the first direction X, both ends of the second bonding assembly 1b covering the second outer bus bar 6022 are disposed on the second conductive base layer 4.

[0087] Reference Figure 10 , in some embodiments, the electrochromic device 1000 further includes a barrier portion 7. The barrier portion 7 is disposed on at least one of the first conductive base 2 and the second conductive base layer 4. Along the first direction X, the barrier portion 7 is located between the electrochromic layer 3 and the bus bar 6, and the bonding assembly 1 also at least partially covers the barrier portion 7.

[0088] Understandably, when the electrochromic device 1000 is subjected to pressure deformation causing the first conductive base layer 2 or the second conductive base layer 4 to bend and deform, it may cause the first conductive layer 22 of the first conductive base layer 2 and the second conductive layer 42 of the second conductive base layer 4 to come into contact with each other in the first groove 501 or the second groove 502, resulting in a short circuit.

[0089] Therefore, a barrier portion 7 is provided between the first internal bus bar 6011 in the first groove 501 and the electrochromic layer 3; and a barrier portion 7 is provided between the second internal bus bar 6021 in the second groove 502 and the electrochromic layer 3; the barrier portion 7 can form an isolation effect between the first conductive base layer 2 and the second conductive base layer 4, avoiding short circuit.

[0090] In some embodiments, the barrier portion 7 is a separately provided insulating material.

[0091] In some embodiments, referring to Figure 10 , the barrier portion 7 in the first groove 501 is integrally formed with the first conductive base layer 2, and the barrier portion 7 is formed by partitioning the first conductive base layer 2 to be spaced apart from the first conductive base layer 2 in the first direction X. The barrier portion 7 in the second groove 502 is integrally formed with the second conductive base layer 4, and the barrier portion 7 is formed by partitioning the second conductive base layer 4 to be spaced apart from the second conductive base layer 4 in the first direction X.

[0092] In some embodiments, the bonding assembly 1 covers the barrier portion 7 and at least partially covers the first conductive base layer 2, which can improve the bonding stability of the end of the bonding assembly 1 on the first conductive base layer 2 and avoid the end of the bonding assembly 1 from separating or falling off the first conductive base layer 2.

[0093] In some other embodiments, the bonding assembly 1 covers the barrier portion 7 and at least partially covers the second conductive base layer 4, which can improve the bonding stability of the end of the bonding assembly 1 on the second conductive base layer 4 and avoid the end of the bonding assembly 1 from separating or falling off the fourth conductive base layer.

[0094] Referring to Figure 9 、 Figure 11 , in some embodiments, the bus bar 6 includes a first bus bar 601 and a second bus bar 602, and the bonding assembly 1 includes a first bonding assembly 1a and a second bonding assembly 1b. Among them, the first bonding assembly 1a at least partially covers the first bus bar 601, the second bonding assembly 1b at least partially covers the second bus bar 602, and, at the peripheral edge of the electrochromic device 1000 in the first direction X, one end of the first bonding assembly 1a is connected to one end of the second bonding assembly 1b.

[0095] It can be understood that the first bus bar 601 and the second bus bar 602 are respectively provided on opposite sides of the electrochromic device 1000 in the stacking direction Y, and the first bonding assembly 1a and the second bonding assembly 1b respectively cover the first bus bar 601 and the second bus bar 602.

[0096] In some embodiments, referring to Figure 11, when a groove 5 is formed at one end of the electrochromic device 1000 in the first direction X, one end of the first bonding component 1a covering the first external current collector 6012 is connected to one end of the second bonding component 1b covering the second internal current collector 6021; or, one end of the first bonding component 1a covering the first internal current collector 6011 is connected to one end of the second bonding component 1b covering the second external current collector 6022; so that the first bonding component 1a and the second bonding component 1b are connected on the side surface of the electrochromic device 1000 in the first direction X, which can improve the bonding strength between the first bonding component 1a and the second bonding component 1b; and can also isolate the electrochromic device 1000 from the outside, preventing water vapor from entering the side surface of the electrochromic device 1000 and making the performance of the electrochromic device 1000 stable.

[0097] In some embodiments, when neither end of the electrochromic device 1000 in the first direction X has a groove 5, one end of the first bonding component 1a covering the first external current collector 6012 is connected to one end of the second bonding component 1b covering the second external current collector 6022; so that the first bonding component 1a and the second bonding component 1b are connected on the side surface of the electrochromic device 1000 in the first direction X, which can improve the bonding strength between the first bonding component 1a and the second bonding component 1b; and can also isolate the electrochromic device 1000 from the outside.

[0098] Reference Figure 2 , Figures 6 - 8 , in some embodiments, the bonding component 1 includes a first sub-bonding member 1011 and a second sub-bonding member 1012 arranged adjacent to each other. Wherein, along the first direction X, one end of the first sub-bonding member 1011 is disposed on the peripheral edge of the first conductive base layer 2 away from the electrochromic layer 3 or on the peripheral edge of the second conductive base 4 away from the electrochromic layer 3, and the other end of the first sub-bonding member 1011 is disposed on the current collector 6 or on the second sub-bonding member 1012; along the first direction X, one end of the second sub-bonding member 1012 is disposed on the current collector 6 or on the first sub-bonding member 1011, and the other end of the second sub-bonding member 1012 is disposed on the peripheral edge of the second conductive base layer 4 close to the electrochromic layer 3 or on the peripheral edge of the first conductive base layer 2 close to the electrochromic layer 3.

[0099] Specifically, the first bonding component 1a has a first sub-bonding member 1011 and a second sub-bonding member 1012; and the second bonding component 1b has a first sub-bonding member 1011 and a second sub-bonding member 1012.

[0100] For the first bonding assembly 1a, along the first direction X, one end of the first sub-bonding member 1011 of the first bonding assembly 1a forms one end of the first bonding assembly 1a and is disposed on the peripheral edge of the first conductive base layer 2 on the side away from the electrochromic layer 3. The other end of the first sub-bonding member 1011 of the first bonding assembly 1a is disposed on the first bus bar 601 or the second sub-bonding member 1012, so that the first sub-bonding member 1011 of the first bonding assembly 1a can also form a seal on the side surface of the electrochromic layer 3. One end of the second sub-bonding member 1012 of the first bonding assembly 1a forms the other end of the first bonding assembly 1a and is disposed on the peripheral edge of the second conductive base layer 4 on the side close to the electrochromic layer 3, so that the first bonding assembly 1a can be stably connected to the electrochromic device 1000.

[0101] For the second bonding assembly 1b, along the first direction X, one end of the first sub-bonding member 1011 of the second bonding assembly 1b forms one end of the second bonding assembly 1b and is disposed on the peripheral edge of the second conductive base layer 4 on the side away from the electrochromic layer 3. The other end of the first sub-bonding member 1011 of the second bonding assembly 1b is disposed on the second bus bar 602 or the second sub-bonding member 1012, so that the first sub-bonding member 1011 of the second bonding assembly 1b can also form a seal on the side surface of the electrochromic layer 3. One end of the second sub-bonding member 1012 of the second bonding assembly 1b forms the other end of the second bonding assembly 1b and is disposed on the peripheral edge of the first conductive base layer 2 on the side close to the electrochromic layer 3, so that the second bonding assembly 1b can be stably connected to the electrochromic device 1000.

[0102] And here, the specific connection relationship between the first sub-bonding member 1011 and the second sub-bonding member 1012 is not limited. The first sub-bonding member 1011 can be connected to the second sub-bonding member 1012, or the first sub-bonding member 1011 may not be connected to the second sub-bonding member 1012.

[0103] In some embodiments, referring to Figure 2 , along the first direction X, one end of the first sub-bonding member 1011 is connected and covers the bus bar 6, and one end of the second sub-bonding member 1012 is stacked and covers the first sub-bonding member 1011.

[0104] Or, referring to Figure 6 , the first sub-bonding member 1011 is connected and covers the first bus bar 601, and one end of the first sub-bonding member 1011 is stacked and covers the second sub-bonding member 1012.

[0105] By laminating and connecting between the first sub - adhesive member 1011 and the second sub - adhesive member 1012, a firm connection is maintained between the first sub - adhesive member 1011 and the second sub - adhesive member 1012, which can improve the connection stability of the colloid and preferably avoid the detachment of the adhesive assembly 1 from the electrochromic device 1000.

[0106] In some embodiments, referring to Figure 7 , along the first direction X, the first sub - adhesive member 1011 and the second sub - adhesive member 1012 are each connected and cover the bus bar 6, and there is a gap between them. This enables them not to interfere with each other when connecting to the electrochromic device 1000, making it more convenient to set up the adhesive assembly 1.

[0107] In some embodiments, referring to Figure 8 , the adhesive assembly 1 further includes a sealant 8. The sealant 8 is disposed on the bus bar 6 and is located between two adjacent sub - adhesive members 101.

[0108] It can be understood that when there is a gap between two adjacent sub - adhesive members 101, in order to improve the connection stability and sealing performance of the adhesive assembly 1, the sealant 8 is disposed at the gap between two adjacent sub - adhesive members 101 to make the connection of the adhesive assembly 1 firm.

[0109] In some embodiments, referring to Figure 12 , the adhesive assembly 1 may further include a third sub - adhesive member 1013. The first sub - adhesive member 1011, the second sub - adhesive member 1012, and the third sub - adhesive member 1013 are sequentially disposed along the first direction X on the peripheral edge of the electrochromic device 1000, and the first sub - adhesive member 1011 and the second sub - adhesive member 1012 are laminated and connected, and the second sub - adhesive member 1012 and the third sub - adhesive member 1013 are laminated and connected, making the connection structure of the adhesive assembly very firm.

[0110] In some embodiments, the adhesive assembly 1 may further include a third sub - adhesive member 1013. The first sub - adhesive member 1011, the second sub - adhesive member 1012, and the third sub - adhesive member 1013 are sequentially disposed along the first direction X on the peripheral edge of the electrochromic device 1000, and the first sub - adhesive member 1011 and the second sub - adhesive member 1012 are laminated and connected, and the second sub - adhesive member 1012 and the third sub - adhesive member 1013 are spaced apart.

[0111] Referring to Figures 2 - 8 , in some embodiments, in the groove 5, the lamination thickness of the adhesive assembly 1 and the bus bar 6 in the lamination direction Y is less than or equal to the lamination thickness of the first conductive base layer 2 and the electrochromic layer 3 in the lamination direction Y; and / or,

[0112] In the groove 5, the stacked thickness of the bonding assembly 1 and the bus bar 6 in the stacking direction Y is less than or equal to the stacked thickness of the second conductive base layer 4 and the electrochromic layer 3 in the stacking direction Y.

[0113] Specifically, in the first groove 501, the stacked thickness of the first bonding assembly 1a and the first inner bus bar 6011 in the stacking direction Y is less than or equal to the stacked thickness of the first conductive base layer 2 and the electrochromic layer 3 in the stacking direction Y, so that the overall first bonding assembly 1a and the first inner bus bar 6011 are not higher than the first conductive base layer 2 in the stacking direction Y.

[0114] Here, the stacked thickness of the first bonding assembly 1a and the first inner bus bar 6011 can be the stacked thickness of one of the sub-bonding parts 101 and the first inner bus bar 6011; it can also be the stacked thickness of two stacked sub-bonding parts 101 and the first inner bus bar 6011, which is not limited here and is referred to the maximum thickness.

[0115] Since subsequent pressing operations need to be performed on the electrochromic device, the overall first bonding assembly 1a and the first inner bus bar 6011 are not higher than the first conductive base layer 2 in the stacking direction Y, which can ensure that the stress on the stacked part of the first bonding assembly 1a and the first inner bus bar 6011 is not too high, avoiding damage or detachment of the first bonding assembly 1a or the first inner bus bar 6011 when the stress here is too large, and improving the structural stability of the stacked part.

[0116] It can be understood that at the second groove 502, the stacked thickness of the second bonding assembly 1b and the second inner bus bar 6021 in the stacking direction Y is less than or equal to the stacked thickness of the second conductive base layer 4 and the electrochromic layer 3 in the stacking direction Y, so that the overall second bonding assembly 1b and the second inner bus bar 6021 are also not higher than the second conductive base layer 4 in the stacking direction Y, avoiding damage or detachment of the second bonding assembly 1b or the second inner bus bar 6021 when the stress here is too large, and improving the structural stability of the stacked part.

[0117] Reference Figure 14 Accordingly, a second aspect of the present application provides an electrochromic device. An electrochromic device 2000 provided in the second aspect of the embodiments of the present application includes a substrate 2001, and the substrate 2001 is disposed on a side of the first conductive base layer 2 away from the electrochromic layer 3; and / or, the substrate 2001 is disposed on a side of the second conductive base layer 4 away from the electrochromic layer 3.

[0118] Specifically, substrates 2001 are provided on both sides of the electrochromic device 1000 in the stacking direction Y, and the substrates 2001 are bonded to both sides of the electrochromic device 1000 in the stacking direction Y through a substrate bonding layer 2002; the substrate 2001 has light transmittance, and is preferably glass.

[0119] The third aspect of the present application provides an electrochromic product, including the above-mentioned electrochromic device 1000 or electrochromic device 2000.

[0120] Among them, the electrochromic product includes any one of a rearview mirror, a curtain wall, a car sunroof, a car side window, a car windshield, a housing of an electronic product, glasses, a vehicle, and a display panel.

[0121] The above are only the preferred embodiments of the present application, and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electrochromic device, characterized in that, Comprising: A first conductive substrate layer, an electrochromic layer, and a second conductive substrate layer that are sequentially stacked; Bus bars disposed at the peripheral edges of at least one of the first conductive substrate layer and the second conductive substrate layer; An adhesive assembly disposed at the peripheral edges of at least one of the first conductive substrate layer and the second conductive substrate layer and at least partially covering the bus bars; wherein, The adhesive assembly includes at least two sub - adhesive members, and along a first direction, the at least two sub - adhesive members are sequentially arranged on the peripheral edges of at least one of the first conductive substrate layer and the second conductive substrate layer; the first direction is perpendicular to the stacking direction of the first conductive substrate layer, the electrochromic layer, and the second conductive substrate layer.

2. The electrochromic device according to claim 1, characterized in that, Further comprising: A groove disposed at the peripheral edge of the electrochromic device, the groove penetrating through the first conductive substrate layer and the electrochromic layer along the stacking direction, and / or the groove penetrating through the second conductive substrate layer and the electrochromic layer along the stacking direction; At least part of the bus bar is disposed at the peripheral edge of the second conductive substrate layer on the side close to the electrochromic layer through the groove, and / or at least part of the bus bar is disposed at the peripheral edge of the first conductive substrate layer on the side close to the electrochromic layer through the groove.

3. The electrochromic device according to claim 2, characterized in that, Along the first direction, one end of at least part of the adhesive assembly is disposed on the peripheral edge of the first conductive substrate layer far from the electrochromic layer, and the other end of at least part of the adhesive assembly is disposed on the peripheral edge of the second conductive substrate layer on the side close to the electrochromic layer; and / or, Along the first direction, one end of at least part of the adhesive assembly is disposed on the peripheral edge of the second conductive substrate layer far from the electrochromic layer, and the other end of at least part of the adhesive assembly is disposed on the peripheral edge of the first conductive substrate layer on the side close to the electrochromic layer.

4. The electrochromic device according to claim 2 or 3, characterized in that, At least part of the bus bar is disposed on the peripheral edge of the first conductive substrate layer on the side far from the electrochromic layer, and / or at least part of the bus bar is disposed on the peripheral edge of the second conductive substrate layer on the side far from the electrochromic layer.

5. The electrochromic device according to claim 4, characterized in that, Along the first direction, both ends of at least part of the adhesive assembly are disposed on the first conductive substrate layer, and / or both ends of at least part of the adhesive assembly are disposed on the second conductive substrate layer.

6. The electrochromic device according to claim 2 or 3, characterized in that, Further comprising a barrier portion, the barrier portion is disposed on at least one of the first conductive substrate layer and the second conductive substrate layer, along the first direction, the barrier portion is located between the electrochromic layer and the bus bar, and the adhesive assembly also at least partially covers the barrier portion.

7. The electrochromic device according to claim 1, wherein, The bus bar includes a first bus bar and a second bus bar, and the adhesive assembly includes a first adhesive assembly and a second adhesive assembly, wherein, The first adhesive assembly at least partially covers the first bus bar, the second adhesive assembly at least partially covers the second bus bar, and, Along the first direction, one end of the first adhesive assembly is connected to one end of the second adhesive assembly.

8. The electrochromic device according to claim 1, characterized in that, The bonding assembly includes a first sub-bonding member and a second sub-bonding member arranged adjacent to each other, wherein, Along the first direction, one end of the first sub-bonding member is disposed on the peripheral edge of the first conductive base layer away from the electrochromic layer or on the peripheral edge of the second conductive base layer away from the electrochromic layer, and the other end of the first sub-bonding member is disposed on the bus bar or on the second sub-bonding member; Along the first direction, one end of the second sub-bonding member is disposed on the bus bar or on the first sub-bonding member, and the other end of the second sub-bonding member is disposed on the peripheral edge of the second conductive base layer close to the electrochromic layer or on the peripheral edge of the first conductive base layer close to the electrochromic layer.

9. The electrochromic device according to claim 2, characterized in that, In the groove, the stacked thickness of the bonding assembly and the bus bar in the stacking direction is less than or equal to the stacked thickness of the first conductive base layer and the electrochromic layer in the stacking direction; and / or, In the groove, the stacked thickness of the bonding assembly and the bus bar in the stacking direction is less than or equal to the stacked thickness of the second conductive base layer and the electrochromic layer in the stacking direction.

10. The electrochromic device according to claim 1, characterized in that, The bonding assembly further includes a sealant, and the sealant is disposed on the bus bar and located between two adjacent sub-bonding members.

11. An electrochromic device, characterized in that, It includes a substrate and the electrochromic device according to any one of claims 1-10, and the substrate is disposed on the side of the first conductive base layer facing away from the electrochromic layer; and / or, the substrate is disposed on the side of the second conductive base layer facing away from the electrochromic layer.

12. An electrochromic product, characterized in that, It includes the electrochromic device according to any one of claims 1-10 or the electrochromic device according to claim 11, wherein the electrochromic product includes any one of a rearview mirror, a curtain wall, a car sunroof, a car side window, a car windshield, a housing of an electronic product, glasses, a vehicle, and a display panel.

Citation Information

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