Method for manufacturing package carrier
By combining the adhesive material of two metal sheets to form a circuit substrate board, the problems of high cost and low production capacity in the manufacturing of coreless packaging load plates are solved, and a single-layer circuit packaging load plate is achieved at low cost and efficient production.
Patent Information
- Application Number
- CN202311839351.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2025-07-01
AI Technical Summary
In the existing coreless packaging load plate manufacturing methods, high-cost load plates are required, and only one packaging load plate can be produced at a time, resulting in high production costs and low production capacity.
Two metal sheets are used to form a circuit substrate plate by adhesion and bonding of adhesive materials, and patterned development, etching and RCC film compression are carried out to form a packaging loading plate with a single layer of circuit, avoiding the use of a bearing plate, and producing two packaging loading plates at the same time.
It reduces production costs, improves production efficiency and capacity, and simplifies the manufacturing process and improves production stability and efficiency.
Smart Images
Figure CN120237007A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for manufacturing a packaging substrate, and particularly to a method for simultaneously manufacturing two packaging substrates each having a single-layer circuit. Background Art
[0002] The main function of a packaging substrate is to achieve electrical interconnection between the external circuits of integrated circuit chips and electronic components. Packaging substrates can be divided into nucleated packaging substrates and non-nucleated packaging substrates according to different manufacturing methods.
[0003] A nucleated packaging substrate can be mainly divided into a core board in the middle part and build-up boards in the upper and lower parts in terms of structure. The manufacturing method of a nucleated packaging substrate is through a printed circuit board technology with high-density connection.
[0004] A non-nucleated packaging substrate, compared with a nucleated packaging substrate, removes the use of the core board in the middle part. The manufacturing method of the new non-nucleated packaging substrate mainly uses an electroplating deposition method from bottom to top to produce the copper pillar conductive structure between the layers of the substrate.
[0005] Since a non-nucleated packaging substrate does not use a core board, a carrier with a relatively rigid material is usually used to carry out subsequent electroplating deposition processes and insulating layer processes at the beginning of manufacturing. The internal build-up circuit interconnection structure of a non-nucleated packaging substrate mainly includes copper pillars and circuits. The technical feature of the manufacturing method of a non-nucleated packaging substrate is mainly to deposit copper metal from bottom to top on a carrier with a relatively rigid material according to the planned circuit pattern through electroplating deposition technology to form the interconnection structure in the packaging substrate, such as copper pillars and circuits. Since the copper pillars obtained by this method are solid copper metal column structures, the electrical transmission performance is better.
[0006] After the circuit build-up of the packaging substrate is completed, the carrier must be removed to obtain a packaging substrate.
[0007] Since the carrier is used to carry out build-up generation during the manufacturing process of the packaging substrate, it is inevitably necessary to use a carrier for production in general known manufacturing methods. However, the cost of the carrier is very high. If it is possible to avoid using a carrier for production, it is undoubtedly a great progress in terms of production cost. Summary of the Invention
[0008] In view of the above problems and their root causes, the object of the present invention is to provide a manufacturing method of a packaging carrier without using a carrier plate, especially a packaging carrier for Quad Flat No-lead Package (QFN). The present invention utilizes two metal sheets adhered to each other with an adhesive material to form a circuit substrate plate with sufficient rigidity. Since the price of the adhesive material is much lower than that of the carrier plate, the use cost of the carrier plate is eliminated. Then, subsequent manufacturing processes such as patterning development, etching, and RCC lamination (Resin Coated Copper) are carried out on this circuit substrate plate to form a packaging carrier with a single-layer circuit.
[0009] In addition, a manufacturing method of a packaging carrier of the present invention uses two metal sheets adhered to each other with an adhesive material as the circuit substrate plate to manufacture the packaging carrier. Therefore, the biggest difference between the manufacturing method of the present invention and the generally known methods is that, in addition to saving costs by not using a carrier plate, more importantly, the manufacturing method of the present invention processes two metal sheets simultaneously. Therefore, two packaging carriers can be produced simultaneously by this manufacturing method. Compared with the known manufacturing method that can only produce one packaging carrier at a time, the production capacity can be greatly improved.
[0010] The present invention provides a method for manufacturing a packaging substrate, comprising: providing a circuit substrate plate formed by bonding two metal plates together with an adhesive material; performing a first developing process to form a patterned first protective layer on the outer surfaces of the two metal plates; performing a first etching process to etch and remove a part of the metal material in the regions of the two metal plates that are not covered by the first protective layer, thereby forming a plurality of first openings; performing a second etching process to etch and remove the first protective layer, thereby exposing the surfaces of the two metal plates; performing a lamination process to perform lamination (RCC lamination) on the two metal plates with an insulating film material having a metal surface on one side surface, and filling each first opening with the insulating film material; performing a second developing process to form a patterned second protective layer on the metal surface of each insulating film material; performing a third etching process to etch and remove the metal material on the metal surface in the regions of each insulating film material that are not covered by the second protective layer, wherein the metal surface covered by the second protective layer further serves as a patterned third protective layer; performing a fourth etching process to etch and remove the second protective layer and a part of the insulating film material, thereby exposing the third protective layer and the second surfaces of the two metal plates corresponding to positions outside the plurality of first openings; performing a fifth etching process to etch and remove the third protective layer; performing a debonding process to separate the two metal plates from the adhesive material, thereby obtaining two semi-finished packaging substrates; performing a third developing process to form a patterned fourth protective layer on the flat side surface of the metal plate of the semi-finished packaging substrate; performing a surface treatment process to form a patterned surface treatment layer on the surface of the metal plate in the region not covered by the fourth protective layer; performing a sixth etching process to etch and remove the fourth protective layer, thereby exposing the metal surface of the metal plate in the region not covered by the surface treatment layer; performing a seventh etching process to etch and remove the metal material of the metal plate in the region not covered by the surface treatment layer, thereby forming a plurality of second openings communicating with the plurality of first openings, so as to obtain a packaging substrate with a single-layer circuit.
[0011] In an embodiment of a method for manufacturing a packaging substrate according to the present invention, the material of the first protective layer, the second protective layer or the fourth protective layer is a dry film, a photosensitive resin composition or a photosensitive resin film.
[0012] In an embodiment of a method for manufacturing a packaging substrate according to the present invention, the debonding process further includes performing a high-temperature baking or low-temperature baking process before separating the two metal plates from the adhesive material.
[0013] In an embodiment of a method for manufacturing a packaging substrate according to the present invention, the material of the surface treatment layer is a non-copper metal. In another preferred embodiment, the material of the surface treatment layer is nickel, palladium, platinum, gold or a combination thereof, or an alloy thereof. Brief Description of the Drawings
[0014] Figures 1 to 8 Schematic cross-sectional views of the structures of the respective steps in a method for manufacturing a packaging carrier of the present invention in sequence.
[0015] Figure 1 Schematic cross-sectional view of the structure of a circuit substrate in a method for manufacturing a packaging carrier of the present invention.
[0016] Figure 2 Schematic cross-sectional view of the structure after performing a first development process and a first etching process in a method for manufacturing a packaging carrier of the present invention.
[0017] Figure 3 Schematic cross-sectional view of the structure after performing a film laminating process in a method for manufacturing a packaging carrier of the present invention.
[0018] Figure 4 Schematic cross-sectional view of the structure after performing a second development process in a method for manufacturing a packaging carrier of the present invention.
[0019] Figure 5 Schematic cross-sectional view of the structure after performing a second etching process in a method for manufacturing a packaging carrier of the present invention.
[0020] Figure 6 Schematic cross-sectional views of the structures of two semi-finished packaging carriers obtained after performing a board separation process in a method for manufacturing a packaging carrier of the present invention.
[0021] Figure 7 Schematic cross-sectional view of the structure after performing a third development process and a surface treatment process in a method for manufacturing a packaging carrier of the present invention.
[0022] Figure 8 Schematic cross-sectional view of the structure of the packaging carrier obtained after performing a third etching process in a method for manufacturing a packaging carrier of the present invention.
[0023] Figure 9 Schematic diagram of an embodiment of applying a packaging carrier of the present invention to semiconductor packaging.
[0024] Description of the reference numerals in the drawings: 10: metal plate; 11: first surface; 12: second surface; 20: adhesive material; 30: first protective layer; 31: first opening; 40: insulating film layer; 41: second protective layer; 42: third protective layer; 60: fourth protective layer; 70: surface treatment layer; 80: second opening; 100: circuit substrate; A10: semi-finished packaging carrier; B10: packaging carrier; M: metal surface; S100 - S800: process flow. Detailed Description of the Invention
[0025] Hereinafter, with reference to the relevant drawings, an embodiment of a method for manufacturing a packaging substrate of the present invention will be described. For the sake of clarity and convenience of illustration, the components in the drawings may be presented with exaggeration or reduction in size and proportion. For ease of understanding, the same elements or steps in the following embodiments are denoted by the same reference numerals.
[0026] Please refer to Figures 1 to 8 , which is a cross-sectional schematic diagram of the structure of each step in a method for manufacturing a packaging substrate of the present invention. A method for manufacturing a packaging substrate of the present invention at least includes the following steps: Step S100: Provide a circuit base plate 100; Step S200: Perform a first developing process and a first etching process to form a plurality of first openings; Step S300: Perform a lamination process to fill each first opening with RCC lamination to make the insulating material; Step S400: Perform a second developing process and a third etching process to remove a part of the metal surface on the RCC lamination; Step S500: Perform a fourth etching process and a fifth etching process to remove a part of the insulating material and all of the metal surface of the RCC lamination; Step S600: Perform a board splitting process to form two semi-finished packaging substrates; Step S700: Perform a third developing process and a surface treatment process to form a fourth protective layer and a surface treatment layer; and Step S800: Perform a sixth etching process and a seventh etching process to form a plurality of second openings communicating with the plurality of first openings, thereby obtaining a packaging substrate with a single-layer circuit manufactured according to the manufacturing method of the present invention.
[0027] The detailed description is as follows. First, please refer to Figure 1 , in a method for manufacturing a packaging substrate of the present invention, Step S100 (as shown in Figure 1 ): Provide a circuit base plate 100 as the starting piece for manufacturing the packaging substrate to start manufacturing the packaging substrate, and its structure is as shown in Figure 1 . The circuit base plate 100 includes two metal plates 10 (for example, copper metal plates), and an adhesive material 20. Both of the two metal plates have opposite first surfaces 11 and second surfaces 12, and the adhesive material 20 is disposed between the two metal plates 10 and adhesively bonded to each of the first surfaces 11 of the two metal plates 10. In other words, from Figure 1As can be seen from the structure shown, this circuit substrate 100 is a multi-layer structure formed by adhesively bonding two pieces of the metal plate 10 to be processed. By adhesively bonding the two metal plates 10 with an inexpensive adhesive 20, the formed circuit substrate 100 has considerable rigidity, so that it will not be deformed even when the manufacturing process of the package substrate is carried out without using a carrier plate, and the usage cost of the carrier plate can be saved. In addition, by simultaneously performing the manufacturing process on the two metal plates 10 of the circuit substrate 100, two package substrates can be produced at one time. Compared with the existing manufacturing method of producing one piece at a time and having to use a carrier plate, the manufacturing method of the package substrate of the present invention can greatly improve the production capacity and reduce the cost.
[0028] Next, please refer to Figure 2 . In a manufacturing method of a package substrate of the present invention, step S200 (as shown in Figure 2 ) includes implementing a first development process, implementing a first etching process, and implementing a second etching process. Implementing the first development process includes: forming a patterned first protective layer 30 on each second surface 12 of the two metal plates 10 of the circuit substrate 100. Next, implementing the first etching process includes: etching to remove the metal material (such as copper metal) at the portions on each second surface 12 of the two metal plates 10 that are not covered by the first protective layer 30 to form a plurality of first openings 31. Next, implementing the second etching process includes: etching to remove the first protective layer 30 to expose each second surface 12 of the two metal plates 10.
[0029] In an embodiment of a manufacturing method of a package substrate of the present invention, the material of the above-mentioned first protective layer 30 is a dry film, a photosensitive resin composition, or a photosensitive resin film.
[0030] Next, please refer to Figure 3 . In a manufacturing method of a package substrate of the present invention, step S300 (as shown in Figure 3As shown in the figure: The film pressing process is implemented, including: on each second surface 12 of the two metal plates 10, a film pressing (RCC film pressing) is performed with an insulating film material having a metal surface on one side surface layer to form an insulating film layer 40 on each second surface. The outer surface layer of the insulating film layer 40 has a metal surface M, and the insulating film layer 40 covers each second surface 12 and fills each first opening 31. Among them, the composition of the insulating material is a dielectric material, such as ABF (Ajinomoto Build-up Film), photosensitive resin, polyimide (abbreviated as PI), bismaleimide triazine (abbreviated as BT), prepreg (abbreviated as PP) of FR5, molding compound, epoxy molding compound (abbreviated as EMC), or other suitable materials.
[0031] Next, please refer to Figure 4 . In a manufacturing method of a packaging substrate of the present invention, step S400 (as shown in Figure 4 ): Implement the second developing process, including: forming a patterned second protective layer 41 on the metal surface M of each insulating film layer 40. Among them, the area where each second protective layer 41 covers each insulating film layer 40 corresponds to each first opening 31. In this step, the purpose of forming the patterned second protective layer 41 is to only retain the insulating film layer 40 and its metal surface M relatively located in the area of each first opening 31, and remove the metal surface M in other areas not covered by the second protective layer 41. Therefore, by forming the patterned second protective layer 41, the second protective layer 41 is formed on the insulating film layer 40 in the area of each first opening 31, thereby protecting the insulating film layer 40 and its metal surface M in this area from being removed in the subsequent etching process. Then, implement the third etching process, including: etching to remove the metal material of the metal surface M in the area of each insulating film layer 40 not covered by the second protective layer 41 to expose the insulating surface of the insulating film layer 40 at the corresponding position, where the metal surface M covered by the second protective layer 41 further serves as a patterned third protective layer 42.
[0032] In an embodiment of a manufacturing method of a packaging substrate of the present invention, the material of the second protective layer 41 described above is a dry film, a photosensitive resin composition, or a photosensitive resin film.
[0033] Next, please refer to Figure 5 . In a manufacturing method of a packaging substrate of the present invention, step S500 (as shown in Figure 5As shown in the figure, it includes: implementing a fourth etching process, including: etching to remove the insulating surfaces of the second protective layer 41 and the insulating film layer 40 that are exposed (i.e., the areas not covered by the third protective layer 42), so as to expose the third protective layer 42 and the second surfaces 12 of the two metal plates 10 corresponding to the positions of the plurality of first openings 31. Then, implement a fifth etching process, including: etching to remove the third protective layer 42 to expose the insulating surface of the insulating film layer 40 at the corresponding positions originally covered by the third protective layer 42, wherein a small amount of the plurality of exposed second surfaces 12 will also be etched away, but it does not affect the overall structural integrity.
[0034] In an embodiment of the manufacturing method of a packaging substrate of the present invention, the material of the above-mentioned third protective layer 42 is copper metal.
[0035] Next, please refer to Figure 6 . In a manufacturing method of a packaging substrate of the present invention, step S600 (as shown in Figure 6 ): Implement a board separation process, including: separating the two metal plates 10 from the adhesive material 20 to obtain two semi-finished packaging substrates A10. That is to say, after the above steps, a plurality of first openings 31 have been formed on the respective second surfaces 12 of the two metal plates 10 of the circuit substrate 100, and the insulating film layer 40 covers and fills each first opening 31. As shown in Figure 6 : The area where the insulating film layer 40 covers the first opening 31 is larger than the first opening 31. After the board separation process of step S600, two semi-finished packaging substrates A10 can be obtained. As shown in Figure 6 : For the semi-finished packaging substrate A10, its first surface 11 is a completely unprocessed metal surface. That is to say, in the manufacturing method of a packaging substrate of the present invention, the two second surfaces 12 of the two metal plates 10 are processed together first. After the process is completed, the two metal plates 10 are separated, and then the first surfaces 11 of the two metal plates 10 are processed.
[0036] The board separation process in step S600 further includes performing a high-temperature baking or low-temperature baking step before separating the two metal plates 10 from the adhesive material 20. It should be understood that the baking temperature selected in this embodiment is related to the adhesive material 20 used. Those with ordinary knowledge in the technical field of the present invention can select the baking temperature according to the selected adhesive material 20 to make it easy to separate the two metal plates 10 from the adhesive material 20, which will not be elaborated here.
[0037] Next, please refer to Figure 7 . In a manufacturing method of a packaging substrate of the present invention, step S700 (as shown in Figure 7As shown in the figure, it includes implementing a third developing process and a surface treatment process. Implementing the third developing process includes: forming a patterned fourth protective layer 60 on the plurality of exposed first surfaces 11, and the area of the fourth protective layer 60 covering the first surface 11 corresponds to each of the first openings 31 on the second surface 12. Implementing the surface treatment process includes: forming a patterned surface treatment layer 70 on the exposed metal surface areas of the first surface 11 and the second surface 12, wherein the composition of the surface treatment layer 70 is a non-copper metal (such as nickel, palladium, platinum, gold or a combination thereof, or an alloy thereof). Further explanation, the main purpose of step S700 is to enable subsequent processes to form a plurality of second openings 80 (such as Figure 8 as shown in the figure) on the first surface 11 of the metal plate 10 (such as a copper metal). Therefore, in step S700, first use the third developing process to form a fourth protective layer 60 on the first surface 11 corresponding to the position of the first opening 31 on the second surface 12. Then, form a surface treatment layer 70 on the metal surfaces not covered by the fourth protective layer 60 (including the first surface 11 and the second surface 12). It should be understood that the composition of the surface treatment layer is different from the material of the metal plate 10, so the surface treatment layer 70 will not be removed simultaneously when part of the material of the metal plate 10 is etched away.
[0038] In an embodiment of the manufacturing method of a packaging substrate of the present invention, the material of the fourth protective layer 60 is a dry film, a photosensitive resin composition or a photosensitive resin film.
[0039] Next, please refer to Figure 8 . In a manufacturing method of a packaging substrate of the present invention, step S800 (such as Figure 8 as shown in the figure): Implement a sixth etching process, including: etching to remove the fourth protective layer 60 to expose the metal surface of the first surface 11 of the metal plate 10 not covered by the surface treatment layer 70; then, implement a seventh etching process, including: etching to remove the metal material on the first surface 11 of the metal plate 10 in the area not covered by the surface treatment layer 70 to form a plurality of second openings 80, wherein the bottom of each second opening 80 communicates with the bottom of each first opening 31 at the corresponding position, and the insulating film layer 40 filled in each first opening 31 is exposed at the bottom of each second opening 80 at the corresponding position to obtain a packaging substrate B10 formed by the metal plate 10 with a single-layer circuit.
[0040] Please refer to Figure 9 , which is a schematic diagram of an embodiment of a packaging substrate of the present invention applied to semiconductor packaging. As Figure 9As shown, when the package substrate B10 obtained by the manufacturing method according to the present invention is applied to semiconductor packaging, the wafer to be packaged can be disposed in the die placement area on the first surface 11 of the package substrate B10. Then, the wafer is electrically connected to the single-layer circuit formed by the metal plate 10 through wire bonding. Finally, the whole is encapsulated with an insulating material.
[0041] Of course, any of the above embodiments is only used for illustration and not for limiting the scope of the present invention. Equivalent modifications or changes made according to the manufacturing method of a package substrate described in this embodiment should still be included in the patent scope of the present invention.
[0042] In summary, in the production process of general coreless package substrates, a carrier plate must be used as a support for electroplating copper pillars or building up circuits, and then the carrier plate is removed and discarded when the process is completed. In addition, when using a carrier plate to produce a package substrate in the general way, not only the carrier plate is needed, but only one piece can be produced at a time. The present invention provides a manufacturing method of a package substrate, which uses two metal plates adhered together with an inexpensive adhesive material to form a circuit substrate with sufficient rigidity for production. It can not only save the cost of using the carrier plate and the subsequent treatment cost of discarding the carrier plate, but also simultaneously perform a synchronous production process for two metal plates at a time, and use well-developed processes such as development and etching to manufacture a package substrate with a single-layer circuit. Generally speaking, the manufacturing method of a package substrate proposed by the present invention can not only greatly improve production capacity and reduce production costs, but also the process technology is more mature and stable. Compared with the existing methods, the manufacturing method of a package substrate of the present invention has significant advantages.
[0043] It can be seen that the present invention has indeed achieved the desired enhanced effect under the breakthrough of the prior art, and it is not easily conceived by those of ordinary skill in the art.
[0044] The above is only illustrative and not restrictive. Any other equivalent modifications or changes without departing from the spirit and scope of the present invention should be included in the appended claims.
Claims
1. A manufacturing method of a packaging substrate, characterized in that: Comprising: Providing a circuit substrate board, which includes two metal plates and an adhesive. Each of the two metal plates has a relative first surface and a second surface, and the adhesive is disposed between the two metal plates and adhesively bonded to each of the first surfaces of the two metal plates; Implementing a first developing process, including: forming a patterned first protective layer on each of the second surfaces of the two metal plates; Implementing a first etching process, including: etching to remove the metal material at the portions on each of the second surfaces of the two metal plates that are not covered by the first protective layer to form a plurality of first openings; Implementing a second etching process, including: etching to remove the first protective layer to expose each of the second surfaces of the two metal plates; Implementing a laminating process, including: laminating on each of the second surfaces of the two metal plates with an insulating film material having a metal surface on one side surface layer to form an insulating film layer on each of the second surfaces. The outer surface layer of the insulating film layer has a metal surface, and the insulating film layer covers each of the second surfaces and fills each of the first openings; Implementing a second developing process, including: forming a patterned second protective layer on the metal surface of each of the insulating film layers, wherein the area of each of the second protective layers covering the metal surface of each of the insulating film layers corresponds to each of the first openings; Implementing a third etching process, including: etching to remove the metal material on the metal surface of the area on each of the insulating film layers that is not covered by the second protective layer to expose the insulating surface of the insulating film layer at the corresponding position, wherein the metal surface covered by the second protective layer serves as a patterned third protective layer; Implementing a fourth etching process, including: etching to remove the second protective layer and the exposed insulating surface of the insulating film layer to expose the third protective layer and the second surfaces of the two metal plates corresponding to the positions outside each of the first openings; Implementing a fifth etching process, including: etching to remove the third protective layer to expose the insulating surface of the insulating film layer at the corresponding position that was originally covered by the third protective layer; Implementing a board separation process, including: separating the two metal plates from the adhesive to obtain two semi-finished packaging carrier boards; Implementing a third developing process, including: forming a patterned fourth protective layer on the first surface of the metal plate of the semi-finished packaging carrier board, and the area of the fourth protective layer covering the first surface corresponds to each of the first openings on the second surface; Implementing a surface treatment process, including: forming a patterned surface treatment layer on the exposed metal surface areas of the first surface and the second surface; Implementing a sixth etching process, including: etching to remove the fourth protective layer to expose the metal surface of the first surface of the metal plate that is not covered by the surface treatment layer; and Implement a seventh etching process, including: etching to remove the metal material on the first surface of the metal plate in the area not covered by the surface treatment layer to form a plurality of second openings, wherein the bottom of each second opening communicates with the bottom of each first opening at the corresponding position, and the insulating film layer filled in each first opening is exposed at the bottom of each second opening at the corresponding position to obtain a package substrate.
2. The manufacturing method of the encapsulation carrier board according to claim 1, characterized in that, The composition of the first protective layer, the second protective layer or the fourth protective layer is a dry film, a photosensitive resin composition or a photosensitive resin film.
3. The manufacturing method of the encapsulation carrier board according to claim 1, characterized in that, The composition of the third protective layer is copper metal.
4. The manufacturing method of the encapsulation carrier board according to claim 1, characterized in that, The board separation process further includes performing a high-temperature baking or a low-temperature baking process before separating the two metal plates from the adhesive material.
5. The manufacturing method of the encapsulation carrier board according to claim 1, characterized in that, The composition of the surface treatment layer is nickel, palladium, platinum, gold or a combination thereof, or an alloy thereof.