Edge cleaning device and edge cleaning method

Abstract

The invention provides an edge cleaning device, which is used for carrying out edge cleaning on a square substrate, and comprises: a nozzle suitable for spraying a chemical liquid to clean the edge of the substrate; the bearing table is used for bearing the substrate and driving the substrate to rotate; and the edge cleaning device is configured to control the spray head to move along the edge of the base plate through telescopic motion when the base plate rotates, so that a liquid contact point of the chemical liquid is always kept on an edge cleaning line with a preset width, and the edge cleaning width of the edge of the base plate is uniform.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and relates to an edge cleaning device and an edge cleaning method for substrates such as semiconductor wafers or FPDs (flat panel displays). Background Art

[0002] Generally, in the manufacturing process of semiconductor equipment, the photoresist coating of the semiconductor wafer (hereinafter referred to as the substrate) is formed by a spin coating process. Therefore, in the process of coating the photoresist on the surface of the substrate, the centrifugal force of the rotating substrate will cause the photoresist on the substrate to flow to the edge and back of the substrate during spin coating and form ridges.

[0003] In the substrate electroplating process, the plating solution forms a metal film on the surface of the substrate by spin plating, but the plating solution will gradually move to the edge of the substrate under the action of centrifugal force and form a ridge.

[0004] In order to overcome the above problems, an edge bead removal (EBR) process is required to clean the edge of the substrate as much as possible. The substrate edge cleaning process uses a nozzle to spray a solvent on the edge of the substrate to remove defects generated on the edge and back of the substrate.

[0005] Therefore, providing a method for controlling the edge washing width to make the edge washing width of the substrate edge uniform and improve the product yield has become one of the technical problems that technical personnel in this field need to solve urgently.

[0006] Therefore, in view of the problems existing in the prior art, the designers of this case, relying on their many years of experience in this industry, actively researched and improved, and thus came up with the edge cleaning device and edge cleaning method of the substrate of the present invention. Summary of the invention

[0007] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a substrate edge cleaning device and an edge cleaning method, so as to solve the problem of uneven edge cleaning width of the substrate edge in the prior art.

[0008] To achieve the above-mentioned purpose and other related purposes, the present application provides an edge cleaning device for cleaning the edge of a square substrate, comprising:

[0009] A spray head, the spray head being adapted to spray a chemical liquid to clean an edge of a substrate;

[0010] A carrying platform, used for carrying the substrate and rotating with the substrate;

[0011] The edge cleaning device is configured to control the nozzle to move along the edge of the substrate through telescopic motion when the substrate rotates, so that the landing point of the chemical liquid is always maintained on the edge cleaning line of a preset width.

[0012] Optionally, the front and back surfaces of the substrate are both provided with the spray heads, which are respectively used to clean the edges of the front and back surfaces of the substrate.

[0013] Optionally, it is further configured to compensate for the position of the spray head according to the difference between the sampling value of the edge cleaning width sampling point and the preset width during the rotation of the substrate.

[0014] Optionally, it further includes a control module and an angle tracking module. The angle tracking module is used to track the rotation angle of the substrate, and the control module is used to control the movement of the spray head according to the tracking information of the angle tracking module.

[0015] Optionally, the control module controls the movement of the spray head according to the tracking information of the angle tracking module, including:

[0016] Obtaining the relationship between the substrate rotation angle and the spray head telescopic amount according to the change in the position of the intersection point of the spray head and the edge cleaning line when the substrate rotation angle changes;

[0017] Controlling the movement of the spray head along the edge of the substrate according to the rotation angle of the substrate tracked by the angle tracking module and in combination with the relationship between the substrate rotation angle and the spray head telescopic amount.

[0018] Optionally, the control module is used to control the movement of the spray head according to the tracking information of the angle tracking module, including:

[0019] Obtaining the relationship between the substrate rotation angle and the spray head telescopic amount according to the change in the position of the intersection point of the spray head and the edge cleaning line when the substrate rotation angle changes;

[0020] Taking the derivative of the spray head telescopic amount to obtain the relationship between the substrate rotation time and the spray head movement speed;

[0021] Controlling the movement of the spray head according to the substrate rotation time obtained from the rotation angle of the substrate tracked by the angle tracking module and in combination with the relationship between the substrate rotation time and the spray head movement speed.

[0022] Optionally, the control module is further used to calibrate and adjust the movement position of the spray head according to the change in the position of the intersection point of the spray head and the edge cleaning line when the substrate rotation angle changes.

[0023] Optionally, the edge cleaning device is further configured to, when the spray head moves along a circle of edge cleaning lines of the rotating substrate through telescopic movement, control the spray head to synchronously lift and lower according to the warping amount of the edge cleaning line, so that the height difference between the liquid landing point of the chemical liquid from the spray head on the edge cleaning line and the spray head remains consistent.

[0024] Optionally, the edge cleaning device further includes a detection unit for detecting information related to the warpage amount of the substrate edge.

[0025] Optionally, the detection unit is a camera device or a position sensor.

[0026] Optionally, the camera device is configured to capture an image of the substrate at the same height when the substrate rotates one circle.

[0027] Optionally, the camera device is configured to capture an image of the entire stationary substrate.

[0028] Optionally, the position sensor is configured to measure the distance between the washing line of the substrate and the position sensor at the same height when the substrate rotates one circle.

[0029] Optionally, the edge cleaning device is further configured to obtain the warpage amount of the washing line according to a preset washing width and information related to the warpage amount of the substrate edge.

[0030] Optionally, when the carrier table carries the substrate, the center of the substrate is aligned with the rotation center of the carrier table.

[0031] Optionally, the substrate is square or rectangular.

[0032] To achieve the above and other related purposes, the present invention also provides an edge cleaning method.

[0033] Keep the substrate rotating.

[0034] According to the rotation angle of the substrate, control the nozzle to continuously spray chemical liquid and control the telescopic movement of the nozzle so that the liquid landing point of the chemical liquid always remains on the washing line with a preset width of the substrate.

[0035] Optionally, the step of controlling the movement of the nozzle according to the rotation angle of the substrate includes: controlling the moving position of the nozzle according to the relationship between the rotation angle of the substrate and the telescopic amount of the nozzle to determine the position of the liquid landing point of the chemical liquid.

[0036] Optionally, the calculation method of the relationship between the rotation angle of the substrate and the telescopic amount of the nozzle includes:

[0037] According to the position change of the intersection point of the nozzle and the washing line when the rotation angle of the substrate changes, obtain the relationship between the rotation angle of the substrate and the telescopic amount of the nozzle.

[0038] Optionally, it further includes controlling the movement of the telescopic nozzle according to the difference between the sampling value of the washing width and the preset width to compensate the washing width to make the washing width uniform.

[0039] Optionally, the step of controlling the movement of the nozzle according to the rotation angle of the substrate includes:

[0040] Based on the change in the position of the intersection point between the nozzle and the washing line when the rotation angle of the substrate changes, obtain the relationship between the rotation angle of the substrate and the telescopic amount of the nozzle;

[0041] Take the derivative of the telescopic amount of the nozzle to obtain the relationship between the rotation time of the substrate and the movement speed of the nozzle;

[0042] Based on the rotation angle of the substrate tracked by the angle tracking module, obtain the rotation time of the substrate, and control the movement of the nozzle in combination with the relationship between the rotation time of the substrate and the movement speed of the nozzle.

[0043] Optionally, based on the change in the position of the intersection point between the nozzle and the washing line when the rotation angle of the substrate changes, calibrate and adjust the movement position of the nozzle.

[0044] Optionally, during the process of controlling the telescopic movement of the nozzle, the lifting of the nozzle is also synchronously controlled, including:

[0045] Based on the preset washing width of the substrate, obtain the warpage amount of the washing line for one circle of the substrate;

[0046] During the process of the nozzle moving along the washing line of the rotating substrate through telescopic movement, synchronously control the lifting of the nozzle according to the warpage amount of the washing line, so that the height difference between the liquid landing point of the chemical liquid from the nozzle on the washing line and the nozzle remains consistent.

[0047] Optionally, based on the preset washing width of the substrate, and taking images of the substrate rotating one circle at the same height, obtain the warpage amount of the washing line for one circle in the image.

[0048] Optionally, based on the preset washing width of the substrate, and taking images of the substrate rotating one circle at the same height, obtain the warpage amount of the washing line for one circle in the image.

[0049] Optionally, based on the preset washing width of the substrate, and the distance between the washing line detected by the position sensor and the position sensor, obtain the warpage amount of the washing line.

[0050] Optionally, controlling the lifting of the nozzle includes: determining the starting position of the nozzle for washing the edge, and controlling the lifting of the nozzle in combination with the warpage amount difference between the current liquid landing point and the liquid landing point at the starting position.

[0051] Optionally, controlling the lifting of the nozzle in combination with the warpage amount difference between the current liquid landing point and the liquid landing point at the starting position includes: controlling the lifting movement of the nozzle according to the warpage amount difference between the current liquid landing point and the liquid landing point at the starting position, and the rotation speed of the substrate.

[0052] Optionally, spray heads located on the front and back of the substrate are used to clean the edges of the front and back of the substrate respectively.

[0053] Optionally, the edge cleaning method further includes fixing the substrate to a position where the center of the substrate is aligned with the rotation center of the substrate before performing the edge cleaning process on the substrate.

[0054] As described above, in the edge cleaning device and method for a substrate of the present invention, by controlling the movement of the spray head along the rotating edge of the substrate, the chemical liquid sprayed by the spray head has a uniform width for cleaning the edge of the substrate. Description of the Drawings

[0055] Figure 1 It is a schematic structural diagram of an embodiment of the edge cleaning device in the present invention.

[0056] Figure 2 It is a schematic diagram of the edge cleaning of one side of the substrate by the edge cleaning device in the present invention.

[0057] Figure 3 It is a schematic diagram of the edge cleaning of another side of the substrate by the edge cleaning device in the present invention.

[0058] Figure 4 It is a curve graph of sampling the edge cleaning width at the same angular interval in an embodiment of the present invention.

[0059] Figure 5 It is a comparison graph of the position changes of the edges of a warped substrate and a normal substrate in the substrate thickness direction.

[0060] Figure 6 It is a schematic structural diagram of another embodiment of the edge cleaning device in the present invention.

[0061] Figure 7 It is a schematic structural diagram of the edge cleaning part in the present invention.

[0062] Figure 8 It is a schematic diagram of the detection unit in the present invention for detecting the substrate.

[0063] Figure 9 The warpage amount curve graph of the edge cleaning line around the substrate. Detailed Embodiments

[0064] The following uses specific specific examples to illustrate the embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0065] When describing embodiments of the present invention in detail, for ease of explanation, sectional views showing the device structure may be enlarged locally out of the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions of length, width, and depth should be included.

[0066] For convenience of description, spatial relationship terms such as "below", "beneath", "lower", "below", "under", "above", "upper", "on" etc. may be used herein to describe the relationship of one element or feature shown in the drawings with other elements or features. It will be understood that these spatial relationship terms are intended to encompass other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intervening layers. As used herein, "between... and..." means including the endpoint values.

[0067] In the context of the present application, the structure in which the first feature is "above" the second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0068] It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. In actual implementation, the type, quantity, and ratio of each component may be arbitrarily changed, and the component layout type may also be more complex. The following edge cleaning device and edge cleaning method are used for the processing of semiconductor wafers or substrates in the FPD (flat panel display) field. The vertical direction and height direction involved herein are the thickness direction of the substrate, and the horizontal direction is the extending direction of the front or back surface of the substrate, perpendicular to the thickness direction.

[0069] Reference Figure 1 , the edge cleaning device includes at least one edge cleaning part 100 for cleaning the edge of the substrate W, a carrying part 200 for carrying the substrate W and rotating the substrate W, and an angle tracking module 300 for tracking the rotation angle of the substrate W. The substrate W is non-circular, and in some embodiments, the substrate W is square or rectangular. Before cleaning the edge of the substrate W, the substrate is first moved to a position where the center of the substrate is aligned with the rotation center of the carrying part 200, and then the substrate W is fixed to the carrying part 200.

[0070] Reference Figure 1, the edge cleaning device further includes a control module 800, which controls the actions of all functional components of the edge cleaning device (such as the motors, electric cylinders, cylinders and other power units that drive the movement of the edge cleaning part 100, the bearing part 200 and other structural parts, and the chemical liquid supply part). The control module 800 can be one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors or combinations thereof.

[0071] As Figure 1 shown, in some embodiments, the edge cleaning part 100 includes a spray head 110 for spraying chemical liquid to clean the edge of the substrate W. The edge cleaning part 100 further includes a swing arm 130 and a telescopic motion power part 140 for driving the swing arm 130 to expand and contract as a driving structure. The spray head 110 is located at the end of the swing arm 130. The telescopic motion power part 140 drives the swing arm 130 to expand and contract, so that the swing arm 130 drives the spray head 110 to move. Exemplarily, the telescopic motion power part includes a hydraulic cylinder, a cylinder or a motor. That is to say, the telescopic motion power part can be set as a hydraulic cylinder, a cylinder or a motor connected to the swing arm 130. In some embodiments, two edge cleaning parts 100 can be arranged on the front side of the substrate W at relative positions of the substrate W to clean the edge of the substrate W, so as to improve the cleaning efficiency of the edge of the substrate W. It can be understood that at least one edge cleaning part 100 can also be arranged on the back side of the substrate W to clean the edge of the back side of the substrate W. In some embodiments, two edge cleaning parts 100 are arranged at relative positions on the back side of the substrate W to clean the back side of the substrate W simultaneously, so as to improve the cleaning efficiency of the back side of the substrate W. Here, the control module 800 realizes the telescopic control of the spray head 110 located at the end of the swing arm 130 by controlling the expansion and contraction of the swing arm 130. One spray head 110 corresponding to the edge cleaning part 100 is arranged on the front or back side of the substrate for spraying chemical liquid to clean the edge of the substrate W. Each spray head 110 is driven by the corresponding edge cleaning part 100, and each edge cleaning part 100 drives one spray head 110 to move separately.

[0072] The bearing part 200 includes a bearing table 210 for bearing the substrate W, a rotating shaft 220 for driving the bearing table 210 to rotate, and a rotating power part 230 for driving the rotating shaft 220 to rotate. The rotating power part 230 drives the rotating shaft 220 to rotate, and the rotating shaft 220 drives the bearing table 210 and the substrate W to rotate. When the bearing part 200 bears the substrate W, the center of the substrate W is aligned with the rotation center of the bearing part 200, and the substrate W is fixed on the bearing part 200 so that the bearing part 200 can drive the substrate W to rotate synchronously when rotating.

[0073] In some embodiments, a chemical solution is used to remove the photoresist on the edge of the substrate. The chemical solution includes one or more of a stripping solution, N-Methyl pyrrolidone (NMP), hydrochloric acid, nitric acid, hydrofluoric acid, citric acid, oxalic acid, ammonia water, hydrogen peroxide, and tetramethylammonium hydroxide. In other embodiments, the chemical solution is used to clean the edge of the substrate after electroplating, and the chemical solution may include at least one of sulfuric acid (H2SO4) and hydrogen peroxide (H2O2). It can be understood that the nozzle 110 is in communication with the chemical solution supply unit so that the chemical solution in the chemical solution supply unit flows into the nozzle 110.

[0074] The angle tracking module 300 is used to track the rotation angle of the substrate W. Exemplarily, in some embodiments, the angle tracking module 300 includes an angle sensor for tracking the rotation angle of the substrate W; in other embodiments, the angle tracking module 300 is a motor encoder, and the motor 230 drives the substrate W to rotate, and the motor encoder tracks the rotation angle of the substrate W.

[0075] The control module 800 controls the nozzle 110 to move along the edge of the substrate and spray the chemical solution onto the rotating substrate so that the edge cleaning width is always a preset width. The edge cleaning width is the distance from the liquid landing point of the chemical solution sprayed by the nozzle 110 on the substrate surface to the outer edge of the substrate. For example Figure 2 The preset width for cleaning the edge e of the substrate is set to d. The edge e of the substrate has an outer edge e2 and an inner edge e1 that are oppositely arranged, where the inner edge e1 is the edge cleaning line, and the liquid landing point moves along the edge cleaning line e1. Specifically, when the substrate W rotates, the angle tracking module 300 tracks the rotation angle of the substrate, and the control module 800 controls the movement of the nozzle 110 in real time according to the rotation angle of the substrate, in combination with the relationship between the rotation angle of the substrate and the nozzle telescopic amount. The relationship between the rotation angle of the substrate and the nozzle telescopic amount is calculated by the following method:

[0076] First, the position change of the intersection point of the nozzle and the edge cleaning line is calculated by trigonometric functions when the rotation angle of the substrate changes, and the relationship between the rotation angle θ of the substrate and the telescopic amount s1 of the nozzle is obtained. Exemplarily, in one embodiment, as Figure 2 In, the nozzle 110 starts cleaning the edge e of the substrate from the midpoint of the side with length a of the substrate (referred to as side a). The substrate W rotates an angle θ in the clockwise direction. The intersection point of the nozzle 110 and the edge cleaning line (referred to as the intersection point) is calculated by trigonometric functions at the position where the distance length s0 between the intersection point and the center o of the substrate is:

[0077]

[0078] Among them, the length of the other side (referred to as side b) of the substrate W is b, and the lengths a and b of each side of the substrate are the remaining lengths of the edge e of the substrate after being cleaned according to the preset width d.

[0079] Combining the positions of the intersection points before and after the substrate rotation angle θ, the relationship between the substrate rotation angle θ and the telescopic amount s1 of the nozzle 110 is obtained as follows:

[0080]

[0081] Based on the substrate rotation angle, the control module 800 controls the telescopic movement of the nozzle 110 in combination with the relationship between the substrate rotation angle θ and the telescopic amount s1 of the nozzle 110 in the above formula ①, so as to realize the movement of the nozzle 110 along the edge of the substrate from the midpoint of side a to the first vertex angle of the substrate W (that is, the substrate W rotates from the starting position to

[0082] Refer to Figure 3 , when the substrate W continues to rotate and the nozzle 110 cleans the edge of another side b of the substrate from the vertex angle to the midpoint, the change in the length s0 of the intersection point from the center O of the substrate is calculated through trigonometric functions as follows:

[0083]

[0084] Combining the positions of the intersection points before and after the substrate rotation angle θ, the relationship between the substrate rotation angle θ and the telescopic amount s1 of the nozzle 110 is obtained as follows:

[0085]

[0086] The control module 800 controls the telescopic movement of the nozzle 110 according to the relationship between the substrate rotation angle θ and the telescopic amount s1 of the nozzle 110 in the above formula ②, so as to realize the movement of the nozzle 110 along the edge of the substrate from the first vertex angle of the substrate to the midpoint of side b.

[0087] And so on, the angle tracking module 300 tracks the rotation angle of the substrate. At different rotation angles of the substrate, the nozzle 110 moves synchronously along the edge of the substrate and sprays chemical liquid to clean the edge of the substrate. In this embodiment, starting from the midpoint of side a of the substrate as the starting position to clean the edge of the substrate, at different rotation angles of the substrate, the relationship between the substrate rotation angle θ and the telescopic amount s1 of the nozzle is obtained. The piecewise function of the telescopic amount s1 of the nozzle is as follows:

[0088]

[0089] Among them, the above The piecewise function divides the substrate rotation angle θ into segments in a cyclic and sequential manner according to the way that the nozzle moves from the midpoint to the vertex angle and from the vertex angle to the midpoint of the adjacent side.

[0090] In other embodiments, the nozzle 110 can also start cleaning the edge of the substrate from other positions on the substrate, such as starting from any position at the top corner or edge of the substrate. Similarly, the relationship between the substrate rotation angle and the nozzle telescopic amount can also be calculated through trigonometric functions as in the above embodiments, and will not be specifically calculated here. It can be understood that, similar to the above embodiments, the control module 800 controls the movement of the nozzle 110 in real time according to the substrate rotation angle, in combination with the relationship between the substrate rotation angle and the nozzle telescopic amount.

[0091] During the actual edge cleaning process, when the substrate W rotates, the control module 800 controls the nozzle 110 to move along the edge of the substrate. There will be an error between the actual value of the edge cleaning width and the preset width d (due to equipment errors between motion structures), resulting in a curved edge of the substrate being washed out, as Figure 4 shown. In some embodiments, the actual value of the edge cleaning width is sampled in advance at the same substrate rotation angle intervals. During the actual edge cleaning process, according to the difference δ between the sampled value of the edge cleaning width and the preset width d n the movement of the nozzle 110 is controlled to compensate for the edge cleaning width to make the edge cleaning width uniform. Exemplarily, as Figure 4 in, according to the difference δ1 between the sampled value of the edge cleaning width and the preset width d at the substrate rotation angle Δ1, the position of the nozzle is compensated, and the nozzle 110 is controlled to continue moving on the basis of the original telescopic amount when rotating by Δ1 to make the edge cleaning width uniform.

[0092] In the above embodiments, the control module 800 can control the movement of the substrate and the nozzle 110 according to the relationship between the substrate rotation angle and the nozzle telescopic amount. In other embodiments, the movement of the substrate and the nozzle 110 can also be controlled according to the substrate rotation angle, in combination with the relationship between the substrate rotation time and the nozzle movement speed. The relationship between the substrate rotation time and the nozzle movement speed is calculated as follows:

[0093] Based on the relationship θ = ωt between the angular velocity and rotation angle of the substrate, the piecewise function of the nozzle telescopic amount s1 is differentiated to obtain the relationship between the substrate rotation time t and the nozzle movement speed v1 as follows:

[0094]

[0095] Among them, the above piecewise function is segmented cyclically and sequentially according to the time taken for the nozzle to move from the midpoint of the substrate to the top corner and the time taken from the top corner to the midpoint of the adjacent side.

[0096] After the control module 800 obtains the substrate rotation time based on the substrate rotation angle tracked by the angle tracking module 300, controls the movement of the nozzle 110 in combination with the relationship between the substrate rotation time and the nozzle movement speed, and then calibrates the movement position of the nozzle according to the position change of the intersection point between the nozzle and the edge washing line when the substrate rotation angle changes, so as to make the movement control of the nozzle 110 more accurate. The position change of the intersection point between the nozzle and the edge washing line when the substrate rotation angle changes has been described in the above embodiments and will not be elaborated here.

[0097] In addition, the substrate generally has a flat shape. However, in reality, due to reasons such as the environment, the substrate warps, and the surface of the substrate sometimes has undulations in the vertical direction (i.e., the substrate thickness direction). In particular, the edge of the substrate is strongly affected by the substrate warping, and the position of the edge surface is prone to fluctuate in the thickness direction. Refer to Figure 5 The upward convex part of the substrate edge (which can also be called the downward convex part in the middle of the substrate) and the downward convex part of the substrate edge (which can also be called the upward convex part in the middle of the substrate) cause the surface position of the substrate edge to change by △H1 and △H2 respectively in the thickness direction. During the process of spraying chemical liquid on the substrate edge for edge removal, the nozzle moves along the substrate edge for edge washing. The undulating substrate causes the distance between the surface of the substrate edge and the nozzle spraying the chemical liquid to be non-constant, which also results in non-uniform edge washing width.

[0098] During the substrate edge washing process, for a flat substrate, the control module 800 controls the telescopic movement of the nozzle 110 so that the chemical liquid sprayed by the nozzle makes the edge washing width of the substrate basically uniform. However, for a warped substrate, during the telescopic movement of the nozzle, it is necessary to simultaneously control the lifting movement of the nozzle according to the warping amount of the substrate edge (more specifically, according to the warping amount of the edge washing line on one circle of the substrate) to control the spraying position of the chemical liquid from the nozzle 110 relative to the substrate edge in the substrate thickness direction, so that the height difference between the liquid landing point of the chemical liquid from the nozzle on the edge washing line and the nozzle is consistent, thereby ensuring uniform edge washing width of the substrate.

[0099] In some other embodiments, refer to Figure 6 and in combination with Figure 7, the edge cleaning unit 100 includes a nozzle 110 for ejecting chemical liquid to clean the edge of the substrate. The edge cleaning unit 100 further includes a lifting mechanism and a telescopic mechanism to drive the nozzle 110 to move to a desired vertical position and horizontal position. It can be understood that the movement of the nozzle includes, but is not limited to, the lifting movement in the vertical direction and the telescopic movement in the horizontal direction. Exemplarily, the telescopic mechanism includes a bracket 110, a swing arm 130, and a telescopic movement power unit 140. The nozzle 110 is connected to the bracket 120, and the bracket 120 is connected to the end of the swing arm 130. Here, the telescopic movement power unit 140 drives the swing arm 130 to expand and contract to change the position of the nozzle 110 in the horizontal direction, enabling the nozzle 110 to move along the edge of the substrate. The lifting mechanism includes a support arm 150 and a lifting movement power unit 160. The support arm 150 supports the telescopic mechanism and drives the telescopic mechanism to move up and down under the drive of the lifting power unit 160 to change the position of the nozzle 110 in the vertical direction, enabling the nozzle 110 to be configured at the desired vertical position. In the present invention, the structures and connection methods of the telescopic mechanism and the lifting mechanism for driving the movement of the nozzle are not limited. Any structure and connection method that can achieve the telescopic movement of the nozzle in the horizontal direction and the lifting movement in the vertical direction are within the protection scope of the present invention. In other embodiments, nozzles 301 are respectively arranged on the front and back surfaces of the substrate W for cleaning the edges of the front and back surfaces of the substrate. Both nozzles 301 are installed on the bracket 302, and the telescopic movement and lifting movement of the two nozzles 301 are simultaneously driven by the lifting mechanism and the telescopic mechanism.

[0100] The edge cleaning device further includes a detection unit 600 for detecting the substrate to obtain information related to the warpage amount of the substrate edge (hereinafter referred to as detection information). As Figure 8In the illustrated embodiment, the control module 800 obtains the warpage amount of the substrate edge according to the detection information of the detection unit 600 (more specifically, the corresponding warpage amount of the washing line on the entire circumference of the substrate edge). The control module 800 controls the lifting of the nozzle 301 according to the obtained warpage amount of the substrate edge to control the ejection position of the chemical liquid from the nozzle 301 relative to the substrate edge in the substrate thickness direction. When the detection unit 600 detects the substrate edge, while the substrate W is held by the carrying part 200 and rotated a complete circle, the detection unit 600 detects the substrate to obtain information related to the warpage amount of the substrate edge. Exemplarily, in some embodiments, the detection unit 600 is a camera device. While the substrate W is held by the carrying part 200 and rotated a complete circle, the camera device obtains the substrate image at the same height. The camera device sends the image of the substrate W rotated one circle to the control module 800. The control module 800 obtains the warpage amount of the substrate edge in the image (more specifically, the warpage amount corresponding to one circle of the washing line) according to the obtained image of the substrate rotated one circle and in combination with the substrate washing width, and controls the movement of the nozzle based on the obtained warpage amount to control the ejection position of the chemical liquid from the nozzle 301 relative to the substrate edge in the substrate thickness direction. It can be understood that in other embodiments, when the camera device takes the substrate image, the substrate remains stationary and does not rotate. The camera device takes one image of the entire substrate, and in combination with the washing width of the substrate, obtains the warpage amount corresponding to one circle of the washing line in the obtained image. In some other embodiments, the detection unit is a position sensor, and the position sensor detects the distance between the substrate edge and the position sensor. Similarly, in these embodiments, while the substrate W is held by the carrying part 200 and rotated a complete circle, the position sensor detects the distance between the surface position of the substrate edge in the thickness direction and the position sensor. More specifically, this distance is the distance between the surface position of the washing line of the substrate edge in the thickness direction and the position sensor. Here, since the substrate is square, when the substrate rotates one circle and the position sensor measures the distance between the position sensor and the surface of the substrate edge, the position of the surface of the substrate edge cannot always be on the washing line. However, the position of the surface of the substrate edge can remain fluctuating near the washing line. Therefore, when the substrate rotates one circle, the distance between the position sensor and the surface of the substrate edge is approximately processed as: the distance between the position sensor and the washing line of the substrate. In a more optimal embodiment, it is also possible to set that when the substrate rotates one circle, the position sensor horizontally expands and contracts to keep the position sensor and the washing line in the same vertical direction and measure the distance between the washing line and the position sensor. The distance obtained here is more accurate. The position sensor sends the information detected after the substrate rotates one circle to the control module 800, and the control module 800 obtains the warpage amount of the substrate edge according to the detection information. The control module 800 further controls the movement of the nozzle. The control mode of the control module 800 for the nozzle is similar to the above camera device embodiment and will not be elaborated here.The installation position of the detection unit is not particularly limited. The detection unit is provided at a position where information related to the warpage amount of the substrate edge can be detected. For example, in... Figure 8 In the embodiment shown in, the detection unit is provided above one side of the substrate to obtain information related to the warpage amount of the substrate edge. However, it can be conceived that the detection unit 600 can also be provided outside the edge cleaning device of the present invention. For example, the detection unit 600 is provided in a dedicated module provided in the front stage of the edge cleaning device. Before the substrate W is transferred to the edge cleaning device, information related to the warpage amount of the entire circumference of the substrate edge in the thickness direction is detected by the detection unit 600. In this case, the information related to the warpage amount of the substrate edge detected by the detection unit 600 can also be sent from the detection unit 600 to the control module 800. It can be understood that the larger the warpage amount of the substrate edge, the greater the fluctuation amplitude of the surface position of the substrate edge along the thickness direction, and the greater the vertical movement distance of the nozzle; the smaller the warpage amount of the substrate edge, the smaller the fluctuation amplitude of the surface position of the substrate edge along the thickness direction, and the smaller the vertical movement distance of the nozzle, so as to ensure that the distance between the surface position of the substrate edge and the chemical liquid ejection position of the nozzle remains consistent. Here, by controlling the lifting movement of the nozzle 110 in the substrate thickness direction to control the ejection position of the chemical liquid from the nozzle 110 relative to the substrate edge in the substrate thickness direction, so that the distance between the ejection position of the chemical liquid in the substrate thickness direction and the surface position of the substrate edge remains consistent during the movement of the nozzle, thereby ensuring that the washing width of the warped substrate edge is uniform.

[0101] Generally speaking, from another perspective, the edge cleaning method includes the following steps:

[0102] (1) Keep the substrate rotating;

[0103] (2) According to the rotation angle of the substrate, control the nozzle to continuously spray the chemical liquid and control the nozzle to make a telescopic movement so that the liquid landing point of the chemical liquid always remains on the washing line with a preset width of the substrate.

[0104] Before the substrate rotates, the substrate is fixed to a position where the center of the substrate is aligned with the rotation center of the bearing part, so that the bearing part bears the substrate and drives the substrate to rotate around the rotation center of the bearing part.

[0105] In step (2), in some embodiments, according to the rotation angle of the substrate tracked by the angle tracking module 300 and in combination with the relationship between the rotation angle of the substrate and the telescopic amount of the nozzle, the nozzle is controlled to move along the substrate edge.

[0106] In other embodiments, according to the rotation angle of the substrate and in combination with the relationship between the rotation time of the substrate and the movement speed of the nozzle, the movement of the nozzle is controlled. Specifically, it includes:

[0107] Based on the change in the position of the intersection point between the nozzle and the edge-washing line when the rotation angle of the substrate changes, the relationship between the substrate rotation angle and the nozzle telescopic amount is obtained;

[0108] Based on the relationship between the substrate rotation angle and the nozzle telescopic amount, the derivative of the nozzle telescopic amount is calculated to obtain the relationship between the substrate rotation time and the nozzle movement speed;

[0109] Based on the substrate rotation angle tracked by the angle tracking module, the substrate rotation time is obtained, and the movement of the nozzle is controlled in combination with the relationship between the substrate rotation time and the nozzle movement speed.

[0110] Herein, the control module also calibrates and adjusts the movement position of the nozzle according to the tracking information of the angle tracking module and in combination with the relationship between the substrate rotation angle and the change in the position of the intersection point with the edge-washing line.

[0111] In addition, in one embodiment, in step (2), the movement of the nozzle is controlled according to the difference between the edge-washing width sampling value and the preset width to compensate the edge-washing width so as to make the edge-washing width uniform.

[0112] During the edge-washing process of the substrate, for a flat substrate, the control module 800 controls the telescopic movement of the nozzle 110 so that the chemical liquid sprayed by the nozzle makes the edge-washing width of the substrate basically uniform. However, for a warped substrate, during the telescopic movement of the nozzle, the lifting movement of the nozzle needs to be controlled simultaneously according to the warping amount of the substrate edge (more specifically, according to the warping amount of the edge-washing line on one circle of the substrate) to control the spraying position of the chemical liquid from the nozzle 110 relative to the substrate edge in the substrate thickness direction, so that the height difference between the liquid landing point on the edge-washing line from the nozzle and the nozzle is consistent, thereby ensuring the uniformity of the edge-washing width of the substrate. Therefore, during the process of controlling the telescopic movement of the nozzle, the lifting of the nozzle is also synchronously controlled, specifically including:

[0113] (a) According to the preset edge-washing width of the substrate, the warping amount of the edge-washing line of one circle of the substrate is obtained;

[0114] In this step, the information on the warping amount of the substrate edge can be obtained by a camera device or a position sensor. For the specific acquisition method, please refer to the relevant description of the above-mentioned edge cleaning device. And the control module obtains the warping amount of the substrate edge based on the information related to the warping amount of the substrate edge obtained.

[0115] (b) During the process of the nozzle moving along the edge-washing line of the rotating substrate through telescopic movement, the nozzle is controlled to lift and lower synchronously according to the obtained warping amount so that the height difference between the liquid landing point on the edge-washing line and the nozzle is consistent.

[0116] In this step, by ensuring that the height difference between the liquid application point on the edge cleaning line and the nozzle is consistent, the distance between the ejection position of the chemical liquid from the nozzle relative to the edge of the substrate in the substrate thickness direction and the surface position of the edge of the substrate is kept consistent. Specifically, controlling the lifting of the nozzle specifically includes:

[0117] Controlling the lifting of the nozzle according to the height of the starting position of the nozzle and the warpage amount difference between the current liquid application point and the liquid application point at the starting position. As Figure 9 shown in the embodiment, according to the starting position and the current position of the liquid application point on the substrate surface corresponding to the substrate rotation angles Δ1 and Δ2, the warpage amount difference Δ h between the current liquid application point and the liquid application point at the starting position is obtained, and the nozzle is lifted or lowered by the obtained warpage amount difference Δ h to perform edge cleaning on the substrate edge.

[0118] In addition, based on Figure 9 the warpage amount curve of the substrate edge cleaning line shown in the embodiment, the warpage amount difference between the current liquid application point and the liquid application point at the starting position is obtained, and the vertical lifting movement of the nozzle is controlled in combination with the rotation speed of the substrate. Since the rotation speed of the substrate is different, the lifting speed of the nozzle will change correspondingly to control the nozzle at the desired vertical lifting position. Therefore, when the rotation speed of the substrate is different, the change in the vertical lifting speed of the nozzle will also be different.

[0119] For more details of the embodiment of this method, reference can be made to the description of the edge cleaning device above, and no further elaboration will be made here.

[0120] The above embodiments are only illustrative of the principles and effects of the present invention and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An edge cleaning device for cleaning the edges of a square substrate, characterized in that: include: A spray head, the spray head being adapted to spray a chemical liquid to clean an edge of a substrate; A carrying platform, used for carrying the substrate and rotating with the substrate; The edge cleaning device is configured to control the nozzle to move along the edge of the substrate through telescopic motion when the substrate rotates, so that the landing point of the chemical liquid is always maintained on the edge cleaning line of a preset width.

2. The edge cleaning device according to claim 1, characterized in that: The nozzles are arranged on the front and back sides of the substrate, and are used to clean the substrate edges on the front and back sides of the substrate respectively.

3. The edge cleaning device according to claim 1, characterized in that: It is also configured to compensate the position of the nozzle according to the difference between the sampling value of the edge washing width sampling point and the preset width during the rotation of the substrate.

4. The edge cleaning device according to claim 1, characterized in that: It also includes a control module and an angle tracking module, wherein the angle tracking module is used to track the rotation angle of the substrate, and the control module is used to control the movement of the nozzle according to the tracking information of the angle tracking module.

5. The edge cleaning device according to claim 4, characterized in that: The control module controls the movement of the nozzle according to the tracking information of the angle tracking module, including: According to the change in the position of the intersection of the nozzle and the edge-washing line when the rotation angle of the substrate changes, the relationship between the rotation angle of the substrate and the expansion and contraction amount of the nozzle is obtained; According to the substrate rotation angle tracked by the angle tracking module and in combination with the relationship between the substrate rotation angle and the extension and contraction amount of the nozzle, the nozzle is controlled to move along the edge of the substrate.

6. The edge cleaning device according to claim 4, characterized in that: The control module is used to control the movement of the nozzle according to the tracking information of the angle tracking module, including: According to the change in the position of the intersection of the nozzle and the edge-washing line when the rotation angle of the substrate changes, the relationship between the rotation angle of the substrate and the expansion and contraction amount of the nozzle is obtained; The relationship between the substrate rotation time and the nozzle movement speed is obtained by taking the derivative of the nozzle expansion and contraction amount; The substrate rotation time is obtained according to the substrate rotation angle tracked by the angle tracking module, and the movement of the nozzle is controlled in combination with the relationship between the substrate rotation time and the nozzle movement speed.

7. The edge cleaning device according to claim 6, characterized in that: The control module is also used to calibrate and adjust the movement position of the nozzle according to the change in the position of the intersection of the nozzle and the edge washing line when the rotation angle of the substrate changes.

8. The edge cleaning device according to claim 1, characterized in that: The edge cleaning device is also configured to control the synchronous lifting and lowering of the nozzle head according to the warping amount of the edge washing line when the nozzle head moves along a circle of the edge washing line of the rotating substrate through telescopic movement, so that the landing point of the chemical liquid from the nozzle head on the edge washing line remains consistent with the height difference of the nozzle head.

9. The edge cleaning device according to claim 8, characterized in that: The invention also includes a detection unit for detecting information related to the warping amount of the edge of the substrate.

10. The edge cleaning device according to claim 9, characterized in that: The detection unit is a camera device or a position sensor.

11. The edge cleaning device according to claim 10, characterized in that: The camera device is configured to capture an image of the substrate at the same height when the substrate rotates one circle.

12. The edge cleaning device according to claim 8, characterized in that: The camera device is configured to capture an image of the entire substrate that remains stationary.

13. The edge cleaning device according to claim 8, characterized in that: The position sensor is configured to measure the distance between the edge washing line of the substrate and the position sensor at the same height when the substrate rotates one circle.

14. The edge cleaning device according to any one of claims 8 to 13, characterized in that: The edge cleaning device is further configured to obtain the warping amount of the edge cleaning line according to a preset edge cleaning width and relevant information about the warping amount of the substrate edge.

15. The edge cleaning device according to claim 1, characterized in that: When the carrying platform carries the substrate, the center of the substrate is aligned with the rotation center of the carrying platform.

16. An edge cleaning method, characterized in that: Keep the substrate rotating; According to the rotation angle of the substrate, the nozzle is controlled to continuously spray the chemical liquid and the nozzle is controlled to telescope so that the landing point of the chemical liquid is always maintained on the washing edge line of the preset width of the substrate.

17. The edge cleaning method according to claim 16, characterized in that: The step of controlling the movement of the nozzle according to the rotation angle of the substrate includes: controlling the movement position of the nozzle according to the relationship between the rotation angle of the substrate and the expansion and contraction amount of the nozzle to determine the landing point position of the chemical liquid.

18. The edge cleaning method according to claim 17, characterized in that: The calculation method of the relationship between the substrate rotation angle and the nozzle extension amount includes: According to the change in the position of the intersection of the nozzle and the edge-washing line when the rotation angle of the substrate changes, the relationship between the rotation angle of the substrate and the expansion and contraction amount of the nozzle is obtained.

19. The edge cleaning method according to claim 16, characterized in that: The method also includes controlling the movement of the telescopic nozzle according to the difference between the edge washing width sampling value and the preset width, and compensating the edge washing width to make the edge washing width uniform.

20. The edge cleaning method according to claim 16, characterized in that: The step of controlling the movement of the nozzle according to the rotation angle of the substrate comprises: According to the change in the position of the intersection of the nozzle and the edge-washing line when the rotation angle of the substrate changes, the relationship between the rotation angle of the substrate and the expansion and contraction amount of the nozzle is obtained; The relationship between the substrate rotation time and the nozzle movement speed is obtained by taking the derivative of the nozzle expansion and contraction amount; The substrate rotation time is obtained according to the substrate rotation angle tracked by the angle tracking module, and the movement of the nozzle is controlled in combination with the relationship between the substrate rotation time and the nozzle movement speed.

21. The edge cleaning method according to claim 20, characterized in that: According to the change in the position of the intersection of the nozzle and the edge-washing line when the rotation angle of the substrate changes, the movement position of the nozzle is calibrated and adjusted.

22. The edge cleaning method according to claim 16, characterized in that: During the process of controlling the nozzle extension and retraction movement, the nozzle lifting and lowering are also synchronously controlled, including: According to the preset edge washing width of the substrate, the warping amount of a circle of edge washing line of the substrate is obtained; When the nozzle moves along the edge washing line of the rotating substrate through telescopic motion, the nozzle is raised and lowered synchronously according to the warping amount of the edge washing line, so that the height difference between the landing point of the chemical liquid from the nozzle on the edge washing line and the nozzle is consistent.

23. The edge cleaning method according to claim 22, characterized in that: According to the preset edge-washing width of the substrate and an image of the substrate rotating one circle taken at the same height, the warping amount of one circle of edge-washing lines in the image is obtained.

24. The edge cleaning method according to claim 22, characterized in that: According to the preset edge-washing width of the substrate and an image of the substrate rotating one circle taken at the same height, the warping amount of one circle of edge-washing lines in the image is obtained.

25. The edge cleaning method according to claim 22, characterized in that: The warping amount of the edge washing line is obtained according to the preset edge washing width of the substrate and the distance between the edge washing line detected by the position sensor and the position sensor.

26. The edge cleaning method according to claim 22, characterized in that: Controlling the nozzle lifting includes: The starting position of the nozzle edge washing is determined, and the nozzle lifting is controlled based on the difference in warping between the current liquid landing point and the liquid landing point at the starting position.

27. The edge cleaning method according to claim 26, characterized in that: Controlling the nozzle lifting and lowering in combination with the warping difference between the current landing point and the landing point at the starting position includes: controlling the nozzle lifting and lowering movement according to the warping difference between the current landing point and the landing point at the starting position and the rotation speed of the substrate.

28. The edge cleaning method according to claim 22, characterized in that: The substrate edges on the front and back sides of the substrate are cleaned using nozzles located on the front and back sides of the substrate respectively.

29. The edge cleaning method according to claim 16, characterized in that: The method also includes fixing the substrate to a position where the center of the substrate is aligned with the rotation center of the substrate before performing edge cleaning on the substrate.

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