Wafer film stripping and sorting apparatus

Abstract

The application relates to the technical field of sorting devices, and discloses a wafer film stripping and sorting device, which comprises a conveying device, a carrying device, a stripping device, a decontamination device and a sorting device, the stripping device comprises a fixing table and a stripping pipe, and the carrying device reciprocally moves between the conveying device and the stripping device through a first power source; a plurality of work stations for fixing wafers are arranged on the fixing table; the stripping pipe is horizontally arranged and moves in the working area through a second power source; a vacuum suction port is arranged on the stripping pipe, the stripping pipe is communicated with a vacuum pump; and the stripping pipe rotates around its own axis through a third power source. The application has the effect of improving the film tearing efficiency and reducing the damage to the wafers.

Description

Technical Field

[0001] This application relates to the field of sorting equipment technology, and in particular to a wafer stripping and sorting device. Background Technology

[0002] In the field of MIP (Microin Package) manufacturing, wafers are a key raw material. During the manufacturing process, a protective film is usually applied to the wafer to reduce the risk of contamination from the external environment or scratches from other equipment, thus ensuring the quality and performance of the wafer.

[0003] However, before further wafer processing, such as dicing and drilling, a "film peeling" operation is required to ensure smooth processing. Currently, there are two main methods for film peeling: one is to use tweezers to peel off one edge of the film on the wafer and then gradually remove it. This method is inefficient, and the tweezers can easily damage the wafer. Furthermore, the peeling force is difficult to control, potentially causing wafer breakage. The other method involves attaching an auxiliary adhesive tape to the film on the wafer, pulling the tape to detach the film from the wafer. However, during wafer grinding and thinning, impurities easily adhere to the film, making it difficult for the auxiliary adhesive tape to adhere effectively, thus affecting peeling efficiency.

[0004] In summary, existing wafer peeling methods have certain limitations and need further improvement and optimization to increase peeling efficiency and reduce wafer damage, thereby improving the efficiency and quality of the entire MIP manufacturing process. Summary of the Invention

[0005] In order to improve the efficiency of film removal while reducing damage to wafers, this application provides a wafer stripping and sorting device.

[0006] The wafer stripping and sorting equipment provided in this application adopts the following technical solution:

[0007] A wafer stripping and sorting device includes a conveying device, a handling device, a stripping device, a cleaning device, and a sorting device. The stripping device includes a fixed platform and a stripping tube, wherein:

[0008] The conveying device reciprocates between the conveying device and the stripping device via a first power source;

[0009] The fixed platform is equipped with multiple wafer fixing stations;

[0010] The stripping tube is set horizontally and moves within the working area via a second power source;

[0011] The stripping tube is equipped with a vacuum adsorption port and is connected to a vacuum pump.

[0012] The stripping tube rotates around its own axis via a third power source;

[0013] The vacuum adsorption port includes a first vacuum adsorption port and a second vacuum adsorption port;

[0014] The length direction of the first vacuum adsorption port is consistent with the length direction of the stripping tube;

[0015] The second vacuum adsorption port is located close to the first vacuum adsorption port;

[0016] A baffle plate that can rotate relative to the stripping tube is provided near the vacuum adsorption port;

[0017] The conveying device includes a mounting plate, a suction cup, and a calibration unit, wherein:

[0018] The suction cups are located on the same side of the mounting plate, and there are multiple suction cups.

[0019] The calibration unit includes a positioning bar and an adjustment column, wherein:

[0020] The positioning strip is provided on the mounting plate;

[0021] The adjusting column is slidably mounted on the mounting plate;

[0022] A calibration area is formed between the positioning bar and the adjustment column;

[0023] The mounting plate is provided with guide grooves near both ends of the positioning strip;

[0024] The distance between the two guide grooves gradually increases from the direction closer to the positioning strip to the direction farther away from the positioning strip;

[0025] The adjusting column is provided in pairs, and the adjusting column is adapted to the guide groove;

[0026] The adjusting post passes through the guide groove, and the adjusting post and the guide groove are slidably engaged.

[0027] The adjusting column moves inside the guide groove via a fourth power source.

[0028] Optionally, the fourth power source includes a push bar, a threaded rod, and a motor;

[0029] The push bar is disposed on the mounting plate and slides in cooperation with the mounting plate;

[0030] The threaded rod passes through the push bar and is threadedly connected to the push bar;

[0031] The motor is driven by the threaded rod.

[0032] Optionally, a rotating plate is provided on the fixed platform;

[0033] The rotating plate rotates around its own axis via a fifth power source;

[0034] The workstations are circumferentially distributed on the rotating plate;

[0035] The rotating plate is provided with multiple first vacuum adsorption holes at its work station.

[0036] Optionally, the impurity removal device includes an adsorption plate;

[0037] The adsorption plate moves along a specific route via a sixth power source;

[0038] The adsorption plate is tilted.

[0039] The adsorption plate is provided with multiple second vacuum adsorption holes;

[0040] The adsorption plate is provided with a flow guiding surface.

[0041] Optionally, the conveying device is equipped with a transfer box;

[0042] The transfer box is equipped with a placement plate inside;

[0043] A buffer unit is provided between the placement plate and the transfer box.

[0044] In summary, this application includes at least one of the following beneficial technical effects:

[0045] 1. Through the coordinated work of various devices, such as the conveying device for fast and accurate wafer transport, the stripping device for efficient wafer stripping, and the sorting device for timely inspection and sorting of wafers after stripping, the entire process time of wafer stripping and sorting is greatly shortened, the overall production efficiency is improved, and the capacity and output of wafer processing production are increased.

[0046] 2. From the cushioning design within the transfer box to the stable suction of the multi-suction cups in the handling device, and the precise detection and sorting of wafer damage by the sorting device, the equipment emphasizes wafer protection and quality control at every stage. The design of cushioning units and elastic pads reduces the stress risk to wafers during placement and handling, minimizing damage such as breakage; the sorting device can promptly screen out damaged wafers, ensuring the quality stability of the final product, reducing the defect rate, and improving production efficiency and product reliability.

[0047] 3. Each unit is equipped with a corresponding power source and control system, such as the three-axis robot of the handling device, the motor drive of the calibration unit, the precise movement of the rotating plate and stripping tube of the stripping device, the movement of the adsorption plate of the impurity removal device, and the visual inspection and diversion robot of the sorting device. This realizes the full-process automation of wafer handling, stripping, impurity removal and sorting, reduces manual intervention, improves the stability and consistency of the production process, and reduces labor costs and errors and risks caused by human operation, making the entire production process more intelligent and efficient. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application.

[0049] Figure 2 This is a schematic diagram illustrating the structure of the transfer box in an embodiment of this application.

[0050] Figure 3 This is a schematic diagram illustrating the structure of the handling device in the embodiments of this application.

[0051] Figure 4 yes Figure 3 An enlarged schematic diagram of part A in the middle.

[0052] Figure 5 This is a schematic diagram illustrating the structure of the calibration unit in an embodiment of this application.

[0053] Figure 6 This is a schematic diagram illustrating the rotating plate structure in an embodiment of this application.

[0054] Figure 7 This is a schematic diagram illustrating the structure of the stripping device in an embodiment of this application.

[0055] Figure 8 This is a schematic diagram illustrating the stripping tube structure in an embodiment of this application.

[0056] Figure 9 This is a schematic diagram illustrating the position of the baffle in an embodiment of this application.

[0057] Figure 10 This is a schematic diagram illustrating the structure of the impurity removal device in the embodiments of this application.

[0058] Explanation of reference numerals in the attached figures:

[0059] 1. Conveying device; 11. Transfer box; 12. Placement plate; 2. Handling device; 21. Mounting plate; 211. First mounting plate; 212. Second mounting plate; 213. Guide groove; 22. Suction cup; 23. Calibration unit; 231. Positioning bar; 232. Adjusting column; 24. First power source; 25. Fourth power source; 251. Push bar; 252. Threaded rod; 253. Motor; 3. Stripping device; 31. Rotating plate; 311. First vacuum adsorption hole; 32. Stripping tube; 321. Vacuum adsorption port; 3211. First vacuum adsorption port; 3212. Second vacuum adsorption port; 322. Baffle plate; 33. Second power source; 34. Third power source; 35. Moving frame; 4. Impurity removal device; 41. Adsorption plate; 10. Second vacuum adsorption hole; 43. Sixth power source; 44. Guide surface; 5. Sorting device. Detailed Implementation

[0060] The following is in conjunction with the appendix Figures 1-10 This application will be described in further detail.

[0061] This application discloses a wafer stripping and sorting device.

[0062] A wafer stripping and sorting device includes a conveying device 1, a handling device 2, a stripping device 3, a cleaning device 4, and a sorting device 5.

[0063] A transfer box 11 is fixedly installed on the conveying device 1, and the wafer is placed inside the transfer box 11. When the transfer box 11 carrying the wafer approaches the handling device 2, the handling device 2 picks up the wafer inside the transfer box 11 and transports it to the peeling device 3 via the first power source 24, where the peeling device 3 peels off the film on the wafer. The top of the side wall of the transfer box 11 has a notch to facilitate the placement of the handling device 2 above the transfer box 11, improving the convenience of picking up the wafer.

[0064] Then, the transport device 2, via the first power source 24, transports the wafers with the film removed back into the transfer box 11, and then transports the wafers to be peeled from the transfer box 11 to the peeling device 3 for film removal. During the transport process by the transport device 2, the impurity removal device 4 cleans the film on the peeling device 3. After the wafers have been peeled, they pass through the sorting device 5, where damage to the wafers is detected and wafers of different qualities are sorted.

[0065] The conveying device 1 is a chain conveyor 1, and the transfer box 11 is fixedly installed on the chain plate of the conveying device 1. The chain conveyor is more precise in position than the belt conveyor. The transfer box 11 is provided with a placement plate 12. When placing wafers, the wafers are placed on the placement plate 12.

[0066] To reduce the possibility of wafer breakage due to excessive force when placed on the placement plate 12, the placement plate 12 is slidably engaged with the transfer box 11 along its axial direction. A buffer unit is provided between the placement plate 12 and the transfer box 11. When the wafer is placed on the placement plate 12, the buffer unit cushions the wafer through the placement plate 12. To further improve the cushioning effect, an elastic pad is provided on the side of the placement plate 12 closest to the wafer. In this embodiment, the buffer unit is a buffer spring, with one end connected to the placement plate 12 and the other end connected to the bottom of the transfer box 11.

[0067] Since the transfer box 11 is fixed on the conveying device 1, as the transfer box 11 moves on the conveying device 1, when the opening of the transfer box 11 faces downward, the placement plate 12 will move under its own weight. At this time, the buffer spring will pull the placement plate 12 to reduce the possibility of the placement plate 12 falling off the transfer box 11.

[0068] The handling device 2 includes a mounting plate 21, a suction cup 22, and a calibration unit 23. The mounting plate 21 moves along the X, Y, and Z axes via a first power source 24. The mounting plate 21 includes a first mounting plate 211 and a second mounting plate 212. The first mounting plate 211 is horizontally mounted on the first power source 24 and moves along a preset route via the first power source 24. In this embodiment, the first power source 24 is a three-axis manipulator. The specific direction of the mounting plate 21 is a reciprocating motion between the conveying device 1 and the stripping device 3.

[0069] The suction cup 22 is mounted on the first mounting plate 211 and is connected to the vacuum pump. Multiple suction cups 22 are provided. When picking up the wafer, multiple suction cups 22 further improve the stability of picking up the wafer and reduce the possibility of the wafer falling due to uneven force during the handling process.

[0070] The second mounting plate 212 is mounted on the side of the first mounting plate 211 away from the suction cup 22. The calibration unit 23 is mounted on the second mounting plate 212. The calibration unit 23 includes a positioning strip 231 and an adjusting post 232. The positioning strip 231 is fixedly mounted on the second mounting plate 212. A pair of positioning posts are provided, and the pair of positioning posts are respectively installed near the two ends of the positioning strip 231. A calibration area is formed between the adjusting post 232 and the positioning strip 231.

[0071] The second mounting plate 212 has guide grooves 213 located near both ends of the positioning strip 231. The guide grooves 213 penetrate the second mounting plate 212, and the distance between the two guide grooves 213 gradually increases from the distance near the positioning strip 231 to the distance away from the positioning strip 231. A pair of adjusting posts 232 correspond one-to-one with the two guide grooves 213. The adjusting posts 232 penetrate the second mounting plate 212, and the adjusting posts 232 and the guide grooves 213 are in sliding fit. When the adjusting posts 232 move closer to or away from the positioning strip 231 via the fourth power source 25, the guide grooves 213 guide the adjusting posts 232, causing the two adjusting posts 232 to move closer to each other synchronously.

[0072] The fourth power source 25 includes a push bar 251, a threaded rod 252, and a motor 253. The push bar 251 is mounted on the second mounting plate 212, and is located on the side of the second mounting plate 212 away from the suction cup 22. The length direction of the push bar 251 is parallel to the line connecting the two adjusting posts 232. The push bar 251 and the second mounting plate 212 are threadedly connected. The threaded rod 252 passes through the push bar 251 and is threadedly connected to the push bar 251. The motor 253 is mounted on the second mounting plate 212, and the motor 253 and the threaded rod 252 are connected in a transmission manner.

[0073] After the suction cup 22 approaches the wafer, the motor 253 drives the threaded rod 252 to rotate. The threaded rod 252 drives the push bar 251 to move, and the push bar 251 drives the two adjusting posts 232 to move synchronously. Thus, while the two adjusting posts 232 move towards the positioning bar 231, the two positioning posts simultaneously move closer to each other. During the movement of the adjusting posts 232, the two adjusting posts 232 push the wafer to move and cause the positioning bar 231 to move, thereby completing the centering positioning of the wafer so that the suction cup 22 can adsorb the wafer.

[0074] The adjusting column 232 and the pushing strip 251 are connected, and the adjusting column 232 and the pushing strip 251 slide along the length of the pushing strip 251, so that the pushing strip 251 can drive the adjusting column 232 to reset, so as to reposition the wafer. At the same time, since the adjusting column 232 is columnar, the adjusting column 232 and the wafer roll together when adjusting the wafer position, which reduces the friction between the adjusting column 232 and the wafer, thereby reducing the damage to the wafer caused by the adjusting column 232 when pushing the wafer.

[0075] The peeling device 3 includes a fixed platform and a peeling tube 32. A rotating plate 31 is horizontally mounted on the fixed platform. The rotating plate 31 is horizontally mounted on the fixed platform and rotates around its own axis through a fifth power source. Multiple workstations are arranged circumferentially along the axis of the rotating plate 31. In this embodiment, there are four workstations. Each workstation of the rotating plate 31 is provided with a first vacuum adsorption hole 311 connected to a vacuum pump. In this embodiment, the fifth power source is a rotary motor 253.

[0076] After the transport device 2 transports the wafer to the station on the rotating plate 31, a negative pressure is formed at the first vacuum adsorption hole 311 to adsorb the wafer. Then, the rotating plate 31 drives the wafer to rotate, which facilitates the placement of multiple wafers on the rotating table and reduces the waiting time of the stripping tube 32, thereby improving the overall efficiency of wafer stripping. At the same time, when the wafer is on the rotating plate 31, the adsorption of the first vacuum adsorption hole 311 always holds the wafer, reducing the possibility of relative movement between the wafer and the rotating plate 31, and improving the positional accuracy and stability of the wafer.

[0077] The size of the adsorption area of ​​the first vacuum adsorption hole 311 is adjusted according to the size of the wafer to reduce the impact of the negative pressure at the first vacuum adsorption hole 311 on the stripping tube 32 while ensuring wafer adsorption. The stripping tube 32 is mounted on a moving frame 35 at both ends. The moving frame 35 is arranged in an inverted U-shape, and the stripping tube 32 is horizontally positioned. The stripping tube 32 rotates relative to the moving frame 35 via a third power source 34. In this embodiment, the third power source 34 is a drive motor 253. The stripping tube 32 is provided with a vacuum adsorption port 321 and is connected to a vacuum pump. The moving frame 35 moves in the working area via a second power source 33. In this embodiment, the second power source 33 is a three-axis robotic arm.

[0078] When peeling the film off the wafer, the peeling tube 32 is moved to a position close to the wafer. Then, the peeling tube 32 is rotated so that the vacuum adsorption port 321 on the peeling tube 32 is slightly higher than the wafer and faces the side of the film on the wafer. Then, the vacuum pump creates a negative pressure at the vacuum adsorption port 321, thereby gradually sucking up the side of the film on the wafer and causing the peeling tube 32 to adsorb the film on the wafer onto the peeling tube 32 through the vacuum adsorption port 321. Then, while moving the position of the peeling tube 32, the peeling tube 32 is rotated around its own axis, so that the peeled film is wrapped around the peeling tube 32 at the same time, so that the peeled film can be moved by the peeling tube 32 in the future.

[0079] A certain gap is maintained between the moving frame 35 and the wall of the stripping tube 32. The specific size of the gap is determined based on the size and material of the film on the wafer. When the stripping tube 32 is rotated to wrap the film around it, the gap between the moving frame 35 and the stripping tube 32 limits the film, facilitating smooth wrapping and reducing the possibility of the film spreading out on the stripping tube 32 after wrapping is completed and the film is completely removed from the wafer.

[0080] The vacuum adsorption port 321 includes a first vacuum adsorption port 3211 and a second vacuum adsorption port 3212. The first vacuum adsorption port 3211 is elongated and its length direction is consistent with the length direction of the stripping tube 32. The second vacuum adsorption port 3212 is located near the first vacuum adsorption port 3211, and there are multiple second vacuum adsorption ports 3212. In this embodiment, multiple second vacuum adsorption ports 3212 are provided and distributed along the length direction of the stripping tube 32. When the first vacuum adsorption port 3211 is close to the side of the film on the wafer, the elongated first vacuum adsorption port 3211 and the relatively small suction port increase the force of adsorption on the wafer, thereby facilitating the peeling of the side of the film.

[0081] When the membrane is first wound onto the stripping tube 32, the stripping tube 32 gradually rotates, and the position and angle of the first vacuum adsorption port 3211 change. At this time, the second vacuum adsorption port 3212 assists the first vacuum adsorption port 3211 in adsorbing the membrane, thereby increasing the adsorption force on the membrane and thus improving the stability of adsorbing the membrane onto the stripping tube 32, so as to facilitate the subsequent winding of the membrane onto the stripping tube 32.

[0082] To increase the adsorption force of the vacuum adsorption port 321 near the film, a shielding plate 322 is provided near the vacuum adsorption port 321. In this embodiment, the shielding plate 322 is located inside the stripping tube 32, and its end is mounted on the moving frame 35. When the stripping tube 32 moves, the shielding plate 322 and the stripping tube 32 rotate relative to each other. As the vacuum adsorption port 321 gradually moves away from the wafer due to the rotation of the stripping tube 32, the vacuum adsorption port 321 gradually moves into the range of the shielding plate 322. The shielding plate 322 blocks the vacuum adsorption port 321, thereby increasing the adsorption force of other vacuum adsorption ports 321, thus improving the stability and reliability of the adsorption film.

[0083] When the film on the wafer is initially peeled off, a large adsorption force is required. At this time, the shielding plate 322 blocks the second vacuum adsorption port 3212 to increase the adsorption force of the first vacuum adsorption port 3211 and improve the effect of peeling off the film.

[0084] The impurity removal device 4 includes an adsorption plate 41, which moves along a specific route via a sixth power source 43. The adsorption plate 41 is inclined, with the side of the adsorption plate 41 closer to the stripping device 3 being lower than the side farther from the stripping device 3. Multiple second vacuum adsorption holes 10 are provided on the side of the adsorption plate 41 closest to the stripping device 3, and these second vacuum adsorption holes 10 are connected to a vacuum pump.

[0085] After the film on the wafer is wound onto the stripping tube 32, the stripping tube 32 and the film wound on the stripping tube 32 approach the adsorption plate 41 together. Then, the stripping tube 32 is rotated at a small angle so that the film on the stripping tube 32 approaches the adsorption plate 41 and is adsorbed on the side through the second vacuum adsorption hole 10. Then, the sixth power source 43 causes the adsorption plate 41 to move along the inclined direction of the adsorption plate 41. At this time, the stripping tube 32 rotates synchronously so that the stripping tube 32 can quickly peel off the film. After the film is completely removed from the stripping tube 32, the stripping tube 32 is reset and the next film peeling is performed.

[0086] The specific route of the adsorption plate 41 refers to the following: the adsorption plate 41 moves horizontally toward the stripping tube 32; after the adsorption plate 41 adsorbs the membrane, it moves upward in an inclined direction; and after the membrane on the stripping tube 32 is completely detached, the adsorption plate 41 returns to its initial position. At this time, the adsorption plate 41 moves along the inclined surface of the adsorption plate 41 to the lowest point, and then releases the adsorption of the membrane, allowing the membrane to detach from the adsorption plate 41. The adsorption plate 41 is provided with a guide surface 44 to facilitate the membrane on the adsorption plate 41 sliding off the guide surface 44.

[0087] A first collection box can also be provided near the adsorption plate 41 to collect the membrane that falls from the adsorption plate 41. Alternatively, the first collection box can be installed directly below the peeling tube 32, and the membrane can be detached from the peeling tube 32 by reversing the peeling tube 32.

[0088] The sorting device 5 includes a vision inspection component and a sorting robot. The vision inspection component is placed on the conveying device 1. The vision inspection component inspects the wafers after the film has been removed from the conveying device 1. After the inspection is completed, the sorting robot takes the undamaged wafers out of the transfer box 11 and transfers them to the next process.

[0089] Damaged wafers remain in transfer box 11. As transfer box 11 moves with the transport device 1 until its opening faces downwards, the wafers inside fall out, freeing up the box for new wafers with films to be placed inside. A second collection box is located at the bottom of the transport device 1 to collect damaged wafers.

[0090] The implementation principle of a wafer stripping and sorting device according to an embodiment of this application is as follows: The transfer box 11 of the conveying device 1 carries the wafer to the handling device 2. The handling device 2 picks up the wafer and transports it to the stripping device 3 via a first power source 24. The stripping device 3 tears off the film on the wafer. Subsequently, the handling device 2 transports the wafer back to the transfer box 11 after the film is removed. At the same time, the impurity removal device 4 cleans the film on the stripping device 3. The sorting device 5 detects and sorts the wafers after the film is removed. The conveying device 1 is a chain conveyor 1. The transfer box 11 contains a placement plate 12, a buffer unit, and an elastic pad to prevent excessive force on the wafers during placement. The handling device 2 includes a mounting plate 21, a suction cup 22, and a calibration unit 23. It moves along three axes via a first power source 24. The suction cup 22 picks up the wafer, and the calibration unit 23 centers the wafer. The stripping device 3 includes a fixed platform and a stripping tube 32. A rotating plate 31 rotates via a fifth power source. A conveying device 2 transports the wafer to the rotating plate 31 station. The first vacuum adsorption port 311 adsorbs the wafer, and the rotation of the rotating plate 31 increases the film-removing efficiency. The stripping tube 32 rotates relative to a moving frame 35 via a third power source 34. The moving frame 35 moves via a second power source 33. The vacuum adsorption port 321 on the stripping tube 32 picks up the wafer film and wraps it around the wafer. The adsorption plate 41 of the impurity removal device 4 moves via a sixth power source 43, adsorbs the film on the stripping tube 32, and then moves along an inclined direction to detach the film, which slides into the first collection box. The sorting device 5 includes a vision inspection component and a sorting robot. It inspects the wafers after film removal. The sorting robot transfers undamaged wafers, while damaged wafers remain in the transfer box 11 and fall out, where they are collected in the second collection box.

[0091] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer stripping and sorting device, characterized in that: It includes a conveying device, a handling device, a stripping device, a cleaning device, and a sorting device. The stripping device includes a fixed platform and a stripping tube, wherein: The conveying device reciprocates between the conveying device and the stripping device via a first power source; The fixed platform is equipped with multiple wafer fixing stations; The stripping tube is set horizontally and moves within the working area via a second power source; The stripping tube is equipped with a vacuum adsorption port and is connected to a vacuum pump. The stripping tube rotates around its own axis via a third power source; The vacuum adsorption port includes a first vacuum adsorption port and a second vacuum adsorption port; The length direction of the first vacuum adsorption port is consistent with the length direction of the stripping tube; The second vacuum adsorption port is located close to the first vacuum adsorption port; A baffle plate that can rotate relative to the stripping tube is provided near the vacuum adsorption port; The conveying device includes a mounting plate, a suction cup, and a calibration unit, wherein: The suction cups are located on the same side of the mounting plate, and there are multiple suction cups. The calibration unit includes a positioning bar and an adjustment column, wherein: The positioning strip is provided on the mounting plate; The adjusting column is slidably mounted on the mounting plate; A calibration area is formed between the positioning bar and the adjustment column; The mounting plate is provided with guide grooves near both ends of the positioning strip; The distance between the two guide grooves gradually increases from the direction closer to the positioning strip to the direction farther away from the positioning strip; The adjusting column is provided in pairs, and the adjusting column is adapted to the guide groove; The adjusting post passes through the guide groove, and the adjusting post and the guide groove are slidably engaged. The adjusting column moves inside the guide groove via a fourth power source.

2. The wafer stripping and sorting equipment according to claim 1, characterized in that: The fourth power source includes a push bar, a threaded rod, and a motor; The push bar is disposed on the mounting plate and slides in cooperation with the mounting plate; The threaded rod passes through the push bar and is threadedly connected to the push bar; The motor is driven by the threaded rod.

3. The wafer stripping and sorting equipment according to claim 1, characterized in that: A rotating plate is provided on the fixed platform; The rotating plate rotates around its own axis via a fifth power source; The workstations are circumferentially distributed on the rotating plate; The rotating plate is provided with multiple first vacuum adsorption holes at its work station.

4. The wafer stripping and sorting equipment according to claim 1, characterized in that: The impurity removal device includes an adsorption plate; The adsorption plate moves along a specific route via a sixth power source; The adsorption plate is tilted. The adsorption plate is provided with multiple second vacuum adsorption holes; The adsorption plate is provided with a flow guiding surface.

5. The wafer stripping and sorting equipment according to claim 1, characterized in that: The conveying device is equipped with a transfer box; The transfer box is equipped with a placement plate inside; A buffer unit is provided between the placement plate and the transfer box.

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