Teaching method, teaching program, and substrate processing apparatus

Abstract

The invention discloses a teaching method, a teaching program, and a substrate processing apparatus for a transfer robot including a transfer hand, the teaching method including: a first teaching operation; a first teaching operation in which a first image is acquired by photographing a marking plate attached to a chamber or a frame surrounding the chamber through a visual member chamber provided on a transfer robot that transfers a substrate, and a teaching point of the transfer robot is adjusted based on the first image; and a second teaching operation in which a second image is acquired by photographing the structure in the chamber by a substrate-type sensor including an image photographing unit placed on a hand of the transfer robot, and a teaching point of the transfer robot is adjusted based on the second image.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefits of Korean Patent Application No. 10 - 2023 - 0195389, filed with the Korean Patent Office on December 28, 2023, the entire content of which is incorporated herein by reference. Technical field

[0003] The present invention relates to a teaching method, a teaching program, and a substrate processing apparatus. Background art

[0004] To manufacture semiconductor devices, various processes such as coating, etching, stripping, cleaning, baking, ion implantation, and drying are performed on a substrate such as a wafer. A semiconductor device manufacturing apparatus is provided with a plurality of chambers for performing the above - mentioned processes and a transfer robot for transferring the substrate to each chamber. The transfer robot includes a transfer hand on which the substrate is placed.

[0005] To appropriately process the substrate in the above - mentioned chamber, it is important to transfer the substrate to its correct position in the chamber. The operation of designating a teaching point (the teaching point is the coordinate for transferring the substrate to the chamber) is called a teaching operation, and it is necessary to designate an accurate teaching point through the teaching operation so that the transfer robot can transfer the substrate to the correct position.

[0006] Generally, the teaching operation is performed by placing a teaching jig or a substrate (such as a wafer) on the hand of the transfer robot and manually adjusting the transfer robot by an operator. This method may cause errors depending on the skill level of the operator and requires a long time to complete the teaching operation. Summary of the invention

[0007] An object of the present invention is to provide a teaching method, a teaching program, and a substrate processing apparatus capable of effectively performing the teaching of a transfer robot.

[0008] The present invention is committed to providing a teaching method, a teaching program, and a substrate processing apparatus capable of minimizing the time required for the teaching operation.

[0009] The present invention is also committed to providing a teaching method, a teaching program, and a substrate processing apparatus capable of obtaining the teaching point of the transfer hand in the chamber without marking a separate teaching mark in the chamber.

[0010] The problems to be solved by the present invention are not limited to the above problems, and those skilled in the art will clearly understand the unmentioned problems from the following description.

[0011] Exemplary embodiments of the present invention provide a teaching method for a transfer robot including a transfer hand, the teaching method including: a first teaching operation in which a first image is acquired by a vision chamber provided in the transfer robot on a transfer substrate and by photographing a markplate attached to or surrounding the chamber, and a teaching point of the transfer robot is adjusted based on the first image; and a second teaching operation in which a second image is acquired by a substrate-type sensor including an image capturing unit placed on the hand of the transfer robot and by photographing a structure in the chamber, and a teaching point of the transfer robot is adjusted based on the second image.

[0012] According to the exemplary embodiment, when the vision is facing the chamber, the front-back direction may be defined as the X direction, the left-right direction may be defined as the Y direction, the up-down direction may be defined as the Z direction, and the circumferential direction centered on the Z direction may be defined as the θ direction, and on the markplate, a plurality of teaching marks may be marked side by side along the Y direction.

[0013] According to the exemplary embodiment, the teaching mark is a QR code.

[0014] According to the exemplary embodiment, the first teaching operation may include: a mark photographing operation in which a first image is acquired by the vision; and a first error calculation operation in which the teaching mark is identified and at least one of the direction of the train teaching mark, the length of the markplate, and the offset between the markplate and a first reference point is obtained from the first image, and an error between the position of the transfer hand when the transfer robot acquires the first image and the position of the transfer hand when the transfer hand transfers the substrate to a regular position is calculated based on the obtained result.

[0015] According to the exemplary embodiment, the teaching method may further include a first hand position adjustment operation in which the position and / or angle of the transfer hand of the transfer robot is adjusted by an error in the Y direction, Z direction, and / or θ direction calculated in the first error calculation operation.

[0016] According to the exemplary embodiment, the second teaching operation may include: a hand loading operation in which the transfer hand is loaded into the processing space of the chamber in a state where the transfer hand supports the substrate-type sensor; and a port photographing operation in which a circular fluid port is photographed by the substrate-type sensor loaded into the processing space by the transfer hand to acquire a second image.

[0017] According to an exemplary embodiment, the port imaging operation may include imaging a fluid port in a state where a substrate type sensor is placed on a transfer hand.

[0018] According to an exemplary embodiment, the second teaching operation may include a second error calculation operation in which at least one of a radius of a fluid port and an offset between a center point of the fluid port and a second reference point is obtained from a second image, and based on the obtained result, an error between a position of the transfer hand when the substrate type sensor acquires the second image and a position of the transfer hand when the transfer hand transfers the substrate to a normal position is calculated.

[0019] According to an exemplary embodiment, when the vision unit faces the chamber, the front - rear direction may be defined as the X direction, the left - right direction may be defined as the Y direction, the up - down direction may be defined as the Z direction, and a circumferential direction centered on the Z direction may be defined as the θ direction, and the teaching method may further include a second hand position adjustment operation in which the position and / or angle of the transfer hand of the transfer robot is adjusted by an error in the X direction, Y direction, Z direction, and / or θ direction calculated in the second error calculation operation.

[0020] Another exemplary embodiment of the present invention provides a teaching program stored in a storage medium for obtaining teaching points of a transfer robot included in a substrate processing apparatus, the teaching program including: generating an instruction for acquiring a first image by a vision unit provided on the transfer robot by imaging a marker plate attached to or surrounding a chamber, where the marker plate is marked with a plurality of teaching markers; obtaining at least one of a direction in which the teaching markers are arranged, a length of the marker plate, and a first offset between the marker plate and a center point of the first image from the first image; and calculating an error in a teaching position of a hand of the transfer robot by at least one of the direction in which the teaching markers are arranged, the length of the marker plate, and the first offset.

[0021] According to an exemplary embodiment, the teaching program may, based on the calculated error, execute an instruction for generating an instruction for primarily adjusting the position of the transfer hand of the transfer robot in at least one of the Z direction as the up - down direction, the Y direction as a horizontal direction perpendicular to the Z direction, and the θ direction as a circumferential direction centered on the Z direction.

[0022] According to an exemplary embodiment, after primarily adjusting the position of the transfer hand, the teaching program may execute storing coordinates of the transfer hand as a primary teaching point.

[0023] According to an exemplary embodiment, the teaching program may: after initially adjusting the position of the transfer hand, in a state where the transfer hand supports the substrate-type sensor, execute generating an instruction for loading the transfer hand into the processing space of the chamber; and generate an instruction for the substrate-type sensor to capture the fluid port of the chamber to obtain a second image.

[0024] According to an exemplary embodiment, the teaching program may execute obtaining the radius of the fluid port and a second offset between the center of the fluid port and the center point of the second image from the second image.

[0025] According to an exemplary embodiment, the teaching program may generate an instruction for secondarily adjusting the position of the transfer hand in the Y direction, Z direction, θ direction, and X direction perpendicular to the Y and Z directions based on the radius of the fluid port and the second offset.

[0026] According to an exemplary embodiment, after secondarily adjusting the position of the transfer hand, the teaching program may execute storing the coordinates of the transfer hand as a secondary teaching point.

[0027] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus including: a plurality of chambers configured to process a substrate, wherein the chamber provides a processing space in which the substrate is processed and includes a port for supplying a processing fluid to the processing space; a frame configured to provide a placement space in which the plurality of chambers are arranged; a teaching board attached to the frame and marked with a plurality of teaching marks; a transfer manipulator configured to transfer the substrate; and a controller configured to control the chamber and the transfer manipulator, wherein the transfer manipulator includes: a transfer hand on which a substrate and a substrate-type sensor are selectively placed; and a vision unit positioned on the top side of the transfer hand and capturing the teaching board, and a controller that adjusts the teaching point of the transfer hand based on a first image obtained by capturing the teaching board and a second image obtained by capturing the port.

[0028] According to an exemplary embodiment, the first image may be obtained by the vision unit, and the second image may be obtained by a substrate-type sensor placed on the transfer hand.

[0029] According to an exemplary embodiment, the teaching marks marked on the teaching board may be QR codes.

[0030] According to an exemplary embodiment, the port may be a supply port and have a circular shape, and the supply port supplies the processing fluid to the top surface of the substrate.

[0031] According to an exemplary embodiment of the present invention, teaching of a transfer robot can be effectively performed.

[0032] According to an exemplary embodiment of the present invention, the time required for a teaching operation can be minimized.

[0033] According to an exemplary embodiment of the present invention, teaching points of a transfer hand in a chamber can be obtained without marking a separate teaching mark in the chamber.

[0034] The effects of the present invention are not limited to the foregoing effects, and those skilled in the art can clearly understand the effects not mentioned from this specification and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A diagram showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0036] Figure 2 Showing Figure 1 of the transfer robot.

[0037] Figure 3 Showing Figure 1 of the view of the liquid processing chamber.

[0038] Figure 4 Showing Figure 1 of the drying chamber.

[0039] Figure 5 A diagram schematically showing a substrate type sensor used in the teaching method of the present invention.

[0040] Figure 6 A flowchart of the teaching method of the present invention.

[0041] Figure 7 Showing the installation Figure 6 of the position of the marker plate photographed in the first teaching operation.

[0042] Figure 8 Showing Figure 7 of the appearance of the marker plate.

[0043] Figure 9 A diagram showing a first image obtained by a vision member before completion of the first teaching operation.

[0044] Figure 10 A diagram showing a first image obtained by a vision member after completion of the first teaching operation.

[0045] Figure 11 A diagram showing a second image obtained by a substrate type sensor before completion of the second teaching operation.

[0046] Figure 12 A diagram showing a second image obtained by a substrate-type sensor after completion of a second teaching operation.

[0047] The various features and advantages of the non-limiting example embodiments of this specification may become apparent upon review of the detailed description in conjunction with the accompanying drawings. The accompanying drawings are provided for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not considered to be drawn to scale. For clarity and ease of understanding, various dimensions in the drawings may be exaggerated. Detailed Description

[0048] Example embodiments will now be described more fully with reference to the accompanying drawings. The example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details (such as examples of specific components, devices, and methods) are set forth to provide a thorough understanding of the embodiments of this disclosure. It will be apparent to those skilled in the art that the example embodiments may be embodied in many different forms and that the specific details should not be construed as limiting the scope of this disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies have not been described in detail.

[0049] The terms used herein are for the purpose of describing particular example embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the singular forms “a,” “an,” and “the” may be intended to also include the plural forms. The terms “comprises,” “comprising,” “including,” and “having” are inclusive and thus specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. Unless explicitly identified as the order of execution, the method steps, processes, and operations described herein should not be construed as necessarily being performed in the particular order discussed or illustrated. It should also be understood that additional or alternative steps may be employed.

[0050] When an element or layer is referred to as being “on another element or layer,” “engaged to another element or layer,” “connected to another element or layer,” or “coupled to another element or layer,” it can be directly on, engaged to, connected to, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on another element or layer,” “directly engaged to another element or layer,” “directly connected to another element or layer,” or “directly coupled to another element or layer,” there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a like manner (e.g., “between” relative to “directly between,” “adjacent” relative to “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0051] Although the terms first, second, third, etc. may be used herein to describe different elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, and / or section from another. When used herein, unless the context clearly dictates otherwise, terms such as “first,” “second,” and other numerical terms do not imply an order or sequence. Thus, a first element, first component, first region, first layer, or first section discussed below may be referred to as a second element, second component, second region, second layer, or second section without departing from the teachings of the exemplary embodiments.

[0052] For ease of description, spatial relative terms, such as “inner,” “outer,” “beneath,” “below,” “under,” “above,” “over,” etc., may be used herein to describe one element or feature's relationship to another element(s) or feature(s), as illustrated. Spatial relative terms are intended to cover different orientations of a device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, an element described as “below” or “beneath” another element or feature would then be oriented “above” the other element or feature. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein are interpreted accordingly.

[0053] When the terms "same" or "identical" are used in the description of the exemplary embodiments, it should be understood that there may be some imprecision. Thus, when an element or value is said to be the same as another element or value, it should be understood that the element or value is the same as other elements or values within the manufacturing or operating tolerance range (e.g., ±10%).

[0054] When the terms "about" or "substantially" are used with a numerical value, it should be understood that the associated numerical value includes the manufacturing or operating tolerance around the stated numerical value (e.g., ±10%). Further, when the words "generally" and "substantially" are used in association with a geometry, it should be understood that precision of the geometry is not required, but the latitude of the shape is within the scope of the present disclosure.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should also be understood that terms (including those defined in common dictionaries) should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0056] Hereinafter, a manufacturing method, a substrate processing method, and a substrate processing apparatus according to an exemplary embodiment of the present invention will be described in detail. The manufacturing method may be a method of manufacturing a semiconductor device. The substrate processing method may be a process corresponding to some of the various processes required for manufacturing a semiconductor device. Further, the substrate processing apparatus may be a device for implementing the above-described substrate processing method, for processing a substrate W such as a wafer. Further, the substrate processing apparatus may correspond to a semiconductor device manufacturing apparatus capable of performing a process corresponding to some of the various processes required for manufacturing the above-described semiconductor device.

[0057] Hereinafter, with reference to the attached Figures 1 to 11 The exemplary embodiments of the present invention will be described in detail.

[0058] Figure 1 FIG. showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0059] See Figure 1, the substrate processing apparatus includes an indexing module 10, a processing module 20, and a controller 30. When viewed from above, the indexing module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the indexing module 10 and the processing module 20 are arranged is referred to as the Y direction, the direction perpendicular to the Y direction when viewed from above is referred to as the X direction, and the direction perpendicular to the X direction and the Y direction is referred to as the Z direction. In addition, when the vision CAM of the transfer robot 320 gazes at the liquid processing chamber 400 or the drying chamber 500, the X direction may be the front-back direction, the Y direction may be the left-right direction, and the Z direction may be the up-down direction.

[0060] The indexing module 10 transfers the substrate W from the container C that houses the substrate W to the processing module 20, and houses the substrate W that has been completely processed in the processing module 20 in the container C. The longitudinal direction of the indexing module 10 is set in the X direction. The indexing module 10 includes a loading port 12 and an indexing frame 14. Based on the indexing frame 14, the loading port 12 is located on the side opposite to the processing module 20. The container C in which the substrate W is housed is placed in the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be arranged along the X direction.

[0061] As the container C, a sealed container such as a Front Open Unified Pod (FOUP) may be used. The container C may be placed on the loading port 12 by a transfer method (not shown) such as overhead transportation, an overhead conveyor belt, an automated guided vehicle, or an operator.

[0062] An indexing robot 120 is provided to the indexing frame 14. A guide rail 124 is provided in the indexing frame 14, the longitudinal direction of the guide rail is set in the X direction, and the indexing robot 120 may be provided to be movable on the guide rail 124. The indexing robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable forward and backward, rotatable about the Z direction, and movable along the Z direction. A plurality of hands 122 are arranged at intervals in the vertical direction, and the hands 122 may move forward and backward independently of each other.

[0063] The processing module 20 includes a buffer unit 200, a transfer chamber 300, a liquid processing chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which the substrate W loaded into the processing module 20 and the substrate W unloaded from the processing module 20 are temporarily parked. The liquid processing chamber 400 performs a liquid processing process of processing the substrate W with a liquid by supplying the liquid to the substrate W. The drying chamber 500 performs a drying process of removing the liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500.

[0064] The buffer unit 200 includes a plurality of buffer zones 220 on which a substrate W is placed. The buffer zones 220 may be arranged to be spaced apart from each other in the Z direction. The buffers 220 may be substrate holders that support the lower side of the substrate W. The buffers 220 may be arranged in the form of support frames that support the lower side of the substrate W.

[0065] The front and rear of the buffer unit 200 are open. The front is the face facing the indexing module 10, and the rear is the face facing the transfer chamber 300. The indexing robot 120 may enter the buffer unit 200 through the front, and the transfer robot 320 may enter the buffer unit 200 through the rear.

[0066] The transfer chamber 300 may be arranged such that its longitudinal direction is in the Y direction. The buffer unit 200 may be arranged between the indexing module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 may be arranged on the sides of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the X direction. The drying chamber 500 and the transfer chamber 300 may be arranged along the X direction. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0067] According to an example, the liquid processing chambers 400 are arranged on both sides of the transfer chamber 300, and the drying chambers 500 are arranged on both sides of the transfer chamber 300, and the liquid processing chambers 400 may be arranged to be closer to the buffer unit 200 than the drying chambers 500. On one side of the transfer chamber 300, the liquid processing chambers 400 may be arranged in an A×B (where each of A and B is a natural number of 1 or greater) in the Y, X, and Z directions. Further, on one side of the transfer chamber 300, the drying chambers 500 may be provided in a quantity of C×D (where each of C and D is a natural number of 1 or greater) in the Y and Z directions. Different from the above, only the liquid processing chambers 400 may be arranged on one side of the transfer chamber 300, and only the drying chambers 500 may be arranged on the other side of the transfer chamber 300.

[0068] The transfer chamber 300 includes a transfer robot 320. In the transfer chamber 300, a transfer track 324 may be arranged, the longitudinal direction of which is arranged in the Y direction, and the transfer robot 320 may be arranged to be movable on the transfer track 324.

[0069] Figure 2 To illustrate Figure 1Figure of the transfer manipulator. The transfer manipulator 320 may include a rail traveling member 320A, a hand driving member 320B, and a hand part 320C. The rail traveling member 320A may be slidably disposed on the above-described transfer rail 324. The rail traveling member 320A may include a drive motor to travel along the transfer rail 324.

[0070] The hand driving member 320B may rotate the hand part 320C. The hand driving member 320B may move the hand part 320C in the Z direction. The hand driving member 320B may include a drive box 320B1 and a drive shaft 320B2. The drive box 320B1 may include a driving device for rotating the drive shaft 320B2 or for moving the drive shaft 320B2 in the up and down direction. The drive shaft 320B2 may rotate the hand part 320C by 360 degrees. That is, the hand part 320C may change its position in the Y direction through the rail traveling member 320A, change its position in the theta (θ) direction through the hand driving member 320B, the θ direction being a circumferential direction centered on the Z direction, and change its height in the Z direction.

[0071] The hand part 320C may include a first hand 320C-A1, a first hand movable body 320C-A2, a second hand 320C-B1, a second hand movable body 320C-B2, a third hand 320C-C1, a third hand movable body 320C-C2, and a sliding body 320C-D.

[0072] The first hand 320C-A1 may be configured to support the lower side of the substrate W. The first hand 320C-A1 may be mounted at a higher height than the second hand 320C-B1 and the third hand 320C-C1. The first hand 320C-A1 may be coupled to the first hand movable body 320C-A2. The first hand movable body 320C-A2 may be slidably mounted in a second sliding groove 320C-D2 formed in the sliding body 320C-D. The first hand 320C-A1 may be configured to be movable forward and backward by the movement of the first hand movable body 320C-A2.

[0073] The second hand 320C-B1 may be configured to support the lower side of the substrate W. The second hand 320C-B1 may be mounted at a higher height than the third hand 320C-C1 and at a lower height than the first hand 320C-A1. The second hand 320C-B1 may be coupled to the second hand movable body 320C-B2. The second hand movable body 320C-B2 may be slidably mounted in a first sliding groove 320C-D1 formed in the sliding body 320C-D. The second hand 320C-B1 may be configured to be movable forward and backward by the movement of the second hand movable body 320C-B2.

[0074] The third hand 320C-C1 can be configured to support the lower side of the substrate W. The third hand 320C-C1 can be mounted at a lower height than the first hand 320C-A1 and the second hand 320C-B1. The third hand 320C-C1 can be coupled to the third hand movable body 320C-C2. The third hand movable body 320C-C2 can be slidably mounted in the first sliding groove 320C-D1 or the second sliding groove 320C-D2 formed in the slider 320C-D on the opposite side of the first hand movable body and the second hand movable body. Conversely, the third hand movable body 320C-C2 can be slidably mounted in a third sliding groove (not shown) on the opposite side of the first hand movable body and the second hand movable body, and the third sliding groove is a groove different from the first sliding groove 320C-D1 and the second sliding groove 320C-D2 formed in the slider 320C-D. The third hand 320C-C1 can be configured to be movable forward and backward by the movement of the third hand movable body 320C-C2.

[0075] In addition, the transfer robot 320 can be equipped with a vision CAM. The vision CAM can be a device for acquiring the first image IM1 when performing the teaching method described herein. The vision CAM can include a camera and a lighting. The vision CAM can be mounted on the vision fixing frame 320D. The vision fixing frame 320D can be fixed to the slider 320C-D. The vision CAM can be fixed to the slider 320C-D and can be moved in the Y direction, the Z direction, and the θ direction by the transfer hands 320C-A1, 320C-B1, and 320C-C1.

[0076] Refer again to Figure 1 , the controller 30 can control the substrate processing apparatus.

[0077] The controller 30 can generate commands for controlling the configuration of the substrate processing apparatus described herein, and / or perform operations such as image processing, identifying an object in the image, and adjusting a teaching point necessary for performing the teaching method described herein.

[0078] The controller 30 may include a process controller, a user interface, a display, and a storage unit. The process controller is constituted by a microprocessor (computer) that controls the substrate processing apparatus. The user interface is constituted by a keyboard, and an operator performs command input operations and the like on the keyboard to manage the substrate processing apparatus. The display is used to visualize and display the operating status of the substrate processing apparatus, etc. And the storage unit stores a control program for executing the process performed in the substrate processing apparatus under the control of the process controller, a teaching program for adjusting / obtaining the teaching points of the transfer robot, and a program for performing processing on each component according to various data and processing conditions, that is, a processing plan. Further, the user interface and the storage unit may be connected to the process controller. The processing plan may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, and may also be a portable disk (such as a CD-ROM or a DVD), or a semiconductor memory (such as a flash memory).

[0079] Figure 3 FIG. showing Figure 1 a view of the liquid processing chamber of

[0080] See Figure 3 , the liquid processing chamber 400 includes a housing 410, a processing container 420, a support unit 440, a liquid supply unit 460, and a lifting unit 480.

[0081] The housing 410 may have an internal space in which the substrate W is processed. The housing 410 may have a substantially hexahedral shape. For example, the housing 410 may have a cubic shape. In addition, the housing 410 may have an opening (not shown) through which the substrate W can be loaded or unloaded. Further, the housing 410 may be equipped with a door (not shown) that selectively opens and closes the opening.

[0082] The processing container 430 may have a cylindrical shape with an open top. The processing container 420 provides a processing space for processing the substrate W. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies a processing solution to the substrate W supported by the support unit 440. The processing solution may be provided in multiple types and may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the processing container 420 and the substrate W placed on the support unit 440.

[0083] In one example, the processing container 420 has a plurality of recovery containers 422, 424, and 426. Each of the recovery containers 422, 434, and 426 has a recovery space for recovering the liquid used for processing the substrate. Each of the recovery containers 422, 424, and 426 is provided in a shape surrounding the support unit 440. When performing a liquid processing process, the processing solution splashed by the rotation of the substrate W enters the recovery space through the inlets 422a, 424a, and 426a of the recovery containers 422, 424, and 426, respectively. In one example, the processing container 420 has a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is provided to surround the support unit 440, the second recovery container 424 is provided to surround the first recovery container 422, and the third recovery container 426 is provided to surround the second recovery container 424.

[0084] The second inlet 424a for introducing the liquid into the second recovery container 424 may be placed above the top side of the first inlet 422a for introducing the liquid into the first recovery container 422, and the third inlet 426a for introducing the liquid into the third recovery container 426 may be placed above the top side of the second inlet 424a.

[0085] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 may be provided in a substantially circular shape and may have a diameter larger than the diameter of the substrate W. The edge region of the top surface of the support plate 442 may be provided with support pins 442a for supporting the rear surface of the substrate W. The support pins 442a are provided with tips protruding from the support plate 442 such that the substrate W is spaced apart from the support plate 442 by a certain distance.

[0086] Chuck pins 442b are provided at the edge of the top surface of the support plate 442. The chuck pins 442b may be provided outside the support pins 442a. The chuck pins 442b are provided to protrude upward from the support plate 442 and clamp the side portion of the substrate W such that when the substrate W rotates, the substrate W does not separate from the support unit 440. The drive shaft 444 is driven by a driver 446 and is coupled to the center of the lower surface of the support plate 442 and rotates the support plate 442 about its central axis.

[0087] The liquid supply unit 460 may supply a processing solution to the substrate W. The liquid supply unit 460 may include an arm 461, a nozzle 462, and a driver 463. The nozzle 462 may be mounted at one end of the rod-shaped arm 461. The driver 463 may be configured in the form of a rotating shaft about the rotation axis in the Z direction and may be coupled to the other end of the arm 461. The driver 463 may pivot the arm 461 by rotating about the rotation axis in the Z direction. Thus, the position of the nozzle 462 mounted at one end of the arm 461 can be changed.

[0088] The nozzle 462 can supply a processing solution to the substrate W. The processing solution can be a chemical, a rinsing solution, or an organic solvent. The chemical can be a chemical having strong acid or strong base properties. The rinsing solution can be pure water. In addition, the organic solvent can be isopropyl alcohol (IPA).

[0089] Figure 4 Only one nozzle 462 is shown, but the liquid supply unit 460 can include a plurality of nozzles 462, and each nozzle can be configured to supply a different type of processing solution. For example, one of the nozzles 462 can supply a chemical, another one of the nozzles 462 can supply a rinsing solution, and still another one of the nozzles 462 can supply an organic solvent. In addition, the controller 30 can control the liquid supply unit 460 to supply a rinsing solution from one of the nozzles 462 to the substrate W, and then supply an organic solvent from another one of the nozzles 462. Therefore, the rinsing solution supplied onto the substrate W can be replaced with an organic solvent having a small surface tension.

[0090] The lifting unit 480 can move the processing container 420 in an upward or downward direction. The relative height between the processing container 420 and the substrate W changes as the processing container 420 moves up and down. The lifting unit 480 can include power generation devices such as a motor, a cylinder, or a hydraulic cylinder. The lifting unit 480 can adjust the height of the processing container 420 to distinguish the recovery containers 422, 424, and 426 for recovering the processing solution according to the type of liquid supplied to the substrate W.

[0091] Alternatively, as described above, the processing container 420 can be fixedly installed, and the support plate 442 can be configured to be movable in the vertical direction.

[0092] Figure 4 For showing Figure 1 the drying chamber of.

[0093] See Figure 4 As shown in, the drying chamber 500 can include a main body 510, a support member 520, a fluid supply unit 530, and a fluid discharge unit 540.

[0094] The main body 510 can be provided with a processing space 513 in which the substrate W is processed. The main body 510 can include a first main body 511 and a second main body 512. At least one of the first main body 511 and the second main body 512 can have a shape that is recessed in a direction away from the other of the first main body 511 and the second main body 512. The first main body 511 and the second main body 512 can be combined with each other to define the processing space 513. The first main body 511 and the second main body 512 can be formed of a material that can withstand the high-pressure conditions of the processing space 513. For example, the first main body 511 and the second main body 512 can be formed of a material such as metal (such as aluminum). The first main body 511 can be an upper main body placed on the top, and the second main body 512 can be a lower main body placed on the bottom.

[0095] The position of at least one of the first main body 511 and the second main body 512 can be changed by a driver (not shown). For example, the position of the first main body 511 can be fixed, and the second main body 512 can be configured to be movable in the Z direction. The driver can be any one of a cylinder, a pneumatic cylinder, a motor, and a magnetic levitation actuator.

[0096] The driver can move the second main body 512 between an open position and a closed position. When the second main body 512 is in the open position, the processing space 513 can be opened to the outside. When the second main body 512 is in the closed position, the first main body 511 and the second main body 512 can be combined with each other to provide a sealed processing space 513.

[0097] The first main body 511 can be provided with a first supply port 514. The first supply port 514 can be connected to a first fluid supply line 533, which will be described later, to supply a processing fluid to the processing space 513. The outlet of the first supply port 514 faces the upper region of the processing space 513 and can face the upper surface of the substrate W placed on the support member 520. The first supply port 514 can be formed on the first main body 511 itself, or can be provided as a separate supply pipe inserted into the first main body 511.

[0098] The second main body 512 can be provided with a second supply port 515. The second supply port 515 can be connected to a second fluid supply line 534, which will be described later, to supply a processing fluid to the processing space 513. The outlet of the second supply port 515 can face the lower region of the processing space 513. Similar to the first supply port 514, the second supply port 515 can be formed in the second main body 512 itself, or can be provided as a separate supply pipe inserted into the second main body 512.

[0099] In addition, the second body 512 may be provided with an exhaust port 516. The exhaust port 516 may be connected to an exhaust pipeline 541, which will be described later, to exhaust the atmosphere in the processing space 513. The exhaust port 516 may supply an exhaust treatment fluid such as carbon dioxide to the outside of the processing space 513 to reduce the pressure in the processing space 513. The exhaust port 516 may be arranged in parallel with the second supply port 515. Similar to the first supply port 514 and the second supply port 515, the exhaust port 516 may be formed in the second body 512 itself or may be provided as a separate supply pipe inserted into the second body 512.

[0100] The first supply port 514, the second supply port 515, and the exhaust port 516 may be referred to as fluid ports.

[0101] In the above example, for illustration purposes, the present invention is described based on the case where the first supply port 514 is provided on the first body 511 and the second supply port 515 and the exhaust port 516 are provided on the second body 512, but the present invention is not limited thereto. For example, the first supply port 514, the second supply port 515, and the exhaust port 516 may all be provided on the first body 511, or may all be provided on the second body 512.

[0102] The body 510 may be provided with a heater 517. The heater 517 may be installed in a buried manner inside the first body 511 and / or the second body 512. The heater 517 may be a resistance heater. Alternatively, the heater 517 may be differently modified into any known device that generates heat. The heater 517 may increase the temperature of the processing space 513. The heater 517 may maintain the temperature of the processing space 513 at a set temperature. Herein, the set temperature may be set to a temperature higher than the critical temperature at which the state of the processing fluid is allowed to remain supercritical.

[0103] The support member 520 may support the substrate W. The support member 520 may be configured to support the substrate W in the processing space 513 provided by the body 510.

[0104] The support member 520 may be configured to support the bottom surface of the substrate W. The support member 520 may be configured to support the bottom edge region of the substrate W. The support member 520 may be fixedly installed on the bottom side of the first body 511. The support members 520 may be provided in pairs. Each support member 520 may extend in a downward direction from the first body 511 towards the second body 512 and may have a laterally bent shape at the end to support the bottom surface of the substrate W.

[0105] When the contact area between the substrate W and the support member 520 is large, the risk of damage (such as scratches) to the bottom surface of the substrate W increases; however, the support member 520 can be configured to support only the edge region of the bottom surface of the substrate W, thereby minimizing the contact area with the bottom surface of the substrate W.

[0106] The fluid supply unit 530 can supply a processing fluid to the processing space 513. The processing fluid can be a drying gas for removing any residual processing solution on the substrate W. For example, the processing fluid can be carbon dioxide gas. The processing fluid can also be converted to a supercritical state and supplied to the processing space 513. Alternatively, the processing fluid can be supplied to the processing space 513 in a gaseous state and phase-changed to a supercritical state within the processing space 513.

[0107] The fluid supply unit 530 can include a fluid supply source 531, a main supply pipeline 532, a first fluid supply pipeline 533, a second fluid supply pipeline 534, a first supply valve 535, and a second supply valve 536.

[0108] The supply pipelines 532, 533, and 534 can be equipped with pipeline heaters (not shown) to heat the processing fluid flowing in the supply pipelines 532, 533, and 534.

[0109] The fluid supply source 531 can store and / or supply the processing fluid. The fluid supply source 531 can be a fluid storage tank capable of storing and supplying the processing fluid. The fluid supply source 531 can be configured to store and supply carbon dioxide.

[0110] The fluid supply source 531 can be connected to one end of the main supply pipeline 532. The other end of the main supply pipeline 532 can branch into a first fluid supply pipeline 533 and a second fluid supply pipeline 534. The first fluid supply pipeline 533 can be connected to the first supply port 514 described above. The second fluid supply pipeline 534 can be connected to the second supply port 515. The first fluid supply pipeline 533 can be configured to supply the processing fluid to the upper region of the processing space 513, and the second fluid supply pipeline 534 can be configured to supply the processing fluid to the lower region of the processing space 513.

[0111] The first supply valve 535 can be installed in the first fluid supply pipeline 533. The first supply valve can be set as an automatic valve that receives a control signal from the controller 30 to allow or block the flow of the processing fluid in the first fluid supply pipeline 533.

[0112] Similarly, the second fluid supply pipeline 534 can be provided with a second supply valve 536. The second supply valve 536 can be set as an automatic valve that receives a control signal from the controller 30 to allow or block the flow of the processing fluid in the second fluid supply line 534.

[0113] The fluid discharge unit 540 can control the atmosphere in the processing space 513. The fluid discharge unit 540 can discharge the processing fluid supplied to the processing space to the outside of the drying chamber 500. The fluid discharge unit 540 can include a fluid discharge pipeline 541, a discharge device 542, and a discharge valve 543.

[0114] The fluid discharge pipeline 541 can be connected to the above-mentioned discharge port 516. The discharge valve 543 can be installed in the fluid discharge pipeline 541, and the discharge valve 543 can be set as an automatic valve that receives a control signal from the controller 30 to allow or block the flow of the processing fluid in the discharge pipeline 541.

[0115] The discharge device 542 can be coupled to the discharge pipeline 541. The discharge device 542 can be a pressure reduction device that decompresses the processing space 513. For example, the discharge device 542 can be a pump. However, without limitation, the discharge device 542 can be any known device that is differently modified to be able to provide decompression to the processing space 513 through the discharge pipeline 541 and the discharge port 516.

[0116] Figure 5 A diagram schematically showing a substrate-type sensor used in the teaching method of the present invention.

[0117] See Figure 5 , the substrate-type sensor WS can have the same or similar shape as the substrate W. The substrate-type sensor WS can be conveyed by the transfer robot 320. The substrate-type sensor WS can be supported on the transfer hand of the transfer robot 320.

[0118] The substrate-type sensor WS can include a board WS1, an image capturing unit WS2, a processor WS3, a memory WS4, a battery WS5, and a communication unit WS6. The board WS1 can be a body on which the image capturing unit WS2, the processor WS3, the memory WS4, the battery WS5, and the communication unit WS6 are mounted. The board WS1 can have the same or similar shape as the above-mentioned substrate W.

[0119] The image capturing unit WS2 can be a camera. The image capturing unit WS2 can be a component for acquiring the second image IM2 described below. The image capturing unit WS2 can also include a lighting lamp. The image capturing unit WS2 can be installed on the top surface of the board WS1 to capture an image in the upward direction.

[0120] The processor WS3 can generate instructions for controlling the image capturing unit WS2. The processor WS3 can also perform image processing on the second image IM2 acquired by the image capturing unit WS2. The second image IM2 processed by the processor WS3 can be stored in the memory WS4, which can be a storage medium such as RAM or ROM, or can be transmitted to the controller 30 via the communication unit WS6.

[0121] The communication unit WS6 can transmit data processed by the processor WS3 (such as a LAN card) and / or data stored in the memory WS4 to the controller 30. In addition, the communication unit WS6 can receive instructions from the controller 30.

[0122] The battery WS5 can supply the power required for the operation of the processor WS3, the memory WS4, and the communication unit WS6. The image capturing unit WS2, the processor WS3, the memory WS4, the battery WS5, and the communication unit WS6 can be electrically connected to each other.

[0123] Hereinafter, the teaching method of the exemplary embodiments of the present invention will be described in detail.

[0124] To perform the teaching method described below, the controller 30 can generate instructions for controlling the configuration of substrate processing apparatuses such as the transfer robot 320 and the drying chamber 500, and can transmit data / instructions to and receive data / instructions from the substrate type sensor WS. In addition, the teaching method can be automatically implemented by a program stored in the storage medium of the controller 30. Further, the teaching method can be a method for obtaining teaching points, which are the coordinates of the position where the transfer hand of the transfer robot 320 transfers the substrate W.

[0125] Figure 6 is a flowchart of the teaching method of the present invention. Refer to Figure 6 , the teaching method according to the exemplary embodiment of the present invention can include a first teaching operation S10 and a second teaching operation S20.

[0126] The first teaching operation S10 can be an operation for teaching the position of the chamber (especially the position of the drying chamber 500) with respect to the transfer robot 320. The first teaching operation S10 can include a substrate-type sensor seating operation S11, a marker capturing operation S12, a first error calculation operation S13, and a first hand position adjustment operation S14.

[0127] In the substrate-type sensor placement operation S11, the substrate-type sensor WS can be placed on the transfer hand of the transfer robot 320. The transfer hand can be any one of the first to third hands 320C-A1, 320C-B1, and 320C-C1 described above.

[0128] In the marker photographing operation S12, the marker plate MP is photographed in a state where the substrate-type sensor is placed on the transfer hand of the transfer robot 320. In the marker photographing operation S12, the transfer robot 320 can move to a position close to a chamber (such as the drying chamber 500) for performing a teaching operation based on the initial temporary teaching points. The initial temporary teaching points can be temporarily designated coordinates obtained from the design of the substrate processing apparatus. After the transfer robot 320 has moved to the position for performing teaching based on the initial temporary teaching points close to the drying chamber 500, the vision CAM of the transfer robot 320 can photograph the marker plate MP.

[0129] Figure 7 For a diagram showing the position of the marker plate photographed in the first teaching operation of the installation Figure 6 and Figure 8 For a diagram showing Figure 7 the appearance of the marker plate. Figure 7 It can be a diagram of the transfer robot 320 observing the drying chamber 500 in the X direction.

[0130] Refer to Figure 7 and Figure 8 The substrate processing apparatus can include a frame F. The frame F can provide a placement space in which the main body 510 of the drying chamber 500 described above can be provided. In each placement space, the main bodies 510 of the drying chamber 500 can be provided.

[0131] The frame F can be equipped with the marker plate MP. Since the marker plate MP is provided for the teaching operation, it is very important not to change its position. Since the second main body 512 moves repeatedly in the Z direction and the processing space 513 is maintained at a very high pressure during the execution of the process, the position of the main body 510 itself is very likely to change. Therefore, the marker plate MP can be mounted on the frame F to minimize the position change of the marker plate MP during the process.

[0132] The marker plate MP can be marked with a plurality of teaching marks M. It should be understood that marking the marker plate MP with the teaching marks M includes not only the marker plate MP itself that is processed to mark the teaching marks M, but also the teaching marks M that are separately printed and pasted onto the marker plate MP. The plurality of teaching marks M can be QR codes. The teaching mark M in the form of a QR code can include information about the drying chamber 500. In addition, the plurality of teaching marks M can be arranged side by side in the Y direction.

[0133] A plurality of teaching marks M may include a first mark M1, a second mark M2, and a third mark M3. The first mark M1, the second mark M2, and the third mark M3 may be QR codes of different shapes. The first mark M1, the second mark M2, and the third mark M3 may contain information about different drying chambers 500.

[0134] In the mark photographing operation S12, the mark plate MP may be photographed to obtain a first image IM1.

[0135] Figure 9 FIG. is a diagram showing a first image acquired by a vision device before completion of a first teaching operation.

[0136] See Figure 6 and Figure 9 , when the transfer robot 320 acquires the first image IM1, the transfer hand of the transfer robot 320 may have moved based on the initial temporary teaching point. When the initial temporary teaching point of the transfer robot 320 corresponds to a normal position, the center point (IMC1, an example of a first reference point) of the first image IM1 acquired by the vision device CAM and the center of the mark plate MP may coincide with each other. In Figure 9 , since the center point of the mark plate MP and the center point IMC1 of the first image do not coincide with each other, the initial temporary teaching point may be in a state that needs to be adjusted.

[0137] In the first error calculation operation S13, the controller 30 may calculate an error for adjusting the initial temporary teaching point of the transfer robot 320 from the first image IM1 acquired by the vision device CAM.

[0138] Specifically, the first error calculation operation S13 may include calculating an error between the position of the transfer hand when the transfer robot 320 acquires the first image IM1 (the position before adjusting the initial teaching point) and the position of the transfer hand when the transfer hand transfers the substrate W to the normal position (the position after adjusting the initial teaching point).

[0139] The teaching plate MP may be marked with a plurality of teaching marks M. The vision device CAM may detect the plurality of teaching marks M. The controller 30 may obtain the angle A of inclination of the teaching plate MP based on the direction in which the teaching marks M are listed in the first image IM1. In addition, the controller 30 may compare the length D1 from left to right and the length D2 from top to bottom of the mark plate MP obtained from the first image IM1 with the actual length from left to right and the actual length from top to bottom of the mark plate MP, and obtain a deviation therefrom. Further, a first offset amount OF1 from the mark plate MP and the center point IMC1 of the first image IM1 may be obtained.

[0140] Based on the inclination angle A of the marking plate MP as described above, the deviation between the length of the marking plate MP in the image and the actual length, and the first offset amount OF1, the error between the position when the transfer hand of the transfer robot 320 transfers the substrate W to the normal position and the position when the transfer hand acquires the first image IMC1 can be calculated.

[0141] The calculated error can be an error in the Y direction, an error in the Z direction, or an error in the θ direction.

[0142] In the first hand position adjustment operation S14, based on the error value calculated in the first error calculation operation S13, the position and angle of the transfer hand of the transfer robot 320 can be adjusted by the error in the Y direction, the error in the Z direction, and the error in the θ direction. When the first hand position adjustment operation S14 is completed, the transfer hand of the transfer robot 320 can be placed at the normal position. The coordinates of the transfer hand of the transfer robot 320 placed at the normal position can be stored in the controller 30 as the initial teaching point.

[0143] Figure 10 It is a diagram showing the first image acquired by the vision after the first teaching operation is completed.

[0144] When the vision CAM photographs the marking plate MP after the first teaching operation S10 is completed, the center of the marking plate MP can coincide with the center point IMC1 of the first image IM1.

[0145] When the first teaching operation S10 is completed, the processing space 513 can be opened. In this case, the transfer hand of the transfer robot 320 can move downward by a set distance. Thereafter, the hand loading operation S21 described later can be executed.

[0146] Refer again to Figure 6 , the second teaching operation S20 can be executed after the first teaching operation S10. The second teaching operation S20 can be an operation of teaching the position where the transfer hand of the transfer robot 320 places the substrate W on the support member 520.

[0147] The second teaching operation S20 can include a hand loading operation S21, a port photographing operation S22, a second error calculation operation S23, and a second hand adjustment operation S24.

[0148] In the hand loading operation S21, the transfer hand can be loaded into the processing space 513. The transfer hand can be loaded into the processing space 513 while supporting the substrate type sensor WS. The transfer hand can be loaded into the processing space 513 according to the secondary temporary teaching point. The secondary temporary teaching point can be a teaching point temporarily obtained from the design of the substrate processing apparatus, similar to the above-mentioned primary temporary teaching point.

[0149] The port photographing operation S22 may be an operation of photographing the structure of the drying chamber 500 (such as the first supply port 514) by the substrate type sensor WS placed on the transfer hand. In the port photographing operation S22, the substrate type sensor WS may photograph the first supply port 514 in a state where the substrate type sensor WS is placed on the transfer hand. In the port photographing operation S22, the second image IM2 may be obtained. The first supply port 514 is a circular fluid port. Therefore, the image obtained by photographing the first supply port 514 by the substrate type sensor WS may also have a circular shape.

[0150] Figure 11 A diagram showing the second image obtained by the substrate type sensor before completion of the second teaching operation.

[0151] See Figure 6 and Figure 11 In the second error calculation operation S23, from the second image IM2, the radius R of the first supply port 514 and the second offset OF2 between the center point of the first supply port 514 and the center point (IMC2, an example of the second reference point) of the second image IM2 can be obtained. Then, the error between the position when the transfer hand transfers the substrate W to the normal position and the position of the transfer hand when the substrate type sensor WS obtains the second image IM2 can be obtained.

[0152] The above error can be calculated from the radius R of the first supply port 514 and the second offset OF2. For example, the radius R of the first supply port 515 in the second image IM2 is compared with a pre-stored radius (for example, the radius of the first supply port 514 photographed by the substrate type sensor WS placed on the transfer hand when the transfer hand transfers the substrate W to the normal position). Further, when the radius R is smaller than the pre-stored radius, it is determined that the height of the transfer hand in the Z direction is low, and when the radius R is larger than the pre-stored radius, it is determined that the height of the transfer hand in the Z direction is high. In addition, the error of the transfer hand in the X direction and the Y direction, and if necessary the error in the θ direction, can be calculated according to the second offset OF2.

[0153] In the second hand position adjustment operation S24, the position and / or angle of the transfer hand can be adjusted by the errors in the X direction, Y direction, Z direction, and θ direction calculated in the second error calculation operation S23. After performing the second position adjustment operation S24, the transfer hand of the transfer manipulator 320 can be placed in the normal position. The coordinates of the transfer hand of the transfer manipulator 320 placed in the normal position can be stored in the controller 30 as a secondary teaching point.

[0154] Figure 12A diagram showing a second image acquired by a substrate type sensor after completion of a second teaching operation.

[0155] After the second teaching operation S20 is completed, when the first supply port 514 is photographed by the substrate type sensor WS, the radius of the first supply port 514 is the same as the pre-stored radius, and the center point of the first supply port 514 can coincide with the center point IMC2 of the second image IM2. The substrate type sensor WS photographs the first supply port 514 having a cylindrical shape. When photographing the first supply port 514, since its shape is circular, it is relatively easy to obtain the radius and the center point of the first supply port 514.

[0156] In addition, when viewed from above, the center of the first supply port 514 coincides with the center of the substrate W placed on the support member 520. Therefore, when obtaining the secondary teaching point through the first supply port 514, the advantage is that even if no separate teaching mark is marked / installed in the drying chamber 500, the transfer position of the substrate W can be taught relatively accurately.

[0157] In the above example, the present invention has been described based on the case where the substrate type sensor WS as an example photographs the first supply port 514, but it is not limited thereto. For example, the substrate type sensor WS can be provided in the chamber, and can photograph a circular structure having a center that coincides with the center of the substrate W placed at a conventional position, thereby performing the second teaching operation S20.

[0158] It should be understood that exemplary embodiments are disclosed herein and other variations are possible. The individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable where applicable and can be used in the selected exemplary embodiment even if not specifically shown or described. Modifications should not be considered to depart from the spirit and scope of the present invention, and all such modifications that are obvious to those of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A teaching method for a transfer robot including a transfer hand, the teaching method comprising: a first teaching operation in which a first image is acquired by photographing a marking plate attached to a chamber or a frame surrounding the chamber through a vision chamber provided on the transfer robot for transferring a substrate, and a teaching point of the transfer robot is adjusted based on the first image; as well as A second teaching operation in which a second image is acquired by photographing a structure in the chamber by a substrate-type sensor including an image capturing unit placed on a hand of the transfer robot, and a teaching point of the transfer robot is adjusted based on the second image.

2. The teaching method according to claim 1, wherein: When the visual member faces the chamber, a front-rear direction is defined as an X direction, a left-right direction is defined as a Y direction, an up-down direction is defined as a Z direction, and a circumferential direction centered on the Z direction is defined as a θ direction, and On the marking plate, a plurality of teaching marks are marked side by side along the Y direction.

3. The teaching method according to claim 2, wherein: The teaching mark is a QR code.

4. The teaching method according to claim 2, wherein: The first teaching operation includes: a marking shooting operation, in which the first image is acquired through the visual element; and A first error calculation operation is performed in which the teaching mark is identified and at least one of the direction of the teaching mark, the length of the mark plate, and the offset between the mark plate and a first reference point is obtained from the first image, and based on the obtained results, an error is calculated between the position of the transfer hand when the transfer robot acquires the first image and the position of the transfer hand when the transfer hand transfers the substrate to a normal position.

5. The teaching method according to claim 4, wherein: The method further comprises: A first hand position adjustment operation, in which the position and / or angle of the transfer hand of the transfer robot is adjusted by the errors in the Y direction, Z direction and / or θ direction calculated in the first error calculation operation.

6. The teaching method according to claim 1, wherein: The second teaching operation includes: a hand loading operation in which the transfer hand is loaded into the processing space of the chamber in a state in which the transfer hand supports the substrate-type sensor; and A port photographing operation in which a circular fluid port is photographed by a substrate-type sensor loaded into the processing space by the transfer hand to acquire the second image.

7. The teaching method according to claim 6, wherein: The port photographing operation includes photographing, by the substrate type sensor, the fluid port in a state where the substrate type sensor is placed on the transfer hand.

8. The teaching method according to claim 7, wherein: The second teaching operation includes a second error calculation operation in which at least one of the radius of the fluid port and the offset between the center point of the fluid port and a second reference point is obtained from the second image, and based on the obtained results, an error is calculated between the position of the transfer hand when the substrate-type sensor acquires the second image and the position of the transfer hand when the transfer hand transfers the substrate to a normal position.

9. The teaching method according to claim 8, wherein: When the visual member faces the chamber, a front-rear direction is defined as an X direction, a left-right direction is defined as a Y direction, an up-down direction is defined as a Z direction, and a circumferential direction centered on the Z direction is defined as a θ direction, and The teaching method also includes a second hand position adjustment operation, in which the position and / or angle of the transfer hand of the transfer robot is adjusted by the errors in the X direction, Y direction, Z direction and / or θ direction calculated in the second error calculation operation.

10. A teaching program stored in a storage medium, the teaching program being used to obtain a teaching point of a transfer robot included in a substrate processing device, the teaching program executing: An instruction for acquiring a first image is generated by a vision device provided on the transfer robot, by photographing a marker plate attached to the chamber or a frame surrounding the chamber, wherein: The marking plate is marked with a plurality of teaching marks; obtain, from the first image, at least one of a direction in which the teaching mark is arranged, a length of the mark plate, and a first offset between the mark plate and a center point of the first image; as well as An error in the taught position of the hand of the transfer robot is calculated by at least one of a direction in which the teach mark is arranged, a length of the mark plate, and the first offset.

11. The teaching program according to claim 10, wherein: The teaching program generates instructions for initially adjusting the position of the transfer hand of the transfer robot in at least one of the following directions based on the calculated error: the Z direction being the up and down direction, the Y direction being the horizontal direction perpendicular to the Z direction, and the θ direction being the circumferential direction centered on the Z direction.

12. The teaching program according to claim 11, wherein: The teaching program is executed to store the coordinates of the transport hand as a first teaching point after the position of the transport hand is first adjusted.

13. The teaching program according to claim 11, wherein: The teaching program generates a command for loading the transfer hand into the processing space of the chamber in a state where the transfer hand supports a substrate-type sensor after the position of the transfer hand is adjusted initially; and An instruction is generated to cause the substrate-type sensor to image the fluid port of the chamber to obtain a second image.

14. The teaching program according to claim 13, wherein: The teach program performs deriving, from the second image, a radius of the fluid port and a second offset between a center of the fluid port and a center point of the second image.

15. The teaching program according to claim 14, wherein: The teaching program generates instructions for secondarily adjusting the position of the transfer hand in the Y direction, the Z direction, the θ direction, and the X direction perpendicular to the Y direction and the Z direction based on the radius of the fluid port and the second offset.

16. The teaching program according to claim 15, wherein: The teaching program is executed to store the coordinates of the transport hand as a secondary teaching point after the position of the transport hand is secondarily adjusted.

17. An apparatus for processing a substrate, the apparatus comprising: a plurality of chambers configured to process a substrate, wherein the chambers provide a processing space in which the substrate is processed and include a port for supplying a processing fluid to the processing space; a frame configured to provide a placement space in which a plurality of chambers are arranged; a teaching plate attached to the frame and marked with a plurality of teaching marks; a transfer robot configured to transfer a substrate; and a controller configured to control the chamber and the transfer robot, Wherein, the conveying robot comprises: a transfer hand on which the substrate and the substrate-type sensor are selectively placed; and a visual component placed on the top side of the transfer hand and photographing the teaching board, and A controller adjusts a teaching point of the transfer hand based on a first image acquired by photographing the teaching plate and a second image acquired by photographing the port.

18. The device according to claim 17, wherein: The first image is acquired by the vision member, and the second image is acquired by the substrate type sensor placed on the transfer hand.

19. The device according to claim 17, wherein: The teaching mark marked on the teaching board is a QR code.

20. The device according to claim 17, wherein: The port is a supply port and has a circular shape, the supply port supplying the process fluid to a top surface of the substrate.

Images