Heat dissipation control method and system, electronic equipment and storage medium

Abstract

The invention discloses a heat dissipation control method and system, electronic equipment and a storage medium, and relates to the technical field of heat dissipation, and the method comprises the steps: obtaining the load power of a heating source, and the current environment temperature of the environment where the heating source is located; and based on the load power and the current environment temperature, a heat dissipation control mode is determined through the prediction model, the heat dissipation control mode comprises at least one of a phase change material control mode, a liquid cooling control mode and an air cooling control mode, and the heat dissipation control mode is used for conducting heat dissipation on the heating source. According to the method provided by the invention, the heat dissipation control mode of the heating source can be predicted in advance by using the prediction model, so that the control mode of multiple modules is coordinated and controlled in advance, and active heat dissipation is realized.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and in particular, to a heat dissipation control method and system, an electronic device, and a storage medium. Background Art

[0002] In related heat dissipation control solutions, an increase in temperature will cause an increase in signal loss transmitted on a printed circuit board assembly, thereby affecting the signal quality. However, during the operation of an electronic device, heat dissipation technologies such as fans and liquid cooling, as well as heat-generating components such as chips, will also affect the internal temperature of the electronic device, resulting in inaccurate temperature of the printed circuit board assembly in the electronic device, and further leading to inaccurate heat dissipation control and low heat dissipation control efficiency in the printed circuit board assembly. Summary of the Invention

[0003] The present disclosure provides a heat dissipation control method and system, an electronic device, and a storage medium. Its main purpose is to solve the problem of low heat dissipation control efficiency in related technologies.

[0004] This application provides a heat dissipation control method, including: obtaining the load power of a heat source and the current ambient temperature of the environment where the heat source is located; based on the load power and the current ambient temperature, determining a heat dissipation control mode through a prediction model, where the heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the heat dissipation control mode is used to dissipate heat from the heat source.

[0005] This application also provides a heat dissipation control system, including: a heat source, a phase change material control module, a liquid cooling control module, an air cooling control module, and a control module, The control module is configured to determine a heat dissipation control mode through a prediction model based on the load power of the heat source and the current ambient temperature of the environment where the heat source is located. The heat dissipation control mode is used to perform heat dissipation control on at least one of the phase change material control module, the liquid cooling control module, and the air cooling control module, and the heat dissipation control mode is used to dissipate heat from the heat source.

[0006] This application also provides a heat dissipation control device, including: an acquisition module, configured to obtain the load power of the heat source and the current ambient temperature of the environment where the heat source is located; a control module, configured to determine a heat dissipation control mode through a prediction model based on the load power and the current ambient temperature, where the heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the heat dissipation control mode is used to dissipate heat from the heat source.

[0007] This application also provides an electronic device, including: a memory for storing a computer program; a processor for implementing the steps of any of the above heat dissipation control methods when executing the computer program.

[0008] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above heat dissipation control methods are implemented.

[0009] The present application also provides a computer program product, including a computer program. When the computer program is executed by a processor, the steps of any of the above heat dissipation control methods are implemented.

[0010] Through the present application, the load power of the heat source and the current ambient temperature of the environment where the heat source is located are obtained; based on the load power and the current ambient temperature, a heat dissipation control mode is determined through a prediction model. The heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode. The heat dissipation control mode is used to dissipate heat from the heat source. The method provided by the present disclosure can use a prediction model to predict in advance the heat dissipation control mode of the heat source, so as to coordinate in advance the control modes of multiple modules and achieve active and accurate heat dissipation.

[0011] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present application, nor is it used to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0013] Figure 1 It is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present application; Figure 2 It is a schematic flowchart of determining a heat dissipation control mode provided by an embodiment of the present application; Figure 3 It is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present application; Figure 4 It is a schematic structural diagram of a heat dissipation control system provided by an embodiment of the present application; Figure 5A It is a schematic structural diagram of a heat dissipation system; Figure 5B It is a schematic structural diagram of a heat dissipation substrate; Figure 5C It is a schematic diagram of a heat dissipation fin cavity; Figure 5D It is a schematic structural diagram of a heat dissipation fin; Figure 5E Schematic diagram of the positions of the fan and the heat dissipation fins; Figure 5F Schematic diagram of the heat dissipation control process; Figure 6 Schematic diagram of the structure of a heat dissipation control device provided by an embodiment of the present application. Detailed implementation manners

[0014] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.

[0015] It should be noted that in the description of the present application, the terms "including", "comprising" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0016] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners.

[0017] The related heat dissipation technologies have the following problems: 1. Traditional air cooling has low efficiency, high energy consumption, and high noise at high blockage, and cannot meet the requirements of rapid heat dissipation; 2. A single liquid cooling system has a risk of leakage and high maintenance costs; 3. The current temperature control algorithms cannot adapt to transient heat load changes, the temperature fluctuation range is large, and there is a lack of dynamic response ability to equipment load changes, resulting in energy waste and reduced energy efficiency ratio.

[0018] To solve the problems existing in the related solutions, the embodiments of the present application provide a heat dissipation control method and system, including: obtaining the load power of the heat source and the current ambient temperature of the environment where the heat source is located; based on the load power and the current ambient temperature, determining a heat dissipation control mode through a prediction model, and the heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the heat dissipation control mode is used to dissipate heat from the heat source. The method provided by the present disclosure can use the prediction model to predict the temperature value of the heat source in advance, and further determine the heat dissipation control mode corresponding to the temperature value, so as to coordinate the control modes of multiple modules in advance and achieve active heat dissipation.

[0019] To enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Figure 1 It is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present disclosure.

[0021] As Figure 1 shown, the method includes the following steps: Step 101, obtain the load power of the heat source and the current ambient temperature of the environment where the heat source is located.

[0022] In some embodiments, the load power of the heat source can be obtained from the heat source, and the current ambient temperature of the environment where the heat source is located can be obtained through a temperature sensor, and the temperature sensor can detect the temperature of the environment where the heat source is located.

[0023] In some embodiments, the heat source can be a CPU or a main control module in an electronic device, etc., and the present disclosure is not limited thereto.

[0024] In some embodiments, the load power of the heat source is proportional to the temperature of the heat source. In other words, when the load power of the heat source is greater, the temperature of the heat source will be higher, and when the load power of the heat source decreases, the temperature of the heat source will also decrease accordingly.

[0025] In some embodiments, the current ambient temperature of the environment where the heat source is located will affect the temperature of the heat source. In other words, the higher the ambient temperature, the lower the heat dissipation rate of the heat source, and the lower the ambient temperature, the heat dissipation rate of the heat source will remain unchanged or increase, so the ambient temperature will also affect the heat dissipation efficiency of the heat source.

[0026] Step 102, based on the load power and the current ambient temperature, determine a heat dissipation control mode through a prediction model.

[0027] In some embodiments, the heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the heat dissipation control mode is used to dissipate heat from the heat source.

[0028] In some embodiments, the prediction model is used to predict the temperature of the heat dissipation substrate. The heat dissipation substrate is in contact with the heat source, and a high thermal conductivity material is filled between the heat dissipation substrate and the heat source. The heat dissipated by the heat source is transferred to the heat dissipation substrate through contact, so that the temperature of the heat source is the same as the temperature of the heat dissipation substrate. The temperature of the heat source can be monitored in real time through a plurality of temperature sensors arranged on the heat dissipation substrate to ensure the heat dissipation control of the heat source.

[0029] In some embodiments, the prediction model can be obtained after training using an initial prediction model, or can be a trained prediction model obtained from other entities, and the present disclosure does not limit this.

[0030] In some embodiments, the prediction model can be used to predict the temperature of the heat dissipation substrate and further obtain the corresponding heat dissipation control mode, that is, the model can directly obtain the control methods at different temperatures.

[0031] In some embodiments, the phase change material control mode is to cycle between the gaseous and liquid states through the phase change material to achieve the effect of heat dissipation.

[0032] In some embodiments, the liquid cooling control mode is to control the temperature of the refrigerant and the flow rate of the refrigerant to achieve heat dissipation of the heat source.

[0033] In some embodiments, the air cooling control mode is to control the rotation speed of the fan to achieve heat dissipation of the heat source.

[0034] In some embodiments, the prediction model can predict the temperature value of the heat source in a future time period based on the load power and the current ambient temperature. That is, due to the change in load power, the temperature of the heat source has a lag and will gradually increase after a certain time. Therefore, through the prediction model, the temperature value of the heat source at a future time point can be predicted under the load power and the current ambient temperature.

[0035] In some embodiments, the prediction model can determine the heat dissipation control mode for dissipating heat from the heat source according to the predicted temperature value, so as to actively dissipate heat from the heat source in advance and avoid the increase in the difficulty of heat dissipation caused by dissipating heat after the temperature of the heat source rises.

[0036] In some embodiments, at different load powers and different current ambient temperatures, the heat dissipation control mode can be a phase change material control mode, or a liquid cooling control mode, or an air cooling control mode; or, it can be a phase change material control mode and a liquid cooling control mode; or, it can be a phase change material control mode and an air cooling control mode; or, it can be a liquid cooling control mode and an air cooling control mode; or, it can be various combined control modes such as a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the present disclosure is not limited thereto.

[0037] In some embodiments, the phase change material control mode can implement different control methods based on different predicted temperature values, the liquid cooling control mode can also obtain different control parameters according to different predicted temperature values, and the air cooling control mode can also obtain different control parameters according to different predicted temperature values, so as to perform separately or in combination based on each mode to achieve heat dissipation of the heat source.

[0038] In the above embodiments, combined with AI prediction, based on the load power and the current ambient temperature, the future temperature value of the heat source can be accurately predicted, and further, the heat dissipation control mode for controlling the heat dissipation of the heat source can be adjusted. This mode can integrate the combination of multiple modes to achieve active heat dissipation of the heat source, so as to improve the heat dissipation efficiency and heat dissipation effect.

[0039] In some embodiments, as Figure 2 shown, Figure 2 is a schematic flow chart for determining the heat dissipation control mode provided by the embodiment of the present application, including the following steps: Step 201, use the load power and the current ambient temperature as the input of the prediction model to determine the predicted temperature value of the heat dissipation substrate under the load power.

[0040] In some embodiments, the prediction model can determine the corresponding predicted temperature value of the heat dissipation substrate based on the real-time monitored load power and the current ambient temperature. This predicted temperature value is the possible temperature value that the heat source corresponding to the heat dissipation substrate may reach under the load power and the current ambient temperature. In other words, the prediction model can predict the temperature of the heat source in advance to perform heat dissipation control based on the predicted temperature value.

[0041] In the above embodiments, using the prediction model to predict the predicted temperature value of the heat dissipation substrate in advance can achieve advance prediction of the temperature, so as to actively determine the heat dissipation control mode, achieve active heat dissipation, improve the heat dissipation efficiency, and avoid the lag of starting heat dissipation control after the temperature rises.

[0042] Step 202, determine the first control mode corresponding to the predicted temperature value, and dynamically adjust the heat dissipation control mode based on the current ambient temperature.

[0043] In some embodiments, determining a first control mode corresponding to a predicted temperature value and dynamically adjusting the heat dissipation control mode based on the current ambient temperature includes: determining a first control mode based on the predicted temperature value, where the first control mode includes a first power of a refrigeration unit corresponding to a liquid cooling control mode and a second power of a water pump unit, and / or a rotational speed of a fan corresponding to an air cooling control mode, and / or a phase change material control mode; based on the current ambient temperature, dynamically adjusting the first power and the second power according to a preset rule, and / or dynamically adjusting the rotational speed to obtain a heat dissipation control mode.

[0044] In some embodiments, after the prediction model obtains the predicted temperature value, further determine a first control mode corresponding to the predicted temperature value, where the first control mode is the specific control method or control parameter of each module of heat dissipation control corresponding to the predicted temperature value obtained based on experience or historical data.

[0045] Exemplarily, the AI large model can rollingly regulate the operation mechanism of the heat dissipation device based on the real-time monitored load power and ambient temperature.

[0046] In some embodiments, the first control mode includes control parameters corresponding to each control sub-mode. For example, it can be a first power of a refrigeration unit corresponding to a liquid cooling control mode and a second power of a water pump unit; or it can be a rotational speed of a fan corresponding to an air cooling control mode; or it can be a specific heat dissipation method corresponding to a phase change material control mode.

[0047] In some embodiments, the first control mode can be a combination of multiple control sub-modes. For example, it can be a specific heat dissipation method of a phase change material control mode and a rotational speed corresponding to an air cooling control mode, or it can be a specific heat dissipation method of a phase change material control mode and a first power and a second power corresponding to a liquid cooling control mode, or it can be a specific heat dissipation method of a phase change material control mode, a rotational speed corresponding to an air cooling control mode, and a first power and a second power corresponding to a liquid cooling control mode.

[0048] In some embodiments, based on the current ambient temperature, dynamically adjusting the first power and the second power according to a preset rule can be to judge the adjustment logic corresponding to the current ambient temperature according to the preset rule to adjust the first power and the second power.

[0049] In some embodiments, based on the current ambient temperature, dynamically adjusting the rotational speed according to a preset rule can be to judge the adjustment logic corresponding to the current ambient temperature according to the preset rule to adjust the rotational speed.

[0050] In some embodiments, determining a first control mode corresponding to a predicted temperature value can be to use a trained prediction model, and after inputting the predicted temperature value, obtain a first control mode corresponding to the predicted temperature value.

[0051] In some embodiments, determining the first control mode corresponding to the predicted temperature value may be based on the corresponding mechanism between the predicted temperature value and the first control mode to obtain the first control mode corresponding to the predicted temperature value.

[0052] In some embodiments, at different predicted temperature values, the determined first control modes may be different control modes. Specifically, the following heat dissipation control modes may be available according to different predicted temperature values: Method 1: In some embodiments, determining the first control mode based on the predicted temperature value includes: when the predicted temperature value is less than the first value, determining that the phase change material control mode is the automatic mode. In the automatic mode, at least one heat dissipation fin inserted into the slot of the heat dissipation substrate dissipates heat from the heat source through the cyclic conversion of the phase change material between the liquid state and the gaseous state to keep the temperature of the heat dissipation substrate less than the first value; determining that the liquid cooling control mode is in the standby state, and the first power and the second power are zero; determining that the air cooling control mode is in the operating state, and in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

[0053] In some embodiments, the first value is a preset temperature threshold, and the first value is, for example, 50°C.

[0054] In some embodiments, when the predicted temperature value is less than the first value, it may be to determine the first control mode as the basic heat dissipation strategy. Specifically, it may be to determine that the phase change material control mode is the automatic mode, the liquid cooling control mode is in the standby state, and the air cooling control mode is in the operating state.

[0055] In some embodiments, when the phase change material control mode is the automatic mode, at least one heat dissipation fin inserted into the slot of the heat dissipation substrate dissipates heat from the heat source through the cyclic conversion of the phase change material between the liquid state and the gaseous state. Specifically, a plurality of slots are provided on the heat dissipation substrate, and one heat dissipation fin can be inserted into each slot. The heat dissipation fin has screws to firmly fix the heat dissipation fin on the heat dissipation substrate and make the pipe connection more sealed.

[0056] In some embodiments, a space is left inside the heat dissipation fin, and the reserved cavity is filled with a phase change material for gas-liquid conversion. The phase change material can realize gas-liquid conversion inside the cavity of the heat dissipation fin to dissipate heat through cyclic conversion.

[0057] Further, when the temperature of the phase change material exceeds 50°C, the phase change material in the evaporation section absorbs heat and converts into gas and moves upward to the condensation section. In the condensation section, the gas releases heat and converts into liquid and then flows downward to the evaporation section to form a heat dissipation circulation system.

[0058] In the above embodiments, multiple heat dissipation fins that can be plugged and unplugged on the heat dissipation substrate can adapt to heat sources of different specifications and can be individually disassembled from the heat dissipation substrate for maintenance and upgrading.

[0059] In some embodiments, the liquid cooling control mode being in the standby state can mean that the power of both the refrigeration unit and the water pump unit in the liquid cooling control module is zero. In other words, the refrigeration unit does not cool the refrigerant, and the water pump unit does not push the refrigerant to flow, and the liquid cooling control module does not dissipate heat from the heat source.

[0060] Exemplarily, in the basic heat dissipation strategy, when the temperature of the heat dissipation substrate is less than 50 °C, at this time, the heat of the heat source is conducted to the heat dissipation substrate by contact, then to the heat dissipation fins, and finally to the air. The liquid cooling control module is in the standby state and is ready to start running at any time.

[0061] In some embodiments, the gaseous control mode being in the operating state can mean that in the operating state, the rotational speed of the fan corresponding to the gaseous control module has a preset corresponding relationship with the predicted temperature value.

[0062] In some embodiments, the preset corresponding relationship can be that when the predicted temperature value is less than the fifth value, the rotational speed is zero; when the predicted temperature value is greater than or equal to the fifth value and less than the first value, the rotational speed is greater than zero and less than the first rotational speed value.

[0063] In some embodiments, the fifth value can be a preset temperature threshold. The fifth value can be, for example, 30 °C. When the predicted temperature value is less than the fifth value, the rotational speed of the fan is zero. When the predicted temperature value is greater than or equal to the fifth value and less than the first value, the fan can adaptively maintain low-speed operation, that is, it can be adaptively adjusted between greater than zero and less than the first rotational speed value.

[0064] In some embodiments, the first rotational speed value can be a preset low-speed rotational speed threshold of the fan. The fan's adaptive adjustment can be that for every 1 °C increase in temperature, the rotational speed increases by 2%. Specifically, the adaptive adjustment strategy can be customized according to requirements and scenarios, and the present disclosure does not limit this.

[0065] In some embodiments, when the predicted temperature value is less than the first value, it is determined that the first control mode is a combination of the automatic mode of the phase change material control mode and the operating state of the air cooling control mode for heat dissipation control, so as to realize the automatic gas-liquid circulation of the phase change material and the adaptive adjustment of the fan to dissipate heat from the heat source, which can not only meet the heat dissipation requirements but also reduce noise and energy consumption.

[0066] Exemplarily, in the basic heat dissipation strategy, when the temperature of the heat dissipation substrate is less than 50°C, the fan will run at a speed of 0 to 20% adaptively at a low speed according to the temperature range of the heat dissipation substrate (30°C to 50°C), and take away the heat on the heat dissipation fins through air flow to achieve the effect of continuous heat dissipation. At this time, not only the heat dissipation requirements are met, but also the noise and energy consumption are minimized to the greatest extent.

[0067] Method 2: In some embodiments, based on the predicted temperature value, a first control mode is determined, including: when the predicted temperature value is greater than or equal to the first value and less than the second value, determining that the phase change material control mode is the automatic mode; determining that the liquid cooling control mode is the first state, in the first state, the first power is dynamically adjusted within the first power range, and the second power is dynamically adjusted within the second power range; determining that the air cooling control mode is the operating state, in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

[0068] In some embodiments, the second value is a preset temperature threshold, and the second value is, for example, 65°C.

[0069] In some embodiments, when the predicted temperature value is greater than or equal to the first value and less than the second value, it is determined that the phase change material control mode is the automatic mode, and the heat dissipation method of the automatic mode is the same as that of the automatic mode in the above-mentioned method 1, which will not be elaborated here.

[0070] In some embodiments, when the predicted temperature value is greater than or equal to the first value and less than the second value, it is determined that the liquid cooling control mode is the first state. In the first state, the first power of the refrigeration unit is dynamically adjusted within the first power range, and the second power of the water pump unit is dynamically adjusted within the second power range. Among them, the first power range and the second power range can be preset adjustment range values. The first power range and the second power range can be the same range or different ranges, and the present disclosure does not limit this.

[0071] Exemplarily, the first power range is 20% to 50%, and the second power range is 20% to 50%.

[0072] In some embodiments, the first power is dynamically adjusted within the first power range, and the second power is dynamically adjusted within the second power range. It can be that when the predicted temperature value is within the range of the first value and the second value, for every 1°C increase, the corresponding power is adjusted by a preset ratio within the power range. This preset ratio can be customized according to requirements or scenarios, and the present disclosure does not limit this. For example, when the predicted temperature value is relative to 50°C, for every 1°C increase, the power will increase by 2%.

[0073] Exemplarily, when the temperature of the heat dissipation substrate is greater than or equal to 50°C and less than 65°C, the liquid cooling control module intervenes to work. The controller of the liquid cooling control module monitors the return water temperature through the temperature sensor integrated on the liquid cooling control module and the temperature (50°C - 65°C) monitored by the temperature sensor on the heat dissipation substrate, and adaptively adjusts the temperature and flow rate of the coolant. The refrigeration unit of the liquid cooling control module operates at a power of 20% - 50%, and the water pump operates at a power of 20% - 50%. The heat on the heat dissipation fins is taken away by the circulation of low-temperature liquid and different flow rates, realizing the rapid transfer of the heat on the heat dissipation fins.

[0074] In some embodiments, when the predicted temperature value is greater than or equal to the first value and less than the second value, the air cooling control mode is in the operating state. In the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

[0075] In some embodiments, the preset corresponding relationship may be that when the predicted temperature value is less than the fifth value, the rotation speed is zero; when the predicted temperature value is greater than or equal to the fifth value and less than the first value, the rotation speed is greater than zero and less than the first rotation speed value; when the predicted temperature value is greater than or equal to the first value, the rotation speed is greater than the first rotation speed value and less than the second rotation speed value.

[0076] In some embodiments, when the predicted temperature value is greater than or equal to the first value and less than the second value, the rotation speed of the fan is greater than the first rotation speed value and less than the second rotation speed value. Among them, the first rotation speed value and the second rotation speed value are pre-set rotation speeds. For example, the first rotation speed value is 20% and the second rotation speed value is 50%.

[0077] Exemplarily, when the temperature of the heat dissipation substrate is greater than or equal to 50°C and less than 65°C, the fan will run at a speed of 20% - 50% and adaptively run at medium speed according to the temperature range monitored by the temperature sensor on the heat dissipation substrate. The heat on the heat dissipation fins is accelerated to be taken away by the rapid flow of air to achieve a continuous and rapid heat dissipation effect.

[0078] In the above embodiments, when the predicted temperature value is greater than or equal to the first value and less than the second value, it is determined that the first control mode is the automatic mode of the phase change material control mode, the liquid cooling control mode is in the first state, and the rotation speed in the air cooling control mode is greater than the first rotation speed value and less than the second rotation speed value to achieve rapid heat dissipation of the heat source.

[0079] Method Three: In some embodiments, determining a first control mode based on a predicted temperature value includes: when the predicted temperature value is greater than or equal to a second value and less than a third value, determining that the phase change material control mode is in an automatic mode; determining that the liquid cooling control mode is in a second state, in which a first power is dynamically adjusted within a third power range and a second power is dynamically adjusted within a fourth power range; determining that the air cooling control mode is in an operating state, in which the rotational speed of the fan has a preset correspondence with the predicted temperature value.

[0080] In some embodiments, when the predicted temperature value is greater than or equal to a second value and less than a third value, a first control mode is determined, where the third value may be a pre-set temperature threshold, and the third value is, for example, 80 °C.

[0081] In some embodiments, when the predicted temperature value is greater than or equal to a second value and less than a third value, it is determined that the phase change material control mode is in an automatic mode, and the heat dissipation method in the automatic mode is as described in Method 1, which will not be elaborated here.

[0082] In some embodiments, when the predicted temperature value is greater than or equal to a second value and less than a third value, it is determined that the liquid cooling control mode is in a second state, and the second state may be that a first power is dynamically adjusted within a third power range and a second power is dynamically adjusted within a fourth power range. Among them, the third power range and the fourth power range may be pre-set power range values, and the third power range and the fourth power range may be the same or different, and the present disclosure does not limit this.

[0083] Exemplarily, the third power range may be 50% - 80%, and the fourth power range may be 50% - 80%.

[0084] Exemplarily, when the temperature value of the heat dissipation substrate is greater than 65 °C and less than 80 °C, the liquid cooling control module intervenes to work. The controller of the liquid cooling control module monitors the return water temperature monitored by the temperature sensor integrated on the liquid cooling control module and the temperature monitored by the temperature sensor on the heat dissipation substrate (65 °C - 80 °C), and adaptively adjusts the temperature and flow rate of the coolant. The refrigeration unit of the liquid cooling control module operates at a power of 50% - 80%, and the water pump operates at a power of 50% - 80%. The heat on the heat dissipation fins is taken away by circulating low-temperature liquid and different flow rates, realizing rapid transfer of the heat on the heat dissipation fins.

[0085] In some embodiments, when the predicted temperature value is greater than or equal to a second value and less than a third value, the air cooling control mode is in an operating state, and in the operating state, the rotational speed of the fan has a preset correspondence with the predicted temperature value.

[0086] In some embodiments, the preset corresponding relationship may be that when the predicted temperature value is less than the fifth value, the rotational speed is zero; when the predicted temperature value is greater than or equal to the fifth value and less than the first value, the rotational speed is greater than zero and less than the first rotational speed value; when the predicted temperature value is greater than or equal to the first value and less than the second value, the rotational speed is greater than the first rotational speed value and less than the second rotational speed value; when the predicted temperature value is greater than or equal to the second value and less than the third value, the rotational speed is greater than the second rotational speed value and less than the third rotational speed value.

[0087] In some embodiments, when the predicted temperature value is greater than or equal to the second value and less than the third value, the rotational speed of the fan is greater than the second rotational speed value and less than the third rotational speed value. Among them, the second rotational speed value and the third rotational speed value are preset rotational speeds. For example, the second rotational speed value is 50% and the third rotational speed value is 80%.

[0088] Exemplarily, when the temperature of the heat dissipation substrate is greater than or equal to 65°C and less than 80°C, the fan will operate at a rotational speed of 50% - 80% adaptively at medium speed according to the temperature range monitored by the temperature sensor on the heat dissipation substrate, and accelerate the heat dissipation on the heat dissipation fins through the rapid flow of air to achieve a continuous and rapid heat dissipation effect.

[0089] In the above embodiments, when the predicted temperature value is greater than or equal to the second value and less than the third value, it is determined that the first control mode is the automatic mode of the phase change material control mode, the liquid cooling control mode is in the second state, and the rotational speed in the air cooling control mode is greater than the second rotational speed value and less than the third rotational speed value to achieve rapid heat dissipation of the heat source.

[0090] Method Four: In some embodiments, based on the predicted temperature value, determining the first control mode includes: when the predicted temperature value is greater than or equal to the third value, determining that the phase change material control mode is the automatic mode; determining that the liquid cooling control mode is in the third state, in the third state, the first power is the maximum refrigeration power, and the second power is the maximum water pump power; determining that the air cooling control mode is in the operating state, in the operating state, the rotational speed of the fan is the maximum fan rotational speed.

[0091] In some embodiments, when the predicted temperature value is greater than or equal to the third value, it may be that the predicted temperature value is greater than or equal to 80°C.

[0092] In some embodiments, the heat dissipation method of determining that the phase change material control mode is the automatic mode may be as described in Method One, which will not be elaborated here.

[0093] In some embodiments, determining that the liquid cooling control mode is in the third state, the third state may be that the refrigeration unit operates at the maximum refrigeration power and the water pump unit operates at the maximum water pump power. The values of the maximum refrigeration power and the maximum water pump power may be the same or different, and the present disclosure does not limit this.

[0094] Exemplarily, the maximum refrigeration power can be 90%, and the maximum water pump power can be 90%.

[0095] Exemplarily, when the temperature of the heat dissipation base plate is greater than 80°C, the liquid cooling control module intervenes to work. The controller of the liquid cooling control module monitors the return water temperature through the temperature sensor integrated on the liquid cooling control module and the temperature (greater than 80°C) monitored by the temperature sensor on the heat dissipation base plate. The refrigeration unit of the liquid cooling control module operates at 90% power, and the water pump operates at 90% power. The heat on the heat dissipation fins is taken away by circulating a lower temperature liquid and a faster flow rate, realizing rapid heat transfer on the heat dissipation fins.

[0096] In some embodiments, it is determined that the air cooling control mode is in the operating state, and in the operating state, the rotation speed of the fan is the maximum fan rotation speed. Among them, the value of the maximum fan rotation speed can be preset in advance, for example, it is 90%.

[0097] Exemplarily, when the temperature of the heat dissipation base plate is greater than 80°C, the fan will rotate at 90% speed, and the heat on the heat dissipation fins is accelerated to be taken away through the rapid flow of air to achieve a continuous and rapid heat dissipation effect.

[0098] In the above embodiments, when the predicted temperature value is greater than the third value, it is determined that the first control mode is the automatic mode of the phase change material control mode, the liquid cooling control mode is the third state, and the air cooling control mode is the operating state. The parameter values in each mode operate at the maximum value to achieve rapid heat dissipation of the heat source.

[0099] In the above embodiments, after determining the first control mode based on the predicted temperature value, the specific control value in the first control mode can also be dynamically adjusted according to the current ambient temperature to meet the current heat dissipation requirements.

[0100] In some embodiments, based on the current ambient temperature, according to a preset rule, the first power and the second power are dynamically adjusted, and / or the rotation speed is dynamically adjusted, including: determining the difference between the current ambient temperature and the reference ambient temperature; determining the adjustment ratio according to the difference and the preset adjustment step size; based on the adjustment ratio, adjusting the first power and the second power, and / or the rotation speed to determine the heat dissipation control mode.

[0101] In some embodiments, the reference ambient temperature can be a preset reference value of the ambient temperature, for example, it can be 30°C. It can be custom-set according to different requirements or scenarios, and the present disclosure does not limit this.

[0102] In some embodiments, the preset adjustment step size may be a preset step size ratio. For example, it may be 2% or 3%. Its value can be customized according to requirements or scenarios, and the present disclosure does not limit this.

[0103] In some embodiments, determine the difference between the current ambient temperature and the reference ambient temperature, and determine the adjustment ratio according to the difference and the preset adjustment step size. It may be that the product of the difference and the preset adjustment step size is used as the adjustment ratio.

[0104] In some embodiments, based on the adjustment ratio, adjust the first power, the second power, and / or the rotational speed. It may be that the adjustment ratio is added to the first power obtained in the above-mentioned Method 1 - Method 4 to obtain the operating power of the refrigeration unit, the adjustment ratio is added to the second power obtained in the above-mentioned Method 1 - Method 4 to obtain the operating power of the water pump unit, and / or the adjustment ratio is added to the rotational speed obtained in the above-mentioned Method 1 - Method 4 to obtain the operating rotational speed of the fan, so as to obtain the control parameters corresponding to each mode in the heat dissipation control mode for dissipating heat from the heat source, thereby realizing the heat dissipation of the heat source.

[0105] In some embodiments, the difference between the current ambient temperature and the reference ambient temperature is the value of the current ambient temperature - the reference ambient temperature. This difference can be a positive value or a negative value. Specifically, when the current ambient temperature is less than the reference ambient temperature, the difference is a negative value; when the current ambient temperature is greater than the reference ambient temperature, the difference is a positive value; when the current ambient temperature is equal to the reference ambient temperature, the difference is zero.

[0106] Exemplarily, establish an ambient temperature compensation algorithm. Set a reference ambient temperature. When the temperature is higher or lower than this temperature, the fan and the liquid cooling control module will also be adjusted according to the real-time temperature. For example, when the temperature increases by 1°C, the fan rotational speed increases by 2% and the operating power of the liquid cooling control module increases by 2%.

[0107] Through the description of the above embodiments, the heat dissipation control method proposed by the present disclosure can predict the future temperature increase value, that is, the predicted temperature value, of the heat source under the load power and the current ambient temperature of the environment where the heat source is located through the AI model, so as to determine the heat dissipation control mode corresponding to the predicted temperature value, realize the heat dissipation of the heat source, and achieve the effect of active heat dissipation and improve the heat dissipation efficiency.

[0108] In some embodiments, as Figure 3 shown, Figure 3 is a schematic flowchart of a heat dissipation control method provided by an embodiment of the present application, including the following steps: Step 301, determine the training data set.

[0109] In some embodiments, the training data set includes the heat dissipation substrate temperature, the ambient temperature, and the power of the heat source.

[0110] In some embodiments, determining the training data set includes: obtaining the first temperature values of a plurality of temperature sensors on the heat dissipation substrate, the ambient temperature, and the power of the heat source; determining the second temperature value of the heat dissipation substrate based on the first temperature values of the plurality of temperature sensors; associating the second temperature value, the ambient temperature, and the power of the heat source corresponding to the same time point to obtain a first training data group, and the training data set includes a plurality of first training data groups.

[0111] In some embodiments, a plurality of temperature sensors are arranged on the heat dissipation substrate, and each temperature sensor is used to detect the temperature of the heat dissipation substrate, so that a plurality of first temperature values can be obtained.

[0112] In some embodiments, based on the first temperature values of the plurality of temperature sensors, the average value of the plurality of first temperature values can be used as the second temperature value of the heat dissipation substrate, or the maximum and minimum values of the plurality of first temperature values can be removed and then averaged as the second temperature value of the heat dissipation substrate. The specific manner is not limited in the present disclosure.

[0113] In some embodiments, obtaining the power of the heat source may be to record in real time parameters such as the working current, voltage, frequency, and power of the heat source, and calculate the dynamic power as the power of the heat source.

[0114] In some embodiments, obtaining the first temperature value, the ambient temperature, and the power of the heat source can be performed at multiple time points. The second temperature value, the ambient temperature, and the power of the heat source corresponding to the same time point are associated to obtain a first training data group, and this training data group is a set of training data corresponding to the first time point, so that multiple training data groups corresponding to multiple time points can be obtained.

[0115] Exemplarily, data collection: Load power data: Record in real time parameters such as the working current, voltage, frequency, and power of the heat source, and calculate the dynamic power (sampling rate ≥ 100 Hz); Heat dissipation substrate temperature data: Synchronously collect temperature changes through high-precision temperature sensors deployed on the heat dissipation substrate (sampling rate ≥ 10 Hz); Ambient temperature data: Collect the ambient temperature to correct the error of the heat dissipation model. Data alignment: Use a time series database to store data, align the data of the load power and the heat dissipation substrate temperature through a large amount of collected data, and finally obtain the corresponding relationship between the load power, the ambient temperature, and the heat dissipation substrate temperature.

[0116] Step 302, training the initial prediction model based on the training data set to obtain a prediction model.

[0117] In some embodiments, the initial prediction model is trained based on a training data set to obtain a prediction model. It is possible to use multiple training data groups corresponding to multiple time points to train the initial prediction model. The training method is not limited in the present disclosure, so that a trained prediction model for predicting temperature can be obtained.

[0118] In some embodiments, the prediction model can obtain a predicted temperature value of the heat source, or can also be a predicted temperature value of the heat dissipation substrate, according to the load power of the heat source and the current ambient temperature of the environment where the heat source is located.

[0119] In some embodiments, the method further includes: in a heat dissipation control mode, determining a plurality of first data groups. The first data group is, at a first time point, the current temperature values of a plurality of temperature sensors on the heat dissipation substrate, the cooling capacity and water pump speed corresponding to the liquid cooling control module, the current rotation speed of the fan corresponding to the air cooling control mode, and the first ambient temperature; determining the energy consumption corresponding to the current temperature value through an energy efficiency ratio model; and determining, according to a preset sampling frequency, a second data group with the lowest energy consumption among the plurality of first data groups, and the second data group is used to optimize the prediction model.

[0120] In some embodiments, the first data group is collected in real time during the process of dissipating heat from the heat source using the above heat dissipation control method. The first data group includes the current temperature value of the heat dissipation substrate at the first time point, the first ambient temperature, and the control data corresponding to each sub-mode in the heat dissipation control mode obtained using the prediction model at the current temperature value and the first ambient temperature, including the cooling capacity, water pump speed, current rotation speed of the fan, etc.

[0121] In some embodiments, the first ambient temperature can be a plurality of ambient temperatures corresponding to the first time point, that is, at different ambient temperatures, different first data groups are obtained.

[0122] In some embodiments, the current temperature value can be the temperatures of a plurality of heat dissipation substrates corresponding to the first time point, that is, at different temperatures, different first data groups are obtained.

[0123] In some embodiments, the energy efficiency ratio model can be a pre-trained model for determining the energy consumption corresponding to the current temperature value. The energy efficiency ratio model is, for example, a liquid cooling / air cooling energy efficiency ratio model, and the name of the model is not limited in the present disclosure.

[0124] In some embodiments, the preset sampling frequency can be a pre-set sampling frequency. For example, it can be sampled once every 10 minutes, and its specific value can be custom-set according to requirements or scenarios, and the present disclosure is not limited thereto.

[0125] In some embodiments, according to the predicted sampling frequency, the second data group with the lowest energy consumption is determined among multiple first data groups. It can be to determine the second data group with the lowest energy consumption among the first data groups corresponding to different environmental temperatures and the first data groups corresponding to different current temperature values at the same time point, so that multiple second data groups with the lowest energy consumption at multiple sampling points can be obtained.

[0126] In some embodiments, multiple second data groups are used to optimize the prediction model. It can be to optimize the corresponding mechanism between the predicted temperature value and the heat dissipation control mode, so as to improve the energy consumption effect of determining the heat dissipation control mode based on the predicted temperature value in the heat dissipation control method. That is, the energy consumption corresponding to the determined heat dissipation control mode is relatively low, so as to reduce the overall heat dissipation energy consumption of the system while achieving the effect of active heat dissipation.

[0127] In some embodiments, the corresponding mechanism between the temperature of the heat dissipation substrate and the heat dissipation control mode can be in the prediction model. This model can obtain the corresponding heat dissipation control mode based on the temperature of the heat dissipation substrate. Therefore, multiple second data groups are used as the optimization training data of this model to optimize this model, so that it can be applied in the heat dissipation control method to further improve the heat dissipation efficiency and achieve active heat dissipation.

[0128] In the above embodiments, through data collection and data alignment, the initial prediction model is trained using the training data set, and a prediction model that can predict the temperature of the heat dissipation substrate based on the load power and the environmental temperature is obtained, which improves the accuracy of temperature prediction and can achieve the prediction of the temperature of the heat dissipation substrate in advance to achieve the purpose of active heat dissipation.

[0129] In the above embodiments, a series of real-time data are obtained by using the above heat dissipation control method, and the energy efficiency of each group of data is determined using the energy efficiency ratio model. Thus, real-time data with low energy consumption can be screened out, and this real-time data is used to optimize the model, which can improve the accuracy of model prediction, further improve the efficiency of heat dissipation control, and achieve a better heat dissipation effect.

[0130] An embodiment of the present application further provides a heat dissipation control system 400, Figure 4 which is a schematic structural diagram of a heat dissipation control system provided by an embodiment of the present disclosure, as Figure 4 shown, including: a heat source 401, a phase change material control module 402, a liquid cooling control module 403, an air cooling control module 404, and a control module 405, The control module is configured to determine a heat dissipation control mode based on the load power of the heat source and the current ambient temperature of the environment where the heat source is located through a prediction model. The heat dissipation control mode is used to perform heat dissipation control on at least one of the phase change material control module, the liquid cooling control module, and the air cooling control module, and the heat dissipation control mode is used to dissipate heat from the heat source.

[0131] In some embodiments, the system further includes a heat dissipation substrate 406. The heat source is in contact with the heat dissipation substrate, and a plurality of slots are provided on the heat dissipation substrate, and heat dissipation fins 407 can be inserted into the plurality of slots; the phase change material control module is configured to control related materials to circulate between the liquid state and the gaseous state through the heat dissipation fins to dissipate heat from the heat source.

[0132] Exemplarily, as Figure 5A shown in the structural schematic diagram of the heat dissipation system 510, it includes modular heat dissipation fins 407, a heat dissipation substrate 406, a liquid cooling control module 403, and a fan 514.

[0133] Exemplarily, as Figure 5B shown, the heat dissipation substrate 406 is modularly designed and can be adapted to heat sources of different specifications. A high thermal conductivity material is filled between the heat source and the heat dissipation substrate, and the heat dissipated by the heat source is transferred to the heat dissipation substrate through contact. A plurality of slots are provided on the heat dissipation substrate, and heat dissipation fins can be inserted. The heat on the heat dissipation substrate is transferred to the heat dissipation fins through contact. Each fin is modularly designed and can be separately disassembled from the substrate for maintenance and upgrade.

[0134] Exemplarily, as Figure 5C shown in the schematic diagram, a space is left inside the heat dissipation fin to form a microchannel 530, and the reserved cavity is filled with a phase change material for gas-liquid conversion (a composite material is used to improve the thermal conductivity and cycle stability, and the phase change temperature is 50 °C), and oxidation is avoided through vacuum packaging. When the temperature of the phase change material 531 exceeds 50 °C, the phase change material in the evaporation section 532 absorbs heat and is converted into a gas and moves upward to the condensation section 533. In the condensation section, the gas releases heat and is converted into a liquid and then flows downward to the evaporation section, forming a heat dissipation cycle system.

[0135] In some embodiments, a plurality of liquid pipes are provided inside the heat dissipation substrate, and the plurality of liquid pipes are used for the circulating flow of the coolant; the liquid cooling control module includes a refrigeration unit and a water pump unit. The refrigeration unit is configured to control the temperature of the coolant, and the water pump unit is configured to control the flow rate of the coolant in the plurality of liquid pipes to dissipate heat from the heat source through the circulating flow of the coolant.

[0136] Exemplarily, as Figure 5BIn the schematic diagram shown, the flow channel pipes on the heat dissipation fins can be directly inserted into the flow channels on the heat dissipation substrate, and a sealing ring is provided at the connection to prevent liquid leakage. Electromagnetic induction valves are installed on the liquid inlet pipes 522 and the liquid return pipes 523 of the corresponding heat dissipation fins on the heat dissipation substrate. The valves open when the heat dissipation fins are installed and the screws 524 are tightened, and the valves close when the screws are loosened, avoiding liquid leakage during maintenance and upgrade. The screws on the heat dissipation fins can firmly fix the fins on the heat dissipation substrate and make the pipe connection more sealed. The liquid inlet pipe of the heat dissipation fin can communicate with the main liquid inlet pipe 525 of the heat dissipation substrate, and the liquid return pipe of the heat dissipation fin can communicate with the main liquid return pipe 526 of the heat dissipation substrate.

[0137] Exemplarily, as Figure 5D In the schematic diagram shown, spiral microchannels 530 are formed on the heat dissipation fins, and heat is removed by the circulating flow of the coolant. The coolant circulates through the micro liquid cooling control module, enters the microchannels of the heat dissipation fins through the main liquid inlet pipe 525, and returns to the liquid cooling control module through the main liquid return pipe 526. After the heat dissipation fins are inserted into the heat dissipation substrate, they are fixed by screws 524, and the phase change material 531 forms a heat dissipation circulation system through the cavities of the heat dissipation fins. Flow sensors are provided on the flow channels of each fin to monitor the flow rate data of the liquid in real time, and the problem of flow channel blockage can be detected in time. Filter meshes are provided on the main liquid inlet and return pipes to filter out possible impurities in the liquid and avoid flow channel blockage. The liquid cooling control module can monitor and adjust the temperature, flow rate and pressure of the coolant in real time through sensors and control systems to ensure efficient heat dissipation and system stability. The liquid cooling control module consists of main components such as a liquid-liquid heat exchanger, a secondary side water pump, pipeline components, sensors, controllers, etc., as well as auxiliary function modules such as filters, voltage stabilizing devices, and automatic liquid replenishing devices. A low-viscosity liquid with excellent thermal stability and chemical stability is added to the liquid cooling control module, which can operate in a high-temperature environment for a long time.

[0138] In some embodiments, a fan is provided on one side of the heat dissipation fin, and the air cooling control module dissipates heat from the heat source by controlling the rotation speed of the fan.

[0139] Exemplarily, as Figure 5E In the schematic diagram shown, a modular adaptive cooling fan 514 is installed on one side of the heat dissipation fin 407, which enables quick maintenance and upgrade. The modular fan blows the gas to flow and takes away the heat of the fin.

[0140] In some embodiments, the control module is configured to obtain the load power of the heat source and the current ambient temperature of the environment where the heat source is located; use the load power and the current ambient temperature as inputs to a prediction model to determine the predicted temperature value of the heat dissipation substrate at the load power; determine the first control mode corresponding to the predicted temperature value, and dynamically adjust the heat dissipation control mode based on the current ambient temperature.

[0141] In some embodiments, a plurality of temperature sensors are provided on the heat dissipation substrate for detecting the real-time temperature of the heat dissipation substrate.

[0142] Exemplarily, the heat dissipation substrate has a plurality of temperature sensors to monitor the temperature data of the heat source in real time and dynamically adjust the heat dissipation strategy according to the temperature.

[0143] Exemplarily, a load prediction mechanism is provided to predict the load status of the heat source in the future for a period of time. Through the AI dynamic control algorithm and the temperature sensors on the module, the fan speed and the refrigeration strategy of the liquid cooling control module are adjusted in real time to achieve active heat dissipation. - The principle of the temperature control operation mechanism of the entire module: According to the temperatures monitored by the temperature sensors on the heat dissipation substrate and the temperature sensors on the return water pipeline of the liquid cooling control module, the operation mechanisms of the fan and the liquid cooling control module are adjusted in real time, and the load of the heat source is predicted by AI to allocate heat dissipation resources in advance, so as to balance the heat generation and heat dissipation and avoid heat accumulation. The heat dissipation strategy can also be continuously learned and optimized by the large model according to the past heat dissipation data to reduce energy consumption while meeting the heat dissipation requirements.

[0144] In some embodiments, determining the first control mode corresponding to the predicted temperature value and dynamically adjusting the heat dissipation control mode based on the current ambient temperature includes: based on the predicted temperature value, determining the first control mode, where the first control mode includes the first power of the refrigeration unit corresponding to the liquid cooling control mode and the second power of the water pump unit, and / or the rotation speed of the fan corresponding to the air cooling control mode, and / or the phase change material control mode; based on the current ambient temperature, dynamically adjusting the first power and the second power according to the preset rules, and / or dynamically adjusting the rotation speed to obtain the heat dissipation control mode.

[0145] In the above embodiments, the heat dissipation control system proposed by the present disclosure can achieve the disassembly of the heat dissipation fins to adapt to heat sources of different specifications. At the same time, through the prediction of the prediction model in the control module, active heat dissipation can be realized, and the heat dissipation efficiency can be improved.

[0146] The following is a specific implementation manner of the present disclosure: As Figure 5A shown, it is a schematic structural diagram of the heat dissipation system 510. This system mainly includes a modular heat dissipation fin 407, a heat dissipation substrate 406, a liquid cooling control module 403, and a fan 514. The heat source (CPU / GPU) is in contact with the heat dissipation substrate and transfers heat to the heat dissipation substrate.

[0147] Optionally, the fan has an equivalent relationship with Figure 4 the air cooling control module in

[0148] As Figure 5BAs shown in the figure, it is a schematic structural diagram of a heat dissipation substrate. Multiple fin slots 521 are opened on the heat dissipation substrate, into which heat dissipation fins can be inserted. There is space inside the heat dissipation fins, which is filled with a phase change material for gas-liquid conversion. When in the evaporation section, the liquid absorbs heat and is converted into gas and moves upward to the condensation section. In the condensation section, the gas releases heat and is converted into liquid and then flows downward to the evaporation section, forming a heat dissipation cycle system. Each fin is modularly designed and can be separately disassembled from the substrate for maintenance and upgrade. Inductive valves are installed on each branch corresponding to each liquid inlet and return liquid pipeline on the heat dissipation substrate. The valves are opened when the heat dissipation fins are installed and closed when the fins are disassembled. The flow channel pipeline on the heat dissipation fins can be directly inserted into the flow channel on the heat dissipation substrate, and a sealing ring is set at the connection to avoid liquid leakage. Electromagnetic induction valves are installed on the liquid inlet pipeline 522 and the return liquid pipeline 523 corresponding to each heat dissipation fin on the heat dissipation substrate. The valves are opened after the heat dissipation fins are installed and the screws 524 are tightened, and the valves are closed when the screws are loosened, avoiding liquid leakage during maintenance and upgrade. The screws on the heat dissipation fins can firmly fix the fins on the heat dissipation substrate and make the pipeline connection more sealed. The liquid inlet pipeline of the heat dissipation fin can be connected to the main liquid inlet pipeline 525 of the heat dissipation substrate, and the return liquid pipeline of the heat dissipation fin can be connected to the main return liquid pipeline 526 of the heat dissipation substrate.

[0149] As Figure 5C shown in the schematic diagram of the heat dissipation fin cavity, there is space inside the heat dissipation fin to form a microchannel 530. The reserved cavity is filled with a phase change material for gas-liquid conversion (using a composite material to improve the thermal conductivity and cycle stability, with a phase change temperature of 50 °C), and oxidation is avoided through vacuum packaging. When the temperature of the phase change material 531 exceeds 50 °C, the phase change material in the evaporation section 532 absorbs heat and is converted into gas and moves upward to the condensation section 533. In the condensation section, the gas releases heat and is converted into liquid and then flows downward to the evaporation section, forming a heat dissipation cycle system.

[0150] As Figure 5D shown in the schematic structural diagram of the heat dissipation fin 407, a spiral microchannel 530 is opened on the heat dissipation fin, and heat is removed by the circulating flow of the coolant. The coolant circulates through the micro liquid cooling control module, enters the microchannel of the heat dissipation fin through the main liquid inlet pipeline 525, and returns to the liquid cooling control module through the main return liquid pipeline 526. After the heat dissipation fin is inserted into the heat dissipation substrate, it is fixed by the screw 524, and the phase change material 531 forms a heat dissipation cycle system through the heat dissipation fin cavity.

[0151] As Figure 5E shown in the schematic diagram of the position of the fan and the heat dissipation fin, a heat dissipation fan 514 is installed on one side of the heat dissipation fin 407, and the heat of the fin is removed by the flow of gas. The modular adaptive heat dissipation fan can be quickly maintained and upgraded, and the modular fan blows the gas to remove the heat of the fin.

[0152] The heat dissipation substrate is equipped with multiple temperature sensors to monitor the temperature data of the heat source in real time; each microchannel of the fin has a flow sensor to monitor the flow data of the liquid in real time, and the problem of channel blockage can be detected in time. A filter screen is set on the main liquid inlet and return pipelines to filter out possible impurities in the liquid and avoid channel blockage. The coolant circulates through the water pump of the liquid cooling control module to take away the heat generated on the heat dissipation fins. The liquid cooling control module can monitor and adjust the temperature, flow rate and pressure of the coolant in real time through sensors and control systems to ensure efficient heat dissipation and system stability. The liquid cooling control module consists of main components such as a liquid-liquid heat exchanger, a secondary-side water pump, pipeline components, sensors, and controllers, as well as auxiliary function modules such as filters, voltage stabilizing devices, and automatic liquid replenishing devices. The liquid cooling control module is filled with a low-viscosity liquid with excellent thermal stability and chemical stability, and can operate in a high-temperature environment for a long time.

[0153] There are temperature sensors on the main liquid inlet pipeline and the main liquid return pipeline to monitor the inlet and return water temperature data of the liquid in real time.

[0154] A load prediction mechanism is provided to predict the load of the heat source in the next period of time. Through the AI dynamic regulation algorithm and the temperature sensors on the module, the fan speed and the refrigeration strategy of the liquid cooling control module are adjusted in advance to achieve active heat dissipation.

[0155] Figure 5F This is a schematic diagram of the heat dissipation control process corresponding to this heat dissipation system. I. Basic heat dissipation strategy: 1. When the multiple temperature sensors on the heat dissipation substrate monitor that the temperature is less than 50°C, at this time, the heat of the heat source is conducted to the heat dissipation substrate by contact, then to the heat dissipation fins, and finally to the air.

[0156] The phase change material is in a liquid state and can absorb a part of the heat and conduct it to the heat dissipation fins.

[0157] The liquid cooling control module is in a standby state and is ready to start running at any time.

[0158] The fan will run at a speed of 0~20% adaptively at a low speed according to the temperature (30°C~50°C) monitored by the temperature sensor on the heat dissipation substrate, and take away the heat on the heat dissipation fins through air flow to achieve continuous heat dissipation. At this time, not only the heat dissipation requirement is met, but also the noise and energy consumption can be minimized to the greatest extent.

[0159] 2. When multiple temperature sensors on the heat dissipation substrate detect that the temperature is greater than or equal to 50°C and less than 65°C, at this time, the heat of the heat source is conducted to the heat dissipation substrate by contact and then to the heat dissipation fins (there are two conduction methods at this time. One is that the fins conduct heat from the bottom to the top by themselves, and the other is that the phase change material conducts heat from the bottom to the top through gas-liquid phase change). Part of the heat of the fins is conducted to the air to take away the heat, and part of the heat is conducted to the liquid circulating in the flow channel to take away the heat.

[0160] When the phase change material reaches its phase change temperature of 50°C, the phase change material begins to continuously absorb heat and vaporize in the evaporation section. The gas rises to the condensation section, releases heat, cools down to 50°C and then condenses into a liquid, flowing downward to the evaporation section, thus forming a cyclic phase change to achieve rapid heat transfer.

[0161] The liquid cooling control module intervenes in the work. The controller of the liquid cooling control module monitors the return water temperature detected by the temperature sensor integrated on the liquid cooling control module and the temperature detected by the temperature sensor on the heat dissipation substrate (50°C - 65°C), and adaptively adjusts the temperature and flow rate of the coolant. The refrigeration unit of the liquid cooling control module operates at a power of 20% - 50%, and the water pump operates at a power of 20% - 50%. The heat on the heat dissipation fins is taken away by the circulation of low-temperature liquid and different flow rates, realizing the rapid transfer of the heat on the heat dissipation fins.

[0162] The fan will run at a speed of 20% - 50% and adaptively operate at a medium speed according to the temperature detected by the temperature sensor on the heat dissipation substrate in the range of 50°C - 65°C, accelerating the heat dissipation from the heat dissipation fins through the rapid flow of air to achieve the effect of continuous and rapid heat dissipation.

[0163] 3. When multiple temperature sensors on the heat dissipation substrate detect that the temperature is greater than 65°C and less than 80°C, at this time, the heat transfer mode of the heat source is the same as when the temperature detected by the temperature sensor is greater than 50°C and less than 65°C.

[0164] When the phase change material reaches its phase change temperature of 50°C, the phase change material begins to continuously absorb heat and vaporize in the evaporation section. The gas rises to the condensation section, releases heat, cools down to 50°C and then condenses into a liquid, flowing downward to the evaporation section, thus forming a cyclic phase change to achieve rapid heat transfer.

[0165] The liquid cooling control module intervenes in operation. The controller of the liquid cooling control module adaptively adjusts the temperature and flow rate of the coolant based on the return water temperature monitored by the temperature sensor integrated on the liquid cooling control module and the temperature (65°C - 80°C) monitored by the temperature sensor on the heat dissipation substrate. The refrigeration unit of the liquid cooling control module operates at a power of 50% - 80%, and the water pump operates at a power of 50% - 80%. Heat on the heat dissipation fins is removed through the circulation of low-temperature liquid at different flow rates, achieving rapid heat transfer on the heat dissipation fins.

[0166] The fan will operate at a speed of 50 - 80% and adaptively operate at medium speed according to the temperature (65°C - 80°C) monitored by the temperature sensor on the heat dissipation substrate. Heat on the heat dissipation fins is accelerated to be removed through the rapid flow of air to achieve the effect of continuous and rapid heat dissipation.

[0167] 4. When multiple temperature sensors on the heat dissipation substrate monitor a temperature greater than 80°C, at this time, the heat transfer method of the heat source is the same as when the temperature monitored by the temperature sensor is greater than 50°C and less than 65°C.

[0168] The phase change material is far above its phase change temperature of 50°C. The phase change material continuously and rapidly absorbs heat and vaporizes in the evaporation section. The gas rises to the condensation section, releases heat, and condenses back into a liquid when the temperature drops to 50°C, flowing downward to the evaporation section, thus forming a cyclic phase change to achieve rapid heat transfer.

[0169] The liquid cooling control module intervenes in operation. The controller of the liquid cooling control module based on the return water temperature monitored by the temperature sensor integrated on the liquid cooling control module and the temperature (greater than 80°C) monitored by the temperature sensor on the heat dissipation substrate. The refrigeration unit of the liquid cooling control module operates at a power of 90%, and the water pump operates at a power of 90%. Heat on the heat dissipation fins is removed through the circulation of even lower-temperature liquid at a faster flow rate, achieving rapid heat transfer on the heat dissipation fins.

[0170] The fan will operate at a speed of 90% and accelerate the removal of heat on the heat dissipation fins through the rapid flow of air to achieve the effect of continuous and rapid heat dissipation.

[0171] II. AI large model heat dissipation strategy, controlling the heat dissipation strategy through load prediction and training learning: 1. Load prediction mechanism: Real-time monitor the load power of the heat source and the temperature data of the current temperature sensor on the heat dissipation substrate. After a large amount of data collection and analysis by multiple temperature sensors over a long time, it is possible to obtain the difference in time between the current heat dissipation substrate temperature and the time of the heat source load power, that is, each load power corresponds to a temperature of the heat dissipation substrate. By monitoring the real-time load power of the heat source, the temperature of the heat dissipation substrate can be predicted, thereby controlling the fan and liquid cooling control module to allocate resources in advance to achieve precise heat dissipation.

[0172] (1)Data acquisition.

[0173] Load power data: Record the working current, voltage, frequency, power and other parameters of the heat source in real time, and calculate the dynamic power (sampling rate ≥ 100Hz).

[0174] Heat dissipation substrate temperature data: Synchronously collect the temperature change through the high-precision temperature sensors deployed on the heat dissipation substrate (sampling rate ≥ 10Hz).

[0175] Ambient temperature data: Collect the ambient temperature to correct the error of the heat dissipation model.

[0176] Data alignment. Use the time series database to store data, align the data of the load power and the heat dissipation substrate temperature through a large amount of collected data, and finally obtain the corresponding relationship between the load power, the ambient temperature and the heat dissipation substrate temperature.

[0177] Temperature prediction. Based on the load power and the ambient temperature monitored in real time, roll and regulate the operation mechanism of the heat dissipation equipment (fan, liquid cooling control module).

[0178] (2)Training and learning mechanism: There will be a certain error in regulating the temperature by the load prediction mechanism. Here, it is necessary to establish a training and learning mechanism, and continuously learn and adjust the heat dissipation strategy to improve the whole system to achieve a more efficient and energy-saving effect.

[0179] Establish a database. Record the temperature of the temperature sensor, the cooling capacity of the liquid cooling control module and the water pump speed, the rotation speed of the fan and the ambient temperature in real time.

[0180] Construct the liquid cooling / air cooling efficiency ratio model, and collect the energy consumption at different temperatures during the operation process in real time.

[0181] Establish an ambient temperature compensation algorithm. Set a reference ambient temperature. When it is 30 higher or lower than this temperature, the fan and the liquid cooling control module will also be adjusted according to the real-time temperature. For example, when the temperature rises by 1℃, the rotation speed of the fan increases by 2% and the operating power of the liquid cooling control module increases by 2%.

[0182] Establish the optimal power consumption combination with the best energy efficiency. Collect the optimal power consumption combination parameters every 10 minutes and record them to form an optimal power consumption database. When the samples in the database are sufficient, the optimal power consumption combination at different temperatures can be obtained through data screening and alignment.

[0183] The beneficial effects of the above heat dissipation system and heat dissipation method are as follows: 1. High-efficiency composite heat dissipation performance. Through the triple collaborative mechanism of phase change materials, microchannel liquid cooling, and air cooling, a gradient heat transfer system is constructed. The phase change material realizes an automatic phase change cycle when the temperature exceeds 50°C, and the liquid cooling system also intervenes to enhance heat dissipation when the temperature exceeds 50°C. As the basic guarantee, air cooling forms an intelligent thermal management closed loop.

[0184] 2. Dynamic intelligent regulation advantage. Based on the load prediction module, the heat generation of the heat source can be identified in advance. Combined with the adaptive control strategy and the continuous learning and optimization of the large model, it is more energy-efficient.

[0185] 3. Modular and scalable architecture. The heat dissipation fins are modularly designed and cooperate with electromagnetic induction valves to achieve plug-and-play functions.

[0186] 4. Fault tolerance and reliability improvement. A three-level redundancy mechanism is constructed. The phase change material provides passive heat dissipation buffering, the liquid cooling control module conducts liquid cooling heat dissipation, and the fan group conducts cross-control heat dissipation.

[0187] 5. Energy efficiency optimization and economy. In the later stage, through the continuous learning of the AI large model, heat dissipation resources are intelligently allocated. While meeting heat dissipation requirements, it can save energy more efficiently.

[0188] Through the description of the above implementation manners, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, it can also be implemented by hardware, but in many cases, the former is a better implementation manner.

[0189] An embodiment of the present application also provides a heat dissipation control device 600. Figure 6 As shown in the structural schematic diagram of a heat dissipation control device provided by an embodiment of the present disclosure, Figure 6 it includes: An acquisition module 610, configured to acquire the load power of the heat source and the current ambient temperature of the environment where the heat source is located; A control module 405, configured to determine a heat dissipation control mode based on the load power and the current ambient temperature through a prediction model. The heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the heat dissipation control mode is used to dissipate heat from the heat source.

[0190] In some embodiments, the control module is further configured to use the load power and the current ambient temperature as inputs to the prediction model to determine the predicted temperature value of the heat dissipation substrate under the load power; determine the first control mode corresponding to the predicted temperature value, and dynamically adjust the heat dissipation control mode based on the current ambient temperature.

[0191] In some embodiments, the control module is further configured to determine a first control mode based on the predicted temperature value. The first control mode includes the first power of the refrigeration unit corresponding to the liquid cooling control mode and the second power of the water pump unit, and / or the rotation speed of the fan corresponding to the air cooling control mode, and / or the phase change material control mode. Based on the current ambient temperature and according to a preset rule, the first power and the second power are dynamically adjusted, and / or the rotation speed is dynamically adjusted to obtain a heat dissipation control mode.

[0192] In some embodiments, the control module is further configured to determine that the phase change material control mode is the automatic mode when the predicted temperature value is less than a first value. In the automatic mode, at least one heat dissipation fin inserted into the slot of the heat dissipation substrate dissipates heat from the heat source through the cyclic conversion of the phase change material between the liquid state and the gaseous state to keep the temperature of the heat dissipation substrate less than the first value. Determine that the liquid cooling control mode is in the standby state, and the first power and the second power are zero. Determine that the air cooling control mode is in the operating state, and in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

[0193] In some embodiments, the control module is further configured to determine that the phase change material control mode is the automatic mode when the predicted temperature value is greater than or equal to the first value and less than a second value. Determine that the liquid cooling control mode is in the first state, and in the first state, the first power is dynamically adjusted within a first power range, and the second power is dynamically adjusted within a second power range. Determine that the air cooling control mode is in the operating state, and in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

[0194] In some embodiments, the control module is further configured to determine that the phase change material control mode is the automatic mode when the predicted temperature value is greater than or equal to the second value and less than a third value. Determine that the liquid cooling control mode is in the second state, and in the second state, the first power is dynamically adjusted within a third power range, and the second power is dynamically adjusted within a fourth power range. Determine that the air cooling control mode is in the operating state, and in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

[0195] In some embodiments, the control module is further configured to determine that the phase change material control mode is the automatic mode when the predicted temperature value is greater than or equal to the third value. Determine that the liquid cooling control mode is in the third state, and in the third state, the first power is the maximum refrigeration power, and the second power is the maximum water pump power. Determine that the air cooling control mode is in the operating state, and in the operating state, the rotation speed of the fan is the maximum fan rotation speed.

[0196] In some embodiments, the control module is further configured to determine the difference between the current ambient temperature and the reference ambient temperature. According to the difference and the preset adjustment step, determine the adjustment ratio. Based on the adjustment ratio, adjust the first power, the second power, and / or the rotation speed to determine the heat dissipation control mode.

[0197] In some embodiments, the preset correspondence is as follows: when the predicted temperature value is less than the fifth value, the rotational speed is zero; when the predicted temperature value is greater than or equal to the fifth value and less than the first value, the rotational speed is greater than zero and less than the first rotational speed value; when the predicted temperature value is greater than or equal to the first value and less than the second value, the rotational speed is greater than the first rotational speed value and less than the second rotational speed value; when the predicted temperature value is greater than or equal to the second value and less than the third value, the rotational speed is greater than the second rotational speed value and less than the third rotational speed value.

[0198] In some embodiments, the control module is further configured to determine a training data set, where the training data set includes the temperature of the heat dissipation substrate, the ambient temperature, and the power of the heat source; and train the initial prediction model based on the training data set to obtain a prediction model.

[0199] In some embodiments, the control module is further configured to obtain the first temperature values of a plurality of temperature sensors on the heat dissipation substrate, the ambient temperature, and the power of the heat source; determine the second temperature value of the heat dissipation substrate based on the first temperature values of the plurality of temperature sensors; associate the second temperature value, the ambient temperature, and the power of the heat source corresponding to the same time point to obtain a first training data group, and the training data set includes a plurality of first training data groups.

[0200] In some embodiments, the control module is further configured to, in the heat dissipation control mode, determine a plurality of first data groups. The first data group is, at the first time point, the current temperature values of a plurality of temperature sensors on the heat dissipation substrate, the cooling capacity and the water pump speed corresponding to the liquid cooling control mode, the current rotational speed of the fan corresponding to the air cooling control mode, and the first ambient temperature; determine the energy consumption corresponding to the current temperature value through an energy efficiency ratio model; and determine, according to a preset sampling frequency, a second data group with the lowest energy consumption among the plurality of first data groups, and the second data group is used to optimize the prediction model.

[0201] For the descriptions of the features in the embodiments corresponding to the heat dissipation control device, reference may be made to the relevant descriptions in the embodiments corresponding to the heat dissipation control method, which will not be elaborated here one by one.

[0202] An embodiment of the present application further provides an electronic device, including a memory and a processor. A computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any of the above embodiments of the heat dissipation control method.

[0203] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps in any of the above embodiments of the heat dissipation control method when running.

[0204] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: various media that can store computer programs such as USB flash drives, read-only memory (ROM for short), random access memory (RAM for short), mobile hard disks, magnetic disks, or optical discs.

[0205] An embodiment of the present application also provides a computer program product. The above computer program product includes a computer program, and when the computer program is executed by a processor, it implements the steps in any of the above embodiments of the heat dissipation control method.

[0206] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium. The non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, it implements the steps in any of the above embodiments of the heat dissipation control method.

[0207] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0208] The above has introduced in detail the heat dissipation control method and heat dissipation control system provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heat dissipation control method, characterized in that, Including: Obtaining the load power of the heat source and the current ambient temperature of the environment where the heat source is located; Based on the load power and the current ambient temperature, determining a heat dissipation control mode through a prediction model, where the heat dissipation control mode includes at least one of a phase change material control mode, a liquid cooling control mode, and an air cooling control mode, and the heat dissipation control mode is used to dissipate heat from the heat source.

2. The heat dissipation control method according to claim 1, wherein The determining the heat dissipation control mode based on the load power and the current ambient temperature through a prediction model includes: Taking the load power and the current ambient temperature as inputs of the prediction model, and determining a predicted temperature value of the heat dissipation substrate under the load power; Determining a first control mode corresponding to the predicted temperature value, and dynamically adjusting the heat dissipation control mode based on the current ambient temperature.

3. The heat dissipation control method according to claim 2, wherein The determining the first control mode corresponding to the predicted temperature value and dynamically adjusting the heat dissipation control mode based on the current ambient temperature includes: Based on the predicted temperature value, determining the first control mode, where the first control mode includes a first power of a refrigeration unit corresponding to the liquid cooling control mode and a second power of a water pump unit, and / or a rotation speed of a fan corresponding to the air cooling control mode, and / or the phase change material control mode; Based on the current ambient temperature, dynamically adjusting the first power and the second power according to a preset rule, and / or dynamically adjusting the rotation speed to obtain the heat dissipation control mode.

4. The heat dissipation control method according to claim 3, wherein The determining the first control mode based on the predicted temperature value includes: When the predicted temperature value is less than a first value, determining the phase change material control mode as an automatic mode, and in the automatic mode, at least one heat dissipation fin inserted into a slot of the heat dissipation substrate dissipates heat from the heat source through the cyclic conversion of the phase change material between the liquid state and the gaseous state to keep the temperature of the heat dissipation substrate less than the first value; Determining the liquid cooling control mode as a standby state, and the first power and the second power are zero; Determining the air cooling control mode as an operating state, and in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

5. The heat dissipation control method according to claim 3, wherein The determining the first control mode based on the predicted temperature value includes: When the predicted temperature value is greater than or equal to the first value and less than a second value, determining the phase change material control mode as an automatic mode; Determining the liquid cooling control mode as a first state, and in the first state, the first power is dynamically adjusted within a first power range, and the second power is dynamically adjusted within a second power range; Determining the air cooling control mode as an operating state, and in the operating state, the rotation speed of the fan has a preset corresponding relationship with the predicted temperature value.

6. The heat dissipation control method according to claim 3, characterized in that, The determining the first control mode based on the predicted temperature value includes: When the predicted temperature value is greater than or equal to the second value and less than a third value, determining the phase change material control mode as an automatic mode; Determine that the liquid cooling control mode is in the second state. In the second state, the first power is dynamically adjusted within the third power range, and the second power is dynamically adjusted within the fourth power range; Determine that the air cooling control mode is in the operating state. In the operating state, the rotation speed of the fan has a preset correspondence with the predicted temperature value.

7. The heat dissipation control method according to claim 3, characterized in that The determining of the first control mode based on the predicted temperature value includes: When the predicted temperature value is greater than or equal to the third value, determine that the phase change material control mode is in the automatic mode; Determine that the liquid cooling control mode is in the third state. In the third state, the first power is the maximum cooling power, and the second power is the maximum water pump power; Determine that the air cooling control mode is in the operating state. In the operating state, the rotation speed of the fan is the maximum fan rotation speed.

8. The heat dissipation control method according to claim 3, wherein The dynamically adjusting the first power and the second power, and / or the rotation speed based on the current ambient temperature according to a preset rule includes: Determine the difference between the current ambient temperature and the reference ambient temperature; Determine an adjustment ratio according to the difference and a preset adjustment step size; Based on the adjustment ratio, adjust the first power and the second power, and / or the rotation speed to determine the heat dissipation control mode.

9. The heat dissipation control method according to any one of claims 4-6, characterized in that The preset correspondence is: When the predicted temperature value is less than the fifth value, the rotation speed is zero; When the predicted temperature value is greater than or equal to the fifth value and less than the first value, the rotation speed is greater than zero and less than the first rotation speed value; When the predicted temperature value is greater than or equal to the first value and less than the second value, the rotation speed is greater than the first rotation speed value and less than the second rotation speed value; When the predicted temperature value is greater than or equal to the second value and less than the third value, the rotation speed is greater than the second rotation speed value and less than the third rotation speed value.

10. The heat dissipation control method according to claim 1, wherein The heat dissipation control method further includes: Determine a training data set, where the training data set includes the heat dissipation substrate temperature, the ambient temperature, and the power of the heat source; Train an initial prediction model based on the training data set to obtain the prediction model.

11. The heat dissipation control method according to claim 10, wherein The determining of the training data set includes: Obtain the first temperature values of multiple temperature sensors on the heat dissipation substrate, the ambient temperature, and the power of the heat source; Based on the first temperature values of the multiple temperature sensors, determine the second temperature value of the heat dissipation substrate; Correlate the second temperature value, the ambient temperature, and the power of the heat source corresponding to the same time point to obtain a first training data group, and the training data set includes multiple first training data groups.

12. The heat dissipation control method according to claim 1, wherein The heat dissipation control method further includes: In the heat dissipation control mode, determine multiple first data groups. The first data group is the current temperature values of multiple temperature sensors on the heat dissipation substrate, the cooling capacity and water pump speed corresponding to the liquid cooling control mode, the current rotation speed of the fan corresponding to the air cooling control mode, and the first ambient temperature at the first time point; Determine the energy consumption corresponding to the current temperature value through an energy efficiency ratio model; Determine the second data group with the lowest energy consumption among the multiple first data groups according to a preset sampling frequency, and the second data group is used to optimize the prediction model.

13. A heat dissipation control system, characterized in that, The heat dissipation control system includes: a heat source, a phase change material control module, a liquid cooling control module, an air cooling control module, and a control module. The control module is configured to determine a heat dissipation control mode based on the load power of the heat source and the current ambient temperature of the environment where the heat source is located through a prediction model. The heat dissipation control mode is used to perform heat dissipation control on at least one of the phase change material control module, the liquid cooling control module, and the air cooling control module, and the heat dissipation control mode is used to dissipate heat from the heat source.

14. The heat dissipation control system according to claim 13, wherein The heat dissipation control system further includes a heat dissipation substrate. The heat source is in contact with the heat dissipation substrate. A plurality of slots are provided on the heat dissipation substrate, and heat dissipation fins can be inserted into the plurality of slots; the phase change material control module is configured to control relevant materials to circulate between a liquid state and a gaseous state through the heat dissipation fins to dissipate heat from the heat source. A plurality of liquid pipes are provided inside the heat dissipation substrate, and the plurality of liquid pipes are used for the circulating flow of the coolant. The liquid cooling control module includes a refrigeration unit and a water pump unit. The refrigeration unit is configured to control the temperature of the coolant, and the water pump unit is configured to control the flow rate of the coolant in the plurality of liquid pipes to dissipate heat from the heat source through the circulating flow of the coolant. A fan is provided on one side of the heat dissipation fin, and the air cooling control module dissipates heat from the heat source by controlling the rotation speed of the fan.

15. The heat dissipation control system according to claim 14, wherein the control module is configured to obtain the load power of the heat source and the current ambient temperature of the environment of the heat source; use the load power and the current ambient temperature as inputs to the prediction model to determine a predicted temperature value of the heat dissipation substrate at the load power; determine a first control mode corresponding to the predicted temperature value, and dynamically adjust the heat dissipation control mode based on the current ambient temperature. The determining the first control mode corresponding to the predicted temperature value and dynamically adjusting the heat dissipation control mode based on the current ambient temperature includes: determining the first control mode based on the predicted temperature value. The first control mode includes a first power of the refrigeration unit and a second power of the water pump unit corresponding to the liquid cooling control mode, and / or the rotation speed of the fan corresponding to the air cooling control mode, and / or the phase change material control mode; based on the current ambient temperature, dynamically adjust the first power and the second power according to a preset rule, and / or adjust the rotation speed to obtain the heat dissipation control mode.

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