Full-automatic horizontal cleaning equipment for semiconductor device

Abstract

The invention relates to the technical field of semiconductor equipment, and discloses full-automatic horizontal cleaning equipment for a semiconductor device, which comprises a base, a transmission assembly arranged on the base and used for transmitting the semiconductor device, an ultrasonic cleaning mechanism, a spray cleaning mechanism and a drying mechanism, the drying mechanism is arranged behind the spraying and cleaning mechanism and is used for drying the cleaned semiconductor device; baffles are arranged on the two opposite sides of the conveying assembly in the second direction, the first water storage plate and the second water storage plate slide and abut against the conveying assembly when the device enters a cleaning area, a closed ultrasonic cleaning cavity is formed, cleaning energy is effectively concentrated, the cavitation effect is improved, the removal capacity for fine particles and attached dirt is remarkably improved, and the cleaning efficiency is improved. The multiple array nozzles are evenly distributed on a conveying path, residues on the surface of a device are flushed at multiple angles, the synergistic effect of liquid cleaning and impurity stripping is achieved, and the device is suitable for semiconductor production scenes with the high cleanliness requirement.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and more particularly, to a fully automatic horizontal cleaning device for semiconductor devices. Background Art

[0002] With the miniaturization and integration trend of electronic products, the cleanliness requirements for semiconductor devices before packaging are getting higher and higher. At the same time, the rapid development of technologies such as AI and VR has promoted a huge increase in the data computing volume of graphics processors, resulting in a more complex design of heat sinks in semiconductor devices, and higher standards are put forward for the cleaning of semiconductor devices before packaging and heat sinks. Automated cleaning equipment has gradually become the mainstream choice in the market because it can significantly improve the cleaning quality and production efficiency. By integrating a variety of cleaning technologies and modules, it has achieved effective cleaning of different types of heat sinks and performed well in reducing labor costs and environmental risks.

[0003] Currently, the common semiconductor device cleaning solutions on the market mainly include methods such as manual wiping, cleaning and passivation treatment on the cleaning and passivation line, semi-automatic trolley walking basket-type environmentally friendly cleaning liquid cleaning, and hand-held dry ice spraying. Although manual wiping has high flexibility, it is difficult to completely remove the stains in the dead corners of complex-structured heat sinks, with low cleaning efficiency and requiring a large amount of manual support. In order to improve the cleaning efficiency, existing technologies usually use VOC solvents such as alcohol and isopropyl alcohol, or toxic and harmful organic solvents containing fluorine, chlorine, and bromine for semi-automatic cleaning methods. However, such cleaning solutions have safety hazards, and the cleaning process is likely to cause damage to the health of operators and may cause varying degrees of damage to the environment.

[0004] Therefore, it is necessary to provide a fully automatic horizontal cleaning device for semiconductor devices to solve the problem of relying on a large amount of toxic and harmful organic solvents to achieve efficient cleaning in the prior art. Summary of the Invention

[0005] The main object of the present invention is to provide a fully automatic horizontal cleaning device for semiconductor devices, aiming to solve the technical problems mentioned in the above background art.

[0006] The present invention adopts the following technical solutions: A fully automatic horizontal cleaning device for semiconductor devices, comprising: A base, on which a transmission component for conveying semiconductor devices is provided, and the transmission component extends along a first direction; An ultrasonic cleaning mechanism, which is arranged at the inlet end of the transmission component, and the ultrasonic cleaning mechanism is provided with a cleaning box enclosing the transmission component; A spray cleaning mechanism, which is arranged after the ultrasonic cleaning mechanism along the conveying direction of the transmission component, and includes a plurality of nozzles arranged in an array; A drying mechanism, arranged along the conveying direction of the transmission assembly after the spray cleaning mechanism, for drying the cleaned semiconductor devices; Among them, along the second direction, baffles are arranged on the opposite sides of the transmission component, the baffles are arranged in the cleaning box, and the first water storage plate and the second water storage plate are slidably connected between the two baffles along the third direction. When the semiconductor device is transmitted between the first water storage plate and the second water storage plate, the first water storage plate and the second water storage plate slide and abut the transmission component to form an ultrasonic cleaning chamber.

[0007] Furthermore, the transmission component is provided with an ultrasonic cleaning area corresponding to the ultrasonic cleaning chamber, and water storage partition axes are respectively provided on both sides of the ultrasonic cleaning area along the first direction, and the two water storage partition axes are respectively aligned with the first water storage plate and the second water storage plate; The water storage dividing shafts are all connected with water storage side plates, and the water storage side plates are arranged below the transmission component, and a bottom plate is fixedly connected between the two water storage side plates, so that when the first water storage plate and the second water storage plate slide against the water storage dividing shaft, the bottom plate and the water storage side plates, the first water storage plate, the second water storage plate and the baffle form the ultrasonic cleaning chamber.

[0008] Further, a first water blocking strip is provided on the upper end surface of the water storage side plate, the first water blocking strip is fixedly connected to the water storage partition axis, and a second water blocking strip is provided on one end surface of the first water storage plate and the second water storage plate facing the water storage side plate, and the width of the first water blocking strip and the second water blocking strip are both greater than the width of the water storage partition axis; An ultrasonic generator is arranged below the ultrasonic cleaning area, and the ultrasonic generator is fixedly connected to the bottom plate.

[0009] Furthermore, a first electric push rod and a second electric push rod are provided on an end surface of the baffle away from the transmission assembly, a driving end of the first electric push rod is connected to the first water storage plate, and a driving end of the second electric push rod is connected to the second water storage plate; A plurality of rollers are provided on one end face of the baffle plate facing the transmission component, and the plurality of rollers are rotatably connected to the baffle plate, wherein the plurality of rollers are respectively provided on the opposite end faces of the first water storage plate and the opposite end faces of the second water storage plate, so that the first water storage plate and the second water storage plate are slidably connected to the baffle plate along a third direction.

[0010] Furthermore, the spray cleaning mechanism further comprises a spray box, wherein the spray box is provided with a spray channel for the transmission component to pass through; There are two symmetrically arranged spraying components connected inside the spraying box. The two spraying components are respectively arranged above and below the conveying component. The spraying component includes a spraying frame, the spraying frame is connected to the spraying box, and several array - arranged nozzles are connected to the spraying frame.

[0011] Further, several angle - adjusting parts are arranged in an array on the spraying frame, and the movable end of the angle - adjusting part is fixedly connected to the nozzle; Sliding motors are arranged on the opposite sides of the spraying frame along the conveying direction of the conveying component. A pulley is arranged on the output shaft of the sliding motor, and a sliding platform corresponding to the pulley is arranged on the spraying box, so that the spraying frame is slidably connected to the spraying box to realize the relative swing of the nozzle and the conveying component.

[0012] Further, the drying mechanism includes a drying box body. The drying box body is provided with a drying channel for the conveying component to pass through. A strong - wind drying component and a heating drying component are arranged in the drying channel. The heating drying component is arranged behind the strong - wind drying component along the conveying direction of the conveying component.

[0013] Further, the strong - wind drying component includes a wind - direction adjusting part. The wind - direction adjusting part is rotatably connected to the drying box body, and several wind - direction adjusting openings are arranged along the rotation axis core in a divergent manner on the wind - direction adjusting part. The wind - direction adjusting part is connected with a strong - force blower; The heating drying component includes a blower, and an infrared heating tube is arranged between the outlet of the blower and the conveying component.

[0014] Further, a recovery and filtration component is also included. The ultrasonic cleaning mechanism is also provided with a water storage tank. The water storage tank is arranged below the cleaning box body. The recovery and filtration component includes a circulating water pump. The circulating water pump is arranged on the upper end surface of the water storage tank. The circulating water pump is connected to the water storage tank and the spraying and cleaning mechanism through a pipeline; The recovery and filtration component also includes a multi - stage filtration device. The inlet of the multi - stage filtration device is connected to the discharge port of the spraying and cleaning mechanism through a pipeline, and the discharge port of the multi - stage filtration device is connected to the inlet of the water storage tank through a pipeline.

[0015] Further, a recovery and solidification component is also included. The recovery and solidification component includes a low - pressure vacuum distillation device. The waste discharge port of the multi - stage filtration device is connected to the inlet of the low - pressure vacuum distillation device through a pipeline. The discharge port of the low - pressure vacuum distillation device is connected to the water storage tank, and a recovery box is connected to the waste discharge port of the low - pressure vacuum distillation device.

[0016] Beneficial effects: In the present invention, by arranging a transmission component on the base, the semiconductor device passes through multiple functional modules in sequence during the horizontal transmission process, forming a continuous and efficient cleaning process. The ultrasonic cleaning mechanism is arranged at the inlet end of the transmission component, and the cleaning box effectively encloses the cleaning environment to avoid splashing of the cleaning liquid and diffusion of the mist. The first water storage plate and the second water storage plate slide and abut the transmission component when the device enters the cleaning area to form a closed ultrasonic cleaning chamber, which effectively concentrates the cleaning energy and improves the cavitation effect. It is suitable for semiconductor devices with complex structures or irregular surfaces, and significantly improves the ability to remove fine particles and attached dirt. It achieves deep cleaning without relying on organic solvents such as fluorine and chlorine, which is in line with the concept of green manufacturing. In addition, the semiconductor device is sent to the spray cleaning mechanism through the transmission component, and multiple array nozzles are evenly distributed on the transmission path to rinse the residue on the surface of the device at multiple angles to achieve the synergistic effect of liquid cleaning and impurity stripping. The drying mechanism is arranged after the spray area to further ensure that the device is in a dry state before leaving the cleaning equipment to prevent water stains from remaining and affecting the subsequent packaging quality. The entire cleaning process is fully automatically controlled and the modules are operated in linkage, which not only reduces the degree of manual participation and occupational health risks, but also significantly shortens the cleaning cycle and improves the production line rhythm. It has excellent environmental protection and cleaning efficiency, and is suitable for semiconductor production scenarios with high cleanliness requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of a fully automatic horizontal cleaning device for semiconductor devices of the present invention; Figure 2 It is a schematic diagram of the assembly of the components of the present invention; Figure 3 It is a structural schematic diagram of the ultrasonic cleaning area of ​​the present invention; Figure 4 It is a structural schematic diagram of the ultrasonic cleaning mechanism of the present invention; Figure 5 It is a structural schematic diagram of the spray cleaning mechanism of the present invention; Figure 6 yes Figure 5 A schematic diagram of the local enlarged structure at point A in the middle; Figure 7 It is a structural schematic diagram of the drying mechanism of the present invention; in: 1. Base; 2. Transmission component; 200. Ultrasonic cleaning area; 201. Water storage separation shaft; 3. Ultrasonic cleaning mechanism; 301. Cleaning box; 302. Baffle; 303. First water storage plate; 304. Second water storage plate; 305. Water storage side plate; 306. Bottom plate; 307. First water blocking strip; 308. Second water blocking strip; 309. Ultrasonic generator; 310. First electric push rod; 311. Second electric push rod; 312. Roller; 313. Water storage tank; 4. Spray cleaning mechanism; 400. Spray channel; 410. Spray box; 420. Spray component; 421. Spray rack; 422. Nozzle; 423. Angle adjustment part; 424. Sliding motor; 425. Pulley; 426. Sliding platform; 5. Drying mechanism; 510. Drying box body; 520. Drying channel; 530. Strong wind drying component; 531. Wind direction adjustment part; 532. Strong force blower; 540. Heating drying component; 541. Blower; 542. Infrared heating tube; 6. Recycling and filtering component; 61. Circulating water pump; 62. Multi-stage filtering device; 7. Recycling and solidifying component; 71. Low-pressure vacuum distillation device; 72. Recycling box; 8. Isolation and transition component.

[0018] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0019] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0021] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection, a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0022] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0023] Referring to Figures 1 to 7 , the present invention provides a fully automatic horizontal cleaning device for semiconductor devices, comprising: a base 1, on which a transmission assembly 2 for conveying semiconductor devices is provided, and the transmission assembly 2 extends along a first direction; An ultrasonic cleaning mechanism 3, which is provided at an inlet end of the transmission assembly 2, and the ultrasonic cleaning mechanism 3 is provided with a cleaning box body 301 surrounding the transmission assembly 2; A spray cleaning mechanism 4, along the conveying direction of the transmission assembly 2, the spray cleaning mechanism 4 is provided behind the ultrasonic cleaning mechanism 3, and the spray cleaning mechanism 4 includes a plurality of nozzles 422 arranged in an array; A drying mechanism 5, along the conveying direction of the transmission assembly 2, the drying mechanism 5 is provided behind the spray cleaning mechanism 4, for drying the cleaned semiconductor devices; Wherein, along a second direction, baffles 302 are provided on opposite sides of the transmission assembly 2, the baffles 302 are arranged inside the cleaning box body 301, and a first water storage plate 303 and a second water storage plate 304 are slidably connected between the two baffles 302 along a third direction. When the semiconductor device is conveyed between the first water storage plate 303 and the second water storage plate 304, the first water storage plate 303 and the second water storage plate 304 slide and abut against the transmission assembly 2 to form an ultrasonic cleaning chamber.

[0024] In the above embodiments, a transmission component 2 extending in the first direction is provided on the base 1. The first direction is the conveying direction of the transmission component 2. The transmission component 2 adopts a roller 312 conveying mechanism to ensure that the semiconductor device can move smoothly and continuously in the horizontal direction during the cleaning process, thereby realizing an automated production line operation. The stable operation of the transmission component 2 enables the device to pass through the subsequent cleaning and drying modules in sequence, forming an efficient cleaning process. The ultrasonic cleaning mechanism 3 is arranged at one end of the inlet of the transmission component 2 and includes a cleaning box body 301 surrounding the transmission component 2. The cleaning box body 301 is made of corrosion-resistant material, which can effectively prevent the splashing of cleaning liquid or the diffusion of aerosol and keep the cleaning environment clean. In the cleaning box body 301, it is necessary to cooperate with an ultrasonic generator 309. Through the cavitation effect of generating microbubbles by high-frequency vibration, it can penetrate into the dead corners of the complex radiator structure and efficiently remove surface particles and organic pollutants. Along the second direction, baffles 302 are arranged on both sides of the transmission component 2 in the cleaning box body 301. A first water storage plate 303 and a second water storage plate 304 are slidably connected between the baffles 302 in the third direction, that is, the first water storage plate 303 and the second water storage plate 304 can slide up and down. When the semiconductor device is transported between the first water storage plate 303 and the second water storage plate 304, the two plates slide through a driving mechanism such as a cylinder or a motor and tightly abut against the transmission component 2 to form a closed ultrasonic cleaning chamber, which not only concentrates the cleaning energy of ultrasonic waves, improves the cavitation effect, but also optimizes the use efficiency of the cleaning liquid and reduces liquid waste.

[0025] After the ultrasonic cleaning mechanism 3, a spray cleaning mechanism 4 is arranged along the conveying direction of the transmission component 2. The mechanism includes a plurality of spray heads 422 distributed in an array. The spray heads 422 can be connected to an environmentally friendly cleaning liquid storage tank through a high-pressure pump and can perform multi-angle and high-pressure flushing on the surface of the device. The uniform distribution of the spray heads 422 ensures that the cleaning liquid can fully cover the surface of the device, further stripping the remaining particles or dirt, forming a complementary effect with ultrasonic cleaning, thereby improving the overall cleaning quality. The spray cleaning mechanism 4 uses a water-based or low-volatility cleaning liquid, avoiding the use of harmful solvents such as fluorine, chlorine, and bromine, significantly reducing environmental pollution and the health risks of operators. Immediately following the spray cleaning mechanism 4, a drying mechanism 5 is arranged at the end of the transmission component 2. By adopting hot air circulation or infrared heating technology, it can quickly evaporate the remaining moisture on the surface of the device, ensuring that the device is completely dry when leaving the equipment, effectively preventing the influence of water stains or moisture on the subsequent packaging process, and ensuring the high cleanliness requirements of the device.

[0026] Furthermore, the opening of the cleaning box body 301 cooperates with the cleaning channel of the transmission component 2 and has a certain height space, so it can allow semiconductor devices with a certain height to pass horizontally for cleaning, solving the problem in the prior art that through-type cleaning can only clean horizontal thin products such as PCB types.

[0027] In summary, by setting the transmission component 2 on the base 1, the semiconductor device passes through multiple functional modules in sequence during the horizontal transmission process, forming a continuous and efficient cleaning process. The ultrasonic cleaning mechanism 3 is arranged at the inlet end of the transmission component 2, and the cleaning box 301 effectively encloses the cleaning environment to avoid splashing of the cleaning liquid and diffusion of the mist. The first water storage plate 303 and the second water storage plate 304 slide and abut the transmission component 2 when the device enters the cleaning area to form a closed ultrasonic cleaning chamber, which effectively concentrates the cleaning energy and improves the cavitation effect. It is suitable for semiconductor devices with complex structures or irregular surfaces, and significantly improves the ability to remove fine particles and attached dirt. It achieves deep cleaning without relying on organic solvents such as fluorine and chlorine, which is in line with the concept of green manufacturing. In addition, the semiconductor device is sent to the spray cleaning mechanism 4 through the transmission component 2, and multiple array nozzles 422 are evenly distributed in the transmission path to rinse the residue on the surface of the device at multiple angles to achieve the synergistic effect of liquid cleaning and impurity stripping. The drying mechanism 5 is arranged after the spray area to further ensure that the device is in a dry state before leaving the cleaning equipment to prevent water stains from remaining and affecting the subsequent packaging quality. The entire cleaning process is fully automatically controlled and the modules are operated in linkage, which not only reduces the degree of manual participation and occupational health risks, but also significantly shortens the cleaning cycle and improves the production line rhythm. It has excellent environmental protection and cleaning efficiency, and is suitable for semiconductor production scenarios with high cleanliness requirements.

[0028] refer to Figure 1 In one embodiment, an isolation transition component 8 is also provided, which is arranged after the spray cleaning mechanism 4 along the conveying direction of the transmission component 2, and is used to isolate the cleaning area and the drying area in the fully automatic horizontal cleaning equipment to prevent water vapor from affecting the subsequent drying and discharging process.

[0029] refer to Figure 1 , Figure 3 and Figure 4 In one embodiment, the transmission component 2 is provided with an ultrasonic cleaning area 200 corresponding to the ultrasonic cleaning chamber, and water storage partition axes 201 are respectively provided on both sides of the ultrasonic cleaning area 200 along the first direction, and the two water storage partition axes 201 are respectively aligned with the first water storage plate 303 and the second water storage plate 304; The water storage dividing shafts 201 are all connected with water storage side plates 305, and the water storage side plates 305 are arranged below the transmission component 2, and a bottom plate 306 is fixedly connected between the two water storage side plates 305, so that when the first water storage plate 303 and the second water storage plate 304 slide and abut against the water storage dividing shaft 201, the bottom plate 306, the water storage side plates 305, the first water storage plate 303, the second water storage plate 304 and the baffle 302 form the ultrasonic cleaning chamber.

[0030] In the above embodiments, the part of the transmission component 2 corresponding to the ultrasonic cleaning chamber is set as the ultrasonic cleaning area 200, which is specifically used to carry semiconductor devices for ultrasonic cleaning. On both sides of the ultrasonic cleaning area 200 in the first direction, water storage partition shafts 201 are respectively arranged, and the two water storage partition shafts 201 are precisely aligned with the first water storage plate 303 and the second water storage plate 304 to ensure that the two plates can be closely matched with the water storage partition shafts 201 when sliding down. The water storage partition shafts 201 are made of corrosion-resistant materials and are fixed on both sides of the transmission component 2, which not only plays a positioning role but also provides structural support for the airtightness of the subsequent chamber. Each water storage partition shaft 201 is also connected with a water storage side plate 305. The water storage side plates 305 are arranged below the transmission component 2, and the two water storage side plates 305 are connected by a fixedly connected bottom plate 306. The bottom plate 306 also uses corrosion-resistant materials to ensure the structural stability under long-term use. When the first water storage plate 303 and the second water storage plate 304 slide through the driving mechanism and abut against the water storage partition shafts 201, the bottom plate 306, the water storage side plates 305, the first water storage plate 303, the second water storage plate 304 and the baffles 302 on both sides jointly enclose a sealed ultrasonic cleaning chamber.

[0031] In one example, a first water blocking strip 307 is arranged on the upper end surface of the water storage side plate 305. The first water blocking strip 307 is fixedly connected with the water storage partition shaft 201. A second water blocking strip 308 is arranged on one end surface of the first water storage plate 303 and the second water storage plate 304 facing the water storage side plate 305. The widths of the first water blocking strip 307 and the second water blocking strip 308 are both greater than the width of the water storage partition shaft 201. Below the ultrasonic cleaning area 200, an ultrasonic generator 309 is arranged, and the ultrasonic generator 309 is fixedly connected with the bottom plate 306.

[0032] In the above embodiment, a first water blocking strip 307 is fixedly arranged on the upper end surface of the water storage side plate 305, and the first water blocking strip 307 is in close fit with the water storage separation shaft 201 through mechanical fixation. Second water blocking strips 308 are respectively arranged at the bottom ends of the first water storage plate 303 and the second water storage plate 304 facing the water storage side plate 305. The widths of the first water blocking strip 307 and the second water blocking strip 308 are both greater than the width of the water storage separation shaft 201, so as to form a wider sealing contact surface during sliding contact, thereby enhancing the leak-proof performance of the chamber. The water storage side plates 305 are fixedly connected through a bottom plate 306, and an ultrasonic generator 309 is installed below the bottom plate 306. The generator is firmly connected to the bottom plate 306 by bolts or welding to ensure that it will not loosen under high-frequency vibration. The ultrasonic generator 309 can generate high-frequency ultrasonic waves to drive the cleaning liquid to produce cavitation effects, efficiently removing tiny particles and contaminants on the surface of semiconductor devices. When the first water storage plate 303 and the second water storage plate 304 slide to abut against the water storage separation shaft 201, the bottom plate 306, the water storage side plates 305, the first water storage plate 303, the second water storage plate 304 and the baffles 302 on both sides jointly enclose a sealed ultrasonic cleaning chamber.

[0033] In one example, a first electric push rod 310 and a second electric push rod 311 are arranged on an end surface of the baffle 302 facing away from the transmission assembly 2. The driving end of the first electric push rod 310 is connected to the first water storage plate 303, and the driving end of the second electric push rod 311 is connected to the second water storage plate 304; A plurality of rollers 312 are arranged on an end surface of the baffle 302 facing the transmission assembly 2. The plurality of rollers 312 are all rotatably connected to the baffle 302. Among them, the plurality of rollers 312 are respectively arranged on opposite end surfaces of the first water storage plate 303 and opposite end surfaces of the second water storage plate 304, so that the first water storage plate 303 and the second water storage plate 304 are slidably connected to the baffle 302 along the third direction.

[0034] In the above embodiments, one end face of the baffle 302 facing away from the transmission component 2 is fixedly installed with a first electric push rod 310 and a second electric push rod 311 by bolts or welding. The driving end of the first electric push rod 310 is firmly connected to the first water storage plate 303 through a connecting member, and the driving end of the second electric push rod 311 is also connected to the second water storage plate 304, ensuring that the push rod can accurately drive each water storage plate to lift and lower along the third direction. On the end face of the baffle 302 facing the transmission component 2, that is, the inner side, a number of rollers 312 are provided. The rollers 312 themselves can be replaced by bearings, or can be in the form of a wheel body structure and rotatably connected to the baffle 302 through bearings. The rollers 312 are respectively distributed on the opposite end faces of the first water storage plate 303 and the second water storage plate 304, forming a sliding support structure. The rollers 312 are made of wear-resistant and high-strength materials to ensure low-friction sliding can still be maintained under long-term use, enabling the first water storage plate 303 and the second water storage plate 304 to smoothly slide and connect with the baffle 302 along the third direction. When the electric push rod is started, the first water storage plate 303 and the second water storage plate 304 move with the assistance of the rollers 312, and enclose a sealed ultrasonic cleaning chamber with the water storage separation shaft 201 and the water storage side plate 305.

[0035] The first electric push rod 310 and the second electric push rod 311 provide precise linear drive, can quickly adjust the position of the water storage plate, ensure that the chamber can be assembled or disassembled within a short time, thereby shortening the preparation time of the cleaning process. The setting of the rollers 312 reduces the instability when the water storage plate lifts and lowers, reduces the energy consumption of the electric push rod, improves the smoothness of movement and the positioning accuracy at the same time, effectively avoids the jamming problem in traditional mechanical sliding, and extends the service life of the equipment. The rapid formation of the sealed chamber ensures the sealing of the cleaning liquid, prevents liquid leakage, and improves the environmental safety of the cleaning process. The sliding connection between the rollers 312 and the water storage plate also enhances the modular characteristics of the structure, facilitates the maintenance and replacement of components, and reduces the operation cost of the equipment.

[0036] Reference Figure 1 、 Figure 5 and Figure 6 and, in an example, the spray cleaning mechanism 4 further includes a spray box 410, and the spray box 410 is provided with a spray channel 400 for the transmission component 2 to pass through; Two symmetrically arranged spray components 420 are connected inside the spray box 410. The two spray components 420 are respectively arranged above and below the transmission component 2. The spray component 420 includes a spray rack 421, the spray rack 421 is connected to the spray box 410, and a number of arrayed nozzles 422 are connected to the spray rack 421.

[0037] In the above embodiments, based on the cleaning structure of the spray box 410 and the symmetric spray assembly 420, efficient and uniform cleaning of semiconductor devices can be achieved, thereby improving the cleaning quality and the operating efficiency of the equipment. The spray cleaning mechanism 4 includes a spray box 410 made of corrosion-resistant materials. A spray channel 400 running through in the first direction is provided inside it for the transmission assembly 2 to pass through. The transmission assembly 2 is used to carry and convey semiconductor devices through the spray area. Two groups of symmetrically arranged spray assemblies 420 are fixedly connected inside the spray box 410, located above and below the transmission assembly 2 respectively, ensuring that both the upper and lower surfaces of the device can be covered by the cleaning liquid. Each spray assembly 420 includes a spray rack 421 connected to the inner wall of the spray box 410, which can achieve multi-directional spraying through swinging. A number of spray nozzles 422 arranged in an array are installed on the spray rack 421. The spray nozzles 422 are connected to the external cleaning liquid supply system through pipelines. The spray nozzles 422 adopt a high-pressure spraying structure and can spray the cleaning liquid in a uniform atomized form to cover the surface of the semiconductor devices on the transmission assembly 2.

[0038] The symmetrically arranged upper and lower spray assemblies 420 achieve full coverage of the cleaning liquid through the array of spray nozzles 422, effectively removing pollutants and residues on the surface of the device. The spray rack 421 ensures the stability of the spray nozzles 422 under high-pressure spraying. The array of spray nozzles 422 optimizes the distribution of the cleaning liquid and reduces liquid waste. In addition, the closed structure of the spray box 410 effectively prevents the cleaning liquid from splashing outside, keeps the cleaning area clean, meets environmental protection requirements, and continuous automated cleaning operations adapt to high-throughput production needs. Through precise spraying control and uniform liquid flow distribution, the cleaning efficiency and surface cleanliness of semiconductor devices are significantly improved.

[0039] Reference Figure 5 and Figure 6 , in an example, a number of angle adjusting members 423 are arranged in an array on the spray rack 421, and the movable end of the angle adjusting member 423 is fixedly connected to the spray nozzle 422; Sliding motors 424 are arranged on the opposite sides of the spray rack 421 along the conveying direction of the transmission assembly 2. A pulley 425 is provided on the output shaft of the sliding motor 424. The spray box 410 is provided with a sliding platform 426 corresponding to the pulley 425, so that the spray rack 421 is slidably connected to the spray box 410 to achieve relative swinging between the spray nozzles 422 and the transmission assembly 2.

[0040] In the above embodiments, for the spray cleaning mechanism 4 in the fully automatic horizontal cleaning equipment for semiconductor devices, a spray rack 421 structure with a dynamic adjustment function is provided to achieve flexible adjustment of the angle and position of the nozzles 422, thereby improving the accuracy and adaptability of cleaning. Specifically, a plurality of angle adjustment members 423 are arranged in an array on the spray rack 421. The movable end of each angle adjustment member 423 is fixedly connected to the nozzle 422 by bolts or buckles, and the driving end of the angle adjustment member 423 can achieve dynamic adjustment of the nozzle 422 within a preset angle range. In addition, sliding motors 424 are respectively installed on the opposite sides of the spray rack 421 along the conveying direction of the conveying component 2. The output shaft of the sliding motor 424 is connected to a pulley 425, and the pulley 425 cooperates with a sliding platform 426 provided on the inner wall of the spray tank 410. The sliding platform 426 is a high-precision guide rail structure, ensuring that the spray rack 421 reciprocates along the second direction within the spray tank 410, thereby realizing the swing of the nozzles 422 on the spray rack 421 relative to the conveying component 2.

[0041] The setting of the angle adjustment member 423 allows the nozzle 422 to dynamically adjust the spraying angle according to the shape and surface characteristics of the semiconductor device, ensuring that the cleaning liquid can accurately cover the complex areas on the device surface, effectively removing fine particles and residues, and improving the cleaning quality. The cooperation between the sliding motor 424 and the sliding platform 426 enables the spray rack 421 to reciprocate along the conveying direction, expanding the cleaning coverage range of the nozzles 422, adapting to different sizes and types of devices, and enhancing the versatility of the equipment.

[0042] Reference Figure 1 、 Figure 2 and Figure 7 Referring to

[0043] In the above embodiment, the drying mechanism 5 includes a drying box body 510. Inside the drying box body 510, there is a drying channel 520 through which the transmission component 2 passes. The drying channel 520 is integrated with a strong wind drying component 530 and a heating drying component 540. Among them, the strong wind drying component 530 is located on the inlet side of the drying channel 520, and the heating drying component 540 is arranged after the strong wind drying component 530 along the conveying direction of the transmission component 2. The strong wind drying component 530 can be composed of multiple groups of high-speed centrifugal fans and a matching air guiding structure. The high-speed air flow generated by the fans is evenly distributed to the surface of the device through the air guiding structure. The heating drying component 540 can include infrared heating tubes 542 and temperature sensors. The infrared heating tubes 542 are symmetrically arranged on both sides of the drying channel 520. The temperature sensors monitor the temperature in the channel in real time and feedback it to the control system to ensure the precise control of the heating process.

[0044] Through the collaborative work of the strong wind drying component 530 and the heating drying component 540, the drying efficiency and the drying quality of the device surface are significantly improved. The strong wind drying component 530 acts on the cleaned semiconductor device first, using the high-speed air flow to quickly blow off the liquid droplets and moisture residues on the device surface, reducing the burden of subsequent heating and drying, and at the same time avoiding secondary pollution caused by the retention of liquid. Then, the heating drying component 540 provides uniform heat through the infrared heating tubes 542 to further evaporate the trace residual moisture, ensuring that the device surface is completely dry, preventing the formation of water stains or oxides, and thus improving the cleanliness and reliability of the device surface.

[0045] In one embodiment, the strong wind drying component 530 includes a wind direction adjusting member 531. The wind direction adjusting member 531 is rotatably connected to the drying box body 510, and a plurality of wind direction adjusting openings are divergently arranged along the rotation axis core of the wind direction adjusting member 531. The wind direction adjusting member 531 is connected to a powerful blower 532; The heating drying component 540 includes a blower 541. An infrared heating tube 542 is arranged between the outlet of the blower 541 and the transmission component 2.

[0046] In the above embodiment, the strong wind drying assembly 530 includes a wind direction adjusting member 531. The wind direction adjusting member 531 is rotatably connected to the drying box body 510 through a rotating shaft. A plurality of wind direction adjusting openings are arranged divergently along the rotating shaft core. The wind direction adjusting member 531 is connected to a strong wind blower 532. The strong wind blower 532 is driven by a variable frequency motor to generate a high-speed air flow, and the air flow is evenly distributed to the surface of the device through the wind direction adjusting openings. The rotation of the wind direction adjusting member 531 allows the dynamic adjustment of the air flow angle to adapt to semiconductor devices of different sizes and shapes. The heating and drying assembly 540 includes a blower 541. An infrared heating tube 542 is arranged between the outlet of the blower 541 and the transmission assembly 2. The infrared heating tubes 542 are symmetrically arranged on both sides of the drying channel 520, and cooperate with a temperature sensor and a control system to achieve precise temperature control.

[0047] Furthermore, the wind direction adjusting member 531 of the strong wind drying assembly 530 can adjust the air flow direction and intensity according to the characteristics of the semiconductor device through the rotating shaft and a plurality of wind direction adjusting openings. The high-speed air flow effectively blows off the droplets and moisture residues on the surface of the device, reducing the burden of subsequent heating and drying, and at the same time avoiding secondary pollution caused by liquid retention. The variable frequency control of the strong wind blower 532 further optimizes the air flow output and reduces energy consumption. The blower 541 of the heating and drying assembly 540 and the infrared heating tube 542 work together. The air flow generated by the blower 541 forms uniform hot air after being heated by the infrared heating tube 542 and directly acts on the surface of the device, accelerating the evaporation of trace residual moisture, ensuring the complete drying of the device, preventing the formation of water stains or oxides, thereby improving the cleanliness and reliability of the device surface. The efficient heat conduction of the infrared heating tube 542 combined with the real-time monitoring of the temperature sensor avoids damage to the device performance caused by overheating and extends the service life of the device. The enclosed structure of the drying box body 510 prevents external moisture interference, maintains a stable drying environment, and at the same time reduces heat loss, meeting the requirements of energy conservation and environmental protection. Through dynamic wind direction adjustment and precise heating control, not only a fast and uniform drying effect is achieved, but also the adaptability of the equipment to different device types is improved, the production cost is reduced, the high-throughput production demand is supported, and a high-quality surface state is provided for the subsequent processing of semiconductor devices.

[0048] Reference Figure 1 , in one embodiment, a recovery and filtration assembly 6 is further included. The ultrasonic cleaning mechanism 3 is further provided with a water storage tank 313. The water storage tank 313 is arranged below the cleaning box body 301. The recovery and filtration assembly 6 includes a circulating water pump 61. The circulating water pump 61 is arranged on the upper end surface of the water storage tank 313. The circulating water pump 61 is connected to the water storage tank 313 and the spray cleaning mechanism 4 through a pipeline; The recycling and filtering component 6 further includes a multi-stage filtering device 62. The inlet of the multi-stage filtering device 62 is connected to the discharge port of the spray cleaning mechanism 4 through a pipeline, and the discharge port of the multi-stage filtering device 62 is connected to the inlet of the water storage tank 313 through a pipeline.

[0049] In the above embodiment, the efficient recycling and reuse of the cleaning water are realized through the recycling and filtering component 6, minimizing the wastewater discharge to the greatest extent and approaching the goals of zero discharge and pollution-free. Specifically, the cleaning equipment includes a cleaning box body 301 made of corrosion-resistant stainless steel material, and a water storage tank 313 is arranged below the box body. The water volume can be monitored in real time through a liquid level sensor. The recycling and filtering component 6 includes a circulating water pump 61 and a multi-stage filtering device 62. The circulating water pump 61 is installed on the upper end surface of the water storage tank 313, and the water storage tank 313 and the spray cleaning mechanism 4 are connected through a high-pressure resistant pipeline to ensure the connection of the cleaning water and the spray cleaning mechanism 4. The spray cleaning mechanism 4 evenly sprays the cleaning liquid onto the surface of the semiconductor device through high-pressure nozzles to remove surface particles and pollutants, and the wastewater generated at its discharge port flows into the inlet of the multi-stage filtering device 62 through a pipeline. The discharge port of the multi-stage filtering device 62 is connected to the inlet of the water storage tank 313 through a pipeline to form a closed water circulation system. The multi-stage filtering device 62 includes three levels of filtering units: ultrafiltration, nanofiltration, and reverse osmosis, which respectively process pollutants with different particle sizes and types step by step to ensure the purity of the recycled water. It can also be set to turn on different levels of filtering according to the cleanliness requirements of different semiconductor devices.

[0050] The circulating water pump 61 adopts variable frequency control technology to adjust the water flow rate and pressure according to the real-time demand of the spray cleaning mechanism 4, which not only ensures the cleaning effect but also reduces the energy consumption. The sealing structure of the water storage tank 313 and the liquid level sensor work together to dynamically monitor and maintain the water volume balance, avoiding overflow or water shortage phenomena and ensuring the stability of the system operation. The wastewater generated by the spray cleaning mechanism 4 contains pollutants such as trace particles, organic substances, and ions. Direct discharge not only wastes resources but also may cause environmental pollution. The multi-stage filtering device 62 effectively solves this problem through the step-by-step treatment of ultrafiltration, nanofiltration, and reverse osmosis. The ultrafiltration unit uses a membrane module with a pore size of 0.01 micrometers to intercept large particle suspensions and colloids; the nanofiltration unit further removes organic substances with smaller molecular weights and some salts; the reverse osmosis unit removes residual ions and dissolved impurities through a highly selective membrane, making the purity of the recycled water close to the deionized water standard. The filtered water flows back to the water storage tank 313 through a pipeline and re-enters the spray cleaning mechanism 4 to form an efficient closed-loop water circulation system. This system can recycle more than 95% of the cleaning water, greatly reducing the usage amount of fresh water and lowering the production cost.

[0051] In addition, the modular design of the multi-stage filtration device 62 facilitates maintenance and replacement. Meanwhile, the anti-pollution coating of the filtration unit reduces the membrane clogging problem and lowers the maintenance frequency. The cleaning box body 301 and the pipeline system are made of corrosion-resistant materials to prevent chemical erosion and ensure the reliability of long-term operation. In summary, the fully automatic horizontal cleaning equipment of this semiconductor device not only realizes the efficient recycling of water resources, but also significantly reduces wastewater discharge, meeting the environmental protection goals of zero discharge and pollution-free. The efficient operation of the recycling and filtration system ensures the water quality stability during the cleaning process of semiconductor devices, avoids the influence of secondary pollution on the surface cleanliness of the devices, improves the cleaning quality and device reliability. At the same time, the filtration system has good adaptability to different types and sizes of semiconductor devices, supports high-throughput production requirements, demonstrates significant economic and environmental benefits, and provides important technical support for the green and intelligent development of semiconductor cleaning equipment.

[0052] Reference Figure 1 , in one embodiment, it further includes a recycling and solidification component 7. The recycling and solidification component 7 includes a low-pressure vacuum distillation device 71. The waste discharge port of the multi-stage filtration device 62 is connected to the inlet of the low-pressure vacuum distillation device 71 through a pipeline. The discharge port of the low-pressure vacuum distillation device 71 is connected to the water storage tank 313, and a recycling box 72 is connected to the waste discharge port of the low-pressure vacuum distillation device 71.

[0053] In the above embodiment, the recycling and solidification component 7 further realizes the resource utilization of waste liquid, minimizes environmental pollution to the greatest extent, and further promotes the realization of the zero-discharge goal. In the recycling and solidification component 7, the low-pressure vacuum distillation device 71 is connected to the waste discharge port of the multi-stage filtration device 62 through a high-pressure-resistant pipeline to receive the high-concentration waste liquid discharged from the multi-stage filtration device 62. The discharge port of the low-pressure vacuum distillation device 71 is connected to the water storage tank 313 through a pipeline to return the purified water generated by distillation to the water storage tank 313 for reuse in the spray cleaning mechanism 4. Its waste discharge port is connected to a recycling box 72 for collecting concentrated or solidified residual substances. The multi-stage filtration device 62 has removed most of the particles, organic substances and ions in the cleaning wastewater through ultrafiltration, nanofiltration and reverse osmosis units in the pre-treatment, and outputs a waste liquid close to saturation, containing high-concentration solutes and a small amount of residual pollutants. Direct discharge will cause waste of resources and environmental burden, and the low-pressure vacuum distillation device 71 effectively solves this problem.

[0054] Specifically, the low-pressure vacuum distillation device 71 adopts vacuum technology and a heating module to reduce the boiling point of water in a low-pressure environment, significantly reducing energy consumption. At the same time, it avoids the decomposition of sensitive components in the waste liquid through temperature control. After the waste liquid enters the distillation device, it is heated and evaporated in the vacuum cavity, and water molecules are separated and condensed into pure water, which flows back to the water storage tank 313 through the discharge port and re-enters the cleaning circulation system. The remaining concentrated liquid or solidified matter is collected in the waste collection box 72 through the waste discharge port. The waste collection box 72 is made of corrosion-resistant materials and is equipped with a sealed cover and waste classification compartments for subsequent treatment or resource utilization. The entire system realizes automated operation through the PLC control unit, real-time monitoring the vacuum degree, temperature, and waste liquid flow rate to ensure the efficiency and stability of the distillation process.

[0055] Through the optimization of the recycling and solidification component 7, the environmental protection performance and resource utilization efficiency of this equipment are significantly improved. The low-pressure vacuum distillation device 71 can process the high-concentration waste liquid discharged from the multi-stage filtration device 62, recover more than 95% of the water in it as pure water and reuse it for the cleaning process, greatly reducing the consumption of fresh water and lowering the production cost. The concentrated liquid or solidified matter collected in the waste collection box 72 can be further processed for resource utilization, such as extracting valuable chemical substances or using it as industrial raw materials, realizing waste reduction and resource utilization. The low-energy consumption design and automated control system of the low-pressure vacuum distillation device 71 reduce the operating cost. The selection of corrosion-resistant materials for the pipeline system and the waste collection box 72 ensures the reliability of long-term operation and prevents chemical corrosion. The coordinated work of the cleaning box 301 and the water storage tank 313 maintains the stability of the water circulation system and avoids environmental pollution caused by the external discharge of waste liquid.

[0056] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural or equivalent process transformations made using the content of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are equally included in the patent protection scope of the present invention.

Claims

1. A fully automatic horizontal cleaning device for a semiconductor device, characterized in that, Comprising: A base (1), on which a transmission component (2) for transmitting semiconductor devices is provided, and the transmission component (2) extends along a first direction; An ultrasonic cleaning mechanism (3), which is arranged at the inlet end of the transmission component (2), and the ultrasonic cleaning mechanism (3) is provided with a cleaning box body (301) surrounding the transmission component (2); A spray cleaning mechanism (4), along the transmission direction of the transmission component (2), the spray cleaning mechanism (4) is arranged behind the ultrasonic cleaning mechanism (3), and the spray cleaning mechanism (4) includes a plurality of nozzles (422) arranged in an array; A drying mechanism (5), along the transmission direction of the transmission component (2), the drying mechanism (5) is arranged behind the spray cleaning mechanism (4) for drying the cleaned semiconductor devices; Wherein, along a second direction, baffles (302) are arranged on opposite sides of the transmission component (2), the baffles (302) are arranged in the cleaning box body (301), and a first water storage plate (303) and a second water storage plate (304) are slidably connected between the two baffles (302) along a third direction. When the semiconductor device is transmitted between the first water storage plate (303) and the second water storage plate (304), the first water storage plate (303) and the second water storage plate (304) slide and abut against the transmission component (2) to form an ultrasonic cleaning chamber.

2. The fully automatic horizontal cleaning equipment for a semiconductor device according to claim 1, wherein, The transmission component (2) is provided with an ultrasonic cleaning area (200) corresponding to the ultrasonic cleaning chamber. Along the first direction, water storage separation shafts (201) are respectively arranged on both sides of the ultrasonic cleaning area (200), and the two water storage separation shafts (201) are respectively aligned with the first water storage plate (303) and the second water storage plate (304); Both of the water storage separation shafts (201) are connected with water storage side plates (305), and the water storage side plates (305) are arranged below the transmission component (2). A bottom plate (306) is fixedly connected between the two water storage side plates (305). When the first water storage plate (303) and the second water storage plate (304) slide and abut against the water storage separation shafts (201), the bottom plate (306), the water storage side plates (305), the first water storage plate (303), the second water storage plate (304) and the baffles (302) form the ultrasonic cleaning chamber.

3. The fully automatic horizontal cleaning device for a semiconductor device according to claim 2, characterized in that, A first water blocking strip (307) is arranged on the upper end surface of the water storage side plate (305), and the first water blocking strip (307) is fixedly connected with the water storage separation shaft (201). A second water blocking strip (308) is arranged on the end surface of the first water storage plate (303) and the second water storage plate (304) facing the water storage side plate (305). The widths of the first water blocking strip (307) and the second water blocking strip (308) are both greater than the width of the water storage separation shaft (201); An ultrasonic generator (309) is arranged below the ultrasonic cleaning area (200), and the ultrasonic generator (309) is fixedly connected with the bottom plate (306).

4. The fully automatic horizontal cleaning device for a semiconductor device according to claim 1, characterized in that, One end face of the baffle plate (302) facing away from the transmission assembly (2) is provided with a first electric push rod (310) and a second electric push rod (311). The driving end of the first electric push rod (310) is connected to the first water storage plate (303), and the driving end of the second electric push rod (311) is connected to the second water storage plate (304). One end face of the baffle plate (302) facing the transmission assembly (2) is provided with a plurality of rollers (312). The plurality of rollers (312) are all rotatably connected to the baffle plate (302). Among them, the plurality of rollers (312) are respectively arranged on the opposite end faces of the first water storage plate (303) and the opposite end faces of the second water storage plate (304), so that the first water storage plate (303) and the second water storage plate (304) are slidably connected to the baffle plate (302) along the third direction.

5. The full-automatic horizontal cleaning equipment for a semiconductor device according to claim 1, wherein, The spray cleaning mechanism (4) further includes a spray box (410). The spray box (410) is provided with a spray channel (400) for the transmission assembly (2) to pass through. Two symmetrically arranged spray assemblies (420) are connected in the spray box (410). The two spray assemblies (420) are respectively arranged above and below the transmission assembly (2). The spray assembly (420) includes a spray frame (421). The spray frame (421) is connected to the spray box (410), and a plurality of arrayed spray heads (422) are connected to the spray frame (421).

6. The fully automatic horizontal cleaning device for a semiconductor device according to claim 5, characterized in that, A plurality of angle adjusting members (423) are arrayed on the spray frame (421). The movable end of the angle adjusting member (423) is fixedly connected to the spray head (422). Sliding motors (424) are arranged on opposite sides of the spray frame (421) along the conveying direction of the transmission assembly (2). A pulley (425) is arranged on the output shaft of the sliding motor (424). The spray box (410) is provided with a sliding platform (426) corresponding to the pulley (425), so that the spray frame (421) is slidably connected to the spray box (410) to realize the relative swing of the spray head (422) and the transmission assembly (2).

7. The fully automatic horizontal cleaning equipment for a semiconductor device according to claim 1, characterized in that, The drying mechanism (5) includes a drying box body (510). The drying box body (510) is provided with a drying channel (520) for the transmission assembly (2) to pass through. A strong wind drying component (530) and a heating drying component (540) are arranged in the drying channel (520). The heating drying component (540) is arranged behind the strong wind drying component (530) along the conveying direction of the transmission assembly (2).

8. The fully automatic horizontal cleaning device for a semiconductor device according to claim 7, wherein, The strong wind drying component (530) includes a wind direction adjusting member (531). The wind direction adjusting member (531) is rotatably connected to the drying box body (510), and a plurality of wind direction adjusting openings are divergently arranged along the rotation axis core of the wind direction adjusting member (531). The wind direction adjusting member (531) is connected with a strong wind blower (532). The heating and drying assembly (540) includes a blower (541), and an infrared heating tube (542) is provided between the outlet of the blower (541) and the transmission assembly (2).

9. The fully automatic horizontal cleaning device for a semiconductor device according to claim 1, wherein, It further includes a recycling and filtering assembly (6). The ultrasonic cleaning mechanism (3) is further provided with a water storage tank (313). The water storage tank (313) is arranged below the cleaning box body (301). The recycling and filtering assembly (6) includes a circulating water pump (61). The circulating water pump (61) is arranged on the upper end surface of the water storage tank (313). The circulating water pump (61) is connected to the water storage tank (313) and the spray cleaning mechanism (4) through pipelines; The recycling and filtering assembly (6) further includes a multi-stage filtering device (62). The inlet of the multi-stage filtering device (62) is connected to the discharge port of the spray cleaning mechanism (4) through a pipeline. The discharge port of the multi-stage filtering device (62) is connected to the inlet of the water storage tank (313) through a pipeline.

10. The fully automatic horizontal cleaning device for a semiconductor device according to claim 9, characterized in that, It further includes a recycling and curing assembly (7). The recycling and curing assembly (7) includes a low-pressure vacuum distillation device (71). The waste discharge port of the multi-stage filtering device (62) is connected to the inlet of the low-pressure vacuum distillation device (71) through a pipeline. The discharge port of the low-pressure vacuum distillation device (71) is connected to the water storage tank (313), and a recycling box (72) is connected to the waste discharge port of the low-pressure vacuum distillation device (71).

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