Chip tantalum capacitor anode tantalum block forming and sintering device and method for improving density

Abstract

The invention relates to the technical field of tantalum block forming and sintering, in particular to a chip tantalum capacitor anode tantalum block forming and sintering device and method for improving compactness. The device comprises a workbench, a sintering box and a bearing plate, the sintering box and the bearing plate are fixed to the workbench, a lifting assembly is arranged on the workbench, and a supporting pipe is connected to the lifting assembly; the forming kettle is fixed to the bearing plate, and an ejection assembly connected with the forming kettle is installed on the workbench; the intermittent slicking assembly is arranged on the supporting pipe, and the intermittent slicking assembly comprises a slicking plate matched with the forming kettle; and the staggered compaction mechanism is arranged on the supporting pipe and connected with the intermittent slicking assembly, the staggered compaction mechanism comprises a plurality of first compaction plates and second compaction plates which are distributed at equal intervals in the circumferential direction, and multidirectional compaction acting force can be applied to tantalum powder through alternate lifting of the first compaction plates and the second compaction plates so as to ensure that the compactness of tantalum blocks is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of tantalum block forming and sintering, and specifically to a forming and sintering device and method for an anode tantalum block of a chip tantalum capacitor with improved density. Background Art

[0002] A chip tantalum capacitor, also known as a surface mount tantalum capacitor, is a type of electrolytic capacitor. It uses metallic tantalum as the anode material and has unique properties and a wide range of applications.

[0003] According to the anode structure, it can be divided into two types: foil type and sintered tantalum powder type; among the sintered tantalum powder type tantalum capacitors, they can be further divided into solid electrolyte tantalum capacitors and non-solid electrolyte tantalum capacitors according to different working electrolytes, and the solid tantalum electrolytic capacitors have the largest usage.

[0004] Before sintering the tantalum block, it is necessary to compact and form the tantalum block. When the existing tantalum block is molded by die pressing, usually the tantalum powder is directly pressed to form. When the bottom of the die cavity is in a special-shaped state, due to a certain height difference at the bottom of the die cavity, if it is directly applied to the tantalum powder for forming, it will inevitably lead to the problem that some parts of the tantalum block are too compact and some are relatively loose during forming, resulting in poor density and uniformity of the product, and further causing pores to be generated inside the tantalum block during the subsequent sintering process, affecting the density and electrical properties of the product. Summary of the Invention

[0005] The purpose of the present invention is to provide a forming and sintering device and method for an anode tantalum block of a chip tantalum capacitor with improved density, so as to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A forming and sintering device for an anode tantalum block of a chip tantalum capacitor with improved density, comprising:

[0008] A workbench, a sintering box and a receiving plate fixed on the workbench, a lifting assembly is arranged on the workbench, and a support tube is connected to the lifting assembly;

[0009] It further includes:

[0010] A forming kettle fixed on the receiving plate, and an ejecting assembly connected to the forming kettle is installed on the workbench;

[0011] An intermittent scraping assembly is arranged on the support tube, and the intermittent scraping assembly includes a scraping plate cooperating with the forming kettle;

[0012] The staggered compaction mechanism is arranged on the support pipe and connected to the intermittent scraping and leveling assembly. The staggered compaction mechanism includes a plurality of first compaction plates and second compaction plates that are circumferentially and equidistantly distributed. When the intermittent scraping and leveling assembly moves, the staggered compaction mechanism can drive the first compaction plate and the second compaction plate to reciprocate staggeredly in the vertical direction.

[0013] As a further scheme of the present invention: The intermittent scraping and leveling assembly includes a second motor fixedly installed at the end of the support pipe. A transmission rod is rotatably installed in the support pipe and is connected to the output shaft of the second motor. The transmission rod is fixedly connected to the scraping plate.

[0014] As a further scheme of the present invention: The staggered compaction mechanism includes a first guide groove and a second guide groove opened on the inner wall of the support pipe. A first rotating sleeve is slidably installed on the transmission rod. The first rotating sleeve is fixedly connected to the first compaction plate. A first movable ring is fixed at the end of the first rotating sleeve. A first limiting block that is slidably fitted with the first guide groove is fixed on the first movable ring.

[0015] As a further scheme of the present invention: The staggered compaction mechanism further includes a second rotating sleeve slidably installed on the first rotating sleeve. A through groove that is slidably matched with the first compaction plate is opened on the circumferential outer wall of the second rotating sleeve. The second rotating sleeve is fixedly connected to the second compaction plate. A second movable ring is fixed at the end of the second rotating sleeve. A second limiting block that is slidably fitted with the second guide groove is fixed on the second movable ring. An elastic component is arranged in the support pipe.

[0016] As a further scheme of the present invention: The elastic component includes a fixing plate fixed in the support pipe. A first spring that abuts against the first movable ring is sleeved on the transmission rod. A second spring is sleeved on the second rotating sleeve. The two ends of the second spring respectively abut against the second movable ring and the fixing plate.

[0017] As a further scheme of the present invention: The first guide groove includes a first annular groove, a first inclined groove, and a first vertical groove opened on the inner wall of the support pipe. A plurality of the first inclined grooves and the first vertical grooves are circumferentially and equidistantly distributed. The two ends of the first annular groove are respectively connected to the ends of one of the first inclined grooves and one of the first vertical grooves.

[0018] As a further scheme of the present invention: The second guide groove includes a second annular groove, a second inclined groove, and a second vertical groove opened on the inner wall of the support pipe. A plurality of the second inclined grooves and the second vertical grooves are circumferentially and equidistantly distributed. The two ends of the second annular groove are respectively connected to the ends of one of the second inclined grooves and one of the second vertical grooves.

[0019] As a further solution of the present invention: The lifting assembly includes a guide rail formed on the workbench. A first motor is fixed on the workbench. A lead screw connected to the output shaft of the first motor is rotatably installed on the workbench. A threaded sleeve is threadedly connected to the lead screw. A sliding plate fixedly connected to the guide rail is fixed on the threaded sleeve. The sliding plate is fixedly connected to the support tube.

[0020] As a further solution of the present invention: The ejecting assembly includes a cylinder fixedly installed on the workbench. An ejecting plate is fixed on the telescopic end of the cylinder. The ejecting plate is slidably connected to the forming kettle.

[0021] A method for forming and sintering an anode tantalum block of a chip tantalum capacitor to improve the density includes the following steps:

[0022] Step 1: Add tantalum powder into the forming kettle, and insert tantalum wires between the tantalum powder.

[0023] Step 2: Under the action of the lifting assembly, control the support tube to move towards the forming kettle, so that the scraping plate, the first compaction plate and the second compaction plate enter the forming kettle.

[0024] Step 3: Under the action of the intermittent scraping assembly, level the tantalum powder through the scraping plate. At the same time, the intermittent scraping assembly controls the first compaction plate and the second compaction plate to perform an interleaved movement in the vertical direction through the interleaved compaction mechanism, so as to perform a multi-directional compaction action on the tantalum powder.

[0025] Step 4: After the compaction and forming are completed, the lifting assembly controls the scraping plate to disengage from the support tube. Under the action of the ejecting assembly, control the tantalum block to disengage from the support tube, and transfer the tantalum block to a sintering box for sintering treatment.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows: This application can realize multi-directional interleaved compaction of the tantalum block through the mutual cooperation of the scraping plate, the first compaction plate and the second compaction plate, so as to ensure that when the surface of the ejecting plate carrying the tantalum powder is irregular, the density and uniformity of the tantalum block forming can still reach the best. Specifically, when the tantalum powder and tantalum wires are added into the forming kettle, under the action of the lifting assembly, control the scraping plate, the first compaction plate and the second compaction plate to enter the forming kettle. At the same time, under the action of the intermittent scraping assembly, level the tantalum powder through the scraping plate. The intermittent scraping assembly will also drive the interleaved compaction mechanism to move, so as to control the first compaction plate and the second compaction plate to perform an interleaved movement in the vertical direction, thereby performing a multi-directional interleaved compaction action on the tantalum block to ensure the best density and uniformity of the tantalum block.

[0027] The tantalum powder is subjected to staggered compaction by the first compaction plate and the second compaction plate, which can not only perform multi-directional compaction on multiple tantalum powders to ensure higher density of the compacted tantalum block, but also perform compaction treatment on the first compaction plate and the second compaction plate before and after the scraping plate levels the powder, making the compaction of the tantalum block more uniform. Moreover, since there is a certain height difference on the side of the ejector plate that bears the tantalum powder, when the first compaction plate or the second compaction plate compacts the tantalum powder at a higher position at the bottom of the mold cavity, the excess tantalum powder is squeezed and displaced to the gap generated between the first compaction plate and the second compaction plate, and is leveled by the scraping plate and then compacted again. Thus, when the bottom of the tantalum block is of special shape, the density and uniformity inside the tantalum block can still be kept consistent, ensuring that no voids and holes are generated during subsequent sintering. And after the scraping plate, the first compaction plate and the second compaction plate are combined, the molding pressure direction can be unified, thereby further compacting the tantalum block to ensure the best density and uniformity of the tantalum block.

[0028] By driving the scraping plate to rotate, the tantalum powder can be leveled to ensure that during the compaction process of the tantalum block, the problem of poor density of the tantalum block caused by uneven filling of the tantalum powder in the forming kettle can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic structural diagram of an embodiment of a forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density.

[0030] Figure 2 Schematic structural diagram of another angle in an embodiment of a forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density.

[0031] Figure 3 Schematic connection diagram of a partial intermittent scraping assembly, a partial staggered compaction mechanism, and a partial ejector assembly in an embodiment of a forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density.

[0032] Figure 4 Schematic structural diagram of a partial intermittent scraping assembly and a partial staggered compaction mechanism in an embodiment of a forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density.

[0033] Figure 5 For Figure 4 the enlarged structural diagram at A in

[0034] Figure 6 Schematic structural diagram of an ejector assembly, a forming kettle, and a receiving plate in an embodiment of a forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density.

[0035] Figure 7 Schematic cross-sectional structural diagram of a support tube in an embodiment of a forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density.

[0036] Figure 8 Schematic structural diagram of the staggered compaction mechanism in an embodiment of the forming and sintering device for the anode tantalum block of a chip tantalum capacitor to improve the density.

[0037] Figure 9 Schematic connection diagram of a partial staggered compaction mechanism and a partial intermittent scraping assembly in an embodiment of the forming and sintering device for the anode tantalum block of a chip tantalum capacitor to improve the density.

[0038] Figure 10 Schematic exploded view of a partial staggered compaction mechanism and a partial intermittent scraping assembly in an embodiment of the forming and sintering device for the anode tantalum block of a chip tantalum capacitor to improve the density.

[0039] Figure 11 Schematic exploded view of a partial staggered compaction mechanism in an embodiment of the forming and sintering device for the anode tantalum block of a chip tantalum capacitor to improve the density.

[0040] In the figure: 1, workbench; 2, sintering box; 3, receiving plate; 4, forming kettle; 5, cylinder; 6, ejecting plate; 7, guide rail; 8, first motor; 9, lead screw; 10, threaded sleeve; 11, sliding plate; 12, support tube; 1201, first annular groove; 1202, first inclined groove; 1203, first vertical groove; 1204, second annular groove; 1205, second inclined groove; 1206, second vertical groove; 13, second motor; 14, transmission rod; 15, scraping plate; 16, first rotating sleeve; 17, first compaction plate; 18, first movable ring; 19, first limit block; 20, first spring; 21, fixing plate; 22, second rotating sleeve; 2201, through groove; 23, second compaction plate; 24, second movable ring; 25, second limit block; 26, second spring. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0042] In addition, an element in the present invention is referred to as being "fixed to" or "disposed on" another element, which can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation manners.

[0043] Please refer to Figures 1 to 10 , in the embodiment of the present invention, a forming and sintering device for the anode tantalum block of a chip tantalum capacitor with improved density includes:

[0044] A workbench 1, and a sintering box 2 and a receiving plate 3 fixed on the workbench 1. An elevating assembly is arranged on the workbench 1, and a support tube 12 is connected to the elevating assembly;

[0045] It further includes:

[0046] A forming kettle 4 fixed on the receiving plate 3, and an ejecting assembly connected to the forming kettle 4 is installed on the workbench 1;

[0047] An intermittent scraping and leveling assembly is arranged on the support tube 12, and the intermittent scraping and leveling assembly includes a scraping plate 15 that cooperates with the forming kettle 4;

[0048] An interleaved compaction mechanism is arranged on the support tube 12 and is connected to the intermittent scraping and leveling assembly. The interleaved compaction mechanism includes a plurality of first compaction plates 17 and second compaction plates 23 that are circumferentially and equidistantly distributed. The interleaved compaction mechanism can drive the first compaction plates 17 and the second compaction plates 23 to perform an interleaved reciprocating motion in the vertical direction when the intermittent scraping and leveling assembly moves.

[0049] Specifically, when forming tantalum powder, the tantalum powder can be added into the forming kettle 4, and tantalum wires can be inserted between the tantalum powder. At this time, under the action of the elevating assembly, the support tube 12 is controlled to move towards the forming kettle 4, so that the scraping plate 15, the first compaction plates 17 and the second compaction plates 23 enter the forming kettle 4. Under the action of the intermittent scraping and leveling assembly, the scraping plate 15 is controlled to rotate intermittently to level the tantalum powder. The intermittent scraping and leveling assembly will also drive the interleaved compaction mechanism to move, so as to control the first compaction plates 17 and the second compaction plates 23 to perform an alternating reciprocating motion in the vertical direction, thereby performing a multi-directional compaction action on the tantalum powder. When the tantalum powder is evenly compacted, under the action of the interleaved compaction mechanism, the first compaction plates 17, the second compaction plates 23 and the scraping plate 15 are combined to form an integral body. Under the action of the elevating assembly, the combined integral body is controlled to move downward to perform a comprehensive compaction action on the tantalum powder. By leveling the tantalum powder and providing a multi-directional interleaved compaction force, the density and uniformity of the tantalum powder during the compaction and forming process can be ensured, thereby avoiding the generation of pores inside the tantalum block during the subsequent sintering process, which affects the density and electrical performance of the product. When the compaction and forming are completed, the elevating assembly controls the scraping plate 15, the first compaction plates 17 and the second compaction plates 23 to disengage from the forming kettle 4. Under the action of the ejecting assembly, the tantalum block in the forming kettle 4 is ejected. At this time, the tantalum block can be transferred to the sintering box 2 for sintering treatment.

[0050] Please refer to Figures 1 - 3 , Figure 6, the ejecting assembly includes a cylinder 5 fixedly installed on the workbench 1, an ejecting plate 6 is fixed on the telescopic end of the cylinder 5, and the ejecting plate 6 is slidably connected to the forming kettle 4.

[0051] Among them, the ejecting plate 6 is used to carry tantalum powder, and the surface of the ejecting plate 6 for carrying tantalum powder is of a special shape with a certain height difference on its surface. The ejecting plate 6 is slidably and sealingly connected to the forming kettle 4. In the initial state, under the action of the cylinder 5, the ejecting plate 6 is located at the end of the stroke towards the receiving plate 3. When it is necessary to form tantalum powder, the tantalum powder can be added into the forming kettle 4, and the tantalum powder will fall on the ejecting plate 6. After the tantalum powder is added, a tantalum wire can be inserted between the tantalum powder. At this time, the tantalum powder can be compacted. After the compaction is completed, under the action of the cylinder 5, the ejecting plate 6 is driven to move in a direction away from the receiving plate 3 to eject the compacted tantalum block out of the forming kettle 4 and transfer the tantalum block to the sintering box 2 for sintering treatment.

[0052] Please refer to Figure 1 , Figure 2 , the lifting assembly includes a guide rail 7 formed on the workbench 1, a first motor 8 is fixedly installed on the workbench 1, a lead screw 9 connected to the output shaft of the first motor 8 is rotatably installed on the workbench 1, a threaded sleeve 10 is threadedly connected to the lead screw 9, and a sliding plate 11 slidably connected to the guide rail 7 is fixed on the threaded sleeve 10. The sliding plate 11 is fixedly connected to the support tube 12.

[0053] Specifically, when compacting tantalum powder, it is necessary to adjust the height of the support tube 12 to ensure that the scraping plate 15 enters the forming kettle 4. In the initial state, under the action of the threaded sleeve 10, the sliding plate 11 and the support tube 12 are located at the end of the stroke away from the workbench 1. When it is necessary to perform compaction and forming treatment on tantalum powder, at this time, the first motor 8 works to drive the lead screw 9 to rotate, thereby driving the threaded sleeve 10 to move. The threaded sleeve 10 will control the sliding plate 11 to move along the length direction of the guide rail 7. The sliding plate 11 and the guide rail 7 have a guiding effect, which can ensure that the threaded sleeve 10 moves along the length direction of the lead screw 9 and will not rotate with the lead screw 9. The sliding plate 11 will also drive the support tube 12 to move to control the intermittent scraping assembly and the staggered compaction mechanism to move, so as to perform a compaction action on the tantalum powder through the scraping plate 15, the first compaction plate 17 and the second compaction plate 23.

[0054] Preferably, during the compaction and forming process of the tantalum block, if the pressurization rate is too fast, it will lead to low uniformity and density of the tantalum block. The lead screw 9 drive has the effects of high transmission accuracy and slow transmission rate. Therefore, it can ensure that the pressurization rate of the tantalum block is in a slower state to ensure the uniformity and density of the tantalum block during forming.

[0055] Please refer to Figures 1 - 5, Figure 7 , Figure 10 , the intermittent scraping and leveling assembly includes a second motor 13 fixedly installed at the end of the support pipe 12. A transmission rod 14 is rotatably installed in the support pipe 12 and is connected to the output shaft of the second motor 13. The transmission rod 14 is fixedly connected to the scraping plate 15.

[0056] Specifically, a hole for cooperating with the tantalum wire is provided at the end of the transmission rod 14. When the transmission rod 14 is inserted into the forming kettle 4, the tantalum wire can smoothly enter the hole to prevent the problem of tantalum wire deformation caused by interference between the transmission rod 14 and the tantalum wire. When adding tantalum powder, the tantalum powder in the forming kettle 4 is not in a flat state. When it is necessary to compact the tantalum powder, at this time, under the action of the lifting assembly, the support pipe 12 is controlled to move towards the forming kettle 4, so that the scraping plate 15 and the transmission rod 14 enter the forming kettle 4. When the scraping plate 15 contacts the tantalum powder, the lifting assembly stops moving. At this time, the second motor 13 works and drives the scraping plate 15 to rotate through the transmission rod 14. Under the action of the scraping plate 15, the tantalum powder is scraped and leveled to ensure that during the compaction process of the tantalum block, the problem of poor density of the tantalum block caused by uneven filling of the tantalum powder in the forming kettle 4 is avoided.

[0057] Please refer to Figures 1 - 5 , Figures 7 - 11 , the staggered compaction mechanism includes a first guide groove and a second guide groove opened on the inner wall of the support pipe 12. The first guide groove includes a first annular groove 1201, a first inclined groove 1202, and a first vertical groove 1203 opened on the inner wall of the support pipe 12. A plurality of the first inclined grooves 1202 and the first vertical grooves 1203 are circumferentially and equidistantly distributed. Both ends of the first annular groove 1201 are respectively connected to the end of one of the first inclined grooves 1202 and the end of one of the first vertical grooves 1203. The second guide groove includes a second annular groove 1204, a second inclined groove 1205, and a second vertical groove 1206 opened on the inner wall of the support pipe 12. A plurality of the second inclined grooves 1205 and the second vertical grooves 1206 are circumferentially and equidistantly distributed. Both ends of the second annular groove 1204 are respectively connected to the end of one of the second inclined grooves 1205 and the end of one of the second vertical grooves 1206;

[0058] Please refer to Figure 5 , Figure 7, It should be noted that the first guiding groove and the second guiding groove are at different heights within the support tube 12, have the same composition, and are arranged staggeredly. The first inclined groove 1202 and the first vertical groove 1203 are each provided with four sections. Three of the first inclined groove 1202 and the first vertical groove 1203 are connected end to end in sequence, and the fourth section is connected to the end of the first annular groove 1201. The second annular groove 1204, the second inclined groove 1205, and the second vertical groove 1206 have the same arrangement and dimensions as the above-mentioned first annular groove 1201, first inclined groove 1202, and first vertical groove 1203. The difference is that when the first guiding groove and the second guiding groove start from the first annular groove 1201 and the second annular groove 1204 respectively, when the first limiting block 19 is located at the connection position between the first annular groove 1201 and the first inclined groove 1202, the second limiting block 25 is located at the middle position of the second annular groove 1204.

[0059] Please refer to Figures 1 - 5 , Figures 7 - 11 , a first rotating sleeve 16 is slidably mounted on the transmission rod 14. The first rotating sleeve 16 is fixedly connected to the first compaction plate 17. A first movable ring 18 is fixed to the end of the first rotating sleeve 16. A first limiting block 19 that is slidably engaged with the first guiding groove is fixed to the first movable ring 18. The staggered compaction mechanism further includes a second rotating sleeve 22 slidably mounted on the first rotating sleeve 16. A through groove 2201 that slidably cooperates with the first compaction plate 17 is formed on the circumferential outer wall of the second rotating sleeve 22. The second rotating sleeve 22 is fixedly connected to the second compaction plate 23. A second movable ring 24 is fixed to the end of the second rotating sleeve 22. A second limiting block 25 that is slidably engaged with the second guiding groove is fixed to the second movable ring 24. An elastic component is arranged within the support tube 12. The elastic component includes a fixing plate 21 fixed within the support tube 12. A first spring 20 that abuts against the first movable ring 18 is sleeved on the transmission rod 14. A second spring 26 is sleeved on the second rotating sleeve 22. Two ends of the second spring 26 respectively abut against the second movable ring 24 and the fixing plate 21.

[0060] Please refer to Figure 7 , further, in the initial state, the first limiting block 19 is located at the connection position between the first annular groove 1201 and the first inclined groove 1202, the second limiting block 25 is located at the middle position of the second annular groove 1204, and both the first spring 20 and the second spring 26 are in a compressed state, such that both the first movable ring 18 and the second movable ring 24 have a tendency to move towards the workbench 1. At this time, the scraping plate 15, the first compaction plate 17, and the second compaction plate 23 are on the same horizontal plane and are combined to form a disc-shaped cylinder. Under the action of the lifting component, the disc-shaped cylinder is controlled to enter the forming kettle 4 and contact the tantalum powder;

[0061] Subsequently, the second motor 13 operates and drives the transmission rod 14 to rotate, thereby driving the scraping plate 15 to rotate. The transmission rod 14 also drives the first rotating sleeve 16 and the second rotating sleeve 22 to rotate synchronously to control the synchronous movement of the first movable ring 18 and the second movable ring 24. Under the action of the first movable ring 18, the first limiting block 19 is driven to disengage from the first annular groove 1201 and enter the first inclined groove 1202, causing the first movable ring 18 to move and compress the first spring 20, so as to drive the first compaction plate 17 to move away from the scraping plate 15 through the first rotating sleeve 16. At this time, when the second movable ring 24 moves, it drives the second limiting block 25 to slide in the second annular groove 1204, keeping the position of the second compaction plate 23 unchanged and rotating with the scraping plate 15. Under the action of the scraping plate 15 and the second compaction plate 23, the tantalum powder is leveled;

[0062] When the first limiting block 19 moves to the middle position of the first inclined groove 1202, the second limiting block 25 just moves to the connection position of the second annular groove 1204 and the second inclined groove 1205. At this time, the transmission rod 14 continues to rotate, causing the first limiting block 19 to continue sliding along the first inclined groove 1202. The second limiting block 25 will disengage from the second annular groove 1204 and enter the second inclined groove 1205, thereby controlling the movement of the second movable ring 24, so as to control the second compaction plate 23 to move away from the scraping plate 15 through the second rotating sleeve 22. The second spring 26 is also compressed, and a height difference will be formed between the first compaction plate 17 and the second compaction plate 23. When the first limiting block 19 moves to the connection position of the first inclined groove 1202 and the first vertical groove 1203, the second limiting block 25 moves to the middle position of the second inclined groove 1205. At this time, the second motor 13 stops working briefly, causing the transmission rod 14 to stop rotating. At the same time, the first spring 20 elastically releases and controls the first limiting block 19 to slide along the length direction of the first vertical groove 1203 through the first movable ring 18. The first movable ring 18 also controls the first compaction plate 17 to quickly move towards the tantalum powder through the first rotating sleeve 16, so as to compact the tantalum powder through the first compaction plate 17;

[0063] When the first limiting block 19 moves to the connection position of the first vertical groove 1203 and the first inclined groove 1202, the second motor 13 works again, so that the first limiting block 19 moves into the next first inclined groove 1202. And when the first limiting block 19 moves to the middle position of the next first inclined groove 1202, the second limiting block 25 moves to the connection position of the second inclined groove 1205 and the second vertical groove 1206. The second motor 13 stops working again, and the second spring 26 elastically releases, so that the second limiting block 25 slides along the second vertical groove 1206. At the same time, the second compaction plate 23 will quickly move towards the tantalum powder direction to perform compaction treatment on the tantalum powder again. Repeat the above steps until multi-directional staggered compaction is completed. Among them, during the multi-directional staggered compaction process, the lifting assembly can also control the support tube 12 to slowly descend to gradually increase the compaction force on the tantalum block. When the transmission rod 14 rotates one circle, the first limiting block 19 returns to the connection position of the first annular groove 1201 and the first inclined groove 1202, and the second limiting block 25 returns to the middle position of the second annular groove 1204, so that the scraping plate 15, the first compaction plate 17, and the second compaction plate 23 are combined again to form a disc-shaped cylinder, making the molding direction unified. At this time, the lifting assembly continues to move to perform a compaction action on the whole tantalum block through the disc-shaped cylinder until the tantalum block is compacted and formed;

[0064] Preferably, the tantalum powder is subjected to staggered compaction treatment by the first compaction plate 17 and the second compaction plate 23, which can not only realize the multi-directional compaction operation of the multi-tantalum powder to ensure higher density of the tantalum block compaction, but also realize the compaction treatment by the first compaction plate 17 and the second compaction plate 23 before and after the scraping plate 15 scrapes flat, making the compaction of the tantalum block more uniform to ensure that no voids and holes will be generated during subsequent sintering. Since there is a certain height difference on the surface of the ejector plate 6, the amount of tantalum powder required at the concave position of the ejector plate 6 is more, and the amount of tantalum powder required at the convex position is less. When the first compaction plate 17 or the second compaction plate 23 acts on the relatively convex position of the ejector plate 6, due to the misaligned state of the first compaction plate 17 and the second compaction plate 23, the excess tantalum powder will give way to the gap generated by the misalignment during downward pressing and will be filled into the concave position of the ejector plate after the scraping plate 15 scrapes flat, ensuring that when the bottom of the tantalum block is irregular, the density and uniformity inside the tantalum block remain consistent. After the scraping plate 15, the first compaction plate 17, and the second compaction plate 23 are combined with each other, the molding direction can be unified, and then the tantalum block can be further compacted to ensure the best density and uniformity of the tantalum block.

[0065] A method for forming and sintering an anode tantalum block of a chip tantalum capacitor with improved density includes the following steps:

[0066] Step 1: Add tantalum powder into the forming kettle 4 and insert tantalum wires between the tantalum powder;

[0067] Step 2: Under the action of the lifting assembly, control the support tube 12 to move towards the forming kettle 4, so that the scraping plate 15, the first compaction plate 17 and the second compaction plate 23 enter the forming kettle 4;

[0068] Step 3: Under the action of the intermittent scraping assembly, level the tantalum powder through the scraping plate 15. At the same time, the intermittent scraping assembly controls the first compaction plate 17 and the second compaction plate 23 to perform an interleaved movement in the vertical direction through the interleaved compaction mechanism, so as to perform a multi-directional compaction action on the tantalum powder;

[0069] Step 4: When the compaction and forming are completed, the lifting assembly controls the scraping plate 15 to disengage from the support tube 12. Under the action of the ejection assembly, control the tantalum block to disengage from the support tube 12, and transfer the tantalum block to the sintering box 2 for sintering treatment.

[0070] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0071] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A forming and sintering device for an anode tantalum block of a chip tantalum capacitor for improving density, comprising: A workbench, a sintering box and a receiving plate fixed on the workbench, a lifting assembly is arranged on the workbench, and a support tube is connected to the lifting assembly; It is characterized in that it further comprises: A forming kettle fixed on the receiving plate, and an ejecting assembly connected to the forming kettle is installed on the workbench; An intermittent scraping assembly arranged on the support tube, and the intermittent scraping assembly comprises a scraping plate cooperating with the forming kettle; An interleaved compaction mechanism arranged on the support tube and connected to the intermittent scraping assembly, the interleaved compaction mechanism comprises a plurality of first compaction plates and second compaction plates arranged at equal circumferential intervals, and the interleaved compaction mechanism can drive the first compaction plates and the second compaction plates to perform interleaved reciprocating motions in the vertical direction when the intermittent scraping assembly moves.

2. The forming and sintering device for the anode tantalum block of the chip tantalum capacitor with improved density according to claim 1, characterized in that, The intermittent scraping assembly comprises a second motor fixedly installed at the end of the support tube, a transmission rod rotatably installed in the support tube and connected to the output shaft of the second motor, and the transmission rod is fixedly connected to the scraping plate.

3. The forming and sintering device for the anode tantalum block of the chip tantalum capacitor with improved density according to claim 2, characterized in that, The interleaved compaction mechanism comprises a first guiding groove and a second guiding groove opened on the inner wall of the support tube, a first rotating sleeve is slidably installed on the transmission rod, the first rotating sleeve is fixedly connected to the first compaction plate, a first movable ring is fixed at the end of the first rotating sleeve, and a first limiting block slidably fitted with the first guiding groove is fixed on the first movable ring.

4. The forming and sintering device for the anode tantalum block of the chip tantalum capacitor with improved density according to claim 3, characterized in that, The interleaved compaction mechanism further comprises a second rotating sleeve slidably installed on the first rotating sleeve, a through groove slidably matched with the first compaction plate is opened on the circumferential outer wall of the second rotating sleeve, the second rotating sleeve is fixedly connected to the second compaction plate, a second movable ring is fixed at the end of the second rotating sleeve, and a second limiting block slidably fitted with the second guiding groove is fixed on the second movable ring, and an elastic assembly is arranged in the support tube.

5. The sheet tantalum capacitor anode tantalum block forming and sintering device for improving density according to claim 4, characterized in that, The elastic assembly comprises a fixing plate fixed in the support tube, a first spring sleeved on the transmission rod and abutted against the first movable ring, a second spring is sleeved on the second rotating sleeve, and two ends of the second spring are respectively abutted against the second movable ring and the fixing plate.

6. The sintering device for forming a tantalum anode block of a chip tantalum capacitor with improved density according to claim 3, characterized in that, The first guiding groove comprises a first annular groove, a first inclined groove and a first vertical groove opened on the inner wall of the support tube, a plurality of the first inclined grooves and the first vertical grooves are arranged at equal circumferential intervals, and two ends of the first annular groove are respectively communicated with the ends of one of the first inclined grooves and one of the first vertical grooves.

7. The sheet tantalum capacitor anode tantalum block forming and sintering device for improving density according to claim 3, characterized in that The second guiding groove comprises a second annular groove, a second inclined groove and a second vertical groove opened on the inner wall of the support tube, a plurality of the second inclined grooves and the second vertical grooves are arranged at equal circumferential intervals, and two ends of the second annular groove are respectively communicated with the ends of one of the second inclined grooves and one of the second vertical grooves.

8. The sintering device for forming anode tantalum blocks of chip tantalum capacitors with improved density according to claim 1, characterized in that, The lifting assembly comprises a guide rail formed on the workbench, a first motor fixed on the workbench, a lead screw rotatably installed on the workbench and connected to the output shaft of the first motor, a threaded sleeve threadedly connected to the lead screw, a sliding plate fixed on the threaded sleeve and slidably connected to the guide rail, and the sliding plate is fixedly connected to the support tube.

9. The forming and sintering device for the anode tantalum block of the chip tantalum capacitor with improved density according to claim 1, characterized in that, The ejecting assembly comprises a cylinder fixed on the workbench, an ejecting plate fixed on the telescopic end of the cylinder, and the ejecting plate is slidably connected to the forming kettle.

10. A method for forming and sintering an anode tantalum block of a chip tantalum capacitor to improve the density, using the device for forming and sintering an anode tantalum block of a chip tantalum capacitor to improve the density according to any one of claims 1-9, characterized in that, Including the following steps: Step 1: Add tantalum powder into the forming kettle, and insert tantalum wires between the tantalum powder; Step 2: Under the action of the lifting assembly, control the support tube to move towards the forming kettle, so that the scraping plate, the first compaction plate and the second compaction plate enter the forming kettle; Step 3: Under the action of the intermittent scraping assembly, use the scraping plate to level the tantalum powder. At the same time, the intermittent scraping assembly controls the first compaction plate and the second compaction plate to move in a staggered manner in the vertical direction through the staggered compaction mechanism to perform multi-directional compaction on the tantalum powder; Step 4: After the compaction and forming are completed, the lifting assembly controls the scraping plate to disengage from the support tube. Under the action of the ejection assembly, control the tantalum block to disengage from the support tube and transfer the tantalum block to the sintering box for sintering treatment.

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