Glass and preparation method thereof

Abstract

The invention discloses glass and a preparation method thereof, and belongs to the technical field of materials. The glass is composed of the following components by mole percent: 55%-65% of SiO2; al2O3: 10% to 23%; r2O: 0% to 4%; mgO: 5% to 15%; caO: 1% to 5%; tiO2: 2% to 8%; y2O3: 0% to 10%; zrO2: 0% to 5%; the R2O is one or more of Li2O, Na2O and K2O, the Sb2O3 is one or more of Li2O, Na2O and K2O, and the R2O is one or more of Li2O, Na2O and K2O. The preparation difficulty of the glass can be reduced, so that the thermal expansion coefficient of the glass is better matched with the thermal expansion coefficient of a silicon wafer, and meanwhile, the glass is relatively high in Young modulus, relatively high in glass transition temperature and relatively low in high-temperature viscosity.

Description

Technical Field

[0001] The present disclosure relates to the field of material technologies, and particularly to a glass and a preparation method thereof. Background Art

[0002] Semiconductor manufacturing technology involves creating complex electronic circuits on silicon wafers, which are the basis for manufacturing integrated circuits (ICs) and other electronic components. With the continuous development of the semiconductor manufacturing field, there is an increasing demand for ultra-thin wafers, which are used to produce uniform and high-density packages in compact electronic devices. To reduce the impact of the decrease in the physical strength of ultra-thin wafers on the production yield of semiconductor manufacturing, glass is generally used to provide support or protection for the wafers.

[0003] In related technologies, the components of the glass used to provide support or protection for wafers include: SiO2, Al2O3, B2O3, CaO, and alkali metal oxides, etc.

[0004] However, when the components of the glass contain both B2O3 and alkali metal oxides, it is easy to produce the boron anomaly effect, resulting in a sudden change in the properties of the glass. For example, the thermal expansion coefficient suddenly increases, resulting in an excessive thermal expansion coefficient of the glass. In addition, B2O3 is volatile under high-temperature melting conditions, which makes the preparation of the glass difficult. The volatilization of B2O3 during the melting process of the glass also affects the thermal expansion coefficient of the glass. If the difference in the thermal expansion coefficient between the glass and the wafer is too large, cracks may occur at the interface between the glass and the wafer during the semiconductor manufacturing process, affecting the product reliability. Summary of the Invention

[0005] The present disclosure provides a glass and a preparation method thereof, which can reduce the preparation difficulty of the glass, make the thermal expansion coefficient of the glass more matched with that of the silicon wafer, and at the same time ensure that the glass has a relatively high Young's modulus, a relatively high glass transition temperature, and a relatively low high-temperature viscosity. The technical solution at least includes the following aspects:

[0006] On the one hand, a glass is provided, which is composed of the following components in mole percentages: SiO2: 55% to 65%; Al2O3: 10% to 23%; R2O: 0% to 4%; MgO: 5% to 15%; CaO: 1% to 5%; TiO2: 2% to 8%; Y2O3: 0% to 10%; ZrO2: 0% to 5%; Sb2O3: 0.02% to 0.05%, wherein the R2O is one or more of Li2O, Na2O, and K2O.

[0007] Optionally, the components of the glass are expressed in mole percentages, wherein: (SiO2 + Al2O3) / Sb2O3 is 3400 to 3900.

[0008] Optionally, the components of the glass are expressed in mole percentages, where: SiO2 + Al2O3 is 70% to 85%.

[0009] Optionally, the components of the glass are expressed in mole percentages, where: MgO + CaO is 7% to 19%.

[0010] Optionally, the components of the glass are expressed in mole percentages, where: (SiO2 + Al2O3) / TiO2 is 12.5 to 44.

[0011] Optionally, the components of the glass are expressed in mole percentages, where: (SiO2 + Al2O3) / Y2O3 is 9.8 to 88.

[0012] Optionally, the components of the glass are expressed in mole percentages, where: TiO2 + Y2O3 is 5% to 15%.

[0013] Optionally, the components of the glass are expressed in mole percentages, where: SiO2 + Al2O3 + ZrO2 is 81% to 87%.

[0014] Optionally, the components of the glass are expressed in mole percentages, where: Al2O3 + R2O is 17% to 22%.

[0015] On the other hand, a method for preparing the glass is provided, including: mixing the raw materials evenly and then melting to obtain the glass, where the raw materials are composed of the following components in mole percentages: SiO2: 55% to 65%; Al2O3: 10% to 23%; R2O: 0% to 4%; MgO: 5% to 15%; CaO: 1% to 5%; TiO2: 2% to 8%; Y2O3: 0% to 10%; ZrO2: 0% to 5%; Sb2O3: 0.02% to 0.05%, where the R2O is one or more of Li2O, Na2O, and K2O.

[0016] The beneficial effects brought by the technical solutions provided by the embodiments of the present disclosure at least include:

[0017] In the embodiments of the present disclosure, the components of the glass contain alkali metal oxide R2O and do not contain B2O3, which can reduce the preparation difficulty of the glass, reduce the influence of the volatilization of B2O3 and the boron anomaly effect on the thermal expansion coefficient of the glass during the melting process of the glass, make the thermal expansion coefficient of the glass more matched with the thermal expansion coefficient of the silicon wafer, thereby reducing the probability of cracking at the interface between the glass and the silicon wafer during the semiconductor manufacturing process, and ensuring high reliability of the product.

[0018] Meanwhile, through reasonable design of the glass composition, it is possible to ensure that the glass has a relatively high Young's modulus and a large stiffness, so that the glass is not easily deformed and has a good supporting effect on the wafer; the glass transition temperature of the glass is relatively high, and when the glass and the wafer are hermetically sealed at a high temperature, the glass is not easily softened, thus ensuring a good sealing effect of the sealing; the high-temperature viscosity of the glass is relatively low, which is beneficial to improving the processing performance and forming efficiency of the glass. Detailed implementation manners

[0019] In the description of the embodiments of the present application, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations; the term " / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may include three situations: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship; the terms "preferred" and "optional" are not used to limit the scope of the present application, nor do they indicate that certain technical features are critical and essential for the embodiments of the present application, but should be understood as merely indicating specific aspects of the embodiments of the present application. In addition, when expressing components and contents, the terms "not containing", "not including", and "not introducing" mean that the relevant components or substances are not actively and intentionally added to the glass, but they may be passively and unexpectedly introduced into the glass as an indeterminate quantity (small amount or trace) of impurities.

[0020] Unless specifically pointed out in a specific situation, the numerical ranges recorded in the embodiments of the present application are intended to include the endpoints of the numerical range and all integers and fractions within the range. When describing a certain content, solubility or other parameter in the form of a preferred range or a preferred value, it should be understood that any range obtained by combining any preferred range with a preferred range, a preferred value with a preferred value, and a preferred range with a preferred value is disclosed, without considering whether such pairwise combinations are specifically explained in the embodiments.

[0021] Unless specifically pointed out in a specific situation, the component contents recorded in the embodiments of the present application are all expressed in mole percentages.

[0022] To make the objectives, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below.

[0023] An embodiment of the present disclosure provides a glass, which is composed of the following components in mole percentages: SiO2: 55% to 65%; Al2O3: 10% to 23%; R2O: 0% to 4%; MgO: 5% to 15%; CaO: 1% to 5%; TiO2: 2% to 8%; Y2O3: 0% to 10%; ZrO2: 0% to 5%; Sb2O3: 0.02% to 0.05%, where R2O is one or more of Li2O, Na2O, and K2O.

[0024] In the embodiment of the present disclosure, the glass composition contains alkali metal oxide R2O and does not contain B2O3, which can reduce the preparation difficulty of the glass, reduce the volatilization of B2O3 during the melting process of the glass and the influence of the boron anomaly effect on the thermal expansion coefficient of the glass, make the thermal expansion coefficient of the glass more matched with that of the silicon wafer, thereby reducing the probability of cracking at the interface between the glass and the silicon wafer during semiconductor manufacturing, and ensuring high product reliability.

[0025] At the same time, through reasonable design of the glass composition, it can be ensured that the glass has a relatively high Young's modulus and large stiffness, so that the glass is not easily deformed and has a good supporting effect on the wafer; the glass transition temperature of the glass is relatively high, and when the glass and the wafer are hermetically sealed at high temperature, the glass is not easily softened, thus ensuring good sealing effect of the sealing; the high-temperature viscosity of the glass is relatively low, which is beneficial to improving the processing performance and forming efficiency of the glass.

[0026] Moreover, the content of alkali metal oxide R2O is relatively low, and the glass is a low-alkali glass, which can reduce the probability of affecting the product performance and life due to the migration of alkali metal ions to the silicon wafer, reduce the influence of alkali metal ions on the reaction environment during semiconductor manufacturing, and ensure that the glass has strong resistance to acid and alkali corrosion.

[0027] SiO2 is a glass-forming oxide, which forms an irregular continuous network with the structural unit of silicon-oxygen tetrahedron and is the skeleton for forming glass. The dielectric constant of the glass is mainly determined by the electronic displacement polarizability of the ions in the network. The electronic displacement polarizability of Si 4+ is relatively low, which is beneficial to making the glass have a relatively low dielectric constant. If the content of SiO2 is less than 55%, the dielectric constant of the glass increases; if the content of SiO2 is higher than 65%, it may lead to too high melting temperature of the glass, difficult batch melting, and the glass is not easily formed. Therefore, the content of SiO2 in the embodiment of the present disclosure is 55% to 65%. Optionally, the content of SiO2 can be 58% to 65%, preferably 60% to 64%. Exemplarily, the content of SiO2 can be 60%, 61%, 62%, 63% or 64%, etc.

[0028] The introduction of Al2O3 can significantly reduce the crystallization property of the glass, improve the strength and hardness of the glass, and the presence of Al2O3 increases the forming range of the glass in the three-dimensional phase diagram, enhances the chemical stability of the glass, and can also improve the transparency of the glass, etc. If the content of Al2O3 is less than 10 mol%, unmelted impurities are likely to appear in the glass, resulting in a decrease in the transmittance of the glass, and it may also cause a weak establishment of the combination of alkali metal ions and aluminum-oxygen tetrahedra, a strong diffusion activation energy of alkali metal ions, a loose glass network, and an increase in the dielectric constant and dielectric loss of the glass; if the content of Al2O3 is higher than 23%, the melting temperature of the glass may be too high. Therefore, in the embodiments of the present disclosure, the content of Al2O3 is 10% to 23%. Optionally, the content of Al2O3 can be 12% to 22%, preferably 15% to 21%. Exemplarily, the content of Al2O3 can be 15%, 17%, 19%, 21%, etc.

[0029] Optionally, the sum of the contents of SiO2 and Al2O3, SiO2 + Al2O3, is 65% to 88%. SiO2 and Al2O3 belong to refractory oxides. If the melting temperature is too high, it will have a greater impact on the furnace body of the melting furnace. When the sum of the contents of SiO2 and Al2O3, SiO2 + Al2O3, is within this range, while ensuring good strength, hardness, chemical stability, and transparency of the glass, the melting temperature of the glass can be relatively low. The sum of the contents of SiO2 and Al2O3, SiO2 + Al2O3, can be preferably 70% to 85%, and more preferably 75% to 83%. Exemplarily, the sum of the contents of SiO2 and Al2O3, SiO2 + Al2O3, can be 75%, 77%, 79%, 81%, 83%, etc.

[0030] R2O represents alkali metal oxides. Since the content of Al2O3 in the glass is relatively high and the melting temperature of the glass is relatively high, alkali metal elements can be introduced to reduce the batch melting temperature of the glass and improve the forming property of the glass. If the content of R2O is too low, the difficulty of melting the batch increases; if the content of R2O is higher than 4%, it may cause a sharp increase in the dielectric constant and dielectric loss of the glass and a decrease in the insulation performance. Therefore, in the embodiments of the present disclosure, the content of R2O is 0% to 4%. Optionally, the content of R2O can be 1% to 3%. Exemplarily, the content of R2O can be 1%, 2%, 3%, etc.

[0031] In the embodiments of the present disclosure, R2O is one or more of Li2O, Na2O, and K2O. Optionally, the content of Li2O is 0.1% to 3.5%. For example, the content of Li2O can be 0.1%, 2%, or 3.5%, etc. Optionally, the content of Na2O is 0% to 1.9%. For example, the content of Na2O can be 0%, 1%, or 1.9%, etc. Optionally, the content of K2O is 0% to 3.2%. For example, the content of K2O can be 0%, 1.5%, or 3.2%, etc.

[0032] Optionally, the sum of the contents of Al2O3 and R2O, Al2O3 + R2O, is 17% to 22%. When the sum of the contents of Al2O3 and R2O, Al2O3 + R2O, is within this range, it can prevent the diffusion activation energy of alkali metal ions from being strong and the glass network from being loose, preventing the increase of the dielectric constant and dielectric loss of the glass, thereby ensuring better insulation performance of the glass. The sum of the contents of Al2O3 and R2O, Al2O3 + R2O, can be preferably 18% to 21%, and more preferably 19% to 20%. Exemplarily, the sum of the contents of Al2O3 and R2O, Al2O3 + R2O, can be 19%, 19.5%, or 20%, etc.

[0033] MgO and CaO belong to alkaline earth metal oxides. Adding an appropriate amount of alkaline earth metal oxides to the glass can increase the Young's modulus of the glass, reduce the high-temperature viscosity of the glass, balance the glass components at the same time, and improve the melting performance of the glass. However, too much alkaline earth metal oxide will reduce the anti-crystallization performance of the glass. If the anti-crystallization performance of the glass is poor, crystallization particles may be generated in the glass. The physical properties such as the hardness of the crystallization particles are quite different from those of the surrounding glass, and defects may be generated during the semiconductor manufacturing process due to the failure to meet the requirements of the surface roughness. Although the common point of the alkaline earth metal oxides MgO and CaO is that they can reduce the high-temperature viscosity and improve the melting performance of the glass, their abilities to reduce the high-temperature viscosity, the degrees of affecting the anti-crystallization performance of the glass, the degrees of affecting the glass density, and the degrees of enhancing the Young's modulus and its heat resistance are inconsistent and quite different.

[0034] MgO can effectively increase the Young's modulus of the glass and reduce the high-temperature viscosity of the glass. If the content of MgO is less than 5%, the effects of reducing the glass density and increasing the Young's modulus of the glass are not obvious; if the content of MgO is higher than 15%, the anti-crystallization performance of the glass will decrease significantly. Therefore, in the embodiments of the present disclosure, the content of MgO is 5% to 15%. Optionally, the content of MgO can be 5% to 14%, and preferably 5% to 12%. Exemplarily, the content of MgO can be 5%, 8%, or 12%, etc.

[0035] The effect of CaO in reducing the high-temperature viscosity is more obvious, and at the same time, it can also increase the Young's modulus of the glass. If the content of CaO is less than 1%, the Young's modulus of the glass may be relatively low, and the effect of reducing the high-temperature viscosity of the glass is not obvious. If the content of CaO is higher than 5%, the anti-crystallization ability of the glass may decrease sharply, and at the same time, the chemical stability of the glass, especially the water resistance, will decrease rapidly. Therefore, in the embodiments of the present disclosure, the content of CaO is 1% to 5%. Optionally, the content of CaO can be 1% to 4%, preferably 2% to 4%. Exemplarily, the content of CaO can be 2%, 3% or 4%, etc.

[0036] In the embodiments of the present disclosure, the glass composition does not contain BaO. BaO is toxic. If the glass composition contains BaO, protection is required during processing, and it will increase the preparation cost of the glass. Only adding the alkaline earth metal oxides MgO and CaO can increase the Young's modulus of the glass, reduce the high-temperature viscosity of the glass, while reducing the preparation cost of the glass and improving the environmental friendliness of the glass.

[0037] Optionally, the sum of the contents of MgO and CaO, MgO + CaO, is 6% to 20%. When the sum of the contents of MgO and CaO, MgO + CaO, is within this range, the heat resistance and anti-crystallization ability of the glass can be effectively improved. The sum of the contents of MgO and CaO, MgO + CaO, can be preferably 7% to 19%, and more preferably 9% to 16%. Exemplarily, the sum of the contents of MgO and CaO, MgO + CaO, can be 9%, 11%, 13%, 15% or 16%, etc.

[0038] TiO2 can reduce the high-temperature viscosity of the glass, and improve the thermal expansion coefficient and Young's modulus of the glass. If the content of TiO2 is less than 2%, the effects of reducing the high-temperature viscosity, increasing the thermal expansion coefficient and Young's modulus are not obvious. If the content of TiO2 is higher than 8%, the anti-crystallization ability of the glass will decrease rapidly. Therefore, in the embodiments of the present disclosure, the content of TiO2 is 2% to 8%. Optionally, the content of TiO2 can be 2% to 7%, preferably 2% to 6%. Exemplarily, the content of TiO2 can be 2%, 4% or 6%, etc.

[0039] Optionally, the ratio of the sum of the contents of SiO2 and Al2O3 to the content of TiO2, (SiO2 + Al2O3) / TiO2, is from 12.5 to 44. When the ratio of the sum of the contents of SiO2 and Al2O3 to the content of TiO2, (SiO2 + Al2O3) / TiO2, is within this range, it can ensure that the thermal expansion coefficient of the glass is more matched with that of the silicon wafer, and at the same time, it has a relatively high Young's modulus. The ratio of the sum of the contents of SiO2 and Al2O3 to the content of TiO2, (SiO2 + Al2O3) / TiO2, is preferably from 14 to 40, and more preferably from 16 to 38. Exemplarily, the ratio of the sum of the contents of SiO2 and Al2O3 to the content of TiO2, (SiO2 + Al2O3) / TiO2, can be 16, 30, 38, etc.

[0040] The content of Y2O3 being from 0% to 10% can significantly improve the thermal expansion coefficient, Young's modulus and heat resistance of the glass, and at the same time, it can reduce the high-temperature viscosity of the glass. Optionally, the content of Y2O3 can be from 0% to 9%, and is preferably from 1% to 9%. Exemplarily, the content of Y2O3 can be 1%, 3%, 5%, 7%, 9%, etc.

[0041] Optionally, the sum of the contents of TiO2 and Y2O3, TiO2 + Y2O3, is from 2% to 18%. When the sum of the contents of TiO2 and Y2O3, TiO2 + Y2O3, is within this range, the improvement effect on the thermal expansion coefficient and Young's modulus of the glass is relatively obvious. The sum of the contents of TiO2 and Y2O3, TiO2 + Y2O3, can be preferably from 5% to 15%, and more preferably from 8% to 12%. Exemplarily, the sum of the contents of TiO2 and Y2O3, TiO2 + Y2O3, can be 8%, 10%, 12%, etc.

[0042] Optionally, the ratio of the sum of the contents of SiO2 and Al2O3 to the content of Y2O3, (SiO2 + Al2O3) / Y2O3, is from 9.8 to 88. When the ratio of the sum of the contents of SiO2 and Al2O3 to the content of Y2O3, (SiO2 + Al2O3) / Y2O3, is within this range, it can ensure that the thermal expansion coefficient of the glass is more matched with that of the silicon wafer, and at the same time, it has a relatively high Young's modulus. The ratio of the sum of the contents of SiO2 and Al2O3 to the content of Y2O3, (SiO2 + Al2O3) / Y2O3, can be preferably from 11 to 85, and more preferably from 13 to 82. Exemplarily, the ratio of the sum of the contents of SiO2 and Al2O3 to the content of Y2O3, (SiO2 + Al2O3) / Y2O3, can be 13, 36, 59, 82, etc.

[0043] ZrO2 can improve the crystallization resistance of the glass while enhancing the chemical stability of the glass. If the content of ZrO2 is higher than 5%, the melting performance of the glass will decrease significantly, and at the same time, the high-temperature viscosity of the glass will increase, and unmelted substances are likely to appear in the glass. Therefore, in the embodiments of the present disclosure, the content of ZrO2 is 0% to 5%. Optionally, the content of ZrO2 can be 0% to 4%, preferably 1% to 3%. Exemplarily, the content of ZrO2 can be 1%, 2% or 3%, etc.

[0044] Optionally, the sum of the contents of SiO2, Al2O3 and ZrO2, SiO2 + Al2O3 + ZrO2, is 81% to 87%. When the sum of the contents of SiO2, Al2O3 and ZrO2, SiO2 + Al2O3 + ZrO2, is within this range, it can ensure that the glass has good chemical stability and excellent crystallization resistance. The sum of the contents of SiO2, Al2O3 and ZrO2, SiO2 + Al2O3 + ZrO2, can be preferably 82% to 86%, and further preferably 83% to 85%. Exemplarily, the sum of the contents of SiO2, Al2O3 and ZrO2, SiO2 + Al2O3 + ZrO2, can be 83%, 84% or 85%, etc.

[0045] When the content of Sb2O3 is 0.02% to 0.05%, it can effectively reduce the clarification temperature of the glass, improve the uniformity of the glass, and increase the transmittance of the glass.

[0046] Optionally, the ratio of the sum of the contents of SiO2 and Al2O3 to the content of Sb2O3, (SiO2 + Al2O3) / Sb2O3, is 3400 to 3900. Since SiO2 and Al2O3 are refractory oxides and also the key factors causing the accumulation of bubbles in the melting tank, when the ratio of the sum of the contents of SiO2 and Al2O3 to the content of Sb2O3, (SiO2 + Al2O3) / Sb2O3, is within this range, the effect on the clarification and homogenization of the glass is better, and the phenomenon of bubble accumulation during the melting process can be improved. The ratio of the sum of the contents of SiO2 and Al2O3 to the content of Sb2O3, (SiO2 + Al2O3) / Sb2O3, can be preferably 3500 to 3800, and further preferably 3600 to 3800. Exemplarily, the ratio of the sum of the contents of SiO2 and Al2O3 to the content of Sb2O3, (SiO2 + Al2O3) / Sb2O3, can be 3600, 3700 or 3800, etc.

[0047] The performance of the glass in the embodiments of the present disclosure will be described exemplarily below.

[0048] The thermal expansion coefficient α of the glass can be tested according to the method specified in "GB / T7962.16 - 2010". It should be noted that the thermal expansion coefficient of the glass in the embodiments of the present disclosure refers to the average thermal expansion coefficient of the glass from 30°C to 380°C.

[0049] Optionally, the coefficient of thermal expansion α of the glass is 35×10 -7 / K to 53×10 -7 / K. The coefficient of thermal expansion α of the glass within this range can ensure a better match between the coefficients of thermal expansion of the glass and the silicon wafer. The coefficient of thermal expansion α of the glass can preferably be 36×10 -7 / K to 45×10 -7 / K, and more preferably 37×10 -7 / K to 40×10 -7 / K. Exemplarily, the coefficient of thermal expansion of the glass can be 37×10 -7 / K, 38.8×10 -7 / K, or 40×10 -7 / K, etc.

[0050] The Young's modulus of the glass can be calculated according to the following formulas (1) and (2):

[0051] E = (4G 2 - 4GV T 2 ρ) / (G - V T 2 ρ) (1)

[0052] G = V S 2 ρ (2)

[0053] where E is the Young's modulus, Pa; G is the shear modulus, Pa; V T is the longitudinal wave velocity, m / s; V S is the transverse wave velocity, m / s; ρ is the density of the glass, g / cm 3 . The longitudinal wave velocity V T and the transverse wave velocity V S can be measured by the ultrasonic method. The density ρ of the glass can be measured according to the method specified in "GB / T7962.20 - 2010".

[0054] In the embodiments of the present disclosure, the following formula (3) can also be used to verify the calculation of the Young's modulus of the glass:

[0055] E = 9.8×{6.52n SiO2 + 11n Al2O3 + 17n MgO + 12.5n CaO + [19 - 0.2×(n MgO + n CaO ) + n Li2O +

[0056] n Na2O + nK2O × n TiO2 + 4.5n Na2O + 36n Y2O3 + 18.7n ZrO2 + 36n Sb2O3}(× 100)(3)

[0057] Among them, E is the Young's modulus, and n SiO2 is the content of SiO₂, and n Al2O3 is the content of Al₂O₃, and n MgO is the content of MgO, and n CaO is the content of CaO, and n Li2O is the content of Li₂O, and n Na2O is the content of Na₂O, and n K2O is the content of K₂O, and n TiO2 is the content of TiO₂, and n Y2O3 is the content of Y₂O₃, and n ZrO2 is the content of ZrO₂, and n Sb2O3 is the content of Sb₂O₃. The result calculated by using formula (3) can be compared and verified with the results calculated by using formula (1) and formula (2). At the same time, the result calculated by using formula (3) can also be used to measure the property of the glass undergoing elastic deformation.

[0058] Optionally, the Young's modulus E of the glass is 82 GPa to 106 GPa. When the Young's modulus E of the glass is within this range, it can ensure that the glass has a relatively large stiffness, so as to ensure that the glass is not easily deformed and has a good supporting effect on the wafer. The Young's modulus E of the glass can be preferably 90 GPa to 103 GPa, and further preferably 95 GPa to 103 GPa. Exemplarily, the Young's modulus E of the glass can be 95 GPa, 97 GPa, 99 GPa, 101 GPa or 103 GPa, etc.

[0059] The glass transition temperature T of the glass g can be tested according to the method specified in "GB / T7962.16 - 2010".

[0060] Optionally, the glass transition temperature T of the glass g is 743 °C to 832 °C. This can ensure that the glass transition temperature T of the glass g is relatively high. When the glass and the wafer are hermetically sealed at a high temperature, the glass is not easily softened, thus ensuring a good sealing effect. The glass transition temperature T of the glass g can be preferably 760 °C to 820 °C, and further preferably 780 °C to 810 °C. Exemplarily, the glass transition temperature T of the glass g can be 780 °C, 790 °C, 800 °C or 810 °C, etc.

[0061] The transmittance of the glass can be tested according to the method specified in "GB / T 7962.12 - 2010". Exemplarily, the glass can be made into a sample with a thickness of 2 mm ± 0.1 mm, and then the transmittance of the glass at a wavelength of 400 nm can be tested.

[0062] The devitrification performance of the glass can be classified and judged according to Table 1 below.

[0063] Table 1 Classification and judgment criteria for devitrification

[0064] Level Judgment criteria 1 No visible crystallization particles to the naked eye 2 Visible crystallization particles to the naked eye, few and scattered 3 Larger, scattered or denser and smaller visible crystallization particles to the naked eye 4 Larger and denser crystallization particles 5 The glass is completely crystallized and devitrified

[0065] The bubble condition of the glass can be classified and judged according to Table 2 below.

[0066] Table 2 Classification and judgment criteria for bubbles

[0067]

[0068]

[0069] The embodiments of the present disclosure also provide a method for preparing glass, and the preparation method includes: mixing the raw materials evenly and then melting to obtain glass. The raw materials are composed of the following components in molar percentages: SiO2: 55% to 65%; Al2O3: 10% to 23%; R2O: 0% to 4%; MgO: 5% to 15%; CaO: 1% to 5%; TiO2: 2% to 8%; Y2O3: 0% to 10%; ZrO2: 0% to 5%; Sb2O3: 0.02% to 0.05%, where R2O is one or more of Li2O, Na2O, and K2O.

[0070] Exemplarily, after mixing quartz sand, aluminum hydroxide, sodium carbonate, magnesium carbonate, calcium carbonate, TiO2, Y2O3, ZrO2, and Sb2O3 evenly to complete batching, the prepared furnace charge can be put into a melting furnace at 1300 °C to 1500 °C for melting. After clarification, stirring, and homogenization, a homogeneous molten glass without bubbles and without unmelted substances can be obtained. This molten glass is cast in a mold and annealed to obtain glass. It should be noted that those skilled in the art can adjust the types of raw materials and process parameters according to actual needs, and the present disclosure does not limit this.

[0071] The glass obtained in the embodiments of the present disclosure is virgin glass, that is, glass that has not been nucleated, crystallized, and strengthened, which is beneficial to simplifying the process steps.

[0072] The glass in the embodiments of the present disclosure can be used to fabricate the glass substrate of semiconductors. In other embodiments, the glass can also be used to fabricate the observation window of wafer processing equipment, the sight glass of a vacuum chamber, or the cavity cover plate for semiconductor device packaging, etc. The present disclosure places no restrictions thereon.

[0073] To illustrate the technical effects of the glass in the embodiments of the present disclosure, the present disclosure conducted tests on glasses with different components and contents to measure the corresponding properties of the glass, and the test results are shown in Tables 3 to 6.

[0074] Table 3

[0075]

[0076]

[0077]

[0078] Table 4

[0079]

[0080]

[0081] Table 5

[0082]

[0083]

[0084] Table 6

[0085]

[0086]

[0087] As can be seen from the embodiments in Tables 3 to 6 above, the thermal expansion coefficient of the glass provided in the embodiments of the present disclosure is more matched with that of the silicon wafer, and the glass has a relatively high Young's modulus and glass transition temperature.

[0088] The foregoing are only optional embodiments of the present disclosure and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

1. A glass, characterized in that, Composed of components in the following molar percentages: SiO2: 55% to 65%; Al2O3: 10% to 23%; R2O: 0% to 4%; MgO: 5% to 15%; CaO: 1% to 5%; TiO2: 2% to 8%; Y2O3: 0% to 10%; ZrO2: 0% to 5%; Sb2O3: 0.02% to 0.05%, wherein the R2O is one or more of Li2O, Na2O, and K2O.

2. The glass according to claim 1, wherein The components of the glass are expressed in molar percentages, wherein: (SiO2 + Al2O3) / Sb2O3 is 3400 to 3900.

3. The glass according to claim 1, characterized in that, The components of the glass are expressed in molar percentages, wherein: SiO2 + Al2O3 is 70% to 85%.

4. The glass according to claim 1, wherein The components of the glass are expressed in molar percentages, wherein: MgO + CaO is 7% to 19%.

5. The glass according to claim 1, wherein, The components of the glass are expressed in molar percentages, wherein: (SiO2 + Al2O3) / TiO2 is 12.5 to 44.

6. The glass according to claim 1, wherein The components of the glass are expressed in molar percentages, wherein: (SiO2 + Al2O3) / Y2O3 is 9.8 to 88.

7. The glass according to claim 1, wherein, The components of the glass are expressed in molar percentages, wherein: TiO2 + Y2O3 is 5% to 15%.

8. The glass according to claim 1, wherein The components of the glass are expressed in molar percentages, wherein: SiO2 + Al2O3 + ZrO2 is 81% to 87%.

9. The glass according to claim 1, characterized in that, The components of the glass are expressed in molar percentages, wherein: Al2O3 + R2O is 17% to 22%.

10. A method for preparing glass, characterized in that, Including: After uniformly mixing the raw materials and then melting them, the glass is obtained. The raw materials are composed of components in the following molar percentages: SiO2: 55% to 65%; Al2O3: 10% to 23%; R2O: 0% to 4%; MgO: 5% to 15%; CaO: 1% to 5%; TiO2: 2% to 8%; Y2O3: 0% to 10%; ZrO2: 0% to 5%; Sb2O3: 0.02% to 0.05%, wherein the R2O is one or more of Li2O, Na2O, and K2O.

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