Liquid crystal polymerization lightweight LCP (Liquid Crystal Polymer) material with low dielectric property and preparation method thereof

Abstract

The invention discloses a liquid crystal polymerization lightweight LCP (Liquid Crystal Polymer) material with low dielectric property and a preparation method thereof, and belongs to the technical field of high polymer materials. The material comprises the following components in parts by weight: 70-80 parts of LCP modified resin, 5-10 parts of low-dielectric modified filler, 1-2 parts of reinforced fibers, 1-3 parts of inorganic filler and 10-15 parts of a high-flow aid. Lightweight high-flexibility LCP modified resin is obtained through copolymerization compounding of LCP resin, then low-dielectric filler is modified, a coupling agent is added, the composite material is obtained, the dielectric constant is reduced, the dielectric loss is reduced, meanwhile, the heat conductivity of the material is improved, and the toughness of the material is further improved by adding reinforcing fibers, inorganic filler and a high-flow aid into a polymer modified matrix. The mechanical property is good; the water absorption of the material is reduced. On the basis of meeting material requirements of customers in the 5G field and the artificial intelligence field, a novel substitute material is researched and developed according to product characteristics and physical property requirements, and the novel substitute material is developed by adopting LCP resin independently researched and developed in China.

Description

Technical Field

[0001] The present invention relates to the technical field of polymer materials, and particularly relates to a liquid crystal polymer lightweight LCP material with low dielectric properties and a preparation method thereof. Background Art

[0002] Low dielectric LCP resin is a material with low loss, high-frequency response and good electrical properties, and is widely used in fields such as microwave communication, wireless network, and radio frequency module. With the development of 5G communication technology, the requirements for high-frequency and high-speed transmission and signal stability are increasing day by day. High-frequency low dielectric constant resin has attracted much attention due to its excellent performance. However, the current product price is too high, and the cost pressure on domestic customers in the artificial intelligence field is too great, resulting in a loss of competitiveness in the domestic market. The demand for materials in the domestic market is small and the colors are diverse, and foreign materials cannot cooperate to meet this demand, and after-sales service is not in place. The dielectric constant of the current materials is usually above 3.0Mhz, which cannot meet the excellent electrical conductivity and affects the transmission speed and effect of signals. The liquid crystal polymer lightweight LCP material with low dielectric properties has unique performance characteristics including lightweight, excellent dielectric properties, and good mechanical properties. Summary of the Invention

[0003] Object of the Invention: The object of the present invention is to provide a liquid crystal polymer lightweight LCP material with low dielectric properties and a preparation method thereof, so as to solve the problems that the demand for materials in the domestic market is small and the colors are diverse, foreign materials cannot cooperate to meet this demand, and the excellent electrical conductivity cannot be satisfied, which affects the transmission speed and effect of signals.

[0004] Technical Solution: A liquid crystal polymer lightweight LCP material with low dielectric properties includes 70 - 80 parts by weight of LCP modified resin, 5 - 10 parts of low dielectric modified filler, 1 - 2 parts of reinforcing fiber, 1 - 3 parts of inorganic filler, and 10 - 15 parts of high flow aid.

[0005] The preparation method of the LCP modified resin is as follows: LCP resin and maleic anhydride are added into a reaction flask, heated to 340°C, and initiator dicumyl peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization is carried out for 1 - 3h. After the reaction ends, epoxy resin is added and melted continuously. After adding hollow glass microspheres, it is formed by a twin-screw extruder to obtain the LCP modified resin.

[0006] The preparation method of the low-dielectric modified filler is as follows: Add low-dielectric material and 10%-30% sulfuric acid into the reaction flask for pretreatment by soaking for 2-4 hours, start stirring at 10 rpm, take out the low-dielectric material, wash it with purified water until the pH = 7, then disperse the low-dielectric material in toluene, add a coupling agent, start stirring, and react at 40 °C for 2-4 hours. After the reaction, filter, wash the filter cake with purified water, and dry to obtain a low-dielectric material with alkynyl groups introduced on the surface. Then continue to add azide-modified polyethylene glycol and a copper catalyst, stir at room temperature for 2 hours, filter, and wash and dry with purified water to obtain the low-dielectric modified filler.

[0007] The preferred low-dielectric material is: hexagonal boron nitride (h-BN) Preferably, the coupling agent is: propargyltrimethylsilane Preferably, the reinforcing fiber is: one or more of carbon fiber, glass fiber, and aramid fiber.

[0008] Preferably, the inorganic filler is: one or more of titanium dioxide, alumina, and silicon carbide.

[0009] Preferably, the high-flow aid is: one or more of butyl stearate, liquid paraffin, and dimethyl silicone oil.

[0010] A preparation method of a liquid crystal polymer lightweight LCP material with low dielectric properties includes the following steps: S1. Weigh the LCP modified resin, low-dielectric modified filler, reinforcing fiber, inorganic filler, and high-flow aid according to the above weight ratio, put them into a high-speed mixer for mixing to obtain a mixture of the above components.

[0011] S2. Add the component mixture obtained by high-speed mixing in step S1 to a twin-screw extruder, set the temperature at 320~360 °C, extrude into strips, and cut into pellets to obtain a liquid crystal polymer lightweight LCP material with low dielectric properties. Beneficial effects

[0012] (1) In the present invention, by modifying the LCP resin, the LCP resin, maleic anhydride, and the initiator dicumyl peroxide (DCP) are added, and under the protection of stirring and nitrogen, melt polymerization is carried out. Epoxy resin is added and melted continuously. After adding hollow glass beads, it is formed by a twin-screw extruder to obtain a lightweight and highly flexible LCP modified resin. (2) In the modified low-dielectric modified filler of the present invention, adding sulfuric acid to the low-dielectric material increases the number of active hydroxyl groups, and adding a coupling agent in ethanol introduces alkynyl groups, thereby obtaining a low-dielectric material with a reduced dielectric constant, a reduced dielectric loss, and an improved thermal conductivity of the material.

[0013] (3) By adding reinforcing fibers and inorganic fillers to the modified LCP resin and the modified low-dielectric filler, the corrosion resistance, oxidation resistance of the material can be enhanced, the water absorption rate can be reduced, and the hardness can be increased. Description of the Drawings

[0014] Figure 1 It is a graph showing the comparison results of the performance tests of the examples and the comparative examples. Specific Embodiments

[0015] To make the technical solution of the present invention clearer, the following further describes the present invention in detail with reference to the drawings and specific embodiments. Example

[0016] A low-dielectric performance liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) The preparation method of the LCP modified resin is as follows: 500 g of LCP resin and 50 g of maleic anhydride are added to a reaction flask, heated to 340 °C and melted, then 7.5 g of diisopropylbenzene peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization is carried out for 1 - 3 h. After the reaction ends, 25 g of epoxy resin is added and melted continuously. After adding 15 g of hollow glass microspheres, the LCP modified resin is formed by using a twin-screw extruder.

[0017] (2) Preparation method of the low-dielectric modified filler: 500 g of hexagonal boron nitride (h-BN) is pretreated and soaked in an aqueous sulfuric acid solution (50 g of sulfuric acid + 500 g of purified water), and stirring is started for 2 - 4 h at a stirring speed of 10 rpm. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction ends, filtration is carried out, and the filter cake is washed with purified water to obtain a low-dielectric material with an alkyne group introduced on the surface. Then, 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are added, and the reaction is stirred at room temperature for 2 hours, filtered, and rinsed with purified water and dried to obtain the low-dielectric modified filler.

[0018] (3) 350 g of the LCP modified resin in step (1), 25 g of the low-dielectric modified filler in step (2), 5 g of carbon fiber, 5 g of titanium dioxide, and 50 g of butyl stearate are added to a crusher for crushing, and then put into a high-speed mixer and mixed for 30 min to obtain a premix.

[0019] (4) The premix in step (3) is added to a twin-screw extruder, and the material is extruded into a strip at 340 °C. After cooling to 20 °C, the strip is cut into pellets by a pelletizer to obtain a low-dielectric performance liquid crystal polymer lightweight LCP material. Example

[0020] A low-dielectric performance liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) The preparation method of the LCP modified resin is as follows: 500 g of LCP resin and 50 g of maleic anhydride are added into a reaction flask. After heating to 340 °C and melting, 7.5 g of dicumyl peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization is carried out for 1 - 3 h. After the reaction ends, 25 g of epoxy resin is added and melted continuously. After adding 15 g of hollow glass microspheres, the LCP modified resin is obtained by molding with a twin-screw extruder.

[0021] (2) The preparation method of the low-dielectric modified filler: 500 hexagonal boron nitrides (h-BN) are pretreated and soaked in an aqueous sulfuric acid solution (50 g of sulfuric acid + 500 g of purified water), and stirring is started for 2 - 4 h at a stirring speed of 10 rpm. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction ends, filtration is carried out, the filter cake is washed with purified water, and a low-dielectric material with an alkyne group introduced on the surface is obtained. Then, 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are added, and stirring reaction is carried out at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0022] (3) 375 g of the LCP modified resin in step (1), 35 g of the low-dielectric modified filler in step (2), 7.5 g of glass fiber, 10 g of alumina, and 60 g of liquid paraffin are added to a pulverizer for pulverization, and then put into a high-speed mixer and mixed for 30 min to obtain a premix.

[0023] (4) The premix in step (3) is added to a twin-screw extruder, and a strip is extruded at 340 °C. After cooling to 20 °C, the strip is cut into pellets by a pelletizer to obtain a low-dielectric property liquid crystal polymer lightweight LCP material. Example

[0024] A low-dielectric property liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) The preparation method of the LCP modified resin is as follows: 500 g of LCP resin and 50 g of maleic anhydride are added into a reaction flask. After heating to 340 °C and melting, 7.5 g of dicumyl peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization is carried out for 1 - 3 h. After the reaction ends, 25 g of epoxy resin is added and melted continuously. After adding 15 g of hollow glass microspheres, the LCP modified resin is obtained by molding with a twin-screw extruder.

[0025] (2) Preparation method of low-dielectric modified filler: 500 hexagonal boron nitrides (h-BN) and sulfuric acid aqueous solution (50 g sulfuric acid + 500 g purified water) are used for pretreatment soaking and stirring is started for 2 - 4 h, the stirring speed is 10 rpm. The low-dielectric material is taken out, rinsed with purified water until the pH = 7. Then the low-dielectric material is dispersed in 1500 g of toluene, 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction is completed, filtration is carried out, the filter cake is washed with purified water, and a low-dielectric material with an alkyne group introduced on the surface is obtained. Then 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are added, and stirring reaction is carried out at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0026] (3) Add 400 g of the LCP modified resin in step (1), 50 g of the low-dielectric modified filler in step (2), 10 g of aramid fiber, 15 g of silicon carbide, and 75 g of dimethyl silicone oil into a crusher for crushing, and then put them into a high-speed mixer for mixing for 30 min to obtain a premix.

[0027] (4) Add the premix in step (3) into a twin-screw extruder, extrude a strip at 340 °C, wait until it cools to 20 °C, and cut the strip into pellets with a pelletizer to obtain a low-dielectric property liquid crystal polymer lightweight LCP material.

[0028] A low-dielectric property liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) The preparation method of the LCP modified resin is as follows: 500 g of LCP resin and 50 g of maleic anhydride are added into a reaction flask, heated to 340 °C for melting, then 7.5 g of diisopropylbenzene peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization reaction is carried out for 1 - 3 h. After the reaction is completed, 25 g of epoxy resin is added for continuous melting, and 15 g of hollow glass microspheres are added, and then molding is carried out with a twin-screw extruder to obtain the LCP modified resin; (2) Add 350 g of the LCP modified resin in step (1), 5 g of carbon fiber, 5 g of titanium dioxide, and 50 g of butyl stearate into a crusher for crushing, and then put them into a high-speed mixer for mixing for 30 min to obtain a premix; (3) Add the premix in step (3) into a twin-screw extruder, extrude a strip at 340 °C, wait until it cools to 20 °C, and cut the strip into pellets with a pelletizer to obtain a low-dielectric property liquid crystal polymer lightweight LCP material.

[0029] A low-dielectric property liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1)The preparation method of the LCP modified resin is as follows: 500 g of LCP resin and 50 g of maleic anhydride are added into a reaction flask. After heating to 340 °C and melting, 7.5 g of dicumyl peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization is carried out for 1 - 3 h. After the reaction ends, 25 g of epoxy resin is added and melted continuously. After adding 15 g of hollow glass microspheres, the LCP modified resin is obtained by molding with a twin-screw extruder. (2)The preparation method of the low-dielectric modified filler: 500 hexagonal boron nitride (h-BN) is pretreated and soaked in an aqueous sulfuric acid solution (50 g of sulfuric acid + 500 g of purified water), and stirring is started for 2 - 4 h at a stirring speed of 10 rpm. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction ends, filtration is carried out, the filter cake is washed with purified water, and a low-dielectric material with an alkyne group introduced on the surface is obtained. Then, 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are added, and the reaction is stirred at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0030] (3)375 g of the LCP modified resin in step (1), 35 g of the low-dielectric modified filler in step (2), 10 g of alumina, and 60 g of liquid paraffin are added to a pulverizer for pulverization, and then put into a high-speed mixer and mixed for 30 min to obtain a premix.

[0031] (4)The premix in step (3) is added to a twin-screw extruder, and a strip is extruded at 340 °C. After cooling to 20 °C, the strip is cut into pellets with a pelletizer to obtain a low-dielectric property liquid crystal polymer lightweight LCP material.

[0032] A low-dielectric property liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1)The preparation method of the LCP modified resin is as follows: 500 g of LCP resin and 50 g of maleic anhydride are added into a reaction flask. After heating to 340 °C and melting, 7.5 g of dicumyl peroxide (DCP) is added. Under stirring and nitrogen protection, melt polymerization is carried out for 1 - 3 h. After the reaction ends, 25 g of epoxy resin is added and melted continuously. After adding 15 g of hollow glass microspheres, the LCP modified resin is obtained by molding with a twin-screw extruder.

[0033] (2) Preparation method of low-dielectric modified filler: 500 hexagonal boron nitrides (h-BN) and sulfuric acid aqueous solution (50 g sulfuric acid + 500 g purified water) are subjected to pretreatment soaking and stirring is started. The stirring speed is 10 rpm, and the reaction is carried out for 2 - 4 h. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction is completed, filtration is carried out, the filter cake is washed with purified water, and a low-dielectric material with an alkyne group introduced on the surface is obtained. Then, 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are continuously added, and the reaction is stirred at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0034] (3) Add 400 g of the LCP modified resin in step (1), 50 g of the low-dielectric modified filler in step (2), 10 g of glass fiber, and 75 g of dimethyl silicone oil into a pulverizer for pulverization, and then put them into a high-speed mixer and mix for 30 min to obtain a premix. (4) Add the premix in step (3) into a twin-screw extruder, extrude a strip at 340 °C, wait until it cools to 20 °C, and cut the strip into pellets with a pelletizer to obtain a low-dielectric property liquid crystal polymer lightweight LCP material.

[0035] A low-dielectric property liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) Preparation method of low-dielectric modified filler: 500 hexagonal boron nitrides (h-BN) and sulfuric acid aqueous solution (50 g sulfuric acid + 500 g purified water) are subjected to pretreatment soaking and stirring is started. The stirring speed is 10 rpm, and the reaction is carried out for 2 - 4 h. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction is completed, filtration is carried out, the filter cake is washed with purified water, and a low-dielectric material with an alkyne group introduced on the surface is obtained. Then, 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are continuously added, and the reaction is stirred at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0036] (2) Add 25 g of the low-dielectric modified filler in step (1), 350 g of LCP resin, 5 g of carbon fiber, 5 g of titanium dioxide, and 50 g of butyl stearate into a pulverizer for pulverization, and then put them into a high-speed mixer and mix for 30 min to obtain a premix. (3) Add the premix in step (3) into a twin-screw extruder, extrude a strip at 340 °C, wait until it cools to 20 °C, and cut the strip into pellets with a pelletizer to obtain a low-dielectric property liquid crystal polymer lightweight LCP material.

[0037] A low-dielectric property liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) Preparation method of low-dielectric modified filler: 500 hexagonal boron nitrides (h-BN) and sulfuric acid aqueous solution (50 g sulfuric acid + 500 g purified water) are used for pretreatment soaking and stirring is started. The stirring speed is 10 rpm, and the reaction is carried out for 2 - 4 h. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction, filtration is carried out, the filter cake is washed with purified water, and the low-dielectric material with alkynyl groups introduced on the surface is obtained. Then 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are added, and the reaction is stirred at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0038] (3) Add 35 g of the low-dielectric modified filler, 375 g of LCP resin, 7.5 g of glass fiber, 10 g of alumina, and 60 g of liquid paraffin in step (1) into a crusher for crushing, and then put them into a high-speed mixer and mix for 30 min to obtain a premix. (4) Add the premix in step (3) into a twin-screw extruder, extrude a strip at 340 °C, wait until it cools to 20 °C, and use a granulator to cut the strip into pellets to obtain a low-dielectric performance liquid crystal polymer lightweight LCP material.

[0039] A low-dielectric performance liquid crystal polymer lightweight LCP material is obtained by the following preparation method: (1) Preparation method of low-dielectric modified filler: 500 hexagonal boron nitrides (h-BN) and sulfuric acid aqueous solution (50 g sulfuric acid + 500 g purified water) are used for pretreatment soaking and stirring is started. The stirring speed is 10 rpm, and the reaction is carried out for 2 - 4 h. The low-dielectric material is taken out, rinsed with purified water until the pH = 7, and then the low-dielectric material is dispersed in 1500 g of toluene. 25 g of propargyltrimethylsilane is added, and the reaction is carried out at 40 °C for 2 - 4 h. After the reaction, filtration is carried out, the filter cake is washed with purified water, and the low-dielectric material with alkynyl groups introduced on the surface is obtained. Then 500 g of azide-modified polyethylene glycol and 25 g of copper catalyst are added, and the reaction is stirred at room temperature for 2 hours, followed by filtration, rinsing with purified water and drying to obtain the low-dielectric modified filler.

[0040] (2) Add 50 g of the low-dielectric modified filler, 400 of LCP resin, 10 g of aramid fiber, 15 g of silicon carbide, and 75 g of dimethyl silicone oil in step (1) into a crusher for crushing, and then put them into a high-speed mixer and mix for 30 min to obtain a premix.

[0041] (3) Add the premix in step (2) into a twin-screw extruder, extrude a strip at 340 °C, wait until it cools to 20 °C, and use a granulator to cut the strip into pellets to obtain a low-dielectric performance liquid crystal polymer lightweight LCP material.

[0042] The low-dielectric LCP resin materials obtained from the above-mentioned examples and comparative examples were injection-molded into plastic parts of a certain shape.

[0043] Tensile properties: Tested according to ASTM-D638 standard, tensile rate 50 mm / min; Flexural properties: Tested according to ASTM-D790 standard, flexural rate 10 mm / min; Dielectric constant: Tested according to ASTM-D150 standard, test frequency 1 GHz; Specific gravity: Tested by the Archimedes principle method; Melt flow rate: Tested according to ATSM-1238 standard; Water absorption rate: Tested according to ASTM D570-98 standard, immersed in distilled water at 23 °C for 24 hours.

[0044] The performance test comparison results of the above-mentioned examples and comparative examples are as Figure 1 shown. The results show that the halogen-free flame-retardant reinforced LCP material with corrosion resistance provided by the present invention has excellent tensile strength, toughness, corrosion resistance and flame-retardant performance. It can be seen from Examples 1 to 3 and Comparative Examples 1 to 6 that: (1) LCP modified resin, reinforcing fiber, inorganic filler, and high-flow additive, through their synergistic interaction, improve the mechanical properties of LCP resin, reduce water absorption rate, increase toughness, and the impact resistance is greatly enhanced, especially making the LCP resin lightweight; (2) The addition of the low-dielectric modified filler component reduces the dielectric constant of the LCP resin, decreases the dielectric loss and the thermal conductivity of the material, reduces the interference to signal transmission, and meets the requirements of 5G communication equipment for heat dissipation and low-dielectric performance.

[0045] The above-mentioned embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A lightweight LCP material with low dielectric properties for liquid crystal polymerization, characterized in that, It includes 70 - 80 parts by weight of LCP modified resin, 5 - 10 parts of low - dielectric modified filler, 1 - 2 parts of reinforcing fiber, 1 - 3 parts of inorganic filler, and 10 - 15 parts of high - flow aid; among them, the preparation method of the LCP modified resin is as follows: Put LCP resin and maleic anhydride into a reaction flask, heat up to 340 °C, add initiator dicumyl peroxide (DCP), under stirring and nitrogen protection, carry out melt polymerization for 1 - 3 h. After the reaction ends, add epoxy resin and continue melting. After adding hollow glass beads, use a twin - screw extruder to form the LCP modified resin; among them, the preparation method of the low - dielectric modified filler is as follows: Add low - dielectric material and sulfuric acid into a reaction flask for pretreatment and soaking, stir for 2 - 4 h, the stirring speed is 10 rpm, then take out the low - dielectric material, wash it with purified water until the pH = 7. Then disperse the low - dielectric material in toluene, add a coupling agent, start stirring, react at 40 °C for 2 - 4 h. After the reaction ends, filter, wash the filter cake with purified water to obtain a low - dielectric material with alkynyl groups introduced on the surface. Then continue to add azide - modified polyethylene glycol, react under a copper catalyst at room temperature with stirring for 2 hours, filter, wash with purified water and dry to obtain the low - dielectric modified filler.

2. The lightweight LCP material with low dielectric properties according to claim 1, characterized in that, The low - dielectric material is: hexagonal boron nitride (h - BN).

3. The lightweight LCP material with low dielectric properties according to claim 1, characterized in that The coupling agent is: propargyltrimethylsilane.

4. The lightweight LCP material with low dielectric properties according to claim 1, characterized in that, The reinforcing fiber is one or more of carbon fiber, glass fiber, and aramid fiber.

5. The lightweight LCP material with low dielectric properties according to claim 1, characterized in that, The inorganic filler is one or more of titanium dioxide, alumina, and silicon carbide.

6. The lightweight LCP material with low dielectric properties according to claim 1, characterized in that The high - flow aid is one or more of butyl stearate, liquid paraffin, and dimethyl silicone oil.

7. A preparation method of a liquid crystal polymer lightweight LCP material with low dielectric properties according to any one of claims 1-6, characterized in that, It includes the following steps: S1. Weigh the LCP modified resin, low - dielectric modified filler, reinforcing fiber, inorganic filler, and high - flow aid according to the above weight ratio, put them into a high - speed mixer for mixing to obtain a mixture of the above components; S2. Add the component mixture obtained by high - speed mixing in step S1 to a twin - screw extruder, set the temperature at 320 - 360 °C, extrude into strips and pelletize to obtain a low - dielectric - property liquid crystal polymer lightweight LCP material.

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