Powder mixing device for improving phase uniformity of tungsten-silicon alloy target material and using method of powder mixing device

Abstract

The invention provides a powder mixing device for improving phase uniformity of a tungsten-silicon alloy target material and a using method of the powder mixing device. The powder mixing device comprises a cylinder body, a powder conveying device is arranged at the top of the cylinder body; the powder conveying device comprises a tungsten powder conveying device and a silicon powder conveying device which are arranged in parallel; a piston and a pushing shaft are sequentially arranged in the cylinder body from top to bottom; and the push shaft is connected with the flywheel. The tungsten powder and the silicon powder are compacted in a layered mode, the problem of spontaneous agglomeration of powder raw materials during powder mixing is solved, the phase uniformity of the tungsten-silicon alloy target material is greatly improved, and then the use performance of the tungsten-silicon alloy target material is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of target material preparation, and particularly to a powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target and a method for using the same. Background Art

[0002] The solid bombarded during sputtering coating is the target material. The tungsten-silicon target material is a commonly used target material in the manufacturing process of semiconductor film layers. The film layer formed by sputtering the tungsten-silicon target material is an excellent conductor and is widely used in the fields of electronic gate materials and electronic thin films. In order to make the thin film have better performance, it is required that the tungsten-silicon target material has high purity and density, and has high requirements for the microstructure uniformity and grain size of the target material.

[0003] CN103056368A discloses a preparation method of a tungsten-silicon alloy target material, including the following steps: (1) fully mixing tungsten powder, silicon powder and a forming agent to obtain tungsten-silicon alloy powder; (2) cold pressing the tungsten-silicon alloy powder obtained in step (1) to obtain a preformed blank; (3) performing vacuum hot pressing on the preformed blank obtained in step (2) and cooling to obtain a sintered blank; (4) cutting the sintered blank in step (3) to obtain the tungsten-silicon alloy target material.

[0004] CN113088899A discloses a high-purity low-oxygen tungsten-silicon alloy target material and a preparation method thereof. The preparation method uses high-purity tungsten powder and high-purity silicon powder as raw materials, and performs powder batching, powder mixing and canning, and powder packing in a glove box filled with inert gas to ensure that the powder is not exposed to the atmospheric environment throughout the process, obtaining high-purity low-oxygen mixed powder, and then using hot isostatic pressing sintering to form a tungsten-silicon target material with uniform microstructure, relative density ≥ 99%, purity ≥ 5N, and oxygen content ≤ 400 ppm.

[0005] CN114293158A discloses a preparation method of a tungsten-silicon alloy target material, including the following steps: (1) using silicon powder and tungsten powder as raw materials, vacuum heating the silicon powder and then performing water quenching treatment; (2) putting the water-quenched silicon powder into a ball milling tank for vacuum ball milling and then vacuum drying; (3) adding the vacuum-dried silicon powder into a mixed solution of sulfuric acid and hydrochloric acid for ultrasonic treatment; then washing with water and putting it into a drying oven for vacuum drying; (4) performing vacuum ball milling on the silicon powder and tungsten powder; (5) performing vacuum induction heating treatment on the tungsten-silicon powder; (6) performing ball milling treatment on the preliminarily alloyed tungsten-silicon powder; (7) sintering, machining and removing the carburized layer of the mixed powder to obtain the tungsten-silicon alloy target material.

[0006] However, the above preparation methods of tungsten-silicon alloy target materials still have the problem of spontaneous agglomeration of powders during powder mixing, which will affect the phase uniformity of the prepared target materials. Summary of the Invention

[0007] In view of the problems existing in the prior art, the present invention provides a powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets and a method for using the same. By using a specific powder mixing device, the tungsten powder and silicon powder are compacted layer by layer, effectively solving the problem of spontaneous agglomeration of powder raw materials, greatly improving the phase uniformity of tungsten-silicon alloy targets, and being suitable for wide promotion and application.

[0008] To achieve this purpose, the present invention adopts the following technical solutions:

[0009] In the first aspect, the present invention provides a powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets. The powder mixing device includes a cylinder body; a powder feeding device is arranged at the top of the cylinder body; the powder feeding device includes a tungsten powder feeding device and a silicon powder feeding device arranged in parallel.

[0010] A piston and a push shaft are sequentially arranged in the cylinder body from top to bottom; the push shaft is connected to a flywheel.

[0011] The powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets according to the present invention uses the tungsten powder feeding device and the silicon powder feeding device arranged in parallel to respectively transport different powder raw materials into the cylinder body, and uses the piston to perform layered compaction treatment on the powder raw materials, effectively solving the problem of powder raw material agglomeration, improving the phase uniformity of the prepared tungsten-silicon alloy target, and further improving the service performance of the tungsten-silicon alloy target.

[0012] The powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets according to the present invention has a reasonable structural design. The settings of the piston, push shaft and flywheel imitate the structural design of an internal combustion engine, with simple operation and realizing efficient compaction treatment of powder raw materials.

[0013] In the present invention, the diameter of the cylinder body is the diameter of the target blank. The push shaft pushes the piston to move up and down to achieve powder compaction. The maximum pressure can be set at the axis of the push shaft. After reaching the maximum pressure, it will automatically move downward to achieve constant pressure compaction of the target blank.

[0014] Preferably, the tungsten powder feeding device is connected to a first nozzle.

[0015] Preferably, a first valve controller is arranged on the tungsten powder feeding device.

[0016] Preferably, the silicon powder feeding device is connected to a second nozzle.

[0017] Preferably, a second valve controller is arranged on the silicon powder feeding device.

[0018] The present invention sprays the powder raw materials into the cylinder body through nozzles, which can make the powder uniformly stressed under the action of the piston and avoid agglomeration. The present invention uses valve controllers to regulate the feeding amounts of tungsten powder and silicon powder, avoiding stratification of tungsten powder and silicon powder caused by excessive powder raw materials sprayed in a single time.

[0019] In a second aspect, the present invention also provides a method for using a powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target as described in the first aspect. The method for using includes the following steps:

[0020] (1) After weighing tungsten powder and silicon powder and loading them into a tungsten powder conveying device and a silicon powder conveying device respectively, evacuate the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target;

[0021] (2) The tungsten powder is sprayed into the cylinder through the first nozzle, and the pushing shaft is pushed to move the piston upward to compact the tungsten powder and then the piston moves downward; then, after the silicon powder is sprayed into the cylinder through the second nozzle, the pushing shaft is pushed to move the piston upward to compact the silicon powder and then the piston moves downward;

[0022] Or after the silicon powder is sprayed into the cylinder through the second nozzle, the pushing shaft is pushed to move the piston upward to compact the silicon powder and then the piston moves downward; then, the tungsten powder is sprayed into the cylinder through the first nozzle, and the pushing shaft is pushed to move the piston upward to compact the tungsten powder and then the piston moves downward;

[0023] (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed out, and a compacted tungsten-silicon alloy target blank is obtained.

[0024] The method for using the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target according to the present invention is simple to operate. By alternately spraying tungsten powder and silicon powder into the cylinder multiple times and using a piston to compact each time after spraying the powder raw materials, the problem of agglomeration of the powder raw materials during the preparation of the tungsten-silicon alloy target blank is avoided, and the phase uniformity of the tungsten-silicon alloy target is improved.

[0025] The present invention does not limit the mass ratio of tungsten powder and silicon powder. Those skilled in the art can reasonably set the mass ratio of the two according to the requirements of the tungsten-silicon alloy target blank actually needed.

[0026] In the method for using of the present invention, the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target is evacuated, effectively eliminating the gas and adsorbates in the gaps of the powder raw materials, making the pressure distribution more uniform during the compaction process, and thus significantly improving the performance of the finally obtained alloy target blank.

[0027] Preferably, the end point of the evacuation treatment in step (1) is an absolute vacuum degree < 40 Pa. For example, it can be 39 Pa, 38 Pa, 35 Pa, 30 Pa, 28 Pa, 25 Pa or 20 Pa, etc., but is not limited to the listed values. Other unlisted values within this numerical range are equally applicable.

[0028] Preferably, the working pressure of the first nozzle in step (2) is 160 - 200 MPa. For example, it can be 160 MPa, 165 MPa, 170 MPa, 175 MPa, 180 MPa, 190 MPa or 200 MPa, etc., but it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0029] Preferably, the working pressure of the second nozzle is 160 - 200 MPa. For example, it can be 160 MPa, 165 MPa, 170 MPa, 175 MPa, 180 MPa, 190 MPa or 200 MPa, etc., but it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0030] In the present invention, preferably, the working pressure of the first nozzle is 160 - 200 MPa, and the working pressure of the second nozzle is 160 - 200 MPa. That is, high-pressure nozzles are used for powder spraying, ensuring the uniformity of the compacted raw material powder.

[0031] Preferably, the mass of tungsten powder sprayed into the first nozzle in step (2) is 5 - 20 g. For example, it can be 5 g, 6 g, 8 g, 10 g, 13 g, 18 g or 20 g, etc., but it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0032] Preferably, the mass of silicon powder sprayed into the second nozzle is 5 - 20 g. For example, it can be 5 g, 6 g, 8 g, 10 g, 13 g, 18 g or 20 g, etc., but it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0033] In the present invention, preferably, the mass of tungsten powder sprayed into the first nozzle is 5 - 20 g, and the mass of silicon powder sprayed into the second nozzle is 5 - 20 g, avoiding the layering of tungsten powder and silicon powder caused by excessive powder raw materials sprayed in a single time.

[0034] In the present invention, the particle sizes of tungsten powder and silicon powder can be the conventional particle sizes for preparing alloys by powder compaction and sintering in the art.

[0035] Preferably, the pressure used for compaction in step (2) is 800 - 1000 MPa. For example, it can be 800 MPa, 850 MPa, 900 MPa, 930 MPa, 980 MPa or 1000 MPa, etc., but it is not limited to the listed values, and other unlisted values within this range are equally applicable.

[0036] In the present invention, preferably, the pressure used for compaction is 800 - 1000 MPa, which can inhibit grain growth during sintering, refine grains, and also improve the phase uniformity of the finally obtained tungsten-silicon alloy target.

[0037] Preferably, the compacted tungsten-silicon alloy target blank in step (3) is sintered to obtain a tungsten-silicon alloy target.

[0038] Preferably, the temperature of the sintering treatment is 1400-1500 °C, for example, it can be 1400 °C, 1410 °C, 1430 °C, 1450 °C, 1470 °C, 1490 °C or 1500 °C, etc., but is not limited to the listed values, and other unlisted values within this numerical range are equally applicable.

[0039] Preferably, the time of the sintering treatment is 2-4 h, for example, it can be 2 h, 2.5 h, 2.8 h, 3 h, 3.5 h or 4 h, etc., but is not limited to the listed values, and other unlisted values within this numerical range are equally applicable.

[0040] As a preferred technical solution of the present invention, the usage method includes the following steps:

[0041] (1) After weighing tungsten powder and silicon powder and loading them into the tungsten powder conveying device and the silicon powder conveying device respectively, the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target is evacuated; the end point of the evacuation treatment is an absolute vacuum degree < 40 Pa;

[0042] (2) The tungsten powder is sprayed into the cylinder through the first nozzle, and the pushing shaft is pushed to move the piston upward to compact the tungsten powder and then the piston moves downward; then, after the silicon powder is sprayed into the cylinder through the second nozzle, the pushing shaft is pushed to move the piston upward to compact the silicon powder and then the piston moves downward;

[0043] Or after the silicon powder is sprayed into the cylinder through the second nozzle, the pushing shaft is pushed to move the piston upward to compact the silicon powder and then the piston moves downward; then, the tungsten powder is sprayed into the cylinder through the first nozzle, and the pushing shaft is pushed to move the piston upward to compact the tungsten powder and then the piston moves downward;

[0044] The working pressure of the first nozzle is 160-200 MPa; the working pressure of the second nozzle is 160-200 MPa.

[0045] The mass of tungsten powder sprayed into the cylinder by the first nozzle each time is 5-20 g; the mass of silicon powder sprayed into the cylinder by the second nozzle each time is 5-20 g;

[0046] The pressure used for compaction is 800-1000 MPa;

[0047] (3) Step (2) is repeated until all the tungsten powder and silicon powder are sprayed out, obtaining a compacted tungsten-silicon alloy target blank, which is sintered at a temperature of 1400-1500 °C for 2-4 h to obtain a tungsten-silicon alloy target.

[0048] Compared with the prior art, the present invention has at least the following beneficial effects:

[0049] The powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets provided by the present invention has a simple structure and reasonable design. By layering and compacting tungsten powder and silicon powder, it solves the problem of spontaneous powder agglomeration in the prior art when preparing targets by powder sintering, greatly improves the phase uniformity of tungsten-silicon alloy targets, and thus improves the service performance of tungsten-silicon alloy targets. Brief Description of the Drawings

[0050] Figure 1 It is a schematic structural diagram of the powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets in Embodiment 1 of the present invention.

[0051] In the figure: 1 - cylinder body; 2 - tungsten powder conveying device; 3 - silicon powder conveying device; 4 - piston; 5 - push shaft; 6 - flywheel; 7 - first nozzle; 8 - first valve controller; 9 - second nozzle; 10 - second valve controller; 11 - tungsten-silicon alloy target blank after compaction. Detailed Description of the Embodiments

[0052] The technical solution of the present invention will be further described below in conjunction with the drawings and through specific embodiments.

[0053] The present invention will be further described in detail below. However, the following examples are only simple examples of the present invention and do not represent or limit the scope of the protection of the rights of the present invention. The scope of protection of the present invention is subject to the claims.

[0054] It should be understood that in the description of the present invention, the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the technical features indicated. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0055] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "arranged", "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0056] Embodiment 1

[0057] This embodiment provides a powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target, and its structural schematic diagram is as Figure 1 shown.

[0058] The powder mixing device includes a cylinder body 1; a powder feeding device is arranged at the top of the cylinder body 1; the powder feeding device includes a tungsten powder feeding device 2 and a silicon powder feeding device 3 arranged in parallel;

[0059] A piston 4 and a push shaft 5 are sequentially arranged in the cylinder body 1 from top to bottom; the push shaft 5 is connected to a flywheel 6.

[0060] The tungsten powder feeding device 2 is connected to a first nozzle 7;

[0061] A first valve controller 8 is arranged on the tungsten powder feeding device 2.

[0062] The silicon powder feeding device 3 is connected to a second nozzle 9;

[0063] A second valve controller 10 is arranged on the silicon powder feeding device 3.

[0064] Figure 1 Above the piston 4 is the compacted tungsten-silicon alloy target blank 11.

[0065] Embodiment 2

[0066] This embodiment provides a method for using the powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target described in Embodiment 1, and the method includes the following steps:

[0067] (1) After weighing tungsten powder and silicon powder and loading them into the tungsten powder feeding device and the silicon powder feeding device respectively, perform a vacuum pumping treatment on the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target; the end point of the vacuum pumping treatment is an absolute vacuum degree < 40 Pa;

[0068] (2) The tungsten powder is sprayed into the cylinder body through the first nozzle, and the push shaft pushes the piston to move upward to compact the tungsten powder and then the piston moves downward; then, after the silicon powder is sprayed into the cylinder body through the second nozzle, the push shaft pushes the piston to move upward to compact the silicon powder and then the piston moves downward;

[0069] The working pressure of the first nozzle is 180 MPa; the working pressure of the second nozzle is 180 MPa;

[0070] The mass of tungsten powder injected by the first nozzle each time is 5 g; the mass of silicon powder injected by the second nozzle each time is 15 g;

[0071] The pressure used for compaction is 850 MPa;

[0072] (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed, obtaining a compacted tungsten-silicon alloy target blank, and obtaining a tungsten-silicon alloy target after sintering treatment at a temperature of 1450 °C for 2.4 h.

[0073] Example 3

[0074] This example provides a method for using the powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target described in Example 1. The method includes the following steps:

[0075] (1) After weighing tungsten powder and silicon powder and loading them into the tungsten powder conveying device and the silicon powder conveying device respectively, perform a vacuum pumping treatment on the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target; the end point of the vacuum pumping treatment is an absolute vacuum degree < 40 Pa;

[0076] (2) After the silicon powder is sprayed into the cylinder through the second nozzle, the push rod is pushed to move the piston upward to compact the silicon powder and then the piston moves downward; then the tungsten powder is sprayed into the cylinder through the first nozzle, the push rod is pushed to move the piston upward to compact the tungsten powder and then the piston moves downward;

[0077] The working pressure of the first nozzle is 160 MPa; the working pressure of the second nozzle is 200 MPa;

[0078] The mass of tungsten powder injected by the first nozzle each time is 10 g; the mass of silicon powder injected by the second nozzle each time is 10 g;

[0079] The pressure used for compaction is 1000 MPa;

[0080] (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed, obtaining a compacted tungsten-silicon alloy target blank, and obtaining a tungsten-silicon alloy target after sintering treatment at a temperature of 1500 °C for 4 h.

[0081] Example 4

[0082] This example provides a method for using the powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target described in Example 1. The method includes the following steps:

[0083] (1) Weigh tungsten powder and silicon powder and load them into the tungsten powder conveying device and the silicon powder conveying device respectively, and then evacuate the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target; the end point of the evacuation process is an absolute vacuum degree < 40 Pa;

[0084] (2) The tungsten powder is sprayed into the cylinder through the first nozzle, and the pushing shaft is pushed to move the piston upward to compact the tungsten powder and then the piston moves downward; then, after the silicon powder is sprayed into the cylinder through the second nozzle, the pushing shaft is pushed to move the piston upward to compact the silicon powder and then the piston moves downward;

[0085] The working pressure of the first nozzle is 200 MPa; the working pressure of the second nozzle is 160 MPa;

[0086] The mass of tungsten powder sprayed into the cylinder by the first nozzle each time is 20 g; the mass of silicon powder sprayed into the cylinder by the second nozzle each time is 5 g;

[0087] The pressure used for compaction is 800 MPa;

[0088] (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed out, obtaining a compacted tungsten-silicon alloy target blank, and sinter it at a temperature of 1400 °C for 2 h to obtain the tungsten-silicon alloy target.

[0089] From Examples 2 to 4, it can be seen that the method for using the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target provided by the present invention is simple to operate. By alternately spraying the powder raw materials into the cylinder multiple times and performing compaction treatment, the spontaneous agglomeration of the powder is avoided, and the phase uniformity of the tungsten-silicon alloy target is effectively improved.

[0090] Example 5

[0091] This example provides a method for using the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target described in Example 1. Except that the mass of tungsten powder sprayed into the cylinder by the first nozzle each time in step (2) is 2 g, the rest are the same as in Example 2.

[0092] Example 6

[0093] This example provides a method for using the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target described in Example 1. Except that the mass of tungsten powder sprayed into the cylinder by the first nozzle each time in step (2) is 30 g, the rest are the same as in Example 2.

[0094] From Examples 5 to 6 and Example 2, it can be seen that in Example 5, the small mass of tungsten powder sprayed into the cylinder by the first nozzle each time will result in a longer preparation time for the tungsten-silicon alloy target and a significant reduction in the preparation efficiency; in Example 6, the large mass of tungsten powder sprayed into the cylinder by the first nozzle each time will cause stratification of the tungsten powder and the silicon powder, and finally the phase uniformity of the obtained tungsten-silicon alloy target will deteriorate.

[0095] Example 7

[0096] This example provides a method for using the powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets described in Example 1. Except that the pressure used for compaction in step (2) is 700 MPa, the rest are the same as in Example 2.

[0097] Example 8

[0098] This example provides a method for using the powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets described in Example 1. Except that the pressure used for compaction in step (2) is 1100 MPa, the rest are the same as in Example 2.

[0099] From a comprehensive comparison of Examples 7 - 8 and Example 2, it can be seen that in Example 7, the relatively low pressure used for compaction leads to grain growth during the sintering process, and the finally prepared tungsten-silicon alloy target has a relatively high porosity, insufficient densification, and poor phase uniformity. In Example 8, the relatively high pressure used for compaction results in microcracks in the finally prepared tungsten-silicon alloy target, affecting the overall performance.

[0100] Comparative Example 1

[0101] This comparative example provides a method for using the powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets described in Example 1. The method includes the following steps:

[0102] (1) After weighing tungsten powder and silicon powder and loading them into the tungsten powder conveying device and the silicon powder conveying device respectively, perform a vacuum pumping treatment on the powder mixing device for improving the phase uniformity of tungsten-silicon alloy targets; the end point of the vacuum pumping treatment is an absolute vacuum degree < 40 Pa;

[0103] (2) The first nozzle and the second nozzle simultaneously spray tungsten powder and silicon powder into the cylinder body, and the pushing shaft pushes the piston upward to compact the tungsten powder and then the piston moves downward;

[0104] The working pressure of the first nozzle is 180 MPa; the working pressure of the second nozzle is 180 MPa;

[0105] The mass of tungsten powder sprayed by the first nozzle each time is 5 g; the mass of silicon powder sprayed by the second nozzle each time is 15 g;

[0106] The pressure used for compaction is 850 MPa;

[0107] (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed, obtaining a compacted tungsten-silicon alloy target blank, and subject it to sintering treatment at a temperature of 1450 °C for 2.4 h to obtain a tungsten-silicon alloy target.

[0108] In this comparative example, tungsten powder and silicon powder were simultaneously sprayed into the cylinder. Due to differences in particle size, density, surface properties, etc. between the two metal powders, density segregation or particle size segregation occurred. The light / fine powders agglomerated first due to electrostatic or van der Waals forces, resulting in poor phase uniformity of the finally prepared tungsten-silicon alloy target.

[0109] The applicant declares that the above description is only a specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by any person skilled in the art within the technical scope disclosed by the present invention fall within the protection scope and the disclosure scope of the present invention.

Claims

1. A powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target, characterized in that, The powder mixing device includes a cylinder body; a powder conveying device is arranged at the top of the cylinder body; the powder conveying device includes a tungsten powder conveying device and a silicon powder conveying device arranged in parallel. A piston and a push shaft are sequentially arranged inside the cylinder body from top to bottom; the push shaft is connected to a flywheel.

2. The powder mixing device according to claim 1, wherein The tungsten powder conveying device is connected to a first nozzle. Preferably, a first valve controller is arranged on the tungsten powder conveying device.

3. The powder mixing device according to claim 1 or 2, characterized in that, The silicon powder conveying device is connected to a second nozzle. Preferably, a second valve controller is arranged on the silicon powder conveying device.

4. A method for using a powder mixing device for improving the phase uniformity of a tungsten-silicon alloy target according to any one of claims 1 to 3, characterized in that, The usage method includes the following steps: (1) After weighing tungsten powder and silicon powder and loading them into the tungsten powder conveying device and the silicon powder conveying device respectively, evacuate the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target. (2) The tungsten powder is sprayed into the cylinder body through the first nozzle, and the push shaft pushes the piston upward to compact the tungsten powder and then the piston moves downward; then the silicon powder is sprayed into the cylinder body through the second nozzle, and the push shaft pushes the piston upward to compact the silicon powder and then the piston moves downward; Or after the silicon powder is sprayed into the cylinder body through the second nozzle, the push shaft pushes the piston upward to compact the silicon powder and then the piston moves downward; then the tungsten powder is sprayed into the cylinder body through the first nozzle, and the push shaft pushes the piston upward to compact the tungsten powder and then the piston moves downward; (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed out to obtain a compacted tungsten-silicon alloy target blank.

5. The usage method according to claim 4, characterized in that, The end point of the evacuation treatment in step (1) is an absolute vacuum degree < 40 Pa.

6. The usage method according to claim 4 or 5, characterized in that, The working pressure of the first nozzle in step (2) is 160 - 200 MPa. Preferably, the working pressure of the second nozzle is 160 - 200 MPa.

7. The usage method according to any one of claims 4 to 6, characterized in that, The mass of tungsten powder sprayed into the cylinder body by the first nozzle in step (2) is 5 - 20 g. Preferably, the mass of silicon powder sprayed into the cylinder body by the second nozzle each time is 5 - 20 g.

8. The usage method according to any one of claims 4 to 7, characterized in that, The pressure used for compaction in step (2) is 800 - 1000 MPa.

9. The usage method according to any one of claims 4 to 8, characterized in that, The compacted tungsten-silicon alloy target blank in step (3) is sintered to obtain a tungsten-silicon alloy target. Preferably, the temperature of the sintering treatment is 1400 - 1500 °C. Preferably, the time of the sintering treatment is 2 - 4 h.

10. The usage method according to any one of claims 4 to 9, characterized in that, The usage method includes the following steps: (1) After weighing tungsten powder and silicon powder and loading them into the tungsten powder conveying device and the silicon powder conveying device respectively, evacuate the powder mixing device for improving the phase uniformity of the tungsten-silicon alloy target; the end point of the evacuation treatment is an absolute vacuum degree < 40 Pa. (2) The tungsten powder is sprayed into the cylinder body through the first nozzle, and the push shaft pushes the piston upward to compact the tungsten powder and then the piston moves downward; then the silicon powder is sprayed into the cylinder body through the second nozzle, and the push shaft pushes the piston upward to compact the silicon powder and then the piston moves downward; Or after the silicon powder is sprayed into the cylinder body through the second nozzle, the push shaft pushes the piston upward to compact the silicon powder and then the piston moves downward; then the tungsten powder is sprayed into the cylinder body through the first nozzle, and the push shaft pushes the piston upward to compact the tungsten powder and then the piston moves downward; The working pressure of the first nozzle is 160 - 200 MPa; the working pressure of the second nozzle is 160 - 200 MPa. The mass of tungsten powder sprayed into the cylinder body by the first nozzle each time is 5 - 20 g; the mass of silicon powder sprayed into the cylinder body by the second nozzle each time is 5 - 20 g. The pressure used for compaction is 800 - 1000 MPa. (3) Repeat step (2) until all the tungsten powder and silicon powder are sprayed out to obtain a tungsten-silicon alloy target blank after compaction, and then obtain a tungsten-silicon alloy target through sintering treatment at a temperature of 1400 - 1500 °C for 2 - 4 h.

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