Substrate magnetron sputtering coating production equipment

Abstract

The invention relates to magnetron sputtering coating production equipment for a substrate. The magnetron sputtering coating production equipment comprises a rack, a forevacuum unit, a transmission unit, a pretreatment unit and a magnetron sputtering process unit, the four units are integrally mounted on the rack; the forevacuum unit, the pretreatment unit and the magnetron sputtering process unit are arranged in three directions outside the transmission unit; the transmission unit is respectively connected with a substrate inlet and outlet of the forevacuum unit, a substrate inlet and outlet of the pretreatment unit and a substrate inlet and outlet of the magnetron sputtering process unit through three substrate inlets and outlets, and gate valves are respectively arranged at the joint of the transmission unit and the pretreatment unit and the joint of the transmission unit and the magnetron sputtering process unit; the forevacuum unit is used for multi-layer loading of substrates; the transmission unit is used for transmitting the substrate among the other three units; the pretreatment unit is used for removing moisture on the substrate and etching the surface of the substrate; and the magnetron sputtering process unit is used for realizing sputtering coating on the surface of the substrate. According to the invention, the utilization rate of the target material is improved, and the diversity of the process is realized.

Description

Technical Field

[0001] The present invention belongs to the technical field of thin film deposition, and particularly relates to a substrate magnetron sputtering coating production device. Background Art

[0002] Substrate coating refers to a processing technology of coating a thin film material on the surface of a substrate, which is widely used in fields such as semiconductors, optics, electronics, and biology. Currently, there are various substrate coating methods. Among them, magnetron sputtering equipment is widely used in multiple fields such as microelectronics, optoelectronics, nanotechnology, new materials, biomedicine, energy, and aerospace due to its advantages such as low deposition temperature, good film quality, good uniformity, and fast deposition speed.

[0003] The current magnetron sputtering coating method generally sputters and coats a small-diameter substrate with a large-diameter target, resulting in a problem of low target utilization rate. In addition, a magnetron sputtering device generally applies to a single coating process, with poor coating processability. Moreover, the cost of the magnetron sputtering device itself is high, leading to a relatively high production cost of substrate coating. In addition, sputtering and coating of multiple materials on a substrate are usually completed on more than two independent devices, which cannot achieve good connection between production processes, resulting in low coating production efficiency and increased substrate coating cost. Summary of the Invention

[0004] In view of the above technical problems, the present invention provides a substrate magnetron sputtering coating production device that can improve the production efficiency of coating, improve the coating quality, improve the utilization rate of the target, and realize the diversity of coating processes.

[0005] The above object of the present invention is achieved by the following technical solutions:

[0006] A substrate magnetron sputtering coating production device includes a frame, a pre-vacuum unit, a transmission unit, a pre-treatment unit, and a magnetron sputtering process unit; the pre-vacuum unit, the transmission unit, the pre-treatment unit, and the magnetron sputtering process unit are integrally installed on the frame; the pre-vacuum unit, the pre-treatment unit, and the magnetron sputtering process unit are arranged at three positions outside the transmission unit; the transmission unit is respectively connected to the substrate inlet / outlet A of the pre-vacuum unit, the substrate inlet / outlet E of the pre-treatment unit, and the substrate inlet / outlet F of the magnetron sputtering process unit through the substrate inlet / outlet B, the substrate inlet / outlet C, and the substrate inlet / outlet D, and gate valves are respectively arranged at the connection with the pre-treatment unit and the connection with the magnetron sputtering process unit.

[0007] The pre-vacuum unit includes a vacuum chamber A and a liftable substrate carrier placed inside the vacuum chamber A for realizing multi-layer loading of substrates; the transfer unit includes a vacuum chamber B and a transfer actuator. The transfer actuator uses a robotic arm that can perform three composite motions of lifting, rotating, and telescoping, and is used to transfer substrates among the pre-vacuum unit, the pretreatment unit, and the magnetron sputtering process unit; the pretreatment unit includes a vacuum chamber C and a pretreatment actuator; the pretreatment actuator includes an upper heating unit, a substrate carrier unit, and a radio frequency power unit, and is used to remove moisture on the substrate and etch the surface of the substrate; the magnetron sputtering process unit includes a vacuum chamber D and the execution part of magnetron sputtering; the execution part of magnetron sputtering includes a sputtering device, a substrate holder system, and a gas supply device. The sputtering device and the substrate holder system are arranged opposite to each other up and down, and are used to realize sputtering coating of the substrate in a state of revolving around the central axis of the substrate holder system and rotating around its own central axis.

[0008] Moreover, a lockable and sealable chamber door is connected to the front of the vacuum chamber A, and a substrate inlet / outlet A is provided on the back of the vacuum chamber A. The substrate carrier is a three-dimensional rack with upper and lower multi-layer platforms separated by spacer columns. A positioning boss is provided at the center of the upper end of each layer of the platform for realizing positioning and support of the disk body carrying the substrate; the lower end of the substrate carrier is connected to a top rod, and the top rod passes through a rod hole provided at the lower end of the vacuum chamber A. A flange bellows is provided outside the top rod at the lower end of the vacuum chamber A; the lower end of the top rod is connected to the push rod of an electric cylinder A provided below the vacuum chamber A; the electric cylinder A is fixed on a cylinder rack below the vacuum chamber A; an emitter of a transmissive laser photoelectric switch and a receiver of the transmissive laser photoelectric switch are oppositely installed on the left and right side walls of the vacuum chamber A, and the two form a transmissive photoelectric sensor.

[0009] Moreover, the vacuum chamber B adopts a square box structure, including a main chamber and an upper chamber cover. Three sides of the main chamber are provided with substrate inlets and outlets, namely substrate inlet and outlet B, substrate inlet and outlet C, and substrate inlet and outlet D. Substrate inlet and outlet B is directly connected to substrate inlet and outlet A of the pre-vacuum unit. Substrate inlet and outlet C is hermetically connected to substrate inlet and outlet E on the vacuum chamber C of the pretreatment unit through a gate valve. Substrate inlet and outlet D is hermetically connected to substrate inlet and outlet F on the vacuum chamber D of the magnetron sputtering process unit through a gate valve, so that the four vacuum chambers are connected into an integral vacuum chamber structure with gates arranged in the middle. The upper chamber cover adopts a circular chamber cover. A positioning round hole is provided at the upper end of the main chamber. The lower end of the upper chamber cover is hermetically fitted with the positioning round hole, and the two are coaxially arranged and fixedly connected. An observation window B is provided at the center of the upper chamber cover. Two flange interfaces are also reserved on the upper chamber cover for connecting to an external vacuum pumping system and a vacuum degree detection device. Two pairs of opposed photoelectric sensors are cooperatively installed on the upper chamber cover and the main chamber, and the two pairs of opposed photoelectric sensors are respectively installed at positions close to substrate inlet and outlet C and close to substrate inlet and outlet D.

[0010] Moreover, the transmission actuator further includes a telescopic robotic arm, a lifting drive cylinder, a rotary drive cylinder, an arm telescopic drive cylinder, a hollow transmission shaft, a central shaft, a transmission unit frame, a lower magneto-fluid vacuum-sealed transmission device, an upper magneto-fluid vacuum-sealed transmission device, and a bearing seat; the end of the robotic arm is in the shape of a fork.

[0011] The transmission unit frame includes a top plate, a bottom base, and multiple fixed struts connecting the top plate and the bottom base.

[0012] The lifting drive cylinder is vertically fixed below the bottom base, and the upper cylinder rod end of the lifting drive cylinder is fixedly connected to the lower end of the cylinder body of the rotary drive cylinder through a lifting flange.

[0013] The upper cylinder rod end of the rotary drive cylinder is fixedly connected with a lower rotary base. The arm telescopic drive cylinder is fixed to the upper end of the lower rotary base. An upper rotary base is arranged above the arm telescopic drive cylinder. The upper rotary base and the lower rotary base are fixedly connected into one body through multiple circumferentially arranged rotary struts. The hollow transmission shaft is coaxially and fixedly connected with the lower magneto-fluid vacuum-sealed transmission device up and down, and the lower flange part of the hollow transmission shaft is coaxially and fixedly connected with the upper rotary base.

[0014] A guide disk is arranged above the upper rotary base. The guide disk forms a vertical guiding fit with multiple upper guiding columns vertically fixed to the lower end of the top plate through multiple guide holes. The upper magneto-fluid vacuum-sealed transmission device is coaxially and fixedly installed below the guide disk, and the bearing seat is coaxially and fixedly installed above the guide disk. A transition flange is coaxially installed at the upper end of the bearing seat through an end face bearing, and a rotary base is coaxially positioned and installed at the upper end of the transition flange.

[0015] The hollow transmission shaft is sequentially sleeved and matched with the upper magnetic fluid vacuum sealing transmission device and the bearing seat from bottom to top, and the upper end of the hollow transmission shaft is fixedly connected with the transition flange; the lower end of the central shaft is coaxially and fixedly connected with the output shaft of the arm telescopic driving cylinder, and the central shaft is sequentially sleeved and matched with the lower magnetic fluid vacuum sealing transmission device, the hollow transmission shaft, and the transition flange from bottom to top. The part of the central shaft near the upper end is rotationally matched with the central hole of the rotating base through a bearing; the upper end of the central shaft is connected to the head end of the telescopic robotic arm;

[0016] A bellows is further arranged outside the bearing seat. The upper part of the bellows is welded and connected to the top plate, and the lower part of the bellows is welded and connected to the upper part of the guide plate;

[0017] The telescopic robotic arm is composed of two groups of robotic arms and an end effector; one group of robotic arms is composed of a first linear robotic arm and a left curved arm. One end of the first linear robotic arm is connected to one end of the left curved arm through a rotating pair. The other group of robotic arms is composed of a second linear robotic arm and a right curved arm. One end of the second linear robotic arm is connected to one end of the right curved arm through a rotating pair; the end effector adopts a fork structure, and the other ends of the left curved arm and the right curved arm are both fixedly connected to the fork handle part of the end effector;

[0018] The upper end of the central shaft is fixedly connected to the other end of one of the linear robotic arms and is provided with a driving gear; a pin shaft hole is arranged on one side of the central hole on the rotating base. A pin shaft is rotatably installed in the pin shaft hole through a bearing. The upper end of the pin shaft is fixedly connected to the other end of the other linear robotic arm and is provided with a driven gear, and the driven gear meshes with the driving gear.

[0019] Moreover, the upper end of the vacuum cavity C is hermetically matched with the upper heating unit, and the lower end of the vacuum cavity C is hermetically connected to the substrate carrying unit to form a pretreatment cavity inside. The heating lamps are arranged at the lower end part of the upper heating unit located inside the pretreatment cavity;

[0020] The substrate carrier unit includes an anode flange, a shielding cover A, a temperature-controlled anode plate, a ceramic circuit breaker, a high-temperature-resistant insulating plug, an insulating sleeve, a temperature-controlled medium input pipe, and a temperature-controlled medium output pipe; the anode flange is arranged at the lower end of the vacuum chamber C and is fixedly connected to the vacuum chamber C; the shielding cover A is a cylindrical shielding cover with a frustum at the upper end and a flange at the lower end, and the lower flange of the shielding cover A is fixedly connected to the upper end of the anode flange; the ceramic circuit breaker is placed in the inner hole of the shielding cover A, and the lower end of the ceramic circuit breaker is fixedly connected to the upper end of the anode flange; the lower end of the temperature-controlled anode plate is fixedly connected to the upper end of the ceramic circuit breaker, and the upper part of the temperature-controlled anode plate extends out from the upper end of the frustum of the shielding cover A, and its upper end forms a substrate tray or a supporting surface for the substrate, and uniformly distributed medium flow channels are made in the upper part of the temperature-controlled anode plate. A high-temperature-resistant insulating plug is installed in the upper part of the inner hole of the ceramic circuit breaker, and an insulating sleeve is fixed at the lower part; the temperature-controlled medium input pipe and the temperature-controlled medium output pipe pass through the pipe holes in the high-temperature-resistant insulating plug and the inner holes of the insulating sleeve up and down. The upper ends of the two pipes are fixedly connected to the temperature-controlled anode plate and are communicated with the built-in medium flow channels. The lower ends of the two pipes extend below the anode flange. The lower end of the temperature-controlled medium input pipe forms a medium inlet, and the lower end of the temperature-controlled medium output pipe forms a medium return port, and is connected to an externally provided medium supply device through the medium inlet and the medium return port;

[0021] The radio frequency power unit includes a radio frequency protection box and a radio frequency matcher. The radio frequency protection box is fixed below the anode flange through a housing flange, so that the temperature-controlled medium input pipe and the temperature-controlled medium output pipe are located inside the radio frequency protection box. The radio frequency matcher is installed outside the radio frequency protection box, and the output line of the radio frequency matcher is electrically connected to the temperature-controlled medium input pipe and the temperature-controlled medium output pipe through a power transmission fixture.

[0022] Moreover, the preprocessing execution mechanism further includes a pneumatic grille, which is arranged between the lower part of the upper heating unit and the upper part of the temperature control anode plate in the vacuum chamber C; the pneumatic grille includes a grille substrate, grille plates, a swing cylinder and a rigid connecting piece; the grille substrate is fixed below the upper heating unit by multiple support columns B, and a square opening is arranged in the middle of the grille substrate; on the upper end of the grille substrate, a fixed seat is respectively fixed on both sides of the square opening, and a sliding seat is respectively slidably arranged above the two fixed seats; a plurality of grille plates are arranged in parallel in the square opening in sequence, and the lower parts of both ends of each grille plate are rotatably connected to the two fixed seats on both sides through a lower rotating shaft, and the upper parts of both ends of each grille plate are rotatably connected to the two sliding seats on both sides through an upper rotating shaft; a rigid connecting piece is arranged outside one of the sliding seats, one end of the rigid connecting piece is fixedly connected with one end of a fork-shaped pin in an inserted manner, the other end of the fork-shaped pin is vertically rotatably connected to the outside of the corresponding sliding seat, and the two ends of the fork-shaped pin are arranged in parallel; the other end of the rigid connecting piece is connected to the output end of the swing cylinder; a rigid connecting piece lead-out interface is arranged on the side wall of the vacuum chamber C, and the rigid connecting piece forms a rotatable sealing fit with the rigid connecting piece lead-out interface through mechanical sealing and bearings, and the swing cylinder is fixed on a cylinder bracket outside the vacuum chamber C.

[0023] Moreover, the vacuum chamber D is composed of a lower chamber and an upper cover, the upper cover is hermetically buckled on the upper end of the lower chamber, and a closed sputtering process chamber is formed inside; an interface for connecting an external vacuum pumping system and an air inlet interface for connecting a gas supply device are arranged on the side wall of the lower chamber; a substrate inlet / outlet F is arranged on the side part of the lower chamber.

[0024] The sputtering device includes a magnetron cathode, a target and a sputtering power supply; the substrate holder system includes a substrate tray, a substrate support, a substrate tray and a substrate support movement driving mechanism; there are multiple substrate trays, and the multiple substrate trays are arranged circumferentially with the center of the substrate support as the center; the substrate tray and the substrate support movement driving mechanism are a composite movement driving mechanism for driving the substrate support to drive the substrate tray to rotate around the center of the common rotation axis and at the same time driving each substrate tray to rotate around the center of its own rotation axis.

[0025] A cathode mounting flange is arranged on the upper cover or multiple cathode mounting flanges are arranged circumferentially with the center of the upper cover as the center. A magnetron cathode is installed at each cathode mounting flange, the target is installed at the lower end of the magnetron cathode, and the sputtering power supply is connected to the magnetron cathode; the substrate tray and the substrate support are placed at a position below the magnetron cathode in the sputtering process chamber; the multiple substrate trays and the magnetron cathode are eccentrically arranged in the radial direction of the substrate support.

[0026] Moreover, the substrate support is a disc-shaped support which is coaxially arranged in the lower cavity. The center of the substrate support is coaxially and drivingly connected to the upper end of the male rotating shaft. An installation through hole is eccentrically arranged on the substrate support or a plurality of installation through holes are arranged in a circumferential direction centered on the center of the substrate support. A self-rotating bearing seat is installed in each installation through hole; a self-rotating shaft of a substrate tray is rotatably matched with each self-rotating bearing seat through a bearing; the substrate tray and the substrate support motion driving mechanism include a revolution driving motor, a rotation driving motor, a central gear and planetary gears; a plurality of planetary gears are respectively fixed to the lower ends of a plurality of self-rotating shafts. The central gear is coaxially and fixedly connected with an upper bearing seat, and the upper bearing seat is positioned and installed in a central hole at the bottom of the lower cavity; the central gear meshes with a plurality of planetary gears; a lower bearing seat is fixed at the lower end of the lower cavity, and the lower bearing seat and the upper bearing seat are coaxially arranged. A shaft sleeve which is limited up and down is penetrated in the central holes of the upper bearing seat and the lower bearing seat. The shaft sleeve is rotatably connected with the lower bearing seat through a bearing, and the upper end of the shaft sleeve is connected with the central hole of the upper bearing seat through a key; a first driven gear is fixed below the lower bearing seat on the shaft sleeve. The first driven gear is connected with a first driving gear through a synchronous belt or gear meshing. The first driving gear is fixedly installed at the output end of the rotation driving motor, and the rotation driving motor is fixed below the lower cavity through a motor bracket; the male rotating shaft is inserted into the shaft sleeve with a gap, and its upper end is rotatably connected with the upper bearing seat through a bearing; a second driven gear is fixed at a position close to the lower end of the male rotating shaft. The second driven gear is connected with a second driving gear through a synchronous belt or gear meshing. The second driving gear is fixedly installed at the output end of the revolution driving motor.

[0027] Moreover, a shielding cover B is installed above the substrate support in the vacuum cavity D through a support column. Through holes for the substrate trays to extend upward are arranged on the shielding cover B corresponding to the positions of each substrate tray; baffles are arranged at the upper end of the shielding cover B at positions between two adjacent substrate trays, and a plurality of baffles intersect at the center.

[0028] Moreover, one or more layer spacing adjusting pressure rings are installed below the housing flange of the magnetron cathode, and are connected to the cathode flange on the upper cover through the spacing adjusting pressure rings.

[0029] Advantages and positive effects of the present invention:

[0030] 1. The present invention respectively arranges a pre-vacuum unit, a pretreatment unit and a magnetron sputtering process unit at three positions on the periphery of the transmission unit. The transmission unit forms an integral chamber structure with internal gate valves by combining four vacuum chambers, ensuring that the entire coating process is completed in a sealed vacuum environment.

[0031] 2. The retractable robotic arm of the substrate transfer mechanism of the present invention is driven by three electric cylinders arranged coaxially to perform up / down movement, deployment / retraction movement, and rotation movement, achieving the function of picking up the substrate from one position, rotating a certain angle, and transporting it to another position within a relatively small transfer space.

[0032] 3. Compared with the existing robotic arm driven by four motors, the substrate transfer mechanism of the present invention simplifies the transmission and adopts a coaxial design, featuring a small device volume, light weight, high integration level, stable and firm structure, and reduced cost.

[0033] 4. After evacuating the vacuum chamber C, the pretreatment execution mechanism of the present invention can degas the substrate placed on the upper end of the temperature-controlled anode plate by turning on the heating lamp tube of the upper heating unit. After degassing is completed, when argon is input through the process gas input interface and stabilized, the radio frequency matcher is turned on to achieve etching treatment on the surface of the substrate, obtaining a good pretreatment effect. The anode plate adopts a temperature-controlled anode plate, which can cool or heat the anode plate, thereby cooling or heating the substrate during the etching process, ensuring that the substrate is etched at an optimal temperature, improving the etching efficiency. On the other hand, it is applicable to the pretreatment of different specifications and sizes of substrates made of various materials, showing good applicability.

[0034] 5. The substrate holder of the magnetron sputtering process module of the present invention is applicable to substrate processes of different sizes (such as regular or irregular substrates with a diameter of 8 inches or less) and different materials (such as silicon, ceramics, glass, silicon carbide, gallium arsenide, gallium nitride, sapphire, etc.), realizing the diversity of substrate processes.

[0035] 6. This magnetron sputtering process module can rotate the substrate tray around the center of the public rotation axis under the cathode in a continuous or scanning (back and forth) manner. At the same time, the substrate tray can also rotate around its own axis. In addition, the position of the substrate tray deviates from the central axis of the cathode. During the sputtering coating process, different parts of the large-diameter substrate supported on the substrate tray can be successively and continuously located below the working area of the target sputtering, realizing sputtering coating of the large-diameter substrate with a small target. This coating method can, on the one hand, reduce the overflow and waste of the target, reduce the volume that cannot be utilized before target replacement, thereby greatly improving the target utilization rate. On the other hand, it can obtain better coating uniformity. For general metals, the film thickness uniformity can reach ≤±2%; for magnetic materials, the film thickness uniformity can reach ≤±3%; for reactive sputtering materials, the film thickness uniformity can also reach ≤±3%.

[0036] 7. This magnetron sputtering process module can achieve sputtering coating on a single substrate while the substrate tray rotates or rotates and revolves, and can also achieve sputtering coating of a target material of one material on multiple substrates while the substrate tray rotates or rotates and revolves. In addition, when multiple magnetron cathodes are installed on the upper cover, target materials of different materials can be set at the lower ends of the multiple magnetron cathodes, so that multi-material multi-layer sputtering coating can also be carried out on the surface of the substrate at different time stages of sputtering in the same vacuum environment, thus realizing the diversity of the magnetron sputtering process and improving the applicability of the equipment.

[0037] In summary, through the cooperation of the four functional units of the present invention, the pretreatment and magnetron sputtering coating of the substrate can be realized in the same vacuum environment, which can greatly improve the production efficiency of sputtering coating and improve the coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is the overall structure diagram of the substrate magnetron sputtering coating production equipment of the present invention;

[0039] Figure 2 is the front view of the pre-vacuum unit of the present invention;

[0040] Figure 3 is the three-dimensional external view of the pre-vacuum unit of the present invention;

[0041] Figure 4 is the internal structure schematic diagram of the pre-vacuum unit after removing the chamber door of the present invention;

[0042] Figure 5 is the front view of the substrate transfer unit of the present invention;

[0043] Figure 6 is Figure 5 the A-A cross-sectional view of;

[0044] Figure 7 is the three-dimensional external view of the transfer unit of the present invention;

[0045] Figure 8 is the structural schematic diagram of the transfer execution mechanism cooperating with the transfer chamber of the present invention;

[0046] Figure 9 is the structural schematic diagram of the transfer execution mechanism in the retracted state of the present invention;

[0047] Figure 10 is the three-dimensional structural schematic diagram of the transfer execution mechanism after removing the protective cover of the present invention;

[0048] Figure 11 is the longitudinal cross-sectional view of the transfer execution mechanism of the present invention;

[0049] Figure 12It is a schematic structural diagram of the transmission actuator of the present invention in the extended state;

[0050] Figure 13 It is an overall external view of the pretreatment unit of the present invention;

[0051] Figure 14 It is a cross-sectional view of the upper heating device of the pretreatment unit of the present invention;

[0052] Figure 15 It is a cross-sectional view of the substrate carrier unit and the radio frequency power unit of the pretreatment unit of the present invention;

[0053] Figure 16 It is an overall cross-sectional view of the pretreatment unit of the present invention;

[0054] Figure 17 It is a schematic structural diagram of the pneumatic grille of the present invention;

[0055] Figure 18 It is a schematic diagram of the overall external appearance of the magnetron sputtering process module of the present invention Figure 1 ;

[0056] Figure 19 It is a schematic diagram of the overall external appearance of the magnetron sputtering process module of the present invention Figure 2 ;

[0057] Figure 20 It is a schematic installation diagram of the magnetron cathode on the upper cover plate of the magnetron sputtering process module of the present invention;

[0058] Figure 21 It is a schematic structural diagram of the magnetron cathode of the magnetron sputtering process module of the present invention;

[0059] Figure 22 It is a three-dimensional view of the substrate holder system of the present invention;

[0060] Figure 23 It is an overall cross-sectional view of the substrate holder system of the present invention;

[0061] Figure 24 It is a schematic diagram of the lower cavity of the magnetron sputtering process module and its internal installation structure of the present invention;

[0062] Reference Numerals: 1, frame; 2, pre-vacuum unit; 2.1, vacuum chamber A; 2.2, chamber door; 2.3, observation window A; 2.4, emitter of opposed laser photoelectric switch; 2.5, receiver of opposed laser photoelectric switch; 2.6, flange bellows; 2.7, cylinder frame; 2.8, electric cylinder A; 2.9, substrate inlet / outlet A; 2.10, three-dimensional frame; 2.10.1, carrier stage; 3, transmission unit; 3.1, vacuum chamber B; 3.1.1, main chamber; 3.1.2, upper chamber cover; 3.2, transmission actuator; 3.2.1, end effector; 3.2.2, robotic arm; 3.2.2.1, first linear robotic arm; 3.2.2.2, left bending arm; 3.2.2.3, second linear robotic arm; 3.2.2.4, right bending arm; 3.2.3, top disc; 3.2.4, protective cover; 3.2.5, lifting drive cylinder; 3.2.6, rotating base; 3.2.7, limit sleeve; 3.2.8, upper guide post; 3.2.9, linear bearing; 3.2.10, cable fixing angle piece; 3.2.11, anti-cable winding spacer disc; 3.2.12, upper rotary base; 3.2.13, rotary support pillar; 3.2.14, arm telescoping drive cylinder; 3.2.15, lower rotary base; 3.2.16, rotary drive cylinder; 3.2.17, bottom base; 3.2.18, lower guide post; 3.2.19, guide sleeve fixing seat; 3.2.20, coupling; 3.2.21, lower magnetic fluid vacuum sealing transmission device; 3.2.22, upper magnetic fluid vacuum sealing transmission device; 3.2.23, guide disc; 3.2.24, bearing seat; 3.2.25, transition flange; 3.2.26, bellows; 3.2.27, pin shaft; 3.2.28, driven gear; 3.2.29, driving gear; 3.2.30, hollow transmission shaft; 3.2.31, central shaft; 3.2.32, lifting flange; 3.3, gate valve; 3.4, flange interface; 3.5, observation window B; 3.6, opposed photoelectric sensor; 4, pre-treatment unit; 4.1, upper heating unit; 4.1.1, thermocouple; 4.1.2, terminal protective cover; 4.1.3, positive terminal wiring; 4.1.4, negative terminal wiring; 4.1.5, connecting flange; 4.1.6, top cover; 4.1.7, positive power supply terminal; 4.1.8, negative power supply terminal; 4.1.9, heat shield; 4.1.10, heat insulation board; 4.1.11, heating lamp tube; 4.1.12, lamp holder; 4.1.13, viewing window; 4.2, vacuum chamber C; 4.2.1, substrate inlet / outlet E; 4.3, lifting rod; 4.4, guide seat; 4.5, top cover connecting frame; 4.6, substrate carrying unit; 4.6.1, temperature-controlled anode plate; 4.6.2, high-temperature resistant insulating plug; 4.6.3, ceramic circuit breaker; 4.6.4, shielding cover A; 4.6.5, anode flange; 4.6.6, housing flange; 4.6.7, insulating sleeve; 4.6.8. Temperature control medium output pipe; 4.6.9. Temperature control medium input pipe; 4.7. Power transmission fixture; 4.8. RF protection box; 4.9. RF matcher; 4.10. Pneumatic grille; 4.10.1. Swing cylinder; 4.10.2. Rigid connecting piece; 4.10.3. Fork-shaped pin; 4.10.4. Sliding seat; 4.10.5. Fixed seat; 4.10.6. Grille piece; 4.10.7. Grille substrate; 5. Magnetron sputtering process unit; 5.1. Magnetron cathode; 5.2. Spacing adjustment pressure ring; 5.3. Upper cover; 5.4. Lower cavity; 5.5. Substrate inlet / outlet F; 5.6. Angle valve; 5.7. Self-rotation drive motor; 5.8. Revolution drive motor; 5.9. Electric cylinder B; 5.10. Condensation pump; 5.11. Guide seat; 5.12. Observation window D; 5.13. Target; 5.14. Substrate tray; 5.15. Baffle; 5.16. Shield B; 5.17. First driving wheel; 5.18. First driven wheel; 5.19. Encoder; 5.20. Second driving wheel; 5.21. Second driven wheel; 5.22. Magnetic fluid seal; 5.23. Substrate support; 5.24. Upper bearing seat; 5.25. Central wheel; 5.26. Planet wheel; 5.27. Lower bearing seat; 5.28. Bush; 5.29. Public rotating shaft; 6. Disk body. Detailed implementation manners

[0063] The structure of the present invention will be further described below with reference to the accompanying drawings and through embodiments. It should be noted that this embodiment is narrative rather than restrictive.

[0064] A substrate magnetron sputtering coating production device, please refer to Figures 1 - 24 which has an inventive point that it includes a frame 1, a pre-vacuum unit 2, a transmission unit 3, a pre-treatment unit 4, and a magnetron sputtering process unit 5.

[0065] The pre-vacuum unit, the transmission unit, the pre-treatment unit, and the magnetron sputtering process unit are integrally installed on the frame. The pre-vacuum unit, the pre-treatment unit, and the magnetron sputtering process unit are arranged at three positions outside the transmission unit. The pre-vacuum unit is used to realize the multi-layer loading of substrates. The transmission unit is used to transfer the substrates among the pre-vacuum unit, the pre-treatment unit, and the magnetron sputtering process unit. The pre-treatment unit is used to remove the water vapor on the substrates and etch the surface of the substrates; the magnetron sputtering process unit is used to perform magnetron sputtering coating on the surface of the substrates.

[0066] Pre-vacuum unit:

[0067] The pre-vacuum unit mainly includes a vacuum chamber A 2.1 and a liftable substrate carrier placed in the vacuum chamber A 2.1. The specific structure is as follows:

[0068] A locking and sealing chamber door 2.2 is connected to the front of the vacuum chamber A2.1, and a transparent observation window A2.3 is provided in the middle of the chamber door 2.2. After the chamber door 2.2 is opened, it is used to place the substrate before coating and take it out after the coating is completely finished. A substrate inlet / outlet A2.9 is provided on the back of the vacuum chamber A2.1, which is directly connected to the substrate inlet / outlet B on one side of the transfer unit. The substrate carrier is a three-dimensional rack 2.10 with upper and lower multi-layer platforms 2.10.1 separated by spacer columns. A positioning boss is provided at the center of the upper end of each layer of the platform to realize the positioning and support of the disk body 6 carrying the substrate. The lower end of the substrate carrier is connected to a push rod, and the push rod passes through a rod hole provided at the lower end of the vacuum chamber A2.1. A flange bellows 2.6 is provided outside the push rod at the lower end of the vacuum chamber A2.1 to ensure the sealing performance at the joint between the push rod and the vacuum chamber A2.1. The lower end of the push rod is connected to the push rod of the electric cylinder A2.8 provided below the vacuum chamber A2.1. The electric cylinder A2.8 is fixed on the cylinder frame 2.7 below the vacuum chamber A2.1. An emitter 2.4 of a transmissive laser photoelectric switch and a receiver 2.5 of the transmissive laser photoelectric switch are oppositely installed on the left and right side walls of the vacuum chamber A2.1. The two form a transmissive photoelectric sensor, which is used to detect whether there is a substrate at a set height position, so as to control the up and down movement position of the substrate carrier through the control system of the production equipment.

[0069] Transfer unit:

[0070] The transfer unit mainly includes a vacuum chamber B3.1 and a transfer actuator 3.2. The vacuum chamber B3.1 is a transfer chamber, and the vacuum chamber B3.1 adopts a square box structure, including a main chamber 3.1.1 and an upper chamber cover 3.1.2. Substrate inlets / outlets are provided on three sides of the main chamber 3.1.1, namely substrate inlet / outlet B, substrate inlet / outlet C, and substrate inlet / outlet D. Substrate inlet / outlet B is directly connected to the substrate inlet / outlet A of the pre-vacuum unit. Substrate inlet / outlet C is hermetically connected to the substrate inlet / outlet E on the vacuum chamber C of the pretreatment unit through a gate valve 3.3. Substrate inlet / outlet D is hermetically connected to the substrate inlet / outlet F on the vacuum chamber D of the magnetron sputtering process unit through a gate valve 3.3, so as to connect the four vacuum chambers into an integral vacuum chamber structure with gates in the middle. The upper chamber cover 3.1.2 adopts a circular chamber cover. A positioning round hole is provided at the upper end of the main chamber 3.1.1. The lower end of the upper chamber cover 3.1.2 is hermetically fitted with the positioning round hole, and the two are coaxially arranged and fixedly connected by a circle of screws. An observation window B3.5 is provided at the center of the upper chamber cover 3.1.2, and the tooling state of the transfer actuator can be observed in time through the observation window B3.5.

[0071] The transmission execution mechanism mainly includes two groups of robotic arms 3.2.2, an end effector 3.2.1, a lifting drive cylinder 3.2.5, a rotary drive cylinder 3.2.16, an arm telescopic drive cylinder 3.2.14, a hollow transmission shaft 3.2.30, a central shaft 3.2.31, a transmission unit frame, a lower magnetic fluid vacuum sealing transmission device 3.2.21, an upper magnetic fluid vacuum sealing transmission device 3.2.22, and a bearing block 3.2.24. The two groups of robotic arms 3.2.2 and the end effector 3.2.1 form a robotic arm. The lifting drive cylinder 3.2.5 uses a pull-rod type electric cylinder, and both the rotary drive cylinder 3.2.16 and the arm telescopic drive cylinder 3.2.14 use rotary type electric cylinders. A flange is provided at the lower end of the hollow transmission shaft 3.2.30. One group of robotic arms is composed of a first linear robotic arm 3.2.2.1 and a left bending arm 3.2.2.2. One end of the first linear robotic arm is connected to one end of the left bending arm through a rotating pair. The other group of robotic arms is composed of a second linear robotic arm 3.2.2.3 and a right bending arm 3.2.2.4. One end of the second linear robotic arm is connected to one end of the right bending arm through a rotating pair. The end effector 3.2.1 adopts a fork structure, and the other ends of the left bending arm and the right bending arm are both fixedly connected to the fork handle part of the end effector 3.2.1 through screws. The two groups of robotic arms and the end effector 3.2.1 are connected to form a telescopic robotic arm.

[0072] The transmission unit frame is composed of a top plate 3.2.3, a bottom base 3.2.17, multiple fixed struts connecting the top plate 3.2.3 and the bottom base 3.2.17, and a protective cover 3.2.4 arranged outside the multiple fixed struts. A transmission part installation cavity is formed inside the transmission unit frame. Screw through holes are provided at the upper end of the top plate 3.2.3, and it can be fixed below the vacuum cavity B through screws, so as to realize placing the telescopic robotic arm inside the vacuum cavity B.

[0073] The lifting drive cylinder 3.2.5 is vertically fixed below the bottom base 3.2.17, and its cylinder rod extends into the transmission unit frame through the central hole on the bottom base 3.2.17. The upper cylinder rod end of the lifting drive cylinder 3.2.5 is fixedly connected to the lower end of the cylinder body of the rotary drive cylinder 3.2.16 through a lifting flange 3.2.32. A guide sleeve fixing seat 3.2.19 is fixed on the side of the cylinder body of the rotary drive cylinder 3.2.16. A linear bearing is installed in the guide hole of the guide sleeve fixing seat, and this linear bearing forms a vertical guiding fit with the lower guiding column 3.2.18 fixed on the bottom base 3.2.17.

[0074] The upper cylinder rod end of the rotary drive cylinder 3.2.16 is fixedly connected to the lower slewing base 3.2.15. The arm telescopic drive cylinder 3.2.14 is fixed to the upper end of the lower slewing base 3.2.15. An upper slewing base 3.2.12 is arranged above the arm telescopic drive cylinder 3.2.14. The upper slewing base 3.2.12 and the lower slewing base 3.2.15 are fixedly connected into a whole by a plurality of slewing struts 3.2.13 arranged along the circumferential direction. The hollow transmission shaft 3.2.30 and the lower magneto - hydrodynamic vacuum sealing transmission device 3.2.21 are fixedly connected coaxially up and down by screws. The lower flange part of the hollow transmission shaft 3.2.30 is fixedly connected coaxially to the upper slewing base 3.2.12 by screws. An anti - cable - winding spacer disc 3.2.11 is also installed outside the lower flange part of the hollow transmission shaft 3.2.30. The anti - cable - winding spacer disc is composed of two half - discs spliced and fixedly connected by screws.

[0075] A guide disc 3.2.23 is arranged above the upper slewing base 3.2.12. A plurality of guide holes arranged along the circumferential direction are provided on the guide disc 3.2.23. A linear bearing 3.2.9 is installed in each guide hole. The plurality of linear bearings form a guiding fit in the up - and - down direction with a plurality of upper guide columns 3.2.8 vertically fixed to the lower end of the top disc 3.2.3. An L - shaped cable fixing angle piece 3.2.10 is also fixed to the lower end of each upper guide column 3.2.8. A gap is left between the inner side of the vertical side of the cable fixing angle piece and the outer side of the anti - cable - winding spacer disc. The upper magneto - hydrodynamic vacuum sealing transmission device 3.2.22 is fixedly installed coaxially below the guide disc 3.2.23 by screws. The bearing seat 3.2.24 is fixedly installed coaxially above the guide disc 3.2.23 by screws. A transition flange 3.2.25 is coaxially installed at the upper end of the bearing seat 3.2.24 through an end face bearing. A rotary base 3.2.6 is coaxially positioned and installed at the upper end of the transition flange 3.2.25.

[0076] The hollow transmission shaft 3.2.30 is successively inserted and fitted with the upper magnetic fluid vacuum sealing transmission device 3.2.22 and the bearing housing 3.2.24 from bottom to top, and the upper end of the hollow transmission shaft 3.2.30 is fixedly connected to the transition flange 3.2.25 by screws. The lower end of the central shaft 3.2.31 is fixedly connected to the output shaft of the arm telescopic driving cylinder 3.2.14 through a coupling 3.2.20. The central shaft 3.2.31 is successively inserted and fitted with the lower magnetic fluid vacuum sealing transmission device 3.2.21, the hollow transmission shaft 3.2.30, and the transition flange 3.2.25 upward. The part of the central shaft 3.2.31 near the upper end is rotationally fitted with the central hole of the rotary base 3.2.6 through a bearing. The upper end of the central shaft 3.2.31 is fixedly connected to the other end of one of the linear robotic arms and is provided with a driving gear 3.2.29. A pin shaft hole is provided on one side of the central hole of the rotary base 3.2.6. A pin shaft 3.2.27 is rotatably installed in the pin shaft hole through a bearing. The upper end of the pin shaft is fixedly connected to the other end of the other linear robotic arm and is provided with a driven gear 3.2.28. The driven gear 3.2.28 meshes with the driving gear 3.2.29.

[0077] In the above structure, a bellows 3.2.26 is further provided outside the bearing housing 3.2.24. The upper part of the bellows 3.2.26 is welded to the top plate 3.2.3, and the lower part of the bellows 3.2.26 is welded to the upper part of the guide plate 3.2.23. The setting of the bellows 3.2.26 can, on the one hand, adapt to the up and down movement of the guide plate 3.2.23, and on the other hand, achieve the vacuum seal around the cooperation between the bearing housing 3.2.24 and the central hole of the top plate 3.2.3. This layer of seal is the outermost seal. The cooperation between the above-mentioned upper magnetic fluid vacuum sealing transmission device 3.2.22 and the hollow transmission shaft 3.2.30 constitutes the middle layer seal. The cooperation between the above-mentioned lower magnetic fluid vacuum sealing transmission device 3.2.21 and the central shaft 3.2.31 constitutes the inner layer seal. Through the above three-layer seal, the present substrate transfer mechanism can be better adapted to the vacuum working environment.

[0078] In the above structure, a limit sleeve 3.2.7 is further fixed above the guide plate 3.2.23 on multiple guide posts at the lower end of the top plate 3.2.3 for realizing the upward limit of the robotic arm.

[0079] The present substrate transfer mechanism can realize the lifting action of driving the end effector 3.2.1 by two groups of robotic arms, the rotational action of driving the end effector 3.2.1 by two groups of robotic arms around the center of the rotary base, and the telescopic action of driving the end effector 3.2.1 by two groups of robotic arms in the radial direction, and can realize the transfer of substrates between different vacuum chambers of the coating production equipment.

[0080] In addition, two flange interfaces 3.4 are reserved on the upper cavity cover 3.1.2 for connecting to an external vacuum pumping system and a vacuum degree detection device. Two sets of opposed photoelectric sensors 3.6 are cooperatively installed on the upper cavity cover 3.1.2 and the main cavity 3.1.1. The two sets of opposed photoelectric sensors are respectively installed at positions close to the substrate inlet / outlet C and close to the substrate inlet / outlet D, and are respectively used to detect whether the retractable robotic arm extends into the vacuum cavity C of the pretreatment unit and whether it extends into the vacuum cavity D of the magnetron sputtering process unit. When the receiving end of the opposed photoelectric sensor cannot sense the signal from the transmitting end, it indicates that the retractable robotic arm extends into the corresponding vacuum cavity. At this time, the gate valve 3.3 between the transfer unit and the corresponding vacuum cavity cannot be closed. If the receiving end of the opposed photoelectric sensor can sense the signal from the transmitting end, it indicates that the retractable robotic arm does not extend into the corresponding vacuum cavity. At this time, it is necessary to close the gate valve 3.3 between the transfer unit and the corresponding vacuum cavity to achieve isolation between the vacuum cavities. An exhaust interface is also provided at the lower part of the main cavity 3.1.1, and an exhaust switch valve is installed at the exhaust interface. When the exhaust switch valve is opened, the vacuum break of the vacuum cavities A and B can be achieved.

[0081] Pretreatment unit:

[0082] The pretreatment unit includes a vacuum cavity C 4.2 and a pretreatment actuator. The pretreatment actuator includes an upper heating unit 4.1, a substrate carrier unit 4.6, and a radio frequency power unit.

[0083] The upper end of the vacuum cavity C 4.2 is hermetically fitted with the upper heating unit 4.1, and the lower end of the vacuum cavity C 4.2 is hermetically connected to the substrate carrier unit 4.6, forming a pretreatment chamber inside. Multiple flange interfaces are provided on the side wall of the vacuum cavity C 4.2, which are respectively connected to an external vacuum pumping system, a vacuum degree detection device, a process gas supply device (gas for etching the substrate, generally argon gas), an exhaust switch valve for vacuum break, etc. A substrate inlet / outlet E 4.2.1 is also provided on the side wall of the vacuum cavity C 4.2, and the substrate inlet / outlet E 4.2.1 is connected to the corresponding substrate inlet / outlet C on the vacuum cavity B through a gate valve. An observation window C is also provided on the side wall of the vacuum cavity C 4.2, which can be used to observe the situation inside the vacuum cavity C 4.2 from the outside.

[0084] The upper heating unit 4.1 adopts a heating tube structure, mainly including a top cover 4.1.6, a lamp holder 4.1.12, a viewing window 4.1.13, heating lamp tubes 4.1.11, an upper heat insulation device, a positive power supply terminal 4.1.7, a negative power supply terminal 4.1.8, a positive wire 4.1.3, a negative wire 4.1.4, a thermocouple 4.1.1, a terminal protection cover 4.1.2, a connection flange 4.1.5, etc.

[0085] The top cover is supported on the upper end of the vacuum chamber C4.2, and the two are sealed through a sealing ring. The lamp holder is connected to the lower part of the top cover through a plurality of support columns A, and a viewing window is provided on the lamp holder. The viewing window is fixed at a position corresponding to the viewing window under the lamp holder. The upper heat insulation device is composed of a heat insulation cover 4.1.9 with an opening at the lower end and multiple upper and lower heat insulation plates 4.1.10 arranged inside the heat insulation cover. The heat insulation cover is fixedly connected to the plurality of support columns A and is arranged above the lamp shade. The heating lamp tube adopts a halogen heating lamp tube. A plurality of heating lamp tubes are supported in parallel above the lamp holder through a lamp tube support and are located below the lowermost heat insulation plate inside the heat insulation cover. The plurality of heating lamps form a circular radiation heating surface, and the circular radiation heating surface is aligned with the viewing window located below. The positive power supply terminal and the negative power supply terminal are fixed on the top of the heat insulation cover and are electrically connected to the positive and negative poles of the heating lamp tube. A wire passing hole is provided at the center of the top cover. A connection flange is fixed at the center position above the top cover, and a positive lead hole, a negative lead hole and a thermocouple passing hole are provided on the connection flange. A terminal protection cover is fixed on the periphery of the connection flange above the top cover, and a cable total introduction hole is provided at the upper end of the terminal protection cover. The positive wiring, the negative wiring and the thermocouple respectively pass through the positive lead hole, the negative lead hole and the thermocouple lead hole in a sealed manner. The upper ends of the positive wiring, the negative wiring and the thermocouple are all introduced through the cable total introduction hole. The lower ends of the positive wiring and the negative wiring are respectively connected to the positive power supply terminal and the negative power supply terminal. The lower end of the thermocouple extends to a position close to the upper end of the viewing window for detecting the heating temperature.

[0086] The substrate carrier unit 4.6 mainly includes an anode flange 4.6.5, a shielding cover A 4.6.4, a temperature-controlled anode plate 4.6.1, a ceramic circuit breaker 4.6.3, a high-temperature resistant insulating plug 4.6.2, an insulating sleeve 4.6.7, a temperature-controlled medium input pipe 4.6.9, and a temperature-controlled medium output pipe 4.6.8. The anode flange 4.6.5 is arranged at the lower end of the vacuum chamber C4.2 and is fixedly connected to the vacuum chamber C4.2 by screws. The shielding cover A 4.6.4 is a cylindrical protective cover with a frustum at the upper end and a flange at the lower end. The lower flange of the shielding cover A 4.6.4 is fixedly connected to the upper end of the anode flange 4.6.5 by screws. The ceramic circuit breaker 4.6.3 is placed in the inner hole of the shielding cover A 4.6.4, and the lower end of the ceramic circuit breaker 4.6.3 is fixedly connected to the upper end of the anode flange 4.6.5 by screws. The lower end of the temperature-controlled anode plate 4.6.1 is fixedly connected to the upper end of the ceramic circuit breaker 4.6.3. The upper part of the temperature-controlled anode plate 4.6.1 extends out from the upper end of the upper frustum, and its upper end forms a support surface. Uniformly distributed medium flow channels are made in the upper part of the temperature-controlled anode plate 4.6.1. A high-temperature resistant insulating plug 4.6.2 is installed in the upper part of the inner hole of the ceramic circuit breaker 4.6.3, and an insulating sleeve 4.6.7 is fixed at the lower part. The temperature-controlled medium input pipe 4.6.9 and the temperature-controlled medium output pipe 4.6.8 pass through the pipe holes in the high-temperature resistant insulating plug 4.6.2 and the inner holes of the insulating sleeve 4.6.7 up and down. The upper ends of the two pipes are fixedly connected to the temperature-controlled anode plate 4.6.1 and are communicated with the built-in medium flow channels. The lower ends of the two pipes extend below the anode flange 4.6.5. The lower end of the temperature-controlled medium input pipe 4.6.9 forms a medium inlet, and the lower end of the temperature-controlled medium output pipe 4.6.8 forms a medium return port. They are connected to an externally provided medium supply device through the medium inlet and the medium return port to realize the input and output of the medium. According to specific substrate process treatment requirements, the temperature-controlled medium can be used for cooling treatment or heating treatment.

[0087] The radio frequency power unit includes a radio frequency protection box 4.8 and a radio frequency matcher 4.9. The radio frequency protection box 4.8 is fixed below the anode flange 4.6.5 through a housing flange 4.6.6, so that the temperature-controlled medium input pipe 4.6.9 and the temperature-controlled medium output pipe 4.6.8 are located inside the radio frequency protection box 4.8. The radio frequency matcher 4.9 is installed outside the radio frequency protection box 4.8, and the output line of the radio frequency matcher 4.9 is electrically connected to the temperature-controlled medium input pipe 4.6.9 and the temperature-controlled medium output pipe 4.6.8 through a power transmission fixture 4.7.

[0088] In addition to the above structure, a lifting mechanism for lifting the upper heating unit 4.1 is provided. The lifting mechanism includes a lifting rod 4.3, two guide seats 4.4, a top cover connecting frame 4.5, and a lifting rod driving structure. The two guide seats are fixedly mounted on the outer side wall of the vacuum chamber C4.2 up and down. Linear bearings are installed in the vertically aligned guide holes of the two guide seats. The lifting rod 4.3 is inserted into the vertical linear bearings. The upper end of the lifting rod 4.3 is fixedly connected to the top cover connecting frame 4.5, and the top cover connecting frame 4.5 is fixedly mounted on the top cover. The lifting rod driving structure can adopt a driving cylinder, such as an electric cylinder, or a combined structure of gear transmission and lead screw nut driven by a handwheel.

[0089] In addition to the above structure, a pneumatic grille 4.10 is further disposed between the lower part of the upper heating unit 4.1 and the upper part of the temperature-controlled anode plate 4.6.1 within the vacuum chamber C4.2. The pneumatic grille 4.10 includes a grille substrate 4.10.7, grille plates 4.10.6, a swing cylinder 4.10.1, and a rigid connecting member 4.10.2. The grille substrate 4.10.7 is fixed to the lower part of the upper heating unit 4.1 by a plurality of support columns B, and a square opening is provided in the middle of the grille substrate 4.10.7. A fixing seat 4.10.5 is respectively fixed to both sides of the square opening at the upper end of the grille substrate 4.10.7, and a sliding seat 4.10.4 is slidably disposed above the fixing seats 4.10.5 on both sides. A plurality of grille plates 4.10.6 are sequentially arranged in parallel within the square opening. The lower parts of both ends of each grille plate 4.10.6 are relatively rotatably connected to the fixing seats 4.10.5 on both sides through lower rotating shafts, and the upper parts of both ends of each grille plate 4.10.6 are relatively rotatably connected to the sliding seats 4.10.4 on both sides through upper rotating shafts. A rigid connecting member 4.10.2 is disposed outside the sliding seat 4.10.4 on one side. One end of the rigid connecting member 4.10.2 is inserted and fixedly connected to one end of a fork-shaped pin 4.10.3, and the other end of the fork-shaped pin 4.10.3 is vertically rotatably connected to the outside of the sliding seat 4.10.4 on the corresponding side. The two ends of the fork-shaped pin 4.10.3 are arranged in parallel (not coaxial), and the other end of the rigid connecting member 4.10.2 is connected to the output end of a swing cylinder 4.10.1. An interface for leading out the rigid connecting member 4.10.2 is provided on the side wall of the vacuum chamber C4.2. The rigid connecting member 4.10.2 forms a relatively rotatable sealing fit with the interface for leading out the rigid connecting member 4.10.2 through mechanical sealing and bearings. The swing cylinder 4.10.1 is fixed to an electric cylinder bracket outside the vacuum chamber C4.2. This pneumatic grille 4.10 drives the rigid connecting member 4.10.2 to rotate through the swing cylinder 4.10.1, and the rigid connecting member 4.10.2 drives the sliding seat 4.10.4 to slide on the fixing seat 4.10.5, realizing the rotation of the grille plates around the center of the lower rotating shafts. When all the grille plates 4.10.6 rotate to the horizontal position, the square opening on the grille substrate 4.10.7 is closed, which can avoid the adverse effects caused by the impact of metal particles generated during the etching process on the upper heating unit 4.1. When all the grille plates 4.10.6 rotate to the vertical position, the substrate placed on the temperature-controlled anode plate 4.6.1 can be heated by the upper heating unit to remove the water vapor on the substrate.

[0090] Magnetron sputtering process unit:

[0091] The magnetron sputtering process unit includes a vacuum chamber D and the execution part of magnetron sputtering. The vacuum chamber D is externally connected with a vacuum pumping system, a gas supply system, a switching valve for breaking vacuum, etc. through reserved interfaces. The execution part of magnetron sputtering includes a sputtering device, a substrate holder system, and a gas supply device.

[0092] The vacuum chamber D adopts a cylindrical chamber structure and is composed of a lower chamber 5.4 and an upper cover 5.3. The lower chamber 5.4 is installed on the frame. A substrate inlet / outlet F5.5 is arranged on the side of the lower chamber 5.4. The substrate inlet / outlet F is hermetically connected to the corresponding substrate inlet / outlet D on the vacuum chamber B through a gate valve. In addition, a transparent observation window D5.12 is also arranged on the side wall of the lower chamber 5.4, which is convenient for observing the situation inside the chamber during sputtering. The upper cover 5.3 is hermetically buckled on the upper end of the lower chamber 5.4, and a closed sputtering process chamber is formed inside. A cathode mounting flange is arranged on the upper cover 5.3 or a plurality of cathode mounting flanges are arranged circumferentially centered on the center of the upper cover 5.3. A magnetron cathode 5.1 can be installed at each cathode mounting flange.

[0093] The vacuum pumping system includes a condensation pump 5.10, a primary vacuum pump, a fully automatic gate valve, a bypass vacuum valve, and an inflation valve. The condensation pump is connected to a flange interface reserved on the side wall of the lower chamber 5.4 through a fully automatic gate valve. The primary vacuum pump is connected to a flange interface reserved on the side wall of the lower chamber 5.4 through a bypass vacuum valve. The inflation valve is connected to the interface position reserved on the side wall of the lower chamber 5.4.

[0094] The capacitance vacuum gauge is installed at the angle valve 5.6 on the side wall of the lower chamber 5.4 to monitor the vacuum degree of the chamber during the sputtering process.

[0095] The sputtering device includes a magnetron cathode 5.1, a target 5.13, and a sputtering power supply. A target 5.13 is installed at the lower end of each group of magnetron cathodes 5.1 by means of a fixture or bonding. Each group of magnetron cathodes 5.1 is electrically connected to the sputtering power supply, and the sputtering power supply can be DC, RF, etc. The magnetron device of the magnetron cathode 5.1 can adopt a permanent magnet system and can also adopt an electromagnetic coil system. The outer shell flanges of multiple groups of magnetron cathodes 5.1 are fixedly connected to the multiple cathode mounting flanges on the upper cover 5.3 through screws.

[0096] The substrate holder system is a magnetron anode, including a substrate tray 5.14, a substrate holder 5.23, and a driving mechanism for the movement of the substrate tray and the substrate holder. Among them, a self-rotating shaft is fixedly installed at the center of the lower end of the substrate tray 5.14. The substrate holder 5.23 is a disc-shaped holder, which is coaxially arranged in the lower cavity 5.4. The center of the substrate holder 5.23 is coaxially and drivingly connected to the upper end of the common rotating shaft 5.29. An installation through-hole is eccentrically arranged on the substrate holder 5.23 or a plurality of installation through-holes are arranged along the circumferential direction with the center of the substrate holder 5.23 as the center. A self-rotating bearing seat is installed in each installation through-hole. A self-rotating shaft of a substrate tray 5.14 is rotatably matched with each self-rotating bearing seat through a bearing. The driving mechanism for the movement of the substrate tray and the substrate holder is a compound movement driving mechanism, which is used to drive the substrate holder 5.23 to drive a plurality of substrate trays 5.14 to rotate around the center of the common rotating shaft 5.29, and at the same time drive each substrate tray 5.14 to rotate around the center of its own self-rotating shaft. Specifically, it includes a common rotation driving motor 5.8, a self-rotation driving motor 5.7, a central gear 5.25, and a planetary gear 5.26. A plurality of planetary gears 5.26 are respectively fixed to the lower ends of a plurality of self-rotating shafts. The central gear 5.25 is coaxially fixedly connected with an upper bearing seat 5.24, and the upper bearing seat 5.24 is positioned and installed in the central hole at the bottom of the lower cavity 5.4. The central gear 5.25 meshes with a plurality of planetary gears 5.26. A lower bearing seat 5.27 is fixedly installed at the lower end of the lower cavity 5.4. The lower bearing seat 5.27 and the upper bearing seat 5.24 are coaxially arranged. A shaft sleeve 5.28 limited up and down is penetrated in the central holes of the upper bearing seat 5.24 and the lower bearing seat 5.27. The shaft sleeve 5.28 is rotatably connected with the lower bearing seat 5.27 through a bearing. The upper end of the shaft sleeve 5.28 is key-connected to the central hole of the upper bearing seat 5.24. A first driven wheel 5.18 is fixedly installed below the lower bearing seat 5.27 on the shaft sleeve 5.28. The first driven wheel 5.18 is connected to a first driving wheel 5.17 through a synchronous belt or gear meshing. The first driving wheel 5.17 is fixedly installed at the output end of the self-rotation driving motor 5.7, and the self-rotation driving motor 5.7 is fixed below the lower cavity 5.4 through a motor bracket.

[0097] The common rotating shaft 5.29 is inserted into the bushing 5.28 with a clearance, and its upper end is rotatably connected to the upper bearing seat 5.24 through a bearing. A second driven wheel 5.21 is fixed at a position near the lower end of the common rotating shaft 5.29. The second driven wheel 5.21 is connected to the second driving wheel 5.20 through a synchronous belt or gear meshing. The second driving wheel 5.20 is fixedly installed at the output end of the revolution driving motor 5.8. In addition, in order to detect the revolution speed and rotation speed, an encoder 5.19 is fixedly installed at the lower end of the common rotating shaft 5.29. In addition, a magnetic fluid seal 5.22 is also installed above the position where the second driven wheel 5.21 is installed on the common rotating shaft 5.29. The upper end of the magnetic fluid seal 5.22 forms an inserted positioning fit with the lower end of the bushing 5.28. The function of the magnetic fluid seal 5.22 is to maintain a high vacuum environment in the cavity.

[0098] The above-mentioned substrate holder 5.23 can rotate around the axis of the common rotating shaft 5.29 under the magnetron cathode 5.1 in a continuous or scanning (back and forth) manner, and the speed can reach 5 RPM, and it can be quickly accelerated to a certain uniform speed; while the substrate tray 5.14 can rotate around the center of its respective self-rotating shaft, and the rotation speed can reach 30 RPM. The position of the substrate tray 5.14 can deviate from the center of the magnetron cathode 5.1 to obtain better uniformity.

[0099] The lower cavity 5.4 is grounded through a cable.

[0100] In addition, a shielding cover B5.16 is installed above the substrate holder 5.23 in the vacuum chamber D through a support column. Through holes for the substrate tray 5.14 to extend upward are provided at positions corresponding to each substrate tray 5.14 on the shielding cover B5.16. Baffles 5.15 are provided at positions between two adjacent substrate trays 5.14 at the upper end of the shielding cover B5.16. The multiple baffles 5.15 intersect at the center. The settings of the shielding cover B5.16 and the baffles 5.15 can reduce cross-infection between different magnetron cathodes 5.1.

[0101] The gas supply system includes a flow meter, a stop valve, a gas supply pipeline, etc. A gas supply interface is installed at the bottom of the lower cavity 5.4, and Ar, N2, O2, etc. can be introduced according to actual needs. The gas supply pipeline adopts a stainless steel electro-polished pipeline and is equipped with a stop valve and a VCR interface.

[0102] In the above structure, to facilitate the replacement of the target 5.13 and the shielding cover B5.16, an upper cover automatic lifting mechanism is further included. The upper cover automatic lifting mechanism includes an electric cylinder B5.9, a guide seat 5.11, and an upper cover connecting frame. The electric cylinder B5.9 is vertically fixed on the lower frame, and a plurality of guide seats 5.11 are fixed on the outer side wall of the lower cavity 5.4 in the vertical direction. The upper cover connecting frame is fixed to the upper end of the upper cover 5.3. The cylinder rod of the electric cylinder B5.9 passes through the guide holes on the two cylinder rod guide seats 5.11, and its upper end is connected to the upper cover connecting frame.

[0103] In the above structure, to adjust the distance between the target 5.13 and the substrate to further optimize the coating uniformity and deposition rate, a distance adjustment pressure ring 5.2 is installed below the housing flange of the magnetron cathode 5.1. By adjusting the number of distance adjustment rings, the installation height of the magnetron cathode 5.1 is adjusted, thereby realizing the adjustment of the distance between the target 5.13 and the substrate. In the present invention, the distance between the target 5.13 and the substrate can be adjusted between 30 - 80 mm.

[0104] The working process of coating the substrate in the present invention is as follows:

[0105] 1. Establish the preconditions for the coating work: The pre-vacuum unit, the transfer unit, the pre-treatment unit, and the magnetron sputtering process unit are brought into a high-vacuum state through an external vacuum pumping system.

[0106] 2. Load the substrate: Open the exhaust switch valve at the lower end of the vacuum chamber B to make the vacuum chamber B perform an automatic vacuum-breaking operation first to restore it to the atmospheric environment. Then open the front chamber door of the vacuum chamber A, place multiple substrates directly or through the disk body 6 on the multi-layer carriers of the substrate carrier, and then close the chamber door. Then start the vacuum pumping system to make the vacuum chamber A and the vacuum chamber B return to the high-vacuum state. During this process, the vacuum chamber A and the vacuum chamber B remain connected, and the two chambers finally reach the same vacuum degree.

[0107] 3. Self-check the substrate in the vacuum chamber A: According to the program settings, the electric cylinder A supporting the substrate carrier moves to raise the substrate carrier. On the left and right side walls of the vacuum chamber A, a transmissive laser photoelectric switch emitter and a receiver are relatively installed. Through the signals of the emitter and the receiver, the transmissive photoelectric sensor detects whether there is a substrate on the substrate carrier at the set height position to confirm the substrate state of the pre-vacuum chamber unit in the fully automatic process flow.

[0108] 4. Transfer the substrate in the pre-vacuum unit to the pre-treatment unit: The lifting drive cylinder of the transfer unit operates, causing the rotation drive cylinder, arm telescopic drive cylinder, hollow transmission shaft, central shaft, lower magnetic fluid vacuum-sealed transmission device, upper magnetic fluid vacuum-sealed transmission device, two groups of robotic arms, and end effector to move as a whole to the lower working position; then, through the operation of the rotation drive cylinder, the telescopic robotic arm rotates to a position aligned with the substrate inlet / outlet B of the transfer unit; then, through the operation of the arm telescopic drive cylinder, the left and right bending arms unfold, driving the end effector to extend into the vacuum chamber A through the substrate inlet / outlet A of the pre-vacuum unit; then, through the operation of the lifting drive cylinder, the telescopic robotic arm moves to the upper working position, and the substrate or the disk 6 carrying the substrate is held by the fork of the end effector; then, through the arm telescopic drive cylinder, the left and right bending arms retract and fold; then, through the operation of the rotation drive cylinder, the telescopic robotic arm drives the substrate tray or the substrate to rotate to a position aligned with the substrate inlet / outlet C of the vacuum chamber B; at this time, the gate valve at this position has been opened; then, through the operation of the arm telescopic drive cylinder, the left and right bending arms unfold, driving the end effector to extend into the vacuum chamber C through the substrate inlet / outlet E of the pre-treatment unit; through the operation of the lifting drive cylinder, the telescopic robotic arm moves to the lower working position, and the substrate or the disk 6 carrying the substrate is placed on the support surface of the temperature-controlled anode plate; then, through the arm telescopic drive cylinder, the left and right bending arms retract and fold; then, the gate valve at the substrate inlet / outlet E of the vacuum chamber C is closed.

[0109] 5. Degas and etch the substrate: Turn on the upper heating unit to degas the substrate. After the degassing is completed within the set time, turn off the upper heating unit; then, input argon into the vacuum chamber C. When the pressure in the vacuum chamber C reaches the set stable state, start the RF power source. Under the action of the RF electric field, argon is ionized to generate argon ions and electrons. The argon ions obtain energy after being accelerated by the electric field and bombard the surface of the substrate, removing the material on the surface of the substrate through physical sputtering, thereby achieving the effect of etching treatment. During the etching process, according to specific process requirements, a cooling or heating medium (such as water) can be introduced through the temperature-controlled medium input pipe to adjust the temperature of the substrate, and the heat-exchanged medium is output through the temperature-controlled medium output pipe. Additionally, the substrate can also be heated by the upper heating unit. During this heating process, the pneumatic grid needs to be turned on and the input of argon needs to be paused.

[0110] 6. Transfer the preprocessed substrate to the magnetron sputtering process unit: First, open the gate valve at the substrate inlet / outlet E of the vacuum chamber C. Through the action of the arm telescopic drive cylinder, expand the left and right bending arms, drive the end effector to extend into the vacuum chamber C through the substrate inlet / outlet E of the pretreatment unit, hold the preprocessed substrate, and then lift the substrate from the support surface of the temperature-controlled anode plate through the lifting drive cylinder. Then, the arm telescopic drive cylinder acts to retract and fold the left and right bending arms. Then, through the rotation drive cylinder, rotate the telescopic robotic arm to a position aligned with the substrate inlet / outlet D of the transfer unit. At this time, the gate valve at the substrate inlet / outlet F of the magnetron sputtering process unit has been opened, and at the same time, the gate valve at the substrate inlet / outlet E of the pretreatment unit has been closed. Then, the arm telescopic drive cylinder is used to expand the left and right bending arms, drive the end effector to extend into the vacuum chamber D through the substrate inlet / outlet F of the magnetron sputtering process unit. Then, the lifting drive cylinder acts to move the telescopic robotic arm to the lower working position, place the substrate or the disk 6 carrying the substrate on the substrate tray. Then, through the arm telescopic drive cylinder, retract and fold the left and right bending arms. Close the gate valve at the substrate inlet / outlet F of the vacuum chamber D.

[0111] 7. Perform magnetron sputtering coating on the surface of the substrate: Turn on the gas supply system of the magnetron sputtering process unit, introduce the gas medium for sputtering. When the set gas flow rate is reached, energize the magnetron cathode, and turn on the rotation drive motor and revolution drive motor of the substrate holder to complete the coating while the substrate is in a state of revolution and rotation.

[0112] 8. Return the coated substrate to the pre-vacuum unit: After the substrate coating is completed, open the gate valve at the substrate inlet / outlet F of the vacuum chamber D. Through the cooperation of the telescopic movement, rotational movement and lifting movement of the telescopic robotic arm, send the coated substrate to the initial placement position of the substrate carrier in the pre-vacuum unit, and close the gate valve at the substrate inlet / outlet F of the vacuum chamber D.

[0113] 9. Unload the substrate: When the substrate is placed on the substrate carrier, the robotic arm returns to its original position. The vacuum chamber A performs an automatic vacuum-breaking operation to restore it to the atmospheric environment. Open the front chamber door of the vacuum chamber A, take out the substrate or the disk 6 placed on the substrate carrier, and then close the chamber door. Start the vacuum pumping system to restore the vacuum chamber A to a high vacuum state. During this process, the vacuum chamber A remains connected to the vacuum chamber B, and the two chambers finally reach the same vacuum degree, thus completing the entire substrate coating process.

[0114] Although embodiments and drawings of the present invention are disclosed for illustrative purposes, those skilled in the art can understand that various substitutions, changes, and modifications are possible without departing from the spirit of the present invention and the appended claims. Therefore, the scope of the present invention is not limited to the content disclosed in the embodiments and drawings.

Claims

1. A substrate magnetron sputtering coating production device, comprising a frame (1), a pre-vacuum unit (2), a transmission unit (3), a pre-treatment unit (4), and a magnetron sputtering process unit (5); the pre-vacuum unit (2), the transmission unit (3), the pre-treatment unit (4), and the magnetron sputtering process unit (5) are integrally installed on the frame (1); the pre-vacuum unit (2), the pre-treatment unit (4), and the magnetron sputtering process unit (5) are arranged at three positions outside the transmission unit (3); the transmission unit (3) is respectively connected to the substrate inlet / outlet A (2.9) of the pre-vacuum unit (2), the substrate inlet / outlet E of the pre-treatment unit (4), and the substrate inlet / outlet F (5.5) of the magnetron sputtering process unit (5) through the substrate inlet / outlet B, the substrate inlet / outlet C, and the substrate inlet / outlet D, and gate valves (3.3) are respectively arranged at the connection with the pre-treatment unit (4) and the connection with the magnetron sputtering process unit (5). The pre-vacuum unit (2) includes a vacuum chamber A (2.1) and a liftable substrate carrier placed in the vacuum chamber A (2.1) for realizing multi-layer loading of substrates; the transmission unit (3) includes a vacuum chamber B (3.1) and a transmission actuator (3.2), and the transmission actuator (3.2) adopts a robotic arm that can realize three composite motions of lifting, rotating, and telescoping, and is used for transmitting substrates among the pre-vacuum unit (2), the pre-treatment unit (4), and the magnetron sputtering process unit (5); the pre-treatment unit (4) includes a vacuum chamber C (4.2) and a pre-treatment actuator; the pre-treatment actuator includes an upper heating unit (4.1), a substrate carrier unit (4.6), and a radio frequency power unit, and is used for removing moisture on the substrate and etching the substrate surface; the magnetron sputtering process unit (5) includes a vacuum chamber D and the execution part of magnetron sputtering; the execution part of magnetron sputtering includes a sputtering device, a substrate holder system, and a gas supply device, and the sputtering device and the substrate holder system are arranged opposite to each other up and down, and are used for realizing sputtering coating of the substrate in a state of revolving around the central axis of the substrate holder system and rotating around its own central axis.

2. The substrate magnetron sputtering coating production equipment according to claim 1, wherein: On the front of the vacuum chamber A (2.1), a lockable and sealable chamber door (2.2) is connected. On the back of the vacuum chamber A (2.1), a substrate inlet / outlet A (2.9) is provided. The substrate carrier is a three-dimensional frame (2.10) with upper and lower multiple layers of platforms (2.10.1) separated by spacer columns. At the center of the upper end of each layer of platform (2.10.1), a positioning boss is provided to achieve the positioning and support of the disk body carrying the substrate. The lower end of the substrate carrier is connected to a push rod, and the push rod passes through a rod hole provided at the lower end of the vacuum chamber A (2.1). Outside the push rod at the lower end of the vacuum chamber A (2.1), a flange bellows (2.6) is provided. The lower end of the push rod is connected to the push rod of an electric cylinder A (2.8) provided below the vacuum chamber A (2.1). The electric cylinder A (2.8) is fixed on a cylinder frame (2.7) below the vacuum chamber A (2.1). On the left and right side walls of the vacuum chamber A (2.1), a transmissive laser photoelectric switch emitter (2.4) and a transmissive laser photoelectric switch receiver (2.5) are oppositely installed, and the two form a transmissive photoelectric sensor.

3. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: The vacuum chamber B (3.1) adopts a square box structure, including a main chamber (3.1.1) and an upper chamber cover (3.1.2). On three sides of the main chamber (3.1.1), there are substrate inlets / outlets, namely substrate inlet / outlet B, substrate inlet / outlet C, and substrate inlet / outlet D. The substrate inlet / outlet B is directly connected to the substrate inlet / outlet A of the pre-vacuum unit. The substrate inlet / outlet C is hermetically connected to the substrate inlet / outlet E on the vacuum chamber C (4.2) of the pretreatment unit (4) through a gate valve (3.3). The substrate inlet / outlet D is hermetically connected to the substrate inlet / outlet F (5.5) on the vacuum chamber D of the magnetron sputtering process unit (5) through a gate valve (3.3), so that the four vacuum chambers are connected into an integral vacuum chamber structure with gates in the middle. The upper chamber cover (3.1.2) adopts a circular chamber cover. At the upper end of the main chamber (3.1.1), a positioning round hole is provided. The lower end of the upper chamber cover (3.1.2) is hermetically fitted with the positioning round hole, and the two are coaxially arranged and fixedly connected. At the center of the upper chamber cover (3.1.2), an observation window B (3.5) is provided. On the upper chamber cover (3.1.2), two flange interfaces (3.4) are also reserved for connecting to an external vacuum pumping system and a vacuum degree detection device. Two groups of transmissive photoelectric sensors (3.6) are installed in a matching manner on the upper chamber cover (3.1.2) and the main chamber (3.1.1). The two groups of transmissive photoelectric sensors (3.6) are respectively installed at positions close to the substrate inlet / outlet C and close to the substrate inlet / outlet D.

4. The substrate magnetron sputtering coating production equipment according to claim 3, characterized in that: The transmission execution mechanism (3.2) further includes a telescopic robotic arm, a lifting drive cylinder (3.2.5), a rotary drive cylinder (3.2.16), an arm telescopic drive cylinder (3.2.14), a hollow transmission shaft (3.2.30), a central shaft (3.2.31), a transmission unit frame, a lower magnetorheological fluid vacuum sealing transmission device (3.2.21), an upper magnetorheological fluid vacuum sealing transmission device (3.2.22), and a bearing seat (3.2.24); the end of the robotic arm is in the shape of a fork; The transmission unit frame includes a top plate (3.2.3), a bottom base (3.2.17), and multiple fixed struts connecting the top plate (3.2.3) and the bottom base (3.2.17); The lifting drive cylinder (3.2.5) is vertically fixed below the bottom base (3.2.17), and the upper cylinder rod end of the lifting drive cylinder (3.2.5) is fixedly connected to the lower end of the cylinder body of the rotary drive cylinder (3.2.16) through a lifting flange (3.2.32); The upper cylinder rod end of the rotary drive cylinder (3.2.16) is fixedly connected with a lower slewing base (3.2.15), the arm telescopic drive cylinder (3.2.14) is fixed to the upper end of the lower slewing base (3.2.15), an upper slewing base (3.2.12) is arranged above the arm telescopic drive cylinder (3.2.14), and the upper slewing base (3.2.12) and the lower slewing base (3.2.15) are fixedly connected into one body through multiple circumferentially arranged slewing struts (3.2.13); the hollow transmission shaft (3.2.30) is fixedly connected coaxially with the lower magnetorheological fluid vacuum sealing transmission device (3.2.21) up and down, and the lower flange part of the hollow transmission shaft (3.2.30) is fixedly connected coaxially with the upper slewing base (3.2.12); A guide disk (3.2.23) is arranged above the upper slewing base (3.2.12), and the guide disk (3.2.23) forms a vertical guiding fit with multiple upper guide posts (3.2.8) vertically fixed to the lower end of the top plate (3.2.3) through multiple guide holes; the upper magnetorheological fluid vacuum sealing transmission device (3.2.22) is coaxially fixedly installed below the guide disk (3.2.23), and the bearing seat (3.2.24) is coaxially fixedly installed above the guide disk (3.2.23); a transition flange (3.2.25) is coaxially installed at the upper end of the bearing seat (3.2.24) through an end face bearing, and a rotary base (3.2.6) is coaxially positioned and installed at the upper end of the transition flange (3.2.25); The hollow transmission shaft (3.2.30) is successively sleeved and fitted with the upper magnetic fluid vacuum sealing transmission device (3.2.22) and the bearing seat (3.2.24) from bottom to top, and the upper end of the hollow transmission shaft (3.2.30) is fixedly connected to the transition flange (3.2.25); the lower end of the central shaft (3.2.31) is coaxially and fixedly connected to the output shaft of the arm telescopic driving cylinder (3.2.14), and the central shaft (3.2.31) is successively sleeved and fitted with the lower magnetic fluid vacuum sealing transmission device (3.2.21), the hollow transmission shaft (3.2.30), and the transition flange (3.2.25) upward. The part of the central shaft (3.2.31) near the upper end is rotationally fitted with the central hole of the rotating base (3.2.6) through a bearing; the upper end of the central shaft (3.2.31) is connected to the head end of the telescopic robotic arm; A corrugated pipe (3.2.26) is further arranged outside the bearing seat (3.2.24). The upper part of the corrugated pipe (3.2.26) is welded to the top plate (3.2.3), and the lower part of the corrugated pipe (3.2.26) is welded to the upper part of the guiding plate (3.2.23); The telescopic robotic arm is composed of two groups of robotic arms (3.2.2) and an end effector (3.2.1); one group of robotic arms (3.2.2) is composed of a first linear robotic arm (3.2.2.1) and a left bending arm (3.2.2.2). One end of the first linear robotic arm (3.2.2.1) is connected to one end of the left bending arm (3.2.2.2) through a rotating pair. The other group of robotic arms (3.2.2) is composed of a second linear robotic arm (3.2.2.3) and a right bending arm (3.2.2.4). One end of the second linear robotic arm (3.2.2.3) is connected to one end of the right bending arm (3.2.2.4) through a rotating pair; the end effector (3.2.1) adopts a fork structure, and the other ends of the left bending arm (3.2.2.2) and the right bending arm (3.2.2.4) are both fixedly connected to the fork handle part of the end effector (3.2.1); The upper end of the central shaft (3.2.31) is fixedly connected to the other end of one of the linear robotic arms, and a driving gear (3.2.29) is installed; a pin shaft hole is arranged on one side of the central hole of the rotating base (3.2.6). A pin shaft (3.2.27) is rotatably installed in the pin shaft hole through a bearing. The upper end of the pin shaft (3.2.27) is fixedly connected to the other end of the other linear robotic arm, and a driven gear (3.2.28) is installed. The driven gear (3.2.28) meshes with the driving gear (3.2.29); 5. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: The upper end of the vacuum chamber C (4.2) is hermetically fitted with the upper heating unit (4.1), and the lower end of the vacuum chamber C (4.2) is hermetically connected to the substrate carrying unit (4.6), forming a pretreatment chamber inside. Heating tubes are arranged at the lower end part of the upper heating unit (4.1) located inside the pretreatment chamber; The substrate carrier unit (4.6) includes an anode flange, a shielding cover A (4.6.4), a temperature-controlled anode plate (4.6.1), a ceramic circuit breaker (4.6.3), a high-temperature-resistant insulating plug (4.6.2), an insulating sleeve (4.6.7), a temperature-controlled medium input pipe (4.6.9), and a temperature-controlled medium output pipe (4.6.8); the anode flange is arranged at the lower end of the vacuum chamber C (4.2) and is fixedly connected to the vacuum chamber C (4.2); the shielding cover A (4.6.4) is a cylindrical shielding cover with a frustum at the upper end and a flange at the lower end, and the lower flange of the shielding cover A (4.6.4) is fixedly connected to the upper end of the anode flange; the ceramic circuit breaker (4.6.3) is placed inside the inner hole of the shielding cover A (4.6.4), and the lower end of the ceramic circuit breaker (4.6.3) is fixedly connected to the upper end of the anode flange; the lower end of the temperature-controlled anode plate (4.6.1) is fixedly connected to the upper end of the ceramic circuit breaker (4.6.3), and the upper part of the temperature-controlled anode plate (4.6.1) extends out from the upper end of the frustum of the shielding cover A (4.6.4), and its upper end forms a support surface for the substrate tray or the substrate, and evenly distributed medium flow channels are made inside the upper part of the temperature-controlled anode plate (4.6.1). A high-temperature-resistant insulating plug (4.6.2) is installed in the upper part of the inner hole of the ceramic circuit breaker (4.6.3), and an insulating sleeve (4.6.7) is fixed at the lower part; the temperature-controlled medium input pipe (4.6.9) and the temperature-controlled medium output pipe (4.6.8) pass through the pipe holes in the high-temperature-resistant insulating plug ( 4.6.2) and the inner hole of the insulating sleeve (4.6.7) up and down. The upper ends of the two pipes are fixedly connected to the temperature-controlled anode plate (4.6.1) and are communicated with the built-in medium flow channels. The lower ends of the two pipes extend below the anode flange. The lower end of the temperature-controlled medium input pipe (4.6.9) forms a medium inlet, and the lower end of the temperature-controlled medium output pipe (4.6.8) forms a medium return port, and is connected to an externally provided medium supply device through the medium inlet and the medium return port; The RF power unit includes an RF protection box (4.8) and an RF matcher (4.9). The RF protection box (4.8) is fixed below the anode flange through a housing flange (4.6.6), so that the temperature-controlled medium input pipe (4.6.9) and the temperature-controlled medium output pipe (4.6.8) are located inside the RF protection box (4.8). The RF matcher (4.9) is installed outside the RF protection box (4.8), and the output line of the RF matcher (4.9) is electrically connected to the temperature-controlled medium input pipe (4.6.9) and the temperature-controlled medium output pipe (4.6.8) through a power transmission fixture (4.7).

6. The substrate magnetron sputtering coating production equipment according to claim 5, characterized in that: The preprocessing actuator further includes a pneumatic grille (4.10), and the pneumatic grille (4.10) is arranged in the vacuum chamber C (4.2) between the lower part of the upper heating unit (4.1) and the upper part of the temperature-controlled anode plate (4.6.1); the pneumatic grille (4.10) includes a grille substrate (4.10.7), grille plates (4.10.6), a swing cylinder (4.10.1) and a rigid connecting piece (4.10.2); the grille substrate (4.10.7) is fixed under the upper heating unit (4.1) by multiple support columns B, and a square opening is arranged in the middle of the grille substrate (4.10.7); on both sides of the square opening at the upper end of the grille substrate (4.10.7), a fixed seat (4.10.5) is respectively fixed, and a sliding seat (4.10.4) is slidably arranged above the two fixed seats (4.10.5); a plurality of grille plates (4.10.6) are arranged in parallel in the square opening in sequence, and the lower parts of both ends of each grille plate (4.10.6) are rotatably connected to the two fixed seats (4.10.5) on both sides through lower rotating shafts, and the upper parts of both ends of each grille plate (4.10.6) are rotatably connected to the two sliding seats (4.10.4) on both sides through upper rotating shafts; a rigid connecting piece (4.10.2) is arranged outside one sliding seat (4.10.4), one end of the rigid connecting piece (4.10.2) is fixedly connected with one end of a fork-shaped pin (4.10.3) in an inserted manner, the other end of the fork-shaped pin (4.10.3) is vertically rotatably connected with the outside of the corresponding sliding seat (4.10.4), and the two ends of the fork-shaped pin (4.10.3) are arranged in parallel; the other end of the rigid connecting piece (4.10.2) is connected with the output end of the swing cylinder (4.10.1); a rigid connecting piece (4.10.2) lead-out interface is arranged on the side wall of the vacuum chamber C (4.2), and the rigid connecting piece (4.10.2) forms a rotatable sealing fit with the rigid connecting piece (4.10.2) lead-out interface through mechanical sealing and bearings, and the swing cylinder (4.10.1) is fixed on a cylinder bracket outside the vacuum chamber C (4.2).

7. The substrate magnetron sputtering coating production equipment according to claim 1, characterized in that: The vacuum chamber D is composed of a lower chamber (5.4) and an upper cover (5.3), and the upper cover (5.3) is hermetically buckled on the upper end of the lower chamber (5.4) to form a closed sputtering process chamber inside; an interface for connecting an external vacuum pumping system and an air inlet interface for connecting a gas supply device are arranged on the side wall of the lower chamber (5.4); a substrate inlet / outlet F (5.5) is arranged on the side part of the lower chamber (5.4). The sputtering device includes a magnetron cathode (5.1), a target (5.13), and a sputtering power supply; the substrate holder system includes a substrate tray (5.14), a substrate support (5.23), and a driving mechanism for the movement of the substrate tray and the substrate support; there are a plurality of substrate trays (5.14), and the plurality of substrate trays (5.14) are arranged circumferentially with the center of the substrate support (5.23) as the center; the driving mechanism for the movement of the substrate tray and the substrate support is a composite motion driving mechanism for driving the substrate support (5.23) to drive the substrate tray (5.14) to rotate around the center of the common rotation axis (5.29) and at the same time driving each substrate tray (5.14) to rotate around the center of its own rotation axis. A cathode mounting flange is provided on the upper cover (5.3) or a plurality of cathode mounting flanges are arranged circumferentially with the center of the upper cover (5.3) as the center. A magnetron cathode (5.1) is installed at each cathode mounting flange. The target (5.13) is installed at the lower end of the magnetron cathode (5.1), and the sputtering power supply is connected to the magnetron cathode (5.1). The substrate tray (5.14) and the substrate support (5.23) are placed below the magnetron cathode (5.1) in the sputtering process chamber; the plurality of substrate trays (5.14) are eccentrically arranged with respect to the magnetron cathode (5.1) in the radial direction of the substrate support (5.23).

8. The substrate magnetron sputtering coating production equipment according to claim 7, characterized in that: The substrate support (5.23) is a disc-shaped support, the substrate support (5.23) is coaxially arranged in the lower cavity (5.4), the center of the substrate support (5.23) is coaxially driven to the upper end of the revolution axis (5.29), an eccentric mounting through hole is arranged on the substrate support (5.23) or a plurality of mounting through holes are arranged along the circumferential direction with the center of the substrate support (5.23) as the center, and a rotation bearing seat is installed in each mounting through hole; each rotation bearing seat is rotationally matched with the rotation axis of a substrate tray (5.14) through a bearing; the substrate tray and substrate support motion drive mechanism includes a revolution drive A motor (5.8), a self-rotating drive motor (5.7), a center wheel (5.25) and planetary wheels (5.26); a plurality of planetary wheels (5.26) are respectively fixed to the lower ends of a plurality of self-rotating shafts; the center wheel (5.25) is coaxially fixedly connected to an upper bearing seat (5.24); the upper bearing seat (5.24) is positioned and installed in a center hole at the bottom of the lower cavity (5.4); the center wheel (5.25) meshes with the plurality of planetary wheels (5.26); a lower bearing seat (5.27) is fixed at the lower end of the lower cavity (5.4); the lower bearing seat (5.27) is coaxial with the upper bearing seat (5.24) A shaft sleeve (5.28) with upper and lower limited positions is installed in the center hole of the upper bearing seat (5.24) and the center hole of the lower bearing seat (5.27); the shaft sleeve (5.28) is rotatably connected to the lower bearing seat (5.27) through a bearing; the upper end of the shaft sleeve (5.28) is connected to the center hole of the upper bearing seat (5.24) through a key; a first driven wheel (5.18) is fixed on the shaft sleeve (5.28) below the lower bearing seat (5.27); the first driven wheel (5.18) is connected to the first driving wheel (5.17) through a synchronous belt or tooth meshing; the first driving wheel (5.17) is fixed The self-rotation drive motor (5.7) is fixedly mounted at the output end of the self-rotation drive motor (5.7), and the self-rotation drive motor (5.7) is fixed below the lower cavity (5.4) through a motor bracket; the revolution shaft (5.29) is loosely mounted in the shaft sleeve (5.28), and its upper end is rotatably connected to the upper bearing seat (5.24) through a bearing; a second driven wheel (5.21) is fixed on the revolution shaft (5.29) at a position close to the lower end, and the second driven wheel (5.21) is connected to the second driving wheel (5.20) through a synchronous belt or gear meshing, and the second driving wheel (5.20) is fixedly mounted at the output end of the revolution drive motor (5.8).

9. The substrate magnetron sputtering coating production equipment according to claim 7, wherein: A shielding cover B (5.16) is installed above the substrate support (5.23) in the vacuum chamber D via a support column, and a through hole for the substrate tray (5.14) to extend upward is provided on the shielding cover B (5.16) at a position corresponding to each substrate tray (5.14); a baffle (5.15) is provided at an upper end of the shielding cover B (5.16) between two adjacent substrate trays (5.14), and a plurality of baffles (5.15) intersect at the center.

10. The substrate magnetron sputtering coating production equipment according to claim 7, characterized in that: One or more layer of spacing adjusting pressure rings (5.2) are installed under the housing flange of the magnetron cathode (5.1), and are connected to the cathode flange on the upper cover (5.3) through the spacing adjusting pressure rings (5.2).

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