An automatic PCB board drying equipment

Abstract

The present invention relates to the technical field of drying equipment, and in particular to an automated PCB board drying equipment. The equipment comprises: a drying equipment body; a controller, mounted on the drying equipment body; a mounting rod, symmetrically connected to the inner wall of the drying equipment body; a fixed frame, symmetrically connected to the mounting rod, and the front of the four sides of the fixed frame, including upper, lower, left, and right, are all separated by first ventilation holes; a first fan, mounted on the inner rear side of the fixed frame; a placement frame, placed on the inner front side of the fixed frame, and the placement frame is separated by second ventilation holes corresponding one-to-one to the first ventilation holes. The present invention can effectively separate multiple PCB boards and keep them in a vertical state by using the fixed frame in conjunction with the placement frame, and the second ventilation holes on the placement frame correspond one-to-one to the first ventilation holes on the fixed frame, ensuring that hot air can flow smoothly through the surface of each PCB board, thereby avoiding the problems of poor hot air circulation and uneven heat distribution caused by the traditional stacking method.

Description

Technical Field

[0001] The present invention relates to the technical field of drying equipment, and in particular to an automatic PCB board drying equipment. Background Art

[0002] In the electronics manufacturing industry, drying is a crucial step in the production of printed circuit boards (PCBs). After wet processes such as cleaning, electroplating, or coating, moisture or chemical solvents will remain on the surface and in the holes of the PCB. Failure to thoroughly dry the PCB can lead to oxidation, corrosion, or poor soldering in subsequent processes, seriously affecting product reliability and service life. Therefore, the performance of the drying equipment directly determines the final quality of the PCB.

[0003] Currently, existing drying equipment typically stacks PCBs inside the drying machine. Large areas of obstruction between adjacent PCBs hinder hot air circulation and uneven heat distribution, resulting in inadequate drying of some areas, impacting overall drying efficiency. Furthermore, PCBs are often designed with numerous micro-holes (such as through-holes, blind vias, or buried vias). These holes are small in diameter (perhaps less than 0.1 mm), and their inner walls also require thorough drying. However, in existing drying equipment, hot air struggles to effectively penetrate these small holes, preventing any residual moisture from fully evaporating. This creates dead zones and results in poor drying efficiency. Summary of the Invention

[0004] In view of this, the present invention provides an automated PCB board drying device that can overcome the shortcomings of existing drying equipment in that, when in use, stacked PCB boards will cause poor hot air circulation and uneven heat distribution, and hot air has difficulty effectively penetrating the micropores on the PCB boards, which affects the overall drying effect.

[0005] The technical implementation scheme of the present invention is: an automated PCB board drying device, comprising: a drying device body; a controller, mounted on the drying device body; a mounting rod, symmetrically connected to the inner wall of the drying device body; a fixed frame, symmetrically connected to the mounting rod, and the front portions of the upper, lower, left, and right sides of the fixed frame are all spaced apart with first ventilation holes; a first fan, mounted on the inner rear side of the fixed frame; a placement frame, placed on the inner front side of the fixed frame, and the placement frame is spaced apart with second ventilation holes corresponding one-to-one to the first ventilation holes, and the placement frame is also spaced apart with placement slots for placing PCB boards; a dehumidification component, arranged on the drying device body, for removing moisture from the drying device body; and a shielding component, arranged on the fixed frame, for shielding the first ventilation holes.

[0006] More preferably, the dehumidification component includes: a dehumidifier installed on the top of the drying equipment body; and a humidity sensor installed on the inner wall of the drying equipment body.

[0007] More preferably, the shielding assembly includes: a connecting rod, symmetrically connected to the outer wall of the fixed frame; a first electric push rod, installed on the connecting rod; a shielding frame, slidably connected to the outer wall of the fixed frame; a connecting plate, symmetrically connected to both sides of the shielding frame, and the connecting plate is connected to the telescopic rod of the first electric push rod.

[0008] More preferably, it also includes: a fixed column, symmetrically connected to the inner top of the drying equipment body; a second electric push rod, installed on the fixed column; a lifting frame, connected to the telescopic rod of the second electric push rod; and a limit plate, spaced apart and connected to the bottom of the lifting frame.

[0009] More preferably, the system further comprises: a mounting plate symmetrically connected to the bottom of the mounting rod on the lower side; and a second fan mounted on the mounting plate.

[0010] More preferably, it also includes: a placement plate, symmetrically connected to the side of the mounting rod on the lower side; a sliding push frame, symmetrically slidingly connected to both sides of the placement plate; a third electric push rod, symmetrically installed at the bottom of the placement plate, and the telescopic rod of the third electric push rod is connected to the sliding push frame.

[0011] More preferably, it further comprises: fixing springs connected to the inner wall of the placement groove at symmetrical intervals.

[0012] More preferably, the device further comprises a buffer sponge connected to the inner bottom of the placement groove.

[0013] Compared with the prior art, the present invention has the following advantages: 1. The present invention can effectively separate multiple PCB boards and maintain them in a vertical state by using a fixed frame and a placement frame in combination. The second ventilation holes on the placement frame correspond one-to-one with the first ventilation holes on the fixed frame, ensuring that hot air can flow smoothly through the surface of each PCB board, avoiding the problems of poor hot air circulation and uneven heat distribution caused by traditional stacking methods.

[0014] 2. The present invention uses the function of the shielding component to timely close the first ventilation hole of the fixed frame during the drying process. Then, with the cooperation of the first fan, the hot air in the drying equipment body will be forced to pass through the micropores on the PCB board, ensuring that the inner wall of the micropores can also be fully dried, solving the problem of the existing technology that it is difficult to effectively penetrate the small holes for thorough drying, and greatly improving the overall drying quality.

[0015] 3. During the cooling process of the PCB boards, the controller can control the second electric push rod to drive the lifting frame and the limit plate to descend, so that the limit plates are accurately positioned on the front and back sides of each PCB board to prevent them from deforming during temperature changes. This design not only improves the quality stability of the final product, but also reduces the risk of product damage due to improper cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the specific structure inside the drying equipment body of the present invention.

[0018] Figure 3 This is a schematic diagram of the installation of the fixing frame, the first fan and the placement frame of the present invention.

[0019] Figure 4 It is a schematic diagram of the specific structure of the placement frame of the present invention.

[0020] Figure 5 The figure is a schematic diagram of the installation of the connecting rod, the first electric push rod, the shielding frame and the connecting plate of the present invention.

[0021] Figure 6 This is a schematic diagram of the installation of the fixed column, the second electric push rod, the lifting frame and the limiting plate of the present invention.

[0022] Figure 7 This is a schematic diagram of the installation of the mounting plate, the second fan, the placement plate and the sliding push frame of the present invention.

[0023] Figure 8 This is a schematic diagram of the installation of the fixed spring piece and the buffer sponge of the present invention.

[0024] The parts in the accompanying drawings are marked as follows: 1-drying equipment body, 101-controller, 2-mounting rod, 3-fixing frame, 301-first ventilation hole, 4-first fan, 5-placement frame, 501-second ventilation hole, 502-placement slot, 6-dehumidifier, 7-humidity sensor, 8-connecting rod, 9-first electric push rod, 10-shielding frame, 11-connecting plate, 12-fixing column, 13-second electric push rod, 14-lifting frame, 15-limiting plate, 17-mounting plate, 18-second fan, 19-placement plate, 20-sliding push frame, 21-third electric push rod, 22-fixed spring, 23-buffer sponge. DETAILED DESCRIPTION

[0025] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0027] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0028] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] Example: An automated PCB board drying device, such as Figure 1-Figure 5 As shown, it includes a drying device body 1, a controller 101, a mounting rod 2, a fixing frame 3, a first fan 4, a placement frame 5, a dehumidification component and a shielding component. The controller 101 is installed on the front side of the door panel of the drying device body 1. Four mounting rods 2 are symmetrically connected to the inner wall of the drying device body 1. Two fixing frames 3 are connected between the four mounting rods 2. The two fixing frames 3 are symmetrically arranged, and a plurality of first ventilation holes 301 are spaced apart on the upper, lower, left and right front parts of the two fixing frames 3. The front and rear sides of the fixing frames 3 are both open-type designs. The inner rear sides of the two fixing frames 3 are both installed with The first fan 4, a placement frame 5 is placed on the inner front side of the two fixed frames 3, and the two placement frames 5 are spaced apart with second ventilation holes 501, the second ventilation holes 501 correspond to the first ventilation holes 301 one by one and remain connected, and multiple placement slots 502 are spaced apart on the two placement frames 5, and multiple PCB boards can be placed in each placement slot 502 respectively, so that the multiple PCB boards can be separated, and a dehumidification component for removing moisture from the drying device body 1 is provided on the drying equipment body 1, and a shielding component for shielding the first ventilation holes 301 is provided on the fixed frame 3.

[0030] like Figure 1 and Figure 2 As shown, the dehumidification component includes a dehumidifier 6 and a humidity sensor 7. The dehumidifier 6 is installed in the middle of the top of the drying equipment body 1, and the humidity sensor 7 is installed on the left side of the inner wall of the drying equipment body 1. The humidity sensor 7 is electrically connected to the dehumidifier 6.

[0031] like Figure 5 As shown, the shielding assembly includes a connecting rod 8, a first electric push rod 9, a shielding frame 10 and a connecting plate 11. The left and right rear parts of the two fixed frames 3 are connected with connecting rods 8, and each connecting rod 8 is installed with a first electric push rod 9. The outer walls of the two fixed frames 3 are slidably connected with the shielding frames 10, and the inner walls of the shielding frames 10 are in contact with the outer walls of the fixed frames 3. The left and right sides of the two shielding frames 10 are connected with connecting plates 11, and the connecting plates 11 are connected to the telescopic rods of the first electric push rods 9.

[0032] When it is necessary to dry the PCB board, first rotate the door panel of the drying device body 1 to open it, then pull the placement frame 5 forward and take it out, so that the placement frame 5 is separated from the fixed frame 3, and then manually put the PCB board into each placement slot 502, and then put the placement frame 5 back into the fixed frame 3, and then rotate the door panel of the drying device body 1 to close it; then control the drying device body 1 to start working, and the hot air in the drying device body 1 passes through the front and back sides of the fixed frame 3 and the first and second ventilation holes 301 and 501, and can directly contact the PCB board placed in the placement slot 502. Thus, the PCB boards can be dried, and the placement frame 5 can separate the PCB boards to prevent adjacent PCB boards from contacting and causing large-area blocking, thereby improving the drying effect. During the drying process, the humidity in the drying device body 1 will gradually rise, and the humidity sensor 7 will monitor the humidity in the drying device body 1 in real time. When the humidity sensor 7 detects that the humidity in the drying device body 1 is higher than the preset value, the humidity sensor 7 will send a signal. After receiving the signal, the controller 101 will control the dehumidifier 6 to start working, and the dehumidifier 6 can remove the humidity in the drying device body 1. The humidity in the drying device body 1 is controlled by the controller 101. After the PCB board is dried for a certain period of time, the first electric push rod 9 can be controlled by the controller 101 to drive the shielding frame 10 to move forward, so that the shielding frame 10 is sleeved on the front of the outer side of the fixed frame 3. At this time, the shielding frame 10 can completely block the outer side of the first ventilation hole 301, so that the upper, lower, left and right sides of the fixed frame 3 are in a closed state. Then, the first fan 4 is controlled by the controller 101 to start working. The first fan 4 can blow air backward, so that the hot air in the drying device body 1 can enter from the front side of the fixed frame 3 and be discharged backward along the inside of the fixed frame 3, forcing the drying device to A large amount of hot air in the main body 1 passes through the micropores on the PCB board to ensure the drying effect of the inner wall of the micropores. After the PCB board is dried, the controller 101 needs to control the first fan 4 to stop working, and control the first electric push rod 9 to drive the shielding frame 10 to move backward and reset. When the humidity sensor 7 detects that the humidity in the drying device body 1 is lower than the preset value, the humidity sensor 7 will send a signal. After receiving the signal, the controller 101 will control the dehumidifier 6 to stop working, and then wait for the PCB board to slowly cool down in the drying device body 1. After the cooling is completed, the PCB board can be taken out.

[0033] like Figure 2 、 Figure 5 and Figure 6 As shown, it also includes a fixed column 12, a second electric push rod 13, a lifting frame 14 and a limit plate 15. Four fixed columns 12 are symmetrically connected to the inner top of the drying device body 1. The four fixed columns 12 are all installed with a second electric push rod 13. The lifting frame 14 is connected between the telescopic rods of the four second electric push rods 13. The lifting frame 14 is located just above the fixed frame 3. The bottom of the lifting frame 14 is evenly spaced and connected to a plurality of limit plates 15. When the PCB board is cooled in the drying device body 1, the second electric push rod 1 can be controlled by the controller 101 to The lifting frame 14 and the limiting plates 15 are driven to move downward. Each limiting plate 15 sequentially passes through the first ventilation hole 301 and the second ventilation hole 501 and moves to the front and rear sides of each PCB board. The limiting plates 15 come into contact with the surface of the PCB board. The limiting plates 15 limit the PCB board, thereby preventing deformation of the PCB board during the cooling process and ensuring the flatness of the PCB board. After the PCB board is cooled, the controller 101 controls the second electric push rod 13 to drive the lifting frame 14 and the limiting plates 15 to move upward and reset.

[0034] like Figure 7 As shown, it also includes a mounting plate 17 and a second fan 18. Two mounting plates 17 are connected between the bottoms of the two mounting rods 2 on the lower side. The two mounting plates 17 are symmetrically arranged and are located directly below the fixed frame 3. The front of the two mounting plates 17 is installed with a second fan 18; during the drying process of the PCB boards, the controller 101 can control the second fan 18 to blow air upward, so that the hot air in the drying equipment body 1 can quickly pass through the first ventilation hole 301 and the second ventilation hole 501 and enter between the two adjacent PCB boards, thereby accelerating the air flow rate between the two adjacent PCB boards and improving the drying efficiency and drying effect.

[0035] Since the outer diameter of the placement frame 5 is adapted to the inner diameter of the fixed frame 3, it is difficult to align the placement frame 5 when it is placed in the fixed frame 3, so an alignment component is designed; Figure 7As shown, the alignment assembly includes a placement plate 19, a sliding push frame 20 and a third electric push rod 21. The front side of the mounting rod 2 on the front lower side is symmetrically connected to the placement plate 19. The left and right sides of the two placement plates 19 are slidably connected to the sliding push frame 20. The bottom of the two placement plates 19 is symmetrically installed with a third electric push rod 21. The third electric push rod 21 corresponds to the sliding push frame 20 one by one, and the telescopic rod of the third electric push rod 21 is connected to the sliding push frame 20. When it is necessary to place the placement frame 5 into the fixed frame 3, the placement frame 5 can be placed first. The placement frame 5 is placed on the top of the placement plate 19, and then the controller 101 controls the third electric push rod 21 to drive the sliding push frames 20 on the left and right sides to move toward each other. The sliding push frames 20 can push the placement frame 5 placed on the top of the placement plate 19 to be centered, ensuring that the placement frame 5 can be longitudinally aligned with the fixed frame 3. Then, the placement frame 5 can be smoothly pushed backward into the fixed frame 3. Finally, the controller 101 controls the third electric push rod 21 to drive the sliding push frames 20 on the left and right sides to move away from each other and reset.

[0036] like Figure 8 As shown, it also includes fixed springs 22 and buffer sponges 23. The inner wall of each placement slot 502 is connected with three groups of fixed springs 22 at intervals from top to bottom. The number of fixed springs 22 in each group is two, and they are symmetrically arranged front to back. The inner bottom of each placement slot 502 is connected with a buffer sponge 23, and the buffer sponge 23 has high temperature resistance. When the PCB board is placed in the placement slot 502, the PCB board will fall down along the placement slot 502 due to its own weight. The buffer sponge 23 can buffer the bottom of the PCB board to prevent the PCB board from colliding with the bottom of the placement slot 502 and being damaged. The fixed springs 22 can fix the PCB board due to their own elastic energy and can keep the PCB board in a vertical state, reducing the contact area between the PCB board and the inner wall of the placement slot 502, thereby improving the drying effect.

[0037] The above description is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed by the present invention, which should be covered by the scope of protection of the present invention.

Claims

1. An automated PCB board drying device, comprising: a drying device body (1); characterized in that, The device further comprises: a controller (101) mounted on the drying device body (1); a mounting rod (2) symmetrically connected to the inner wall of the drying device body (1); a fixing frame (3) symmetrically connected to the mounting rod (2), and the front portions of the four upper, lower, left, and right sides of the fixing frame (3) are all spaced apart with first ventilation holes (301); a first fan (4) mounted on the inner rear side of the fixing frame (3); a placement frame (5) placed on the inner front side of the fixing frame (3), and the placement frame (5) is spaced apart with second ventilation holes (501) corresponding to the first ventilation holes (301), and the placement frame (5) is also spaced apart with second ventilation holes (501) corresponding to the first ventilation holes (301). A placement slot (502) for placing a PCB board; a dehumidification component, arranged on the drying device body (1), for removing moisture from the drying device body (1); a shielding component, arranged on the fixing frame (3), for shielding the first ventilation hole (301) so that the upper, lower, left, and right sides of the fixing frame (3) are in a closed state, and then controlling the first fan (4) to blow air backwards so that hot air in the drying device body (1) enters from the front side of the fixing frame (3) and is discharged backwards along the inside of the fixing frame (3), forcing a large amount of hot air in the drying device body (1) to pass through the micropores on the PCB board.

2. An automatic PCB board drying equipment according to claim 1, characterized in that: The dehumidification component comprises: a dehumidifier (6) installed on the top of the drying equipment body (1); and a humidity sensor (7) installed on the inner wall of the drying equipment body (1).

3. An automatic PCB board drying equipment according to claim 1, characterized in that: The shielding assembly comprises: a connecting rod (8) symmetrically connected to the outer wall of the fixed frame (3); a first electric push rod (9) mounted on the connecting rod (8); a shielding frame (10) slidably connected to the outer wall of the fixed frame (3); and a connecting plate (11) symmetrically connected to both sides of the shielding frame (10), and the connecting plate (11) is connected to the telescopic rod of the first electric push rod (9).

4. An automated PCB board drying device according to claim 1, characterized in that: It also includes: a fixed column (12) symmetrically connected to the inner top of the drying equipment body (1); a second electric push rod (13) installed on the fixed column (12); and a lifting frame (14) connected to the telescopic rod of the second electric push rod (13); The limiting plate (15) is connected to the bottom of the lifting frame (14) at intervals.

5. An automatic PCB board drying equipment according to claim 1, characterized in that: It also includes: a mounting plate (17) symmetrically connected to the bottom of the mounting rod (2) on the lower side; and a second fan (18) mounted on the mounting plate (17).

6. An automated PCB board drying device according to claim 1, characterized in that: The utility model further comprises: a placement plate (19) symmetrically connected to the side of the mounting rod (2) on the lower side; a sliding push frame (20) symmetrically slidably connected to both sides of the placement plate (19); a third electric push rod (21) symmetrically installed at the bottom of the placement plate (19), and a telescopic rod of the third electric push rod (21) is connected to the sliding push frame (20).

7. An automated PCB board drying device according to claim 1, characterized in that: It also includes: fixed spring pieces (22) connected to the inner wall of the placement groove (502) at symmetrical intervals.

8. An automated PCB board drying device according to claim 1, characterized in that: It also includes a buffer sponge (23) connected to the inner bottom of the placement groove (502).

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