Nanoscale capacitance sensor rapid assembly and adjustment device and method

Abstract

The present invention relates to the field of capacitance sensor installation, and in particular to a rapid adjustment device and method for a nano-scale capacitance sensor. The rapid adjustment device for the nano-scale capacitance sensor includes a base and three adjustment fixtures. The base includes a storage space for placing a measuring block of a component to be measured, and three capacitance sensor probes are respectively fixed to the three inner walls of the storage space for measuring the displacement of the measuring block in three mutually perpendicular directions. The three adjustment fixtures are respectively arranged on the three inner walls of the storage space. The adjustment fixture includes a mounting portion, and the mounting portion includes two mounting surfaces that are relatively arranged and parallel along a first direction. One of the two mounting surfaces abuts against the inner wall of the storage space, and the other abuts against the surface of the measuring block. The mounting portion is detachably mounted between the inner wall of the storage space and the surface of the measuring block. In this way, while ensuring the installation accuracy requirements of the capacitance sensor, rapid adjustment of the capacitance sensor can be achieved.

Description

Technical Field

[0001] The present invention belongs to the field of capacitance sensor installation, and in particular relates to a rapid assembly and adjustment device and method for a nanometer-level capacitance sensor. Background Art

[0002] In the field of large-scale space optical telescopes, mirror displacement monitoring is primarily used to ensure the positional stability and accuracy of the mirror in the optical system. Mirror displacement monitoring plays a vital role in high-precision optical systems, enabling precise positioning and real-time monitoring of the mirror, thereby improving the overall performance and reliability of the optical system.

[0003] A capacitive sensor is a sensor that uses changes in capacitance to measure relative displacement. It usually uses a parallel plate capacitor structure consisting of a probe and the surface of the object being measured. Its measurement principle is mainly to achieve changes in capacitance by changing the distance between two conductive plates, thereby detecting the displacement of the object. It has the advantages of simple structure, small size, high resolution, high accuracy, good dynamic characteristics, low power, fast response speed, and good linearity. It is widely used in the field of large space optical telescopes.

[0004] The initial installation spacing, parallelism, and stability between the capacitive probe and the measured surface of the mirror body all affect the displacement measurement accuracy of the sensor. Mirror displacement monitoring requires nanometer-level measurement accuracy in three spatial directions, placing stringent demands on the initial installation accuracy between the probe and the measured surface. To meet the initial installation accuracy requirements of nanoscale capacitive sensors, existing technologies employ a large number of complex movable adjustment mechanisms to meet these requirements. This significantly impacts the stability between the probe and the measured surface and fails to meet the requirements for rapid adjustment of capacitive sensors in practical engineering applications. Therefore, there is an urgent need to develop a rapid adjustment device and method for nanoscale capacitive sensors for mirror bodies. Summary of the Invention

[0005] In view of this, the present invention aims to provide a rapid assembly and adjustment device for a nanometer-scale capacitive sensor and a method thereof, which can achieve rapid assembly and adjustment of the capacitive sensor while ensuring the installation accuracy requirements of the capacitive sensor.

[0006] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0007] A rapid assembly and adjustment device for a nanoscale capacitance sensor, comprising:

[0008] A base, comprising a receiving space for placing a measuring block of the component to be measured, wherein three capacitive sensor probes are respectively fixed to three inner walls of the receiving space and are used to measure the displacement of the measuring block in three mutually perpendicular directions; and

[0009] The three mounting fixtures are respectively arranged on the three inner walls of the accommodating space. The mounting fixture includes a mounting portion, which includes two mounting surfaces that are relatively arranged and parallel along a first direction. One of the two mounting surfaces abuts against the inner wall of the accommodating space, and the other abuts against the surface of the measuring block; the mounting portion is detachably installed between the inner wall of the accommodating space and the surface of the measuring block.

[0010] Furthermore, the base includes a main body portion, a first extension portion, a second extension portion and a third extension portion that enclose a accommodating space; the first extension portion and the second extension portion extend outward from the surface of the main body portion, and the third extension portion extends outward from an end of the second extension portion away from the main body portion; wherein the inner surfaces of the first extension portion, the second extension portion and the third extension portion are the three inner walls of the accommodating space.

[0011] Furthermore, the component to be measured also includes an adapter and a mirror body; the adapter is installed between the measuring block and the mirror body.

[0012] Furthermore, a boss is protruding from the surface of the measuring block, and a conductive pad is provided on the top of the boss; the adapter is provided with a through hole, the boss passes through the through hole, and the conductive pad on the top of the boss abuts against the surface of the mirror body.

[0013] Furthermore, the shape of the measuring block is a regular hexahedron.

[0014] Furthermore, the mounting tool further includes a handle, the mounting portion extends from the handle along a second direction, and the first direction is perpendicular to the second direction;

[0015] When the mounting portion is mounted between the inner wall of the accommodation space and the surface of the measuring block, the handle extends out of the accommodation space.

[0016] Furthermore, the mounting portion includes a first part and a second part, the first part and the second part are arranged along a third direction, and there is an installation space between the first part and the second part; the capacitive sensor probe is arranged in the installation space; wherein the first direction is perpendicular to the third direction.

[0017] Furthermore, in the first direction, the thickness of the mounting portion is greater than the thickness of the capacitive sensor probe; and the difference between the thickness of the mounting portion and the thickness of the capacitive sensor is greater than half of the measuring range of the capacitive sensor probe.

[0018] Furthermore, the parallelism between the two mounting surfaces is better than 1 μm.

[0019] A rapid adjustment method for a nanoscale capacitance sensor is implemented by the rapid adjustment device described above. The rapid adjustment method for a nanoscale capacitance sensor includes:

[0020] Fixing three capacitive sensor probes to three inner walls of the accommodation space respectively;

[0021] Install three adjustment fixtures between the inner wall of the accommodation space and the surface of the measuring block;

[0022] The base is fixedly connected to the measuring reference, and the mirror body of the component to be measured is connected to the measuring block;

[0023] The three adjustment fixtures are removed so that the capacitance sensor probe is fixed on the measurement reference through the base, the measurement block is fixed on the mirror body, and the surface of the capacitance sensor probe is parallel to the surface of the measurement block.

[0024] Compared with the prior art, the present invention can achieve the following beneficial effects:

[0025] The present invention provides a rapid adjustment device for nanoscale capacitive sensors. The mounting portion of the adjustment fixture is removably mounted between the inner wall of the storage space and the surface of the measurement block. The adjustment fixture ensures the proper spacing and parallelism between the capacitive sensor probe and the measurement block. This allows for rapid adjustment of the capacitive sensor while maintaining the required installation accuracy, meeting the requirements for displacement monitoring of large-scale space optical telescopes. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which constitute part of the present invention, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0027] Figure 1 This is a three-dimensional exploded view of the rapid adjustment device according to an embodiment of the present invention;

[0028] Figure 2 A schematic structural diagram of the base of the rapid adjustment device according to an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of the structure of the adjustment tooling of the rapid adjustment device according to an embodiment of the present invention;

[0030] Figure 4 A schematic structural diagram of a measuring block of a rapid adjustment device according to an embodiment of the present invention;

[0031] Figure 5 The present invention creates a flowchart of the rapid assembly method described in an embodiment.

[0032] Description of reference numerals:

[0033] 10. Quick adjustment device; 11. Base; 12. Adjustment tool; 13. Component to be tested; 14. Measuring block; 15. Accommodation space; 16. Capacitive sensor probe; 17. Probe fixing screw; 18. Mounting portion; 19, 20. Mounting surface; 21. Adjustment screw; 22. Main body; 23. First extension portion; 24. Second extension portion; 25. Third extension portion; 26. Adapter; 27. Boss; 28. Conductive pad; 29. ​​Through hole; 30. Upper surface; 31. Front surface; 32. Side surface; 33. Handle; 34. First part; 35. Second part; 36. Installation space. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation to the present invention. Similar elements in different embodiments use associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present invention to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present invention are not shown or described in the specification. This is to avoid the core part of the present invention being overwhelmed by too much description. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0035] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other to form various implementation methods. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various orders in the description and the drawings are only for the purpose of clearly describing a certain embodiment and are not intended to be a required order, unless otherwise specified that a certain order must be followed.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0037] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art can understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0038] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0039] See also Figure 1 、 Figure 2 and Figure 3 As shown, an embodiment of the present invention provides a rapid assembly and adjustment device 10 for a nano-scale capacitance sensor. The rapid assembly and adjustment device 10 includes a base 11 and three assembly and adjustment tools 12 .

[0040] The base 11 includes a receiving space 15 for placing a measuring block 14 of the component under test 13. Three capacitive sensor probes 16 are fixed to the three inner walls of the receiving space 15, respectively, for measuring the displacement of the measuring block 14 in three mutually perpendicular directions. The surfaces of the three inner walls are perpendicular to each other. In this embodiment, the perpendicularity of the surfaces of any two of the three inner walls is better than 3μm. The three capacitive sensor probes 16 are fixed to the three inner walls of the receiving space 15 by probe fixing screws 17, respectively, and have nanometer-level measurement accuracy.

[0041] Three mounting fixtures 12 are respectively disposed on the three inner walls of the accommodating space 15. The mounting fixture 12 includes a mounting portion 18, which includes two mounting surfaces 19 and 20 that are oppositely disposed and parallel to each other along a first direction X. In this embodiment, the parallelism between the two mounting surfaces 19 and 20 is better than 1 μm, thereby ensuring the installation parallelism between the capacitive sensor probe and the measuring block 14. One of the two mounting surfaces 19 and 20 abuts the inner wall of the accommodating space 15, and the other abuts the surface of the measuring block 14. The mounting portion 18 is detachably mounted between the inner wall of the accommodating space 15 and the surface of the measuring block 14. The mounting portion 18 can be detachably mounted between the inner wall of the accommodating space 15 and the surface of the measuring block 14 using an adjusting screw 21. In this way, the mounting fixture 12 can be used to ensure the installation spacing and parallelism between the capacitive sensor probe 16 and the measuring block 14.

[0042] In one embodiment, the base 11 includes a main body 22, a first extension 23, a second extension 24, and a third extension 25, which enclose and form the accommodating space 15. The first extension 23 and the second extension 24 extend outward from the surface of the main body 22, and the third extension 25 extends outward from an end of the second extension 24 away from the main body 22. The inner surfaces of the first extension 23, the second extension 24, and the third extension 25 serve as the three inner walls of the accommodating space 15.

[0043] In one embodiment, the component under test 13 further includes an adapter 26 and a mirror body (not shown). The adapter 26 is mounted between the measuring block 14 and the mirror body. In this embodiment, the measuring block 14 is bonded to the adapter 26, which in turn is bonded to the mirror body. The measuring block 14 can be bonded to the adapter 26 using optical epoxy adhesive. The adapter 26 has an adhesive injection hole. Photosensitive adhesive is injected into the injection hole to bond the adapter 26 to the mirror body.

[0044] See also Figure 1 and Figure 4 As shown, in one embodiment, a boss 27 is protruding from the surface of the measuring block 14, and the shape of the boss 27 can be cylindrical. A conductive pad 28 is provided at the top of the boss 27. The adapter 26 is provided with a through hole 29, and the boss 27 passes through the through hole 29, and the conductive pad 28 at the top of the boss 27 abuts the surface of the mirror body. The boss 27 passes through the through hole 29 so that the conductive pad 28 at the top of the boss 27 protrudes from the surface of the adapter 26 away from the measuring block 14. In this embodiment, the distance between the top of the conductive pad 28 and the surface of the adapter 26 away from the measuring block 14 is 0.2 mm. The conductive pad 28 abuts the surface of the mirror body, thereby ensuring that the measuring block 14 and the mirror body have the same electrical potential.

[0045] In one embodiment, the base 11, the adjustment fixture 12, and the measuring block 14 are made of Invar, and the adapter 26 is made of glass-ceramic. This can utilize the low expansion properties of Invar and glass-ceramic to reduce the impact of temperature changes on measurement results.

[0046] In one embodiment, the measuring block 14 is shaped like a regular hexahedron, meaning that each of the six surfaces of the measuring block 14 is perpendicular to the other. In this embodiment, the perpendicularity between two adjacent surfaces of the six surfaces is better than 2 μm. In this embodiment, threaded holes are provided on the top surface 30, front surface 31, and side surface 32 of the measuring block 14. Adjustment screws 21 can pass through the inner wall of the accommodating space 15 and the mounting portion 18 of the adjustment fixture 12, mating with the threaded holes to removably mount the mounting portion 18 of the adjustment fixture 12 between the inner wall of the accommodating space 15 and the surface of the measuring block 14.

[0047] In one embodiment, the adjustment tool 12 further includes a handle 33. The handle 33 can be square in shape. The mounting portion 18 extends from the handle 33 in a second direction Y, with the first direction X being perpendicular to the second direction Y. When the mounting portion 18 is installed between the inner wall of the accommodating space 15 and the surface of the measuring block 14, the handle 33 extends outside the accommodating space 15. This makes it easier for the user to hold and facilitates removal of the adjustment tool 12 after the capacitive sensor probe 16 is installed.

[0048] In one embodiment, the mounting portion 18 includes a first portion 34 and a second portion 35, which are arranged along a third direction Z, with a mounting space 36 defined between the first portion 34 and the second portion 35. The capacitive sensor probe 16 is disposed in the mounting space 36. The first direction X is perpendicular to the third direction Z. The first direction X, the second direction Y, and the third direction Z are all perpendicular to each other. The capacitive sensor probe 16 can be located between the first portion 34 and the second portion 35 of the mounting portion 18, resulting in a more compact overall structural design.

[0049] In one embodiment, the thickness of mounting portion 18 in the first direction X is greater than the thickness of capacitive sensor probe 16. The difference between the thickness of mounting portion 18 and the thickness of the capacitive sensor is greater than half the measuring range of capacitive sensor probe 16. This allows for adjusting the thickness of mounting fixture 12 to ensure a more optimal mounting spacing between capacitive sensor probe 16 and measuring block 14, ensuring that the initial mounting spacing between capacitive sensor probe 16 and measuring block 14 is located at the center of the measuring range of capacitive sensor probe 16. In this embodiment, the difference between the thickness of mounting portion 18 and the thickness of the capacitive sensor is 0.1 mm.

[0050] The present invention provides a rapid adjustment device 10 for a nanoscale capacitive sensor. The mounting portion 18 of the adjustment fixture 12 is removably mounted between the inner wall of the accommodating space 15 and the surface of the measuring block 14. The adjustment fixture 12 can be used to ensure the installation spacing and parallelism between the capacitive sensor probe 16 and the measuring block 14. This ensures that the capacitive sensor can be rapidly adjusted while maintaining the required installation accuracy. This can meet the needs of large-scale space optical telescope mirror displacement monitoring. Tests have shown that the measurement accuracy of the system adjusted by the rapid adjustment device 10 is better than 3 nm, and the measurement range is greater than 0.2 mm. Furthermore, the various structures of the rapid adjustment device 10 are all fixedly connected, with no moving parts, resulting in a simple overall structure, reliable connections, and high stability. Furthermore, the connection between the adapter 26 and the mirror body is made of photosensitive adhesive, eliminating assembly stress and improving the structural stability of the rapid adjustment device 10.

[0051] See also Figure 5 As shown, the present invention also provides a method for rapid adjustment of a nano-scale capacitance sensor, which is implemented by the rapid adjustment device 10 as described above. The method includes:

[0052] Step S101 : Fix three capacitive sensor probes 16 to three inner walls of the accommodation space 15 , respectively. The three capacitive sensor probes 16 are fixed to the three inner walls of the accommodation space 15 by probe fixing screws 17 , respectively, so as to install the three capacitive sensor probes 16 on the base 11 .

[0053] In one embodiment, before step S101 , the rapid assembly method further includes: bonding the measuring block 14 to the adapter 26 by optical epoxy adhesive, and bonding the conductive pad 28 to the top of the boss 27 of the measuring block 14 by conductive adhesive.

[0054] Step S102: Install the three adjustment fixtures 12 between the inner wall of the accommodating space 15 and the surface of the measuring block 14. The adjustment screws 21 can pass through the inner wall of the accommodating space 15 and the mounting portion 18 of the adjustment fixture 12, and engage with the threaded holes of the measuring block 14 to pre-install the three adjustment fixtures 12 between the inner wall of the accommodating space 15 and the surface of the measuring block 14. The parallelism between the two mounting surfaces of the mounting portion 18 of the adjustment fixture 12 can be used to ensure the initial installation parallelism between the capacitive sensor probe 16 and the measuring block 14. The thickness of the adjustment fixture 12 can be adjusted to ensure a more appropriate installation spacing between the capacitive sensor probe 16 and the measuring block 14, so that the initial installation spacing between the capacitive sensor probe 16 and the measuring block 14 is located at the center of the measuring range of the capacitive sensor probe 16.

[0055] Step S103: Securely connect the base 11 to the measurement reference and the mirror of the component under test 13 to the measurement block 14. Secure the base 11 to the measurement reference with screws. Ensure that the conductive pad 28 is in contact with the mirror during installation. Quickly connect and secure the adapter 26 to the mirror by injecting photosensitive adhesive into the adhesive injection hole of the adapter 26, thereby indirectly connecting the mirror to the measurement block 14.

[0056] Step S104: Remove the three adjustment fixtures 12 so that the capacitive sensor probe 16 is fixed to the measurement reference via the base 11, the measurement block 14 is fixed to the scope, and the surface of the capacitive sensor probe 16 is parallel to the surface of the measurement block 14. After the photosensitive adhesive is cured and the adapter 26 is fixedly connected to the scope, the three adjustment fixtures 12 can be removed. The adjustment screws 21 can be unscrewed, and the handle 33 of the adjustment fixture 12 can be grasped to remove the adjustment fixture 12. At this point, the capacitive sensor probe 16 is disconnected from the measurement block 14. The capacitive sensor probe 16 is fixed to the measurement reference via the base 11, the measurement block 14 is fixed to the scope, and the surface of the capacitive sensor probe 16 is parallel to the surface of the measurement block 14. This allows for real-time measurement of the change in the spacing between the capacitive sensor probe 16 and the measurement block 14 to monitor the displacement of the scope.

[0057] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in the present disclosure can be achieved. This is not limited herein.

[0058] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A rapid adjustment device for nanometer-scale capacitance sensors, characterized in that: include: A base, comprising a receiving space for placing a measuring block of the component to be measured, three capacitive sensor probes respectively fixed to three inner walls of the receiving space, for measuring the displacement of the measuring block in three mutually perpendicular directions, the base being fixedly connected to a measurement reference, and the mirror body of the component to be measured being connected to the measuring block; and Three adjustment fixtures are respectively arranged on the three inner walls of the accommodating space, and the adjustment fixtures include a mounting portion, and the mounting portion includes two mounting surfaces that are arranged opposite to each other and parallel along a first direction, one of the two mounting surfaces abuts against the inner wall of the accommodating space, and the other abuts against the surface of the measuring block; the mounting portion is detachably installed between the inner wall of the accommodating space and the surface of the measuring block, and the three adjustment fixtures are removed to fix the capacitive sensor probe on the measuring reference through the base, and the measuring block is fixed on the mirror body, and the surface of the capacitive sensor probe is parallel to the surface of the measuring block. The distance between the capacitive sensor probe and the measuring block changes to realize monitoring of the displacement of the mirror body.

2. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: The base includes a main body, a first extension, a second extension and a third extension that enclose the accommodating space; the first extension and the second extension extend outward from the surface of the main body, and the third extension extends outward from an end of the second extension away from the main body; wherein the inner surfaces of the first extension, the second extension and the third extension are the three inner walls of the accommodating space.

3. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: The component to be measured further includes an adapter and a mirror body; the adapter is installed between the measuring block and the mirror body.

4. The rapid adjustment device for nanoscale capacitance sensors according to claim 3, characterized in that: The surface of the measuring block is provided with a boss protruding from the surface, and a conductive pad is provided on the top of the boss; the adapter is provided with a through hole, the boss passes through the through hole, and the conductive pad on the top of the boss abuts against the surface of the mirror body.

5. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: The shape of the measuring block is a regular hexahedron.

6. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: The adjustment tool further includes a handle, the mounting portion extends from the handle along a second direction, and the first direction is perpendicular to the second direction; When the mounting portion is mounted between an inner wall of the accommodation space and a surface of the measuring block, the handle extends out of the accommodation space.

7. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: The mounting portion includes a first part and a second part, the first part and the second part are arranged along a third direction, and there is an installation space between the first part and the second part; the capacitive sensor probe is arranged in the installation space; wherein, the first direction is perpendicular to the third direction.

8. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: In the first direction, the thickness of the mounting portion is greater than the thickness of the capacitive sensor probe; and the difference between the thickness of the mounting portion and the thickness of the capacitive sensor is greater than half of the measuring range of the capacitive sensor probe.

9. The rapid adjustment device for nanoscale capacitance sensors according to claim 1, characterized in that: The parallelism between the two mounting surfaces is better than 1 μm.

10. A method for rapid assembly and adjustment of a nanometer-scale capacitance sensor, characterized in that: The rapid adjustment method of the nanoscale capacitive sensor is realized by the rapid adjustment device according to any one of claims 1 to 9, comprising: Fixing the three capacitive sensor probes to the three inner walls of the accommodating space respectively; Installing the three adjustment fixtures between the inner wall of the accommodating space and the surface of the measuring block; The base is fixedly connected to the measuring reference, and the mirror body of the component to be measured is connected to the measuring block; The three adjustment fixtures are removed so that the capacitance sensor probe is fixed on the measurement reference through the base, the measurement block is fixed on the mirror body, and the surface of the capacitance sensor probe is parallel to the surface of the measurement block.

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