Chip test equipment and control method

Abstract

The invention provides chip testing equipment and a control method, and relates to the technical field of chip testing. According to the invention, the target first adsorption part is firstly controlled to adsorb the tested chip, then the first rotating tower is controlled to rotate so as to drive the target first adsorption part to rotate to the feeding station of the annular linear motor, and the tested chip is placed on the target test fixture. And then the annular linear motor is controlled to drive the target test fixture to move to the test station, after the tested chip is tested, the annular linear motor is controlled to drive the target test fixture to move to the blanking station, and the tested chip is blanked. According to the technical scheme, the rotating tower is used for feeding the tested chip, the multiple first adsorption pieces synchronously take and place materials, and the feeding speed is increased. The mode that the annular linear motor drives the testing jigs to move is adopted, the feeding speed can be matched with the feeding speed of the turret, therefore, the testing efficiency is overall improved, the multiple testing jigs on the annular linear motor can be independently controlled, and flexibility is good.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a chip testing device and a control method therefor. Background Art

[0002] The KGD (Known Good Die) testing system is mainly applied to the dynamic and static parameter testing of power bare chips, and can screen the Dies after dicing, thereby improving the cumulative yield of Die packaging. It mainly consists of a chip handling device and a tester.

[0003] In the prior art, a linear motion module such as a linear motor is generally used for loading and unloading the chip to be tested. This linear layout is limited by the speed of the loading and unloading of the moving parts of the linear motor. The loading and unloading cycle is generally no more than 2 s / pcs. Without considering the testing time and calculating according to double Dies, the limit UPH (units per hour) ≤ 3600 pcs / h, and the loading and unloading speed is slow, thus affecting the testing speed. In addition, the method of using a turntable to test the chip to be tested requires the synchronous movement of multiple test seats on the turntable, with poor flexibility and the inability to expand the test stations. Therefore, there is an urgent need to design a control method that can improve the testing efficiency and achieve flexible control. Summary of the Invention

[0004] An object of the present invention is to provide a control method for a chip testing device, so as to solve the technical problems of low chip testing efficiency and poor control flexibility in the prior art.

[0005] Another further object of the present invention is to provide a chip testing device applying the above control method.

[0006] Specifically, the present invention provides a control method for a chip testing device, including the following steps:

[0007] In response to a trigger instruction for loading, control the turret of the loading mechanism to rotate, so as to drive the target suction attachment among the multiple suction attachments of the turret to move to the loading component, and control the target suction attachment to adsorb the chip to be tested on the loading component;

[0008] Control the turret to rotate, so as to drive the target suction attachment to rotate to the loading station of the annular linear motor of the conveying mechanism, and control the target first suction attachment to place the chip to be tested on the target test fixture at the loading station. The conveying mechanism includes multiple test fixtures installed on the annular linear motor, and each test fixture is set to be controlled separately;

[0009] Control the annular linear motor to drive the target test fixture to move to the test station;

[0010] Control the test device at the test station to perform a functional test on the chip under test;

[0011] After the chip under test is completed with the test, control the ring linear motor to drive the target test fixture to move to the blanking station, and blank the chip under test after the test is completed;

[0012] Control the target test fixture to move to the loading station to receive the next chip under test adsorbed by the target first adsorbing member, and loop to execute the above steps.

[0013] Optionally, in response to a trigger instruction for loading, control the first turret of the loading mechanism to rotate, so as to drive the target first adsorbing member among the multiple first adsorbing members of the first turret to move to the loading assembly, and control the target first adsorbing member to adsorb the chip under test on the loading assembly. Specifically, it includes the following steps:

[0014] Control the first turret to rotate to drive the target first adsorbing member to move to the target loading assembly among multiple groups of the loading assemblies;

[0015] Control the target first adsorbing member to adsorb the chip under test on the target loading assembly.

[0016] Optionally, control the test device at the test station to perform a functional test on the chip under test. Specifically, it includes the following steps:

[0017] Control the drive mechanism of the test device to drive the target test fixture to move downward, so that the diversion module of the target test fixture contacts the transfer probe on the PCB board of the test machine, thereby electrically connecting the target test fixture to the test machine;

[0018] Control the test machine to perform a functional test on the chip under test in the target test fixture.

[0019] Optionally, before controlling the ring linear motor to drive the target test fixture to move to the test station, it further includes the following steps:

[0020] Control the ring linear motor to drive the target test fixture to move to the mold closing station, and make the upper cover plate of the target test fixture move along the arc surface of the cam member of the mold closing device, so that the upper cover plate rotates towards the lower cover plate of the target test fixture;

[0021] Control the pressing structure of the mold closing device to press down, so that the pressing block of the pressing mechanism abuts against the upper cover plate, and drive the upper cover plate to continue to rotate towards the lower cover plate until the upper cover plate and the lower cover plate are closed.

[0022] Optionally, before controlling the ring linear motor to drive the target test fixture to move to the blanking station and blank the tested chip after the test, the following steps are further included:

[0023] After the tested chip is tested, control the ring linear motor to drive the target test fixture to move to the mold opening station;

[0024] Control the driving member of the mold opening device to drive the convex rod of the mold opening device to extend, so that the convex rod abuts against and presses the buckle of the lower cover plate, so that the upper cover plate disengages from the buckle and opens.

[0025] Optionally, after controlling the driving member of the mold opening device to drive the convex rod of the mold opening device to extend, so that the convex rod abuts against and presses the buckle of the lower cover plate, so that the upper cover plate disengages from the buckle and opens, the following steps are further included:

[0026] Control the ring linear motor to drive the target test fixture to move to the cleaning station;

[0027] Obtain the test result of the testing machine, and judge whether the tested chip is blown up according to the test result;

[0028] After determining that the tested chip is blown up, control the adsorbing member of the cleaning device to adsorb the blown-up tested chip and transport the blown-up tested chip to the waste box.

[0029] Optionally, after obtaining the test result of the testing machine and judging whether the tested chip is blown up according to the test result, the following steps are further included:

[0030] After determining that the tested chip is not blown up, control the ring linear motor to drive the target test fixture to move to the blanking station and blank the tested chip after the test.

[0031] Optionally, after controlling the driving member of the mold opening device to drive the convex rod of the mold opening device to extend, so that the convex rod abuts against and presses the buckle of the lower cover plate, so that the upper cover plate disengages from the buckle and opens, the following steps are further included:

[0032] Control the ring linear motor to drive the target test fixture to move to the probe detection station;

[0033] Control the probe detection device to detect the test probes on the target test fixture and judge whether the test probes are abnormal;

[0034] When it is determined that the test probes are not abnormal, control the ring linear motor to drive the target test fixture to move to the loading station.

[0035] Optionally, control the probe detection device to detect the test probes on the target test fixture, and determine whether there is an abnormality in the test probes. After that, it further includes:

[0036] When it is determined that there is an abnormality in the test probes, control the ring linear motor to drive the target test fixture to move to the replacement station;

[0037] Control the gripper of the replacement device to remove the target test fixture on the ring linear motor, and then control the gripper to grab a new target test fixture and place the new target test fixture on the ring linear motor, so as to complete the replacement of the target test fixture.

[0038] Optionally, after the chip under test is completed, control the ring linear motor to drive the target test fixture to move to the unloading station, and unload the chip under test that has completed the test. Specifically, it includes the following steps:

[0039] Control the transfer mechanism to transfer the chip under test at the unloading station of the conveying mechanism to the target test fixture at the loading station of another conveying mechanism;

[0040] Control the ring linear motor of the other conveying mechanism to drive the target test fixture to move to the corresponding test station, and control the corresponding test device to perform a functional test on the chip under test; the two test devices corresponding to the two conveying mechanisms are respectively used to test the chip under test at different temperatures;

[0041] After the chip under test is completed, control the ring linear motor of the other conveying mechanism to drive the target test fixture to move to the corresponding unloading station, and unload the chip under test that has completed the test.

[0042] Optionally, the present invention further provides a chip testing device, which applies the above control method, and includes:

[0043] A loading mechanism for loading the chip under test;

[0044] At least one conveying mechanism, each conveying mechanism includes a ring linear motor and a plurality of test fixtures installed on the ring linear motor. The ring linear motor has a loading station, at least one unloading station and at least one test station. Each test fixture is independently controlled to move between the loading station, the test station and the unloading station. The test fixture is configured to receive the chip under test at the loading station;

[0045] At least one functional mechanism, each of the functional mechanisms corresponding to one of the conveying mechanisms, each of the functional mechanisms including a testing device disposed corresponding to the testing station, the testing device being configured to perform a functional test on the chip under test when the testing fixture moves to the testing station;

[0046] A blanking mechanism, disposed on one side of the blanking station, and configured to blank the chip under test that has completed the functional test when the testing fixture moves to the blanking station.

[0047] Optionally, the loading mechanism includes:

[0048] A first turret, including a first turntable and a plurality of first suction members spaced along the circumferential side of the first turntable,

[0049] At least one set of loading components, installed beside the first turret, the first turntable being controlled to rotate to drive a target first suction member among the plurality of first suction members to move to a target loading component among the at least one set of loading components, so that the target first suction member sucks the chip under test on the target loading component and transports the chip under test.

[0050] In the present invention, first, the target first suction member among the plurality of first suction members of the first turret is controlled to move to the loading component, and the target first suction member is controlled to adsorb the chip under test on the loading component. Then, the first turret is controlled to rotate to drive the target first suction member to rotate to the loading station of the annular linear motor of the conveying mechanism, and the target first suction member is controlled to place the chip under test on the target testing fixture at the loading station. Then, the annular linear motor is controlled to drive the target testing fixture to move to the testing station, and the testing device is controlled to perform a functional test on the chip under test. After the chip under test completes the test, the annular linear motor is controlled to drive the target testing fixture to move to the blanking station, and the chip under test after the test is blanked. The conveying mechanism includes a plurality of testing fixtures installed on the annular linear motor, and each testing fixture is configured to be controlled separately. The above technical solution cancels the linear motor loading method in the prior art, uses the turret to load the chip under test, can control the plurality of first suction members on the turret to work simultaneously, and can perform material taking and material placing synchronously, improving the loading speed of the chip under test. In addition, the method of driving the testing fixture to move by using the annular linear motor can match the loading speed of the turret, thereby improving the overall testing efficiency of the chip under test. The plurality of testing fixtures on the annular linear motor can be controlled separately, and the flexibility is good.

[0051] From the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more clear about the above and other objects, advantages and features of the present invention. Description of the Drawings

[0052] Some specific embodiments of the present invention will be described in detail hereinafter with reference to the accompanying drawings in an exemplary but not restrictive manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0053] Figure 1 is a schematic structural diagram of a test device for a chip according to an embodiment of the present invention;

[0054] Figure 2 is a schematic structural diagram of a ring linear motor according to an embodiment of the present invention;

[0055] Figure 3 is a schematic structural diagram of a conveying mechanism according to an embodiment of the present invention;

[0056] Figure 4 is a schematic structural diagram of a loading mechanism according to an embodiment of the present invention;

[0057] Figure 5 is a schematic structural diagram of a transfer mechanism according to an embodiment of the present invention;

[0058] Figure 6 is a schematic structural diagram of a deviation correction device according to an embodiment of the present invention;

[0059] Figure 7 is a schematic structural diagram of a mold clamping device according to an embodiment of the present invention;

[0060] Figure 8 is a schematic structural diagram of a test fixture located at a test station according to an embodiment of the present invention;

[0061] Figure 9 is a schematic structural diagram of a cleaning device and a mold opening device according to an embodiment of the present invention;

[0062] Figure 10 is a schematic structural diagram of a replacement device according to an embodiment of the present invention;

[0063] Figure 11 is a schematic flow chart of a control method for a chip test device according to an embodiment of the present invention;

[0064] Figure 12 is a schematic flow chart of a control method for a chip test device according to another embodiment of the present invention;

[0065] Figure 13 is a schematic flow chart of a control method for a chip test device according to another embodiment of the present invention;

[0066] Figure 14is a schematic flow chart of a control method of a chip testing device according to another embodiment of the present invention;

[0067] Figure 15 is a schematic flow chart of a control method of a chip testing device according to another embodiment of the present invention.

[0068] Reference numerals:

[0069] 100-test equipment, 10-feeding mechanism, 20-conveyor mechanism, 30-functional mechanism, 40-unloading mechanism, 50-transfer mechanism, 11-feeding assembly, 12-first turret, 13-first XY axis moving module, 14-second XY axis moving module, 121-first turntable, 122-first adsorption member, 21-annular linear motor, 22-test fixture, 211-feeding station, 212-correction station, 213-mold closing station, 214-replacement station, 215-test station, 216-cleaning station, 217-unloading station, 218-probe detection station, 219-mold opening station, 221-upper cover, 222-lower cover, 223-transfer probe, 224-buckle, 225-quick change assembly, 226-floating assembly, 227-elastic member, 228-guide Flow module, 31-testing device, 311-driving mechanism, 312-PCB board, 32-probe detection device, 33-replacing device, 331-gripper, 332-XYZ axis moving module, 333-platform, 34-cleaning device, 341-fourth adsorption member, 35-mold opening device, 351-convex rod, 352-third driving member, 36-accommodating box, 37-correcting device, 371-first driving member, 372-second driving member, 373-connecting assembly, 374-third XY axis moving module, 375-third adsorption member, 38-mold closing device, 381-cam member, 382-arc surface, 383-pressing structure, 384-pressing block, 41-second turret, 42-NG unloading structure, 43-unloading assembly, 51-rotating motor, 52-rotating table, 53-adsorption assembly. DETAILED DESCRIPTION

[0070] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0071] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0072] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0073] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features, that is, include one or more of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. When a certain feature "includes or contains" a certain or certain features it covers, unless otherwise specifically described, this indicates that other features are not excluded and other features may be further included.

[0074] Unless otherwise clearly specified and defined, terms such as "connection" and "installation" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art should be able to understand the specific meanings of the above terms in the present invention according to specific circumstances.

[0075] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0076] Figure 1 is a schematic structural diagram of a chip testing device 100 according to an embodiment of the present invention, Figure 2 is a schematic structural diagram of a ring linear motor 21 according to an embodiment of the present invention, Figure 3 is a schematic structural diagram of a conveying mechanism 20 according to an embodiment of the present invention. As Figures 1 to 3As shown, in a specific embodiment, the chip testing device 100 includes a loading mechanism 10, at least one conveying mechanism 20, at least one functional mechanism 30, and an unloading mechanism 40. The loading mechanism 10 is used to load the chips to be tested. Each conveying mechanism 20 includes a ring linear motor 21 and a plurality of test fixtures 22 mounted on the ring linear motor 21. The ring linear motor 21 has a loading station 211, at least one unloading station 217, and at least one testing station 215. Each test fixture 22 is individually controlled to move between the loading station 211, the testing station 215, and the unloading station 217. The test fixture 22 is configured to receive the chips to be tested at the loading station 211. Each functional mechanism 30 corresponds to a conveying mechanism 20. Each functional mechanism 30 includes a testing device 31 correspondingly arranged with the testing station 215. The testing device 31 is configured to perform a functional test on the chips to be tested when the test fixture 22 moves to the testing station 215. The unloading mechanism 40 is arranged on one side of the unloading station 217 and is configured to unload the chips to be tested that have completed the functional test when the test fixture 22 moves to the unloading station 217. Here, each test fixture 22 can move along the ring linear motor 21 individually or synchronously along the ring linear motor 21.

[0077] In this embodiment, the ring linear motor 21 is adopted to drive the movement of a plurality of test fixtures 22. Each test fixture 22 is independent and can move either synchronously or individually. Compared with the way that all the test fixtures 22 on the turntable can only move synchronously, the ring linear motor 21 is more flexible. In addition, there are straight segments on the ring linear motor 21, which are more conducive to arranging the testing station 215 and can be better expanded, with good expandability.

[0078] Figure 4 is a schematic structural diagram of the loading mechanism 10 according to an embodiment of the present invention, as Figure 4 As shown, in some embodiments, the loading mechanism 10 includes a first turret 12 and at least one set of loading components 11. The first turret 12 includes a first turntable 121 and a plurality of first suction members 122 arranged at intervals along the circumferential side of the first turntable 121. The loading components 11 are mounted beside the first turret 12. The first turntable 121 is controlled to rotate to drive the target first suction member among the plurality of first suction members 122 to move to the target loading component among at least one set of loading components 11, so that the target first suction member sucks the chips to be tested on the target loading component and transports the chips to be tested.

[0079] In this embodiment, a turret is used to replace the feeding method of the linear axis system. The time for the linear axis system to pick and place materials is the sum of the picking time, the axis system moving time, and the placing time. The turret can synchronize the picking and placing actions. Compared with the picking and placing of the linear axis system, the picking cycle can be significantly improved, thereby increasing the feeding speed. In addition, this embodiment uses a ring linear motor 21 to drive the test fixture 22 to move, which can match the feeding speed of the first turret 12, thereby improving the overall test efficiency of the chip under test.

[0080] In some embodiments, the number of the feeding assemblies 11 is three groups. Each group of feeding assemblies 11 is respectively used for feeding the chips under test with different packaging methods. Among them, one group of feeding assemblies 11 is used for feeding the tray carrying the chips under test. One group of feeding assemblies 11 is used for feeding the wafer with the chips under test. The remaining group of feeding assemblies 11 is used for feeding the tape of the reel chip feeder, and the tape has the chips under test. It can be understood that the test equipment 100 of this embodiment can meet the feeding requirements of the chips under test with three different packaging methods.

[0081] In some embodiments, due to the particularity of the feeding of the wafer and the tray, during feeding, there are multiple chips under test on the entire wafer, and there are also multiple chips under test on the entire tray. When each first adsorbing member 122 is feeding, the position reaching the same feeding assembly 11 is fixed. Therefore, it is necessary to design the tray carrying the chips under test and the wafer conveying the chips under test to be movable, so that when the previous chip under test is taken away, the next chip under test can be moved to the corresponding feeding position through its own movement. Therefore, this embodiment is provided with a first XY-axis moving module 13 and a second XY-axis moving module 14. Among them, the first XY-axis moving module 13 is connected to the carrying platform of the wafer, so as to controllably drive the wafer to move along the X-axis and Y-axis directions. The second XY-axis moving module 14 is connected to the tray, so as to controllably drive the tray to move along the X-axis and Y-axis directions. Here, refer to Figure 1 the directions of the X-axis and Y-axis shown by the arrows.

[0082] Refer to Figure 1 , the unloading mechanism 40 includes a second turret 41 and at least one group of unloading assemblies 43. The second turret 41 includes a second turntable and a plurality of second adsorbing members arranged at intervals along the circumferential side of the second turntable. The unloading assembly 43 is installed beside the second turret 41. It can be understood that the structure of the second turret 41 is the same as that of the first turret 12.

[0083] In this embodiment, not only does the feeding mechanism 10 use a turret to replace the feeding method of the linear axis system, but also the unloading mechanism 40 uses a turret to replace the unloading method of the linear axis system, which can improve the unloading cycle and increase the unloading speed.

[0084] In this embodiment, the number of the blanking assemblies 43 is one group, and one group of blanking assemblies 43 is used to convey the wafers with the DUTs that have completed the test for blanking.

[0085] In some embodiments, referring to Figure 1 , an NG blanking structure 42 is provided at the second turret 41 for blanking the DUTs with poor test results, and the blanking is carried out by using a tray.

[0086] In some embodiments, at least one conveying mechanism 20 includes a first conveying mechanism and a second conveying mechanism, and at least one functional mechanism 30 includes a first functional mechanism and a second functional mechanism; wherein the first functional mechanism is correspondingly arranged with the first conveying mechanism, and the testing device 31 of the first functional mechanism is used to perform a high-temperature test on the DUT; the second functional mechanism is correspondingly arranged with the second conveying mechanism, and the testing device 31 of the second functional mechanism is used to perform a normal-temperature test on the DUT. Here, the first conveying mechanism is Figure 1 the left conveying mechanism 20 in Figure 1 , and the second conveying mechanism is

[0087] Figure 5 is a schematic structural diagram of a transfer mechanism 50 according to an embodiment of the present invention. As Figure 5 shown, and referring to Figure 1 , in some embodiments, the testing equipment 100 further includes a transfer mechanism 50. The transfer mechanism 50 is arranged between the first conveying mechanism and the second conveying mechanism, and is arranged to controllably carry the DUTs at the blanking station 217 of the first conveying mechanism to the loading station 211 of the second conveying mechanism. It can be understood that the testing equipment 100 of this embodiment can not only perform a normal-temperature test on the DUTs, but also perform a high-temperature test on the DUTs. Referring to Figure 1 , the left testing device 31 is for high-temperature testing, and the right testing device 31 is for normal-temperature testing.

[0088] In some embodiments, the transfer mechanism 50 includes a rotating motor 51 and a rotating table 52 connected to the rotating motor 51. Two groups of adsorption assemblies 53 are arranged on the rotating table 52 at 180°. When one group of adsorption assemblies 53 adsorbs the DUTs at the blanking station 217 of the first conveying mechanism, the rotating motor 51 drives the rotating table 52 to rotate 180°, so as to move the DUTs on the first conveying mechanism to the loading station 211 of the second conveying mechanism, thereby realizing the transfer of the DUTs between the first conveying mechanism and the second conveying mechanism.

[0089] Figure 6Schematic structural diagram of the deviation rectifying device 37 according to an embodiment of the present invention. As Figure 6 shown, and referring to Figure 2 , in some embodiments, each conveying mechanism 20 further includes a deviation rectifying station 212, the deviation rectifying station 212 is located downstream of the loading station 211, each functional mechanism 30 further includes a deviation rectifying device 37, and the deviation rectifying device 37 is installed at the deviation rectifying station 212 for adjusting the position of the chip under test in the test fixture 22. That is to say, when the test fixture 22 completes the loading of the chip under test at the loading station 211, the test fixture 22 moves to the deviation rectifying station 212, and the deviation rectifying device 37 adjusts the position of the chip under test.

[0090] In some embodiments, the deviation rectifying device 37 includes a third adsorbing member 375, a first driving member 371, a connecting assembly 373, and a second driving member 372. The third adsorbing member 375 is used for adsorbing the chip under test on the test fixture 22. The third adsorbing member 375 and the first driving member 371 are arranged at intervals in the vertical direction. The first driving member 371 is connected to the third adsorbing member 375 through the connecting assembly 373. The first driving member 371 drives the connecting assembly 373 to drive the third adsorbing member 375 to rotate, so as to realize the angle adjustment of the chip under test. Here, the connecting assembly 373 can be a structure of a synchronous belt and a synchronous pulley. In addition, the deviation rectifying device 37 further includes a third XY-axis moving module 374, and the third XY-axis moving module 374 is used for driving the third adsorbing member 375 to move along the X-axis and Y-axis directions to adjust the position of the chip under test. The second driving member 372 is arranged above the third adsorbing member 375 and is used for driving the third adsorbing member 375 to move along the Z-axis direction.

[0091] This embodiment is equivalent to making the first driving member 371 and the third adsorbing member 375 into a split type, and then driving the third adsorbing member 375 to move up and down through the second driving member 372. The second driving member 372 does not need to drive the first driving member 371 to move up and down, thereby reducing the burden on the second driving member 372. On the basis of being able to realize the rotational adjustment of the third adsorbing member 375, the driving accuracy of the second driving member 372 can be improved, accurately controlling the moving distance of the third adsorbing member 375 and avoiding damaging the chip.

[0092] Figure 7 Schematic structural diagram of the mold clamping device 38 according to an embodiment of the present invention. As Figure 7 shown, and referring to Figure 2, each conveying mechanism 20 further includes a mold clamping station 213, the mold clamping station 213 is arranged downstream of the loading station 211, the test fixture 22 includes a test base, the test base includes an upper cover plate 221 and a lower cover plate 222, each functional mechanism 30 further includes a mold clamping device 38, the mold clamping device 38 is installed at the mold clamping station 213 and is used to clamp the upper cover plate 221 and the lower cover plate 222 of the test base. It can be understood that the test base of this embodiment includes an upper cover plate 221 and a lower cover plate 222 that are rotatably connected, and the upper cover plate 221 and the lower cover plate 222 are covered by using the mold clamping device 38.

[0093] In some embodiments, the mold clamping device 38 includes a cam member 381 and a pressing-down structure 383. The cam member 381 has an arc surface 382. The pressing-down structure 383 includes at least one pressing block 384. The number of pressing blocks 384 is the same as the number of test fixtures 22 and they are arranged in one-to-one correspondence.

[0094] Figure 8 is a schematic structural diagram of the test fixture 22 located at the test station 215 according to an embodiment of the present invention. As Figure 8 shown, in some specific embodiments, the test device 31 includes a test machine and at least one driving mechanism 311. Each driving mechanism 311 corresponds to a test station 215. The test machine includes a PCB board 312. The test fixture 22 further includes a transfer probe 223. The transfer probe 223 is installed on the PCB board 312. The driving mechanism 311 is arranged above the corresponding test station 215. A diversion module 228 is installed in the lower cover plate 222 of the test base. The diversion module 228 penetrates through the lower cover plate 222. This embodiment adopts the method of contacting the diversion module 228 with the transfer probe 223, effectively shortening the circuit length during chip testing, reducing the stray inductance in the test loop, and improving the chip testing performance.

[0095] In some embodiments, the test fixture 22 further includes a floating component 226. The floating component 226 is located below the lower cover plate 222 and is detachably connected to the lower cover plate 222. The floating component 226 is arranged to expand and contract along the moving direction of the test base. Under the action of the floating component 226, the test base can move up and down more smoothly.

[0096] In some embodiments, the floating component 226 includes at least one elastic member 227 arranged vertically. The elastic member 227 is arranged to drive the test base to reset when the external force acting on the test base is withdrawn.

[0097] In some embodiments, the test fixture 22 further includes a quick-change component 225. The quick-change component 225 includes a first quick-change part installed at the bottom of the test base and a second quick-change part installed at the top of the floating component 226. The first quick-change part and the second quick-change part have a connected state in which they cooperate with each other and a separated state in which they are separated from each other. In this embodiment, by installing the quick-change component 225 between the floating component 226 and the test base, the requirement for quickly replacing the test base due to damage caused by die explosion during the test process can be met, the efficiency and convenience of replacing the test base can be improved, and the on-line processing time when the test base is abnormal can be shortened.

[0098] In some embodiments, the quick-change component 225 can be unlocked and locked by compressed air, facilitating the requirement for quickly replacing the test base in case of abnormality.

[0099] Figure 9 is a schematic structural diagram of the cleaning device 34 and the mold-opening device 35 according to an embodiment of the present invention. As Figure 9 shown, and referring to Figure 2 , in some embodiments, each conveying mechanism 20 further includes a mold-opening device 35, and the mold-opening device 35 is arranged at the mold-opening station 219.

[0100] In some embodiments, the lower cover plate 222 of the test base is provided with a buckle 224, and the buckle 224 is used to engage with the upper cover plate 221, so as to realize the mold closing of the upper cover plate 221 and the lower cover plate 222. The mold-opening device 35 includes a third driving member 352 and at least one convex rod 351. Each convex rod 351 corresponds to a test fixture 22. When the test fixture 22 moves to the mold-opening station 219, the third driving member 352 of the mold-opening device 35 drives the convex rod 351 to extend out, abuts against the buckle 224 of the corresponding test base, and applies an external force to the buckle 224, so that the buckle 224 is separated from the upper cover plate 221, and the upper cover plate 221 is opened, realizing the mold opening of the test base.

[0101] In some embodiments, each conveying mechanism 20 further includes a cleaning station 216, and the cleaning station 216 is arranged between the mold-opening station 219 and the blanking station 217. Each functional mechanism 30 further includes a cleaning device 34, and the cleaning device 34 is installed at the cleaning station 216 for cleaning the test fixture 22. Here, mainly for the situation where die explosion may occur after the tested chip is completed, it is necessary to clean the broken tested chip on the test fixture 22 through the cleaning device 34. If there is no die explosion, the cleaning device 34 does not need to clean the test base, and the test base directly moves to the blanking station 217.

[0102] In some embodiments, the cleaning device 34 includes at least one fourth adsorbing member 341 and a waste box 36 for placing the crushed chip under test. After the test socket of the test fixture 22 is opened, the fourth adsorbing member 341 adsorbs the crushed chip under test and places it in the waste box 36, thereby cleaning the test socket.

[0103] Figure 10 is a schematic structural diagram of the replacement device 33 according to an embodiment of the present invention. As Figure 10 shown, and referring to Figure 2 , each conveying mechanism 20 further includes a replacement station 214, and each functional mechanism 30 further includes a replacement device 33. The replacement device 33 is installed at the replacement station 214 for replacing the test socket. In this embodiment, the replacement station 214 is arranged between the mold closing station 213 and the test station 215.

[0104] In some embodiments, the replacement device 33 includes an XYZ-axis movement module 332, a gripper 331, and a platform 333 for placing the test socket. Driven by the XYZ-axis movement module 332, the gripper 331 grabs the test socket on the replacement station 214, places the test socket on the platform 333, then grabs a new test socket on the platform 333, and returns it to the replacement station 214, thereby realizing the replacement of the test socket.

[0105] Referring to Figure 2 and Figure 3 , in some embodiments, each conveying mechanism 20 further includes a probe detection station 218, and the probe detection station 218 is arranged between the unloading station 217 and the loading station 211. Each functional mechanism 30 further includes a probe detection device 32. When the test fixture 22 moves to the probe detection station 218, the probe detection device 32 detects the test probes on the test socket.

[0106] Figure 11 is a schematic flowchart of the control method of the chip testing device 100 according to an embodiment of the present invention. As Figure 11 shown, in a specific embodiment, the control method of the chip testing device 100 includes the following steps:

[0107] Step S100, in response to the trigger instruction for loading, control the first turret 12 of the loading mechanism 10 to rotate, so as to drive the target first adsorbing member among the multiple first adsorbing members 122 of the first turret 12 to move to the loading assembly 11, and control the target first adsorbing member to adsorb the chip under test on the loading assembly 11;

[0108] Step S200: Control the first turret 12 to rotate, so as to drive the target first suction component to rotate to the loading station 211 of the ring linear motor 21 of the conveying mechanism 20, and control the target first suction component to place the chip under test on the target test fixture at the loading station 211. The conveying mechanism 20 includes a plurality of test fixtures 22 installed on the ring linear motor 21, and each test fixture 22 is set to be controlled separately;

[0109] Step S300: Control the ring linear motor 21 to drive the target test fixture to move to the test station 215;

[0110] Step S400: Control the test device 31 at the test station 215 to perform a functional test on the chip under test;

[0111] Step S500: After the chip under test is tested, control the ring linear motor 21 to drive the target test fixture to move to the unloading station 217, and unload the chip under test after the test is completed;

[0112] Step S600: Control the target test fixture to move to the loading station 211 to receive the next chip under test adsorbed by the target first suction component, and loop through the above steps. Here, it is equivalent to each test fixture 22 being recycled along the ring linear motor 21.

[0113] This embodiment cancels the linear motor loading method in the prior art, uses the first turret 12 to load the chip under test, can control multiple first suction components 122 on the first turret 12 to work simultaneously, and can perform material taking and material placing synchronously, improving the loading speed of the chip under test. In addition, the method of driving the test fixture to move by using the ring linear motor 21 can match the loading speed of the first turret 12, thereby improving the overall test efficiency of the chip under test. The multiple test fixtures 22 on the ring linear motor 21 can be controlled separately, with good flexibility.

[0114] In some embodiments, step S100 specifically includes the following steps:

[0115] Step S110: Control the first turret 12 to rotate, so as to drive the target first suction component to move to the target loading component among multiple loading components 11;

[0116] Step S120: Control the target first suction component to adsorb the chip under test on the target loading component.

[0117] In this embodiment, through the design of the first turret 12, it is possible to load the DUT chips in three different packaging methods, with good compatibility. Through reasonable design, while one of the first suction members 122 sucks the DUT chip at the loading assembly 11, the other first suction member 122 places the previously sucked DUT chip onto the test fixture 22, realizing synchronous picking and placing of materials, thereby achieving the speed of picking and placing materials.

[0118] Figure 12 is a schematic flowchart of a control method for a chip testing device 100 according to another embodiment of the present invention. As Figure 12 shown, step S400 specifically includes the following steps:

[0119] Step S410, controlling the driving mechanism 311 of the testing device 31 to drive the target test fixture to move downward, so that the diversion module 228 of the target test fixture contacts the transfer probe 223 on the PCB board 312 of the testing machine, thereby electrically connecting the target test fixture to the testing machine;

[0120] Step S420, controlling the testing machine to perform a functional test on the DUT chip in the target test fixture.

[0121] This embodiment adopts the method of contacting the diversion module 228 with the transfer probe 223, effectively shortening the circuit length during chip testing, reducing the stray inductance in the test loop, and improving the chip testing performance.

[0122] In some embodiments, before step S300, the following steps are further included:

[0123] Step S210, controlling the ring linear motor 21 to drive the target test fixture to move to the mold closing station 213, and causing the upper cover plate 221 of the target test fixture to move along the arc surface 382 of the cam member 381 of the mold closing device 38, so that the upper cover plate 221 rotates towards the lower cover plate 222 of the target test fixture;

[0124] Step S220, controlling the pressing structure 383 of the mold closing device 38 to press down, so that the pressing block 384 of the pressing mechanism 383 abuts against the upper cover plate 221, and driving the upper cover plate 221 to continue rotating towards the lower cover plate 222 until the upper cover plate 221 and the lower cover plate 222 are closed.

[0125] Here, when the test fixture 22 moves to the mold closing station 213, the side of the upper cover plate 221 of the test seat away from the lower cover plate 222 will abut against the arc surface 382 of the cam member 381. As the test fixture 22 continues to rotate following the circular linear motor 21, the upper cover plate 221 will move along the arc surface 382, thereby rotating in the direction closer to the lower cover plate 222. After the upper cover plate 221 moves away from the arc surface 382, there is only a small gap between the upper cover plate 221 and the lower cover plate 222. In order to better close the mold between the upper cover plate 221 and the lower cover plate 222, it can be pressed down by the pressing structure 383, so that the pressing block 384 abuts against the upper cover plate 221, thereby driving the upper cover plate 221 to continue rotating until it closes with the lower cover plate 222.

[0126] In some embodiments, before step S210, the following steps are further included:

[0127] Step 1, control the circular linear motor 21 to drive the target test fixture to move to the deviation correction station 212;

[0128] Step 2, control the deviation correction device 37 to adjust the position of the chip under test.

[0129] Specifically, the second driving member 372 of the deviation correction device 37 first drives the third adsorbing member 375 to move downward, so that the third adsorbing member 375 adsorbs the chip under test on the test fixture 22, and then drives the third adsorbing member 375 to move upward. The first driving member 371 is used to drive the third adsorbing member 375 to rotate, thereby adjusting the angle of the third adsorbing member 375. After the angle adjustment is completed, the second adsorbing member 412 controls the third adsorbing member 375 to move downward again, so that the third adsorbing member 375 places the chip under test with the adjusted position back on the test fixture 22, thereby completing the adjustment of the position of the chip under test.

[0130] Here, it is mainly considered that when the first adsorbing member 122 places the chip under test on the test seat, there may be some deviations in the position of the chip under test. Therefore, the deviation correction device 37 is used to adjust the position of the chip under test, so as to avoid the deviation of the position of the chip under test affecting the test efficiency.

[0131] Figure 13 It is a schematic flowchart of the control method of the chip testing device 100 according to another embodiment of the present invention. As Figure 13 shown, in some embodiments, before step S500, the following steps are further included:

[0132] Step S430, after the chip under test is completed, control the circular linear motor 21 to drive the target test fixture to move to the mold opening station 219;

[0133] Step S440: Control the driving member of the mold opening device 35 to drive the convex rod 351 of the mold opening device 35 to extend, so that the convex rod 351 abuts against and presses the buckle 224 of the lower cover plate 222, thereby causing the upper cover plate 221 to disengage from the buckle 224 and open. Here, the driving member of the mold opening device 35 is the third driving member 352.

[0134] In this embodiment, the upper cover plate 221 and the lower cover plate 222 are connected by the buckle 224. Thus, by pressing the buckle 224, the upper cover plate 221 can be disengaged from the lower cover plate 222. The control steps are simple and do not require manual participation, saving labor costs.

[0135] In some embodiments, after step S440, the following steps are further included:

[0136] Step S450: Control the annular linear motor 21 to drive the target test fixture to move to the cleaning station 316;

[0137] Step S460: Obtain the test results of the testing machine;

[0138] Step S470: Judge whether the tested chip is blown up according to the test results. If so, execute step S480; if not, execute step S500;

[0139] Step S480: Control the suction attachment of the cleaning device 34 to adsorb the blown-up tested chip and transport the blown-up tested chip to the waste box. Here, the suction attachment of the cleaning device 34 is the fourth suction attachment 341.

[0140] In this embodiment, the cleaning device 34 can automatically clean the blown-up tested chip, avoiding affecting the test rhythm. The blown-up tested chip does not need to be encapsulated, which can save subsequent encapsulation resources.

[0141] Figure 14 It is a schematic flowchart of the control method of the chip testing device 100 according to another embodiment of the present invention. As Figure 14 shown, in some embodiments, after step S440, the following steps are further included:

[0142] Step S540: Control the annular linear motor 21 to drive the target test fixture to move to the probe detection station 218;

[0143] Step S550: Control the probe detection device 32 to detect the test probes on the target test fixture and judge whether there is an abnormality in the test probes. If so, execute step S560; if not, execute step S600;

[0144] Step S560: Control the annular linear motor 21 to drive the target test fixture to move to the replacement station 214;

[0145] Step S570: Control the gripper 331 of the replacement device 33 to remove the target test fixture on the annular linear motor 21. Then, control the gripper 33 to grasp a new target test fixture and place the new target test fixture on the annular linear motor 21, thereby completing the replacement of the target test fixture.

[0146] In this embodiment, after the test socket is opened, the test socket is first cleaned, and then the test probes are detected.

[0147] In other embodiments, it is also possible to first detect the test probes after the test socket is opened, and then clean the test socket.

[0148] Figure 15 It is a schematic flowchart of the control method of the chip testing device 100 according to another embodiment of the present invention. As Figure 15 shown, step S500 specifically includes the following steps:

[0149] Step S510: Control the transfer mechanism 50 to transfer the chip under test at the unloading station 217 of the conveying mechanism 20 to the target test fixture at the loading station of another conveying mechanism.

[0150] Step S520: Control the annular linear motor of another conveying mechanism to drive the target test fixture to move to the corresponding test station, and control the corresponding test device to perform a functional test on the chip under test; the two test devices corresponding to the two conveying mechanisms are respectively used to test the chip under test at different temperatures.

[0151] Step S530: After the chip under test is completed, control the annular linear motor to drive the target test fixture to move to the unloading station, and unload the chip under test after the test is completed.

[0152] It can be understood that when the number of the conveying mechanisms 20 is two, it is necessary to transfer the chip under test from the previous conveying mechanism 20 to the next conveying mechanism 20 through the transfer mechanism 50, so as to test the chip under test at different temperatures. The annular linear motors 21 of the two conveying mechanisms 20 both have a loading station 211, a deviation correction station 212, a mold closing station 213, a replacement station 214, a test station 215, a mold opening station 219, a cleaning station 216, an unloading station 217, and a probe detection station 218. Each conveying mechanism 20 is configured with a deviation correction device 37, a mold closing device 38, a replacement device 33, a mold opening device 35, a test device 31, a cleaning device 34, and a probe detection device 32, and a transfer mechanism 50 is provided between the two conveying mechanisms 20.

[0153] In some embodiments, the number of test stations 215 for each annular linear motor 21 is three. The three test stations 215 respectively perform different functional tests on the chip under test. Therefore, after the chip under test on the test fixture 22 completes the test at the previous test station 215, it still needs to be moved to the next test station 215 for the next test.

[0154] In this embodiment, when high-temperature and normal-temperature tests need to be performed on the chip under test, the chip under test is loaded at the loading station 211 of the first conveying mechanism, that is, loaded by using the first turret 12. After the loading is completed, the annular linear motor 21 of the first conveying mechanism drives the test fixture 22 to move to the alignment station 212, the mold clamping station 213, the test station 215, the mold opening station 219, the cleaning station 216, the unloading station 217, and the probe detection station 218 in sequence, and enables the test device 31 to perform a high-temperature test on the chip under test. When necessary, it drives the test fixture 22 to move to the replacement station 214 for replacement. After the high-temperature test is completed, the chip under test at the unloading station 217 of the first conveying mechanism is transported to the test fixture 22 at the loading station 211 of the second conveying mechanism through the transfer mechanism 50. Then, the second conveying mechanism moves the test fixture 22 to the alignment station 212, the mold clamping station 213, the test station 215, the mold opening station 219, the cleaning station 216, the unloading station 217, and the probe detection station 218 in sequence, and enables the test device 31 of the second functional mechanism to perform a normal-temperature test on the chip under test. When necessary, it drives the test fixture 22 to move to the replacement station 214 for replacement. Finally, the second turret 41 of the unloading mechanism 40 unloads the chip under test, thus completing the test. Here, it should be noted that there are three test stations 215 for each conveying mechanism 20, and the test fixture 22 sequentially performs different functional tests at the three test stations 215.

[0155] When only high-temperature testing of the chip under test is required, the chip under test is loaded at the loading station 211 of the first conveying mechanism, that is, loaded by the first turret 12. After the loading is completed, the annular linear motor 21 of the first conveying mechanism drives the test fixture 22 to move successively to the alignment station 212, the mold closing station 213, the testing station 215, the mold opening station 219, the cleaning station 216, the unloading station 217, and the probe detection station 218, and enables the testing device 31 of the first functional mechanism to perform high-temperature testing on the chip under test. When necessary, it drives the test fixture 22 to move to the replacement station 214 for replacement. After the high-temperature testing is completed, the chip under test at the unloading station 217 of the first conveying mechanism is transported to the test fixture 22 at the loading station 211 of the second conveying mechanism through the transfer mechanism 50. The test fixture 22 directly moves along the annular linear motor 21 of the second conveying mechanism to the unloading station 217 for unloading, and no normal-temperature testing is required. When necessary, it drives the test fixture 22 to move to the replacement station 214 for replacement. Finally, the second turret 41 of the unloading mechanism 40 unloads the chip under test, thus completing the testing.

[0156] When only normal-temperature testing of the chip under test is required, the chip under test is loaded at the loading station 211 of the first conveying mechanism, that is, loaded by the first turret 12. The test fixture 22 directly moves along the annular linear motor 21 of the first conveying mechanism to the unloading station 217, and no high-temperature testing is required. Then, the chip under test at the unloading station 217 of the first conveying mechanism is transported to the test fixture 22 at the loading station 211 of the second conveying mechanism through the transfer mechanism 50. Then, the second conveying mechanism moves the test fixture 22 successively to the alignment station 212, the mold closing station 213, the testing station 215, the mold opening station 219, the cleaning station 216, and the unloading station 217, and enables the testing device 31 of the second functional mechanism to perform normal-temperature testing on the chip under test. When necessary, it drives the test fixture 22 to move to the replacement station 214 for replacement. Finally, the second turret 41 of the unloading mechanism 40 unloads the chip under test, thus completing the testing.

[0157] At this point, those skilled in the art should recognize that although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and determined to cover all these other variations or modifications.

Claims

1. A control method for a chip testing device, characterized in that, Including the following steps: In response to a feeding trigger instruction, control the rotation of the first turret of the feeding mechanism to drive the target first suction attachment among the multiple first suction attachments of the first turret to move to the feeding assembly, and control the target first suction attachment to adsorb the chip under test on the feeding assembly; Control the rotation of the first turret to drive the target first suction attachment to rotate to the loading station of the annular linear motor of the conveying mechanism, and control the target first suction attachment to place the chip under test on the target test fixture at the loading station. The conveying mechanism includes multiple test fixtures installed on the annular linear motor, and each test fixture is set to be controlled separately; Control the annular linear motor to drive the target test fixture to move to the test station; Control the test device at the test station to perform a functional test on the chip under test; After the chip under test is completed, control the annular linear motor to drive the target test fixture to move to the unloading station, and unload the chip under test after the test is completed; Control the target test fixture to move to the loading station to receive the next chip under test adsorbed by the target first suction attachment, and loop to execute the above steps.

2. The control method according to claim 1, wherein In response to a feeding trigger instruction, control the rotation of the first turret of the feeding mechanism to drive the target first suction attachment among the multiple first suction attachments of the first turret to move to the feeding assembly, and control the target first suction attachment to adsorb the chip under test on the feeding assembly, specifically including the following steps: Control the rotation of the first turret to drive the target first suction attachment to move to the target feeding assembly among multiple groups of feeding assemblies; Control the target first suction attachment to adsorb the chip under test on the target feeding assembly.

3. The control method according to claim 2, wherein Control the test device at the test station to perform a functional test on the chip under test, specifically including the following steps: Control the driving mechanism of the test device to drive the target test fixture to move downward, so that the diversion module of the target test fixture contacts the transfer probe on the PCB board of the testing machine, so that the target test fixture is electrically connected to the testing machine; Control the testing machine to perform a functional test on the chip under test in the target test fixture.

4. The control method according to claim 3, wherein Before controlling the annular linear motor to drive the target test fixture to move to the test station, the following steps are also included: Control the annular linear motor to drive the target test fixture to move to the mold closing station, and make the upper cover plate of the target test fixture move along the arc surface of the cam part of the mold closing device, so that the upper cover plate rotates towards the lower cover plate of the target test fixture; Control the pressing structure of the mold closing device to press down, so that the pressing block of the pressing mechanism abuts against the upper cover plate, and drive the upper cover plate to continue to rotate towards the lower cover plate until the upper cover plate and the lower cover plate are closed.

5. The control method according to claim 4, wherein Before controlling the annular linear motor to drive the target test fixture to move to the unloading station and unload the chip under test after the test is completed, the following steps are also included: After the chip under test is completed, control the annular linear motor to drive the target test fixture to move to the mold opening station; The driving member that controls the mold opening device drives the convex rod of the mold opening device to extend, so that the convex rod abuts against and presses the buckle of the lower cover plate, so that the upper cover plate disengages from the buckle and opens.

6. The control method according to claim 5, wherein The driving member that controls the mold opening device drives the convex rod of the mold opening device to extend, so that the convex rod abuts against and presses the buckle of the lower cover plate, so that the upper cover plate disengages from the buckle and opens. After that, the following steps are further included: Control the ring linear motor to drive the target test fixture to move to the cleaning station; Obtain the test result of the testing machine, and judge whether the tested chip is blown up according to the test result; After determining that the tested chip is blown up, control the adsorbing member of the cleaning device to adsorb the blown-up tested chip, and transport the blown-up tested chip to the waste box.

7. The control method according to claim 6, wherein Obtain the test result of the testing machine, and judge whether the tested chip is blown up according to the test result. After that, the following steps are further included: After determining that the test chip is not blown up, control the ring linear motor to drive the target test fixture to move to the blanking station, and blank the tested chip after the test is completed.

8. The control method according to claim 5, wherein The driving member that controls the mold opening device drives the convex rod of the mold opening device to extend, so that the convex rod abuts against and presses the buckle of the lower cover plate, so that the upper cover plate disengages from the buckle and opens. After that, the following steps are further included: Control the ring linear motor to drive the target test fixture to move to the probe detection station; Control the probe detection device to detect the test probes on the target test fixture, and judge whether the test probes are abnormal; When it is determined that the test probes are not abnormal, control the ring linear motor to drive the target test fixture to move to the loading station.

9. The control method according to claim 8, wherein Control the probe detection device to detect the test probes on the target test fixture, and judge whether the test probes are abnormal. After that, the following is further included: When it is determined that the test probes are abnormal, control the ring linear motor to drive the target test fixture to move to the replacement station; Control the gripper of the replacement device to remove the target test fixture on the ring linear motor, and then control the gripper to grab a new target test fixture and place the new target test fixture on the ring linear motor, so as to complete the replacement of the target test fixture.

10. The control method according to any one of claims 1-9, characterized in that, After the tested chip completes the test, control the ring linear motor to drive the target test fixture to move to the blanking station, and blank the tested chip after the test is completed. Specifically, the following steps are included: Control the transfer mechanism to transfer the tested chip at the blanking station of the conveying mechanism to the target test fixture at the loading station of another conveying mechanism; Control the ring linear motor of the other conveying mechanism to drive the target test fixture to move to the corresponding test station, and control the corresponding test device to perform a functional test on the tested chip; the two test devices corresponding to the two conveying mechanisms are respectively used to perform tests on the tested chip at different temperatures; After the chip under test is completed with testing, control the ring linear motor of the other conveying mechanism to drive the target test fixture to move to the corresponding unloading station, and unload the chip under test that has completed testing.

11. A chip testing device, which applies the control method according to any one of claims 1-10, characterized in that, It includes: A loading mechanism for loading the chip under test; At least one conveying mechanism, each of the conveying mechanisms includes a ring linear motor and a plurality of test fixtures installed on the ring linear motor. The ring linear motor has a loading station, at least one unloading station and at least one testing station. Each of the test fixtures moves independently and controllably between the loading station, the testing station and the unloading station. The test fixture is configured to receive the chip under test at the loading station; At least one functional mechanism, each of the functional mechanisms corresponds to one of the conveying mechanisms. Each of the functional mechanisms includes a testing device corresponding to the testing station. The testing device is configured to perform a functional test on the chip under test when the test fixture moves to the testing station; An unloading mechanism, arranged on one side of the unloading station, and configured to unload the chip under test that has completed the functional test when the test fixture moves to the unloading station.

12. The testing device according to claim 11, characterized in that, The loading mechanism includes: A first turret, including a first turntable and a plurality of first suction members arranged at intervals along the circumferential side of the first turntable, At least one set of loading components, installed beside the first turret. The first turntable rotates controllably to drive the target first suction member among the plurality of first suction members to move to the target loading component among at least one set of the loading components, so that the target first suction member sucks the chip under test on the target loading component and transports the chip under test.

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