Silicon optical chip spiral arm contact coupling structure and use method

Abstract

The invention relates to the technical field of optical communication, in particular to a silicon optical chip spiral arm contact coupling structure and a use method, and the structure comprises a spiral arm, a clamping assembly and a fixed base. The clamping assembly is rotationally connected with one end of the rotary arm, and the clamping assembly is used for clamping an optical fiber; the rotating arm is rotationally connected with the fixed base; installation shafts are symmetrically arranged on the two sides of the tail of the rotary arm, each installation shaft is provided with a force limiting spring, and the fixed base is provided with installation parts corresponding to the installation shafts and used for containing the force limiting springs. Compared with a traditional rigid coupling method, the force limiting spring is arranged at the tail of the rotating arm, so that the problem of contact force control during coupling of the optical fiber and the silicon optical chip is solved, the contact force of the coupling area of the optical fiber and the silicon optical chip can be controlled within 2N, and the problem of coupling damage of the optical fiber and the silicon optical chip is effectively solved.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a silicon photonic chip spiral arm contact coupling structure and a use method thereof. Background Art

[0002] Silicon photonics is a large-scale integration technology of silicon-based optoelectronics that uses photons and electrons as information carriers. It can greatly improve the performance of integrated chips and is a basic supporting technology for emerging industries such as big data, artificial intelligence, and future mobile communications. It can be widely used in industries such as big data centers, 5G, and the Internet of Things. Silicon photonic chips are integrated optical circuits that integrate silicon photonic materials and devices through standard semiconductor processes. They are mainly composed of modulators, detectors, passive waveguide devices, etc. It can integrate multiple optical devices on the same silicon-based substrate.

[0003] Silicon-based waveguide optical coupling technology is mainly used to solve the problem of interconnecting optical signals on silicon-based integrated optoelectronic chips with external optical signals (wherein the silicon photonic chip is located on the silicon-based integrated optoelectronic chip), and is also a key technology for silicon-based optoelectronic chip packaging. The coupling between single-mode optical fiber and silicon photonic chip will be an important means to solve the problem of large-scale, high-density silicon-based integrated optoelectronic chips and external optical interconnection in the future. The contact coupling between optical fiber and silicon photonic chip is the difficulty of optical coupling technology.

[0004] The purpose of silicon photonic chip coupling is to interconnect the optical signal on the silicon photonic chip with the external optical signal. Since the thickness of the coupling area of ​​the silicon photonic chip is only 8um and it is very fragile, when the contact force between the optical fiber and the silicon photonic chip coupling area is greater than 2N, the silicon photonic chip is likely to be damaged, causing the silicon photonic chip to be scrapped. The conventional coupling method is to rigidly couple the optical fiber to the silicon photonic chip. The contact force of this coupling method is difficult to control. It often happens that when the optical fiber just contacts the coupling area of ​​the silicon photonic chip, the contact force is greater than 2N, causing the silicon photonic chip to be damaged and ineffective.

[0005] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Summary of the invention

[0006] The technical problem to be solved by the present invention is that the existing coupling technology of optical fiber and silicon photonic chip is difficult to control the contact force when the optical fiber and silicon photonic chip are coupled, and the excessive contact force between the two causes the silicon photonic chip to break and fail.

[0007] The present invention adopts the following technical solution:

[0008] In a first aspect, the present invention provides a silicon photonic chip rotary arm contact coupling structure, comprising: a rotary arm 1, a clamping assembly 2 and a fixed base 3;

[0009] The clamping assembly 2 is rotatably connected to one end of the swing arm 1, and the clamping assembly 2 is used for clamping the optical fiber 5; the swing arm 1 is rotatably connected to the fixed base 3;

[0010] On both sides of the tail of the swing arm 1, mounting shafts 11 are symmetrically arranged, and a force-limiting spring 4 is installed on each mounting shaft 11. The fixed base 3 is provided with a mounting part corresponding to the mounting shaft 11 to accommodate the force-limiting spring 4.

[0011] Preferably, a first through hole 10 is provided on the swing arm 1, and a bearing 30 is provided on the fixed base 3. The bearing 30 is coupled with the first through hole 10;

[0012] The bearing 30 includes a bearing part 300 and a first connecting part 301. The bearing part 300 is arranged on the upper surface of the first connecting part 301, and the first connecting part 301 is fixed on the fixed base 3;

[0013] The bearing part 300 includes an inner ring 3000 and an outer ring 3001. A ball is arranged between the inner ring 3000 and the outer ring 3001. The inner ring 3000 and the outer ring 3001 can rotate relative to each other freely, and the outer ring 3001 is coupled with the first through hole 10;

[0014] The lower surface of the bearing part 300 is higher than the upper surface of the fixed base 3.

[0015] Preferably, a circular groove 14 is provided at the bottom of the swing arm 1. The center of the first through hole 10 coincides with the geometric center of the circular groove 14, and the first through hole 10 penetrates through the bottom of the circular groove 14; a first plane 15 is formed between the bottom plane of the first through hole 10 and the circular groove 14. The first plane 15 abuts against the outer ring 3001, and the swing arm 1 and the outer ring 3001 together can rotate relative to the inner ring 3000.

[0016] Preferably, the clamping assembly 2 includes a micro-rotating part 20. An installation part 200 is provided on the upper surface of the micro-rotating part 20. A second through hole 2000 is provided on the installation part 200. A pin shaft is provided on the swing arm 1. The second through hole 2000 is coupled with the pin shaft, and the micro-rotating part 20 rotates around the pin shaft.

[0017] Preferably, a return spring 21 is arranged between one side of the micro-rotating part 20 and the swing arm 1; a return stop pin 22 is arranged on the swing arm 1, and the return stop pin 22 abuts against the installation part 200;

[0018] The mounting portion 200 is provided with a stop surface 2001 and a transition inclined surface 2002. The transition inclined surface 2002 is connected to the stop surface 2001, and the transition inclined surface 2002 is located below the stop surface 2001. When the swing arm 1 is in the natural state, the reset stop pin 22 abuts against the stop surface 2001.

[0019] Preferably, a first groove 201 is provided on one side of the micro-rotating member 20. The first groove 201 is used to accommodate the return spring 21. An installation plate 12 is provided at the head of the swing arm 1. A second groove 13 is provided on the installation plate 12. The second groove 13 is correspondingly arranged with the first groove 201, and the second groove 13 is used to accommodate the return spring 21.

[0020] Preferably, the clamping assembly 2 further includes a connecting arm 23 and an optical fiber clip 24. A first clamping groove 25 is provided at the head of the micro-rotating member 20. The connecting arm 23 is clamped and fixed with the first clamping groove 25.

[0021] A second clamping groove 230 is provided on the lower surface of the connecting arm 23. The optical fiber clip 24 is clamped and fixed with the second clamping groove 230.

[0022] Preferably, notches 2300 for fixing are provided on both sides of the second clamping groove 230. Fixed sliders 240 are provided on both sides of the optical fiber clip 24. The optical fiber clip 24 is clamped with the notches 2300 through the fixed sliders 240.

[0023] Preferably, a spring mounting seat 33 is provided at the tail of the fixed base 3. A third groove 330 corresponding to the mounting shaft 11 is provided inside the spring mounting seat 33. The third groove 330 is used to mount the force-limiting spring 4.

[0024] There is a gap between the end of the mounting shaft 11 and the third groove 330.

[0025] In a second aspect, the present invention provides a method for using a silicon photonic chip swing arm contact coupling structure, which is applicable to the silicon photonic chip swing arm contact coupling structure described in the first aspect. The fixed base 3 is arranged on a fine adjustment frame, including:

[0026] The fine adjustment frame drives the fixed base 3 and the swing arm 1 and the clamping assembly 2 arranged on the fixed base 3 to move.

[0027] The optical fiber 5 is clamped and fixed by the clamping assembly 2. When the fixed base 3 is driven by the fine adjustment frame to move towards the silicon photonic chip, the optical fiber 5 also moves towards the silicon photonic chip together.

[0028] When the coupling region of the optical fiber 5 abuts against the silicon photonic chip 6, the rotating arm 1 connected with the clamping assembly 2 will rotate as the fine adjustment frame continues to move. At this time, for the limiting springs 4 on both sides of the tail of the rotating arm 1, one limiting spring 4 is compressed and the other limiting spring 4 is stretched to buffer the contact force between the optical fiber 5 and the silicon photonic chip 6.

[0029] The beneficial effects of the present invention are as follows: Compared with the rigid coupling method of traditional silicon photonic chip coupling, the present invention solves the problem of contact force control during the coupling of the optical fiber 5 and the silicon photonic chip 6 by setting the limiting springs 4 at the tail of the rotating arm 1; during the coupling process of the optical fiber 5 and the silicon photonic chip 6, when the coupling region of the optical fiber 5 abuts against the silicon photonic chip 6, the force generated instantaneously during abutment is buffered by the two limiting springs 4, which is different from the rigid coupling method of the traditional method, that is, the optical fiber 5 and the silicon photonic chip 6 are directly abutted. If the force at the instant of abutment is too large, it may cause chip damage. The silicon photonic chip rotating arm contact coupling structure provided by the present invention converts the rigid contact coupling into an elastic contact coupling, and can control the contact force of the coupling region of the optical fiber 5 and the silicon photonic chip 6 within 2N, effectively solving the problem of coupling breakage between the optical fiber 5 and the silicon photonic chip 6.

[0030] In the preferred solution, the present invention sets the reset spring 21 between the clamping assembly 2 and the rotating arm 1, so that during the process of the optical fiber 5 being advanced for coupling within the coupling region of the silicon photonic chip 6, the optical fiber 5 will not slip out of the coupling region of the silicon photonic chip 6, ensuring the smooth progress of the coupling process and greatly improving the coupling efficiency. Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly introduced below. Obviously, the following described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 It is a schematic diagram of the overall structure of a silicon photonic chip rotating arm contact coupling structure provided by an embodiment of the present invention;

[0033] Figure 2 It is a schematic diagram of a silicon photonic chip of a silicon photonic chip rotating arm contact coupling structure provided by an embodiment of the present invention;

[0034] Figure 3 It is a schematic diagram of a fixed base of a silicon photonic chip rotating arm contact coupling structure provided by an embodiment of the present invention;

[0035] Figure 4 It is a schematic diagram of the size of the rotating arm of a silicon photonic chip rotating arm contact coupling structure provided by an embodiment of the present invention;

[0036] Figure 5 It is a schematic diagram of the force analysis of the counter-force spring and the cantilever of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0037] Figure 6 It is a schematic diagram of a bearing of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0038] Figure 7 It is a schematic diagram of a circular groove of a cantilever of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0039] Figure 8 It is a side view of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0040] Figure 9a It is a schematic diagram of a micro-rotating member of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0041] Figure 9b It is a schematic diagram of a stop surface and a transition surface of a micro-rotating member of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0042] Figure 10 It is a schematic diagram of a clamping assembly of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0043] Figure 11 It is a schematic diagram of the force analysis of an optical fiber of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0044] Figure 12 It is a schematic diagram of a mounting plate of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0045] Figure 13 It is a schematic diagram of a connecting arm of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0046] Figure 14 It is a schematic diagram of an optical fiber clip of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0047] Figure 15 It is a combined schematic diagram of an optical fiber clip and a connecting arm of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention;

[0048] Figure 16 It is a schematic diagram of the common use of multiple coupling structures of a silicon photonic chip cantilever contact coupling structure provided by an embodiment of the present invention.

[0049] Among them, the reference numerals are as follows:

[0050] 1 - Spinning arm, 10 - First through - hole, 11 - Mounting shaft, 12 - Mounting plate, 13 - Second groove, 14 - Circular groove, 15 - First plane, 16 - Contact portion, 2 - Clamping assembly, 20 - Micro - spinning part, 200 - Mounting portion, 2000 - Second through - hole, 2001 - Stop surface, 2002 - Transition inclined plane, 201 - First groove, 21 - Return spring, 22 - Return stop pin, 23 - Connecting arm, 230 - Second clamping groove, 2300 - Notch, 24 - Optical fiber clip, 240 - Fixed slider, 241 - Semi - circular groove, 242 - Limiting cap, 25 - First clamping groove, 3 - Fixed base, 30 - Bearing, 300 - Bearing part, 3000 - Inner ring, 3001 - Outer ring, 301 - First connecting portion, 302 - Second connecting portion, 3020 - Bearing plane, 32 - Nut, 33 - Spring mounting seat, 330 - Third groove, 34 - Step, 4 - Force - limiting spring, 5 - Optical fiber, 6 - Silicon photonic chip, 60 - V - shaped groove, 600 - First end face, 7 - Horizontal pressure sensor. Detailed implementation manners

[0051] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0052] In the description of the present invention, the orientation or positional relationships indicated by the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom", etc. are based on the orientation or positional relationships shown in the accompanying drawings. These are only for the convenience of describing the present invention and do not require the present invention to be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0053] In the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0054] In the present invention, unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one; it can be directly connected or indirectly connected through an intermediate medium. In addition, the term "coupling" can be a way of electrical connection for signal transmission.

[0055] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0056] Embodiment 1:

[0057] Embodiment 1 of the present invention provides a silicon photonics chip cantilever contact coupling structure, as Figure 1 shown, including: a cantilever 1, a clamping assembly 2, and a fixed base 3. The clamping assembly 2 is used to clamp an optical fiber 5 to couple the optical fiber 5 with the silicon photonics chip 6.

[0058] In an actual application scenario, as Figure 2 shown, a coupling region with the optical fiber 5 is provided on the silicon photonics chip 6. The coupling region can be a V-groove 60. The silicon photonics chip 6 is placed on a horizontal pressure sensor 7, and the silicon photonics chip cantilever contact coupling structure is arranged on a fine adjustment stage. When the optical fiber 5 is coupled with the V-groove 60 of the silicon photonics chip 6, the fine adjustment stage moves towards the silicon photonics chip 6 to drive the optical fiber 5 to slide along the V-groove 60 until the optical fiber 5 abuts against the first end face 600 of the V-groove 60. After the optical fiber 5 abuts against the first end face 600, as the fine adjustment stage continues to move, the cantilever 1 connected to the optical fiber 5 will rotate slightly around the bearing 30. When the fine adjustment stage stops moving, the cantilever 1 with the optical fiber 5 stops rotating, and then an adhesive curing process is performed on the optical fiber 5 and the silicon photonics chip 6 to connect the optical fiber 5 and the silicon photonics chip 6 together. In an actual application scenario, when the optical fiber 5 abuts against the first end face 600, the horizontal pressure sensor 7 will display the magnitude of the horizontal pressure value applied by the current optical fiber 5 on the silicon photonics chip 6. When the horizontal pressure sensor 7 starts to display a value, it means that the optical fiber 5 has abutted against the silicon photonics chip 6, and the fine adjustment stage can be stopped to start the coupling operation. Among them, in this embodiment, the maximum distance that the fine adjustment stage moves each time is about 0.5 mm, that is, when the optical fiber 5 abuts against the first end face 600 of the V-groove 60 and then moves, the movement distance each time will not exceed 0.5 mm. During the movement of the fine adjustment stage to make the optical fiber 5 abut against the V-groove 60, the abutting state of the optical fiber 5 and the V-groove 60 is observed through a Charge-Coupled Device Microscope (abbreviated as CCD).

[0059] The clamping assembly 2 is rotatably connected to one end of the rotating arm 1, and the clamping assembly 2 is used for clamping the optical fiber 5; the rotating arm 1 is rotatably connected to the fixed base 3; wherein, the rotating arm 1 is provided with a first through hole 10, and the fixed base 3 is provided with a bearing 30, and the bearing 30 is coupled with the first through hole 10; mounting shafts 11 are symmetrically arranged on both sides of the tail of the rotating arm 1, and a force-limiting spring 4 is mounted on each mounting shaft 11, and the fixed base 3 is provided with a mounting part corresponding to the mounting shaft 11 to accommodate the force-limiting spring 4. In one embodiment, a pin shaft (not marked in the figure) is provided at the top end of the rotating arm 1, and the clamping assembly 2 is rotatably connected to the rotating arm 1 through the pin shaft.

[0060] When the rotating arm 1 rotates, the rotating arm 1 drives the clamping assembly 2 to rotate together. Among them, in the initial natural state, the force-limiting spring 4 placed between the rotating arm 1 and the fixed base 3 can be compressed by 1 mm. Specifically, in one embodiment, as Figure 3 shown, a spring mounting seat 33 is provided at the tail of the fixed base 3, and a third groove 330 corresponding to the mounting shaft 11 is provided inside the spring mounting seat 33, and the third groove 330 is used for mounting the force-limiting spring 4; there is a gap between the end of the mounting shaft 11 and the third groove 330. Among them, the gap is used to realize the compression or relaxation of the force-limiting spring 4. The spring mounting seat 33 and the fixed base 3 can be connected by bolts, and hole positions for fixing the fixed base 3 on the fine adjustment frame are also provided on both sides of the spring mounting seat 33. In addition, the spring mounting seat 33 can also be used to mount the force-limiting spring 4 by providing the same mounting shaft 11 as the rotating arm 1, but in order to prevent the two relatively mounted mounting shafts 11 from abutting against each other when the rotating arm 1 rotates, making the force-limiting spring 4 unable to be compressed, therefore, in this embodiment, the above-mentioned method of arranging the mounting shaft 11 on one side is adopted, which not only ensures the stability of the installation of the force-limiting spring 4, but also enables the force-limiting spring 4 to play a role.

[0061] In one embodiment, the elastic coefficient K of the force-limiting spring 4 is less than or equal to 2 N / mm; in addition, in order to facilitate the calculation and control of the contact force of the coupling area between the optical fiber 5 and the silicon optical chip 6, according to the torque formula M = FL, in this embodiment, as Figure 4As shown, with the center of the first through-hole 10 as the center, the distance d1 from the tail of the swing arm 1 to the center of the first through-hole 10 is equal to the distance d2 between the clamping assembly 2 connected to the head of the swing arm 1 and the first through-hole 10. In the initial state, the swing arm 1 is in a balanced state under the extrusion of the springs on both sides; when the optical fiber 5 abuts against the V-groove 60 of the silicon optical chip 6, the optical fiber 5 and the silicon optical chip 6 are in a static state for coupling operation. Therefore, the torques of both ends of the swing arm 1 with respect to the center of the first through-hole 10 are torques with equal magnitudes and opposite directions. Since d1 = d2, the elastic forces exerted by the force-limiting springs 4 located at both ends of the swing arm 1 on the swing arm 1 are equal to the contact forces exerted by the optical fiber 5 from the silicon optical chip 6, as described in detail below.

[0062] As Figure 5 shown, when the optical fiber 5 is in coupled contact with the V-groove 60, the first end face 600 of the optical fiber 5 and the V-groove 60 mutually receive contact thrusts. Since the optical fiber 5 is fixed to the swing arm 1 through the clamping assembly 2, the contact thrust received by the optical fiber 5 will be transmitted to the swing arm 1, causing the swing arm 1 to rotate slightly. Here, it is assumed that the force received by the optical fiber 5 is F T , F T 's direction determines the rotation direction of the swing arm 1 (in the direction shown in Figure 5 , that is, clockwise rotation), which means that the torque generated by F T is the positive torque M1 = F T *d2.

[0063] Since, in the initial natural state, the force-limiting springs 4 placed between the swing arm 1 and the fixed base 3 are both compressed by 1 mm. Under the action of the contact force F T , the force-limiting spring 4 on the left side of the tail of the swing arm 1 is relaxed (i.e., the corresponding elastic force decreases), and the force-limiting spring 4 on the right side of the tail of the swing arm 1 continues to be compressed (i.e., the corresponding elastic force increases). The two force-limiting springs 4 interact to offset F T . Assume that the force exerted by the force-limiting spring 4 on the left side of the swing arm 1 is F1 (direction to the right), and the force exerted by the force-limiting spring 4 on the right side of the swing arm 1 is F2 (direction to the left); therefore, taking the direction shown in the figure as an example, when the swing arm 1 rotates slightly, F1 decreases and F2 increases. Adding the two forces together F1 + F2, the torque generated by the forces exerted by the two force-limiting springs 4 on the swing arm 1 is the negative torque M2 = (F1 + F2)*d1. The positive torque M1 and the negative torque M2 cancel each other out, preventing the swing arm 1 from continuing to rotate.

[0064] In practical application scenarios, as mentioned above, the maximum distance that the fine adjustment frame moves each time is about 0.5 mm. That is, when the optical fiber 5 abuts against the first end face 600 of the V-groove 60 and then moves, the moving distance each time will not exceed 0.5 mm. In this embodiment, even assuming that the elastic coefficient K of the force-limiting spring 4 is set to the maximum value of 2 N / mm, and the moving distance after the optical fiber 5 abuts against the V-groove 60 is the maximum value of 0.5 mm. According to the elastic force formula F = Kx of the force-limiting spring 4, since the force-limiting spring 4 is compressed by 1 mm in the initial state, the force-limiting springs 4 on both sides of the swing arm 1 apply forces of 2 N in opposite directions to the swing arm 1 in the initial state. Taking the direction shown in the figure as an example, when the optical fiber 5 abuts against the silicon photonic chip 6 as the fine adjustment frame moves, and makes a small rotation around the bearing 30 as the fine adjustment frame continues to move. When the fine adjustment frame stops moving, the swing arm 1 with the optical fiber 5 stops rotating. Assuming that after the optical fiber 5 abuts against the first end face 600, the movement of the fine adjustment frame stretches the left force-limiting spring 4 by 0.5 mm and compresses the right force-limiting spring 4 by 0.5 mm. At this time, the force F1 of the left force-limiting spring 4 = 2 N - 1 N = 1 N; the force F2 applied by the right force-limiting spring 4 to the swing arm 1 = 2 N + 1 N = 3 N, and the directions of F1 and F2 are opposite, so F1 + F2 = 2 N; since F T = F1 + F2, F T = 2 N, the contact force between the optical fiber 5 and the silicon photonic chip 6 is an interaction, and the force magnitudes are the same. Therefore, the contact force received by the silicon photonic chip 6 is approximately equal to the difference in the elastic force of the force-limiting spring 4, which can ensure that the contact force between the optical fiber 5 and the silicon photonic chip 6 always remains below 2 N.

[0065] Compared with the traditional rigid coupling method for silicon photonic chip coupling, the present invention solves the problem of contact force control during the coupling of the optical fiber 5 and the silicon photonic chip 6 by setting the force-limiting spring 4 at the tail of the swing arm 1; during the coupling process of the optical fiber 5 and the silicon photonic chip 6, when the coupling area of the optical fiber 5 and the silicon photonic chip 6 abuts, the force generated at the moment of abutment is buffered through the setting of the force-limiting spring 4, which is different from the traditional rigid coupling method, that is, the optical fiber 5 and the silicon photonic chip 6 directly abut. If the force at the moment of abutment is too large, it may cause chip damage. The silicon photonic chip swing arm contact coupling structure provided by the present invention converts the rigid contact coupling into an elastic contact coupling, which can control the contact force in the coupling area of the optical fiber 5 and the silicon photonic chip 6 within 2 N, effectively solving the problem of coupling breakage between the optical fiber 5 and the silicon photonic chip 6.

[0066] In the preferred solution, combined with Figure 10 , the present invention sets a return spring 21 between the clamping assembly 2 and the swing arm 1, so that during the process of the optical fiber 5 being advanced and coupled within the coupling area of the silicon photonic chip 6, the optical fiber 5 will not slip out of the coupling area of the silicon photonic chip 6, ensuring the smooth progress of the coupling process and greatly improving the coupling efficiency.

[0067] To elaborate on the complete solution provided by the embodiments of the present invention, the details of the above-mentioned structures will be further described in detail below.

[0068] In the silicon photonic chip cantilever contact coupling structure provided by the present invention, the cantilever 1 rotates around the bearing 30 as the center, as Figure 6 shown. The bearing 30 includes a bearing part 300 and a first connecting part 301. The bearing part 300 is disposed on the upper surface of the first connecting part 301, and the first connecting part 301 is fixed to the fixed base 3. The bearing part 300 includes an inner ring 3000 and an outer ring 3001. There are balls disposed between the inner ring 3000 and the outer ring 3001. The inner ring 3000 and the outer ring 3001 can rotate freely relative to each other, and the outer ring 3001 is coupled with the first through hole 10. Refer to Figure 8 shown. The lower surface of the bearing part 300 is higher than the upper surface of the fixed base 3. Among them, the nut 32 is coupled with the first connecting part 301 to play a role in fixing the bearing 30. The structure of the bearing 30 is well-known technical content to those skilled in the art and will not be elaborated here.

[0069] In order to couple the cantilever 1 with the bearing 30 and realize the free rotation of the cantilever 1, as Figure 7 shown, a circular groove 14 is provided at the bottom of the cantilever 1. The center of the first through hole 10 coincides with the geometric center of the circular groove 14, and the first through hole 10 penetrates through the bottom of the circular groove 14. A first plane 15 is formed between the bottom plane of the first through hole 10 and the circular groove 14. The first plane 15 abuts against the outer ring 3001, and the cantilever 1 can rotate relative to the inner ring 3000 together with the outer ring 3001.

[0070] According to the composition structure of the bearing 30, the parts below the cantilever 1 are part of the bearing part 300 and the first connecting part 301. If the fixed base 3 is a rectangular body with a completely horizontal surface, when the bearing 30 is installed on the fixed base 3, it will cause a relatively high overall height of the silicon photonic chip cantilever contact coupling structure, which is not conducive to the overall stability of the structure. In order to reduce the overall height of the silicon photonic chip cantilever contact coupling structure, refer to Figure 8 shown. A step 34 is provided on the fixed base 3 for installing the bearing 30. The bearing 30 is fixed to the step 34 through the nut 32. The distance between the step 34 and the upper surface of the fixed base 3 accommodates a part of the height of the bearing 30, thereby reducing the overall height of the structure.

[0071] In the coupling structure, a clamping assembly 2 is provided at the head of the cantilever 1 for clamping the optical fiber 5. Usually, the clamping assembly 2 can be fixedly connected to the cantilever 1, that is, the clamping assembly 2 does not rotate relative to the cantilever 1. However, if it is fixedly arranged in this way, when the optical fiber 5 is coupled with the V-groove 60 of the silicon optical chip 6, the optical fiber 5 may not be in close contact with the first end face 600 of the V-groove 60, which is not conducive to the subsequent coupling process. In view of the above problems, the embodiments of the present invention have made the following design solutions. Refer to Figure 8 and Figure 9a As shown, the clamping assembly 2 includes a micro-rotating member 20. An installation portion 200 is provided on the upper surface of the micro-rotating member 20. A second through hole 2000 is provided on the installation portion 200. A pin shaft is provided on the cantilever 1. The second through hole 2000 is coupled with the pin shaft, and the micro-rotating member 20 rotates around the pin shaft.

[0072] Since the sensitivity of the rotation of the micro-rotating member 20 is higher than that between the cantilever 1 and the fixed base 3, if there is only the above-mentioned micro-rotating member 20 that can rotate relative to the cantilever 1, the optical fiber 5 may be bounced off as soon as it touches the first end face 600 of the V-groove 60, which is not sufficient to meet the requirement of closely contacting the optical fiber 5 with the first end face 600. And to avoid the problem that the pressure applied to the first end face 600 by the optical fiber 5 exceeds 2N at the moment of contact with the first end face 600, as Figure 10 As shown, a return spring 21 is provided between one side of the micro-rotating member 20 and the cantilever 1; a return stop pin 22 is provided on the cantilever 1, and the return stop pin 22 abuts against the installation portion 200; as Figure 9b As shown, a stop surface 2001 and a transition inclined surface 2002 are provided on the side surface of the installation portion 200. The transition inclined surface 2002 is connected to the stop surface 2001, and the transition inclined surface 2002 is located below the stop surface 2001; when the cantilever 1 is in a natural state, the return stop pin 22 abuts against the stop surface 2001.

[0073] Among them, the elastic coefficient of the return spring 21 is 2N / mm. When the return spring 21 is placed between the micro-rotating member 20 and the cantilever 1, the return spring 21 is in a slightly compressed state. When the optical fiber 5 is in coupling contact with the silicon optical chip 6, the micro-rotating member 20 is subjected to the thrust transmitted by the optical fiber 5, causing the micro-rotating member 20 to rotate around the pin shaft, pushing the return spring 21, and the return spring 21 applies a pressure to the micro-rotating member 20 so that the optical fiber 5 is in close contact with the V-groove 60. The specific principle is as Figure 11 As shown, according to Newton's third law, the action of force is mutual. The force exerted by the optical fiber 5 on the first end face 600 of the V-groove 60 is equal to the thrust F V exerted by the first end face 600 of the V-groove 60 on the optical fiber 5 Vis perpendicular to the direction of the spiral arm 1, and the thrust on the optical fiber 5 can be decomposed into a horizontal thrust F V1 and a downward pressure F V2 , and the downward pressure acts on the optical fiber 5, pressing the optical fiber 5 tightly in the V-groove 60 of the silicon optical chip 6, thereby ensuring that the optical fiber 5 will not slip out of the V-groove 60 of the silicon optical chip 6 during the contact coupling process. In addition, as the thrust F V increases, the pressure F V2 also increases accordingly, firmly pressing the optical fiber 5 in the V-groove 60 and ensuring the function that the optical fiber 5 will not slip out of the V-groove 60. After the coupling operation of the optical fiber 5 and the silicon optical chip 6 is completed, the optical fiber 5 is separated from the clamping assembly 2, and the micro-rotating member 20 is not stressed. The micro-rotating member 20 will rotate counterclockwise to reset. To prevent the thrust of the reset spring 21 on the micro-rotating member 20 from causing the micro-rotating member 20 to not be in a horizontal state, a reset stop pin 22 can be provided on the opposite side of the reset spring 21 to keep the micro-rotating member 20 in a horizontal state and be able to clamp the optical fiber 5 horizontally. At the same time, it plays a role in buffering the moment when the optical fiber 5 abuts against the silicon optical chip 6.

[0074] Regarding the setting of the above-mentioned reset spring 21, in one embodiment, as shown in Figure 9a 、 Figure 10 and Figure 12 , a first groove 201 is provided on one side of the micro-rotating member 20 for accommodating the reset spring 21. An installation plate 12 is provided at the head of the spiral arm 1, and a second groove 13 is provided on the installation plate 12. The second groove 13 is correspondingly arranged with the first groove 201 for accommodating the reset spring 21. In addition to accommodating the reset spring 21 in the form of a groove, installation shafts can be respectively provided on the installation plate 12 and the micro-rotating member 20 to fix the reset spring 21. However, considering the small distance between the installation plate 12 and the micro-rotating member 20, setting the installation shafts further occupies the distance space between the installation plate 12 and the micro-rotating member 20. Therefore, in order to make the reset spring 21 play the maximum role, the preferred solution is to use the form of a groove to accommodate the spring.

[0075] The function of the clamping assembly 2 is to clamp the optical fiber 5. As shown in Figure 9a and Figure 10 , the clamping assembly 2 further includes a connecting arm 23 and an optical fiber clip 24. A first clamping groove 25 is provided at the head of the micro-rotating member 20, and the connecting arm 23 is clamped and fixed with the first clamping groove 25. In one embodiment, the connecting arm 23 is L-shaped. When the connecting arm 23 is clamped and fixed with the first clamping groove 25, the short inner side of the L-shape of the connecting arm 23 abuts against one side of the micro-rotating member 20, and the long side of the L-shape of the connecting arm 23 is clamped in the first clamping groove 25. As shown in Figure 13As shown, a second clamping groove 230 is provided on the lower surface of the connecting arm 23, and the optical fiber clip 24 is clamped and fixed with the second clamping groove 230.

[0076] In one embodiment, as Figure 13 and Figure 14 shown, notches 2300 for fixing are provided on both sides of the second clamping groove 230. As Figure 14 shown, fixing sliders 240 are provided on both sides of the optical fiber clip 24, and the optical fiber clip 24 is clamped with the notches 2300 through the fixing sliders 240. During the assembly process, the optical fiber clip 24 is slid into the notches 2300 through the fixing sliders 240 on both sides for clamping and fixing. As Figure 15 shown, for the optical fiber clip 24, a semi-circular groove 241 is provided inside the head clip of the optical fiber clip 24 to more firmly clamp the optical fiber 5. At the tail of the optical fiber clip 24, a limit cap 242 for preventing the optical fiber clip 24 from slipping off is provided, and the limit cap 242 is threadedly connected to the tail of the optical fiber clip 24.

[0077] Based on the silicon photonic chip rotating arm contact coupling structure of the foregoing embodiment, an embodiment of the present invention provides a usage method of the silicon photonic chip rotating arm contact coupling structure. First, the fixed base 3 is arranged on the fine adjustment frame. Driven by the fine adjustment frame, the usage method includes: the fine adjustment frame drives the fixed base 3 and the rotating arm 1 and the clamping assembly 2 arranged on the fixed base 3 to move; the optical fiber 5 is clamped and fixed by the clamping assembly 2. When the fixed base 3 is driven by the fine adjustment frame to move towards the silicon photonic chip, the optical fiber 5 also moves towards the silicon photonic chip together; when the optical fiber 5 abuts against the coupling region of the silicon photonic chip 6, the rotating arm 1 connected with the clamping assembly 2 will rotate as the fine adjustment frame continues to move. At this time, one of the force-limiting springs 4 located on both sides of the tail of the rotating arm 1 is compressed, and the other force-limiting spring 4 is stretched to buffer the contact force between the optical fiber 5 and the silicon photonic chip 6; a horizontal pressure sensor 7 is arranged below the silicon photonic chip 6. When the optical fiber 5 abuts against the silicon photonic chip 6, the horizontal pressure sensor 7 will display the magnitude of the horizontal pressure exerted by the optical fiber 5 on the silicon photonic chip 6. In addition, as Figure 16 shown, in an actual application scenario, multiple silicon photonic chip rotating arm contact coupling structures can also be combined for use to improve the coupling efficiency.

[0078] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon photonics chip cantilever contact coupling structure, characterized in that, Comprising: A rotating arm (1), a clamping assembly (2) and a fixed base (3); The clamping assembly (2) is rotatably connected to one end of the rotating arm (1), and the clamping assembly (2) is used for clamping an optical fiber (5); the rotating arm (1) is rotatably connected to the fixed base (3); Mounting shafts (11) are symmetrically arranged on both sides of the tail of the rotating arm (1), a force-limiting spring (4) is mounted on each mounting shaft (11), and the fixed base (3) is provided with a mounting part corresponding to the mounting shaft (11) to accommodate the force-limiting spring (4).

2. The silicon photonic chip cantilever contact coupling structure according to claim 1, wherein A first through hole (10) is provided on the rotating arm (1), a bearing (30) is provided on the fixed base (3), and the bearing (30) is coupled with the first through hole (10); The bearing (30) includes a bearing part (300) and a first connecting part (301), the bearing part (300) is arranged on the upper surface of the first connecting part (301), and the first connecting part (301) is fixed on the fixed base (3); The bearing part (300) includes an inner ring (3000) and an outer ring (3001), balls are arranged between the inner ring (3000) and the outer ring (3001), the inner ring (3000) and the outer ring (3001) can rotate relative to each other freely, and the outer ring (3001) is coupled with the first through hole (10); The lower surface of the bearing part (300) is higher than the upper surface of the fixed base (3).

3. The silicon photonics chip cantilever contact coupling structure according to claim 2, characterized in that A circular groove (14) is provided at the bottom of the rotating arm (1), the center of the first through hole (10) coincides with the geometric center of the circular groove (14), and the first through hole (10) penetrates the bottom plane of the circular groove (14); a first plane (15) is formed between the first through hole (10) and the bottom plane of the circular groove (14), the first plane (15) abuts against the outer ring (3001), and the rotating arm (1) together with the outer ring (3001) can rotate relative to the inner ring (3000).

4. The silicon photonics chip cantilever contact coupling structure according to claim 1, wherein The clamping assembly (2) includes a micro-rotating member (20), a mounting part (200) is provided on the upper surface of the micro-rotating member (20), a second through hole (2000) is provided on the mounting part (200), a pin shaft is provided on the rotating arm (1), the second through hole (2000) is coupled with the pin shaft, and the micro-rotating member (20) rotates around the pin shaft.

5. The silicon photonic chip cantilever contact coupling structure according to claim 4, characterized in that A return spring (21) is arranged between one side of the micro-rotating member (20) and the rotating arm (1); a return stop pin (22) is provided on the rotating arm (1), and the return stop pin (22) abuts against the mounting part (200); A stop surface (2001) and a transition inclined surface (2002) are provided on the side surface of the mounting part (200), the transition inclined surface (2002) is connected to the stop surface (2001), and the transition inclined surface (2002) is located below the stop surface (2001); when the rotating arm (1) is in a natural state, the return stop pin (22) abuts against the stop surface (2001).

6. The silicon photonics chip cantilever contact coupling structure according to claim 5, characterized in that One side of the micro-rotating part (20) is provided with a first groove (201) for accommodating the return spring (21). The head of the rotating arm (1) is provided with a mounting plate (12), and the mounting plate (12) is provided with a second groove (13) corresponding to the first groove (201) for accommodating the return spring (21).

7. The silicon photonics chip cantilever contact coupling structure according to claim 4, wherein The clamping assembly (2) further includes a connecting arm (23) and an optical fiber clip (24). The head of the micro-rotating part (20) is provided with a first clamping groove (25), and the connecting arm (23) is clamped and fixed with the first clamping groove (25). The lower surface of the connecting arm (23) is provided with a second clamping groove (230), and the optical fiber clip (24) is clamped and fixed with the second clamping groove (230).

8. The silicon photonic chip cantilever contact coupling structure according to claim 7, wherein Both sides of the second clamping groove (230) are provided with notches (2300) for fixing. Both sides of the optical fiber clip (24) are provided with fixing sliders (240), and the optical fiber clip (24) is clamped with the notches (2300) through the fixing sliders (240).

9. The silicon photonic chip cantilever contact coupling structure according to any one of claims 1-8, characterized in that, The tail of the fixed base (3) is provided with a spring mounting seat (33). The inner side of the spring mounting seat (33) is provided with a third groove (330) corresponding to the mounting shaft (11) for installing a force-limiting spring (4). There is a gap between the end of the mounting shaft (11) and the third groove (330).

10. A method of using a silicon photonics chip cantilever contact coupling structure, applicable to the silicon photonics chip cantilever contact coupling structure described in any one of claims 1-9, wherein the fixed base (3) is arranged on the fine adjustment frame, and is characterized in that, Including: The fine adjustment frame drives the fixed base (3) and the rotating arm (1) and the clamping assembly (2) arranged on the fixed base (3) to move. The optical fiber (5) is clamped and fixed by the clamping assembly (2). When the fixed base (3) is driven by the fine adjustment frame to move towards the silicon optical chip, the optical fiber (5) also moves towards the silicon optical chip. When the optical fiber (5) abuts against the coupling area of the silicon optical chip (6), the rotating arm (1) connected to the clamping assembly (2) will rotate as the fine adjustment frame continues to move. At this time, for the force-limiting springs (4) on both sides of the tail of the rotating arm (1), one force-limiting spring (4) is compressed and the other force-limiting spring (4) is stretched to buffer the contact force between the optical fiber (5) and the silicon optical chip (6).

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