Self-control heat dissipation dustproof computer case

Abstract

The invention discloses a self-control heat dissipation dustproof computer case, and relates to the technical field of computer cases, the self-control heat dissipation dustproof computer case comprises a case body frame, a front end panel, a rear end panel, a heat dissipation module and a control module, the two side plates are mounted on the two sides of the box body frame respectively; the installation frame is arranged in the box body frame and installed on one side plate, a containing groove is formed in the installation frame from top to bottom in a penetrating mode, and an installation groove is formed in the upper portion of the containing groove. Heat conduction and heat dissipation treatment can be continuously carried out on heating hardware through the exchange type heat dissipation assembly, and the first heat dissipation component and the second heat dissipation component can be alternately used under the control of the first electric telescopic rod and the second electric telescopic rod; therefore, it can be guaranteed that the first heat dissipation component and the second heat dissipation component used for heat conduction are not in a continuous high-temperature heat conduction state, the good heat dissipation effect can be guaranteed, and then it can be guaranteed that hardware such as a mainboard can be cooled to the proper temperature more quickly.

Description

Technical Field

[0001] The present invention relates to the technical field of computer chassis, and particularly relates to a self-controlled heat dissipation and dust-proof computer chassis. Background Art

[0002] A computer chassis generally includes a housing, brackets, various switches and indicators on the panel, etc. The housing is made of a combination of steel plates and plastics, with high hardness, and mainly serves to protect the components inside the chassis. The brackets are mainly used to fix the motherboard, power supply and various drives. There are many computer hardware components in the computer chassis, which generate a large amount of heat during operation, so heat dissipation is required.

[0003] The patent with the publication number CN107613732A discloses a chassis heat dissipation structure, which includes: a chassis body having a frame, a heat dissipation module and at least one heat conduction unit. The frame is for setting at least one server host. The heat dissipation module has at least one heat dissipation unit and a plurality of fan units. The heat dissipation unit is arranged between the fan unit and the server host. The heat conduction unit has at least one first end and a second end. The first end contacts a heat generating module of the server host, and the second end contacts the heat dissipation unit. The heat conduction unit conducts the heat of the heat generating module to the heat dissipation unit, and the heat dissipation unit dissipates heat through the fan unit. Through the design of the present invention, the heat dissipation effect and space utilization effect of the internal space of the chassis body can be effectively improved.

[0004] When heat dissipation is carried out in the chassis in the above technical solution, the conduction structure continuously contacts the heat generating hardware. Therefore, after the temperature of the conduction structure rises, the heat dissipation effect will seriously decline, which will lead to insufficient heat dissipation capacity and cannot quickly control the hardware temperature within a suitable range. And opening ventilation holes on the chassis in cooperation with the radiator will cause a large amount of dust to enter the chassis. Summary of the Invention

[0005] The purpose of the present invention is to provide a self-controlled heat dissipation and dust-proof computer chassis, which solves the problem that the conduction structure continuously contacts the heat generating hardware, so that the heat dissipation effect will seriously decline after the temperature of the conduction structure rises, resulting in insufficient heat dissipation capacity.

[0006] The present invention solves the above technical problems through the following technical solutions. The present invention includes: Cabinet Frame: A front panel, which is installed on the front side of the cabinet frame; Two side panels, which are respectively installed on both sides of the cabinet frame; Installation frame, the installation frame is arranged inside the box frame and the installation frame is installed on one of the side plates. An accommodation groove is penetrated through the installation frame from top to bottom inside, an installation groove is opened above the accommodation groove, and a main board mounting plate is installed in the installation groove; A switching heat dissipation component, which is used to dissipate heat from the computer hardware installed on the main board mounting plate. The switching heat dissipation component is arranged inside the installation frame and is located below the main board mounting plate. The switching heat dissipation component includes a heat collecting plate, a heat conducting plate, a first heat dissipation member, a second heat dissipation member, a first electric telescopic rod and a second electric telescopic rod. The heat collecting plate is fixedly installed at the bottom of the installation frame, the heat conducting plate is installed above the heat collecting plate. The heat collecting plate is in an S-shaped shape and there are a plurality of positioning grooves on both sides. The first heat dissipation member and the second heat dissipation member are both arranged above the heat collecting plate and are respectively arranged on both sides of the heat conducting plate. The first heat dissipation member and the second heat dissipation member are both composed of heat conducting strips and a plurality of fins. A plurality of the fins are installed on one side of the heat conducting strip and the fins are clamped in the positioning grooves. The first electric telescopic rod and the second electric telescopic rod are both installed at the bottom of the heat collecting plate. The first heat dissipation member is installed at the output end of the first electric telescopic rod, and the second heat dissipation member is installed at the output end of the second electric telescopic rod; A first temperature sensor and a second temperature sensor are respectively installed on the first heat dissipation member and the second heat dissipation member. A controller is arranged on the front panel. The first temperature sensor and the second temperature sensor are both communicatively connected to the controller, and the controller is communicatively connected through the first electric telescopic rod and the second electric telescopic rod.

[0007] Preferably, the heat conducting plate, the first heat dissipation member and the second heat dissipation member form a cuboid plate with the same cross-sectional area as the installation frame.

[0008] Preferably, an installation shell is installed on one side of the installation frame, and a plurality of radiators are sequentially installed on the installation shell.

[0009] Preferably, a heat conducting groove is opened inside the heat collecting plate near the side plate, and a movable heat dissipation component is arranged in the heat conducting groove. The movable heat dissipation component includes a sealing piece, a heat conducting piece and a plurality of limiting springs. The sealing piece is clamped in the heat conducting groove, a vacuum cavity is arranged between the sealing piece and the inner wall of the heat conducting groove, the limiting springs are installed between the sealing piece and the side plate, the heat conducting piece is installed at one end of the sealing piece, and heat dissipation openings are opened on the side plate and the installation frame. One end of the heat conducting piece is clamped in the heat dissipation opening.

[0010] Preferably, the vacuum cavity is filled with a coolant.

[0011] Preferably, a sealing member is installed at one end of the heat conducting piece, and a ventilation groove is opened on the side plate. The sealing member is clamped in the ventilation groove.

[0012] Preferably, the seal includes a metal rod and two metal plates. The metal plates are welded to both ends of the metal rod, and a plurality of notches are formed in the metal plates.

[0013] Preferably, an interactive panel is provided on the front end panel, and a power button and a plurality of wiring ports are provided on the interactive panel.

[0014] Preferably, a rear baffle is installed at the rear side of the box frame, and raised strips are installed on both the rear baffle and the side plates.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Through the switching heat dissipation component of the present invention, heat conduction and heat dissipation treatment can be continuously carried out on the heat-generating hardware. The first heat dissipation member and the second heat dissipation member can be alternately used under the control of the first electric telescopic rod and the second electric telescopic rod. Therefore, it can be ensured that the first heat dissipation member and the second heat dissipation member for heat conduction will not be in a continuous high-temperature heat conduction state, so that good heat dissipation effect can be guaranteed, and further it can be ensured that hardware such as the main board can be cooled to a suitable temperature faster.

[0016] 2. Through the movable heat dissipation component of the present invention, the coolant can be used to absorb heat and the evaporation of the coolant can be used to push the heat conduction plate outwards, so that the heat conduction plate can be in contact with the external air and heat dissipation can be quickly completed.

[0017] 3. The present invention also controls the position of the seal through the movable heat dissipation component. When the heat-generating hardware in the computer case is not in use, the seal can cooperate with the ventilation slot to make the case in a sealed state. During the heat conduction process, the seal can move out of the ventilation slot, which can greatly improve the heat dissipation efficiency during heat dissipation and ensure that the case is in a sealed and dust-proof state when not in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the structural view of the present invention; Figure 2 is the internal structural view of the box frame of the present invention; Figure 3 is the structural view of the installation frame of the present invention; Figure 4 is the top exploded view of the installation frame of the present invention; Figure 5 is the bottom exploded view of the installation frame of the present invention; Figure 6 is the exploded view of the switching heat dissipation component of the present invention; Figure 7 is the sectional view of the heat collecting plate of the present invention; Figure 8 is the structural view of the seal of the present invention.

[0019] The numbers in the figures represent: 1. Cabinet frame; 2. Front panel; 3. Side panel; 4. Mounting frame; 5. Motherboard mounting plate; 6. Switchable heat dissipation component; 601. Heat collecting plate; 602. Heat conducting plate; 603. First heat dissipation member; 604. Second heat dissipation member; 605. First electric telescopic rod; 606. Second electric telescopic rod; 7. Positioning groove; 8. Heat conducting strip; 9. Fins; 10. First temperature sensor; 11. Second temperature sensor; 12. Mounting shell; 13. Radiator; 14. Heat conducting groove; 15. Movable heat dissipation component; 1501. Sealing piece; 1502. Heat conducting piece; 1503. Limiting spring; 16. Vacuum chamber; 17. Heat dissipation port; 18. Coolant; 19. Ventilation groove; 20. Metal rod; 21. Metal plate; 22. Interaction panel; 23. Power button; 24. Wiring port; 25. Controller; 26. Raised strip; 27. Seal. Detailed implementation mode

[0020] The following further elaborates on the above and other technical features and advantages of the present invention in conjunction with the accompanying drawings.

[0021] Embodiment 1 This embodiment provides a technical solution: an automatic heat dissipation and dust-proof computer chassis, as Figure 1 shown, including a cabinet frame 1, a front panel 2, two side panels 3, a mounting frame 4 and a switchable heat dissipation component 6.

[0022] In a specific implementation, as Figure 2 and Figure 3 shown, the front panel 2 is installed on the front side of the cabinet frame 1, the two side panels 3 are respectively installed on both sides of the cabinet frame 1, the mounting frame 4 is arranged inside the cabinet frame 1 and the mounting frame 4 is installed on one of the side panels 3. A receiving groove is vertically penetrated inside the mounting frame 4, and a mounting groove is opened above the receiving groove. A motherboard mounting plate 5 is installed in the mounting groove. Through the motherboard mounting plate 5, computer hardware such as a motherboard and a processor can be installed. A controller 25 is provided on the front panel 2.

[0023] In a specific implementation, as Figures 3 - 6As shown, the switching heat dissipation component 6 is used to dissipate heat from the computer hardware installed on the motherboard mounting plate 5. The switching heat dissipation component 6 is arranged within the mounting frame 4 and is located below the motherboard mounting plate 5. The temperature detection unit in the motherboard and other hardware is connected to the controller 25. When the detected temperature is too high, the switching heat dissipation component 6 can be triggered through the controller 25. Therefore, automatic temperature control can be achieved, thus preventing the occurrence of overheating. The switching heat dissipation component 6 can conduct heat and dissipate heat from the heat-generating hardware on the motherboard mounting plate 5. The switching heat dissipation component 6 includes a heat collecting plate 601, a heat conducting plate 602, a first heat dissipation member 603, a second heat dissipation member 604, a first electric telescopic rod 605, and a second electric telescopic rod 606. The heat collecting plate 601 is fixedly installed at the bottom of the mounting frame 4, and the heat conducting plate 602 is installed above the heat collecting plate 601. The heat collecting plate 601 is in an S shape and multiple positioning grooves 7 are provided on both sides. Both the first heat dissipation member 603 and the second heat dissipation member 604 are arranged above the heat collecting plate 601 and are respectively arranged on both sides of the heat conducting plate 602. Both the first heat dissipation member 603 and the second heat dissipation member 604 are composed of heat conducting strips 8 and multiple fins 9. The multiple fins 9 are installed on one side of the heat conducting strip 8 and the fins 9 are clamped in the positioning grooves 7. Therefore, it can ensure that the contact area between the first heat dissipation member 603 and the second heat dissipation member 604 and the heat conducting plate 602 is large, thereby accelerating the heat conduction speed between the first heat dissipation member 603 and the second heat dissipation member 604 and the heat conducting plate 602. When the first heat dissipation member 603 or the second heat dissipation member 604 is in contact with the heat-generating hardware respectively, it can absorb the heat generated by the heat-generating hardware, thereby helping the heat-generating hardware dissipate heat. The heat conducting plate 602, the first heat dissipation member 603, and the second heat dissipation member 604 form a cuboid plate with the same cross-sectional area as the mounting frame 4. The first electric telescopic rod 605 and the second electric telescopic rod 606 are both installed at the bottom of the heat collecting plate 601. The first heat dissipation member 603 is installed at the output end of the first electric telescopic rod 605, and the second heat dissipation member 604 is installed at the output end of the second electric telescopic rod 606. The first electric telescopic rod 605 and the second electric telescopic rod 606 can be alternately switched on to alternately use the first heat dissipation member 603 and the second heat dissipation member 604 to dissipate heat from the heat-generating hardware, thereby ensuring that the first heat dissipation member 603 and the second heat dissipation member 604 used for heat conduction do not remain in a continuously high-temperature heat conduction state, thus ensuring good heat dissipation effect.

[0024] A first temperature sensor 10 and a second temperature sensor 11 are respectively installed on a first heat dissipation member 603 and a second heat dissipation member 604. Both the first temperature sensor 10 and the second temperature sensor 11 are communicatively connected to a controller 25. The controller 25 is communicatively connected through a first electric telescopic rod 605 and a second electric telescopic rod 606. The current temperatures of the first heat dissipation member 603 and the second heat dissipation member 604 can be detected through the first temperature sensor 10 and the second temperature sensor 11. Therefore, when the first heat dissipation member 603 or the second heat dissipation member 604 overheats, they can be switched to each other in time, so as to ensure good heat dissipation effect.

[0025] Computer hardware can be installed on a main board mounting plate 5. When the heat generation temperature of the computer hardware reaches the set temperature, a temperature detection unit in the computer hardware can transmit temperature information to the controller 25. Therefore, the controller 25 can activate the first electric telescopic rod 605, and the first electric telescopic rod 605 can push the first heat dissipation member 603 upward. The first heat dissipation member 603 can contact the main board mounting plate 5, so as to quickly absorb the heat generated by the heat-generating hardware. When the first temperature sensor 10 detects that the temperature of the first heat dissipation member 603 is too high, it can transmit temperature information to the controller 25. The controller 25 can activate the second electric telescopic rod 606 and control the first electric telescopic rod 605 to retract. The second electric telescopic rod 606 can push the second heat dissipation member 604 upward. The second heat dissipation member 604 can contact the main board mounting plate 5, so as to quickly absorb the heat generated by the heat-generating hardware. At the same time, the first electric telescopic rod 605 can drive the first heat dissipation member 603 to reset. Each fin 9 in the first heat dissipation member 603 fits into the positioning groove 7 on the heat conduction plate 602. Therefore, the heat can be quickly conducted to the heat conduction plate 602, so that the first heat dissipation member 603 can be quickly cooled down. When the second temperature sensor 11 detects that the temperature of the second heat dissipation member 604 is too high, it can transmit temperature information to the controller 25. The controller 25 can activate the first electric telescopic rod 605 and control the second electric telescopic rod 606 to retract. Therefore, the first heat dissipation member 603 and the second heat dissipation member 604 can be used alternately. During the heat dissipation process, the first heat dissipation member 603 and the second heat dissipation member 604 alternately contact the main board mounting plate 5 and the heat-generating hardware. Therefore, the first heat dissipation member 603 and the second heat dissipation member 604 are always in a state of heat conduction and rapid heat dissipation, so as to ensure that the first heat dissipation member 603 and the second heat dissipation member 604 always have good heat conduction effects, so as to ensure good heat dissipation effect and prevent the situation that the heat dissipation effect rapidly decreases due to continuous high temperature.

[0026] In a specific implementation, an installation shell 12 is installed on one side of an installation frame 4. A plurality of radiators 13 are sequentially installed on the installation shell 12. The radiators 13 can drive the gas flow in the box body frame 1, so as to further improve the heat dissipation effect.

[0027] Further, an interaction panel 22 is provided on the front panel 2, and a power button 23 and a plurality of wiring ports 24 are provided on the interaction panel 22.

[0028] Further, a rear baffle is installed at the rear side of the box body frame 1, so that the inside of the computer case can be kept in a sealed environment. Raised strips 26 are installed on both the rear baffle and the side plate 3, and the side plate 3 and the rear baffle can be conveniently installed and disassembled through the raised blocks.

[0029] Embodiment 2 This embodiment provides a technical solution: a self-controlled heat dissipation and dust-proof computer case, as Figure 1 shown, including a box body frame 1, a front panel 2, two side plates 3, a mounting frame 4, and a switched heat dissipation component 6.

[0030] In a specific implementation, as Figure 2 and Figure 3 shown, the front panel 2 is installed on the front side of the box body frame 1, the two side plates 3 are respectively installed on both sides of the box body frame 1, the mounting frame 4 is arranged inside the box body frame 1 and the mounting frame 4 is installed on one of the side plates 3. A receiving groove is vertically penetrated inside the mounting frame 4, and a mounting groove is opened above the receiving groove. A main board mounting plate 5 is installed in the mounting groove. Through the main board mounting plate 5, computer hardware such as a main board and a processor can be installed. A controller 25 is provided on the front panel 2.

[0031] In a specific implementation, as Figures 3 - 6As shown, the switched heat dissipation component 6 is used to dissipate heat from the computer hardware installed on the motherboard mounting plate 5. The switched heat dissipation component 6 is arranged within the mounting frame 4 and is located below the motherboard mounting plate 5. The temperature detection unit in the motherboard and other hardware is connected to the controller 25, and when the detected temperature is too high, it can trigger the switched heat dissipation component 6 through the controller 25. Therefore, automatic temperature control can be achieved, thereby preventing the occurrence of overheating. The switched heat dissipation component 6 can conduct and dissipate heat from the heat-generating hardware on the motherboard mounting plate 5. The switched heat dissipation component 6 includes a heat collecting plate 601, a heat conducting plate 602, a first heat dissipation member 603, a second heat dissipation member 604, a first electric telescopic rod 605, and a second electric telescopic rod 606. The heat collecting plate 601 is fixedly installed at the bottom of the mounting frame 4, and the heat conducting plate 602 is installed above the heat collecting plate 601. The heat collecting plate 601 is in an S shape and is provided with a plurality of positioning grooves 7 on both sides. The first heat dissipation member 603 and the second heat dissipation member 604 are both arranged above the heat collecting plate 601 and are respectively arranged on both sides of the heat conducting plate 602. The first heat dissipation member 603 and the second heat dissipation member 604 are both composed of heat conducting strips 8 and a plurality of fins 9. The plurality of fins 9 are installed on one side of the heat conducting strip 8 and the fins 9 are clamped in the positioning grooves 7. Therefore, it can ensure that the contact area between the first heat dissipation member 603 and the second heat dissipation member 604 and the heat conducting plate 602 is large, thereby accelerating the heat conduction speed between the first heat dissipation member 603 and the second heat dissipation member 604 and the heat conducting plate 602. When the first heat dissipation member 603 or the second heat dissipation member 604 is in contact with the heat-generating hardware respectively, it can absorb the heat generated by the heat-generating hardware, thereby helping the heat-generating hardware dissipate heat. The heat conducting plate 602, the first heat dissipation member 603, and the second heat dissipation member 604 form a cuboid plate with the same cross-sectional area as the mounting frame 4. The first electric telescopic rod 605 and the second electric telescopic rod 606 are both installed at the bottom of the heat collecting plate 601. The first heat dissipation member 603 is installed at the output end of the first electric telescopic rod 605, and the second heat dissipation member 604 is installed at the output end of the second electric telescopic rod 606. The first electric telescopic rod 605 and the second electric telescopic rod 606 can be alternately switched on to alternately use the first heat dissipation member 603 and the second heat dissipation member 604 to dissipate heat from the heat-generating hardware, thereby ensuring that the first heat dissipation member 603 and the second heat dissipation member 604 used for heat conduction do not remain in a continuously high-temperature heat conduction state, and thus ensuring good heat dissipation effect.

[0032] A first temperature sensor 10 and a second temperature sensor 11 are respectively installed on a first heat dissipation member 603 and a second heat dissipation member 604. Both the first temperature sensor 10 and the second temperature sensor 11 are communicatively connected to a controller 25. The controller 25 is communicatively connected through a first electric telescopic rod 605 and a second electric telescopic rod 606. The current temperatures of the first heat dissipation member 603 and the second heat dissipation member 604 can be detected through the first temperature sensor 10 and the second temperature sensor 11. Therefore, when the first heat dissipation member 603 or the second heat dissipation member 604 overheats, they can be switched to each other in time, so as to ensure good heat dissipation effect.

[0033] In a specific implementation, an installation shell 12 is installed on one side of an installation frame 4. A plurality of radiators 13 are successively installed on the installation shell 12. The radiators 13 can drive the gas flow in the box body frame 1, so as to further improve the heat dissipation effect.

[0034] In a specific implementation, as Figure 7 shown, a heat conduction groove 14 is formed inside the heat collecting plate 601 close to one side of the side plate 3. A movable heat dissipation assembly 15 is arranged in the heat conduction groove 14. The movable heat dissipation assembly 15 includes a sealing sheet 1501, a heat conduction sheet 1502 and a plurality of limiting springs 1503. The sealing sheet 1501 is clamped in the heat conduction groove 14. A vacuum cavity 16 is arranged between the sealing sheet 1501 and the inner wall of the heat conduction groove 14. The limiting springs 1503 are installed between the sealing sheet 1501 and the side plate 3. The heat conduction sheet 1502 is installed at one end of the sealing sheet 1501. Heat dissipation openings 17 are formed on the side plate 3 and the installation frame 4. One end of the heat conduction sheet 1502 is clamped in the heat dissipation opening 17. A coolant 18 is filled in the vacuum cavity 16. The coolant 18 accounts for one-third of the vacuum cavity 16. The coolant 18 is an ether solvent. Through the movable heat dissipation assembly 15, the heat concentrated on the heat collecting plate 601 in the above operation can be discharged to the outside through the heat conduction sheet 1502. Therefore, it can ensure that the heat collecting plate 601 is cooled more quickly, so as to further improve the heat dissipation efficiency. When the temperature of the heat collecting plate 601 rises, the ether in the ether solvent in the vacuum cavity 16 can be heated and evaporated. Therefore, the volume of the vacuum cavity 16 can be increased, so as to push the sealing sheet 1501 to squeeze the limiting springs 1503 and move outward. Therefore, the sealing sheet 1501 can push the heat conduction sheet 1502 outward from the heat dissipation opening 17. Since a large amount of heat is concentrated on the heat conduction sheet 1502, the heat conduction sheet 1502 can directly contact with the outside air to quickly conduct the heat, so as to ensure the fast cooling speed of the heat collecting plate 601.

[0035] In a specific implementation, as Figure 8As shown, a seal 27 is installed at one end of the heat-conducting fin 1502. An air vent groove 19 is formed in the side plate 3. The seal 27 is clamped in the air vent groove 19. The seal 27 can provide a larger heat-conducting area for the heat-conducting fin 1502, so that the cooling speed of the heat-collecting plate 601 can be further improved. The seal 27 includes a metal rod 20 and two metal plates 21. The metal plates 21 are welded to both ends of the metal rod 20. A plurality of notches are formed in the metal plates 21. Under the control of the movable heat dissipation assembly 15, the seal 27 can be pushed outwards. Therefore, the air vent groove 19 can be used for the flow of internal and external gases at this time. Cooperating with the radiator 13 can greatly improve the heat dissipation speed in the cabinet frame 1. When no heat dissipation operation is performed, the seal 27 can block the air vent groove 19, so that external dust can be prevented from entering under normal circumstances.

[0036] The above are only the preferred embodiments of the present invention, which are illustrative rather than restrictive to the present invention. Those skilled in the art understand that many changes, modifications, and even equivalents can be made within the spirit and scope defined by the claims of the present invention, but all will fall within the protection scope of the present invention.

Claims

1. An automatic heat dissipation and dust-proof computer chassis, characterized in that, Including: Cabinet frame (1): Front panel (2), which is installed on the front side of the cabinet frame (1); Two side panels (3), which are respectively installed on both sides of the cabinet frame (1); Mounting frame (4), which is arranged inside the cabinet frame (1) and the mounting frame (4) is installed on one of the side panels (3). An accommodation groove is vertically penetrated inside the mounting frame (4), and a mounting groove is opened above the accommodation groove. A main board mounting plate (5) is installed in the mounting groove; Switching heat dissipation component (6), which is used to dissipate heat from the computer hardware installed on the main board mounting plate (5). The switching heat dissipation component (6) is arranged inside the mounting frame (4) and is located below the main board mounting plate (5). The switching heat dissipation component (6) includes a heat collecting plate (601), a heat conducting plate (602), a first heat dissipation member (603), a second heat dissipation member (604), a first electric telescopic rod (605) and a second electric telescopic rod (606). The heat collecting plate (601) is fixedly installed at the bottom of the mounting frame (4), the heat conducting plate (602) is installed above the heat collecting plate (601). The heat collecting plate (601) is in an S shape and a plurality of positioning grooves (7) are arranged on both sides. The first heat dissipation member (603) and the second heat dissipation member (604) are both arranged above the heat collecting plate (601) and are respectively arranged on both sides of the heat conducting plate (602). The first heat dissipation member (603) and the second heat dissipation member (604) are both composed of heat conducting strips (8) and a plurality of fins (9). A plurality of the fins (9) are installed on one side of the heat conducting strip (8) and the fins (9) are clamped in the positioning grooves (7). The first electric telescopic rod (605) and the second electric telescopic rod (606) are both installed at the bottom of the heat collecting plate (601). The first heat dissipation member (603) is installed at the output end of the first electric telescopic rod (605), and the second heat dissipation member (604) is installed at the output end of the second electric telescopic rod (606); A first temperature sensor (10) and a second temperature sensor (11) are respectively installed on the first heat dissipation member (603) and the second heat dissipation member (604). A controller (25) is arranged on the front panel (2). The first temperature sensor (10) and the second temperature sensor (11) are both communicatively connected to the controller (25), and the controller (25) is communicatively connected through the first electric telescopic rod (605) and the second electric telescopic rod (606).

2. The self-controlled heat dissipation and dust-proof computer chassis according to claim 1, characterized in that, The heat conducting plate (602), the first heat dissipation member (603) and the second heat dissipation member (604) form a cuboid plate with the same cross-sectional area as the mounting frame (4).

3. The self-controlled heat dissipation and dust-proof computer chassis according to claim 2, characterized in that, A mounting shell (12) is installed on one side of the mounting frame (4), and a plurality of radiators (13) are sequentially installed on the mounting shell (12).

4. The self-controlled heat dissipation and dust-proof computer chassis according to claim 3, wherein, On the inner side of the heat collecting plate (601) close to the side plate (3), a heat conduction groove (14) is formed. An active heat dissipation component (15) is arranged in the heat conduction groove (14). The active heat dissipation component (15) includes a sealing sheet (1501), a heat conduction sheet (1502) and a plurality of limiting springs (1503). The sealing sheet (1501) is clamped in the heat conduction groove (14). A vacuum chamber (16) is arranged between the sealing sheet (1501) and the inner wall of the heat conduction groove (14). The limiting springs (1503) are installed between the sealing sheet (1501) and the side plate (3). The heat conduction sheet (1502) is installed at one end of the sealing sheet (1501). Heat dissipation openings (17) are formed in the side plate (3) and the installation frame (4). One end of the heat conduction sheet (1502) is clamped in the heat dissipation opening (17).

5. The self-controlled heat-dissipating and dust-proof computer chassis according to claim 4, wherein, A coolant (18) is filled in the vacuum chamber (16).

6. The self-controlled heat-dissipating and dust-proof computer chassis according to claim 5, characterized in that, A sealing member (27) is installed at one end of the heat conduction sheet (1502). A ventilation groove (19) is formed in the side plate (3). The sealing member (27) is clamped in the ventilation groove (19).

7. The self-controlled heat dissipation and dust-proof computer chassis according to claim 6, characterized in that, The sealing member (27) includes a metal rod (20) and two metal plates (21). The metal plates (21) are welded to both ends of the metal rod (20). A plurality of notches are formed in the metal plates (21).

8. The self-controlled heat dissipation and dust-proof computer chassis according to claim 1, characterized in that, An interaction panel (22) is arranged on the front end panel (2). A power button (23) and a plurality of wiring ports (24) are arranged on the interaction panel (22).

9. The self-controlled heat dissipation and dust-proof computer chassis according to claim 1, characterized in that, A rear baffle is installed at the rear side of the box body frame (1). Raised strips (26) are installed on both the rear baffle and the side plate (3).

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