Display module and electronic equipment

Abstract

The invention provides a display module and electronic equipment, the display module comprises a first display screen and a flexible circuit board, and the flexible circuit board can be a functional device of the display screen; the first display screen comprises a display layer and a conductive layer which are arranged in a stacked mode, the conductive layer is arranged on the side, away from the light emitting face, of the display layer, and the display layer comprises a display panel and a connecting part connected with the display panel; the flexible circuit board comprises a first part and a second part which are connected, the connecting part is connected with the second part, the first part of the flexible circuit board can serve as an electric connection conduction area, and the first part is used for abutting against the conductive layer under the elastic force effect of the grounding assembly so as to electrically connect the grounding assembly and the conductive layer. Therefore, the first display screen is grounded. Therefore, the flexible circuit board not only can be used as a functional device of the display screen, but also can be used for grounding the display screen, so that the reuse of the flexible circuit board is realized, the design scheme of electric connection is simplified, and the production cost is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to a display module and an electronic device. Background Art

[0002] As mobile terminals and other electronic devices develop towards thinness, high reliability, and long battery life, the compact design of terminal electronic devices can greatly free up the design space of the whole device. In order to solve radiated spurious emission (RSE) and radio frequency interference, it is necessary to perform radio frequency grounding and signal channeling on conductive materials such as screens.

[0003] For example, the conductive layer of the screen can be connected to the base of the metal frame of the whole machine through a metal spring to achieve grounding of the conductive layer of the screen. The metal frame of the whole machine can be a middle frame or a metal shielding cover.

[0004] However, the contact between the metal spring and the display screen is point contact, which generates a large stress on the display screen and easily causes a top screen, which has a great impact on the film printing. Summary of the invention

[0005] The embodiments of the present application provide a display module and an electronic device, which solve the problem that the grounding design of the display screen has a significant impact on film printing.

[0006] In order to achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0007] In a first aspect of an embodiment of the present application, a display module is provided, the display module comprising: a first display screen and a flexible circuit board, the first display screen comprising a display layer and a conductive layer stacked, the conductive layer being arranged on the side of the display layer away from the light emitting surface, the display layer comprising: a display panel, and a connecting portion connected to the display panel; the flexible circuit board comprising: a first part and a second part connected to each other, the connecting portion being connected to the second part, the first part being used to abut against the conductive layer under the action of elastic force to electrically connect the conductive layer. Thus, the flexible circuit board can be a functional device of the display screen, the first part of the flexible circuit board can be used as an electrically connected conductive area, under the elastic force of the grounding component, the electrically connected conductive area is reliably electrically connected to the conductive layer, thereby realizing a reliable electrical connection between the display screen and the grounding component, being able to perform radio frequency grounding and signal conduction on conductive materials such as the screen, and reducing the influence of charge on the antenna signal and the display performance of the display screen. Among them, the first part of the circuit board component can disperse the elastic force of the grounding component to the surface, which can reduce or avoid the problem of screen film printing, thereby improving the reliability of the screen. Furthermore, the flexible circuit board can not only be used as a functional device of the display screen, but also can be used for grounding the display screen, thereby realizing the reuse of the flexible circuit board, simplifying the design of the electrical connection, and reducing the production cost.

[0008] In an alternative implementation, the first part includes a plurality of connected side edges, and the angle between adjacent two side edges is a rounded corner. Thus, with the rounded corner design of the first part, the screen printing problem can be reduced or avoided, thereby improving the reliability of the screen.

[0009] In an alternative implementation, the first part includes: a first metal layer, a first substrate, a first connection layer, a third metal layer, a second substrate, and a second metal layer which are stacked. The first metal layer is disposed on one side of the first substrate close to the first display screen, and the second metal layer is disposed on one side of the first substrate close to the elastic member. The first part includes: via holes, and the first metal layer is electrically connected to the second metal layer through the via holes. Thus, under the action of the via holes, the first metal layer and the second metal layer can be conducted, and further the grounding component can be electrically connected to the conductive layer through the metal layer of the first part.

[0010] In an alternative implementation, there are a plurality of the via holes, and the plurality of via holes are arranged in an array. Thus, by providing a plurality of via holes, the stability of the electrical connection can be further improved.

[0011] In an alternative implementation, the first metal layer includes a plurality of first metal lines arranged along a first direction, the second metal layer includes a plurality of second metal lines arranged along a second direction, the projection of the first metal lines on the substrate and the projection of the second metal lines on the substrate have an overlapping area, and the projection of the via holes on the substrate overlaps with the overlapping area. Thus, the first metal layer and the second metal layer adopt metal lines, which have better bending performance compared with using a whole layer of metal, making the first part fit better with the conductive layer and improving the electrical connection stability.

[0012] In an alternative implementation, the first direction and the second direction are parallel.

[0013] In an alternative implementation, the first direction and the second direction intersect. Thus, the metal lines of different metal layers are overlapped at different angles, which is beneficial to forming a multi-directional distribution of the metal lines to form a metal line network, thereby meeting the stress distribution requirements of the metal layer in different directions and better improving the electrical connection stability.

[0014] In an alternative implementation, the projection of the first metal lines on the substrate and the projection of the second metal lines on the substrate are in a grid shape. Thus, the metal layer can be continuously distributed in multiple directions, which can better disperse stress, is beneficial to reducing screen printing, and can also provide sufficient conduction area.

[0015] In an alternative implementation, the display module further includes a first connection portion. The second portion is connected to the conductive layer through the first connection portion. The first connection portion is configured to create a gap between the first portion and the conductive layer. This gap allows the first portion to move in the thickness direction of the first display screen within the gap under the elastic force of the elastic member until it abuts against the conductive layer. Thus, there is a gap between the first portion and the display screen, so that the abutting force between the first portion and the display screen is only provided by the grounding component, which has good controllability and facilitates the design of the size parameters and elastic force of the grounding component. Additionally, the existence of the gap can offset errors generated during processes such as processing and assembly, avoiding or alleviating the film printing problem.

[0016] In an alternative implementation, the second portion includes a first sub-portion and a second sub-portion connected to each other. The first sub-portion is connected to the first portion. The second sub-portion and the third portion are stacked. The first connection portion is disposed between the first sub-portion and the conductive layer. The side of the second sub-portion close to the first display screen is a metal layer. The connection portion includes a third portion and a fourth portion connected to each other. The third portion and the second portion are stacked. The fourth portion is connected to the display layer. The third portion is connected to the side of the second sub-portion close to the first display screen. Thus, by dividing the second portion into two sub-functional portions, a gap can be formed through the second portion and electrical connection with the display screen can be achieved, realizing the reuse of the second portion, which is beneficial to reducing production costs.

[0017] In an alternative implementation, the second portion further includes a shielding layer disposed between the first sub-portion and the first connection portion. Thus, by providing the shielding layer, interference between metal traces of the metal layer can be reduced, improving the electromagnetic shielding performance.

[0018] In an alternative implementation, the display module further includes a second connection layer and a support layer disposed between the third portion and the conductive layer. The second connection layer is connected to the conductive layer. The support layer is disposed between the second connection layer and the third portion. Thus, the connection layer and the support layer can be used to create a preset distance between the first portion and the conductive layer. For example, it is used to create a gap between the first portion and the conductive layer.

[0019] In an alternative implementation, the first portion includes a third sub-portion, a fourth sub-portion, and a fifth sub-portion connected to each other. The third sub-portion is connected to the second portion. The display module further includes a second connection portion. The fifth sub-portion is connected to the conductive layer through the second connection portion. The fourth sub-portion is configured to abut against the conductive layer under the elastic force generated by the elastic member. Thus, the middle position of the first portion can abut against the conductive layer, avoiding damage to the display screen at the edge position, reducing or avoiding the screen film printing problem, and thus improving the reliability of the screen.

[0020] In an alternative implementation, the width of the fourth sub - part is less than the width of the third sub - part, and the width of the fourth sub - part is less than the width of the fifth sub - part. Thus, the fourth sub - part has a smaller width and better bending performance, can better conform to the conductive layer, and improves the electrical connection stability.

[0021] In an alternative implementation, the cross - sectional shape of the first part includes: an I - shape. Thus, a design with wide sides and a narrow middle can be achieved, facilitating the abutment of the conductive layer after bending at the middle position.

[0022] In an alternative implementation, the first part further includes: a first plating layer and a second plating layer. The first plating layer is disposed on the side of the first part close to the first display screen, and the second plating layer is disposed on the side of the first part away from the first display screen. Thus, the plating layer can be used to improve the performance of the flexible circuit board, such as enhancing at least one of the corrosion resistance, wear resistance, conductivity, or hardness.

[0023] In an alternative implementation, the first part further includes: a reinforcing plate, which is disposed on the side of the second plating layer away from the first display screen. Thus, the anti - extrusion and anti - film printing capabilities of the first part can be further improved.

[0024] In the second aspect of the present application, an electronic device is provided, including: a grounding component and the display module as described above. The grounding component includes: an elastic member and a metal member. The elastic member is disposed between the first display screen and the metal member; one end of the elastic member is connected to the metal member, and the other end abuts against the first part. The first part is configured to abut against the conductive layer under the elastic force generated by the elastic member to electrically connect the metal member and the conductive layer. Thus, the electronic device adopts the above - mentioned display module, the display screen is electrically connected to the flexible circuit board, and the elastic member is electrically connected to the metal member. Under the elastic force of the elastic member, the first part of the flexible circuit board can be reliably electrically connected to the elastic member, thereby realizing the reliable electrical connection between the display screen and the metal member. The flexible circuit board can be a flexible circuit board functional device of the display screen. On the original flexible circuit board framework, a region electrically connected and conducted with the elastic member is designed, which is beneficial to simplifying the design, reducing the production cost, and having a stable electrical connection function. It can perform radio - frequency grounding and signal guidance on conductive substances such as the screen, reducing the influence of charges on the antenna signal and the display performance of the display screen. At the same time, compared with conductive foam, the working height and contact area of the elastic member are smaller, occupying less space, which is beneficial to reducing the overall thickness of the machine and increasing the device layout space inside the electronic device, improving the space utilization rate. In addition, the first part of the circuit board assembly can disperse the elastic force of the elastic member to the surface, which can reduce or avoid the screen film - printing problem, thereby improving the reliability of the screen. And, the display screen electrical connection solution provided by the embodiments of the present application has a simple structure and low cost.

[0025] In an optional implementation, the electronic device further includes a second display screen, the second display screen is a flexible screen that can be folded or unfolded along a folding axis, the first display screen is arranged opposite to the second display screen, and the flexible circuit board, the elastic member and the metal member are arranged between the first display screen and the second display screen. Thus, the electronic device can be a dual-screen device, the first display screen can be an external screen, and the grounding component can be used for grounding the first display screen.

[0026] In an optional implementation, the electronic device further comprises a housing, the housing is arranged opposite to the first display screen, and the flexible circuit board, the elastic member and the metal member are arranged between the housing and the first display screen. Thus, the electronic device can be a straight-screen mobile phone.

[0027] In an optional implementation, the electronic device further includes a middle frame, the middle frame is arranged on a side away from the light-emitting surface of the first display screen, the metal piece is arranged on the middle frame, or the middle frame includes the metal piece. Thus, the display screen can be grounded through the middle frame.

[0028] The embodiment of the present application provides a display module and an electronic device, the electronic device includes a middle frame, and the display module is connected to the middle frame. The display module includes: a first display screen and a flexible circuit board, the flexible circuit board can be a functional device of the display screen; the first display screen includes a stacked display layer and a conductive layer, the conductive layer is arranged on the side of the display layer away from the light-emitting surface, the display layer includes: a display panel, and a connecting portion connected to the display panel; the flexible circuit board includes: a first part and a second part connected, the connecting portion is connected to the second part, the first part of the flexible circuit board can be used as an electrically connected conductive area, the first part is used to abut against the conductive layer under the elastic force of the grounding component, so as to electrically connect the grounding component and the conductive layer, so that the first display screen is grounded. Among them, the first part of the circuit board component can disperse the elastic force of the grounding component to the surface, which can reduce or avoid the problem of screen film printing, thereby improving the reliability of the screen. In this way, the flexible circuit board can not only be used as a functional device of the display screen, but also can be used to ground the display screen, thereby realizing the reuse of the flexible circuit board, simplifying the design of the electrical connection, reducing the production cost, and the electrical connection function is stable, and can perform RF grounding and signal conduction on conductive materials such as the screen, reducing the impact of charge on the antenna signal and the display performance of the display screen.

[0029] In some embodiments, the first part includes a metal layer and a substrate, and the second part has more laminations. A via can be provided in the first part, and the via at least penetrates the insulating layer of the first part. Under the action of the via, the surface of the first part can be electrically connected to the metal layer on the ground, so that the grounding component can be electrically connected to the conductive layer through the metal layer of the first part.

[0030] In some embodiments, the electronic device further includes a first connection part. The second part is connected to the conductive layer through the first connection part. The first connection part is used to create a gap between the first part and the conductive layer. The gap is used for the first part to move in the thickness direction of the first display screen in the gap under the elastic force of the elastic member until it abuts against the conductive layer. Thus, there is a gap between the first part and the display screen, so that the abutting force between the first part and the display screen is only provided by the grounding component, which has good controllability and is convenient for designing the size parameters and elastic force of the grounding component. In addition, the existence of the gap can offset the errors generated during processes such as processing and assembly, and avoid causing or aggravating the film printing problem. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic diagram of the disassembly structure of an electronic device provided by an embodiment of the present application;

[0032] Figure 2 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application;

[0033] Figure 3 is a schematic diagram of the structure of another electronic device provided by an embodiment of the present application;

[0034] Figure 4 is a cross-sectional view of an electronic device;

[0035] Figure 5 is a schematic diagram of the structure of the first display screen;

[0036] Figure 6 is Figure 4 a schematic diagram of the structure of the conductive layer in;

[0037] Figure 7 is a schematic diagram of the structure of a display module provided by an embodiment of the present application;

[0038] Figure 8 is Figure 7 a schematic diagram of a flexible circuit board in a working state in;

[0039] Figure 9 is Figure 7 another schematic diagram of a flexible circuit board in a working state in;

[0040] Figure 10Schematic diagram of the structure of a flexible circuit board provided by an embodiment of the present application;

[0041] Figure 11 Schematic diagram of the structure of another flexible circuit board provided by an embodiment of the present application;

[0042] Figure 12 Schematic diagram of the structure of a first part of the flexible circuit board provided by an embodiment of the present application;

[0043] Figure 13 Schematic diagram of the structure of another first part of the flexible circuit board provided by an embodiment of the present application;

[0044] Figure 14 Schematic diagram of the structure of another first part of the flexible circuit board provided by an embodiment of the present application;

[0045] Figure 15 Schematic diagram of the structure of another first part of the flexible circuit board provided by an embodiment of the present application;

[0046] Figure 16 Projection schematic diagram of the metal layer of the flexible circuit board provided by an embodiment of the present application;

[0047] Figure 17 Top view of the first part of the flexible circuit board provided by an embodiment of the present application;

[0048] Figure 18 Cross-sectional view of the first part of the flexible circuit board provided by an embodiment of the present application;

[0049] Figure 19 Schematic diagram of the structure of an electronic device provided by an embodiment of the present application;

[0050] Figure 20 For Figure 19 A schematic diagram when the flexible circuit board in is in a working state;

[0051] Figure 21 For Figure 19 Another schematic diagram when the flexible circuit board in is in a working state;

[0052] Figure 22 Schematic diagram of the structure of an elastic member provided by an embodiment of the present application;

[0053] Figure 23 Schematic diagram of the structure of a conductive layer provided by an embodiment of the present application. Detailed implementation manners

[0054] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0055] Hereinafter, terms such as "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0056] In addition, in the present application, orientation terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification and can change accordingly with the change of the orientation of the components placed in the drawings.

[0057] An embodiment of the present application provides an electronic device, which can be a product with a display interface such as a mobile phone, a display, a tablet computer, an in-vehicle computer, etc. The specific form of the above-mentioned electronic device is not particularly limited in the embodiments of the present application.

[0058] An embodiment of the present application provides an electronic device. The electronic device can be a product with a display interface such as a tablet computer, a mobile phone, an e-reader, a remote control, a personal computer (PC), a laptop computer, a personal digital assistant (PDA), an in-vehicle device, an Internet TV, a wearable device, a TV set, etc., as well as intelligent display wearable products such as smart watches and smart bracelets. The form of the above-mentioned electronic device is not particularly limited in the embodiments of the present application. For the convenience of description, the following embodiments are all exemplified by taking the electronic device as a mobile phone.

[0059] As Figure 1 shown, the electronic device 1 includes a display module 10, a middle frame 11, and a housing 12. The middle frame 11 is located between the display module 10 and the housing 12.

[0060] The display module 10 is used for displaying images.

[0061] The display module 10, the middle frame 11, and the housing 12 can be respectively arranged on different layers in the thickness direction of the electronic device, and these layers can be parallel to each other. The plane where each layer is located can be called the X-Y plane, and the direction perpendicular to the X-Y plane can be called the Z direction. By way of example, the display module 10, the middle frame 11, and the housing 12 can be distributed in layers in the Z direction.

[0062] The display module 10 may include: a display screen and a flexible printed circuit (FPC). The display screen can be connected through, for example Figure 1The flexible circuit board shown is electrically connected to a printed circuit board (PCB) disposed on the middle frame 11. Thereby, the PCB can transmit display data to the display module 10 to control the display module 10 to perform image display.

[0063] The middle frame 11 is located between the display module 10 and the housing 12. The surface of the middle frame 11 away from the display module 10 is used to mount internal components such as a battery, a printed circuit board (PCB), a camera, an antenna, etc. After the housing 12 is covered with the middle frame 11, the above internal components are located between the housing 12 and the middle frame 11.

[0064] The housing 12 and the middle frame 11 are connected to form a receiving cavity for accommodating the above-mentioned electronic devices such as the PCB, the camera, and the battery. Thereby, it is possible to prevent external moisture and dust from invading the receiving cavity and affecting the performance of the above-mentioned electronic devices.

[0065] The embodiments of the present application do not limit the structure of the mobile phone. In some embodiments of the present application, as Figure 2 shown, the mobile phone can be a straight-bar mobile phone.

[0066] Alternatively, the mobile phone can also be a folding-screen mobile phone. In some embodiments, as Figure 3 shown, the display screen of the folding-screen mobile phone includes: a first display screen 200 and a second display screen 300, a middle frame 11 (or a support member), and a housing.

[0067] Among them, as Figure 3 shown, the second display screen 300 includes a first part A and a second part B. When the folding-screen mobile phone is in a folded state (the included angle between the first part A and the second part B of the second display screen 300 is 0°), the second display screen 300 is located inside, the first display screen 200 is located outside, and the first part A of the second display screen 300 is opposite to the second part B of the second display screen 300.

[0068] The first part A of the second display screen 300 and the first display screen 200 are stacked, the second part B of the second display screen 300 and the housing 12 are stacked, and the second display screen is disposed opposite to the first part A of the second display screen 300.

[0069] For performance optimization, the display screen on an electronic device is usually grounded, that is, the display screen is electrically connected to metal components (such as the middle frame, shielding cover, etc.) inside the electronic device to form a ground return path, thereby achieving grounding of the display screen. For example, users of electronic devices often carry static electricity. After contacting the electronic device, the static electricity will hit the display screen, causing electrostatic discharge (ESD). To improve the anti-static ability of the display screen, the display screen is usually grounded. Another example is that when the display screen is working normally, electronic components (such as light-emitting diodes, semiconductors, etc.) in the display screen will accumulate charges, or static electricity will be generated by friction between the electronic device and the impact object after it falls. These charges will gradually accumulate on the display screen. If too many charges accumulate on the display screen, it may affect the normal use of the display screen, such as causing the inability to effectively control the lighting and extinguishing of local areas of the display screen, resulting in phenomena such as bright circles or light leakage. Grounding the display screen can transfer the excess charges on the display screen, thereby avoiding the influence of excessive charge accumulation on the display effect of the display screen. Another example is that if an antenna is set between two relatively arranged display screens (such as the aforementioned second display screen 300 and the first display screen 200), the charges on the display screen will cause problems such as antenna clutter, such as radiation spurious emissions. Grounding at least one display screen can transfer the charges on the display screen, which is beneficial to improving the radio frequency performance of the electronic device.

[0070] In some embodiments, the electrical connection of the display screen can be achieved through conductive foam. Conductive foam is a foam material with conductive properties. Its principle is to mix fillers with good conductive properties, such as carbon fiber, copper powder, etc., into the foam material to make the foam material have conductive characteristics. However, conductive foam requires a relatively large working height and contact area. For example, to solve the problem of display screen film printing, conventional designs often choose conductive foam with an initial height of 1.5 mm and a working height of 0.5 mm - 0.8 mm. Another example is that to avoid the RSE problem, conductive foam has a minimum design area requirement (such as the contact area meeting 2.5 mm * 6.5 mm). And usually multiple conductive foams need to be set inside the electronic device, which seriously affects the thickness of the whole machine and the layout space of components. Moreover, when conductive foam works, it is compressed. Each piece of conductive foam generates a top screen force of about 1 newton (symbol N) on the display screen. The more the number of conductive foams, the greater the top screen force. For example, when more than 6 pieces of conductive foam are set, a top screen force of more than 6 N will be generated. On the one hand, conductive foam applies a top screen force locally to the display screen, which has a greater impact on film printing. On the other hand, currently, the display screen and the housing of the electronic device are usually bonded by dispensing or back gluing. The top screen force generated by the conductive foam causes a risk of screen delamination. This makes the risk of display screen film printing and screen delamination relatively large, affecting the reliability of the screen.

[0071] In some other embodiments, the working height of the metal elastic sheet is relatively low, and the electrical connection of the display screen can be achieved through the metal elastic sheet.

[0072] Exemplarily, as Figure 4 shown, the electronic device includes: a display screen 100, a metal elastic sheet 2001, and a metal part 30. The display screen 100 includes a display layer 101 and a conductive layer 102 arranged in a stacked manner, and the conductive layer 102 is disposed on a side of the display layer 101 away from the light-emitting surface. The metal elastic sheet 2001 is disposed between the display screen 100 and the metal part 30.

[0073] In the embodiments of the present application, the display layer 101 is a multi-layer structure (i.e., a composite layer).

[0074] In one example, referring to Figure 5 shown, the display layer 101 may include a polarizer 1011 (POL), a display panel 1012, and a protective layer 1013 arranged in a stacked manner. The display panel 1012 is disposed between the polarizer 1011 and the protective layer 1013.

[0075] The display panel 1012 is a layer for implementing a display function and can convert an electrical signal into visible information. In some embodiments, the display panel 1012 is a panel display control panel (PNL).

[0076] The protective layer 1013 is used to be connected to the conductive layer 102. In some embodiments, the protective layer 1013 may be a back film (BF). Exemplarily, the material of the protective layer 1013 may be polyethylene terephthalate (PET) or polyimide (PI), etc.

[0077] In some embodiments, the display screen further includes a cover plate 1017. The cover plate 1017 is disposed above the polarizer 1011. The polarizer 1011 is disposed between the cover plate 1017 and the display panel 1012, and the display panel 1012 is disposed between the polarizer 1011 and the protective layer 1013. The polarizer 1011 is used to convert unpolarized light into polarized light or change the polarization direction of polarized light.

[0078] In some embodiments, the display layer 101 further includes a third adhesive layer, and the third adhesive layer is disposed between the cover plate 1017 and the polarizer 1011 for bonding the cover plate 1017 and the polarizer 1011. Exemplarily, the material of the third adhesive layer may be optical adhesive or double-sided grid adhesive, etc.

[0079] In some embodiments, the display layer 101 further includes a fourth adhesive layer disposed between the display panel 1012 and the protective layer 1013 for bonding the display panel 1012 and the protective layer 1013. Exemplarily, the material of the fourth adhesive layer may be optical adhesive, double-sided mesh adhesive, pressure sensitive adhesive (PSA), etc.

[0080] In some embodiments, the display layer 101 further includes: a support layer 1015 disposed between the display layer 101 and the conductive layer 102. The support layer 1015 functions as a buffer and a protector. The conductive layer 102 is used for electrical connection with the metal shrapnel and functions as a conductor.

[0081] Exemplarily, the material of the support layer 1015 may include at least one of thermoplastic polyurethanes (TPU), polypropylene, polyethylene terephthalate (PET), polyvinylidene fluoride, or foam.

[0082] Exemplarily, the material of the conductive layer 102 may include at least one of stainless steel, copper, titanium alloy, aluminum alloy, or silver.

[0083] In some embodiments, the display layer 101 further includes an adhesive layer 1014 disposed between the protective layer 1013 and the support layer 1015 for bonding the support layer 1015 and the protective layer 1013.

[0084] In some embodiments, the display layer 101 further includes an adhesive layer 1016 disposed between the support layer 1015 and the conductive layer 102 for bonding the support layer 1015 and the conductive layer 102.

[0085] Exemplarily, the material of the adhesive layer 1016 and / or the adhesive layer 1014 may be optical clear adhesive (OCA), double-sided mesh adhesive, or other conductive adhesive layers, etc.

[0086] The conductive layer 102 is disposed on the side of the display layer 101 facing away from the light-emitting surface. The display layer 101 is used for displaying interface content, such as images and / or text data. The conductive layer 102 is used to achieve the electrical connection of the display screen. Specifically, the conductive layer 102 is electrically connected to the metal shrapnel. In some embodiments, the conductive layer 102 also serves as the support layer 1015 of the display layer 101 and functions as a support.

[0087] The material of the conductive layer 102 can be a metal conductive material, such as stainless steel, titanium alloy, aluminum alloy, vinyl carbonate (VC), copper, silver, etc.; or a non-metal conductive material, such as carbon fiber, carbon nanotube, titanium carbide, graphene, zinc oxide, and some conductive polymer materials, conductive ceramic materials, etc. Exemplarily, the conductive layer 102 is in a sheet shape.

[0088] It can be understood that Figure 5 The stacked structure of the display layer 101 shown is only exemplary. For different types of electronic devices, the stacked structure of the display layer 101 is also different and will not be described one by one here.

[0089] In some embodiments, the conductive layer 102 can be a buffer heat dissipation film, also known as superclean foam (SCF). In other embodiments, the conductive layer 102 can be a support plate (such as a foldable support plate) for providing a supporting force for the display screen.

[0090] As Figure 4 shown, the metal elastic sheet 2001 is used for electrically connecting the metal part 30 and the conductive layer 102, so that the conductive layer 102 can be conducted with the metal part 30 through the metal elastic sheet 2001.

[0091] In this way, the conduction with the metal protection layer 1013 on the back of the screen can be achieved by the propping of the metal elastic sheet 2001, and finally the electrical connection of the display screen - metal elastic sheet 2001 - metal part 30 is realized, and the display screen is grounded.

[0092] In some embodiments, multiple metal elastic sheets 2001 can be set to conduct with the conductive layer 102. For example, as Figure 6 shown, 4 metal elastic sheets can be set: the first metal elastic sheet 2001A, the second metal elastic sheet 2001B, the third metal elastic sheet 2001C, and the fourth metal elastic sheet 2001D.

[0093] However, the contact between the metal elastic sheet and the display screen is a point contact, which generates a large stress on the display screen and is prone to causing screen propping, having a greater impact on the film printing. When multiple metal elastic sheets are set, the screen propping force is greater and the impact on the film printing is also greater.

[0094] For this reason, the embodiment of the present application further provides a display module, which can reuse the flexible circuit board of the display screen. For example, an electrically connected conduction area can be set on the flexible circuit board connected to the display panel, and the metal elastic sheet is elastically connected to the electrically connected conduction area to realize the electrical connection of the display screen, while reducing the thickness of the whole machine and improving the reliability of the screen and the device layout space inside the electronic device.

[0095] Among them, the display module of the present application can include as Figure 2The display screen of the straight-bar mobile phone shown may also include, for example Figure 3 The first display screen 200 of the dual-screen mobile phone shown. The electrically connected conduction area may be provided on the flexible circuit board connected to the display screen 100 shown, for example Figure 2 It may also be provided on the flexible circuit board connected to the first display screen 200 shown. In this embodiment, the display screen 100 and the flexible circuit board shown are taken as examples for illustration. Figure 3 For example Figure 2 The display screen 100 and the flexible circuit board shown are taken as examples for illustration.

[0096] Figure 7 It is a schematic structural diagram of a display module provided by an embodiment of the present application. As Figure 7 shown, the display module includes: a display screen 100 and a flexible circuit board 40. The display screen 100 includes a display layer 101 and a conductive layer 102 which are stacked, and the conductive layer 102 is disposed on a side of the display layer 101 away from the light-emitting surface.

[0097] Among them, the flexible circuit board 40 may be a flexible circuit board layer functional device of the display screen 100, and the flexible circuit board 40 is connected to the display screen 100.

[0098] In some embodiments, as Figures 7 - 9 shown, the flexible circuit board 40 may include a first part 401 and a second part 402 that are connected in sequence.

[0099] The first part 401 includes the above-mentioned electrically connected conduction area, and the first part 401 is used to abut against the conductive layer 102 under the action of an elastic force to electrically connect the conductive layer 102. For example, the first part 401 may be elastically connected to the conductive layer 102 under the elastic force of a grounding component ( Figure 7 not shown in Figure 19 and can be referred to as 20 and 30 in

[0100] to electrically connect the grounding component and the conductive layer to achieve grounding.

[0101] The display screen further includes: a connection part 1010 connected to the display layer 101. In some embodiments, one end of the connection part 1010 is connected to the display panel in the display layer 101, and a part of the connection part 1010 is connected to the second part 402.

[0102] The flexible circuit board 40 provided in the embodiment of the present application can be a functional device of the display screen. The first part of the flexible circuit board can be used as an electrically connected conduction area. Under the elastic force of the grounding component, the electrically connected conduction area is reliably electrically connected to the conductive layer, thereby realizing the reliable electrical connection between the display screen and the grounding component. The flexible circuit board can not only be used as a functional device of the display screen, but also be used to ground the display screen, simplifying the electrical connection design scheme, reducing the production cost, and having a stable electrical connection function. It can perform radio frequency grounding and signal guidance on conductive substances such as the screen, reducing the influence of charges on the antenna signal and the display performance of the display screen.

[0103] As Figure 7 shown, there is a gap H between the surface of the first part 401 facing the display screen and the surface of the display screen facing the first part 401. The gap H involved in this embodiment refers to the one formed after the flexible circuit board 40 and the display screen are assembled. In the complete assembled state, after the grounding component applies a force to the first part 401, the first part 401 will move or deform in the gap H in the thickness direction of the display screen, and the gap H may be eliminated.

[0104] That is to say, when the flexible circuit board 40 is in the initial state (i.e., the state when it is not assembled with other components), that is, when the first part 401 is not in contact with the second end 203, there is a preset distance between the surface of the first part 401 facing the display screen and the surface of the second part 402 facing the display screen. This preset distance is used for the first part 401 to move in the formed gap H in the thickness direction of the display screen under the elastic force of the grounding component until it contacts the display screen when the flexible circuit board 40 is in the assembled state.

[0105] Since there is a gap H between the first part 401 and the display screen, the contact force between the first part 401 and the display screen is only provided by the grounding component, which has good controllability and is convenient for designing the size parameters and elastic force of the grounding component. In addition, the existence of the gap H can offset the errors generated during processes such as processing and assembly, avoiding causing or aggravating the film printing problem. Assuming that there is no gap H between the first part 401 and the display screen, if there are errors during the processing and assembly lamination of the flexible circuit board 40, it may cause the surface of the first part 401 facing the display screen to be closer to the display screen than the surface of the second part 402 facing the display screen. In this case, after the flexible circuit board 40 is attached to the display screen, the first part 401 will exert a certain pressure on a local area of the display screen, and this pressure has an impact on the film printing.

[0106] Figure 8 It is a schematic diagram of the working state of a flexible circuit board 40 provided in the embodiment of the present application. Figure 9 It is a schematic diagram of another working state of a flexible circuit board 40 provided in the embodiment of the present application. As Figure 8 、 Figure 9As shown, when the grounding component applies a force to the first part 401, the first part 401 can move relative to the second part 402 in the direction close to the display screen, finally contact the display screen, and abut against the display screen under the elastic force of the grounding component, realizing a reliable electrical connection between the first part 401 and the display screen.

[0107] In some embodiments, as Figure 8 shown, under the elastic force of the grounding component, the first part 401 deforms. The first part 401 is an arc surface, and the first part 401 abuts against the conductive layer 102.

[0108] In other embodiments, as Figure 9 shown, under the elastic force of the grounding component, the first part 401 deforms. The first part 401 is a curved surface, and the bending direction of the curved surface faces the grounding component. The first part 401 abuts against the conductive layer 102.

[0109] In some embodiments, a connecting part can be provided between the second part 402 and the conductive layer 102, and / or between the connecting part 1010 and the conductive layer 102 to generate the above-mentioned gap H.

[0110] Exemplarily, referring to Figures 7 - 9 shown, the display module further includes a first connecting part 501. The first connecting part 501 is arranged on the side of the first shielding layer 4003 close to the display screen and is used to bond the second part 402 to the display screen (specifically, the conductive layer 102 for example). The first connecting part 501 is used to generate a preset distance between the first part 401 and the conductive layer 102. For example, it is used to generate a gap H between the first part 401 and the conductive layer 102.

[0111] In some embodiments, the first connecting part 501 can also be called a back glue. Among them, the back glue can adopt a low modulus material, which is beneficial to reducing the difficulty of the downward pressing stroke of the display screen. Exemplarily, the material of the first connecting part 501 can be optical glue, double-sided grid glue or insulating foam glue, etc. Exemplarily, the glue material of the first connecting part 501 can select a low modulus glue material with a modulus less than 150 Kpa. For example, foam glue can be selected.

[0112] The embodiments of the present application do not limit the size of the first connecting part 501. In some embodiments, the thickness of the first connecting part 501 is less than or equal to 0.15 mm, reducing the step height formed by the first connecting part 501 on the conductive layer. Then the height of the gap H between the first part 401 and the conductive layer 102 is less than or equal to 0.15 mm, making it easier for the elastic part to deform and contact the conductive layer.

[0113] In some other embodiments, the display module further includes: a connection layer 502 and a support layer 70 which are stacked. The connection layer 502 and the support layer 70 are disposed between the connection portion 1010 and the conductive layer 102. The connection layer 502 is connected to the conductive layer 102, and the support layer 70 is disposed between the connection portion 1010 and the connection layer 502. The connection layer 502 and the support layer 70 can be used to create a preset distance between the first portion 401 and the conductive layer 102. For example, they are used to create a gap H between the first portion 401 and the conductive layer 102.

[0114] The embodiments of the present application do not limit the material of the connection layer 502. In some embodiments, the connection layer 502 can be a double-sided adhesive for connecting the support layer 70 and the conductive layer 102.

[0115] The embodiments of the present application do not limit the stacked structure of the flexible circuit board 40. In some embodiments, the flexible circuit board 40 includes at least one metal layer.

[0116] Reference Figure 10 , the flexible circuit board 40 can include a metal layer 41, a substrate 42, and a metal layer 43 which are stacked. The metal layer 41 and the metal layer 43 are respectively disposed on both sides of the substrate 42 in the display screen thickness direction. For example, the metal layer 41 is disposed on the side of the substrate 42 close to the display screen, and the metal layer 43 is disposed on the side of the substrate 42 away from the display screen.

[0117] In this embodiment, the substrate 42 can be used to support the metal layer 41 and the metal layer 43.

[0118] Among them, the metal layer 41 includes a first sub-region 41A disposed in the first portion, and a second sub-region 41B disposed in the second portion. The substrate 42 includes a first sub-region 42A disposed in the first portion, and a second sub-region 42B disposed in the second portion. The metal layer 43 includes a first sub-region 43A disposed in the first portion, and a second sub-region 43B disposed in the second portion.

[0119] In some embodiments, the first portion 401 includes: the first sub-region 41A of the stacked metal layer 41, the first sub-region 42A of the substrate 42, and the first sub-region 43A of the metal layer 43. The first sub-region 43A of the metal layer 43 is used for electrical connection with the grounding component.

[0120] The stacked structure design of the first portion 401 can improve the strength, stability, etc. of the flexible circuit board 40 while ensuring the conductive performance of the flexible circuit board 40.

[0121] In some embodiments, reference Figure 10As shown, the first part 401 may further include a coating 4001 and a coating 4002. The coating 4001 is disposed on the side of the first sub-region 41A of the metal layer 41 close to the display screen, and the coating 4002 is disposed on the side of the fifth part of the metal layer 43 close to the grounding component. The coatings 4001 and 4002 are used to improve the performance of the flexible circuit board 40, such as enhancing at least one of the corrosion resistance, wear resistance, electrical conductivity, or hardness.

[0122] For example, the coating 4001 and / or the coating 4002 may include at least one of a gold plating layer, a nickel plating layer, and a silver plating layer. The silver plating layer can improve the electrical conductivity of the flexible circuit board 40. The nickel plating layer can improve the corrosion resistance and wear resistance of the flexible circuit board 40. The gold plating layer can improve the electrical contact impedance and enhance the electrical conductivity.

[0123] The embodiments of the present application do not limit the thickness of the coating. By way of example, the coating thickness is greater than or equal to 4 μm.

[0124] The second part 402 and the first part 401 both include, for example, a metal layer 41, a substrate 42, and a metal layer 43 stacked. By way of example, the second part 402 includes: a second sub-region 41B of the metal layer 41, a second sub-region 42B of the substrate 42, and a second sub-region 43B of the metal layer 43 stacked.

[0125] In some embodiments, the second part further includes other laminated structures. By way of example, as Figure 10 shown, the second part 402 further includes: a substrate 44 and a metal layer 45 and other laminations. The substrate 44 is disposed on the side of the second sub-region 43B of the metal layer 43 away from the display screen, and the metal layer 45 is disposed on the side of the substrate 44 away from the display screen.

[0126] In some embodiments, the second part 402 includes: a first sub-part 402A and a second sub-part 402B, and a conductive layer 102 in the connecting part 1010 is connected to the second sub-part 402B.

[0127] In some embodiments, the first sub-part 402A further includes a first shielding layer 4003, and the first shielding layer 4003 is disposed on the side of the first sub-part 402A close to the display screen.

[0128] In some other embodiments, the second part 402 further includes: a second shielding layer, and the second shielding layer is disposed on the side of the second part close to the grounding component. The first shielding layer 4003 and the second shielding layer can play a protective role or cover for subsequent surface treatment.

[0129] Of course, in some embodiments, the second part 402 may include one of the first shielding layer 4003 and the second shielding layer.

[0130] For example, Figure 10 As shown, the first sub - part 402A includes: a first shielding layer 4003 arranged in a stacked manner, a second sub - region 41B of a metal layer 41 arranged in a stacked manner, a second sub - region 42B of a substrate 42, a second sub - region 43B of a metal layer 43, a first sub - region 44A of a substrate 44, and a first sub - region 45A of a metal layer 45.

[0131] The second sub - part 402B includes: a third sub - region 41C of a metal layer 41 arranged in a stacked manner, a third sub - region 42C of a substrate 42, a third sub - region 43C of a metal layer 43, a second sub - region 44B of a substrate 44, and a second sub - region 45B of a metal layer 45. There is no shielding layer provided on the surface of the third sub - region 41C of the metal layer 41, and the connecting portion 1010 can be connected to the third sub - region 41C of the metal layer 41.

[0132] In this way, the processing process requirements for the flexible circuit board 40 are relatively low, and since the number of stacked layers of the first part 401 is less than that of the second part 402, local thinning of the flexible circuit board 40 is achieved. The saved space can provide space for the working height of the grounding component, which is beneficial to reducing the thickness of the whole machine and is of great benefit to the inner cavity of the electronic device.

[0133] In the embodiments of the present application, the thickness of the first part 401 is not limited. In some embodiments, the thickness range of the first part is between 0.05 - 0.15 mm. For example, the thickness of the first part is 0.1 mm.

[0134] In some embodiments, the materials of the first shielding layer 4003 and the second shielding layer can be an electromagnetic interference (EMI) layer and solder mask ink. By setting the shielding layer, the interference between metal traces in different regions of the metal layer can be reduced, and the electromagnetic shielding performance can be improved.

[0135] In the above - mentioned embodiments, the metal layer 41 and the metal layer 43 can be a single - layer structure or a multi - layer structure. For example, the metal layer 41 adopts a double - layer structure, and the metal layer 41 includes: a copper - clad layer provided on the substrate 42, and a metal plating layer provided on the copper - clad layer. The present application does not make any limitation in this regard. Alternatively, the flexible circuit board 40 can include the metal layer 41 or the metal layer 43.

[0136] Among them, the thickness of the copper - clad layer is greater than or equal to 6 μm, and the metal plating layer can be a copper - plating layer, and the thickness of the copper - plating layer is greater than or equal to 11 μm.

[0137] In some embodiments, the material of the aforementioned substrate 42 may include at least one of polyimide (PI), TPU, polypropylene, PET, or polyvinylidene fluoride. The materials of the substrate 42 and the support layer 70 may be the same or different, and the present application does not limit this.

[0138] In some embodiments, as Figure 11 shown, the circuit board may further include: a connection layer 46, a metal layer 47, and a substrate 48 that are stacked. The connection layer 46 is disposed below the substrate 42, and the substrate 48 is disposed above the metal layer 43.

[0139] The second part 402 and the first part 401 each include, for example, a metal layer 41, a substrate 42, a connection layer 46, a metal layer 47, a substrate 48, and a metal layer 43 that are stacked.

[0140] The embodiments of the present application do not limit the material of the connection layer 46. In some implementations, the connection layer 46 may use an adhesive to connect the substrate 42 and the metal layer 47.

[0141] Among them, the metal layer 41 includes a first sub-region 41A disposed in the first part and a second sub-region 41B disposed in the second part. The substrate 42 includes a first sub-region 42A disposed in the first part and a second sub-region 42B disposed in the second part. The connection layer 46 includes a first sub-region 46A disposed in the first part and a second sub-region 46B disposed in the second part. The metal layer 47 includes a first sub-region 47A disposed in the first part and a second sub-region 47B disposed in the second part. The substrate 48 includes a first sub-region 48A disposed in the first part and a second sub-region 48B disposed in the second part. The metal layer 43 includes a first sub-region 43A disposed in the first part and a second sub-region 43B disposed in the second part.

[0142] As Figure 11 shown, the first part 401 includes: the first sub-region 41A of the metal layer 41, the first sub-region 42A of the substrate 42, the first sub-region 46A of the connection layer 46, the first sub-region 47A of the metal layer 47, the first sub-region 48A of the substrate 48, and the first sub-region 43A of the metal layer 43 that are stacked.

[0143] The second part 402 includes: a first sub-part 402A and a second sub-part 402B, and a connection part 1010 is connected to a conductive layer 102 in the second sub-part 402B.

[0144] The first sub - part 402A includes: a second sub - region 41B of the metal layer 41 arranged in a stack, a second sub - region 42B of the substrate 42, a second sub - region 46B of the connection layer 46, a second sub - region 47B of the metal layer 47, a second sub - region 48B of the substrate 48, a second sub - region 43B of the metal layer 43, a first sub - region 44A of the substrate 44, and a first sub - region 45A of the metal layer 45.

[0145] The second sub - part 402B includes: a third sub - region 41C of the metal layer 41 arranged in a stack, a third sub - region 42C of the substrate 42, a third sub - region 46C of the connection layer 46, a third sub - region 47C of the metal layer 47, a third sub - region 48C of the substrate 48, a third sub - region 43C of the metal layer 43, a second sub - region 44B of the substrate 44, and a second sub - region 45B of the metal layer 45.

[0146] In some embodiments, the connecting part 1010 includes: a third part 1011 and a fourth part 1012 connected in sequence. The third part 1011 is arranged in a stack with the second part 402, and the fourth part 1012 is connected to the display screen. For example, the third part 1011 is arranged on the side of the second part 402 close to the display screen and is connected to the second part 402.

[0147] To improve the electrical connection performance of the first part 401. In some embodiments, vias 4010 can be provided in the first part 401. Under the action of the vias 4010, the metal layer 41 and the metal layer 43 are electrically connected, so that the grounding component is electrically connected to the conductive layer 102 through the first part 401.

[0148] In some embodiments, the resistance between the upper and lower surfaces of the first part 401 provided with vias can be detected. The resistance between the upper and lower surfaces is, for example, less than or equal to 1 ohm, which can achieve stable and good electrical signal conduction.

[0149] The embodiment of the present application does not limit the length of the via 4010 in the first part 401. In some embodiments, the first part 401 includes an insulating layer. For example, the substrate 42, the connection layer 46, and the substrate 48 are all insulating layers, and the via 4010 penetrates through all the insulating layers of the first part 401 at least in the thickness direction of the display screen.

[0150] The following takes the structure of the first part 401 including three metal layers as an example for illustration.

[0151] In some embodiments, such as Figure 12As shown, the via 4010 is a through hole that penetrates through the plating layer 4001, the first sub-region 41A of the metal layer 41, the first sub-region 42A of the substrate 42, the first sub-region 46A of the connection layer 46, the first sub-region 47A of the metal layer 47, the first sub-region 48A of the substrate 48, the first sub-region 43A of the metal layer 43, and the plating layer 4002. In this embodiment, the via 4010 penetrates through the entire first part 401 in the thickness direction of the display screen. When the grounding component abuts against the plating layer 4002, the grounding component can be electrically connected to the via 4010 through the plating layer 4002 and to the plating layer 4001 through the via 4010.

[0152] In some other embodiments, as Figure 13 shown, the via 4010 is a blind hole that penetrates through the first sub-region 42A of the substrate 42, the first sub-region 46A of the connection layer 46, the first sub-region 47A of the metal layer 47, the first sub-region 48A of the substrate 48, the first sub-region 43A of the metal layer 43, and the plating layer 4002. When the grounding component abuts against the plating layer 4002, the grounding component can be electrically connected to the via 4010 through the plating layer 4002 and to the metal layer 41 and the plating layer 4001 through the via 4010.

[0153] In some embodiments, in order to improve the anti-extrusion and anti-film printing capabilities of the first part 401, a reinforcing plate 4005 can also be provided on the first part 401.

[0154] For example, as Figure 14 、 Figure 15 shown, the first part 401 further includes: a reinforcing plate 4005, which is provided on the side of the first part 401 away from the display screen 100.

[0155] The embodiments of the present application do not limit the connection method between the reinforcing plate 4005 and the first part 401. In some embodiments, as Figure 14 shown, the reinforcing plate 4005 is connected to the plating layer 4002 through a conductive adhesive 4004. The conductive adhesive 4004 can be a thermosetting adhesive, and the thermosetting adhesive can be cured by a chemical reaction. The conductive adhesive 4004 in this embodiment uses a thermosetting adhesive, and referring to the structure of a pressure-sensitive adhesive, it can better improve the stability of radio frequency electrical connection.

[0156] In some other embodiments, the reinforcing plate 4005 can be connected to the plating layer 4002 through surface mount technology (SMT), for example, by welding. As Figure 15As shown, a welding layer 4007 is provided between the reinforcement plate 4005 and the plating layer 4002, and the reinforcement plate 4005 can be welded to the plating layer 4002 through the welding layer 4007. In some embodiments, the material of the welding layer 4007 is tin.

[0157] The embodiments of the present application do not limit the material of the reinforcement plate. In some embodiments, the material of the reinforcement plate includes: copper or stainless steel. The stainless steel can be of a low-magnetic type, such as SUS316.

[0158] Among them, in this embodiment, the reinforcement plate is connected to the first part by welding, which can be used in the solution where the via hole is a blind hole, avoiding the contamination of the surface of the first part caused by the heating of the material of the welding layer.

[0159] In some embodiments, in order to further improve the electrical conductivity of the first part 401, a plating layer 4006 can also be provided on the reinforcement plate 4005, and the plating layer 4006 is provided on the side of the reinforcement plate 4005 away from the display screen 100.

[0160] In some embodiments, the first sub-region 43A of the metal layer 43 can also be etched to form metal lines, which can improve the bending performance of the first part 401. For example, the first sub-region 43A of the metal layer 43 includes a plurality of first metal lines 43A1 arranged along the first direction, the first sub-region 47A of the metal layer 47 includes a plurality of second metal lines 47A1 arranged along the second direction, and the projection of the first metal line 43A1 on the substrate and the projection of the second metal line 47A1 on the substrate overlap in the region 4011.

[0161] The embodiments of the present application do not limit the angle between the first direction and the second direction, as long as the projection of the first metal line on the substrate and the projection of the second metal line on the substrate have an overlapping area. In some embodiments, the first direction and the second direction are parallel.

[0162] In some embodiments, the first direction and the second direction intersect. For example, the projection of the first metal line 43A1 on the substrate and the projection of the second metal line 47A1 on the substrate are in a grid shape.

[0163] For example, the first direction and the second direction are perpendicular, and a plurality of first metal lines 43A1 and a plurality of second metal lines 47A1 are arranged crosswise. For example, as Figure 16 shown, the first direction is parallel to the y direction, and the second direction is parallel to the x direction.

[0164] In some embodiments, in order to improve the electrical connection performance of the first part 401, the via hole 4010 can be arranged at the intersection position of the metal lines. For example, the projection of the via hole 4010 on the substrate overlaps with the region 4011.

[0165] Taking Figure 13 the structure shown as an example for illustration, for example, as Figure 16 shown, the first sub-region 43A of the metal layer 43 includes a plurality of first metal lines 43A1 arranged along a first direction, the first sub-region 47A of the metal layer 47 includes a plurality of second metal lines 47A1 arranged along a second direction, and the projection of the first metal line 43A1 on the substrate and the projection of the second metal line 47A1 on the substrate overlap in the region 4011. Among them, the first direction and the second direction are perpendicular, and the plurality of first metal lines 43A1 and the plurality of second metal lines 47A1 are cross-arranged.

[0166] The first part 401 is also provided with a plurality of vias 4010, and the projection of the via 4010 on the substrate overlaps with the region 4011.

[0167] In this embodiment, the first part 401 of the flexible circuit board 40 adopts a linear distribution of different layers of metal in the woven mesh, which can disperse stress, is beneficial to reducing film printing, and can also provide a sufficient conduction area. By providing the vias 4010 in the first part 401, different layer conduction can be achieved.

[0168] The embodiment of the present application does not limit the number of vias 4010. In some embodiments, the first part includes a plurality of vias 4010, and the plurality of vias 4010 are arranged in an array. Among them, the vias 4010 arranged in an array can be called a via comb, and the number is greater than or equal to 6. For example, the cross-sectional length of the first part is 2.5 mm, the width is 2.5 mm, and the number range of the vias 4010 is between 9 and 16.

[0169] The embodiment of the present application does not limit the line widths of the first metal line 43A1 and the second metal line 47A1. In some embodiments, the elastic contact area of the grounding component is within the range of the projection cross area of the first metal line 43A1 and the second metal line 47A1, improving the stability of the electrical connection.

[0170] The embodiment of the present application does not limit the shape of the first part 401. In order to further reduce film printing, in some embodiments, the shape of the first part 401 can be adjusted so that the corners on the first part 401 are all rounded corners.

[0171] For example, the cross-sectional length of the first part is 2.5 mm, the width is 2.5 mm, and the radius of the rounded corner is greater than or equal to 0.5 mm, avoiding the generation of cusp extrusion at the surface of the conductive layer.

[0172] For example, Figure 17 is a top view of the first part 401 of the flexible circuit board 40 provided by the embodiment of the present application. As Figure 17As shown, the top view of the first part 401 includes: a first side 401a and a second side 401b, and the included angle between the first side 401a and the second side 401b is a rounded corner.

[0173] In some embodiments of the present application, the first part 401 includes an opposite top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface. The top surface is the surface of the first part 401 close to the display screen 100. For example, the top surface adopts a shape as Figure 17 shown. The bottom surface is the surface of the first part 401 facing away from the display screen 100. In some embodiments, the shape of the bottom surface is the same as the shape of the surface of the first part 401 close to the display screen 100. For example, both adopt a shape as Figure 17 shown.

[0174] When the flexible circuit board 40 is in the working state, the first part 401 abuts against the conductive layer 102 under the action of the grounding component. The top surface of the first part 401 abuts against the conductive layer 102. The top surface includes multiple sides, and the included angle between adjacent two sides is a rounded corner. In this way, the design of the rounded corner can effectively reduce film printing.

[0175] Figure 18 It is a cross-sectional schematic diagram of the first part 401 of the flexible circuit board 40 provided by the embodiment of the present application. As Figure 18 shown, the first part 401 includes a third sub-part 4012, a fourth sub-part 4013, and a fifth sub-part 4014 that are sequentially connected in the direction away from the second part. The width of the fourth sub-part 4013 is smaller than the width of the third sub-part 4012, and the width of the fourth sub-part 4013 is smaller than the width of the fifth sub-part 4014. Thus, the fourth sub-part has a smaller width and better bending performance, can better fit the conductive layer, and improves the electrical connection stability.

[0176] In some embodiments, as Figure 9 shown, the display module further includes a second connecting part 503. The fifth sub-part 4014 is connected to the conductive layer 102 through the second connecting part 503. The second area is used to abut against the conductive layer under the elastic force generated by the elastic member. The material of the third connecting part 503 can refer to the description of the first connecting part 501, which will not be elaborated here.

[0177] Exemplarily, referring to Figure 18 , the cross-sectional shape of the first part 401 includes: an I shape. The width of the third sub-part 4012 in the x direction is d1, the width of the fourth sub-part 4013 in the x direction is d2, and the width of the fifth sub-part 4014 in the x direction is d3. d2 is less than d1, and d2 is less than d3. Thus, the fourth sub-part has a smaller width and better bending performance, can better fit the conductive layer, and improves the electrical connection stability.

[0178] An embodiment of the present application further provides an electronic device, such as Figure 19 shown, the electronic device includes: a display module and a grounding component. The display module is as Figures 7 - 9 shown. The grounding component includes: an elastic member 20 and a metal member 30. The elastic member 20 is disposed between the display screen 100 and the metal member 30.

[0179] The embodiment of the present application does not limit the structure of the electronic device. In some embodiments, as Figure 2 shown, the electronic device further includes a housing 12, and the housing 12 is disposed opposite to the display screen 100. Among them, the flexible circuit board 40, the elastic member 20 and the metal member 30 are disposed between the housing 12 and the display screen 100, and the electrically connected conduction region can be disposed on the flexible circuit board connected to the display screen 100 as Figure 2 shown.

[0180] In some embodiments, the electronic device adopts a double-sided screen structure as Figure 3 shown, the electronic device includes: a first display screen 200 and a second display screen 300, the second display screen 300 is a flexible screen that can be folded or unfolded along the folding axis, the first display screen 200 is disposed opposite to the second display screen 300, and the flexible circuit board 40, the elastic member 20 and the metal member 30 are disposed between the first display screen 200 and the second display screen 300. The electrically connected conduction region can be disposed on the flexible circuit board connected to the first display screen 200 as Figure 3 shown. In this embodiment, the display screen 100 and the flexible circuit board as Figure 2 shown are taken as examples for description.

[0181] In some embodiments, the elastic member 20 includes a first end 201, a second end 203, and a deformation section 202 located between the first end 201 and the second end 203. The first end 201 is connected to the metal member 30, and the second end 203 abuts against the first portion 401 under the elastic force generated by the deformation section 202 to electrically connect the elastic member 20 and the conductive layer 102.

[0182] In some embodiments, the second end 203 and the first portion 401 are in point contact, and the first portion 401 and the display screen are in surface contact.

[0183] In the embodiment of the present application, the display screen is electrically connected to the flexible circuit board 40, and the elastic member 20 is electrically connected to the metal member 30. Under the elastic force of the elastic member 20, the first part 401 of the flexible circuit board 40 can be reliably electrically connected to the elastic member 20, thereby realizing a reliable electrical connection between the display screen and the metal member 30. The flexible circuit board 40 can be a flexible circuit board functional device of the display screen. On the original flexible circuit board frame, a conductive area electrically connected to the elastic member 20 is designed, which is conducive to simplifying the design and reducing the production cost. The electrical connection function is stable, and the screen and other conductive materials can be RF grounded and signal guided, which reduces the influence of the charge on the antenna signal and the display performance of the display screen.

[0184] At the same time, compared with conductive foam, the elastic member 20 has a smaller working height and contact area, occupies less space, and is conducive to reducing the thickness of the whole machine and increasing the device layout space in the electronic device, thereby improving space utilization. In addition, the first part 401 of the circuit board assembly can disperse the elastic force of the elastic member 20 to the surface, which can reduce or avoid the problem of screen film printing, thereby improving the reliability of the screen. In addition, the display screen electrical connection solution provided in the embodiment of the present application has a simple structure and low cost.

[0185] Figure 22 A schematic diagram of the structure of an elastic member 20 provided in an embodiment of the present application is shown in FIG. Figure 22 As shown, the elastic member 20 includes a first end 201, a second end 203 and a deformation section 202, and the deformation section 202 is located between the first end 201 and the second end 203 and can be elastically deformed. In some embodiments, the deformation section 202 is a curved sheet, and when an external force is applied to the deformation section 202, it can store and release energy by bending. Exemplarily, the shape of the deformation section 202 can be an arc. In the embodiment of the present application, the first end 201 is a fixed end, the second end 203 is a free end, and the deformation section 202 can be elastically deformed, so the elastic member 20 is a single cantilever design, which can ensure the stability of the electrical connection.

[0186] In some embodiments, the surface of the second end 203 facing the display screen includes an arc surface, and the arc surface protrudes toward one side of the display screen. When the second end 203 abuts against the first part 401, it is actually the arc surface that contacts the first part 401. The design of the arc surface can ensure the reliability of the electrical connection between the second end 203 and the first part 401.

[0187] In some embodiments, the second end 203 includes at least a portion of a sphere. Exemplarily, the second end 203 is spherical or hemispherical.

[0188] In some embodiments, the first end 201 includes a welding portion, and the welding portion is used to be welded to the metal member 30 .

[0189] The size occupied by the elastic member 20 provided in the embodiment of the present application in the thickness direction of the display screen is greatly reduced, which is beneficial to reducing the thickness of the whole machine. The top screen force generated by the elastic member 20 provided in the embodiment of the present application is greatly reduced, which is beneficial to improving the film printing problem and reducing the risk of screen delamination. Further, generally multiple grounding points need to be set for the electrical connection of the display screen. If a conductive foam is used to electrically connect the display screen, in order to prevent the screen from falling off, it is necessary to widen the bonding area and the dispensing area to hold the screen, which will cause an increase in the black border of the screen. However, when using the elastic member 20 provided in the present application to electrically connect the display screen, the top screen force generated by the elastic member 20 is small, which can not only greatly reduce the risk of screen delamination, improve the reliability of the screen, but also improve the black border of the screen and enhance the competitiveness of the whole machine.

[0190] In addition, since the top screen force generated by the elastic member 20 is small, it is beneficial to design the thickness reduction of the display screen while ensuring the reliability of the screen, such as reducing the thickness and / or the number of the stacks of the display screen, etc., to achieve the thin and light design of the electronic device.

[0191] Figure 20 It is a schematic diagram of the working state of a flexible circuit board 40 provided in the embodiment of the present application. Figure 21 It is another schematic diagram of the working state of a flexible circuit board 40 provided in the embodiment of the present application. As Figure 20 、 Figure 21 shown, when the second end 203 of the elastic member 20 applies a force to the first part 401, the first part 401 can move relative to the second part 402 in the direction close to the display screen, and finally contact the display screen, and abut against the display screen under the elastic force of the elastic member 20, so as to realize the reliable electrical connection between the first part 401 and the display screen.

[0192] In some embodiments, as Figure 20 shown, under the elastic force of the elastic member 20, the first part 401 deforms, the first part 401 is an arc surface, and the first part 401 abuts against the conductive layer 102.

[0193] In other embodiments, as Figure 21 shown, under the elastic force of the elastic member 20, the first part 401 deforms, the first part 401 is a curved surface, the bending direction of the curved surface faces the metal member 30, and the first part 401 abuts against the conductive layer 102.

[0194] The embodiment of the present application does not limit the number of electrical connection conduction regions for grounding in the flexible circuit board. Multiple electrical connection conduction regions can be set on the flexible circuit board. For example, as Figure 23 shown, two electrical connection conduction regions are provided on the flexible circuit board 40: a first electrical connection conduction region 401A and a second electrical connection conduction region 401B.

[0195] In the embodiments of the present application, there are various types of metal parts 30. As an example, the metal part 30 can be a shielding case. The shielding case can be used to protect the internal components of the electronic device from external radiation and being interfered by external radiation. In some embodiments, the shielding case can be disposed on the circuit board and electrically connected to the circuit board. Since the working height requirement of the elastic member 20 is small, when the elastic member 20 is connected to the shielding case, the utilization rate of the motherboard layout can be improved.

[0196] As another example, the metal part 30 can be a middle frame, such as Figure 1 the middle frame shown.

[0197] In some embodiments, the lower surface of the conductive layer 102, the lower surface of the first part 401, the elastic member 20 and the middle frame jointly enclose a cavity.

[0198] In the embodiments of the present application, there are various assembly methods for the electrical connection scheme of the display screen.

[0199] As an example, the elastic member 20 can be first connected (such as welded) to the metal part 30 (such as a shielding case, a middle frame, etc.), and the flexible circuit board 40 can be connected (such as adhered through an insulating back glue or an insulating foam glue) to the display screen. For example, the first sub - part of the second part 402 of the flexible circuit board 40 is connected to the stack layer (such as the SCF layer, the VC layer or the stainless - steel layer, etc.) of the display screen closest to the circuit board, and the connection part of the display screen is connected to the second sub - part of the second part 402 of the flexible circuit board 40. For example, the third part of the connection part and the metal layers of the second sub - part can be stacked and connected layer by layer. Then, the display screen connected with the flexible circuit board 40 and the metal part 30 connected with the elastic member 20 are assembled together, and the second end 203 of the elastic member 20 abuts against the first part 401 (such as the central area of the first part 401) of the flexible circuit board 40. Since the first part 401 is in contact with the display screen or has a small gap, under the elastic force of the elastic member 20, the second end 203 applies a force to the first part 401 to deform the first part 401 to abut against the display screen, thereby forming a complete electrical connection scheme.

[0200] In some embodiments, the display screen can be a flexible screen (i.e., the screen can be bent and folded), or a rigid screen (i.e., the screen cannot be bent and folded).

[0201] The embodiment of the present application provides a display module and an electronic device, the electronic device includes a middle frame, and the display module is connected to the middle frame. The display module includes: a first display screen and a flexible circuit board, the flexible circuit board can be a functional device of the display screen; the first display screen includes a stacked display layer and a conductive layer, the conductive layer is arranged on the side of the display layer away from the light-emitting surface, the display layer includes: a display panel, and a connecting portion connected to the display panel; the flexible circuit board includes: a first part and a second part connected, the connecting portion is connected to the second part, the first part of the flexible circuit board can be used as an electrically connected conductive area, the first part is used to abut against the conductive layer under the elastic force of the grounding component, so as to electrically connect the grounding component and the conductive layer, so that the first display screen is grounded. Among them, the first part of the circuit board component can disperse the elastic force of the grounding component to the surface, which can reduce or avoid the problem of screen film printing, thereby improving the reliability of the screen. In this way, the flexible circuit board can not only be used as a functional device of the display screen, but also can be used to ground the display screen, thereby realizing the reuse of the flexible circuit board, simplifying the design of the electrical connection, reducing the production cost, and the electrical connection function is stable, and can perform RF grounding and signal conduction on conductive materials such as the screen, reducing the impact of charge on the antenna signal and the display performance of the display screen.

[0202] In some embodiments, the first part includes a metal layer and a substrate, and the second part has more stacked layers. A via can be set in the first part, and the via at least passes through the insulating layer of the first part. Under the action of the via, the surface of the first part and the metal layer of the ground can be conductive, so that the grounding component can be electrically connected to the conductive layer through the metal layer of the first part.

[0203] In some embodiments, the electronic device further comprises a first connection portion, the second portion is connected to the conductive layer through the first connection portion, the first connection portion is used to generate a gap between the first portion and the conductive layer, the gap is used for the first portion to move in the gap along the thickness direction of the first display screen under the elastic force of the elastic member until it abuts against the conductive layer. Thus, there is a gap between the first portion and the display screen, so that the abutting force between the first portion and the display screen is only provided by the grounding component, which has good controllability and is convenient for designing the size parameters and elastic force of the grounding component. In addition, the existence of the gap can offset the errors generated during processing, assembly, etc., and avoid causing or aggravating film printing problems.

[0204] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that, include: A first display screen and a flexible circuit board, wherein the first display screen comprises a display layer and a conductive layer which are stacked, wherein the conductive layer is arranged on a side of the display layer away from a light emitting surface, and the display layer comprises: a display panel, and a connecting portion connected to the display panel; The flexible circuit board comprises: a first part and a second part connected to each other, the connecting portion is connected to the second part, and the first part is used to abut against the conductive layer under the action of elastic force to electrically connect the conductive layer.

2. The display module according to claim 1, wherein The first part includes a plurality of connected side edges, and the angle between two adjacent side edges is a rounded angle.

3. The display module according to claim 1 or 2, characterized in that, The first part includes: a first metal layer, a first substrate, a first connection layer, a third metal layer, a second substrate and a second metal layer which are stacked, wherein the first metal layer is arranged close to the first display screen, and the first part includes: a via hole, through which the first metal layer is connected to the second metal layer.

4. The display module according to claim 3, wherein There are multiple via holes, and the multiple via holes are arranged in an array.

5. The display module according to any one of claims 2-4, characterized in that, The first metal layer includes a plurality of first metal wires arranged along a first direction, the second metal layer includes a plurality of second metal wires arranged along a second direction, the projection of the first metal wires on the substrate and the projection of the second metal wires on the substrate have an overlapping area, and the projection of the via on the substrate overlaps with the overlapping area.

6. The display module according to claim 5, wherein The first direction and the second direction are parallel.

7. The display module according to claim 5, wherein The first direction and the second direction intersect.

8. The display module according to claim 7, wherein The projection of the first metal wire on the substrate and the projection of the second metal wire on the substrate are in a grid shape.

9. The display module according to any one of claims 1-8, characterized in that, The display module also includes a first connecting portion, and the second portion is connected to the conductive layer via the first connecting portion. The first connecting portion is used to generate a gap between the first portion and the conductive layer. The gap is used for the first portion to move in the gap along the thickness direction of the first display screen under the elastic force of the elastic member until it abuts against the conductive layer.

10. The display module according to claim 9, characterized in that, The second part includes: a first sub-part and a second sub-part connected to each other, the first sub-part is connected to the first part, the second sub-part and the third part are stacked, the first connecting part is arranged between the first sub-part and the conductive layer, the side of the second sub-part close to the first display screen is a metal layer, and the connecting part includes: a third part and a fourth part connected to each other, the third part is arranged on a side of the second part close to the first display screen, the fourth part is connected to the display layer; the third part is connected to the second part.

11. The display module according to claim 10, wherein The second portion further includes a shielding layer disposed between the first sub-portion and the first connecting portion.

12. The display module according to claim 10 or 11, characterized in that, The electronic device further includes: a second connection layer and a support layer arranged between the third portion and the conductive layer, the second connection layer is connected to the conductive layer, and the support layer is arranged between the second connection layer and the third portion.

13. The display module according to any one of claims 9-12, characterized in that, The first part includes a third sub-part, a fourth sub-part and a fifth sub-part which are connected to each other, the third sub-part is connected to the second part, the electronic device also includes a second connecting part, the fifth sub-part is connected to the conductive layer through the second connecting part, and the fourth sub-part is used to abut against the conductive layer under the elastic force generated by the elastic member.

14. The display module according to claim 13, wherein, The width of the fourth subsection is smaller than the width of the third subsection, and the width of the fourth subsection is smaller than the width of the fifth subsection.

15. The display module according to claim 14, wherein, The cross-sectional shape of the first portion includes: an I-shape.

16. The display module according to any one of claims 1-15, characterized in that, The first part further includes: a first coating layer and a second coating layer, wherein the first coating layer is arranged on a side of the first part close to the first display screen, and the second coating layer is arranged on a side of the first part away from the first display screen.

17. The display module according to any one of claims 1-16, characterized in that, The first part further includes: a reinforcing plate, and the reinforcing plate is arranged on a side of the second coating layer away from the first display screen.

18. An electronic device, characterized in that, include: A conductive component and a display module according to any one of claims 1 to 17, wherein the conductive component comprises: an elastic member and a metal member, wherein the elastic member is arranged between the first display screen and the metal member; One end of the elastic member is connected to the metal member, and the other end is in contact with the first portion. The first portion is used to abut against the conductive layer under the elastic force generated by the elastic member to electrically connect the metal member and the conductive layer.

19. The electronic device according to claim 18, characterized in that, The electronic device also includes a second display screen, which is a flexible screen that can be folded or unfolded along a folding axis. The first display screen is arranged opposite to the second display screen, and the elastic member and the metal member are arranged between the first display screen and the second display screen.

20. The electronic device according to claim 18 or 19, characterized in that, The electronic device further includes a housing, which is arranged opposite to the first display screen, and the flexible circuit board, the elastic member and the metal member are arranged between the housing and the first display screen.

21. The electronic device according to any one of claims 18-20, characterized in that, The electronic device further includes a middle frame, which is arranged on a side away from the light-emitting surface of the first display screen, and the metal component is arranged on the middle frame, or the middle frame includes the metal component.

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