Sintering equipment and method for power device packaging

Abstract

The present invention discloses a sintering device and method for power device packaging, and relates to the technical field of sintering. The present invention includes a sintering furnace arranged on a support column, and also includes: a sealing component; a gas storage tank arranged in the sintering furnace; an air guide unit, including an air blowing component and an air return component, and an air guide inner ring is arranged in the air blowing component; a sintering inner box is arranged in the air guide inner ring, and a sintering unit is arranged in the sintering inner box; a mounting component and a pressurizing component are arranged in the sintering unit. The advantages are: the present invention adopts a contact heating method to effectively improve the sintering efficiency of the packaged chip, and can directly blow the inert gas to the vicinity of the packaged chip during sintering so that the two are in full contact, and the sintering effect is better. At the same time as sintering, the impact of the inert gas can be used to achieve intermittent pressurization of the packaged chip, further improving the sintering effect. It can also achieve the recovery of the inert gas and the cyclic cooling of the packaged chip after sintering, and has stronger functionality.

Description

Technical Field

[0001] The present invention relates to the technical field of sintering, and in particular to a sintering device and method for power device packaging. Background Art

[0002] Power device packaging refers to the technology of encapsulating and protecting power semiconductor device chips and connecting the chips to external circuits. The packaged chips are usually sintered using sintering equipment during packaging, so that the sintering material is sintered to the packaged chips in a high-temperature environment and a dense sintered layer is formed on the packaged chips.

[0003] Existing sintering equipment uses a variety of methods to achieve the sintering of packaged chips, such as a sintering equipment for power device packaging with announcement number CN112071775B, including: a first support seat, a second support seat arranged opposite to the first support seat, and a sintering cavity for sealing the first support seat and the second support seat; the first support seat and the second support seat can reciprocate relative to each other; the sintering cavity includes a first cavity structure that surrounds the first support seat and is fixedly set, and a second cavity structure that surrounds the second support seat and reciprocates with the second support seat, and also includes a material tray, which is detachably supported on the first support seat; a first through hole for introducing inert gas is provided on the first cavity structure; a through hole for introducing inert gas is provided on the first support seat adjacent to the device to be sintered on the material tray; and a second through hole for exhausting gas is provided on the second cavity structure.

[0004] When sintering, packaged chips are usually blown into a certain amount of inert gas for assistance. However, existing packaging equipment usually blows the inert gas into the sintering furnace as a whole, but does not divide the inert gas in detail, so that multiple packaged chips cannot be evenly contacted with the inert gas, and the sintering effect is poor. For example, the above-mentioned referenced prior art uses an external pipeline device to directly introduce the inert gas into the cavity, but does not divide the inert gas in detail, so that the packaged chips therein cannot fully contact with the inert gas, and oxidation is prone to occur during sintering. Moreover, the device cannot achieve synchronous pressurization of multiple packaged chips, so that the sintering, pressurization, blowing and other processes of the packaged chips cannot be synchronized, and the sintering efficiency is low.

[0005] Therefore, there is an urgent need to design a sintering device and method for power device packaging to solve the above problems. Summary of the Invention

[0006] In view of the deficiencies of the prior art, the present invention provides a sintering device and method for power device packaging, which solves the problems raised in the above background technology.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: A sintering device for power device packaging, comprising a sintering furnace for sintering packaged chips arranged on a support column, and further comprising:

[0008] A sealing assembly provided on the side of the sintering furnace for achieving sealing thereof;

[0009] A gas storage tank for storing inert gas arranged in the sintering furnace;

[0010] The air guide unit is arranged in the sintering furnace and includes an air blowing assembly and an air return assembly. The air blowing assembly is provided with an air guide inner ring. The air blowing assembly is used to introduce the inert gas in the gas storage tank into the air guide inner ring and purify and recover the inert gas through the air return assembly.

[0011] A sintering inner box is arranged in the gas guide inner ring, and a plurality of air blowing pipes are fixedly connected between the sintering inner box and the gas guide inner ring, and a sintering unit is arranged in the sintering inner box;

[0012] A plurality of mounting components for mounting packaged chips are provided in the sintering unit, and a pressurizing component for pressurizing the plurality of packaged chips is provided in the sintering unit.

[0013] Preferably, the sealing assembly includes an opening and closing chain plate fixedly installed on the side of the sintering furnace, and a sealing cover is provided at the end of the opening and closing chain plate, a locking bar is fixedly installed in the sealing cover, and a locking groove matching the locking bar is provided on the inner side of the end of the sintering furnace, and a control handle is provided on the outer side of the sealing cover.

[0014] Preferably, the air guide unit comprises a servo motor fixedly mounted in the sintering furnace, and a driving roller is fixedly mounted on the driving end of the servo motor;

[0015] The air blowing assembly includes a blow box fixedly installed in the sintering furnace, and the blow box and the sintering furnace are rotatably connected. A plurality of wind impellers are fixedly installed on the driving roller, and the plurality of wind impellers are all located in the blow box. An air intake pipe for conducting inert gas is fixedly connected between the blow box and the gas storage tank, and a blowing mechanism is provided on the blow box.

[0016] Preferably, the blowing mechanism includes a conduction tube for guiding air fixedly connected to the end of the blower box, and a gas collecting plate is fixedly connected to the conduction tube. An air guide inner ring is fixedly installed in the sintering furnace, and a plurality of air guide tubes for blowing are fixedly connected between the air collecting plate and the air guide inner ring.

[0017] Preferably, the air return assembly includes an air collecting hood fixedly mounted on the end of the air guide inner ring, a purification adsorption cylinder for purifying inert gas is provided in the sintering furnace, and an air collecting pipe is fixedly connected between the purification adsorption cylinder and the air collecting hood, and a plurality of air return pipes are fixedly connected between the purification adsorption cylinder and the blower box;

[0018] A ventilation pipe for ventilation is fixedly connected between the blast box and the sintering furnace.

[0019] Preferably, the sintering unit includes a partition plate fixedly installed in the sintering inner box, and a plurality of mounting components are respectively arranged on both sides of the partition plate;

[0020] The mounting assembly comprises two support frames which are slidably mounted on the partition plate and the sintering inner box, and the packaged chip is placed between the two support frames, and a positioning mechanism is installed between the two support frames.

[0021] Preferably, the positioning mechanism includes a connecting frame fixedly installed between the two support frames, and a plurality of sintering heating plates for heating the packaged chips are fixedly installed on the connecting frame. Threaded adjustment rods are threadedly installed on the two support frames, and a positioning pressure plate for positioning the packaged chip is rotatably installed at the lower end of each threaded adjustment rod. A telescopic limit rod is fixedly installed between the two positioning pressure plates and the corresponding support frames.

[0022] Preferably, the pressurizing assembly includes a plurality of supporting side plates fixedly mounted on a plurality of supporting frames, and a pressurizing plate is slidably mounted between the supporting side plates on the same side, a linkage plate is fixedly mounted between the two pressurizing plates at the front and rear positions, and two linkage rods are fixedly mounted between the adjacent upper and lower linkage plates, and a pressurizing mechanism is installed between the upper linkage plate and the sintering inner box.

[0023] Preferably, the pressure mechanism includes an air injection pipe fixedly connected between the air guide inner ring and the sintered inner box, the lower part of the air injection pipe is fixedly connected to a reciprocating cylinder, an extrusion plate is slidably installed in the reciprocating cylinder through two return spring rods, and the extrusion plate is in contact with the inner wall of the reciprocating cylinder, and a pressure rod cooperating with a linkage plate is fixedly installed at the lower part of the extrusion plate;

[0024] A trigger rod is fixedly mounted on the extrusion disc, and a trigger button cooperating with the trigger rod is provided in the reciprocating cylinder. A pressure relief valve cooperating with the trigger button is provided on the reciprocating cylinder, and an air pressure sensor is provided in the reciprocating cylinder.

[0025] A sintering method for power device packaging, used in the above-mentioned sintering equipment for power device packaging, comprising the following steps:

[0026] S1. When sintering the packaged chips, first place multiple packaged chips neatly in the sintering inner box and seal the sintering furnace with a sealing assembly;

[0027] S2. Start the sintering unit to heat and sinter the multiple packaged chips, and simultaneously start the air blowing assembly to evenly introduce the inert gas in the gas storage tank into the sintering inner box to assist sintering;

[0028] S3, while sintering, start the pressurizing component to pressurize multiple packaged chips at the same time;

[0029] S4. After sintering is completed, the inert gas is recovered through the gas return component;

[0030] S5. After sintering is completed, the sealing assembly is opened to open the sintering furnace, and the air guide unit is started to blow air to cool the packaged chips in the sintering inner box.

[0031] The present invention provides a sintering device and method for power device packaging, which has the following beneficial effects:

[0032] 1. When sintering packaged chips, this sintering equipment can inject inert gas into the sintering inner box through the cooperation of the blast component while the packaged chips are sintering. The inert gas can be blown to the vicinity of multiple packaged chips in a targeted manner, achieving effective sintering anti-oxidation, making the inert gas fully contact with the packaged chips, and effectively avoiding uneven contact.

[0033] 2. When sintering packaged chips, this sintering equipment can automatically drive multiple lower pressure plates to move back and forth by using the blowing impact of inert gas during sintering. It can not only realize the sintering and pressurization of multiple packaged chips at the same time, but also realize intermittent pressurization, which can effectively improve the pressurization effect of the packaged chips and improve their sintering efficiency.

[0034] 3. When sintering packaged chips, this sintering equipment can effectively recover the inert gas through the return gas component and the purification adsorption cylinder after sintering is completed. At the same time, it can purify and adsorb impurities in the inert gas, further improving the recovery effect of the inert gas and effectively avoiding waste.

[0035] 4. When sintering packaged chips, this sintering equipment can achieve rapid extrusion and positioning of the packaged chips through the cooperation of the positioning mechanism. At the same time, the sintering heating plate at the bottom can directly heat the packaged chips, which has higher heating efficiency and no waste of heat energy.

[0036] 5. When sintering packaged chips, this sintering equipment can generate circulating air in the sintering inner box by using the cooperation of the blast assembly after sintering is completed, so as to quickly blow and cool the packaged chips after sintering, thereby effectively improving the cooling efficiency of the packaged chips.

[0037] In summary, the present invention adopts the contact heating method to effectively improve the sintering efficiency of the packaged chip. During sintering, the inert gas can be directly blown to the vicinity of the packaged chip so that the two are in full contact, resulting in a better sintering effect. At the same time as sintering, the impact of the inert gas can be used to achieve intermittent pressurization of the packaged chip, further improving the sintering effect. After sintering, the inert gas can be recovered and the packaged chip can be circulated and cooled, which makes it more functional.

[0038] Other features and advantages of the present invention will be described in the following description, and part of them will become obvious from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, wherein:

[0040] Figure 1 This is a schematic structural diagram of a sintering device for power device packaging proposed by the present invention;

[0041] Figure 2 for Figure 1 Schematic diagram of the structure after the middle sealing cover is opened;

[0042] Figure 3 for Figure 1 Schematic diagram of the internal structure of the sintering furnace;

[0043] Figure 4 for Figure 3 Schematic diagram of the structure after rotating a certain angle;

[0044] Figure 5 for Figure 4 Schematic diagram of the structure after removing the sintering furnace;

[0045] Figure 6 for Figure 5 Schematic diagram of the structure of the inner ring of the central air guide and the blower box;

[0046] Figure 7 for Figure 5 Schematic diagram of the internal structure of the central air hood and the blower box;

[0047] Figure 8 for Figure 2 Schematic diagram of the structure of the sintering inner box;

[0048] Figure 9 for Figure 8 Schematic diagram of the internal structure of the sintering inner box;

[0049] Figure 10 Schematic diagram of the structure of the sintering unit in the present invention;

[0050] Figure 11 for Figure 10 Schematic diagram of the structure between the two support frames;

[0051] Figure 12 for Figure 11 Front view of

[0052] Figure 13 for Figure 11 Schematic diagram of the structural decomposition;

[0053] Figure 14 for Figure 10 Schematic diagram of the structure between multiple groups of pressure plates;

[0054] Figure 15 for Figure 14 A magnified view of the structure of the middle reciprocating cylinder;

[0055] Figure 16 for Figure 15 Schematic diagram of the internal structure of the middle reciprocating cylinder.

[0056] In the figure: 1 support column, 2 sintering furnace, 3 sealing cover, 4 opening and closing chain plate, 5 air guide inner ring, 6 sintering inner box, 7 servo motor, 8 gas storage tank, 9 blower box, 10 gas collecting hood, 11 air guide pipe, 12 gas collecting plate, 13 purification adsorption cylinder, 14 air blowing pipe, 15 suction pipe, 16 impeller, 17 return air pipe, 18 air collecting pipe, 19 conduction pipe, 20 drive roller, 21 partition plate, 22 support frame, 23 air injection pipe, 24 connecting frame, 25 support side plate, 26 limit slider, 27 threaded adjustment rod, 28 pressure plate, 29 package chip, 30 sintering heating plate, 31 positioning pressure plate, 32 linkage plate, 33 linkage rod, 34 reciprocating cylinder, 35 pressure rod, 36 pressure relief valve, 37 extrusion plate, 38 return spring rod. DETAILED DESCRIPTION

[0057] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0058] Example 1: Reference Figure 1-Figure 4 as well as Figure 11 A sintering device for power device packaging includes a sintering furnace 2 for sintering a packaged chip 29 arranged on a support column 1. The power device is the packaged chip 29. When packaging the packaged chip 29, a sintering device is usually required to sinter the sintering material onto the packaged chip 29 so that the sintering material forms a sintering layer on the packaged chip 29, thereby protecting the packaged chip 29 and improving its conductivity.

[0059] The sintering equipment also includes:

[0060] A sealing assembly is provided on the side of the sintering furnace 2 for achieving its sealing. The sealing assembly includes an opening and closing chain plate 4 fixedly installed on the side of the sintering furnace 2, and a sealing cover 3 is provided at the end of the opening and closing chain plate 4. A snap-fitting strip is fixedly installed in the sealing cover 3, and a snap-fitting groove that cooperates with the snap-fitting strip is provided on the inner side of the end of the sintering furnace 2.

[0061] After multiple packaged chips 29 are placed, the sealing cover 3 can be rotated and clamped into the sintering furnace 2 through the opening and closing chain plate 4, and the sealing cover 3 can be clamped and limited by the cooperation of the clamping bar and the clamping groove. At this time, the sealing cover 3 will seal the inside of the sintering furnace 2, so that the heat and gas inside will not leak during sintering and cause waste.

[0062] A control handle is provided on the outer side of the sealing cover 3, and the sealing cover 3 can be rotated by the control handle, which is more convenient and saves trouble.

[0063] In a further embodiment, a gas storage tank 8 for storing inert gas is provided in the sintering furnace 2 . The gas storage tank 8 is used to store inert gas and can be replenished at any time.

[0064] The gas guide unit is provided in the sintering furnace 2 and is used to realize the conduction, blowing and recovery of the inert gas. At the same time, it can quickly cool down the packaged chip 29 after sintering.

[0065] The sintering unit is used to realize simultaneous sintering of multiple packaged chips 29 to improve sintering efficiency.

[0066] Example 2: Reference Figure 2-Figure 7 The technical difference between this embodiment and the first embodiment is that the air guide unit includes an air blowing component and an air return component. An air guide inner ring 5 is provided in the air blowing component. The air blowing component is used to introduce the inert gas in the gas storage tank 8 into the air guide inner ring 5, and purify and recover the inert gas through the air return component.

[0067] The sintering inner box 6 is disposed in the gas guide inner ring 5 , and a plurality of air blowing pipes 14 are fixedly connected between the sintering inner box 6 and the gas guide inner ring 5 .

[0068] The air guide unit includes a servo motor 7 fixedly installed in the sintering furnace 2, and a driving roller 20 is fixedly installed on the driving end of the servo motor 7. When the servo motor 7 is started, the driving roller 20 is driven to rotate. The speed and rotation direction of the driving roller 20 can be controlled by the servo motor 7.

[0069] The air blowing assembly includes a blow box 9 fixedly mounted in the sintering furnace 2, and the blow box 9 is rotatably connected to the sintering furnace 2. A plurality of impellers 16 are fixedly mounted on the driving roller 20, and the plurality of impellers 16 are all located in the blow box 9. An air intake pipe 15 for conducting inert gas is fixedly connected between the blow box 9 and the gas storage tank 8.

[0070] The servo motor 7 starts to drive the driving roller 20 to rotate forward and then drives the impeller 16 to rotate forward. When the impeller 16 rotates forward, the inert gas in the gas storage tank 8 is sucked into the blower box 9 through the suction pipe 15, completing the conduction of the inert gas.

[0071] The blower box 9 is provided with a blowing mechanism, which includes a conduction pipe 19 for guiding air fixedly connected to the end of the blower box 9, and a gas collecting plate 12 is fixedly connected to the conduction pipe 19. An air guide inner ring 5 is fixedly installed in the sintering furnace 2, and a plurality of air guide pipes 11 for blowing air are fixedly connected between the air collecting plate 12 and the air guide inner ring 5.

[0072] The inert gas in the blower box 9 will enter the gas collecting plate 12 through the conduction tube 19, and the inert gas in the gas collecting plate 12 will enter the gas guiding inner ring 5 through multiple gas guiding tubes 11 and fully fill the gas guiding inner ring 5. The inert gas in the gas guiding inner ring 5 will be directly blown into different areas in the sintering inner box 6 through multiple blowing tubes 14, that is, it will fully contact with the packaged chips 29 in different areas in the sintering inner box 6, thereby effectively improving the contact range between the packaged chips 29 and the inert gas, avoiding insufficient contact during sintering and causing oxidation of the packaged chips 29, and achieving a better sintering effect.

[0073] In a further embodiment, the return air assembly includes an air collecting hood 10 fixedly mounted on the end of the air guide inner ring 5, a purification adsorption cylinder 13 for purifying inert gas is provided in the sintering furnace 2, and an air collecting pipe 18 is fixedly connected between the purification adsorption cylinder 13 and the air collecting hood 10, and a plurality of return air pipes 17 are fixedly connected between the purification adsorption cylinder 13 and the blower box 9, and an air collecting pipe (not shown in the figure) is provided in the sintering inner box 6, and the air collecting pipe is provided at the rear end of the sintering inner box 6 for discharging the inert gas therein to the air collecting hood 10 for collection after sintering is completed.

[0074] When the sintering of the packaged chip 29 is completed, the servo motor 7 can be started to drive the drive roller 20 and the multiple impellers 16 to rotate in the opposite direction. When the multiple impellers 16 reverse, negative pressure suction will be generated, that is, the inert gas in the sintering inner box 6 will be adsorbed into the purification adsorption cylinder 13 through the collecting air pipe, the gas collecting hood 10, and the gas collecting pipe 18. At this time, the purification adsorption cylinder 13 will purify the inert gas and adsorb impurities, that is, the purification of the inert gas will be realized. The purified inert gas will enter the blower box 9 and be replenished to the gas storage tank 8 through the suction pipe 15, so that the recovery of the inert gas can be automatically completed, which can effectively avoid the waste of inert gas.

[0075] There is a ventilation pipe fixedly connected between the blower box 9 and the sintering furnace 2 for ventilation. After the sintering of the packaged chip 29 is completed and the inert gas recovery is completed, the sealing cover 3 can be opened to connect the sintering furnace 2 and the sintering inner box 6. Then the servo motor 7 is started to drive the driving roller 20 and the multiple impellers 16 to rotate forward. At this time, the impeller 16 rotates forward and the cold air outside the sintering furnace 2 is sucked into the blower box 9 through the ventilation pipe (the suction pipe 15 is closed at this time and no inert gas is absorbed), and the cold air is discharged through the conduction pipe. The tube 19, the air collecting plate 12, the air guide pipe 11, the air guide inner ring 5, and multiple air blowing pipes 14 blow the cold air directly into the sintering inner box 6 and contact the high-temperature packaged chip 29 that has been sintered therein, so as to efficiently blow air to dissipate heat for the packaged chip 29, thereby improving its cooling efficiency. The air after heat dissipation will be directly discharged through the end of the sintering furnace 2, thereby realizing the air circulation in the sintering furnace 2 and the sintering inner box 6, and realizing automatic and efficient cooling and heat dissipation of the packaged chip 29 during the circulation process.

[0076] Example 3: Reference Figure 2-Figure 4 as well as Figures 8-16 The technical difference between this embodiment and the second embodiment is that a sintering unit is provided in the sintering inner box 6, a plurality of mounting components for mounting packaged chips 29 are provided in the sintering unit, and a pressurizing component for pressurizing the plurality of packaged chips 29 is provided in the sintering unit.

[0077] The sintering unit includes a partition plate 21 fixedly installed in the sintering inner box 6, and multiple mounting components are respectively arranged on both sides of the partition plate 21. The partition plate 21 is used to partition the sintering inner box 6 internally, thereby realizing the separation of multiple packaged chips 29, and multiple packaged chips 29 can be placed at the same time.

[0078] The mounting assembly includes two support frames 22 slidably mounted on the partition plate 21 and the sintering inner box 6 , and the packaged chip 29 is placed between the two support frames 22 . A positioning mechanism is installed between the two support frames 22 .

[0079] The two support frames 22 can slide between the partition plate 21 or the sintering inner box 6, so that the two support frames 22 can slide out of the sintering inner box 6 to take out the packaged chips 29, which is more convenient and saves trouble.

[0080] The positioning mechanism includes a connecting frame 24 fixedly installed between the two support frames 22. The two support frames 22 are both threadedly mounted with threaded adjustment rods 27, and the lower end of each threaded adjustment rod 27 is rotatably mounted with a positioning pressure plate 31 for positioning the packaged chip 29.

[0081] When installing the packaged chip 29, the packaged chip 29 can be placed between the two support frames 22 first, and then the two threaded adjustment rods 27 are rotated respectively to drive the two positioning pressure plates 31 to move downward until the two positioning pressure plates 31 move down to contact and squeeze the packaged chip 29. At this time, the two positioning pressure plates 31 cooperate to squeeze and position the packaged chip 29, so that it remains stable during sintering without shaking, effectively improving the sintering effect of the packaged chip 29.

[0082] A telescopic limit rod is fixedly installed between the two positioning pressure plates 31 and the corresponding support frame 22. The telescopic limit rod is used to limit the positioning pressure plate 31 so that it can only move vertically and will not rotate with the rotation of the threaded adjustment rod 27.

[0083] A plurality of sintering heating plates 30 for heating the packaged chip 29 are fixedly mounted on the connecting frame 24. After the packaged chip 29 is placed and positioned, it can be pushed back into the sintering inner box 6 and the sealing cover 3 can be closed. At this time, the sintering work can be started. During sintering, the plurality of sintering heating plates 30 can be started to directly heat the bottom of the packaged chip 29 to quickly heat it up, thereby realizing the heating and sintering of the packaged chip 29.

[0084] The heating efficiency and the heating temperature of the packaged chips 29 can be controlled by controlling the number of the opened sintering heating plates 30 , thereby effectively improving the sintering efficiency of the packaged chips 29 .

[0085] In a further embodiment, the pressure assembly includes a plurality of support side plates 25 fixedly mounted on a plurality of support frames 22, and a pressure plate 28 is slidably mounted between the support side plates 25 on the same side, a linkage plate 32 is fixedly mounted between the two pressure plates 28 at the front and rear positions, and two linkage rods 33 are fixedly mounted between the adjacent upper and lower linkage plates 32.

[0086] The two pressure plates 28 in the horizontal position are connected by a linkage plate 32, so that the two horizontal pressure plates 28 can be raised and lowered synchronously under the action of the linkage plate 32, and the linkage plates 32 in the vertical state are connected by a linkage rod 33, so that multiple linkage plates 32 in the vertical direction can be raised and lowered synchronously, that is, when the upper linkage plate 32 is raised and lowered, it can drive multiple pressure plates 28 to be raised and lowered at the same time, and multiple packaged chips 29 can be pressurized at the same time.

[0087] A pressure mechanism is installed between the upper linkage plate 32 and the sintering inner box 6. The pressure mechanism includes an air injection pipe 23 fixedly connected between the air guide inner ring 5 and the sintering inner box 6. The lower part of the air injection pipe 23 is fixedly connected to a reciprocating cylinder 34. An extrusion plate 37 is slidably installed in the reciprocating cylinder 34 through two return spring rods 38, and the extrusion plate 37 is in contact with the inner wall of the reciprocating cylinder 34. A pressure rod 35 that cooperates with the linkage plate 32 is fixedly installed at the lower part of the extrusion plate 37.

[0088] An electromagnet is provided at the lower part of the pressure rod 35, and a permanent magnet is provided on the uppermost linkage plate 32, so that when sintering pressure is performed, the electromagnet is started to be adsorbed by the permanent magnet. At this time, when the pressure rod 35 is raised or lowered, the adsorption effect of the electromagnet and the permanent magnet will drive the linkage plate 32 to rise and fall, and then the multiple pressure plates 28 can be driven to rise and fall synchronously.

[0089] During sintering, part of the inert gas in the gas guide inner ring 5 will be injected into the reciprocating cylinder 34 through the gas injection pipe 23. As the inert gas gradually increases, the extrusion plate 37 will be synchronously pushed downward (the two return spring rods 38 will be stretched at this time). The downward movement of the extrusion plate 37 will drive the pressure rod 35 at its lower part to move downward, and then drive the multiple linkage plates 32 to move downward, thereby driving the multiple pressure plates 28 to move downward, so that the packaged chip 29 can be pressurized during sintering, thereby promoting its sintering efficiency.

[0090] When the extrusion disk 37 moves down and away from the reciprocating cylinder 34, the inert gas in the reciprocating cylinder 34 will be quickly discharged through the air between the extrusion disk 37 and the reciprocating cylinder 34, and the lower part of the reciprocating cylinder 34 is in a connected state, that is, the amount of gas injected into the reciprocating cylinder 34 through the gas injection pipe 23 is less than the amount of gas discharged from the lower part of the reciprocating cylinder 34, that is, the instantaneous pressure release is completed, and the air in the reciprocating cylinder 34 is rapidly reduced. At this time, the reset spring rod 38 will automatically contract and reset, thereby driving the extrusion disk 37 to move up and reset, and then driving the linkage plate 32 and multiple pressure plates 28 to move up, thereby releasing the pressure on the packaged chip 29.

[0091] When the extrusion disk 37 is reset, the lower part of the reciprocating cylinder 34 is in a closed state, and gas can continue to be injected through the gas injection pipe 23, thereby driving the extrusion disk 37 and the pressure plate 28 to move downward again, and the packaged chip 29 can be pressurized again, so that the packaged chip 29 can be repeatedly pressurized during sintering, which will neither affect the contact between the upper part of the packaged chip 29 and the inert gas during sintering, nor affect the pressurization effect, and can effectively improve its sintering efficiency and avoid sintering oxidation.

[0092] The use of intermittent pressurization can ensure that the upper part of the packaged chip 29 is in full contact with the inert gas, thereby avoiding the situation where the upper part of the packaged chip 29 cannot contact with the inert gas when the pressure plate 28 is in long-term contact and pressurization with the upper part of the packaged chip 29, resulting in oxidation or sintering difficulties, thereby effectively improving the sintering effect of the packaged chip 29.

[0093] Furthermore, a trigger rod is fixedly mounted on the extrusion disk 37 , and a trigger button cooperating with the trigger rod is provided in the reciprocating cylinder 34 , a pressure relief valve 36 cooperating with the trigger button is provided on the reciprocating cylinder 34 , and an air pressure sensor is provided in the reciprocating cylinder 34 .

[0094] The internal pressure release of the reciprocating cylinder 34 can be automatically completed through the pressure relief valve 36, that is, when the extrusion disk 37 moves down to drive the trigger rod to contact the trigger button, the trigger button will automatically control the pressure relief valve 36 to open, that is, the inert gas in the reciprocating cylinder 34 is directly discharged through the pressure relief valve 36, and then the extrusion disk 37 is driven to move up and reset with the cooperation of the reset spring rod 38. When the extrusion disk 37 is reset, the trigger button stops triggering. At this time, the pressure relief valve 36 closes the reciprocating cylinder 34 and continues to store gas, thereby pushing the extrusion disk 37 down again to achieve reciprocating lifting and pressurization of the pressure plate 28.

[0095] The specific working principle of this sintering equipment is:

[0096] When installing the packaged chip 29, first place the packaged chip 29 between the two support frames 22, then rotate the two threaded adjustment rods 27 respectively to drive the two positioning pressure plates 31 to move downward until the two positioning pressure plates 31 move down to contact and squeeze the packaged chip 29. At this time, the two positioning pressure plates 31 cooperate to squeeze and position the packaged chip 29. After the packaged chip 29 is placed and positioned, push it back into the sintering inner box 6 and close the sealing cover 3, and then start sintering.

[0097] During sintering, multiple sintering heating plates 30 are started to directly heat the bottom of the packaged chip 29 to quickly heat it up, thereby achieving heating and sintering of the packaged chip 29. At the same time, the servo motor 7 is started to drive the drive roller 20 to rotate forward and then drive the impeller 16 to rotate forward. When the impeller 16 rotates forward, the inert gas in the gas tank 8 will be sucked into the blower box 9 through the intake pipe 15.

[0098] The inert gas in the blower box 9 will enter the gas collecting plate 12 through the conduction tube 19, and the inert gas in the gas collecting plate 12 will enter the gas guiding inner ring 5 through multiple gas guiding tubes 11 and fully fill the gas guiding inner ring 5. The inert gas in the gas guiding inner ring 5 will be directly blown into different areas in the sintering inner box 6 through multiple blowing tubes 14, that is, it will fully contact with the packaged chips 29 in different areas in the sintering inner box 6, thereby effectively improving the contact range between the packaged chips 29 and the inert gas.

[0099] During sintering pressurization, the electromagnet is started to attract the permanent magnet, and part of the inert gas in the air guide inner ring 5 will be injected into the reciprocating cylinder 34 through the gas injection pipe 23. As the inert gas gradually increases, the extrusion plate 37 will be synchronously pushed downward. The downward movement of the extrusion plate 37 will drive the pressure rod 35 at its lower part to move downward, and then drive the multiple linkage plates 32 to move downward, thereby driving the multiple pressure plates 28 to move downward, so that the packaged chip 29 can be pressurized during sintering, thereby promoting its sintering efficiency.

[0100] When the extrusion plate 37 moves down and away from the reciprocating cylinder 34, the pressure will be released quickly, and then the extrusion plate 37 and multiple pressure plates 28 will be driven upward with the cooperation of the reset spring rod 38 to release the pressure on the packaged chip 29. After the extrusion plate 37 is reset, the lower part of the reciprocating cylinder 34 is in a closed state. At this time, the gas injection pipe 23 continues to inject gas to drive the extrusion plate 37 and the pressure plate 28 downward again, and the packaged chip 29 is pressurized again, realizing repeated pressurization during sintering of the packaged chip 29. This will neither affect the contact between the upper part of the packaged chip 29 and the inert gas during sintering, nor affect its pressurization effect, thereby effectively improving its sintering efficiency and avoiding sintering oxidation.

[0101] When the sintering of the packaged chip 29 is completed, the servo motor 7 can be started to drive the drive roller 20 and the multiple impellers 16 to rotate in the opposite direction. When the multiple impellers 16 reverse, negative pressure suction will be generated, that is, the inert gas in the sintering inner box 6 will be adsorbed into the purification adsorption cylinder 13 through the collecting air pipe, the gas collecting hood 10, and the gas collecting pipe 18. At this time, the purification adsorption cylinder 13 will purify the inert gas and adsorb impurities, that is, the purification of the inert gas will be realized. The purified inert gas will enter the blower box 9 and be replenished to the gas storage tank 8 through the suction pipe 15, so that the recovery of the inert gas can be automatically completed, which can effectively avoid the waste of inert gas.

[0102] An embodiment of the present invention further provides a sintering method for power device packaging, which is used in the above-mentioned sintering equipment for power device packaging, and includes the following steps:

[0103] S1. When sintering the packaged chips 29, first place the multiple packaged chips 29 neatly in the sintering inner box 6, and seal the sintering furnace 2 with a sealing assembly;

[0104] S2. Start the sintering unit to heat and sinter the multiple packaged chips 29, and start the air blowing assembly to evenly introduce the inert gas in the gas storage tank 8 into the sintering inner box 6 to assist sintering during sintering.

[0105] S3, while sintering, start the pressurizing component to pressurize the multiple packaged chips 29 at the same time;

[0106] S4. After sintering is completed, the inert gas is recovered through the gas return component;

[0107] S5. After sintering is completed, the sealing assembly is opened to open the sintering furnace 2, and the air guide unit is started to blow air to cool the packaged chips 29 in the sintering inner box 6.

[0108] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A sintering device for power device packaging, comprising a sintering furnace (2) arranged on a support column (1) for sintering a packaged chip (29), characterized in that: Also includes: A sealing assembly provided on the side of the sintering furnace (2) for achieving sealing thereof; A gas storage tank (8) for storing inert gas disposed in the sintering furnace (2); An air guide unit is provided in the sintering furnace (2), and includes an air blowing assembly and an air return assembly. An air guide inner ring (5) is provided in the air blowing assembly. The air blowing assembly is used to introduce the inert gas in the gas storage tank (8) into the air guide inner ring (5), and purify and recover the inert gas through the air return assembly. A sintering inner box (6) is arranged in the air guide inner ring (5), and a plurality of air blowing pipes (14) are fixedly connected between the sintering inner box (6) and the air guide inner ring (5), and a sintering unit is arranged in the sintering inner box (6); A plurality of mounting components for mounting packaged chips (29) are provided in the sintering unit, and a pressurizing component for pressurizing the plurality of packaged chips (29) is provided in the sintering unit; The sintering unit includes a partition plate (21) fixedly mounted in a sintering inner box (6), and a mounting assembly includes two support frames (22) slidably mounted on the partition plate (21) and the sintering inner box (6), so that the two support frames (22) can slide out of the sintering inner box (6); The pressurizing assembly includes a plurality of supporting side plates (25) fixedly mounted on a plurality of supporting frames (22), and a pressurizing plate (28) that can slide up and down is mounted between the supporting side plates (25) on the same side, a linkage plate (32) is fixedly mounted between two pressurizing plates (28) at front and rear positions, and two linkage rods (33) are fixedly mounted between two adjacent upper and lower linkage plates (32), and a pressurizing mechanism is mounted between the upper linkage plate (32) and the sintering inner box (6); The pressure mechanism includes an air injection pipe (23) fixedly connected between the air guide inner ring (5) and the sintering inner box (6); the lower part of the air injection pipe (23) is fixedly connected to a reciprocating cylinder (34); an extrusion plate (37) that can slide up and down is installed in the reciprocating cylinder (34) through two return spring rods (38), and the extrusion plate (37) is in contact with the inner wall of the reciprocating cylinder (34); and a pressure rod (35) that cooperates with the linkage plate (32) is fixedly installed at the lower part of the extrusion plate (37); A trigger rod is fixedly mounted on the extrusion disc (37), a trigger button cooperating with the trigger rod is provided in the reciprocating cylinder (34), a pressure relief valve (36) cooperating with the trigger button is provided on the reciprocating cylinder (34), and an air pressure sensor is provided in the reciprocating cylinder (34).

2. The sintering equipment for power device packaging according to claim 1, characterized in that: The sealing assembly comprises an opening and closing chain plate (4) fixedly mounted on the side of the sintering furnace (2), and a sealing cover (3) is provided at the end of the opening and closing chain plate (4), a locking bar is fixedly mounted in the sealing cover (3), and a locking groove matching the locking bar is provided on the inner side of the end of the sintering furnace (2), and a control handle is provided on the outer side of the sealing cover (3).

3. The sintering equipment for power device packaging according to claim 1, characterized in that: The air guide unit comprises a servo motor (7) fixedly mounted in the sintering furnace (2), and a driving roller (20) is fixedly mounted on the driving end of the servo motor (7); The air blowing assembly includes a blow box (9) fixedly installed in the sintering furnace (2), and the blow box (9) and the sintering furnace (2) are rotatably connected. A plurality of wind impellers (16) are fixedly installed on the driving roller (20), and the plurality of wind impellers (16) are all located in the blow box (9). An air intake pipe (15) for conducting inert gas is fixedly connected between the blow box (9) and the gas storage tank (8), and a blower mechanism is provided on the blow box (9).

4. The sintering equipment for power device packaging according to claim 3, characterized in that: The blowing mechanism comprises a conduction pipe (19) for guiding air fixedly connected to the end of the blower box (9), and a gas collecting plate (12) is fixedly connected to the conduction pipe (19). An air guide inner ring (5) is fixedly installed in the sintering furnace (2), and a plurality of air guide pipes (11) for blowing air are fixedly connected between the gas collecting plate (12) and the air guide inner ring (5).

5. The sintering equipment for power device packaging according to claim 4, characterized in that: The return air assembly comprises a gas collecting hood (10) fixedly mounted on the end of the gas guide inner ring (5); a purification adsorption cylinder (13) for purifying inert gas is provided in the sintering furnace (2); a gas collecting pipe (18) is fixedly connected between the purification adsorption cylinder (13) and the gas collecting hood (10); and a plurality of return air pipes (17) are fixedly connected between the purification adsorption cylinder (13) and the blower box (9); A ventilation pipe for ventilation is fixedly connected between the blast box (9) and the sintering furnace (2).

6. The sintering equipment for power device packaging according to claim 5, characterized in that: A plurality of mounting components are respectively arranged on both sides of the partition plate (21), the packaged chip (29) is placed between the two support frames (22), and a positioning mechanism is installed between the two support frames (22).

7. The sintering equipment for power device packaging according to claim 6, characterized in that: The positioning mechanism comprises a connecting frame (24) fixedly mounted between two support frames (22), and a plurality of sintering heating plates (30) for heating the packaged chip (29) are fixedly mounted on the connecting frame (24), a threaded adjustment rod (27) is threadedly mounted on both support frames (22), and a positioning pressure plate (31) for positioning the packaged chip (29) is rotatably mounted at the lower end of each threaded adjustment rod (27), and a telescopic limiting rod is fixedly mounted between the two positioning pressure plates (31) and the corresponding support frames (22).

8. A sintering method for power device packaging, used in the sintering equipment for power device packaging according to any one of claims 1 to 7, characterized in that: The following steps are involved: S1. When sintering the packaged chips (29), firstly, a plurality of packaged chips (29) are neatly stacked in a sintering inner box (6), and the sintering furnace (2) is sealed by a sealing component; S2, starting the sintering unit to heat and sinter the plurality of packaged chips (29), and simultaneously starting the air blowing assembly to evenly introduce the inert gas in the gas storage tank (8) into the sintering inner box (6) to assist in sintering; S3, while sintering, starting the pressurizing component to pressurize the plurality of packaged chips (29) at the same time; S4. After sintering is completed, the inert gas is recovered through the gas return component; S5. After sintering is completed, the sealing assembly is opened to open the sintering furnace (2), and at the same time, the air guide unit is started to blow air to cool the packaged chips (29) in the sintering inner box (6).

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