Wafer carrying device with lifting rotating arm

Abstract

The invention relates to a lifting rotating arm wafer carrying device which comprises a wafer fixing plate, a wafer lifting assembly is connected to the wafer fixing plate, a wafer rotating assembly is connected to the wafer lifting assembly, a carrying telescopic material taking assembly is connected to the wafer rotating assembly, and a supporting plate is connected to the carrying telescopic material taking assembly. The supporting plate is connected with a carrying vacuum adsorption assembly. The working efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to a wafer handling device with a lifting and rotating arm. Background Art

[0002] With the development of the semiconductor industry, especially the miniaturization of chip sizes and the trend of high integration and miniaturization in semiconductor packaging, many high - requirement packaging processes start to use invisible cutting, and then the wafers or chips with attached films are completely separated along a predetermined path to obtain independent individuals. At the same time, it is necessary to ensure that the dies in the wafer are separated by the required gap. On the other hand, the current products on the market mainly use manually operated mother - son rings to expand the film to separate the dies, with low efficiency and unable to meet the needs of automation. This requires high - precision equipment and strict process control. Moreover, the miniaturization of equipment can reduce the occupation of workshop space. Therefore, it is necessary to use a wafer handling device with a lifting and rotating arm to handle wafers between different workstations in a small space, which requires the ability to handle wafers with a steel ring between workstations with different heights, different angles, and different distances. To solve the above problems, it is necessary to develop a wafer handling device with a lifting and rotating arm to facilitate subsequent operations. Summary of the Invention

[0003] To solve the above - mentioned technical problems, the purpose of the present invention is to provide a wafer handling device with a lifting and rotating arm.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] The wafer handling device with a lifting and rotating arm includes a wafer fixing plate, a wafer lifting assembly is connected to the wafer fixing plate, a wafer rotating assembly is connected to the wafer lifting assembly, a handling telescopic material - taking assembly is connected to the wafer rotating assembly, a support plate is connected to the handling telescopic material - taking assembly, and a handling vacuum adsorption assembly is connected to the support plate;

[0006] The wafer rotating assembly includes a wafer rotating backplane, on which a pedestal bearing is connected. A rotating shaft is connected to the pedestal bearing through a bearing. An inductor piece that rotates synchronously with the rotating shaft is connected to the rotating shaft. A sensor sheet metal is connected to the wafer rotating backplane. An inductor that is inductively matched with the inductor piece is connected to the sensor sheet metal. A motor fixing plate is connected to the wafer rotating backplane. A motor is connected to the motor fixing plate. The rotating shaft of the motor is connected to a first synchronous pulley. A bearing fixing seat is connected to the wafer rotating backplane. A rotating shaft is connected between the bearing fixing seats through a bearing. A second synchronous pulley opposite to the first synchronous pulley is connected to the lower end of the rotating shaft. A first synchronous belt is connected between the second synchronous pulley and the first synchronous pulley. A third synchronous pulley synchronous with the second synchronous pulley is connected above the rotating shaft. A fourth synchronous pulley opposite to the third synchronous pulley is connected to the rotating shaft. A second synchronous belt is connected between the fourth synchronous pulley and the third synchronous pulley.

[0007] Preferably, for a lifting and rotating arm wafer handling device, the handling vacuum adsorption assembly includes an arm support. An air circuit board is connected above the arm support. The air circuit board is connected to a handling telescopic picking component through a connecting block. Arm plates are connected to both the left and right sides of the arm support through sliding plates. A pressing plate is connected above the arm plates. A vacuum connector is connected to the pressing plate. A vacuum chuck for adsorbing the wafer is connected to the vacuum connector.

[0008] Preferably, for a lifting and rotating arm wafer handling device, the handling telescopic picking component includes a telescopic support. A telescopic guide rail is connected to one side of the telescopic support. A slider is connected to the telescopic guide rail. A sliding arm is connected to the slider. A front cylinder support and a rear cylinder support are respectively connected to the front side and the rear side of the other side of the telescopic support. A telescopic cylinder is connected between the front cylinder support and the rear cylinder support. The driving shaft of the telescopic cylinder passes through the front cylinder support and is connected to one end of a connecting bracket. The other end of the connecting bracket is connected to the sliding arm.

[0009] Preferably, for a lifting and rotating arm wafer handling device, a telescopic guard plate is connected to the outside of the telescopic support.

[0010] Preferably, for a lifting and rotating arm wafer handling device, an extended connection section connected to the wafer rotating assembly is connected to the telescopic support. The telescopic support and the extended connection section are of an integrally formed structure and are in an L-shaped structure.

[0011] Preferably, for a lifting and rotating arm wafer handling device, there are two inductor pieces, and they are arranged in an up-and-down staggered manner with a staggering angle of 180°. There are two inductors, which are arranged up and down, and each inductor piece corresponds to each inductor one by one.

[0012] Preferably, for the wafer handling device with a lifting and rotating arm, the wafer lifting assembly includes a wafer adjustment plate, on which a vertical lifting back plate is connected. On one side of the lifting back plate, a lifting guide rail is connected. A slider fixing block is slidably connected to the lifting guide rail. On the top of the slider fixing block, a first buffer fixing plate is connected. On the other side of the lifting back plate, a cylinder mounting sheet metal is connected. An lifting cylinder is connected to the cylinder mounting sheet metal. The driving shaft of the lifting cylinder is connected to the first buffer fixing plate through a floating joint. A buffer is connected to the first buffer fixing plate and is in buffer contact with the top of the lifting back plate.

[0013] Preferably, for the wafer handling device with a lifting and rotating arm, a buffer support is connected to the back surface of the lifting back plate. A second buffer fixing plate is connected to the buffer support. A buffer for slidably contacting the slider fixing block is connected to the second buffer fixing plate.

[0014] Preferably, for the wafer handling device with a lifting and rotating arm, adjustment fixing seats are connected around the wafer adjustment plate. Adjusting bolts for adjusting the wafer adjustment plate are connected to the adjustment fixing seats.

[0015] Preferably, for the wafer handling device with a lifting and rotating arm, a support sheet metal is connected to the side of the wafer adjustment plate.

[0016] By means of the above solution, the present invention has at least the following advantages:

[0017] 1. The present invention can realize wafer handling in a small space, facilitating subsequent processes.

[0018] 2. The present invention can realize the lifting function, enabling high and low handling, and facilitating wafer handling at different stations.

[0019] 3. The present invention contains a two-stage synchronous pulley structure, can rotate the swing arm, and can realize handling at different angles, facilitating wafer handling at different stations.

[0020] 4. The present invention has a telescopic function and an adsorption function, can realize handling and adsorption at different distances, and facilitates subsequent operations.

[0021] The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly and implement it according to the content of the specification, the following further details the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0023] Figure 1 is a schematic structural diagram of the present invention;

[0024] Figure 2 is a schematic structural diagram of the handling vacuum adsorption assembly of the present invention;

[0025] Figure 3 is a schematic internal structural diagram of the handling telescopic material taking assembly of the present invention;

[0026] Figure 4 is a schematic structural diagram of the handling telescopic material taking assembly of the present invention;

[0027] Figure 5 is a schematic structural diagram of the wafer rotation assembly of the present invention;

[0028] Figure 6 is a schematic structural diagram of the wafer lifting assembly of the present invention. Detailed Embodiments

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0031] As Figures 1 to 6 shown, a lifting and rotating arm wafer handling device includes a wafer fixing plate, a wafer lifting assembly 5 is connected to the wafer fixing plate, a wafer rotation assembly 4 is connected to the wafer lifting assembly 5, a handling telescopic material taking assembly 3 is connected to the wafer rotation assembly 4, a support plate 2 is connected to the handling telescopic material taking assembly 3, and a handling vacuum adsorption assembly 1 is connected to the support plate 2.

[0032] Further, for the rotation of the handling vacuum adsorption assembly 1, the wafer rotation assembly 4 includes a wafer rotation backplane 401. A pedestal bearing 402 is connected to the wafer rotation backplane 401. A rotating shaft 403 is connected to the pedestal bearing 402 through a bearing. An inductor piece 404 that rotates synchronously with the rotating shaft 403 is connected to the rotating shaft 403. A sensor sheet metal 405 is connected to the wafer rotation backplane 401. An inductor 406 that is inductively matched with the inductor piece 404 is connected to the sensor sheet metal 405. A motor fixing plate 407 is connected to the wafer rotation backplane 401. A motor 408 is connected to the motor fixing plate 407. The rotating shaft of the motor 408 is connected to a first synchronous pulley 409. A bearing fixing seat 410 is connected to the wafer rotation backplane 401. A rotating shaft 411 is connected between the bearing fixing seats 410 through a bearing. A second synchronous pulley 412 opposite to the first synchronous pulley 409 is connected to the lower end of the rotating shaft 411. A first synchronous belt 413 is connected between the second synchronous pulley 412 and the first synchronous pulley 409. A third synchronous pulley 414 synchronous with the second synchronous pulley 412 is connected above the rotating shaft 411. A fourth synchronous pulley 415 opposite to the third synchronous pulley 414 is connected to the rotating shaft 403. A second synchronous belt 416 is connected between the fourth synchronous pulley 415 and the third synchronous pulley 414.

[0033] There are two inductor pieces 404, and they are arranged in a vertically offset manner, with an offset angle of 180°. There are two inductors 406, which are arranged vertically, and each inductor piece 404 is arranged in one-to-one correspondence with each inductor 406. The positions of the above two inductor pieces can be adjusted to adapt to different angle ranges. In the present invention, a range of 0° to 180° is adopted, that is, the angle required for each of them to contact the corresponding inductor is 180°. This improves the rotation range, enabling it to operate within a larger range.

[0034] Still further, for the adsorption structure of the product, the handling vacuum adsorption assembly 1 includes an arm bracket 105. An air circuit board 104 is connected above the arm bracket 105. The air circuit board 104 is connected to the handling telescopic material taking assembly 3 through a connecting block. Arm plates 102 are connected to the left and right sides of the arm bracket 105 through sliding plates 103. A pressing plate 101 is connected above the arm plates 102. A vacuum joint 107 is connected to the pressing plate 101. A vacuum chuck 106 for adsorbing the wafer is connected to the vacuum joint 107.

[0035] Furthermore, it is possible to achieve the telescopic movement of the product back and forth. The handling telescopic material taking assembly 3 includes a telescopic bracket 303. One side of the telescopic bracket 303 is connected with a telescopic guide rail 309. A slider 308 is connected to the telescopic guide rail 309. A sliding arm 301 is connected to the slider 308. On the front side and the rear side of the other side of the telescopic bracket 303, a front cylinder bracket 304 and a rear cylinder bracket 305 are respectively connected. A telescopic cylinder 307 is connected between the front cylinder bracket 304 and the rear cylinder bracket 305. The drive shaft of the telescopic cylinder 307 passes through the front cylinder bracket 304 and is connected to one end of a connecting bracket 306. The other end of the connecting bracket 306 is connected to the sliding arm 301.

[0036] Among them, an extended connection section connected to the wafer rotation assembly 4 is connected to the telescopic bracket 303. The telescopic bracket 303 and the extended connection section are of an integrally formed structure, and they are in a similar L-shaped structure. The angle between them is greater than 90°, about 100°. At the same time, connection holes are provided on the extended connection section. Through the connection with the rotating shaft on the connection holes, the handling telescopic material taking assembly can rotate synchronously with the wafer rotation assembly.

[0037] A telescopic guard plate 302 is connected to the outside of the telescopic bracket 303.

[0038] The present invention can achieve the work of lifting the product. The wafer lifting assembly 5 includes a wafer adjustment plate 513. A vertical lifting back plate 511 is connected to the wafer adjustment plate 513. One side of the lifting back plate 511 is connected with a lifting guide rail 508. A slider fixing block 505 is slidably connected to the lifting guide rail 508. A first buffer fixing plate 503 is connected to the top end of the slider fixing block 505. A cylinder mounting sheet metal 507 is connected to the other side of the lifting back plate 511. A lifting cylinder 506 is connected to the cylinder mounting sheet metal 507. The drive shaft of the lifting cylinder 506 is connected to the first buffer fixing plate 503 through a floating joint 504. A buffer 501 that is in buffer contact with the top of the lifting back plate 511 is connected to the first buffer fixing plate 503.

[0039] A buffer bracket is connected to the back surface of the lifting back plate 511. A second buffer fixing plate 502 is connected to the buffer bracket. A buffer 501 for sliding contact with the slider fixing block 505 is connected to the second buffer fixing plate 502, which can slow down the impact force brought by rising or falling, so that the product can be more stable during operation.

[0040] Furthermore, adjustment fixing seats 509 are connected around the wafer adjustment plate 513. Adjusting bolts 510 for adjusting the wafer adjustment plate 513 are connected to the adjustment fixing seats 509, and fine adjustment of the adjustment fixing seats can be achieved to realize more precise installation.

[0041] A support sheet metal 512 is connected to the side of the wafer adjustment plate 513 described in the present invention.

[0042] The working principle of the present invention is as follows:

[0043] When wafer lifting and handling are required, the lifting cylinder in the wafer lifting assembly extends, driving the first buffer fixing plate to extend, and then driving the slider fixing block to extend. The wafer rotation backplane in the wafer rotation assembly on the slider fixing block also extends, thereby driving the entire wafer rotation assembly to move upward. After reaching the position, the lifting cylinder in the wafer lifting assembly retracts, driving the first buffer fixing plate to retract, and then driving the slider fixing block to retract. The wafer rotation backplane in the wafer rotation assembly on the slider fixing block retracts, and drives the entire wafer rotation assembly to move downward to complete the lifting movement. At the same time, the vacuum chuck in the handling vacuum adsorption assembly adsorbs the wafer with a steel ring to complete the lifting and handling.

[0044] When wafer rotation handling is required, the motor in the wafer rotation assembly operates, driving the first synchronous pulley to rotate, and driving the rotation of the synchronous pulley driven by the first synchronous belt, and then driving the rotation of the rotating shaft. The rotation of the rotating shaft drives the third synchronous pulley to rotate, drives the fourth synchronous pulley to rotate through the second synchronous belt, and then drives the rotating shaft to rotate. The rotation will drive the bracket in the handling telescopic material taking assembly to rotate, driving the handling vacuum adsorption assembly to rotate, and completing the handling operation of the wafer with a steel ring at different angles.

[0045] When wafer handling at different distances between workstations is required, the telescopic cylinder in the handling telescopic material taking assembly extends or retracts, driving the sliding arm to extend or retract, driving the handling vacuum adsorption assembly connected to the support plate to extend or retract. At the same time, according to the need, the vacuum chuck of the handling vacuum adsorption assembly adsorbs the wafer with a steel ring to complete the handling operation of the wafer with a steel ring at different positions.

[0046] The present invention can realize wafer handling in a small space, facilitating subsequent processes. It can realize the lifting function, can perform high and low handling, and is convenient for wafer handling at different workstations. It contains a two-stage synchronous pulley structure, can rotate the swing arm, can perform handling at different angles, and is convenient for wafer handling at different workstations. It has a telescopic function and an adsorption function, can realize handling and adsorption at different distances, and is convenient for subsequent operations.

[0047] It should be noted that: Similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0048] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0049] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0050] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0051] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer handling device with a lifting and rotating arm, characterized in that: It includes a wafer fixing plate, on which a wafer lifting component (5) is connected. On the wafer lifting component (5), a wafer rotating component (4) is connected. On the wafer rotating component (4), a handling telescopic material taking component (3) is connected. On the handling telescopic material taking component (3), a support plate (2) is connected. On the support plate (2), a handling vacuum adsorption component (1) is connected. The wafer rotating component (4) includes a wafer rotating back plate (401). On the wafer rotating back plate (401), a pedestal bearing (402) is connected. On the pedestal bearing (402), a rotating shaft (403) is connected through a bearing. On the rotating shaft (403), an inductor piece (404) that rotates synchronously with it is connected. On the wafer rotating back plate (401), a sensor sheet metal (405) is connected. On the sensor sheet metal (405), an inductor (406) that is inductively matched with the inductor piece (404) is connected. On the wafer rotating back plate (401), a motor fixing plate (407) is connected. On the motor fixing plate (407), a motor (408) is connected. The rotating shaft of the motor (408) is connected to a first synchronous pulley (409). On the wafer rotating back plate (401), a bearing fixing seat (410) is connected. Between the bearing fixing seats (410), a rotating shaft (411) is connected through a bearing. The lower end of the rotating shaft (411) is connected to a second synchronous pulley (412) opposite to the first synchronous pulley (409). A first synchronous belt (413) is connected between the second synchronous pulley (412) and the first synchronous pulley (409). Above the rotating shaft (411), a third synchronous pulley (414) that is synchronous with the second synchronous pulley (412) is connected. On the rotating shaft (403), a fourth synchronous pulley (415) opposite to the third synchronous pulley (414) is connected. A second synchronous belt (416) is connected between the fourth synchronous pulley (415) and the third synchronous pulley (414).

2. The wafer handling device with a lifting and rotating arm according to claim 1, wherein: The handling vacuum adsorption component (1) includes an arm support (105). Above the arm support (105), an air circuit board (104) is connected. The air circuit board (104) is connected to the handling telescopic material taking component (3) through a connecting block. On the left and right sides of the arm support (105), arm plates (102) are connected through sliding plates (103). Above the arm plates (102), a pressing plate (101) is connected. On the pressing plate (101), a vacuum joint (107) is connected. On the vacuum joint (107), a vacuum chuck (106) for adsorbing the wafer is connected.

3. The wafer handling device with a lifting and rotating arm according to claim 1, characterized in that: The handling telescopic material taking component (3) includes a telescopic support (303). One side of the telescopic support (303) is connected with a telescopic guide rail (309). A slider (308) is connected to the telescopic guide rail (309). A sliding arm (301) is connected to the slider (308). On the front side and the rear side of the other side of the telescopic support (303), a front cylinder support (304) and a rear cylinder support (305) are respectively connected. A telescopic cylinder (307) is connected between the front cylinder support (304) and the rear cylinder support (305). The driving shaft of the telescopic cylinder (307) passes through the front cylinder support (304) and is connected to one end of a connecting bracket (306). The other end of the connecting bracket (306) is connected to the sliding arm (301).

4. The wafer handling device with a lifting and rotating arm according to claim 3, characterized in that: A telescopic guard plate (302) is connected to the outside of the telescopic support (303).

5. The lifting and rotating arm wafer handling device according to claim 4, wherein: An extended connection section connected to the wafer rotating component (4) is connected to the telescopic support (303). The telescopic support (303) and the extended connection section are of an integrally formed structure and they are in an L-shaped structure.

6. The wafer handling device with a lifting and rotating arm according to claim 1, characterized in that: There are two sensor chips (404), and they are arranged in an up-and-down offset manner, and the offset angle is 180°. There are two sensors (406), and they are arranged up and down, and each sensor chip (404) is arranged in one-to-one correspondence with each sensor (406).

7. The wafer handling device with a lifting and rotating arm according to claim 1, characterized in that: The wafer lifting component (5) includes a wafer adjustment plate (513). A vertical lifting back plate (511) is connected to the wafer adjustment plate (513). One side of the lifting back plate (511) is connected with a lifting guide rail (508). A slider fixing block (505) is slidably connected to the lifting guide rail (508). A first buffer fixing plate (503) is connected to the top end of the slider fixing block (505). A cylinder mounting sheet metal (507) is connected to the other side of the lifting back plate (511). A lifting cylinder (506) is connected to the cylinder mounting sheet metal (507). The driving shaft of the lifting cylinder (506) is connected to the first buffer fixing plate (503) through a floating joint (504). A buffer (501) that is in buffer contact with the top of the lifting back plate (511) is connected to the first buffer fixing plate (503).

8. The wafer handling device with a lifting and rotating arm according to claim 7, wherein: A buffer support is connected to the back surface of the lifting back plate (511). A second buffer fixing plate (502) is connected to the buffer support. A buffer (501) for making sliding contact with the slider fixing block (505) is connected to the second buffer fixing plate (502).

9. The wafer handling device with a lifting and rotating arm according to claim 7, characterized in that: Adjusting fixing seats (509) are connected around the wafer adjustment plate (513). Adjusting bolts (510) for adjusting the wafer adjustment plate (513) are connected to the adjusting fixing seats (509).

10. The wafer handling device with a lifting and rotating arm according to claim 7, characterized in that: A support sheet metal (512) is connected to the side of the wafer adjustment plate (513).

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