A target plate assembly for wafer processing

Abstract

The present invention discloses a target plate assembly for wafer processing, comprising a base, a rotating target plate provided above the base, a rotating shaft provided at the bottom of the rotating target plate, and a plurality of material slots for placing wafers provided on the top surface of the rotating target plate, wherein the wafers are locked by a fixing mechanism provided in the material slots. The fixing mechanism comprises an outer shell and a locking assembly provided in the outer shell; wherein the top of the outer shell is used to place the wafers, a base plate is movably provided in the outer shell, a plurality of ejection rods are provided on the base plate, a group of fixed blocks are provided in the middle position of the base plate, a guide rod is provided between the fixed blocks, a moving block is provided on the guide rod, and can be limited under the action of a second spring, the top of the moving block is connected to one end of a transmission rod, the other end of the transmission rod extends to a U-shaped opening groove and extends out, a flexible limiting block is sleeved on the other end of the transmission rod, and the bottom of the moving block extends out of the outer shell through the opening in the middle of the base plate.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to a target disk assembly for wafer processing. Background Art

[0002] Wafers, a core material in semiconductor manufacturing, are thin, circular sheets made of high-purity single-crystal silicon or other semiconductor materials. They are primarily used in the manufacture of integrated circuits, sensors, optoelectronic devices, and other semiconductor products. An ion implanter is used to implant ions into the wafer surface to alter its electrical properties. This process is typically performed in a vacuum environment. The wafer is placed on a target disk, which secures the wafer and ensures its precise position during the implantation process.

[0003] To prevent the wafer from shifting during high-speed rotation, existing target plates are typically equipped with electrostatic adsorption structures or mechanical stoppers. Mechanical stoppers, however, lack the necessary ejection mechanism by providing a fixed mechanism, making it difficult to remove the wafer from the processing station after processing.

[0004] Therefore, it is necessary for us to improve such a structure to overcome the above-mentioned defects. Summary of the Invention

[0005] The purpose of the present invention is to provide a target disk assembly for wafer processing to solve the problems existing in the prior art.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] A target plate assembly for wafer processing includes a base, a rotating target plate is provided above the base, a rotating shaft is provided at the bottom of the rotating target plate, and a plurality of material slots for placing wafers are provided on the top surface of the rotating target plate. The wafers are locked by fixing mechanisms arranged in the material slots.

[0008] Furthermore, the fixing mechanism includes an outer shell and a locking assembly disposed in the outer shell;

[0009] The outer shell is installed in the material slot of the rotating target disk by a stepped structure arranged along the outer edge of the top. The top surface of the outer shell is used to place wafers. A plurality of ejection holes are opened on the top surface. A limiting baffle is provided at a part of the edge of the top surface. A U-shaped opening groove is opened on the top surface opposite to the limiting baffle.

[0010] Furthermore, the locking assembly includes a base plate movably arranged in the outer shell, a plurality of ejection rods corresponding to the positions of the ejection holes are provided on the base plate, a first spring is sleeved on the ejection rod, a group of fixed blocks are provided in the middle position of the base plate, a guide rod is provided between the fixed blocks, the movable block is provided on the guide rod and can be limited under the action of the second spring, the top of the movable block is connected to one end of the transmission rod, the other end of the transmission rod extends to the U-shaped opening groove and extends out, a flexible limit block is sleeved on the other end of the transmission rod, and the bottom of the movable block extends out of the outer shell from the opening in the middle of the base plate.

[0011] A method for locking and unlocking a target disk assembly for wafer processing comprises the following steps:

[0012] S1. When the wafer needs to be processed, by pushing the bottom of the moving block, the moving block overcomes the spring force of the second spring and moves along the guide rod. The transmission rod and the flexible limit block connected to the moving block will move synchronously.

[0013] S2. At this point, the flexible stopper moves away from the U-shaped opening. After placing the wafer on the top surface of the outer shell, the force applied to the bottom of the movable block is removed. The movable block, transmission rod, and flexible stopper return to their original positions under the action of the second spring. The wafer is locked by the flexible stopper and the stopper plate, allowing wafer processing.

[0014] S3. After wafer processing is complete, repeat step S1 to release the wafer lock from the fixing mechanism. Then, push the base plate upward. The ejector pins on the base plate extend out of the corresponding ejector holes, moving the processed wafer away from the top surface of the outer shell in the height direction, thereby facilitating wafer removal.

[0015] S4. After the processed wafer is removed, the upward force on the substrate is removed and the substrate returns to its original position.

[0016] In summary, the present invention has the following beneficial effects:

[0017] By setting a laterally movable moving block inside the outer shell for placing the wafer, the bottom of the moving block extends out of the outer shell, so that the moving block, transmission rod and flexible limit block can be pushed from the bottom of the outer shell to move, thereby achieving locking and unlocking of the wafer.

[0018] At the same time, a base plate and an ejector rod that can move in the height direction are provided inside the outer shell. After the wafer processing is completed, the wafer can be lifted by pushing the base plate and the ejector rod upwards, thereby facilitating the removal of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the target plate assembly of the present invention.

[0020] Figure 2 It is a schematic diagram of the fixing mechanism of the present invention.

[0021] Figure 3 Schematic diagram of the locking assembly of the present invention.

[0022] Figure 4 It is a bottom schematic diagram of the fixing mechanism of the present invention. DETAILED DESCRIPTION

[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below with reference to diagrams and specific embodiments.

[0024] like Figures 1 to 4 As shown, the present invention proposes a target plate assembly for wafer processing, including a base 11, a rotating target plate 12 is provided above the base 11, a rotating shaft 13 is provided at the bottom of the rotating target plate 12, and a plurality of material slots 14 for placing wafers 4 are provided on the top surface of the rotating target plate 12. The wafers 4 are locked by a fixing mechanism 5 arranged in the material slots 14.

[0025] The fixing mechanism 5 includes an outer shell 51 and a locking assembly 52 disposed in the outer shell 51;

[0026] The outer shell 51 is limitedly installed in the material slot 14 of the rotating target plate 12 by a stepped structure 511 set along the outer edge of the top. The top surface 512 of the outer shell 51 is used to place the wafer 4. A plurality of ejection holes 513 are opened on the top surface 512. A limiting baffle 514 is provided at a part of the edge of the top surface 512. A U-shaped opening groove 515 is opened on the top surface 512 on the opposite side of the limiting baffle 514.

[0027] The locking assembly 52 includes a base plate 521 movably arranged in the outer shell 51, and a plurality of ejection rods 522 corresponding to the positions of the ejection holes 513 are provided on the base plate 521. A first spring 523 is sleeved on the ejection rod 522, and a group of fixed blocks 524 are provided in the middle position of the base plate 521. Guide rods 525 are provided between the fixed blocks 524. A moving block 526 is provided on the guide rod 525 and can be limited by the action of a second spring 529. The top of the moving block 526 is connected to one end of the transmission rod 527, and the other end of the transmission rod 527 extends to the U-shaped opening groove 515 and extends out. A flexible limiting block 528 is sleeved on the other end of the transmission rod 527, and the bottom of the moving block 526 extends out of the outer shell 51 through the opening in the middle of the base plate 521.

[0028] A method for locking and unlocking a target disk assembly for wafer processing comprises the following steps:

[0029] S1. When wafer 4 needs to be processed, by pushing the bottom of the moving block 526, the moving block 526 overcomes the spring force of the second spring 529 and moves along the guide rod 525. The transmission rod 527 and the flexible stop block 528 connected to the moving block 526 will move synchronously;

[0030] S2. At this point, the flexible stopper 528 moves away from the U-shaped opening 515. After the wafer 4 is placed on the top surface 512 of the outer shell 51, the pushing force on the bottom of the movable block 526 is removed. The movable block 526, the transmission rod 527, and the flexible stopper 528 return to their original positions under the action of the second spring 529. The wafer 4 is locked by the flexible stopper 528 and the limit baffle 514, so that the wafer 4 can be processed.

[0031] S3. After wafer 4 is processed, step S1 is repeated to release the lock on wafer 4 by fixing mechanism 5. Then, base plate 521 is pushed upward. Ejector rods 522 provided on base plate 521 extend out of corresponding ejector holes 513, so that the processed wafer 4 is vertically away from the top surface 512 of outer shell 51, thereby facilitating the removal of wafer 4.

[0032] S4. After the processed wafer 4 is removed, the upward push on the substrate 521 is removed, and the substrate 521 returns to its original position.

[0033] In this document, the directions or positional relationships indicated by terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "vertical", and "horizontal" are based on the directions or positional relationships shown in the accompanying drawings and are only for the clarity of the technical solution and the convenience of description, and therefore should not be understood as limiting the present invention.

[0034] As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion of elements other than the listed elements and may also include additional elements not specifically listed.

[0035] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A target plate assembly for wafer processing, characterized in that: The invention comprises a base (11), a rotating target disk (12) is provided above the base (11), a rotating shaft (13) is provided at the bottom of the rotating target disk (12), and a plurality of material slots (14) for placing wafers (4) are provided on the top surface of the rotating target disk (12), and the wafers (4) are locked by a fixing mechanism (5) provided in the material slots (14); The fixing mechanism (5) comprises an outer shell (51) and a locking assembly (52) arranged in the outer shell (51); The outer shell (51) is installed in the material slot (14) of the rotating target disk (12) by means of a stepped structure (511) arranged along the outer edge of the top, the top surface (512) of the outer shell (51) is used to place the wafer (4), a plurality of ejection holes (513) are provided on the top surface (512), a limiting baffle (514) is provided at a portion of the edge of the top surface (512), and a U-shaped opening groove (515) is provided on the top surface (512) on the opposite side of the limiting baffle (514); The locking assembly (52) includes a base plate (521) movably arranged in the outer shell (51); a plurality of ejection rods (522) corresponding to the positions of the ejection holes (513) are provided on the base plate (521); a first spring (523) is sleeved on the ejection rods (522); a group of fixed blocks (524) are provided in the middle position of the base plate (521); a guide rod (525) is provided between the fixed blocks (524); a moving block (526) is provided on the guide rod (525) and can be limited under the action of a second spring (529); the top of the moving block (526) is connected to one end of a transmission rod (527); the other end of the transmission rod (527) extends to the U-shaped opening groove (515) and extends out; a flexible limiting block (528) is sleeved on the other end of the transmission rod (527); the bottom of the moving block (526) extends out of the outer shell (51) through the opening in the middle of the base plate (521).

2. The target plate assembly for wafer processing according to claim 1, wherein: The working process of the target disc assembly is as follows: S1. When the wafer (4) needs to be processed, the bottom of the moving block (526) is pushed, so that the moving block (526) overcomes the spring force of the second spring (529) and moves along the guide rod (525), and the transmission rod (527) and the flexible limit block (528) connected to the moving block (526) move synchronously; S2. At this time, the flexible limit block (528) will be away from the U-shaped opening groove (515). After the wafer (4) is placed on the top surface (512) of the outer shell (51), the driving force on the bottom of the moving block (526) is removed. The moving block (526), ​​the transmission rod (527) and the flexible limit block (528) will return to their original positions under the action of the second spring (529). The wafer (4) is locked under the action of the flexible limit block (528) and the limit baffle (514), so that the wafer (4) can be processed; S3. After the wafer (4) is processed, the fixing mechanism (5) is released from locking the wafer (4) by repeating step S1, and then the base plate (521) is pushed upward, and the ejection rod (522) provided on the base plate (521) extends out of the corresponding ejection hole (513), so that the processed wafer (4) is away from the top surface (512) of the outer shell (51) in the height direction, thereby facilitating the clamping of the wafer (4); S4. After the processed wafer (4) is removed, the upward push force on the substrate (521) is removed, and the substrate (521) returns to its original position.

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