A large-size chip demolding ejector pin mechanism

Abstract

The application relates to the technical field of semiconductor mounting equipment, and particularly discloses a large-size chip demolding needle mechanism, which comprises a needle stripping module and a Z-direction motion module. The needle stripping module comprises a needle assembly and an adsorption assembly, the adsorption assembly is slidably connected in the needle assembly, the needle assembly comprises a plurality of needles, the adsorption assembly comprises a plurality of adsorption heads, the plurality of needles and the plurality of adsorption heads are staggered, and a fixing part is arranged on the top of the needle assembly and surrounds the adsorption assembly. The Z-direction motion module comprises a local motion module and a whole motion module, the local motion module is connected to the output end of the whole motion module, the needle assembly is fixedly connected to the local motion module, and the adsorption assembly is connected to the output end of the local motion module. The technical scheme can solve the technical problem that the existing technology is prone to causing chip cracking and other hidden troubles during the stripping process of large-size chips, and affecting the product qualification rate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor mounting equipment, in particular to a large-size chip demolding needle mechanism. BACKGROUND

[0002] The field of high-precision equipment manufacturing dedicated to semiconductor devices mainly involves semiconductor mounting equipment, semiconductor packaging equipment, etc. At present, chip peeling is one of the important process steps included in most semiconductor packaging equipment, and the peeling action of the chip is usually completed by a needle mechanism. The existing chip peeling needle mechanism mainly consists of a needle base movement module and a needle peeling module. The needle base movement module has X-axis, Y-axis and Z-axis movements, which can drive the needle peeling module to move along the X-axis and Y-axis under the wafer carrier, so that the needle peeling module can move under each chip, and then drive the needle peeling module to move along the Z-axis, so that the needle of the needle peeling module can lift the chip upwards to separate the chip from the blue film on the wafer carrier, thereby completing the chip peeling process and facilitating the chip to be sucked and moved by a pickup head.

[0003] The contact force between the needle of the needle peeling module and the chip, and the stress deformation of the chip under the contact force, directly determine whether the chip will crack, crack, perforate, or fail to be lifted out during the peeling process, which is crucial to whether the chip can be successfully peeled. In particular, as the thickness of the chip decreases and the packaging speed increases, the chip peeling process under the action of the needle is one of the main causes of chip cracking, directly affecting the yield of the product.

[0004] The existing needle peeling module adopts a single needle structure, which is suitable for demolding operation of small-size chips with a certain thickness, such as 0.5x0.5mm, 1x1mm, 2x2mm, etc. When used for demolding of large-size chips of 10x10mm to 50x50mm, the thickness of the large-size chip is often very small (less than or equal to 70μm), and the contact area between the single needle of the needle peeling module and the large-size chip is too small, which will cause stress concentration of the large-size chip, making the large-size chip prone to cracking, cracking, perforation, and failure to be lifted out during the peeling process, thereby reducing the yield of the product, and the large chip consumption in the peeling process will increase the cost and affect the overall work efficiency of the semiconductor packaging equipment.

[0005] Therefore, there is an urgent need for a large-size chip demolding needle mechanism to complete the peeling process of large-size chips to reduce the cracking, cracking, perforation, and failure to be lifted out of the chip during the peeling process, and to improve the yield of the product. SUMMARY

[0006] The present application intends to provide a large-size chip demolding ejector pin mechanism to solve the technical problem that the existing technology for large-size chip peeling process is prone to cause chip cracking and other hidden troubles, affecting product qualification rate.

[0007] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0008] A large-size chip demolding ejector pin mechanism, comprising an ejector pin peeling module and a Z-direction motion module, the ejector pin peeling module comprising an ejector pin assembly and a suction assembly, the suction assembly being slidingly inserted into the ejector pin assembly, the ejector pin assembly comprising a plurality of ejector pins, the suction assembly comprising a plurality of suction heads, the plurality of ejector pins and the plurality of suction heads being staggered, and a fixing portion being provided at the top of the ejector pin assembly around the suction assembly; the Z-direction motion module comprising a local motion module and an overall motion module, the local motion module being connected to the output end of the overall motion module, the ejector pin assembly being fixedly connected to the local motion module, and the suction assembly being connected to the output end of the local motion module.

[0009] The overall motion module drives the ejector pin peeling module to move upward, so that the ejector pins contact the blue film at the corresponding position of the chip, the fixing portion is used to fix the blue film around the chip, and the suction heads are used to adsorb the blue film at the corresponding position of the chip; the local motion module first drives the suction assembly to move upward by a small distance and then resets, so as to realize the pre-loosening of the chip and the blue film, and then drives the suction assembly to move downward by a small distance, so as to realize the peeling of the chip and the blue film.

[0010] The principle and advantages of the present application are as follows:

[0011] 1. In the present application, the ejector pin assembly is provided with a plurality of ejector pins. When the ejector pin peeling module performs demolding operation on a large-size chip with small thickness (less than or equal to 70 μm), compared with the single ejector pin structure of the prior art, the multi-ejector pin structure of the present application can effectively increase the contact area between the ejector pins and the large-size chip, avoid stress concentration of the large-size chip during demolding, reduce the stress deformation of the large-size chip under the action of contact force, thereby reducing or even avoiding the hidden troubles such as cracking, hidden cracking, perforation and inability to eject of the large-size chip during demolding, which is conducive to improving the qualification rate of the product, reducing the consumption of chips in the peeling process to reduce the cost, and improving the overall working efficiency of the semiconductor packaging equipment.

[0012] 2、The scheme is fixed through the fixed part arranged on the top of the ejector assembly before the formal demolding operation, and the blue film around the chip is fixed, and the blue film corresponding to the position of the chip is adsorbed and fixed through the adsorption assembly, and then the adsorption assembly is driven to move upward by a small distance through the local motion module, so as to drive the chip to move upward by a small distance, at this time, the blue film corresponding to the position of the chip is stretched and appears jagged wrinkle, so that the contact area between the chip and the blue film is reduced, the connection tightness between the two is reduced, the formal demolding operation is facilitated, and the demolding effect and efficiency of the chip are improved.

[0013] 3、The scheme is fixed through the fixed part arranged on the top of the ejector assembly before the formal demolding operation, and the blue film around the chip is fixed, and the blue film corresponding to the position of the chip is adsorbed and fixed through the adsorption assembly, and then the adsorption assembly is driven to move upward by a small distance through the local motion module, so as to drive the chip to move upward by a small distance, at this time, the blue film corresponding to the position of the chip is stretched and appears jagged wrinkle, so that the contact area between the chip and the blue film is reduced, the connection tightness between the two is reduced, the formal demolding operation is facilitated, and the demolding effect and efficiency of the chip are improved.

[0014] 4、The scheme is fixed through the fixed part arranged on the top of the ejector assembly before the formal demolding operation, and the blue film around the chip is fixed, and the blue film corresponding to the position of the chip is adsorbed and fixed through the adsorption assembly, and then the adsorption assembly is driven to move upward by a small distance through the local motion module, so as to drive the chip to move upward by a small distance, at this time, the blue film corresponding to the position of the chip is stretched and appears jagged wrinkle, so that the contact area between the chip and the blue film is reduced, the connection tightness between the two is reduced, the formal demolding operation is facilitated, and the demolding effect and efficiency of the chip are improved.

[0015] Preferably, as an improvement, the ejector assembly further comprises a ejector cap and a ejector body connected in sequence from top to bottom, a chip slot is formed in the top of the ejector cap, a plurality of ejectors are arranged at the bottom of the chip slot, a vacuum cavity is formed in the inside of the ejector cap, a vacuum hole is formed in the ejector body, one end of the vacuum hole is in communication with the vacuum cavity, and the other end is in communication with an external vacuum generator; the fixed part comprises a plurality of fixed holes arranged on the top of the ejector cap around the adsorption assembly, and the fixed holes are in communication with the vacuum cavity.

[0016] Beneficial effects: the chip slot is arranged on the top of the ejector cap, when the whole motion module drives the ejector pin stripping module to move upward to the preset position, the chip to be stripped enters the chip slot, which can realize the mutual positioning of the chip and the ejector pin stripping module, ensure the accuracy of the subsequent stripping action, and limit the chip through the chip slot, and improve the position stability of the chip in the subsequent stripping process.

[0017] The scheme forms a vacuum cavity in the ejector cap by connecting an external vacuum generator, and a plurality of fixed holes as fixing parts are arranged on the top of the ejector cap around the adsorption assembly (i.e. around the chip slot) and communicated with the vacuum cavity, the blue film around the chip is adsorbed and fixed through the negative pressure in the fixed holes, and the structure is simple, which is beneficial to simplify the structure of the ejector pin assembly.

[0018] Preferably, as an improvement, the ejector pin assembly further comprises an ejector pin base detachably connected in the ejector cap, a plurality of ejector pins are fixedly connected on the top of the ejector pin base, and an ejector pin hole is arranged on the bottom of the chip slot corresponding to the position of the ejector pin.

[0019] Beneficial effects: the ejector pin base is additionally arranged in the ejector cap for mounting the ejector pin, the detachable connection of the ejector pin and the ejector cap can be realized, the ejector pin can be conveniently replaced alone when the ejector pin is worn or damaged in a long time use, the chip stripping effect is ensured, the service life of the whole stripping ejector pin mechanism is prolonged, and the cost can be reduced compared with the whole replacement of the ejector pin stripping mechanism.

[0020] Preferably, as an improvement, the adsorption assembly further comprises an adsorption base and a lifting rod connected in sequence from top to bottom, a plurality of adsorption heads are fixedly connected on the top of the adsorption base, a motion hole is arranged on the bottom of the chip slot corresponding to the position of the adsorption head, a give-way hole is arranged on the adsorption base corresponding to the position of the adsorption head, and the adsorption head is slidingly connected in the motion hole and the give-way hole; an adsorption hole is arranged on the top of the adsorption head, an adsorption channel is arranged in the adsorption base, and the adsorption channel is communicated between the adsorption hole and the vacuum cavity; the lifting rod is slidingly inserted in the ejector pin body, and a first reset member is connected between the lifting rod and the ejector pin body.

[0021] Beneficial effects: the adsorption heads are connected on the top of the lifting rod through the adsorption base, the local motion module drives the adsorption heads to move up and down through the lifting rod to realize the pre-loosening of the chip and the blue film and the stripping of the chip, and the structure is simple and reliable. The adsorption heads slide up and down in the motion hole of the chip slot and the give-way hole of the adsorption base, which can guide the movement of the adsorption heads. The adsorption hole arranged on the top of the adsorption head is communicated with the vacuum cavity through the adsorption channel arranged in the adsorption base, so that the negative pressure can be formed in the adsorption hole, thereby effectively realizing the adsorption and fixation of the blue film at the corresponding position of the chip, ensuring that the blue film at the corresponding position of the chip moves up and down with the adsorption head, and effectively realizing the pre-loosening of the chip and the blue film and the stripping of the chip.

[0022] The jacking rod is slidably inserted in the ejector body, when the local motion module drives the jacking rod to move up and down to drive the adsorption head to move up and down, the ejector body can guide the movement of the jacking rod, ensure that the jacking rod moves along the set direction, thereby ensuring the pre-loosening effect of the chip and the blue film and the film peeling effect of the chip. The first reset member is connected between the jacking rod and the ejector body, after the local motion module drives the adsorption head to move up a small distance through the jacking rod to achieve the pre-loosening of the chip and the blue film, the jacking rod can drive the adsorption head to reset under the action of the first reset member, thereby preparing for the subsequent formal film peeling action and ensuring the smooth progress of the subsequent formal film peeling action.

[0023] Preferably, as an improvement, a connecting member is arranged between the ejector assembly and the local motion module, and the ejector assembly and the local motion module are detachably connected through the connecting member.

[0024] Beneficial effects: the detachable connection of the ejector assembly and the local motion module is realized through the connecting member, when the ejector assembly is damaged during long-term use, the ejector assembly can be conveniently replaced alone, thereby ensuring the film peeling effect of the chip and prolonging the service life of the entire ejector peeling module, which can also reduce the cost compared to replacing the entire ejector peeling module. In addition, when the adsorption assembly slidably connected in the ejector assembly fails or is damaged during long-term use, the body assembly can be detached, thereby facilitating the repair or replacement operation of the adsorption assembly.

[0025] Preferably, as an improvement, the connecting member includes an upper connecting plate fixedly connected to the bottom of the ejector body and a lower connecting plate fixedly connected to the top of the local motion module, the upper connecting plate and the lower connecting plate oppositely arranged with a plurality of magnets, and the opposite sides of the magnets of the upper connecting plate and the lower connecting plate oppositely arranged with a plurality of magnets, and the opposite sides of the magnets of the upper connecting plate and the lower connecting plate oppositely arranged with a plurality of magnets; the bottom of the upper connecting plate is provided with a plurality of positioning pins, and the top of the lower connecting plate is provided with a plurality of positioning holes corresponding to the positions of the positioning pins.

[0026] Beneficial effects: the detachable connection of the upper connecting plate and the lower connecting plate is realized through the opposite poles attracting each other between the magnets of the upper connecting plate and the magnets of the lower connecting plate, thereby realizing the detachable connection of the ejector assembly and the local motion module, which is simple in structure, reliable in connection and convenient to install. In addition, the positioning pins are arranged at the bottom of the upper connecting plate, and the positioning holes are arranged at the corresponding positions of the lower connecting plate, and the positioning pins are inserted into the positioning holes, thereby realizing the rapid positioning of the upper connecting plate and the lower connecting plate, and further improving the connection convenience of the ejector assembly and the local motion module.

[0027] Preferably, as an improvement, the local motion module comprises a motor fixing plate and a local motor fixedly connected to the motor fixing plate, a driving cam is fixedly connected to an output shaft of the local motor; a Z-direction motion plate is vertically and slidingly connected to the motor fixing plate, a second reset member is connected between the motor fixing plate and the Z-direction motion plate; a cam follower is arranged on the Z-direction motion plate, the driving cam is tangent to the cam follower so that the Z-direction motion plate can move up and down, and the Z-direction motion plate is fixedly connected to the jacking rod.

[0028] Beneficial effects: the scheme drives the driving gear to rotate through the local motor, drives the cam follower tangent to the driving cam to move up and down, thereby driving the adsorption head to move up and down through the Z-direction motion plate and the jacking rod, realizing the pre-loosening of the chip and the blue film and the demolding of the chip, and the structure is simple and reliable. The second reset member is connected between the motor fixing plate and the Z-direction motion plate, after the driving cam drives the adsorption head to move upward by a small distance to realize the pre-loosening of the chip and the blue film, the Z-direction motion plate gradually moves downward and resets under the action of the second reset member, thereby driving the cam follower to move downward and reset, maintaining the tangency of the cam follower to the driving cam, and preparing for the subsequent driving cam to drive the adsorption head to move downward to realize the demolding of the chip.

[0029] Preferably, as an improvement, a first photoelectric sensor is arranged on the motor fixing plate, a first sensor sheet metal is arranged on the Z-direction motion plate corresponding to the first photoelectric sensor, the first photoelectric sensor cooperates with the first sensor sheet metal to realize the zero return of the Z-direction motion plate.

[0030] Beneficial effects: the scheme arranges the first photoelectric sensor on the motor fixing plate as a fixing member and arranges the first sensor sheet metal on the Z-direction motion plate as a moving member, after the demolding action of one chip is completed, the first photoelectric sensor cooperates with the first sensor sheet metal to realize the zero return of the Z-direction motion plate as a moving member, and prepares for the demolding action of the next chip, thereby ensuring the reliability and accuracy of the subsequent demolding action.

[0031] Preferably, as an improvement, the overall motion module comprises a motor mounting plate and an overall motor fixedly connected to the motor mounting plate, a worm is fixedly connected to an output shaft of the overall motor; a ball screw is arranged on the motor mounting plate, a turbine is fixedly connected to a screw rod of the ball screw, the turbine is engaged with the worm, and a manual adjusting nut is fixedly connected to the top of the turbine; a screw nut of the ball screw is fixedly connected to the motor fixing plate, and the motor fixing plate is slidingly connected to the motor mounting plate.

[0032] Beneficial Effects: This solution uses an integral motor to drive the worm, which rotates the ball screw through the turbine, causing the ball screw nut to move up and down. This, in turn, drives the local motion module and the ejector stripping module up and down through the motor fixing plate. This allows the ejector stripping module to move upward to prepare for chip demolding, and the ejector stripping module to move downward to avoid X and Y movement of the wafer carrier. Furthermore, this solution incorporates a manually adjustable nut at the top of the turbine, which can be used to manually drive the ball screw to rotate, thereby manually driving the ejector stripping module up and down to accommodate different working conditions.

[0033] Preferably, as an improvement, a second photoelectric sensor is provided on the motor mounting plate, and a second sensor sheet metal is provided on the motor fixing plate corresponding to the second photoelectric sensor. The second photoelectric sensor cooperates with the second sensor sheet metal to realize zero return of the motor fixing plate.

[0034] Beneficial effect: This solution sets a second photoelectric sensor on the motor mounting plate serving as a fixed part, and sets a second sensor sheet metal on the motor fixing plate serving as a moving part. When the demolding action of a chip is completed, the motor fixing plate serving as a moving part is returned to zero through the cooperation of the second photoelectric sensor and the second sensor sheet metal, which can prepare for the demolding action of the next chip and ensure the reliability and accuracy of subsequent demolding actions. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the present invention.

[0036] Figure 2 This is a structural diagram of the ejector stripping module in Example 1 of the present invention.

[0037] Figure 3 for Figure 2 Top view of .

[0038] Figure 4 for Figure 2 Exploded diagram.

[0039] Figure 5 for Figure 4 Schematic diagram of the structure of the adsorption head and adsorption seat.

[0040] Figure 6 for Figure 4 Bottom view of the middle upper connecting plate.

[0041] Figure 7 This is a schematic structural diagram of the Z-axis motion module in Example 1 of the present invention.

[0042] Figure 8 for Figure 7 Exploded diagram of the local motion module.

[0043] Figure 9 for Figure 7 Schematic diagram of the structure of the overall motion module. DETAILED DESCRIPTION

[0044] The following is further described in detail through specific implementation methods:

[0045] The reference numerals in the drawings of the specification include: ejector stripping module 100, locking cover 101, ejector cap 102, adsorption head 103, coupling 104, ejector body 105, ball spline 106, upper connecting plate 107, ejector 108, chip slot 109, fixing hole 110, adsorption seat 111, lifting rod 112, adsorption hole 113, adsorption channel 114, upper magnet 115, positioning pin 116, local motion module 200, local motor 2 01, lower connecting plate 202, motor fixing plate 203, drive cam 204, Z-axis motion plate 205, cross guide rail 206, lower magnet 207, cam follower 208, connecting shaft 209, positioning hole 210, overall motion module 300, overall motor 301, guide rail mounting plate 302, motor mounting plate 303, linear guide rail 304, turbine 305, worm 306, manual adjustment nut 307, bearing seat 308, ball screw 309.

[0046] Example 1

[0047] A large-size chip demoulding ejector pin mechanism, as shown in the attached Figure 1 As shown, it includes a pin stripping module 100 and a Z-direction motion module. The pin stripping module 100 includes a pin assembly and an adsorption assembly, and the adsorption assembly is slidably inserted into the pin assembly; the Z-direction motion module includes a local motion module 200 and an overall motion module 300. The local motion module 200 is connected to the output end of the overall motion module 300, the pin assembly is fixedly connected to the local motion module 200, and the adsorption assembly is connected to the output end of the local motion module 200.

[0048] The overall motion module 300 drives the local motion module 200 to move upward, thereby driving the ejector stripping module 100 to move upward to contact the blue film; the ejector assembly contacts the blue film at the corresponding position of the chip and fixes the blue film around the chip, and the adsorption assembly adsorbs the blue film at the corresponding position of the chip; the local motion module 200 first drives the adsorption assembly to move upward a short distance and then resets to achieve pre-loosening of the chip and the blue film, and then drives the adsorption assembly to move downward a short distance to achieve stripping of the chip and the blue film.

[0049] Combined with attachment Figure 2 and Figure 3As shown, the ejector assembly comprises an ejector cap 102 and an ejector body 105 connected in sequence from top to bottom, and a locking cover plate 101 is sleeved at the connection of the ejector cap 102 and the ejector body 105, which can increase the sealing property of the connection of the ejector cap 102 and the ejector body 105. A chip slot 109 is formed at the top center of the ejector cap 102, and the size of the chip slot 109 matches the size of the chip to be unmolded, so that the chip to be unmolded enters the chip slot 109. A plurality of ejector pins 108 are fixedly connected at the bottom of the chip slot 109 in a vertical manner, and the plurality of ejector pins 108 are arranged in a rectangular array at the bottom of the chip slot 109. A vacuum cavity is formed in the interior of the ejector cap 102, a vacuum hole (not shown in the figure) is formed in the ejector body 105 in an axial direction, the upper end of the vacuum hole penetrates through the top of the ejector body 105 and communicates with the vacuum cavity, and the lower end of the vacuum hole penetrates through the bottom of the ejector body 105. A plurality of fixing holes 110 are formed at the top of the ejector cap 102, the plurality of fixing holes 110 are arranged around the chip slot 109, and the plurality of fixing holes 110 all penetrate through the ejector cap 102 and communicate with the vacuum cavity.

[0050] In combination with the accompanying drawings Figure 4 and Figure 5 As shown, the adsorption assembly comprises an adsorption seat 111 and a jacking rod 112 connected in sequence from top to bottom, and specifically, the bottom of the adsorption seat 111 and the top of the jacking rod 112 are connected through a shaft coupling 104. A plurality of adsorption heads 103 are fixedly connected at the top of the adsorption seat 111, and the plurality of adsorption heads 103 and the plurality of ejector pins 108 are arranged alternately. As shown in the accompanying drawings Figure 3 In this embodiment, the horizontal projection of the adsorption head 103 is a rectangle, and the adsorption head 103 is located between the two adjacent rows of ejector pins 108. A movement hole is formed at the position corresponding to the adsorption head 103 in the chip slot 109, the adsorption head 103 is slidingly connected in the movement hole, and the adsorption head 103 can extend into the chip slot 109 through the movement hole. A plurality of adsorption holes 113 are formed at the top of the adsorption head 103, an adsorption channel 114 is formed in the adsorption seat 111, and the adsorption channel 114 communicates between the plurality of adsorption holes 113 and the vacuum cavity. The jacking rod 112 is slidingly inserted into the ejector body 105, and specifically, the jacking rod 112 and the ejector body 105 are coaxially slidingly connected through a ball spline 106, and a first return member (not shown in the figure) is connected between the jacking rod 112 and the ball spline 106. In this embodiment, the first return member is a first compression spring, the first compression spring is sleeved on the jacking rod 112, one end of the first compression spring is fixedly connected with the outer wall of the jacking rod 112, and the other end is fixedly connected with the end of the ball spline 106.

[0051] In combination with the accompanying drawings Figure 4 , Figure 6 and Figure 7As shown, a connecting piece is arranged between the ejector pin assembly and the local motion module 200, and the ejector pin assembly and the local motion module 200 are detachably connected through the connecting piece. Specifically, the connecting piece includes an upper connecting plate 107 and a lower connecting plate 202, the upper connecting plate 107 is fixedly connected to the bottom of the ejector pin body 105, and the lower connecting plate 202 is fixedly connected to the top of the local motion module 200. The bottom of the upper connecting plate 107 is provided with a plurality of upper mounting holes, and an upper magnet 115 is fixedly connected in each upper mounting hole. The top of the lower connecting plate 202 is provided with a lower mounting hole corresponding to the position of the upper mounting hole, and a lower magnet 207 is fixedly connected in the lower mounting hole. The opposite side of the upper magnet 115 and the lower magnet 207 has opposite magnetic poles. In this embodiment, the bottom of the upper magnet 115 is a south pole, and the top of the lower magnet 207 is a north pole, so as to ensure that the upper magnet 115 and the lower magnet 207 are attracted to each other. The bottom of the upper connecting plate 107 is fixedly connected with a plurality of positioning pins 116, and the top of the lower connecting plate 202 is provided with a positioning hole 210 corresponding to the position of the positioning pin 116. The positioning pin 116 is inserted into the positioning hole 210, so as to position the upper connecting plate 107 and the lower connecting plate 202.

[0052] In combination Figure 7 and Figure 8 As shown, the local motion module 200 includes a motor fixing plate 203 and a local motor 201 fixedly connected to the motor fixing plate 203, and a driving cam 204 is fixedly connected to the output shaft of the local motor 201. A Z-direction motion plate 205 is vertically and slidably connected to the motor fixing plate 203. Specifically, a cross guide rail 206 is fixedly connected to the motor fixing plate 203, and the Z-direction motion plate 205 is fixedly connected to the sliding block of the cross guide rail 206. A second reset member (not shown in the figure) is connected between the motor fixing plate 203 and the Z-direction motion plate 205. In this embodiment, the second reset member is a second compression spring, which is vertically arranged, and one end of the second compression spring is fixedly connected to the motor fixing plate 203, and the other end is fixedly connected to the Z-direction motion plate 205. A cam follower 208 is fixedly connected to the Z-direction motion plate 205, and the driving cam 204 is tangent to the cam follower 208, so that the Z-direction motion plate 205 can move up and down.

[0053] The lower connecting plate 202 is fixedly connected to the top of the motor fixed plate 203. The Z-direction motion plate 205 is fixedly connected to the jacking rod 112. Specifically, the top of the Z-direction motion plate 205 is vertically fixedly connected to a connecting shaft 209. The top of the connecting shaft 209 passes through the motor fixed plate 203 and the lower connecting plate 202 from bottom to top in sequence. The bottom of the jacking rod 112 is fixedly connected to the top of the connecting shaft 209 through the upper connecting plate 107. The lower end of the vacuum hole of the needle body 105 is in communication with an external vacuum generator. Specifically, the upper connecting plate 107 and the lower connecting plate 202 are vertically provided with a communication hole at the positions corresponding to the vacuum hole. The upper end of the communication hole is in communication with the lower end of the vacuum hole. The motor fixed plate 203 is internally provided with a vacuum passage. One end of the vacuum passage is in communication with the lower end of the communication hole. The other end of the vacuum passage is in communication with the external vacuum generator through a pipeline.

[0054] In combination with the accompanying drawings Figure 7 and Figure 9 As shown in the drawings, the overall motion module 300 includes a motor mounting plate 303 and an overall motor 301 fixedly connected to the motor mounting plate 303. The motor mounting plate 303 is fixedly connected to a guide rail mounting plate 302 away from the overall motor 301. A worm 306 is coaxially fixedly connected to the output shaft of the overall motor 301. The worm 306 passes through the motor mounting plate 303 and the guide rail mounting plate 302. A ball screw 309 is vertically arranged on the guide rail mounting plate 302. Specifically, a bearing seat 308 is fixedly connected to the guide rail mounting plate 302. A limiting bearing is fixedly connected in the bearing seat 308. The screw rod of the ball screw 309 is fixedly inserted into the limiting bearing, so that the screw rod of the ball screw 309 is rotationally connected to the bearing seat 308 through the limiting bearing. A turbine 305 is coaxially fixedly connected to the top of the screw rod of the ball screw 309. The turbine 305 is engaged with the worm 306. A manual adjusting nut 307 is coaxially fixedly connected to the top of the turbine 305. The nut of the ball screw 309 is fixedly connected to the motor fixed plate 203, so as to drive the motor fixed plate 203 to move up and down. The motor fixed plate 203 is vertically slidably connected to the guide rail mounting plate 302. Specifically, a linear guide rail 304 is fixedly connected to the guide rail mounting plate 302. The motor fixed plate 203 is fixedly connected to the sliding block of the linear guide rail 304.

[0055] The specific implementation process is as follows:

[0056] (1) Demolding preparation: the overall motor 301 of the overall motion module 300 drives the worm 306 to rotate, the worm 306 drives the screw of the ball screw 309 to rotate through the turbine 305, drives the nut of the ball screw 309 to move upwards, so that the entire local motion module 200 and the needle stripping module 100 are moved upwards through the motor fixing plate 203, so that the chip to be demolded enters the chip groove 109, at this time the plurality of pins 108 and the plurality of suction heads 103 contact the blue film at the corresponding position of the chip, and the top of the pin cap 102 contacts the blue film around the chip; the pickup head moves above the chip to be demolded, contacts the chip to be demolded and adsorbs it, and keeps relative stillness with the chip.

[0057] (2) Chip and blue film pre-looseness: start the external vacuum generator, the vacuum generator communicates with the vacuum channel in the motor fixing plate 203 through the pipeline, so as to form a vacuum environment in the vacuum channel of the motor fixing plate 203, the communication hole between the upper connecting plate 107 and the lower connecting plate 202, the vacuum hole of the pin body 105 and the vacuum cavity inside the pin cap 102, the suction hole 113 connected with the suction channel 114 and the vacuum cavity uses negative pressure to adsorb and fix the blue film at the corresponding position of the chip, and the fixed hole 110 connected with the vacuum cavity uses negative pressure to adsorb and fix the blue film around the chip.

[0058] The local motor 201 of the local motion module 200 rotates with the driving cam 204, at this time the cam follower 208 is tangent to the rising section of the driving cam 204, so that the cam follower 208 moves upward by a small distance (4mm), drives the Z-direction motion plate 205 to move upward by a small distance, so as to drive the suction head 103 to move upward by a small distance through the connecting shaft 209, the lifting rod 112, the suction seat 111, the pickup head moves upward with the suction head 103, the chip and the blue film at the corresponding position of the chip are lifted upward by a small distance, at this time the blue film at the corresponding position of the chip is stretched and appears jagged wrinkles, so that the contact area of the chip and the blue film becomes smaller, the connection tightness between the two is reduced, and the pre-looseness of the chip and the blue film is realized.

[0059] The local motor 201 continues to rotate with the driving cam 204, at this time the cam follower 208 is tangent to the reset section of the driving cam 204, so that the cam follower 208 moves downward by a small distance (4mm) to reset. The first compression spring drives the lifting rod 112 to move downward by a small distance to reset, drives the suction head 103 to move downward by a small distance to reset, the pickup head moves downward with the suction head 103 to reset, so that the chip returns to the chip groove 109 supported by the pin 108. The second compression spring drives the Z-direction motion plate 205 to move downward by a small distance to reset, preparing for the subsequent chip demolding action.

[0060] (3) Chip demolding: the local motor 201 continues to rotate the driving cam 204, at this time the cam follower 208 is tangent to the descending segment of the driving cam 204, so that the cam follower 208 moves downward by a small distance (4mm), driving the Z-direction motion plate 205 to move downward by a small distance, thereby driving the adsorption head 103 to move downward by a small distance through the connecting shaft 209, the lifting rod 112, and the adsorption seat 111, and the blue film at the corresponding position of the chip moves downward by a small distance following the adsorption head 103, and the chip is limited to move downward by the ejector pin 108, thereby peeling the chip from the blue film, realizing the demolding of the chip. The pick-up head takes away the demolded chip.

[0061] The local motor 201 continues to rotate the driving cam 204, at this time the cam follower 208 is tangent to the reset segment of the driving cam 204, so that the cam follower 208 moves upward by a small distance (4mm) to reset. The first compression spring drives the lifting rod 112 to move upward by a small distance to reset, driving the adsorption head 103 to move upward by a small distance to reset. The second compression spring drives the Z-direction motion plate 205 to move upward by a small distance to reset, preparing for the demolding action of the next chip.

[0062] (4) Position avoidance: the overall motor 301 drives the worm 306 to rotate in the opposite direction, the worm 306 drives the screw rod of the ball screw 309 to rotate in the opposite direction through the turbine 305, driving the nut of the ball screw 309 to move downward, thereby driving the entire local motion module 200 and the ejector pin peeling module 100 to move downward through the motor fixing plate 203, so that the ejector pin peeling module 100 moves away from the wafer stage, avoiding the position of the wafer stage. The wafer stage moves in the X and Y directions, so that the next chip to be demolded moves directly above the ejector pin peeling module 100, so as to perform the demolding operation of the next chip.

[0063] Embodiment 2

[0064] A large-size chip demolding ejector pin mechanism, which is different from embodiment 1 in that: the plurality of ejector pins 108 are detachably connected with the ejector pin cap 102, so as to replace the worn ejector pins 108 after long-term use, ensuring the demolding effect of the chip. Specifically, the ejector pin cap 102 is detachably connected with an ejector pin seat through bolts, and the plurality of ejector pins 108 are fixedly connected to the top of the ejector pin seat; the bottom of the chip groove 109 is provided with an ejector pin hole corresponding to the position of the ejector pin 108, and the ejector pin 108 extends out of the chip groove 109 through the ejector pin hole. Adaptively, the ejector pin seat is provided with a clearance hole corresponding to the position of the adsorption head 103, and the adsorption head 103 is slidably connected in the clearance hole, and the adsorption head 103 extends out of the chip groove 109 through the clearance hole and the movement hole in sequence.

[0065] Embodiment 3

[0066] A large size chip demolding ejector pin mechanism, which is different from the embodiment 2 in that the first photoelectric sensor is fixedly connected on the motor fixing plate 203, the first sensor sheet metal is fixedly connected on the Z direction movement plate 205 corresponding to the position of the first photoelectric sensor, the first photoelectric sensor cooperates with the first sensor sheet metal, and the zero return of the Z direction movement plate 205 is realized, so as to prepare for the next large size chip lifting demolding.

[0067] Embodiment 4

[0068] A large size chip demolding ejector pin mechanism, which is different from the embodiment 3 in that the second photoelectric sensor is fixedly connected on the guide rail mounting plate 302, the second sensor sheet metal is fixedly connected on the motor fixing plate 203 corresponding to the position of the first photoelectric sensor, the second photoelectric sensor cooperates with the second sensor sheet metal, and the zero return of the motor fixing plate 203 is realized, so as to prepare for the next large size chip lifting demolding.

[0069] The above-mentioned is only the embodiment of the present application, and the specific technical solutions and / or common knowledge of the scheme are not described in detail. It should be noted that for those skilled in the art, without departing from the technical solutions of the present application, a number of modifications and improvements can be made, which should also be regarded as the protection scope of the present application, and these will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.

Claims

1. A large-size chip demolding ejector mechanism, comprising an ejector stripping module and a Z-direction motion module, characterized in that: The ejector stripping module includes an ejector assembly and an adsorption assembly. The adsorption assembly is slidably inserted into the ejector assembly. The ejector assembly includes a plurality of ejectors. The adsorption assembly includes a plurality of adsorption heads. The ejectors and adsorption heads are arranged alternately. A fixing portion is provided on the top of the ejector assembly around the adsorption assembly. The Z-direction motion module includes a local motion module and an overall motion module. The local motion module is connected to the output end of the overall motion module. The ejector assembly is fixedly connected to the local motion module. The adsorption assembly is connected to the output end of the local motion module. The overall motion module drives the ejector stripping module upward, allowing the ejector pins to contact the blue film at the corresponding position of the chip. The fixing part is used to fix the blue film around the chip, and the adsorption head is used to adsorb the blue film at the corresponding position of the chip. The local motion module first drives the adsorption component upward for a short distance and then resets it to achieve pre-loosening of the chip and the blue film. It then drives the adsorption component downward for a short distance to achieve the separation of the chip and the blue film. The ejector assembly further includes an ejector cap and an ejector body connected in sequence from top to bottom, a chip slot is formed on the top of the ejector cap, a plurality of ejectors are arranged at the bottom of the chip slot, a vacuum chamber is formed inside the ejector cap, a vacuum hole is formed in the ejector body, one end of the vacuum hole is connected to the vacuum chamber, and the other end is connected to an external vacuum generator; the fixing portion includes a plurality of fixing holes formed on the top of the ejector cap around the adsorption assembly, and the fixing holes are connected to the vacuum chamber; The ejector assembly also includes an ejector seat detachably connected to the ejector cap, a plurality of ejectors fixedly connected to the top of the ejector seat, an ejector hole is opened at the bottom of the chip slot at a position corresponding to the ejector, and the ejector extends from the ejector hole; The adsorption assembly also includes an adsorption seat and a lifting rod connected in sequence from top to bottom, a plurality of adsorption heads are fixedly connected to the top of the adsorption seat, a movement hole is provided at the bottom of the chip slot corresponding to the position of the adsorption head, and a clearance hole is provided at the position of the ejector seat corresponding to the adsorption head, and the adsorption head is slidably connected in the movement hole and the clearance hole; an adsorption hole is provided on the top of the adsorption head, and an adsorption channel is provided in the adsorption seat, and the adsorption channel is connected between the adsorption hole and the vacuum chamber; the lifting rod is slidably inserted in the ejector body, and a first reset member is connected between the lifting rod and the ejector body.

2. A large-size chip ejection pin mechanism according to claim 1, characterized in that: A connecting piece is provided between the ejector assembly and the local motion module, and the ejector assembly and the local motion module are detachably connected via the connecting piece.

3. A large-size chip ejection pin mechanism according to claim 2, characterized in that: The connecting member includes an upper connecting plate fixedly connected to the bottom of the ejector body and a lower connecting plate fixedly connected to the top of the local motion module. The upper connecting plate and the lower connecting plate are provided with a plurality of magnets opposite to each other, and the magnets of the upper connecting plate and the magnets of the lower connecting plate have opposite magnetic poles; a plurality of positioning pins are provided at the bottom of the upper connecting plate, and a positioning hole is provided at the top of the lower connecting plate corresponding to the position of the positioning pins.

4. A large-size chip ejection pin mechanism according to claim 3, characterized in that: The local motion module includes a motor fixing plate and a local motor fixedly connected to the motor fixing plate, and a driving cam is fixedly connected to the output shaft of the local motor; a Z-direction motion plate is vertically slidably connected to the motor fixing plate, and a second reset member is connected between the motor fixing plate and the Z-direction motion plate; a cam follower is provided on the Z-direction motion plate, and the driving cam is tangent to the cam follower so that the Z-direction motion plate can move up and down, and the Z-direction motion plate is fixedly connected to the lifting rod.

5. A large-size chip ejection pin mechanism according to claim 4, characterized in that: The motor fixing plate is provided with a first photoelectric sensor, and the Z-direction motion plate is provided with a first sensor sheet metal corresponding to the first photoelectric sensor sheet metal. The first photoelectric sensor cooperates with the first sensor sheet metal to realize zero return of the Z-direction motion plate.

6. A large-size chip ejection pin mechanism according to claim 5, characterized in that: The integral motion module includes a motor mounting plate and an integral motor fixedly connected to the motor mounting plate, a worm fixedly connected to the output shaft of the integral motor; a ball screw is provided on the motor mounting plate, a turbine fixedly connected to the screw of the ball screw, the turbine is engaged with the worm, and a manual adjustment nut is fixedly connected to the top of the turbine; the nut of the ball screw is fixedly connected to the motor fixing plate, and the motor fixing plate is slidably connected to the motor mounting plate.

7. A large-size chip ejection pin mechanism according to claim 6, characterized in that: The motor mounting plate is provided with a second photoelectric sensor, and the motor fixing plate is provided with a second sensor sheet metal corresponding to the second photoelectric sensor. The second photoelectric sensor cooperates with the second sensor sheet metal to realize zero return of the motor fixing plate.

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