Frame type packaging structure comprising passive element and manufacturing method thereof

Abstract

The invention provides a frame type packaging structure comprising a passive element and a manufacturing method thereof, the frame type packaging structure comprises an LGA packaging body, an integrated circuit chip and a metal frame, the LGA packaging body is configured to comprise the passive element and a substrate, one surface of the substrate is provided with a substrate bonding pad, and the substrate bonding pad is connected with the passive element. The passive element is configured to be adhered to the surface, opposite to the substrate bonding pad, of the substrate; the LGA packaging body and the integrated circuit chip are configured to be pasted on the frame carrier, and a substrate bonding pad of the LGA and a bonding pad of the integrated circuit chip are arranged in a face-up mode; and the substrate bonding pad, the bonding pad of the integrated circuit chip and the frame pin are interconnected through a routing process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and particularly to a frame-type packaging structure including passive components and a preparation method thereof. Background Art

[0002] The main purpose of chip packaging is to lead out the functional signals inside the chip, achieve conduction with the outside world, and at the same time fix, seal, and protect the chip. There are various packaging technologies and packaging types. According to the type of chip carrier, it can be divided into frame-type packaging and substrate-type packaging. The main forms of frame-type packaging include Small Outline Package (SOP), Quad Flat Package (QFP), Quad Flat No-lead Package (QFN), etc. The main forms of substrate-type packaging include Land Grid Array (LGA), Ball Grid Array Package (BGA), Pin Grid Array (PGA), etc. The production process of frame-type packaging is simple, the production cost is low, and the application fields are relatively wide, and it is applied from low-end electronic products to high-end electronic products. Substrate-type packaging has higher integration, more complex production process, and higher production cost, and is mainly applied to electronic products with more complex functions.

[0003] Passive components are a common type of electronic components and an important category in microwave radio frequency devices. Passive components are components that can display their characteristics without the need for an external power supply. The main classifications include components such as resistors, inductors, and capacitors. These passive components usually use ceramic-type packaging, and there are welding end faces at both ends of the component. The metal constituting the welding end face can be tin. Through the Surface Mount Technology (SMT), the welding end face of the passive component can be welded to the pads of the PCB board. Because the welding end face of the passive component is small, when conducting the passive component with the outside world, both the reliability of welding and the prevention of short circuits need to be considered. This requires the carrier for welding the passive component to make precise openings. Therefore, only carriers such as substrates that can make precise openings on the surface can be packaged with passive components, which results in passive components usually being packaged with substrates and rarely with frames.

[0004] However, for some products encapsulated in a frame, if the number of passive components such as capacitors, resistors, and inductors integrated inside the integrated circuit chip is insufficient, or some special passive components need to be used, it is necessary to encapsulate the integrated circuit chip and the passive components on a frame carrier. How to achieve the interconnection between the integrated circuit chip and the passive components becomes a key issue. Since the outer shell of the passive component is made of ceramic, the material of the welding end face is tin, and the welding area is small, it is impossible to directly wire-bond the integrated circuit chip and the passive component. Therefore, it is necessary to explore a method to achieve the interconnection between the integrated circuit chip and the passive component and co-encapsulate them on the frame carrier. Summary of the Invention

[0005] One aspect of the present invention provides a frame-type encapsulation structure including passive components, and a method for interconnecting and co-encapsulating an integrated circuit chip and passive components onto a frame carrier. By encapsulating the passive components on a substrate carrier to form an LGA package, then pasting the solder pad surface of the LGA package upward onto the frame, and at the same time pasting the integrated circuit chip onto the frame. Since the solder pads of the LGA package can be wire-bonded, the solder pads of the LGA can be connected to the chip solder pads by wire-bonding, thereby realizing the co-encapsulation of the integrated circuit chip and the passive components onto the frame carrier.

[0006] According to one aspect of the present invention, there is provided a frame-type encapsulation structure including passive components, comprising an LGA package body, an integrated circuit chip, and a metal frame. Wherein, the LGA package body is configured to include passive components and a substrate, and substrate solder pads are arranged on one surface of the substrate, and the passive components are configured to be pasted onto the surface of the substrate opposite to the substrate solder pads; the metal frame includes a frame carrier and frame pins; the LGA package body and the integrated circuit chip are configured to be pasted on the frame carrier, wherein the substrate solder pads of the LGA and the solder pads of the integrated circuit chip are arranged with the surfaces facing upward; the substrate solder pads, the solder pads of the integrated circuit chip, and the frame pins are interconnected by a wire-bonding process.

[0007] According to one aspect of the present invention, there is provided a frame-type encapsulation structure including passive components, wherein the passive component includes a welding end face, and the substrate includes through holes, and the welding end face and the substrate solder pads are connected through the through holes.

[0008] According to one aspect of the present invention, there is provided a frame-type encapsulation structure including passive components, wherein the area of the substrate solder pads is configured to be larger than the area of the welding end face.

[0009] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. Wherein, the LGA package further includes a plastic - encapsulated housing, and the plastic - encapsulated housing is configured on the surface of the substrate opposite to the substrate pads to cover the package housing of the passive components.

[0010] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. Wherein, the passive components are pasted onto the surface of the substrate opposite to the substrate pads by surface - mount technology, and wherein, the LGA package and the integrated circuit chip are pasted onto the frame carrier by die - attach adhesive.

[0011] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. Wherein, the frame - type package structure further includes a protective housing, and the protective housing is configured as an epoxy molding compound to cover the frame carrier and is connected to the outside through frame pins.

[0012] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. Wherein, the frame carrier is configured as a copper frame carrier.

[0013] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. Wherein, the frame - type package structure includes a QFN package.

[0014] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. Wherein, the welding end face is a tin - welding end face.

[0015] According to one aspect of the present invention, there is provided a frame - type package structure including passive components. The substrate pads are configured as electroless nickel - palladium - gold pads, wherein the thickness of nickel is 0.3 - 0.5 um, the minimum thickness of palladium is 0.1 um, and the minimum thickness of gold is 0.1 um.

[0016] According to one aspect of the present invention, there is provided a manufacturing method of a frame - type package structure including passive components. The frame - type package structure includes an LGA package, an integrated circuit chip, and a metal frame. The method includes: forming a substrate having substrate pads formed on one surface; pasting the welding end face of the passive components onto the other surface opposite to the one surface of the substrate having the substrate pads to form an LGA package, wherein the passive components and the substrate pads are connected through the through - holes of the substrate; pasting the integrated circuit chip and the LGA package onto the frame carrier included in the metal frame, wherein the surface of the integrated circuit chip having pads and the surface of the LGA package having substrate pads are arranged face - up; interconnecting the integrated circuit chip and the LGA package through a wire - bonding process; and molding the frame carrier to form a protective housing to form the frame - type package structure. Brief Description of the Drawings

[0017] Figure 1 is a schematic diagram showing the external shape of a passive component according to an embodiment of the present invention;

[0018] Figure 2 is a schematic diagram showing the soldering process of a passive component and a substrate according to an embodiment of the present invention;

[0019] Figure 3 is a schematic diagram showing the external shape of an LGA package formed after encapsulating a passive component and a substrate according to an embodiment of the present invention;

[0020] Figure 4 is a cross-sectional view of the LGA package along A-A according to an embodiment of the present invention;

[0021] Figure 5 is a schematic diagram showing an integrated circuit chip and a passive component in an LGA package being simultaneously pasted onto a metal frame according to an embodiment of the present invention;

[0022] Figure 6 is a schematic diagram showing the external shape of a QFN package according to an embodiment of the present invention;

[0023] Figure 7 is a schematic diagram showing the process of co-packaging an integrated circuit chip and a passive component into a frame according to an embodiment of the present invention. Detailed Description of the Invention

[0024] Before proceeding with the following detailed description, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document. The terms "coupled," "connected," and their derivatives refer to any direct or indirect communication between two or more elements, whether or not those elements are in physical contact with each other. The terms "transmit," "receive," and "communicate," and their derivatives, encompass both direct and indirect communication. The terms "comprises" and "comprising," and their derivatives, mean including but not limited to. The term "or" is inclusive, meaning and / or. The phrase "associated with," and its derivatives, means including, included within, interconnected with, contained within, contained within, connected or coupled with, communicating with, cooperating with, interlacing with, juxtaposed with, proximate to, bound or bound with, having, having an attribute, having a relationship or a relationship with, etc. The term "controller" refers to any device, system, or part thereof that controls at least one operation. Such a controller can be implemented in hardware, or a combination of hardware and software and / or firmware. The functions associated with any particular controller can be centralized or distributed, whether local or remote. The phrase "at least one," when used in conjunction with a list of items, means that different combinations of one or more of the listed items can be used, and only one item in the list may be required. For example, "at least one of A, B, C" includes any one of the following combinations: A, B, C, A and B, A and C, B and C, A and B and C.

[0025] Definitions of other specific words and phrases are provided throughout this patent document. Those of ordinary skill in the art should understand that in many instances, if not most instances, such definitions apply to the prior and future use of the words and phrases so defined.

[0026] In this patent document, the application combinations of circuit blocks and the division of sub-circuit blocks are for illustrative purposes only, and within the scope of not departing from this disclosure, the application combinations of circuit blocks and the division of sub-circuit blocks can have different ways.

[0027] The following discussion Figures 1 to 7 and the various embodiments used to describe the principles of this disclosure in this patent document are for illustrative purposes only and should not be construed in any way as limiting the scope of this disclosure. Those skilled in the art will understand that the principles of this disclosure can be implemented in any appropriately arranged system or device.

[0028] Figure 1 is a schematic diagram showing the profile of a passive component according to an embodiment of the present invention.

[0029] Reference Figure 1, the passive component includes a package housing 1 and soldering end faces 2, wherein the soldering end faces 2 are disposed at both ends of one surface of the package housing 1. According to an embodiment of the present invention, the passive component is configured as a ceramic package, wherein the package housing 1 can be configured as a ceramic housing, and the soldering end faces 2 are configured as metal soldering end faces, including tin soldering end faces. Those skilled in the art should understand that the soldering end faces 2 can have multiple ports, which are configured according to the attributes of the passive component. For example, the soldering end faces of the passive component can be located on both sides of the package body of the passive component; the soldering end faces can be configured on the same surface (for example, the bottom surface); the soldering end faces can be configured on two surfaces of the package body (for example, the bottom surface and one side surface); or the soldering end faces can be configured on five surfaces of the package body (for example, the bottom surface and four side surfaces).

[0030] Figure 2 is a schematic diagram showing the soldering process of the passive component and the substrate according to an embodiment of the present invention.

[0031] Reference Figure 2 , the substrate 3 is configured to include substrate pads 4, and the substrate pads 4 are disposed at positions corresponding to the soldering end faces 2 of the passive component. The soldering end faces 2 are pasted to the surface opposite to the substrate pads 4 to fix the passive component and the substrate 3 together. According to an embodiment of the present invention, the substrate 3 is configured as a two-layer substrate with a thickness of 150 um, and the substrate metal surface (substrate pads 4) is processed as an electroless nickel palladium gold pad through surface treatment, wherein the thickness of nickel is 0.3 - 0.5 um, the thickness of palladium is at least 0.1 um, and the thickness of gold is at least 0.1 um. Different surfaces of the substrate 3 are connected through vias 6. Preferably, the area of the substrate 3 is configured to be larger than the area of the surface of the passive component having the soldering end faces 2. According to an embodiment of the present invention, the passive component can be soldered to the substrate by means of surface mount technology (SMT). Those skilled in the art should understand that the substrate 3 can also be configured as a substrate with other numbers of layers according to the number of internal copper layers thereof, for example, a four-layer board, a six-layer board, etc. In the substrate, different copper layers are electrically connected through vias to transmit electrical signals.

[0032] Figure 3 is a schematic diagram showing the external shape of the LGA package formed after the passive component and the substrate are packaged according to an embodiment of the present invention, and Figure 4 is a cross-sectional view of the LGA package along A - A according to an embodiment of the present invention.

[0033] Reference Figure 3, an LGA package is formed by forming a plastic encapsulation shell 5 outside the passive component. Among them, the plastic encapsulation shell 5 is configured to be formed by epoxy resin. Preferably, the plastic encapsulation shell 5 is configured on the surface of the substrate 3 to cover the encapsulation shell 1 of the passive component. The pads of the LGA package (substrate pads 4) are processed into electroless nickel palladium gold pads through surface treatment.

[0034] The substrate pads 4 of the substrate 3 are configured on the surface opposite to the welding end face 2, and the substrate pads 4 and the welding end face 2 are connected through vias 6. By configuring the external pads 4 to have a larger area than the welding end face 2, the area of the connection between the welding end face 2 and the outside can be effectively enlarged, so as to facilitate interconnection with the outside through the wire bonding process.

[0035] Figure 5 is a schematic diagram showing an integrated circuit chip and a passive component of an LGA package being simultaneously pasted onto a metal frame according to an embodiment of the present invention.

[0036] Reference Figure 5 , the metal frame includes a copper frame carrier 8 and frame pins 9. The integrated circuit chip 7 and the LGA package are configured to be pasted on the upper surface of the copper frame carrier 8, wherein the pads of the integrated circuit chip 7 and the substrate pads 4 of the LGA package are configured face up. The copper frame pins 9 are configured on the periphery of the copper frame carrier 8, and the pads of the integrated circuit chip 7, the external pads 4, and the copper frame pins 9 are connected through the wire bonding process. According to an embodiment of the present invention, the LGA package and the integrated circuit chip are pasted onto the copper frame carrier 8 through an adhesive (such as silver paste). According to an embodiment of the present invention, the pads of the integrated circuit chip 7, the external pads 4, and the copper frame pins 9 are connected through a wire bonding process including ultrasonic thermocompression bonding. According to an embodiment of the present invention, the copper frame pins 9 include pins P1 - P20, but those skilled in the art should understand that the frame - type package structure according to the embodiment of the present invention can have different numbers of pins. Those skilled in the art should understand that although in Figure 5 the example shown, the metal frame includes a copper frame carrier 8 and copper frame pins 9, the metal frame can also be formed by other types of metal frames.

[0037] According to an embodiment of the present invention, the metal frame is formed by stamping copper foil. After stamping, the copper foil is configured in a hollowed - out form, wherein the part for carrying the chip is configured as the frame carrier, and the part configured for connection with the outside (or connection with wire bonding) is configured as the frame pins. The frame carrier and the frame pins are connected by metal ribs, and the metal ribs are configured to be cut off in subsequent steps after the chip - pasting process. For example, it can be cut off after encapsulation.

[0038] Figure 6It is a schematic diagram showing the outline of a QFN package according to an embodiment of the present invention.

[0039] Reference Figure 6 , the QFN package is formed by injection molding above the copper frame carrier 8. For example, by placing the metal frame into a specific mold and injecting a flowing encapsulant from the injection port of the mold, the metal frame is covered and cured. The encapsulant is configured to cover the metal frame from above, so that the metal surfaces of the metal frame (i.e., the frame carrier and the frame pins) are exposed after cutting. According to an embodiment of the present invention, the injection molding is performed using an epoxy molding compound (EMC) to form a protective housing and to fix the frame carrier and the frame pins. In addition, the metal frame is cut to form individual QFN package bodies, and the cutting is performed at positions corresponding to the frame pins to form L-shaped frame pins. According to an embodiment of the present invention, the QFN package has an external dimension of 4×4×0.85 mm, and an integrated circuit chip and a passive component (e.g., an inductor) are co-packaged inside. The size of the integrated circuit chip is 1.8×1.2×0.2 mm, the original size of the inductor is 1.0×0.5×0.5 mm, and the chip and the inductor are interconnected by a wire bonding process using 20-μm gold-palladium copper wires.

[0040] According to an embodiment of the present invention, the formed QFN package body belongs to a general package, which can be placed in a general fixture for testing, and it can also be pasted onto a PCB board to realize the functions of the entire package body. According to an embodiment of the present invention, a frame-type package structure is realized in which an integrated circuit chip and an external passive component are co-packaged onto a frame. Those skilled in the art should understand that the QFN package body is only for illustration, and without departing from the scope of the present invention, it can be packaged into other types of package bodies.

[0041] Figure 7 It is a schematic flowchart showing a method for co-packaging an integrated circuit chip and a passive component into a frame according to an embodiment of the present invention.

[0042] Reference Figure 7, in step S701, a double-layer substrate 3 is formed, and a substrate pad 4 is disposed on one surface of the double-layer substrate 3. The substrate 3 is configured as two layers of substrate with a thickness of 150 um. The metal surface (substrate pad 4) of the substrate is surface-treated to be an electroless nickel-palladium-gold pad, with the thickness of nickel being 0.3 - 0.5 um, the minimum thickness of palladium being 0.1 um, and the minimum thickness of gold being 0.1 um. In step S702, passive components are pasted onto the substrate 3, where the welding end face 2 of the passive components is pasted onto the surface of the substrate 3 opposite to the substrate pad 4 to form an LGA package. Through-holes 6 are used to connect the welding end face 2 and the substrate pad 4, and the passive components are pasted onto the substrate 3 by means of the SMT process. In step S703, the integrated circuit chip and the LGA package are pasted onto the frame carrier by means of die attach glue. The surface of the integrated circuit chip having pads and the surface of the LGA package having the substrate pad 4 are arranged facing upward, and the die attach glue is silver glue. In step S704, the pads of the integrated circuit chip and the substrate pad 4 are connected by a wire bonding process including ultrasonic thermocompression bonding to interconnect the integrated circuit chip and the passive components of the LGA package. In step S705, the frame is encapsulated to form a frame-like package.

[0043] Those skilled in the art should understand that the above steps are only for illustration, and without departing from the scope of the present invention, the order of the above steps can be adjusted, decomposed, and combined.

[0044] Although the present disclosure has been described with exemplary embodiments, various changes and modifications can be proposed to those skilled in the art. The present disclosure is intended to cover such changes and modifications that fall within the scope of the appended claims.

[0045] Any description in the present invention should not be construed as implying that any particular element, step, or function is an essential element that must be included within the scope of the claims. The scope of the inventive subject matter is defined only by the claims.

Claims

1. A frame - type package structure including passive components, comprising an LGA package body, an integrated circuit chip, and a metal frame. Among them, the LGA package body is configured to include passive components and a substrate. A substrate pad is disposed on one surface of the substrate, and the passive components are configured to be pasted onto the surface of the substrate opposite to the substrate pad; the metal frame includes a frame carrier and frame pins; the LGA package body and the integrated circuit chip are configured to be pasted on the frame carrier. Among them, the substrate pads of the LGA and the pads of the integrated circuit chip are arranged with the pads facing upward; the substrate pads, the pads of the integrated circuit chip, and the frame pins are interconnected through a wire - bonding process.

2. The frame-type encapsulation structure including passive components according to claim 1, wherein, The passive components include a welding end face, and the substrate includes a through - hole. The welding end face and the substrate pad are connected through the through - hole.

3. The frame-type encapsulation structure including passive components according to claim 2, wherein, The area of the substrate pad is configured to be larger than the area of the welding end face.

4. The frame-like encapsulation structure containing passive components according to claim 1, wherein, The LGA package body further includes a plastic encapsulation shell, and the plastic encapsulation shell is configured on the surface of the substrate opposite to the substrate pad to cover the encapsulation shell of the passive components.

5. The frame-like encapsulation structure including passive components according to claim 1, wherein, The passive components are pasted onto the surface of the substrate opposite to the substrate pad through surface - mount technology, and among them, the LGA package body and the integrated circuit chip are pasted on the frame carrier through an adhesive.

6. The frame-type encapsulation structure containing passive components according to claim 1, wherein, The frame - type package structure further includes a protective housing, and the protective housing is configured as an epoxy molding compound to cover the frame carrier and is connected to the outside through the frame pins.

7. The frame-like encapsulation structure containing passive components according to claim 1, wherein, The frame carrier is configured as a copper frame carrier.

8. The frame-type encapsulation structure including passive components according to claim 1, wherein, The frame - type package structure includes a QFN package.

9. The frame-like encapsulation structure containing passive components according to claim 2, wherein, The substrate pads are configured as electroless nickel - palladium - gold pads, where the thickness of nickel is 0.3 - 0.5 um, the minimum thickness of palladium is 0.1 um, and the minimum thickness of gold is 0.1 um.

10. A manufacturing method of a frame - type package structure including passive components, the frame - type package structure including an LGA package body, an integrated circuit chip, and a metal frame. The method includes: forming a substrate with substrate pads formed on its surface; pasting the welding end face of the passive components onto the other surface of the substrate opposite to the surface where the substrate pads are formed to form an LGA package body. Among them, the passive components and the substrate pads are connected through the through - holes of the substrate; pasting the integrated circuit chip and the LGA package body onto the frame carrier included in the metal frame. Among them, the surface of the integrated circuit chip having pads and the surface of the LGA package body having substrate pads are arranged with the pads facing upward; interconnecting the integrated circuit chip and the LGA package body through a wire - bonding process; and encapsulating the frame carrier to form a protective housing to form the frame - type package structure.

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