Antenna device and electronic equipment

Abstract

The invention discloses an antenna device and electronic equipment. The antenna device comprises a substrate assembly, a first metal bending structure, a shielding cover and a frame. The substrate assembly comprises a plurality of metal through holes and at least one signal metal through hole. The first metal bending structure comprises a first part and a second part. The second part is connected with the first part. The second portion is parallel to the substrate assembly. The first part is connected to the substrate assembly. The shielding cover is arranged on the substrate assembly and shields the first metal bending structure. And one side, close to the first part of the first metal bending structure, of the shielding cover is closed. The other side, far away from the first portion of the first metal bending structure, of the shielding cover is open and provided with an opening. The frame is connected to the side, with the opening, of the shielding cover. The substrate assembly is connected with a control circuit to receive an antenna signal. And an antenna signal is transmitted to the first metal bending structure through the signal metal through hole of the substrate assembly, so that the transmission direction is adjusted, and the antenna signal is transmitted.

Description

Technical Field

[0001] The present invention relates to an antenna device and an electronic device, and particularly to an antenna device with an adjustable antenna signal transmission direction and an electronic device using the antenna device. Background Art

[0002] As the mobile communication network evolves to the current 5G generation, in order to expand more bandwidth for the increasingly developing digital applications, in addition to the limited bandwidth of sub-6GHz in Frequency Range 1 (FR1) of 5G, the practical application and popularization of the millimeter-wave band in Frequency Range 2 (FR2) are also quite important. The millimeter-wave module of 5G on mobile devices is usually designed as an Antenna in Package (AiP). The antenna array is arranged on the circuit layer below the substrate of the millimeter-wave module and realized in the form of a patch antenna, which saves cost and volume. However, the disadvantage of the packaged antenna (AiP) is that the antenna efficiency and effective bandwidth are poor, and as it develops towards higher frequencies, such as Band n263 which has been extended to 71GHz, for a patch antenna with a conductor on a printed circuit board as the radiator, the high-frequency loss of the substrate of the printed circuit board becomes more obvious, resulting in even worse antenna efficiency.

[0003] In the application of smart phones, due to the above-mentioned packaged antenna (AiP), the antenna radiation direction is towards the upper side (Boresight direction) of the antenna body, so it is usually installed on the side of the mobile device to send the antenna signal to the side of the mobile device. Since the thickness of the side of the mobile device is limited, this configuration method will greatly limit the width of the packaged antenna (AiP), and the heat dissipation performance is poor. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide an antenna device in view of the deficiencies of the prior art. The antenna device is characterized in that it includes: a substrate assembly including a plurality of metal vias and at least one signal metal via; a first metal bending structure including a first part and a second part, the second part connecting the first part, the second part being parallel to the substrate assembly, and the first part being connected and disposed on the substrate assembly; a shielding cover disposed on the substrate assembly and shielding the first metal bending structure, one side of the shielding cover close to the first part of the first metal bending structure being closed, and the other side of the shielding cover far from the first part of the first metal bending structure being open and having an opening; and a frame disposed on the substrate assembly, the frame connecting the shielding cover; wherein the substrate assembly is connected to a control circuit to receive an antenna signal, and the antenna signal is transmitted through the signal metal via of the substrate assembly to the first metal bending structure for adjusting the transmission direction and then transmitted.

[0005] Optionally, the second part of the first metal bending structure is a triangle or a trapezoid, and a width of the second part of the first metal bending structure is gradually decreasing.

[0006] Optionally, one side of the first metal bending structure is connected to an inner sidewall of the shielding cover.

[0007] Optionally, the first part of the first metal bending structure includes a first notch, the first notch being disposed on a side where the first part is connected to the substrate assembly, and the first part is divided into two sub-parts according to the first notch. The first part includes a first sub-part and a second sub-part, and the second sub-part is connected to the inner sidewall of the shielding cover.

[0008] Optionally, the substrate assembly includes a multilayer circuit board, a signal strip line, a solder pad, at least one signal metal via, and a plurality of metal vias. The signal strip line is disposed in an intermediate layer of the multilayer circuit board, the signal strip line is connected to the solder pad through the signal metal via, and the first sub-part is connected to the solder pad to receive the antenna signal.

[0009] Optionally, the substrate assembly includes a first side and a second side. The plurality of metal vias on the first side of the substrate assembly are arranged symmetrically in pairs along a first direction, and the plurality of metal vias on the second side of the substrate assembly are arranged in two rows along a second direction. The first direction and the second direction are perpendicular to each other.

[0010] Optionally, the frame includes a frame width and a frame height, the shielding cover includes a shielding cover width and a shielding cover height, the frame width is the shielding cover width plus twice the predetermined width, the frame height is the shielding cover height plus a predetermined height, a width value of the predetermined width is 1 mm, a height value of the predetermined height is 1 mm, the frame further includes a frame thickness, and a thickness value of the frame thickness is 1 mm.

[0011] The present invention also discloses an electronic device, characterized in that it includes: a control circuit; and at least one antenna device, the at least one antenna device is electrically connected to the control circuit to receive an antenna signal, and the at least one antenna device includes: a substrate assembly including a plurality of metal vias and at least one signal metal via; a first metal bending structure including a first part and a second part, the second part connects the first part, the second part is parallel to the substrate assembly, and the first part is connected and arranged on the substrate assembly; a shielding cover arranged on the substrate assembly and shielding the first metal bending structure, one side of the shielding cover close to the first part of the first metal bending structure is closed, and the other side of the shielding cover away from the first part of the first metal bending structure is open and has an opening; and a frame arranged on the substrate assembly, the frame connecting the shielding cover; wherein, the substrate assembly is connected to a control circuit to receive an antenna signal, and the antenna signal passes through the signal metal via of the substrate assembly and is transmitted to the first metal bending structure for adjustment of the transmission direction and then transmitted.

[0012] The present invention also discloses an electronic device, which is characterized by comprising: a control circuit; a first antenna device electrically connected to the control circuit to receive an antenna signal; and a second antenna device electrically connected to the control circuit to receive the antenna signal; the first antenna device and the second antenna device each include: a substrate assembly including a plurality of metal vias and at least one signal metal via; a first metal bending structure including a first portion and a second portion, the second portion connecting the first portion, the second portion being parallel to the substrate assembly, and the first portion being connected and disposed on the substrate assembly; a shielding cover disposed on the substrate assembly and shielding the first metal bending structure, one side of the shielding cover close to the first portion of the first metal bending structure being closed, and the other side of the shielding cover away from the first portion of the first metal bending structure being open and having an opening; and a frame disposed on the substrate assembly, the frame connecting the shielding cover; wherein the antenna signal is transmitted through the signal metal via of the substrate assembly to the first metal bending structure for adjusting the transmission direction and then transmitted; wherein the antenna signal of the first antenna device is transmitted along a first direction, and the antenna signal of the second antenna device is transmitted along a second direction, and the first direction and the second direction are different directions.

[0013] Optionally, the first direction and the second direction are perpendicular to each other.

[0014] One of the beneficial effects of the present invention is the antenna device and the electronic device provided by the present invention. The antenna device of the present invention uses a shielding cover design that can use surface mount technology to convert the antenna signal (RF signal) from the inner layer circuit of the multi-layer circuit board in the substrate assembly to the waveguide structure on the substrate assembly. Then, the antenna device of the present invention allows the electromagnetic wave (electric field vector) of the antenna signal to radiate directly outward in the horizontal direction and provides better performance than the antenna-in-package.

[0015] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the provided drawings are only for reference and illustration and are not used to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the antenna device according to the first embodiment of the present invention.

[0017] Figure 2 is a top view of the antenna device according to the first embodiment of the present invention.

[0018] Figure 3 is a side perspective view of the antenna device according to the first embodiment of the present invention.

[0019] Figure 4 is a front view of the antenna device according to the first embodiment of the present invention.

[0020] Figure 5 is Figure 2 a schematic diagram of the electric field vector of the sectional line VI-VI in

[0021] Figure 6 is Figure 2 a schematic diagram of the electric field vector of the sectional line V-V in

[0022] Figure 7 is a side view of the electric field strength distribution of the antenna device according to the first embodiment of the present invention.

[0023] Figure 8 is a top view of the electric field strength distribution of the antenna device according to the first embodiment of the present invention.

[0024] Figure 9 is an S-parameter simulation diagram of the antenna device according to the first embodiment of the present invention.

[0025] Figure 10 is a schematic diagram of the antenna device according to the first embodiment of the present invention with a millimeter-wave module.

[0026] Figure 11 is another schematic diagram of the antenna device according to the first embodiment of the present invention with a millimeter-wave module.

[0027] Figure 12 is a schematic diagram of the electronic device according to the second embodiment of the present invention.

[0028] Figure 13 is a schematic diagram of the electronic device according to the third embodiment of the present invention.

[0029] Figure 14 is a schematic diagram of the electronic device according to the fourth embodiment of the present invention. Detailed implementation manners

[0030] The following is to illustrate the embodiments of the present invention related to "antenna device and electronic device" through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is hereby stated in advance. The following embodiments will further elaborate on the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein should, depending on the actual situation, possibly include any one or a combination of more of the associated listed items.

[0031] [First Embodiment]

[0032] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 , Figure 1 which are schematic diagrams of the antenna device of the first embodiment of the present invention. Figure 2 which is a top view of the antenna device of the first embodiment of the present invention. Figure 3 which is a side perspective view of the antenna device of the first embodiment of the present invention. Figure 4 which is a front view of the antenna device of the first embodiment of the present invention. Figure 5 is Figure 2 the schematic diagram of the electric field vector of the section line IV-IV in Figure 6 is Figure 2 the schematic diagram of the electric field vector of the section line V-V in Figure 7 which is a side view of the electric field intensity distribution of the antenna device of the first embodiment of the present invention. Figure 8 which is a top view of the electric field intensity distribution of the antenna device of the first embodiment of the present invention.

[0033] In this embodiment, an antenna device AT1 is provided.

[0034] The antenna device AT1 includes a substrate assembly CB1, a first metal bending structure M11, a shielding cover C1, and a frame B1.

[0035] The first metal bending structure M11 includes a first side and a second side. The first side of the first metal bending structure M11 is disposed on one side of the substrate assembly CB1. The second side of the first metal bending structure M11 extends towards the other side of the substrate assembly CB1.

[0036] The shielding cover C1 is disposed on the substrate assembly CB1 and shields the first metal bending structure M11.

[0037] The frame B1 is disposed on the other side of the substrate assembly CB1. The frame B1 is connected to the shielding cover C1.

[0038] The substrate assembly CB1 is connected to a control circuit and receives an antenna signal. The antenna signal is transmitted through the signal metal via SPTH of the substrate assembly CB1 to the first metal bending structure M11 for transmission.

[0039] The first metal bending structure M11 includes a first portion MP1 and a second portion MP2. The second portion MP2 is connected to the first portion MP1. There is an included angle A1 between the first portion MP1 and the second portion MP2. In this embodiment, the included angle between the first portion MP1 and the second portion MP2 is 90 degrees. Therefore, the second portion MP2 is parallel to the substrate assembly CB1. In addition, the first portion MP1 is vertically connected and disposed on the substrate assembly CB1.

[0040] Furthermore, the second portion MP2 of the first metal bending structure M11 is a triangle or a trapezoid. That is, a width value of the second portion MP2 is gradually decreasing. The width value of the second portion MP2 gradually decreases from the side closed by the shielding cover C1 to the side of the shielding cover C1 having an opening structure.

[0041] In addition, a length value of the long side distance MPT1 of the second portion MP2 is less than or equal to the sum of a length value of the shielding cover C1 and a width value of the frame B1. That is, the first metal bending structure M11 is completely accommodated in the shielding cover C1 and the frame B1.

[0042] The first portion MP1 of the first metal bending structure M11 includes a first notch ST1. The first notch ST1 is disposed on the side where the first portion MP1 is connected to the substrate assembly CB1. The first portion MP1 is divided into two sub - portions according to the first notch ST1, that is, the first portion MP1 includes a first sub - portion MP11 and a second sub - portion MP12. The second sub - portion MP12 is connected to the inner sidewall of the shielding cover C1 and a ground layer GL.

[0043] In addition, please refer to Figure 2 , the long side of the second portion MP2 of the first metal bending structure M11 is also connected to the inner sidewall of the shielding cover C1.

[0044] The side of the shielding cover C1 close to the first portion MP1 of the first metal bending structure M11 is closed. The other side (the side joined to the frame B1) of the shielding cover C1 away from the first portion MP1 of the first metal bending structure M11 is open and has an opening. Moreover, the opening on the second side of the shielding cover C1 is the same size as the inner cavity of the shielding cover C1.

[0045] In this embodiment, the shielding cover C1 can be disposed on the substrate assembly CB1 by using surface mount technology (SMT). Furthermore, the shielding cover C1 can be made of a metallic material.

[0046] The substrate assembly CB1 includes a multi-layer circuit board PCB, a solder pad SP1, at least one signal metal via SPTH, and a plurality of metal vias TH. At least one signal metal via SPTH and the plurality of metal vias TH are both disposed in the multi-layer circuit board PCB. A signal stripline SL1 is disposed in the middle layer of the multi-layer circuit board PCB. It is connected to the solder pad SP1 on the uppermost layer through at least one signal metal via SPTH. In addition, the top layer of the multi-layer circuit board PCB further includes a ground layer GL. In this embodiment, the signal stripline is a radio frequency stripline. The signal stripline of the substrate assembly CB1 is connected to a control circuit (not shown in the figure) to receive an antenna signal. In this embodiment, the first sub-portion MP11 of the first portion MP1 of the first metal bending structure M11 is connected to the solder pad SP1 and the signal metal via SPTH to receive the antenna signal. In this embodiment, the signal stripline SL1 is a stripline with a 50-ohm impedance. The antenna signal is fed into the signal stripline SL1 with a 50-ohm impedance, then to the lower side of the shielding cover C1 with the metal vias TH (ground vias) arranged on both sides, and then connected to the solder pad SP1 on the uppermost layer of the multi-layer circuit board PCB through the signal metal via SPTH.

[0047] In addition, the plurality of metal vias TH of the substrate assembly CB1 are disposed on both sides of the multi-layer circuit board PCB. The plurality of metal vias TH on the first side of the substrate assembly CB1 are arranged in a pairwise opposite manner along a first direction DR1. The plurality of metal vias TH on the second side of the substrate assembly CB1 are arranged in a pairwise opposite manner along a second direction DR2. The first direction DR1 and the second direction DR2 are two perpendicular directions on the same plane.

[0048] The frame B1 includes a frame width BW1 and a frame height BH1. The shielding cover C1 includes a shielding cover width CW1 and a shielding cover height CEH1. The frame width BW1 is the shielding cover width CW1 plus twice the predetermined width PW1. The frame height BH1 is the shielding cover height CEH1 plus a predetermined height PH1. In this embodiment, a width value of the predetermined width PW1 is 1 mm. A height value of the predetermined height PH1 is 1 mm. The frame B1 further includes a frame thickness BT1. In this embodiment, the frame thickness is 1 mm. In this embodiment, the frame B1 is an L-shaped frame. The frame B1 can also be regarded as a metal ring, which is joined to the side of the shielding cover C1 with an opening.

[0049] In this embodiment, a height value of the mask height CEH1 of the mask C1 is 2.9 mm. A thickness value of the side wall thickness CT1 of the mask C1 is 0.15 mm. A height value of an inner height CIH1 of the mask C1 is 2.75 mm.

[0050] A first part MP1 of the first metal bending structure M11 has a distance D1 from the inner wall of the closed side of the mask C1, and a distance value of the distance D1 is 0.225 mm. That is, the first part MP1 of the first metal bending structure M11 is not connected to the inner wall of the closed side of the mask C1. However, the first part MP1 and the second part MP2 of the first metal bending structure M11 will be connected to the inner wall of the other side of the mask C1 (the inner wall adjacent to the closed side of the mask C1, the inner wall of the mask C1 adjacent to the second part MP12).

[0051] However, the first part MP1 and the second part MP2 of the first metal bending structure M11 will not be connected to the inner wall of the mask C1 adjacent to the first part MP11. The first part MP1 of the first metal bending structure M11 has a distance D4 from the inner wall of the mask C1 adjacent to the first part MP11, and a distance value of the distance D4 is 0.1 mm. In addition, a thickness value of the structure thickness MT1 of the first metal bending structure M11 is 0.2 mm.

[0052] In addition, there is a distance D2 between the upper side of the second part MP2 of the first metal bending structure M11 and the inner wall of the mask C1, and a distance value of the distance D2 is 1.275 mm.

[0053] There is a distance D3 between the lower side of the second part MP2 of the first metal bending structure M11 and the substrate assembly CB1, and a distance value of the distance D3 is 1.275 mm.

[0054] The shape of the second part MP2 of the first metal bending structure M11 is a triangle or a trapezoid. That is, the end of the second part MP2 can be a tip structure or a flat cut structure. The length value of the long side distance MPT1 connecting the inner wall of the mask C1 of the second part MP2 is 3 mm. The end of the second part MP2 does not exceed outside the frame B1. In this embodiment, there is a distance D5 between the end of the second part MP2 and the boundary of the frame B1, and a distance value of the distance D5 is 0.4 mm. The second part MP2 of the first metal bending structure M11 includes a distance D6 from the inner wall of the mask C1 on the side close to the first part MP1, and a distance value of the distance D6 is 0.21 mm. In this embodiment, the mask height CEH1 of the mask C1 is 2.9 mm. The length value of the total length LT1 of the mask C1 and the frame B1 is 3.775 mm.

[0055] In this embodiment, the second part MP2 of the first metal bending structure M11 has a bevel structure on the side close to the first part MP1. The distance value of a distance D7 between the first metal bending structure M11 and the inner side wall of the first side of the shielding cover C1 is 0.415 mm. The width value of a width WP1 of the first part MP1 connected to one side of the substrate assembly CB1 is 1.1 mm. That is, the first part MP1 will vertically extend to a certain height, and the bevel structure will only appear at the connection of the first part MP1 and the second part MP2.

[0056] The first notch ST1 of the first metal bending structure M11 includes a notch height STH1 and a notch width STW1. The height value of the notch height STH1 is 0.45 mm. The width value of the notch width STW1 is 0.1 mm. In this embodiment, the above distance value, height value, and width value can all be adjusted according to actual requirements in proportion or according to the antenna signal frequency, and are not limited in the present invention.

[0057] Please refer to Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , the antenna signal passes through the substrate assembly CB1 and the first metal bending structure M11 and is transmitted in the shielding cover C1. The transmission direction of the antenna signal is adjusted through the first metal bending structure M11 and the shielding cover C1. That is, the antenna signal is first bent through the guidance of the first metal bending structure M11 and the shielding cover C1. Then, the bent antenna signal is guided by the second part MP2 of the first metal bending structure M11 to form an antenna signal with horizontal polarization.

[0058] From Figure 5 the electric field vector diagram of the sectional line IV-IV, it can be seen that after the electromagnetic wave signal enters from the signal strip line SL1 in the inner layer, the energy is transmitted to the first metal bending structure M11 through the signal metal through hole SPTH, and under the coverage of the shielding cover C1, a bent electric field vector is formed. As Figure 6 shown in the electric field vector diagram of the sectional line V-V of Figure 6 , when the electric field vector advances along the first metal bending structure M11 towards the opening direction of the shielding cover C1, when approaching the opening of the shielding cover C1, due to the gradually decreasing structural characteristics (triangle or trapezoid) of the second part MP2 of the first metal bending structure M11, the electric field vector will gradually change from the folded state to a horizontally polarized state in a single direction (such as Figure 7 the electric field vector diagram of the sectional line V-V in Figure 8 ).

[0059] As for disposing the frame B1 (ㄇ-shaped metal ring) at the opening of the shielding cover C1, it can avoid the diffraction and reflection effects of the electric field vector at the opening edge of the shielding cover C1, thereby reducing energy reflection, increasing the gain of the antenna device AT1 and improving the directivity.

[0060] In addition, please refer to Table 1 below. Table 1 shows the radiation efficiency of the antenna device AT1 of this embodiment at each frequency.

[0061]

[0062] As can be seen from Table 1, the peak realized gain in this embodiment can reach 5.95 dBi at 60 GHz. Without considering the mismatch at the feeding end, the radiation efficiency can reach 94%.

[0063] Please refer to Figure 9 , Figure 9 which is the S-parameter simulation diagram of the antenna device of the first embodiment of the present invention.

[0064] From Figure 9 the S-parameter diagram, it can be clearly seen that the antenna device AT1 of this embodiment has a return loss of more than 10 dB in the frequency band of n263 in the new frequency range 2 (FR2) (57 - 71 GHz), indicating that the antenna device AT1 of this embodiment is very suitable for applications in 5G millimeter waves or higher frequency bands.

[0065] Please refer to Figure 10 and Figure 11 , Figure 10 which are schematic diagrams of the antenna device of the first embodiment of the present invention with a millimeter-wave module. Figure 11 is another schematic diagram of the antenna device of the first embodiment of the present invention with a millimeter-wave module.

[0066] In Figure 10 and Figure 11 , multiple antenna devices AT1 can be disposed adjacent to each other, and the substrate assemblies CB1 of the multiple antenna devices AT1 can be disposed on the same circuit board. In addition, the millimeter-wave module MMW1 can be disposed on the same side of the antenna device AT1 ( Figure 11 ) or the opposite side ( Figure 10 ).

[0067] [Second Embodiment]

[0068] Please refer to Figure 12 , Figure 12 which is a schematic diagram of the electronic device of the second embodiment of the present invention.

[0069] In this embodiment, an electronic device ED1 is provided.

[0070] The electronic device ED1 includes a housing ECH1, a control circuit CR1, and an antenna device AT2. The control circuit CR1 and the antenna device AT2 are both disposed in the housing ECH1.

[0071] The antenna device AT2 has the same structure and function as the antenna device AT1 in the first embodiment, and will not be described herein again. The antenna device AT2 is electrically connected to the control circuit CR1 to receive an antenna signal. The antenna signal can be transmitted according to the position and direction of the antenna device AT2.

[0072] The electronic device ED1 is a smart phone, a tablet computer, a wearable electronic device, or a desktop electronic device.

[0073] [Third Embodiment]

[0074] Please refer to Figure 13 , Figure 13 which is a schematic diagram of the electronic device according to the third embodiment of the present invention.

[0075] In this embodiment, an electronic device ED2 is provided.

[0076] The electronic device ED2 includes a housing ECH2, a control circuit CR2, and an antenna module ATM1. The antenna module ATM1 and the control circuit CR2 are disposed in the housing ECH2. The antenna module ATM1 includes a plurality of antenna devices AT3.

[0077] The plurality of antenna devices AT3 of the antenna module ATM1 are electrically connected to the control circuit CR2 to receive antenna signals. The antenna signals can be transmitted according to the position and direction of the antenna devices AT3.

[0078] The antenna device AT3 in this embodiment has the same structure and function as the antenna device AT1 in the first embodiment, and will not be described herein again. However, the plurality of antenna devices AT3 in this embodiment are adjacently arranged, and the opening directions of the respective shielding covers C1 and the frames B1 of the plurality of antenna devices AT3 are all towards the same side. In addition, the height of the plurality of antenna devices AT3 in the antenna module ATM1 of this embodiment is only less than 5 mm (substrate assembly CB1 (less than 1 mm) + shielding cover C1 (2.9 mm) + frame B1 (1 mm) < 5 mm), which is very suitable for being disposed on the side of the electronic device ED2 for antenna signal transmission and will not increase or affect the thickness of the electronic device ED2.

[0079] In this embodiment, the electronic device ED2 is a smart phone, a tablet computer, a wearable electronic device, or a desktop electronic device.

[0080] [Fourth Embodiment]

[0081] Please refer to Figure 14 , Figure 14 which is a schematic diagram of an electronic device according to the fourth embodiment of the present invention.

[0082] In this embodiment, an electronic device ED3 is provided.

[0083] The electronic device ED3 includes a housing ECH3, a control circuit CR3, a first antenna device AT4, and a second antenna device AT5.

[0084] In this embodiment, the first antenna device AT4 and the second antenna device AT5 are electrically connected to the control circuit CR3 to receive antenna signals. Moreover, the structures and functions of the first antenna device AT4 and the second antenna device AT5 are similar to those of the antenna device AT1 in the first embodiment, and will not be elaborated here. However, in this embodiment, the first antenna device AT4 and the second antenna device AT5 are arranged in different directions. The shielding cover C1 and the frame B1 of the first antenna device AT4 face a first direction DR1, and the opening of the shielding cover C1 and the frame B1 of the second antenna device AT5 faces a second direction DR2. That is, the antenna signal can be transmitted from the first antenna device AT4 facing the first direction DR1, or can be transmitted from the second antenna device AT5 facing the second direction DR2, which can increase the possibility of the transmission direction of the antenna signal. In other embodiments, the first antenna device AT4 and the second antenna device AT5 can respectively receive antenna signals of different modules for signal transmission in different directions.

[0085] [Advantages of the Embodiment]

[0086] One of the advantages of the present invention lies in the antenna device and the electronic device provided by the present invention. The antenna device of the present invention uses a shielding cover design that can use surface mount technology to convert the antenna signal (RF signal) from the inner layer circuit of the multi-layer circuit board in the substrate assembly to the waveguide structure on the substrate assembly. Then, the antenna device of the present invention allows the electromagnetic wave (electric field vector) of the antenna signal to radiate directly outward in the horizontal direction and provides better performance than the antenna-in-package.

[0087] The content disclosed above is only the preferred feasible embodiment of the present invention, and does not limit the claims of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the claims of the present invention.

Claims

1. An antenna device, characterized in that, Comprising: A substrate assembly including a plurality of metal vias and at least one signal metal via; A first metal bending structure including a first portion and a second portion, the second portion connecting the first portion, the second portion being parallel to the substrate assembly, and the first portion being connected and disposed on the substrate assembly; A shielding cover disposed on the substrate assembly and shielding the first metal bending structure, one side of the shielding cover close to the first portion of the first metal bending structure being closed, and the other side of the shielding cover far from the first portion of the first metal bending structure being open and having an opening; and A frame disposed on the substrate assembly, the frame connecting the shielding cover; Wherein, the substrate assembly is connected to a control circuit to receive an antenna signal, and the antenna signal passes through the signal metal via of the substrate assembly and is transmitted to the first metal bending structure for adjusting the transmission direction and then transmitted.

2. The antenna device according to claim 1, characterized in that, The second portion of the first metal bending structure is a triangle or a trapezoid, and a width of the second portion of the first metal bending structure is gradually decreasing.

3. The antenna device according to claim 2, wherein, One side of the first metal bending structure is connected to an inner sidewall of the shielding cover.

4. The antenna device according to claim 3, characterized in that, The first portion of the first metal bending structure includes a first notch, the first notch being disposed on a side where the first portion is connected to the substrate assembly, and the first portion is divided into two sub-portions according to the first notch, the first portion including a first sub-portion and a second sub-portion, and the second sub-portion being connected to the inner sidewall of the shielding cover.

5. The antenna device according to claim 4, characterized in that, The substrate assembly includes a multilayer circuit board, a signal strip line, a pad, at least one signal metal via and a plurality of metal vias, the signal strip line being disposed in an intermediate layer of the multilayer circuit board, the signal strip line being connected to the pad through the signal metal via, and the first sub-portion being connected to the pad to receive the antenna signal.

6. The antenna device according to claim 5, characterized in that, The substrate assembly includes a first side and a second side, the plurality of metal vias on the first side of the substrate assembly are arranged symmetrically in pairs along a first direction, and the plurality of metal vias on the second side of the substrate assembly are arranged in two rows along a second direction, and the first direction and the second direction are perpendicular to each other.

7. The antenna device according to claim 6, characterized in that, The frame includes a frame width and a frame height, the shielding cover includes a shielding cover width and a shielding cover height, the frame width is the shielding cover width plus twice a predetermined width, the frame height is the shielding cover height plus a predetermined height, a width value of the predetermined width is 1 mm, a height value of the predetermined height is 1 mm, and the frame further includes a frame thickness, and a thickness value of the frame thickness is 1 mm.

8. An electronic device, characterized in that, Comprising: A control circuit; And At least one antenna device, the at least one antenna device being electrically connected to the control circuit to receive an antenna signal, and the at least one antenna device including: A substrate assembly including a plurality of metal vias and at least one signal metal via; A first metal bending structure includes a first part and a second part. The second part is connected to the first part. The second part is parallel to the substrate assembly, and the first part is connected and disposed on the substrate assembly. A shielding cover is disposed on the substrate assembly and shields the first metal bending structure. One side of the shielding cover close to the first part of the first metal bending structure is closed, and the other side of the shielding cover away from the first part of the first metal bending structure is open and has an opening. And A frame is disposed on the substrate assembly, and the frame is connected to the shielding cover. Wherein, the substrate assembly is connected to a control circuit to receive an antenna signal. The antenna signal is transmitted through the signal metal via hole of the substrate assembly to the first metal bending structure for adjusting the transmission direction and then transmitted.

9. An electronic device, characterized in that, Comprising: A control circuit; A first antenna device electrically connected to the control circuit to receive an antenna signal; And A second antenna device electrically connected to the control circuit to receive the antenna signal; The first antenna device and the second antenna device respectively include: A substrate assembly including a plurality of metal vias and at least one signal metal via; A first metal bending structure includes a first part and a second part. The second part is connected to the first part. The second part is parallel to the substrate assembly, and the first part is connected and disposed on the substrate assembly. A shielding cover is disposed on the substrate assembly and shields the first metal bending structure. One side of the shielding cover close to the first part of the first metal bending structure is closed, and the other side of the shielding cover away from the first part of the first metal bending structure is open and has an opening. And A frame is disposed on the substrate assembly, and the frame is connected to the shielding cover. Wherein, the antenna signal is transmitted through the signal metal via hole of the substrate assembly to the first metal bending structure for adjusting the transmission direction and then transmitted; Wherein, the antenna signal of the first antenna device is transmitted along a first direction, and the antenna signal of the second antenna device is transmitted along a second direction. The first direction and the second direction are different directions.

10. The electronic device according to claim 9, wherein The first direction and the second direction are perpendicular to each other.

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