Computing device and active cable connector of computing device

Abstract

The embodiment of the invention provides computing equipment and an active cable connector of the computing equipment. The computing equipment comprises a main board, a power supply module and a power supply module, the circuit board comprises a first surface and a second surface, and the first surface is perpendicular to the second surface; the circuit board is used for being inserted into the socket, the circuit board is provided with signal golden fingers and power supply golden fingers, the signal golden fingers are arranged on the first surface and arranged at one end, facing the socket, of the circuit board, the signal golden fingers are connected with signal wires on the circuit board, and the signal golden fingers are configured to be in electric signal connection with the socket; the power supply golden finger is arranged in a first area which is arranged on the second surface and is used for being contacted with a socket; the power supply golden finger is connected with a power supply wire on the circuit board, and the power supply golden finger is configured to be electrically connected with the socket. The influence of power supply of an active chip on signal transmission can be reduced, and the signal transmission density of the active cable can be improved.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of servers, and in particular, to a computing device and an active cable connector for the computing device. Background Art

[0002] In the field of data centers, due to the growing demand for high-speed data transmission and long-distance transmission, the interconnection bandwidth is continuously increasing, the transmission frequency is continuously rising, and the transmission distance of passive electrical signals is becoming shorter and shorter. Therefore, active cables have become an ideal solution. By adding active chips, active cables modulate and amplify attenuated electrical signals, thereby increasing the transmission distance of the cables.

[0003] In related technologies, to supply power to the active chips, power supply gold fingers are usually arranged next to the signal gold fingers, or power supply gold fingers are arranged at intervals of a certain number of signal gold fingers.

[0004] However, in related technologies, when the size of the circuit board remains unchanged, adding power supply gold fingers will occupy the setting space of the signal gold fingers, affecting the setting density of the signal gold fingers, and thus affecting the signal transmission density of the active cable. Summary of the Invention

[0005] Embodiments of the present application provide a computing device and an active cable connector for the computing device, which can reduce the influence of power supply to the active chips on signal transmission and improve the signal transmission density of the active cable.

[0006] To achieve the above object, the embodiments of the present application adopt the following technical solutions:

[0007] On the one hand, an embodiment of the present application provides a computing device, including:

[0008] A main board provided with a socket;

[0009] A circuit board, the circuit board includes a first surface and a second surface, and the first surface and the second surface are perpendicular to each other; the circuit board is for being inserted into the socket, the circuit board is provided with signal gold fingers and power supply gold fingers, the signal gold fingers are arranged on the first surface and are arranged at one end of the circuit board facing the socket, the signal gold fingers are connected to signal traces on the circuit board, and the signal gold fingers are configured to be electrically connected to the socket; the power supply gold fingers are arranged in a first area on the second surface for contacting the socket;

[0010] The power supply gold fingers are connected to power supply traces on the circuit board, and the power supply gold fingers are configured to be electrically connected to the socket.

[0011] In the embodiments of the present application, by providing signal gold fingers and power supply gold fingers on the circuit board, the signal gold fingers are arranged on the first surface of the circuit board at the end facing the socket. In this way, after the circuit board is inserted into the socket, the signal gold fingers can be electrically connected to the socket and receive the electrical signals transmitted by the main board; the signal gold fingers are connected to the signal traces on the circuit board. In this way, the electrical signals transmitted by the main board can be transmitted to the active chip through the signal traces, and the active chip modulates and amplifies the attenuated electrical signals; the power supply gold fingers are provided on the second surface of the circuit board, and the second surface is perpendicular to the first surface; and the power supply gold fingers are arranged in the first area on the second surface for contacting the socket, and the power supply gold fingers are connected to the power supply traces on the circuit board, so as to be connected to the power supply pins of the active chip through the power supply traces; after the circuit board is inserted into the socket, the power supply gold fingers can be electrically connected to the socket, so as to supply power to the active chip. In the embodiments of the present application, since the power supply gold fingers are provided on the second surface of the circuit board; therefore, when designing the signal gold fingers at the end of the circuit board facing the socket, there is no need to reserve space for setting the power supply gold fingers. That is to say, the power supply gold fingers do not occupy the setting space of the signal gold fingers. Without changing the size of the circuit board, the setting density of the signal gold fingers can be ensured, thereby ensuring the active signal transmission density.

[0012] In addition, since the power supply gold fingers are provided on the second surface of the circuit board and the size of the circuit board remains unchanged, there is no need to change the size of the socket, so that the socket can be compatible with the circuit boards of active cable connectors and the circuit boards of passive cable plugs, improving the applicable range of the socket on the main board and enhancing the usability and versatility of the socket.

[0013] In addition, by providing the signal gold fingers on the first surface of the circuit board and the power supply gold fingers on the second surface intersecting with the first surface; that is to say, the power supply gold fingers and the signal gold fingers are located on different surfaces of the circuit board; in this way, the distance between the power supply gold fingers and the signal gold fingers can be increased, and the interference of the power supply signal on the signal transmitted by the signal gold fingers can be reduced, improving the signal integrity.

[0014] In one implementation, the circuit board has a protruding portion that protrudes from the end face of the circuit board along the length direction; the first area includes:

[0015] A first sub-surface that perpendicularly intersects the arrangement area formed by the signal gold fingers arranged along the first surface;

[0016] A second sub-surface that is located on the end face of the protruding portion facing the socket and intersects the first sub-surface; the power supply gold fingers are provided on at least one of the first sub-surface and the second sub-surface.

[0017] In the embodiment of the present application, a protrusion is provided on the end surface of the circuit board along the length direction. Thus, after the circuit board is inserted into the socket, the protrusion can abut against the edge of the socket port of the socket, so as to limit the position of the circuit board and ensure that the signal gold finger maintains good contact with the signal spring on the socket.

[0018] The area perpendicularly intersecting the arrangement area formed by the arrangement direction of the gold fingers is used as the first sub-surface of the first area, and the end surface of the protrusion facing the socket is used as the second sub-surface of the first area; the power supply gold finger is arranged on at least one of the first sub-surface and the second sub-surface. In this way, after the circuit board is inserted into the socket, the power supply gold finger can be in conductive contact with the conductive shell of the socket, or the power supply gold finger can be in contact with the power supply spring in the inner wall of the socket that is not on the same surface as the signal spring, which will not affect the size of the socket along the arrangement direction of the signal spring, and can improve the compatibility of the socket with active cable connectors and passive cable plugs.

[0019] In one implementation, a power supply gold finger is disposed on a first sub-surface, and a slot of the socket includes a first side wall and a second side wall; when a circuit board is inserted into the socket, the first side wall contacts the first surface, and the second side wall contacts the first sub-surface, and a power supply spring is disposed on the second side wall, and the power supply spring is connected to a switching power supply on the mainboard; the power supply gold finger is configured to be in conductive contact with the power supply spring.

[0020] By setting the power supply gold finger on the first sub-surface and setting the power supply spring sheet on the second side wall of the socket slot opposite to the first sub-surface, the power supply spring sheet and the signal spring sheet are located in different planes, and the power supply spring sheet will not affect the size of the socket; in addition, after the circuit board is inserted into the socket, the power supply spring sheet abuts against the power supply gold finger, which can ensure the stability of the conductive contact between the power supply spring sheet and the power supply gold finger.

[0021] In one implementation, the power supply gold finger is arranged on the second sub-surface, the socket has a conductive shell, and the conductive shell is connected to the switching power supply on the mainboard; the power supply gold finger is configured to be in conductive contact with the conductive shell.

[0022] By setting the power supply gold finger on the second sub-surface, after the circuit board is inserted into the socket, the power supply gold finger can abut against the conductive shell of the socket. In other words, the metal shell of the socket can be directly connected to the power switch box on the motherboard to supply power to the active chip. There is no need to make changes to the socket, which can save the processing and production cost of the socket and improve the compatibility of the socket with active cable connectors and passive cable connectors.

[0023] In one implementation, the first area includes two, which are respectively located at two ends of the arrangement area; the power supply gold finger includes: two conductive parts, the conductive polarities of the two conductive parts are opposite; the two conductive parts are respectively arranged on different first areas.

[0024] In the embodiment of the present application, by setting two first regions at both ends of the arrangement region and disposing two conductive members with different conductive polarities in different first regions, the distance between the two conductive members can be increased, the influence on the signal transmitted on the signal gold finger when current flows through the two conductive members can be reduced, and the signal integrity is improved.

[0025] In one implementation, the power supply gold finger includes two conductive members, one of the two conductive members is disposed on the first sub-surface; the other of the two conductive members is disposed on the second sub-surface.

[0026] In this way, the conductive member can be disposed in one of the first regions. Only the conductive member needs to be set in one of the first regions, which simplifies the setting of the conductive member and improves the setting efficiency of the conductive member.

[0027] In one implementation, the power supply trace includes:

[0028] A first power supply trace connected to one of the two conductive members;

[0029] A second power supply trace connected to the other of the two conductive members, and the signal trace is located between the first power supply trace and the second power supply trace.

[0030] In the embodiment of the present application, the first power supply trace is connected to one of the two conductive members, and the second power supply trace is connected to the other of the two conductive members. In this way, the signal trace can be located between the first power supply trace and the second power supply axis, increasing the distance between the first power supply trace and the second power supply trace, and reducing the influence on the signal transmitted on the signal trace when current flows through the first power supply trace and the second power supply trace, thereby improving the signal integrity.

[0031] On the other hand, the embodiment of the present application provides an active cable connector for a computing device, including:

[0032] A circuit board, the circuit board includes a first surface and a second surface which are perpendicular to each other. The circuit board is provided with a signal gold finger and a power supply gold finger. The signal gold finger is arranged on the first surface and is disposed at one end of the circuit board. The signal gold finger is connected to the signal trace on the circuit board and is configured to be electrically connected to the socket on the main board of the computing device; the power supply gold finger is disposed in the first region on the second surface for connecting to the socket; the power supply gold finger is connected to the power supply trace on the circuit board and is configured to be electrically connected to the socket.

[0033] In the embodiments of the present application, by providing signal gold fingers and power supply gold fingers on the circuit board, the signal gold fingers are arranged on the first surface of the circuit board at the end facing the socket. In this way, after the circuit board is inserted into the socket, the signal gold fingers can be electrically connected to the socket and receive the electrical signals transmitted by the main board; the signal gold fingers are connected to the signal traces on the circuit board. In this way, the electrical signals transmitted by the main board can be transmitted to the active chip through the signal traces, and are modulated by the active chip and amplified for the attenuated electrical signals; the power supply gold fingers are provided on the second surface of the circuit board, and the second surface is perpendicular to the first surface; and the power supply gold fingers are arranged in the first area on the second surface for contacting the socket, and the power supply gold fingers are connected to the power supply traces on the circuit board, so as to be connected to the power supply pins of the active chip through the power supply traces; after the circuit board is inserted into the socket, the power supply gold fingers can be electrically connected to the socket, so as to supply power to the active chip. In the embodiments of the present application, since the power supply gold fingers are provided on the second surface of the circuit board; therefore, when designing the signal gold fingers at the end of the circuit board facing the socket, there is no need to reserve space for setting the power supply gold fingers. That is to say, the power supply gold fingers do not occupy the setting space of the signal gold fingers. Without changing the size of the circuit board, the setting density of the signal gold fingers can be ensured, thereby ensuring the active signal transmission density.

[0034] In addition, since the power supply gold fingers are provided on the second surface of the circuit board and the size of the circuit board remains unchanged, there is no need to change the size of the socket, so that the socket can be compatible with the circuit boards of active cable connectors and the circuit boards of passive cable plugs, improving the applicable range of the socket on the main board and enhancing the usability and versatility of the socket.

[0035] In addition, by providing the signal gold fingers on the first surface of the circuit board and the power supply gold fingers on the second surface intersecting with the first surface; that is to say, the power supply gold fingers and the signal gold fingers are located on different surfaces of the circuit board; in this way, the distance between the power supply gold fingers and the signal gold fingers can be increased, the interference of the power supply signal on the signal transmitted by the signal gold fingers can be reduced, and the signal integrity is improved.

[0036] In one implementation, it further includes:

[0037] An active chip; provided on the circuit board, the signal pins of the active chip are connected to the signal traces, and the power supply pins of the active chip are connected to the power supply traces.

[0038] In one implementation, the circuit board has a protrusion, and the protrusion is on the end face of the circuit board along the span direction;

[0039] The first area includes:

[0040] A first sub-surface, the first sub-surface is vertically intersected with the arrangement area formed by the signal gold fingers arranged along the first surface;

[0041] The second sub-surface is located at the end surface of the protrusion facing the socket, and the second sub-surface intersects with the first sub-surface; the second sub-surface intersects with the first sub-surface; and the power supply gold finger is arranged on at least one of the first sub-surface and the second sub-surface.

[0042] In the embodiment of the present application, a protrusion is provided on the end surface of the circuit board along the length direction. Thus, after the circuit board is inserted into the socket, the protrusion can abut against the edge of the socket port of the socket, so as to limit the position of the circuit board and ensure that the signal gold finger maintains good contact with the signal spring on the socket.

[0043] The area perpendicularly intersecting the arrangement area formed by the arrangement direction of the gold fingers is used as the first sub-surface of the first area, and the end surface of the protrusion facing the socket is used as the second sub-surface of the first area; the power supply gold finger is arranged on at least one of the first sub-surface and the second sub-surface. In this way, after the circuit board is inserted into the socket, the power supply gold finger can be in conductive contact with the conductive shell of the socket, or the power supply gold finger can be in contact with the power supply spring in the inner wall of the socket that is not on the same surface as the signal spring, which will not affect the size of the socket along the arrangement direction of the signal spring, and can improve the compatibility of the socket with active cable connectors and passive cable plugs. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a schematic diagram of the structure of the active cable connector and the mainboard in the computing device provided by some embodiments of the present application;

[0045] Figure 2 It is a schematic diagram of an exploded structure of an active cable connector and a mainboard in a computing device provided by some embodiments of the present application;

[0046] Figure 3 is a schematic diagram of a structure of an active cable connector in a computing device provided in some embodiments of the present application;

[0047] Figure 4 is another structural schematic diagram of an active cable connector in a computing device provided in some embodiments of the present application;

[0048] Figure 5 It is a schematic diagram of an exploded structure of an active cable connector and a socket in a computing device provided by some embodiments of the present application;

[0049] Figure 6 yes Figure 5 A partial enlarged view of point A in the middle;

[0050] Figure 7 is a schematic diagram of the structure of a socket in a computing device provided in some embodiments of the present application;

[0051] Figure 8It is a top view of a socket in a computing device provided by some embodiments of the present application;

[0052] Figure 9 It is a cross-sectional view along line B-B in Figure 8 ;

[0053] Figure 10 It is Figure 9 a partial enlarged view at C in

[0054] Figure 11 It is another schematic structural diagram of an active cable connector in a computing device provided by some embodiments of the present application;

[0055] Figure 12 It is Figure 11 a partial enlarged view at D in

[0056] Explanation of reference numerals:

[0057] 10 - main board; 20 - circuit board; 30 - active chip;

[0058] 110 - socket; 210 - signal finger; 220 - power supply finger; 230 - layout area; 240 - protrusion;

[0059] 111 - slot; 112 - signal spring piece; 113 - power supply spring piece; 201 - first surface; 202 - second surface; 221 - conductive part;

[0060] 2021 - first sub - surface; 2022 - second sub - surface. Detailed implementation manners

[0061] Next, the technical solutions in the embodiments of the present application will be described in conjunction with the accompanying drawings in the embodiments of the present application. For the convenience of clearly describing the technical solutions in the embodiments of the present application, the first, second, etc. descriptions that appear in the embodiments of the present application are only for schematic and distinguishing the described objects, without order, and do not represent the special limitation on the number of devices in the embodiments of the present application, and cannot constitute any limitation on the embodiments of the present application.

[0062] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0063] It should be noted that many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited by the specific embodiments disclosed below.

[0064] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "horizontal", "bottom", "inner", "outer" (if any) is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium.

[0065] In the present application, unless otherwise clearly specified and limited, terms such as "connected", "coupled", "fixed" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements. However, indicating a direct connection means that there is no connection relationship constructed through an excessive structure between the two connected main bodies, and they are only connected through the connection structure to form a whole. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0066] In the present application, descriptions such as "first", "second" and the like are only for descriptive purposes and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include at least one such feature.

[0067] Figure 1 It is a schematic structural diagram of the cooperation between the active cable connector and the main board in the computing device provided by some embodiments of the present application.

[0068] Computing devices now play important roles such as data storage, information interaction, and instruction control in various industries. Computing devices may include rack servers, cabinet servers, high-density servers, blade servers, etc. It can be understood that in the embodiments of the present application, the types of computing devices are only shown as a specific example and do not limit the specific types of computing devices.

[0069] In some examples, a computing device can be applied to process and transmit data in a data center. Currently, due to the growing demands for high-speed data transmission and long-distance transmission, etc., the Internet bandwidth is continuously increasing, the transmission frequency is continuously rising, and the transmission distance of passive electrical signals is becoming shorter and shorter.

[0070] In some examples, the data transmission rate of the Internet has increased from the traditional 8 Gigabits per second (Gbps) to the current 112 Gbps, and the cable transmission distance of passive electrical signals has decreased from 3 m to 1 m.

[0071] In some examples, a passive signal refers to a signal that can be transmitted without external energy input. A passive signal itself can carry energy and can propagate in a medium. In electronic communication, a passive signal can usually be generated by natural phenomena such as electromagnetic waves.

[0072] In some examples, an active signal refers to a signal source that can generate electrical energy by itself and is usually used for current signals. In a circuit, an active signal is often used in fields such as amplification, oscillation, and driving.

[0073] In some examples, to meet the demand for data transmission distance, a signal is transmitted through an active cable. The active cable modulates and amplifies the attenuated electrical signal by adding an active chip 30, thereby increasing the transmission distance of the cable. That is, the active cable generates an active signal by adding an active chip. In some examples, referring to Figure 1 as shown, the computing device can include a main board 10. Electronic components can be arranged on the main board 10.

[0074] In some examples, the main board 10 can be an integrated circuit board 20.

[0075] In some examples, the main board 10 can be a printed circuit board 20 (Printed Circuit Board, abbreviated as PCB).

[0076] It can be understood that in some examples of the embodiments of the present application, the type of the main board 10 is only shown as some specific examples and does not limit the specific type of the main board 10.

[0077] In some examples, referring to Figure 1 as shown, a socket 110 can be provided on the main board 10.

[0078] Figure 2 is an exploded structural schematic diagram of the cooperation between an active cable connector and a main board in a computing device provided in some embodiments of the present application.

[0079] In some examples, referring to Figure 2As shown, the socket 110 may be provided with a slot 111. The slot 111 may be configured to receive a live cable connector. That is, the live cable interface may be inserted into the slot 111 of the socket 110, so as to realize the connection between the live cable and the main board 10.

[0080] In some examples, referring to Figure 1 and Figure 2 As shown, the live cable connector may include a circuit board 20. The circuit board 20 may be inserted into the socket 110. The circuit board 20 may be inserted into the slot 111 of the socket 110.

[0081] In some examples, the circuit board 20 may be an integrated circuit board 20.

[0082] In some examples, the circuit board 20 may be a PCB.

[0083] It can be understood that in some examples of the embodiments of the present application, the type of the circuit board 20 is only shown as some specific examples, and is not a limitation on the specific type of the short circuit board.

[0084] In some examples, referring to Figure 2 As shown, the circuit board 20 is provided with signal fingers 210. The signal fingers 210 may be arranged at one end of the circuit board 20 facing the socket 110.

[0085] In some examples, the signal fingers 210 may be connected to signal traces (not shown in the figure) on the circuit board 20. In this way, the signal fingers 210 can transmit electrical signals to the signal traces. In addition, the signal fingers 210 can receive electrical signals from the signal traces.

[0086] In some examples, the signal fingers 210 may be configured to be electrically connected to the socket 110. In this way, the electrical signals on the main board 10 can be transmitted to the signal fingers 210 through the socket 110 and transmitted through the signal traces.

[0087] In some examples, to increase the signal transmission distance of the live cable, referring to Figure 1 and Figure 2 As shown, the live cable connector may include an active chip 30. Generally, an active chip 30 is added to the live cable connector. By modulating the electrical signals through the active chip 30 and amplifying the attenuated electrical signals, the signal transmission distance of the live cable can be increased.

[0088] In some examples, the active chip 30 may be disposed on the circuit board 20 by means of surface mounting.

[0089] In some examples, the signal pins of the active chip 30 may be connected to the signal traces. Thus, the electrical signals transmitted by the signal fingers 210 are processed (such as modulating or amplifying the electrical signals).

[0090] In some examples, to supply power to the active chip 30, a power supply finger 220 may be provided on the circuit board 20. The power supply finger 220 may be configured to be connected to a power supply trace (not shown in the figure) on the circuit board 20.

[0091] In some examples, the power supply finger 220 may be configured to be electrically connected to the socket 110. In this way, the switching power supply on the main board 10 can transmit current to the power supply finger 220 through the socket 110, and the power supply finger 220 transmits the current to the power supply trace.

[0092] In some examples, the power supply pin of the active chip 30 may be connected to the power supply trace on the circuit board 20. In this way, the power supply trace can supply power to the active chip 30.

[0093] An embodiment of the present application provides an active cable connector for a computing device. To ensure the setting density of the signal finger 210 and ensure the signal transmission density of the active signal. The active cable connector of the computing device may include a circuit board 20. The circuit board 20 may include a first surface 201 and a second surface 202 that are perpendicular to each other; the signal finger may be provided on the first surface 201 and is provided at one end of the circuit board 20 facing the socket 110. The power supply finger 220 may be provided in a first area on the second surface 202 for contacting the socket 110. In this way, the setting of the power supply finger 220 does not need to occupy the layout space of the signal finger 210. When designing the signal finger 210 on the circuit board 20, there is no need to reserve space for setting the power supply finger 220. That is to say, the power supply finger 220 does not occupy the setting space of the signal finger 210. Without changing the size of the circuit board 20, the setting density of the signal finger 210 can be ensured, thereby ensuring the signal transmission density of the active cable. In addition, since the power supply finger 220 is provided on the second surface 202 and the size of the circuit board 20 remains unchanged, there is no need to change the size of the socket 110, so that the socket 110 can be compatible with the circuit board 20 of the active cable connector and the circuit board 20 of the passive cable plug, improving the applicable range of the socket 110 on the main board 10 and improving the usability and versatility of the socket 110.

[0094] Figure 3 It is a schematic structural diagram of an active cable connector in a computing device provided by some embodiments of the present application. Figure 4 It is another schematic structural diagram of an active cable connector in a computing device provided by some embodiments of the present application.

[0095] In some examples, referring to Figures 2 - 4 As shown, the signal finger 210 may be along the length direction of the circuit board 20 (for example Figure 2 the direction shown by the x-axis in Figure 3arranged in the direction shown by the y-axis in the figure), and the signal gold fingers 210 can be arranged at one end of the circuit board 20 facing the socket 110.

[0096] In some examples, to improve the signal transmission density, along the length direction of the circuit board 20 (for example Figure 2 the direction shown by the x-axis in the figure, or Figure 3 the direction shown by the y-axis in the figure), signal gold fingers 210 are arranged on the entire end of the circuit board 20 facing the socket 110.

[0097] In some examples, referring to Figures 2 - 4 as shown, the circuit board 20 may have a first surface 201. The first surface 201 may be the board surface of the circuit board 20. Electronic components may be arranged on the first surface 201. The electronic components may include components such as resistors, capacitors, and inductors.

[0098] In some examples, taking Figure 2 as an example for illustration. The first surface 201 may be one of the surfaces of the circuit board 20 along Figure 2 the direction shown by the y-axis in the figure.

[0099] In some examples, taking Figure 2 as an example for illustration. The first surface 201 may be the two surfaces of the circuit board 20 along Figure 2 the direction shown by the y-axis in the figure. The two first surfaces 201 may be arranged oppositely.

[0100] It can be understood that in some examples of the embodiments of the present application, the types of the electronic components are only shown as some specific examples, and are not intended to limit the specific types of the electronic components.

[0101] In some examples, referring to Figure 3 as shown, the first surface 201 may be Figure 3 the plane formed by the x-axis and the y-axis in the figure. Or, it can also be understood that the first surface 201 may be a surface parallel to the plane formed by the x-axis and the y-axis in the figure. In other words, the first surface 201 may be the two surfaces along the thickness direction of the circuit board 20. Figure 3 the plane formed by the x-axis and the y-axis in the figure.

[0102] In some examples, referring to Figures 2 - 4 as shown, the signal gold fingers 210 may be arranged on the first surface 201. It can be understood that the arrangement manner of the signal gold fingers 210 on the first surface 201 may refer to the arrangement manner in the related art. For example, it may be formed on the first surface 201 by copper foil pressing, or may be formed on the first surface 201 by etching. The embodiments of the present application will not elaborate on the arrangement manner of the signal gold fingers 210 on the first surface 201.

[0103] In some examples, referring to Figures 2 - 4 as described, the circuit board 20 may have a second surface 202. The second surface 202 and the first surface 201 may be perpendicular to each other. For example, taking Figure 3 as an example, the second surface 202 may be Figure 3 the plane formed by the x-axis and the z-axis in

[0104] In some examples, taking Figure 3 as an example, the second surface 202 may be Figure 3 the plane formed by the y-axis and the z-axis in

[0105] In some examples, the second surface 202 may be a bent surface. For example, taking Figure 3 as an example, a part of the second surface 202 may be parallel to Figure 3 the plane formed by the x-axis and the z-axis in Figure 3 and another part of the second surface 202 may be parallel to

[0106] In some examples, the second surface 202 may be the surface formed by the end face of the circuit board 20 along the length direction. That is to say, the second surface 202 may be the surface connecting the two first surfaces 201.

[0107] In some examples, referring to Figure 3 as shown, the second surface 202 may be Figure 3 the surface formed by the x-axis and the z-axis in Figure 3 or the second surface 202 may be parallel to

[0108] In some examples, referring to Figures 2 - 4 as shown, the power supply gold fingers 220 may be disposed in the first area on the second surface 202 for connecting to the socket 110. That is to say, the power supply gold fingers 220 and the signal gold fingers 210 are respectively disposed on different surfaces of the circuit board 20. In this way, the power supply gold fingers 220 do not need to occupy the space of the signal gold finger arrangement area 230. In addition, since the power supply gold fingers 220 and the signal gold fingers 210 are respectively located on different surfaces of the circuit board 20, the distance between the signal gold fingers 210 and the power supply gold fingers 220 can be increased, and the interference of the power signal to the electrical signal transmitted on the signal gold fingers can be reduced.

[0109] In the embodiments of the present application, the signal gold finger 210 is disposed on the first surface 201 of the circuit board 20, and the power supply gold finger 220 is disposed on the second surface 202 intersecting the first surface 201; that is to say, the power supply gold finger 220 and the signal gold finger 210 are located on different surfaces of the circuit board 20; thus, the distance between the power supply gold finger 220 and the signal gold finger 210 can be increased, the interference of the power signal on the signal transmitted by the signal gold finger 210 can be reduced, and the signal integrity is improved.

[0110] In the embodiments of the present application, by disposing the signal gold finger 210 and the power supply gold finger 220 on the circuit board 20, the signal gold finger 210 is arranged on the first surface 201 of the circuit board 20 facing one end of the socket 110. Thus, after the circuit board 20 is inserted into the socket 110, the signal gold finger 210 can be electrically connected to the socket 110 and receive the electrical signal transmitted by the main board 10; the signal gold finger 210 is connected to the signal trace on the circuit board 20. Thus, the electrical signal transmitted by the main board 10 can be transmitted to the active chip 30 through the signal trace, and is modulated by the active chip 30 and the attenuated electrical signal is amplified; the power supply gold finger 220 is disposed on the second surface 202, the second surface 202 is perpendicular to the first surface 201, and the power supply gold finger 220 is connected to the power supply trace on the circuit board 20, so as to be connected to the power supply pin of the active chip 30 through the power supply trace; after the circuit board 20 is inserted into the socket 110, the power supply gold finger 220 can be electrically connected to the socket 110, so as to supply power to the active chip 30. In the embodiments of the present application, since the power supply gold finger 220 is disposed on the second surface 202; therefore, when designing the signal gold finger 210 on the circuit board 20, there is no need to reserve space for setting the power supply gold finger 220, that is to say, the power supply gold finger 220 does not occupy the setting space of the signal gold finger 210. Without changing the size of the circuit board 20, the setting density of the signal gold finger 210 can be ensured, thereby ensuring the active signal transmission density.

[0111] In addition, since the power supply gold finger 220 is disposed on the second surface 202 and the size of the circuit board 20 remains unchanged, there is no need to change the size of the socket 110, so that the socket 110 can be compatible with the circuit board 20 of the active cable connector and the circuit board 20 of the passive cable plug, improving the applicable range of the socket 110 on the main board 10 and improving the usability and versatility of the socket 110.

[0112] Figure 5 FIG. is an exploded structural schematic diagram of the cooperation between the active cable connector and the socket in the computing device provided by some embodiments of the present application. Figure 6 is Figure 5 The partial enlarged view at A in FIG.

[0113] In some examples, with reference to Figures 3 - 6As described above, the circuit board 20 may have a protrusion 240. The protrusion 240 may protrude from an end face of the circuit board 20 along the length direction (for example, Figure 2 the direction shown by the x-axis in

[0114] In some examples, the protrusion 240 may be an integral part of the circuit board 20. For example, after the circuit board 20 is integrally formed, the circuit board 20 may be cut to form the protrusion 240.

[0115] In some examples, referring to Figure 2 as shown, after the circuit board 20 is inserted into the slot 111 of the socket 110, the protrusion 240 may abut against the edge of the slot 111. The protrusion 240 may limit the insertion depth of the circuit board 20 to ensure good contact between the signal gold fingers 210 and the signal elastic pieces 112 in the slot 111.

[0116] In some examples, referring to Figure 3 and Figure 4 as shown, the first region may include a first sub-surface 2021. The first sub-surface 2021 may be provided on an end face of the circuit board 20 along the length direction. Referring to Figure 3 as shown, along the arrangement direction of the signal gold fingers 210 (for example, Figure 3 the direction shown by the y-axis in Figure 3 as shown), the first sub-surface 2021 intersects with the plane formed by the signal gold fingers 210 in their arrangement direction. That is to say, the first sub-surface 2021 may intersect perpendicularly with the arrangement region 230. For example, referring to Figure 3 as shown, the first sub-surface 2021 intersects with the plane formed by the signal gold fingers 210 arranged in the direction of the

[0117] y-axis in Figure 3 and Figure 4 as shown, the power supply gold fingers 220 may be provided on the first sub-surface 2021. The setting manner of the power supply gold fingers 220 may be the same as, similar to, or analogous to that of the signal gold fingers 210. For details, reference may be made to the detailed description of the signal gold fingers 210 in the foregoing embodiments of the present application, and the embodiments of the present application will not be elaborated herein.

[0118] In some examples, the power supply traces may run from the inside of the circuit board 20. For example, the circuit board 20 may be a multi-layer board. The power supply traces may run from the internal layer of the circuit board 20. The power supply traces may extend to the first sub-surface 2021 and be connected to the power supply gold fingers 220.

[0119] In some examples, referring to Figure 6 as shown, the first region may include a second sub-surface 2022. The second sub-surface 2022 may be provided on an end face of the protrusion 240 facing the socket 110.

[0120] In some examples, the second sub-surface 2022 may intersect with the first sub-surface 2021. For example, referring to Figure 3 as shown, the first sub-surface 2021 may extend along the Figure 3 direction shown by the x-axis in Figure 3 and the second sub-surface 2022 may extend along the

[0121] In some examples, referring to Figure 6 as shown, the power supply gold finger 220 may be disposed on the second sub-surface 2022. It can be understood that the power supply gold finger 220 may be disposed on the second sub-surface 2022 in the same, similar or approximate manner as on the first sub-surface 2021. Specifically, reference may be made to the manner in which the power supply gold finger 220 is disposed on the first sub-surface 2021 in the foregoing embodiments of the present application, and the embodiments of the present application will not elaborate on this again.

[0122] In the embodiments of the present application, a protrusion 240 is provided on the side of the circuit board 20. In this way, after the circuit board 20 is inserted into the socket 110, the protrusion 240 can abut against the edge of the socket of the socket 110, and the circuit board 20 can be limited, ensuring good contact between the signal gold finger 210 and the signal elastic piece 112 on the socket 110.

[0123] Along the arrangement direction of the gold fingers, the plane perpendicular to the plane formed by the gold fingers 210 along the arrangement direction is taken as the first sub-surface 2021 of the first region, and the surface where the protrusion 240 intersects with the first sub-surface 2021 is the second sub-surface 2022 of the first region; the power supply gold finger 220 is disposed on at least one of the first sub-surface 2021 and the second sub-surface 2022. In this way, after the circuit board 20 is inserted into the socket 110, the power supply gold finger 220 can form good electrical contact with the socket 110 and will not affect the size of the socket 110 along the arrangement direction of the signal gold fingers 210 (for example Figure 2 the direction shown by the x-axis in Figure 3 or the direction shown by the y-axis in

[0124] Figure 7 is a schematic structural diagram of a socket in a computing device provided by some embodiments of the present application. Figure 8 is a top view of a socket in a computing device provided by some embodiments of the present application. Figure 9 is a cross-sectional view along the Figure 8 B-B line in Figure 10 is Figure 9 a partial enlarged view at C in

[0125] In some examples, the power supply gold finger 220 is provided on the first sub-surface 2021 as an example for illustration. Refer to Figure 3 and Figure 4 As shown, the power supply gold finger 220 can be provided on the first sub-surface 2021.

[0126] In some examples, for the convenience of connecting the power supply gold finger 220 to the power switch on the main board 10 through the socket 110, refer to Figures 7 - 10 As shown, a power supply elastic piece 113 can be provided in the slot 111 of the socket 110. The power supply elastic piece 113 can be connected to the power switch on the main board 10.

[0127] In some examples, the power switch can be a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET for short).

[0128] In some examples, refer to Figure 7 As shown, the inner wall of the slot 111 can include a first side wall (not labeled in the figure). Taking Figure 7 as an example for illustration, the first side wall can be two side walls along the Figure 7 direction shown by the y-axis in. When the circuit board 20 is inserted into the socket 110, the first side wall can be in contact with the first surface 201 of the circuit board 20.

[0129] In some examples, refer to Figure 7 As shown, the inner wall of the slot 111 can include a second side wall (not labeled in the figure). The second side wall can be perpendicular to the first side wall. Taking Figure 7 as an example for illustration, the second side wall can be two side walls along the Figure 7 direction shown by the x-axis in. When the circuit board 20 is inserted into the socket 110, the second side wall can be in contact with the first sub-surface 2021 of the circuit board.

[0130] In some examples, refer to Figure 9 and Figure 10 As shown, the power supply elastic piece 113 can be provided on the second side wall of the slot 111 of the socket 110.

[0131] In some examples, the signal elastic piece 112 can be provided on two first side walls in the width direction of the slot 111 (for example, Figure 7 the direction shown by the y-axis in), and the power supply elastic piece 113 can be provided on two second side walls along the length direction of the slot 111 (for example, Figure 7 the direction shown by the x-axis in).

[0132] In the embodiments of the present application, refer to Figure 3 and Figure 4As shown, by disposing the power supply gold fingers 220 on the first sub-surface 2021, disposing the power supply elastic pieces 113 on the first side wall of the slot 111, and disposing the signal elastic pieces 112 on the second side wall of the slot 111, in this way, the power supply elastic pieces 113 and the signal elastic pieces 112 are located in different planes, and the power supply elastic pieces 113 will not affect the size of the socket 110; in addition, after the circuit board 20 is inserted into the socket 110, the power supply elastic pieces 113 are abutted against the power supply gold fingers 220, which can ensure the stability of the conductive contact between the power supply elastic pieces 113 and the power supply gold fingers 220.

[0133] In some examples, referring to Figure 5 and Figure 6 shown, taking the power supply gold fingers 220 disposed on the second sub-surface 2022 as an example for illustration. Referring to Figure 5 and Figure 6 shown, the power supply gold fingers 220 can be disposed on the second sub-surface 2022.

[0134] In some examples, the socket 110 can have a conductive housing (not shown in the figure). The conductive housing can be connected to the power switch on the main board 10.

[0135] In some examples, the metal housing of the socket 110 in the related art can be used as the conductive housing. The conductive housing can be an aluminum alloy housing, a copper housing, or an aluminum housing, etc. It can be understood that in some examples of the embodiments of the present application, the material of the conductive housing is only shown as some specific examples, and does not limit the material of the conductive housing.

[0136] In some examples, after the circuit board 20 is inserted into the socket 110, the power supply gold fingers 220 can be in conductive contact with the conductive housing. Thereby, the switching power supply on the main board 10 is conducted to the active chip 30, and the active chip 30 is powered.

[0137] In the embodiments of the present application, by disposing the power supply gold fingers 220 on the second sub-surface 2022, after the circuit board 20 is inserted into the socket 110, the power supply gold fingers 220 can be abutted against the conductive housing of the socket 110. That is to say, the metal housing of the socket 110 can be directly connected to the power switch box on the main board 10 and power the active chip 30. There is no need to modify the socket 110, which can save the processing and production cost of the socket 110 and improve the compatibility of the socket 110 with the active cable connector and the passive cable connector.

[0138] In some examples, referring to Figure 3 and Figure 4 described, there can be two second surfaces 202. The two second surfaces 202 can be oppositely arranged. For example, taking Figure 3 as an example for illustration, the two first regions can be along Figure 3The directions shown by the y-axis in the figure are relatively set. That is, in some examples of the embodiments of the present application, there may be two first regions, and the two first regions may be relatively set.

[0139] In some examples, each first region may include a first sub-surface 2021 and a second sub-surface 2022.

[0140] In some examples, Figure 3 One of the second surfaces 202 is shown in the figure. Figure 4 The other second surface 202 is shown in the figure.

[0141] It can be understood that there are also two first sub-surfaces 2021. The two first sub-surfaces 2021 are relatively set. The first sub-surface 2021 intersects with the plane formed by the signal gold fingers 210 in their arrangement direction.

[0142] In some examples, there may be two second sub-surfaces 2022, and the two second sub-surfaces 2022 may be respectively disposed on one side of the two protrusions 240 facing the socket.

[0143] In some examples, referring to Figure 3 and Figure 4 shown, the power supply gold fingers 220 may be disposed on at least one of the two second surfaces 202. Figure 11 It is another schematic structural diagram of the active cable connector in the computing device provided by some embodiments of the present application. Figure 12 It is Figure 11 The partial enlarged view at D in the figure.

[0144] In some examples, referring to Figure 11 shown, the power supply gold fingers 220 may be disposed on one of the two second surfaces 202.

[0145] In some examples, the power supply gold fingers 220 may include two conductive members 221. One of the two conductive members 221 may be disposed on the first sub-surface 2021. The other of the two conductive members 221 may be disposed on the second sub-surface 2022.

[0146] In some examples, referring to Figure 12 shown, one of the conductive members 221 may be disposed on the first sub-surface 2021.

[0147] In some examples, referring to Figure 12 shown, the other conductive member 221 may be disposed on the second sub-surface 2022.

[0148] In some examples, the electrode polarities of the two conductive members 221 may be opposite.

[0149] It can be understood that the power supply to the active chip 30 can be direct current. In some examples, one of the conductive members 221 can be the positive pole of the direct current (in some examples, it can become DC+). The other conductive member 221 can be the negative pole of the direct current (in some examples, it can become DC-).

[0150] In the embodiments of the present application, the two second surfaces 202 intersect with the plane formed by the signal gold fingers 210 in their arrangement direction; the two conductive members 221 of the power supply gold fingers 220 are arranged on one of the two second surfaces 202. In this way, the flexibility of the setting position of the power supply gold fingers 220 is improved, which is convenient for the setting of the power supply gold fingers 220.

[0151] In some examples, referring to Figure 3 as shown, one of the conductive members 221 can be arranged on one of the first sub-surfaces 2021.

[0152] In some examples, referring to Figure 4 as shown, the other conductive member 221 can be arranged on the other first sub-surface 2021.

[0153] In some examples, the two conductive members 221 can be arranged opposite to each other. Taking Figure 3 as an example for illustration, the two conductive members 221 can be arranged opposite to each other along the Figure 3 direction shown by the y-axis in

[0154] In some examples, one of the conductive members 221 can be arranged on one of the second sub-surfaces 2022.

[0155] In some examples, the other conductive member 221 can be arranged on the other second sub-surface 2021. That is to say, the two conductive members 221 can be arranged in parallel along the Figure 3 direction shown by the y-axis at both ends of the arrangement area 230.

[0156] In some examples of the embodiments of the present application, one of the two conductive members 221 with different electrode polarities is arranged on one of the two second surfaces 202, and the other conductive member 221 is arranged on the other of the two second surfaces 202. In this way, the distance between the two conductive members 221 can be increased, the influence on the signal transmitted on the signal gold fingers 210 when current flows through the two conductive members 221 can be reduced, and the signal integrity is improved.

[0157] In some examples, the power supply trace can include a first power supply trace (not shown in the figure). The first power supply trace can be routed from the inner layer of the circuit board 20. The first power supply trace can be connected to one of the conductive members 221.

[0158] In some examples, the power supply trace may include a second power supply trace (not shown in the figure). The second power supply trace may be routed from the inner layer of the circuit board 20. The second power supply trace may be connected to another conductive member 221.

[0159] In some examples, either of the two conductive members 221 may be disposed on both the first sub-surface 2021 and the second sub-surface 2022 simultaneously. That is to say, the conductive member 221 may be arranged in a bent shape, with a part of the conductive member 221 disposed on the first sub-surface 2021 and another part of the conductive member 221 disposed on the second sub-surface 2022. The two conductive members 221 may be disposed on opposite sides of the signal finger 210 arrangement region 230. In this way, the conductive member 221 can be in contact with both the power supply elastic piece 113 on the first side wall of the socket 111 and the conductive housing of the socket 110 simultaneously, increasing the contact area of the conductive member 221 with the socket 110 in electrical connection, and improving the stability of the electrical connection between the conductive member 221 and the socket 110.

[0160] In some examples, the signal trace may be located between the first power supply trace and the second power supply trace.

[0161] In some examples, the signal trace may be routed from the first surface 201.

[0162] In some examples, the signal trace may be routed from the inner layer of the circuit board 20.

[0163] In some examples, the routing arrangement of the power supply traces and signal traces on the circuit board 20 may be the same as, similar to, or analogous to the routing arrangement in the related art, and the embodiments of the present application will not elaborate on this further.

[0164] In some examples of the embodiments of the present application, the first power supply trace is connected to the conductive member 221, and the second power supply trace is connected to the conductive member 221. In this way, the signal trace can be located between the first power supply trace and the second power supply axis, increasing the distance between the first power supply trace and the second power supply trace, reducing the influence of the current flowing through the first power supply trace and the second power supply trace on the signal transmitted on the signal trace, and improving the signal integrity.

[0165] The above-described embodiments are only specific embodiments of the present application and are not used to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the present application shall be included within the protection scope of the present application.

Claims

1. A computing device, characterized in that, Comprising: A main board (10) provided with a socket (110); A circuit board (20), the circuit board (20) includes a first surface (201) and a second surface (202), the first surface (201) and the second surface (202) are perpendicular to each other; the circuit board (20) is for being inserted into the socket (110), the circuit board (20) is provided with signal fingers (210) and power supply fingers (220), the signal fingers (210) are arranged on the first surface (201) and are disposed at one end of the circuit board (20) facing the socket (110), the signal fingers (210) are connected to signal traces on the circuit board (20), and the signal fingers (210) are configured to be electrically connected to the socket (110); the power supply fingers (220) are disposed in a first area on the second surface (202) for contacting the socket (110); The power supply fingers (220) are connected to power supply traces on the circuit board (20), and the power supply fingers (220) are configured to be electrically connected to the socket (110).

2. The computing device according to claim 1, wherein The circuit board (20) has a protrusion (240), and the protrusion (240) protrudes from an end surface of the circuit board (20) along the length direction; The first area includes: A first sub-surface (2021), the first sub-surface (2021) is perpendicularly intersected with an arrangement area (230) formed by arranging the signal fingers (210) along the first surface (201); A second sub-surface (2022), the second sub-surface (2022) is located on an end surface of the protrusion (240) facing the socket (110), the second sub-surface (2022) intersects with the first sub-surface (2021); the power supply fingers (220) are disposed on at least one of the first sub-surface (2021) and the second sub-surface (2022).

3. The computing device according to claim 2, wherein The power supply fingers (220) are disposed on the first sub-surface (2021), and the slot (111) of the socket (110) includes a first side wall and a second side wall; when the circuit board (20) is inserted into the socket (110), the first side wall is in contact with the first surface (201), the second side wall is in contact with the first sub-surface (2021), the second side wall is provided with a power supply elastic piece (113), and the power supply elastic piece (113) is connected to a switching power supply on the main board (10); the power supply fingers (220) are configured to be in conductive contact with the power supply elastic piece (113).

4. The computing device according to claim 2, wherein The power supply fingers (220) are disposed on the second sub-surface (2022), the socket (110) has a conductive housing, and the conductive housing is connected to a switching power supply on the main board (10); the power supply fingers (220) are configured to be in conductive contact with the conductive housing.

5. The computing device according to claim 2, wherein The first regions are two in number and are respectively located at both ends of the arrangement region (230); the power supply gold fingers (220) include: two conductive members (221), and the conduction polarities of the two conductive members (221) are opposite; the two conductive members (221) are respectively disposed on different ones of the first regions.

6. The computing device according to claim 2, wherein The power supply gold fingers (220) include two conductive members (221); one of the two conductive members (221) is disposed on the first sub-surface (2021); the other of the two conductive members (221) is disposed on the second sub-surface (2022); the conduction polarities of the two conductive members (221) are opposite.

7. The computing device according to claim 5 or 6, characterized in that, The power supply trace includes: A first power supply trace connected to one of the two conductive members (221); A second power supply trace connected to the other of the two conductive members (221), and the signal trace is located between the first power supply trace and the second power supply trace.

8. An active cable connector for a computing device, characterized in that, Comprising: A circuit board (20), the circuit board (20) includes a first surface (201) and a second surface (202), and the first surface (201) and the second surface (202) are perpendicular to each other; the circuit board (20) is provided with signal gold fingers (210) and power supply gold fingers (220), the signal gold fingers (210) are arranged on the first surface (201) and are disposed at one end of the circuit board (20), the signal gold fingers (210) are connected to the signal traces on the circuit board (20), and the signal gold fingers (210) are configured to be electrically connected to a socket (110) on the main board (10) of a computing device; the power supply gold fingers (220) are disposed on a first region on the second surface (202) for contacting the socket (110); the power supply gold fingers (220) are connected to the power supply traces on the circuit board (20), and the power supply gold fingers (220) are configured to be electrically connected to the socket (110).

9. The active cable connector of the computing device according to claim 8, wherein, Further comprising: An active chip (30); disposed on the circuit board (20), a signal pin of the active chip (30) is connected to the signal trace, and a power supply pin of the active chip (30) is connected to the power supply trace.

10. The active cable connector of the computing device according to claim 8, characterized in that, The circuit board (20) has a protrusion (240), and the protrusion (240) is on an end face of the circuit board (20) along the width direction; The first region includes: A first sub-surface (2021), the first sub-surface (2021) perpendicularly intersects an arrangement region (230) formed by arranging the signal gold fingers (210) along the first surface (201); A second sub-surface, the second sub-surface (2022) is on an end face of the protrusion (240) facing the socket (110), and the second sub-surface (2022) intersects the first sub-surface (2021); the power supply gold fingers (220) are disposed on at least one of the first sub-surface (2021) and the second sub-surface (2022).

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