Solid Laser and Fiber Laser Integrated High-Power Medical Treatment Equipment

Abstract

The present invention is a high-power medical treatment device integrating solid-state laser and fiber laser, which relates to the field of high-power laser devices. A semiconductor refrigeration sheet is used for refrigeration to cool the installation cylinder, and the cooling is conducted into the air guide cylinder through the condensation fins. When the air flow entering the air guide cylinder passes through the condensation fins, the water vapor in the air flow is liquefied and condensed into water droplets on the condensation fins. The water droplets flow along the condensation fins into the V-shaped groove of the V-shaped guide piece, pass through the perforation along the V-shaped guide piece and flow out of the air guide cylinder, and then flow into the condensate collection tank through the gap between the installation cylinder and the air guide cylinder. The water in the condensate collection tank is discharged through the drain pipe. The condensed air flow enters the working element box from the upper end of the air guide cylinder, reducing the water vapor content of the air flow entering the working element box through condensation, and the air flow is cooled, increasing the temperature difference between the air flow and the working element box, promoting heat exchange with the heat generated by the circuit elements and the laser in the working element box, and facilitating the heat dissipation of the laser.

Description

Technical Field

[0001] The present invention relates to the field of high-power laser devices, and particularly to a high-power medical treatment device integrating solid-state lasers and fiber lasers. Background Art

[0002] A high-power medical treatment device integrating solid-state lasers and fiber lasers forms a synergistic advantage of "precise energy output + flexible path transmission" by integrating the high energy density of solid-state lasers and the flexible conduction characteristics of fiber lasers, and is widely used in minimally invasive surgery, surgical hemostasis assistance, myopia correction and other scenarios;

[0003] In a laser treatment device, the laser is installed inside the chassis of the treatment device. When the laser generates high-energy laser, it also generates a large amount of heat. If the laser is not cooled in a timely and effective manner, the laser is likely to be damaged, affecting the service life of the laser. In the existing air-cooling method, an air-cooling fan drives the external air flow into the chassis to cool the laser by promoting the air flow inside and outside the chassis. When the water vapor content in the external air is relatively large, the water vapor enters the chassis, which will cause damage to the laser and the cooling effect is not ideal. Summary of the Invention

[0004] What the present invention aims to overcome is the problem that in the existing air-cooling method, when the water vapor content in the air flow is relatively large, it will cause damage to the laser and the cooling effect is not ideal. The purpose is to provide a high-power medical treatment device integrating solid-state lasers and fiber lasers.

[0005] The technical problems to be solved by the present invention are realized by adopting the following technical solutions:

[0006] A high-power medical treatment device integrating solid-state lasers and fiber lasers, comprising: a device body, a laser, and a cooling circulation module;

[0007] A working element box is provided inside the device body, the laser is arranged in the working element box, a fiber optic inlet for connecting the laser is provided on the side of the working element box, and an air outlet is provided on the upper part of the working element box;

[0008] The cooling cycle module includes an air guide cylinder, a mounting cylinder, a drum fan, and a semiconductor refrigeration sheet. The upper end of the air guide cylinder is fixed to the lower part of the working element box and is in communication with the working element box. The drum fan is fixedly installed at the lower end of the air guide cylinder. The mounting cylinder is coaxially sleeved outside the air guide cylinder. The cold end of the semiconductor refrigeration sheet is fixedly attached to the outer side wall of the mounting cylinder. The side wall of the air guide cylinder is provided with condensation fins in a matrix pattern. The condensation fins penetrate through the air guide cylinder and extend into the gap between the mounting cylinder and the air guide cylinder. V-shaped guide pieces are fixedly arranged at equal intervals on the condensation fins. Through holes are provided on the side wall of the air guide cylinder corresponding to the V-shaped guide pieces. The ends of the V-shaped guide pieces pass through the through holes and extend out of the air guide cylinder. A condensation water collection groove is provided at the lower end of the air guide cylinder.

[0009] Further, the V-shaped guide piece is arranged at an angle of 60 degrees with the side wall of the air guide cylinder, and the opening of the angle faces the upper end of the air guide cylinder.

[0010] Further, a heat exhaust cylinder is fixed on the mounting cylinder. A heat dissipation fan and heat dissipation fins are installed in the heat exhaust cylinder. A heat pipe is inserted through the heat dissipation fins. The heat pipe is attached to the hot end of the semiconductor refrigeration sheet. One end of the heat pipe is inserted into the condensation water collection groove.

[0011] Further, a cooling pipe penetrates into the laser. One end of the cooling pipe is connected to a coolant tank. The coolant tank is connected to the inlet of a cooling pump. The outlet of the cooling pump is connected to a heat exchange network pipe. The heat exchange network pipe is connected to the cooling pipe. The heat exchange network pipe is located in the upper part of the air guide cylinder.

[0012] Further, a panel frame is provided at the upper part of the equipment body. A human-machine interaction panel is installed on the panel frame. An air outlet is provided on the panel frame. The air outlet is in communication with an exhaust outlet. The air flow blown out from the exhaust outlet flows out from the air outlet and blows down along the board surface of the human-machine interaction panel.

[0013] Further, a circulation flow channel is provided inside the equipment body. The bottom of the panel frame extends into the circulation flow channel. A top push rod is slidably installed inside the equipment body. The upper end of the top push rod extends into the circulation flow channel. A return spring is provided in the equipment body. The return spring applies a downward thrust to the top push rod. The upper end of the top push rod is hinged to a pressure rod. A support rod is installed inside the circulation flow channel. The middle of the pressure rod is hinged to the support rod. The other end of the pressure rod is connected to a sealing plug. An isolation groove is provided on the panel frame. The isolation groove is located on one side of the air outlet and is in communication with the air outlet. The sealing plug is slidably located in the isolation groove. The sealing plug can be inserted into the air outlet along the isolation groove.

[0014] Further, a return air cylinder is provided below the drum fan. A filter screen cylinder is installed below the return air cylinder. The lower part of the circulation flow channel is communicated with the return air cylinder through a pipeline.

[0015] Further, a connecting ring is slidably mounted on the return air duct. The lower end of the top push rod is connected to the connecting ring. A cooperative rack is fixed on the top push rod. The cooperative rack is slidably mounted on the return air duct. The filter screen cylinder is sleeved at the lower end of the return air duct through a threaded connection. The lower end of the cooperative rack contacts the filter screen cylinder. A wind hopper is provided at the lower end of the return air duct. A closing frame is mounted on the wind hopper. A closing rod is slidably mounted on the closing frame. A closing plug cooperating with the wind hopper is provided at the lower end of the closing rod. A linkage disk is provided at the upper end of the closing rod. A support spring is provided between the linkage disk and the closing frame. A linkage rack is fixed on the linkage disk. A linkage shaft is rotatably mounted on the return air duct. One end of the linkage shaft meshes with the linkage rack through a gear, and the other end meshes with the cooperative rack through a gear.

[0016] Further, the condensation fins are slidably arranged on the air guide cylinder. A tension spring is provided between the condensation fins and the installation cylinder. A U-shaped heat conduction pipe is fixed on the installation cylinder. One end of the U-shaped heat conduction pipe is located on the installation cylinder on the cold end side of the semiconductor refrigeration sheet, and the other end is located on the end face on the hot end side of the semiconductor refrigeration sheet. A floating piston is provided in the U-shaped heat conduction pipe. A connecting rod is connected to the floating piston. The connecting rod extends out from the end of the U-shaped heat conduction pipe. An extrusion block is mounted on the connecting rod. An inclined plane is provided on the extrusion block, and the inclined plane contacts the condensation fins.

[0017] The beneficial effects of the present invention are:

[0018] The installation cylinder is cooled by using the semiconductor refrigeration sheet for refrigeration. When the air flow entering the air guide cylinder passes through the condensation fins, the water vapor in the air flow is liquefied and condensed into water droplets on the condensation fins, reducing the water vapor content of the air flow entering the working element box through condensation. Moreover, the air flow is cooled, increasing the temperature difference between the air flow and the working element box, promoting heat exchange with the heat generated by the circuit elements and the laser in the working element box, and facilitating heat dissipation of the laser.

[0019] When disassembling and replacing the filter screen cylinder, the working element box is cooled by an internal circulation method. When the filter screen cylinder is installed, while using part of the internal air flow circulation, external air flow can also be introduced into the working element box, thereby improving the heat dissipation effect of the working element box. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic structural diagram of the present invention;

[0021] Figure 2 is a schematic installation diagram of the laser of the present invention;

[0022] Figure 3 is a schematic installation diagram of the air guide cylinder of the present invention;

[0023] Figure 4Cross-sectional view of the air guide tube and the installation tube connection of the present invention;

[0024] Figure 5 Schematic diagram of the installation of the heat exhaust tube of the present invention;

[0025] Figure 6 Schematic diagram of the installation of the panel frame of the present invention;

[0026] Figure 7 Schematic diagram of the structure of the return air tube of the present invention.

[0027] In the figure: 1. Equipment body; 2. Laser; 3. Cooling circulation module; 12. Working element box; 13. Optical fiber access port; 14. Exhaust port; 21. Air guide tube; 22. Installation tube; 23. Blower fan; 24. Semiconductor refrigeration sheet; 25. Condensing fin; 26. V-shaped guide piece; 27. Perforation; 28. Condensate collection tank; 31. Heat exhaust tube; 32. Heat dissipation fan; 33. Heat dissipation fin; 34. Heat pipe; 35. Cooling pipe; 36. Coolant tank; 37. Cooling pump; 38. Heat exchange network tube; 41. Panel frame; 42. Human-machine interaction panel; 44. Air outlet; 45. Circulation channel; 46. Top push rod; 47. Return spring; 48. Pressure rod; 49. Support rod; 50. Sealing plug; 51. Isolation groove; 61. Return air tube; 62. Filter screen tube; 63. Connection ring; 64. Cooperative rack; 65. Air scoop; 66. Enclosure; 67. Enclosure rod; 68. Sealing plug; 69. Linkage disk; 70. Support spring; 71. Linkage rack; 72. Linkage shaft; 81. Tension spring; 82. U-shaped heat conduction tube; 83. Floating piston; 84. Connecting rod; 85. Extrusion block. Detailed implementation manners

[0028] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below with reference to specific drawings.

[0029] Embodiment 1: As Figures 1-4 shown, a solid laser and fiber laser integrated high-power medical treatment device includes: an equipment body 1, a laser 2, and a cooling circulation module 3;

[0030] A working element box 12 is provided inside the equipment body 1. Circuit modules and power modules required for the operation of the equipment are installed in the working element box 12. The laser 2 is arranged in the working element box 12. An optical fiber access port 13 for connecting the laser 2 is provided on the side of the working element box 12, and an exhaust port 14 is provided on the upper part of the working element box 12;

[0031] The cooling cycle module 3 includes an air guide cylinder 21, a mounting cylinder 22, a blower fan 23, and a semiconductor refrigeration sheet 24. The upper end of the air guide cylinder 21 is fixed to the lower part of the working element box 12 and communicates with the working element box 12. The blower fan 23 is fixedly installed at the lower end of the air guide cylinder 21. The mounting cylinder 22 is coaxially sleeved outside the air guide cylinder 21. The cold end of the semiconductor refrigeration sheet 24 is fixedly attached to the outer side wall of the mounting cylinder 22. The side wall of the air guide cylinder 21 is provided with condensation fins 25 in a matrix pattern. The condensation fins 25 pass through the air guide cylinder 21 and extend into the gap between the mounting cylinder 22 and the air guide cylinder 21. V-shaped guide pieces 26 are fixedly arranged at equal intervals on the condensation fins 25. Through holes 27 corresponding to the V-shaped guide pieces 26 are provided on the side wall of the air guide cylinder 21. The ends of the V-shaped guide pieces 26 pass through the through holes 27 and extend out of the air guide cylinder 21. A condensate collection trough 28 is provided at the lower end of the air guide cylinder 21;

[0032] The V-shaped guide pieces 26 are arranged at an angle of 60 degrees with the side wall of the air guide cylinder 21, and the opening of the angle faces the upper end of the air guide cylinder 21. The blower fan 23 blows external air into the air guide cylinder 21, uses the semiconductor refrigeration sheet 24 to refrigerate and cool the mounting cylinder 22, conducts heat through the condensation fins 25 and enters the interior of the air guide cylinder 21. When passing through the V-shaped guide pieces 26, the air flow impacts the V-shaped guide pieces 26 and disperses, and then impacts the adjacent condensation fins 25. When the air flow passes through the condensation fins 25, the water vapor in the air flow liquefies and condenses into water droplets on the condensation fins 25. The water droplets flow along the condensation fins 25 into the V-shaped grooves of the V-shaped guide pieces 26, pass through the through holes 27 along the V-shaped guide pieces 26 and flow out of the air guide cylinder 21, and flow into the condensate collection trough 28 through the gap between the mounting cylinder 22 and the air guide cylinder 21. The water in the condensate collection trough 28 is discharged through a drain pipe. The condensed air flow enters the working element box 12 from the upper end of the air guide cylinder 21, reduces the water vapor content of the air flow entering the working element box 12 through condensation, and the air flow is cooled, increasing the temperature difference between the air flow and the circuit elements and the heat generated by the laser 2 in the working element box 12, promoting heat exchange with the heat generated by the circuit elements and the laser 2 in the working element box 12, and facilitating the heat dissipation of the laser 2.

[0033] Embodiment 2: On the basis of Embodiment 1, as Figures 1-5 shown, a heat discharge cylinder 31 is fixed on the mounting cylinder 22. A heat dissipation fan 32 and heat dissipation fins 33 are installed in the heat discharge cylinder 31. A heat pipe 34 is inserted through the heat dissipation fins 33. The heat pipe 34 is attached to the hot end of the semiconductor refrigeration sheet 24. One end of the heat pipe 34 is inserted into the condensate collection trough 28; The condensed condensate enters the condensate collection trough 28, and one end of the heat pipe 34 is inserted into the condensate collection trough 28, which can promote the heat dissipation of the heat pipe 34 and is beneficial to the heat dissipation of the hot end of the semiconductor refrigeration sheet 24;

[0034] A cooling pipe 35 passes through the laser 2. One end of the cooling pipe 35 is connected to a coolant tank 36. The coolant tank 36 is connected to the inlet of a cooling pump 37. The outlet of the cooling pump 37 is connected to a heat exchange network pipe 38. The heat exchange network pipe 38 is connected to the cooling pipe 35. The heat exchange network pipe 38 is located above the air guide cylinder 21. The cooling pump 37 drives the coolant to flow between the coolant tank 36, the cooling pipe 35, and the heat exchange network pipe 38. When the coolant passes through the heat exchange network pipe 38, the heat therein forms a heat exchange with the cooling air flow flowing out of the air guide cylinder 21 for cooling. The cooled coolant enters the laser 2 through the cooling pipe 35, thereby being able to dissipate heat inside the laser 2;

[0035] Embodiment 3: On the basis of Embodiment 1, as Figures 1-7 shown, a panel frame 41 is provided on the upper part of the equipment body 1. A human-machine interaction panel 42 is installed on the panel frame 41. An air outlet 44 is provided on the panel frame 41. The air outlet 44 is communicated with the air discharge port 14. The air flow blown out from the air discharge port 14 flows out from the air outlet 44 and blows down along the plate surface of the human-machine interaction panel 42 from top to bottom; The air flow from the working element box 12 is blown out from the air discharge port 14 and blown out to the outside of the equipment body 1 through the air outlet 44 on the panel frame 41. When the air flow blows out, it flows along the plate surface of the human-machine interaction panel 42, and a layer of air flow shielding layer can be formed on the plate surface of the human-machine interaction panel 42, promoting the heat dissipation of the human-machine interaction panel 42 and reducing the settlement of dust in the air on the human-machine interaction panel 42;

[0036] A circulation channel 45 is provided inside the equipment body 1. The bottom of the panel frame 41 extends into the circulation channel 45. A top push rod 46 is slidably installed inside the equipment body 1. The upper end of the top push rod 46 extends into the circulation channel 45. A return spring 47 is provided in the equipment body 1. The return spring 47 exerts a downward thrust on the top push rod 46. The upper end of the top push rod 46 is hingedly connected to a pressure rod 48. A support rod 49 is installed inside the circulation channel 45. The middle of the pressure rod 48 is hinged to the support rod 49. The other end of the pressure rod 48 is connected to a sealing plug 50. An isolation groove 51 is provided on the panel frame 41. The isolation groove 51 is located on one side of the air outlet 44 and is communicated with the air outlet 44. The sealing plug 50 is slidably located in the isolation groove 51. The sealing plug 50 can be inserted into the air outlet 44 by moving along the isolation groove 51; When the top push rod 46 moves towards the panel frame 41, the top push rod 46 squeezes the pressure rod 48, and then pushes the pressure rod 48 to deflect around the support rod 49. The end of the pressure rod 48 connected to the sealing plug 50 moves away from the air outlet 44. At this time, the air flow in the circulation channel 45 can flow out from the air outlet 44 on the panel frame 41; When the top push rod 46 moves away from the panel frame 41, the sealing plug 50 is pushed towards the air outlet 44 by the pressure rod 48. At this time, the sealing plug 50 is inserted into the air outlet 44 to restrict the air outlet of the air outlet 44;

[0037] A return air cylinder 61 is provided at the lower part of the centrifugal fan 23. A filter screen cylinder 62 is installed at the lower part of the return air cylinder 61. The lower part of the circulation flow channel 45 is communicated with the return air cylinder 61 through a pipeline. The air flow flowing downward in the circulation flow channel 45 passes through the return air cylinder 61, and then is blown into the air guide cylinder 21 again by the centrifugal fan 23. This part of the air flow has been subjected to condensation treatment, and is mixed with the air flow entering from the filter screen cylinder 62 again and then enters the working element box 12, reducing the moisture in the entering air flow;

[0038] A connecting ring 63 is slidably installed on the return air cylinder 61. The lower end of the top push rod 46 is connected to the connecting ring 63. A cooperative rack 64 is fixed on the top push rod 46. The cooperative rack 64 is slidably installed on the return air cylinder 61. The filter screen cylinder 62 is sleeved on the lower end of the return air cylinder 61 through a threaded connection. The lower end of the cooperative rack 64 contacts the filter screen cylinder 62. A wind hopper 65 is provided at the lower end of the return air cylinder 61. A closing frame 66 is installed on the wind hopper 65. A closing rod 67 is slidably installed on the closing frame 66. A closing plug 68 matching with the wind hopper 65 is provided at the lower end of the closing rod 67. A linkage disk 69 is provided at the upper end of the closing rod 67. A support spring 70 is provided between the linkage disk 69 and the closing frame 66. A linkage rack 71 is fixed on the linkage disk 69. A linkage shaft 72 is rotatably installed on the return air cylinder 61. One end of the linkage shaft 72 meshes with the linkage rack 71 through a gear, and the other end meshes with the cooperative rack 64 through a gear. When the filter screen cylinder 62 is installed on the return air cylinder 61, the filter screen cylinder 62 upwardly presses the cooperative rack 64, causing the cooperative rack 64 to move upward. The cooperative rack 64 pushes the linkage shaft 72 to rotate. The linkage shaft 72 pushes the linkage rack 71 to move downward, driving the linkage disk 69 and the closing rod 67 to move downward, and pushing the closing plug 68 to separate from the wind hopper 65. At this time, the air flow outside the filter screen cylinder 62 can pass through the filter screen cylinder 62 and enter the return air cylinder 61 through the gap between the sealing plug 50 and the wind hopper 65. At the same time, since the cooperative rack 64 moves upward, it pushes the connecting ring 63 to move upward, and the connecting ring 63 can push the top push rod 46 to move upward, causing the sealing plug 50 to be received into the isolation groove 51. At this time, the air flow entering the return air cylinder 61 is not only the air flow outside the filter screen cylinder 62, but also the air flow in the circulation flow channel 45;

[0039] When the filter screen cylinder 62 needs to be disassembled and cleaned, due to the removal of the filter screen cylinder 62, under the action of gravity, the connecting ring 63 and the cooperative rack 64 move downward, the connecting ring 63 moves downward, pulling the top push rod 46 downward, reducing the sealing plug 50 being pushed into the air outlet 44 to seal the air outlet 44. At this time, the air flow in the circulation channel 45 flows downward and returns to the return air cylinder 61. Under the action of the support spring 70, the linkage disk 69 drives the linkage disk 69, the closing rod 67 and the closing plug 68 to move upward. The closing plug 68 contacts the air scoop 65. At this time, the air flow entering the return air cylinder 61 can only enter through the circulation channel 45, and the external air flow will not enter the return air cylinder 61. When disassembling and replacing the filter screen cylinder 62, the working element box 12 is cooled by means of internal circulation. When the filter screen cylinder 62 is installed, while using part of the internal air flow circulation, external air flow can also be introduced into the working element box 12, thereby improving the heat dissipation effect of the working element box 12;

[0040] A humidity sensor SHT30 and a controller STM32F103C8T6 are arranged in the working element box 12. The humidity sensor is used to collect the humidity data inside the working element box 12 in real time. The data collected by the humidity sensor is filtered by a signal conditioning module (INA128 + RC filtering) and then converted into a digital signal by an ADC module ADS1115 and transmitted to the signal input end of the controller. The control output end of the controller is connected to a drive module L298N. The drive module controls the operation of the thermoelectric cooler TEC1-12706. The controller controls the working power of the thermoelectric cooler. When the system works, the threshold value of humidity work is set;

[0041] When the water vapor content in the air is relatively low, the humidity sensor detects that the humidity value is less than the threshold value of the system operation. The controller controls the output of a control signal to control the thermoelectric cooler 24 to turn off. Relying on the blowing of the blower fan 23, the air flow filtered by the filter screen cylinder 62 is inhaled into the working element box 12 to cool the internal components of the working element box 12. When the humidity sensor detects that the humidity value is greater than the threshold value of the system operation, the controller controls the thermoelectric cooler 24 to work to cool the air flow passing through the air guide cylinder 21, so that the water vapor in the air flow condenses on the condensation fins 25, thereby reducing the water vapor content in the air flow. The heat dissipation of the equipment is adjusted according to the humidity change, reducing the heat dissipation energy consumption;

[0042] After the filter screen cylinder 62 is removed, the closing plug 68 and the air scoop 65 are sealed. At this time, the air flow inside the working element box 12 can flow back into the working element box 12 through the circulation channel 45. At this time, it is the internal air flow circulation of the working element box 12, preventing external water vapor and dust from entering the equipment;

[0043] The condensation fin 25 is slidably arranged on the air guide cylinder 21. A tension spring 81 is arranged between the condensation fin 25 and the mounting cylinder 22. A U-shaped heat conduction pipe 82 is fixed on the mounting cylinder 22. One end of the U-shaped heat conduction pipe 82 is located on the mounting cylinder 22 on the cold end side of the semiconductor refrigeration sheet 24, and the other end is located on the end face on the hot end side of the semiconductor refrigeration sheet 24. A floating piston 83 is arranged in the U-shaped heat conduction pipe 82. A connecting rod 84 is connected to the floating piston 83. The connecting rod 84 extends out from the end of the U-shaped heat conduction pipe 82. An extrusion block 85 is mounted on the connecting rod 84. The extrusion block 85 is provided with an inclined plane which contacts the condensation fin 25.

[0044] The U-shaped heat conduction pipe 82 can be filled with a liquid having a relatively large coefficient of thermal expansion, such as alcohol. When the semiconductor refrigeration sheet 24 works, a temperature difference is formed between the hot end and the cold end of the semiconductor refrigeration sheet 24. The temperature of the U-shaped heat conduction pipe 82 on the hot end side rises, causing the liquid in the U-shaped heat conduction pipe 82 on this side to expand, while the liquid in the U-shaped heat conduction pipe 82 near the cold end contracts, causing the floating piston 83 to move towards the end of the U-shaped heat conduction pipe 82 on the cold end side, pushing the connecting rod 84 and the extrusion block 85 to move upward. The extrusion block 85 pushes the condensation fin 25 upward, and the condensation fin 25 moves towards the inside of the air guide cylinder 21 along the direction of the V-shaped guide piece 26, thereby increasing the contact area between the air flowing into the air guide cylinder 21 and the condensation fin 25.

[0045] When the external humidity is at a relatively low level, the semiconductor refrigeration sheet 24 stops working, and the temperature difference between the cold end and the hot end of the semiconductor refrigeration sheet 24 is relatively low. At this time, the liquid volume in the U-shaped heat conduction pipe 82 at the cold end expands, while the liquid in the U-shaped heat conduction pipe 82 at the hot end contracts, thereby pushing the floating piston 83 to move downward, driving the connecting rod 84 and the extrusion block 85 to move downward. The thrust of the inclined plane on the extrusion block 85 on the condensation fin 25 decreases. Under the action of the tension spring 81, the condensation fin 25 moves towards the side wall of the mounting cylinder 22, and then the condensation fin 25 moves towards the outside of the air guide cylinder 21. At this time, an unobstructed cylindrical flow channel will be formed in the middle of the matrix of the condensation fins 25. Therefore, when the semiconductor refrigeration sheet 24 stops working, the flow performance of the air in the air guide cylinder 21 is increased, and the air flow resistance is reduced.

[0046] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-power medical treatment device integrating solid-state laser and fiber laser, characterized in that Including: The device body, a laser, and a cooling circulation module; A working element box is provided inside the device body, the laser is arranged in the working element box, a fiber optic inlet for connecting the laser is provided on the side of the working element box, and an air outlet is provided on the upper part of the working element box; The cooling circulation module includes an air guide cylinder, a mounting cylinder, a blower fan, and a semiconductor refrigeration sheet. The upper end of the air guide cylinder is fixed to the lower part of the working element box and is communicated with the working element box. The blower fan is fixedly installed at the lower end of the air guide cylinder. The mounting cylinder is coaxially sleeved outside the air guide cylinder. The cold end of the semiconductor refrigeration sheet is fixedly attached to the outer side wall of the mounting cylinder. The side wall of the air guide cylinder is provided with condensation fins in a matrix pattern. The condensation fins penetrate through the air guide cylinder and extend into the gap between the mounting cylinder and the air guide cylinder. V-shaped guide pieces are fixedly arranged at equal intervals on the condensation fins. Through holes are provided on the side wall of the air guide cylinder corresponding to the V-shaped guide pieces. The end of the V-shaped guide piece passes through the through hole and extends out of the air guide cylinder. A condensation water collection tank is provided at the lower end of the air guide cylinder. The V-shaped guide piece and the side wall of the air guide cylinder are arranged at an angle of 60 degrees, and the opening of the angle faces the upper end of the air guide cylinder. A heat discharge cylinder is fixed on the mounting cylinder. A heat dissipation fan and heat dissipation fins are installed in the heat discharge cylinder. Heat pipes are inserted into the heat dissipation fins. The heat pipes are attached to the hot end of the semiconductor refrigeration sheet. One end of the heat pipe is inserted into the condensation water collection tank. A cooling pipe passes through the laser. One end of the cooling pipe is connected to a coolant tank. The coolant tank is connected to the inlet of a cooling pump. The outlet of the cooling pump is connected to a heat exchange network pipe. The heat exchange network pipe is connected to the cooling pipe. The heat exchange network pipe is located in the upper part of the air guide cylinder. The condensation fins are slidably arranged on the air guide cylinder. A tension spring is provided between the condensation fins and the mounting cylinder. A U-shaped heat conduction pipe is fixed on the mounting cylinder. One end of the U-shaped heat conduction pipe is located on the mounting cylinder on the side of the cold end of the semiconductor refrigeration sheet, and the other end is located on the end face on the side of the hot end of the semiconductor refrigeration sheet. A floating piston is provided in the U-shaped heat conduction pipe. A connecting rod is connected to the floating piston. The connecting rod extends out from the end of the U-shaped heat conduction pipe. An extrusion block is installed on the connecting rod. An inclined plane is provided on the extrusion block, and the inclined plane contacts the condensation fins.

2. The high-power medical treatment device integrating solid-state laser and fiber laser according to claim 1, characterized in that A panel frame is provided on the upper part of the device body. A human-machine interaction panel is installed on the panel frame. An air outlet is provided on the panel frame. The air outlet is communicated with the air outlet. The airflow blown out from the air outlet flows out from the air outlet and blows down along the plate surface of the human-machine interaction panel.

3. The high-power medical treatment device integrating solid-state laser and fiber laser according to claim 2, wherein A circulation channel is provided inside the device body. The bottom of the panel frame extends into the circulation channel. A top push rod is slidably installed inside the device body, and the upper end of the top push rod extends into the circulation channel. A return spring is provided in the device body, and the return spring applies a downward thrust on the top push rod. The upper end of the top push rod is hinged to a pressure rod. A support rod is installed inside the circulation channel, and the middle of the pressure rod is hinged to the support rod. The other end of the pressure rod is connected to a sealing plug. An isolation groove is provided on the panel frame, which is located on one side of the air outlet and communicates with the air outlet. The sealing plug is slidably located in the isolation groove, and the sealing plug can be inserted into the air outlet along the isolation groove when it moves along the isolation groove.

4. The high-power medical treatment device integrating solid-state laser and fiber laser according to claim 3, wherein A return air cylinder is provided below the blower fan, and a filter screen cylinder is installed below the return air cylinder. The lower part of the circulation channel is communicated with the return air cylinder through a pipeline.

5. The high-power medical treatment device integrating solid-state laser and fiber laser according to claim 4, wherein A connecting ring is slidably installed on the return air cylinder, and the lower end of the top push rod is connected to the connecting ring. A cooperative rack is fixed on the top push rod, and the cooperative rack is slidably installed on the return air cylinder. The filter screen cylinder is threadedly sleeved on the lower end of the return air cylinder, and the lower end of the cooperative rack contacts the filter screen cylinder. A wind hopper is provided at the lower end of the return air cylinder, and a closing frame is installed on the wind hopper. A closing rod is slidably installed on the closing frame, a closing plug cooperating with the wind hopper is provided at the lower end of the closing rod, a linkage disc is provided at the upper end of the closing rod, a support spring is provided between the linkage disc and the closing frame, a linkage rack is fixed on the linkage disc, a linkage shaft is rotatably installed on the return air cylinder, one end of the linkage shaft meshes with the linkage rack through a gear, and the other end meshes with the cooperative rack through a gear.

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