Optical interconnection transmission method and system, storage medium and program product

Abstract

The invention discloses an optical interconnection transmission method and system, a storage medium and a program product, and relates to the technical field of wireless communication, the method is applied to an optical interconnection system comprising at least two transmission core grains, a control core grain and an optical base chip, and the method comprises the following steps: the control core grain sends a request signal to at least one transmission core grain based on the request signal sent by the at least one transmission core grain; a first building instruction is sent to the optical base chip, the first building instruction is used for building at least one first optical path through the optical base chip, the first optical path is an optical path between the sending core particle and the target receiving core particle, the at least two transmission core particles comprise the sending core particle and at least one receiving core particle, and the receiving core particle is used for receiving the sending core particle and the target receiving core particle. The target receiving core particle is any one core particle in at least one receiving core particle; the sending core particle transmits an optical signal to a target receiving core particle through a first optical path; and the target receiving core particle sends a confirmation signal to the control core particle, wherein the confirmation signal is used for indicating that the target receiving core particle successfully executes the cyclic redundancy check operation.

Description

Technical Field

[0001] This application relates to the field of wireless communication technologies, and in particular, to an optical interconnection transmission method, system, storage medium, and program product. Background Art

[0002] As a technical solution for resolving the contradiction between high computing power and low energy consumption in base stations, the optical interconnection solution between chiplets completes the optical interconnection between chiplets through a chip-level optical pedestal, forming an optoelectronic hybrid general computing and intelligent integrated chip. Currently, in the optical interconnection system between chiplets, the optical signal transmission module in the transmitting chiplet receives an electrical signal and converts it into an optical signal, the optical signal transmission module transmits the optical signal emitted by the transmitting chiplet to the receiving chiplet, and the optical signal receiving module in the receiving chiplet detects the optical signal and converts it into an electrical signal. The optical interconnection system between chiplets realizes the interconnection between two chiplets through the optical transmission module. Although it can perform ultra-high-speed and low-energy-consuming data transmission, the system's expansion ability is limited, and it can only support the combination of a single optical signal transmission module and an optical signal receiving module, making it difficult to meet the requirements of high integration and difficult to adapt to large-scale complex systems with multiple cores or multiple modules. Summary of the Invention

[0003] Embodiments of this application provide an optical interconnection transmission method, system, storage medium, and program product, which can support the combination of multiple optical signal transmission modules and optical signal receiving modules, meet the requirements of high integration, and be adapted to large-scale complex systems with multiple cores or multiple modules for optical signal transmission.

[0004] In a first aspect, embodiments of this application provide an optical interconnection transmission method, which is applied to an optical interconnection system. The optical interconnection system includes at least two transmission chiplets, a control chiplet, and an optical pedestal chip. A first port of each of the at least two transmission chiplets is connected to a first port of the control chiplet, a second port of each of the at least two transmission chiplets is connected to a first port of the optical pedestal chip, and a second port of the optical pedestal chip is connected to a second port of the control chiplet. The method includes:

[0005] Based on request signals sent by at least one of the at least two transmission chiplets, the control chiplet sends a first building instruction to the optical pedestal chip. The first building instruction is used to indicate to establish at least one first optical path in the optical interconnection system through the optical pedestal chip. The first optical path is an optical path between a transmitting chiplet and a target receiving chiplet. Among the at least two transmission chiplets, the transmitting chiplet and at least one receiving chiplet are included, and the target receiving chiplet is any one of the at least one receiving chiplets.

[0006] The transmitting chiplet transmits an optical signal to the target receiving chiplet through the first optical path.

[0007] The target receiving die sends an acknowledgement signal to the control die, and the acknowledgement signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

[0008] Optionally, based on a request signal sent by at least one of the transmitting dies, the control die sends a first setup instruction to the optical base chip to establish at least one first optical path through the optical base chip in the optical interconnect system, including:

[0009] The control die receives a first request signal sent by the transmitting die and a second request signal sent by the at least one receiving die;

[0010] Based on the first request signal and the second request signal, the control die sends the first setup instruction to the optical base chip;

[0011] The control die sends an acknowledgement signal to the transmitting die and the at least one receiving die, and the acknowledgement signal is used to indicate that the at least one first optical path has been successfully set up.

[0012] Optionally, the target receiving die sending an acknowledgement signal to the control die includes:

[0013] When receiving an optical signal, the target receiving die performs a cyclic redundancy check operation;

[0014] When the check fails, the target receiving die sends a check failure signal to the control die;

[0015] Based on the check failure signal, the control die sends a retransmission data instruction to the transmitting die;

[0016] The control die receives a third request signal sent by the transmitting die and a fourth request signal sent by the target receiving die;

[0017] Based on the third request signal and the fourth request signal, the control die sends a second setup instruction to the optical base chip, and the second setup instruction is used to indicate the establishment of a second optical path between the transmitting die and the target receiving die;

[0018] The transmitting die transmits an optical signal to the target receiving die through the second optical path;

[0019] When the target receiving die receives an optical signal again, it performs a cyclic redundancy check operation, and when the check is successful, it sends a check acknowledgement signal to the control die.

[0020] Optionally, the optical base chip includes an N-level switching layer, and the N-level switching layer includes An N-stage switching layer includes N-1 Mach-Zehnder interferometer (MZI) modules, and the first stage of the N-stage switching layer includes 1 MZI module. Adjacent MZI modules in each switching layer are connected by detectors, where N is a positive integer greater than or equal to 2.

[0021] The transmitting die transmits an optical signal to the target receiving die through the first optical path, including:

[0022] The transmitting die inputs the optical signal from p first ports of the first optical path to transmit the optical signal output from q second ports of the first optical path to the target receiving die.

[0023] Where p and q are positive integers, and both p and q are less than or equal to

[0024] Optionally, the optical switching network corresponding to the first optical path is determined based on the positions of the p first ports and the q second ports in the optical base chip. The optical switching network includes an M-stage switching layer, and the M-stage switching layer includes at least M MZI modules. The Mth stage of the M-stage switching layer includes p parallel MZI modules corresponding to the p first ports, and the q second ports are distributed at the output ports of the at least M MZI modules, where M is less than or equal to N.

[0025] The transmitting die inputs the optical signal from the p first ports of the first optical path, including:

[0026] The transmitting die inputs the optical signal to the p first ports.

[0027] Where, when the phase modulator parameters of the MZI modules in the Mth stage of the M-stage switching layer are set to a first preset parameter and the coupler parameters of k MZI modules are set to a second preset parameter, the optical signal is directed to the (M-1)th stage of the first optical path until the optical signal is output from each of the q second ports, where k is an integer greater than or equal to 0.

[0028] Optionally, the method further includes:

[0029] Determining the intensity of the target optical signal output after the optical signals input from the first input port and the second input port pass through the optical switching network according to the first information, the second information, and the phase difference between the optical signal input from the first input port and the optical signal input from the second input port.

[0030] Wherein, the first information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input at the first input port among the p first ports, and the second information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input at the second input port among the p first ports.

[0031] Optionally, the intensity of the target optical signal is proportional to a target product, which is the product of the intensity of the optical signal input at the first input port and the intensity of the optical signal input at the second input port.

[0032] Optionally, the method further includes:

[0033] Before the first optical signal output from the second port is input into the target receiving die, input the first optical signal into a microring resonator in the optical interconnection system to obtain a second optical signal;

[0034] Wherein, the optical power of the second optical signal is greater than the optical power of the first optical signal.

[0035] In a second aspect, an embodiment of the present application further provides an optical interconnection system, which includes at least two transmission dies, a control die, and an optical base chip. The first port of each transmission die is connected to the first port of the control die, the second port of each transmission die is connected to the first port of the optical base chip, and the second port of the optical base chip is connected to the second port of the control die;

[0036] The control die is configured to send a first building instruction to the optical base chip based on a request signal sent by at least one of the transmission dies. The first building instruction is used to indicate to establish at least one first optical path in the optical interconnection system through the optical base chip. The first optical path is the optical path between the sending die and the target receiving die; wherein, the at least two transmission dies include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die;

[0037] The sending die is configured to transmit an optical signal to the target receiving die through the first optical path;

[0038] The target receiving die is configured to send an acknowledgment signal to the control die, and the acknowledgment signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

[0039] In a third aspect, an embodiment of the present application provides an optical interconnection transmission system, and the system includes:

[0040] An optical interconnection system, including at least two transmission dies, a control die, and an optical base chip. The first port of each of the transmission dies is connected to the first port of the control die, the second port of each of the transmission dies is connected to the first port of the optical base chip, and the second port of the optical base chip is connected to the second port of the control die. There is a first optical path connecting a sending die and a target receiving die in the optical interconnection system; wherein, the at least two transmission dies include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die;

[0041] A controller, configured to send a first building instruction to the optical base chip based on a request signal sent by at least one of the transmission dies, to establish at least one of the first optical paths in the optical interconnection system through the optical base chip; control the sending die to transmit an optical signal to the target receiving die through the first optical path; receive an acknowledgment signal sent by the target receiving die, where the acknowledgment signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

[0042] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the optical interconnection transmission method as described in any one of the first aspect are implemented.

[0043] In a fifth aspect, an embodiment of the present application further provides a computer program product, which is stored in a storage medium. The computer program product is executed by at least one processor to implement the steps of the optical interconnection transmission method as described in any one of the first aspect.

[0044] In the embodiment of the present application, the optical interconnection system is composed of multiple transmission dies, a control die, and an optical base chip. After receiving a request signal sent by at least one transmission die, the control die sends a first building instruction to the optical base chip to indicate to establish at least one first optical path between the sending die and the receiving die through the optical base chip. In this way, the sending die transmits an optical signal to the target receiving die through the first optical path, realizing the building of multiple first optical paths, enabling different signals to be executed in parallel on independent channels, effectively improving the parallel transmission efficiency between multiple transmission dies, adapting to large-scale complex system design, reducing communication bottlenecks, and improving the processing capacity and efficiency of the system. Description of the Drawings

[0045] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments of the present application. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0046] Figure 1 is a schematic structural diagram of an optical interconnection system in the related art;

[0047] Figure 2 is one of the schematic structural diagrams of an optical interconnection system in the embodiments of the present application;

[0048] Figure 3 is one of the flowcharts of an optical interconnection transmission method in the embodiments of the present application;

[0049] Figure 4 is the second flowchart of an optical interconnection transmission method in the embodiments of the present application;

[0050] Figure 5 is a schematic diagram of the optical network structure in the embodiments of the present application;

[0051] Figure 6 is the second schematic structural diagram of an optical interconnection system in the embodiments of the present application. Detailed implementation manners

[0052] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0053] To make the embodiments of the present application clearer, the following will first introduce the relevant technical knowledge involved in the embodiments of the present application as follows:

[0054] In the current optical interconnection system between chiplets, the optical signal emission module in the emitting chiplet receives an electrical signal and converts it into an optical signal; the optical signal transmission module transmits the optical signal emitted by the emitting chiplet to the receiving chiplet; the optical signal receiving module in the receiving chiplet detects the optical signal and converts it into an electrical signal.

[0055] In the related art, such as Figure 1A typical optical interconnection system between two die is shown. In the transmitting die of the system, an electrical signal is input into an optical emission module, and a driving circuit controls a laser to modulate the electrical signal into an optical signal, and a wavelength division multiplexer is used to combine optical signals of different wavelengths; an optical signal transmission module uses an optical fiber or a waveguide to transmit the optical signal to a receiving die; in the receiving die, after different-wavelength optical signals are decomposed into different optical paths by a wavelength demultiplexing device, the optical signal is converted into an electrical signal by a photodetector. This optical interconnection system realizes the interconnection between two die through the optical transmission module. Although it can perform ultra-high-speed and low-power consumption data transmission, its expansion ability and function multiplexing are limited. It can only support a single two-module combination, cannot meet the requirements of high integration, and is difficult to adapt to large-scale complex system designs that require multiple cores or multiple modules.

[0056] To solve the above technical deficiencies, embodiments of the present application provide an optical interconnection transmission method, system, storage medium, and program product. The following will be described in detail with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0057] Please refer to Figure 2 and 3 , Figure 2 which is one of the structural schematic diagrams of an optical interconnection system in an embodiment of the present application. The optical interconnection system includes at least two transmission die, a control die, and an optical base chip. The first port of each transmission die is connected to the first port of the control die, the second port of each transmission die is connected to the first port of the optical base chip, and the second port of the optical base chip is connected to the second port of the control die.

[0058] Among them, the optical interconnection system can be a hardware architecture that transmits data based on optical signals rather than traditional electrical signals. Its core advantages are high bandwidth, low latency, and electromagnetic interference resistance, and it is suitable for scenarios such as high-performance computing and data centers that require rapid exchange of massive amounts of data.

[0059] The above-mentioned transmission die refers to either a transmitting die or a receiving die. As the basic data transmission unit in the optical interconnection system, the transmitting die is responsible for converting an electrical signal into an optical signal, and the receiving die is responsible for converting an optical signal into an electrical signal. Each transmission die has two key ports. The first port is used to connect to the control die and is used to transmit instructions and status information. The second port is used to connect to the optical base chip and is used for actual optical signal transmission.

[0060] Such as Figure 2As shown in the figure, the control die is responsible for managing and optimizing the communication process between multiple dies, improving the signal transmission efficiency. The optical base chip is used to connect each transmitting die and receiving die, and according to the control signal of the control die, it realizes the routing and transmission of signals between the transmitting dies. The above control die can be understood as the core controller of the optical interconnection system, responsible for coordinating the communication paths between all transmitting dies. Its functions include receiving and parsing the request signals sent by the transmitting dies, dynamically generating optical path construction instructions according to requirements, monitoring the system status, and processing confirmation signals, etc. The above optical base chip can be the optical routing hub in the optical interconnection system, which integrates programmable optical switches or wavelength selection devices inside. The role of the optical base chip is to dynamically adjust the optical path connection path according to the instructions of the control die, and realize the directional transmission of optical signals between any two transmitting dies.

[0061] It is worth mentioning that the above first optical path can be a physical / logical path established by the optical base chip, which is used to directly guide the optical signal emitted by the transmitting die to the target receiving die. For example, the directional transmission of optical signals is realized by adjusting the micromirror or waveguide path inside the optical base.

[0062] It should be noted that the number and composition of at least two transmitting dies in this application can be designed according to the actual communication scenario requirements. For example, in a large-scale complex system, multiple transmitting dies and multiple receiving dies can be set. One transmitting die can correspond to multiple receiving dies, and an independent first optical path can be formed with each receiving die, realizing the parallel operation of multiple optical paths.

[0063] Please refer to Figure 3 , a specific optical interconnection transmission method applied to an optical interconnection system in an embodiment of this application specifically includes:

[0064] Step 11: Based on the request signals sent by at least one of the transmitting dies, the control die sends a first construction instruction to the optical base chip. The first construction instruction is used to indicate to establish at least one first optical path in the optical interconnection system through the optical base chip. The first optical path is the optical path between the transmitting die and the target receiving die; wherein, the at least two transmitting dies include the transmitting die and at least one receiving die, and the target receiving die is any one of the at least one receiving die.

[0065] In some embodiments, the transmitting die can send a path construction request signal to the control die. The control die sends a first construction instruction to the optical base chip. The optical base chip constructs an optical path under the first construction instruction. After the optical path construction is completed, the control die sends a path construction completion signal to the transmitting die and the receiving die, and the transmitting die starts to perform optical data transmission.

[0066] Among them, the control die generates a first building instruction and sends the instruction to the optical base die through the second port. The first building instruction may include: the second port number of die A to be sent and the second port number of the target receiving die B. After receiving the first building instruction, the optical base die establishes a physical optical path from die A to be sent to the target receiving die B through internal adjustable optical elements (such as Micro-Electro-Mechanical System (MEMS) micromirrors or wavelength multiplexers).

[0067] Exemplarily, in the optical interconnection system, there are transmission dies A, B, and C. If A needs to send optical data to B, the control die will send a first building instruction to the optical base die, requiring the second port of A to be connected to the second port of B through the optical channel in the optical base.

[0068] Step 12: The sending die transmits an optical signal to the target receiving die through the first optical path.

[0069] In this application, after the first optical path is established, die A can immediately start the data transmission module, convert the electrical signal data into optical pulse signals, and transmit them to the second port of the target receiving die B through the first optical path. For example, a laser diode is used to modulate the electrical signal into an optical signal. Among them, the optical base die ensures that the optical signal only propagates along the specified path (such as from A to B), avoiding interference from other transmission dies. In addition, the optical interconnection system in this application supports Wavelength Division Multiplexing (WDM), and can simultaneously transmit optical signals of multiple wavelengths to increase the bandwidth. After receiving the optical signal through its second port, the target receiving die B converts it into an electrical signal.

[0070] Step 13: The target receiving die sends an acknowledgment signal to the control die, and the acknowledgment signal is used to indicate that the target receiving die has successfully performed the cyclic redundancy check operation.

[0071] It can be understood that cyclic redundancy check, as an error detection technology in the field of data transmission, in the embodiments of this application, after receiving the optical signal transmitted by the sending die, the target receiving die calculates the check code by performing a Cyclic Redundancy Check (CRC) operation to verify the data integrity. In the case of successful CRC check, this data transmission is completed, and the next data transmission can be prepared.

[0072] Specifically, the target receiving die performs CRC check on the data, calculates the actually received check code, and compares it with the original check code appended in the data packet. If they are the same, the transmission is considered successful, and an acknowledgement signal is sent to the control die. If they do not match, it is determined that there is a transmission error, such as the influence of optical signal attenuation or interference problems.

[0073] In this application, the acknowledgement signal is sent back from the target receiving die to the control die through its first port, indicating that the CRC check is successful. After receiving the acknowledgement signal, the control die may release the optical path resource for reuse by other transmission tasks. If no acknowledgement is received (such as timeout or error), the control die can trigger a retransmission mechanism.

[0074] In this way, in the embodiments of this application, through the programmable optical path of the optical base chip, rapid connection switching between any two transmission dies is supported, effectively improving the parallel transmission efficiency between multiple transmission dies, adapting to large-scale complex system designs. At the same time, the control die centrally manages the optical path allocation, avoiding the limitations of fixed physical connections in traditional electrical interconnections, enabling different signals to be executed in parallel on independent channels, reducing communication bottlenecks, and enhancing the processing capacity and efficiency of the system.

[0075] Optionally, based on the request signals sent by at least one of the transmission dies, the control die sends a first setup instruction to the optical base chip to establish at least one first optical path in the optical interconnection system through the optical base chip, including:

[0076] The control die receives the first request signal sent by the sending die and receives the second request signal sent by the at least one receiving die;

[0077] Based on the first request signal and the second request signal, the control die sends the first setup instruction to the optical base chip;

[0078] The control die sends an acknowledgement signal to the sending die and the at least one receiving die, and the acknowledgement signal is used to indicate that the at least one first optical path is successfully set up.

[0079] In some embodiments, when the transmission die is a sending die and needs to send data to other transmission dies, such as the target receiving die, it will first send a first request signal to the control die through its first port. The first request signal may include: a sender identifier, such as the unique number of the sending die, and data priority or transmission requirement parameters, etc.

[0080] In some other embodiments, both the sending die and the receiving die send request signals to the control die. After the control die receives the request signals from both of them, it determines that a first optical path can be established between the sending die that sent the first request signal and the receiving die that sent the second request signal. Specifically, the control die can determine the sending die and the target receiving die by parsing the first request signal and the second request. For example, if the sending die A requests to transmit data to any one of the receiving die B and the receiving die C, the sending die A will send a first request signal to the control die. The first request signal can carry the identifiers of the receiving die B and the receiving die C, which are used to inform the control die of the available receiving dies. At the same time, the receiving die C can also send a second request signal to the control die, and then the control die can select the available target receiving die as the receiving die C. Or, the control die does not receive the second request signal sent by the receiving die, but can confirm that the receiving die B is currently idle while the receiving die C is in a non-idle state, then the control die can select the receiving die B as the target receiving die.

[0081] The above-mentioned second request signal may include a list of identifiers of the target receiving die. Among them, there may be only one identifier in the identifier list, indicating that the sending die transmits an optical signal to only one receiving die, or the list may include multiple identifiers, indicating that the sending die transmits optical signals to multiple receiving dies in parallel.

[0082] In this way, through the two-way request verification between the sending die and the receiving die in the embodiments of the present application, the establishment of multiple first optical paths is realized, ensuring that the sending die and the receiving die are synchronized and ready, and reducing resource conflicts.

[0083] Optionally, the target receiving die sending an acknowledgment signal to the control die includes:

[0084] When receiving the optical signal, the target receiving die performs a cyclic redundancy check operation;

[0085] When the check fails, the target receiving die sends a check failure signal to the control die;

[0086] Based on the check failure signal, the control die sends a retransmission data instruction to the sending die;

[0087] The control die receives the third request signal sent by the sending die and the fourth request signal sent by the target receiving die;

[0088] Based on the third request signal and the fourth request signal, the control die sends a second building instruction to the optical base chip, and the second building instruction is used to indicate the establishment of a second optical path between the sending die and the target receiving die;

[0089] The sending die transmits an optical signal to the target receiving die through the second optical path;

[0090] When the target receiving die receives the optical signal again, it performs a cyclic redundancy check operation, and when the check is successful, it sends a verification confirmation signal to the control die.

[0091] In some embodiments, as Figure 4 shown, if the cyclic redundancy check fails, the receiving die will feedback a cyclic redundancy check failure signal to the control die, that is, a check failure signal. After receiving the check failure signal, the control die will send a retransmission data instruction to the sending die, instructing the sending die to prepare to retransmit this group of optical data. The sending die will send a path setup request signal to the control die again, and the control die will send a second setup instruction to the optical base chip. The optical base chip will reconstruct the second optical path between the sending die and the target receiving die according to the second setup instruction.

[0092] After the optical path setup is completed, the control die sends a path setup completion signal to the sending die and the target receiving die, and the sending die starts to transmit optical data to the target receiving die. The target receiving die will feedback a check success signal to the control die only after the cyclic redundancy check is successful. And only after passing the cyclic redundancy check, will the current data transmission be completed and the next data transmission be prepared. Therefore, if the CRC check still fails, the control die needs to send a setup instruction to the optical base chip again, and the optical base chip reconstructs the optical path until the constructed optical path can enable the optical signal transmitted from the sending die to the target receiving die to pass the CRC check smoothly.

[0093] In this way, through the automatic retransmission mechanism and the secondary optical path reconstruction in the embodiments of the present application, the redundant path switching is triggered when the first transmission check fails, significantly improving the reliability of the transmitted optical data. At the same time, the control die coordinates the two ends to re-request and establish a new optical path, avoiding the interference or failure of the original path, and ensuring data integrity through double-end verification and confirmation, reducing the need for manual intervention, enhancing the fault tolerance and transmission stability of the system, and avoiding connection anomalies caused by unilateral misoperations.

[0094] Optionally, the optical base chip includes an N-level switching layer, and the N-level switching layer includes Mach-Zehnder interferometer (MZI) modules. The Nth-level switching layer in the N-level switching layer includes N - 1 MZI modules, and the first-level switching layer in the N-level switching layer includes 1 MZI module. Adjacent two MZI modules in each switching layer are connected by detectors, and N is a positive integer greater than or equal to 2;

[0095] The sending die transmits an optical signal to the target receiving die through the first optical path, including:

[0096] The transmitting die inputs optical signals from p first ports of the first optical path to transmit the optical signals output from q second ports of the first optical path to the target receiving die;

[0097] where p and q are positive integers, and both p and q are less than or equal to

[0098] It is worth mentioning that in the optical pedestal chip, the optical switching network is mainly composed of coupler modules based on Mach-Zehnder Interferometers (MZIs). These MZI modules serve as switching nodes. By precisely controlling the parameters of the phase modulators in the MZIs, continuous regulation of the intensity of the output optical signal can be achieved using interference. By making full use of the interference effect of the MZIs and the phase modulation characteristics of the optical signals, the optical signals can be flexibly transmitted and exchanged between different dies.

[0099] In this application, as Figure 5 shown, the optical switching network formed by the optical pedestal chip can be a triangular network structure. In some embodiments, for the entire optical switching network in the optical pedestal chip, the number of input ports and output ports of the optical switching network can be the same. When the number of input ports and output ports is the same, the number of MZI modules in the optical pedestal chip can be That is, the optical switching network includes N input ports and N output ports. When the number of input ports and output ports is equal, the optical switching network formed by the optical pedestal chip in this application is an equilateral triangle structure. Thus, the entire optical switching network includes N levels of switching layers, and each level of switching layer is composed of at least one MZI module. Two adjacent MZI modules are connected by detectors.

[0100] In the optical switching network formed by the optical pedestal chip, the first-level switching layer can include N - 1 MZI modules, the second-level switching layer can include N - 2 MZI modules, and the number of each layer decreases sequentially until the last layer, that is, the Nth-level switching layer, and the Nth-level switching layer can include only 1 MZI module.

[0101] For the first optical path, the first optical path itself can be an optical switching network or can be understood as an optical transmission path. The path of the first optical path is determined by the number and positions of the input ports where the optical signals enter the optical pedestal chip and the number and positions of the input ports where the optical signals exit the optical pedestal chip.

[0102] In a specific embodiment, for the first optical path with single-port input and multi-port output, a total of 5 switching nodes are used. For example, as Figure 4As shown, the optical signal is input from the input port I3. By adjusting the switching nodes MZI12, MZI21, MZI31, MZI32, and MZI41, the output power of the detectors D02 and D21 can be made 0, so as to realize that the input optical signal of the input port I3 is output from the output ports O3 to O5.

[0103] In a specific embodiment, for the first optical path with multi-port input, multi-port output, and the number of input ports less than the number of output ports, a total of 7 switching nodes are used. For example, as Figure 4 shown, the optical signals are respectively input from the input ports I1 to I3. By adjusting the switching nodes MZI12, MZI13, MZI14, MZI22, MZI23, MZI32, and MZI41, the output power of the detectors D12 and D32 can be made 0, and the input optical signals are output from the output ports O1 to O5 respectively according to the designed amplitude and phase.

[0104] In a specific embodiment, for the first optical path with multi-port input and multi-port output, a total of 10 switching nodes are used. For example, as Figure 4 shown, the optical signals are respectively input from the input ports I1 to I5. By adjusting the MZIs in the triangular network, the input optical signals can be output from the output ports O1 to O5 respectively according to the designed amplitude and phase.

[0105] Thus, the embodiments of the present application realize the linear matrix transformation of optical signals between any number of input ports and output ports, realize the optical interconnection between multi-die chips, allow dynamic adjustment of optical channels and wavelengths, ensure the transmission efficiency of control signals between multi-dies, and adapt to the design of large-scale complex systems.

[0106] Optionally, the optical switching network corresponding to the first optical path is determined based on the positions of the p first ports and the q second ports in the optical base chip. The optical switching network includes M switching layers. The Mth switching layer includes at least M MZI modules. The Mth switching layer in the M switching layers includes p parallel MZI modules corresponding to the p first ports. The q second ports are distributed at the output ports of the at least M MZI modules, and M is less than or equal to N;

[0107] The transmitting die inputs optical signals from the p first ports of the first optical path, including:

[0108] The transmitting die inputs optical signals to the p first ports;

[0109] Wherein, when the phase modulator parameters of the MZI modules in the M-th stage switching layer are set to first preset parameters and the coupler parameters of k MZI modules are set to second preset parameters, the optical signal is directed to the (M-1)-th stage switching layer in the first optical path until the optical signal is output from each of the q second ports, where k is an integer greater than or equal to 0.

[0110] In one embodiment, input from Figure 4 the single port I1 shown and output from the single port O1. When an optical signal is input to the optical switching network from the single port I1, it passes through the nodes in the first stage switching layer, that is, through MZI14. By controlling the parameters of the phase modulator of the MZI in MZI14, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the beam splitting ratio of the output coupler to 100:0, it is ensured that all optical signals are directed to the output port O1. Finally, the first optical path or the optical switching network for the optical signal to be input from a single port and output from a single port is constructed.

[0111] In one embodiment, input from Figure 4 the single port I1 shown and output from the dual ports O1 and O2. When an optical signal is input to the optical switching network from the single port I1, it passes through two stages of switching layers. By controlling the parameters of the phase modulator of the MZI module in the first stage switching layer, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, the optical signal can be directed to the output port O1 and the second stage switching layer according to the designed beam splitting ratio. Then, by controlling the parameters of the phase modulator of the MZI in the second stage switching layer, the intensity of the optical signal is precisely regulated using the interference effect. By adjusting the beam splitting ratio of the output coupler to 100:0, it is ensured that the output optical signal of the second stage switching layer is all directed to the output port O2. Finally, the first optical path or the optical switching network for the optical signal to be input from the single port I1 and output from the ports O1 and O2 is constructed.

[0112] In one embodiment, input from Figure 4The single-port I3 input and three-port O1, O3, O5 outputs are shown. When an optical signal is input into the optical switching network from the single port I3, it will pass through four levels of switching layers. By controlling the parameters of the phase modulators of the MZIs in the first-level switching layer, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, the optical signal can be directed to the output port O1 and the second-level switching layer according to the designed splitting ratio. By controlling the parameters of the phase modulators of the MZIs in the second-level switching layer, the intensity of the optical signal is precisely regulated using the interference effect. By adjusting the parameters of the output coupler, it is ensured that the output optical signal of the second-level switching layer is directed to the third-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the third-level switching layer, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, the optical signal can be directed to the output port O3 and the fourth-level switching layer according to the designed splitting ratio. By controlling the parameters of the phase modulators of the MZIs in the fourth-level switching layer, the intensity of the optical signal is precisely regulated using the interference effect. By adjusting the splitting ratio of the output coupler to 100:0, it is ensured that all the output optical signals of the fourth-level switching layer are directed to the output port O5. Finally, the first optical path or optical switching network for the optical signal to be input from the single port I3 to the multi-ports O1, O3, O5 output is constructed.

[0113] In one embodiment, from Figure 4 the shown dual-port I1, I3 inputs and dual-port O2 and O5 outputs are provided. When an optical signal is input into the optical switching network from the ports I1, I3, it will pass through four levels of switching layers. By controlling the parameters of the phase modulators of the MZIs in the first-level switching layer, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that all the output optical signals of the first-level switching layer are directed to the second-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the second-level switching layer, the intensity of the optical signal is precisely regulated using the interference effect. By adjusting the parameters of the output coupler, the optical signal can be directed to the output port O2 and the third-level switching layer according to the designed splitting ratio. By controlling the parameters of the phase modulators of the MZIs in the third-level switching layer, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that all the output optical signals of the third-level switching layer are directed to the fourth-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the fourth-level switching layer, the intensity of the input optical signal is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that all the output optical signals of the fourth-level switching layer are directed to the output port O5. Finally, the first optical path or optical switching network for the optical signal to be input from the dual-port I1I3 to the multi-ports O2, O5 output is constructed.

[0114] In one embodiment, from Figure 4The shown optical switch has two input ports I1 and I3 and three output ports O2, O3 and O5. When optical signals are input into the optical switching network from ports I1 and I3, they will pass through four levels of switching layers. By controlling the parameters of the phase modulators of the MZIs in the first-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the first-level switching layer are all directed to the second-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the second-level switching layer, the intensity of the optical signals is precisely regulated using the interference effect. By adjusting the parameters of the output coupler, the optical signals can be directed to the output port O2 and the third-level switching layer according to the designed splitting ratio. By controlling the parameters of the phase modulators of the MZIs in the third-level switching layer, the intensity of the optical signals is precisely regulated using the interference effect. By adjusting the parameters of the output coupler, the optical signals can be directed to the output port O3 and the fourth-level switching layer according to the designed splitting ratio. By controlling the parameters of the phase modulators of the MZIs in the fourth-level switching layer, the intensity of the optical signals is precisely regulated using the interference effect. By adjusting the splitting ratio of the output coupler to 0:100, the optical signals can be directed to the output port O5 according to the designed splitting ratio. Finally, the first optical path or optical switching network for optical signals input from the two input ports I1 and I3 to the three output ports O2, O3 and O5 is constructed.

[0115] In one embodiment, from Figure 4 The shown optical switch has three input ports I1, I3 and I5 and three output ports O2, O3 and O4. When optical signals are input into the optical switching network from ports I1, I3 and I5, they will pass through four levels of switching layers. By controlling the parameters of the phase modulators of the MZIs in the first-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the first-level switching layer are directed to the second-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the second-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the second-level switching layer are directed to the output port O2 and the third-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the third-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the third-level switching layer are directed to the output port O3 and the fourth-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the fourth-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the splitting ratio of the output coupler to 0:100, it is ensured that the output optical signals of the fourth-level switching layer are directed to the output port O5. Finally, the first optical path or optical switching network for optical signals input from the three input ports I1, I3 and I5 to the three output ports O2, O3 and O4 is constructed.

[0116] In one embodiment, from Figure 4The three-port I1, I3, and I5 inputs and five-port O1 to O5 outputs are shown. When optical signals are input into the optical switching network from ports I1, I3, and I5, they will pass through four levels of switching layers. By controlling the parameters of the phase modulators of the MZIs in the first-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the first-level switching layer are directed to output port O1 and the second-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the second-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the second-level switching layer are directed to output port O2 and the third-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the third-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the third-level switching layer are directed to output port O3 and the fourth-level switching layer. By controlling the parameters of the phase modulators of the MZIs in the fourth-level switching layer, the intensity of the input optical signals is precisely regulated using the interference effect. Subsequently, by adjusting the parameters of the output coupler, it is ensured that the output optical signals of the fourth-level switching layer are directed to output ports O4 and O5. Finally, the first optical path or optical switching network for optical signals to be input from the three ports I1, I3, and I5 to the five ports O1 to O5 is constructed.

[0117] It can be seen that in the above embodiments of the present application, by adjusting the parameters of the phase modulator, the interference effect is adjusted by changing the phase difference, thereby controlling the intensity of the output port, and by adjusting the splitting ratio, the distribution ratio of the optical signal between different output ports is adjusted, thereby realizing the operation of the optical signal. The switching layer structure used in the present application has higher efficiency than the general direct transmission structure and requires fewer MZI modules. Progressive design can be achieved through the programming design of the input ports, switching layers, specific MZI modules in the switching layers, and output ports, thereby supporting the linear matrix transformation of optical signals between any number of input ports and output ports and realizing optical interconnection between multi-die chips.

[0118] Optionally, the method further includes:

[0119] Determine the intensity of the target optical signal output after the optical signals input from the first input port and the second input port pass through the optical switching network according to the first information, the second information, and the phase difference between the optical signal input from the first input port and the optical signal input from the second input port;

[0120] Wherein, the first information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input from the first input port among the p first ports, and the second information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input from the second input port among the p first ports.

[0121] In the embodiments of the present application, the intensity of the output light can be controlled by adjusting the phase difference between the two MZI interference arms. Specifically, by adjusting the phase difference of the interference arms, the optical signals input from the first input port and the second input port undergo constructive interference or destructive interference at the output end.

[0122] In a specific embodiment, the optical signal input from the first input port is The optical signal input from the second input port is Wherein, I 10 and I 20 are the maximum amplitudes of I1 and I2 respectively; ω1 and ω2 are the angular frequencies of I1 and I2 respectively; and are the phases of I1 and I2 respectively.

[0123] Thus, the intensity of the output target optical signal is Wherein, is the phase difference between the input optical signals I1 and I2, that is

[0124] In some embodiments, when adjusted such that , the output light intensity is equal to the sum of the two input light intensities; when adjusted such that , the output light intensity is equal to the absolute value of the difference between the two input light intensities.

[0125] In this way, through the configuration algorithm, the amplitudes and phases of the input optical signals can be arbitrarily superimposed in the triangular network structure to achieve complex target output results.

[0126] Optionally, the intensity of the target optical signal is proportional to the target product, and the target product is the product of the intensity of the optical signal input from the first input port and the intensity of the optical signal input from the second input port.

[0127] In the embodiments of the present application, by adjusting the phase difference of the MZI, the output optical intensity can be made proportional to the product of the two input optical intensities. Using the MZI as a node of the optical switching network, the addition and subtraction of optical signals can be achieved by adjusting the phase difference of the interference arms. The multiplication and division of optical signals can also be achieved by adding a micro-ring resonator (MRR). The chip-level optical pedestal chip for inter-die interconnection realizes the efficient transmission of optical signals while realizing the functions of optical signal multiplexing, demultiplexing, multiplication, and division. In this way, the present application provides an expandable computing power base for the base station by supporting the on-demand superposition of wavelengths / die numbers, further meeting the computing power requirements. By adding an optical pre-computation unit, the load of digital signal processing (DSP) in the electrical domain is shared, the end-to-end delay is reduced, and the system processing capacity and efficiency are improved.

[0128] Optionally, the method further includes:

[0129] Before the first optical signal output from the second port is input into the target receiving die, the first optical signal is input into the micro-ring resonator in the optical interconnection system to obtain a second optical signal;

[0130] Wherein, the optical intensity of the second optical signal is greater than that of the first optical signal.

[0131] In some embodiments, by inputting the output optical signal of the MZI into the MRR, the resonance enhancement effect of the MRR can be utilized to further amplify the intensity of the optical signal, thereby realizing the multiplication of the optical signal. The filtering characteristics of the MRR can also be used to process the optical signal, thereby realizing the division of the optical signal.

[0132] Specifically, after two optical signals with optical intensities I1 and I2 are input into the MZI module in the first optical path, the output result is Therefore, by inputting the first optical signal output from the second port into the MRR, the resonance condition of the MRR can be adjusted so that its transfer function performs non-linear modulation on I out so that the output optical intensity is equal to the product or ratio of the input optical intensities.

[0133] In this way, in the embodiments of the present application, the optical pedestal chip realizes the data transmission from a single die to multiple dies and from multiple dies to multiple dies through the optical switching network, greatly improving the data transmission efficiency. At the same time, using the optical switching network composed of MZIs, the basic operations of optical signals are realized, further enhancing the computing power of the chip.

[0134] Please refer to Figure 6, embodiments of the present application provide an optical interconnection system, which includes at least two transmission die, a control die, and an optical base chip. The first port of each transmission die is connected to the first port of the control die, the second port of each transmission die is connected to the first port of the optical base chip, and the second port of the optical base chip is connected to the second port of the control die;

[0135] The control die is configured to send a first setup instruction to the optical base chip based on a request signal sent by at least one of the transmission die. The first setup instruction is used to indicate establishing at least one first optical path through the optical base chip in the optical interconnection system. The first optical path is an optical path between a sending die and a target receiving die. Among them, the at least two transmission die include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die;

[0136] The sending die is configured to transmit an optical signal to the target receiving die through the first optical path;

[0137] The target receiving die is configured to send an acknowledgment signal to the control die, and the acknowledgment signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

[0138] Optionally, the control die is specifically configured to:

[0139] Receive a first request signal sent by the sending die and receive a second request signal sent by the at least one receiving die;

[0140] Send the first setup instruction to the optical base chip based on the first request signal and the second request signal;

[0141] Send an acknowledgment signal to the sending die and the at least one receiving die, and the acknowledgment signal is used to indicate that the at least one first optical path has been successfully set up.

[0142] Optionally, the target receiving die is specifically configured to:

[0143] Perform a cyclic redundancy check operation when receiving an optical signal;

[0144] Send a check failure signal to the control die when the check fails;

[0145] The control die is specifically configured to:

[0146] Send a retransmission data instruction to the sending die based on the check failure signal;

[0147] Receive the third request signal sent by the sending die and the fourth request signal sent by the target receiving die;

[0148] Based on the third request signal and the fourth request signal, send a second building instruction to the optical base chip, where the second building instruction is used to indicate establishing a second optical path between the sending die and the target receiving die;

[0149] The sending die is specifically used for:

[0150] Transmit an optical signal to the target receiving die through the second optical path;

[0151] The target receiving die is specifically used for:

[0152] In the case of receiving an optical signal again, perform a cyclic redundancy check operation, and in the case of successful verification, send a verification confirmation signal to the control die.

[0153] Optionally, the optical base chip includes an N-level switching layer, and the N-level switching layer includes a number of Mach-Zehnder interferometer (MZI) modules. The Nth-level switching layer in the N-level switching layer includes N - 1 MZI modules, and the first-level switching layer in the N-level switching layer includes 1 MZI module. Adjacent two MZI modules in each switching layer are connected by detectors, and N is a positive integer greater than or equal to 2;

[0154] The sending die is specifically used for:

[0155] Input an optical signal from p first ports of the first optical path to transmit the optical signal output from q second ports of the first optical path to the target receiving die;

[0156] where p and q are positive integers, and both p and q are less than or equal to

[0157] Optionally, the optical switching network corresponding to the first optical path is determined based on the positions of the p first ports and the q second ports in the optical base chip. The optical switching network includes an M-level switching layer, and the M-level switching layer includes at least M MZI modules. The Mth-level switching layer in the M-level switching layer includes p parallel MZI modules corresponding to the p first ports, and the q second ports are distributed at the output ports of the at least M MZI modules, and M is less than or equal to N;

[0158] The sending die is specifically used for:

[0159] Input optical signals to the p first ports; wherein, when the phase modulator parameters of the MZI modules in the M-th stage switching layer are set to first preset parameters, and the coupler parameters of k MZI modules are second preset parameters, direct the optical signals to the (M-1)-th stage switching layer in the first optical path until the optical signals are output from each of the q second ports, where k is an integer greater than or equal to 0.

[0160] Optionally, the optical interconnection system is further configured to:

[0161] Determine the intensity of the target optical signal output after the optical signals input to the first input port and the optical signals input to the second input port pass through the optical switching network according to the first information, the second information, and the phase difference between the optical signals input to the first input port and the optical signals input to the second input port.

[0162] Wherein, the first information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input to the first input port among the p first ports, and the second information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input to the second input port among the p first ports.

[0163] Optionally, the intensity of the target optical signal is proportional to the target product, and the target product is the product of the intensity of the optical signal input to the first input port and the intensity of the optical signal input to the second input port.

[0164] Optionally, the optical interconnection system is further configured to:

[0165] Before the first optical signal output from the second port is input to the target receiving die, input the first optical signal into the microring resonator in the optical interconnection system to obtain a second optical signal.

[0166] Wherein, the optical intensity of the second optical signal is greater than the optical intensity of the first optical signal.

[0167] The optical interconnection system provided by the embodiments of the present application can execute the method embodiments shown above. Figure 3 The implementation principle and technical effects are similar, and will not be elaborated here in this embodiment.

[0168] In the embodiments of the present application, an optical interconnection transmission system is further provided, and the system includes:

[0169] An optical interconnection system, including at least two transmission dies, a control die, and an optical base chip. A first port of each of the at least two transmission dies is connected to a first port of the control die, a second port of each of the at least two transmission dies is connected to a first port of the optical base chip, and a second port of the optical base chip is connected to a second port of the control die. There is a first optical path connecting a sending die and a target receiving die in the optical interconnection system; wherein, the at least two transmission dies include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die.

[0170] A controller, configured to send a first building instruction to the optical base chip based on a request signal sent by at least one of the at least two transmission dies, to establish at least one of the first optical paths in the optical interconnection system through the optical base chip; control the sending die to transmit an optical signal to the target receiving die through the first optical path; receive an acknowledgement signal sent by the target receiving die, where the acknowledgement signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

[0171] The optical interconnection transmission system provided by an embodiment of the present application can execute the Figure 3 method embodiment shown above. Its implementation principle and technical effects are similar, and will not be elaborated here in this embodiment.

[0172] An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements each process of the optical interconnection transmission method embodiment as described above Figure 3 and can achieve the same technical effects. To avoid repetition, it will not be elaborated here. Among them, the computer-readable storage medium is, for example, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disc, etc.

[0173] Another embodiment of the present application provides a computer program / program product. The computer program / program product is stored in a storage medium, and the computer program / program product is executed by at least one processor to implement each process of the Figure 1 optical interconnection transmission method embodiment as described above and can achieve the same technical effects. To avoid repetition, it will not be elaborated here.

[0174] In several embodiments provided by the present application, it should be understood that the disclosed methods and apparatuses can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of the apparatus or unit can be in electrical, mechanical or other forms.

[0175] In addition, each functional unit in various embodiments of the present application can be integrated in a processing unit, or each unit can be physically included separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware, or in the form of a combination of hardware and software functional units.

[0176] The above-mentioned integrated unit implemented in the form of a software functional unit can be stored in a computer-readable storage medium. The above-mentioned software functional unit stored in a storage medium includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute some steps of the transceiver methods described in various embodiments of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0177] The above is the preferred implementation manner of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle described in the present application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present application.

Claims

1. A method for optical interconnection transmission, characterized in that, Applied to an optical interconnection system, the optical interconnection system includes at least two transmission die, a control die, and an optical base chip. The first port of each transmission die is connected to the first port of the control die, the second port of each transmission die is connected to the first port of the optical base chip, and the second port of the optical base chip is connected to the second port of the control die; the method includes: Based on a request signal sent by at least one of the transmission die, the control die sends a first setup instruction to the optical base chip, and the first setup instruction is used to indicate establishing at least one first optical path through the optical base chip in the optical interconnection system. The first optical path is an optical path between a sending die and a target receiving die; wherein, the at least two transmission die include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die; The sending die transmits an optical signal to the target receiving die through the first optical path; The target receiving die sends a confirmation signal to the control die, and the confirmation signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

2. The method according to claim 1, wherein The control die sends a first setup instruction to the optical base chip based on a request signal sent by at least one of the transmission die to establish at least one first optical path through the optical base chip in the optical interconnection system, including: The control die receives a first request signal sent by the sending die and a second request signal sent by the at least one receiving die; Based on the first request signal and the second request signal, the control die sends the first setup instruction to the optical base chip; The control die sends a confirmation signal to the sending die and the at least one receiving die, and the confirmation signal is used to indicate that the at least one first optical path has been successfully set up.

3. The method according to claim 1 or 2, characterized in that The target receiving die sends a confirmation signal to the control die, including: When receiving the optical signal, the target receiving die performs a cyclic redundancy check operation; When the check fails, the target receiving die sends a check failure signal to the control die; Based on the check failure signal, the control die sends a retransmission data instruction to the sending die; The control die receives a third request signal sent by the sending die and a fourth request signal sent by the target receiving die; Based on the third request signal and the fourth request signal, the control die sends a second setup instruction to the optical base chip, and the second setup instruction is used to indicate establishing a second optical path between the sending die and the target receiving die; The sending die transmits an optical signal to the target receiving die through the second optical path; When receiving the optical signal again, the target receiving die performs a cyclic redundancy check operation, and when the check is successful, the target receiving die sends the confirmation signal to the control die.

4. The method according to claim 1, characterized in that The optical base chip includes an N-level switching layer, and the N-level switching layer includes Mach-Zehnder interferometer (MZI) modules. The Nth-level switching layer in the N-level switching layer includes N-1 MZI modules, and the first-level switching layer in the N-level switching layer includes 1 MZI module. Adjacent two MZI modules in each switching layer are connected by detectors. N is a positive integer greater than or equal to 2; The sending die transmits an optical signal to the target receiving die through the first optical path, including: The sending die inputs optical signals from p first ports of the first optical path to transmit the optical signals output from q second ports of the first optical path to the target receiving die; where p and q are positive integers, and both p and q are less than or equal to 5. The method according to claim 4, characterized in that, The optical switching network corresponding to the first optical path is determined based on the positions of the p first ports and the q second ports in the optical base chip. The optical switching network includes M levels of switching layers. The M-level switching layer includes at least M MZI modules. The Mth-level switching layer in the M-level switching layer includes p parallel MZI modules corresponding to the p first ports. The q second ports are distributed at the output ports of the at least M MZI modules, and M is less than or equal to N; The sending die inputs optical signals from p first ports of the first optical path, including: The sending die inputs optical signals to the p first ports; Wherein, when the phase modulator parameters of the MZI modules in the Mth-level switching layer are set to first preset parameters and the coupler parameters of k MZI modules are second preset parameters, the optical signals are directed to the (M - 1)th-level switching layer in the first optical path until the optical signals are output from each of the q second ports, and k is an integer greater than or equal to 0.

6. The method according to claim 4 or 5, characterized in that, The method further includes: Determining the intensity of the target optical signal output after the optical signals input from the first input port and the second input port pass through the optical switching network according to the first information, the second information, and the phase difference between the optical signal input from the first input port and the optical signal input from the second input port; Wherein, the first information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input from the first input port among the p first ports, and the second information includes the intensity, maximum amplitude, angular frequency, and phase of the optical signal input from the second input port among the p first ports.

7. The method according to claim 6, characterized in that, The intensity of the target optical signal is proportional to the target product, and the target product is the product of the intensity of the optical signal input from the first input port and the intensity of the optical signal input from the second input port.

8. The method according to claim 6, characterized in that, The method further includes: Before the first optical signal output from the second port is input to the target receiving die, inputting the first optical signal into a microring resonator in the optical interconnection system to obtain a second optical signal; Wherein, the optical intensity of the second optical signal is greater than the optical intensity of the first optical signal.

9. An optical interconnection system, characterized in that, The optical interconnection system includes at least two transmission dies, a control die, and an optical base chip. The first port of each transmission die is connected to the first port of the control die, the second port of each transmission die is connected to the first port of the optical base chip, and the second port of the optical base chip is connected to the second port of the control die; The control die is configured to send a first building instruction to the optical base die based on a request signal sent by at least one of the transmission dies, where the first building instruction is used to indicate establishing at least one first optical path through the optical base die in the optical interconnection system, and the first optical path is an optical path between a sending die and a target receiving die; wherein, the at least two transmission dies include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die; The sending die is configured to transmit an optical signal to the target receiving die through the first optical path; The target receiving die is configured to send an acknowledgement signal to the control die, and the acknowledgement signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

10. An optical interconnection transmission system, characterized in that, The system includes: An optical interconnection system, including at least two transmission dies, a control die, and an optical base die. A first port of each transmission die is connected to a first port of the control die, a second port of each transmission die is connected to a first port of the optical base die, and a second port of the optical base die is connected to a second port of the control die. There is a first optical path connecting the sending die and the target receiving die in the optical interconnection system; wherein, the at least two transmission dies include the sending die and at least one receiving die, and the target receiving die is any one of the at least one receiving die; A controller, configured to send a first building instruction to the optical base die based on a request signal sent by at least one of the transmission dies, so as to establish at least one of the first optical paths through the optical base die in the optical interconnection system; control the sending die to transmit an optical signal to the target receiving die through the first optical path; receive the acknowledgement signal sent by the target receiving die, and the acknowledgement signal is used to indicate that the target receiving die has successfully performed a cyclic redundancy check operation.

11. A computer-readable storage medium for storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps in the optical interconnection transmission method according to any one of claims 1 to 8.

12. A computer program product, characterized in that, Including computer instructions, which when executed by a processor implement the steps in the optical interconnection transmission method according to any one of claims 1 to 8.

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