Electronic device

Abstract

The invention discloses electronic equipment. The electronic equipment comprises a camera module and a mainboard bracket, wherein the camera module comprises a camera and a camera bracket, and the camera is arranged on the camera bracket in an overlapping manner; a supporting plate is arranged in the circumferential direction of the camera support, and at least one protruding supporting part is arranged on the edge of the supporting plate; the mainboard support is provided with a first through hole, and at least two pressing structures perpendicular to the mainboard support are arranged around the first through hole. Wherein the camera penetrates through the first through hole and is partially arranged on the first side of the main board support, and the camera support is located on the second side of the main board support; the pressing structure is arranged on the second side of the mainboard support and faces the camera support, and the pressing structure is pressed on the supporting part.

Description

Technical Field

[0001] This application belongs to the field of communication technologies, and particularly relates to an electronic device. Background Art

[0002] Nowadays, the overall camera performance of terminals is becoming increasingly important, and periscope cameras are all applied. Periscope cameras can improve the zoom ability, enabling users to capture clearer distant scenes, meeting people's needs for telephoto photography, and enhancing the usage performance of mobile phones.

[0003] When a periscope camera is assembled inside a terminal, it needs to cooperate with other components of the terminal, such as cooperating with components like the motherboard upper cover, motherboard, motherboard bracket, and battery cover. Therefore, how to ensure the stability of the overall structure of the whole machine in the thickness direction of the electronic device when the periscope camera cooperates with other components of the terminal is an urgent problem to be solved. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an electronic device to solve the problem of the stability of the camera and the overall structure of the whole machine in the thickness direction of the electronic device.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, the embodiments of this application provide an electronic device, including: a camera module and a motherboard bracket;

[0007] Wherein, the camera module includes: a camera and a camera bracket, and the camera is stacked on the camera bracket;

[0008] The camera bracket is circumferentially provided with a support plate, and at least one protruding support portion is provided at the edge of the support plate;

[0009] The motherboard bracket is provided with a first through hole, and around the first through hole, at least two pressing structures perpendicular to the motherboard bracket are provided;

[0010] Wherein, the camera passes through the first through hole and is partially disposed on a first side of the motherboard bracket, and the camera bracket is located on a second side of the motherboard bracket; the pressing structure is disposed on the second side of the motherboard bracket facing the camera bracket, and the pressing structure presses on the support portion.

[0011] In an embodiment of the present application, a first through hole is formed in the main board bracket, and the camera passes through the first through hole and partially extends to the first side of the main board bracket. The camera bracket is located on the second side of the main board bracket. A support plate is circumferentially arranged on the camera bracket, and a protruding support portion is provided at the edge of the support plate. A pressing structure is arranged around the first through hole of the main board bracket, and the pressing structure presses against the support portion on the camera. In this way, when the battery cover or the camera is subjected to external pressure, the camera bracket can support the main board bracket, thereby supporting the main board and ensuring the stability of the internal structure of the electronic device in the thickness direction of the electronic device. Description of the Drawings

[0012] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, where:

[0013] Figure 1 is one of the schematic diagrams of the support portion and the pressing structure of the embodiment of the present application;

[0014] Figure 2 is another schematic diagram of the support portion and the pressing structure of the embodiment of the present application;

[0015] Figure 3 is one of the schematic diagrams of the structure of the camera bracket of the embodiment of the present application;

[0016] Figure 4 is another schematic diagram of the structure of the camera bracket of the embodiment of the present application;

[0017] Figure 5 is still another schematic diagram of the structure of the camera bracket of the embodiment of the present application;

[0018] Figure 6 is one of the cross-sectional schematic diagrams of the electronic device of the embodiment of the present application;

[0019] Figure 7 is another cross-sectional schematic diagram of the electronic device of the embodiment of the present application;

[0020] Figure 8 is one of the schematic diagrams of the structure of the upper cover of the main board of the embodiment of the present application;

[0021] Figure 9 is another schematic diagram of the structure of the upper cover of the main board of the embodiment of the present application;

[0022] Figure 10 is still another schematic diagram of the structure of the upper cover of the main board of the embodiment of the present application;

[0023] Figure 11 is one of the schematic diagrams of the structure of the camera module of the embodiment of the present application;

[0024] Figure 12 It is the second schematic structural diagram of the camera module according to an embodiment of the present application;

[0025] Figure 13 It is the third schematic structural diagram of the camera module according to an embodiment of the present application;

[0026] Figure 14 It is the first schematic diagram of the camera position of the electronic device according to an embodiment of the present application;

[0027] Figure 15 It is the partial enlarged schematic diagram of the cooperation between the camera bracket and the main board upper cover according to an embodiment of the present application;

[0028] Figure 16 It is the exploded view of the structure of the electronic device according to an embodiment of the present application;

[0029] Figure 17 It is the third cross-sectional schematic diagram of the electronic device according to an embodiment of the present application;

[0030] Figure 18 It is the second schematic diagram of the camera position of the electronic device according to an embodiment of the present application;

[0031] Figure 19 It is the fourth cross-sectional schematic diagram of the electronic device according to an embodiment of the present application;

[0032] Figure 20 It is the fifth cross-sectional schematic diagram of the electronic device according to an embodiment of the present application;

[0033] Figure 21 It is the schematic diagram of the main board bracket according to an embodiment of the present application;

[0034] Figure 22 It is the schematic diagram of the decorative part bracket according to an embodiment of the present application;

[0035] Figure 23 It is the third schematic diagram of the camera position of the electronic device according to an embodiment of the present application.

[0036] Reference numerals: 1, camera; 2, camera bracket; 3, main board upper cover; 4, main board bracket; 5, battery cover; 6, screen assembly; 7, main board; 11, lens; 12, prism; 13, sensor; 21, limiting groove; 22, support plate; 221, support portion; 23, first colloid structure; 24, second colloid structure; 31, limiting protrusion; 32, first groove; 41, first through hole; 42, pressing structure; 121, third groove; 1211, fourth colloid structure; 131, fifth colloid structure; 51, camera decoration part; 52, third colloid structure; 53, battery cover film; 54, decoration part bracket; 55, sixth colloid structure; 541, notch. Detailed implementation manners

[0037] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0038] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0039] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application.

[0040] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0041] A camera module and an electronic device according to an embodiment of the present application will be described below with reference to the accompanying drawings.

[0042] As Figures 1 to 22 shown, an embodiment of the present application provides an electronic device, including: a camera module and a main board bracket 4;

[0043] Among them, the camera module includes: a camera 1 and a camera bracket 2, and the camera 1 is stacked on the camera bracket 2; a support plate 22 is circumferentially arranged on the camera bracket 2, and at least one protruding support portion 221 is provided at the edge of the support plate 22; a first through hole 41 is formed in the main board bracket 4, and at least two pressing structures 42 perpendicular to the main board bracket 4 are arranged around the first through hole 41;

[0044] Among them, the camera 1 passes through the first through hole 41 and is partially arranged on the first side of the main board bracket 4, and the camera bracket 2 is located on the second side of the main board bracket 4; the pressing structure 42 is arranged on the second side of the main board bracket facing the camera bracket 2, and the pressing structure 42 presses on the support portion 221.

[0045] In this embodiment, the camera module may be a camera module equipped with a periscope camera, and the camera 1 may be a periscope camera. The camera module is installed under the battery cover of the electronic device and corresponds to the lens on the battery cover, and the camera module is fixed to the upper cover 3 of the main board of the electronic device. Specifically, the camera module includes a camera 1 and a camera bracket 2, the camera bracket 2 is used to fix the camera 1, and the camera bracket 2 is fixed to the upper cover 3 of the main board and the main board bracket 4 of the electronic device.

[0046] Such as Figure 1 、 Figure 2 and Figure 3 shown, a support plate 22 is circumferentially arranged on the camera bracket 2, and at least one protruding support portion 221 is provided at the edge of the support plate 22. The support plate 22 can be used to support the camera 1. A second groove is formed in the camera bracket 2, and this second groove is used to fix the prism of the camera module. As Figures 3 to 5 shown, where Figure 3 is the top view of the camera bracket 2, Figure 4 is the bottom view of the camera bracket 2, Figure 5 is the front view of the camera bracket. Around the opening of this second groove, there is a support plate 22 that bends and extends around the opening. One or more protruding support portions 221 are arranged at the edge of the support plate 22. The support portion 221 can be located at the corner position of the support plate 22, and the support portion 221 protrudes in the direction of the extension of the support plate 22. The support portion 221 can be rectangular or rectangular with rounded edges, or can be other shapes, which are not limited here.

[0047] The main board bracket 4 is provided with a first through hole 41. After the electronic device is assembled, the lens 11 of the camera 1 passes through this first through hole 41 and corresponds to the position of the lens on the battery cover 5. As Figure 6As shown, the lens 11 is located on the first side of the main board bracket 4, and the camera bracket 2 is located on the second side of the main board bracket 4. Around the first through hole 41, one or more pressing structures 42 extending towards the camera bracket 2 are provided. The pressing structure 42 can also be referred to as a pressing foot. As Figure 1 and Figure 2 shown, the pressing structure 42 is located on the second side surface of the main board bracket 4 and extends in the direction towards the camera bracket 2. It can also be understood as extending in the direction towards the camera bracket 2 and perpendicular to the main board bracket 4. The pressing structure 42 presses against the supporting portion 221, and can press the supporting portion 221 onto the main board upper cover 3.

[0048] Optionally, the number and position of the pressing structures 42 correspond to the number and position of the supporting portions 221. As Figure 1 shown, it is Figure 3 a schematic diagram of the two upper supporting portions 221 in Figure 2 pressing against the pressing structure 42; as Figure 3 shown, it is

[0049] a schematic diagram of the two lower supporting portions 221 in

[0050] pressing against the pressing structure 42. The main board bracket 4 has a pressing structure 42 corresponding to each supporting portion 221. The pressing structure 42 and the supporting portion 221 have a zero-gap fit in the Z direction (the thickness direction of the electronic device). The zero-gap can be understood as being in contact with each other without a gap.

[0051] As an optional embodiment, the electronic device further includes:

[0052] The upper cover 3 of the main board, the upper cover 3 of the main board is located on the second side of the main board bracket 4, and the upper cover 3 of the main board is provided with a first groove 32, and the camera bracket 2 is clamped in the first groove 32;

[0053] Wherein, one of the bottom of the camera bracket 2 and the inner wall of the first groove 32 is provided with a limiting groove 21, and the other is provided with a limiting protrusion 31; the limiting protrusion 31 is clamped in the limiting groove 21.

[0054] For example Figure 1 Or Figure 4 As shown: the camera bracket 2 is provided with a limiting groove 21 towards the bottom of the first groove 32, as Figure 8 shown, the inner wall of the first groove 32 is provided with a limiting protrusion 31 protruding towards the inner space of the first groove 32; the limiting protrusion 31 is clamped in the limiting groove 21, and the camera bracket 2 is fixed to the upper cover 3 of the main board. Or, the camera bracket 2 is provided with a limiting protrusion 31 (not shown in the figure) towards the bottom of the first groove 32, and the inner wall of the first groove 32 is provided with a limiting groove 21 (not shown in the figure); the limiting protrusion 31 on the camera bracket 2 is clamped in the limiting groove 21 on the inner wall of the first groove 32.

[0055] In this embodiment, as Figure 7 shown, the upper cover 3 of the main board and the camera bracket 2 are both located on the second side of the main board bracket 4, and the camera bracket 2 is fixed to the upper cover 3 of the main board. A first groove 32 is opened on the upper cover 3 of the main board, as Figures 8 to 10 shown. The camera bracket 2 is partially fixed in the first groove 32. Taking the bottom of the camera bracket 2 being provided with a limiting groove 21 and the inner wall of the first groove 32 being provided with a limiting protrusion 32 as an example, as Figure 11 and Figure 12 shown; a limiting protrusion 31 is provided in the first groove 32 of the upper cover 3 of the main board, the bottom of the camera bracket 2 is located in the first groove 32, and the limiting protrusion 31 is clamped in the limiting groove 21, so that the camera bracket 2 is fixed to the upper cover 3 of the main board, thereby fixing the camera module to the upper cover 3 of the main board.

[0056] As Figure 7 and Figure 11 shown, the limiting groove 21 is located at the bottom of the side of the camera bracket 2 facing the first groove 32. The limiting groove 21 can be a concave stepped shape, or it can be understood that both sides of the limiting groove 21 are open, as Figure 12 shown, Figure 12 showing the bottom of the camera module; or, the limiting groove 21 can also be a groove type with one side open.

[0057] The number of the limiting grooves 21 is not limited in this application, as long as the stability between the camera bracket 2 and the main board upper cover 3 can be satisfied. For example Figure 4 and Figure 12 As shown, a limiting groove 21 can be respectively arranged on each side of the bottom of the camera bracket 2, or only on two opposite sides respectively, or the bottom of the camera bracket 2 can be entirely set as the limiting groove 21.

[0058] The limiting protrusions 31 arranged on the main board upper cover 3 correspond to the limiting grooves 21. The limiting protrusions 31 on the main board upper cover 3 are, for example Figure 8 、 Figure 9 、 Figure 10 As shown. A first groove 32 is formed on the main board upper cover 3. It should be noted that the bottom of the first groove 32 can have through holes, such as partial openings, or no through holes can be provided. As Figure 8 and Figure 9 are schematic diagrams of the bottom of the first groove 32 having through holes. The limiting protrusions 31 are arranged on the inner wall of the first groove 32 and protrude towards the inner space of the first groove 32. The number of the limiting protrusions 31 can be the same as that of the limiting grooves 21.

[0059] When the camera bracket 2 is arranged in the first groove 32, the limiting protrusions 31 are snapped into the sunken positions of the limiting grooves 21, so that the camera bracket 2 and the main board upper cover 3 are fixed in the Z direction (the thickness direction of the electronic device). The structure of the camera module after being installed on the main board upper cover 3 is as Figure 1 、 Figure 2 、 Figure 6 and Figure 7 shown. The limiting protrusions 31 extend to the sunken positions of the limiting grooves 21 to realize the support of the camera module.

[0060] The partial enlargement of the cooperation between the limiting groove 21 and the limiting protrusion 31 is as Figure 13 shown. In the sectional view shown in Figure 13 , there are two mutually cooperating limiting structures between the camera bracket 2 and the main board upper cover 3 in the left - right direction, one on the left and one on the right. The limiting protrusion 31 on the left and the limiting groove 21 have zero - clearance fit in the Z direction (the thickness direction of the electronic device). Optionally, in the horizontal direction shown in Figure 13 , the limiting protrusion 31 on the left and the limiting groove 21 have zero - clearance fit.

[0061] Optionally, in the right - hand side shown in Figure 13 , the limiting protrusion 31 and the limiting groove 21 have zero - clearance fit in the Z direction (the thickness direction of the electronic device). Optionally, in Figure 13In the horizontal direction as shown, there may be a gap between the limiting protrusion 31 on the right side and the limiting groove 21.

[0062] As Figure 13 shown, except for the position where the limiting protrusion 31 and the limiting groove 21 cooperate, there are gaps at the remaining positions between the main board upper cover 3 and the camera bracket 2, such as Figure 13 the d position and the e position shown. Since the limiting protrusion 31 and the limiting groove 21 are in zero-gap fit in the thickness direction of the electronic device, the main board upper cover 3 supports the camera bracket 2 in the thickness direction of the electronic device. Setting gaps at the remaining positions between the main board upper cover 3 and the camera bracket 2 can avoid direct contact between the two, thereby preventing damage to the camera bracket 2 or the main board upper cover 3 caused by collision.

[0063] The back of the electronic device is as Figure 14 shown. Making a cross-section in the A1 direction as Figure 14 shown, a cross-sectional schematic diagram of the camera module is obtained. As Figure 15 shown, there are two mutually cooperating limiting structures between the camera bracket 2 and the main board upper cover 3 in the up and down directions, one above the other. Figure 15 The limiting protrusion 31 and the limiting groove 21 located above in are in zero-gap fit in the Z direction (the thickness direction of the electronic device), and there can be a gap between the two in the horizontal direction. Figure 15 The limiting protrusion 31 and the limiting groove 21 located below in are in zero-gap fit in the Z direction (the thickness direction of the electronic device), and there can be a gap between the two in the horizontal direction.

[0064] By the cooperation of the limiting groove 21 of the camera bracket 2 and the limiting protrusion 31 of the main board upper cover 3, the relative horizontal position between the camera module and the main board upper cover can be guaranteed, and the position of the camera module and the main board upper cover in the thickness direction of the electronic device can be guaranteed, thereby ensuring the concentricity of the camera and the lens silk screen on the appearance of the electronic device.

[0065] The supporting part 221 can be located above the main board upper cover 3 or the main board 7 ( Figure 1 and Figure 2 the directions in), as Figure 1 shown, the left supporting part 221 is located above the main board upper cover 3, and there can be a certain gap between the supporting part 221 and the main board upper cover 3; Figure 1The support portion 221 on the right side is located above the main board 7, and there can be a certain gap between the support portion 221 and the main board 7. By providing a gap between the support portion 221 and the main board upper cover 3 or the main board 7, it can be ensured that when an external force is applied, the pressing structure 42 pressing against the support portion 221 will not cause collision or damage to the main board upper cover 3 or the main board 7. In some embodiments, a part of the support portion 221 is located on the side of the main board upper cover 3 facing the main board bracket 4, and another part of the support portion 221 is located on the side of the main board 7 facing the main board bracket 4. When pressure is applied, the support portions 221 form a misaligned snap connection, further enhancing stability. The setting of the pressing structure 42 can ensure that the camera module is pressed against the limiting protrusion 31 of the main board upper cover 3 under the action of the main board bracket 4, ensuring the fixation of the camera module in the Z direction (the thickness direction of the electronic device) in the whole machine.

[0066] In this embodiment, a limiting groove 21 is provided at the bottom of the camera bracket 2 of the camera module. The limiting groove 21 is snap-connected to the limiting protrusion 31 of the main board upper cover 3 to achieve the fixation between the camera module and the main board upper cover 3, ensuring the stability of the camera module in the thickness direction of the electronic device. Through the cooperative fixation of this limiting structure, when the battery cover exerts pressure on the camera module, the main board upper cover can also provide good support for the camera module, while avoiding squeezing the screen part of the electronic device and enhancing the stability of the internal structure of the electronic device.

[0067] It should be noted that when a limiting protrusion 32 is provided at the bottom of the camera bracket 2 and a limiting groove 21 is provided on the inner wall of the first groove 32, the snap connection situation between the limiting protrusion 32 and the limiting groove 21 is similar to that of the above embodiment and will not be elaborated here.

[0068] It should be noted that the thickness direction of the electronic device described in this application refers to the direction perpendicular to the screen of the electronic device, and can also be understood as the direction parallel to the incident direction of light. As Figure 11 shown by the arrow indicating the incident direction of light and the optical path direction of light from incidence to propagation to the sensor.

[0069] Optionally, the support plate 22 is provided along the circumference of the joint surface of the camera bracket 2 and the camera 1, which can also be understood as having a circumferentially arranged support plate 22 in the plane where the camera bracket 2 and the camera 1 are combined, and there is a support portion 221 at the edge of the support plate 22. For example Figure 1 and Figure 11 shown, by providing the support portion 221, the camera bracket 2 can not only support the camera 1 but also support the main board bracket 4.

[0070] Optionally, as Figure 6As shown, the electronic device further includes: a first colloid structure 23; wherein, the first colloid structure 23 is circumferentially arranged on one surface of the camera bracket 2 facing the main board upper cover 3, and is located at a position corresponding to the inner wall of the first groove 32 of the camera bracket 2;

[0071] Or,

[0072] The first colloid structure 23 is circumferentially arranged along the inner wall of the first groove 32;

[0073] Wherein, the hardness of the first colloid structure 23 is less than the hardness of the main board upper cover 3.

[0074] As Figure 6 shown, the first colloid structure 23 is arranged between the camera bracket 2 and the main board upper cover 3. When an external downward force is applied to the camera module or an external pressure is applied to the main board upper cover 3, buffering is achieved between the camera bracket 2 and the main board upper cover 3 through the first colloid structure 23, reducing the force on the camera module, thereby avoiding damage to the camera.

[0075] Optionally, the first colloid structure 23 can be arranged on the camera bracket 2, fixed on one surface of the camera bracket 2 facing the main board upper cover 3, for example Figure 6 as shown, the first colloid structure 23 is fixed on the surface of the camera bracket 2 opposite to the first groove 32. The first colloid structure 23 can be first assembled on the camera bracket 2; or, the first colloid structure 23 can also be two-color injection molded on the camera bracket 2. In this way, the Z-direction (the thickness direction of the electronic device) positioning of the camera module inside the electronic device is based on the main board upper cover 3, and the XY direction (the length and width directions of the electronic device) is positioned by the first colloid structure 23.

[0076] Optionally, the first colloid structure 23 can also be arranged on the main board upper cover 3, for example, arranged on the inner wall of the first groove 32. In this way, when the camera bracket 2 is fixed to the first groove 32, the first colloid structure 23 is located between the camera bracket 2 and the inner wall of the first groove 32. The first colloid structure 23 can be first assembled on the main board upper cover 3; or, the first colloid structure 23 can also be two-color injection molded on the main board upper cover 3.

[0077] When the battery cover of the electronic device is subjected to external pressure, the motherboard bracket 4 presses the camera bracket 2, and the pressing structure 42 presses against the supporting portion 221, causing the camera bracket 2 to press the motherboard upper cover 3 within the first groove 32. The first colloid structure 23 can achieve buffering between the camera bracket 2 and the motherboard upper cover 3, avoiding damage to the camera due to impact. Optionally, if there is sufficient space in the Z direction (the thickness direction of the electronic device) of the whole machine, the first groove 32 of the motherboard upper cover 3 has no through holes or has local through holes, and a colloid structure can also be provided between the bottom of the camera bracket 2 and the bottom of the first groove 32 in the Z direction (the thickness direction of the electronic device) to position the camera module in the Z direction and achieve a better buffering effect. The hardness of the first colloid structure 23 is less than that of the motherboard upper cover 3. The first colloid structure 23 can be a colloid material with a smaller hardness, such as silica gel, rubber-like materials, etc. By setting a softer colloid structure, damage to the camera module caused by hitting the motherboard upper cover 3 is avoided.

[0078] For the case where the first colloid structure 23 is provided on the motherboard upper cover 3, for example Figure 10 As shown, the first colloid structure 23 can be provided on the inner wall of the first groove 32. For example, a circle of the first colloid structure 23 can be provided around the inner wall of the first groove 32 and around the limiting protrusion 31.

[0079] By adding the assembly of the first colloid structure 23 between the camera module and the motherboard upper cover 3, the force on the camera module can be buffered, thereby reducing the force on the camera prism and improving reliability. As Figure 6 Shown, the camera module is directly fixed on the motherboard upper cover 3. When the motherboard upper cover 3 is subjected to an external force, it will be directly transmitted to the camera module. Among them, the limiting protrusion 31 of the motherboard upper cover 3 can position the limiting groove 21 on the camera bracket 2 in the Z direction (the thickness direction of the electronic device), and the first groove 32 of the motherboard upper cover 3 positions the periphery of the lower end of the camera bracket 2 in the XY (the length and width of the electronic device) direction. When the camera module is subjected to a downward force applied from the outside or the motherboard upper cover 3 is subjected to external pressure, buffering is achieved between the camera bracket 2 and the motherboard upper cover 3 through the first colloid structure 23, and the force on the camera module is reduced through buffering.

[0080] Optionally, as Figure 7 and Figure 11 Shown, the camera 1 includes:

[0081] A lens 11, the first end of the lens 11 being the light incident end;

[0082] The camera module further includes:

[0083] Prism 12, the prism 12 includes a plane facing the lens 11, the plane includes a light incident surface and a light exit surface, and the lens 11 is disposed opposite to the light incident surface; the prism 12 is disposed in the second groove of the camera bracket 2, and there is a first gap between the prism 12 and the inner wall of the second groove;

[0084] Sensor 13, disposed corresponding to the light exit surface of the prism 12; light enters from the first end of the lens 11, is reflected by the prism 12, and then enters the sensor 13.

[0085] Figure 7 is a cross-sectional view of a part of the camera module of the electronic device. The lens 11 part of the camera 1 is higher than the sensor 13, and the height of the sensor 13 is greatly reduced. The sensor 13 can be disposed at the lower end of the battery cover 5, thereby reducing the width of the lens. As Figure 11 shown, after the light enters from the lens 11, it is reflected three times by the prism 12, is converted from vertically downward to vertically upward, and finally projects onto the area of the horizontally placed sensor 13 to achieve imaging.

[0086] The camera bracket 2 is provided with a second groove, the prism 12 is fixed in the second groove, and there is a first gap between the prism 12 and the inner wall of the second groove. Optionally, the value of the first gap is greater than 0.05 mm and less than 0.3 mm. For example, the first gap is 0.15 mm.

[0087] The prism 12 is assembled in the second groove of the camera bracket 2. Since the inclined surface position of the prism 12 is relatively weak, it is easy to collide with the camera bracket during deformation in the dropping process, resulting in cracking. In this application, the gap between the inner wall of the second groove and the inclined surface of the prism 12 is increased to be greater than 0.05 mm and less than 0.3 mm (the current gap is 0.01 mm). By increasing the gap, the prism 12 is not easily in contact with the camera bracket 2, reducing the probability of collision. Optionally, the cross-section of the prism 12 in the width direction of the electronic device is trapezoidal. The plane corresponding to the long side of the trapezoid is the plane where the light exit surface and the light incident surface of the prism 12 are located, and the plane corresponding to the short side of the trapezoid is the plane facing the first groove 32 of the main board upper cover 3.

[0088] Optionally, the surface of the inner wall of the second groove is provided with a second colloid structure 24. As Figure 11 shown, a second colloid structure 24 is provided between the prism 12 and the camera bracket 2. In this way, when an external force acts on the camera 1 or the battery cover 5, the second colloid structure 24 can play a buffering effect to avoid damage to the camera 1.

[0089] Among them, the second colloid structure 24 can be inlaid by injection molding of ordinary plastic and the second colloid structure 24 on the camera bracket 2, or the second colloid structure 24 can be separately arranged on the inner wall surface of the second groove of the camera bracket 2. The hardness of the second colloid structure 24 is less than that of the camera bracket 2. In this way, during the device drop process, even if the camera is deformed and impacted, the second colloid structure 24 can play a good buffering effect, reducing the probability of the prism cracking in the camera 1, thereby improving the reliability. The second colloid structure 24 can be a colloid material with a relatively small hardness, such as silica gel, rubber-like materials, etc.

[0090] Optionally, the second colloid structure 24 can be arranged in the first interval between the prism 12 and the inner wall of the second groove, or after the second colloid structure 24 is arranged between the prism 12 and the inner wall of the second groove, there is still this first interval between the second colloid structure 24 and the prism 12.

[0091] For increasing the gap between the prism 12 and the camera bracket 2, for accurate positioning, a jig can be used for positioning in the Z direction (the thickness direction of the electronic device), and both the camera bracket and the prism are positioned in the jig to achieve the installation accuracy of the two. For X-direction (the length direction of the electronic device) positioning, CCD can be used for positioning.

[0092] Optionally, as Figure 3 and Figure 13 shown, the edge of the plane of the prism 12 facing the lens 11 is fixed to the camera bracket 2 through a colloid.

[0093] In this embodiment, a plurality of grooved points can be arranged on the inner wall of the second groove, and a colloid is injected into the grooved points to realize the fixation of the camera bracket 2 and the prism 12. The grooved points are, for example, Figure 3 the position a shown in the figure, located at the edge of the second groove for fixing the prism 12. Fixing the prism and the camera bracket through a colloid can further ensure the stable installation of the prism in the second groove and avoid the prism and the camera bracket from colliding and being damaged when subjected to external force. In this way, both the gap between the inclined plane of the prism 12 and the camera bracket 2 is ensured, and the probability of the prism colliding with the camera bracket 2 is reduced, thereby improving the device reliability. The surface of the inner wall of the second groove can also be provided with a second colloid structure 24, so that during the device drop process, the prism will not directly contact the camera bracket, and the second colloid structure 24 with a relatively small hardness can play a good buffering effect, reducing the probability of the prism cracking, and improving the reliability of the prism without increasing additional space.

[0094] Optionally, the prism 12 further includes a plane away from the lens 11, and a third groove 121 is formed in the plane away from the lens 11, and a fourth colloid structure 1211 is disposed in the third groove 121.

[0095] The position where the third groove 121 is provided is as Figure 11 shown. As Figure 13 shown, injecting the fourth colloid structure 1211 into the bottom groove (the third groove 121) of the prism 12 can remove the stress concentration point, and at the same time improve the drop deformation amount of the prism 12, thereby improving the reliability of the camera module.

[0096] Optionally, the lens 11 and the sensor 13 are fixed by a fifth colloid structure 131.

[0097] As Figure 7 shown, the sensor 13 can be fixed to the housing of the lens 11 through the fifth colloid structure 131. The fifth colloid structure 131 is filled between the housing of the lens 11 and the sensor 13 to achieve the fixation of the sensor 13 in the horizontal direction.

[0098] As an optional embodiment, the electronic device further includes: a battery cover 5, and the battery cover 5 covers the first side of the main board bracket 4; a camera lens is disposed on a side of the battery cover 5 away from the main board bracket 4, and the camera 1 is disposed opposite to the camera lens.

[0099] The battery cover 5 has a light-transmitting area, and a camera lens is disposed in the light-transmitting area for light to enter the camera. As Figure 12 shown, the light enters the lens 11 through the camera lens, and after multiple reflections by the prism 12, the light enters the sensor 13 for processing.

[0100] The structure of the electronic device is as Figure 16 shown, including a battery cover 5, a main board bracket 4, a camera module 100, a main board 7, an upper main board cover 3, and a screen assembly 6 arranged in sequence. The battery cover 5 is provided with a camera lens and a camera decoration part. The main board bracket 4 is located on a side of the battery cover 5 facing the inside of the electronic device, that is, the battery cover 5 is located on the first side of the main board bracket. The main board bracket 4 has a first through hole 41, and the camera 1 of the camera module 100 passes through the first through hole 41 and corresponds to the lens on the battery cover 5. The main board 7 has an opening, and the camera bracket 2 of the camera module 100 can pass through the opening and be fixed to the upper main board cover 3. The main board 7 is located between the main board bracket 4 and the upper main board cover 3, and the screen assembly 6 is located on a side of the upper main board cover 3 away from the main board 7.

[0101] The bottom of the first groove 32 formed in the upper cover 3 of the main board has no opening or partial opening; in the case of partial opening at the bottom of the first groove, the bottom of the camera bracket 2 does not contact the screen assembly 6, that is, the bottom of the camera module is suspended above the screen assembly 6, and there is a certain gap in the Z direction (the thickness direction of the electronic device) between the two to ensure that they do not contact each other and prevent the bottom of the camera from impacting the screen and causing the touch screen to fail.

[0102] In one embodiment, the electronic device further includes:

[0103] A battery cover 5, on the side of the battery cover 5 facing away from the main board bracket 4, a camera decoration part 51 is provided; at least part of the camera decoration part 51 correspondingly covers at least part of the sensor 13;

[0104] A decoration part bracket 54, located between the camera decoration part 51 and the main board bracket 4; the circumferential direction of the decoration part bracket 54 is pressed against the circumferential direction of the first through hole 41;

[0105] Wherein, the circumferential direction of the decoration part bracket 54 has a notch 541, and the notch 541 is correspondingly arranged for the sensor 13.

[0106] Next, the overall structure of the electronic device in the embodiment of the present application will be described.

[0107] As Figure 17 shown is a cross-sectional schematic diagram of the camera module of the electronic device. A camera decoration part 51 is arranged at the position for installing the lens on the battery cover 5. The camera decoration part 51 is connected to the battery cover 5 through a third colloid structure 52 (such as double-sided tape). The battery cover 5 is provided with a battery cover diaphragm 53 facing the inside of the electronic device. The sensor 13 of the camera module is arranged below the battery cover diaphragm 53. As Figure 17 shown, the camera decoration part 51 basically covers the sensor 13, and the camera decoration part 51 is bonded to the outer surface of the battery cover 5 through the third colloid structure 52. Inside the camera decoration part 51, a decoration part bracket 54 is arranged. The decoration part bracket 54 can be made of plastic material and is used to support the camera decoration part 51. As Figure 19 and Figure 20 shown, the decoration part bracket 54 is located between the camera decoration part 51 and the main board bracket 4 and is pressed against the main board bracket 4. The battery cover 5 is arranged between the camera decoration part 51 and the decoration part bracket 54. Among them Figure 19 is a schematic diagram obtained by making a transverse cross-section at the b position in Figure 18 , Figure 20 is a schematic diagram obtained by making a transverse cross-section at the c position in Figure 18 .

[0108] Specifically, as Figure 21The following is a schematic diagram of the main board bracket 4. Among them, the decorative part bracket 54 is circumferentially pressed against the circumferential direction of the first through hole 41 to realize the support of the main board bracket 4 for the decorative part bracket 54.

[0109] As Figure 22 shown, it is a schematic diagram of the decorative part bracket 54. There is a notch 541 on one side in the circumferential direction of the decorative part bracket 54. The sensor 13 is located at the position of the notch 541. The notch 541 is provided corresponding to the sensor 13, corresponding Figure 18 to the indicated position of the sensor 13. The part of the decorative part bracket 54 except the notch 541 is bonded to the side of the battery cover 5 facing the main board bracket 4 by glue. The side of the circumferential direction of the decorative part bracket 54 facing the main board bracket 4 is pressed against the side of the circumferential direction of the first through hole 41 facing the battery cover 5. The camera decorative part 51 is bonded to the side of the battery cover 5 facing away from the main board bracket 4 by glue, and the camera decorative part 51 covers most of the area of the sensor 13. In this way, there is no decorative part bracket 54 on the side of the sensor 13 facing the camera decorative part 51, which can ensure a certain interval between the sensor 13 and the camera decorative part 51. It can not only ensure that the main board bracket 4 realizes the support for the camera decorative part 51 through the support of the decorative part bracket 54, but also ensure that the sensor 13 will not be squeezed when the camera decorative part 51 is broken, effectively preventing the sensor 13 from being damaged.

[0110] In addition, when the battery cover 5 fails and cracks, the battery cover diaphragm 53 can ensure that the glass fragments of the battery cover 5 will not enter the area where the sensor 13 is located. The third colloid structure 52 under the camera decorative part 51 can apply an upward pulling force to the battery cover, which can prevent the battery cover 5 from collapsing and squeezing the sensor 13. Since the camera decorative part 51 has a relatively high stiffness, the glass battery cover 5 can be maintained in the shape when it is not damaged through the third colloid structure 52.

[0111] As Figure 18 shown, the camera decorative part 51 basically covers more than 2 / 3 of the sensor 13, which can effectively improve the protection effect on the sensor.

[0112] In order to prevent the camera decorative part 51 from deforming too much towards the area where the sensor 13 is located when it is under excessive force, resulting in the inner surface of the battery cover 5 contacting the sensor 13, the main board bracket 4 can Figure 18 support the camera decorative part 51 at positions b and c indicated by the arrows.

[0113] Perform a transverse section along the positions b and c, and obtain Figure 19 and Figure 20 . Among them Figure 19 is a schematic diagram obtained by making a transverse section at position b in Figure 18 , Figure 20 is for Figure 18Schematic diagram obtained by making a horizontal cross-section at position c in Figure 23 is a schematic diagram of the setting position of the support part of the main board bracket after hiding the battery cover. From Figure 19 and Figure 20 it can be seen that the decorative part bracket 54 on the battery cover 5 supports the main board bracket 4 (with a small gap left from the main board bracket 4), the decorative part bracket 54 is bonded to the battery cover diaphragm through the sixth colloid structure 55 (such as double-sided tape), and the decorative part bracket 54 is arranged on the side of the battery cover 5 facing the inside of the electronic device. The main board bracket 4 supports the main board 7, and the main board 7 supports the main board upper cover 3. Through the mutual support of multiple components in the Z direction, it can be ensured that when the force on the camera decoration part 51 is too large, the situation where the inner surface of the battery cover contacts the sensor will not occur. For the assembled electronic device, each camera module can be on the same axis, avoiding the misalignment of each camera, and the appearance aesthetic is better.

[0114] In the embodiment of the present application, a first through hole is provided on the main board bracket, the camera passes through the first through hole, and part of it is located on the first side of the main board bracket, and the camera bracket is located on the second side of the main board bracket. A support plate is circumferentially arranged on the camera bracket, and a protruding support part is provided at the edge of the support plate; a pressing structure is arranged around the first through hole of the main board bracket, and the pressing structure is pressed against the support part on the camera. In this way, when the battery cover or the camera is subjected to external pressure, the camera bracket can support the main board bracket, thereby supporting the main board and ensuring the stability of the internal structure of the electronic device in the thickness direction of the electronic device.

[0115] The camera bracket is provided with a limiting groove, which cooperates with the limiting protrusion on the main board upper cover to achieve Z-direction limiting and XY-direction limiting. The camera bracket is provided with a plurality of support parts, which cooperate with the pressing on the main board bracket, and can ensure the uniqueness of the Z-direction position of the camera module. The camera module of the electronic device of the present application can meet the flexible stacking requirements of the main board bracket, the main board, and the main board upper cover, which is convenient for improving the aesthetics of the appearance of the electronic device. The main board upper cover, the main board, the main board bracket, and the battery cover cooperate with each other to ensure the effective assembly of the camera module inside the whole machine and improve the use safety of the camera module.

[0116] At the camera position of the electronic device, the appearance decorative ring straddles the sensor area of the camera, and there are corresponding supports at both the upper and lower ends of the sensor area, which can effectively reduce the failure probability of the sensor caused by contact in the case of excessive force on the battery cover and battery cover damage.

[0117] The electronic device of the present application can be various electronic products such as mobile phones, e-books, and tablet computers. Other components of the electronic device in the embodiment of the present application, such as the housing, are known to those of ordinary skill in the art and will not be described in detail here.

[0118] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0119] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this application, and the scope of this application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, Comprising: A camera module and a main board bracket; Wherein, the camera module includes: a camera and a camera bracket, and the camera is stacked on the camera bracket; The camera bracket is circumferentially provided with a support plate, and at least one protruding support portion is provided at the edge of the support plate; The main board bracket is provided with a first through hole, and at least two pressing structures perpendicular to the main board bracket are provided around the first through hole; Wherein, the camera passes through the first through hole and is partially disposed on the first side of the main board bracket, and the camera bracket is located on the second side of the main board bracket; the pressing structure is disposed on the second side of the main board bracket facing the camera bracket, and the pressing structure presses on the support portion.

2. The electronic device according to claim 1, wherein The electronic device further includes: A main board upper cover, the main board upper cover is located on the second side of the main board bracket, the main board upper cover is provided with a first groove, and the camera bracket is clamped in the first groove; Wherein, one of the bottom of the camera bracket and the inner wall of the first groove is provided with a limiting groove, and the other is provided with a limiting protrusion; the limiting protrusion is clamped in the limiting groove.

3. The electronic device according to claim 2, wherein The electronic device further includes: a first colloid structure; Wherein, the first colloid structure is circumferentially disposed on the surface of the camera bracket facing the main board upper cover, and is located at a position corresponding to the inner wall of the first groove of the camera bracket; Or, The first colloid structure is circumferentially disposed along the inner wall of the first groove; Wherein, the hardness of the first colloid structure is less than the hardness of the main board upper cover.

4. The electronic device according to claim 1, characterized in that The support plate is circumferentially disposed along the joint surface of the camera bracket and the camera.

5. The electronic device according to claim 1, characterized in that, The camera includes: A lens, the first end of the lens is the light incident end; The camera module further includes: A prism, the prism includes a plane facing the lens, the plane includes a light incident surface and a light exit surface, and the lens is disposed opposite to the light incident surface; the prism is disposed in the second groove of the camera bracket, and a first gap is provided between the prism and the inner wall of the second groove; A sensor, disposed corresponding to the light exit surface of the prism; light is incident from the first end of the lens, and is reflected by the prism and then incident on the sensor.

6. The electronic device according to claim 5, wherein A second colloid structure is provided on the surface of the inner wall of the second groove.

7. The electronic device according to claim 5, wherein The prism further includes a plane away from the lens, a third groove is provided in the plane away from the lens, and a fourth colloid structure is provided in the third groove.

8. The electronic device according to claim 5, characterized in that, The value of the first gap is greater than 0.05 mm and less than 0.3 mm.

9. The electronic device according to claim 5, wherein The edge of the plane of the prism facing the lens is fixed to the camera bracket through a colloid.

10. The electronic device according to claim 5, wherein The lens and the sensor are fixed through a fifth colloid structure.

11. The electronic device according to claim 5, wherein The electronic device further includes: A battery cover, a camera decoration portion is provided on the surface of the battery cover facing away from the main board bracket; at least a part of the camera decoration portion correspondingly covers at least a part of the sensor; A decoration portion bracket, located between the camera decoration portion and the main board bracket; the circumference of the decoration portion bracket is pressed against the circumference of the first through hole; Wherein, the decorative part bracket has a notch in the circumferential direction, and the notch corresponds to the sensor.

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