PCB assembly and manufacturing method of voltage regulator module

Abstract

The invention provides a PCB assembly and a manufacturing method of a voltage regulator module. The PCB assembly comprises a PCB and an inductor. The PCB comprises a top surface and a bottom surface which are oppositely arranged. The inductor comprises a magnetic core, a winding, an upper surface and a lower surface, the winding passes through the magnetic core, and the winding forms an upper leading-out terminal on the upper surface and forms a lower leading-out terminal on the lower surface. The inductor is embedded in the PCB, the top surface is opposite to the upper surface in space, the bottom surface is opposite to the lower surface in space, a plurality of conductive layers are arranged above the upper surface and below the lower surface respectively, the top surface and the bottom surface are provided with an upper welding position electrically connected to an upper wire outlet end and a lower welding position electrically connected to a lower wire outlet end respectively. The upper welding position is electrically connected to the power device and is assembled to transmit an input electric signal. The lower welding position is electrically connected to an external circuit board to assemble, transmit and output electric signals, the power device, the PCB assembly and the external circuit board are vertically stacked in sequence, the power device and the upper welding position are electrically connected through a one-time reflow soldering technology, and the lower welding position and the external circuit board are electrically connected through a one-time reflow soldering technology to form the voltage regulator module.

Description

Technical Field

[0001] The present invention relates to an assembly structure of an electronic device, and particularly to a PCB assembly applied to a voltage regulator module and a manufacturing method of the voltage regulator module. Background Art

[0002] With the rapid development of artificial intelligence, the current of computing chips has increased rapidly, exceeding 1000 amperes, which poses a great challenge to the voltage regulator that powers the chips.

[0003] A voltage regulator generally has the characteristics of outputting low voltage and large current, and mainly uses a buck circuit to achieve this. The buck circuit mainly consists of an integrated IC (Integrated Circuit) power device, a power inductor, and input and output capacitors. In a traditional horizontal voltage regulator design, as Figure 1 shown, generally, motherboard manufacturers will horizontally arrange the input capacitor 52, the IC power device 53, and the power inductor 54 beside the computing chip 51 on the motherboard 50, while the output capacitor (not shown in the figure) is mainly arranged below the computing chip 51. The horizontal connection method of the voltage regulator not only increases the total occupied area, but also increases the line parasitic parameters and losses as the wiring length increases, thus affecting the power conversion efficiency. Due to this factor, power supply manufacturers will design the on-board voltage regulator composed of discrete components into a voltage regulator module to improve power density and efficiency. Motherboard manufacturers directly use such a voltage regulator module and place it around the computing chip, which can significantly increase the output current of the voltage regulator in a limited space and meet the power supply requirements of larger power computing chips.

[0004] Another typical stacked voltage regulator module solution is as Figure 2 shown. Its structure is to stack the IC power device 63 and the inductor 64 vertically and jointly weld them onto the same PCB (Printed Circuit Board) 61. Capacitor 67 is also provided on the PCB 61. In addition, the inductor 64 is arranged on another PCB 62. The PCB 62 is used for electrical signal transfer, so that the welding surface of the voltage regulator module matches the welding surface of the computing motherboard (not shown in the figure). The PCB 61 and the PCB 62 are electrically connected through a plurality of signal connectors 65, and the plurality of signal connectors 65 are connected through a connector 66. However, this method is a four-layer structure, and the voltage regulator module body undergoes multiple reflow soldering processes, which not only increases the production difficulty and cost, but also undergoes an additional reflow soldering process on the computing motherboard. Such a large number of soldering processes greatly affect the quality and long-term reliability of the voltage regulator.

[0005] In view of this, it is necessary to provide a PCB assembly for a voltage regulator module and a manufacturing method of the voltage regulator module. By integrating a PCB assembly including multiple structures such as an output inductor and a signal connector, the number of components is greatly reduced, the number of stacking layers of the voltage regulator module is simplified, thereby greatly reducing the total number of welding times of the product, reducing the production cost of the voltage regulator module, and improving the product quality. The PCB assembly can be matched with the power device, the external circuit board and the stacking parts to adjust the placement order when stacking, so that the voltage regulator module can be flexibly adjusted according to the actual situation during manufacturing, which is convenient for manufacturing. The welding of the entire voltage regulator module can be completed with one reflow soldering, so that the module production yield is increased and the production cost is reduced. Further, when the PCB assembly is applied to the manufacture of the voltage regulator module, it can be combined with the connecting structure of multiple PCB assemblies and the substrate structure of multiple external circuit boards. Multiple voltage regulator modules can be manufactured with only one reflow soldering. The multiple voltage regulator modules after cutting and separation are independent of each other, which improves the product quality and long-term reliability, and also greatly reduces the production cost. Alternatively, multiple PCB assemblies can be placed by assembling a jig, and multiple voltage regulator modules can be manufactured with only one reflow soldering. Summary of the invention

[0006] The purpose of the present invention is to provide a PCB assembly for a voltage regulator module and a manufacturing method of the voltage regulator module. By integrating the inductor, input circuit path, control signal path, signal detection path, test function circuit, etc. into a PCB assembly, the number of stacked layers of the voltage regulator module is simplified, thereby greatly reducing the total number of welding times of the product, reducing the production cost of the voltage regulator module, and improving the product quality. Among them, one layer of the voltage regulator module is a PCB assembly with an embedded inductor, and the layer above the PCB assembly can be placed on the power device. In the inductor integrated in the PCB assembly, the inductor winding passes through the inside of the magnetic core and is embedded in the PCB assembly. Its two outlet terminals are integrated with the copper of the circuit board in the PCB assembly through the electroplating process. The electroplated copper is interconnected from the inside to the outside, and is pressed and processed successively to form the welding position of the IC power device on the outer layer of the PCB assembly, and the number of electroplated copper layers stacked on both sides of the inductor is symmetrical and equal. The power device, PCB assembly, stacking parts and external circuit board are connected in an up-and-down stacking manner, which reduces the total occupied area of ​​the voltage regulator module. At the same time, the welding of the entire voltage regulator can be completed with only one reflow soldering, which increases the module production yield and reduces the production cost. At the same time, the PCB assembly can be coordinated with the power device, the external circuit board and the stacking parts to adjust the placement order when stacking, so that the voltage regulator module can be flexibly adjusted according to actual conditions during manufacturing, which is convenient for manufacturing. In addition, when the PCB assembly is used in the manufacture of the voltage regulator module, it can be combined with the connecting structure of multiple PCB assemblies and the substrate structure of multiple external circuit boards. Multiple voltage regulator modules can be manufactured with only one reflow soldering. The multiple voltage regulator modules after cutting and separation are independent of each other, which improves product quality and long-term reliability, and also greatly reduces production costs. Alternatively, multiple PCB assemblies can be placed by assembling jigs, and multiple voltage regulator modules can be manufactured with only one reflow soldering.

[0007] To achieve the above-mentioned purpose, one aspect of the present invention provides a PCB assembly including a PCB and an inductor. The PCB includes a top surface and a bottom surface that are arranged relatively to each other. The inductor includes an upper surface and a lower surface that are arranged relatively to each other, and the inductor also includes a magnetic core and a winding. The winding passes through the magnetic core, and the winding forms an upper outlet terminal on the upper surface and a lower outlet terminal on the lower surface. The inductor is embedded in the PCB, the top surface is opposite to the upper surface in space, the bottom surface is opposite to the lower surface in space, and there are multiple conductive layers above the upper surface and below the lower surface, and the top surface and the bottom surface respectively have an upper welding position electrically connected to the upper outlet terminal and a lower welding position electrically connected to the lower outlet terminal. The upper welding position is electrically connected to the power device, and the combination transmits the input electrical signal. The lower welding position is electrically connected to the external circuit board, and the combination transmits the output electrical signal. The power device, the PCB assembly and the external circuit board are stacked vertically in sequence, and the power device and the upper welding position and the lower welding position and the external circuit board are electrically connected through a reflow soldering process to form a voltage regulator module.

[0008] In one embodiment, a plurality of PCB assemblies are arranged in an array within a fixture, and a plurality of power devices, a plurality of PCB assemblies, and a plurality of external circuit boards are vertically stacked in sequence. The upper welding positions between the plurality of power devices and the plurality of PCB assemblies and the lower welding positions of the plurality of PCB assemblies and the plurality of external circuit boards are electrically connected through a single reflow soldering process to form a plurality of voltage regulator modules.

[0009] In one embodiment, a plurality of PCB assemblies form a continuous structure, and a plurality of power devices, the continuous structure, and a plurality of external circuit boards are vertically stacked in sequence. The upper welding positions between the plurality of power devices and the plurality of PCB assemblies of the continuous structure and the lower welding positions of the plurality of PCB assemblies of the continuous structure and the plurality of external circuit boards are electrically connected through a single reflow soldering process. Among them, by cutting and separating the continuous structure, the plurality of power devices, the continuous structure, and the plurality of external circuit boards vertically stacked in sequence form a plurality of independent voltage regulator modules.

[0010] In one embodiment, a plurality of PCB assemblies form a continuous structure, and a plurality of external circuit boards form a substrate structure. A plurality of power devices, the continuous structure, and the substrate structure are vertically stacked in sequence. The upper welding positions between the plurality of power devices and the plurality of PCB assemblies of the continuous structure and the lower welding positions of the plurality of PCB assemblies of the continuous structure and the plurality of external circuit boards of the substrate structure are electrically connected through a single reflow soldering process. Among them, by cutting and separating the continuous structure and the substrate structure, the plurality of power devices, the continuous structure, and the substrate structure vertically stacked in sequence form a plurality of independent voltage regulator modules.

[0011] In one embodiment, the PCB assembly includes a plurality of inductors connected in parallel. Among them, the upper welding positions of the plurality of inductors are respectively electrically connected to a plurality of power devices to group and transmit input electrical signals, and the lower welding positions of the plurality of inductors are electrically connected to an external circuit board to group and transmit output electrical signals. A plurality of power devices, the PCB assembly, and the external circuit board are vertically stacked in sequence. The upper welding positions between the plurality of power devices and the plurality of inductors and the lower welding positions of the plurality of inductors and the external circuit board are electrically connected through a single reflow soldering process to form a voltage regulator module.

[0012] In one embodiment, the volume ratio of the magnetic core in the PCB assembly exceeds 50%, and in the horizontal plane, the projected area ratio of the magnetic core on the projected area of the PCB assembly exceeds 70%.

[0013] In one embodiment, the PCB assembly further includes an input circuit path, a control signal path, a signal detection path, or a test function circuit.

[0014] In one embodiment, a metal conductor is further disposed inside the PCB assembly, and the metal conductor is configured to transmit an electrical signal.

[0015] In one embodiment, the lower welding position and the external circuit board are electrically connected via a stacking member, and the stacking member includes an upper welding pad and a lower welding pad.

[0016] In one embodiment, the stacked component is a capacitor unit, a switch unit or a magnetic unit.

[0017] In one embodiment, a metal conductor is disposed inside the stack, and the metal conductor is configured to transmit an electrical signal.

[0018] In one embodiment, the upper welding position is electrically connected to the power device, the lower welding position is electrically connected to the upper welding pad, the lower welding pad is electrically connected to the external circuit board, the power device, the PCB assembly, the stacked parts and the external circuit board are vertically stacked in sequence, and the power device and the upper welding position, the lower welding position and the upper welding pad, and the lower welding pad and the external circuit board are electrically connected through a single reflow soldering process to form a voltage regulator module.

[0019] In one embodiment, a plurality of PCB component arrays are arranged in a fixed fixture, a plurality of power devices, a plurality of PCB components, a plurality of stacked parts and a plurality of external circuit boards are vertically stacked in sequence, and the plurality of power devices and the upper welding positions of the plurality of PCB components, the lower welding positions of the plurality of PCB components and the upper welding pads of the plurality of stacked parts, and the lower welding pads of the plurality of stacked parts and the plurality of external circuit boards are electrically connected through a single reflow soldering process to form a plurality of voltage regulator modules.

[0020] In one embodiment, multiple PCB components form a contiguous structure, multiple power devices, the contiguous structure, multiple stacking parts and multiple external circuit boards are vertically stacked in sequence, and the multiple power devices and the upper welding positions of the multiple PCB components of the contiguous structure, the lower welding positions of the multiple PCB components of the contiguous structure and the upper welding pads of the multiple stacking parts, and the lower welding pads of the multiple stacking parts and the multiple external circuit boards are electrically connected through a single reflow soldering process, wherein the contiguous structure is cut and separated, and the multiple power devices, the contiguous structure, multiple stacking parts and multiple external circuit boards vertically stacked in sequence form multiple independent voltage regulator modules.

[0021] In one embodiment, multiple PCB components form a contiguous structure, multiple external circuit boards form a substrate structure, multiple power devices, the contiguous structure, multiple stacked parts and the substrate structure are vertically stacked in sequence, and the multiple power devices and the upper welding positions of the multiple PCB components of the contiguous structure, the lower welding positions of the multiple PCB components of the contiguous structure and the upper welding pads of the multiple stacked parts, and the lower welding pads of the multiple stacked parts and the multiple external circuit boards of the substrate structure are electrically connected through a single reflow soldering process, wherein the contiguous structure and the substrate structure are cut and separated, and the multiple power devices, the contiguous structure, the multiple stacked parts and the substrate structure vertically stacked in sequence form multiple independent voltage regulator modules.

[0022] In one embodiment, the PCB includes M conductive layers and N conductive layers, M and N are positive integers, the M conductive layers are arranged above the upper surface, the upper terminal is electrically connected to the M conductive layers that are attached to the upper surface, the N conductive layers are arranged below the lower surface, the lower terminal is electrically connected to the N conductive layers that are attached to the lower surface, and M=N≥2.

[0023] In one embodiment, the M-layer conductive layer and the N-layer conductive layer respectively include a surface conductive layer and an inner conductive layer, wherein the surface conductive layer includes a top surface and a bottom surface and is used for surface routing, copper cladding and welding devices, and the inner conductive layer is used for internal routing and copper cladding.

[0024] In one embodiment, the M conductive layer and the N conductive layer are respectively formed of multiple copper-plated layers.

[0025] In one embodiment, the PCB assembly further includes a board edge copper plating layer, which is disposed on the top surface, bottom surface and side wall of the PCB and is electrically connected between the M conductive layer and the N conductive layer to transmit current signals or form a test function circuit.

[0026] In one embodiment, the PCB assembly further includes a conductive through hole, which penetrates the top surface and the bottom surface and is electrically connected between the M-layer conductive layer and the N-layer conductive layer.

[0027] In one embodiment, two adjacent conductive layers in the M conductive layer and the N conductive layer are connected via a buried via, and the M conductive layer and the N conductive layer are electrically connected to external electrical signals sequentially from inside to outside through the buried via.

[0028] In one embodiment, the N-layer conductive layer forms output welding positions and ground welding positions on the bottom surface through buried vias, wherein the output welding positions and the ground welding positions are arranged alternately.

[0029] In one embodiment, the upper welding position and the upper lead-out terminal are spatially opposite to each other and are electrically connected through an upper circuit channel, and the upper circuit channel is electrically connected to the M conductive layers in sequence.

[0030] In one embodiment, the lower welding position and the lower wire outlet end are opposite to each other in space and are electrically connected through a lower circuit channel, and the lower circuit channel is sequentially electrically connected to N conductive layers.

[0031] In one embodiment, the upper circuit channel electrically connects the upper welding position and the upper wire outlet end in the M conductive layer from the inside to the outside through electroplated via copper, and the lower circuit channel electrically connects the lower welding position and the lower wire outlet end in the N conductive layer from the inside to the outside through electroplated via copper.

[0032] To achieve the above object, another aspect of the present invention provides a method for manufacturing a voltage regulator module, including the steps of: (a) providing a PCB assembly, the PCB assembly includes a PCB and an inductor, wherein the PCB includes a top surface and a bottom surface arranged opposite to each other, the inductor includes an upper surface and a lower surface arranged opposite to each other, the top surface is opposite to the upper surface in space, the bottom surface is opposite to the lower surface in space, the inductor is buried in the PCB, and the inductor includes a magnetic core and a winding, the winding passes through the magnetic core, and the winding forms an upper wire outlet end on the upper surface and a lower wire outlet end on the lower surface; wherein there are a plurality of conductive layers above the upper surface and below the lower surface, and the top surface and the bottom surface respectively have an upper welding position electrically connected to the upper wire outlet end and a lower welding position electrically connected to the lower wire outlet end; (b) providing a power device having a welding portion opposite to the upper welding position in space; (c) providing an external circuit board having a welding area opposite to the lower welding position in space; (d) setting solder in the welding area and the upper welding position, and vertically stacking the power device, the PCB assembly and the external circuit board in sequence, wherein the welding portion is aligned with the upper welding position, and the lower welding position is aligned with the welding area; and (e) performing a reflow soldering process to achieve the electrical connection of the power device, the PCB assembly and the external circuit board.

[0033] In one embodiment, the volume ratio of the magnetic core in the PCB assembly exceeds 50%, and in the horizontal plane, the projected area ratio of the magnetic core on the projected area of the PCB assembly exceeds 70%.

[0034] In one embodiment, the solder is solder paste, and the solder is set by spraying or printing.

[0035] In one embodiment, the PCB assembly also integrates an input circuit path, a control signal path, a signal detection path or a test function circuit.

[0036] In one embodiment, a metal conductor is also provided inside the PCB assembly, and the metal conductor is configured to transmit electrical signals.

[0037] In one embodiment, the PCB assembly includes a plurality of inductors connected in parallel, and step (d) includes: setting solder on a welding area and upper welding positions of the plurality of inductors, and vertically stacking a plurality of power devices, a PCB assembly, and an external circuit board in sequence, wherein the welding portions of the plurality of power devices are aligned to the upper welding positions of the plurality of inductors, and the lower welding positions of the plurality of inductors are aligned to the welding area.

[0038] In one embodiment, step (d) includes: (d1) arranging a plurality of PCB component arrays in a fixing fixture; (d2) setting solder on the upper soldering positions of the plurality of PCB components; (d3) placing the plurality of PCB components on soldering areas of a plurality of external circuit boards provided with solder by side clamping; and (d4) placing a plurality of power devices correspondingly on the upper soldering positions of the plurality of PCB components.

[0039] In one embodiment, step (d) includes: (d1) providing a connecting structure, the connecting structure including multiple PCB components; (d2) setting solder on the upper welding positions of the multiple PCB components of the connecting structure; (d3) placing the connecting structure on the welding areas of multiple external circuit boards where solder is set in a side clamping manner; and (d4) placing multiple power devices correspondingly on the upper welding positions of the multiple PCB components of the connecting structure.

[0040] In one embodiment, step (e) includes sub-steps: (e1) performing a reflow soldering process to achieve electrical connection between multiple power devices, a connecting structure, and multiple external circuit boards; (e2) cutting and separating the connecting structure so that the multiple power devices, the connecting structure, and the multiple external circuit boards stacked vertically in sequence form multiple independent voltage regulator modules.

[0041] In one embodiment, step (d) includes: (d1) providing a connecting structure, the connecting structure including multiple PCB components; (d2) providing a substrate structure, the substrate structure including multiple external circuit boards; (d3) setting solder on the upper welding positions of the multiple PCB components of the connecting structure; (d4) placing the connecting structure on the welding areas of the multiple external circuit boards of the substrate structure where solder is set in a side clamping manner; and (d5) placing multiple power devices correspondingly on the upper welding positions of the multiple PCB components of the connecting structure.

[0042] In one embodiment, step (e) includes sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of multiple power devices, connecting structures and substrate structures; (e2) cutting and separating the connecting structures and the substrate structure so that the multiple power devices, connecting structures and substrate structures vertically stacked in sequence form multiple independent voltage regulator modules.

[0043] In one embodiment, the lower welding position and the external circuit board are electrically connected via a stacking member, and the stacking member includes an upper welding pad and a lower welding pad.

[0044] In one embodiment, the stacked component is a capacitor unit, a switch unit or a magnetic unit.

[0045] In one embodiment, a metal conductor is disposed inside the stack, and the metal conductor is configured to transmit an electrical signal.

[0046] In one embodiment, step (d) includes: (d1) setting solder in the welding area and placing the stacking part on the welding area so that the lower welding pad is aligned with the welding area; (d2) setting solder on the upper welding pad and placing the PCB component on the upper welding pad so that the lower welding position is aligned with the upper welding pad; and (d3) setting solder on the upper welding position and placing the power device on the upper welding position so that the welding part is aligned with the upper welding position.

[0047] Step (d) includes: (d1) arranging a plurality of PCB component arrays in a fixing fixture; (d2) setting solder on the welding areas of the plurality of external circuit boards, and placing the plurality of stacking parts on the welding areas of the plurality of external circuit boards, so that the lower welding pads of the plurality of stacking parts are aligned to the welding areas of the plurality of external circuit boards; (d3) setting solder on the upper welding pads of the plurality of stacking parts, and placing the lower welding positions of the plurality of PCB components on the upper welding pads of the plurality of stacking parts in a side clamping manner, so that the lower welding positions of the plurality of PCB components are aligned to the upper welding pads of the plurality of stacking parts; and (d4) setting solder on the upper welding positions of the plurality of PCB components, and placing the plurality of power devices on the upper welding positions of the plurality of PCB components, so that the welding parts of the plurality of power devices are aligned to the upper welding positions of the plurality of PCB components.

[0048] In one embodiment, step (d) includes: (d1) providing a connecting structure, the connecting structure including multiple PCB components; (d2) setting solder on the welding areas of multiple external circuit boards, and placing multiple stacking parts on the welding areas of the multiple external circuit boards, so that the lower welding pads of the multiple stacking parts are aligned to the welding areas of the multiple external circuit boards; (d3) setting solder on the upper welding pads of the multiple stacking parts, and placing the lower welding positions of the multiple PCB components of the connecting structure on the upper welding pads of the multiple stacking parts in a side clamping manner, so that the lower welding positions of the multiple PCB components of the connecting structure are aligned to the upper welding pads of the multiple stacking parts; and (d4) setting solder on the upper welding positions of the multiple PCB components of the connecting structure, and placing multiple power devices on the upper welding positions of the multiple PCB components of the connecting structure, so that the welding parts of the multiple power devices are aligned to the upper welding positions of the multiple PCB components of the connecting structure.

[0049] In one embodiment, step (e) includes sub-steps: (e1) performing a reflow soldering process to achieve electrical connection of multiple power devices, a connecting structure, multiple stacking parts and multiple external circuit boards; (e2) cutting and separating the connecting structure so that the multiple power devices, the connecting structure, multiple stacking parts and multiple external circuit boards arranged vertically stacked in sequence form multiple independent voltage regulator modules.

[0050] In one embodiment, step (d) includes: (d1) providing a connecting structure, the connecting structure including multiple PCB components; (d2) providing a substrate structure, the substrate structure including multiple external circuit boards; (d3) setting solder on the welding areas of the multiple external circuit boards of the substrate structure, and placing multiple stacking parts on the welding areas of the multiple external circuit boards of the substrate structure, so that the lower welding pads of the multiple stacking parts are aligned to the welding areas of the multiple external circuit boards of the substrate structure; (d4) setting solder on the upper welding pads of the multiple stacking parts, and placing the lower welding positions of the multiple PCB components of the connecting structure on the upper welding pads of the multiple stacking parts in a side clamping manner, so that the lower welding positions of the multiple PCB components of the connecting structure are aligned to the upper welding pads of the multiple stacking parts; and (d5) setting solder on the upper welding positions of the multiple PCB components of the connecting structure, and placing multiple power devices on the upper welding positions of the multiple PCB components of the connecting structure, so that the welding parts of the multiple power devices are aligned to the upper welding positions of the multiple PCB components of the connecting structure.

[0051] In one embodiment, step (e) includes sub-steps: (e1) performing a reflow soldering process to achieve electrical connection between multiple power devices, a connecting structure, multiple stacking parts and a substrate structure; (e2) cutting and separating the connecting structure and the substrate structure so that the multiple power devices, the connecting structure, multiple stacking parts and the substrate structure vertically stacked in sequence form multiple independent voltage regulator modules.

[0052] In one embodiment, the PCB includes M conductive layers and N conductive layers, M and N are positive integers, the M conductive layers are arranged above the upper surface, the upper terminal is electrically connected to the M conductive layers that are attached to the upper surface, the N conductive layers are arranged below the lower surface, the lower terminal is electrically connected to the N conductive layers that are attached to the lower surface, and M=N≥2.

[0053] In one embodiment, the M-layer conductive layer and the N-layer conductive layer respectively include a surface conductive layer and an inner conductive layer, wherein the surface conductive layer includes the top and bottom surfaces of the PCB and is used for surface routing, copper cladding and welding devices, and the inner conductive layer is used for internal routing and copper cladding.

[0054] In one embodiment, the M conductive layer and the N conductive layer are respectively formed of multiple copper-plated layers.

[0055] In one embodiment, the PCB assembly further includes a copper plating layer on the board edge, which is disposed on the top surface, bottom surface and side wall of the PCB and is electrically connected between the M-layer conductive layer and the N-layer conductive layer to form a combined transmission of current signals or a test function circuit.

[0056] In one embodiment, the PCB assembly further includes a conductive through-hole that penetrates the top surface and the bottom surface and is electrically connected between the M-layer conductive layer and the N-layer conductive layer.

[0057] In one embodiment, the upper welding position and the upper wire outlet end are opposite to each other in space and are electrically connected through an upper circuit channel, and the upper circuit channel is electrically connected to the M-layer conductive layer in sequence. Among them, the lower welding position and the lower wire outlet end are opposite to each other in space and are electrically connected through a lower circuit channel, and the lower circuit channel is electrically connected to the N-layer conductive layer in sequence.

[0058] In one embodiment, the upper circuit channel electrically connects the upper welding position and the upper wire outlet end inside the M-layer conductive layer from the inside out through electroplated hole copper, and the lower circuit channel electrically connects the lower welding position and the lower wire outlet end inside the N-layer conductive layer from the inside out through electroplated hole copper. Description of the Drawings

[0059] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above content and are not intended to limit the present invention.

[0060] Figure 1 Disclose the structural schematic diagram of a traditional horizontal power voltage regulator module.

[0061] Figure 2 Disclose the structural schematic diagram of a traditional stacked power voltage regulator module.

[0062] Figure 3 Disclose the three-dimensional structure of a voltage regulator module (external circuit board not shown) according to an embodiment of the present invention;

[0063] Figure 4 Disclose Figure 3 The cross-sectional view along the AA' line segment;

[0064] Figure 5 Disclose the cross-sectional view of a PCB assembly according to an embodiment of the present invention;

[0065] Figure 6 Disclose the structural schematic diagram of an inductor according to an embodiment of the present invention;

[0066] Figure 7 Disclose the schematic diagram of the upper welding position corresponding to the power device on the top surface of the PCB assembly of the present invention;

[0067] Figure 8 Disclose the schematic diagram of the lower welding position on the bottom surface of the PCB assembly of the present invention;

[0068] Figure 9 A schematic diagram of a lower welding position of another embodiment of the bottom surface of a PCB assembly of the present invention is disclosed;

[0069] Figure 10 and Figure 11 A schematic diagram of another voltage regulator module of the present invention disassembling an external circuit board is disclosed;

[0070] Figure 12 and Figure 13 An exploded view of another voltage regulator module of the present invention is disclosed; and

[0071] Figure 14 A flow chart of a method for manufacturing a voltage regulator module according to an embodiment of the present invention is disclosed.

[0072] Figure 15 A structural schematic diagram of another embodiment of a PCB assembly of the present invention is disclosed.

[0073] Figure 16 The invention discloses a connected structure formed by arranging a plurality of PCB components.

[0074] Figure 17 Another embodiment of the present invention discloses a three-dimensional structure of a voltage regulator module including stacked components.

[0075] Figure 18 and Figure 19 public Figure 17 An exploded view of the disclosed voltage regulator module.

[0076] Figure 20 A cross-sectional view of a stacking member according to an embodiment of the present invention is disclosed. DETAILED DESCRIPTION

[0077] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different ways, all of which do not depart from the scope of the present invention, and the descriptions and drawings therein are for illustrative purposes in nature and not for limiting the present invention. For example, if the following content of the present invention describes a first feature being disposed on or above a second feature, it means that it includes embodiments in which the above-mentioned first feature and the above-mentioned second feature are in direct contact, and also includes embodiments in which additional features can be disposed between the above-mentioned first feature and the above-mentioned second feature, such that the above-mentioned first feature and the above-mentioned second feature may not be in direct contact. Additionally, different embodiments of the present invention may use repeated reference symbols and / or markings. These repetitions are for the purpose of simplification and clarity and are not used to limit the relationship between each embodiment and / or the described appearance structure. Furthermore, for the convenience of describing the relationship between a component or feature part in the drawing and another (plural) component or (plural) feature part, spatial relative terms may be used, such as "above", "below", "top", "bottom" and similar terms. Except for the orientations shown in the drawings, the spatial relative terms are used to cover different orientations of the device during use or operation. The device can also be positioned otherwise (e.g., rotated 90 degrees or in other orientations), and the descriptions of the spatial relative terms used are interpreted accordingly. In addition, when a component is referred to as being "connected to" or "coupled to" another component, it can be directly connected to or coupled to the other component, or there may be intervening components. Additionally, it can be understood that although terms such as "first", "second", etc. may be used in the claims to describe different components, these components should not be limited by these terms, and in the embodiments, these components described correspondingly are represented by different component symbols. These terms are used to distinguish different components. For example: The first component can be referred to as the second component, and similarly, the second component can also be referred to as the first component, without departing from the scope of the embodiments. The term "and / or" used in this way includes any or all combinations of one or more of the related listed items.

[0078] Figure 3 Disclosed is the three-dimensional structure of a voltage regulator module (the external circuit board is not shown) according to an embodiment of the present invention. Figure 4 Disclose Figure 3 The cross-sectional view along the line AA'. Figure 5 Disclosed is the cross-sectional view of a PCB component according to an embodiment of the present invention. For the convenience of display, Figure 3 - Figure 4The external circuit board is not shown. To simplify the overall number of component layers of the voltage regulator module 1 and facilitate subsequent soldering and reduce the number of soldering operations, the present invention proposes a PCB assembly 2 applied to the voltage regulator module 1. In this embodiment, the PCB assembly 2 includes a PCB 10 and an inductor 15. The PCB 10 includes a top surface 101 and a bottom surface 102. The inductor 15 is buried in the PCB 10. The inductor 15 includes an upper surface 151 and a lower surface 152 which are oppositely arranged. The inductor 15 includes a magnetic core 14 and a winding 13. The winding 13 passes through the magnetic core 14, and the winding 13 forms an upper lead-out end 131 on the upper surface 151 and a lower lead-out end 132 on the lower surface 152. It should be noted that in this embodiment, the volume ratio of the magnetic core 14 in the PCB assembly 2 exceeds 50%. In addition, in this embodiment, the PCB 10 is a multi-layer board structure, including M conductive layers and N conductive layers, where the M conductive layers are arranged above the upper surface 151 of the inductor 15. In this embodiment, the M conductive layers include three conductive layers 111, 112, and 113. The upper lead-out end 131 of the winding 13 is connected to the inner conductive layer 111 attached to the upper surface 151 of the inductor 15. The upper surface conductive layer 113 forms an upper soldering position 103 on the top surface 101 of the PCB assembly 2. In this embodiment, the upper soldering position 103 and the upper lead-out end 131 of the winding 13 are opposite to each other in space and are connected through an upper circuit channel 114. The upper circuit channel 114 connects the upper soldering position 103 and the upper lead-out end 131 by electroplating via holes from the inside to the outside in the M conductive layers. In this embodiment, the N conductive layers are arranged below the lower surface 152 of the inductor 15. In this embodiment, the N conductive layers include three conductive layers 121, 122, and 123. The lower lead-out end 132 of the winding 13 is connected to the inner conductive layer 121 attached to the lower surface 152 of the inductor 15, and the lower surface conductive layer 123 forms a lower soldering position 104 on the bottom surface 102 of the PCB assembly 2. In this embodiment, the lower soldering position 104 and the lower lead-out end 132 of the winding 13 are opposite to each other in space and are connected through a lower circuit channel 124. The lower circuit channel 124 connects the lower soldering position 104 and the lower lead-out end 132 by electroplating via holes from the inside to the outside in the N conductive layers. It should be noted that M and N are integers, and M = N ≥ 2.

[0079] In this embodiment, the upper soldering position 103 on the top surface 101 of the PCB 10 is further electrically connected to the soldering pad 31 of the power device 3 to assemble and transmit the input electrical signal. Among them, the power device 3 can be an IC (Integrated Circuit) device. The connection between the soldering pad 31 and the upper soldering position 103 can be realized by solder 5 through a reflow soldering process. In this embodiment, the PCB assembly 2, the power device 3, and the modules of the external circuit board (not shown in the figure) form a new structure of the voltage regulator module 1. The overall external shape of the voltage regulator module 1 structure is as Figure 3As shown, it includes three parts: the power device 3 on the upper layer, the PCB component 2 on the lower layer, and the external circuit board (not shown in the figure) on the bottommost layer. Among them, the power device 3 can be DrMOS, including two switching tubes and a driving circuit. The PCB component 2 used to construct the voltage regulator module 1 structure can further form a plated-through hole layer 21 on the board edge through the board edge copper plating process. In this embodiment, the plated-through hole layer 21 is disposed on the top surface 101, the bottom surface 102, and the side walls of the PCB 10, and is electrically connected between the M-layer conductive layer and the N-layer conductive layer to form a test function circuit by assembling and transmitting current signals. In other embodiments, the plated-through hole layer 21 is further connected to other later main board connections for testing and repair. In another embodiment, the PCB component 2 can also be provided with conductive vias 22 that penetrate the top surface 101 and the bottom surface 102 of the PCB 10 and are electrically connected between the M-layer conductive layer and the N-layer conductive layer. In some embodiments of the present invention, adjacent two conductive layers among the M-layer conductive layer and the N-layer conductive layer are connected by buried vias 17, and the M-layer conductive layer and the N-layer conductive layer are sequentially connected to the external electrical signals from the inside out through the buried vias 17.

[0080] Figure 6 Schematic diagram of the inductor structure of an embodiment of the present invention is disclosed. Refer to Figure 3 to Figure 6 . In this embodiment, the PCB component 2 includes an inductor 15 buried inside the PCB 10, and a multi-layer board structure above the upper surface 151 and below the lower surface 152 of the inductor. The integrated inductor 15 has, for example, Figure 6 the structure shown. The inductor 15 includes at least one winding 13 and a magnetic core 14. The winding 13 passes through the magnetic core 14 made of a magnetic conductive material such as ferrite or magnetic powder core, and then is formed into an integrated inductor 15 through pressing, and the whole process is integrally formed. It should be noted that in this embodiment, the volume ratio of the magnetic core 14 in the PCB component 2 exceeds 50%, and the area ratio of the magnetic core 14 on the top view surface of the PCB component 2 (i.e., Figure 6 the plane formed by the direction X and the direction Y) exceeds 70%. By increasing the effective magnetic conductive cross-sectional area of the magnetic core 14, the loss of the magnetic core 14 and the loss of the winding 13 are reduced, and the overall conversion efficiency of the voltage regulator module 1 is improved. In other words, in a horizontal plane, the horizontal plane can be parallel to the upper surface 151 and the lower surface 152, and the projected area ratio of the magnetic core 14 on the projected area of the PCB component 2 exceeds 70%.

[0081] In this embodiment, the inductor 15 includes, for example, two windings 13. The two windings 13 respectively form two upper lead-out ends A1 and B1 on the upper surface 151 of the inductor 15, and two lower lead-out ends A2 and B2 on the lower surface 152 of the inductor 15, as Figure 6 shown.

[0082] In this embodiment, as Figure 5As shown, the M-layer conductive layer includes inner conductive layers G1, G2, G3 and upper surface conductive layer GTL. The N-layer conductive layer includes inner conductive layers G4, G5, G6 and lower surface conductive layer GBL. In this embodiment, the inner conductive layers G1, G2, G3, G4, G5, G6 can all be regarded as the inner layers of the PCB assembly 2, and are used for internal wiring and copper cladding of the PCB assembly 2. The upper surface conductive layer GTL and the lower surface conductive layer GBL can be regarded as the outer layers of the PCB assembly 2, such as the top surface 101 and the bottom surface 102 of the PCB 10, and are used for surface wiring, copper cladding and soldering devices.

[0083] In this embodiment, in addition to integrating the inductor 15, the PCB assembly 2 integrates an input circuit path, a control signal path, a signal detection path, and even a test function circuit, etc. The wiring in the multi-layer board structure of the PCB 10 can all realize the transmission of input signals, control signals and sampling signals. In one embodiment, the voltage regulator module 1 can also improve the function of the overall PCB assembly 2 by adding a copper plating layer 21 on the edge of the PCB assembly 2. For example, the copper plating layer 21 on the edge is used to transmit current signals or for adding a test function circuit. Of course, the present invention is not limited thereto.

[0084] In this embodiment, when the power input terminal VIN is connected to the power device 3 through the wiring of the upper surface conductive layer GTL of the PCB assembly 2, the welding pad 31 of the power device 3 is spatially opposite to the upper welding position 103 on the upper surface of the PCB assembly 2. Among them, the upper welding position 103 and the upper lead-out end 131 of the inductor 15 are spatially opposite to each other and are electrically connected through the upper circuit channel 114. The upper welding position 103 is connected to the upper lead-out end 131 on the upper surface 151 of the inductor 15 by electroplating and punching, so as to realize the electrical signal transmission between the power device 3 and the inductor 15. The lower lead-out end 132 on the lower surface 152 of the inductor 15 is also electrically connected to the welding pad connected to the lower surface conductive layer GBL of the PCB assembly 2 through electroplating and punching.

[0085] In other embodiments, the control signal and the sampling signal realize the electrical connection between the welding pads on the top surface 101 and the bottom surface 102 through the internal wiring and electroplating and punching of the PCB assembly 2. In addition, the electrical connection between the welding pads on the top surface 101 and the bottom surface 102 of the PCB assembly 2 can also be realized through the copper plating layer 21 on the edge of the board. At the same time, the load current can flow back from the bottom surface 102 of the PCB assembly 2 to the top surface 101 of the PCB assembly 2 through the copper plating layer 21 on the edge of the board. Since the transmission path is exposed on the outer surface of the PCB assembly 2, it is beneficial to the overall heat dissipation of the PCB assembly 2.

[0086] In this embodiment, the inductor 15 is embedded in the PCB multi-layer board structure. The upper lead-out end 131 of the winding 13 is connected to the inner conductive layer G3, which can be achieved by electroplating. In one embodiment, the multi-layer board structure above the upper surface 151 of the inductor can electrically connect the inner conductive layers G3, G2, G1, and the upper surface conductive layer GTL to each other in sequence through the electroplated via copper process, and is electrically connected through the upper circuit channel 114. Similarly, the multi-layer board structure below the lower surface 152 of the inductor can electrically connect the inner conductive layers G4, G5, G6, and the lower surface conductive layer GBL to each other in sequence through the electroplated via copper process, and is electrically connected through the lower circuit channel 124.

[0087] In this embodiment, a metal conductor 16 is also provided inside the PCB assembly 2. The metal conductor 16 is configured to transmit electrical signals. In other embodiments, the metal conductor can be a copper block, which is used to realize the transmission of control signals or other signals. At the same time, the copper block can help improve the stress of the PCB assembly 2. Of course, the position where the copper block is set can be adjusted according to actual application requirements. The present invention is not limited thereto.

[0088] Figure 7 Disclosed is a schematic diagram of the upper welding position on the top surface of the PCB assembly of the present invention corresponding to the power device. In this embodiment, the upper and lower multi-layer board structures are processed layer by layer from the inside to the outside through the electroplated via copper process, and the upper welding position 103 can be formed on the top surface 101 of the PCB assembly 2 by sequential lamination. Finally, the upper surface conductive layer GTL forms the first winding upper welding position SW1 and the second winding upper welding position SW2 corresponding to the two power devices 3 on the top surface 101 of the PCB assembly 2, as Figure 7 shown, for welding the power device 3 to make the external input current flow into the inductor 15. The terminals of the inductor 15 are located inside the PCB assembly 2 and are directly connected through electroplating and routing, avoiding the risks generated during the welding of traditional independent inductors and PCBs, and reducing the process flow. In this embodiment, the PCB assembly 2 is paired with two power devices 3. In other embodiments, the number of power devices 3 paired with the PCB assembly 2 can be adjusted according to actual application requirements. When the voltage regulator module 1 needs to configure multiple power devices 3 on the PCB assembly 2, the power devices 3 can be arranged horizontally on the top surface 101 of the PCB assembly 2 and are electrically connected to the inductor 15 through the upper welding position 103. Of course, the present invention is not limited thereto.

[0089] Figure 8 Disclosed is a schematic diagram of the lower welding position on the bottom surface of the PCB assembly of the present invention. Similarly, the multi-layer board structure below the lower surface 152 of the inductor is processed layer by layer from the inside to the outside, and the lower welding position 104 can be formed on the bottom surface 102 of the PCB assembly 2 after sequential lamination. The other lead-out ends A2, B2 of the inductor 15 (see Figure 6)It is processed and connected layer by layer by electroplating to the lower surface conductive layer GBL below, and the first output welding position VO1 and the second output welding position VO2 are formed, as Figure 8 shown. In an embodiment, the first output welding position VO1 and the second output welding position VO2 can be used to connect to an external circuit board such as a system motherboard or an adapter board, so that current flows out of the inductor to supply power to the system motherboard or provide an electrical signal to the adapter board. It should be noted that the multilayer board structures above the upper surface 151 and below the lower surface 152 of the inductor have the same number of conductive layers and are symmetrically arranged with each other, so as to ensure the same electrical performance on both sides of the inductor 15.

[0090] Figure 9 Schematic diagram of the lower welding position of another embodiment of the bottom surface of the PCB component of the present invention is disclosed. In this embodiment, the lower welding position 104 formed on the bottom surface 102 of the PCB component 2 can be adjusted according to actual application requirements. In this embodiment, the lower welding position 104 can form, for example, a matrix of pads, where the first output welding position VO1 and the second output welding position VO2 are composed of different matrix pads, and other matrix pads can also be used as the ground welding position GND. In some embodiments of the present invention, the multilayer board structure below the lower surface 152 of the inductor 15 is processed layer by layer from the inside to the outside to form the first output welding position VO1, the second output welding position VO2, and the ground welding position GND, where the first output welding position VO1 and the ground welding position GND are arranged in an interleaved manner, and the second output welding position VO2 and the ground welding position GND are arranged in an interleaved manner to disperse the current density of the PCB component 2 and the external circuit board and reduce the parasitic inductance of the output port. Of course, the present invention is not limited thereto.

[0091] Figure 10 and Figure 11Disclosed is a schematic diagram of disassembling an external circuit board of another voltage regulator module of the present invention. In this embodiment, a lower-layer PCB component 2 and an upper-layer power device 3 are disposed on an external circuit board to form a voltage regulator module 1. Among them, the bottom surface 102 of the lower-layer PCB component 2 can be electrically connected to the external circuit board 9. In this embodiment, the external circuit board 9 is, for example, a motherboard or an adapter board of an external system. The bottom surface 102 of the PCB component 2 has a lower welding position 104, which includes a plurality of matrix pads. Some of the matrix pads are further divided into a first output welding position VO1 and a second output welding position VO2 according to the circuit design requirements. Other matrix pads can also be divided for other applications. In addition, there is a welding area 91 on the upper surface of the external circuit board 9 corresponding to the matrix pads. In this embodiment, the connection between the welding area 91 of the external circuit board 9 and the lower welding position 104 of the PCB component 2 can be realized by solder through a reflow soldering process. In this embodiment, the terminals of the inductor 15 are integrally formed inside the PCB component 2, and the electrical connection is directly realized through the electroplating and wiring of the multilayer board structure above the upper surface 151 and below the lower surface 152 of the inductor, avoiding the risks generated when an independent inductor is welded to an external system with terminals, and at the same time reducing the process flow.

[0092] It should be noted that when assembling the voltage regulator module 1 before welding in the present invention, the power device 3, the PCB component 2, and the external circuit board 9 are vertically stacked in sequence. The upper welding position 103 of the PCB component 2 is electrically connected to the power device 3 to assemble and transmit an input electrical signal. The lower welding position 104 of the PCB component 2 is electrically connected to the external circuit board 9 to assemble and transmit an output electrical signal. It is worth noting that the power device 3 and the upper welding position 103 and the lower welding position 104 and the external circuit board 9 are electrically connected through a single reflow soldering process to form the voltage regulator module 1. In other words, the manufacturing of the voltage regulator module 1 of the present invention avoids multiple weldings. When the welding point undergoes more reflow high-temperature processes, the air bubbles inside the solder joint are more likely to gather and expand, splashing out solder balls and causing welding quality problems. Especially on the motherboard of artificial intelligence, the number of voltage regulator modules 1 used is dozens or hundreds, which will seriously amplify this quality risk. In order to enable the PCB component 2 and the power device 3 to only go through a single reflow soldering process when completing the production of the voltage regulator, the present invention proposes a new method. After the power device 3, the PCB component 2, and the external circuit board 9 are vertically stacked. Finally, the entire power system can be welded through a single reflow soldering. Thus, not only the overall mechanical structure of using the voltage regulator module 1 is maintained, and all the performance advantages are retained, but also the product quality and long-term reliability are improved, and the overall cost is reduced.

[0093] Figure 12 and Figure 13 Disclosed is an exploded view of another voltage regulator module of the present invention.Figure 14 Flow chart of the manufacturing method of the voltage regulator module according to the first embodiment of the present invention. In the production method of the voltage regulator's first reflow soldering, refer to Figure 3 to Figure 14, in this embodiment, first, as shown in steps S01, S02, and S03, a PCB assembly 2, a power device 3, and an external circuit board 9 are respectively provided, and the providing order can be adjusted according to requirements. In this embodiment, the PCB assembly 2 includes a PCB 10 and an inductor 15. The PCB 10 includes a top surface 101 and a bottom surface 102 arranged oppositely. The inductor 15 is buried in the PCB 10, and the inductor 15 includes an upper surface 151 and a lower surface 152 arranged oppositely. The inductor 15 further includes a magnetic core 14 and a winding 13. The winding 13 passes through the magnetic core 14, and the winding 13 forms an upper lead-out end 131 on the upper surface 151 and a lower lead-out end 132 on the lower surface 152. The PCB 10 is a multi-layer board structure, including an M-layer conductive layer and an N-layer conductive layer. The M-layer conductive layer is arranged above the upper surface 151 of the inductor 15, and the N-layer conductive layer is arranged below the lower surface 152 of the inductor 15. It should be noted that the upper surface 151 and the lower surface 152 have the same number of conductive layers, and the top surface 101 and the bottom surface 102 of the PCB assembly 2 respectively have an upper welding position 103 connected to the upper lead-out end 131 of the winding 13 and a lower welding position 104 connected to the lower lead-out end 132 of the winding 13. Additionally, in this embodiment, the volume ratio of the magnetic core 14 in the PCB assembly 2 exceeds 50%, and the area ratio of the magnetic core 14 on the top view of the PCB assembly 2 exceeds 70%, thereby reducing the losses of the magnetic core 14 and the winding 13 and improving the overall conversion efficiency of the voltage regulator module 1. In other words, in a horizontal plane, the horizontal plane can be parallel to the upper surface 151 and the lower surface 152, and the area ratio of the projection of the magnetic core 14 on the projection area of the PCB assembly 2 exceeds 70%. Of course, the present invention is not limited thereto. In this embodiment, the power device 3 is, for example, an IC device, specifically a DrMOS, and includes two switching transistors and a driving circuit. The power device 3 includes two surfaces, and the lower surface contains a welding portion formed by a welding pad 31, which is spatially opposite to the upper welding position 103 of the PCB assembly 2. In this embodiment, the upper surface of the external circuit board 9 includes a welding area 91 of a pad structure, which is spatially opposite to the lower welding position 104 of the PCB assembly 2 and is used for welding the PCB assembly 2. Then, as in step S04: solder is provided in the welding area 91 of the external circuit board, and solder is provided in the upper welding position 103 of the PCB assembly. The solder is, for example, solder paste, and the solder can be provided by spraying or printing methods. In this step, the power device 3, the PCB assembly 2, and the external circuit board 9 with solder provided are vertically stacked in sequence to form a vertical structure, which is the power device 3, the PCB assembly 2, and the external circuit board 9 from top to bottom in sequence.When forming a vertical structure, the order of providing the power device 3, the PCB assembly 2, and the external circuit board 9 can be adjusted according to requirements. That is, the power device 3 can be first disposed on the PCB assembly 2, and then the power device 3 and the PCB assembly 2 can be placed together on the external circuit board 9. Or the PCB assembly 2 can be first placed on the external circuit board 9, and then the power device 3 can be placed on the PCB assembly 2. Among them, the lower welding position 104 of the PCB assembly 2 is aligned with the welding area 91 of the external circuit board 9, and the welding pad 31 of the power device 3 is aligned with the upper welding position 103 of the PCB assembly 2. Finally, a reflow soldering process is performed according to step S05 to realize the electrical connection of the power device 3, the PCB assembly 2, and the external circuit board 9.

[0094] Figure 15 Disclosed is a schematic structural diagram of another embodiment of the PCB assembly of the present invention. It should be noted that the PCB assembly 2 applied to the assembly of the voltage regulator module 1 proposed by the present invention, in addition to Figure 12 and Figure 13 the PCB assembly 2 structure shown in Figure 15 the PCB assembly 2a in

[0095] is composed of a multilayer board structure 10a, and further includes an inductor 15 buried in the multilayer board structure 10a. The inductor 15 includes a magnetic core 14 and at least one winding 13. The magnetic core 14 is pre-processed and formed, and the winding 13 passes through the magnetic core 14 and is buried in the multilayer board structure 10a of the PCB assembly 2a to form the upper and lower lead-out ends of the inductor 15. And through the electroplating and drilling method, the upper and lower lead-out ends of the winding 13 of the inductor 15 are electrically connected to the upper welding position 103 and the lower welding position 104 on the surface of the PCB assembly 2a, forming the first winding upper welding position SW1 and the second winding upper welding position SW1 and the first output welding position VO1 and the second output welding position VO2 of the two windings 13 of the inductor 15. Since the inductor 15 is built into the multilayer board structure 10a of the PCB assembly 2a, and through the electroplating process, the inductor 15 and the multilayer board structure 10a of the PCB assembly 2a form a unified whole, so that the unified PCB assembly 2a and the power device 3, the external circuit board 9 can complete all the welding processes only through one reflow soldering. While increasing the welding reliability of the voltage regulator module 1, the production cost is reduced at the same time.

[0095] Refer again to Figure 3 to Figure 15In other embodiments of the present invention, a single PCB assembly 2, 2a may include multiple inductors 15, which are connected in parallel. In step S04, solder is set on the welding area of ​​the external circuit board 9 and the upper welding positions 103 of the multiple inductors 15, and the multiple power devices 3, PCB assemblies 2, 2a and the external circuit board 9 are stacked vertically in sequence, wherein the welding parts of the multiple power devices 3 are aligned to the upper welding positions 103 of the multiple inductors 15, and the lower welding positions 104 of the multiple inductors 15 are aligned to the welding area 91. Finally, a reflow soldering process is performed according to step S05 to achieve electrical connection of the multiple power devices 3, the PCB assembly 2a and the external circuit board 9. Of course, the present invention is not limited to this.

[0096] refer to Figure 3 to Figure 14 For the above-mentioned production method of one-time reflow soldering of the voltage regulator module, in some other embodiments of the present invention, a plurality of PCB components 2 may be first arrayed in a fixing fixture, and then solder paste may be set on the upper soldering position 103 of the top surface 101 of the PCB component by a printing or spraying process, and then the PCB component with the solder paste set may be placed on the soldering area 91 of the external circuit board 9 by a side clamping method, on which the solder paste has been set by a printing or spraying process, and then a power device 3 such as an IC may be placed on the upper soldering position 103 of the top surface 101 of the PCB component 2. In some other embodiments of the present invention, multiple PCB components 2 may be arranged in an array in a fixed fixture, and then solder paste is set on the upper soldering position 103 of the top surface 101 of the PCB component by printing or spraying, and then the power device 3 such as IC is placed on the upper soldering position 103 of the top surface 101 of the PCB 10 with the solder paste set, and then the PCB component with the solder paste set and the power device 3 such as IC is placed is placed on the soldering area 91 of the external circuit board 9 by side clamping, and the solder paste is set on the soldering area 91 by printing or spraying. Finally, by performing a reflow soldering process, the electrical connection of multiple power devices 3, PCB components 2 and external circuit boards 9 can be achieved. Of course, the present invention is not limited to this.

[0097] Figure 16 The present invention discloses a connected structure formed by arranging multiple PCB components. Figure 3 to Figure 14 and Figure 16For the above-mentioned method for producing the voltage regulator module by one-time reflow soldering, in some other embodiments of the present invention, a connecting structure 200 including a plurality of PCB components 2 is further provided. When producing the voltage regulator module 1 by one-time reflow soldering, solder can be firstly provided on the upper soldering positions 103 of the plurality of PCB components 2 of the connecting structure 200. Then, the connecting structure 200 is placed on the soldering areas 91 of the plurality of external circuit boards 9 provided with solder by means of side clamping. Then, a plurality of power devices 3 are correspondingly placed on the upper soldering positions 103 of the plurality of PCB components 2 of the connecting structure 200. In some other embodiments of the present invention, solder paste may be firstly set on the upper soldering positions 103 of the multiple PCB components 2 of the connecting structure 200 by printing or spraying, and then the multiple power devices 3 may be placed on the upper soldering positions 103 of the multiple PCB components 2 of the connecting structure 200 with the solder paste set, and then the connecting structure 200 with the solder paste set and the multiple power devices 3 placed may be placed on the soldering areas 91 of the multiple external circuit boards 9 with solder by side clamping. After that, as long as a reflow soldering process is performed, the electrical connection of the multiple power devices 3, the connecting structure 200 and the multiple external circuit boards 9 is realized. Finally, the connecting structure 200 is cut and separated, so that the multiple power devices 3, the connecting structure 200 and the multiple external circuit boards 9 arranged vertically and sequentially stacked form multiple independent voltage regulator modules 1.

[0098] In addition, in addition to the connecting structure 200 formed by arranging multiple PCB components 2, in some other embodiments of the present invention, a substrate structure formed by arranging multiple external circuit boards 9 can also be provided. When the voltage regulator module 1 is produced by a single reflow soldering, solder can be first set on the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200. Then, the connecting structure 200 is placed on the welding areas 91 of the multiple external circuit boards 9 of the substrate structure where solder is set in a side clamping manner. Then, multiple power devices 3 are correspondingly placed on the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200. In some other embodiments of the present invention, solder paste may be first set on the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200 by printing or spraying, and then the multiple power devices 3 may be placed on the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200 with the solder paste set, and then the connecting structure 200 with the solder paste set and the multiple power devices 3 placed may be placed on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure with solder by side clamping. After that, as long as a reflow soldering process is performed, the electrical connection of the multiple power devices 3, the connecting structure 200 and the substrate structure is realized. Finally, the connecting structure 200 and the substrate structure are cut and separated, so that the multiple power devices 3, the connecting structure 200 and the substrate structure arranged vertically stacked in sequence form multiple independent voltage regulator modules 1.

[0099] Figure 17 Another embodiment of the present invention discloses a three-dimensional structure of a voltage regulator module including stacked components. Figure 18 and Figure 19 public Figure 17 Exploded view of the voltage regulator module. Figure 20 The cross-sectional view of a stacked component according to an embodiment of the present invention is disclosed. In this embodiment, the voltage regulator module 1a and Figure 1 to Figure 13 The voltage regulator module 1 shown in the figure is similar, and the same component numbers represent the same components, structures and functions, which will not be repeated here. In the present embodiment, the voltage regulator module 1a also includes a stacking member 4, which is stacked between the PCB assembly 2 and the external circuit board 9, so that the lower welding position 104 of the PCB assembly 2 and the external circuit board 9 are electrically connected through the stacking member 4. The stacking member 4 includes an upper welding pad 403 and a lower welding pad 404, which are respectively located on the upper surface 401 and the lower surface 402 opposite to each other. In the present embodiment, the stacking member 4 may be a capacitor monomer, and the capacitor monomer may include a capacitor component and / or a metal conductor 406, which is embedded in the interior of the stacking member 4. The capacitor component may, for example, be a plurality of capacitors 405 embedded in a circuit board (such as Figure 20 As shown in FIG. 1 , in other embodiments of the present invention, the capacitor assembly may also be formed by welding a plurality of capacitors on the surface of a circuit board. In addition, the metal conductor 406 may be, for example, a copper block, configured to transmit electrical signals, and may increase the structural strength of the stacking member 4. In other embodiments, the stacking member 4 may also be a switch monomer or a magnetic member monomer. The present invention is not limited thereto.

[0100] In this embodiment, the upper welding position 103 of the PCB assembly 2 is electrically connected to the power device 3, the lower welding position 104 is electrically connected to the upper welding pad 403 of the stacking member 4, and the lower welding pad 404 of the stacking member 4 is electrically connected to the welding area 91 of the external circuit board 9. The power device 3, the PCB assembly 2, the stacking member 4 and the external circuit board 9 are vertically stacked in sequence, and the power device 3 and the upper welding position 103, the lower welding position 104 and the upper welding pad 403, and the lower welding pad 404 and the external circuit board 9 are electrically connected through a reflow soldering process to form a voltage regulator module 1a. In this embodiment, the PCB assembly 2, the power device 3, the stacking member 4 and the external circuit board 9 are first provided for assembly before reflow soldering, and the order of providing and stacking assembly can be adjusted as required.

[0101] In some other embodiments of the present invention, solder may be first disposed on the soldering area 91 of the external circuit board 9, and the stack 4 is placed on the soldering area 91 so that the lower solder pad 404 of the stack 4 is aligned with the soldering area 91. Then, a solder is disposed on the upper solder pad 403 of the stack 4, and the PCB assembly 2 is placed on the upper solder pad 403 so that the lower soldering position 104 is aligned with the upper solder pad 403. After that, a solder is disposed on the upper soldering position 103 of the PCB assembly 2, and the power device 3 is placed on the upper soldering position 103 so that the soldering portion of the power device 3 is aligned with the upper soldering position 103 of the PCB assembly 2. Finally, by performing a reflow soldering process, the electrical connection of the power device 3, the PCB assembly 2, the stack 4, and the external circuit board 9 can be achieved to form the voltage regulator module 1a. Of course, the stacking order and the providing order of the power device 3, the PCB assembly 2, the stack 4, and the external circuit board 9 can be adjusted according to actual application requirements and are not limited to sequential stacking. For example, a solder may be first disposed on the upper solder pad 403 of the stack 4, and the PCB assembly 2 is placed on the upper solder pad 403 so that the lower soldering position 104 is aligned with the upper solder pad 403. Then, a solder is disposed on the upper soldering position 103 of the PCB assembly 2, and the power device 3 is placed on the upper soldering position 103 so that the soldering portion of the power device 3 is aligned with the upper soldering position 103 of the PCB assembly 2. After that, a solder is disposed on the soldering area 91 of the external circuit board 9, and the stack 4 is placed on the soldering area 91. Finally, by performing a reflow soldering process, the electrical connection of the power device 3, the PCB assembly 2, the stack 4, and the external circuit board 9 can be achieved to form the voltage regulator module 1a. Some other manufacturing combinations can be flexibly adjusted according to actual manufacturing requirements and will not be elaborated here.

[0102] In some other embodiments of the present invention, a plurality of PCB assemblies 2 may also be arranged in an array within a fixing jig first. Then, solder is provided at the welding areas 91 of the plurality of external circuit boards 9, and a plurality of overlays 4 are placed on the welding areas 91 of the plurality of external circuit boards 9, such that the lower welding pads 404 of the plurality of overlays 4 are aligned with the welding areas 91 of the plurality of external circuit boards 9. After that, a solder is provided at the upper welding pads 403 of the plurality of overlays 4, and the lower welding positions 104 of the plurality of PCB assemblies 2 are correspondingly placed on the upper welding pads 403 of the plurality of overlays 4 in a side clamping manner, such that the lower welding positions 104 of the plurality of PCB assemblies 2 are aligned with the upper welding pads 403 of the plurality of overlays 4. Finally, a solder is provided at the upper welding positions 103 of the plurality of PCB assemblies 2, and the plurality of power devices 3 are correspondingly placed on the upper welding positions 103 of the plurality of PCB assemblies 2, such that the welding portions of the plurality of power devices 3 are aligned with the upper welding positions 103 of the plurality of PCB assemblies 2. In this way, the stacked structure of the power devices 3, the PCB assemblies 2, the overlays 4, and the external circuit boards 9 can be completed. As long as a reflow soldering process is carried out again, the electrical connection between the power devices 3, the PCB assemblies 2, the overlays 4, and the external circuit boards 9 can be realized, and a plurality of voltage regulator modules 1a are formed. Of course, the stacking order and the providing order of the plurality of power devices 3, the plurality of PCB assemblies 2, the plurality of overlays 4, and the plurality of external circuit boards 9 can be adjusted according to actual application requirements, and are not limited to sequential stacking. For example, a solder can be provided at the upper welding pads 403 of the plurality of overlays 4 first, and then the plurality of PCB assemblies 2 are arranged in an array within a fixing jig. After that, the lower welding positions 104 of the plurality of PCB assemblies 2 are correspondingly placed on the upper welding pads 403 of the plurality of overlays 4 in a side clamping manner, such that the lower welding positions 104 of the plurality of PCB assemblies 2 are aligned with the upper welding pads 403 of the plurality of overlays 4. Subsequently, a solder is provided at the upper welding positions 103 of the plurality of PCB assemblies 2, and the plurality of power devices 3 are correspondingly placed on the upper welding positions 103 of the plurality of PCB assemblies 2, such that the welding portions of the plurality of power devices 3 are aligned with the upper welding positions 103 of the plurality of PCB assemblies 2. Finally, a solder is provided at the welding areas 91 of the plurality of external circuit boards 9, and the plurality of overlays 4 are placed on the welding areas 91 of the plurality of external circuit boards 9. In this way, the stacked structure of the power devices 3, the PCB assemblies 2, the overlays 4, and the external circuit boards 9 can be completed. As long as a reflow soldering process is carried out again, the electrical connection between the power devices 3, the PCB assemblies 2, the overlays 4, and the external circuit boards 9 can be realized, and a plurality of voltage regulator modules 1a are formed. As described above, some other manufacturing combinations can be flexibly adjusted according to actual manufacturing requirements, and will not be elaborated here.

[0103] Reference Figure 16 to Figure 20. In some other embodiments of the present invention, a connecting structure 200 including multiple PCB components 2 may also be provided for manufacturing a voltage regulator. When the voltage regulator module 1a is produced by a single reflow soldering, solder may be first set on the welding area 91 of multiple external circuit boards 9, and multiple stacking parts 4 may be placed on the welding area 91 of multiple external circuit boards 9, so that the lower welding pads 404 of the multiple stacking parts 4 are aligned to the welding area 91 of the multiple external circuit boards 9. Next, a solder is set on the upper welding pads 403 of the multiple stacking parts 4, and the lower welding positions 104 of the multiple PCB components 2 of the connecting structure 200 are placed on the upper welding pads 403 of the multiple stacking parts 4 in a side clamping manner, so that the lower welding positions 104 of the multiple PCB components 2 of the connecting structure 200 are aligned to the upper welding pads 403 of the multiple stacking parts 4. Afterwards, solder is set on the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200, and the multiple power devices 3 are placed on the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200, so that the welding parts of the multiple power devices 3 are aligned to the upper welding positions 103 of the multiple PCB components 2 of the connecting structure 200. Then, as long as a reflow soldering process is performed, the electrical connection of the multiple power devices 3, the connecting structure 200, the multiple stacking parts 4 and the multiple external circuit boards 9 is achieved. Finally, the connecting structure 200 is cut and separated, so that the multiple power devices 3, the connecting structure 200, the multiple stacking parts 4 and the multiple external circuit boards 9 arranged vertically in sequence form multiple independent voltage regulator modules 1. Of course, the stacking order and the providing order of the multiple power devices 3, the connecting structure 200, the multiple stacking parts 4 and the multiple external circuit boards 9 can be adjusted according to the actual application requirements, and are not limited to stacking in sequence. For example, a solder may be firstly set on the upper soldering pads 403 of the plurality of stacking parts 4, and the lower soldering positions 104 of the plurality of PCB components 2 of the connecting structure 200 may be placed on the upper soldering pads 403 of the plurality of stacking parts 4 in a side clamping manner, so that the lower soldering positions 104 of the plurality of PCB components 2 of the connecting structure 200 are aligned to the upper soldering pads 403 of the plurality of stacking parts 4. Then, a solder may be set on the upper soldering positions 103 of the plurality of PCB components 2 of the connecting structure 200, and the plurality of power devices 3 may be placed on the upper soldering positions 103 of the plurality of PCB components 2 of the connecting structure 200, so that the soldering parts of the plurality of power devices 3 are aligned to the upper soldering positions 103 of the plurality of PCB components 2 of the connecting structure 200. Afterwards, a solder may be set on the soldering areas 91 of the plurality of external circuit boards 9, and the plurality of stacking parts 4 may be placed on the soldering areas 91 of the plurality of external circuit boards 9, so that the lower soldering pads 404 of the plurality of stacking parts 4 are aligned to the soldering areas 91 of the plurality of external circuit boards 9. Then, by performing a reflow soldering process, the electrical connection of the multiple power devices 3, the connecting structure 200, the multiple stacking parts 4 and the multiple external circuit boards 9 is achieved. As mentioned above, other manufacturing combinations can be flexibly adjusted according to actual manufacturing needs, which will not be repeated here.

[0104] In addition, in addition to the continuous structure 200 formed by arranging multiple PCB components 2, in some other embodiments of the present invention, a substrate structure formed by arranging multiple external circuit boards 9 can also be provided. When producing a voltage regulator module by a single reflow soldering process, first, solder is provided on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, and multiple stack-up components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, so that the lower solder pads 404 of the multiple stack-up components 4 are aligned with the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure. Then, a solder is provided on the upper solder pads 403 of the multiple stack-up components 4, and the lower soldering positions 104 of the multiple PCB components 2 of the continuous structure 200 are correspondingly placed on the upper solder pads 403 of the multiple stack-up components 4 in a side clamping manner, so that the lower soldering positions 104 of the multiple PCB components 2 of the continuous structure 200 are aligned with the upper solder pads 403 of the multiple stack-up components 4. After that, solder is provided on the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200, and multiple power devices 3 are correspondingly placed on the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200, so that the soldering parts of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200. Then, as long as a reflow soldering process is performed, the electrical connection of the multiple power devices 3, the continuous structure 200, the multiple stack-up components 4, and the substrate structure is achieved. Finally, the continuous structure 200 and the substrate structure are cut and separated, so that the multiple power devices 3, the continuous structure 200, the multiple stack-up components 4, and the substrate structure vertically stacked in sequence form multiple independent voltage regulator modules 1a. Of course, the stacking order and the providing order of the multiple power devices 3, the continuous structure 200, the multiple stack-up components 4, and the substrate structure can be adjusted according to actual application requirements, and are not limited to stacking in sequence. For example, a solder can be provided on the upper solder pads 403 of the multiple stack-up components 4 first, and the lower soldering positions 104 of the multiple PCB components 2 of the continuous structure 200 are correspondingly placed on the upper solder pads 403 of the multiple stack-up components 4 in a side clamping manner, so that the lower soldering positions 104 of the multiple PCB components 2 of the continuous structure 200 are aligned with the upper solder pads 403 of the multiple stack-up components 4. Then, solder is provided on the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200, and multiple power devices 3 are correspondingly placed on the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200, so that the soldering parts of the multiple power devices 3 are aligned with the upper soldering positions 103 of the multiple PCB components 2 of the continuous structure 200. After that, solder is provided on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, and multiple stack-up components 4 are placed on the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure, so that the lower solder pads 404 of the multiple stack-up components 4 are aligned with the soldering areas 91 of the multiple external circuit boards 9 of the substrate structure. Then, as long as a reflow soldering process is performed, the electrical connection of the multiple power devices 3, the continuous structure 200, the multiple stack-up components 4, and the substrate structure is achieved.As mentioned above, some other manufacturing combinations can be flexibly adjusted according to actual manufacturing needs and will not be elaborated here.

[0105] In summary, the present invention provides a PCB assembly for a voltage regulator module and a method for manufacturing the voltage regulator module. By integrating the inductor, input circuit path, control signal path, signal detection path, test function circuit, etc. into a PCB assembly, the number of stacked layers of the voltage regulator module is simplified, thereby greatly reducing the total number of welding times of the product, reducing the production cost of the voltage regulator module, and improving the product quality. Among them, one layer of the voltage regulator module is a PCB assembly with an embedded inductor, and the layer above the PCB assembly can be used to place power devices. In the inductor integrated in the PCB assembly, the inductor winding Winding passes through the inside of the magnetic core and is embedded in the PCB assembly. Its two output terminals are integrated with the copper of the circuit board in the PCB assembly through the electroplating process. The electroplated copper is interconnected from the inside to the outside, and is pressed together one by one to form the welding position of the IC power device on the outer layer of the PCB assembly, and the number of electroplated copper layers stacked on both sides of the inductor is symmetrical and equal. The power device, PCB assembly, stacking parts and external circuit board are connected in an up-and-down stacking manner, which reduces the total occupied area of ​​the voltage regulator module. At the same time, the welding of the entire voltage regulator can be completed with only one reflow soldering, which increases the module production yield and reduces the production cost. At the same time, the PCB assembly can be coordinated with the power device, the external circuit board and the stacking parts to adjust the placement order when stacking, so that the voltage regulator module can be flexibly adjusted according to actual conditions during manufacturing, which is convenient for manufacturing. In addition, when the PCB assembly is used in the manufacture of the voltage regulator module, it can be combined with the connecting structure of multiple PCB assemblies and the substrate structure of multiple external circuit boards. Multiple voltage regulator modules can be manufactured with only one reflow soldering. The multiple voltage regulator modules after cutting and separation are independent of each other, which improves product quality and long-term reliability, and also greatly reduces production costs. Alternatively, multiple PCB assemblies can be placed by assembling jigs, and multiple voltage regulator modules can be manufactured with only one reflow soldering.

[0106] The present invention may be modified in various ways by those skilled in the art, but all of these modifications are within the scope of the claims of the present invention.

Claims

1. A PCB component, characterized in that, Comprising: A PCB, the PCB comprising a top surface and a bottom surface which are oppositely arranged; And An inductor, the inductor comprising an upper surface and a lower surface which are oppositely arranged, the inductor further comprising a magnetic core and a winding, the winding passing through the magnetic core, and the winding forming an upper lead-out end on the upper surface and a lower lead-out end on the lower surface; Wherein, the inductor is embedded in the PCB, the top surface is opposite to the upper surface in space, the bottom surface is opposite to the lower surface in space, there are a plurality of conductive layers above the upper surface and below the lower surface, and the top surface and the bottom surface respectively have an upper welding position electrically connected to the upper lead-out end and a lower welding position electrically connected to the lower lead-out end; Wherein, the upper welding position is electrically connected to a power device, configured to transmit an input electrical signal, the lower welding position is electrically connected to an external circuit board, configured to transmit an output electrical signal, the power device, the PCB assembly and the external circuit board are vertically stacked in sequence, and the power device and the upper welding position, and the lower welding position and the external circuit board are electrically connected through a single reflow soldering process to form a voltage regulator module.

2. The PCB assembly according to claim 1, wherein a plurality of the PCB assemblies are arranged in an array within a fixed jig, a plurality of the power devices, a plurality of the PCB assemblies and a plurality of the external circuit boards are vertically stacked in sequence, and the power devices and the upper welding positions of the plurality of the PCB assemblies, and the lower welding positions of the plurality of the PCB assemblies and the plurality of the external circuit boards are electrically connected through a single reflow soldering process to form a plurality of the voltage regulator modules.

3. The PCB assembly according to claim 1, wherein a plurality of the PCB assemblies form a continuous sheet structure, a plurality of the power devices, the continuous sheet structure and a plurality of the external circuit boards are vertically stacked in sequence, and the power devices and the upper welding positions of the plurality of the PCB assemblies of the continuous sheet structure, and the lower welding positions of the plurality of the PCB assemblies of the continuous sheet structure and the plurality of the external circuit boards are electrically connected through a single reflow soldering process, wherein by cutting and separating the continuous sheet structure, a plurality of the power devices, the continuous sheet structure and a plurality of the external circuit boards vertically stacked in sequence form a plurality of independent voltage regulator modules.

4. The PCB assembly according to claim 1, wherein a plurality of the PCB assemblies form a continuous sheet structure, a plurality of the external circuit boards form a substrate structure, a plurality of the power devices, the continuous sheet structure and the substrate structure are vertically stacked in sequence, and the power devices and the upper welding positions of the plurality of the PCB assemblies of the continuous sheet structure, and the lower welding positions of the plurality of the PCB assemblies of the continuous sheet structure and the plurality of the external circuit boards of the substrate structure are electrically connected through a single reflow soldering process, wherein by cutting and separating the continuous sheet structure and the substrate structure, a plurality of the power devices, the continuous sheet structure and the substrate structure vertically stacked in sequence form a plurality of independent voltage regulator modules.

5. The PCB assembly according to claim 1, wherein the PCB assembly includes a plurality of the inductors connected in parallel, wherein, The upper welding positions of multiple such inductors are respectively electrically connected to multiple such power devices, configured to transmit the input electrical signal, and the lower welding positions of multiple such inductors are electrically connected to the external circuit board, configured to transmit the output electrical signal. Multiple such power devices, the PCB assembly, and the external circuit board are vertically stacked in sequence. The upper welding positions between multiple such power devices and multiple such inductors and the lower welding positions of multiple such inductors and the external circuit board are electrically connected through a single reflow soldering process to form the voltage regulator module.

6. The PCB assembly according to claim 1, wherein the volume ratio of the magnetic core in the PCB assembly exceeds 50%, and in a horizontal plane, the projected area ratio of the magnetic core on the projected area of the PCB assembly exceeds 70%.

7. The PCB assembly according to claim 1, wherein the PCB assembly further includes an input circuit path, a control signal path, a signal detection path, or a test function circuit.

8. The PCB assembly according to claim 1, wherein a metal conductor is further provided inside the PCB assembly, and the metal conductor is configured to transmit an electrical signal.

9. The PCB assembly according to claim 1, wherein the lower welding position and the external circuit board are electrically connected through a superimposed component, and the superimposed component includes an upper welding pad and a lower welding pad.

10. The PCB assembly according to claim 9, wherein the superimposed component is a single capacitor, a single switch, or a single magnetic component.

11. The PCB assembly according to claim 9, wherein a metal conductor is provided inside the superimposed component, and the metal conductor is configured to transmit an electrical signal.

12. The PCB assembly according to claim 9, wherein the upper welding position is electrically connected to the power device, the lower welding position is electrically connected to the upper welding pad, the lower welding pad is electrically connected to the external circuit board, and the power device, the PCB assembly, the superimposed component, and the external circuit board are vertically stacked in sequence. The upper welding position and the power device, the lower welding position and the upper welding pad, and the lower welding pad and the external circuit board are electrically connected through a single reflow soldering process to form the voltage regulator module.

13. The PCB assembly according to claim 9, wherein multiple such PCB assemblies are arranged in an array within a fixed jig, and multiple such power devices, multiple such PCB assemblies, multiple such superimposed components, and multiple such external circuit boards are vertically stacked in sequence. The upper welding positions between multiple such power devices and multiple such PCB assemblies, the lower welding positions of multiple such PCB assemblies and the upper welding pads of multiple such superimposed components, and the lower welding pads of multiple such superimposed components and multiple such external circuit boards are electrically connected through a single reflow soldering process to form multiple such voltage regulator modules.

14. The PCB component according to claim 9, wherein a plurality of the PCB components form a continuous sheet structure, and a plurality of the power devices, the continuous sheet structure, a plurality of the superimposed members, and a plurality of the external circuit boards are vertically stacked in sequence. Between the upper welding positions of the plurality of the power devices and the plurality of the PCB components of the continuous sheet structure, between the lower welding positions of the plurality of the PCB components of the continuous sheet structure and the upper welding pads of the plurality of the superimposed members, and between the lower welding pads of the plurality of the superimposed members and the plurality of the external circuit boards, they are electrically connected by a single reflow soldering process. Wherein, by cutting and separating the continuous sheet structure, the plurality of the power devices, the continuous sheet structure, the plurality of the superimposed members, and the plurality of the external circuit boards vertically stacked in sequence form a plurality of independent voltage regulator modules.

15. The PCB component according to claim 9, wherein a plurality of the PCB components form a continuous sheet structure, and a plurality of the external circuit boards form a substrate structure. A plurality of the power devices, the continuous sheet structure, a plurality of the superimposed members, and the substrate structure are vertically stacked in sequence. Between the upper welding positions of the plurality of the power devices and the plurality of the PCB components of the continuous sheet structure, between the lower welding positions of the plurality of the PCB components of the continuous sheet structure and the upper welding pads of the plurality of the superimposed members, and between the lower welding pads of the plurality of the superimposed members and the plurality of the external circuit boards of the substrate structure, they are electrically connected by a single reflow soldering process. Wherein, by cutting and separating the continuous sheet structure and the substrate structure, the plurality of the power devices, the continuous sheet structure, the plurality of the superimposed members, and the substrate structure vertically stacked in sequence form a plurality of independent voltage regulator modules.

16. The PCB component according to claim 1, wherein the PCB includes an M-layer conductive layer and an N-layer conductive layer, where M and N are positive integers. The M-layer conductive layer is disposed above the upper surface, and the upper lead-out terminal is electrically connected to the one that abuts against the upper surface in the M-layer conductive layer. The N-layer conductive layer is disposed below the lower surface, and the lower lead-out terminal is electrically connected to the one that abuts against the lower surface in the N-layer conductive layer, and M = N ≥ 2.

17. The PCB component according to claim 16, wherein the M-layer conductive layer and the N-layer conductive layer each include a surface conductive layer and an inner conductive layer. The surface conductive layer includes a top surface and a bottom surface, and is used for surface routing, copper cladding, and soldering devices. The inner conductive layer is used for internal routing and copper cladding.

18. The PCB component according to claim 16, wherein the M-layer conductive layer and the N-layer conductive layer are each composed of multiple copper plating layers.

19. The PCB component according to claim 16, further including a board-edge copper plating layer, which is disposed on the top surface, the bottom surface, and one side wall of the PCB, and is electrically connected between the M-layer conductive layer and the N-layer conductive layer to group and transmit current signals or form a test functional circuit.

20. The PCB component according to claim 16, further including a conductive through-hole, which penetrates the top surface and the bottom surface, and is electrically connected between the M-layer conductive layer and the N-layer conductive layer.

21. The PCB component according to claim 16, wherein two adjacent conductive layers among the M-layer conductive layer and the N-layer conductive layer are connected by a buried via, and the M-layer conductive layer and the N-layer conductive layer are sequentially and electrically connected to an external electrical signal from the inside out through the buried via.

22. The PCB component according to claim 21, wherein the N-layer conductive layer forms an output soldering pad and a ground soldering pad on the bottom surface through the buried via, and the output soldering pad and the ground soldering pad are arranged staggeredly.

23. The PCB component according to claim 16, wherein the upper soldering pad and the upper wire outlet end are opposite to each other in space and are electrically connected by an upper circuit channel, and the upper circuit channel is electrically connected to the M-layer conductive layer in sequence.

24. The PCB component according to claim 16, wherein the lower soldering pad and the lower wire outlet end are opposite to each other in space and are electrically connected by a lower circuit channel, and the lower circuit channel is electrically connected to the N-layer conductive layer in sequence.

25. The PCB component according to claim 23 or 24, wherein the upper circuit channel electrically connects the upper soldering pad and the upper wire outlet end in the M-layer conductive layer from the inside out through electroplated via copper, and the lower circuit channel electrically connects the lower soldering pad and the lower wire outlet end in the N-layer conductive layer from the inside out through electroplated via copper.

26. A manufacturing method of a voltage regulator module, characterized in that, Comprising the steps of: (a) Providing a PCB component, which includes a PCB and an inductor. The PCB includes a top surface and a bottom surface that are oppositely arranged. The inductor includes an upper surface and a lower surface that are oppositely arranged. The top surface is opposite to the upper surface in space, and the bottom surface is opposite to the lower surface in space. The inductor is buried in the PCB, and the inductor includes a magnetic core and a winding. The winding passes through the magnetic core, and the winding forms an upper wire outlet end on the upper surface and a lower wire outlet end on the lower surface. Above the upper surface and below the lower surface, there are multiple conductive layers respectively, and the top surface and the bottom surface respectively have an upper soldering pad electrically connected to the upper wire outlet end and a lower soldering pad electrically connected to the lower wire outlet end; (b) Providing a power device having a soldering part opposite to the upper soldering pad in space; (c) Providing an external circuit board having a soldering area opposite to the lower soldering pad in space; (d) Setting a solder between the soldering area and the upper soldering pad, and vertically stacking the power device, the PCB component, and the external circuit board in sequence, wherein the soldering part is aligned with the upper soldering pad, and the lower soldering pad is aligned with the soldering area; and (e) Performing a reflow soldering process to achieve the electrical connection of the power device, the PCB component, and the external circuit board.

27. The manufacturing method of the voltage regulator module according to claim 26, wherein the volume ratio of the magnetic core in the PCB component exceeds 50%, and in a horizontal plane, the projected area ratio of the magnetic core on the projected area of the PCB component exceeds 70%.

28. The manufacturing method of the voltage regulator module according to claim 26, wherein the solder is a solder paste, and the solder is set by spraying or printing.

29. The manufacturing method of the voltage regulator module as claimed in claim 26, wherein the PCB assembly further integrates an input circuit path, a control signal path, a signal detection path or a test function circuit.

30. The manufacturing method of the voltage regulator module as claimed in claim 26, wherein a metal conductor is further disposed inside the PCB assembly, and the metal conductor is configured to transmit an electrical signal.

31. The manufacturing method of the voltage regulator module according to claim 26, wherein the PCB assembly includes a plurality of inductors connected in parallel, and the step (d) includes: Solder is disposed at the welding area and the upper welding positions of the plurality of inductors, and the plurality of power devices, the PCB assembly and the external circuit board are vertically stacked in sequence, wherein the welding parts of the plurality of power devices are aligned with the upper welding positions of the plurality of inductors, and the lower welding positions of the plurality of inductors are aligned with the welding area.

32. The manufacturing method of the voltage regulator module as claimed in claim 26, wherein step (d) comprises: (d1) Arranging a plurality of the PCB assemblies in an array in a fixed jig; (d2) Disposing solder at the upper welding positions of the plurality of PCB assemblies; (d3) Placing the plurality of PCB assemblies on the welding area provided with the solder of the plurality of external circuit boards in a side clamping manner; and (d4) Placing the plurality of power devices correspondingly on the upper welding positions of the plurality of PCB assemblies.

33. The manufacturing method of the voltage regulator module as claimed in claim 26, wherein step (d) comprises: (d1) Providing a continuous sheet structure, the continuous sheet structure comprising a plurality of the PCB assemblies; (d2) Disposing solder at the upper welding positions of the plurality of PCB assemblies in the continuous sheet structure; (d3) Placing the continuous sheet structure on the welding area provided with the solder of the plurality of external circuit boards in a side clamping manner; and (d4) Placing the plurality of power devices correspondingly on the upper welding positions of the plurality of PCB assemblies in the continuous sheet structure.

34. The manufacturing method of the voltage regulator module as claimed in claim 33, wherein step (e) comprises sub-steps: (e1) Performing a reflow soldering process to achieve electrical connection of the plurality of power devices, the continuous sheet structure and the plurality of external circuit boards; (e2) Cutting and separating the continuous sheet structure, so that the plurality of power devices, the continuous sheet structure and the plurality of external circuit boards vertically stacked in sequence form a plurality of independent voltage regulator modules.

35. The manufacturing method of the voltage regulator module as claimed in claim 26, wherein step (d) comprises: (d1) Providing a continuous sheet structure, the continuous sheet structure comprising a plurality of the PCB assemblies; (d2) Providing a substrate structure, the substrate structure comprising a plurality of the external circuit boards; (d3) Disposing solder at the upper welding positions of the plurality of PCB assemblies in the continuous sheet structure; (d4) Placing the continuous sheet structure on the welding area provided with the solder of the plurality of external circuit boards in the substrate structure in a side clamping manner; and (d5) Placing the plurality of power devices correspondingly on the upper welding positions of the plurality of PCB assemblies in the continuous sheet structure.

36. The manufacturing method of the voltage regulator module as claimed in claim 35, wherein step (e) comprises sub-steps: (e1) performing a reflow soldering process to achieve electrical connection between the plurality of power devices, the connecting structure and the substrate structure; (e2) Cutting and separating the connecting structure and the substrate structure, so that the multiple power devices, the connecting structure and the substrate structure vertically stacked in sequence form a plurality of independent voltage regulator modules.

37. The method for manufacturing a voltage regulator module as claimed in claim 26, wherein the lower soldering position and the external circuit board are electrically connected via a stacking member, and the stacking member includes an upper soldering pad and a lower soldering pad.

38. The method for manufacturing a voltage regulator module as claimed in claim 37, wherein the stacked component is a capacitor monomer, a switch monomer or a magnetic component monomer.

39. The method for manufacturing a voltage regulator module as claimed in claim 37, wherein a metal conductor is disposed inside the stack, and the metal conductor is configured to transmit an electrical signal.

40. The method for manufacturing a voltage regulator module as claimed in claim 37, wherein the step (d) comprises: (d1) placing the solder on the welding area and placing the stacked member on the welding area so that the lower welding plate is aligned with the welding area; (d2) placing a solder on the upper soldering pad and placing the PCB assembly on the upper soldering pad so that the lower soldering position is aligned with the upper soldering pad; as well as (d3) The solder is arranged on the upper soldering position, and the power device is placed on the upper soldering position so that the soldering portion is aligned with the upper soldering position.

41. The method for manufacturing a voltage regulator module as claimed in claim 37, wherein the step (d) comprises: (d1) arranging a plurality of PCB component arrays in a fixing fixture; (d2) placing the solder on the welding area of ​​the plurality of external circuit boards, and placing the plurality of stacked parts on the welding area of ​​the plurality of external circuit boards, so that the lower welding pads of the plurality of stacked parts are aligned to the welding area of ​​the plurality of external circuit boards; (d3) placing a solder on the upper soldering pads of the plurality of stacked parts, and placing the lower soldering positions of the plurality of PCB components on the upper soldering pads of the plurality of stacked parts in a side clamping manner, so that the lower soldering positions of the plurality of PCB components are aligned to the upper soldering pads of the plurality of stacked parts; as well as (d4) The solder is set on the upper soldering positions of the multiple PCB components, and the multiple power devices are placed correspondingly on the upper soldering positions of the multiple PCB components, so that the soldering parts of the multiple power devices are aligned to the upper soldering positions of the multiple PCB components.

42. The method for manufacturing a voltage regulator module as claimed in claim 37, wherein the step (d) comprises: (d1) providing a continuous structure, the continuous structure comprising a plurality of the PCB components; (d2) placing the solder on the welding area of ​​the plurality of external circuit boards, and placing the plurality of stacked parts on the welding area of ​​the plurality of external circuit boards, so that the lower welding pads of the plurality of stacked parts are aligned to the welding area of ​​the plurality of external circuit boards; (d3) a solder is disposed on the upper welding pads of the plurality of stacked parts, and the lower welding positions of the plurality of PCB components of the connected structure are placed correspondingly on the upper welding pads of the plurality of stacked parts in a side clamping manner, so that the lower welding positions of the plurality of PCB components of the connected structure are aligned to the upper welding pads of the plurality of stacked parts; as well as (d4) The solder is set on the upper welding positions of the multiple PCB components of the connecting structure, and the multiple power devices are placed correspondingly on the upper welding positions of the multiple PCB components of the connecting structure, so that the welding parts of the multiple power devices are aligned to the upper welding positions of the multiple PCB components of the connecting structure.

43. The method for manufacturing a voltage regulator module as claimed in claim 42, wherein the step (e) comprises sub-steps of: (e1) performing a reflow soldering process to achieve electrical connection between the plurality of power devices, the connecting structure, the plurality of stacked components, and the plurality of external circuit boards; (e2) Cutting and separating the connecting structure, so that the multiple power devices, the connecting structure, the multiple stacked parts and the multiple external circuit boards vertically stacked in sequence form a plurality of independent voltage regulator modules.

44. The method for manufacturing a voltage regulator module as claimed in claim 37, wherein the step (d) comprises: (d1) providing a continuous structure, the continuous structure comprising a plurality of the PCB components; (d2) providing a substrate structure, the substrate structure comprising a plurality of the external circuit boards; (d3) setting the solder on the welding area of ​​the plurality of external circuit boards of the substrate structure, and placing the plurality of stacked parts on the welding area of ​​the plurality of external circuit boards of the substrate structure, so that the lower welding pads of the plurality of stacked parts are aligned to the welding area of ​​the plurality of external circuit boards of the substrate structure; (d4) a solder is disposed on the upper welding pads of the plurality of stacked parts, and the lower welding positions of the plurality of PCB components of the connected structure are placed correspondingly on the upper welding pads of the plurality of stacked parts in a side clamping manner, so that the lower welding positions of the plurality of PCB components of the connected structure are aligned to the upper welding pads of the plurality of stacked parts; as well as (d5) The solder is set on the upper welding positions of the multiple PCB components of the connected structure, and the multiple power devices are placed correspondingly on the upper welding positions of the multiple PCB components of the connected structure, so that the welding parts of the multiple power devices are aligned to the upper welding positions of the multiple PCB components of the connected structure.

45. The method for manufacturing a voltage regulator module as claimed in claim 44, wherein the step (e) comprises the sub-steps of: (e1) performing a reflow soldering process to achieve electrical connection between the plurality of power devices, the connecting structure, the plurality of stacked components, and the substrate structure; (e2) Cutting and separating the connecting structure and the substrate structure, so that the multiple power devices, the connecting structure, the multiple stacked parts and the substrate structure vertically stacked in sequence form a plurality of independent voltage regulator modules.

46. The manufacturing method of the voltage regulator module as claimed in claim 26, wherein the PCB comprises M conductive layers and N conductive layers, M and N being positive integers, the M conductive layers are disposed above the upper surface, the upper lead-out terminal is electrically connected to the one of the M conductive layers that is attached to the upper surface, the N conductive layers are disposed below the lower surface, the lower lead-out terminal is electrically connected to the one of the N conductive layers that is attached to the lower surface, and M = N ≥ 2.

47. The manufacturing method of the voltage regulator module as claimed in claim 46, wherein the M conductive layers and the N conductive layers respectively comprise a surface conductive layer and an inner conductive layer, wherein the surface conductive layer comprises the top surface and the bottom surface of the PCB and is used for surface routing, copper cladding and device soldering, and the inner conductive layer is used for internal routing and copper cladding.

48. The manufacturing method of the voltage regulator module as claimed in claim 46, wherein the M conductive layers and the N conductive layers are respectively composed of multiple copper plating layers.

49. The manufacturing method of the voltage regulator module as claimed in claim 46, wherein the PCB assembly further comprises a board-edge copper plating layer, the board-edge copper plating layer is disposed on the top surface, the bottom surface and one side wall of the PCB, and is electrically connected between the M conductive layers and the N conductive layers to group and transmit current signals or form a test function circuit.

50. The manufacturing method of the voltage regulator module as claimed in claim 46, wherein the PCB assembly further comprises a conductive through-hole, the conductive through-hole penetrates the top surface and the bottom surface and is electrically connected between the M conductive layers and the N conductive layers.

51. The manufacturing method of the voltage regulator module as claimed in claim 46, wherein the upper soldering position and the upper lead-out terminal are opposite to each other in space and are electrically connected through an upper circuit channel, the upper circuit channel is sequentially electrically connected to the M conductive layers, wherein the lower soldering position and the lower lead-out terminal are opposite to each other in space and are electrically connected through a lower circuit channel, the lower circuit channel is sequentially electrically connected to the N conductive layers.

52. The manufacturing method of the voltage regulator module as claimed in claim 51, wherein the upper circuit channel electrically connects the upper soldering position and the upper lead-out terminal in the M conductive layers from the inside to the outside through electroplated hole copper, and the lower circuit channel electrically connects the lower soldering position and the lower lead-out terminal in the N conductive layers from the inside to the outside through electroplated hole copper.

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