Machining method for improving X-ray punching precision

Abstract

The invention relates to a processing method for improving X-ray punching precision. The processing method comprises the following steps: etching an upper-layer target and a lower-layer target to be grabbed by X-rays on a target layer corresponding to a laser hole; laminating the etched pattern inner layer and the target layer to form a PCB (Printed Circuit Board); determining a first central point position of the upper-layer target and a second central point position of the lower-layer target by adopting X-ray equipment; and a third center point position is determined according to the first center point position and the second center point position, drilling operation is conducted on the third center point position, and a CF hole is drilled. According to the machining method for improving the X-ray punching precision, different targets are designed on the upper layer and the lower layer of the target layer, X-ray equipment grabs the targets on the corresponding layer in two times and determines the center positions, then the absolute center point is calculated according to the center positions of the targets on the upper layer and the lower layer, then CF holes are punched, laser holes in the two faces can be taken into consideration at the same time, and the machining precision is improved. And the risk of laser hole deviation breakage is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly to a processing method for improving the X-ray drilling accuracy. Background Art

[0002] With the development of technology, the communication industry has higher and higher requirements for the performance of electronic products. The PCB starts to be designed in a more integrated direction to shorten the signal loss caused by the link between components. High-end HDI (High Density Interconnect Board) products can integrate traditional NPO / CPO (Near Packaged Optics / Co-Packaged Optics) with the main board. At the same time, as multiple modules start to be stacked on the same PCB board, the via pad and anti-pad will also be designed in a smaller direction, saving more wiring space for the PCB and also contributing greatly to the transmission integrity of signals.

[0003] When designing a smaller via pad on a traditional HDI printed circuit board, the operation difficulty for the PCB is relatively large. After laser processing, there will be a problem of misalignment between the laser hole and the via pad of the target layer, resulting in the laser hole being partially broken and piercing through to the next layer, affecting the signal and service life of the PCB. The key factor affecting the position accuracy between the laser hole and the via pad of the target layer is the position accuracy of the CF hole target grabbed by the laser, which is punched by X-ray. Conventional X-ray simultaneously grabs the overlapping area of the pads (meaning solder pads) of the laser target layers on both sides to calculate the center point, and then punches the CF hole (Conformal, a positioning hole used when making an etching pattern). Due to the thickness of the PCB board and the calculation logic of X-ray itself, the clarity and recognition of the upper target pad are higher. Therefore, X-ray will preferentially grab the clear pad to calculate the center point and punch the CF hole. If there is a position deviation between the target pads on the upper and lower sides, the CF hole only takes into account the upper target and does not consider the reverse target. During laser processing, there will be a large misalignment between the reverse laser and the reverse solder pad, resulting in the phenomenon of the laser hole breaking through the via pad. Summary of the Invention

[0004] Based on this, it is necessary to provide a processing method for improving the X-ray drilling accuracy for at least one of the above-mentioned problems.

[0005] The present invention provides a processing method for improving the X-ray drilling accuracy, including the following steps:

[0006] Etch the upper target and the lower target to be grabbed by the X-ray on the target layer corresponding to the laser hole;

[0007] Press the etched inner layer pattern onto the target layer to form a PCB board;

[0008] Use an X-ray device to determine the position of the first center point of the upper target and the position of the second center point of the lower target;

[0009] Determine the position of the third center point based on the positions of the first center point and the second center point, and perform drilling operations at the position of the third center point to drill CF holes.

[0010] In one embodiment, the shape of the upper target is circular, and the shape of the lower target is annular.

[0011] In one embodiment, the shape of the upper target is a square with a hole in the middle, and the shape of the lower target is a dot-shaped rectangle.

[0012] In one embodiment, after the step of drilling the CF holes, the method further includes: grasping the front side of the CF hole to punch the laser hole on the front side, and then grasping the back side of the CF hole to punch the laser hole on the back side.

[0013] In one embodiment, after the step of drilling the CF holes, the method further includes: electroplating the laser holes to achieve conduction between the laser holes on the front side and the laser holes on the back side.

[0014] The technical solutions provided in the embodiments of the present invention bring the following beneficial technical effects:

[0015] The processing method for improving the X-ray drilling accuracy provided by the present invention designs different targets on the upper and lower layers of the target layer, enables the X-ray device to capture the corresponding layer targets twice and determine the center positions, calculates the absolute center point based on the center positions of the upper and lower layer targets, and then drills CF holes, which can take into account the laser holes on both sides and reduce the risk of laser hole deviation and breakage.

[0016] The additional aspects and advantages of the present application will be given in the subsequent parts, and will be understood in detail from the subsequent description, or will be understood through the specific implementation of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic flow chart of a processing method for improving X-ray drilling accuracy according to an embodiment of the present invention;

[0018] Figure 2 is a schematic structural diagram of a target layer after S100 according to an embodiment of the present invention;

[0019] Figure 3 is a schematic interlayer structure diagram after S200 according to an embodiment of the present invention;

[0020] Figure 4 Schematic diagram of the planar structure after S200 is completed in an embodiment of the present invention;

[0021] Figure 5 Schematic diagram of the calculation logic structure in an embodiment of the present invention;

[0022] Figure 6 Schematic flow chart of the processing method for improving the X-ray drilling accuracy in another embodiment of the present invention;

[0023] Figure 7 Schematic flow chart of the processing method for improving the X-ray drilling accuracy in yet another embodiment of the present invention;

[0024] Figure 8 Schematic diagram of the PCB interlayer structure after S600 is completed in an embodiment of the present invention.

[0025] Explanation of the reference numerals:

[0026] 10 - upper target layer, 20 - lower target layer, 30 - laser hole on the PCB, 40 - CF hole. Detailed implementation manners

[0027] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The possible embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in the present invention through the drawings. The embodiments described by referring to the drawings are exemplary and are used to make the understanding of the disclosure content of the present invention more thorough and comprehensive, and cannot be construed as a limitation to the present invention. In addition, if the detailed description of the known technology is not necessary for the features of the present invention shown, these technical details may be omitted.

[0028] Those skilled in the relevant art can understand that unless otherwise defined, all terms (including technical terms and scientific terms) used here have the same meaning as the general understanding of those of ordinary skill in the technical field to which the present invention belongs. It should also be understood that terms such as those defined in the general dictionary should be understood as having the same meaning as in the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0029] It will be understood by those skilled in the art that, unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that the term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0030] The technical solution of the present invention and how the technical solution solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0031] The present invention provides a processing method for improving the X-ray drilling accuracy, such as Figure 1 As shown, the following steps are included:

[0032] S100: Etching the upper target and the lower target to be captured by the X-ray on the target layer corresponding to the laser hole. Figure 2 and Figure 3 As shown, the target to be captured by the X-ray is etched on the target layer corresponding to the laser hole. Optionally, in one specific implementation, the shape of the upper target is circular, and the shape of the lower target is annular. The target P1 close to the top is circular, and the target P2 close to the bottom is annular. The target determined on the upper target layer is the upper target, and the target determined on the lower target layer is the lower target. Optionally, in another specific implementation, the shape of the upper target is a Chinese umbilical cord, and the shape of the lower target is a dotted rectangle. The circular and annular shapes are more favorable to the recognition efficiency of the X-ray equipment, and the outer contour of the target can be captured more clearly, so as to determine the center point of the target more quickly and accurately. The Chinese umbilical cord and the matrix shape can also capture the center of the peripheral graphics and lock the graphics, which is also a feasible way.

[0033] S200: Laminating the etched inner layer with the target layer to form a PCB board. Laminating the etched inner layer with the target layer to form a PCB board. Figure 3 and Figure 4 As shown. Those skilled in the art will know, a PCB board generally has many layers, for example, a PCB board with 20 layers, and the target layers of the laser are the 2nd and 19th layers, and the 3rd to 18th layers in the middle are ordinary graphic inner layers, and then these 20 layers are stacked together and pressed to form a PCB board.

[0034] S300: Using an X-ray device to determine the first center point position of the upper target and the second center point position of the lower target. Figure 5As shown, after pressing, an X-ray device is used to first capture the contour of the P1 pattern described above from the front, calculate the center point position T1 of P1, that is, the aforementioned first center point position. At the same time, continue to capture the contour of the P2 pattern from the front and calculate the center point position T2 of P2, that is, the second center point position.

[0035] S400: Determine the third center point position based on the first center point position and the second center point position, and perform a drilling operation at the third center point position to drill out the CF hole 40. As Figure 5 shown, according to T1 and T2, calculate the position of the center point T3 of the line segment formed by T1 and T2, that is, the third center point position. Perform a drilling operation at the T3 position to drill out the CF hole 40, realizing the function of taking both patterns on both sides into account.

[0036] Specifically, in combination with the foregoing embodiments, in another embodiment of the present application, as Figure 6 shown, after the step of drilling the CF hole in S400, it further includes S500: Capture the front of the CF hole and punch the laser hole 30 on the front, and then capture the back of the CF hole and punch the laser hole 30 on the back.

[0037] Specifically, in combination with the foregoing embodiments, in yet another embodiment of the present application, as Figure 7 and Figure 8 shown, after the step of drilling the CF hole in S400, it further includes S600: Electroplate the laser hole 30 to achieve conduction between the laser hole 30 on the front and the laser hole 30 on the back. After electroplating, the laser hole 30 of the PCB is filled with metal.

[0038] The processing method for improving the X-ray drilling accuracy provided by the present invention designs different targets on the upper and lower layers of the target layer, allows the X-ray device to capture the targets on the corresponding layers in two times and determine the center positions, then calculates the absolute center point according to the center positions of the upper and lower layer targets, and then drills the CF hole, which can take both sides of the laser holes into account and reduce the risk of laser hole deviation and breakage.

[0039] Those skilled in the art of the present technology can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in the present application can be alternated, changed, combined, or deleted. Further, other steps, measures, and solutions in the various operations, methods, and processes discussed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and solutions in the prior art that are the same as those disclosed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted.

[0040] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0041] It should be understood that although each step in the flowchart of the accompanying drawings is shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this document, the execution of these steps has no strict order limitation and may be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time but may be executed at different times, and their execution order is not necessarily sequential but may be executed alternately or in turn with at least a part of other steps or sub-steps or stages of other steps.

[0042] The above are only some embodiments of this application. It should be noted that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of this application.

Claims

1. A processing method for improving the X-ray punching accuracy, characterized in that, Including the following steps: Etch the upper target and the lower target to be captured by X-rays on the target layer corresponding to the laser holes; Laminating the etched inner layer of the pattern with the target layer to form a PCB board; Use an X-ray device to determine the position of the first center point of the upper target and the position of the second center point of the lower target; Determine the position of the third center point according to the position of the first center point and the position of the second center point, and perform drilling operations at the position of the third center point to drill out CF holes.

2. The processing method for improving the X-ray punching accuracy according to claim 1, wherein The shape of the upper target is circular, and the shape of the lower target is annular.

3. The processing method for improving the X-ray punching accuracy according to claim 1, characterized in that, The shape of the upper target is a square with a hole in the middle, and the shape of the lower target is a dot-shaped rectangle.

4. The processing method for improving the X-ray drilling accuracy according to claim 1, characterized in that After the step of drilling out the CF holes, it further includes: grasping the front side of the CF hole to punch out the laser holes on the front side, and then grasping the back side of the CF hole to punch out the laser holes on the back side.

5. The processing method for improving the X-ray drilling accuracy according to claim 4, wherein, After the step of drilling out the CF holes, it further includes: electroplating the laser holes to achieve conduction between the laser holes on the front side and the laser holes on the back side.

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