Manufacturing method of flexible circuit board product and flexible circuit board product
By preparing adhesive layer and isolation groove on the reinforcement substrate, combined with laser deep-controlled milling and mechanical milling, the problems of alignment difficulties and burrs in the manufacturing of flexible circuit boards are solved, and product quality and production efficiency are improved.
Patent Information
- Application Number
- CN202510437569.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2025-07-04
AI Technical Summary
During the manufacturing process of flexible circuit boards, it is difficult to precisely align the reinforcement substrate with flexible circuit boards, and burrs are easily generated during processing, affecting product quality.
The adhesive layer is prepared on the target reinforcement substrate and the isolation groove is processed thereon. By combining laser deep-controlled milling and mechanical milling, the precise alignment of the reinforcement substrate and the flexible circuit board is ensured and burrs are avoided.
The precise alignment between the reinforcement substrate and the flexible circuit board is achieved, the product quality and yield rate is improved, the processing cost and time is reduced, the production process is optimized, and the overall production efficiency is improved.
Smart Images
Figure CN120264601A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of printed circuit board manufacturing, and particularly to a manufacturing method for a flexible circuit board product and a flexible circuit board product. Background Art
[0002] Flexible Printed Circuit (FPC) is widely used in fields such as consumer electronics, medical devices, and automotive electronics due to its advantages of being thin, bendable, and having high space utilization. During the manufacturing process of flexible circuit boards, it is usually necessary to attach a reinforcing substrate in a specific area to enhance the local mechanical strength and prevent bending damage.
[0003] However, there are many technical difficulties in the bonding process of the reinforcing substrate of traditional flexible circuit boards. For example, it is difficult to ensure the precise alignment of the reinforcing substrate and the flexible circuit board during the manual or automatic bonding process, which easily causes the reinforcing substrate to shift relative to the outer contour line of the flexible circuit board. In addition, due to the softness of the flexible circuit board during processing, burrs are easily generated, affecting the product quality.
[0004] Therefore, how to ensure the precise alignment of the reinforcing substrate and the flexible circuit board and reduce burrs during processing is an urgent problem to be solved. Summary of the Invention
[0005] The present invention provides a manufacturing method for a flexible circuit board product and a flexible circuit board product to solve the technical problems of great difficulty in aligning the reinforcing substrate and the flexible circuit board and easy generation of burrs during the processing of the flexible circuit board.
[0006] In a first aspect, a manufacturing method for a flexible circuit board product is provided, including: Preparing an adhesive layer on the bonding surface of the target reinforcing substrate, and the coverage area of the adhesive layer corresponds to the reinforcing area of the target flexible circuit board; Processing isolation grooves on the target reinforcing substrate to obtain a processed target reinforcing substrate, and the positions of the isolation grooves correspond to the boundary line between the reinforcing area and the non-reinforcing area of the target flexible circuit board; Pressing and curing the processed target reinforcing substrate and the target flexible circuit board; Performing laser controlled depth milling on the contour edge of the reinforcing area of the target flexible circuit board along the isolation groove to form a milling profile; Mechanically milling the target reinforcing substrate along the milling profile and laser cutting the contour edge of the non-reinforcing area of the target flexible circuit board to obtain a flexible circuit board product.
[0007] In an embodiment, the thickness of the target reinforcing substrate is .
[0008] In one embodiment, the thickness of the adhesive layer is .
[0009] In one embodiment, the width of the isolation groove is .
[0010] In one embodiment, the temperature of the pressing and curing is 150°C to 180°C, the duration is 3 minutes to 20 minutes, and the pressure is 0.01 MPa to 0.5 MPa.
[0011] In one embodiment, laser controlled depth milling is performed along the isolation groove on the contour edge of the reinforcement area of the target flexible circuit board to form a milling contour, including: Starting from the junction of one end of the isolation groove and the contour edge, and ending at the junction of the other end of the isolation groove and the contour edge, performing multiple times of the laser controlled depth milling on the contour edge, and the spacing between adjacent laser controlled depth milling is 0.02 mm to 0.08 mm to form the milling contour.
[0012] In one embodiment, the depth of the milling contour is greater than the thickness of the target flexible circuit board, and / or the width of the milling contour is .
[0013] In one embodiment, before preparing the adhesive layer on the bonding surface of the target reinforcement substrate, it includes: Selecting a reinforcement substrate of a target material; Performing cutting and processing on the reinforcement substrate according to the design parameters of the target flexible circuit board to obtain a preselected reinforcement substrate with a preset shape and preset size; Performing surface treatment on the preselected reinforcement substrate to obtain a treated preselected reinforcement substrate as the target reinforcement substrate.
[0014] In one embodiment, the target material is a composite material including epoxy resin and glass fiber.
[0015] In a second aspect, a flexible circuit board product is provided, and the flexible circuit board product is prepared by using the manufacturing method of the flexible circuit board product described in the first aspect above.
[0016] A solution provided by the present invention includes: preparing an adhesive layer on the bonding surface of a target reinforcing substrate, where the coverage area of the adhesive layer corresponds to the reinforcing area of a target flexible circuit board; processing isolation grooves on the target reinforcing substrate to obtain a processed target reinforcing substrate, and the positions of the isolation grooves correspond to the boundary line between the reinforcing area and the non-reinforcing area of the target flexible circuit board; laminating and curing the processed target reinforcing substrate and the target flexible circuit board; performing laser controlled-depth milling on the contour edge of the reinforcing area of the target flexible circuit board along the isolation grooves to form a milling contour; performing mechanical milling on the target reinforcing substrate along the milling contour and performing laser cutting on the contour edge of the non-reinforcing area of the target flexible circuit board to obtain a flexible circuit board product. In this embodiment, by preparing an adhesive layer on the target reinforcing substrate in advance and processing isolation grooves at positions corresponding to the boundary line between the reinforcing area and the non-reinforcing area, and then when laminating and curing the processed target reinforcing substrate and the target flexible circuit board, the isolation grooves can be used as precise positioning marks to achieve precise alignment, thus solving the problem of great difficulty in aligning the reinforcing substrate and the flexible circuit board. Further, by combining laser controlled-depth milling and mechanical milling, the accuracy and edge finish of the milling process are ensured, the problem of easy generation of burrs due to the softness of the flexible circuit board during the processing is avoided, the product quality and the yield rate are improved, the costs of subsequent processing and quality control are reduced, the production process is optimized, and the overall production efficiency is increased. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings without creative efforts based on these drawings.
[0018] Figure 1 is a flowchart of a method for manufacturing a flexible circuit board product in an embodiment of the present invention; Figure 2 is a sectional view of a target reinforcing substrate after preparing an adhesive layer in an embodiment of the present invention; Figure 3 is a sectional view of a flexible circuit board product in an embodiment of the present invention; Figure 4 is another flowchart of a method for manufacturing a flexible circuit board product in an embodiment of the present invention; Figure 5 is a sectional view of a target reinforcing substrate with isolation grooves processed in an embodiment of the present invention; Figure 6 is a top view of a target reinforcing substrate with isolation grooves processed in an embodiment of the present invention; Figure 7 It is an integrated structure diagram of a reinforcing substrate and a flexible circuit board in an embodiment of the present invention; Figure 8 It is a top view of a flexible circuit board product in an embodiment of the present invention; Figure 9 It is a sectional view of a milled profile processed in an embodiment of the present invention; Figure 10 It is a sectional view of a target reinforcing substrate after mechanical milling in an embodiment of the present invention.
[0019] Among them, the reference numerals are as follows: 1 - Target reinforcing substrate; 2 - Adhesive layer, 21 - First adhesive layer, 22 - Second adhesive layer; 3 - Isolation groove, A1 - First reinforcing corresponding area, A2 - Second reinforcing corresponding area, B - Non - reinforcing area, C1 - Upper contour edge, C2 - Lower contour edge, C3 - Side contour edge, D1 - First reinforcing area, D2 - Second reinforcing area, L - Demarcation line, 4 - Target flexible circuit board. Detailed implementation manners
[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In the description of the present invention, unless otherwise specified, the meaning of "a plurality of" is two or more.
[0022] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0023] To thoroughly understand the present invention, please refer to Figures 1 to 10 the following description for detailed structures and steps to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below. However, in addition to these detailed descriptions, the present invention may have other embodiments.
[0024] In a first aspect, as Figure 1 shown, a method for manufacturing a flexible circuit board product is provided, including the following steps: S10. Prepare an adhesive layer 2 on the bonding surface of the target reinforcing substrate 1, and the covering area of the adhesive layer 2 corresponds to the reinforcing area of the target flexible circuit board 4.
[0025] As an example, the covering area of the adhesive layer 2 corresponding to the reinforcing area of the target flexible circuit board 4 can be understood as that the shape and area of the adhesive layer 2 precisely match the local area (reinforcing area) to be strengthened of the target flexible circuit board 4. For example, Figure 2 and Figure 3 shown, the reinforcing area of the target flexible circuit board 4 includes a first reinforcing area D1 and a second reinforcing area D2. Then the target reinforcing substrate 1 includes a first reinforcing corresponding area A1 corresponding to the first reinforcing area D1 and a second reinforcing corresponding area A2 corresponding to the second reinforcing area D2. Moreover, the shape and area of the first reinforcing corresponding area A1 and its corresponding first reinforcing area D1, as well as the second reinforcing corresponding area A2 and its corresponding second reinforcing area D2, are the same. For example, if the size of the first reinforcing area D1 is 15 mm × 5 mm, then the size of the corresponding first reinforcing corresponding area A1 is also 15 mm × 5 mm. And the adhesive layer 2 includes a first adhesive layer 21 and a second adhesive layer 22, and the first adhesive layer 21 exactly covers the first reinforcing corresponding area A1, and the second adhesive layer 22 exactly covers the second reinforcing corresponding area A2, thereby completing the preparation of the adhesive layer 2 on the bonding surface of the target reinforcing substrate 1.
[0026] It should be clear that the size of the target reinforcing substrate 1 needs to ensure that it can completely cover the target flexible circuit board 4, that is, the size of the target reinforcing substrate 1 is greater than or equal to the size of the target flexible circuit board 4. In this way, the target flexible circuit board 4 can be covered comprehensively to effectively avoid the situation where the reinforced area of the processed product cannot fully cover the part to be reinforced. In addition, it is worth noting that the adhesive layer 2 mentioned here is in a solid state.
[0027] In one embodiment, as Figure 4 shown, before preparing the adhesive layer 2 on the bonding surface of the target reinforcing substrate 1, the following steps are included: S10A. Select a reinforcing substrate of the target material; S10B. Cut and process the reinforcing substrate according to the design parameters of the target flexible circuit board 4 to obtain a preselected reinforcing substrate with a preset shape and preset size; S10C. Perform surface treatment on the preselected reinforcing substrate to obtain a processed preselected reinforcing substrate as the target reinforcing substrate 1.
[0028] In this embodiment, the target material is a composite material including epoxy resin and glass fiber. Specifically, the target material can be FR4 material or other composite materials of epoxy resin and glass fiber, which is only used as an example here. Among them, FR4 material (Flame Retardant 4 material, epoxy glass fiber cloth flame retardant material) is a composite material made by impregnating glass fiber cloth with epoxy resin, covering copper foil on both sides, and passing through processes such as hot pressing, and usually exists in the form of glass fiber cloth-based copper clad laminate, epoxy glass cloth laminate or flame retardant glass fiber cloth copper clad laminate, etc.
[0029] As an example, after selecting the reinforcing substrate of the target material, for example, after selecting the reinforcing substrate of FR4 material, further, it is necessary to cut and process the reinforcing substrate according to the design parameters of the target flexible circuit board 4 (such as the shape and size of the target flexible circuit board 4) to obtain a preselected reinforcing substrate with the required shape and size. For example, if the size of the target flexible circuit board 4 is 50mm x 100mm, then the size of the cut reinforcing substrate is also 50mm x 100mm, or 55mm x 105mm. Then, perform surface treatment on the preselected reinforcing substrate. For example, first use plasma activation treatment to remove the surface oxide layer, and then perform chemical etching treatment to make the surface roughness Ra of the bonding surface reach a preset roughness (for example, ), and then perform drying treatment to obtain a processed preselected reinforcing substrate as the target reinforcing substrate 1. Through the above steps, it can be ensured that the prepared target reinforcing substrate 1 meets the design parameters of the target flexible circuit board 4, providing a guarantee for the subsequent preparation of the adhesive layer 2 and the lamination of the target flexible circuit board 4.
[0030] S20. Process an isolation groove 3 on the target reinforcing substrate 1 to obtain the processed target reinforcing substrate 1, and the position of the isolation groove 3 corresponds to the boundary line L between the reinforcing area and the non-reinforcing area B of the target flexible circuit board.
[0031] In this embodiment, the position of the isolation groove 3 on the processed target reinforcing substrate 1 corresponds to the boundary line L between the reinforcing area and the non-reinforcing area B of the target flexible circuit board 4. For example, as Figures 2 to 3 , Figures 5 to 6 shown, the position of the isolation groove 3 on the target reinforcing substrate 1, that is, the position corresponding to the boundary line L between the first reinforcing area D1 and the non-reinforcing area B. It should be understood that, for the sake of avoiding repetition, only the position of the isolation groove 3 corresponding to the boundary line L between the first reinforcing area D1 and the non-reinforcing area B is described above, but it does not constitute a limitation to the present invention, and the extending direction of the isolation groove 3 is from the edge of the corresponding reinforcing area to the non-reinforcing area. For example, as Figures 2 to 3 , Figures 5 to 6 shown, it extends from the area corresponding to the first reinforcing area A1 to the area corresponding to the non-reinforcing area.
[0032] As an example, laser cutting technology can be used to process the isolation groove 3 on the target reinforcing substrate 1, that is, cut the target reinforcing substrate 1 at the position corresponding to the boundary line L (such as Figure 3 the dashed line L) to obtain the isolation groove 3. The function of the isolation groove 3 is to clearly divide the reinforcing area and the non-reinforcing area B, so as to provide a processing basis for subsequent sub-processes of processing the target flexible circuit board 4, and to provide an accurate positioning mark when laminating and curing the processed target reinforcing substrate and the target flexible circuit board, so as to solve the problem of large alignment difficulty between the reinforcing substrate and the flexible circuit board.
[0033] S30. Laminating and curing the processed target reinforcing substrate 1 and the target flexible circuit board 4.
[0034] As an example, as Figure 7 shown, the isolation groove 3 of the processed target reinforcing substrate 1 can be aligned with the boundary line L of the target flexible circuit board 4. For example, the infrared positioning mark on the edge of the isolation groove 3 is matched with the optical alignment mark of the flexible board boundary line L, and is calibrated in real time through the CCD vision system, so that the deviation between the center line of the isolation groove 3 and the boundary line L is ≤ ± , so as to reduce the interlayer offset between the target reinforcing substrate 1 and the target flexible circuit board 4 to ± (traditional process > 80 ), the alignment accuracy is improved by more than 4 times, significantly reducing the alignment difficulty between the target reinforcing substrate 1 and the target flexible circuit board 4, and establishing a physical benchmark for subsequent step-by-step cutting. Then, the processed target reinforcing substrate 1 and the target flexible circuit board 4 can be pressed and cured by a vacuum hot press to form a composite structure, that is, an integrated product of the target reinforcing substrate 1 and the target flexible circuit board 4, ensuring the strong adhesion between the target reinforcing substrate 1 and the target flexible circuit board 4, and improving the reliability and durability of the entire product.
[0035] S40. Laser-controlled deep milling is performed on the contour edge of the reinforcing area of the target flexible circuit board 4 along the isolation groove 3 to form a milling profile.
[0036] In this embodiment, the contour edge refers to the edge of the reinforcing area of the target flexible circuit board 4. For example, Figures 7 to 10 As shown, the edge of the first reinforcing area D1 surrounded by the upper contour edge C1, the lower contour edge C2, and the side contour edge C3. It should be understood that the edge of the second reinforcing area D2 is similar to the edge of the first reinforcing area D1, and will not be described in detail here to avoid repetition.
[0037] As an example, laser-controlled deep milling is performed on the contour edge of the reinforcing area of the target flexible circuit board 4 along the isolation groove 3 to form a milling profile (as Figure 9 shown. It should be understood that the Figure 9 here is the cross-sectional view after rotating Figure 7 by 90 degrees, and only takes a cross-section of the X area as an example.). The cutting depth is accurately controlled to only act on the target flexible circuit board 4, effectively avoiding the burr problem generated during the mechanical milling of traditional flexible circuit boards. Specifically, as described in step S40A.
[0038] S40A. Starting from the junction of one end of the isolation groove 3 and the contour edge, and ending at the junction of the other end of the isolation groove 3 and the contour edge, multiple laser-controlled deep milling operations are performed on the contour edge, and the spacing between adjacent laser-controlled deep milling operations is 0.02 mm to 0.08 mm to form a milling profile.
[0039] As an example, it can start from the junction of one end of the isolation groove 3 and the reinforcing area of the target flexible circuit board 4 (for example, Figure 8 the junction of the upper contour edge C1 and the isolation groove 3 in the Figure 8It ends at the junction of the middle and lower contour edge C2 and the isolation groove 3, and multiple laser controlled-depth milling operations are performed to form a milling contour. Among them, the spacing range between adjacent laser controlled-depth milling operations is 0.02 mm to 0.08 mm. For example, 0.05 mm can be selected as the spacing between adjacent laser controlled-depth milling operations. On the contour boundary of the entire reinforcement area (for example, the first reinforcement area D1), multiple laser controlled-depth milling operations are performed to ensure the smoothness and accuracy of the milling contour. Among them, the multiple laser controlled-depth milling operations can be 5 times, 6 times, 7 times, 8 times, 9 times or 10 times, etc. Here, it is only an example and does not constitute a limitation to the present invention. This milling process not only follows a continuous path from one end to the other end, but also forms a clear and uniform milling contour through multiple superpositions, effectively avoiding the burr problem that is prone to occur in the mechanical milling process of traditional flexible circuit boards.
[0040] It should be understood that the start and end at the junction of the isolation groove 3 and the reinforcement area described here essentially refer to the complete milling process along the contour boundary of the reinforcement area.
[0041] S50. Mechanically mill the target reinforcement substrate 1 along the milling contour, and laser cut the contour edge of the target flexible circuit board 4 in the non-reinforcement area B to obtain a flexible circuit board product.
[0042] As an example, as Figure 7 and Figure 10 shown, after machining the milling contour, at this time, the reinforcement area of the target flexible circuit board 4 has been separated from the surrounding waste materials. Further, it is necessary to mechanically mill the target reinforcement substrate 1 along the milling contour (as Figure 10 shown, it should be understood that the Figure 10 here is the cross-sectional view after rotating Figure 7 by 90 degrees, and only takes the cross-section of the X area as an example.), to separate the target reinforcement substrate 1 in the reinforcement area from the waste materials around the target reinforcement substrate 1. At this time, the non-reinforcement area B of the target flexible circuit board 4 is still in a connected state with the surrounding waste materials. At this time, a laser cutting method can be used to cut the contour edge of the target flexible circuit board 4 in the non-reinforcement area B (that is, the Figure 8 shown black line segment), to obtain a flexible circuit board product with the edge of the target reinforcement substrate 1 flush with the target flexible circuit board 4.
[0043] The present invention provides a solution, by pre-preparing an adhesive layer 2 on a target reinforcement substrate 1, and processing an isolation groove 3 at a position corresponding to the boundary line L between the reinforcement area and the non-reinforcement area B, and then when the processed target reinforcement substrate 1 and the target flexible circuit board 4 are pressed and cured, the isolation groove 3 can be used as a precise positioning mark to achieve precise alignment, thereby solving the problem of difficulty in aligning the reinforcement substrate and the flexible circuit board. Furthermore, by combining laser controlled deep milling and mechanical milling, the accuracy and edge finish of the milling process are ensured, avoiding the problem of burrs due to the softness of the flexible circuit board during processing, improving product quality and yield rate, reducing the cost of subsequent processing and quality control, optimizing the production process, and improving overall production efficiency.
[0044] In one embodiment, the thickness of the target reinforcement substrate 1 is .
[0045] As an example, the thickness range of the target reinforcement substrate 1 can be set to Preferably, the thickness of the target reinforcement substrate 1 can be set to , By setting the thickness range of the target reinforcement substrate 1 to , which not only balances the reinforcement effect and the material cost, but also ensures that the target reinforcement substrate 1 can provide sufficient structural support without adding unnecessary weight or cost due to excessive thickness.
[0046] It is understandable that if the thickness of the target reinforcement substrate 1 is , then it is relatively thin and suitable for some applications that do not require particularly high strength, such as flexible circuit boards in small consumer electronic products, which can reduce the thickness of the entire flexible circuit board product and help achieve a lightweight design, especially suitable for use in devices with limited space. On the contrary, if the thickness of the target reinforcement substrate 1 is , it can provide higher mechanical strength and is suitable for applications that require higher pressure resistance and bending resistance, such as flexible circuit board products in industrial equipment or high-end automotive electronics. This can effectively improve the stability and durability of flexible circuit board products, especially when subjected to large external forces or used under extreme working conditions. It can better protect the circuit from damage.
[0047] It should be noted that the specific target thickness of the reinforcing substrate 1 can be reasonably selected according to the specific requirements of the product and is not limited here.
[0048] In one embodiment, the thickness of the adhesive layer 2 is .
[0049] As an example, the thickness range of the adhesive layer 2 can be set to , preferably, the thickness of the adhesive layer 2 can be set to . By setting the thickness range of the adhesive layer 2 within , it not only ensures that the adhesive layer 2 can effectively bond the target reinforcing substrate 1 and the reinforcing area of the target flexible circuit board 4, but also does not affect the flexibility and mechanical properties of the overall structure.
[0050] It can be understood that if the thickness of the adhesive layer 2 is , then the adhesive layer 2 is thinner, suitable for application scenarios requiring high flexibility and precise connection, capable of curing quickly, reducing the time impact on the production process, and having less impact on the bending performance of the flexible circuit board. On the contrary, if the thickness of the adhesive layer 2 is , it can provide stronger adhesion and higher mechanical strength.
[0051] It should be noted that the specific thickness of the adhesive layer 2 can be reasonably selected according to the specific requirements of the product and is not limited here.
[0052] In one embodiment, the adhesive layer 2 includes epoxy resin, silica powder, and phosphorus-based flame retardant. Among them, the weight ratio of epoxy resin can be 60% - 75%, the filling amount of silica powder can be 10% - 25%, and the content of phosphorus-based flame retardant can be 3% - 8%. Here, it is only an example and does not constitute a limitation to the present invention.
[0053] In one embodiment, the width of the isolation groove 3 is .
[0054] As an example, the width range of the isolation groove 3 can be set to , preferably, the width of the isolation groove 3 can be set to , . Here, it is only an example and does not constitute a limitation to the present invention. By setting the width of the isolation groove 3 within , it ensures the effective separation of the target reinforcing substrate 1 in the reinforcing area and the target reinforcing substrate 1 in the non-reinforcing area B.
[0055] It can be understood that if the width of the isolation groove 3 is , then the groove width is relatively narrow, which helps to improve the accuracy in the cutting process and reduce material waste. On the contrary, if the width of the isolation groove 3 is , it helps to ensure better separation between the reinforcing area and the non-reinforcing area B.
[0056] It should be noted that the specific width of the isolation groove 3 can be reasonably selected according to the specific requirements of the product and is not limited here, and the depth of the isolation groove 3 is the same as the thickness of the target reinforcing substrate 1, or slightly less than the thickness of the target reinforcing substrate 1. For example, the depth of the isolation groove 3 can be , preferably, the depth of the isolation groove 3 can be set to 、 , which is only used as an example here and does not constitute a limitation to the present invention. In this way, the parts of the target reinforcement substrate 1 located in the reinforcement area and the non-reinforcement area can be effectively separated.
[0057] In an embodiment, the temperature of the pressing and curing is 150°C to 180°C, the duration is 3 minutes to 20 minutes, and the pressure is 0.01 MPa to 0.5 MPa.
[0058] As an example, the temperature range of the pressing and curing can be set to 150°C to 180°C. Preferably, the temperature of the pressing and curing can be set to 160°C or 170°C, which is not limited here. By setting the temperature range of the pressing and curing to 150°C to 180°C, it can ensure that the adhesive layer 2 can be fully softened and fully combined with the target reinforcement substrate 1 and the target flexible circuit board 4; the curing time range can be set to 3 minutes to 20 minutes. Preferably, the curing time can be set to 5 minutes, 7 minutes, 10 minutes or 15 minutes, which is not limited here. By setting the curing time range to 3 minutes to 20 minutes, it can ensure the complete curing of the adhesive layer 2 and avoid the situation of loose bonding or structural loosening in subsequent use due to incomplete curing; the pressure range can be set to 0.01 MPa to 0.5 MPa. Preferably, the pressure can be set to 0.02 MPa, 0.03 MPa, 0.05 MPa, 0.1 MPa, 0.2 MPa, 0.3 MPa or 0.4 MPa. By setting the pressure range to 0.01 MPa to 0.5 MPa, it can ensure the uniform distribution and full curing of the adhesive layer 2, and effectively avoid the deformation of the target flexible circuit board 4 or the damage of the target reinforcement substrate 1 caused by excessive pressure.
[0059] It should be understood that the limitation of the above process conditions ensures that the performance of the finally obtained flexible circuit board product meets the product requirements, avoids the use failure or circuit board damage caused by insufficient curing, and improves the overall reliability and quality of the flexible circuit board product.
[0060] In an embodiment, the depth of the milling profile is greater than the thickness of the target flexible circuit board 4, and / or the width of the milling profile is 。
[0061] As an example, the depth of the milling profile is greater than the thickness of the target flexible circuit board 4. In this way, when the target reinforcement substrate 1 and the target flexible circuit board 4 are milled out by mechanical milling together, since the material of the target flexible circuit board 4 is relatively soft, the problem of easy generation of burrs can be effectively avoided. And the width range of the milling profile is set to , because the width of the machining tool for mechanical milling is generally within this range. By limiting the width of the milling profile, it is further possible to avoid the problem of burrs being generated when machining the target reinforcement substrate 1 by mechanical milling, improve the machining efficiency, and ensure the final quality of the flexible circuit board product.
[0062] Preferably, the width of the milling profile can be set to 、 , which does not constitute a limitation to the present invention here.
[0063] In one embodiment, the target flexible circuit board 4 includes a single-layer flexible circuit board, a double-layer flexible circuit board, or a multi-layer flexible circuit board.
[0064] In a second aspect, a flexible circuit board product is provided, and the flexible circuit board product is obtained by using the manufacturing method of the flexible circuit board product described in the first aspect above.
[0065] The above-described embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.
Claims
1. A manufacturing method of a flexible circuit board product, characterized in that, Including: Prepare an adhesive layer on the bonding surface of the target reinforcing substrate, and the coverage area of the adhesive layer corresponds to the reinforcing area of the target flexible circuit board; Process isolation grooves on the target reinforcing substrate to obtain the processed target reinforcing substrate, and the position of the isolation grooves corresponds to the boundary line between the reinforcing area and the non-reinforcing area of the target flexible circuit board; Press and cure the processed target reinforcing substrate and the target flexible circuit board; Perform laser controlled-depth milling on the contour edge of the reinforcing area of the target flexible circuit board along the isolation groove to form a milling contour; Perform mechanical milling on the target reinforcing substrate along the milling contour, and perform laser cutting on the contour edge of the non-reinforcing area of the target flexible circuit board to obtain a flexible circuit board product.
2. The manufacturing method of the flexible circuit board product according to claim 1, wherein The thickness of the target reinforced substrate is .
3. The manufacturing method of the flexible circuit board product according to claim 1, characterized in that, The thickness of the bonding adhesive layer is .
4. The manufacturing method of the flexible circuit board product according to claim 1, characterized in that, The width of the isolation groove is .
5. The manufacturing method of the flexible circuit board product according to claim 1, characterized in that The temperature of the press and cure is 150°C to 180°C, the duration is 3 minutes to 20 minutes, and the pressure is 0.01 MPa to 0.5 MPa.
6. The manufacturing method of the flexible circuit board product according to claim 1, characterized in that, Performing laser controlled-depth milling on the contour edge of the reinforcing area of the target flexible circuit board along the isolation groove to form a milling contour includes: Starting from the intersection of the isolation groove and one end of the contour edge and ending at the intersection of the isolation groove and the other end of the contour edge, perform multiple times of the laser controlled-depth milling on the contour edge, and the spacing between adjacent laser controlled-depth milling is 0.02 mm to 0.08 mm to form the milling contour.
7. The manufacturing method of the flexible circuit board product according to any one of claims 1 to 6, characterized in that, The depth of the milling profile is greater than the thickness of the target flexible circuit board, and / or the width of the milling profile is .
8. The manufacturing method of the flexible circuit board product according to any one of claims 1 to 6, characterized in that, Before preparing the adhesive layer on the bonding surface of the target reinforcing substrate, it includes: Select a reinforcing substrate of the target material; Cut and process the reinforcing substrate according to the design parameters of the target flexible circuit board to obtain a preselected reinforcing substrate with a preset shape and preset size; Perform surface treatment on the preselected reinforcing substrate to obtain the processed preselected reinforcing substrate as the target reinforcing substrate.
9. The manufacturing method of the flexible circuit board product according to claim 8, characterized in that, The target material is a composite material including epoxy resin and glass fiber.
10. A flexible circuit board product, characterized in that, The target flexible circuit board product is obtained by using the manufacturing method of the flexible circuit board product according to any one of claims 1 to 9.