Energy-saving heat dissipation device and system of immersed liquid cooling system

Abstract

The embodiment of the invention provides an energy-saving heat dissipation device and system of an immersed liquid cooling system, and the device comprises one or more TANK containers, and each TANK container is internally provided with at least one heat dissipation station used for placing a heat-dissipated workpiece; the plurality of groups of radiators are arranged on the radiating station and are attached to the radiated device of the radiated workpiece; the fan modules are located at the upstream position of the radiator and used for increasing the flow speed of the cooling medium around the radiator device; and the controller is used for acquiring temperature data in the device to be cooled, and controlling the fan module corresponding to the device to be cooled to work under the condition that the temperature data is higher than a device frequency reduction threshold value. By means of the heat dissipation method and device, the problem that targeted heat dissipation is difficult to conduct on the device to be subjected to heat dissipation in a single TANK container in the related technology is solved, and then the effect of improving the heat exchange efficiency of the device to be subjected to heat dissipation is achieved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of heat dissipation, and more particularly, to an energy-saving heat dissipation device and system for a submerged liquid cooling system. Background Art

[0002] A submerged liquid cooling system is a cooling system that uses a liquid medium for heat dissipation. Different from traditional air cooling systems, it immerses electronic devices or computer components completely or partially in a liquid for cooling. In a submerged liquid cooling system, the devices or components are placed in a TANK container filled with a specific liquid cooling medium (such as water or oil). The devices are in direct contact with the liquid, and heat is absorbed and carried away by the liquid through conduction and convection. Then, the cooling medium is guided to an external heat dissipation device (such as a cooling tower or a heat exchanger) by a circulation pump for heat dissipation and then recirculated back to the system.

[0003] In related technologies, a centralized liquid supply device is generally used to provide the supply and circulation of the cooling medium for the TANK container. However, a centralized liquid supply device generally supplies and circulates heat dissipation for the heat dissipation devices in one or more TANK containers simultaneously, and it is difficult to perform targeted heat dissipation for the heat dissipation devices in a single TANK container. Summary of the Invention

[0004] The embodiments of the present invention provide an energy-saving heat dissipation system and device for a submerged liquid cooling system, which at least solves the problem in related technologies that it is difficult to perform targeted heat dissipation for the heat dissipation devices in a single TANK container.

[0005] According to an embodiment of the present invention, there is provided an energy-saving heat dissipation device for a submerged liquid cooling system, including:

[0006] One or more TANK containers, each of which is provided with at least one heat dissipation station for placing the workpiece to be heat dissipated;

[0007] Multiple groups of radiators, installed at the heat dissipation station and attached to the heat dissipation devices of the workpiece to be heat dissipated;

[0008] Multiple groups of fan modules, located upstream of the radiators, for accelerating the flow rate of the cooling medium around the heat dissipation devices;

[0009] A controller, configured to obtain the temperature data inside the heat dissipation devices, and control the fan module corresponding to the heat dissipation devices to operate when the temperature data is higher than the device down-frequency threshold.

[0010] According to another embodiment of the present invention, an energy-saving heat dissipation system for an immersion liquid cooling system is further provided, including the device described in any one of the above, and further including:

[0011] A centralized liquid supply device for circulatingly supplying a cooling medium to a plurality of the TANK containers.

[0012] Through an embodiment of the present invention, at least one heat dissipation station is provided in each TANK container for placing the workpiece to be cooled. A radiator is installed at each heat dissipation station, and these radiators are in contact with the workpiece to be cooled, so that heat can be effectively conducted from the workpiece to be cooled into the radiator. In addition, a fan module is installed at the upstream position of each radiator to accelerate the flow rate of the cooling medium around the device to be cooled.

[0013] In addition, the present invention further includes a controller for obtaining the temperature data inside the device to be cooled. When the temperature data is higher than the preset device frequency reduction threshold, the controller will start the corresponding fan module to work. In this way, targeted heat dissipation can be performed on the devices to be cooled in a single TANK container according to actual needs, so as to overcome the disadvantage that it is difficult for the centralized liquid supply device to precisely control heat dissipation. Description of the Drawings

[0014] Figure 1 is a schematic structural diagram of an energy-saving heat dissipation device for an immersion liquid cooling system according to an embodiment of the present invention Figure 1 ;

[0015] Figure 2 is a schematic structural diagram of an energy-saving heat dissipation device for an immersion liquid cooling system according to an embodiment of the present invention Figure 2 ;

[0016] Figure 3 is a schematic structural diagram of an energy-saving heat dissipation system for an immersion liquid cooling system according to an embodiment of the present invention;

[0017] Figure 4 is a schematic diagram of the connection relationship between the centralized liquid supply device and a plurality of TANK containers according to an embodiment of the present invention.

[0018] Explanation of reference numerals: 100, cooling tower; 200, cooling water pump; 301, cooling water supply pressure sensor; 302, cooling water supply flow sensor; 303, cooling water supply temperature sensor; 304, cooling water return pressure sensor; 305, cooling water return temperature sensor; 306, circulating supply pressure sensor; 307, circulating supply flow sensor; 308, circulating supply temperature sensor; 309, circulating return pressure sensor; 310, circulating return temperature Sensor; 400, centralized liquid supply device; 401, circulation pump; 500, liquid supply electric bypass valve; 600, TANK container; 601, inner cavity temperature sensor; 602, liquid level sensor; 603, inner cavity flow plate; 604, heat dissipation station; 605, fan module; 606, radiator; 607, temperature sensor of the heat dissipated device; 610, TANK container return pump; 611, composite cold plate; 700, liquid supply pipeline assembly; 800, cooling water electric valve. DETAILED DESCRIPTION

[0019] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and in combination with the embodiments.

[0020] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0021] In this embodiment, an energy-saving heat dissipation device for an immersion liquid cooling system is provided. Figure 1 Schematic diagram of an energy-saving heat dissipation device for an immersion liquid cooling system according to an embodiment of the present invention Figure 1 ,like Figure 1 As shown, the device comprises:

[0022] TANK container 600, each TANK container 600 is provided with at least one heat dissipation station 604 for placing a workpiece to be cooled;

[0023] In an exemplary embodiment, the number of TANK containers 600 may be one or more, and one or more TANK containers 600 are placed in a cooling station to dissipate heat from the workpiece using the stored cooling medium. The cooling medium may be a special liquid (such as fluorinated liquid, oil, etc.), which is pumped into the TANK container 600 to use the cooling medium contained in the TANK container 600. The workpiece to be dissipated is immersed in the cooling medium so that the cooling medium absorbs and removes the heat generated by the workpiece to be dissipated. Figure 1 As shown, five heat dissipation stations 604 can be set in a TANK container 600 to place 10 heat dissipation workpieces. Figure 1This is merely an example. The number of heat dissipation stations 604 within each can be set according to actual circumstances, and the present invention does not make any limitations. Moreover, the number of workpieces to be heat dissipated placed within each heat dissipation station 604 is also not limited and can be set according to actual circumstances.

[0024] Multiple groups of radiators 606, installed at the heat dissipation stations 604, are in contact with the heat dissipation devices of the workpieces to be heat dissipated;

[0025] In one embodiment, the radiator 606 is a copper radiator or a VC composite radiator.

[0026] In an exemplary embodiment, the copper radiator 606 is a radiator 606 made of copper material. Through the design of heat conduction tubes and heat sinks, by utilizing the excellent heat conduction performance and heat dissipation ability of copper, the heat generated by the workpiece to be heat dissipated is quickly and effectively dissipated into the cooling medium, maintaining the temperature of the workpiece to be heat dissipated within a safe range. The VC composite radiator 606 is a radiator 606 that combines copper and aluminum materials and utilizes evaporation chamber technology. The copper and aluminum materials are combined in the form of an evaporation chamber to provide more efficient heat dissipation performance.

[0027] Multiple groups of fan modules 605, located upstream of the radiators 606, are used to accelerate the flow rate of the cooling medium around the heat dissipation devices;

[0028] In an exemplary embodiment, as Figure 1 shown, the cooling medium flows from the position of the fan module 605 within the TANK container 600 to the position of the radiator 606. According to the flow direction of the cooling medium, the fan module 605 is located upstream of the radiator 606. When the cooling medium flows within the TANK container 600, the fan module 605 turbulates the cooling medium. After being turbulated by the fan module 605, the flow path of the cooling medium changes, and the flow rate also changes, thereby facilitating the "pushing away" of the cooling medium near the radiator 606 and allowing the cooling medium near the fan module 605 to flow to the vicinity of the radiator 606 to exchange energy for the radiator 606.

[0029] In one embodiment, the device further includes an inner cavity flow equalizing plate 603. The inner cavity flow equalizing plate 603 is disposed within the TANK container 600 and can be provided in multiple groups. A plurality of inner cavity flow equalizing plates 603 are arranged parallel to each other within the TANK container 600, or can be installed according to actual circumstances, and the present invention does not make any limitations. The inner cavity flow equalizing plate 603 is connected to a plurality of shunt pipelines, and one end of each shunt pipeline away from the inner cavity flow equalizing plate 603 communicates with the heat dissipation station 604 to enable the circulation of the cooling medium.

[0030] A controller is configured to obtain temperature data inside the device to be cooled. When the temperature data is higher than the device downclocking threshold, it controls the fan module 605 corresponding to the device to be cooled to operate.

[0031] In an exemplary implementation, each device to be cooled is integrated with a temperature sensor 607 of the device to be cooled during installation. The device to be cooled is installed in the workpiece to be cooled. Here, the workpiece to be cooled can be communication devices such as servers, routers, switches, and BBU, or the workpiece to be cooled can be chips such as CPUs and GPUs. By receiving the temperature collected by the temperature sensor 607 of the device to be cooled, the controller can know the temperature when the device to be cooled corresponding to the temperature sensor 607 of the device to be cooled is operating. By comparing the received temperature data with the device downclocking threshold, it is convenient to control the fan module 605 corresponding to the device to be cooled to operate and cool the device to be cooled.

[0032] In an exemplary implementation, multiple temperature sensors 607 of the device to be cooled are installed inside the workpiece to be cooled, and each temperature sensor 607 of the device to be cooled is placed near the position of the device to be cooled to collect the temperature data of the device to be cooled.

[0033] In an exemplary implementation, a thermistor network is used to measure the temperatures of multiple devices to be cooled. Among them, the thermistor network connects multiple thermistors to a circuit board, and each thermistor is connected to a device to be cooled. By measuring the change in the resistance value of each thermistor, the temperature of each device to be cooled is obtained. For example, a correspondence table between the resistance value and the temperature is established in advance. The temperature corresponding to the resistance value is obtained according to the correspondence table. Or, the thermistor values at known temperatures are measured in advance, and a calibration curve is generated based on the measurement results. The calibration curve is a functional relationship between the resistance value and the temperature. The temperature corresponding to the measured resistance value is found based on the functional relationship.

[0034] Through the present invention, at least one heat dissipation station 604 is provided inside each TANK container 600 for placing the workpiece to be cooled. Each heat dissipation station 604 is equipped with a radiator 606, and these radiators 606 are in contact with the workpiece to be cooled, enabling heat to be effectively conducted from the workpiece to be cooled into the radiator 606. In addition, a fan module 605 is installed at the upstream position of each radiator 606 to accelerate the flow rate of the cooling medium around the device to be cooled.

[0035] In addition, the present invention further includes a controller for obtaining the temperature data inside the device to be cooled. When the temperature data is higher than the preset device frequency reduction threshold, the controller will start the corresponding fan module 605 to work. In this way, targeted heat dissipation can be performed on the device to be cooled within a single TANK container 600 according to actual needs, so as to overcome the disadvantage that the centralized liquid supply device 400 cannot accurately control heat dissipation.

[0036] In one embodiment, the fan module 605 can be an axial flow fan or a mixed flow fan.

[0037] In an exemplary embodiment, using an axial flow fan or a mixed flow fan can bring the following technical effects:

[0038] Improved heat dissipation efficiency: The fan quickly removes the heat in the cooling medium through forced circulation and convection, effectively reducing the temperature of the cooling medium. It can help the device to be cooled maintain a normal operating temperature and improve the heat dissipation efficiency.

[0039] Uniform cooling: The fan can evenly transfer the heat in the cooling medium to the entire cooling area by generating an air flow. This can avoid the generation of hot spots, ensure that the cooling medium cools comprehensively and evenly, and prevent the device to be cooled from overheating.

[0040] Enhanced heat transfer: The convective effect of the fan can strengthen the heat transfer process. By generating air flow, the fan promotes the heat exchange speed between the cooling medium and the heat dissipation surface, thereby enhancing the heat transfer effect.

[0041] Improved heat dissipation benefit: The fan can directly take away and discharge the heat in the cooling medium without exposing the cooling medium to an overheated environment. This can help improve the heat dissipation benefit and effectively protect the normal operation of the device to be cooled.

[0042] Better controllability: Axial flow fans and mixed flow fans can usually be adjusted by adjusting the fan speed or adopting a multi-stage speed regulation design to adapt to different cooling requirements. This can improve the flexibility and controllability of the entire device and can be adjusted according to actual situations.

[0043] In one embodiment, the device further includes:

[0044] A liquid level sensor 602 for obtaining the liquid level of the cooling medium in the TANK container 600 and transmitting the liquid level result and the number of the TANK container 600 to the controller;

[0045] In an exemplary embodiment, in order to measure the liquid level of the cooling medium in the TANK container 600, the following several installation methods can be adopted:

[0046] 1. Immersion installation: Immerse the liquid level sensor 602 directly inside the TANK container 600, exposing it above the liquid surface. The sensor measures the height to which the liquid reaches and converts it into a corresponding liquid level signal.

[0047] 2. External installation: Install the sensor outside the TANK container 600, connecting it to the liquid through the wall or side hole. The sensor determines the liquid level height by measuring the pressure difference of the medium between the liquid and the sensor.

[0048] 3. Installation around the seal: Install a pipe around the TANK container 600 on the wall of the container and install the sensor inside the pipe. The liquid will be connected to the sensor through the pipe, and the sensor measures the liquid level height.

[0049] 4. Non-contact installation: Use a non-contact liquid level sensor 602, such as a radar or ultrasonic sensor. These sensors emit signals from outside the container to the inside and measure the liquid level height by receiving the reflection of the signals.

[0050] Among them, each liquid level sensor 602 is set with an IP address, and the number of the TANK container 600 can be known by identifying the IP address of the liquid level sensor 602.

[0051] In one implementation, the controller is further configured to:

[0052] When the identified liquid level result is higher than the maximum liquid level height, reduce the rotation speed of the fan module 605 until the liquid level result is lower than the maximum liquid level height.

[0053] In an exemplary implementation, since most of the TANK containers 600 are semi-closed containers, that is, the tops of the TANK containers 600 are mostly open or equipped with detachable dust covers, and the sealing performance is not strong. The liquid level sensor 602 is used to monitor the liquid level of the cooling medium in the TANK container 600 in real time, so as to control the rotation speed of the fan module 605, thereby reducing the probability of the cooling medium overflowing from the TANK container 600 when the fan module 605 is working.

[0054] In one implementation, the controller is further configured to:

[0055] When the temperature data is higher than the device downclocking threshold and the liquid level result is lower than the maximum liquid level height, start the fan module 605.

[0056] In an exemplary implementation, when the liquid level result is lower than the maximum liquid level height and the temperature data is higher than the device downclocking threshold, it indicates that the device to be cooled needs to be cooled. When the liquid level result is lower than the maximum liquid level height, the start condition of the fan module 605 is met at this time. At this time, the fan module 605 is used to cool the device to be cooled, thereby improving the heat dissipation efficiency of the device to be cooled.

[0057] In one embodiment, the device further includes an inner cavity temperature sensor 601 for measuring the temperature of the cooling medium in one or more TANK containers 600, and outputting the temperature result and the number of the TANK container 600;

[0058] In an exemplary embodiment, in order to measure the temperature of the cooling medium in the TANK container 600, the following installation methods can be adopted:

[0059] Insertion sensor: Insert the temperature sensor into the TANK container 600. The sensor can be installed on the wall or top of the TANK container 600 through a hole or a flange connector to directly contact the cooling medium for temperature measurement.

[0060] Surface-attached sensor: Attach the temperature sensor to the outer surface of the TANK container 600. The sensor can be fixed on the container surface through an adhesive or magnetism to measure the temperature of the outer wall in real time.

[0061] Sensing through a heat-conducting material: Use a heat-conducting material, such as a thermosensitive film or a thermosensitive patch, to directly contact the temperature sensor with the TANK container 600. The heat-conducting material can help the sensor perceive the temperature change of the cooling medium faster and conduct the heat from the cooling medium to the sensor.

[0062] Inlet / outlet pipeline installation: Install the temperature sensor on the inlet or outlet pipeline of the cooling medium to measure the temperature of the cooling medium entering or leaving the TANK container 600. This method can provide monitoring of the instantaneous temperature change of the cooling medium.

[0063] Among them, each temperature sensor is set with an IP address, and the number of the corresponding TANK container 600 can be known by identifying the IP address of the temperature sensor.

[0064] Figure 2 is a structural schematic of an energy-saving heat dissipation device of an immersion liquid cooling system according to an embodiment of the present invention Figure 2 , in one embodiment, as Figure 2 shown, the fan module 605 and the radiator 606 can be replaced with a TANK container return liquid pump 610, a composite cold plate 611, and a branch electric valve 612.

[0065] In an exemplary embodiment, the composite cold plate 611 is installed at the heat dissipation station and is attached to the device to be cooled. The TANK container liquid return pump 610 is installed in the circuit pipeline of the cooling medium of the TANK container 600. The TANK container liquid return pump 610 is used to provide circulating power for the cooling medium. The branch electric valve 612 is installed in the shunt pipeline of the inner cavity flow equalizing plate 603 to control the flow rate of the cooling medium at the corresponding heat dissipation station, and the branch electric valve is electrically connected to the controller.

[0066] The controller obtains the temperature data of the temperature sensor in the device to be cooled. When the temperature data is higher than the device downclocking threshold, the controller controls the TANK container liquid return pump 610 to operate and opens the branch electric valve 612 corresponding to the device to be cooled, so as to pump the cooling medium to the heat dissipation station corresponding to the device to be cooled through the TANK container liquid return pump, and dissipate heat from the composite cold plate 611 through the cooling medium, thereby dissipating heat from the device to be cooled.

[0067] Figure 3 FIG. is a schematic structural diagram of an energy-saving heat dissipation system of an immersion liquid cooling system according to an embodiment of the present invention. In this embodiment, an energy-saving heat dissipation system of an immersion liquid cooling system is also provided, as Figure 3 shown. This system not only includes the devices in the above embodiments, but also includes:

[0068] A centralized liquid supply device 400, which is used to circulate and supply cooling medium to one or more TANK containers 600.

[0069] In an exemplary embodiment, this system not only includes a heat dissipation module formed by a fan module 605 and a radiator 606, but also a centralized liquid supply device 400 is provided as a second set of heat dissipation modules. The two heat dissipation modules cooperate with each other for heat dissipation, improving the heat dissipation efficiency of the device to be cooled. Moreover, the centralized liquid supply device 400 not only functions to dissipate heat from the device to be cooled, but also can timely replenish the cooling medium into the TANT container, improving the applicability of this device.

[0070] In one embodiment, the centralized liquid supply device 400 includes a circulation pump 401, which is used to provide circulating power for the cooling medium in the liquid supply pipeline assembly 700, so that the cooling medium circulates between the centralized liquid supply device 400 and the TANK container 600.

[0071] In one embodiment, this system further includes a liquid supply electric bypass valve 500, which is arranged between the heat dissipation input pipeline and the heat dissipation output pipeline of the centralized liquid supply device 400 and is used to form a shunt branch between the heat dissipation input pipeline and the heat dissipation output pipeline when the rotation speed of the circulation pump 401 of the centralized liquid supply device 400 is reduced to the first rotation speed.

[0072] In an exemplary embodiment, as Figure 3 shown, when using the centralized liquid supply device 400 to dissipate heat from the device to be cooled, when the liquid supply motorized bypass valve 500 is opened, there is an additional flow path between the centralized liquid supply device 400 and the device to be cooled. When the cooling medium in the TANK container 600 is saturated, it is convenient for the cooling medium to flow back from the shunt branch of the liquid supply motorized bypass valve 500 to the centralized liquid supply device 400, thereby reducing the probability of the cooling medium overflowing from the TANK container 600. Or it returns from the TANK container 600 through the shunt branch and then back into the TANK container 600, effectively saving the cooling medium.

[0073] In one embodiment, the system further includes:

[0074] A cooling tower 100 for exchanging heat of the cooling medium of the centralized liquid supply device 400;

[0075] In an exemplary embodiment, the cooling tower 100 can be one or more of the following types:

[0076] An open cooling tower: It can include an open pool and several tower bodies. The supplied cooling medium undergoes heat exchange through the tower packing and the spray system, while the fan enhances the heat dissipation effect by generating air flow.

[0077] A closed cooling tower: The closed cooling tower is also known as a cooling tower cover and is a sealed type. It adopts a water filtration system or an air cooling system, and the cooling medium is introduced into the tower through pipelines.

[0078] A cooling plate heat exchanger: The cooling plate heat exchanger is a cooling device that can directly contact through cooling plates for heat exchange. The cooling plates can be made of metal materials, and the heat is efficiently transferred to the ambient air or other cooling media by cooling the plate surface with the cooling medium.

[0079] A cooling radiator: The cooling radiator is a device that transfers heat through heat sinks and fans. The heat sinks are generally made of aluminum or copper materials. The heat sinks are cooled by the cooling medium, and the heat dissipation effect is enhanced by the air flow generated by the fan.

[0080] Among them, the cooling tower 100 can include the following components:

[0081] A cooling tower housing: The cooling tower housing is the external structure of the entire cooling tower 100, which is used to protect the internal components and provide structural support. The housing can be made of corrosion-resistant materials such as metals or synthetic materials.

[0082] Tower body: The tower body is the main part of the cooling tower 100, and the space for the cooling medium to flow is included inside. Types such as cross-flow (horizontal or vertical flow) and counter-flow (horizontal or vertical flow) can be adopted.

[0083] Tower packing: The tower packing is the packing inside the tower body, which is used to increase the surface area and contact area to promote the heat exchange between the cooling medium and the ambient air. The packing material can be plastic, metal or ceramic.

[0084] Spray system: The spray system is responsible for evenly spraying the cooling medium in the centralized liquid supply device 400 onto the tower packing. The spray system can include nozzles, recirculation pumps, water tanks and related pipelines.

[0085] Fan: The fan is the main component in the cooling tower 100, which promotes heat transfer by generating air flow. The fan can be installed on the top of the tower and can be an axial flow fan or a mixed flow fan.

[0086] Air outlet: The air outlet is the outlet where the air flow generated by the fan discharges from the cooling tower 100. The air outlet can be located on one side or the top of the tower, and a guiding cover or a wind vane can be set to control the direction and distribution of the air flow.

[0087] Multi-stage spray system: The multi-stage spray system provides a higher cooling effect through multi-stage nozzles and the tower body, and conducts multiple coolings during the heat exchange process.

[0088] Transport pipelines and valves: The transport pipelines and valves are used to guide the cooling medium from the centralized liquid supply device 400 to the cooling tower 100 and control the flow of the cooling medium.

[0089] Control system: The control system is used to monitor and adjust the operating parameters of the cooling tower 100, such as temperature, pressure and flow rate. The control system can include components such as sensors, controllers, automatic regulating valves, etc.

[0090] Among them, the control system of the cooling tower 100 is connected to the controller so that the controller communicates with the control system of the cooling tower 100.

[0091] Cooling water pump 200, which is used to provide circulating power for the coolant circulating between the cooling tower 100 and the centralized liquid supply device 400.

[0092] In an exemplary embodiment, the cooling water pump 200 can adopt one or more of the following: centrifugal pump, axial flow pump, positive displacement pump, micro pump.

[0093] Among them, a centrifugal pump generates centrifugal force through a rotating impeller, causing the liquid to be drawn into the pump body and pushed to the pump outlet as the impeller rotates. An axial-flow pump pushes the liquid along the axial direction through the rotation of the impeller and can be used for both pumping and draining water. A positive-displacement pump, also known as a gear pump or a screw pump, draws and discharges liquid through a chamber with a changing volume. A micro pump is a small electric pump that can be used for applications with small flow rates and low pressures.

[0094] In one embodiment, the coolant is water or an ethylene glycol solution.

[0095] In one embodiment, the system further includes a cooling water electric valve 800 disposed between the cooling water input pipeline and the cooling water output pipeline of the cooling tower 100, and is used to form a diversion branch between the cooling water input pipeline and the cooling water output pipeline when the rotational speed of the cooling water pump 200 is reduced to a preset rotational speed.

[0096] In an exemplary embodiment, as Figure 3 shown, since the cooling water electric valve 800 is disposed between the cooling water input pipeline and the cooling water output pipeline of the cooling tower 100, when the cooling water electric valve 800 is opened, there is an additional diversion branch between the cooling tower 100 and the centralized liquid supply device 400. When the rotational speed of the cooling water pump 200 is reduced to the preset rotational speed, at this time, it is necessary to stop the circulation of the cooling water. The cooling water between the cooling tower 100 and the centralized liquid supply device 400 can flow back into the cooling tower 100 or back into the centralized liquid supply device 400 through the diversion branch, thereby accelerating the efficiency of stopping the circulation of the cooling water.

[0097] In one embodiment, the controller is further used for:

[0098] Obtaining the rotational speed of the fan module 605;

[0099] In an exemplary embodiment, the following method can be adopted:

[0100] Using a bidirectional communication interface: Ensure that the fan module 605 can communicate with the controller bidirectionally. A communication protocol such as Modbus or CAN bus can be selected so that the controller can send commands to the fan module 605 and receive rotational speed data.

[0101] Installing a rotational speed sensor: Install a rotational speed sensor on the fan module 605 to measure the rotational speed of the rotor. The sensor can be an optical encoder, a Hall sensor, a magnetosensitive sensor, etc., and a suitable sensor type is selected according to the characteristics of the fan module 605.

[0102] Connect the sensor to the controller: Connect the rotational speed sensor to the controller. This can be achieved through wired or wireless means. If wired connection is selected, a cable can be used to connect the output signal of the sensor to the input port of the controller. If wireless connection is selected, a wireless transmission module can be used to transmit the sensor signal to the controller.

[0103] Data processing and parsing: After the controller receives the rotational speed data sent by the sensor, data processing and parsing are required. According to the sensor type and the specifications of the communication protocol, the controller can parse the received raw data and convert it into a rotational speed value for subsequent control and monitoring.

[0104] Control and monitoring: The controller can perform control and monitoring based on the rotational speed data of the fan module 605 obtained. According to the system requirements, corresponding rotational speed control strategies can be formulated, such as adjusting the rotational speed of the fan to achieve the required cooling effect or energy efficiency requirements. At the same time, the controller can also monitor the rotational speed data in real time to detect abnormal situations and perform fault diagnosis.

[0105] In the case where the temperature data is higher than the device downclocking threshold and the fan module 605 is operating at full power output, increase at least one of the following factors: the rotational speed of the cooling water pump 200, the rotational speed of the fan of the cooling tower 100, the flow output of the centralized liquid supply device 400.

[0106] In an exemplary implementation, in the case where the temperature data is higher than the device downclocking threshold and the fan module 605 is operating at full power output, it indicates that it is difficult to meet the heat dissipation requirements of the device to be cooled through the fan module 605. By increasing the rotational speed of the cooling water pump 200, the rotational speed of the fan of the cooling tower 100, and the flow output of the centralized liquid supply device 400, the centralized liquid supply device 400, the cooling tower 100, and the fan module 605 cooperate to dissipate heat for the device to be cooled, thereby further improving the heat dissipation efficiency of the device to be cooled.

[0107] In one implementation, the controller is further configured to:

[0108] In the case where the temperature data is lower than a preset difference of the device downclocking threshold, first control to reduce the rotational speed of the cooling water pump 200 and the rotational speed of the fan of the cooling tower 100, then control to reduce the flow output of the centralized liquid supply device 400, and finally control to reduce the rotational speed of the fan module 605.

[0109] In an exemplary embodiment, when the temperature data is lower than a preset difference value of the device down-frequency threshold, it indicates that the temperature of the device to be cooled has been reduced to a reasonable range. At this time, it is necessary to stop the cooling tower 100, the centralized liquid supply device 400, and the fan module 605 from continuing to dissipate heat. Since the power consumption of the cooling tower 100 is greater than that of the centralized liquid supply device 400, and the power consumption of the centralized liquid supply device 400 is greater than that of the fan module 605, therefore, they are stopped working step by step according to the sorting of power consumption from high to low to meet the energy-saving requirements.

[0110] In one embodiment, the system further includes: a cooling water supply pressure sensor 301, a cooling water supply flow sensor 302, a cooling water supply temperature sensor 303, a cooling water return pressure sensor 304, and a cooling water return temperature sensor 305.

[0111] In an exemplary embodiment, the cooling water supply pressure sensor 301, the cooling water supply flow sensor 302, and the cooling water supply temperature sensor 303 are all installed on the pipeline components of the supply pipeline between the cooling tower 100 and the centralized liquid supply device 400, and are respectively used to monitor the pressure, flow rate, and temperature of the cooling water flowing from the cooling tower 100 to the centralized liquid supply device 400, and transmit the pressure data, flow rate data, and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400. The cooling water return pressure sensor 304 and the cooling water return temperature sensor 305 are all installed on the pipeline components of the return pipeline between the cooling tower 100 and the centralized liquid supply device 400, and are respectively used to monitor the pressure and temperature of the cooling water flowing back from the centralized liquid supply device 400 to the cooling tower 100, and transmit the pressure data and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400.

[0112] In one embodiment, the system further includes: a circulating liquid supply pressure sensor 306, a circulating liquid supply flow sensor 307, a circulating liquid supply temperature sensor 308, a circulating liquid return pressure sensor 309, and a circulating liquid return temperature sensor 310.

[0113] In an exemplary embodiment, the circulating liquid supply pressure sensor 306, the circulating liquid supply flow sensor 307, and the circulating liquid supply temperature sensor 308 are all installed on the pipeline assembly of the liquid supply pipeline between the centralized liquid supply device 400 and the TANK container 600, and are respectively used to monitor the pressure, flow rate, and temperature of the cooling medium flowing from the centralized liquid supply device 400 to the TANK container 600, and transmit the pressure data, flow rate data, and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400. The circulating liquid return pressure sensor 309 and the circulating liquid return temperature sensor 310 are both installed on the pipeline assembly of the liquid return pipeline between the centralized liquid supply device 400 and the TANK container 600, and are respectively used to monitor the pressure and temperature of the cooling medium flowing from the TANK container 600 to the centralized liquid supply device 400, and transmit the pressure data and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400.

[0114] Figure 4 FIG. is a schematic diagram of the connection relationship between the centralized liquid supply device and multiple TANK containers according to an embodiment of the present invention. In an exemplary embodiment, as Figure 4 shown, a set of centralized liquid supply device 400 can be connected to TANK container 1, TANK container 2,..., TANK container N. Of course, the illustration is only an example, and a set of centralized liquid supply device 400 can also be connected to only one large TANK container. Among them, an electric valve is provided in the pipeline assembly connecting a set of centralized liquid supply device to each TANK container, and the electric valve is electrically connected to the controller and / or the control system of the centralized liquid supply device 400, so that the controller and / or the control system of the centralized liquid supply device 400 controls the working state of each electric valve.

[0115] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An energy-saving heat dissipation device for an immersion liquid cooling system, characterized in that, Comprising: One or more TANK containers, each of which is provided with at least one heat dissipation station for placing the workpiece to be heat dissipated; Multiple groups of radiators, installed at the heat dissipation station, and attached to the heat dissipation devices of the workpiece to be heat dissipated; Multiple groups of fan modules, located upstream of the radiators, for accelerating the flow rate of the cooling medium around the heat dissipation devices; A controller, configured to obtain the temperature data inside the heat dissipation device, and control the corresponding fan module of the heat dissipation device to operate when the temperature data is higher than the device down-frequency threshold.

2. The device according to claim 1, characterized in that, Further comprising: A liquid level sensor, configured to obtain the liquid level of the cooling medium in the TANK container, and transmit the liquid level result and the number of the TANK container to the controller; The controller is further configured to: When it is recognized that the liquid level result is higher than the maximum liquid level height, reduce the rotation speed of the fan module until the liquid level result is lower than the maximum liquid level height.

3. The device according to claim 2, characterized in that, The controller is further configured to: When the temperature data is higher than the device down-frequency threshold and the liquid level result is lower than the maximum liquid level height, start the fan module.

4. The device according to claim 1, characterized in that, The radiator is a copper radiator or a VC composite radiator.

5. The device according to claim 1, characterized in that The fan module can be an axial flow fan or a mixed flow fan.

6. An energy-saving heat dissipation system for an immersion liquid cooling system, characterized in that, Comprising the device according to any one of claims 1 to 5, further comprising: A centralized liquid supply device, configured to circularly supply cooling medium to multiple TANK containers.

7. The system according to claim 6, characterized in that, Further comprising: A cooling tower, configured to exchange heat for the cooling medium of the centralized liquid supply device; A cooling water pump, configured to provide circulating power for the coolant circulating between the cooling tower and the centralized liquid supply device.

8. The system according to claim 7, wherein The controller is further configured to: Obtain the rotation speed of the fan module; When the temperature data is higher than the device down-frequency threshold and the fan module outputs at full power, increase at least one of the following factors: the rotation speed of the cooling water pump, the rotation speed of the fan of the cooling tower, the flow output of the centralized liquid supply device.

9. The system according to claim 7, wherein The controller is further configured to: When the temperature data is lower than a preset difference of the device down-frequency threshold, first control to reduce the rotation speed of the cooling water pump and the rotation speed of the fan of the cooling tower, then control to reduce the flow output of the centralized liquid supply device, and finally control to reduce the rotation speed of the fan module.

10. The system according to claim 7, wherein The coolant is water or ethylene glycol solution.

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