Liquid supplementing and heat dissipating device of immersed liquid cooling system

Abstract

The embodiment of the invention provides a fluid infusion heat dissipation device of an immersed liquid cooling system, and the device comprises a plurality of TANK containers which are used for placing heat-dissipated workpieces; the liquid level sensor is used for measuring the liquid levels of the heat dissipation media in the plurality of TANK containers and outputting liquid level results and serial numbers of the TANK containers; the turbulent flow pump is used for pumping a heat dissipation medium for the plurality of TANK containers; and the controller is used for supplementing a heat dissipation medium for the TANK container corresponding to the serial number of the TANK container through the turbulent flow pump based on the liquid level result and the serial number of the TANK container. By means of the method and device, the problem that in the related technology, in the process of supplementing the heat dissipation medium to the TANK container, the heat dissipation medium is prone to being wasted is solved, and then the effect of reducing excessive consumption of the heat dissipation medium is achieved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of heat dissipation, and more specifically, to a liquid replenishment heat dissipation device for an immersion liquid cooling system. Background Art

[0002] An immersion liquid cooling system is a cooling system that uses a liquid medium for heat dissipation. Different from traditional air cooling systems, it immerses electronic devices or computer components completely or partially in a liquid for cooling. In an immersion liquid cooling system, the devices or components are placed in a TANK container filled with a specific liquid heat dissipation medium (such as water or oil). The devices are in direct contact with the liquid, and heat is absorbed and carried away by the liquid through conduction and convection. Then, the heat dissipation medium is guided to an external heat dissipation device (such as a cooling tower or a heat exchanger) by a heat dissipation pump for heat dissipation, and then recycled back to the system.

[0003] In related technologies, a centralized liquid supply system is generally used to supply and circulate the heat dissipation medium for the TANK container. However, a centralized liquid supply system generally connects multiple TANK containers. When the liquid level of a certain or certain TANK containers decreases, the centralized liquid supply system will centrally replenish the heat dissipation medium for all connected TANK containers, thus easily causing waste of the heat dissipation medium. Summary of the Invention

[0004] The embodiments of the present invention provide a liquid replenishment heat dissipation device for an immersion liquid cooling system, which at least solves the problem of easy waste of the heat dissipation medium in the process of replenishing the heat dissipation medium for the TANK container in related technologies.

[0005] According to an embodiment of the present invention, there is provided a liquid replenishment heat dissipation device for an immersion liquid cooling system, including:

[0006] Multiple TANK containers for placing workpieces to be cooled;

[0007] A liquid level sensor for measuring the liquid level of the heat dissipation medium in the multiple TANK containers and outputting a liquid level result and the number of the TANK container;

[0008] A turbulence pump for pumping the heat dissipation medium for the multiple TANK containers;

[0009] A controller for replenishing the heat dissipation medium for the TANK container corresponding to the number of the TANK container through the turbulence pump based on the liquid level result and the number of the TANK container.

[0010] Through the present invention, since a liquid level sensor is introduced to measure the liquid level of the heat dissipation medium in each TANK container and output the liquid level result and the number of the TANK container.

[0011] Based on the measurement result of the liquid level sensor and the number of the TANK container, the controller can accurately determine which TANK container needs to be replenished with the heat dissipation medium. Moreover, by using the turbulence pump arranged in the TANK container, the controller can specifically provide the heat dissipation medium for the TANK container that needs to be replenished, avoiding the situation of centralized liquid supply to all connected TANK containers.

[0012] By the above method, the technical solution of the present invention can accurately and effectively replenish the heat dissipation medium for each TANK container, avoid the waste of the heat dissipation medium, and achieve the effect of reducing the excessive consumption of the heat dissipation medium. At the same time, since only the TANK containers that need liquid replenishment will be replenished with the heat dissipation medium, energy can be saved and costs can be reduced. Description of the Drawings

[0013] Figure 1 is a schematic diagram of the connection relationship of the controller, the turbulence pump, multiple TANK containers, and the centralized heat dissipation system according to an embodiment of the present invention;

[0014] Figure 2 is a schematic structural diagram of a liquid replenishment and heat dissipation device of an immersion liquid cooling system according to an embodiment of the present invention;

[0015] Figure 3 is a structural block diagram of the turbulence component in which the turbulence workpiece is a turbulence tube according to an embodiment of the present invention;

[0016] Figure 4 is a structural block diagram of the turbulence component in which the turbulence workpiece is a turbulence plate according to an embodiment of the present invention.

[0017] Description of the Reference Numerals: 100, centralized heat dissipation system; 200, TANK container; 201, liquid distributor; 202, pipeline interface; 203, branch electric valve; 204, branch pipe fitting; 205, turbulence workpiece; 300, heat dissipation pump; 301, pressure sensor before the heat dissipation pump; 302, pressure sensor after the heat dissipation pump; 303, heat dissipation return liquid pressure sensor; 304, heat dissipation return liquid temperature sensor; 305, heat dissipation supply liquid pressure sensor; 306, heat dissipation supply liquid flow sensor; 307, heat dissipation supply liquid temperature sensor; 308, turbulence supply liquid pressure sensor; 309, turbulence supply liquid temperature sensor; 310, turbulence supply liquid flow sensor; 311, pressure sensor before the turbulence pump; 312, inner cavity temperature sensor; 313, liquid level sensor; 400, first electric bypass valve; 500, second electric bypass valve; 600, electric valve before the turbulence pump; 700, turbulence pump; 800, purification module; 900, heat dissipation pipeline assembly. DETAILED DESCRIPTION

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and in combination with the embodiments.

[0019] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0020] In this embodiment, a liquid replenishment heat dissipation device for an immersion liquid cooling system is provided. Figure 1 is a schematic diagram of the connection relationship among a controller, a spoiler pump, a plurality of TANK containers, and a centralized cooling system according to an embodiment of the present invention, Figure 2 is a schematic structural diagram of a liquid replenishment heat dissipation device of an immersion liquid cooling system according to an embodiment of the present invention. Figure 1 and Figure 2 As shown, the device comprises:

[0021] A plurality of TANK containers 200, for placing heat dissipated workpieces;

[0022] In an exemplary embodiment, a plurality of TANK containers 200 are placed in a cooling station for storing heat dissipation medium. The heat dissipation medium may be a special liquid (e.g., fluorinated liquid, oil, etc.), which is pumped into the TANK container 200 to cool the heat dissipation workpiece using the heat dissipation medium contained in the TANK container 200. The heat dissipation workpiece is immersed in the heat dissipation medium so that the heat generated by the heat dissipation workpiece is absorbed and taken away by the heat dissipation medium.

[0023] The liquid level sensor 313 is used to measure the liquid level of the heat dissipation medium in the multiple TANK containers 200 and output the liquid level result and the number of the TANK container 200;

[0024] In an exemplary embodiment, in order to measure the liquid level of the heat dissipation medium in the TANK container 200, the following installation methods can be used:

[0025] 1. Immersion installation: directly immerse the liquid level sensor 313 into the tank container 200 so that it is exposed on the surface of the liquid. The sensor will measure the height reached by the liquid and convert it into a corresponding liquid level signal.

[0026] 2. External installation: Install the sensor on the outside of the TANK container 200 and connect it to the liquid through the wall or side hole. The sensor determines the liquid level by measuring the medium pressure difference between the liquid and the sensor.

[0027] 3. Installation around the seal: Install a pipe that surrounds the container on the wall of the TANK container 200, and install the sensor inside the pipe. The liquid will be connected to the sensor through the pipe, and the sensor measures the liquid level height.

[0028] 4. Non-contact installation: Use a non-contact liquid level sensor 313, such as a radar or ultrasonic sensor. These sensors emit signals from the outside of the container to the inside and measure the liquid level height by receiving the reflection of the signals.

[0029] Among them, each liquid level sensor 313 is set with an IP address, and the controller can know the number of the TANK container 200 by identifying the IP address of the liquid level sensor 313.

[0030] A turbulent flow pump 700 for pumping a heat dissipation medium for a plurality of TANK containers 200;

[0031] In an exemplary embodiment, a turbulent flow pump 700 is installed in each TANK container 200, and the turbulent flow pump 700 pumps the heat dissipation medium for the TANK container 200 one by one.

[0032] In an exemplary embodiment, as Figure 2 shown, a turbulent flow pump 700 is installed outside each TANK container 200, and the turbulent flow pump 700 pumps the heat dissipation medium for the TANK container 200 one by one.

[0033] In an exemplary embodiment, as Figure 1 shown, the turbulent flow pump 700 can be connected to a plurality of TANK containers 200 through a plurality of pipelines. A liquid distribution valve is installed in each pipeline, and through the cooperation of the liquid distribution valve and the turbulent flow pump 700, it is convenient to pump the heat dissipation medium for the TANK containers 200 respectively. Among them, the turbulent flow pump 700 can be an ordinary mechanical pump or a canned motor pump, and can be selected according to the actual situation, and the present invention does not make a limitation.

[0034] In an exemplary embodiment, pumping the heat dissipation medium into the TANK container 200 through the turbulent flow pump 700 can not only make the TANK container 200 replenish the heat dissipation medium, but also make the replenished heat dissipation medium enter the TANK container 200, thereby promoting the flow of the heat dissipation medium contained in the TANK container 200, so as to play a role in disturbing the flow of the heat dissipation medium in the TANK container 200.

[0035] A controller for replenishing the heat dissipation medium for the TANK container 200 corresponding to the number of the TANK container 200 through the turbulent flow pump 700 based on the liquid level result and the number of the TANK container 200.

[0036] In an exemplary embodiment, a valve body is installed on the pipeline between each connection controller and the TANK container 200. The controller controls the on / off of the corresponding valve body to pump the heat dissipation medium to the TANK container 200 respectively.

[0037] With the above device, since the liquid level sensor 313 is introduced to measure the liquid level of the heat dissipation medium in each TANK container 200 and output the liquid level result and the number of the TANK container 200.

[0038] Based on the measurement result of the liquid level sensor 313 and the number of the TANK container 200, the controller can accurately determine which TANK container 200 needs to be replenished with the heat dissipation medium. Moreover, by using the turbulence pump 700, the controller can provide the heat dissipation medium to the TANK container 200 that needs to be replenished in a targeted manner, avoiding the situation of centralized liquid supply to all connected TANK containers 200.

[0039] By the above method, the technical solution of the present invention can accurately and effectively replenish the heat dissipation medium for each TANK container 200, avoid the waste of the heat dissipation medium, and achieve the effect of reducing the excessive consumption of the heat dissipation medium. At the same time, since only the TANK container 200 that needs liquid replenishment will be replenished with the heat dissipation medium, it can also save energy and reduce costs.

[0040] Figure 3 It is a structural block diagram of the turbulence component in the turbulence workpiece being a turbulence pipe according to an embodiment of the present invention. In one embodiment, as Figure 3 shown, the device further includes:

[0041] Multiple groups of turbulence components are arranged in the TANK container 200. Among them, at least one heat dissipation station for placing the workpiece to be heat dissipated is arranged in each TANK container 200, and the turbulence component corresponds to the heat dissipation station;

[0042] In an exemplary embodiment, as Figure 2 and 3 shown, 5 heat dissipation stations can be arranged in one TANK container 200 to place 10 workpieces to be heat dissipated. Of course Figure 2 and 3 is only an example. The number of heat dissipation stations in each TANK container 200 can be set according to the actual situation, and the present invention does not make a limitation. Among them, each heat dissipation station is provided with a turbulence component to change the flow rate and flow path of the heat dissipation medium at the heat dissipation station to dissipate heat from the workpiece to be heat dissipated.

[0043] The liquid distributor 201 is used to distribute the heat dissipation medium to multiple groups of turbulence components;

[0044] In an exemplary embodiment, the liquid distributor 201 may adopt a tube-type liquid distributor 201: The tube-type liquid distributor 201 diverts the heat dissipation medium from the pipeline between the controller and the TANK container 200 to the corresponding flow disturbance components. It can be made of metal or plastic and has a series of pipelines and connectors to accurately distribute the heat dissipation medium to the corresponding flow disturbance components.

[0045] The controller is further configured to: acquire the temperature data of the device to be cooled, and when the temperature data is higher than the device down-frequency threshold, pump the heat dissipation medium for the flow disturbance component corresponding to the device to be cooled through the flow disturbance pump 700, wherein the device to be cooled is installed on the workpiece to be cooled.

[0046] In an exemplary embodiment, each device to be cooled is integrated with a temperature sensor during installation, and the device to be cooled is installed in the workpiece to be cooled. Among them, the workpiece to be cooled can be communication devices such as servers, routers, switches, and BBUs, and the device to be cooled can be chips such as CPUs and GPUs. The controller can know the temperature of the device to be cooled corresponding to the temperature sensor when it is working by receiving the temperature collected by the temperature sensor. By comparing the received temperature data with the device down-frequency threshold, the flow disturbance pump 700 is used to pump the heat dissipation medium for the flow disturbance component corresponding to the device to be cooled, so as to cool the workpiece to be cooled.

[0047] In an exemplary embodiment, a plurality of temperature sensors are installed in the workpiece to be cooled, and each temperature sensor is placed near the position of the workpiece to be cooled to collect the temperature data of the workpiece to be cooled.

[0048] In an exemplary embodiment, a thermistor network is used to measure the temperatures of multiple devices to be cooled. Among them, the thermistor network connects multiple thermistors to a circuit board, and each thermistor is connected to the workpiece to be cooled. By measuring the change in the resistance value of each thermistor, the temperature of each workpiece to be cooled is obtained. For example, a correspondence table between the resistance value and the temperature is established in advance. The temperature corresponding to the resistance value is obtained according to the correspondence table. Or, the resistance value of the thermistor at a known temperature is measured in advance, and a calibration curve is generated based on the measurement result. The calibration curve is a functional relationship between the resistance value and the temperature. The temperature corresponding to the measured resistance value is found based on the functional relationship.

[0049] In one embodiment, the flow disturbance component includes:

[0050] A flow disturbance workpiece 205, installed at the heat dissipation station, for changing the flow path of the heat dissipation medium around the device to be cooled;

[0051] Figure 4 It is a structural block diagram of the flow disturbance workpiece being a flow disturbance plate in the flow disturbance component according to an embodiment of the present invention. In one embodiment, asFigure 3 and Figure 4 As shown in Figure 4 , the flow disturbing workpiece 205 is at least one of the following: a flow disturbing tube and a flow disturbing plate.

[0052] In an exemplary embodiment, the flow disturbing tube can be a tapered tube, a variable-diameter tube, etc., to increase the flow rate of the coolant. The diameter of the flow disturbing tube can be determined according to the power, position, and flow rate of the flow disturbing pump 700.

[0053] The flow disturbing plate can be one or more of the following: a straight plate flow deflector, a corrugated flow deflector, a columnar flow deflector, and a mesh flow deflector. Among them, the straight plate flow deflector is a flat plate structure installed between the heat dissipation medium flow regions for guiding the flow. It can change the speed and direction of the fluid, increase the contact area between the heat dissipation medium and the device or component, and improve the heat transfer efficiency. The corrugated flow deflector is a structure with a wave shape used in the heat dissipation medium flow region. It increases the heat transfer and dispersion by increasing the tortuosity and friction of the fluid path, and improves the heat transfer efficiency. The columnar flow deflector is a cylindrical or rod-shaped structure installed in the heat dissipation medium flow region. It can disperse the flow of the fluid, increase the heat transfer path and contact area, and improve the heat transfer efficiency. The mesh flow deflector is a flow disturbing plate with a mesh structure installed in the heat dissipation medium flow region. It improves the heat transfer efficiency and uniformity by increasing the turbulence and mixing of the fluid.

[0054] The branch pipe fitting 204 is connected to the distributor 201 at one end and to the flow disturbing workpiece 205 at the other end;

[0055] In an exemplary embodiment, the branch pipe fitting 204 can be made of a rigid material or a flexible material. When the branch pipe fitting 204 is made of a flexible material, it can swing during the flow of the heat dissipation medium to drive the flow disturbing workpiece 205 to swing. For example: when the flow disturbing workpiece 205 is a flow disturbing tube, the swing of the branch pipe fitting 204 can drive the flow disturbing tube to swing, thereby changing the orientation of the outlet of the flow disturbing tube and further changing the flow path of the heat dissipation medium.

[0056] In one embodiment, the distributor 201 is provided with a plurality of pipeline interfaces 202, and one end of the branch pipe fitting 204 is connected to the distributor 201 through the pipeline interface 202.

[0057] The branch electric valve 203 is installed on the branch pipe fitting 204 for adjusting the flow rate of the heat dissipation medium in the branch pipe fitting 204.

[0058] In an exemplary embodiment, the branch electric valve 203 can be one or more of the following: rotary electric valve, linear electric valve, pulse electric valve, regulating electric valve. Among them, the rotary electric valve is driven by an electric actuator to rotate the valve flap of the valve to control the on-off and regulation of the medium. Different types such as ball valves, butterfly valves, and cock valves can be used, which have the characteristics of fast response, precise control, and reliable closing. The linear electric valve is pushed by an electric actuator to move the valve stem linearly to control the opening of the valve and the flow rate of the medium. Gate valves, globe valves, etc. can be used for the linear electric valve. The pulse electric valve generates a fast pulse action through an electric actuator to realize the function of quickly opening and closing the valve. The regulating electric valve is driven by an electric actuator to finely adjust the valve flap to achieve precise flow or pressure control. Regulating ball valves, regulating butterfly valves, etc. can be used.

[0059] In one embodiment, the device further includes:

[0060] The inlet pressure sensor of the turbulent flow pump 700 is used to obtain the inlet pressure value of the turbulent flow pump 700;

[0061] In an exemplary embodiment, the pressure sensor is electrically connected to the controller to facilitate sending the collected data to the controller.

[0062] The controller is further configured to: when the temperature data is higher than the device down-frequency threshold and the inlet pressure value is less than the start threshold of the turbulent flow pump 700, control the centralized cooling system 100 to send the cooling medium to the cooling pump 300 of the TANK container 200.

[0063] In an exemplary embodiment, the start of the turbulent flow pump 700 requires meeting the start threshold and requires a start-up time. Therefore, during the start-up period of the turbulent flow pump 700, controlling the centralized cooling system 100 to send the cooling medium to the cooling pump 300 of the TANK container 200 effectively utilizes the cooling capacity of the centralized cooling system 100, thereby reasonably cooling the workpiece to be cooled.

[0064] In one embodiment, the centralized cooling system 100 includes:

[0065] The cooling pump 300 is used to provide circulating power for the cooling medium to make the cooling medium circulate in the pipeline assembly between the centralized cooling system 100 and the TANK container 200;

[0066] The pressure sensor 301 before the cooling pump is used to monitor the inlet pressure of the cooling pump 300 and transmit the monitored data to the control system of the centralized cooling system 100; among them, the number of the pressure sensors 301 before the cooling pump is set according to the number of the cooling pumps 300, so that one cooling pump 300 is equipped with one pressure sensor 301 before the cooling pump.

[0067] The pressure sensor 302 after the heat dissipation pump is used to monitor the outlet pressure of the heat dissipation pump 300 and transmit the monitored data to the control system of the centralized heat dissipation system 100. Among them, the number of pressure sensors 302 after the heat dissipation pump is set according to the number of heat dissipation pumps 300, so that one heat dissipation pump 300 is equipped with one pressure sensor 302 after the heat dissipation pump.

[0068] In one embodiment, the controller is further configured to:

[0069] When the temperature data is higher than the device downclocking threshold and the inlet pressure value is greater than or equal to the start threshold of the turbulent flow pump 700, reduce the flow rate of the heat dissipation medium of the centralized heat dissipation system 100 and start the turbulent flow pump 700 to pump the heat dissipation medium for the turbulent flow component corresponding to the temperature sensor.

[0070] In an exemplary embodiment, when the turbulent flow pump 700 meets the start threshold, the turbulent flow pump 700 can be used to dissipate heat from the workpiece to be cooled, and the flow rate of the heat dissipation medium of the centralized heat dissipation system 100 is reduced. When the cooling requirement is met, the power consumption of the entire device can be effectively saved.

[0071] In one embodiment, the controller is further configured to:

[0072] Obtain the rotation speed of the turbulent flow pump 700. When the rotation speed of the turbulent flow pump 700 reaches the rated rotation speed and the temperature data is higher than the device downclocking threshold, increase the flow rate of the heat dissipation medium of the centralized heat dissipation system 100.

[0073] In an exemplary embodiment, when the rotation speed of the turbulent flow pump 700 reaches the rated rotation speed, but the temperature data is still higher than the device downclocking threshold, it indicates that the heat dissipation capacity of the turbulent flow pump 700 is difficult to meet the current heat dissipation requirement. By increasing the flow rate of the heat dissipation medium of the centralized heat dissipation system 100, the turbulent flow pump 700 and the centralized heat dissipation system 100 can dissipate heat from the workpiece to be cooled simultaneously, thereby improving the heat dissipation efficiency.

[0074] In one embodiment, the controller is further configured to:

[0075] When the temperature data drops to the first preset temperature range, control the turbulent flow pump 700 to reduce its rotation speed.

[0076] In an exemplary embodiment, when the temperature data drops to the first preset temperature range, it indicates that an effective heat dissipation effect has been achieved on the device to be cooled. By controlling the controller to reduce the rotation speed of the turbulent flow pump 700, power consumption can be saved. Among them, the maximum value of the first preset temperature range is less than the device downclocking threshold, and the specific range can be set according to the actual situation.

[0077] In one embodiment, the controller is further configured to:

[0078] When the temperature data drops to within a second preset temperature range, turn off the turbulence pump 700, where the second preset temperature range is the temperature reduction range processed by the centralized heat dissipation system 100.

[0079] In an exemplary embodiment, when the temperature data drops to within the second preset temperature range, it indicates that the centralized heat dissipation system 100 can be used to dissipate heat from the device to be cooled. At this time, the centralized heat dissipation system 100 is entrusted to perform heat dissipation alone, which can further reduce the power consumption of the device.

[0080] In one embodiment, the device further includes: a first electric bypass valve 400, disposed between the heat dissipation input pipeline and the heat dissipation output pipeline of the centralized heat dissipation system 100, and configured to form a diversion branch between the heat dissipation input pipeline and the heat dissipation output pipeline when the rotational speed of the heat dissipation pump 300 of the centralized heat dissipation system 100 drops to a first rotational speed.

[0081] In an exemplary embodiment, as Figure 2 shown, when the centralized heat dissipation system 100 dissipates heat from the device to be cooled, when the first electric bypass valve 400 is opened, there is an additional flow path between the centralized heat dissipation system 100 and the device to be cooled. When the heat dissipation medium in the TANK container 200 is saturated, it is convenient for the heat dissipation medium to flow back to the centralized heat dissipation system 100 from the diversion branch of the first electric bypass valve 400, or to return to the TANK container 200 from the TANK container 200 through the diversion branch, thereby reducing the probability of the heat dissipation medium overflowing from the TANK container 200.

[0082] In one embodiment, the device further includes: a second electric bypass valve 500, disposed between the turbulence input pipeline and the turbulence output pipeline of the turbulence pump 700, and configured to form a diversion branch between the turbulence input pipeline and the turbulence output pipeline when the rotational speed of the turbulence pump 700 drops to a second rotational speed.

[0083] In an exemplary embodiment, as Figure 2 shown, the second electric bypass valve 500 is disposed between the turbulence input pipeline and the turbulence output pipeline of the turbulence pump 700. When the second electric bypass valve 500 is opened, there is an additional flow path between the turbulence pump 700 and the device to be cooled. When the heat dissipation medium in the TANK container 200 is saturated, it is convenient for the heat dissipation medium to flow back to the turbulence pump 700 from the diversion branch of the second electric bypass valve 500, or to return to the TANK container 200 from the TANK container 200 through the diversion branch, thereby reducing the probability of the heat dissipation medium overflowing from the TANK container 200.

[0084] In one embodiment, the device further includes: a heat dissipation return liquid pressure sensor 303, a heat dissipation return liquid temperature sensor 304, a heat dissipation supply liquid pressure sensor 305, a heat dissipation supply liquid flow sensor 306, and a heat dissipation supply liquid temperature sensor 307.

[0085] Among them, the heat dissipation return liquid pressure sensor 303 and the heat dissipation return liquid temperature sensor 304 are both installed on the heat dissipation pipeline assembly 900 of the return liquid pipeline between the centralized heat dissipation system 100 and the TANK container 200, and are respectively used to monitor the pressure and temperature of the heat dissipation medium flowing from the TANK container 200 to the centralized heat dissipation system 100, and transmit the pressure data and temperature data to the controller. The heat dissipation supply liquid pressure sensor 305, the heat dissipation supply liquid flow sensor 306, and the heat dissipation supply liquid temperature sensor 307 are all installed on the heat dissipation pipeline assembly 900 of the supply liquid pipeline between the centralized heat dissipation system 100 and the TANK container 200, and are respectively used to detect the pressure, flow rate, and temperature of the heat dissipation medium flowing from the centralized heat dissipation system 100 to the TANK container 200, and transmit the pressure data, flow rate data, and temperature data to the controller.

[0086] In one embodiment, the device further includes: a turbulent flow supply liquid pressure sensor 308, a turbulent flow supply liquid temperature sensor 309, and a turbulent flow supply liquid flow sensor 310.

[0087] Among them, the turbulent flow supply liquid pressure sensor 308, the turbulent flow supply liquid temperature sensor 309, and the turbulent flow supply liquid flow sensor 310 are all installed on the turbulent flow pipeline assembly of the supply liquid pipeline between the turbulent flow pump 700 and the TANK container 200, and are used to monitor the pressure, temperature, and flow rate of the heat dissipation medium flowing from the turbulent flow pump 700 to the TANK container 200, and transmit the pressure data, temperature data, and flow rate data to the controller.

[0088] In one embodiment, the device further includes a pressure sensor 311 in front of the turbulent flow pump. The pressure sensor 311 in front of the turbulent flow pump is installed on the turbulent flow pipeline assembly of the return liquid pipeline between the turbulent flow pump 700 and the TANK container 200, and is used to monitor the pressure at the inlet of the turbulent flow pump 700, and transmit the pressure at the inlet of the turbulent flow pump 700 to the controller to monitor and control the working state of the turbulent flow pump 700.

[0089] In one embodiment, the device further includes an electric valve 600 in front of the turbulent flow pump. It is installed at the connection position between the turbulent flow pump 700 and the heat dissipation medium supply system, and is used to control the flow rate of the heat dissipation medium provided by the heat dissipation medium supply system to the heat dissipation medium. Among them, the heat dissipation medium supply system can adopt the system of the existing technology, and the present invention will not elaborate.

[0090] In one embodiment, the device further includes an inner cavity temperature sensor 312 for measuring the temperature of the heat dissipation medium in a plurality of TANK containers 200, outputting the temperature result and the number of the TANK container 200;

[0091] In an exemplary embodiment, in order to measure the temperature of the heat dissipation medium in the TANK container 200, the following installation methods can be adopted:

[0092] Insertion sensor: Insert the temperature sensor into the TANK container 200. Use a hole or a flange connector to install the sensor on the wall or the top of the TANK container 200 to directly contact the heat dissipation medium for temperature measurement.

[0093] Surface - fitting sensor: Attach the temperature sensor to the outer surface of the TANK container 200. The sensor can be fixed on the container surface through an adhesive or magnetism to measure the temperature of the outer wall in real - time.

[0094] Sensing through a heat - conducting material: Use a heat - conducting material, such as a thermosensitive film or a thermosensitive patch, to directly contact the temperature sensor with the TANK container 200. The heat - conducting material can help the sensor perceive the temperature change of the heat dissipation medium faster and conduct the heat from the heat dissipation medium to the sensor.

[0095] Inlet / outlet pipeline installation: Install the temperature sensor on the inlet or outlet pipeline of the heat dissipation medium to measure the temperature of the heat dissipation medium when it enters or leaves the TANK container 200. It can provide monitoring of the instantaneous temperature change of the heat dissipation medium.

[0096] Among them, each temperature sensor is set with an IP address, and the number of the corresponding TANK container 200 can be known by identifying the IP address of the temperature sensor.

[0097] In one embodiment, the device further includes a purification module 800. The purification module 800 is installed in the turbulent flow pipeline assembly of the return liquid pipeline between the turbulent flow pump 700 and the TANK container 200, and is used for purifying the heat dissipation medium flowing from the turbulent flow pump 700 to the TANK container 200. For example, operations such as acid removal and water removal are carried out to meet the requirements that the heat dissipation medium is clean and can effectively transfer heat.

[0098] In an exemplary embodiment, the purification module 800 includes:

[0099] Filter: The filter is the core component of the purification module 800 and can be composed of a filter element or a filter screen. Its main function is to prevent solid impurities (such as sediments, particles, etc.) from entering the liquid cooling system and maintain the cleanliness of the heat dissipation medium. The selection of the filter should be determined according to the requirements of the liquid cooling system and the characteristics of the heat dissipation medium.

[0100] Activated carbon filter element: An activated carbon filter element can be added to the purification module 800 to adsorb and remove organic substances, gases, or other contaminants in the liquid cooling medium. Activated carbon has a large surface area and adsorption capacity, which can effectively purify the heat dissipation medium and improve the working efficiency and stability of the system.

[0101] Valves and pipes: The valves and pipes in the purification module 800 are used to control and guide the flow of the liquid cooling medium. They are used to adjust the supply speed and flow rate of the heat dissipation medium in the liquid cooling system to meet the actual working requirements.

[0102] Container and integration: The purification module 800 can include a container or an integrated device for housing the filter and other components. The container has a sealing performance to prevent external impurities from entering the liquid cooling system. The integrated device combines multiple purification modules 800 together to form a complete purification system for the liquid cooling medium.

[0103] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A liquid replenishment and heat dissipation device for an immersion liquid cooling system, characterized in that Comprising: Multiple TANK containers for placing workpieces to be cooled; A liquid level sensor for measuring the liquid level of the cooling medium in the multiple TANK containers, outputting the liquid level result and the number of the TANK container; A turbulent flow pump for pumping the cooling medium for the multiple TANK containers; A controller for replenishing the cooling medium to the TANK container corresponding to the number of the TANK container through the turbulent flow pump based on the liquid level result and the number of the TANK container.

2. The device according to claim 1, wherein Further comprising: Multiple groups of turbulent flow components arranged in the TANK container, wherein at least one cooling station for placing the workpiece to be cooled is arranged in each TANK container, and the turbulent flow component corresponds to the cooling station; A distributor for diverting the cooling medium to the multiple groups of turbulent flow components; The controller is further configured to: obtain the temperature data of the device to be cooled, and when the temperature data is higher than the device downclocking threshold, pump the cooling medium to the turbulent flow component corresponding to the device to be cooled through the turbulent flow pump, wherein the device to be cooled is installed on the workpiece to be cooled.

3. The device according to claim 2, characterized in that, The turbulent flow component includes: A turbulent flow workpiece installed at the cooling station for changing the flow path of the cooling medium around the device to be cooled; A branch pipe fitting, one end of which is connected to the distributor and the other end is connected to the turbulent flow workpiece; A branch electric valve installed on the branch pipe fitting for adjusting the flow rate of the cooling medium in the branch pipe fitting.

4. The device according to claim 2, characterized in that, Further comprising: A turbulent flow pump inlet pressure sensor for obtaining the inlet pressure value of the turbulent flow pump; The controller is further configured to: when the temperature data is higher than the device downclocking threshold and when the inlet pressure value is less than the start threshold of the turbulent flow pump, control the centralized cooling system to pump the cooling medium for the TANK container cooling.

5. The device according to claim 4, wherein The controller is further configured to: When the temperature data is higher than the device downclocking threshold and when the inlet pressure value is greater than or equal to the start threshold of the turbulent flow pump, reduce the flow rate of the cooling medium of the centralized cooling system and start the turbulent flow pump to pump the cooling medium to the turbulent flow component corresponding to the device to be cooled.

6. The device according to claim 5, characterized in that, The controller is further configured to: Obtain the rotation speed of the turbulent flow pump, and when the rotation speed of the turbulent flow pump reaches the rated rotation speed and the temperature data is higher than the device downclocking threshold, increase the flow rate of the cooling medium of the centralized cooling system.

7. The device according to claim 6, characterized in that, The controller is further configured to: When the temperature data drops to the first preset temperature range, control the turbulent flow pump to reduce the rotation speed.

8. The device according to claim 7, characterized in that, The controller is further configured to: When the temperature data drops to the second preset temperature range, turn off the turbulent flow pump, wherein the second preset temperature range is the cooling range processed by the centralized cooling system.

9. The device according to claim 1, characterized in that, Further comprising: A first electric bypass valve arranged between the cooling input pipeline and the cooling output pipeline of the centralized cooling system for forming a diversion branch between the cooling input pipeline and the cooling output pipeline when the rotation speed of the cooling pump of the centralized cooling system drops to the first rotation speed.

10. The device according to claim 1, characterized in that, Further comprising: A second electric bypass valve is arranged between the turbulence input pipeline and the turbulence output pipeline of the turbulence pump, and is used for forming a diversion branch between the turbulence input pipeline and the turbulence output pipeline when the rotational speed of the turbulence pump is reduced to a second rotational speed.

11. The device according to claim 3, characterized in that, The turbulence workpiece is at least one of the following: a turbulence pipe and a turbulence plate.

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