Structural member and light-emitting substrate thereof

Abstract

The invention provides a structural member and a light-emitting substrate thereof, relates to the technical field of display, and is used for reducing the preparation cost. The structural member comprises two first sub-parts and a second sub-part, the two first sub-parts extend in the first direction and are oppositely arranged in the second direction, and a third interval is formed between the two first sub-parts in the second direction; the first direction and the second direction intersect each other. One second sub-part is located in the third interval, and the two ends, in the second direction, of the second sub-part are connected with the two ends, located on the same side, of the two first sub-parts correspondingly. Wherein the second sub-part is provided with a first connector. The wiring substrate is used for preparing a light-emitting substrate.

Description

[0001] This divisional application is filed based on the patent application with the filing date of August 8, 2023, application number 202310997100.5, and invention title "Wiring Substrate, Preparation Method of Structural Member, and Display Device". Technical Field

[0002] The present disclosure relates to the field of display technologies, and particularly to a structural member and a light-emitting substrate thereof. Background Art

[0003] With the development of light-emitting diode technologies, backlights using submillimeter light-emitting diodes (English: Mini Light Emitting Diode; abbreviation: Mini-LED) and micro light-emitting diodes (English: Micro Light Emitting Diode; abbreviation: Micro-LED) have been widely used. The size of Mini-LEDs is approximately 100 μm to 300 μm, and the size of Micro-LEDs is approximately less than 100 μm. Due to advantages such as small size, high brightness, and high contrast, when Mini-LEDs and Micro-LEDs are applied to a backlight module, the backlight can be finely adjusted, thereby realizing the display of high-dynamic range images (English: Hiigh-Dynamic Range; abbreviation: HDR), and thus attracting more and more attention. Summary of the Invention

[0004] The purpose of the embodiments of the present disclosure is to provide a structural member and a light-emitting substrate thereof, which are used to reduce the preparation cost of the light-emitting substrate formed by preparing a light-emitting structural member, and further reduce the preparation cost of a display device.

[0005] To achieve the above purpose, the embodiments of the present disclosure provide the following technical solutions:

[0006] On the one hand, a wiring substrate is provided. The wiring substrate includes a substrate, and the substrate includes a first region and a second region. The first region includes two first main regions and a first connection region. The two first main regions both extend in a first direction and have a first interval in a second direction. End portions of the first connection region are respectively connected to end portions of the two first main regions on the same side. The first region has a first opening. The second region includes two second main regions and a second connection region. The two second main regions both extend in the first direction and have a second interval in the second direction. End portions of the second connection region are respectively connected to end portions of the two second main regions on the same side. The second region has a second opening. The orientation of the second opening is opposite to that of the first opening; the first direction and the second direction intersect each other. One of the first main regions of the first region is located within the second opening, and one of the second main regions of the second region is located within the first opening.

[0007] The above wiring substrate can be used to prepare and form a structural member. Moreover, any one of the first regions and any one of the second regions are both used to form an independent structural member (such as a light-emitting structural member that can be used as a light source), and a wiring substrate can be prepared to form multiple structural members. Moreover, each of the first regions and each of the second regions is a U-shaped structure. When the size and arrangement density of the light-emitting substrate are the same, compared with a linear light-emitting structural member, the U-shaped light-emitting structural member can reduce the usage amount of the light-emitting structural member and reduce the usage amount of the connector, thereby being beneficial to reducing the preparation cost of the light-emitting substrate composed of multiple light-emitting structural members and reducing the preparation cost of the display device.

[0008] In some embodiments, the dimension of the first main region in the first direction is equal to the dimension of the second main region in the first direction. And / or, the dimension of the first main region in the second direction is equal to the dimension of the second main region in the second direction.

[0009] In some embodiments, the first interval is equal to the dimension of the second interval in the second direction.

[0010] In some embodiments, the first interval is greater than the dimension of the second main region in the second direction and less than or equal to 1.5 times the dimension of the second main region in the second direction. The second interval is greater than the dimension of the first main region in the second direction and less than or equal to 1.5 times the dimension of the first main region in the second direction.

[0011] In some embodiments, between adjacent first regions and second regions, there are a plurality of through holes, and between adjacent two through holes, there is a connection structure, and the connection structure is used to connect and fix adjacent first regions and second regions.

[0012] In some embodiments, the first interval is greater than 2 times the dimension of the second main region along the second direction and less than or equal to 2.5 times the dimension of the second main region along the second direction. The second interval is greater than 2 times the dimension of the first main region along the second direction and less than or equal to 2.5 times the dimension of the first main region along the second direction.

[0013] In some embodiments, the substrate includes a plurality of the first regions arranged in sequence along the second direction, and a plurality of second regions arranged in sequence along the second direction. Two first main regions that respectively belong to two adjacent first regions and have the minimum distance along the second direction are located within a second opening of the same second region; two second main regions that respectively belong to two adjacent second regions and have the minimum distance along the second direction are located within a first opening of the same first region.

[0014] In some embodiments, the substrate further includes a third region that extends along the first direction and is located between the outermost first main region and the second main region along the second direction.

[0015] In some embodiments, a plurality of through holes are included between adjacent first regions and second regions, between adjacent first regions and third regions, between adjacent first regions and first regions, between adjacent second regions and second regions, and between adjacent second regions and third regions. A connection structure is included between two adjacent through holes, and the connection structure is used to connect and fix adjacent first regions and second regions, adjacent first regions and third regions, adjacent first regions and first regions, adjacent second regions and second regions, and adjacent second regions and third regions.

[0016] In some embodiments, a plurality of electronic components are arranged at intervals along the first direction for each first main region of the first region and each second main region of the second region. The distance between two adjacent electronic components along the first direction is D1, the dimensions of the first main region and the second main region along the second direction are both D2, and the width of the connection structure along the direction perpendicular to the boundary of the first region or the second region connected to the connection structure is M; wherein, D1, D2, and M satisfy D2 = (D1 - 3M) / 3.

[0017] In some embodiments, the width M of the connection structure along the direction perpendicular to the boundary of the first region or the second region connected to the connection structure is 1 mm to 2 mm.

[0018] In some embodiments, first connectors are provided in both the first connection area of the first region and the second connection area of the second region, and the orthographic projection of the first connector on the substrate only partially overlaps with the first connection area or the second connection area.

[0019] In some embodiments, a plurality of driving elements are provided in each first main area of the first region and each second main area of the second region, and the driving elements are configured to control at least one of the electronic elements in the same region.

[0020] In another aspect, a method for manufacturing a structural member is provided. The manufacturing method includes: dividing a first region, a second region, and a fourth region on a substrate; removing a partial area of the fourth region to form a plurality of through holes arranged at intervals in the fourth region, and a connection structure is formed between two adjacent through holes; wiring in the first region and the second region; disposing electronic elements in each first main area of the first region and each second main area of the second region; mounting first connectors in the first connection area and the second connection area; cutting the connection structure so that any first region and any second region are independently formed into a structural member. Wherein, the first region includes two first main areas and a first connection area, both of the two first main areas extend along a first direction and have a first interval along a second direction; end portions of the first connection area are respectively connected to end portions of the two first main areas on the same side, and the first region has a first opening; the second region includes two second main areas and a second connection area, both of the two second main areas extend along the first direction and have a second interval along the second direction; end portions of the second connection area are respectively connected to end portions of the two second main areas on the same side, and the second region has a second opening; the orientation of the second opening is opposite to the orientation of the first opening; the fourth region is located between adjacent first regions and second regions, between adjacent first regions and first regions, and between adjacent second regions and second regions; the first direction and the second direction intersect each other.

[0021] In some embodiments, after any first region and any second region are independently formed into a structural member, the method further includes: providing an adapter circuit board; assembling a plurality of structural members on the adapter circuit board, and the first connector of each structural member is connected to a second connector. Wherein, the adapter circuit board extends along the second direction, and a plurality of second connectors are provided on the adapter circuit board.

[0022] In some embodiments, two adjacent structural members along the first direction are arranged on both sides of the adapter circuit board in an axisymmetric manner.

[0023] On the other hand, a display device is provided. The display device includes a display panel and a structural member formed by the preparation method of the structural member as described in any of the above embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the present disclosure, the drawings required for use in some embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure, and those of ordinary skill in the art can also obtain other drawings according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual dimensions of the products involved in the embodiments of the present disclosure, the actual processes of the methods, the actual timings of the signals, etc.

[0025] Figure 1 Structural diagram of a display device according to some embodiments;

[0026] Figure 2 Structural diagram of a display panel according to some embodiments;

[0027] Figure 3A A structural diagram of a wiring substrate according to some embodiments;

[0028] Figure 3B Another structural diagram of a wiring substrate according to some embodiments;

[0029] Figure 4 For Figure 3A Partial enlarged view of area A in

[0030] Figure 5 Another structural diagram of a wiring substrate according to some embodiments;

[0031] Figures 6A - 6D Process flow diagram of the preparation of the structural member according to some embodiments;

[0032] Figure 7 Structural diagram of a light-emitting substrate according to some embodiments;

[0033] Figure 8 For Figure 7 Partial enlarged view of area B in

[0034] Figure 9A For Figure 8 One partial enlarged view of area C in

[0035] Figure 9B For Figure 8 Another partial enlarged view of area C in DETAILED DESCRIPTION OF THE EMBODIMENTS

[0036] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are only a part rather than all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure shall fall within the scope of protection of the present disclosure.

[0037] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", are interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example", or "some examples", etc., are intended to indicate that the specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0038] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0039] When describing some embodiments, the expression "connected" and its derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components have direct physical contact or electrical contact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0040] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0041] The use of "configured to" herein means open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps.

[0042] Additionally, the use of "based on" implies openness and inclusiveness, because a process, step, calculation, or other action "based on" one or more of the stated conditions or values can, in practice, be based on additional conditions or values beyond those stated.

[0043] As used herein, "about", "substantially", or "approximately" includes the stated value and an average within an acceptable deviation range of the specific value, where the acceptable deviation range is determined by a person of ordinary skill in the art in view of the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system).

[0044] As used herein, "parallel", "perpendicular", "equal" include the stated situation and situations similar to the stated situation, where the range of the similar situations is within an acceptable deviation range, and the acceptable deviation range is determined by a person of ordinary skill in the art in view of the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two equal values is less than or equal to 5% of either one.

[0045] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or there can be an intermediate layer between the layer or element and the other layer or substrate.

[0046] Some embodiments of the present disclosure provide a display device, and the display device can be any device that displays whether it is moving (e.g., video) or stationary (e.g., still image), and whether it is text or image.

[0047] Exemplarily, the display device may be a mobile phone, a wireless device, a personal digital assistant (PDA), a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a video camera, a game console, a watch, a clock, a calculator, a television monitor, a flat panel display, a computer monitor, an automotive display (e.g., an odometer display, etc.), a cockpit controller and / or display, a display of a camera view (e.g., a display of a rear view camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, a packaging and aesthetic structure (e.g., a display of an image of a piece of jewelry), etc.

[0048] In some embodiments, the above display device may be a liquid crystal display (LCD). Refer to Figure 1 , when the display device 1000 is a liquid crystal display device, the display device 1000 may include a backlight module 100 and a display panel 200. Of course, the embodiments of the present disclosure are not limited thereto, and the display device 1000 may further include other structures or components, such as Figure 1 shown, the display device 1000 may further include a middle frame 300, an outer frame 400, and a glass cover plate ( Figure 1 not shown in the figure) disposed on the display side of the display panel 200, etc., as long as the same technical concept as that of the present application is applied, and they will not be listed one by one here.

[0049] Among them, the display panel 200 includes a display side and a non-display side. The display side refers to the side of the display panel 200 for displaying the picture ( Figure 1 the upper side of the display panel 200 in the figure), and the non-display side refers to the other side opposite to the display side. The backlight module 100 is disposed on the non-display side of the display panel 200 ( Figure 2 the lower side of the display panel 200 in the figure), and the backlight module 100 is used to provide a backlight source for the display panel 200.

[0050] Refer to Figure 2 , when the display device 1000 is a liquid crystal display device, the display panel 200 may be a liquid crystal display panel. At this time, the display panel 200 may include an array substrate 210, a counter substrate 220, and a liquid crystal layer 230 disposed between the array substrate 210 and the counter substrate 220.

[0051] On the array substrate 210, there are thin-film transistors 212 (Thin-film transistor; hereinafter referred to as: TFT) and pixel electrodes 213 disposed on the first substrate 211. The thin-film transistor 212 includes an active layer, a source electrode, a drain electrode, a gate electrode, and a gate insulating layer. The source electrode and the drain electrode are respectively in contact with the active layer, and the pixel electrode 213 is electrically connected to the drain electrode of the thin-film transistor 212.

[0052] In some embodiments, as Figure 2 shown, the array substrate 210 further includes a common electrode 214 disposed on the first substrate 211. The pixel electrode 213 and the common electrode 214 can be disposed on different layers. In this case, as Figure 2 shown, a first insulating layer 215 is disposed between the pixel electrode 213 and the common electrode 214. In the case where the common electrode 214 is disposed between the thin-film transistor 212 and the pixel electrode 213, as Figure 2 shown, a second insulating layer 216 is further disposed between the common electrode 214 and the thin-film transistor 212.

[0053] The pixel electrode 213 and the common electrode 214 can also be disposed on the same layer (not shown in the figure). In this case, both the pixel electrode 213 and the common electrode 214 are in a comb structure including a plurality of strip-shaped sub-electrodes. In some other embodiments, the common electrode 214 can also be disposed in the counter substrate 220.

[0054] As Figure 2 shown, the counter substrate 220 can include a color filter layer 222 disposed on the second substrate 221. In this case, the counter substrate 220 can also be referred to as a color filter substrate (English: Color filter; hereinafter referred to as: CF). Among them, when the backlight module 100 is used to emit white light, the color filter layer 222 at least includes a red photoresist unit, a green photoresist unit, and a blue photoresist unit. The red photoresist unit, the green photoresist unit, and the blue photoresist unit are respectively directly opposite to the sub-pixels of the display panel 200. The counter substrate 220 further includes a black matrix pattern 223 disposed on the second substrate 221, and the black matrix pattern 223 is used to separate the red photoresist unit, the green photoresist unit, and the blue photoresist unit.

[0055] As Figure 2 shown, the display panel 200 can further include a first polarizer 240 disposed on the side of the counter substrate 220 away from the liquid crystal layer 230, and a second polarizer 250 disposed on the side of the array substrate 210 away from the liquid crystal layer 230. In addition, the display panel 200 can further include other film layers or structures, which are not listed one by one in the embodiments of the present disclosure.

[0056] As Figure 1As shown, the backlight module 100 may include a light-emitting substrate 110 and an optical film 120 disposed on the side of the light-emitting substrate 110 close to the display panel 200. The light-emitting substrate 110 may directly emit white light, or the light-emitting substrate 110 may also emit light of other colors, and the light of other colors is converted to the display panel 200 through the optical film 120. The optical film 120 may include a diffuser plate and / or an optical brightening film, which is not specifically limited in the embodiments of the present disclosure. Among them, the diffuser plate has a scattering and diffusion effect, which can further mix the above-mentioned white light; the optical brightening film can improve the light output efficiency of the backlight module 100. In addition, the backlight module 100 may also include other film layers or structures, which are not listed one by one in the embodiments of the present disclosure.

[0057] like Figure 1 As shown, the light-emitting substrate 110 includes a back plate 111 and a light source 112 disposed on the back plate 111. The light source 112 is composed of a plurality of light-emitting elements (such as Mini-LED chips or Micro-LED chips) arranged in an array. There is a light mixing interval H between the light-emitting substrate 110 and the optical film 120. The light-emitting elements can be equivalent to point light sources. The light emitted by adjacent light-emitting elements is initially mixed within the light mixing interval H and then emitted to the optical film 120. After further homogenization by the optical film 120, it is emitted to the display panel 200. It can be understood that the light finally incident on the display panel can be equivalent to the light emitted by the surface light source.

[0058] In some embodiments, in some display products with a larger light mixing interval H (for example, greater than 20 mm), the intervals between adjacent light emitting elements on the light emitting substrate 110 are larger.

[0059] In the related art, a plurality of light-emitting elements arranged along the row direction are provided on a strip circuit board, and a first connector joint is fixed at the end of each strip circuit board. When a plurality of strip circuit boards are arranged to assemble to form a light-emitting substrate, it is also necessary to provide an adapter circuit board, on which a second connector joint is fixed, and the first connector joint of each strip circuit board is connected to a second connector joint on the adapter circuit board. The adapter circuit board can be connected to an external circuit (such as a driving circuit board) through a flexible circuit board (Flexible Printed Circuit; FPC for short). This solution requires each strip circuit board to be assembled and fixed to the adapter circuit board one by one, which is difficult to assemble and consumes a large number of connectors, which is not conducive to reducing the preparation cost of the light-emitting substrate.

[0060] In order to solve the above technical problems, the embodiment of the present application provides a wiring substrate 2000, which can be used to prepare a structural component, such as a light-emitting structural component. Figure 3A and Figure 4, the wiring substrate 2000 includes a substrate 2100, and the substrate 2100 includes a first region 30 and a second region 40. Among them, in Figure 3A , in order to clearly show the boundaries and positions of the first region 30 and the second region 40, different types of filling patterns are used for the two. The material of the substrate 2100 can be any one of glass, quartz, sapphire, ceramics, etc.; or a semiconductor material, such as a single-crystal semiconductor substrate or polycrystalline semiconductor based on silicon or silicon carbide, etc., a compound semiconductor such as silicon germanium, or SOI (Silicon On Insulator); or an organic resin material including, for example, epoxy resin, triazine, silicone resin or polyimide. The substrate 2100 can also be an FR4 type printed circuit board (PCB), or can be a flexible PCB that is easy to deform; it can also be a ceramic material including, for example, silicon nitride, AlN or Al2O3, or a metal or metal compound, or a metal core printed circuit board (MCPCB) or a metal-clad laminate (MCCL).

[0061] The first region 30 includes two first main regions 31 and a first connection region 32. The two first main regions 31 both extend along the first direction X and have a first interval D5 along the second direction Y. That is to say, the first interval D5 refers to the distance between the two first main regions 31 in the second direction Y. The end portions of the first connection region 32 are respectively connected to the end portions (such as Figure 3A the left end portions in Figure 3A ) on the same side of the two first main regions 31. The first region 30 has a first opening 34, and the first opening 34 refers to the region between the two first main regions 31. The orientation of the first opening 34 is in the direction away from the first connection region 32, that is,

[0062] the direction from left to right in Figure 3A . The first region 30 forms a U-shaped structure. Among them, the first direction X and the second direction Y intersect. Exemplarily, the first direction X and the second direction Y are perpendicular to each other.

[0063] The second region 40 includes two second main regions 41 and a second connection region 42. The two second main regions 41 both extend along the first direction X and have a second interval D6 along the second direction Y. That is to say, the second interval D6 refers to the distance between the two first main regions 31 in the second direction Y. The end portions of the second connection region 42 are respectively connected to the end portions (such as Figure 3A the right end portions in Figure 3A ) on the same side of the two second main regions 41. That is, the second region 40 forms a U-shaped structure.

[0063] The second region 40 has a second opening 44, and the second opening 44 refers to the region located between the two second main regions 41. The orientation of the second opening 44 ( Figure 3A from right to left along the first direction X in Figure 3AIn the opposite direction to the first direction X (from left to right), so that the first main region 31 can extend into the second opening 44, and the second main region 42 can extend into the first opening 34. For example, a first main region 31 of the first region 30 is located in the second opening 44, and a second main region 41 of the second region 40 is located in the first opening 34. Based on this, it is beneficial to increase the space utilization rate of the substrate 2100. Any one of the above-mentioned first regions 30 and any one of the second regions 40 are both used to form an independent structural member (such as a light-emitting structural member that can be used as a light source), and a wiring substrate 2000 can be fabricated to form multiple structural members. Moreover, both the first region 30 and each second region 40 are U-shaped structures. When the size and arrangement density of the light-emitting substrate are the same, compared with the linear light-emitting structural member, the U-shape can reduce the usage amount of the light-emitting structural member and the usage amount of the connector, thereby being beneficial to reducing the manufacturing cost of the light-emitting substrate composed of multiple light-emitting structural members and reducing the manufacturing cost of the display device 1000.

[0064] Moreover, compared with setting the first region 30 and the second region 40 as comb-shaped, setting the first region 30 and the second region 40 as U-shaped makes the fabricated light-emitting structural member have better versatility and can be applicable to backlight products of various different sizes. When setting the light-emitting substrate, the number and arrangement density of the U-shaped light-emitting structural members can be flexibly set according to the size of the light-emitting substrate.

[0065] In some embodiments, refer to Figure 3A , the dimension D3 of the first main region 31 along the first direction X is equal to the dimension D4 of the second main region 41 along the first direction X. And / or, refer to Figure 4 , the dimension of the first main region 31 along the second direction Y is equal to the dimension of the second main region 41 along the second direction Y, and the dimensions of both the first main region 31 and the second main region 41 along the second direction Y are D2. In this way, the first main region 31 and the second main region 41 with the same size and shape can be formed. The first main region 31 and the second main region 41 are used to arrange electronic components 50. The electronic components 50 can be, for example, light-emitting elements, sensors, or other components arranged in an array. The same size and shape of the first main region 31 and the second main region 41 are beneficial to improving the uniformity of the arrangement of the electronic components 50 on the first main region 31 and the second main region 41.

[0066] It can be understood that when the electronic component 50 is a light-emitting component, the structural component jointly formed by the wiring substrate 2000 and the electronic component 50 is a light-emitting structural component. Among them, from the type of the light-emitting component, the light-emitting component can be an LED with a quantum well junction, an LED with a columnar structure, an LED with a double heterojunction, etc. The light-emitting component can also include a packaging structure on the light-emitting side of the LED. The packaging structure can be made of a transparent material, and the surface can be an arc surface or a hemispherical surface. From the size of the light-emitting component, the light-emitting component can be a structure with a size miniaturized to the order of hundreds of micrometers. For example, the light-emitting area of the LED in the light-emitting component can be less than 1 mm2, or the light-emitting area of the LED can be less than 10,000 μm2, or the light-emitting area of the LED can be less than 3,000 μm2, and the light-emitting area of the LED can be less than 700 μm2. Of course, the embodiments of the present disclosure are not limited thereto, and the light-emitting component can also adopt light-emitting components with other structures, as long as the same technical idea as that of the present application is applied.

[0067] In some embodiments, as Figure 3A shown, the first interval D5 is equal to the second interval D6D6. In this way, the first region 30 and the second region 40 with the same size and shape can be formed, so that the structural components formed by the first region 30 and the second region 40 have the same shape, improving the consistency and versatility of the structural components.

[0068] Exemplarily, the dimension of the first connection area 32 of the first region 30 along the first direction X is equal to the dimension of the second connection area 42 of the second region 40 along the first direction X. And since the first interval D5 is equal to the second interval D6, it can be known that the dimension of the first connection area 32 of the first region 30 along the second direction Y is equal to the dimension of the second connection area 42 of the second region 40 along the second direction Y. In this way, the first main area 31 of the first region 30 can be completely located within the second interval D6 of the second region 40, and the second main area 42 of the second region 40 can be completely located within the first interval D5 of the first region 30, which is beneficial to further improving the space utilization rate of the wiring substrate 2000 and reducing the manufacturing cost of the wiring substrate 2000.

[0069] In some embodiments, referring to Figure 5 , the first interval D5 is greater than the dimension D2 of the second main area 41 along the second direction Y, and less than or equal to 1.5 times the dimension D2 of the second main area 41 along the second direction Y, that is, D2 < D5 ≤ 1.5D2. At this time, one second main area 41 of the second region 40 is located within the first interval D5 of one first region 30, and the other second main area 41 is located between two adjacent first regions 30. That is to say, only one second main area 41 is provided within each first interval D5.

[0070] The second interval D6 is greater than the dimension D2 of the first main area 31 along the second direction Y and less than or equal to 1.5 times the dimension D2 of the first main area 31 in the second direction, that is, D2 < D6 ≤ 1.5D2. At this time, one first main area 31 of the first area 30 is located within the second opening 44 of a second area 40, and the other first main area 31 is located between two adjacent first areas 30. That is to say, only one second main area 42 is provided within each second opening 44.

[0071] D2 < D5 ≤ 1.5D2 and D2 < D6 ≤ 1.5D2 can not only arrange a second main area 41 within the first opening 34 and a first main area 31 within the second opening 44, but also facilitate setting an interval between the first main area 31 and the second main area 41, which is conducive to separating the first area 30 and the second area 40 from the interval between the first main area 31 and the second main area 41 subsequently.

[0072] Exemplarily, referring to Figure 6A , there are multiple through holes 61 between adjacent first areas 30 and second areas 40, and a connection structure 62 is included between two adjacent through holes 61. The connection structure 62 is used to connect and fix adjacent first areas 30 and second areas 40. The connection structure 62 connects the first area 30 and the second area 40 into a whole, which is conducive to wiring on the first area 30 and the second area 40 of the substrate 2100 during the preparation process of the wiring substrate. The connection structures 62 penetrate through the substrate 2100 through the through holes 61, which is conducive to reducing the contact area between the first area 30 and the second area 40 and facilitating separating the first area 30 and the second area 40 into independent structural parts during the subsequent preparation process. Among them, the multiple through holes 61 and the multiple connection structures 62 together constitute the fourth area 60, and the fourth area 60 separates two adjacent first areas 30 and / or second areas 40, so as to subsequently separate any first area 30 and any second area 40 from within the fourth area 60 to form independent structural parts.

[0073] Exemplarily, along the extension direction of the edge of the first area 30 or the second area 40, the length of the through hole 61 is greater than the length of the connection structure 62. Along the direction perpendicular to the edge of the first area 30 or the second area 40 where the connection structure 62 is located, the width of the connection structure 62 is M, and M can be 1 mm to 2 mm. For example, within the interval between the first main area 31 and the second main area 32 along the second direction Y, the width M of the connection structure 62 along the second direction Y is 1 mm to 2 mm, and within the interval between the first main area 31 and the second main area 32 along the first direction X, the width M of the connection structure 62 along the first direction X is 1 mm to 2 mm. Exemplarily, the width M of the connection structure 62 is 1 mm, 1.5 mm or 2 mm, etc.

[0074] In some other embodiments, such as Figure 3A and Figure 4 shown, the first interval D5 is greater than twice the dimension D2 of the second main region 41 in the second direction and less than or equal to 2.5 times the dimension D2 of the second main region 41 in the second direction Y. That is, 2D2 < D5 ≤ 2.5D2. At this time, the two second main regions 41 of the second region 40 are respectively located within the first interval D5 of two adjacent first regions 30, and only two second main regions 41 are arranged within each first interval D5.

[0075] The second interval D6 is greater than twice the dimension D2 of the first main region 31 in the second direction Y and less than or equal to 2.5 times the dimension D2 of the first main region 31 in the second direction. That is, 2D2 < D6 ≤ 2.5D2. At this time, the two first main regions 31 of the first region 30 are respectively located within the second openings 44 of two adjacent second regions 40, and two first main regions 31 of two adjacent first regions 30 are arranged within one second opening 44. That is to say, two first main regions 31 can be arranged within each second opening 44.

[0076] 2D2 < D5 ≤ 2.5D2, and 2D2 < D6 ≤ 2.5D2. Not only can the two second main regions 41 of two adjacent second regions 40 that are close to each other be arranged within the first opening 34, and the two first main regions 31 of two adjacent first regions 30 that are close to each other be arranged within the second opening 44, but also it is beneficial to arrange an interval between the first main region 31 and the second main region 41, which is beneficial to subsequently separate the first region 30 and the second region 40 from the interval between the first main region 31 and the second main region 41.

[0077] Referring to Figure 3A , the substrate 2100 includes a plurality of first regions 30 arranged in sequence along the second direction Y, and a plurality of second regions 40 arranged in sequence along the second direction Y. The two first main regions 31 that respectively belong to two adjacent first regions 30 and have the minimum distance along the second direction Y are located within the second opening 44 of the same second region 40. The two second main regions 41 that respectively belong to two adjacent second regions 40 and have the minimum distance along the second direction Y are located within the first opening 34 of the same first region 30. Based on this, it is beneficial to improve the space utilization rate of the wiring substrate 2000.

[0078] Such as Figure 3AAs shown, the substrate 2100 further includes two third regions 60. Each third region 70 extends along the first direction X, and the third region 70 is located between the outermost first main region 30 and the second main region 40 along the second direction Y. The third region 70 is used to fill the gap between the outermost first region 30 and the second region 40, so that the substrate 2100 forms a regular shape, which is conducive to the stable connection between the outermost first region 30 and the second region 40.

[0079] Exemplarily, the two outermost sides of the substrate 2100 along the second direction Y can be the first region 30 or the second region 40 respectively. For example, as Figure 3A shown, both the upper side and the lower side of the substrate 2100 along the second direction Y are the first region 30, or, as Figure 3B shown, the upper side of the substrate 2100 along the second direction Y is the first region 30 and the lower side is the second region 40. Of course, both sides of the substrate 2100 along the second direction Y can also be the second region 40 (not shown in the figure); or the upper side is the second region 40 and the lower side is the first region 30 (not shown in the figure).

[0080] Continuing to refer to Figure 3A , between adjacent first regions 30 and second regions 40, between adjacent first regions 30 and third regions 70, between adjacent first regions 30 and first regions 30, between adjacent second regions 40 and second regions 40, and between adjacent second regions 40 and third regions 70, there are a plurality of through holes 61. There is a connection structure 62 between two adjacent through holes 61. The connection structure 62 is used to connect and fix adjacent first regions 30 and second regions 40, adjacent first regions 30 and third regions 70, adjacent first regions 30 and first regions 30, adjacent second regions 40 and second regions 40, and adjacent second regions 40 and third regions 70. The connection structure 62 connects the first region 30, the second region 40, and the third region 70 to form a whole, which is conducive to wiring on the first region 30 and the second region 40 of the substrate 2100 during the preparation of the wiring substrate. The connection structures 62 penetrate the substrate 2100 through the through holes 61, which is conducive to reducing the contact area between the first region 30, the second region 40, and the third region 70, and facilitating separating the first region 30 and the second region 40 during subsequent preparation to form independent structural members.

[0081] In some embodiments, such as Figure 3A and Figure 4As shown, each first trunk area 31 of the first area 30 and each second trunk area 41 of the second area 40 are provided with a plurality of electronic components 50 at intervals along the first direction X. Exemplarily, the electronic components 50 are provided in the middle of the first trunk area 31 along the second direction Y and in the middle of the second trunk area 41 along the second direction Y. The spacing between two adjacent electronic components 50 along the first direction X is D1. The width of the connection structure 62 along the direction perpendicular to the boundary of the first area 30 or the second area 40 connected to the connection structure 62 is M.

[0082] The line connecting the geometric centers of the plurality of electronic components 50 located in any first trunk area 31 or second trunk area 41 coincides with the midline of the first trunk area 31 or second trunk area 41 along the first direction X, and D1, D2 and M satisfy D2 = (D1-3M) / 3, or D1 = 3D2 + 3M. Figure 4 As shown, the distance between two electronic components 50 adjacent to each other along the second direction Y on two first trunk regions 31 belonging to the same first region 30 is equal to the size of one first trunk region 31 along the second direction Y (2*(1 / 2·D2)), the size of two second trunk regions 41 along the second direction Y (2*D2)) and the size of three connecting structures 62 along the second direction Y (3M). Moreover, since the size of the first trunk region 31 along the second direction Y and the size of the second trunk region along the second direction Y are both D2, the interval between two electronic components 50 adjacent to each other along the second direction Y on two first trunk regions 31 belonging to the same first region 30 is also D1, or the interval between two electronic components 50 adjacent to each other along the second direction Y on two second trunk regions 41 belonging to the same second region 40 is also D1. This makes the distribution density of the electronic components 50 in the first direction X and the second direction Y the same.

[0083] In some embodiments, Figure 3A As shown, the first connection area 32 of the first area 30 and the second connection area 42 of the second area 40 are both provided with a first connector 2200, and the orthographic projection of the first connector 2200 on the substrate 2100 only partially overlaps with the first connection area 32 or the second connection area 42, so that the first connector 2200 is electrically connected to the second connector on the adapter circuit board. The structural member formed by cutting the wiring substrate is connected to the adapter circuit board through the first connector 2200, which is conducive to simplifying the assembly process between the structural member and the adapter circuit board and improving the assembly efficiency.

[0084] like Figure 3A and Figure 4As shown, each first main area 31 of the first region 30 and each second main area 41 of the second region 40 are provided with a plurality of driving elements 51, and the driving elements 51 are configured to control at least one electronic element 50 in the same region (such as the same first main area 31 or the same second main area 42). For example, when the electronic element 50 is a light-emitting element (such as a mini-LED chip), the driving element 51 can be a micro integrated circuit chip. One driving element 51 can control a plurality of light-emitting elements, and the plurality of light-emitting elements can be connected in series, in parallel, or in a combination of series and parallel, or the plurality of light-emitting elements are independent of each other, which is not limited herein.

[0085] In some embodiments, as Figure 4 shown, each first main area 31 of the first region 30 and each second main area 41 of the second region 40 are provided with a plurality of fixing holes 52, and the fixing holes 52 are used to fixedly connect the structural members formed by the wiring substrate 2000 to other components, such as fixedly connecting the structural members to the backplane. The wiring substrate further includes encapsulation glue (not shown in the figure), and each encapsulation glue covers an electronic element 50 to protect the electronic element 50.

[0086] In some other embodiments, the embodiments of the present disclosure further provide a method for preparing a structural member. The preparation method includes S100 to S600.

[0087] S100, referring to Figure 6A , divide the first region 30, the second region 40, and the fourth region 60 on the substrate 2100.

[0088] Among them, the first region 30 includes two first main areas 31 and a first connection area 32. The two first main areas 31 both extend along the first direction X and have a first interval D5 along the second direction Y. The end portions of the first connection area 32 are respectively connected to the end portions (such as Figure 6A the left end portions in the figure) of the two first main areas 31 on the same side, and the first region 30 has a first opening 34.

[0089] The second region 40 includes two second main areas 41 and a second connection area 42. The two second main areas 41 both extend along the first direction X and have a second interval D6 along the second direction Y. The end portions of the second connection area 42 are respectively connected to the end portions (such as the right end portions in the figure) of the two second main areas 41 on the same side. The second region 40 has a second opening 44. The first direction X and the second direction Y intersect each other.

[0090] The orientation of the second opening 44 is opposite to that of the first opening 34. So that the first main area 31 can extend into the second opening 44, and the second main area 42 can extend into the first opening 34. One first main area 31 of the first area 30 is located in the second opening 44, and one second main area 41 of the second area 40 is located in the first opening 34, which is beneficial to increasing the space utilization rate of the substrate 2100.

[0091] The fourth area 60 is located between adjacent first areas 30 and second areas 40, between adjacent first areas 30 and first areas 30, and between adjacent second areas 40 and second areas 40. The fourth area 60 is used to form a cuttable area. In the subsequent preparation process of the subsequent structural members, the first area 30 and the second area 40 are cut along the fourth area 60 to form independent structural members respectively.

[0092] It can be understood that the first area 30 and the second area 40 can be the areas described in any of the above embodiments, which will not be elaborated here one by one. Hereinafter, only Figure 6A the shown first area 30 and second area 40 will be taken as examples for exemplary description.

[0093] S200, refer to Figure 6B , remove a partial area of the fourth area 60. So that the fourth area 60 forms a plurality of through holes 61 arranged at intervals, and a connecting structure 62 is formed between two adjacent through holes 61.

[0094] The through holes 61 penetrate through the substrate 2100, which is beneficial to reducing the connection area between the first area 30 and / or the second area 40, facilitating the subsequent separation of the first area 30 and the second area 40 to form independent structural members. The connecting structure 62 is used to connect and fix adjacent first areas 30 and / or second areas 40, which is beneficial to wiring on the first area 30 and the second area 40 of the substrate 2100 during the preparation process of the wiring substrate.

[0095] S300, wire the first area 30 and the second area 40.

[0096] That is to say, a circuit structure for transmitting electrical signals to electronic components 50, driving elements, and other electronic devices (such as the first connector, etc.) is formed on the first area 30 and the second area 40, including but not limited to forming at least one conductive layer and forming at least one insulating layer.

[0097] S400, refer to Figure 6C , arrange electronic components 50 on each first main area 31 of the first area 30 and each second main area 41 of the second area 40. That is, die bonding is performed on the first area 30 and the second area 40.

[0098] The electronic component 50 can be, for example, a light-emitting component, a sensor, or other components arranged in an array. When the electronic component 50 is a light-emitting component, the structural member is also a light-emitting structural member, and the light-emitting structural member can be used to form a backlight source in a display device. The light-emitting component has been described above and will not be elaborated here.

[0099] In some embodiments, after the electronic component 50 is disposed in each first main area 31 of the first area 30 and each second main area 41 of the second area 40 in S400, the method for preparing the structural member may further include encapsulating the electronic component 50. For example, when the electronic component 50 is a light-emitting component, the electronic component 50 can be encapsulated with a protective glue (such as OC glue or UV glue, etc.).

[0100] S500, as Figure 6C shown, mount the first connector 2200 on the first connection area 32 and the second connection area 42. It can also be said that in the first connection area 32 and the second connection area 42, the first connector 2200 is patch-mounted and bound to the first connection area 32 of the first area 30 or the second connection area 42 of the second area 40.

[0101] S600, cut the connection structure 62. As Figure 6D shown, remove the connection structure 62 so that any first area 30 and any second area 40 are independent of each other to form a structural member 500.

[0102] As Figure 6D shown, the structural member 500 includes two first sub-parts 510 extending along the first direction X. The two first sub-parts 510 are oppositely arranged along the second direction Y, and the two first sub-parts 510 have a third interval D7 along the second direction Y. The structural member 500 further includes a second sub-part 520 located within the first interval D7. The two ends of the second sub-part 520 along the second direction Y are respectively connected to two ends on the same side of the two first sub-parts 510. That is, the structural member 500 forms a U-shaped structure, and in the structural member 500, the third interval D7 is greater than the dimension D8 of the first sub-part 510 along the second direction Y.

[0103] In some embodiments, after any first area 30 and any second area 40 are independent of each other to form a structural member 500, the method for preparing the structural member 500 further includes:

[0104] S600, as Figure 7 and Figure 8 shown, provide an adapter circuit board 600 and assemble a plurality of structural members 500 on the adapter circuit board 600.

[0105] In the case where the structural member 500 is a light-emitting structural member, the above S600 assembling a plurality of structural members 500 on the adapter circuit board 600 can be used to form a light-emitting substrate. In the embodiment of the present disclosure, the structural member 500 is a U-shaped structure. Compared with a linear structural member, the U-shape can reduce the amount of structural members used, and reduce the amount of the first connector 2200 and the second connector 2300 used between the structural member 500 and the adapter circuit board 600, thereby helping to reduce the preparation cost of the light-emitting substrate composed of a plurality of structural members 500, and reducing the preparation cost of the display device 1000.

[0106] Moreover, compared with setting the structure 500 in a comb shape, setting the structure 500 in a U shape has better versatility and can be applied to backlight products of various sizes. When setting the light-emitting substrate, the number and arrangement density of the U-shaped light-emitting structures can be flexibly set according to the size of the light-emitting substrate.

[0107] See also Figure 8 , Figure 9A and Figure 9B The adapter circuit board 600 extends along the second direction Y, and a plurality of second connectors 2300 are disposed on the adapter circuit board 600. The first connector 2200 of each structural member 500 is connected to one second connector 2300.

[0108] In some embodiments, two adjacent structural members 500 along the first direction X are arranged in an axisymmetric manner on both sides of the adapter circuit board 600. This is conducive to improving the distribution uniformity of the structural members 500, and further improving the distribution uniformity of the electronic components 50 on the structural members 500.

[0109] For example, Figure 9A As shown, the second connectors 2300 are arranged in two rows along the first direction X on the adapter circuit board 600, and the adapter circuit board 600 is located between two adjacent structural members 500 along the first direction X. The two first connectors 2200 of the two structural members 500 are respectively connected to the two adjacent second connectors 2300 along the first direction X on the adapter circuit board 600.

[0110] Or, if Figure 9B As shown, the adapter circuit board 600 is provided with a plurality of second connectors 2300 along the second direction. The adapter circuit board 600 is located between two adjacent structural members 500 along the first direction X. The two first connectors 2200 of the two structural members 500 can be connected to one second connector 2300 at the same time.

[0111] In some embodiments, the first connector 2200 and the second connector 2300 may be board-to-board connectors (abbreviation: BTB connectors). The first connector 2200 and the second connector 2300 having a connection relationship have the same number of connection terminals, and the two are adaptively connected and fixed by plugging.

[0112] Exemplarily, as Figure 9A and Figure 9B shown, the adapter circuit board 600 may further include a connection area 610, and the connection area 610 is configured to be electrically connected to an external control circuit board through an FPC.

[0113] As described above, the foregoing are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure who thinks of changes or substitutions should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A structural member, characterized in that, include: Two first sub-sections, the two first sub-sections extend along a first direction and are arranged opposite to each other along a second direction, and the two first sub-sections have a third interval along the second direction; the first direction and the second direction intersect each other; a second sub-section, located in the third interval, wherein two ends of the second sub-section along the second direction are respectively connected to two ends of the two first sub-sections located on the same side; Wherein, the second sub-part is provided with a first connector.

2. The structural member according to claim 1, characterized in that, The first sub-section is provided with a plurality of electronic components and at least one driving component.

3. The structural member according to claim 2, wherein The distance between two adjacent electronic components along the first direction is D1, and the size of the first sub-portion along the second direction is D2; wherein D1 and D2 satisfy 1mm≤(D1-3D2) / 3≤2mm.

4. The structural member according to claim 2, characterized in that, The electronic component includes a light emitting component, and the driving component includes a micro integrated circuit chip; wherein the structural member further includes a plurality of packaging glues, each of which covers one of the electronic components.

5. The structural member according to claim 4, wherein One driving element is configured to control a plurality of the light-emitting elements, and the plurality of light-emitting elements controlled by the same driving element are connected in series, in parallel, in a combination of series and parallel, or are independent of each other.

6. The structural member according to any one of claims 1 to 5, characterized in that The first sub-section also includes a plurality of fixing holes, and the fixing holes are configured to be fixedly connected to other components.

7. A light-emitting substrate, characterized in that, include: A plurality of structural members as claimed in any one of claims 1 to 6; The adapter circuit board is connected to the first connector of the structural component.

8. The light-emitting substrate according to claim 7, wherein The adapter circuit board extends along the second direction, and a plurality of second connectors are arranged on the adapter circuit board, and the first connector of each of the structural members is connected to one of the second connectors.

9. The light-emitting substrate according to claim 8, wherein Two of the structural members adjacent to each other along the first direction are arranged on both sides of the adapter circuit board in an axisymmetric manner.

10. The light-emitting substrate according to claim 9, wherein, Two adjacent structural members along the first direction are respectively connected to two adjacent second connectors along the first direction on the adapter circuit board, or two adjacent structural members along the first direction are connected to the same second connector on the adapter circuit board.

11. The light-emitting substrate according to any one of claims 8 to 10, characterized in that, The first connector and the second connector are board-to-board connectors.

12. The light-emitting substrate according to any one of claims 7 to 10, characterized in that, The transfer circuit board also includes a connection area, and the connection area is configured to be electrically connected to an external control circuit board through a flexible circuit board.

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