Substrate processing apparatus

Abstract

The substrate processing apparatus includes: a plurality of polishing modules configured to polish a substrate; and a transport unit that moves the substrate between the plurality of polishing modules. The plurality of grinding modules includes a first module group and a second module group. In a plan view, the transport unit is located between the first module group and the second module group. The first module group is provided with a first upper side route and a first lower side route, and at least two grinding modules are adjacently arranged on the first upper side route and the first lower side route. The second module group is provided with a second upper side route and a second lower side route, and at least two grinding modules are adjacently arranged on the second upper side route and the second lower side route.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus. This application claims priority based on Japanese Patent Application No. 2022-197122 filed in Japan on December 9, 2022, and Japanese Patent Application No. 2022-197125 filed in Japan on December 9, 2022, and incorporates the content thereof herein by reference. Background Art

[0002] Conventionally, a substrate processing apparatus that removes minute defects by grinding a substrate has been known. For example, Patent Document 1 discloses an apparatus for grinding the beveled portion of a substrate. By such an apparatus, minute defects are removed from the substrate, whereby advantages such as suppressing the defect rate in semiconductor manufacturing can be obtained.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-63417

[0006] Problems to be Solved by the Invention

[0007] In addition, in the substrate processing apparatus as described above, it is desired to achieve a process of simultaneously grinding a plurality of substrates, that is, parallel processing.

[0008] Furthermore, in the substrate processing apparatus as described above, it is desired to efficiently achieve a process of simultaneously grinding a plurality of substrates, that is, parallel processing. Summary of the Invention

[0009] In view of such circumstances, an object of the present invention is to provide a substrate processing apparatus capable of performing parallel processing on a plurality of substrates.

[0010] Furthermore, in view of such circumstances, an object of the present invention is to provide a substrate processing apparatus capable of efficiently performing parallel processing on a plurality of substrates.

[0011] Means for Solving the Problems

[0012] In order to solve the above problems, the substrate processing apparatus according to Mode 1 of the present invention includes: a plurality of polishing modules that polish a substrate; and a transfer unit that moves the substrate between the plurality of polishing modules. The plurality of polishing modules includes a first module group and a second module group. In a plan view, the transfer unit is located between the first module group and the second module group. The first module group has a first upper route and a first lower route. At least two of the polishing modules are arranged adjacent to each other on the first upper route, at least two of the polishing modules are arranged adjacent to each other on the first lower route, and the first lower route is arranged below the first upper route. The second module group has a second upper route and a second lower route. At least two of the polishing modules are arranged adjacent to each other on the second upper route, at least two of the polishing modules are arranged adjacent to each other on the second lower route, and the second lower route is arranged below the second upper route.

[0013] Further, the substrate processing apparatus according to Mode 2 of the present invention is the substrate processing apparatus according to Mode 1, wherein the polishing module has a housing exposed to the outside.

[0014] Further, the substrate processing apparatus according to Mode 3 of the present invention is the substrate processing apparatus according to Mode 2, wherein an opening is formed in the housing for the substrate to move between the transfer unit and the polishing module.

[0015] Further, the substrate processing apparatus according to Mode 4 of the present invention is the substrate processing apparatus according to any one of Modes 2 to 3, wherein a filter fan unit is provided in the housing.

[0016] Further, the substrate processing apparatus according to Mode 5 of the present invention is the substrate processing apparatus according to any one of Modes 2 to 4, wherein the polishing module is connected to a side surface of the transfer unit.

[0017] Further, the substrate processing apparatus according to Mode 6 of the present invention is the substrate processing apparatus according to any one of Modes 1 to 5, wherein the polishing module is configured to be detachable.

[0018] Further, the substrate processing apparatus according to Mode 7 of the present invention is the substrate processing apparatus according to Mode 6, wherein in at least one of the first upper route, the first lower route, the second upper route, and the second lower route, the arrangement order of the at least two polishing modules can be changed.

[0019] Further, the substrate processing apparatus according to Mode 8 of the present invention is the substrate processing apparatus according to any one of Modes 1 to 7, wherein the plurality of polishing modules includes: at least one surface polishing module that polishes a surface of the substrate, at least one bevel polishing module that polishes a bevel portion of the substrate, and at least one back surface polishing module that polishes a back surface of the substrate.

[0020] In order to solve the above problems, the substrate processing apparatus according to Mode 9 of the present invention includes: a transfer unit having an upper transfer machine for transferring a first substrate and a lower transfer machine for transferring a second substrate; an upper route including a plurality of polishing modules arranged in the transfer direction of the upper transfer machine for polishing the first substrate; and a lower route including a plurality of polishing modules arranged in the transfer direction of the lower transfer machine for polishing the second substrate. The polishing module is detachable with respect to the transfer unit. The upper route and the lower route are arranged in parallel at different height positions. The upper transfer machine performs the transfer of the first substrate between itself and the upper route, and the lower transfer machine performs the transfer of the second substrate between itself and the lower route.

[0021] Furthermore, the substrate processing apparatus according to Mode 10 of the present invention is the same as the substrate processing apparatus according to Mode 9, wherein the transfer unit further includes an upper moving track along the transfer direction of the upper transfer machine and a lower moving track along the transfer direction of the lower transfer machine. The upper transfer machine can move along the upper moving track, and the lower transfer machine can move along the lower moving track.

[0022] Furthermore, the substrate processing apparatus according to Mode 11 of the present invention is the same as the substrate processing apparatus according to Mode 9 or Mode 10, wherein a plurality of the transfer units are provided and arranged in the transfer direction of the upper transfer machine and the lower transfer machine.

[0023] Furthermore, the substrate processing apparatus according to Mode 12 of the present invention is the same as the substrate processing apparatus according to any one of Modes 9 to 11, wherein the polishing modules constituting the upper route include: at least one surface polishing module for polishing the surface of the first substrate; at least one back surface polishing module for polishing the back surface of the first substrate; and at least one bevel polishing module for polishing the bevel portion of the first substrate. The polishing modules constituting the lower route include: at least one surface polishing module for polishing the surface of the second substrate; at least one back surface polishing module for polishing the back surface of the second substrate; and at least one bevel polishing module for polishing the bevel portion of the second substrate.

[0024] Advantageous Effects of the Invention

[0025] According to the above mode of the present invention, a substrate processing apparatus capable of performing parallel processing on a plurality of substrates can be provided.

[0026] Furthermore, according to the above mode of the present invention, a substrate processing apparatus capable of efficiently performing parallel processing on a plurality of substrates can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a perspective view showing a substrate processing apparatus according to an embodiment of the present invention.

[0028] Figure 2 It is an exploded view of a substrate processing apparatus showing an embodiment of the present invention.

[0029] Figure 3 It is a plan view of a substrate processing apparatus showing an embodiment of the present invention.

[0030] Figure 4 It is along Figure 3 The sectional view taken along line IV-IV shown is a schematic view showing a surface grinding module.

[0031] Figure 5 It is a schematic view showing a bevel grinding module of an embodiment of the present invention.

[0032] Figure 6 It is a schematic view showing a back grinding module of an embodiment of the present invention.

[0033] Figure 7 It is a configuration diagram of a substrate processing apparatus showing an embodiment of the present invention.

[0034] Figure 8 It is a configuration diagram of a first modification of a substrate processing apparatus showing an embodiment of the present invention.

[0035] Figure 9 It is a configuration diagram of a second modification of a substrate processing apparatus showing an embodiment of the present invention.

[0036] Figure 10 It is a configuration diagram of a third modification of a substrate processing apparatus showing an embodiment of the present invention. Detailed Embodiment

[0037] The substrate processing apparatus according to the embodiment of the present invention will be described below with reference to the drawings.

[0038] As Figures 1 to 3 shown, the substrate processing apparatus 1 of the present embodiment includes an EFEM 10, a cleaning and drying unit 20, a processing unit 30, a control unit 40, a plurality of load ports 51, and a measurement unit 53. As Figure 3 shown, the EFEM 10, the cleaning and drying unit 20, and the processing unit 30 each have at least one transfer robot 52. The EFEM 10 and the cleaning and drying unit 20 are housed in a first housing H1. The control unit 40 is housed in a second housing H2. The control unit 40 controls the operation of the substrate processing apparatus 1 in a unified manner.

[0039] As Figure 1As shown, the EFEM 10, cleaning and drying unit 20, processing unit 30, and control unit 40 of the present embodiment are arranged in one direction. Further, the EFEM 10, cleaning and drying unit 20, processing unit 30, and control unit 40 are arranged in this order in this direction.

[0040] (Direction definition)

[0041] In this specification, the direction in which the EFEM 10, cleaning and drying unit 20, processing unit 30, and control unit 40 are arranged is referred to as the transfer direction Y. The transfer direction Y is also the direction in which the later-described routes L1U, L1D, L2U, and L2D extend. The direction from the EFEM 10 toward the control unit 40 along the transfer direction Y is referred to as the +Y direction or the away side. The direction opposite to the +Y direction is referred to as the -Y direction or the near side. One direction intersecting the transfer direction Y is referred to as the left-right direction X. One direction along the left-right direction X is referred to as the +X direction or the right side. The direction opposite to the +X direction is referred to as the -X direction or the left side. The direction intersecting both the left-right direction X and the transfer direction Y is referred to as the up-down direction Z. One direction along the up-down direction Z is referred to as the +Z direction or the upper side. The direction opposite to the +Z direction is referred to as the -Z direction or the lower side. For example, the up-down direction Z is the gravitational direction (vertical direction), and the left-right direction X and the transfer direction Y are horizontal directions. However, the up-down direction Z may be inclined with respect to the gravitational direction, and the left-right direction X and the transfer direction Y may be inclined with respect to the horizontal direction.

[0042] As Figures 1 to 3 shown, the processing unit 30 of the present embodiment includes a plurality of (two in the illustrated example) polishing modules M and a transfer unit C (first transfer unit C1). Each polishing module M polishes the substrate W to remove defects on the substrate W. Examples of "defects on the substrate W" include particles, metal fixed to the substrate W, dirt buried (filled) in the substrate W, and fine irregularities on the substrate W.

[0043] In the present embodiment, the plurality of polishing modules M are respectively any one of a surface polishing module M1, a bevel polishing module M2, and a back polishing module M3. The surface polishing module M1 is a module that polishes the surface of the substrate W. The bevel polishing module M2 is a module that polishes the bevel portion (outer peripheral portion) of the substrate W. The back polishing module M3 is a module that polishes the back surface of the substrate W.

[0044] A plurality of grinding modules M includes a first module group G1 and a second module group G2. In the illustrated example, the first module group G1 and the second module group G2 each have six grinding modules M. When viewed from above, the transfer unit C (the first transfer unit C1) is located between the first module group G1 and the second module group G2. More specifically, the first module group G1 and the second module group G2 are arranged so as to sandwich the transfer unit C (the first transfer unit C1) therebetween in the left-right direction X. The first module group G1 is arranged on the right side (+X side) of the transfer unit C (the first transfer unit C1). The second module group G2 is arranged on the left side (-X side) of the transfer unit C (the first transfer unit C1).

[0045] The first module group G1 has a first upper route L1U and a first lower route L1D arranged below the first upper route L1U. The second module group G2 has a second upper route L2U and a second lower route L2D arranged below the second upper route L2U. In each of the routes L1U, L1D, L2U, and L2D, a plurality of (three in the illustrated example) grinding modules M are arranged adjacent to each other in the transfer direction Y. More specifically, in each of the routes L1U, L1D, L2U, and L2D of the present embodiment, the surface grinding module M1, the bevel grinding module M2, and the back grinding module M3 are arranged in this order from the far side (+Y side) toward the near side (-Y side).

[0046] The first upper route L1U and the first lower route L1D are arranged side by side at different height positions. That is, the first upper route L1U and the first lower route L1D are arranged parallel to each other vertically. The second upper route L2U and the second lower route L2D are arranged side by side at different height positions. That is, the second upper route L2U and the second lower route L2D are arranged parallel to each other vertically. The first upper route L1U and the second upper route L2U are examples of upper routes, respectively. The first lower route L1D and the second lower route L2D are examples of lower routes, respectively.

[0047] As Figures 4 to 6 shown, each grinding module M has a housing 31 and a processing device 32 housed in the housing 31. The housing 31 is not housed in the outer casings H1, H2 but is exposed to the outside of the substrate processing apparatus 1.

[0048] Each grinding module M is connected to the side surface of the transfer unit C (the first transfer unit C1) (the surface facing outward in the left-right direction X in the illustrated example). Also, each grinding module M of the present embodiment is configured to be detachable from the transfer unit C. Furthermore, the grinding modules M1, M2, and M3 have substantially the same outer shape. Thus, in each of the routes L1U, L1D, L2U, and L2D, the order in which the grinding modules M1, M2, and M3 are arranged can be changed. In addition, the so-called "substantially the same outer shape" also includes the case where the outer shapes are the same as each other ignoring manufacturing errors.

[0049] An opening 31a is formed in the housing 31 for moving the substrate W between the transfer unit C and the polishing module M. In the housing 31 of the present embodiment, a shutter S that can switch between a closed state and an open state is provided. The closed state is a state where the shutter S closes the opening 31a. The open state is a state where the shutter S does not close the opening 31a.

[0050] Furthermore, in the housing 31 of the present embodiment, a filter fan unit F is provided. The filter fan unit F has a clean air filter such as a HEPA filter, an ULPA filter, or a chemical filter. The filter fan unit F continuously blows clean air from which particles, toxic vapors, and toxic gases have been removed into the interior of the housing 31. Thereby, the filter fan unit F keeps the interior of the housing 31 in a clean state.

[0051] The specific configuration of the processing device 32 may also vary depending on the type of the polishing module M. That is, the configuration of the processing device 32 included in the surface polishing module M1, the configuration of the processing device 32 included in the bevel polishing module M2, and the configuration of the processing device 32 included in the backside polishing module M3 may also be different from each other. The configuration of the processing device 32 included in each of the polishing modules M1, M2, and M3 will be schematically described below. In addition, the configuration of the processing device 32 described below is only an example and can be appropriately changed.

[0052] As Figure 4 shown, for example, the surface polishing module M1 includes a rotary stage 32a1 and a polishing head 32a2 as the processing device 32. The rotary stage 32a1 is configured to be rotatable about a rotation axis AX1. The substrate W is placed on the rotary stage 32a1. The polishing head 32a2, for example, has a polishing belt 32a3 for polishing the surface of the substrate W. Abrasive grains are provided on the surface of the polishing belt 32a3. The polishing head 32a2 is configured to be movable parallel to and rotatable on the surface of the substrate W, for example.

[0053] In a state where the rotary stage 32a1 and the substrate W rotate about the rotation axis AX1 and the polishing belt 32a3 contacts the surface of the substrate W, the polishing head 32a2 performs parallel movement and rotational movement. Thereby, the polishing belt 32a3 polishes the surface of the substrate W. Thereby, defects located on the surface of the substrate W are removed. In other words, the surface of the substrate W is processed.

[0054] As Figure 5As shown, the bevel grinding module M2 has, for example, a rotary stage 32b1 and a grinding head 32b2 as the processing device 32. The rotary stage 32b1 is configured to be rotatable about the rotation axis AX2. The substrate W is placed on the rotary stage 32b1. The grinding head 32b2 has, for example, a grinding belt 32b3 for grinding the bevel portion (outer peripheral portion) of the substrate W. Abrasive grains are provided on the surface of the grinding belt 32b3. The grinding head 32b2 is configured to be movable along the bevel portion of the substrate W, for example.

[0055] In a state where the rotary stage 32b1 and the substrate W rotate about the rotation axis AX2 and the grinding belt 32b3 contacts the bevel portion of the substrate W, the grinding head 32b2 moves along the bevel portion. Thereby, the grinding belt 32b3 grinds the bevel portion of the substrate W. Thereby, defects located in the bevel portion of the substrate W are removed. In other words, the bevel portion of the substrate W is processed.

[0056] As Figure 6 shown, the back grinding module M3 has, for example, a plurality of holding portions 32c1 and a plurality of grinding heads 32c2 as the processing device 32. The plurality of holding portions 32c1 hold the substrate W in a state where the substrate W can rotate about the central axis AX3a of the substrate W. Specifically, a part (rotary portion) of each holding portion 32c1 is configured to rotate about the central axis AX3b. Then, the rotary portion rotates about the central axis AX3b while contacting the outer peripheral portion of the substrate W. Thereby, the substrate W rotates about the central axis AX3a. The grinding head 32c2 has, for example, a grinding belt 32c3 for grinding the back surface of the substrate W. Abrasive grains are provided on the surface of the grinding belt 32c3. The plurality of grinding heads 32c2 are arranged at intervals along the back surface of the substrate W, for example. Each grinding head 32c2 can also be configured to be movable along the back surface of the substrate W.

[0057] By the action of the holding portion 32c1, the substrate W rotates about the central axis AX3a and the grinding belt 32c3 contacts the back surface of the substrate W. Thereby, the grinding belt 32c3 grinds the back surface of the substrate W. Thereby, defects located on the back surface of the substrate W are removed. In other words, the back surface of the substrate W is processed.

[0058] The surface roughness of the grinding belt in each of the surface grinding module M1, the bevel grinding module M2, and the back grinding module M3 can be determined according to the characteristics required for the substrate W.

[0059] The transfer unit C (first transfer unit C1) moves the substrate W between a plurality of polishing modules M. A tipping prevention means for preventing the transfer unit C from tipping over may also be provided in the transfer unit C. Examples of the tipping prevention means include feet for fixing the transfer unit C to the installation surface (floor surface, ground surface, etc.) and other fixing means. Alternatively, the transfer unit C can be prevented from tipping over by making the weight of the transfer unit C sufficiently greater than the weight of the polishing module M.

[0060] As Figure 4 shown, the transfer unit C has a transporter 52 for transferring the substrate W. The transporter 52 has, for example, an arm 52a and a palm part 52b. The transporter 52 may also have a plurality of arms 52a and a plurality of palm parts 52b. As will be described in detail later, the transfer unit C (first transfer unit C1) may also have two or more transporters 52, which include an upper transporter 52U and a lower transporter 52D. The upper transporter 52U moves the substrate W in the upper routes L1U, L2U. The lower transporter 52D moves the substrate W in the lower routes L1D, L2D.

[0061] As Figure 2 and Figure 4 shown, the transfer unit C has an opening Ca communicating with the opening 31a provided in the housing 31. The transporter 52 inserts the arm 52a and the palm part 52b into the inside of the housing 31 or pulls them out from the inside of the housing 31 through these openings Ca, 31a. Thereby, the substrate W is fed into the housing 31 or taken out from it.

[0062] In addition, in the illustrated example, the opening 31a of the housing 31 and the opening Ca of the transfer unit C are in one-to-one correspondence, but the correspondence between the opening 31a and the opening Ca is not limited to this and can be changed as appropriate. For example, one opening Ca may be provided for a plurality of openings 31a. Also, the above-mentioned baffle S may be provided not at the opening 31a of the housing 31 but at the opening Ca of the transfer unit C.

[0063] As Figure 7 shown, the transfer unit C (first transfer unit C1) includes two or more transporters 52, an upper movement track 61, and a lower movement track 62. The two or more transporters 52 include an upper transporter 52U (first transporter 52U) and a lower transporter 52D (second transporter 52D).

[0064] The upper transfer machine 52U moves the substrate W along the upper routes L1U and L2U. The substrate W moving along the upper routes L1U and L2U is referred to as the "first substrate W1". The first substrate W1 is also the substrate W transported by the upper transfer machine 52U. The lower transfer machine 52D moves the substrate W along the lower routes L1D and L2D. The substrate W moving along the lower routes L1D and L2D is referred to as the "second substrate W2". The second substrate W2 is also the substrate W transported by the lower transfer machine 52D.

[0065] The upper transfer machine 52U can transfer the first substrate W1 to and from the grinding modules M that make up the upper routes L1U and L2U. The palm part 52b of the upper transfer machine 52U (refer to Figure 4 ) holds the first substrate W1. The arm 52a is connected to the palm part 52b (refer to Figure 4 ). The arm 52a can, for example, move the palm part 52b holding the first substrate W1 within a horizontal plane. The arm 52a can carry the first substrate W1 into the grinding modules M that make up the upper routes L1U and L2U. The arm 52a can carry the first substrate W1 out of the grinding modules M that make up the upper routes L1U and L2U.

[0066] The lower transfer machine 52D can transfer the second substrate W2 to and from the grinding modules M that make up the lower routes L1D and L2D. The palm part 52b of the lower transfer machine 52D (refer to Figure 4 ) holds the second substrate W2. The arm 52a is connected to the palm part 52b (refer to Figure 4 ). The arm 52a can, for example, move the palm part 52b holding the second substrate W2 within a horizontal plane. The arm 52a can carry the second substrate W2 into the grinding modules M that make up the lower routes L1D and L2D. The arm 52a can carry the second substrate W2 out of the grinding modules M that make up the lower routes L1D and L2D.

[0067] The upper moving track 61 is arranged along the conveying direction Y of the upper transfer machine 52U. The upper transfer machine 52U can move along the upper moving track 61. When the upper transfer machine 52U transfers the first substrate W1 to and from the grinding modules M that make up the upper routes L1U and L2U, the position of the upper transfer machine 52U in the conveying direction Y can be adjusted along the upper moving track 61 as required.

[0068] The lower moving track 62 is arranged along the conveying direction Y of the lower transfer machine 52D. The lower transfer machine 52D can move along the lower moving track 62. When the lower transfer machine 52D transfers the second substrate W2 to and from the grinding modules M that make up the lower routes L1D and L2D, the position of the lower transfer machine 52D in the conveying direction Y can be adjusted along the lower moving track 62 as required.

[0069] AsFigure 3 As shown, the cleaning and drying unit 20 has a plurality of cleaning sections 21A to 21C, a plurality of drying sections 22, and a transfer unit C (second transfer unit C2). The plurality of cleaning sections 21A to 21C and the plurality of drying sections 22 are provided corresponding to the respective routes L1U, L1D, L2U, and L2D of the processing unit 30. In the illustrated example, three cleaning sections 21A, 21B, and 21C and one drying section 22 are provided for each of the routes L1U, L1D, L2U, and L2D. The cleaning sections 21A to 21C and the drying section 22 are arranged and configured in this order from the far side (+Y side) to the near side (-Y side). The second transfer unit C2 moves the substrate W between the plurality of cleaning sections 21A to 21C and the drying section 22 by the transfer machine 52. The configuration of the second transfer unit C2 may be the same as that of the first transfer unit C1.

[0070] Next, based on Figure 3 an example of the processing of the substrate W by the substrate processing apparatus 1 having the above configuration will be described.

[0071] First, the substrate W is placed on the loading port 51 by a worker or the like. The substrate W placed on the loading port 51 is transferred to the surface grinding module M1 by the transfer machine 52 of the EFEM 10, the transfer machine 52 of the second transfer unit C2, and the transfer machine 52 of the first transfer unit C1. The surface grinding module M1 is the grinding module M located on the farthest side (+Y side). At this time, the substrate W is transferred to any one of the routes L1U, L1D, L2U, and L2D. The surface of the substrate W is ground by the surface grinding module M1.

[0072] The surface of the substrate W (first substrate W1) is ground by the surface grinding module M1 via the upper routes L1U and L2U (see Figure 2 and Figure 7 ). The substrate W (first substrate W1) whose surface has been ground by the surface grinding module M1 is transferred to the bevel grinding module M2 located on the same route by the transfer machine 52 (upper transfer machine 52U) of the first transfer unit C1. The bevel portion of the substrate W (first substrate W1) is ground by the bevel grinding module M2. The substrate W (first substrate W1) whose bevel portion has been ground by the bevel grinding module M2 is transferred to the back grinding module M3 located on the same route by the transfer machine 52 (upper transfer machine 52U). The back surface of the substrate W (first substrate W1) is ground by the back grinding module M3. The substrate W (first substrate W1) whose back surface has been ground by the back grinding module M3 is transferred to the cleaning section 21A by the transfer machine 52 of the first transfer unit C1 and the transfer machine 52 of the second transfer unit C2 (see Figure 3 ). The substrate W is cleaned by the cleaning section 21A.

[0073] The substrate W (second substrate W2) is polished on its surface by the surface polishing module M1 via the lower routes L1D and L2D (refer to Figure 2 and Figure 7 ). The substrate W (second substrate W2) polished on its surface by the surface polishing module M1 is transported by the transporter 52 (lower transporter 52D) of the first transfer unit C1 to the bevel polishing module M2 located on the same route. The substrate W (second substrate W2) is polished on its bevel portion by the bevel polishing module M2. The substrate W (second substrate W2) polished on its bevel portion by the bevel polishing module M2 is transported by the transporter 52 (lower transporter 52D) to the back surface polishing module M3 located on the same route. The substrate W (second substrate W2) is polished on its back surface by the back surface polishing module M3. The substrate W (second substrate W2) polished on its back surface by the back surface polishing module M3 is transported by the transporter 52 of the first transfer unit C1 and the transporter 52 of the second transfer unit C2 to the cleaning unit 21A (refer to Figure 3 ). The substrate W is cleaned by the cleaning unit 21A.

[0074] The substrate W cleaned by the cleaning unit 21A is transported by the transporter 52 of the second transfer unit C2 to the cleaning unit 21B and then cleaned by the cleaning unit 21B. The substrate W cleaned by the cleaning unit 21B is transported by the transporter 52 of the second transfer unit C2 to the cleaning unit 21C and then cleaned by the cleaning unit 21C. The substrate W cleaned by the cleaning unit 21C is transported by the transporter 52 of the second transfer unit C2 to the drying unit 22 and dried by the drying unit 22. The substrate W dried by the drying unit 22 is transported by the transporter 52 of the EFEM 10 to the measuring unit 53. The measuring unit 53 measures the state of the defects remaining on the substrate W. The substrate W measured by the measuring unit 53 is taken out to the load port 51 by the transporter 52 of the EFEM 10. In addition, the substrate processing apparatus 1 may also have a temporary placement table for temporarily placing the substrate W when the transporter 52 transports the substrate W.

[0075] As described above, the substrate processing apparatus 1 of the present embodiment includes a plurality of polishing modules M for polishing the substrate W and a transfer unit C (first transfer unit C1) for moving the substrate W between the plurality of polishing modules M. The plurality of polishing modules M include a first module group G1 and a second module group G2. In a plan view, the transfer unit C is located between the first module group G1 and the second module group G2. The first module group G1 has a first upper route L1U and a first lower route L1D. A plurality of polishing modules M are arranged adjacent to each other in the first upper route L1U. The first lower route L1D is located below the first upper route L1U and a plurality of polishing modules M are arranged adjacent to each other therein. The second module group G2 has a second upper route L2U and a second lower route L2D. A plurality of polishing modules M are arranged adjacent to each other in the second upper route L2U. The second lower route L2D is located below the second upper route L2U and a plurality of polishing modules M are arranged adjacent to each other therein.

[0076] With this configuration, parallel processing of the substrate W can be achieved using the four routes L1U, L1D, L2U, and L2D, and the processing speed of the substrate W can be increased. Also, since the substrate W is polished, defects that cannot be removed by non-contact cleaning with chemical liquid or the like or by processing with a brush or the like can be removed.

[0077] Also, the polishing module M has a housing 31 exposed to the outside. In other words, the polishing module M is not housed in the outer casings H1, H2. With this configuration, it is easy to implement a configuration in which the polishing module M can be attached to and detached from the transfer unit C.

[0078] Also, an opening 31a is formed in the housing 31 for moving the substrate W between the transfer unit C and the polishing module M. With this configuration, the substrate W can be smoothly moved between the transfer unit C and the polishing module M.

[0079] Also, a filter fan unit F is provided in the housing 31. With this configuration, the air flow can be independently controlled in each polishing module M, and the state of the polishing module M can be kept clean.

[0080] Also, the polishing module M is connected to the side surface of the transfer unit C. With this configuration, it is easy to implement a configuration in which the polishing module M can be attached to and detached from the transfer unit C.

[0081] Also, the polishing module M can also be configured to be detachable. With this configuration, the polishing module M can be removed as needed, and maintenance and replacement can be performed.

[0082] Also, in the first upper route L1U, the first lower route L1D, the second upper route L2U, and the second lower route L2D, the arrangement order of the plurality of polishing modules M can be changed respectively. According to this configuration, the order of the processing performed on the substrate W can be changed by changing the arrangement order of the polishing modules M.

[0083] Further, the plurality of grinding modules M include: at least one surface grinding module M1 for grinding the surface of the substrate W; at least one bevel grinding module M2 for grinding the bevel portion of the substrate W; and at least one back grinding module M3 for grinding the back surface of the substrate W. With this configuration, a substrate processing apparatus 1 capable of grinding (processing) the surface, bevel portion, and back surface of the substrate W in one apparatus can be provided.

[0084] Further, as described above, the substrate processing apparatus 1 of the present embodiment can perform parallel processing on the substrate W using the upper routes L1U, L2U and the lower routes L1D, L2D, thereby improving the processing speed of the substrate W. Further, since the substrate W is subjected to a grinding process, defects that cannot be removed by non-contact cleaning with chemical liquid or the like or by processing with a brush or the like can be removed.

[0085] The transfer unit C (first transfer unit C1) includes an upper transfer machine 52U and a lower transfer machine 52D. The upper transfer machine 52U exchanges the substrate W (first substrate W1) between the upper routes L1U, L2U. The lower transfer machine 52D exchanges the substrate W (second substrate W2) between the lower routes L1D, L2D. With this configuration, the substrate processing apparatus 1 can perform parallel processing on the first substrate W1 and the second substrate W2. Therefore, the processing efficiency of the substrate W can be improved.

[0086] The transfer unit C (first transfer unit C1) includes an upper moving rail 61 and a lower moving rail 62. With this configuration, the substrate processing apparatus 1 can adjust the position of the transfer machine 52 (upper transfer machine 52U and lower transfer machine 52D) in the transfer direction Y. Therefore, the transfer machine 52 can be arranged at a position suitable for the exchange of the substrate W. Therefore, the substrate W can be easily exchanged between the transfer machine 52 and the grinding module M.

[0087] The grinding modules M constituting the upper routes L1U, L2U include a surface grinding module M1, a bevel grinding module M2, and a back grinding module M3. The grinding modules M constituting the lower routes L1D, L2D include a surface grinding module M1, a bevel grinding module M2, and a back grinding module M3. With this configuration, a substrate processing apparatus 1 capable of grinding (processing) the surface, bevel portion, and back surface of the substrate W (first substrate W1 and second substrate W2) in one apparatus can be provided.

[0088] In the first upper route L1U, the first lower route L1D, the second upper route L2U, and the second lower route L2D, the order of processing the substrate W in the plurality of grinding modules M can be arbitrarily set. For example, the substrate W can also be processed in the order of the surface grinding module M1, the bevel grinding module M2, and the back grinding module M3. Or, by changing the order in which the transfer machine 52 transfers the substrate W, the processing can also be performed in the order of the back grinding module M3, the bevel grinding module M2, and the surface grinding module M1. Thus, without changing the configuration of the plurality of grinding modules M, the order of processing the substrate W in the grinding modules M can be arbitrarily set. The transfer order of the substrate W can be set by the control unit 40.

[0089] Figure 8 FIG. is a configuration diagram of a substrate processing apparatus 1A showing a first modified example of the substrate processing apparatus 1. Figure 9 FIG. is a configuration diagram of a substrate processing apparatus 1B showing a second modified example of the substrate processing apparatus 1. Figure 10 FIG. is a configuration diagram of a substrate processing apparatus 1C showing a third modified example of the substrate processing apparatus 1.

[0090] As Figures 8 to 10 shown, the processing unit 30 of the substrate processing apparatuses 1A to 1C includes a plurality of transfer units C, and routes L1U, L1D, L2U, and L2D. The number of grinding modules M constituting each of the routes L1U, L1D, L2U, and L2D is equal to the number of transfer units C.

[0091] As Figure 8 shown, the processing unit 30 (processing unit 30A) of the substrate processing apparatus 1A includes two transfer units C (C11, C12) and routes L1U, L1D, L2U, and L2D. The number of grinding modules M constituting the routes L1U, L1D, L2U, and L2D is two each. The two transfer units C11 and C12 are arranged in the transfer direction Y.

[0092] As Figure 9 shown, the processing unit 30 (processing unit 30B) of the substrate processing apparatus 1B includes three transfer units C (C11, C12, C13) and routes L1U, L1D, L2U, and L2D. The number of grinding modules M constituting the routes L1U, L1D, L2U, and L2D is three each. The three transfer units C11, C12, and C13 are arranged in the transfer direction Y.

[0093] As Figure 10As shown, the processing unit 30 (processing unit 30C) of the substrate processing apparatus 1C includes four transfer units C (C11, C12, C13, C14) and routes L1U, L1D, L2U, and L2D. The number of polishing modules M that make up the routes L1U, L1D, L2U, and L2D is four each. The four transfer units C11, C12, C13, and C14 are arranged in the transfer direction Y. In addition, the number of transfer units C is not particularly limited. The number of transfer units C can be one or more. Also, a plurality of transfer units C can also be arranged in the transfer direction Y. The so-called plurality means any number of two or more.

[0094] According to the substrate processing apparatuses 1A to 1C, the transfer units with the optimal configuration can be selected according to the configuration of the routes L1U, L1D, L2U, and L2D. In the substrate processing apparatuses 1A to 1C, the transfer units can be configured appropriately. Therefore, miniaturization of the apparatus and efficiency of processing can be achieved.

[0095] The number of the upper transfer machine and the lower transfer machine can each be one in one transfer unit C. The number of the upper transfer machine and the lower transfer machine can also each be one in a plurality of transfer units C.

[0096] In addition, the technical scope of the present invention is not limited to this embodiment, and various changes can be made as long as the gist of the present invention is not deviated from.

[0097] For example, the arrangement of the polishing module M described in this embodiment is only an example and can be changed appropriately. Also, the substrate processing apparatus 1 may not have any one (or two) of the surface polishing module M1, the bevel polishing module M2, and the back polishing module M3. That is, the substrate processing apparatus 1 may have only one type or only two types of polishing modules M. Also, the substrate processing apparatus 1 may have a polishing module M that is different from any one of the surface polishing module M1, the bevel polishing module M2, and the back polishing module M3.

[0098] Also, although the substrate processing apparatus 1 in this embodiment includes a measurement unit 53 that measures the defect state remaining on the substrate W after processing such as polishing, the example of the substrate processing apparatus 1 is not limited to this. For example, a measurement unit that measures the state of the processing performed by the polishing module M can be provided separately in each of the plurality of polishing modules M.

[0099] Also, the number of polishing modules M included in each of the routes L1U, L1D, L2U, and L2D is not limited to the illustrated example and can be changed appropriately.

[0100] Also, there may be routes L1U, L1D, L2U, and L2D in which the arrangement order of the polishing modules M cannot be changed.

[0101] Further, the polishing module M may also not be configured to be detachable from the transfer unit C.

[0102] Further, the filter fan unit F may not be provided in each housing 31. For example, one filter fan unit F may be provided for a plurality of housings 31.

[0103] Further, the housing 31 may not be exposed to the outside. In other words, the housing 31 may be housed in the outer casings H1 and H2.

[0104] In the substrate processing apparatus 1 of the present embodiment, the transfer unit C (first transfer unit C1) includes the upper moving rail 61 and the lower moving rail 62, but the substrate processing apparatus may also be configured without the moving rails.

[0105] In the substrate processing apparatus 1 of the present embodiment, the number of the upper transfer machines 52U and the lower transfer machines 52D is one each, but the number of the upper transfer machines and the lower transfer machines may each be plural (any number of two or more). When there are a plurality of upper transfer machines, the first substrate may be transferred between the upper transfer machines. When there are a plurality of lower transfer machines, the second substrate may be transferred between the lower transfer machines.

[0106] In addition, within the scope not departing from the gist of the present invention, the constituent elements in the above-described embodiment may be appropriately replaced with known constituent elements, and the above-described embodiment or modification may be appropriately combined.

[0107] Reference Signs

[0108] 1: Substrate processing apparatus 31: Housing 31a: Opening 52U: Upper transfer machine 52D: Lower transfer machine 61: Upper moving rail 62: Lower moving rail C, C11, C12, C13, C14: Transfer unit M: Polishing module M1: Surface polishing module M2: Bevel polishing module M3: Back polishing module F: Filter fan unit G1: First module group G2: Second module group L1U: First upper route (upper route) L1D: First lower route (lower route) L2U: Second upper route (upper route) L2D: Second lower route (lower route) W1: First substrate W2: Second substrate Y: Transfer direction.

Claims

1. A substrate processing apparatus, characterized in that, Comprising: A plurality of grinding modules for grinding a substrate; and A transfer unit for moving the substrate between the plurality of grinding modules, The plurality of grinding modules includes a first module group and a second module group, In a plan view, the transfer unit is located between the first module group and the second module group, The first module group has a first upper route and a first lower route. At least two of the grinding modules are arranged adjacent to each other on the first upper route, and at least two of the grinding modules are arranged adjacent to each other on the first lower route. And the first lower route is arranged below the first upper route, The second module group has a second upper route and a second lower route. At least two of the grinding modules are arranged adjacent to each other on the second upper route, and at least two of the grinding modules are arranged adjacent to each other on the second lower route. And the second lower route is arranged below the second upper route.

2. The substrate processing apparatus according to claim 1, wherein The grinding module has a housing exposed to the outside.

3. The substrate processing apparatus according to claim 2, wherein An opening is formed in the housing for the substrate to move between the transfer unit and the grinding module.

4. The substrate processing apparatus according to claim 2 or 3, wherein A filter fan unit is provided in the housing.

5. The substrate processing apparatus according to any one of claims 1 to 3, wherein The grinding module is connected to the side surface of the transfer unit.

6. The substrate processing apparatus according to any one of claims 1 to 3, wherein The grinding module is configured to be detachable.

7. The substrate processing apparatus according to claim 5, wherein In at least one of the first upper route, the first lower route, the second upper route and the second lower route, the arrangement order of the at least two grinding modules can be changed.

8. The substrate processing apparatus according to any one of claims 1 to 3, wherein The plurality of grinding modules includes: at least one surface grinding module for grinding the surface of the substrate, at least one bevel grinding module for grinding the bevel portion of the substrate, and at least one back grinding module for grinding the back surface of the substrate.

9. A substrate processing apparatus, characterized in that, Comprising: A transfer unit having an upper transfer machine for transferring a first substrate and a lower transfer machine for transferring a second substrate; An upper route including a plurality of grinding modules arranged in the transfer direction of the upper transfer machine and grinding the first substrate; and A lower route including a plurality of grinding modules arranged in the transfer direction of the lower transfer machine and grinding the second substrate, The grinding module is detachable relative to the transfer unit, The upper route and the lower route are arranged side by side at different height positions, The upper transfer machine exchanges the first substrate with the upper route, The lower transfer machine exchanges the second substrate with the lower route.

10. The substrate processing apparatus according to claim 9, wherein: the transfer unit further includes an upper moving track along the transfer direction of the upper transfer machine and a lower moving track along the transfer direction of the lower transfer machine; the upper transfer machine is capable of moving along the upper moving track; the lower transfer machine is capable of moving along the lower moving track.

11. The substrate processing apparatus according to claim 9, wherein: a plurality of the transfer units are provided; the plurality of transfer units are arranged in the transfer direction of the upper transfer machine and the lower transfer machine.

12. The substrate processing apparatus according to any one of claims 9 to 11, wherein: the polishing modules constituting the upper route include: at least one surface polishing module for polishing the surface of the first substrate, at least one back surface polishing module for polishing the back surface of the first substrate, and at least one bevel polishing module for polishing the bevel portion of the first substrate; the polishing modules constituting the lower route include: at least one surface polishing module for polishing the surface of the second substrate, at least one back surface polishing module for polishing the back surface of the second substrate, and at least one bevel polishing module for polishing the bevel portion of the second substrate.

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