Plating device and resistant for plating device

Abstract

The invention provides a plating device capable of improving the uniformity of the thickness of a plating film formed on a plating object. The present invention relates to a device resistor for adjusting an electric field, the device resistor being disposed in a plating device between an anode and a holder for holding an object to be plated, the device resistor having a plate-shaped main body, the plate-shaped main body has an upper surface, a lower surface, and a plurality of through-holes connecting the upper surface and the lower surface, and the resistance body for the plating device further has an insertion body disposed inside the main body, the insertion body having a plurality of through-holes, the insertion body is movable between a first position at which the plurality of through-holes of the insertion body communicate with the plurality of through-holes of the main body, and a second position at which the plurality of through-holes of the insertion body do not communicate with the plurality of through-holes of the main body.

Description

Technical Field

[0001] The present application relates to a plating apparatus and an impedance body for a plating apparatus. Background Art

[0002] As an example of a plating apparatus using an electroplating method, a so-called immersion-type plating apparatus (for example, refer to Patent Document 1) in which a substrate (for example, a semiconductor wafer) and an anode are opposed to each other in the horizontal direction is known. Further, as another example of a plating apparatus using an electroplating method, a cup-type plating apparatus (for example, refer to Patent Document 2) is known. The cup-type plating apparatus immerses a substrate held by a substrate holder with the plating surface facing downward in a plating solution, and applies a voltage between the substrate and the anode, whereby a conductive film (plated film) is deposited on the surface of the substrate.

[0003] In such a plating apparatus, generally, the substrate has electrical contacts at its peripheral portion. Due to the different distances from the electrical contacts, a potential difference may occur between the peripheral portion and the central portion of the substrate during the plating process, resulting in a deviation of the plating current. Therefore, conventionally, in order to improve the uniformity of the thickness of the plated film formed on the substrate, it is known to dispose an impedance body for electric field adjustment between the substrate and the anode. Further, in order to make the electric field adjustment wider and freer, a plating apparatus in which the size of the holes of the impedance body is made variable has been proposed (refer to Patent Document 3).

[0004] Patent Document 1: Japanese Patent No. 7462125

[0005] Patent Document 2: Japanese Patent No. 7079388

[0006] Patent Document 3: Japanese Patent No. 7204060

[0007] In a plating apparatus, in addition to the distance relationship with the electrical contact, sometimes the thickness deviation of the plating film is caused by the resist pattern formed on the substrate. That is, if there is a region (non-opening region) on the plated surface of the substrate where the resist opening is not formed to a certain extent, the plating current does not flow through the non-opening region, and the plating current is concentrated on the peripheral portion of the non-opening region, resulting in an increase in the thickness of the plating film. As a specific example, when the resist opening is formed only in a substantially cross-shaped region in the substrate, since there is no resist opening formed in the region outside the cross and no current flows, the uniformity of the thickness of the plating film may be impaired. Here, for example, in Patent Document 1, in order to adjust the electric field between the anode and the substrate, an anode mask capable of adjusting the size of the anode opening is used. However, the existing structure is designed to cope with the deviation of the plating film thickness caused by the structure of the plating apparatus such as the electrical contact, and sometimes it cannot sufficiently cope with the deviation of the plating film thickness caused by the resist pattern of the substrate. In order to make the thickness of the plating film uniform, it is also possible to consider forming dummy openings in the non-opening region, but there will be a process for forming the dummy openings, and unnecessary plating is formed in the dummy openings, resulting in an increase in the cost of the plating process. Summary of the Invention

[0008] The present invention has been completed in view of the above problems. One of its objects is to provide a plating apparatus capable of improving the uniformity of the thickness of the plating film formed on the plating object.

[0009] According to one embodiment, there is provided a resistance body for a plating apparatus, which is a resistance body for a plating apparatus for electric field adjustment disposed between an anode and a holder for holding a plating object in the plating apparatus. The resistance body for the plating apparatus has a plate-shaped main body, the plate-shaped main body has an upper surface, a lower surface, and a plurality of through holes communicating the upper surface and the lower surface. The resistance body for the plating apparatus further has an insert disposed inside the main body. The insert has a plurality of through holes, and the insert can move between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the main body and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the main body. Brief Description of the Drawings

[0010] Figure 1 It is a perspective view showing the overall structure of a plating apparatus according to one embodiment.

[0011] Figure 2 It is a top view showing the overall structure of a plating apparatus according to one embodiment.

[0012] Figure 3 It is a longitudinal sectional view schematically showing the structure of a plating module according to one embodiment.

[0013] Figure 4A It is a cross-sectional view taken horizontally of the impedance body that can be used for the Figure 3 plating module shown.

[0014] Figure 4B It schematically shows Figure 4A a longitudinal cross-sectional view of the impedance body shown.

[0015] Figure 5A It is a cross-sectional view taken horizontally of the impedance body that can be used for the Figure 3 plating module shown.

[0016] Figure 5B It schematically shows Figure 5A a longitudinal cross-sectional view of the impedance body shown.

[0017] Figure 6 It is a cross-sectional view taken horizontally of the impedance body that can be used for the Figure 3 plating module shown.

[0018] Figure 7 It is a cross-sectional view taken horizontally of the impedance body that can be used for the Figure 3 plating module shown.

[0019] Figure 8 It is a cross-sectional view taken horizontally of the impedance body that can be used for the Figure 3 plating module shown.

[0020] Figure 9A It is a perspective view of a part of the impedance body that can be used for the Figure 3 plating module shown in one embodiment.

[0021] Figure 9B It shows Figure 9A a sectional perspective view of a part of the impedance body shown.

[0022] Figure 9C It shows Figure 9A a sectional perspective view of a part of the impedance body shown.

[0023] Figure 10 It is a top view showing the arrangement of the inserts in one embodiment.

[0024] Figure 11 It is a top view showing the arrangement of the inserts in one embodiment.

[0025] Figure 12 It is a flowchart showing an example of a method for setting the operation scenarios of the impedance body, the anode mask, and the shielding body by the control module.

[0026] Figure 13 It is a diagram schematically showing a resist pattern formed on the surface to be plated of a substrate in one embodiment.

[0027] Figure 14 It is a flowchart showing an example of a method for setting the operation scenarios of the resistor body, the anode mask, and the shielding body during the plating process by the control module. Detailed Embodiment

[0028] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and repeated descriptions are omitted.

[0029] <Overall Structure of Plating Apparatus>

[0030] Figure 1 It is a perspective view showing the overall structure of the plating apparatus of this embodiment. Figure 2 It is a top view showing the overall structure of the plating apparatus of this embodiment. As Figure 1 , 2 shown, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wetting module 200, a pre-dipping module 300, a plating module 400, a cleaning module 500, a spin dryer 600, a transfer device 700, and a control module 800.

[0031] The load port 100 is a module for loading a substrate stored in a cassette such as an unillustrated FOUP into the plating apparatus 1000 or unloading the substrate from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged and configured in the horizontal direction, but the number and configuration of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100, the aligner 120, and the transfer device 700. When transferring a substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporarily placed table (not shown).

[0032] The aligner 120 is a module for aligning the orientation plane, notch, etc. of the substrate to a specified direction. In the present embodiment, two aligners 120 are arranged and configured in the horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wetting module 200 wets the surface to be plated of the substrate before plating treatment with a treatment liquid such as pure water or degassed water, and replaces the air inside the pattern formed on the substrate surface with the treatment liquid. The pre-wetting module 200 is configured to perform a pre-wetting treatment that facilitates the supply of the plating liquid into the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wetting modules 200 are arranged and configured in the vertical direction, but the number and configuration of the pre-wetting modules 200 are arbitrary.

[0033] The pre-dipping module 300 is configured to perform a pre-dipping treatment, for example, to etch and remove a resistive oxide film existing on the surface of the seed layer formed on the surface to be plated of the substrate before plating treatment with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the plating substrate surface. In the present embodiment, two pre-dipping modules 300 are arranged and configured in the vertical direction, but the number and configuration of the pre-dipping modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In the present embodiment, there are two sets of 12 plating modules 400 arranged and configured in 3 rows in the vertical direction and 4 rows in the horizontal direction, with a total of 24 plating modules 400 provided, but the number and configuration of the plating modules 400 are arbitrary.

[0034] The cleaning module 500 is configured to perform a cleaning treatment on the substrate in order to remove the plating liquid and the like remaining on the substrate after the plating treatment. In the present embodiment, two cleaning modules 500 are arranged and configured in the vertical direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin dryer 600 is a module for drying the substrate after the cleaning treatment by rotating it at high speed. In the present embodiment, two spin dryers are arranged and configured in the vertical direction, but the number and configuration of the spin dryers are arbitrary. The transfer device 700 is a device for transferring the substrate between multiple modules within the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be constituted by, for example, a general computer or a dedicated computer having an input / output interface with the operator.

[0035] An example of a series of plating treatments performed by the plating apparatus 1000 will be described. First, the substrate stored in the cassette is carried into the loading port 100. Next, the transfer robot 110 takes out the substrate from the cassette in the loading port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notch, etc. of the substrate to a specified direction. The transfer robot 110 hands over the substrate whose direction has been aligned by the aligner 120 to the transfer device 700.

[0036] The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wetting module 200. The pre-wetting module 200 performs a pre-wetting process on the substrate. The transfer device 700 transfers the substrate that has undergone the pre-wetting process to the pre-impregnation module 300. The pre-impregnation module 300 performs a pre-impregnation process on the substrate. The transfer device 700 transfers the substrate that has undergone the pre-impregnation process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0037] The transfer device 700 transfers the substrate that has undergone the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate that has undergone the cleaning process to the spin dryer 600. The spin dryer 600 performs a drying process on the substrate. The transfer device 700 delivers the substrate that has undergone the drying process to the transfer robot 110. The transfer robot 110 transfers the substrate received from the transfer device 700 to the cassette at the loading port 100. Finally, the cassette containing the substrate is taken out from the loading port 100.

[0038] <Structure of the plating module>

[0039] Next, the structure of the plating module 400 will be described. Since the 24 plating modules 400 in this embodiment have the same structure, only one plating module 400 will be described.

[0040] Figure 3 is a longitudinal sectional view schematically showing the structure of the plating module 400 of this embodiment. As Figure 3 shown, the plating module 400 includes a plating tank 410 for accommodating the plating solution. The plating tank 410 is configured to include a cylindrical inner tank with an open upper surface and an outer tank (not shown) provided around the inner tank for accumulating the plating solution that overflows from the upper edge of the inner tank.

[0041] The plating module 400 includes a substrate holder 440 for holding the substrate Wf in a state where the plating surface Wf-a faces downward. In addition, the substrate holder 440 includes a power supply contact (not shown) for supplying power to the substrate Wf from a power supply (not shown). In one embodiment, the power supply contact contacts the outer edge portion of the substrate Wf and supplies power to the outer edge portion of the substrate Wf. The plating module 400 includes a lifting mechanism 442 for lifting and lowering the substrate holder 440. In addition, in one embodiment, the plating module 400 includes a rotating mechanism 448 for rotating the substrate holder 440 about the vertical axis. The lifting mechanism 442 and the rotating mechanism 448 can be realized by a known mechanism such as a motor, for example.

[0042] The plating module 400 includes a diaphragm 420 that separates the interior of the plating bath 410 in the vertical direction. The interior of the plating bath 410 is divided into a cathode region 422 and an anode region 424 by the diaphragm 420. Plating solutions are filled in the cathode region 422 and the anode region 424 respectively. In addition, in this embodiment, an example of the setting of the diaphragm 420 is shown, but the diaphragm 420 may not be provided.

[0043] An anode 430 is provided on the bottom surface of the anode region 424 of the plating bath 410. As an example, the anode 430 is a circular member having a plate surface with a size approximately equal to the plate surface of the substrate Wf. In addition, an anode hood 426 for adjusting the electric field between the anode 430 and the substrate Wf is arranged in the anode region 424. The anode hood 426 is provided near the anode 430 and is, for example, a substantially plate-shaped electric field shield made of a dielectric material. The anode hood 426 has an opening through which the current flowing between the anode 430 and the substrate Wf passes. In this embodiment, the anode hood 426 is configured to be able to change the opening size, and the control module 800 adjusts the opening size. Here, the opening size refers to the diameter when the opening is circular, and refers to the length of one side or the longest opening width when the opening is polygonal. In addition, the change of the opening size of the anode hood 426 can adopt a known mechanism. In addition, in this embodiment, an example of the setting of the anode hood 426 is shown, but the anode hood 426 may not be provided. In addition, the above diaphragm 420 may also be provided at the opening of the anode hood 426.

[0044] The plating module 400 includes an impedance body 450 disposed between the substrate Wf and the anode 430. In this embodiment, the impedance body 450 is disposed in the cathode region 422. The impedance body 450 is a component for realizing the uniformity of the plating treatment at the plated surface Wf-a of the substrate Wf by adjusting the electric field. By the impedance body 450, the resistance value between the anode 430 and the substrate Wf becomes larger, and the electric field is not easily expanded. As a result, the distribution of the coating thickness formed on the plated surface Wf-a of the substrate Wf can be made uniform. Therefore, if the distance between the substrate Wf and the impedance body 450 becomes larger, the space in which the electric field between the substrate Wf and the impedance body 450 can expand becomes larger. Therefore, the impedance body 450 is preferably disposed near the plated surface Wf-a of the substrate Wf. The impedance body 450 will be described in detail later.

[0045] In addition, the plating module 400 includes: a stirrer 480 disposed between the substrate Wf held by the substrate holder 440 and the resist 450; and a stirrer driving mechanism 482 for moving the stirrer 480 in the plating solution to stir the plating solution. The stirrer 480 is not limited and can be constituted by, for example, a plate member formed with a plurality of honeycomb-shaped holes. The stirrer driving mechanism can be realized by a known mechanism such as a motor. The stirrer driving mechanism 482 is configured to stir the plating solution near the plated surface Wf-a of the substrate Wf by reciprocating the stirrer 480 along the plated surface Wf-a of the substrate Wf. However, it is not limited to such an example. As an example, the stirrer driving mechanism 482 can also be configured to reciprocate the stirrer 480 perpendicular to the plated surface Wf-a. In addition, in the present embodiment, an example in which the stirrer 480 and the stirrer driving mechanism 482 are provided is shown, but the stirrer 480 and the stirrer driving mechanism 482 may not be provided.

[0046] In addition, a sensor 460 for detecting parameters related to the coating film formed on the plated surface Wf-a of the substrate Wf is provided in the cathode region 422. In the present embodiment, the parameters related to the coating film refer to the film thickness of the coating film or a physical quantity for inferring the formation rate of the coating film. The sensor 460 is arranged to face the plated surface Wf-a. In the present embodiment, the sensor 460 is configured to be movable so as to be able to change the detection position along the radial direction of the substrate Wf. However, it is not limited to such an example, and a plurality of sensors 460 facing the plated surface Wf-a may also be provided. In addition, in one embodiment, the detection end of the sensor 460 is arranged inside the resist 450. However, it is not limited to such an example, and the sensor 460 can also be arranged, for example, at other places outside the resist 450.

[0047] The detection signal of the sensor 460 is input to the control module 800. In the present embodiment, as the sensor 460, a potential sensor having a detection electrode (not shown) is used. Further, the detection electrode of the sensor 460 may be configured to face the surface to be plated Wf-a, or may be disposed in a conduit configured to face the surface to be plated Wf-a and filled with a plating solution inside. In addition, when using a potential sensor as the sensor 460, it is preferable to provide at least one reference potential sensor 462 in the plating bath 410. The reference potential sensor 462 is preferably disposed outside the region between the substrate Wf and the anode 430. In other words, the reference potential sensor 462 is preferably provided at a position where it does not overlap with the substrate Wf and the anode 430 when viewed from a direction perpendicular to the surface to be plated Wf-a of the substrate Wf. The control module 800 infers the formation rate of the coating film formed on the surface to be plated Wf-a based on the potential difference between the sensor 460 as a potential sensor and the reference potential sensor 462, and can measure the thickness of the coating film. This is because the plating current and potential are related during the plating process. However, as the sensor 460, as long as it can detect parameters related to the coating film, other sensors such as an optical distance sensor such as a white confocal type, a magnetic field sensor, or an eddy current sensor may be used instead of or in addition to the potential sensor. Further, in the present embodiment, an example in which a sensor 460 for detecting parameters related to the coating film is provided is shown, but the sensor 460 may not be provided.

[0048] A shielding body 470 for shielding the current flowing from the anode 430 to the substrate Wf is provided in the cathode region 422. In the present embodiment, the shielding body 470 is provided at the same height as the stirrer 480, but is not limited to such an example. The shielding body 470 is, for example, a substantially plate-like member made of a dielectric material. The shielding body 470 is configured to be movable between a shielding position between the surface to be plated Wf-a of the substrate Wf and the anode 430 and a retracted position retracted from between the surface to be plated Wf-a and the anode 430. In other words, the shielding body 470 is configured to be movable between a shielding position below the surface to be plated Wf-a and a retracted position away from below the surface to be plated Wf-a. The position of the shielding body 470 is controlled by a drive mechanism 472 that receives an instruction from the control module 800. The drive mechanism 472 can be realized by a known mechanism such as a motor or a solenoid.

[0049] <Resistance body>

[0050] The resistance body 450 of the present embodiment will be described in detail. Figure 4A Schematically shows one embodiment Figure 3 The lateral cross-sectional view of the shown resistance body 450. Figure 4B Schematically represents Figure 4ALongitudinal cross-sectional view of the antibody resistor 450 shown. The antibody resistor 450 of the present embodiment includes a main body 452 having a disc shape, and an arc plate-shaped first insert 456A and a second insert 456B disposed inside the main body 452. In other words, the main body 452 has an annular-shaped space 455 inside, and the arc plate-shaped first insert 456A and second insert 456B are disposed in the annular-shaped space 455. The main body 452 and the two inserts 456A and 456B are components having a resistivity higher than that of the plating solution, and are preferably dielectrics. In addition, the main body 452 and the inserts 456A and 456B may be formed of the same material or different materials.

[0051] In one embodiment, the main body 452 is a plate-shaped component that is fixed relative to the plating tank 410 and is slightly larger than the substrate Wf when viewed from above. In addition, as an example, the main body 452 may also be configured to be movable up and down within the plating tank 410. As Figure 4A , 4B shown, a plurality of through holes 453 communicating the upper surface 452-a and the lower surface 452-b of the main body 452 are formed in the main body 452. In other words, a plurality of through holes 453 that open on the substrate holder 440 side and the anode 430 side are formed in the main body 452. In Figure 4A , the through holes 453 are indicated by dashed lines. The plurality of through holes 453 are through holes of the same size and have an elongated hole shape in which the circumferential length is about twice the radial length. However, not limited to such an example, when viewed from above, the plurality of through holes 453 may be circular, may have any other shape, or may be through holes of different sizes. In addition, in one embodiment, the plurality of through holes 453 are arranged on two or more imaginary reference circles (in Figure 4A , refer to the dotted line) that are concentric and have different diameters. In this case, in one embodiment, the plurality of through holes 453 arranged on adjacent reference circles are arranged at positions where the angular positions in the reference circles are offset from each other. In other words, the through holes 453 arranged on adjacent reference circles are arranged such that the centers of the through holes 453 are not arranged on a straight line extending in the radial direction but are offset in the circumferential direction. However, the arrangement of the plurality of through holes 453 is not limited to such an example, and they may be arranged in a row on a straight line extending in the radial direction, or the above-described arrangement of the through holes 453 may be adopted only in a part of the region. In addition, in Figure 4A , for clarity of illustration, the plurality of through holes 453 are sparsely illustrated, but in an actual design, more through holes 453 are formed in the main body 452.

[0052] As Figure 4AAs shown, the first insert 456A and the second insert 456B are members that are arc-shaped plates when viewed from above. As described above, the first insert 456A and the second insert 456B are disposed in an annular space 455 formed inside the main body 452. In addition, the first insert 456A and the second insert 456B are concentrically disposed with respect to the substrate Wf or the anode 430 when viewed from above. In one embodiment, the first insert 456A and the second insert 456B have a smaller size than the substrate Wf or the anode 430 when viewed from above, and are disposed closer to the center side than the peripheral portion of the substrate Wf or the anode 430 (see Figure 3 ). As will be described later, the first insert 456A and the second insert 456B can each move in the circumferential direction within the annular space 455 formed inside the main body 452.

[0053] A through hole 457A that communicates the upper surface and the lower surface of the first insert 456A is formed in the first insert 456A. In other words, a plurality of through holes 457A that open on the substrate holder 440 side and the anode 430 side are formed in the first insert 456A. In Figure 4A , the through holes 457A are shown by solid lines. In one embodiment, the plurality of through holes 457A are disposed on two or more imaginary reference circles that are concentric and have different diameters (in Figure 4A , see the dotted line). In other words, the plurality of through holes 457A are disposed so as to be dispersed in the radial direction of the first insert 456A. In this case, in one embodiment, the plurality of through holes 457A disposed on adjacent reference circles are disposed at positions where the angular positions in the reference circles are offset from each other. In other words, the through holes 457A disposed on adjacent reference circles are arranged such that the centers of the through holes 457A do not line up on a straight line extending in the radial direction, but are offset in the circumferential direction. However, the plurality of through holes 457A are not limited to such an example, and may be arranged in a line extending in the radial direction. In addition, in one embodiment, the plurality of through holes 457A each define an opening having the same size as the through hole 453 of the main body 452. That is, in Figure 4AIn the illustrated embodiment, the plurality of through-holes 457A of the first insert 456A and the through-hole 453 of the main body 452 define an opening in a slot shape in which the circumferential length is about twice the radial length. However, when viewed from above, the plurality of through-holes 457A of the first insert 456A are not limited to a slot shape, and may be a circular shape or any other arbitrary shape. As an example, the plurality of through-holes 457A of the first insert 456A may also be in a slot shape that defines an opening having a dimension longer in the circumferential direction than the through-hole 453 of the main body 452. In one embodiment, the through-holes 457A are arranged in the same distribution as the through-holes 453 of the main body 452. That is, the plurality of through-holes 457A are configured to be able to overlap the plurality of through-holes 453 of the main body 452 respectively. Figure 4A This indicates a state in which the plurality of through-holes 457A respectively overlap the plurality of through-holes 453 of the main body 452. In addition, in Figure 4A , for clarity of illustration, the plurality of through-holes 457A and 457B are sparsely illustrated, but in an actual design, more through-holes 457A and 457B are formed in the inserts 456A and 456B.

[0054] A plurality of through-holes 457B that open on the substrate holder 440 side and the anode 430 side are formed in the second insert 456B. Since the dimensions of the second insert 456B and the through-holes 457B of the second insert 456B are the same as those of the first insert 456A, the description thereof is omitted.

[0055] As Figure 4A shown, the first insert 456A and the second insert 456B are connected by an elastic member 454 at one end thereof. In addition, as Figure 4A , 5A shown, an impedance body 450 in one embodiment includes a biasing member 490 for moving the first insert 456A and the second insert 456B in the circumferential direction within the annular space 455 of the main body 452. As Figure 4A shown, the biasing member 490 is a wedge-shaped member and is a plate-shaped member having the same thickness as the first insert 456A and the second insert 456B. As illustrated, the biasing member 490 is disposed at an end of the first insert 456A and the second insert 456B opposite to the end where the elastic member 454 is disposed. In addition, a plurality of through-holes 494 are provided in the biasing member 490 in the same manner as in the first insert 456A and the second insert 456B. A drive mechanism 492 is connected to the biasing member 490, and the biasing member 490 is configured to be movable in the radial direction by the drive mechanism 492. The drive mechanism 492 for moving the biasing member 490 in the radial direction can be arbitrary, and for example, a cam mechanism or a ball screw can be employed.

[0056] Figure 4A represents a state in which no force is applied to the elastic member 454. In this specification, Figure 4A the positions of the first insert 456A and the second insert 456B shown are referred to as the "first position". In the first position, the plurality of through holes 453 of the main body 452 of the impedance body 450 are aligned in a communicating manner with the plurality of through holes 457A of the first insert 456A and the plurality of through holes 457B of the second insert 456B. Figure 4B is a longitudinal sectional view showing a state in which the plurality of through holes 453 of the main body 452 of the impedance body 450 are aligned in a communicating manner with the plurality of through holes 457A of the first insert 456A and the plurality of through holes 457B of the second insert 456B. In addition, in the first position, the plurality of through holes 494 of the biasing member 490 are aligned in a communicating manner with the plurality of through holes 453 of the main body 452 of the impedance body 450. Furthermore, in Figure 4A for clarity of illustration, the biasing member 490 is shown having one through hole 494, but in an actual design, a plurality of through holes 494 may also be provided in the biasing member 490.

[0057] When the biasing member 490 is moved radially inward from the Figure 4A state of the first position shown by the drive mechanism 492, the first insert 456A and the second insert 456B move in the circumferential direction respectively, and the elastic member 454 is compressed. It can also be said that the drive mechanism 492 causes the biasing member 490 to overcome the force applied to the first insert 456A and the second insert 456B by the elastic member 454, and causes the first insert 456A and the second insert 456B to move in the circumferential direction. Figure 5A represents a state in which the first insert 456A and the second insert 456B move in the circumferential direction and apply a force to the elastic member 454. In this specification, Figure 5A the positions of the first insert 456A and the second insert 456B shown are referred to as the "second position". In the second position, the plurality of through holes 453 of the main body 452 of the impedance body 450 are not in communication with the plurality of through holes 457A of the first insert 456A and the plurality of through holes 457B of the second insert 456B. In other words, in the second position, the plurality of through holes 453 of the main body 452 of the impedance body 450 are blocked by the first insert 456A and the second insert 456B. Figure 5BIt is a longitudinal sectional view showing a state in which the plurality of through-holes 453 of the main body 452 of the antibody blocker 450 are not connected to the plurality of through-holes 457A of the first insert 456A and the plurality of through-holes 457B of the second insert 456B. Further, at the second position, the plurality of through-holes 494 of the biasing member 490 are not connected to the plurality of through-holes 453 of the main body 452 of the antibody blocker 450. In other words, the plurality of through-holes 453 of the main body 452 of the antibody blocker 450 are blocked by the biasing member 490.

[0058] By the biasing member 490 moving radially outward from Figure 5A the second position shown, the compressive force applied to the elastic member 454 causes the first insert 456A and the second insert 456B to move toward the first position. In other words, it can also be said that the elastic member 454 applies a biasing force to the first insert 456A and the second insert 456B in the direction toward the first position. Figure 4A The first position shown is a state in which the plurality of through-holes 453 of the main body 452 of the antibody blocker 450 are aligned with the plurality of through-holes 457A of the first insert 456A and the plurality of through-holes 457B of the second insert 456B, and the plurality of through-holes 453 of the main body 452 are completely open. The second position is a state in which the plurality of through-holes 453 of the main body 452 of the antibody blocker 450 are completely blocked by the first insert 456A and the second insert 456B. In one embodiment, the first insert 456A and the second insert 456B can be in any position between the first position and the second position, and can be in a state in which the plurality of through-holes 453 of the main body 452 are partially blocked by the first insert 456A and the second insert 456B. In one embodiment, the first insert 456A and the second insert 456B can be arranged at any position between the first position and the second position by the radial position of the biasing member 490. That is, the opening amount of the plurality of through-holes 453 of the main body 452 of the antibody blocker 450 can be adjusted by the radial position of the biasing member 490.

[0059] In addition, in one embodiment, regarding the radial dimensions of the first insert 456A and the second insert 456B, the inner diameter of the first insert 456A and the second insert 456B is 50% to 70% of the diameter of the main body 452 or the substrate Wf, preferably 55% to 65%. Further, in one embodiment, the outer diameter of the first insert 456A and the second insert 456B is 70% to 90% of the diameter of the main body 452 or the substrate Wf, preferably 80% to 90%. The above-mentioned inner diameter and outer diameter of the first insert 456A and the second insert 456B can also be said to be the inner diameter and outer diameter of the annular-shaped space 455 inside the main body 452. In one embodiment, the radial dimensions of the first insert 456A and the second insert 456B can also be determined to be related to the Figure 13It is consistent with the middle region B2 shown.

[0060] In addition, in one embodiment, a groove 459 for accommodating at least a part of the sensor 460 is formed in the main body 452. In one embodiment, the groove 459 penetrates the substrate holder 440 side and the anode 430 side. However, as an example, the anode 430 side may also be closed. In addition, in FIGS. 4 to 5, the groove 459 is formed on the outer peripheral side of the annular space 455 for accommodating the first insert 456A and the second insert 456B, and is radially separated from the annular space 455. However, as an example, the annular space 455 and the groove 459 may also communicate with each other. In addition, in one embodiment, the groove 459 extends inward from the outer peripheral edge of the main body 452 when viewed from above. In one embodiment, as Figure 3 shown, the sensor 460 is disposed in the groove 459 so as not to protrude upward from the upper surface 452-a of the main body 452. As described above, the impedance body 450 is preferably disposed near the plating surface Wf-a, and the sensor 460 for detecting parameters related to the plating film is also preferably disposed near the plating surface Wf-a of the substrate Wf. By disposing the sensor 460 in the groove 459, the distance between the impedance body 450 and the plating surface Wf-a of the substrate Wf can be reduced, and parameters related to the film thickness of the plating film can be appropriately detected. In addition, in the present embodiment, a stirrer 480 is disposed between the impedance body 450 and the substrate Wf. By disposing the sensor 460 in the groove 459, the movement of the stirrer 480 for stirring is not restricted, and interference between the sensor 460 and the stirrer 480 can be prevented.

[0061] Figure 6 is a schematic cross-sectional view of the impedance body 450 of one embodiment of the plating module 400 that can be used for Figure 3 shown. Figure 6 In the embodiment shown, the impedance body 450 is double-configured with inserts. As Figure 6 shown, the main body 452 of the impedance body 450 includes an outer annular space 455A and an inner annular space 455B. The first insert 456A and the second insert 456B are disposed in the outer annular space 455A. In addition, the third insert 456C and the fourth insert 456D are disposed in the inner annular space 455B. Figure 6The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D of the illustrated embodiment have the same structure as the first insert 456A and the second insert 456B shown in FIGS. 4 and 5, except for the radial width. The first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D each have a plurality of through holes 457A to 457D. However, for clarity of illustration, the plurality of through holes 457A to 457D are not shown in Figure 6 .

[0062] As Figure 6 shown, the first insert 456A and the second insert 456B are connected at one end of each by an elastic member 454A, and the third insert 456C and the fourth insert 456D are connected at one end of each by an elastic member 454B. In addition, as Figure 6 shown, a biasing member 490 is provided for moving the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D in the circumferential direction within the annular spaces 455A and 455B of the main body 452. Figure 6 The biasing member 490 shown can have the same structure as the biasing member 490 shown in FIGS. 4 and 5. In Figure 6 the illustrated embodiment, the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D can move between a first position where the plurality of through holes 457A to 457D of each communicate with the plurality of through holes 453 of the main body 452 and a second position where they do not communicate. In addition, the biasing member 490 has a plurality of through holes 494, and the through holes 490 can move between a position where they communicate with the plurality of through holes 453 of the main body 452 and a non-communicating position. In Figure 6 the state shown, the plurality of through holes 494 of the biasing member 490 are aligned so as to communicate with the plurality of through holes 453 of the main body 452.

[0063] Figure 7 shows a state in which the biasing member 490 has moved radially inward partway, and the plurality of through holes 457A and 457B of the first insert 456A and the second insert 456B communicate with the plurality of through holes 453 of the main body 452, while the plurality of through holes 457C and 457D of the third insert 456C and the fourth insert 456D do not communicate with the plurality of through holes 453 of the main body 452. In addition, in Figure 7At the position shown, the plurality of through holes 494 of the biasing member 490 may also be configured such that at the radial positions where the first insert 456A and the second insert 456B are disposed, they do not communicate with the plurality of through holes 453 of the main body 452, and the biasing member 490 blocks the through holes 453 of the main body 452. Figure 8 It shows a state where the biasing member 490 further moves radially inward, and the plurality of through holes 457A to 457D of each of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D do not communicate with the plurality of through holes 453 of the main body 452. Additionally, at Figure 8 the position shown, the plurality of through holes 494 of the biasing member 490 may also be configured such that at the radial positions where the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D are disposed, they do not communicate with the plurality of through holes 453 of the main body 452, and the biasing member 490 blocks the through holes 453 of the main body 452.

[0064] In one embodiment, regarding the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D, the inner diameters of the third insert 456C and the fourth insert 456D are 50% to 70% of the diameter of the main body 452 or the substrate Wf, preferably 55% to 65%. Additionally, in one embodiment, the outer diameters of the first insert 456A and the second insert 456B are 70% to 90% of the diameter of the main body 452 or the substrate Wf, preferably 80% to 90%. In one embodiment, the radial dimensions of the first insert 456A, the second insert 456B, the third insert 456C, and the fourth insert 456D may also be determined to be consistent with the intermediate region B2 shown in Figure 13 below.

[0065] Figure 9A It schematically shows a part of the impedance body 450 that can be used for Figure 3 the plating module 400 shown below in a perspective view of one embodiment. Figure 9B and Figure 9C It shows Figure 9ACross-sectional perspective view of a part of the blocking body 450 shown. The blocking body 450 of the present embodiment has a disc-shaped main body 452 and a cylindrical insert 560 disposed inside the main body 452, similarly to the above-described embodiment. In other words, the main body 452 has a cylindrical space 455 inside, and the cylindrical insert 560 is disposed in the cylindrical space 455. The insert 560 is inserted into the cylindrical space 455 from the outer peripheral edge of the main body 452 toward the radially inner side. The main body 452 and the insert 560 are members having a resistivity higher than that of the plating solution, and are preferably dielectrics. In addition, the main body 452 and the insert 560 may be formed of the same material or different materials.

[0066] In Figure 9A the embodiment shown, the main body 452 is formed with a plurality of through holes 453 that open on the substrate holder 440 side (upper side) and the anode 430 side (lower side). In addition, in Figure 9A order to clarify the illustration, only the portions of the plurality of through holes 453 of the main body 452 related to the insert 560 are illustrated, but the plurality of through holes 453 are formed throughout the main body 452. In Figure 9A this case, the plurality of through holes 453 are through holes of the same size and are circular in shape when viewed from above. However, not limited to such an example, each of the plurality of through holes 453 may also be a long hole-shaped opening having a circumferential length approximately twice the radial length, similar to the embodiments of FIGS. 4 and 5, or may have any other shape, or may be through holes of different sizes.

[0067] As Figure 9A shown, the insert 560 is a cylindrical member. As Figure 9B shown, the insert 560 is formed with a plurality of through holes 562 that open on the substrate holder 440 side and the anode 430 side. In Figure 9B the embodiment shown, the plurality of through holes 562 of the insert 560 have openings of the same size as the plurality of through holes 453 of the main body 452 and have the same distribution. As Figure 9A shown, the insert 560 is connected to a drive mechanism 564 and is configured to be rotatable inside the main body 452. The drive mechanism 564 can employ any drive mechanism including a motor or the like. As Figure 9A shown, the plurality of through holes 562 of the insert 560 are formed in a part of the axial direction (radial direction of the main body 452) of the insert 560. The axial (radial direction of the main body 452) dimension of the region of the insert 560 in which the through holes 562 are formed can be arbitrary, but as an example, it can be from FIGS. 4 to Figure 8The radial dimensions of the inserts 456A to 456D in the embodiments. Further, in one embodiment, the axial dimension (radial dimension of the main body 452) of the region of the insert 560 in which the through holes 562 are formed may also be determined to be consistent with the middle region B2 described later Figure 13 shown in

[0068] Figure 9B represents a state in which the plurality of through holes 453 of the main body 452 and the plurality of through holes 562 of the insert 560 are aligned in a communicating manner. In this specification, the Figure 9B position of the insert 560 shown in is referred to as the "first position". Figure 9C represents a state in which the insert 560 is rotated 90 degrees and the plurality of through holes 453 of the main body 452 and the plurality of through holes 562 of the insert 560 are not in communication. In this specification, the Figure 9C position of the insert 560 shown in is referred to as the "second position". In other words, in the second position, the plurality of through holes 453 of the main body 452 of the impedance body 450 are blocked by the insert 560. Further, by slightly rotating the insert 560 from the first position, only a part of the plurality of through holes 453 of the main body 452 and the plurality of through holes 562 of the insert 560 are aligned, and a state in which the plurality of through holes 453 of the main body 452 are partially blocked by the insert 560 can be achieved.

[0069] Figure 10 is a diagram showing the configuration of the insert 560 in one embodiment. As Figure 10 shown, in one embodiment, a plurality of inserts 560 are arranged at equal intervals on the outer peripheral edge of the main body 452. Further, in Figure 10 the embodiment shown, the plurality of inserts 560 have the same structure. In Figure 10 the embodiment shown, the plurality of inserts 560 can be configured to be rotatable independently of each other. By rotating and moving the plurality of inserts 560 independently between the first position and the second position, the opening amount of the plurality of through holes 453 can be adjusted. Further, as one embodiment, it may also be configured to rotate the plurality of inserts 560 synchronously.

[0070] Figure 11 is a diagram showing the configuration of the insert 560 in one embodiment. As Figure 11 shown, in one embodiment, a plurality of inserts 560 are arranged at equal intervals on the outer peripheral edge of the main body 452. In Figure 11 the embodiment shown, the plurality of inserts 560 have different lengths. In Figure 11 the embodiment shown, the inserts 560 having different lengths can have different dimensions and positions of the regions in which the through holes 562 are formed. Therefore, in Figure 11In the illustrated embodiment, the opening amounts of the plurality of through holes 453 can be adjusted at different radial positions. Further, in Figure 10 , 11 For clarity of illustration, the through holes 453 and 562 are not shown.

[0071] <Plating Process>

[0072] Next, the plating process in the plating module 400 of the present embodiment will be described in more detail. By immersing the substrate Wf in the plating solution in the cathode region 422 using the lifting mechanism 442, the substrate Wf is exposed to the plating solution. The plating module 400 applies a voltage between the anode 430 and the substrate Wf in this state, whereby a plating process can be performed on the plating surface Wf-a of the substrate Wf. Further, in one embodiment, the plating process is performed while rotating the substrate holder 440 using the rotation mechanism 448. Through the plating process, a conductive film (coating film) is deposited on the plating surface Wf-a of the substrate Wf-a.

[0073] In one embodiment, the control module (controller) 800 can improve the uniformity of the coating film thickness distribution of the entire substrate Wf by controlling the drive mechanisms 492 and 564 to adjust the impedance body 450 (position of the insert). As an example, the adjustment of the impedance body 450 using the drive mechanisms 492 and 564 is performed before starting the plating process. Further, as an example, during the plating process, the impedance body 450 is adjusted in real time based on the detection value of the sensor 460 using the drive mechanisms 492 and 564.

[0074] Figure 12 is a flowchart showing an example of a method for setting the operation scenarios of the impedance body 450, the anode mask 426, and the shielding body 470 by the control module 800. As an example, the method shown in Figure 12 is executed when processing a new substrate batch. Further, the control module 800 may set the operation scenarios of only a part of the impedance body 450, the anode mask 426, and the shielding body 470. Here, the operation scenario of the impedance body 450 is a scenario showing the positions of the inserts 456A to 456D and 560, that is, the opening amounts of the through holes 453 of the main body 452. Further, the operation scenario of the anode mask 426 is a scenario showing the opening size of the anode mask 426. Further, the operation scenario of the shielding body 470 is a scenario showing the advancing and retracting positions of the shielding body 470. Further, the operation scenario may be set by a computer outside the plating apparatus 1000 instead of being set by the control module 800 of the plating apparatus 1000 and sent to the plating apparatus 1000.

[0075] In Figure 12In the example shown, first, the control module 800 acquires the resist pattern of the substrate Wf to be processed (step S110). The resist pattern refers to a pattern formed on the resist layer on the surface to be plated Wf-a in such a manner that a desired plating pattern is formed through a plating process. The acquisition of the resist pattern can also be performed by detecting the substrate Wf using a sensor provided in the plating apparatus 1000. As an example, the plating apparatus 1000 may include an imaging sensor (not shown) such as a camera that captures the surface to be plated Wf-a of the substrate Wf. Then, the control module 800 may acquire the imaging data detected by the imaging sensor and acquire the resist pattern on the surface to be plated Wf-a by analyzing the imaging data. The acquisition of the resist pattern from the imaging data can be performed using a known method based on the shadow or feature points of the imaging data. Additionally, as an example, the control module 800 may acquire the resist pattern through an external input via wired or wireless communication.

[0076] Then, the control module 800 sets the operation scenarios of the antibody 450, the anode mask 426, and the shield 470 based on the acquired resist pattern (step S120). As a specific example, the control module 800 calculates the plating growth coefficient for each specified area of the surface to be plated Wf of the substrate Wf based on the acquired resist pattern, and sets the operation scenarios of each controlled object based on the calculated plating growth coefficient. Here, the plating growth coefficient is a parameter indicating the growth rate (formation rate) of the coating film in a state where the antibody 450, the anode mask 426, and the shield 470 do not shield the current at all. As an example, the plating growth coefficient can be the amount of coating film formed per unit time (e.g., 1 second) (e.g., nanometers). As a specific example, the control module 800 can calculate the opening ratio of the resist layer for each specified area based on the resist pattern, and calculate the plating growth coefficient based on the calculated opening ratio. This is because in an area where the opening ratio of the resist layer is large, the area where the coating film accumulates and the plating amount for forming a certain amount of coating film are large, and there is a tendency for the growth rate of the coating film to be smaller compared to an area where the opening ratio of the resist layer is small.

[0077] Figure 13 is a diagram schematically showing a resist pattern formed on the surface to be plated Wf-a of a substrate Wf in one embodiment. In Figure 13In [the figure], a resist opening is formed only in the cross-shaped region A1 with hatched lines, and the region A2 outside the cross-shaped region A1 becomes a non-opening region where no resist opening is formed. When performing a plating process on the substrate Wf with such a resist pattern, no plating current flows through the non-opening region, that is, the region A2, and the plating current flows only through the opening region, that is, the region A1. Further, in the present embodiment, while rotating the substrate holder 440 using the rotation mechanism 448, the plating process is performed. In the cross-shaped convex portion region in the region A1, particularly in the circumferential direction including the region A2, the plating current concentrates and the film thickness becomes large. In the present specification, when observing along the circumferential direction, the region where substantially all the resist openings are formed is referred to as the "central region B1" (in the example shown in Figure 13 it is a circular region surrounded by the inner dotted line C1). Further, when observing along the circumferential direction, the region that includes both the region where the resist opening is formed (opening region A1) and the region where the resist opening is not formed (non-opening region A2), and where the area of the opening region A1 is larger than the area of the non-opening region A2 in the circumferential direction is referred to as the "intermediate region B2" (in the example shown in Figure 13 it is an annular region surrounded by the dotted lines C1 and C2). Further, when observing along the circumferential direction, the region that includes both the opening region A1 and the non-opening region A2, and where the area of the opening region A1 is smaller than the area of the non-opening region A2 in the circumferential direction is referred to as the "outer peripheral region B3" (in the example shown in Figure 13 it is an annular region surrounded by the dotted lines C2 and C3). Further, in the example shown in Figure 13 the central region B1, the intermediate region B2, and the outer peripheral region B3 are sequentially provided from the center of the surface to be plated Wf-a toward the outer peripheral side, and no resist opening is formed on the outer peripheral side of the outer peripheral region B3. However, it is not limited to such an example, and any resist pattern may be formed on the substrate Wf.

[0078] Here, the anode hood 426 or the shield 470 provided in the plating module 400 can appropriately adjust the film formation rate for the vicinity of the outer peripheral edge of the surface to be plated Wf-a. However, when performing a plating process on the substrate Wf shown in Figure 13 the plating formation rate of the region closer to the inner peripheral side than the vicinity of the outer peripheral edge (particularly the intermediate region B2) relatively increases, and the thickness uniformity of the film may be impaired.

[0079] In contrast, in the plating module 400 of the above-described embodiment, it is configured such that by moving or rotating the inserts 456A to 456D and 560 disposed inside the impedance body 450, the opening amount of the through-hole 453 of the main body 452 can be adjusted. Thereby, the current flowing through the intermediate region B2 can be adjusted and the plating formation rate of the intermediate region B2 can be adjusted. As an example, in Figure 13In the substrate Wf, when the plating formation rate in the intermediate region B2 surrounded by the dotted lines C1 and C2 is relatively high, by moving or rotating the inserts 456A to 456D and 560, the opening amount of the through-hole 453 of the main body 452 is reduced, thereby reducing the thickness of the plating film formed in the intermediate region B2. Thus, as an example, even when performing a plating process on the Figure 13 substrate Wf shown, the thickness uniformity of the plating film can be improved. In addition, the plating module 400 of the present embodiment includes an anode mask 426 and a shielding body 470. Thus, for the intermediate region B2, the plating formation rate can be adjusted by moving or rotating the inserts 456A to 456D and 560, and for the outer peripheral region B3, the plating formation rate can be adjusted by the anode mask 426 and the shielding body 470. Therefore, the impedance body 450, the anode mask 426, and the shielding body 470 can be controlled to adjust the plating formation rate for each region of the substrate Wf, and the thickness uniformity of the plating film can be improved. In addition, the radial dimensions of the various inserts 456A to 456D of the impedance body 450 and the radial dimensions of the region of the insert 560 in which the through-hole 562 is formed may be set to be approximately the same size as the intermediate region B2, etc., and the dimensions may be determined based on the intermediate region B2.

[0080] Figure 14 is a flowchart showing an example of a method for setting the operation programs of the impedance body 450, the anode mask 426, and the shielding body 470 during the plating process by the control module 800. During the plating process, the Figure 14 method shown is executed instead of the Figure 12 method shown, or the operation program set by the Figure 12 method shown is corrected. In addition, the control module 800 may also set the operation programs of only a part of the impedance body 450, the anode mask 426, and the shielding body 470.

[0081] When starting the plating process (step S210), the control module 800 obtains in real time parameters related to the film deposition from the sensor 460 (step S220). In the present embodiment, parameters related to the film deposition are detected by the sensor 460 as the substrate Wf rotates. In one embodiment, the parameters related to the film deposition are detected at a plurality of locations along the radial direction on the surface to be plated Wf-a. The control module 800 calculates the film thickness distribution of the film deposited on the surface to be plated Wf-a based on the detection values of the sensor 460 (step S230). Then, the control module 800 sets the operation plans for the impedance body 450, the anode hood 426, and the shielding body 470 based on the calculated film thickness distribution (step S240). Before the plating process ends (step S250), the control module 800 repeatedly performs the processes of steps S220 to S240 to set the operation plans for the controlled objects. Then, the control module 800 controls the impedance body 450, the anode hood 426, and the shielding body 470 based on the set operation plans. In this way, by setting or correcting the operation plans for the impedance body 450, etc. during the plating process based on the parameters related to the film deposition obtained from the sensor 460, the uniformity of the film thickness of the film deposition can be further improved.

[0082] The present invention can also be described in the following manner.

[0083] [Mode 1] According to Mode 1, there is provided an impedance body for a plating apparatus for electric field adjustment, which is disposed between an anode and a holder for holding an object to be plated in the plating apparatus. The impedance body for the plating apparatus has a plate-shaped main body. The plate-shaped main body has an upper surface, a lower surface, and a plurality of through holes communicating the upper surface and the lower surface. The impedance body for the plating apparatus further has an insert disposed inside the main body. The insert has a plurality of through holes. The insert is movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the main body and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the main body.

[0084] [Mode 2] According to Mode 2, based on the impedance body for the plating apparatus of Mode 1, the plurality of through holes of the insert communicate with the upper surface and the lower surface of the insert.

[0085] [Mode 3] According to Mode 3, based on the impedance body for the plating apparatus of Mode 2, the insert has a first insert in the shape of an arc plate and a second insert in the shape of an arc plate. The impedance body for the plating apparatus further has an elastic member connecting between the first insert and the second insert. The elastic member is configured to apply a biasing force to the first insert and the second insert in the direction of the first position.

[0086] [Mode 4] According to Mode 4, on the basis of the impedance body for the plating apparatus in Mode 3, there is also a biasing member that moves the first insert body and the second insert body toward the second position against the biasing force of the elastic member.

[0087] [Mode 5] According to Mode 5, on the basis of the impedance body for the plating apparatus in Mode 3, the insert body has a third insert body in the shape of an arc plate and a fourth insert body in the shape of an arc plate. The impedance body for the plating apparatus also has a second elastic member that connects between the third insert body and the fourth insert body. The second elastic member is configured to apply a biasing force to the third insert body and the fourth insert body in the direction of the first position.

[0088] [Mode 6] According to Mode 6, on the basis of the impedance body for the plating apparatus in Mode 1, the insert body is a cylindrical member having the plurality of through holes, is inserted into the interior from the side surface of the plate-shaped main body, and can move between the first position and the second position by rotating around the central axis of the cylindrical member.

[0089] [Mode 7] According to Mode 7, on the basis of the impedance body for the plating apparatus in Mode 6, the plate-shaped main body is in the shape of a circular plate, the insert body has a plurality of the cylindrical members, and the plurality of cylindrical members are inserted along the radial direction of the plate-shaped main body.

[0090] [Mode 8] According to Mode 8, on the basis of the impedance body for the plating apparatus in Mode 7, the plurality of cylindrical members have different dimensions in the length direction.

[0091] [Mode 9] According to Mode 9, there is provided a plating apparatus having: a plating bath; an anode disposed in the plating bath; a holder for holding an object to be plated; and an impedance body for electric field adjustment disposed between the anode and the holder. The impedance body has a plate-shaped main body having an upper surface, a lower surface, and a plurality of through holes communicating the upper surface and the lower surface. The impedance body also has an insert body disposed inside the main body. The insert body has a plurality of through holes, and the insert body can move between a first position where the plurality of through holes of the insert body communicate with the plurality of through holes of the main body and a second position where the plurality of through holes of the insert body do not communicate with the plurality of through holes of the main body.

[0092] Description of Reference Numerals

[0093] Wf-a…Coated surface; Wf…Substrate; 400…Coating module; 410…Coating bath; 420…Diaphragm; 422…Cathode region; 424…Anode region; 430…Anode; 440…Substrate holder; 442…Lifting mechanism; 448…Rotating mechanism; 450…Resistance body; 452…Main body; 453…Through hole; 456A to 456D…Insertion body; 457A to 457D…Through hole; 459…Groove; 460…Sensor; 470…Masking body; 480…Agitator; 490…Biasing member; 492…Drive mechanism; 494…Through hole; 560…Insertion body; 562…Through hole; 564…Drive mechanism; 800…Control module; 1000…Coating apparatus.

Claims

1. An impedance body for a plating apparatus, which is an impedance body for electric field adjustment disposed between an anode and a holder for holding an object to be plated in a plating apparatus, wherein, the impedance body for the plating apparatus has a plate-shaped main body, and the plate-shaped main body has an upper surface, a lower surface, and a plurality of through holes communicating the upper surface and the lower surface; the impedance body for the plating apparatus further has an insert disposed inside the main body, and the insert has a plurality of through holes; the insert is movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the main body and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the main body.

2. The impedance body for the plating apparatus according to claim 1, wherein, the plurality of through holes of the insert communicate the upper surface and the lower surface of the insert.

3. The impedance body for the plating apparatus according to claim 2, wherein, the insert has a first insert in the shape of an arc plate and a second insert in the shape of an arc plate, the impedance body for the plating apparatus further has an elastic member connecting between the first insert and the second insert, the elastic member is configured to apply a biasing force to the first insert and the second insert in the direction of the first position.

4. The impedance body for the plating apparatus according to claim 3, wherein, a biasing member is further provided, and the biasing member moves the first insert and the second insert toward the second position against the biasing force of the elastic member.

5. The impedance body for the plating apparatus according to claim 3, wherein, the insert has a third insert in the shape of an arc plate and a fourth insert in the shape of an arc plate, the impedance body for the plating apparatus further has a second elastic member connecting between the third insert and the fourth insert, the second elastic member is configured to apply a biasing force to the third insert and the fourth insert in the direction of the first position.

6. The impedance body for the plating apparatus according to claim 1, wherein, the insert is a cylindrical member having the plurality of through holes, and is inserted into the inside from the side surface of the plate-shaped main body, and can be moved between the first position and the second position by rotating around the central axis of the cylindrical member.

7. The impedance body for the plating apparatus according to claim 6, wherein, the plate-shaped main body is in the shape of a circular plate, the insert has a plurality of the cylindrical members, and the plurality of cylindrical members are inserted along the radial direction of the plate-shaped main body.

8. The impedance body for the plating apparatus according to claim 7, wherein, the plurality of cylindrical members have different dimensional lengths in the longitudinal direction.

9. A plating apparatus, wherein, There is provided: a plating bath; an anode disposed in the plating bath; a holder for holding an object to be plated; and an impedance body for electric field adjustment disposed between the anode and the holder, the impedance body has a plate-shaped main body, and the plate-shaped main body has an upper surface, a lower surface, and a plurality of through holes communicating the upper surface and the lower surface. The antibody also has an insert disposed inside the main body, and the insert has a plurality of through holes. The insert is movable between a first position where the plurality of through holes of the insert communicate with the plurality of through holes of the main body and a second position where the plurality of through holes of the insert do not communicate with the plurality of through holes of the main body.

Images