Recovery device and reutilization method for silicon in waste photovoltaic module

Abstract

The invention discloses a recovery device and reutilization method for silicon in a waste photovoltaic module, the recovery device comprises an equipment base, an acid pickling recovery pool, a circulating liquid washing mechanism and a clamping seat, the acid pickling recovery pool is fixedly installed on the surface of the equipment base, a high-pressure air pump is fixedly installed on one side of the equipment base, and the high-pressure air pump is fixedly installed on the other side of the equipment base; an aerator communicated with the output end of the high-pressure air pump is arranged on the bottom face of the acid pickling recycling pool, a liquid injection end pipe and a circulation pipeline are arranged on the top face and one side of the acid pickling recycling pool respectively, and the circulation liquid washing mechanism is fixedly installed on the inner side of the acid pickling recycling pool. According to the invention, the automatic ultrasonic pickling structure is arranged, the pickling recovery pool is used for filling the chemical solvent, the cavitation effect is formed on the surface of the silicon wafer carried by the pickling solution through ultrasonic oscillation in solvent pickling, the silicon wafer and EVA are separated, more than 99% of polymer is removed from the PV module, and the processed silicon wafer is good in integrity; the silicon wafer is almost free of fracture damage, and the recovery value is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of material recycling, and specifically to a device for recycling silicon in waste photovoltaic modules and a method for reusing the same. Background Technique

[0003] The following several methods are commonly used in the prior art to recycle photovoltaic modules: 1. Physical method: The photovoltaic module is physically crushed into particles, the particles are screened and classified, and then recycled separately; 2. Pyrolysis method: The photovoltaic module is directly heated at a temperature above 500 °C, and the EVA material layer is removed through a reaction to achieve the separation of other layer structures; 3. Solvent method: A solvent is used to dissolve or swell the EVA material layer to separate other layer structures.

[0004] Patent CN208912062U proposes a recycling device for waste photovoltaic cells, which is used to leach silver from waste photovoltaic cell powder through nitric acid. The waste photovoltaic cell powder and pure water are added into a reaction kettle, stirred evenly by a stirring component, and then nitric acid is added through an acid inlet pipe. The hydrogen generated during the reaction is discharged through a hydrogen separator to avoid explosion caused by excessive hydrogen content; an oxygen supplement component is used to convert the waste gas generated during the nitric acid leaching reaction into nitric acid to reduce acid consumption; pressure leaching is adopted to improve the metal leaching effect.

[0005] Currently, various physical and chemical methods are used for recycling waste photovoltaic modules, all of which require crushing the waste photovoltaic modules to improve the contact efficiency between the solution and the waste photovoltaic modules, thereby improving the leaching efficiency. However, there are a large number of fine particles in the crushed waste photovoltaic module particles, which interfere with the leaching and precipitation of subsequent recyclables. Moreover, the crushed silicon wafers can only be recycled as building materials with low economic value and cannot be reused or applied to other electronic product components.

[0006] In view of this, in response to the existing problems, research and improvement are carried out to provide a device for recycling silicon in waste photovoltaic modules and a method for reusing the same, so as to solve the problems of low recycling economic value and cumbersome operation currently existing. The aim is to achieve the purpose of solving the problems and improving the practical value through this technology. Summary of the Invention

[0007] The present invention aims to solve one of the technical problems existing in the prior art or related technologies.

[0008] To this end, the technical solution adopted by the present invention is as follows: A silicon recovery device for waste photovoltaic modules, comprising: an equipment base, a pickling recovery tank, a circulating liquid washing mechanism, and a clamping seat. The pickling recovery tank is fixedly installed on the surface of the equipment base. A high-pressure air pump is fixedly installed on one side of the equipment base. An aerator communicated with the output end of the high-pressure air pump is provided at the bottom surface of the pickling recovery tank. A liquid injection end pipe and a circulating pipeline are respectively provided at the top surface and one side of the pickling recovery tank. The circulating liquid washing mechanism is fixedly installed inside the pickling recovery tank. A plurality of ultrasonic generators are embedded and installed inside the pickling recovery tank. The circulating liquid washing mechanism includes an installation frame, a driving motor, a circulating sprocket, and a tension maintaining component. The output end of the driving motor is in transmission connection with the input end of the circulating sprocket. The circulating sprocket is rotatably installed on the surface of the installation frame. The tension maintaining component is fixedly installed on the surface of the installation frame. The circulating sprocket includes a sprocket and a chain structure. The chain is movably sleeved outside the sprocket and a metal bar is fixedly installed on the surface of the sprocket. A permanent magnet block is embedded and installed on the surface of the clamping seat. The clamping seat includes a magnetic absorption strip rod and clamping claws arranged inside the magnetic absorption strip rod. A fixed slot is provided inside the magnetic absorption strip rod. The number of clamping claws is two groups and they are symmetrically arranged inside the fixed slot. The two ends of the clamping claws are respectively provided with a first clamping end and a second clamping end.

[0009] In a preferred example, the present invention can be further configured as follows: A circulating liquid pump is fixedly connected to the ends of the circulating pipeline and the liquid injection end pipe. One end of the circulating pipeline is communicated with the inner cavity of the pickling recovery tank. The liquid injection end pipe is communicated with the top end of the pickling recovery tank.

[0010] By adopting the above technical solution, the liquid flow is led out from the circulating pipeline by the circulating liquid pump and pumped back into the pickling recovery tank through the liquid injection end pipe for circulating pumping of the liquid flow, improving the liquid flow efficiency. The circulating liquid flow repeatedly flushes on the surface of the silicon wafer to dissolve the EVA adhesive.

[0011] In a preferred example, the present invention can be further configured as follows: A plurality of aeration grilles are provided inside the pickling recovery tank. The aeration grilles are evenly spaced. A plurality of aeration grilles are distributed at different heights in sequence. The aeration grilles are communicated with the output end of the aerator.

[0012] By adopting the above technical solution, the output air flow of the high-pressure air pump is distributed to each aeration grille by the aerator for export. The aeration grilles at different heights ensure that the bubbles are distributed layer by layer to fill each spatial layer of the pickling recovery tank, ensuring the treatment effect inside the pickling recovery tank under ultrasonic cavitation treatment.

[0013] In a preferred embodiment, the present invention can be further configured as follows: The number of the ultrasonic generators is several and they are evenly distributed on the inner wall surface of the pickling recovery tank. The input end of the ultrasonic generator is electrically connected to a current generator and a controller.

[0014] By adopting the above technical solution, the current generator and the controller are used to input current to generate high-frequency ultrasonic vibrations through the ultrasonic generator. The physical adhesion on the surface of the silicon wafer can be removed by ultrasonic waves, and the cavitation of the liquid can also make the pickling solution fully contact with the adhesives such as EVA, improving the reaction dissolution efficiency of the adhesives in the liquid.

[0015] In a preferred embodiment, the present invention can be further configured as follows: The clamping jaw is rotatably installed inside the fixed slot. One end of the second clamping end is close to the rotation fulcrum of the clamping jaw. The clamping jaw is made of an elastic material structure, and the first clamping end and the second clamping end are made of rubber material components.

[0016] By adopting the above technical solution, by inserting the silicon wafer inside the fixed slot, the clamping jaw is deflected by the abutting action between the silicon wafer and the surface of the second clamping end. After deflection, the first clamping end abuts against the surface of the silicon wafer to clamp the silicon wafer and move uniformly inside the pickling recovery tank following the transmission of the circulating liquid washing mechanism.

[0017] In a preferred embodiment, the present invention can be further configured as follows: The tension maintaining assembly includes a fixed end fixed on the surface of the installation frame and a driving rod fixedly installed on the bottom surface of the fixed end. The output end of the driving rod is fixedly connected with a moving guide block, and a tension transmission block slidably abutting against the surface of the chain is fixedly installed on one side of the moving guide block.

[0018] By adopting the above technical solution, the driving rod is used to drive the tension transmission block to abut against the surface of the chain, maintaining the stable tension of the chain during the chain transmission. During the transmission of the clamped silicon wafer, due to the influence of the liquid resistance, the surface of the silicon wafer and the chain are easily deformed and slip off the surface of the sprocket. By adding the tension maintaining assembly, the tension in the chain transmission is ensured to eliminate this influence.

[0019] In a preferred embodiment, the present invention can be further configured as follows: The output end of the driving motor is provided with a driving main shaft fixedly connected to the input shaft of the circulating sprocket. A monitoring disk is fixedly installed on one side of the driving main shaft. A number of measuring grooves are evenly formed on the surface of the monitoring disk. A measuring sensor is fixedly installed on the surface of the installation frame, and one end of the measuring sensor elastically abuts against the surface of the monitoring disk.

[0020] By adopting the above technical solution, during the rotation of the circulating sprocket drive, the metering sensor abuts against the surface of the monitoring disk and fits into the passing counting grooves, so as to determine the motion state of the circulating sprocket and obtain data, better judge the survival time of the wafer in the pickling recovery tank, and avoid damage to the silicon wafer caused by excessive pickling.

[0021] A method for recycling silicon in waste photovoltaic modules includes the following operation steps: S1: Place the disassembled waste photovoltaic module flat into the box furnace with the glass wool facing down and the backplane facing up, and treat it at an intracranial temperature of 480 °C for 35 min. Use heat treatment to soften the encapsulation structure, peel the surface, and the backplane fall off freely, and then take out the silicon wafer layer containing the encapsulation material inside completely. S2: Clamp and fix the silicon wafer layer containing the encapsulation material to the inner side of the clamping seat and magnetically fix it on the surface of the circulating sprocket. Add a mixed acid solution of nitric acid and hydrogen peroxide with a concentration of 60-85% into the pickling recovery tank, with an ultrasonic power of 900 W and a temperature of 45 °C. S3: Under continuous solution agitation and ultrasonic oscillation, the mixed acid solution of nitric acid and hydrogen peroxide reacts chemically with residues such as EVA attached to the surface of the silicon wafer to corrode and remove them. After removal, pure crystalline silicon wafers are obtained, and they are washed repeatedly to remove acid, and then they can be recycled.

[0022] The beneficial effects achieved by the present invention are as follows: 1. In the present invention, by setting up an automatic ultrasonic pickling structure, the pickling recovery tank is used to fill the chemical solvent, and ultrasonic oscillation is used during solvent pickling to form a cavitation effect on the surface of the acid pickling solution and the silicon wafer, so that the silicon wafer and EVA are separated and cracked. More than 99% of the polymers are removed from the PV module. The integrity of the treated silicon wafer is good, and the silicon wafer has almost no fracture damage, improving its recycling value.

[0023] 2. In the present invention, by adopting a new liquid flow agitation structure, the silicon wafer obtained by heat treatment to separate the backplane and the glass panel is clamped by the clamping seat and magnetically fixed on the surface of the circulating liquid washing mechanism. Driven by the driving motor, the circulating sprocket rotates at a constant speed, and drives several wafers to move in the acid pickling solution tank through the clamping seat to fully contact with the acid pickling solution, thereby agitating the reaction liquid flow in the peripheral area of the wafer and improving the pickling treatment efficiency.

[0024] 3. In the present invention, by setting up a circulating liquid flow and an aeration structure, under the action of liquid flow circulation, the acid pickling solution circulates and flushes the surface of the wafer to improve the treatment efficiency with the acid pickling solution, and is input into the inside of the pickling recovery tank through the aeration grille by the input of the high-pressure air pump. The special adhesion of EVA is solved by using the bubbles introduced and ultrasonic cavitation bursting, and the removal efficiency of the attached substances is improved. Description of the Drawings

[0025] Figure 1Schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 Schematic cross-sectional structure diagram of the pickling recovery tank of an embodiment of the present invention; Figure 3 Schematic structure diagram of the circulating liquid washing mechanism of an embodiment of the present invention; Figure 4 Schematic structure diagram of the circulating liquid washing mechanism and the clamping seat of an embodiment of the present invention; Figure 5 Schematic structure diagram of the tension maintaining assembly of an embodiment of the present invention; Figure 6 Schematic structure diagram of the clamping seat of an embodiment of the present invention.

[0026] Reference numerals: 100, equipment base; 110, high-pressure air pump; 120, circulation pipeline; 200, pickling recovery tank; 210, liquid injection end pipe; 220, aerator; 230, ultrasonic generator; 221, aeration grid; 300, circulating liquid washing mechanism; 310, installation frame; 320, drive motor; 330, circulating sprocket; 340, tension maintaining assembly; 321, drive main shaft; 322, monitoring disk; 323, metering sensor; 341, fixed end; 342, drive rod; 343, moving guide block; 344, tension transmission block; 400, clamping seat; 410, magnetic strip rod; 420, clamping jaw; 411, fixed slot; 421, first clamping end; 422, second clamping end. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below in conjunction with the specific implementation manners and with reference to the accompanying drawings. It should be noted that, without conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0028] It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention.

[0029] The following describes a silicon recovery device and a recycling method for waste photovoltaic modules provided by some embodiments of the present invention in conjunction with the accompanying drawings.

[0030] Combined with Figures 1-6As shown in the figure, a silicon recovery device for waste photovoltaic modules provided by the present invention includes: an equipment base 100, a pickling recovery tank 200, a circulating liquid washing mechanism 300, and a clamping seat 400. The pickling recovery tank 200 is fixedly installed on the surface of the equipment base 100. A high-pressure air pump 110 is fixedly installed on one side of the equipment base 100. An aerator 220 communicated with the output end of the high-pressure air pump 110 is arranged on the bottom surface of the pickling recovery tank 200. A liquid injection end pipe 210 and a circulation pipeline 120 are respectively arranged on the top surface and one side of the pickling recovery tank 200. The circulating liquid washing mechanism 300 is fixedly installed inside the pickling recovery tank 200. A plurality of ultrasonic generators 230 are embedded and installed inside the pickling recovery tank 200; the circulating liquid washing mechanism 300 includes an installation frame 310, a driving motor 320, a circulating sprocket 330, and a tension maintaining component 340. The output end of the driving motor 320 is in transmission connection with the input end of the circulating sprocket 330. The circulating sprocket 330 is rotatably installed on the surface of the installation frame 310. The tension maintaining component 340 is fixedly installed on the surface of the installation frame 310. The circulating sprocket 330 includes a sprocket and a chain structure. The chain is movably sleeved on the outside of the sprocket, and a metal strip is fixedly installed on the surface of the sprocket. A permanent magnet block is embedded and installed on the surface of the clamping seat 400; the clamping seat 400 includes a magnetic attraction bar 410 and a clamping jaw 420 arranged inside the magnetic attraction bar 410. A fixed slot 411 is arranged inside the magnetic attraction bar 410. The number of clamping jaws 420 is two groups and they are symmetrically arranged inside the fixed slot 411. The two ends of the clamping jaw 420 are respectively provided with a first clamping end 421 and a second clamping end 422.

[0031] In this embodiment, a circulating liquid pump is fixedly connected to the ends of the circulation pipeline 120 and the liquid injection end pipe 210. One end of the circulation pipeline 120 is communicated with the inner cavity of the pickling recovery tank 200, and the liquid injection end pipe 210 is communicated with the top end of the pickling recovery tank 200.

[0032] Specifically, the circulating liquid pump is used to export the liquid flow from the circulation pipeline 120 and pump it back into the pickling recovery tank 200 through the liquid injection end pipe 210 for circulating pumping of the liquid flow, improving the liquid flow efficiency. The circulating liquid flow repeatedly flushes the surface of the silicon wafer, dissolving the EVA adhesive. More than 99% of the polymers are removed from the PV module. The processed silicon wafer has good integrity, and there are almost no fractures or damages to the silicon wafer, improving its recovery value.

[0033] In this embodiment, a plurality of aeration grilles 221 are arranged inside the pickling recovery tank 200. The aeration grilles 221 are evenly spaced, and a plurality of aeration grilles 221 are distributed at different heights in sequence. The aeration grilles 221 are communicated with the output end of the aerator 220.

[0034] Specifically, the output air flow of the high-pressure air pump 110 is distributed by the aerator 220 to each aeration grid 221 for derivation. The aeration grids 221 at different heights ensure that the bubbles are distributed layer by layer to fill the spatial stratification of each pickling recovery tank 200. Under the ultrasonic cavitation treatment, the treatment effect in the pickling recovery tank 200 is ensured. By introducing bubbles and ultrasonic cavitation explosion, the special adhesion of EVA is solved, and the removal efficiency of the attached substances is improved.

[0035] In this embodiment, the number of ultrasonic generators 230 is several and they are evenly distributed on the inner wall surface of the pickling recovery tank 200. The input end of the ultrasonic generator 230 is electrically connected to a current generator and a controller.

[0036] Specifically, by using the current generator and the controller to input current, high-frequency ultrasonic oscillations are generated through the ultrasonic generator 230. The physical removal of the adhesives on the silicon wafer surface can be achieved through ultrasonic waves, and the pickling solution and adhesives such as EVA can be fully contacted through the cavitation of the liquid, improving the reaction dissolution efficiency of the adhesives in the liquid.

[0037] In this embodiment, the clamping jaw 420 is rotatably installed inside the fixed slot 411. One end of the second clamping end 422 is close to the rotation fulcrum of the clamping jaw 420. The clamping jaw 420 is made of an elastic material structure, and the first clamping end 421 and the second clamping end 422 are made of rubber material components.

[0038] Specifically, by inserting the silicon wafer inside the fixed slot 411, the clamping jaw 420 is deflected by the abutting action between the silicon wafer and the surface of the second clamping end 422. After deflection, the first clamping end 421 abuts against the surface of the silicon wafer to clamp the silicon wafer. Following the transmission of the circulating liquid washing mechanism 300, it moves uniformly inside the pickling recovery tank 200. By driving a number of wafers to move in the pickling solution tank and fully contact the pickling solution, the reaction liquid flow around the wafers is agitated, improving the pickling treatment efficiency.

[0039] In this embodiment, the tension maintaining assembly 340 includes a fixed end 341 fixed to the surface of the mounting frame 310, and a driving rod 342 fixedly installed on the bottom surface of the fixed end 341. The output end of the driving rod 342 is fixedly connected with a moving guide block 343, and a tension transmission block 344 that slidably abuts against the surface of the chain is fixedly installed on one side of the moving guide block 343.

[0040] Specifically, the driving rod 342 is used to drive the tension transmission block 344 to abut against the surface of the chain, maintaining the stable tension of the chain during the chain transmission. During the clamping and transmission of the silicon wafer, due to the influence of the liquid resistance, the surface of the silicon wafer and the chain are easily deformed and slip off the sprocket surface. By adding the tension maintaining assembly 340, the tension in the chain transmission is ensured, thereby eliminating this influence.

[0041] In this embodiment, a driving main shaft 321 fixedly connected to the input shaft of the circulating sprocket 330 is provided at the output end of the driving motor 320. A monitoring disk 322 is fixedly installed on one side of the driving main shaft 321. A plurality of measuring grooves are evenly formed on the surface of the monitoring disk 322. A measuring sensor 323 is fixedly installed on the surface of the installation frame 310. One end of the measuring sensor 323 is elastically abutted against the surface of the monitoring disk 322.

[0042] Specifically, during the transmission and rotation of the circulating sprocket 330, the measuring sensor 323 abuts against and adheres to the surface of the monitoring disk 322 to count the passing of the measuring grooves, so as to determine the motion state of the circulating sprocket 330 and obtain data, better judge the survival time of the wafer in the pickling recovery tank 200, and avoid damage to the silicon wafer caused by excessive pickling.

[0043] A method for recycling silicon in waste photovoltaic modules includes the following operating steps: S1: Place the disassembled waste photovoltaic module flat into a box furnace with the glass wool facing down and the backplane facing up, and treat it at an intracranial temperature of 480 °C for 35 min. Use heat treatment to soften the encapsulation structure, peel the surface, and the backplane falls off freely, and then take out the silicon wafer layer containing the encapsulation material inside completely; S2: Clamp and fix the silicon wafer layer containing the encapsulation material to the inside of the clamping seat 400 and magnetically fix it to the surface of the circulating sprocket 330. Add a mixed acid solution of nitric acid and hydrogen peroxide with a concentration of 60 - 85% into the pickling recovery tank 200, with an ultrasonic power of 900 W and a temperature of 45 °C; S3: Under continuous solution agitation and ultrasonic oscillation, the mixed acid solution of nitric acid and hydrogen peroxide reacts chemically with residues such as EVA attached to the silicon wafer surface to corrode and remove them. After removal, a pure crystalline silicon wafer is obtained, and repeated water washing is performed to remove acid, and then it can be recycled.

[0044] In the present invention, the term "plurality" refers to two or more, unless otherwise clearly defined. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "connection" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] It should be noted that when an element is referred to as being "assembled on", "installed on", "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0046] In the description of this specification, the description of terms such as "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or instance. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0047] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon recovery device for waste photovoltaic modules, characterized in that, Including: A device base (100), a pickling recovery tank (200), a circulating liquid washing mechanism (300), and a clamping seat (400). The pickling recovery tank (200) is fixedly installed on the surface of the device base (100). A high-pressure air pump (110) is fixedly installed on one side of the device base (100). An aerator (220) communicated with the output end of the high-pressure air pump (110) is provided at the bottom surface of the pickling recovery tank (200). A liquid injection end pipe (210) and a circulating pipeline (120) are respectively provided at the top surface and one side of the pickling recovery tank (200). The circulating liquid washing mechanism (300) is fixedly installed inside the pickling recovery tank (200). A plurality of ultrasonic generators (230) are embedded and installed inside the pickling recovery tank (200). The circulating liquid washing mechanism (300) includes an installation frame (310), a driving motor (320), a circulating sprocket (330), and a tension maintaining component (340). The output end of the driving motor (320) is in transmission connection with the input end of the circulating sprocket (330). The circulating sprocket (330) is rotatably installed on the surface of the installation frame (310). The tension maintaining component (340) is fixedly installed on the surface of the installation frame (310). The circulating sprocket (330) includes a sprocket and a chain structure. The chain is movably sleeved outside the sprocket, and a metal strip is fixedly installed on the surface of the sprocket. A permanent magnet block is embedded and installed on the surface of the clamping seat (400). The clamping seat (400) includes a magnetic attraction strip rod (410) and clamping claws (420) arranged inside the magnetic attraction strip rod (410). A fixed slot (411) is provided inside the magnetic attraction strip rod (410). The number of the clamping claws (420) is two groups and they are symmetrically arranged inside the fixed slot (411). The two ends of the clamping claws (420) are respectively provided with a first clamping end (421) and a second clamping end (422).

2. The silicon recovery device in a waste photovoltaic module according to claim 1, characterized in that, Circulating liquid pumps are fixedly connected to the ends of the circulating pipeline (120) and the liquid injection end pipe (210). One end of the circulating pipeline (120) is communicated with the inner cavity of the pickling recovery tank (200). The liquid injection end pipe (210) is communicated with the top end of the pickling recovery tank (200).

3. The silicon recovery device for waste photovoltaic modules according to claim 1, characterized in that, A plurality of aeration grilles (221) are provided inside the pickling recovery tank (200). The aeration grilles (221) are evenly spaced. The plurality of aeration grilles (221) are distributed at different heights in sequence. The aeration grilles (221) are communicated with the output end of the aerator (220).

4. The silicon recovery device for waste photovoltaic modules according to claim 1, wherein The number of the ultrasonic generators (230) is several and they are evenly distributed on the inner wall surface of the pickling recovery tank (200). The input end of the ultrasonic generator (230) is electrically connected to a current generator and a controller.

5. The silicon recovery device in a waste photovoltaic module according to claim 1, characterized in that, The clamping claws (420) are rotatably installed inside the fixed slot (411). One end of the second clamping end (422) is close to the rotation fulcrum of the clamping claws (420). The clamping claws (420) are made of an elastic material structure. The first clamping end (421) and the second clamping end (422) are made of rubber material components.

6. The silicon recovery device for waste photovoltaic modules according to claim 1, characterized in that, The tension maintaining component (340) includes a fixed end (341) fixed to the surface of the mounting frame (310), and a driving rod (342) fixedly mounted on the bottom surface of the fixed end (341). The output end of the driving rod (342) is fixedly connected with a moving guide block (343), and a tension transmission block (344) which is in sliding contact with the surface of the chain is fixedly mounted on one side of the moving guide block (343).

7. The recycling device for silicon in waste photovoltaic modules according to claim 1, characterized in that, The output end of the driving motor (320) is provided with a driving main shaft (321) fixedly connected with the input shaft of the circulating sprocket (330). A monitoring disc (322) is fixedly mounted on one side of the driving main shaft (321). A plurality of measuring grooves are evenly formed on the surface of the monitoring disc (322). A measuring sensor (323) is fixedly mounted on the surface of the mounting frame (310), and one end of the measuring sensor (323) is elastically in contact with the surface of the monitoring disc (322).

8. A method for recycling silicon in waste photovoltaic modules, characterized in that, It includes the following operation steps: S1: Place the disassembled waste photovoltaic module flat into the box furnace with the glass wool facing down and the backplane facing up, and treat it at an intracranial temperature of 480 °C for 35 minutes. Use heat treatment to soften the encapsulation structure, peel the surface, and the backplane falls off freely. Then take out the silicon wafer layer containing the encapsulation material inside completely; S2: Clamp and fix the silicon wafer layer containing the encapsulation material to the inside of the clamping seat (400) and magnetically fix it to the surface of the circulating sprocket (330). Add a mixed acid solution of nitric acid and hydrogen peroxide with a concentration of 60 - 85% into the pickling recovery tank (200), with an ultrasonic power of 900 W and a temperature of 45 °C; S3: Under continuous solution agitation and ultrasonic oscillation, the mixed acid solution of nitric acid and hydrogen peroxide reacts chemically with the residues such as EVA attached to the surface of the silicon wafer to corrode and remove them. After removal, a pure silicon wafer is obtained, and it is washed repeatedly with water to remove acid, and then it can be recycled.

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