PCB board blind hole processing method, device, laser drilling equipment and storage medium

Abstract

The present invention discloses a method, device, laser drilling equipment and storage medium for processing blind holes in a PCB board. The laser drilling equipment includes a picosecond or femtosecond laser and a CO2 laser. After determining a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser, on the one hand, cold processing is performed on a surface copper layer by the picosecond or femtosecond laser to form an annular heat-insulating groove, which can prevent the surface copper layer from generating hanging copper at the opening of the blind hole. On the other hand, the annular heat-insulating groove can block the heat generated by the CO2 laser during blind hole processing from diffusing to the opening of the blind hole on the surface copper layer, further preventing the generation of hanging copper. On the other hand, a picosecond or femtosecond laser with low processing efficiency is used to circumferentially cut the annular heat-insulating groove in the surface copper layer, and then a CO2 laser with high processing efficiency is used to remove material from the area within the outer contour of the annular heat-insulating groove to achieve drilling. This takes into account the processing efficiencies of the two lasers with different processing efficiencies, thereby improving the laser drilling efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and in particular to a PCB board blind hole processing method, device, laser drilling equipment and storage medium. Background Art

[0002] In a PCB (Printed Circuit Board) with two or more layers, holes are usually drilled to achieve electrical connections between different layers. A blind via is a hole that goes from an outer layer to an inner layer but does not penetrate the entire PCB.

[0003] like Figure 1 Figure (a) shows a schematic diagram of a blind via. The PCB includes a top copper layer 2 and a bottom copper layer 3 separated by a dielectric layer 1. Blind vias 4 penetrate both top copper layer 2 and dielectric layer 1. Currently, laser drilling is widely used in PCB production due to its ability to achieve small apertures, high precision, and high-density drilling. CO2 laser drilling is also often used in laser drilling because it can effectively cut through dielectric layer 1, eliminates the need for pretreatment of the top copper layer 2, and offers high drilling speeds.

[0004] like Figure 1 As shown in Figure b, CO2 laser drilling is a thermal process with high laser energy. When CO2 laser cuts the surface copper layer 2, it is easy to form overhanging copper 5, which needs to be further processed. Summary of the Invention

[0005] The present invention provides a method and device for processing blind holes in a PCB board, a laser drilling device and a storage medium, so as to solve the problem that hanging copper is easily formed when blind holes are processed in a PCB board using a CO2 laser.

[0006] In a first aspect, the present invention provides a method for processing blind holes on a PCB board, which is used to control a laser drilling device to process blind holes on a PCB board, wherein the laser drilling device includes a CO2 laser and a picosecond or femtosecond laser. The method for processing blind holes on a PCB board includes:

[0007] Providing a PCB board, the PCB board comprising a surface copper layer and a bottom copper layer separated by a dielectric layer;

[0008] Determining a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser;

[0009] Controlling the picosecond or femtosecond laser to form an annular thermal insulation groove penetrating the surface copper layer on the PCB board according to the first processing parameters, and controlling the CO2 laser to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove according to the second processing parameters to obtain a blind hole penetrating the surface copper layer and the dielectric layer;

[0010] The hole wall of the blind hole is metallized to obtain a PCB board with the blind hole processed.

[0011] In a second aspect, the present invention provides a PCB board blind hole processing device for controlling a laser drilling device to process blind holes on a PCB board, wherein the laser drilling device includes a CO2 laser and a picosecond or femtosecond laser. The PCB board blind hole processing device includes:

[0012] A PCB board providing module is used to provide a PCB board, wherein the PCB board includes a surface copper layer and a bottom copper layer separated by a dielectric layer;

[0013] a processing parameter determination module, configured to determine a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser;

[0014] a blind hole processing module, configured to control the picosecond or femtosecond laser to cut an annular thermal insulation groove on the PCB board according to the first processing parameters, and to control the CO2 laser to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove according to the second processing parameters, thereby forming a blind hole that penetrates the surface copper layer and the dielectric layer;

[0015] The blind hole processing module is used to perform metallization processing on the hole wall of the blind hole to obtain a PCB board after the blind hole is processed.

[0016] In a third aspect, the present invention provides a laser drilling device, comprising:

[0017] at least one processor; and

[0018] a memory communicatively connected to the at least one processor; wherein,

[0019] The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the PCB board blind hole processing method described in the first aspect of the present invention.

[0020] In a fourth aspect, the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the PCB board blind hole processing method described in the first aspect of the present invention when executed.

[0021] The laser drilling equipment of the present invention includes a picosecond or femtosecond laser and a CO2 laser. After determining a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser, the picosecond or femtosecond laser is controlled according to the first processing parameter to cut the surface copper layer of the PCB board to form an annular heat-insulating groove that penetrates the surface copper layer, and the CO2 laser is controlled according to the second processing parameter to remove the surface copper layer and the dielectric layer within the outer contour of the annular heat-insulating groove to obtain a blind hole that penetrates the surface copper layer and the dielectric layer. Finally, the blind hole is metallized. On the one hand, the surface copper layer is cut by the picosecond or femtosecond laser. The layer is cold-processed to form an annular heat-insulating groove, which can avoid the generation of hanging copper in the surface copper layer at the opening of the blind hole. On the other hand, the annular heat-insulating groove can block the heat generated by the CO2 laser during blind hole processing from diffusing to the opening of the blind hole on the surface copper layer, further avoiding the generation of hanging copper. On the other hand, a picosecond or femtosecond laser with low processing efficiency is used to cut an annular heat-insulating groove in the surface copper layer, and then a CO2 laser with high processing efficiency is used to remove material from the area within the outer contour of the annular heat-insulating groove to achieve drilling. This takes into account the processing efficiency of two lasers with different processing efficiencies, thereby improving the laser drilling efficiency.

[0022] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 This is a schematic diagram of the overhanging copper formed after CO2 laser processing of blind holes;

[0025] Figure 2 This is a flow chart of a method for processing blind holes in a PCB board provided in the first embodiment of the present invention;

[0026] Figure 3 It is a schematic diagram of the annular thermal insulation groove and blind hole obtained by circular cutting;

[0027] Figure 4 This is a flow chart of a method for processing blind holes in a PCB board provided in the second embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the optical path system for two types of laser asynchronous blind hole processing;

[0029] Figure 6 is a schematic diagram of a ring beam;

[0030] Figure 7 This is a flow chart of two types of laser asynchronous processing of blind holes;

[0031] Figure 8 This is a flow chart of a method for processing blind holes in a PCB board provided in the third embodiment of the present invention;

[0032] Figure 9 This is a schematic diagram of the optical path system for two lasers to simultaneously process blind holes;

[0033] Figure 10 is a schematic diagram of the coupled beam;

[0034] Figure 11 This is a flow chart of two lasers processing blind holes simultaneously;

[0035] Figure 12 This is a structural diagram of a PCB board blind hole processing device provided by the fourth embodiment of the present invention;

[0036] Figure 13 It is a structural schematic diagram of the laser drilling equipment provided in Example 5 of the present invention. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0038] Example 1

[0039] Figure 2 This is a flow chart of a method for processing blind holes on a PCB board provided in the first embodiment of the present invention. This embodiment is applicable to the case of processing blind holes on a PCB board. The method can be performed by a PCB board blind hole processing device. The PCB board blind hole processing device can be implemented in the form of hardware and / or software and can be configured in a laser drilling device. Figure 2 As shown, the PCB board blind hole processing method includes:

[0040] S201. Provide a PCB board, where the PCB board includes a surface copper layer and a bottom copper layer separated by a dielectric layer.

[0041] like Figure 3As shown in Figure a, the PCB board includes a dielectric layer 1 and a surface copper layer 2 and a bottom copper layer 3 located on two opposite sides of the dielectric layer 1. The dielectric layer 1 is a non-metallic layer, for example, its material can be a glass fiber reinforced epoxy resin composite material. The PCB board needs to be laser processed to penetrate the surface copper layer 2 and the dielectric layer 1 blind hole.

[0042] S202: Determine a first processing parameter of a picosecond or femtosecond laser and a second processing parameter of a CO2 laser.

[0043] In this embodiment, blind holes are processed on PCB boards by laser drilling equipment. The laser drilling equipment may include CO2 laser, picosecond laser or femtosecond laser. Among them, CO2 laser is a laser that uses CO2 gas as a working medium and can output infrared laser with a wavelength of 10.6μm. It has high power and good beam quality and mainly realizes drilling by evaporating materials through thermal effect. Picosecond laser is a laser with a pulse width of picosecond level ( ) laser, with a wavelength of 755nm, mainly uses ultra-short pulse energy to break up the processing object, which can reduce heat loss. Femtosecond laser has a pulse width of femtosecond level ( ) lasers have smaller wavelengths and mainly use non-thermal effects to achieve micron-level precision processing. Generally speaking, CO2 lasers belong to hot processing, while picosecond or femtosecond lasers belong to cold processing. Of course, hot processing and cold processing are relative in laser processing.

[0044] In this embodiment, the processing parameters of the picosecond or femtosecond laser may include laser wavelength, pulse frequency, laser power, single-pulse laser energy, scanning speed, number of pulses, laser spot overlap rate, etc. The processing parameters of the CO2 laser may include mask, processing energy, pulse frequency, number of pulses and pulse width, etc. When the laser beam is an annular beam, it also includes the beam diameter of the annular beam.

[0045] In this embodiment, the first processing parameters of the picosecond or femtosecond laser and the second processing parameters of the CO2 laser can be determined based on the blind via parameters and the structural parameters of the PCB board. For example, since the picosecond or femtosecond laser only processes the surface copper layer, the first processing parameters of the picosecond or femtosecond laser can be determined based on the aperture of the blind via and the thickness of the surface copper layer. The CO2 laser needs to process both the surface copper layer and the dielectric layer, and the second processing parameters of the CO2 laser can be determined based on the aperture of the blind via, the thickness of the surface copper layer, and the thickness of the dielectric layer. For example, a processing parameter table including first and second processing parameters corresponding to the aperture, thickness of the surface copper layer, thickness of the dielectric layer, and processing time can be pre-configured, and the first and second processing parameters can be obtained by searching the processing parameter table. Of course, the first and second processing parameters can also be determined by considering the quality indicators of the blind via. This embodiment does not limit the method for determining the first processing parameters of the picosecond or femtosecond laser and the second processing parameters of the CO2 laser.

[0046] S203, controlling a picosecond or femtosecond laser according to the first processing parameters to form an annular thermal insulation groove penetrating the surface copper layer on the PCB board, and controlling a CO2 laser according to the second processing parameters to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove to obtain a blind hole penetrating the surface copper layer and the dielectric layer.

[0047] In this embodiment, blind holes can be processed by asynchronous processing or synchronous processing. In the asynchronous processing, a picosecond or femtosecond laser is first used to perform circumferential cutting on the surface copper layer of the PCB board to form an annular thermal insulation groove penetrating the surface copper layer. After the complete annular thermal insulation groove is formed, a CO2 laser is used to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove to obtain a blind hole penetrating the surface copper layer and the dielectric layer.

[0048] Synchronous processing is to couple the beam of a picosecond or femtosecond laser with the beam of a CO2 laser to obtain a coupled beam. The picosecond or femtosecond beam and the CO2 beam in the coupled beam are processed simultaneously to form an annular thermal insulation groove by circular cutting and remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove during processing, thereby obtaining a blind hole that penetrates the surface copper layer and the dielectric layer.

[0049] like Figure 3 The following is a schematic diagram of the blind hole processing process. Figure 3 FIG. a includes a cross-sectional view and a top view of the annular heat-insulating groove 6 formed by circumferential cutting. According to the first processing parameter, the picosecond or femtosecond laser is controlled to cut the annular heat-insulating groove 6 on the surface copper layer 2 of the PCB board through the surface copper layer 2, and the closed area formed by the outer contour of the annular heat-insulating groove 6 is a blind hole area. Figure 3 As shown in FIG. 2 b, the CO2 laser is controlled according to the second processing parameter to remove the surface copper layer 2 and the dielectric layer 1 in the closed area formed by the outer contour of the annular heat-insulating groove 6 to obtain a blind hole 4.

[0050] like Figure 3 As shown, a picosecond or femtosecond laser is first used to cut the surface copper layer 2 of the PCB board to form an annular thermal insulation groove 6 that penetrates the surface copper layer 2. The annular thermal insulation groove 6 is essentially the opening of the blind hole 4 in the surface copper layer 2. Since the picosecond or femtosecond laser is a cold processing, the generation of hanging copper at the opening of the blind hole 4 in the surface copper layer 2 can be reduced or even avoided. In addition, when the CO2 laser removes the surface copper layer 2 and the dielectric layer 1 in the closed area formed by the outer contour of the annular thermal insulation groove 6, the isolation effect of the annular thermal insulation groove 6 can block the heat of the CO2 laser from diffusing to the surface copper layer 2, thereby avoiding the heat of the CO2 laser from forming a thermal effect on the surface copper layer 2 to generate hanging copper, further reducing or even avoiding the generation of hanging copper.

[0051] S204, performing metallization treatment on the hole wall of the blind hole to obtain a PCB board after the blind hole is processed.

[0052] Specifically, a copper layer can be formed on the hole wall of the blind hole by deposition or the like, so that the copper layer on the hole wall connects the surface copper layer 2 and the bottom copper layer 3, thereby achieving electrical connection between the surface copper layer 2 and the bottom copper layer 3.

[0053] The laser drilling equipment of the present invention includes a picosecond or femtosecond laser and a CO2 laser. When processing a blind hole on a PCB board, the picosecond or femtosecond laser is used to circumferentially cut the surface copper layer of the PCB board to form an annular thermal insulation groove that penetrates the surface copper layer, and the CO2 laser is used to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove to obtain a blind hole that penetrates the surface copper layer and the dielectric layer. Finally, the blind hole is metallized. On the one hand, the annular thermal insulation groove is formed by cold working the surface copper layer by the picosecond or femtosecond laser, which can prevent the surface copper layer from generating hanging copper at the opening of the blind hole. On the other hand, the annular thermal insulation groove can block the heat generated by the CO2 laser during the blind hole processing from diffusing to the opening of the blind hole on the surface copper layer, further preventing the generation of hanging copper. On the other hand, the picosecond or femtosecond laser with low processing efficiency is used to circumferentially cut the surface copper layer to form the annular thermal insulation groove, and the CO2 laser with high processing efficiency is used to remove material from the area within the outer contour of the annular thermal insulation groove to achieve drilling. This takes into account the processing efficiencies of two lasers with different processing efficiencies, thereby improving the laser drilling efficiency.

[0054] Example 2

[0055] Figure 4 This is a flow chart of a method for processing blind holes in a PCB board provided in the second embodiment of the present invention. The embodiment of the present invention is optimized based on the above-mentioned first embodiment. Figure 4 As shown, the PCB board blind hole processing method includes:

[0056] S401. Provide a PCB board, where the PCB board includes a surface copper layer and a bottom copper layer separated by a dielectric layer.

[0057] like Figure 3 As shown in Figure a, the PCB board includes a dielectric layer 1 and a surface copper layer 2 and a bottom copper layer 3 located on two opposite sides of the dielectric layer 1. The dielectric layer 1 is a non-metallic layer, for example, its material can be a glass fiber reinforced epoxy resin composite material. The PCB board needs to be laser processed to penetrate the surface copper layer 2 and the dielectric layer 1 blind hole.

[0058] Providing a PCB board in this embodiment may refer to placing the PCB board on a processing platform of a laser drilling device by manual or mechanical means.

[0059] S402: Obtain blind hole parameters and structural parameters of the PCB board.

[0060] In one example, a QR code can be set on the PCB board, and the laser drilling equipment can obtain the blind hole parameters and structural parameters of the PCB board by scanning the QR code, wherein the blind hole parameters may include parameters such as the aperture and depth of the blind hole, and the structural parameters may include parameters such as the surface copper layer thickness and dielectric layer thickness of the PCB board.

[0061] S403 : Determine first processing parameters of the picosecond or femtosecond laser and second processing parameters of the CO 2 laser based on the blind hole parameters and the structural parameters.

[0062] In one embodiment, a first processing parameter of a picosecond or femtosecond laser can be determined based on the aperture of the blind via and the thickness of the surface copper layer, and a second processing parameter of a CO2 laser can be determined based on the aperture, the thickness of the surface copper layer, and the thickness of the dielectric layer. For example, a processing parameter table can be pre-configured, including the first and second processing parameters corresponding to the aperture, the thickness of the surface copper layer, the thickness of the dielectric layer, and the processing time, and the first and second processing parameters can be obtained by searching the processing parameter table.

[0063] The following are examples of the first processing parameter and the second processing parameter:

[0064] The first processing parameters of picosecond or femtosecond laser:

[0065] The laser wavelength is 10nm-10um, the repetition frequency is 50Hz-10MHz, the laser power is 1-200W, the single pulse energy is 1uJ-10mJ, the scanning speed is 0.1m / s-10m / s, the number of pulses is 1-100, and the spot overlap rate is 1-100%. When the light beam is an annular beam, the diameter of the annular beam is equal to the blind hole aperture.

[0066] Second processing parameters of CO2 laser:

[0067] Mask size 0.1-10mm, processing energy 1-50mj, repetition frequency 50Hz-50KHz, pulse number 1-100, pulse width 1-50ms.

[0068] S404 , controlling the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter.

[0069] Figure 5 This is a schematic diagram of the optical path system of picosecond or femtosecond laser and CO2 laser in laser drilling equipment, as shown in Figure 5 As shown, after setting the parameters of the picosecond or femtosecond laser, such as the laser wavelength, repetition frequency, laser power, single pulse energy, scanning speed, number of pulses, and spot overlap rate, the picosecond or femtosecond laser can be controlled to emit picosecond or femtosecond laser light. The picosecond or femtosecond laser light emitted from the picosecond or femtosecond laser becomes a picosecond or femtosecond parallel beam after passing through the collimation and diffusion components.

[0070] S405 , controlling the annular beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond annular beam having a beam diameter equal to the blind hole aperture.

[0071] In this embodiment, the annular beam modulation component can be a component that modulates a parallel light beam into an annular beam. The annular beam means that when the light beam is irradiated onto a plane, the area covered by the light is an annular area, such as Figure 6 The diagram shows the annular beam irradiating a plane. Figure 6 The white area in the middle is the irradiation area of ​​the annular beam. The maximum diameter of the annular area is the diameter of the annular beam. In this embodiment, when the picosecond or femtosecond annular beam irradiates the surface copper layer of the PCB board, the maximum diameter of the area irradiated by the picosecond or femtosecond annular beam (the diameter of the outer contour of the annular area) is equal to the blind hole diameter. Specifically, Figure 5 As shown, the picosecond or femtosecond parallel light beam modulated by the collimation and diffusion components is split by a spectroscope to obtain a first light beam 11. The first light beam 11 enters the annular light beam modulation component. The annular light beam modulation component can be controlled to modulate the picosecond or femtosecond parallel light beam into a picosecond or femtosecond annular light beam with a beam diameter equal to the blind hole aperture, i.e., the second light beam 12. The specific modulation process of the annular light beam modulation component can refer to the existing technology and will not be described in detail here.

[0072] S406 , controlling the picosecond or femtosecond annular beam to cut the surface copper layer of the PCB board to form an annular thermal insulation groove penetrating the surface copper layer.

[0073] like Figure 5 As shown, the picosecond or femtosecond annular beam modulated by the annular beam modulator is irradiated on the position where the blind hole needs to be drilled on the PCB to be drilled, such as Figure 3 As shown in Figure a, under the action of the pulse energy of the picosecond or femtosecond annular beam, an annular thermal insulation groove 6 is formed in the surface copper layer 2 and penetrates the surface copper layer 2. The outer contour diameter of the annular thermal insulation groove 6 is equal to the blind hole diameter.

[0074] It should be noted that in practical applications, the picosecond or femtosecond parallel light beam can be directly focused on the surface copper layer to form a light spot. The width of the light spot is equal to the width of the annular thermal insulation groove. The annular thermal insulation groove 6 is obtained by processing the surface copper layer along a circular path through the focused picosecond or femtosecond light beam.

[0075] S407 , after forming an annular heat-insulating groove in the surface copper layer, controlling the CO 2 laser to emit a CO 2 parallel beam according to the second processing parameter.

[0076] After the annular insulation groove processing is completed on the surface copper layer, the picosecond or femtosecond laser can be turned off, or the picosecond or femtosecond laser can be switched to a CO2 laser, and the processing parameters of the CO2 laser can be set, such as the mask, processing energy, repetition frequency, number of pulses, pulse width and other parameters of the CO2 laser, and the CO2 laser can be controlled to emit a CO2 parallel beam after working according to the set processing parameters.

[0077] like Figure 5 As shown, the CO2 laser beam emitted by the CO2 laser enters the collimation and diffusion component. By controlling the collimation and diffusion component, the CO2 laser beam emitted by the CO2 laser can be modulated into a CO2 parallel beam.

[0078] S408 , controlling the beam splitter to split the CO 2 parallel beam according to the second processing parameter to obtain a split CO 2 beam.

[0079] like Figure 5 As shown, the CO2 parallel beam modulated by the collimation and diffusion components enters the reflector component and is reflected into the spectrometer. Then, the CO2 parallel beam is split according to the processing energy in the second processing parameter to obtain a third beam 13 with appropriate energy. The third beam 13 is the split CO2 parallel beam.

[0080] S409, using the split CO2 beam to remove the surface copper layer and the dielectric layer enclosed by the annular thermal insulation groove, to obtain a blind hole penetrating the surface copper layer and the dielectric layer.

[0081] like Figure 5 As shown, the third beam 13 obtained after the spectrometer is split is used to process the surface copper layer and the dielectric layer within the outer contour of the annular heat insulation groove 6 in the PCB board to remove the surface copper layer and the dielectric layer within the outer contour of the annular heat insulation groove 6, and obtain Figure 3 The blind hole 4 penetrating the surface copper layer and the dielectric layer is shown in Figure b.

[0082] S410: Obtain the quality inspection result of the blind hole, and determine whether the blind hole is qualified according to the quality inspection result.

[0083] After the CO2 laser processing is completed, the quality of the blind hole can be confirmed by slicing, and then the quality indicators of the blind hole can be observed and measured under a microscope to obtain the quality inspection results. For example, the quality indicators include the size of the overhanging copper, the length of the glass fiber, the residual glue at the bottom of the hole, the hole size, the hole bottom morphology, etc. The quality inspection results are used to determine whether the blind hole is qualified. If so, return to S401 to continue processing the blind hole on the next PCB board and execute S411. If not, return to S403 to adjust the first processing parameters and / or the second processing parameters. The specific parameter adjustment can refer to the existing technology of adjusting the laser parameters according to the drilling quality, which will not be described in detail here. In addition, it should be noted that S410 is not necessary. For example, S410 can be executed when processing the first piece of blind hole on the PCB. When processing blind holes on PCB boards in batches, S410 is executed to adjust the processing parameters for the first piece of blind hole until the blind hole quality is qualified. S410 does not need to be executed when processing blind holes on non-first pieces of PCB boards, or S410 is executed during random inspections.

[0084] S411, performing metallization treatment on the hole wall of the blind hole to obtain a PCB board after the blind hole is processed.

[0085] Specifically, a copper layer can be formed on the hole wall of the blind hole by deposition or the like, so that the copper layer on the hole wall connects the surface copper layer 2 and the bottom copper layer 3, thereby achieving electrical connection between the surface copper layer 2 and the bottom copper layer 3.

[0086] The following combination Figure 7 The process of two kinds of laser asynchronous processing of blind holes in this embodiment is described as follows: Figure 7 As shown in the figure, the blind hole processing process is as follows:

[0087] S1. After placing the PCB board on the processing platform, confirm the processing hole diameter and surface copper layer thickness of the PCB board. For example, the processing hole diameter is 150um;

[0088] S2. Set the circular cutting processing parameters of the picosecond or femtosecond laser according to the processing aperture and the thickness of the surface copper layer, for example, set the circular cutting aperture to 150 μm;

[0089] S3, controlling the picosecond or femtosecond laser to perform circular cutting on the surface copper layer to obtain an annular isolation groove;

[0090] S4. Set the processing parameters of CO2 laser according to the processing hole diameter and blind hole depth;

[0091] S5, performing CO2 laser processing on the area enclosed by the annular isolation groove to obtain a blind hole;

[0092] S6. Determine whether the blind hole is qualified. If so, execute S7. If not, return to S2.

[0093] S7. Metallization treatment of blind hole wall.

[0094] In this embodiment, a picosecond or femtosecond laser is first used to form an annular thermal insulation groove that penetrates the surface copper layer by circumferential cutting on the surface copper layer, and then a CO2 laser is used to process the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove to obtain a blind hole. On the one hand, the annular thermal insulation groove is formed by cold working the surface copper layer by a picosecond or femtosecond laser, which can avoid the generation of hanging copper in the surface copper layer at the opening of the blind hole. On the other hand, the annular thermal insulation groove can block the heat generated by the CO2 laser during the processing of the blind hole from diffusing to the opening of the blind hole on the surface copper layer, further avoiding the generation of hanging copper. On the other hand, a picosecond or femtosecond laser with low processing efficiency is used to form an annular thermal insulation groove by circumferential cutting on the surface copper layer, and then a CO2 laser with high processing efficiency is used to remove material from the area within the outer contour of the annular thermal insulation groove to achieve drilling. This takes into account the processing efficiency of two lasers with different processing efficiencies, thereby improving the laser drilling efficiency.

[0095] Furthermore, a picosecond or femtosecond laser is used to form an annular heat-insulating groove, and then a CO2 laser is used to further process the blind hole. The two lasers are processed asynchronously, which avoids mutual interference between the two lasers, making the processing accuracy of the two lasers higher, the effect of reducing the overhanging copper is better, and the size of the blind hole is more accurate.

[0096] Example 3

[0097] Figure 8 This is a flow chart of a method for processing blind holes in a PCB board provided by the third embodiment of the present invention. The embodiment of the present invention is optimized based on the above-mentioned first embodiment. Figure 8 As shown, the PCB board blind hole processing method includes:

[0098] S801. Provide a PCB board, wherein the PCB board includes a surface copper layer and a bottom copper layer separated by a dielectric layer;

[0099] S802, obtaining blind hole parameters and structural parameters of the PCB board;

[0100] S803 : Determine first processing parameters of the picosecond or femtosecond laser and second processing parameters of the CO 2 laser based on the blind hole parameters and the structural parameters.

[0101] S801-S802 of this embodiment are basically similar to S401-S403 in the second embodiment. For details, please refer to S401-S403 and will not be repeated here.

[0102] S804 , controlling the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter, and controlling the CO 2 laser to emit a CO 2 parallel beam according to the second processing parameter.

[0103] like Figure 9As shown, the laser drilling equipment of this embodiment can realize asynchronous processing of blind holes by picosecond or femtosecond lasers and CO2 lasers, and can also realize synchronous processing of blind holes by picosecond or femtosecond lasers and CO2 lasers. Specifically, Figure 5 Based on the optical path system shown in the figure, a ring beam modulation component, a dichroic mirror and an achromatic focusing objective lens are added.

[0104] After determining the first processing parameter and the second processing parameter, the picosecond or femtosecond laser can be controlled to operate according to the first processing parameter, and the CO2 laser can be controlled to operate according to the second processing parameter. The picosecond or femtosecond laser emitted by the picosecond or femtosecond laser is modulated into a picosecond or femtosecond parallel beam after passing through the collimation and diffusion components, and the CO2 laser emitted by the CO2 laser is modulated into a CO2 parallel beam after passing through the collimation and diffusion components.

[0105] S805 , controlling the ring beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond ring beam and coupling it to the dichroic mirror, wherein the beam diameter of the picosecond or femtosecond ring beam is equal to the blind hole aperture.

[0106] like Figure 9 As shown, when a picosecond or femtosecond laser and a CO2 laser are required to synchronously process blind holes, for the picosecond or femtosecond laser, the beam splitter can be controlled so that the picosecond or femtosecond parallel light beam modulated by the collimation and diffusion components only generates a fourth light beam 14 after passing through the beam splitter, and the beam splitter does not generate the first light beam 11. The fourth light beam 14 passes through the annular beam modulation component to obtain a picosecond or femtosecond annular beam that is coupled into the dichroic mirror.

[0107] S806 , controlling the beam splitter to split the CO 2 parallel light beam according to the second processing parameter to obtain the split CO 2 parallel light beam, and coupling it to the dichroic mirror.

[0108] like Figure 9 As shown, when a picosecond or femtosecond laser and a CO2 laser are required to synchronously process blind holes, for the CO2 laser beam, the beam splitter can be controlled so that the CO2 parallel beam modulated by the collimation and diffusion components is reflected by the reflector assembly to the beam splitter to only generate the fifth beam 15, and the beam splitter will not generate the third beam 13. The fifth beam 15 is coupled into the dichroic mirror.

[0109] S807 , coupling the picosecond or femtosecond annular beam and the split CO2 parallel beam through a dichroic mirror to obtain a coupled beam, where the coupled beam includes the picosecond or femtosecond annular beam and the CO2 parallel beam in the picosecond or femtosecond annular beam.

[0110] In the dichroic mirror, the picosecond or femtosecond ring beam is transmitted through the dichroic mirror, and the CO2 parallel beam is reflected through the dichroic mirror, so that the picosecond or femtosecond ring beam and the CO2 parallel beam are coupled to obtain a coupled beam.

[0111] like Figure 10 FIG2 is a schematic diagram of a coupled beam, which includes a picosecond or femtosecond ring beam A and a CO2 beam B located within the picosecond or femtosecond ring beam, wherein the spot size of the CO2 beam B can be modulated.

[0112] S808. Control the coupled beam to focus on the PCB board, so as to form an annular thermal insulation groove penetrating the surface copper layer by circular cutting in the surface copper layer of the PCB board using a picosecond or femtosecond annular beam, and synchronously remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove using a CO2 beam, thereby obtaining a blind hole penetrating the surface copper layer and the dielectric layer.

[0113] like Figure 9 As shown, the coupled light beam emitted by the dichroic mirror enters the achromatic focusing objective lens, and the achromatic focusing objective lens can be controlled to focus the coupled light beam (sixth light beam 16) onto the PCB board. On the PCB board, the picosecond or femtosecond ring light beam and the CO2 light beam synchronously process the opposite copper layer. Since the surface copper layer is metal, the processing efficiency of the opposite copper layer of the picosecond or femtosecond ring light beam is greater than the processing efficiency of the opposite copper layer of the CO2 light beam. As a result, the picosecond or femtosecond ring light beam will first cut the opposite copper layer to form an annular heat insulation groove, so as to prevent the CO2 light beam from causing a thermal effect on the opening of the blind hole in the surface copper layer to generate hanging copper.

[0114] S809, obtain the quality inspection result of the blind hole, and determine whether the blind hole is qualified according to the quality inspection result; if so, execute S801 and S810, otherwise return to S803.

[0115] S810, performing metallization processing on the hole wall of the blind hole to obtain a PCB board after the blind hole is processed.

[0116] S809-S810 in this embodiment are basically similar to S410-S411 in the second embodiment. For details, please refer to S410-S411 and will not be repeated here.

[0117] The following combination Figure 11 The process of synchronously processing blind holes with two lasers in this embodiment is described as follows: Figure 11 As shown in the figure, the blind hole processing process is as follows:

[0118] S1. After placing the PCB board on the processing platform, confirm the processing hole diameter, surface copper layer thickness and dielectric layer thickness of the PCB board. For example, the processing hole diameter is 150um.

[0119] S2. Set the picosecond or femtosecond laser circumferential cutting processing parameters according to the processing aperture, surface copper layer thickness, and dielectric layer thickness, for example, set the circumferential cutting aperture to 150 μm, and set the CO2 laser processing parameters;

[0120] S3, using the set processing parameters to simultaneously control the picosecond or femtosecond laser for ring cutting and control the CO2 laser processing;

[0121] S4. Determine whether the blind hole is qualified. If so, execute S5. If not, return to S2.

[0122] S5. Metallization treatment of blind hole wall.

[0123] It should be noted that when processing blind holes on PCB boards using laser drilling equipment, you can choose to use picosecond or femtosecond laser and CO2 laser asynchronous processing (such as in Example 2), or choose to use picosecond or femtosecond laser and CO2 laser synchronous processing (such as in Example 3). Specifically, Figure 9 As shown, during asynchronous processing, the two beam splitters in the optical path system are controlled so that after the laser generated by the picosecond or femtosecond laser passes through the beam splitter, only the first beam 11 but no fourth beam 14 is produced, and after the CO2 laser passes through the beam splitter, only the third beam 13 but no fifth beam 15 is produced. During synchronous processing, the two beam splitters in the optical path system are controlled so that after the laser generated by the picosecond or femtosecond laser passes through the beam splitter, only the fourth beam 14 but no first beam 11 is produced, and after the CO2 laser passes through the beam splitter, only the fifth beam 15 but no third beam 13 is produced. In actual production, asynchronous processing or synchronous processing can be selected as needed. For example, asynchronous processing can be selected when small overhang copper and high processing accuracy are required, and synchronous processing can be selected when high-efficiency production is required.

[0124] In this embodiment, a picosecond or femtosecond laser and a CO2 laser are coupled to obtain a coupled beam. When blind holes are processed by the coupled beam, an annular thermal insulation groove penetrating the surface copper layer is formed by circumferential cutting on the surface copper layer by the picosecond or femtosecond laser, and the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove are processed by the CO2 laser to obtain a blind hole. On the one hand, the annular thermal insulation groove is formed by cold processing the surface copper layer by the picosecond or femtosecond laser, which can avoid the generation of hanging copper on the surface copper layer at the opening of the blind hole. On the other hand, the annular thermal insulation groove can block the heat generated by the CO2 laser during the blind hole processing to diffuse to the opening of the blind hole on the surface copper layer, further avoiding the generation of hanging copper. On the other hand, the annular thermal insulation groove is formed by circumferential cutting on the surface copper layer with low processing efficiency, and then the CO2 laser with high processing efficiency is used to remove material from the area within the outer contour of the annular thermal insulation groove to achieve drilling. This takes into account the processing efficiency of two lasers with different processing efficiencies, thereby improving the laser drilling efficiency.

[0125] Furthermore, the picosecond or femtosecond laser and CO2 laser are coupled for synchronous processing, without switching the laser or changing the PCB board position, thereby improving the laser drilling efficiency.

[0126] Example 4

[0127] Figure 12 The schematic diagram of the structure of a PCB board blind hole processing device provided in the fourth embodiment of the present invention. The PCB board blind hole processing device is used to control a laser drilling device to process blind holes on a PCB board, wherein the laser drilling device includes a CO2 laser and a picosecond or femtosecond laser, such as Figure 12 As shown, the PCB board blind hole processing device includes:

[0128] A PCB board providing module 1201 is used to provide a PCB board, wherein the PCB board includes a surface copper layer and a bottom copper layer separated by a dielectric layer;

[0129] A processing parameter determination module 1202 is used to determine a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser;

[0130] a blind hole processing module 1203 for controlling the picosecond or femtosecond laser to cut an annular thermal insulation groove on the PCB board according to the first processing parameters to form an annular thermal insulation groove that penetrates the surface copper layer, and controlling the CO2 laser to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove according to the second processing parameters to obtain a blind hole that penetrates the surface copper layer and the dielectric layer;

[0131] The blind hole processing module 1204 is used to perform metallization processing on the hole wall of the blind hole to obtain a PCB board after the blind hole is processed.

[0132] Optionally, the processing parameter determination module 1202 includes:

[0133] A parameter acquisition unit, used to acquire blind hole parameters and structural parameters of the PCB board;

[0134] A processing parameter determination unit is used to determine a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser based on the blind hole parameter and the structural parameter.

[0135] Optionally, the blind hole parameters include hole diameter and hole depth, the structural parameters include surface copper layer thickness and dielectric layer thickness, and the processing parameter determination unit includes:

[0136] A first processing parameter determination subunit, configured to determine a first processing parameter of the picosecond or femtosecond laser based on the aperture and the thickness of the surface copper layer;

[0137] The second processing parameter determination subunit is used to determine the second processing parameter of the CO2 laser based on the aperture, the thickness of the surface copper layer and the thickness of the dielectric layer.

[0138] Optionally, the laser drilling device includes a ring beam modulation component, and the blind hole processing module 1203 includes:

[0139] a picosecond or femtosecond laser control unit, configured to control the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter;

[0140] a ring beam modulation unit, configured to control the ring beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond ring beam having a beam diameter equal to the blind hole aperture;

[0141] The ring cutting unit is used to control the picosecond or femtosecond ring beam to ring cut the surface copper layer of the PCB board to form an annular heat insulation groove that penetrates the surface copper layer.

[0142] Optionally, the laser drilling device further includes a spectroscope, and the blind hole processing module 1203 includes:

[0143] A CO2 laser control unit is configured to control the CO2 laser to emit a CO2 parallel beam according to the second processing parameter after the annular thermal insulation groove is formed on the surface copper layer;

[0144] A CO2 spectrometer is configured to control the spectrometer to split the CO2 parallel beam according to the second processing parameter to obtain a split CO2 beam;

[0145] The CO2 processing unit is used to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove by using the split CO2 beam to obtain a blind hole penetrating the surface copper layer and the dielectric layer.

[0146] Optionally, the laser drilling device includes a ring beam modulation component, a beam splitter, and a dichroic mirror, and the blind hole processing module 1203 includes:

[0147] a laser control unit, configured to control the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter, and to control the CO2 laser to emit a CO2 parallel beam according to the second processing parameter;

[0148] a ring beam modulation and coupling unit, configured to control the ring beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond ring beam and couple it to the dichroic mirror, wherein the beam diameter of the picosecond or femtosecond ring beam is equal to the blind hole aperture;

[0149] A CO2 beam modulation and coupling unit, configured to control the beam splitter to split the CO2 parallel beam according to the second processing parameter, and couple the split CO2 parallel beam to the dichroic mirror;

[0150] a beam coupling unit, configured to couple the picosecond or femtosecond annular beam and the split CO2 parallel beam through the dichroic mirror to obtain a coupled beam, wherein the coupled beam includes the picosecond or femtosecond annular beam and the CO2 parallel beam located in the picosecond or femtosecond annular beam;

[0151] The blind hole synchronous processing unit is used to control the coupling beam to focus on the PCB board, so as to form an annular thermal insulation groove penetrating the surface copper layer of the PCB board by circular cutting in the surface copper layer of the PCB board through the picosecond or femtosecond annular beam, and to synchronously remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove through the CO2 parallel beam, thereby obtaining a blind hole penetrating the surface copper layer and the dielectric layer.

[0152] Optionally, also include:

[0153] The blind hole judgment module is used to obtain the quality inspection result of the blind hole and judge whether the blind hole is qualified according to the quality inspection result; if so, return to execute the PCB board providing module 1201; if not, return to execute the processing parameter determination module 1202.

[0154] The PCB board blind hole processing device provided in the embodiment of the present invention can execute the PCB board blind hole processing method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0155] Example 5

[0156] Figure 13 A schematic diagram of a laser drilling apparatus 40 that can be used to implement embodiments of the present invention is shown. The laser drilling apparatus includes at least one digital computer in various forms, such as a laptop computer, desktop computer, workstation, personal digital assistant, server, blade server, mainframe computer, and other suitable computers. The components shown herein, their connections and relationships, and their functions are provided for illustrative purposes only and are not intended to limit the implementation of the inventions described and / or claimed herein.

[0157] like Figure 13As shown, the laser drilling device 40 includes at least one processor 41 and memory, such as a read-only memory (ROM) 42 and a random access memory (RAM) 43, communicatively connected to the at least one processor 41. The memory stores computer programs executable by the at least one processor. The processor 41 can perform various appropriate actions and processes based on the computer programs stored in the ROM 42 or loaded from a storage unit 48 into the RAM 43. The RAM 43 can also store various programs and data required for the operation of the laser drilling device 40. The processor 41, ROM 42, and RAM 43 are interconnected via a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0158] Multiple components in the laser drilling device 40 are connected to an I / O interface 45, including an input unit 46, such as a keyboard, a mouse, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a magnetic disk, an optical disk, etc.; and a communication unit 49, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 49 allows the laser drilling device 40 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0159] Processor 41 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any other suitable processor, controller, microcontroller, etc. Processor 41 executes the various methods and processes described above, such as the PCB board blind via processing method.

[0160] In some embodiments, the method for machining blind via holes in PCB boards can be implemented as a computer program tangibly embodied in a computer-readable storage medium, such as storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on the laser drilling device 40 via ROM 42 and / or communication unit 49. When the computer program is loaded into RAM 43 and executed by processor 41, one or more steps of the method for machining blind via holes in PCB boards described above can be performed. Alternatively, in other embodiments, processor 41 can be configured to execute the method for machining blind via holes in PCB boards via any other suitable means (e.g., via firmware).

[0161] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0162] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0163] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, device, or apparatus. A computer-readable storage medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or apparatus, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media may include an electrical connection based on one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0164] To provide user interaction, the systems and techniques described herein can be implemented on a laser drilling device that has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the laser drilling device. Other types of devices can also be used to provide user interaction; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0165] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0166] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0167] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0168] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for processing blind holes in a PCB board, characterized in that: Used to control a laser drilling device to process blind holes on a PCB board. The laser drilling device includes a CO2 laser and a picosecond or femtosecond laser. The method for processing blind holes on a PCB board includes: Providing a PCB board, the PCB board comprising a surface copper layer and a bottom copper layer separated by a dielectric layer; Determining a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser; Controlling the picosecond or femtosecond laser to form an annular thermal insulation groove penetrating the surface copper layer on the PCB board according to the first processing parameters, and controlling the CO2 laser to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove according to the second processing parameters, thereby obtaining a blind hole penetrating the surface copper layer and the dielectric layer, wherein the annular thermal insulation groove is used to prevent heat from being diffused to the surface copper layer when the CO2 laser processes the blind hole; Performing metallization treatment on the hole wall of the blind hole to obtain a PCB board with the blind hole processed; The laser drilling equipment includes an annular beam modulation component, a beam splitter, and a dichroic mirror. According to the first processing parameters, the picosecond or femtosecond laser is controlled to form an annular thermal insulation groove penetrating the surface copper layer on the PCB board. According to the second processing parameters, the CO2 laser is controlled to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove to obtain a blind hole penetrating the surface copper layer and the dielectric layer. The method includes: Controlling the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter, and controlling the CO2 laser to emit a CO2 parallel beam according to the second processing parameter; controlling the annular beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond annular beam and couple it to the dichroic mirror, wherein the beam diameter of the picosecond or femtosecond annular beam is equal to the blind hole aperture; Controlling the beam splitter to split the CO2 parallel beam according to the second processing parameter to obtain the split CO2 parallel beam, and coupling it to the dichroic mirror; The picosecond or femtosecond annular beam and the split CO2 parallel beam are coupled by the dichroic mirror to obtain a coupled beam, wherein the coupled beam includes the picosecond or femtosecond annular beam and the CO2 parallel beam located in the picosecond or femtosecond annular beam; The coupled beam is controlled to focus on the PCB board, so that the picosecond or femtosecond annular beam is used to cut the surface copper layer of the PCB board into an annular thermal insulation groove that penetrates the surface copper layer, and the CO2 parallel beam is used to synchronously remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove, thereby obtaining a blind hole that penetrates the surface copper layer and the dielectric layer.

2. The method for processing blind holes in a PCB board according to claim 1, wherein: Determining a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser includes: Obtaining blind hole parameters and structural parameters of the PCB board; A first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser are determined based on the blind hole parameter and the structural parameter.

3. The method for processing blind holes in a PCB board according to claim 2, wherein: The blind hole parameters include hole diameter and hole depth, the structural parameters include surface copper layer thickness and dielectric layer thickness, and determining the first processing parameters of the picosecond or femtosecond laser and the second processing parameters of the CO2 laser based on the blind hole parameters and the structural parameters includes: Determining a first processing parameter of the picosecond or femtosecond laser based on the aperture and the thickness of the surface copper layer; A second processing parameter of the CO2 laser is determined based on the aperture, the thickness of the surface copper layer, and the thickness of the dielectric layer.

4. The method for processing blind holes in a PCB board according to any one of claims 1 to 3, characterized in that: Before metallizing the hole wall of the blind hole to obtain a PCB board with the blind hole processed, the method further includes: Obtaining a quality inspection result of the blind hole, and determining whether the blind hole is qualified according to the quality inspection result; If yes, return to the step of providing the PCB board to continue processing the blind hole on the next PCB board; If not, return to the step of determining the first processing parameters of the picosecond or femtosecond laser and the second processing parameters of the CO2 laser.

5. A method for processing blind holes in a PCB board, characterized in that: Used to control a laser drilling device to process blind holes on a PCB board, the laser drilling device includes a CO2 laser and a picosecond or femtosecond laser, and the PCB board blind hole processing method includes: Providing a PCB board, the PCB board comprising a surface copper layer and a bottom copper layer separated by a dielectric layer; Determining a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser; Controlling the picosecond or femtosecond laser to form an annular thermal insulation groove penetrating the surface copper layer on the PCB board according to the first processing parameters, and controlling the CO2 laser to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove according to the second processing parameters, thereby obtaining a blind hole penetrating the surface copper layer and the dielectric layer, wherein the annular thermal insulation groove is used to prevent heat from being diffused to the surface copper layer when the CO2 laser processes the blind hole; Performing metallization treatment on the hole wall of the blind hole to obtain a PCB board with the blind hole processed; The laser drilling equipment includes an annular beam modulation component and a spectrometer. According to the first processing parameters, the picosecond or femtosecond laser is controlled to form an annular thermal insulation groove penetrating the surface copper layer on the PCB board. According to the second processing parameters, the CO2 laser is controlled to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove to obtain a blind hole penetrating the surface copper layer and the dielectric layer. The method includes: Controlling the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter; Controlling the annular beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond annular beam having a beam diameter equal to the blind hole aperture; Controlling the picosecond or femtosecond annular beam to cut the surface copper layer of the PCB board to form an annular thermal insulation groove penetrating the surface copper layer; After the annular heat-insulating groove is formed in the surface copper layer, the CO2 laser is controlled to emit a CO2 parallel beam according to the second processing parameter; controlling the beam splitter to split the CO2 parallel beam according to the second processing parameter to obtain a split CO2 beam; The surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove are removed by using the split CO2 beam to obtain a blind hole penetrating the surface copper layer and the dielectric layer.

6. A PCB board blind hole processing device, characterized in that: Used to control laser drilling equipment to process blind holes on PCB boards. The laser drilling equipment includes a CO2 laser and a picosecond or femtosecond laser. The PCB board blind hole processing device includes: A PCB board providing module is used to provide a PCB board, wherein the PCB board includes a surface copper layer and a bottom copper layer separated by a dielectric layer; a processing parameter determination module, configured to determine a first processing parameter of the picosecond or femtosecond laser and a second processing parameter of the CO2 laser; a blind hole processing module, configured to control the picosecond or femtosecond laser to form an annular thermal insulation groove penetrating the surface copper layer in the PCB board according to the first processing parameters, and to control the CO2 laser to remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove according to the second processing parameters, thereby obtaining a blind hole penetrating the surface copper layer and the dielectric layer, wherein the annular thermal insulation groove is configured to prevent heat from being diffused to the surface copper layer when the CO2 laser is processing the blind hole; A blind hole processing module is used to perform metallization on the hole wall of the blind hole to obtain a PCB board with the blind hole processed; The laser drilling equipment includes a ring beam modulation component, a beam splitter and a dichroic mirror, and the blind hole processing module includes: a laser control unit, configured to control the picosecond or femtosecond laser to emit a picosecond or femtosecond parallel beam according to the first processing parameter, and to control the CO2 laser to emit a CO2 parallel beam according to the second processing parameter; a ring beam modulation and coupling unit, configured to control the ring beam modulation component to modulate the picosecond or femtosecond parallel beam into a picosecond or femtosecond ring beam and couple it to the dichroic mirror, wherein the beam diameter of the picosecond or femtosecond ring beam is equal to the blind hole aperture; A CO2 beam modulation and coupling unit, configured to control the beam splitter to split the CO2 parallel beam according to the second processing parameter, and couple the split CO2 parallel beam to the dichroic mirror; a beam coupling unit, configured to couple the picosecond or femtosecond annular beam and the split CO2 parallel beam through the dichroic mirror to obtain a coupled beam, wherein the coupled beam includes the picosecond or femtosecond annular beam and the CO2 parallel beam located in the picosecond or femtosecond annular beam; The blind hole synchronous processing unit is used to control the coupling beam to focus on the PCB board, so as to form an annular thermal insulation groove penetrating the surface copper layer of the PCB board by circular cutting in the surface copper layer of the PCB board through the picosecond or femtosecond annular beam, and to synchronously remove the surface copper layer and the dielectric layer within the outer contour of the annular thermal insulation groove through the CO2 parallel beam, thereby obtaining a blind hole penetrating the surface copper layer and the dielectric layer.

7. A laser drilling device, characterized in that: The laser drilling equipment comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the PCB board blind hole processing method according to any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the PCB board blind hole processing method according to any one of claims 1 to 5 when executed.

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