Conductive sponge knife-mark-free die cutting processing technology

Abstract

The invention relates to a conductive sponge knife-mark-free die cutting processing technology which comprises the following steps: firstly, punching a low-viscosity positioning protective film, designing a waste material hole which is larger than a single side of a product hole in the low-viscosity positioning protective film, laminating conductive sponge, tearing off self-carried paper, laminating adhesive tapes at two ends, and covering a low-gram-weight release film to be laminated with a self-carried adhesive surface of the conductive sponge; the shape of the conductive sponge is punched from the position of a waste hole of the low-viscosity positioning protective film in the second punching process, a cutter mark is punched to the low-gram-weight release film, a waste discharging line is additionally arranged on a cutter die of the second punching process, after punching is completed, the low-viscosity protective film is additionally arranged from the bottom to cover the waste hole, the conductive sponge product is supported, the low-gram-weight release film on the surface is discharged, and a material belt release film is covered; the method comprises the following steps of: punching a release film surface of a material belt to carry out third-punching trimming, overturning a raw material subjected to third-punching punching by 180 degrees before the raw material is fed into a laminating machine, discharging waste materials, and finally rolling a finished product, so that the knife-mark-free production is realized. Compared with the prior art, waste discharge is facilitated while the product performance of the conductive sponge is not affected, and the product yield is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of conductive sponge processing, and particularly relates to a non-knife stamping and die-cutting processing technology for conductive sponges. Background Art

[0002] Conductive sponge is a new type of material that can play an important role in the dense layout of electronic devices. Conductive sponges have the advantages of good electrical conductivity, high elasticity, and shock absorption effects. At the same time, they have characteristics such as electromagnetic radiation protection, which can effectively ensure the normal operation and long-term reliability of electronic components. They can be used for anti-static and grounding in electronic devices, and can also stabilize the voltage and current of the circuit, increasing the stability of the circuit. They are widely used in computers, LCD monitors, liquid crystal TVs, laser printers, high-speed copiers, communication devices, mobile phones, satellite communications, medical equipment high-pressure machine tests, instrumentation, gaskets, partitions, plug-in board electronic products, etc.

[0003] Due to the inherent characteristics of the sponge surface, making products by conventional methods will affect product performance, damage products, and be inconvenient for the manufacturing process, resulting in a low yield. Currently, in the process of making non-knife printing of conductive sponges, due to the loose sponge on the product surface, if the matching positioning protective film is too sticky, it is easy to stick away the conductive particles on the sponge surface, affecting the conductive performance of the product. When the viscosity is too low, the product cannot be firmly adhered, and waste cannot be discharged during production.

[0004] The commonly used manufacturing method for non-knife stamping and die-cutting of conductive sponges in this industry is: laminating the raw material of the conductive sponge to a high-viscosity protective film (above 100G), first using a die to cut out the outer shape of the product, and then laminating the tape film to punch and cut the product tape to achieve non-knife printing production. Summary of the Invention

[0005] The purpose of the present invention is to overcome the defects of the above-mentioned existing technologies and provide a non-knife stamping and die-cutting processing technology for conductive sponges, which is convenient for waste discharge without affecting the product performance of the conductive sponge, and is beneficial to improving the product yield.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A non-knife stamping and die-cutting processing technology for conductive sponges, comprising the following steps:

[0008] A1. Laminating the self-adhesive film of the low-viscosity positioning protective film upwards on the perforated waste protective film to form a primary tape;

[0009] A2. Subjecting the primary tape to a first die-cutting by a die-cutting machine, punching waste holes in the low-viscosity positioning protective film, punching positioning holes in the perforated waste protective film, and removing the self-adhesive film of the low-viscosity positioning protective film to obtain a secondary tape, wherein the positioning holes are located at both ends of the waste holes;

[0010] A3. Place the conductive sponge with its self - adhesive paper facing up on the low - tack positioning protective film, unwind and discharge the self - adhesive tape, and attach tape strips to both ends of the conductive sponge to fix the conductive sponge on the low - tack positioning protective film, forming a three - level strip;

[0011] A4. Wind up and discharge the waste outer frame waste of the pull - hole waste protective film, and attach a low - gram weight release film to the conductive sponge glue to make it completely adhere to the self - adhesive film, forming a four - level strip, and flip the four - level strip by 180° so that the low - tack positioning protective film is on the top;

[0012] A5. Perform secondary die - cutting on the flipped four - level strip through a two - punch die - cutting machine, punch product holes and waste - discharging lines on the low - gram weight release film. The product holes are located within the waste holes and are smaller in size than the waste holes. The waste - discharging lines connect the product holes horizontally, forming a five - level strip;

[0013] A6. Attach a low - tack protective film at the position of the waste holes at the bottom of the low - gram weight release film to hold the conductive sponge within the product holes, wind up and discharge the release film outer frame waste of the low - gram weight release film, and attach a strip release film at the bottom to form a six - level strip. Flip the six - level strip by 180° so that the strip release film is facing up;

[0014] A7. Perform tertiary die - cutting on the flipped six - level strip through a three - punch die - cutting machine, punch border lines on the strip release film. The border lines are located at both ends of the waste holes, forming a seven - level strip. Flip the seven - level strip by 180° so that the low - tack positioning protective film is facing up;

[0015] A8. Discharge the waste from top to bottom in sequence and wind up to obtain the finished conductive sponge die - cut parts.

[0016] Further, in step A1, the tack of the low - tack positioning protective film is 20 - 30G.

[0017] Further, in step A2, the waste holes are rectangular and arranged in a regular matrix.

[0018] Further, in step A2, the positioning holes are C - shaped or circular.

[0019] Further, in step A3, the width of the tape strip is 8 - 10mm.

[0020] Further, in step A3, the tape strip is a silicone tape.

[0021] Further, in step A4, the quality of the low - gram weight release film is 5 - 10g.

[0022] Further, in step A5, the product holes are rectangular and arranged in a regular matrix.

[0023] Further, in step A5, the side dimension of the product holes is 0.3 - 0.5 mm smaller than that of the waste holes.

[0024] Further, in step A5, the adhesiveness of the low - tack protective film is 20 - 30 G.

[0025] Further, in step A8, the waste materials from top to bottom are the low - tack positioning protective film, the waste of the product outer frame of the conductive foam, the low - tack protective film, and the waste of the tape border of the tape release film.

[0026] Compared with the prior art, the present invention has the following advantages:

[0027] (1) In the present invention, the conductive sponge is adhered to the low - tack positioning protective film or the low - gram - weight release film, preventing the positioning protective film from being too sticky and easily sticking away the conductive particles on the surface of the sponge, which affects the conductive performance of the product, and solving the problem of affecting the product characteristics due to the shedding of conductive particles.

[0028] (2) In the present invention, two tape strips are adhered to both ends of the conductive sponge, increasing the adhesion ability between the conductive sponge and the low - tack positioning protective film, preventing unstable adhesion, and solving the problem of difficult matching of auxiliary materials due to the loose phenomenon of raw materials.

[0029] (3) In the present invention, waste holes are punched in the low - tack positioning protective film, and the size of the waste holes is slightly larger than that of the product holes, making the first - punch and second - punch die - cutting match. If the size of the waste holes is too small, it is easy to shift to the periphery of the waste holes during punching. If the size of the waste holes is too large, it is easy to displace the conductive sponge when pulling the waste.

[0030] (4) In the present invention, waste - discharging lines connecting the product holes are added during punching the product holes, which is beneficial to pulling and discharging the waste of the outer frame of the conductive sponge in zones and also preventing the influence on the conductive sponge product during the waste - discharging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the die - cutting processing technological process shown in Embodiment 1;

[0032] Figure 2 It is a schematic structural diagram of the first - punch die - cutting shown in Embodiment 1;

[0033] Figure 3 It is a schematic diagram of the structural level of the first - punch die - cutting shown in Embodiment 1;

[0034] Figure 4 It is a schematic structural diagram of the second - punch die - cutting shown in Embodiment 1;

[0035] Figure 5 Schematic diagram of the structural hierarchy of the two-step die cutting shown in Embodiment 1;

[0036] Figure 6 Schematic diagram of the structure of the three-step die cutting shown in Embodiment 1;

[0037] Figure 7 Schematic diagram of the structural hierarchy of the three-step die cutting shown in Embodiment 1;

[0038] Figure 8 Schematic diagram of the finished product structure of the conductive sponge die-cutting part shown in Embodiment 1;

[0039] Figure 9 Schematic diagram of the die-cutting processing technological process shown in Comparative Example 1;

[0040] Figure 10 Schematic diagram of the structure of the one-step die cutting shown in Comparative Example 1;

[0041] Figure 11 Schematic diagram of the structural hierarchy of the one-step die cutting shown in Comparative Example 1;

[0042] Figure 12 Schematic diagram of the structure of the two-step die cutting shown in Comparative Example 1;

[0043] Figure 13 Schematic diagram of the structural hierarchy of the two-step die cutting shown in Comparative Example 1;

[0044] Figure 14 Schematic diagram of the finished product structure of the die-cutting part shown in Comparative Example 1.

[0045] Explanation of the markings in the figure:

[0046] 1 - Low-adhesion positioning protective film, 101 - Self-adhesive film, 2 - Hole-pulling waste protective film, 201 - Positioning hole, 202 - Hole-pulling waste outer frame waste, 3 - One-step die-cutting machine, 4 - Waste hole, 5 - Conductive sponge, 51 - Self-adhesive paper, 52 - Product outer frame waste, 6 - Tape strip, 7 - Low-grammage release film, 701 - Release film outer frame waste, 8 - Two-step die-cutting machine, 9 - Product hole, 10 - Waste discharge line, 11 - Low-adhesion protective film, 12 - Tape release film, 1201 - Tape border waste, 13 - Three-step die-cutting machine, 14 - Border line, 15 - Waste, 16 - Finished product of conductive sponge die-cutting part, 17 - High-adhesion positioning protective film, 1701 - High-adhesion self-adhesive film, 18 - Protective film, 19 - Process release film, 1901 - Process release film waste, 20 - Peripheral waste, 21 - Sealing tape, 22 - Trimming waste, 23 - Die-cutting part product. Detailed implementation manners

[0047] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and gives the detailed implementation manner and specific operation process, but the protection scope of the present invention is not limited to the following embodiments. Based on the given embodiments, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of this application.

[0048] Embodiment 1

[0049] A conductive sponge non-knife die-cutting processing technology, as Figure 1 shown, includes the following steps:

[0050] A1. Attach the self-adhesive film 101 of the low-viscosity positioning protective film 1 upward to the perforated waste protective film 2 to form a primary strip.

[0051] A2. Perform primary die-cutting on the primary strip through a first die-cutting machine 3, punch waste holes 4 in the low-viscosity positioning protective film 1, punch positioning holes 201 in the perforated waste protective film 2, and remove the self-adhesive film 101 of the low-viscosity positioning protective film 1 to obtain a secondary strip. The positioning holes 201 are located at both ends of the waste holes 4, as Figure 2 shown;

[0052] A3. Attach the self-adhesive paper 501 of the conductive sponge 5 upward to the low-viscosity positioning protective film 1, wind and discharge the self-adhesive 501, and attach tape strips 6 to both ends of the conductive sponge 5 to fix the conductive sponge 5 on the low-viscosity positioning protective film 1 to form a tertiary strip, as Figure 2 and Figure 3 shown;

[0053] A4. Wind and discharge the perforated waste outer frame waste 202 of the perforated waste protective film 2, and attach a low-grammage release film 7 to the conductive sponge adhesive 5 to make it completely fit with the self-adhesive film 101 to form a quaternary strip, and flip the quaternary strip by 180° so that the low-viscosity positioning protective film 1 is at the top;

[0054] A5. Perform secondary die-cutting on the flipped quaternary strip through a second die-cutting machine 8, punch product holes 9 and waste discharge lines 10 in the low-grammage release film 7. The product holes 9 are located within the waste holes 4 and have a size smaller than the waste holes 4. The waste discharge lines 10 are horizontally connected to the product holes 9 to form a quinary strip, as Figure 4 and Figure 5 shown;

[0055] A6. At the position of the waste hole 4 at the bottom of the low-grammage release film 7, a low-adhesion protective film 11 is attached to hold the conductive sponge 5 located in the product hole 9. The release film outer frame waste 701 of the low-grammage release film 7 is wound and discharged, and a tape release film 12 is attached to the bottom to form a six-level tape. The six-level tape is flipped 180° so that the tape release film 12 faces upward;

[0056] A7. The flipped six-level tape is subjected to three-station die-cutting by a three-station die-cutting machine 13, and a border line 14 is die-cut on the tape release film 12. The border line 14 is located at both ends of the waste hole 4 to form a seven-level tape. The seven-level tape is flipped 180° so that the low-adhesion positioning protective film 1 faces upward, as Figure 6 and Figure 7 shown;

[0057] A8. The waste 15 is discharged sequentially from top to bottom, and the finished conductive sponge die-cut part 16 is wound, as Figure 8 shown.

[0058] In this embodiment, in step A1, the adhesion of the low-adhesion positioning protective film 1 is 20G.

[0059] In this embodiment, in step A2, the waste hole 4 is rectangular and arranged in a regular matrix.

[0060] In this embodiment, in step A2, part of the positioning hole 201 is C-shaped and part is circular.

[0061] In this embodiment, in step A3, the tape strip 6 is a green silica gel tape with a width of 8 mm.

[0062] In this embodiment, in step A4, the mass of the low-grammage release film 7 is 5 g.

[0063] In this embodiment, in step A5, the product hole 9 is rectangular and arranged in a regular matrix.

[0064] In this embodiment, in step A5, the single-side dimension of the product hole 9 is 0.3 mm smaller than that of the waste hole 4.

[0065] In this embodiment, in step A5, the adhesion of the low-adhesion protective film 11 is 20G.

[0066] In this embodiment, in step A8, the waste 15 is, from top to bottom, the low-adhesion positioning protective film 1, the product outer frame waste 502 of the conductive foam 5, the low-adhesion protective film 11, and the tape border waste 1201 of the tape release film 12.

[0067] In this embodiment, first punch and cut the low - tack positioning protective film 1. Design a waste hole 4 on the low - tack positioning protective film 1 that is 0.3 larger than the unilateral size of the product hole 9 on each side. Then laminate the conductive sponge 5, peel off the self - adhesive paper 501 of the conductive sponge 5, laminate two 8 - mm silicone tapes at both ends of the adhesive surface to fix the raw material of the conductive sponge 5 on the low - tack positioning protective film 2, and then cover the low - weight release film 7 to laminate it with the self - adhesive surface of the conductive sponge 5. In the second punching, punch and cut the outer shape of the conductive sponge 5, that is, the product hole 9, from the position of the waste hole 4 of the low - tack positioning protective film 1. The knife mark is punched and cut onto the low - weight release film 7. The die for the second punching needs to add a waste - discharging line 10. After the punching is completed, do not discharge the waste 15 first. Add a low - tack protective film 11 from the bottom to cover the waste hole 4, hold the conductive sponge product, discharge the low - weight release film 7 on the surface, cover the tape release film 12, and perform the third punching and trimming from the surface of the tape release film 12. Finally, before laminating, turn the raw material punched and cut in the third punching by 180°, discharge the waste of the outer frame of the low - tack positioning protective film 1, the product outer - frame waste 502 of the conductive foam 5, the low - tack protective film 11, and the tape - frame waste 1201 of the tape release film 12. Finally, wind up the finished conductive sponge die - cut parts 16 to achieve knife - mark - free production.

[0068] Example 2

[0069] Compared with Example 1, most of them are the same. Except that in step A1, the tack of the low - tack positioning protective film 1 is 30G; in step A3, the tape strip 6 is a green silicone tape with a width of 10 mm; in step A4, the mass of the low - weight release film 7 is 10 g; in step A5, the unilateral size of the product hole 9 is 0.5 mm smaller than that of the waste hole 4, and the tack of the low - tack protective film 11 is 30G.

[0070] Example 3

[0071] Compared with Example 1, most of them are the same. Except that in step A1, the tack of the low - tack positioning protective film 1 is 25G; in step A3, the tape strip 6 is a green silicone tape with a width of 9 mm; in step A4, the mass of the low - weight release film 7 is 8 g; in step A5, the unilateral size of the product hole 9 is 0.4 mm smaller than that of the waste hole 4, and the tack of the low - tack protective film 11 is 25G.

[0072] Comparative Example 1

[0073] A knife - mark - free die - cutting process for conductive sponge, as Figure 9 shown, includes the following steps:

[0074] B1. The self - adhesive film 1701 with high adhesiveness of the winding high - adhesiveness positioning protective film 17. Stick the conductive sponge 5 above the high - adhesiveness positioning protective film 17, stick the protective film 18 below the high - adhesiveness positioning protective film 17, and then stick the process release film 19 on the conductive sponge 5 to form a primary strip, as Figure 10 and Figure 11 shown;

[0075] B2. Pass the primary strip through a first - stage die - cutting machine 3 for first - stage die - cutting. Punch product holes 9 and border lines 14 on the high - adhesiveness positioning protective film 17, and discharge the peripheral waste 20. Stick the sealing tape 21 on the process release film 19, and use the sealing tape 21 to wind and discharge the process release film waste 1901. Stick the strip release film 12 on the conductive sponge 5 to form a secondary strip, as Figure 12 and Figure 13 shown;

[0076] B3. Wind and discharge the trimming waste 22 and the high - adhesiveness positioning protective film 17 from the secondary strip in sequence, and wind to obtain the die - cut part finished product 23, as Figure 14 shown.

[0077] In this comparative example, the adhesiveness of the high - adhesiveness positioning protective film 17 is 110G.

[0078] In this comparative example, in step A2, the waste hole 4 is rectangular and arranged in a regular matrix.

[0079] In this comparative example, the raw material of the conductive sponge 5 is stuck to the high - adhesiveness positioning protective film 17. First, use a knife die to cut out the product outline, and then stick the strip release film 12 to punch the product strip to achieve knife - mark - free production. However, using the high - adhesiveness positioning protective film 17 easily sticks away the conductive particles on the surface of the conductive sponge 5, affecting the product's conductive performance and the product yield.

[0080] Although the present invention has been described in detail above with general descriptions, specific embodiments and experiments, based on the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.

Claims

1. A non-knife-imprint die-cutting process for conductive sponge, characterized in that, It includes the following steps: A1. Place the self - adhesive film (101) of the low - tack positioning protective film (1) facing up and bond it to the perforated waste protective film (2) to form a primary strip; A2. Perform primary die - cutting on the primary strip through a first die - cutting machine (3). Punch waste holes (4) on the low - tack positioning protective film (1) and punch positioning holes (201) on the perforated waste protective film (2). Remove the self - adhesive film (101) of the low - tack positioning protective film (1) to obtain a secondary strip. The positioning holes (201) are located at both ends of the waste holes (4); A3. Place the self - adhesive paper (501) of the conductive sponge (5) facing up and bond it to the low - tack positioning protective film (1). Wind up and discharge the self - adhesive (501), and bond tape strips (6) to both ends of the conductive sponge (5) to fix the conductive sponge (5) on the low - tack positioning protective film (1) to form a tertiary strip; A4. Wind up and discharge the perforated waste outer - frame waste (202) of the perforated waste protective film (2), and bond a low - weight release film (7) to the conductive sponge adhesive (5) so that it completely adheres to the self - adhesive film (101) to form a quaternary strip. Flip the quaternary strip by 180° so that the low - tack positioning protective film (1) is on the top; A5. Perform secondary die - cutting on the flipped quaternary strip through a second die - cutting machine (8). Punch product holes (9) and waste - discharging lines (10) on the low - weight release film (7). The product holes (9) are located inside the waste holes (4) and are smaller in size than the waste holes (4). The waste - discharging lines (10) are horizontally connected to the product holes (9) to form a fifth - level strip; A6. Bond a low - tack protective film (11) at the position of the waste holes (4) at the bottom of the low - weight release film (7) to hold the conductive sponge (5) inside the product holes (9). Wind up and discharge the release - film outer - frame waste (701) of the low - weight release film (7), and bond a strip - release film (12) at the bottom to form a sixth - level strip. Flip the sixth - level strip by 180° so that the strip - release film (12) is facing up; A7. Perform tertiary die - cutting on the flipped sixth - level strip through a third die - cutting machine (13). Punch border lines (14) on the strip - release film (12). The border lines (14) are located at both ends of the waste holes (4) to form a seventh - level strip. Flip the seventh - level strip by 180° so that the low - tack positioning protective film (1) is facing up; A8. Discharge the waste (15) from top to bottom in sequence and wind up to obtain the finished conductive - sponge die - cut part (16).

2. The knife-free die-cutting processing technology of a conductive sponge according to claim 1, characterized in that, In step A1, the tack of the low - tack positioning protective film (1) is 20 - 30G.

3. A non-knife die-cutting process for conductive sponges according to claim 1, characterized in that, In step A2, the waste holes (4) are rectangular and arranged in a regular matrix.

4. A non-knife die-cutting process for conductive sponges according to claim 1, characterized in that, In step A2, the positioning holes (201) are C - shaped or circular.

5. A non-knife die-cutting processing technology for conductive sponge, characterized in that, In step A3, the width of the tape strips (6) is 8 - 10mm.

6. A knife-free die-cutting processing technology for conductive sponge according to claim 1, characterized in that, In step A4, the mass of the low - weight release film (7) is 5 - 10g.

7. A knife-free die-cutting process for conductive sponges according to claim 1, characterized in that, In step A5, the product holes (9) are rectangular and arranged in a regular matrix.

8. A knife-free die-cutting process for conductive sponges according to claim 1, characterized in that, In step A5, the unilateral dimension of the product hole (9) is 0.3 - 0.5 mm smaller than that of the waste hole (4).

9. The knife-free die-cutting process for a conductive sponge according to claim 1, wherein, In step A5, the adhesiveness of the low-tack protective film (11) is 20 - 30 G.

10. A knife-free die-cutting process for conductive sponge according to claim 1, characterized in that, In step A8, the waste material (15) from top to bottom is successively the low-tack positioning protective film (1), the product outer frame waste (52) of the conductive foam (5), the low-tack protective film (11), and the tape frame waste (1201) of the tape release film (12).

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