Preparation device of focusing ring for semiconductor equipment

Abstract

The invention provides a preparation device of a focusing ring for semiconductor equipment, which comprises a mounting table, a hot cavity, a preparation cavity, a transition cavity and a cooling cavity, the mounting table is arranged in each of the hot cavity, the preparation cavity, the transition cavity and the cooling cavity, the upper part of each mounting table is connected with a plurality of columnar pieces which are distributed in an annular array, and the upper parts of the columnar pieces are detachably connected with a plurality of dismounting frames in sequence; a focusing ring base material is placed on the upper portion of the disassembly and assembly frame, and the focusing ring base material is a base material for preparing a focusing ring for semiconductor equipment. A plurality of focusing ring base materials can be stacked and placed through the columnar piece and the disassembly and assembly frame, a plurality of focusing rings can be deposited at a time, the contact area of the disassembly and assembly frame and the focusing ring base materials is only three points, the contact area of the focusing ring base materials and the disassembly and assembly frame is extremely small, disassembly and assembly of the focusing ring base materials are facilitated, the contact area is small, and the assembly and disassembly efficiency is improved. The influence of the contact position on the focusing ring forming quality is reduced.

Description

Technical Field

[0001] The present invention relates to the field of focusing ring preparation equipment, and particularly to a preparation device for a focusing ring used in semiconductor equipment. Background Art

[0002] The focusing ring in semiconductor equipment is a key component. It is a core component in the wafer manufacturing process and is widely used in plasma processing equipment. The focusing ring usually consists of a ring-shaped lower member made of a dielectric material and a ring-shaped upper member made of a conductive material disposed on the upper part of the lower member. The material selection of the focusing ring has an important impact on its performance. Commonly used materials include conductive silicon, quartz, silicon carbide (SiC), etc. Among them, silicon carbide has characteristics such as high resistance to ion etching, high thermal conductivity, and high abrasion resistance, and is an ideal material for preparing the focusing ring.

[0003] For a silicon carbide focusing ring, chemical vapor deposition is generally used for preparation. Chemical vapor deposition can prepare a silicon carbide focusing ring with excellent performance. In the Chinese utility model patent with the publication number of CN216337939U and the name of "a chemical vapor deposition device with multiple workpiece placement surfaces", through the workpiece placement rack provided in the reaction chamber, the workpiece placement rack has multiple workpiece placement surfaces in the vertical direction, and workpieces can be placed on each workpiece placement surface, so as to increase the area for placing workpieces, increase the number of workpieces accommodated in the vapor deposition furnace, and improve the production efficiency of the vapor deposition furnace. Although multiple workpieces can be stacked in the above application, the contact area between the placement rack and the workpiece is large, resulting in difficulty in disassembling the deposited workpiece, and the large contact area leads to large defects, affecting the forming quality of the focusing ring. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defect that the contact area between the focusing ring substrate and the placement rack in the prior art is large, making it difficult to disassemble and affecting the forming effect, and to provide a preparation device for a focusing ring used in semiconductor equipment.

[0005] The present invention solves the above technical problem through the following technical solutions: The present invention provides a preparation device for a focusing ring used in semiconductor equipment, including a support outer frame, The support outer frame is sequentially connected by a top support plate, a middle preparation frame housing, and a bottom support frame housing. The middle preparation frame housing is a circular ring-shaped cavity; A blocking door module. The circular ring-shaped cavity of the middle preparation frame housing is divided into four cavities by the blocking door module, which are a preheating cavity, a preparation cavity, a transition cavity, and a cooling cavity in sequence. The blocking door module is used to control the on-off between the preheating cavity, the preparation cavity, the transition cavity, and the cooling cavity; Installation platforms are provided in the preheating chamber, the preparation chamber, the transition chamber, and the cooling chamber. Multiple columnar members distributed in an annular array are connected to the upper part of the installation platform. Multiple disassembly and assembly frames are sequentially and detachably connected to the upper parts of the columnar members. A focusing ring substrate is placed on the upper part of the disassembly and assembly frame. The focusing ring substrate is a substrate for manufacturing a focusing ring of semiconductor equipment; Rotation mechanisms are respectively connected to the bottoms of the four installation platforms. The rotation mechanisms are used to rotate the installation platforms so that the installation platforms operate in the preheating chamber, the preparation chamber, the transition chamber, and the cooling chamber.

[0006] In this technical solution, the focusing ring substrate is installed or disassembled in the cooling chamber, then enters the preheating chamber to preheat the focusing ring substrate, then enters the preparation chamber for chemical vapor deposition to manufacture the focusing ring. After completion, it enters the transition chamber, and finally enters the cooling chamber to cool and disassemble the focusing ring. This enables the preparation chamber to continuously perform vapor deposition without being affected by the cooling of the focusing ring and the disassembly and assembly of the focusing ring substrate. Moreover, after the focusing ring substrate is preheated, the temperature of the focusing ring substrate in the deposition chamber is more uniform, and there will be no large temperature difference on the focusing ring substrate, which may cause non-uniform material properties and affect the quality of the final focusing ring; At the same time, multiple focusing ring substrates can be stacked and placed by using the columnar members and the disassembly and assembly frames. Multiple focusing rings can be deposited at one time. The contact area between the disassembly and assembly frame and the focusing ring substrate is only three points, making the contact area between the focusing ring substrate and the disassembly and assembly frame extremely small, which is convenient for the disassembly and installation of the focusing ring substrate. And the small contact area reduces the influence of the contact position on the forming quality of the focusing ring.

[0007] Preferably, the columnar member includes a thick-bottom column and fixed convex blocks. The bottom of the thick-bottom column is connected to the top of the installation platform, and multiple fixed convex blocks distributed in an annular array are connected to the top of the thick-bottom column.

[0008] In this technical solution, the columnar member can facilitate the installation of the disassembly and assembly frame.

[0009] Preferably, the disassembly and assembly frame includes a disassembly and assembly ring. Three connection bars distributed in an annular array are connected to the side of the disassembly and assembly ring; One end of the connection bar is threadedly connected with a contact column, and the top end of the contact column contacts the bottom of the focusing ring substrate; Multiple disassembly and assembly convex blocks distributed in an annular array are connected to the top of the disassembly and assembly ring, and multiple disassembly and assembly grooves distributed in an annular array are connected to the bottom of the disassembly and assembly ring. The disassembly and assembly convex blocks and the disassembly and assembly grooves are inserted.

[0010] In this technical solution, the disassembly and assembly frame can facilitate the placement of the focusing ring substrate.

[0011] Preferably, the number of the disassembly and assembly bump blocks, the disassembly and assembly groove, and the fixing bump blocks is the same, and the sizes of the disassembly and assembly bump blocks and the fixing bump blocks are all inserted into the disassembly and assembly groove.

[0012] In this technical solution, the disassembly and assembly bump block can be inserted into the disassembly and assembly groove, and the fixing bump block can be inserted into the disassembly and assembly groove.

[0013] Preferably, the rotating mechanism includes a rotating component and a transmission component. The bottoms of the four mounting platforms are all connected with the rotating component, the four rotating components are respectively in transmission connection with the transmission component, and the transmission component is connected inside the bottom support frame housing.

[0014] In this technical solution, the rotating mechanism can drive structures such as the mounting platform to move in the four chambers.

[0015] Preferably, the rotating component includes an arc gear, the arc gear is connected to the bottom of the mounting platform, and the central axes of the arc gears of the four rotating components are on the arc of the same circle; Two symmetrically distributed rotating gears are meshed and connected to the inner side of the arc gear. A connecting shaft is connected to the bottom of the rotating gear, and the connecting shaft is rotatably and penetratingly connected to the top surface of the bottom support frame housing.

[0016] In this technical solution, the rotating component can drive multiple mounting platforms to rotate.

[0017] Preferably, the transmission component includes a central bevel gear, the bottom of the central bevel gear is connected to the output end of the driving source, and the driving source is connected to the inner cavity wall of the bottom support frame housing; A plurality of first bevel gears are meshed and connected to the side of the central bevel gear. A transmission shaft is connected to one side of each of the plurality of first bevel gears. A second bevel gear is connected to one end of the transmission shaft. The side of the second bevel gear is meshed and connected to a third bevel gear, and the top of the third bevel gear is connected to the bottom end of the connecting shaft.

[0018] In this technical solution, the transmission component can drive multiple rotating components to rotate simultaneously.

[0019] Preferably, the rotating mechanism further includes an anti-deviation component. The anti-deviation component includes an arc follower frame and a fixed track. The arc follower frame is connected to the bottom of the mounting platform, and the fixed track is connected to the top of the bottom support frame housing; A plurality of smooth rolling balls are rotatably connected to the top surface of the fixed track, and the smooth rolling balls are in contact with the inner wall of the top surface of the fixed track.

[0020] In this technical solution, the anti-deviation component can limit the movement track of the mounting platform.

[0021] Preferably, the preheating chamber is connected to the transition chamber and the cooling chamber through a waste heat utilization component. The waste heat utilization component includes a central pipeline, and the central pipeline is arranged at the center of the middle preparation housing; The sides of the central pipeline are respectively communicated with the preheating chamber, the transition chamber and the cooling chamber. A centralized housing is connected to the outside of the middle preparation housing, and the centralized housing is communicated with the preheating chamber; A gas flow fan is connected to the inner wall of the centralized housing, and a first one-way valve is connected to one side of the centralized housing away from the preheating chamber.

[0022] In this technical solution, the waste heat utilization component can be used to utilize the waste heat in the transition chamber and the cooling chamber, reducing heat waste and energy consumption.

[0023] Preferably, three first dispersion boxes are connected to the side of the central pipeline. A second dispersion box is arranged on one side of each of the three first dispersion boxes. The three second dispersion boxes are all connected to the inner side of the middle preparation housing, and the three second dispersion boxes are respectively communicated with the transition chamber, the cooling chamber and the preheating chamber; The two side second dispersion boxes are connected by a plurality of second one-way valves.

[0024] In this technical solution, the second one-way valve can be used to prevent the gas in the preheating chamber from flowing back into the transition chamber and the cooling chamber.

[0025] On the basis of conforming to the common knowledge in the art, the above preferred conditions can be combined arbitrarily to obtain various preferred examples of the present invention.

[0026] The beneficial effects of the present invention are as follows: In the present invention, the focusing ring substrate is installed or disassembled in the cooling chamber, then enters the preheating chamber to preheat the focusing ring substrate, then enters the preparation chamber for chemical vapor deposition to prepare the focusing ring. After completion, it enters the transition chamber, and finally enters the cooling chamber to cool and disassemble the focusing ring, so that the preparation chamber can continuously carry out vapor deposition. Cooling the focusing ring and disassembling and assembling the focusing ring substrate do not affect the chemical vapor deposition preparation of the focusing ring. Moreover, after the focusing ring substrate is preheated, the temperature of the focusing ring substrate in the deposition chamber can be more uniform, and there will be no large temperature difference on the focusing ring substrate, which will cause non-uniform material properties and affect the quality of the final focusing ring; At the same time, the columnar member and the disassembly and assembly frame can be used to stack and place multiple focusing ring substrates. Multiple focusing rings can be deposited at one time, and the contact area between the disassembly and assembly frame and the focusing ring substrate is only three points, so that the contact area between the focusing ring substrate and the disassembly and assembly frame is extremely small, which is convenient for the disassembly and installation of the focusing ring substrate, and the small contact area reduces the influence of the contact position on the forming quality of the focusing ring; Furthermore, the heat utilization component can transfer the heat in the transition cavity and the cooling cavity to the preheating cavity to preheat the focusing ring substrate, reducing the energy consumption in the preheating cavity and avoiding heat waste in the transition cavity and the cooling cavity. Further, the self-rotation component can drive structures such as the mounting table, the columnar member, and the disassembly and assembly frame to rotate, so that the focusing ring substrate can rotate when it is in the preheating cavity, the transition cavity, and the cooling cavity, making the contact between the focusing ring substrate and the above-mentioned external environment more comprehensive and uniform, heating or cooling the focusing ring substrate more evenly, improving the quality of the focusing ring, and facilitating the use of semiconductor equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic structural diagram of a preparation device for a focusing ring for a semiconductor device according to an embodiment of the present invention.

[0028] Figure 2 is Figure 1 an overall internal structural diagram of the preparation device for the focusing ring for the semiconductor device shown.

[0029] Figure 3 is Figure 1 an overall top view structural diagram of the preparation device for the focusing ring for the semiconductor device shown.

[0030] Figure 4 is Figure 1 an exploded structural diagram of the support outer frame, the blocking door module, the mounting table, and the columnar member of the preparation device for the focusing ring for the semiconductor device shown.

[0031] Figure 5 is Figure 1 an internal structural diagram of the disassembly and assembly frame of the preparation device for the focusing ring for the semiconductor device shown.

[0032] Figure 6 is Figure 1 a three-dimensional schematic diagram of the disassembly and assembly frame of the preparation device for the focusing ring for the semiconductor device shown Figure 1 .

[0033] Figure 7 is Figure 1 a three-dimensional schematic diagram of the disassembly and assembly frame of the preparation device for the focusing ring for the semiconductor device shown Figure 2 .

[0034] Figure 8 is Figure 1 a three-dimensional schematic diagram of the disassembly and assembly frame of the preparation device for the focusing ring for the semiconductor device shown Figure 3 .

[0035] Figure 9 is Figure 1Explosion structure schematic diagram of the columnar part, disassembly and assembly frame, and focusing ring substrate of the preparation device for the focusing ring used in semiconductor equipment as shown

[0036] Figure 10 For Figure 1 Connection relationship structure schematic diagram between the central pipeline, the first dispersion box, the second dispersion box, and the second one-way valve of the preparation device for the focusing ring used in semiconductor equipment as shown

[0037] Figure 11 For Figure 2 Partial enlarged structure schematic diagram at position A of the preparation device for the focusing ring used in semiconductor equipment as shown

[0038] Figure 12 For Figure 1 Partial structure schematic diagram of the transmission component and the rotating component of the preparation device for the focusing ring used in semiconductor equipment as shown

[0039] Figure 13 For Figure 1 Connection relationship schematic diagram between the rotating component and the second bevel gear of the preparation device for the focusing ring used in semiconductor equipment as shown Figure 1 .

[0040] Figure 14 For Figure 1 Connection relationship schematic diagram between the rotating component and the second bevel gear of the preparation device for the focusing ring used in semiconductor equipment as shown Figure 2 .

[0041] Figure 15 For Figure 2 Partial enlarged structure schematic diagram at position B of the preparation device for the focusing ring used in semiconductor equipment as shown

[0042] Explanation of reference numerals 1. Support outer frame; 2. Blocking door module; 3. Preheating chamber; 4. Preparation chamber; 5. Transition chamber; 6. Cooling chamber; 7. Installation table; 71. Upper mounting plate; 72. Lower mounting frame housing; 8. Columnar member; 81. Thick bottom column; 82. Fixed convex block; 83. Reinforcing column; 9. Disassembly and assembly frame; 91. Disassembly and assembly ring; 92. Connecting strip; 93. Contact column; 94. Disassembly and assembly convex block; 95. Disassembly and assembly groove; 10. Focus ring substrate; 11. Rotating assembly; 111. Arc gear; 112. Rotating gear; 113. Connecting shaft; 12. Transmission assembly; 121. Central bevel gear; 122. Driving source; 123. First bevel gear; 124. Transmission shaft; 125. Second bevel gear; 126. Third bevel gear; 127. Fixed plate; 13. Anti-deviation assembly; 131. Arc follower frame; 132. Fixed track; 133. Smooth rolling ball; 14. Waste heat utilization assembly; 141. Central pipeline; 142. Concentrating frame housing; 143. Gas flow fan; 144. First one-way valve; 145. First dispersion box; 146. Second dispersion box; 147. Second one-way valve; 15. Self-rotating assembly; 151. Rotating source; 152. Anti-disengagement track; 153. Friction-reducing rolling ball. Detailed implementation manners

[0043] The present invention will be further described below by way of embodiments, but the present invention is not limited to the scope of the described embodiments.

[0044] Figures 1 to 15 The figure shows a schematic structural diagram of an embodiment of a preparation device for a focus ring for semiconductor equipment according to the present invention.

[0045] Embodiment 1 The preparation device for a focus ring for semiconductor equipment includes a support outer frame 1. The support outer frame 1 is sequentially connected by a top support plate, a middle preparation frame housing and a bottom support frame housing, and the middle preparation frame housing is a circular ring-shaped cavity. A blocking door module 2, the circular ring-shaped cavity of the middle preparation frame housing is divided into four cavities by the blocking door module 2, which are sequentially a preheating chamber 3, a preparation chamber 4, a transition chamber 5 and a cooling chamber 6, and the blocking door module 2 is used to control the on-off between the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6. The driving mechanism and the up and down travel track of the blocking door module 2 are respectively connected to the upper and lower sides of the support outer frame 1, and the driving mechanism is used to control the movement of the blocking door module 2, so as to control the on-off between the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6.

[0046] The preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6 are all connected to equipment for gas inlet, outlet and heating, etc., and the equipment for gas inlet, outlet and heating, etc. are respectively connected to the top side and the bottom side of the support outer frame 1. The equipment for gas inlet, outlet and heating, etc. is used to introduce corresponding gases into the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6; During use, for the preparation chamber 4, a mixed gas of trichlorosilane and hydrogen is introduced into the preparation chamber 4 during chemical vapor deposition. These gases will undergo chemical reactions at high temperatures to generate the required silicon carbide material on the focusing ring substrate 10. During this process, it is necessary for the equipment for gas inlet, outlet and heating, etc. to control parameters such as the temperature, gas flow rate and reaction time in the preparation chamber 4 to ensure that the deposited silicon carbide has the required purity and structure.

[0047] Mounting table 7, mounting tables 7 are arranged in the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6. A plurality of columnar members 8 distributed in an annular array are connected to the upper part of the mounting table 7. A plurality of disassembly and assembly frames 9 are sequentially detachably connected to the upper part of the columnar members 8. A focusing ring substrate 10 is placed on the upper part of the disassembly and assembly frame 9. The focusing ring substrate 10 is a substrate for a focusing ring used in semiconductor equipment; Rotation mechanism, the rotation mechanism is respectively connected to the bottoms of the four mounting tables 7. The rotation mechanism is used to rotate the mounting table 7 so that the mounting table 7 operates in the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6.

[0048] In this technical solution, the focusing ring substrate 10 is installed or disassembled in the cooling chamber 6, then enters the preheating chamber 3 to preheat the focusing ring substrate 10, then enters the preparation chamber 4 for chemical vapor deposition to prepare the focusing ring. After completion, it enters the transition chamber 5, and finally enters the cooling chamber 6 to cool and disassemble the focusing ring, so that the preparation chamber 4 can continuously perform chemical vapor deposition. Cooling the focusing ring and disassembling and assembling the focusing ring substrate 10 do not affect the chemical vapor deposition preparation of the focusing ring. Moreover, after the focusing ring substrate 10 is preheated, the temperature of the focusing ring substrate 10 can be more uniform when it is in the deposition chamber, and there will be no large temperature difference on the focusing ring substrate 10, which will cause non-uniform material properties and affect the quality of the final focusing ring; At the same time, the columnar members 8 and the disassembly and assembly frames 9 can be used to stack and place a plurality of focusing ring substrates 10. Multiple focusing rings can be deposited at one time, and the contact area between the disassembly and assembly frame 9 and the focusing ring substrate 10 is only three points, so that the contact area between the focusing ring substrate 10 and the disassembly and assembly frame 9 is extremely small, which is convenient for the disassembly and installation of the focusing ring substrate 10, and the small contact area reduces the influence of the contact position on the forming quality of the focusing ring.

[0049] The columnar member 8 includes a thick-bottom column 81 and a fixed convex block 82. The bottom of the thick-bottom column 81 is connected to the top of the mounting table 7, and a plurality of fixed convex blocks 82 distributed in an annular array are connected to the top of the thick-bottom column 81.

[0050] In this technical solution, the columnar member 8 can facilitate the installation of the disassembly and assembly frame 9.

[0051] The disassembly and assembly frame 9 includes a disassembly and assembly ring 91, and three connecting bars 92 distributed in an annular array are connected to the side of the disassembly and assembly ring 91; One end of the connecting bar 92 is threadedly connected with a contact column 93, and the top end of the contact column 93 contacts the bottom of the focusing ring substrate 10; A plurality of disassembly and assembly protruding blocks 94 distributed in an annular array are connected to the top of the disassembly and assembly ring 91, and a plurality of disassembly and assembly grooves 95 distributed in an annular array are connected to the bottom of the disassembly and assembly ring 91, and the disassembly and assembly protruding blocks 94 and the disassembly and assembly grooves 95 are inserted into each other.

[0052] In this technical solution, the disassembly and assembly frame 9 can facilitate the placement of the focusing ring substrate 10.

[0053] The number of the disassembly and assembly protruding blocks 94, the disassembly and assembly grooves 95 and the fixing protruding blocks 82 is the same, and the sizes of the disassembly and assembly protruding blocks 94 and the fixing protruding blocks 82 are both inserted into the disassembly and assembly grooves 95.

[0054] In this technical solution, the disassembly and assembly protruding blocks 94 can be inserted into the disassembly and assembly grooves 95, and the fixing protruding blocks 82 can be inserted into the disassembly and assembly grooves 95.

[0055] During installation, the disassembly and assembly ring 91 is installed on the thick bottom column 81, so that the fixing protruding block 82 is inserted into the disassembly and assembly groove 95 of the disassembly and assembly ring 91, then the focusing ring substrate 10 is placed on the corresponding contact column 93, and then another disassembly and assembly ring 91 is installed, so that the disassembly and assembly groove 95 of this disassembly and assembly ring 91 is inserted into the disassembly and assembly protruding block 94 of the previous disassembly and assembly ring 91, and then the focusing ring substrate 10 is placed on the upper part of the contact column 93 of this disassembly and assembly ring 91. By operating in sequence, multiple focusing ring substrates 10 can be stacked to complete the installation of the focusing ring substrates 10; After the focusing ring is deposited, use a tool to cut off the contact column 93 close to the focusing ring substrate 10, then the focusing ring substrate 10 can be disassembled, and then the disassembly and assembly ring 91 and the focusing ring substrate 10 can be disassembled in sequence.

[0056] It should be noted that the cut contact column 93 can be rotated. At this time, under the action of the connecting bar 92, the contact column 93 can move, so that the contact column 93 can be used multiple times.

[0057] The rotating mechanism includes a rotating component 11 and a transmission component 12. The rotating component 11 is connected to the bottom of each of the four mounting platforms 7, and the four rotating components 11 are respectively in transmission connection with the transmission component 12, and the transmission component 12 is connected in the bottom support frame housing.

[0058] In this technical solution, the rotating mechanism can drive structures such as the mounting table 7 to move within the four chambers.

[0059] The rotating assembly 11 includes an arc gear 111, the arc gear 111 is connected to the bottom of the mounting table 7, and the central axes of the arc gears 111 of the four rotating assemblies 11 are on the arc of the same circle; Two symmetrically distributed rotating gears 112 are meshed and connected to the inner side of the arc gear 111, a connecting shaft 113 is connected to the bottom of the rotating gear 112, and the connecting shaft 113 is rotatably and penetratingly connected to the top surface of the bottom support frame housing.

[0060] In this technical solution, the rotating assembly 11 can drive multiple mounting tables 7 to rotate.

[0061] During use, the transmission assembly 12 can drive the connecting shaft 113 to rotate, thereby driving the rotating gear 112 to rotate. At this time, the arc gear 111 can be driven to rotate, and then structures such as the mounting table 7 and the disassembly and assembly frame 9 can be driven to rotate, so that the focusing ring substrate 10 can be switched within the preheating chamber 3, the preparation chamber 4, the transition chamber 5, and the cooling chamber 6.

[0062] The transmission assembly 12 includes a central bevel gear 121, the bottom of the central bevel gear 121 is connected to the output end of the drive source 122, and the drive source 122 is connected to the inner cavity wall of the bottom support frame housing; A plurality of first bevel gears 123 are meshed and connected to the side of the central bevel gear 121, a transmission shaft 124 is connected to one side of each of the plurality of first bevel gears 123, a second bevel gear 125 is connected to one end of the transmission shaft 124, and the side of the second bevel gear 125 is meshed and connected to a third bevel gear 126, and the top of the third bevel gear 126 is connected to the bottom end of the connecting shaft 113.

[0063] A plurality of fixing plates 127 are connected to the inner cavity of the bottom support frame housing, and the surface of the transmission shaft 124 is rotatably and penetratingly connected to the fixing plates 127.

[0064] The fixing plate 127 is used to support the transmission shaft 124 to make the transmission shaft 124 more stable during rotation.

[0065] In this technical solution, the transmission assembly 12 can drive multiple rotating assemblies 11 to rotate simultaneously.

[0066] During use, the drive source 122 drives the central bevel gear 121 to rotate, thereby driving a plurality of first bevel gears 123 to rotate, and then driving the corresponding transmission shafts 124 to rotate. Thus, a plurality of second bevel gears 125 can be driven to rotate, thereby driving a plurality of third bevel gears 126 to rotate respectively, and then driving a plurality of connecting shafts 113 to rotate respectively.

[0067] The rotating mechanism further includes an anti-deviation component 13, and the anti-deviation component 13 includes an arc-shaped follower frame 131 and a fixed track 132. The arc-shaped follower frame 131 is connected to the bottom of the mounting table 7, and the fixed track 132 is connected to the top of the bottom support frame housing; A plurality of smooth balls 133 are rotatably connected to the top surface of the fixed track 132, and the smooth balls 133 are in contact with the inner wall of the top surface of the fixed track 132.

[0068] In this technical solution, the anti-deviation component 13 can be used to limit the movement track of the mounting table 7.

[0069] When the mounting table 7 rotates, it can drive the arc-shaped follower frame 131 to rotate along the fixed track 132. The fixed track 132 can be used to limit the rotation track of the arc-shaped follower frame 131 and the mounting table 7. At this time, the smooth balls 133 can reduce the friction between the arc-shaped follower frame 131 and the fixed track 132, making the rotation of the arc-shaped follower frame 131 smoother and more labor-saving.

[0070] The preheating chamber 3 is connected to the transition chamber 5 and the cooling chamber 6 through a waste heat utilization component 14. The waste heat utilization component 14 includes a central pipeline 141, and the central pipeline 141 is arranged at the center of the middle preparation frame housing; The side of the central pipeline 141 is respectively communicated with the preheating chamber 3, the transition chamber 5 and the cooling chamber 6. A concentrated frame housing 142 is connected to the outside of the middle preparation frame housing, and the concentrated frame housing 142 is communicated with the preheating chamber 3; A gas flow fan 143 is connected to the inner wall of the concentrated frame housing 142, and a first one-way valve 144 is connected to the side of the concentrated frame housing 142 away from the preheating chamber 3.

[0071] In this technical solution, the waste heat utilization component 14 can be used to utilize the waste heat in the transition chamber 5 and the cooling chamber 6, reducing heat waste and energy consumption.

[0072] Three first dispersion boxes 145 are connected to the side of the central pipeline 141. A second dispersion box 146 is arranged on one side of each of the three first dispersion boxes 145. The three second dispersion boxes 146 are all connected to the inner side of the middle preparation frame housing, and the three second dispersion boxes 146 are respectively communicated with the transition chamber 5, the cooling chamber 6 and the preheating chamber 3; The two side second dispersion boxes 146 are connected through a plurality of second one-way valves 147.

[0073] In this technical solution, the second one-way valve 147 can be used to prevent the gas in the preheating chamber 3 from flowing back into the transition chamber 5 and the cooling chamber 6.

[0074] During use, inside the cooling chamber 6, cold air is introduced into the cooling chamber 6 from the lower part and discharged from the upper part. Under the action of gravity, the cold air sinks and the hot air surges. During this process, the corresponding second dispersion box 146, second one-way valve 147, and first dispersion box 145 are used to send the hot air in the transition chamber 5 and the cooling chamber 6 into the central pipeline 141, and then the heat is directed into the preheating chamber 3 through the corresponding second dispersion box 146, second one-way valve 147, and first dispersion box 145. Inside the preheating chamber 3, the focusing ring substrate 10 is preheated, reducing the energy consumption at the preheating chamber 3 and avoiding heat waste in the transition chamber 5 and the cooling chamber 6; During use, the gas flow fan 143 is used to drive the heat airflow to flow from the transition chamber 5 and the cooling chamber 6 to the preheating chamber 3; During use, the focusing ring substrate 10 is cooled inside the cooling chamber 6 to facilitate the removal of the focusing ring substrate 10.

[0075] Embodiment Two As an embodiment of the present application, the difference between it and other embodiments is that a reinforcing column 83 is connected to the top of the fixed raised block 82, and the distance between the top of the reinforcing column 83 and the inner cavity wall of the top surface of the middle preparation frame housing is within the range of the length of two disassembly and assembly rings 91 and the length of three disassembly and assembly rings 91.

[0076] During use, the disassembly and assembly ring 91 is sleeved on the surface of the reinforcing column 83, and the stability of the connecting strip 92 is ensured by the plugging action between the contact column 93, the fixed raised block 82, the disassembly and assembly raised block 94, and the disassembly and assembly groove 95, so as to further increase the stability when the focusing ring substrate 10 moves.

[0077] Embodiment Three As an embodiment of the present application, the difference between it and other embodiments is that the contact column 93 is fixedly connected to the top of the connecting strip 92.

[0078] During use, the focusing ring substrate 10 is directly placed on the tops of the three contact columns 93 without leveling the heights of the tops of the three contact columns 93, making the placement of the focusing ring substrate 10 faster.

[0079] Embodiment Four As an embodiment of the present application, the difference between it and other embodiments is that the mounting table 7 includes an upper mounting plate 71 and a lower mounting frame housing 72, and the upper mounting plate 71 and the lower mounting frame housing 72 are rotatably connected through a self-rotating component 15; The self-rotating component 15 includes a rotation source 151, the rotation source 151 is connected to the bottom of the inner cavity of the lower mounting frame housing 72, and the output end of the rotation source 151 is connected to the bottom of the upper mounting plate 71; The bottom of the upper mounting plate 71 is connected with an anti - detachment track 152, and an anti - detachment groove is formed on the top side of the lower mounting frame housing 72. The anti - detachment track 152 is slidably connected with the upper mounting plate 71 through the anti - detachment groove. A plurality of friction - reducing balls 153 distributed in an annular array are rotatably connected to the wall of the anti - detachment groove, and the friction - reducing balls 153 are in contact with the side surface of the rotation source 151.

[0080] During use, when the focusing ring substrate 10 is located in the preheating chamber 3, the transition chamber 5 or the cooling chamber 6, the rotation source 151 can be used to drive the upper mounting plate 71 to rotate, so as to drive structures such as the columnar member 8 and the focusing ring substrate 10 to rotate, enabling the multiple groups of focusing ring substrates 10 on the upper mounting plate 71 to rotate by themselves, making the contact between the focusing ring substrate 10 and the external environment more uniform and comprehensive, and facilitating the heating, cooling, etc. of the multiple focusing ring substrates 10.

[0081] Although the specific embodiments of the present invention have been described above, those skilled in the art should understand that this is only an example. Without departing from the principles and essence of the present invention, those skilled in the art can make various changes or modifications to these embodiments, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. Preparation device for a focusing ring for semiconductor equipment, comprising a supporting outer frame (1), wherein the supporting outer frame (1) is sequentially connected by a top support plate, a middle preparation frame housing and a bottom support frame housing, and the middle preparation frame housing is a circular ring-shaped cavity, and is characterized in that, The preparation device for the focusing ring of the semiconductor device further includes: A blocking gate module (2). The circular cavity of the middle preparation frame is divided into four cavities by the blocking gate module (2), which are successively a preheating cavity (3), a preparation cavity (4), a transition cavity (5), and a cooling cavity (6). The blocking gate module (2) is used to control the on-off between the preheating cavity (3), the preparation cavity (4), the transition cavity (5), and the cooling cavity (6); A mounting table (7). Mounting tables (7) are provided in the preheating cavity (3), the preparation cavity (4), the transition cavity (5), and the cooling cavity (6). A plurality of columnar members (8) distributed in an annular array are connected to the upper part of the mounting table (7). A plurality of disassembly and assembly frames (9) are successively and detachably connected to the upper part of the columnar members (8). A focusing ring substrate (10) is placed on the upper part of the disassembly and assembly frame (9). The focusing ring substrate (10) is the substrate for preparing the focusing ring of the semiconductor device; A rotating mechanism. The rotating mechanism is respectively connected to the bottoms of the four mounting tables (7). The rotating mechanism is used to rotate the mounting table (7) so that the mounting table (7) operates in the preheating cavity (3), the preparation cavity (4), the transition cavity (5), and the cooling cavity (6).

2. The manufacturing apparatus of the focus ring for semiconductor devices according to claim 1, characterized in that: The columnar member (8) includes a thick-bottom column (81) and a fixed convex block (82). The bottom of the thick-bottom column (81) is connected to the top of the mounting table (7). A plurality of fixed convex blocks (82) distributed in an annular array are connected to the top of the thick-bottom column (81).

3. The preparation device of the focusing ring for semiconductor equipment according to claim 1, characterized in that: The disassembly and assembly frame (9) includes a disassembly and assembly ring (91). Three connecting bars (92) distributed in an annular array are connected to the side of the disassembly and assembly ring (91); One end of the connecting bar (92) is threadedly connected with a contact column (93). The top end of the contact column (93) contacts the bottom of the focusing ring substrate (10); A plurality of disassembly and assembly convex blocks (94) distributed in an annular array are connected to the top of the disassembly and assembly ring (91). A plurality of disassembly and assembly grooves (95) distributed in an annular array are connected to the bottom of the disassembly and assembly ring (91). The disassembly and assembly convex blocks (94) and the disassembly and assembly grooves (95) are inserted into each other.

4. The manufacturing apparatus of a focus ring for a semiconductor device according to claim 3, characterized in that: The number of the disassembly and assembly convex blocks (94), the disassembly and assembly grooves (95), and the fixed convex blocks (82) is the same, and the sizes of the disassembly and assembly convex blocks (94) and the fixed convex blocks (82) can be inserted into the disassembly and assembly grooves (95).

5. The preparation apparatus for a focusing ring for a semiconductor device according to claim 1, characterized in that: The rotating mechanism includes a rotating component (11) and a transmission component (12). The bottoms of the four mounting tables (7) are all connected with the rotating component (11). The four rotating components (11) are respectively in transmission connection with the transmission component (12). The transmission component (12) is connected in the bottom support frame.

6. The manufacturing apparatus of the focusing ring for semiconductor devices according to claim 5, characterized in that: The rotating component (11) includes an arc gear (111). The arc gear (111) is connected to the bottom of the mounting table (7). The central axes of the arc gears (111) of the four rotating components (11) are on the arc of the same circle; Two symmetrically distributed rotating gears (112) are meshed and connected to the inner side of the arc gear (111). The bottom of the rotating gear (112) is connected with a connecting shaft (113). The connecting shaft (113) is rotatably connected through the top surface of the bottom support frame.

7. The manufacturing apparatus of a focus ring for a semiconductor device according to claim 5, wherein: The transmission assembly (12) includes a central bevel gear (121), the bottom of the central bevel gear (121) is connected to the output end of a drive source (122), and the drive source (122) is connected to the inner cavity wall of the bottom support frame housing; The side of the central bevel gear (121) is meshed and connected with a plurality of first bevel gears (123), one side of each of the plurality of first bevel gears (123) is connected with a transmission shaft (124), one end of the transmission shaft (124) is connected with a second bevel gear (125), the side of the second bevel gear (125) is meshed and connected with a third bevel gear (126), and the top of the third bevel gear (126) is connected with the bottom end of a connecting shaft (113).

8. The manufacturing apparatus of the focus ring for semiconductor devices according to claim 1, wherein: The rotating mechanism further includes an anti-deviation assembly (13), the anti-deviation assembly (13) includes an arc-shaped follower frame (131) and a fixed track (132), the arc-shaped follower frame (131) is connected to the bottom of the mounting table (7), and the fixed track (132) is connected to the top of the bottom support frame housing; A plurality of smooth balls (133) are rotatably connected to the top surface of the fixed track (132), and the smooth balls (133) are in contact with the inner wall of the top surface of the fixed track (132).

9. The manufacturing apparatus of a focusing ring for a semiconductor device according to claim 1, wherein: The preheating chamber (3) is connected to the transition chamber (5) and the cooling chamber (6) through a waste heat utilization assembly (14), the waste heat utilization assembly (14) includes a central pipeline (141), and the central pipeline (141) is arranged at the center of the middle preparation frame housing; The side of the central pipeline (141) is respectively communicated with the preheating chamber (3), the transition chamber (5) and the cooling chamber (6), a centralized frame housing (142) is connected to the outside of the middle preparation frame housing, and the centralized frame housing (142) is communicated with the preheating chamber (3); A gas flow fan (143) is connected to the inner wall of the centralized frame housing (142), and a first one-way valve (144) is connected to one side of the centralized frame housing (142) away from the preheating chamber (3).

10. The manufacturing apparatus of a focusing ring for a semiconductor device according to claim 9, wherein: Three first dispersion boxes (145) are connected to the side of the central pipeline (141), a second dispersion box (146) is arranged on one side of each of the three first dispersion boxes (145), the three second dispersion boxes (146) are all connected to the inner side of the middle preparation frame housing, and the three second dispersion boxes (146) are respectively communicated with the transition chamber (5), the cooling chamber (6) and the preheating chamber (3); The two second dispersion boxes (146) on both sides are connected through a plurality of second one-way valves (147).

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