Chip stripping device and method

Abstract

The invention discloses a chip stripping device and method, and belongs to the technical field of chip processing. The chip stripping device comprises an adsorption cylinder, a center ejector pin seat and an edge ejector pin seat arranged on the outer side of the center ejector pin seat in a sleeving mode, and a center ejector pin on the center ejector pin seat can stretch out of the adsorption face to jack a chip under driving of a first driving assembly through fan-ring-shaped first through holes formed in the adsorption face of the adsorption cylinder in an annular array mode. The first driving assembly can also drive the center ejector pin to rotate in the first through hole to change the abutting position of the center ejector pin and the chip. The periphery of the first through hole is provided with a second through hole, so that the edge ejector pin on the edge ejector pin seat can extend out of the adsorption surface to jack the chip under the driving of the second driving assembly. According to the chip stripping device, the bonding force between the chip and the blue film is reduced step by step in the jacking process, the bonding force at the final connecting position of the chip and the blue film can be further reduced, and therefore the probability that the chip breaks, deforms and flies when the chip is moved and taken is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip manufacturing processes, and in particular relates to a chip peeling device and method. Background Art

[0002] With the development and advancement of technology, memory chips and power semiconductor chips are becoming larger and thinner. In the chip packaging process, ejector pins are usually used to push the chip up, while negative pressure is combined to suck the chip away, separating the chip from the blue film, and ultimately achieving chip pick-up and transfer.

[0003] The existing technology has some problems when using ejector pins to lift the chip: when there are fewer ejector pins, the stress of each ejector pin on the chip is relatively large, which can easily cause large and thin chips to break during the lifting process; when there are more ejector pins, all the ejector pins still support the blue film and the chip when they reach the highest point, resulting in the chip and the blue film being unable to be peeled off over a large area. There is still a large adhesive force between the blue film and the chip, which will generate a large pulling force on the chip during the process of negative pressure suction, causing the chip to easily break. Summary of the Invention

[0004] In response to one or more of the above-mentioned defects or improvement needs in the prior art, the present invention provides a chip peeling device and method, which realizes the step-by-step peeling of the chip and the blue film, gradually reduces the adhesion between the chip and the blue film, and can also reduce the adhesion at the final connection between the chip and the blue film, thereby reducing the probability of the chip breaking when removing the chip.

[0005] To achieve the above object, the present invention provides a chip peeling device, which includes: An adsorption cylinder having an adsorption surface capable of adsorbing a chip, wherein the adsorption surface is provided with a plurality of first through holes and a plurality of second through holes in a fan-shaped pattern, wherein the first through holes are arranged in a circular array, and the second through holes are distributed around the first through holes; A center ejector pin seat is provided on a side of the adsorption surface facing away from the chip. A plurality of center ejector pins arranged in a circular array are provided on one end of the center ejector pin seat facing the adsorption surface, and a first drive assembly is provided on the other end. The first drive assembly can drive the center ejector pin seat to move closer to or away from the adsorption surface, so that the center ejector pins pass through the first through-hole to lift the chip or retract into the adsorption cylinder. The first drive assembly can also drive the center ejector pin seat to rotate to change the contact position between the center ejector pins and the chip. An edge ejector seat is sleeved on the outside of the center ejector seat. A plurality of edge ejectors corresponding to the second through holes are provided at one end of the edge ejector seat facing the adsorption surface, and a second drive assembly is provided at the other end. The second drive assembly can drive the edge ejector seat close to or away from the adsorption surface, so that the edge ejectors pass through the second through holes to lift the chip or retract into the adsorption cylinder.

[0006] As a further improvement of the present invention, all the second through holes are in a rectangular shape.

[0007] As a further improvement of the present invention, there are four center ejectors, and the spacing between adjacent center ejectors is 3-7 mm; there are four edge ejectors, and the spacing between adjacent edge ejectors is 8-20 mm.

[0008] As a further improvement of the present invention, a plurality of adsorption holes are provided on the adsorption surface, a through first channel is opened in the middle of the central ejector seat, and one end of the first channel close to the adsorption surface is opposite to at least one of the adsorption holes.

[0009] As a further improvement of the present invention, the edge ejector seat is provided with a second channel perpendicular to the adsorption surface for passing through the central ejector seat, and the side wall surface of the central ejector seat abuts against the side wall surface of the second channel.

[0010] As a further improvement of the present invention, the adsorption cylinder includes a cylinder body and a cover plate, the adsorption surface is arranged on the cover plate, and the cover plate is detachably connected to the top end of the cylinder body.

[0011] As a further improvement of the present invention, a negative pressure vent hole is provided on the cylinder, and the negative pressure vent hole is connected to the vacuum adsorption air path.

[0012] As a further improvement of the present invention, the center ejector seat and the edge ejector seat are arranged inside the cylinder, the first drive assembly and the second drive assembly are arranged outside the cylinder, the center ejector seat is connected to the first drive assembly through a first ejector rod, and the edge ejector seat is connected to the second drive assembly through a second ejector rod.

[0013] As a further improvement of the present invention, a sealing assembly is provided between the first push rod, the second push rod and the end of the cylinder respectively.

[0014] As another aspect of the present invention, a chip peeling method is provided, which is implemented using the above-mentioned chip region peeling device and includes the following steps: S1: The adsorption cylinder adsorbs the side of the chip covered with the blue film onto the adsorption surface; S2: The first drive assembly and the second drive assembly simultaneously drive the center ejector pin holder and the edge ejector pin holder to approach the adsorption surface, so that the center ejector pin passes through the first through hole and the edge ejector pin passes through the second through hole. The center ejector pin and the edge ejector pin simultaneously lift the chip, and the chip is separated from the adsorption surface; S3: the first driving assembly continues to drive the central ejector pin holder to move faster toward the adsorption surface relative to the edge ejector pin holder, so that the edge ejector pins are separated from the chip; S4: The first driving assembly drives the center ejector seat to rotate, thereby changing the contact position between the chip and the center ejector.

[0015] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0016] In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art: (1) The chip peeling device of the present invention comprises an adsorption cylinder, a center ejector seat, and an edge ejector seat sleeved on the outside of the center ejector seat. The first through hole in the shape of a fan ring is arranged along the annular array on the adsorption surface of the adsorption cylinder, so that the center ejector on the center ejector seat can be extended to the adsorption surface to lift the chip under the drive of the first driving component, and the first driving component can also drive the center ejector to rotate in the first through hole to change its contact position with the chip; by arranging a second through hole outside the first through hole, the edge ejector on the edge ejector seat can be extended to the adsorption surface to lift the chip under the drive of the second driving component. The chip peeling device of the present invention can reduce the bonding force between the chip and the blue film step by step during the lifting process, and can also reduce the bonding force at the final connection between the chip and the blue film, thereby reducing the probability of the chip breaking, deforming, or flying away when removing the chip.

[0017] (2) The chip peeling device of the present invention reduces the chip and blue film peeling process to only 8 contact points by setting the center ejector pins to 4 and forming a rectangular shape, and setting the edge ejector pins to 4 and forming a rectangular shape, thereby realizing step-by-step peeling of rectangular chips, and the two rectangular areas can also ensure that the peeling force between each contact point and the blue film is relatively uniform.

[0018] (3) The chip peeling device of the present invention satisfies the chip peeling process of different sizes by changing the spacing between the center ejector pins and / or the edge ejector pins and replacing different cover plates.

[0019] (4) The chip peeling method of the present invention realizes the step-by-step peeling of the chip and the blue film by the above-mentioned chip regional peeling device, and finally changes the contact position between the center pin and the chip by rotation, thereby reducing the bonding force at the final connection position between the chip and the blue film, thereby reducing the probability of the chip breaking, flying away, and deforming when removing the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a cross-sectional view of a chip peeling device according to an embodiment of the present invention; Figure 2 is a top view of a chip peeling device according to an embodiment of the present invention; Figure 3 This is a structural diagram of a center ejector seat according to an embodiment of the present invention; Figure 4 2. It is a schematic structural diagram of an edge ejector seat according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the embodiment of the present invention in which the edge ejector seat and the center ejector seat are combined together; Figure 6 yes Figure 5 Top view of .

[0022] In all the drawings, the same figure marks represent the same technical features, specifically: 1. Adsorption cylinder; 11. First through hole; 12. Second through hole; 13. Adsorption hole; 14. Cylinder; 141. Negative pressure vent; 15. Cover plate; 151. Annular groove; 2. Center ejector pin seat; 21. Center ejector pin; 22. First channel; 3. Edge ejector pin seat; 31. Edge ejector pin; 32. Second channel; 4. First drive assembly; 5. Second drive assembly; 6. First ejector pin; 7. Second ejector pin. DETAILED DESCRIPTION

[0023] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to illustrate the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0026] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0027] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0028] Example: See also Figures 1 to 6 The chip peeling device in the preferred embodiment of the present invention includes an adsorption cylinder 1, a central ejector seat 2 and an edge ejector seat 3.

[0029] The adsorption cylinder 1 has an adsorption surface capable of adsorbing the chip, and a plurality of first through holes 11 and a plurality of second through holes 12 are provided on the adsorption surface. The first through holes 11 are arranged in a circular array, and the second through holes 12 are distributed around the first through holes 11. Figure 2 shown.

[0030] The center ejector seat 2 is arranged on the side of the adsorption surface away from the chip. The center ejector seat 2 is provided with a plurality of center ejectors 21 arranged in a ring array at one end facing the adsorption surface, and a first driving component 4 is provided at the other end. Figure 3 As shown, the first driving component 4 can drive the center ejector seat 2 to approach or move away from the adsorption surface, so that the center ejector 21 passes through the first through hole 11 to lift the chip or retract it into the adsorption cylinder 1, and the first driving component 4 can drive the center ejector seat 2 to rotate to change the contact position between the center ejector 21 and the chip.

[0031] The edge ejector seat 3 is sleeved on the outside of the center ejector seat 2. The edge ejector seat 3 is provided with a plurality of edge ejectors 31 corresponding to the second through holes 12 at one end thereof facing the adsorption surface, and a second driving assembly 5 is provided at the other end thereof. Figure 4 As shown, the second driving assembly 5 can drive the edge ejector seat 3 to move closer to or away from the adsorption surface, so that the edge ejector 31 passes through the second through hole 12 to lift the chip or retracts it into the adsorption cylinder 1.

[0032] In this embodiment, the first through hole 11 is arranged in a fan-shaped shape, so that each center pin 21 can also rotate around the center of the fan-shaped shape in the first through hole 11 after passing through the first through hole 11. When the present chip regional peeling mechanism is used, the adsorption cylinder 1 first adsorbs the side of the chip covered with the blue film on the adsorption surface, and then controls the height of the center pin 21 and the edge pin 31 on the center pin seat 2 and the edge pin seat 3 extending out of the adsorption surface through the first drive component 4 and the second drive component 5, respectively, to achieve peeling between the blue film and the chip. By controlling the lifting speed of the two pin seats, the chip and the blue film can be further peeled off in steps. For example, initially, the two drive components control the two pin seats to lift out of the adsorption surface to a certain height at the same speed, and then the two drive components control the two pin seats to lift at different speeds, respectively, so that the edge pins 31 is separated from the chip, and only the center ejector pin 21 is in contact with the chip. At this time, the blue film in the edge area is peeled off from the chip under the action of elastic recovery and the adsorption force of the adsorption cylinder. Finally, the second driving component 5 stops working, and the first driving component 4 drives the center ejector pin seat 2 to rotate a certain angle. For example, it can be rotated by 3°, 5°, 10°, etc., so as to change the abutting position of the center ejector pin 21 and the chip, increase the deformation of the blue film at the center ejector pin, and further reduce the bonding force between the chip and the blue film at the center ejector pin 21, so as to reduce the bonding force that needs to be overcome when removing the chip, thereby reducing the probability of the chip breaking, deforming, and flying away when removing the chip.

[0033] Preferably, all the second through-holes 12 enclose a rectangular shape, and the rectangular lifting area is more suitable for the rectangular chip. When lifting rectangular chips of the same size, using a rectangular lifting area can minimize the area required for the edge thimble base 3 and reduce the space it occupies in the adsorption cylinder 1.

[0034] Preferably, there are 4 center thimbles 21 and 4 edge thimbles 31. The 4 thimbles on the two thimble bases respectively form two squares. Preferably, the side lengths of the two squares can be adjusted according to the sizes of different chips. Exemplarily, larger chip sizes are 30×30 mm, 20×20 mm, etc., and smaller chip sizes are 3×3 mm, 5×5 mm, etc.

[0035] Further preferably, the distance between adjacent center thimbles 21 is 3 - 7 mm; the distance between adjacent edge thimbles 31 is 8 - 20 mm. As Figure 5 、 Figure 6 shown, the two squares are in a double-square shape. The side length of the square on the center thimble base 2 is preferably 4 mm, and the distance can be increased in proportions such as increasing by 0.1 times, 0.2 times, 0.3 times, 0.4 times, 0.5 times, 0.6 times, 0.7 times, 0.8 times, 0.9 times, 1.0 times, etc., or decreased by 0.1 times, 0.2 times; the side length of the square on the edge thimble base 3 is preferably 10 mm, and the distance can be increased in proportions such as increasing by 0.1 times, 0.2 times, 0.3 times, 0.4 times, 0.5 times, 0.6 times, 0.7 times, 0.8 times, 0.9 times, 1.0 times, etc., or decreased by 0.1 times, 0.2 times. By changing the distances between the thimbles on the center thimble base 2 and / or the edge thimble base 3, the chip peeling process for chips of different sizes can be satisfied.

[0036] Preferably, a plurality of adsorption holes 13 are provided on the adsorption surface, and a through first channel 22 is opened in the middle of the center thimble base 2. One end of the first channel 22 close to the adsorption surface is facing at least one adsorption hole 13.

[0037] In this embodiment, the adsorption cylinder 1 adsorbs the blue film of the chip on the adsorption surface through the adsorption holes 13. The first channel 22 in the middle of the center thimble base 2 is facing at least one adsorption hole 13, which can ensure that the blue film in the middle of the center thimble 21 is tightly adsorbed on the adsorption surface to prevent the blue film in the area surrounded by the center thimble 21 from being lifted together with the chip and not being peeled off from the chip.

[0038] Preferably, adsorption holes 13 are provided between adjacent first through-holes 11, between adjacent second through-holes 12, and between the first through-hole 11 and the second through-hole 12 to prevent the blue film from being lifted成片 by the center thimble and / or the edge thimble, and ensure that the chip can be effectively peeled off from the blue film when the thimble lifts the chip.

[0039] Preferably, edge ejector seat 3 defines a second channel 32 perpendicular to the suction surface for passing through center ejector seat 2, with the sidewall of center ejector seat 2 abutting against the sidewall of the channel. In this preferred embodiment, the cross-sectional outer contours of second channel 32 and center ejector seat 2 are both circular, and second channel 32 provides a guide for the movement of center ejector seat 2.

[0040] Furthermore, the adsorption cylinder 1 preferably includes a cylinder body 14 and a cover plate 15. The adsorption surface is provided on the cover plate 15, which is removably connected to the top of the cylinder body 14, allowing for replacement of different adsorption surfaces to match different ejector pin holders or chips of different sizes. In this embodiment, the cylinder body 14 has an open top and a closed bottom. Furthermore, when the chip size is larger, the cylinder body 14, cover plate 15, and two ejector pin holders can be replaced together to find the appropriate adsorption surface and ejector pin spacing to match the chip.

[0041] Preferably, the cover plate 15 is provided with a plurality of annular grooves 151 at intervals. The annular grooves 151 can reduce the contact area between the blue film and the adsorption surface, making it easier for the blue film to adhere to the adsorption surface. For example, the first through hole 11, the second through hole 12, and the adsorption hole 13 are all provided along the annular grooves 151.

[0042] Further preferably, a negative pressure vent hole 141 is provided on the cylinder 14, and the negative pressure vent hole 141 is connected to the vacuum adsorption air path, so that the cylinder 14 can be vacuumed to adsorb the blue film of the chip on the cover plate 15. Exemplarily, the negative pressure vent hole 141 is opposite to the other end of the first channel 22.

[0043] Preferably, the center ejector seat 2 and the edge ejector seat 3 are arranged inside the cylinder 14, and the first drive assembly 4 and the second drive assembly 5 are arranged outside the cylinder 14. The center ejector seat 2 is connected to the first drive assembly 4 through the first ejector rod 6, and the edge ejector seat 3 is connected to the second drive assembly 5 through the second ejector rod 7. Arranging the drive assembly outside the cylinder 14 can greatly reduce the space of the cylinder 14, thereby reducing the area that needs to be vacuumed, and facilitating the rapid formation of a negative pressure state in the cylinder 14 to adsorb the blue film of the chip on the adsorption surface.

[0044] In this embodiment, the first drive assembly 4 drives the first ejector pin 6 to move or rotate, thereby driving the center ejector base 2 to move or rotate. The second drive assembly 5 drives the second ejector pin 7 to move, thereby driving the edge ejector base 3 to move. For example, the cross-section of the first ejector pin 6 is preferably circular, and the cross-section of the second ejector pin 7 can be circular, rectangular, etc., but is preferably circular.

[0045] Preferably, a sealing component is provided between the negative pressure vent hole 141 and the vacuum adsorption air path.

[0046] Preferably, a sealing assembly is provided between the first push rod 6, the second push rod 7 and the bottom end of the cylinder 14, respectively, to prevent vacuum leakage between the cylinder 14 and the first push rod 6, the second push rod 7. For example, the sealing assembly can be a sealing ring provided along an annular shape in the through hole through which the first push rod and the second push rod are provided.

[0047] In actual use, the present application also provides a chip peeling method, which is implemented using the above-mentioned chip peeling device and includes the following process: S1: The adsorption cylinder adsorbs the side of the chip covered with the blue film onto the adsorption surface; S2: The first drive assembly and the second drive assembly simultaneously drive the center ejector pin holder and the edge ejector pin holder to approach the adsorption surface, so that the center ejector pin passes through the first through hole and the edge ejector pin passes through the second through hole. The center ejector pin and the edge ejector pin simultaneously lift the chip, and the chip is separated from the adsorption surface; S3: The first driving assembly continues to drive the center ejector pin holder to move faster toward the adsorption surface relative to the edge ejector pin holder, so that the chip is separated from the edge ejector pins; S4: The first driving assembly drives the central ejector pin seat to rotate, thereby changing the contact position between the chip and the central ejector pin.

[0048] Among them, step S3 includes the following three situations: (1) the second driving component stops working, and the first driving component drives the central ejector seat to move toward the direction close to the adsorption surface; (2) the second driving component is working, and it drives the edge ejector to move toward the direction away from the adsorption surface and retract into the adsorption cylinder, and the first driving component drives the central ejector seat to move toward the direction close to the adsorption surface; (3) the second driving component is working, and it drives the edge ejector to move toward the direction close to the adsorption surface, but at a slower speed than the central ejector seat approaches the adsorption surface.

[0049] Preferably, after step S4, a chip pickup head may be used to remove the chip and completely peel off the chip from the blue film.

[0050] The chip peeling method of the present invention realizes step-by-step peeling of the chip and the blue film through a chip peeling device, and finally changes the abutment position of the center ejector pin and the chip by rotation, thereby reducing the adhesion force between the chip and the blue film at the center ejector pin position, and reducing the probability of the chip being broken, ejected, or deformed when removing the chip.

[0051] It will be easily understood by those skilled in the art that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip peeling device, characterized in that: include: An adsorption cylinder having an adsorption surface capable of adsorbing a chip, wherein the adsorption surface is provided with a plurality of first through holes and a plurality of second through holes in a fan-shaped pattern, wherein the first through holes are arranged in a circular array, and the second through holes are distributed around the first through holes; A center ejector pin seat is provided on a side of the adsorption surface facing away from the chip. A plurality of center ejector pins arranged in a circular array are provided on one end of the center ejector pin seat facing the adsorption surface, and a first drive assembly is provided on the other end. The first drive assembly can drive the center ejector pin seat to move closer to or away from the adsorption surface, so that the center ejector pins pass through the first through-hole to lift the chip or retract into the adsorption cylinder. The first drive assembly can also drive the center ejector pin seat to rotate to change the contact position between the center ejector pins and the chip. An edge ejector seat is sleeved on the outside of the center ejector seat. A plurality of edge ejectors corresponding to the second through holes are provided at one end of the edge ejector seat facing the adsorption surface, and a second drive assembly is provided at the other end. The second drive assembly can drive the edge ejector seat close to or away from the adsorption surface, so that the edge ejectors pass through the second through holes to lift the chip or retract into the adsorption cylinder.

2. The chip peeling device according to claim 1, wherein: All the second through holes are arranged in a rectangular shape.

3. The chip peeling device according to claim 2, characterized in that: There are four center ejector pins, and the spacing between adjacent center ejector pins is 3-7 mm; there are four edge ejector pins, and the spacing between adjacent edge ejector pins is 8-20 mm.

4. The chip peeling device according to claim 1, wherein: A plurality of adsorption holes are provided on the adsorption surface, a first through channel is opened in the middle of the central ejector seat, and an end of the first channel close to the adsorption surface is directly opposite to at least one of the adsorption holes.

5. The chip peeling device according to claim 1, wherein: The edge ejector seat is provided with a second channel perpendicular to the adsorption surface for passing through the central ejector seat, and the side wall surface of the central ejector seat abuts against the side wall surface of the second channel.

6. The chip peeling device according to any one of claims 1 to 5, characterized in that: The adsorption cylinder comprises a cylinder body and a cover plate, the adsorption surface is arranged on the cover plate, and the cover plate is detachably connected to the top end of the cylinder body.

7. The chip peeling device according to claim 6, characterized in that: The cylinder is provided with a negative pressure vent hole, and the negative pressure vent hole is communicated with the vacuum adsorption air path.

8. The chip peeling device according to claim 6, wherein: The central ejector seat and the edge ejector seat are arranged inside the cylinder, and the first drive assembly and the second drive assembly are arranged outside the cylinder. The central ejector seat is connected to the first drive assembly through a first ejector rod, and the edge ejector seat is connected to the second drive assembly through a second ejector rod.

9. The chip peeling device according to claim 8, characterized in that: A sealing assembly is provided between the first push rod, the second push rod and the bottom end of the cylinder respectively.

10. A chip peeling method, characterized in that: The method is implemented by using the chip peeling device according to claims 1 to 9, and includes the following steps: S1: The adsorption cylinder adsorbs the side of the chip covered with the blue film onto the adsorption surface; S2: The first drive assembly and the second drive assembly simultaneously drive the center ejector pin holder and the edge ejector pin holder to approach the adsorption surface, so that the center ejector pin passes through the first through hole and the edge ejector pin passes through the second through hole. The center ejector pin and the edge ejector pin simultaneously lift the chip, and the chip is separated from the adsorption surface; S3: the first driving assembly continues to drive the central ejector pin holder to move faster toward the adsorption surface relative to the edge ejector pin holder, so that the edge ejector pins are separated from the chip; S4: The first driving assembly drives the center ejector seat to rotate, thereby changing the contact position between the chip and the center ejector.

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