Device for preparing focus ring for semiconductor equipment

Abstract

The present invention provides an apparatus for preparing focus rings for semiconductor devices, comprising a mounting platform, each of which is provided within a heat chamber, a preparation chamber, a transition chamber, and a cooling chamber. A plurality of cylindrical members arranged in a circular array are connected to the upper portion of the mounting platform. Multiple assembly and disassembly racks are detachably connected to the upper portions of the cylindrical members. A focus ring substrate is placed on the upper portion of the assembly and disassembly racks. The focus ring substrate is used to prepare focus rings for semiconductor devices. The present invention utilizes the cylindrical members and the assembly and disassembly racks to stack multiple focus ring substrates, allowing for the deposition of multiple focus rings at a time. Furthermore, the assembly and disassembly racks have only three contact points with the focus ring substrate, minimizing the contact surface between the focus ring substrate and the assembly and disassembly racks. This facilitates removal and installation of the focus ring substrate, and the small contact area reduces the impact of contact position on the quality of the focus ring formation.

Description

Technical Field

[0001] The present invention relates to the field of focus ring preparation equipment, and in particular to a preparation device for a focus ring used in semiconductor equipment. Background Art

[0002] The focus ring is a critical component in semiconductor equipment. It is a core component in the wafer manufacturing process and is widely used in plasma processing equipment. A focus ring typically consists of a lower ring member made of a dielectric material and an upper ring member made of a conductive material, positioned above the lower member. Common materials include conductive silicon, quartz, and silicon carbide (SiC). Silicon carbide, with its high resistance to ion etching, high thermal conductivity, and high wear resistance, is an ideal material for focus rings.

[0003] For silicon carbide focusing rings, chemical vapor deposition is generally used for preparation. Chemical vapor deposition can produce silicon carbide focusing rings with excellent performance. In the Chinese utility model patent "Announcement No.: CN216337939U, Name: A Chemical Vapor Deposition Equipment with Multi-layer Workpiece Placement Surface", a workpiece placement rack is arranged in the reaction chamber. The workpiece placement rack has multiple layers of workpiece placement surfaces in the vertical direction. Workpieces can be placed on each layer of workpiece placement surface, thereby increasing the area for placing workpieces, increasing the number of workpieces accommodated in the vapor deposition furnace, and improving the production efficiency of the vapor deposition furnace. Although multiple workpieces can be stacked in the above application, the contact area between the placement rack and the workpiece is large, which makes it difficult to disassemble the workpiece after deposition, and the large contact area leads to larger defects, affecting the molding quality of the focusing ring. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defects in the prior art that the focus ring substrate has a large contact area with the placement frame, is difficult to disassemble and affects the molding effect, and to provide a preparation device for the focus ring for semiconductor equipment.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] The present invention provides a device for preparing a focus ring for semiconductor equipment, comprising a supporting outer frame,

[0007] The supporting outer frame is composed of a top supporting plate, a middle preparation frame shell and a bottom supporting frame shell connected in sequence, and the middle preparation frame shell is a circular chamber;

[0008] The blocking door module is used to divide the annular chamber of the middle preparation frame into four chambers, namely the preheating chamber, the preparation chamber, the transition chamber and the cooling chamber. The blocking door module is used to control the connection and disconnection between the preheating chamber, the preparation chamber, the transition chamber and the cooling chamber.

[0009] Mounting platforms are provided in the preheating chamber, preparation chamber, transition chamber, and cooling chamber. A plurality of cylindrical members arranged in a circular array are connected to the upper portion of the mounting platforms. A plurality of disassembly racks are detachably connected to the upper portion of the cylindrical members. A focus ring substrate is placed on the upper portion of the disassembly rack. The focus ring substrate is a substrate for preparing a focus ring for semiconductor equipment.

[0010] The rotating mechanism is connected to the bottom of the four mounting platforms respectively, and is used to rotate the mounting platforms so that the mounting platforms can operate in the preheating chamber, the preparation chamber, the transition chamber and the cooling chamber.

[0011] In this technical solution, the focus ring substrate is installed or removed in the cooling chamber, then enters the preheating chamber to preheat the focus ring substrate, and then enters the preparation chamber for chemical vapor deposition to prepare the focus ring. After completion, it enters the transition chamber and finally enters the cooling chamber to cool and remove the focus ring, so that the preparation chamber can continuously perform vapor deposition. Cooling the focus ring and removing and installing the focus ring substrate do not affect the chemical vapor deposition preparation of the focus ring. After the focus ring substrate is preheated, the temperature of the focus ring substrate can be made more uniform in the deposition chamber, and a large temperature difference will not occur on the focus ring substrate, resulting in uneven material properties and affecting the quality of the final focus ring.

[0012] At the same time, multiple focus ring substrates can be stacked and placed using columnar parts and disassembly and assembly frames, and multiple focus rings can be deposited at a single time. The contact area between the disassembly and assembly frame and the focus ring substrate is only three points, which makes the contact surface between the focus ring substrate and the disassembly and assembly frame extremely small, making it easy to disassemble and install the focus ring substrate. The small contact area reduces the influence of the contact position on the focus ring molding quality.

[0013] Preferably, the columnar member includes a thick bottom column and fixed protrusion blocks, the bottom of the thick bottom column is connected to the top of the mounting platform, and the top of the thick bottom column is connected to a plurality of fixed protrusion blocks distributed in a ring array.

[0014] In this technical solution, the columnar member can be used to facilitate the installation of the disassembly and assembly rack.

[0015] Preferably, the disassembly frame includes a disassembly ring, and the side of the disassembly ring is connected to three connecting bars distributed in a ring array;

[0016] One end of the connecting bar is threadedly connected to a contact post, and the top of the contact post is in contact with the bottom of the focus ring substrate;

[0017] The top of the disassembly ring is connected to a plurality of disassembly and assembly protrusions distributed in a circular array, and the bottom of the disassembly ring is connected to a plurality of disassembly and assembly grooves distributed in a circular array. The disassembly and assembly protrusions and the fixed protrusions are plugged into the disassembly and assembly grooves.

[0018] In this technical solution, the disassembly and assembly rack can be used to facilitate the placement of the focus ring substrate.

[0019] Preferably, the number of the disassembly and assembly protrusions, the disassembly and assembly grooves and the fixed protrusions is the same.

[0020] In this technical solution, the disassembly protrusion block can be plugged into the disassembly groove, and the fixed protrusion block can be plugged into the disassembly groove.

[0021] Preferably, the rotating mechanism includes a rotating assembly and a transmission assembly. The bottoms of the four mounting platforms are connected to a rotating assembly. The four rotating assemblies are respectively connected to the transmission assembly in a transmission connection. The transmission assembly is connected to the bottom support frame shell.

[0022] In this technical solution, the rotating mechanism can be used to drive the mounting platform and other structures to move within the four chambers.

[0023] Preferably, the rotating assembly includes an arc gear, the arc gear is connected to the bottom of the mounting platform, and the central axes of the four arc gears of the rotating assembly are on the same circular arc line;

[0024] The inner side of the arc gear is meshed with two symmetrically distributed rotating gears, and the bottom of the rotating gear is connected to a connecting shaft, which is rotatably connected to the top surface of the bottom supporting frame shell.

[0025] In this technical solution, the rotating assembly can drive multiple mounting platforms to rotate.

[0026] Preferably, the transmission assembly includes a central bevel gear, the bottom of the central bevel gear is connected to the output end of the driving source, and the driving source is connected to the inner wall of the bottom supporting frame shell;

[0027] The side of the central bevel gear is meshed and connected with multiple first bevel gears, one side of each of the first bevel gears is connected to a transmission shaft, one end of the transmission shaft is connected to a second bevel gear, the side of the second bevel gear is meshed and connected with the third bevel gear, and the top of the third bevel gear is connected to the bottom end of the connecting shaft.

[0028] In this technical solution, the transmission component can drive multiple rotating components to rotate at the same time.

[0029] Preferably, the rotating mechanism further includes an anti-deflection component, the anti-deflection component includes an arc-shaped follower frame and a fixed track, the arc-shaped follower frame is connected to the bottom of the mounting platform, and the fixed track is connected to the top of the bottom support frame shell;

[0030] The top surface of the fixed track is rotatably connected to a plurality of smooth rolling balls, and the smooth rolling balls are in contact with the inner wall of the top surface of the fixed track.

[0031] In this technical solution, the anti-deflection component can be used to limit the movement trajectory of the mounting platform.

[0032] Preferably, the preheating chamber is connected to the transition chamber and the cooling chamber via a waste heat utilization component, and the waste heat utilization component includes a central pipeline, and the central pipeline is arranged at the center of the middle preparation frame shell;

[0033] The side surfaces of the central pipeline are respectively connected to the preheating chamber, the transition chamber and the cooling chamber. The outer side of the middle preparation frame shell is connected to a centralized frame shell, and the centralized frame shell is connected to the preheating chamber.

[0034] An air flow fan is connected to the inner wall of the centralized frame shell, and a first one-way valve is connected to a side of the centralized frame shell away from the preheating chamber.

[0035] In this technical solution, the waste heat in the transition cavity and the cooling cavity can be utilized by utilizing the waste heat utilization component, thereby reducing heat waste and energy consumption.

[0036] Preferably, three first dispersion boxes are connected to the side of the central pipeline, and a second dispersion box is provided on one side of each of the three first dispersion boxes. The three second dispersion boxes are connected to the inner side of the middle preparation frame shell, and the three second dispersion boxes are respectively connected to the transition chamber, the cooling chamber, and the preheating chamber;

[0037] The second dispersion boxes on both sides are connected via a plurality of second one-way valves.

[0038] In this technical solution, the second one-way valve can be used to prevent the gas in the preheating chamber from flowing back into the transition chamber and the cooling chamber.

[0039] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0040] The beneficial effects of the present invention are:

[0041] The present invention installs or removes a focus ring substrate in a cooling chamber, then enters a preheating chamber to preheat the focus ring substrate, then enters a preparation chamber to perform chemical vapor deposition to prepare a focus ring, and after completion, enters a transition chamber, and finally enters a cooling chamber to cool and remove the focus ring, so that the preparation chamber can continuously perform vapor deposition, and cooling the focus ring and removing the focus ring substrate do not affect the chemical vapor deposition preparation of the focus ring. Moreover, after the focus ring substrate is preheated, the temperature of the focus ring substrate can be made more uniform in the deposition chamber, and a large temperature difference on the focus ring substrate will not occur, resulting in uneven material properties and affecting the quality of the final focus ring.

[0042] At the same time, the columnar member and the assembly and disassembly frame can be used to stack multiple focus ring substrates, and multiple focus rings can be deposited at a time. The contact area between the assembly and disassembly frame and the focus ring substrate is only three points, which makes the contact surface between the focus ring substrate and the assembly and disassembly frame extremely small, facilitating the removal and installation of the focus ring substrate. The small contact area also reduces the impact of the contact position on the focus ring molding quality.

[0043] Furthermore, the waste heat utilization component can transfer the heat in the transition chamber and the cooling chamber to the preheating chamber to preheat the focus ring substrate, thereby reducing the energy consumption in the preheating chamber and avoiding heat waste in the transition chamber and the cooling chamber.

[0044] Further utilization of the self-rotating assembly can drive the mounting table, columnar parts, disassembly and assembly rack and other structures to rotate, so that the focus ring substrate can be rotated when in the preheating chamber, transition chamber and cooling chamber, so that the contact between the focus ring substrate and the above-mentioned external environment is more comprehensive and uniform, and the heating or cooling of the focus ring substrate is more uniform, thereby improving the quality of the focus ring and facilitating the use of semiconductor equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 Schematic diagram of the structure of a device for preparing a focus ring for semiconductor equipment according to an embodiment of the present invention.

[0046] Figure 2 for Figure 1 The figure shows a schematic diagram of the overall internal structure of a device for preparing a focus ring for a semiconductor device.

[0047] Figure 3 for Figure 1 The figure shows a schematic diagram of the overall top view of the manufacturing apparatus for a focus ring for a semiconductor device.

[0048] Figure 4 for Figure 1 The diagram shows an exploded structure of a supporting outer frame, a blocking door module, a mounting platform and columnar parts of a device for preparing a focusing ring for semiconductor equipment.

[0049] Figure 5 for Figure 1 The diagram shown is a schematic diagram of the internal structure of the disassembly and assembly frame of the device for preparing the focus ring for semiconductor equipment.

[0050] Figure 6 for Figure 1 A three-dimensional diagram of a disassembly and assembly frame of a device for preparing a focus ring for semiconductor equipment shown in FIG. Figure 1 .

[0051] Figure 7 for Figure 1 A three-dimensional diagram of a disassembly and assembly frame of a device for preparing a focus ring for semiconductor equipment shown in FIG. Figure 2 .

[0052] Figure 8 for Figure 1 A three-dimensional diagram of a disassembly and assembly frame of a device for preparing a focus ring for semiconductor equipment shown in FIG. Figure 3 .

[0053] Figure 9 for Figure 1The diagram shows an exploded structure of a columnar component, a disassembly and assembly frame, and a focus ring substrate of a device for preparing a focus ring for semiconductor equipment.

[0054] Figure 10 for Figure 1 The diagram shows the structural connection relationship between the central pipeline, the first dispersion box, the second dispersion box and the second one-way valve of the device for preparing the focusing ring for semiconductor equipment.

[0055] Figure 11 for Figure 2 The diagram shows a partially enlarged structural diagram of location A of a device for preparing a focusing ring for semiconductor equipment.

[0056] Figure 12 for Figure 1 The diagram shows the structure of the transmission component and the rotating component of the device for preparing the focusing ring for semiconductor equipment.

[0057] Figure 13 for Figure 1 The connection relationship between the rotating assembly and the second bevel gear of the manufacturing device for the focus ring of the semiconductor device is shown as follows Figure 1 .

[0058] Figure 14 for Figure 1 The connection relationship between the rotating assembly and the second bevel gear of the manufacturing device for the focus ring of the semiconductor device is shown as follows Figure 2 .

[0059] Figure 15 for Figure 2 The diagram shows a partially enlarged structural diagram of position B of a device for preparing a focusing ring for semiconductor equipment.

[0060] Description of Reference Numerals

[0061] 1. Support outer frame; 2. Blocking door module; 3. Preheating chamber; 4. Preparation chamber; 5. Transition chamber; 6. Cooling chamber; 7. Mounting platform; 71. Upper mounting plate; 72. Lower mounting frame; 8. Column; 81. Thick bottom column; 82. Fixed protrusion; 83. Reinforcement column; 9. Disassembly frame; 91. Disassembly ring; 92. Connecting strip; 93. Contact column; 94. Disassembly protrusion; 95. Disassembly groove; 10. Focusing ring substrate; 11. Rotating assembly; 111. Arc gear; 112. Rotating gear; 113. Connecting shaft; 12. Transmission assembly; 121. Center bevel gear; 122 , driving source; 123, first bevel gear; 124, transmission shaft; 125, second bevel gear; 126, third bevel gear; 127, fixed plate; 13, anti-bias component; 131, arc follower frame; 132, fixed track; 133, smooth rolling ball; 14, waste heat utilization component; 141, central pipeline; 142, centralized frame shell; 143, gas flow fan; 144, first one-way valve; 145, first dispersion box; 146, second dispersion box; 147, second one-way valve; 15, self-rotating component; 151, rotation source; 152, anti-derailment track; 153, anti-friction rolling ball. DETAILED DESCRIPTION

[0062] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0063] Figures 1 to 15 FIG. 1 is a schematic structural diagram of an embodiment of a device for preparing a focus ring for semiconductor equipment according to the present invention.

[0064] Example 1

[0065] The manufacturing apparatus of the focus ring for semiconductor equipment comprises a supporting outer frame 1,

[0066] The supporting outer frame 1 is composed of a top supporting plate, a middle preparation frame shell and a bottom supporting frame shell connected in sequence, and the middle preparation frame shell is a circular chamber;

[0067] The blocking door module 2 is used to divide the annular chamber of the middle preparation frame into four chambers, namely the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6. The blocking door module 2 is used to control the connection between the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6;

[0068] The driving mechanism and upper and lower travel tracks of the blocking door module 2 are respectively connected to the upper and lower sides of the supporting outer frame 1. The driving mechanism is used to control the movement of the blocking door module 2, thereby controlling the connection and disconnection between the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6.

[0069] The preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6 are all connected to gas inlet, outlet and heating equipment, and the gas inlet, outlet and heating equipment are respectively connected to the top and bottom sides of the supporting outer frame 1. The gas inlet, outlet and heating equipment are used to introduce corresponding gases into the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6;

[0070] During use, a mixed gas of trichlorosilane and hydrogen is introduced into the preparation chamber 4 during vapor deposition. These gases will undergo a chemical reaction at high temperature to generate the required silicon carbide material on the focusing ring substrate 10. During this process, gas inlet and outlet and heating equipment are required to control parameters such as temperature, gas flow and reaction time in the preparation chamber 4 to ensure that the deposited silicon carbide has the required purity and structure.

[0071] Mounting platform 7, wherein the preheating chamber 3, the preparation chamber 4, the transition chamber 5, and the cooling chamber 6 are each provided with a mounting platform 7, and a plurality of columnar members 8 distributed in a ring array are connected to the upper portion of the mounting platform 7, and a plurality of disassembly racks 9 are sequentially and detachably connected to the upper portion of the columnar members 8, and a focus ring substrate 10 is placed on the upper portion of the disassembly rack 9. The focus ring substrate 10 is a substrate for preparing a focus ring for semiconductor equipment;

[0072] The rotating mechanism is connected to the bottom of the four mounting platforms 7 respectively. The rotating mechanism is used to rotate the mounting platforms 7 so that the mounting platforms 7 can operate in the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6.

[0073] In this technical solution, the focus ring substrate 10 is installed or removed in the cooling chamber 6, then enters the preheating chamber 3 to preheat the focus ring substrate 10, and then enters the preparation chamber 4 to perform chemical vapor deposition to prepare the focus ring. After completion, it enters the transition chamber 5, and finally enters the cooling chamber 6 to cool and remove the focus ring, so that the preparation chamber 4 can continuously perform vapor deposition. Cooling the focus ring and installing and removing the focus ring substrate 10 do not affect the chemical vapor deposition preparation of the focus ring. After the focus ring substrate 10 is preheated, the temperature of the focus ring substrate 10 can be made more uniform in the deposition chamber, and a large temperature difference will not occur on the focus ring substrate 10, resulting in uneven material properties and affecting the quality of the final focus ring.

[0074] At the same time, the columnar member 8 and the disassembly and assembly frame 9 can be used to stack and place multiple focus ring substrates 10, and multiple focus rings can be deposited at a time. The contact area between the disassembly and assembly frame 9 and the focus ring substrate 10 is only three points, so that the contact surface between the focus ring substrate 10 and the disassembly and assembly frame 9 is extremely small, which is convenient for the disassembly and installation of the focus ring substrate 10. The small contact area reduces the influence of the contact position on the focus ring molding quality.

[0075] The columnar member 8 includes a thick bottom column 81 and a fixed protrusion block 82. The bottom of the thick bottom column 81 is connected to the top of the mounting platform 7. The top of the thick bottom column 81 is connected to a plurality of fixed protrusion blocks 82 distributed in a ring array.

[0076] In this technical solution, the columnar member 8 can be used to facilitate the installation of the disassembly and assembly frame 9.

[0077] The disassembly frame 9 includes a disassembly ring 91, and three connecting bars 92 distributed in a ring array are connected to the side of the disassembly ring 91;

[0078] One end of the connecting bar 92 is threadedly connected to a contact post 93 , and the top of the contact post 93 contacts the bottom of the focus ring substrate 10 ;

[0079] The top of the disassembly ring 91 is connected to a plurality of disassembly protrusions 94 distributed in a ring array, and the bottom of the disassembly ring 91 is connected to a plurality of disassembly grooves 95 distributed in a ring array. The disassembly protrusions 94 and the fixed protrusions 82 are both plugged into the disassembly grooves 95.

[0080] In this technical solution, the disassembly and assembly rack 9 can be used to facilitate the placement of the focus ring substrate 10.

[0081] The number of the disassembly and assembly protrusions 94 , the disassembly and assembly grooves 95 and the fixed protrusions 82 are the same.

[0082] In this technical solution, the disassembly protrusion block 94 can be plugged into the disassembly groove 95 , and the fixed protrusion block 82 can be plugged into the disassembly groove 95 .

[0083] During installation, the disassembly ring 91 is mounted on the thick base column 81 so that the fixed protrusion 82 is inserted into the disassembly groove 95 of the disassembly ring 91. The focus ring substrate 10 is then placed on the corresponding contact column 93. Another disassembly ring 91 is then installed so that the disassembly groove 95 of the disassembly ring 91 is inserted into the disassembly protrusion 94 of the previous disassembly ring 91. The focus ring substrate 10 is then placed on top of the contact column 93 of the disassembly ring 91. This operation is repeated in sequence to stack multiple focus ring substrates 10, completing the installation of the focus ring substrates 10.

[0084] After the focus ring is deposited, the contact pillars 93 near the focus ring substrate 10 are cut off with a tool, and the focus ring substrate 10 can be removed. Then, the disassembly ring 91 and the focus ring substrate 10 can be removed in sequence.

[0085] It is worth noting that the contact pin 93 can be rotated after being cut. At this time, under the action of the connecting strip 92, the contact pin 93 can be moved, so that the contact pin 93 can be used multiple times.

[0086] The rotating mechanism includes a rotating assembly 11 and a transmission assembly 12. The bottoms of the four mounting platforms 7 are connected to the rotating assembly 11. The four rotating assemblies 11 are respectively connected to the transmission assembly 12 for transmission. The transmission assembly 12 is connected to the bottom support frame shell.

[0087] In this technical solution, the rotating mechanism can be used to drive the mounting platform 7 and other structures to move within the four chambers.

[0088] The rotating assembly 11 includes an arc gear 111, and the arc gear 111 is connected to the bottom of the mounting platform 7. The central axes of the four arc gears 111 of the rotating assembly 11 are on the same circular arc line;

[0089] The inner side of the arc gear 111 is meshed with two symmetrically distributed rotating gears 112 . The bottom of the rotating gear 112 is connected to a connecting shaft 113 . The connecting shaft 113 is rotatably connected to the top surface of the bottom supporting frame shell.

[0090] In this technical solution, the rotating assembly 11 can drive multiple mounting platforms 7 to rotate.

[0091] When in use, the transmission assembly 12 can drive the connecting shaft 113 to rotate, thereby driving the rotating gear 112 to rotate, and at this time, it can drive the arc gear 111 to rotate, and then drive the mounting table 7 and the disassembly frame 9 and other structures to rotate, so that the focusing ring substrate 10 can be switched in the preheating chamber 3, the preparation chamber 4, the transition chamber 5 and the cooling chamber 6.

[0092] The transmission assembly 12 includes a central bevel gear 121, the bottom of which is connected to the output end of a driving source 122, and the driving source 122 is connected to the inner wall of the bottom supporting frame;

[0093] The side of the central bevel gear 121 is meshed with multiple first bevel gears 123, and one side of each of the first bevel gears 123 is connected to a transmission shaft 124. One end of the transmission shaft 124 is connected to a second bevel gear 125. The side of the second bevel gear 125 is meshed with a third bevel gear 126, and the top of the third bevel gear 126 is connected to the bottom end of the connecting shaft 113.

[0094] A plurality of fixing plates 127 are connected to the inner cavity of the bottom support frame shell, and the surface of the transmission shaft 124 is rotatably connected to the fixing plates 127 .

[0095] The fixing plate 127 is used to support the transmission shaft 124 so that the transmission shaft 124 is more stable during rotation.

[0096] In this technical solution, the transmission assembly 12 can simultaneously drive multiple rotating assemblies 11 to rotate.

[0097] When in use, the driving source 122 drives the central bevel gear 121 to rotate, thereby driving multiple first bevel gears 123 to rotate, and then driving the corresponding transmission shafts 124 to rotate, thereby driving multiple second bevel gears 125 to rotate, thereby respectively driving multiple third bevel gears 126 to rotate, and then driving multiple connecting shafts 113 to rotate.

[0098] The rotating mechanism further includes an anti-deflection component 13, which includes an arc-shaped follower frame 131 and a fixed rail 132. The arc-shaped follower frame 131 is connected to the bottom of the mounting platform 7, and the fixed rail 132 is connected to the top of the bottom support frame shell;

[0099] A plurality of smooth rolling balls 133 are rotatably connected to the top surface of the fixed track 132 , and the smooth rolling balls 133 are in contact with the inner wall of the top surface of the fixed track 132 .

[0100] In this technical solution, the anti-deflection component 13 can be used to limit the movement trajectory of the mounting platform 7.

[0101] When the mounting platform 7 rotates, the arc-shaped follower frame 131 can be driven to rotate along the fixed track 132. The fixed track 132 can be used to limit the rotation trajectory of the arc-shaped follower frame 131 and the mounting platform 7. At this time, the smooth rolling ball 133 can reduce the friction between the arc-shaped follower frame 131 and the fixed track 132, making the rotation of the arc-shaped follower frame 131 smoother and more labor-saving.

[0102] The preheating chamber 3 is connected to the transition chamber 5 and the cooling chamber 6 via a waste heat utilization component 14. The waste heat utilization component 14 includes a central pipeline 141. The central pipeline 141 is arranged at the center of the middle preparation frame shell.

[0103] The side of the central pipeline 141 is connected to the preheating chamber 3, the transition chamber 5 and the cooling chamber 6 respectively. The outer side of the middle preparation frame shell is connected to the centralized frame shell 142, and the centralized frame shell 142 is connected to the preheating chamber 3;

[0104] An air flow fan 143 is connected to the inner wall of the centralized frame shell 142 , and a first one-way valve 144 is connected to the side of the centralized frame shell 142 away from the preheating chamber 3 .

[0105] In this technical solution, the waste heat utilization component 14 can be used to utilize the waste heat in the transition chamber 5 and the cooling chamber 6, thereby reducing heat waste and energy consumption.

[0106] The central pipeline 141 is connected to the side of three first dispersion boxes 145, and the three first dispersion boxes 145 are each provided with a second dispersion box 146 on one side. The three second dispersion boxes 146 are all connected to the inner side of the middle preparation frame shell, and the three second dispersion boxes 146 are respectively connected to the transition chamber 5, the cooling chamber 6, and the preheating chamber 3;

[0107] The second dispersion boxes 146 on both sides are connected via a plurality of second one-way valves 147 .

[0108] In this technical solution, the second one-way valve 147 can be used to prevent the gas in the preheating chamber 3 from flowing back into the transition chamber 5 and the cooling chamber 6.

[0109] During use, cold air enters the cooling chamber 6 from the bottom and is exhausted from the top. The cold air sinks under the action of gravity, while the hot air rises. During this process, the hot air in the transition chamber 5 and the cooling chamber 6 is sent into the central pipeline 141 by using the corresponding second dispersion box 146, the second one-way valve 147, and the first dispersion box 145. Then, the heat is directed into the preheating chamber 3 through the corresponding second dispersion box 146, the second one-way valve 147, and the first dispersion box 145, so as to preheat the focus ring substrate 10 in the preheating chamber 3, thereby reducing energy consumption in the preheating chamber 3 and avoiding heat waste in the transition chamber 5 and the cooling chamber 6.

[0110] When in use, the gas flow fan 143 is used to drive the hot air flow from the transition chamber 5 and the cooling chamber 6 to the preheating chamber 3;

[0111] When in use, the focus ring substrate 10 is cooled in the cooling chamber 6 to facilitate removal of the focus ring substrate 10 .

[0112] Example 2

[0113] As an embodiment of the present application, the difference between it and other embodiments is that a reinforcing column 83 is connected to the top of the fixed protrusion block 82, and the distance between the top of the reinforcing column 83 and the inner cavity wall of the top surface of the middle preparation frame shell is between the length of two disassembly rings 91 and the length of three disassembly rings 91.

[0114] When in use, the disassembly ring 91 is sleeved on the surface of the reinforcing column 83, and the stability of the connecting strip 92 is ensured by the plug-in effect between the contact column 93 and the fixed protrusion block 82, the disassembly protrusion block 94 and the disassembly groove 95, thereby further increasing the stability of the focusing ring substrate 10 when moving.

[0115] Example 3

[0116] As an embodiment of the present application, the difference between it and other embodiments is that the contact pillar 93 is fixedly connected to the top of the connecting bar 92.

[0117] When in use, the focus ring substrate 10 is directly placed on the top of the three contact pins 93 without leveling the height of the top of the three contact pins 93 , making the placement of the focus ring substrate 10 faster.

[0118] Example 4

[0119] As an embodiment of the present application, the difference between it and other embodiments is that the mounting platform 7 includes an upper mounting plate 71 and a lower mounting frame shell 72, and the upper mounting plate 71 and the lower mounting frame shell 72 are rotatably connected via a self-rotating component 15;

[0120] The self-rotating assembly 15 includes a rotation source 151, which is connected to the bottom of the inner cavity of the lower mounting frame shell 72, and the output end of the rotation source 151 is connected to the bottom of the upper mounting plate 71;

[0121] The bottom of the upper mounting plate 71 is connected to an anti-slip track 152, and the top side of the lower mounting frame shell 72 is provided with an anti-slip groove. The anti-slip track 152 is slidingly connected to the upper mounting plate 71 through the anti-slip groove, and the anti-slip groove wall is rotatably connected to a plurality of anti-friction balls 153 distributed in a ring array, and the anti-friction balls 153 are in contact with the side of the rotation source 151.

[0122] During use, when the focusing ring substrate 10 is located in the preheating chamber 3, the transition chamber 5 or the cooling chamber 6, the rotation source 151 can be used to drive the upper mounting plate 71 to rotate, thereby driving the columnar member 8 and the focusing ring substrate 10 and other structures to rotate, so that the multiple groups of focusing ring substrates 10 on the upper mounting plate 71 can rotate on their own, making the contact between the focusing ring substrate 10 and the external environment more uniform and comprehensive, thereby facilitating the heating and cooling of multiple focusing ring substrates 10.

[0123] Although the above describes specific embodiments of the present invention, it should be understood by those skilled in the art that these are merely illustrative. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications shall fall within the scope of protection of the present invention.

Claims

1. A preparation device for a focusing ring for semiconductor equipment, comprising a supporting outer frame (1), wherein the supporting outer frame (1) is composed of a top supporting plate, a middle preparation frame shell and a bottom support frame shell connected in sequence, wherein the middle preparation frame shell is a circular chamber, characterized in that: The device for preparing the focus ring for semiconductor equipment further comprises: A blocking door module (2), wherein the annular chamber of the middle preparation frame shell is divided into four chambers by the blocking door module (2), which are respectively a preheating chamber (3), a preparation chamber (4), a transition chamber (5) and a cooling chamber (6), and the blocking door module (2) is used to control the on-off between the preheating chamber (3), the preparation chamber (4), the transition chamber (5) and the cooling chamber (6); A mounting platform (7) is provided in each of the preheating chamber (3), the preparation chamber (4), the transition chamber (5) and the cooling chamber (6); a plurality of columnar members (8) distributed in a ring array are connected to the upper portion of the mounting platform (7); a plurality of disassembly racks (9) are detachably connected to the upper portion of the columnar members (8); a focusing ring substrate (10) is placed on the upper portion of the disassembly rack (9); the focusing ring substrate (10) is a substrate for preparing a focusing ring for semiconductor equipment; The columnar member (8) comprises a thick bottom column (81) and a fixed protrusion block (82), wherein the bottom of the thick bottom column (81) is connected to the top of the mounting platform (7), and the top of the thick bottom column (81) is connected to a plurality of fixed protrusion blocks (82) distributed in a ring array; The disassembly frame (9) comprises a disassembly ring (91), and the side of the disassembly ring (91) is connected to three connecting bars (92) distributed in a ring array; One end of the connecting bar (92) is threadedly connected to a contact column (93), and the top end of the contact column (93) is in contact with the bottom of the focusing ring substrate (10); The top of the disassembly ring (91) is connected to a plurality of disassembly protrusions (94) distributed in a ring array, and the bottom of the disassembly ring (91) is connected to a plurality of disassembly grooves (95) distributed in a ring array, and the disassembly protrusions (94) and the fixed protrusions (82) are plugged into the disassembly grooves (95); A rotating mechanism, the rotating mechanism being connected to the bottoms of the four mounting platforms (7) respectively, and the rotating mechanism being used to rotate the mounting platforms (7) so as to allow the mounting platforms (7) to operate in the preheating chamber (3), the preparation chamber (4), the transition chamber (5), and the cooling chamber (6); The rotating mechanism further includes an anti-deflection assembly (13), the anti-deflection assembly (13) including an arc-shaped follower frame (131) and a fixed rail (132), the arc-shaped follower frame (131) is connected to the bottom of the mounting platform (7), and the fixed rail (132) is connected to the top of the bottom support frame shell; The top surface of the fixed track (132) is rotatably connected to a plurality of smooth rolling balls (133), and the smooth rolling balls (133) are in contact with the inner wall of the top surface of the fixed track (132); The preheating chamber (3) is connected to the transition chamber (5) and the cooling chamber (6) via a waste heat utilization component (14), wherein the waste heat utilization component (14) comprises a central pipeline (141), and the central pipeline (141) is arranged at the center of the middle preparation frame shell; The side surfaces of the central pipeline (141) are respectively connected to the preheating chamber (3), the transition chamber (5) and the cooling chamber (6); the outer side of the middle preparation frame shell is connected to a centralized frame shell (142); and the centralized frame shell (142) is connected to the preheating chamber (3).

2. The apparatus for manufacturing a focus ring for semiconductor equipment according to claim 1, wherein: The number of the disassembly and assembly protrusions (94), the disassembly and assembly grooves (95) and the fixed protrusions (82) is the same.

3. The apparatus for manufacturing a focus ring for semiconductor equipment according to claim 1, wherein: The rotating mechanism comprises a rotating assembly (11) and a transmission assembly (12); the bottoms of the four mounting platforms (7) are all connected to the rotating assembly (11); the four rotating assemblies (11) are respectively connected to the transmission assembly (12); and the transmission assembly (12) is connected to the bottom support frame shell.

4. The apparatus for manufacturing a focus ring for semiconductor equipment according to claim 3, wherein: The rotating assembly (11) includes an arc-shaped gear (111), the arc-shaped gear (111) is connected to the bottom of the mounting platform (7), and the central axes of the arc-shaped gears (111) of the four rotating assemblies (11) are on the same circular arc line; The inner side of the arc-shaped gear (111) is meshedly connected to two symmetrically distributed rotating gears (112); the bottom of the rotating gear (112) is connected to a connecting shaft (113); and the connecting shaft (113) is rotatably connected to the top surface of the bottom supporting frame shell.

5. The apparatus for manufacturing a focus ring for semiconductor equipment according to claim 3, wherein: The transmission assembly (12) comprises a central bevel gear (121), the bottom of the central bevel gear (121) is connected to the output end of a driving source (122), and the driving source (122) is connected to the inner wall of the bottom supporting frame shell; The side of the central bevel gear (121) is meshedly connected to a plurality of first bevel gears (123), one side of each of the plurality of first bevel gears (123) is connected to a transmission shaft (124), one end of the transmission shaft (124) is connected to a second bevel gear (125), the side of the second bevel gear (125) is meshedly connected to a third bevel gear (126), and the top of the third bevel gear (126) is connected to the bottom end of the connecting shaft (113).

6. The apparatus for manufacturing a focus ring for a semiconductor device according to claim 1, wherein: The inner wall of the centralized frame shell (142) is connected to a gas flow fan (143), and the side of the centralized frame shell (142) away from the preheating chamber (3) is connected to a first one-way valve (144).

7. The apparatus for manufacturing a focus ring for a semiconductor device according to claim 1, wherein: The central pipeline (141) is connected to three first dispersion boxes (145) on one side, and the three first dispersion boxes (145) are each provided with a second dispersion box (146) on one side. The three second dispersion boxes (146) are all connected to the inner side of the middle preparation frame shell, and the three second dispersion boxes (146) are respectively connected to the transition chamber (5), the cooling chamber (6), and the preheating chamber (3); The second dispersion boxes (146) on both sides are connected via a plurality of second one-way valves (147).

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