Anti-crack light gypsum board and manufacturing method thereof

Abstract

The invention discloses an anti-crack light gypsum board which comprises a base body, the surface of the base body is divided into a non-mounting area and a plurality of mounting areas, the mounting areas are distributed on the surface of the base body in an array mode, a preset mounting hole is formed in the center of each mounting area, a reinforcing ring is embedded in each preset mounting hole, and the reinforcing rings are embedded in the non-mounting areas. A reinforcing layer is arranged on the periphery of the mounting hole, the density of the mounting area is larger than that of the non-mounting area, the surface layer density of the mounting area is 1.2-1.4 g / cm < 3 >, the core layer density of the mounting area is 0.8-1.0 g / cm < 3 >, the surface layer density of the non-mounting area is 0.9-1.0 g / cm < 3 >, the core layer density of the non-mounting area is 0.8-0.9 g / cm < 3 >, and a transition layer is arranged between the non-mounting area and the mounting area. The invention relates to the technical field of building decoration materials. According to the anti-crack light gypsum board and the manufacturing method thereof, the problem that a traditional gypsum board is poor in crack resistance is solved, and meanwhile the overall weight is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of building decoration materials, and particularly to a crack-resistant lightweight gypsum board and a manufacturing method thereof. Background Art

[0002] Gypsum board is a material mainly made of building gypsum. It is a building material with the advantages of light weight, relatively high strength, thin thickness, convenient processing, good sound insulation, heat insulation and fire prevention properties, and is one of the new lightweight boards that are currently being focused on for development. It has been widely used in interior partition walls, wall cladding panels, ceilings, sound-absorbing boards, floor baseboards and various decorative boards of various buildings such as residences, office buildings, stores, hotels and industrial factories. When installing gypsum board, it is necessary to drill holes and fix them with screws or directly use self-tapping screws. However, when drilling through the surface of the gypsum board, the structural integrity of the gypsum board is damaged, forming a crack propagation source. During installation, if the screws are too tight or there is vibration, microcracks are easily induced in the surrounding area, which affects the overall decoration. Therefore, it is necessary to develop a crack-resistant lightweight gypsum board to reduce the surface cracking phenomenon of the gypsum board caused by installation drilling. Summary of the Invention

[0003] (1) Technical Problems to be Solved

[0004] In view of the deficiencies of the prior art, the present invention provides a crack-resistant lightweight gypsum board and a manufacturing method thereof, which solve the problem of poor crack resistance of traditional gypsum boards and at the same time reduce the overall weight.

[0005] (2) Technical Solutions

[0006] To achieve the above object, the present invention is realized through the following technical solutions: A crack-resistant lightweight gypsum board, comprising: a matrix, the surface of the matrix is divided into a non-installation area and an installation area, there are multiple installation areas and they are arrayed on the surface of the matrix, a preset installation hole is provided at the center of each installation area, a reinforcing ring is embedded in the preset installation hole, a reinforcing layer is provided around the hole of the installation hole, the density of the installation area is greater than that of the non-installation area, the surface layer density of the installation area is 1.2 - 1.4 g / cm 3 , the core layer density is 0.8 - 1.0 g / cm 3 , the surface layer density of the non-installation area is 0.9 - 1.0 g / cm3, the core layer density is 0.8 - 0.9 g / cm 3 , and a transition layer is provided between the non-installation area and the installation area;

[0007] A self-healing coating is further provided on the surface of the matrix, and the self-healing coating uses epoxy resin microcapsules;

[0008] The surface layer of the installation area comprises the following components in parts by weight: 100 parts of gypsum powder, 8 - 10 parts of modified bamboo fiber, 5 - 8 parts of nano-silica;

[0009] The core layer of the installation area contains: 100 parts of gypsum powder, 5-8 parts of modified bamboo fiber, and 2-3 parts of chopped carbon fiber;

[0010] The surface layer of the non-installation area contains the following components in parts by weight: 100 parts of gypsum powder, 3-5 parts of modified bamboo fiber, and 10-12 parts of expanded perlite;

[0011] The core layer of the non-installation area contains: 100 parts of gypsum powder, 15-18 parts of expanded perlite, and 0.3-0.5 parts of foaming agent.

[0012] Preferably, the reinforcing ring is a glass fiber ring or a nylon sleeve, the inner diameter of the reinforcing ring is 4-6 mm, the outer diameter is 7-9 mm, and the surface of the reinforcing ring is coated with an epoxy resin adhesive.

[0013] Preferably, the particle size of the epoxy resin microcapsule is 50-100 μm, the core of the epoxy resin microcapsule is an epoxy resin repair agent, the shell is a polymer, and the fracture toughness of the polymer is ≤0.5 MPa·m 1 / 2 。

[0014] Preferably, the transition layer is a natural diffusion mixing area of high-density slurry and low-density slurry, and the density gradually changes from 1.2 g / cm 3 to 0.9 g / cm 3 , and the width of the transition layer is 3-6 mm.

[0015] Preferably, the reinforcement layer is composed of the surface layer slurry of the installation area and chopped carbon fiber of 3-5 mm, and the chopped carbon fiber accounts for 2%-3% of the mass of the reinforcement layer.

[0016] Preferably, the modified bamboo fiber is bamboo fiber soaked in 3%-5% silane coupling agent for 30-60 minutes, and the moisture content of the fiber is ≤2% after drying.

[0017] A preparation method of a crack-resistant lightweight gypsum board includes the following steps:

[0018] Step 1: Preparation of modified bamboo fiber: Cut the bamboo fiber into short fibers of 3-5 mm, soak it in a 5% silane coupling agent solution for 40 minutes, and dry it at 80 °C until the moisture content is ≤2%;

[0019] Step 2: Preparation of high-density slurry: Mix gypsum powder, modified bamboo fiber, and nano-silica in proportion, and the water-cement ratio is 0.5-0.6;

[0020] Step 3: Preparation of low-density slurry: Mix gypsum powder, expanded perlite, and foaming agent in proportion, and the water-cement ratio is 0.8-1.0;

[0021] Step 4: Pour in layers: First, pour high-density slurry into the mold to a preset thickness, embed the reinforcing ring, vibrate at 5 - 10 Hz to remove air bubbles, and then pour in low-density slurry after initial setting.

[0022] Step 5: Microwave gradient curing: Cure in segments at 60 - 80 °C, cure the surface layer at 80 °C for 15 min, and cure the core layer at 60 °C for 30 min.

[0023] Step 6: Spray self-healing coating: Uniformly spray waterborne polyurethane containing 10% - 12% microcapsules, and cure at room temperature for 24 h.

[0024] Preferably, the foaming agent in Step 3 is a composite system of hydrogen peroxide and sodium stearate. The dosage of hydrogen peroxide is 0.3% of the weight of the gypsum powder, and the dosage of sodium stearate is 0.1% of the weight of the gypsum powder.

[0025] Preferably, the vibration frequency in Step 4 is 8 - 10 Hz, the vibration time is 5 - 8 minutes, and the amplitude is 0.5 - 1 mm.

[0026] Preferably, the shell of the microcapsule is urea-formaldehyde resin with a thickness of 2 - 3 μm, the viscosity of the epoxy resin repair agent is 400 - 500 cP, and the particle size of the microcapsule is 50 - 80 μm.

[0027] (III) Beneficial effects

[0028] The present invention provides a crack-resistant lightweight gypsum board and its manufacturing method. It has the following beneficial effects:

[0029] For this crack-resistant lightweight gypsum board, by setting installation areas and non-installation areas with different densities on the surface of the gypsum board, the overall weight is reduced, which is convenient for handling; at the same time, installation holes are set in the installation areas to avoid damage to the structure caused by on-site drilling, disperse stress concentration, and reduce the risk of cracking; at the same time, a self-healing coating is set on the surface. The self-healing coating uses epoxy resin microcapsules, and the microcapsules release the repair agent when cracks occur, filling the microcracks around the holes to prevent crack propagation. Description of the drawings

[0030] Figure 1 It is a schematic diagram of the surface structure of the gypsum board of the present invention;

[0031] Figure 2 It is a cross-sectional view of the gypsum board of the present invention.

[0032] In the figure: 1 - matrix, 101 - non-installation area, 102 - installation area, 103 - installation hole. Specific embodiments

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] Please refer to Figure 1-2 , the present invention provides a technical solution: a crack-resistant lightweight gypsum board, comprising: a substrate 1, the surface of the substrate 1 is divided into a non-installation area 101 and an installation area 102, there are multiple installation areas 102 and they are arrayed on the surface of the substrate 1, a pre-set installation hole 103 is provided at the center of each installation area 102, a reinforcing ring is embedded in the pre-set installation hole 103, the reinforcing ring is a glass fiber ring or a nylon sleeve, the inner diameter of the reinforcing ring is 4 - 6 mm, the outer diameter is 7 - 9 mm, and the surface of the reinforcing ring is coated with epoxy resin adhesive.

[0035] A reinforcing layer is provided around the hole of the installation hole 103, and the reinforcing layer is composed of the surface slurry of the installation area 102 and 3 - 5 mm chopped carbon fibers, and the chopped carbon fibers account for 2% - 3% of the mass of the reinforcing layer.

[0036] The density of the installation area 102 is greater than that of the non-installation area 101. The surface density of the installation area 102 is 1.2 - 1.4 g / cm 3 , the core layer density is 0.8 - 1.0 g / cm 3 , the surface density of the non-installation area 101 is 0.9 - 1.0 g / cm 3 , the core layer density is 0.8 - 0.9 g / cm 3 , a transition layer is provided between the non-installation area 101 and the installation area 102, and the transition layer is a natural diffusion mixing area of high-density slurry and low-density slurry, with the density gradually changing from 1.2 g / cm 3 to 0.9 g / cm 3 , and the width of the transition layer is 3 - 6 mm.

[0037] A self-healing coating is also provided on the surface of the substrate 1. The self-healing coating uses epoxy resin microcapsules. The particle size of the epoxy resin microcapsules is 50 - 100 μm. The core of the epoxy resin microcapsules is an epoxy resin repair agent, and the shell is a polymer. The fracture toughness of the polymer ≤ 0.5 MPa·m 1 / 2 .

[0038] The surface layer of the installation area 102 contains the following components in parts by weight: 100 parts of gypsum powder, 8 - 10 parts of modified bamboo fiber, and 5 - 8 parts of nano-silica;

[0039] The core layer of the installation area 102 contains: 100 parts of gypsum powder, 5 - 8 parts of modified bamboo fiber, and 2 - 3 parts of chopped carbon fibers;

[0040] The surface layer of the non-installation area 101 contains the following components in parts by weight: 100 parts of gypsum powder, 3-5 parts of modified bamboo fiber, and 10-12 parts of expanded perlite;

[0041] The core layer of the non-installation area 101 contains: 100 parts of gypsum powder, 15-18 parts of expanded perlite, and 0.3-0.5 parts of foaming agent.

[0042] The modified bamboo fiber is bamboo fiber soaked in 3%-5% silane coupling agent for 30-60 minutes, and the moisture content of the dried fiber is ≤2%.

[0043] A preparation method of a crack-resistant lightweight gypsum board includes the following steps:

[0044] Step 1: Preparation of modified bamboo fiber: Cut the bamboo fiber into 3-5 mm short fibers, soak it in a 5% silane coupling agent solution for 40 minutes, and dry it at 80°C until the moisture content is ≤2%;

[0045] Step 2: Preparation of high-density slurry: Mix gypsum powder, modified bamboo fiber, and nano-silica in proportion, and the water-cement ratio is 0.5-0.6;

[0046] Step 3: Preparation of low-density slurry: Mix gypsum powder, expanded perlite, and foaming agent in proportion, and the water-cement ratio is 0.8-1.0;

[0047] Step 4: Pouring in steps: First inject the high-density slurry into the mold to a preset thickness, embed the reinforcement ring, vibrate at 5-10 Hz to remove air bubbles, and then inject the low-density slurry after initial setting;

[0048] Step 5: Microwave gradient curing: Cure in sections at 60-80°C, cure the surface layer at 80°C for 15 minutes, and cure the core layer at 60°C for 30 minutes;

[0049] Step 6: Spraying self-healing coating: Uniformly spray the waterborne polyurethane containing 10%-12% microcapsules and cure at room temperature for 24 hours.

[0050] The foaming agent described in Step 3 is a composite system of hydrogen peroxide and sodium stearate. The dosage of hydrogen peroxide is 0.3% of the weight of the gypsum powder, and the dosage of sodium stearate is 0.1% of the weight of the gypsum powder.

[0051] The vibration frequency described in Step 4 is 8-10 Hz, the vibration time is 5-8 minutes, and the amplitude is 0.5-1 mm.

[0052] The shell of the microcapsule is urea-formaldehyde resin, with a thickness of 2-3 μm. The viscosity of the epoxy resin repair agent is 400-500 cP, and the particle size of the microcapsule is 50-80 μm.

[0053] According to the above method, make a gypsum board:

[0054] 1. Raw material treatment:

[0055] Soak bamboo fiber in 5% silane coupling agent for 40 minutes, and dry it at 80°C until the moisture content ≤ 2%;

[0056] High-density slurry: 100 parts of gypsum powder, 8 parts of modified bamboo fiber, 5 parts of nano-SiO₂, 50 parts of water;

[0057] Low-density slurry: 100 parts of gypsum powder, 15 parts of expanded perlite, foaming agent (0.3% hydrogen peroxide + 0.1% sodium stearate), 80 parts of water.

[0058] 2. Pour in stages:

[0059] Inject high-density slurry into the mold to a thickness of 10 mm, embed a glass fiber ring, vibrate at 8 Hz for 5 minutes to remove air bubbles;

[0060] After initial setting for 20 minutes, inject low-density slurry, and let it naturally spread to form a 3-mm transition layer.

[0061] 3. Curing and coating:

[0062] Cure the surface layer at 80°C for 15 min, and cure the core layer at 60°C for 30 min;

[0063] Spray waterborne polyurethane containing 10% microcapsules, with a particle size of 50 - 80 μm, and cure at room temperature for 24 h.

[0064] Performance testing

[0065] Test item The present invention Traditional gypsum board Longitudinal flexural strength (N) 580 536 <![CDATA[Areal density (kg / m 2 )]]> 19.5 25.0 Crack repair rate (48h) 89％ -

[0066] Through comparison, it is found that the gypsum board of the present invention is superior to traditional gypsum boards in terms of longitudinal flexural strength, light weight, and crack repair.

[0067] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0068] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A crack-resistant lightweight gypsum board, comprising: Substrate (1), characterized in that the surface of the substrate (1) is divided into a non-mounting area (101) and a mounting area (102), multiple mounting areas (102) are provided and are arrayed on the surface of the substrate (1), a preset mounting hole (103) is provided at the center of each mounting area (102), a reinforcing ring is embedded in the preset mounting hole (103), a reinforcing layer is provided on the circumference of the mounting hole (103), the density of the mounting area (102) is greater than that of the non-mounting area (101), the surface density of the mounting area (102) is 1.2 - 1.4 g / cm 3 , the core density is 0.8 - 1.0 g / cm 3 , the surface density of the non-mounting area (101) is 0.9 - 1.0 g / cm 3 , the core density is 0.8 - 0.9 g / cm 3 , a transition layer is provided between the non-mounting area (101) and the mounting area (102); A self-healing coating is also provided on the surface of the substrate (1), and the self-healing coating uses epoxy resin microcapsules; The surface layer of the installation area (102) contains the following components by weight: 100 parts of gypsum powder, 8-10 parts of modified bamboo fiber, and 5-8 parts of nano-silica; The core layer of the installation area (102) contains: 100 parts of gypsum powder, 5-8 parts of modified bamboo fiber, and 2-3 parts of chopped carbon fiber; The surface layer of the non-installation area (101) contains the following components by weight: 100 parts of gypsum powder, 3-5 parts of modified bamboo fiber, and 10-12 parts of expanded perlite; The core layer of the non-installation area (101) contains: 100 parts of β-gypsum powder, 15-18 parts of expanded perlite, and 0.3-0.5 parts of foaming agent.

2. A crack-resistant lightweight gypsum board according to claim 1, wherein: The reinforcing ring is a glass fiber ring or a nylon sleeve. The inner diameter of the reinforcing ring is 4-6 mm, the outer diameter is 7-9 mm, and the surface of the reinforcing ring is coated with an epoxy resin adhesive.

3. A crack-resistant lightweight gypsum board according to claim 1, wherein: The particle size of the epoxy resin microcapsules is 50-100 μm. The core of the epoxy resin microcapsules is an epoxy resin repair agent, and the shell is a polymer. The fracture toughness of the polymer is ≤ 0.5 MPa·m 1 / 2 .

4. A crack-resistant lightweight gypsum board according to claim 1, wherein: The transition layer is a natural diffusion mixing zone of high-density slurry and low-density slurry, with the density gradually changing from 1.2 g / cm 3 to 0.9 g / cm 3 , and the width of the transition layer is 3-6 mm.

5. A crack-resistant lightweight gypsum board according to claim 1, characterized in that: The reinforcing layer is composed of the surface layer slurry of the installation area (102) and 3-5 mm chopped carbon fiber, and the chopped carbon fiber accounts for 2%-3% of the mass of the reinforcing layer.

6. A crack-resistant lightweight gypsum board according to claim 1, characterized in that: The modified bamboo fiber is bamboo fiber soaked in 3%-5% silane coupling agent for 30-60 minutes, and the moisture content of the fiber is ≤2% after drying.

7. A preparation method of a crack-resistant lightweight gypsum board according to any one of claims 1-6, characterized in that, It includes the following steps: Step 1: Preparation of modified bamboo fiber: Cut the bamboo fiber into 3-5 mm short fibers, soak them in a 5% silane coupling agent solution for 40 minutes, and dry them at 80°C until the moisture content is ≤2%; Step 2: Preparation of high-density slurry: Mix gypsum powder, modified bamboo fiber, and nano-silica in proportion, and the water-cement ratio is 0.5-0.6; Step 3: Preparation of low-density slurry: Mix gypsum powder, expanded perlite, and foaming agent in proportion, and the water-cement ratio is 0.8-1.0; Step 4: Pouring in steps: First, inject high-density slurry into the mold to a preset thickness, embed the reinforcing ring, vibrate at 5-10 Hz to remove air bubbles, and then inject low-density slurry after initial setting; Step 5: Microwave gradient curing: Cure in segments at 60-80°C, cure the surface layer at 80°C for 15 minutes, and cure the core layer at 60°C for 30 minutes; Step 6: Spraying of self-healing coating: Uniformly spray aqueous polyurethane containing 10%-12% microcapsules and cure at room temperature for 24 hours.

8. The preparation method of a crack-resistant lightweight gypsum board according to claim 7, characterized in that: The foaming agent in Step 3 is a composite system of hydrogen peroxide and sodium stearate. The dosage of hydrogen peroxide is 0.3% of the weight of the gypsum powder, and the dosage of sodium stearate is 0.1% of the weight of the gypsum powder.

9. The preparation method of a crack-resistant lightweight gypsum board according to claim 7, characterized in that: The vibration frequency in Step 4 is 8-10 Hz, the vibration time is 5-8 minutes, and the amplitude is 0.5-1 mm.

10. The preparation method of a crack-resistant lightweight gypsum board according to claim 7, characterized in that: The shell of the microcapsule is urea-formaldehyde resin, with a thickness of 2-3 μm. The viscosity of the epoxy resin repair agent is 400-500 cP, and the particle size of the microcapsule is 50-80 μm.

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